Preparation method of optical coupler, optical coupler and electronic equipment

Abstract

The invention is suitable for the technical field of optical couplers, and provides an optical coupler preparation method, an optical coupler and electronic equipment, and the preparation method comprises the steps: providing a light-emitting device and a light-receiving device, enabling the light emitted by the light-emitting device to reach the light-receiving device through a first surface and a second surface through the stacking of the light-emitting device and the light-receiving device, and enabling the light to pass through the first surface and the second surface. The optical coupler distance between the light-emitting device and the light-receiving device is reduced, the transmission distance of optical signals is shortened, the input interface and the output interface are located on the outer sides, opposite to each other, of the light-emitting device and the light-receiving device respectively, so that wiring is not needed between the light-emitting device and the light-receiving device, and the cost is reduced. The effective light-emitting area of the optical coupler is maximized, more photons are received at the same time, and the optical coupling efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of optical couplers, and in particular, relates to an optical coupler preparation method, an optical coupler and an electronic device. Background Art

[0002] Optocouplers are semiconductor couplers that can be used for both AC and DC. They are devices that combine a light-emitting device and a light-receiving device. The input and output sides of an optocoupler are electrically insulated, but signals can be transmitted via optical signals.

[0003] The optical signal transceiver system of the existing optical coupler on the market adopts a face-to-face frame structure or a face-to-back frame structure. However, no matter whether the face-to-face frame structure or the face-to-back frame structure is adopted, there will be wiring obstruction between the optical signal transceiver ends, resulting in a reduction in the effective area of ​​the optical coupler. In addition, the wiring between the optical signal transceiver ends will also cause a large distance between the optical signal transceiver ends, resulting in a larger overall volume of the optical coupler, which will also affect the response time of the optical coupler, resulting in a reduction in optical coupling efficiency. Summary of the invention

[0004] The embodiment of the present application provides a method for preparing an optical coupler, aiming to solve the problems of large size, high cost and low optical coupling efficiency of existing optical couplers.

[0005] The embodiment of the present application is implemented by providing a method for preparing an optical coupler, comprising:

[0006] Providing a light emitting device, the light emitting device having a first surface and a first electrode port opposite to the first surface;

[0007] Providing a light receiving device, the light receiving device having a second surface and a second electrode port opposite to the second surface;

[0008] The light receiving device is stacked on the first surface of the light emitting device through the second surface, and the first electrode port and the second electrode port are arranged opposite to each other, so that the light emitted by the light emitting device can reach the light receiving device through the first surface and the second surface.

[0009] Furthermore, it also includes:

[0010] An isolation layer is arranged between the light receiving device and the light emitting device, and the isolation layer is located between the first surface and the second surface.

[0011] Furthermore, it also includes:

[0012] A transparent connection layer is provided between the light receiving device and the light emitting device.

[0013] Furthermore, it also includes:

[0014] An electrical connection layer is provided, and a light receiving device or a light emitting device is stacked on the electrical connection layer, so that the electrical connection layer is electrically connected to the first electrode port, or the electrical connection layer is electrically connected to the second electrode port.

[0015] Furthermore, it also includes:

[0016] An active device is provided, and the active device is electrically connected to an electrode of the light emitting device, and / or the active device is electrically connected to an electrode of the light receiving device.

[0017] Furthermore, it also includes:

[0018] A pad is prepared, the pad being used for being electrically connected to the first electrode port, and / or the pad being used for being electrically connected to the second electrode port.

[0019] Furthermore, the light emitting device and / or the light receiving device is a flip chip.

[0020] Furthermore, the wavelength of the light emitted by the light emitting device is smaller than the wavelength of the light received by the light receiving device, and the difference between the wavelength of the light emitted by the light emitting device and the wavelength of the light received by the light receiving device is greater than 20 nanometers.

[0021] Furthermore, a projection area of ​​the isolation layer on the plane where the first surface is located covers and is larger than an area of ​​the first surface.

[0022] Furthermore, it also includes:

[0023] A package is provided, which is used to package the light-emitting device and the light-receiving device, and is provided with a window for exposing the first electrode port and the second electrode port.

[0024] Furthermore, the active layer of the light receiving device includes a direct bandgap material.

[0025] In a second aspect, the present application also provides an optical coupler, which is manufactured by adopting the above-mentioned manufacturing method.

[0026] In a third aspect, the present application further provides an optical coupler, comprising:

[0027] A light emitting device having a first surface and a first electrode port opposite to the first surface; and

[0028] A light receiving device having a second surface and a second electrode port opposite to the second surface;

[0029] The light receiving device is stacked on the first surface of the light emitting device through the second surface, the first electrode port and the second electrode port are arranged opposite to each other, and the light emitted by the light emitting device reaches the light receiving device through the first surface and the second surface.

[0030] Furthermore, it also includes an isolation layer arranged between the first surface and the second surface, and the isolation layer is located between the first surface and the second surface.

[0031] Furthermore, it also includes a transparent connection layer arranged between the first surface and the second surface.

[0032] Furthermore, it also includes an electrical connection layer, and the light receiving device or the light emitting device is stacked on the electrical connection layer so that the electrical connection layer is electrically connected to the first electrode port, or the electrical connection layer is electrically connected to the second electrode port.

[0033] Furthermore, it also includes an active device, which is electrically connected to the electrode of the light-emitting device and / or the active device is electrically connected to the electrode of the light-receiving device.

[0034] Further, the pad is used to be electrically connected to the first electrode port, and / or the pad is used to be electrically connected to the second electrode port.

[0035] Furthermore, the light emitting device and / or the light receiving device is a flip chip.

[0036] Furthermore, the wavelength of the light emitted by the light emitting device is smaller than the wavelength of the light received by the light receiving device, and the difference between the wavelength of the light emitted by the light emitting device and the wavelength of the light received by the light receiving device is greater than 20 nanometers.

[0037] Furthermore, a projection area of ​​the isolation layer on the plane where the first surface is located covers and is larger than an area of ​​the first surface.

[0038] Furthermore, it also includes a package, which is used to package the light-emitting device and the light-receiving device, and the package is provided with a window for exposing the first electrode port and the second electrode port.

[0039] Furthermore, the active layer of the light receiving device includes a direct bandgap material.

[0040] In a fourth aspect, the present application also provides an electronic device, comprising the optical coupler as described above.

[0041] Beneficial effects of the present application: The optical coupler preparation method provided in the present application includes providing a light-emitting device and a light-receiving device, wherein the light-emitting device has a first surface and a first electrode port facing each other, and the light-receiving device has a second surface and a second electrode port facing each other, and the light-receiving device is stacked on the first surface of the light-emitting device through the second surface, and the first electrode port and the second electrode port are arranged facing each other, so that the light emitted by the light-emitting device reaches the light-receiving device through the first surface and the second surface. By stacking the light-emitting device and the light-receiving device, the light emitted by the light-emitting device is used to reach the light-receiving device through the first surface and the second surface, so as to realize the transmission of optical signals between the light-emitting device and the light-receiving device, and the input interface and the output interface are respectively located on the opposite sides of the light-emitting device and the light-receiving device, so that no wiring is required between the light-emitting device and the light-receiving device, so as to maximize the effective area of ​​the optical coupler, and at the same time, the optical coupling distance between the light-emitting device and the light-receiving device can be reduced, and the transmission distance of the optical signal can be shortened, and the reaction time of the optical coupler can be reduced, and more photons can be received at the same time, so as to improve the optical coupling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic flow chart of an embodiment of a method for preparing an optical coupler provided in the present application;

[0043] Figure 2 is a structural schematic diagram of an embodiment of an optical coupler provided by the present application;

[0044] Figure 3 is a schematic structural diagram of an embodiment of an optical coupler provided by the present application having a transparent connection layer;

[0045] Figure 4 This is a schematic diagram of a structure of an optical coupler provided in the present application with an electrical connection layer.

[0046] Figure 5 is a schematic structural diagram of an embodiment of an optical coupler provided by the present application having an isolation layer;

[0047] Figure 6 It is a structural schematic diagram of an embodiment of an optical coupler provided by the present application in which an active device is provided;

[0048] Figure 7 is a structural schematic diagram of an optical coupler assembly process of an embodiment of the optical coupler provided by the present application;

[0049] Figure 8 is a structural schematic diagram of an optical coupler assembly process of another embodiment of the optical coupler provided by the present application;

[0050] Fig. 9 It is a structural schematic diagram of an active device prepared by an optical coupler of another embodiment of the optical coupler provided by the present application;

[0051] Fig.10 It is a structural schematic diagram of an embodiment of an optical coupler provided in the present application, in which the width of the isolation layer is greater than the width of the light-emitting device.

[0052] Explanation of the reference numerals: 110 - light emitting device, 120 - light receiving device, 130 - transparent connection layer, 140 - isolation layer, 150 - electrical connection layer, 160 - insulating filler, 170 - first active device, 180 - second active device, 190 - input pad, 200 - output pad, 210 - bonding wire, 220 - package. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0054] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0056] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0058] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference values ​​and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0059] The optical coupler preparation method provided in the present application includes providing a light-emitting device and a light-receiving device, wherein the light-emitting device has a first surface and a first electrode port facing each other, and the light-receiving device has a second surface and a second electrode port facing each other, and the light-receiving device is stacked on the first surface of the light-emitting device through the second surface, so that the first electrode port and the second electrode port are arranged facing each other, so that the light emitted by the light-emitting device is used to reach the light-receiving device through the first surface and the second surface. The present application realizes the transmission of optical signals between the light-emitting device and the light-receiving device by stacking the light-emitting device and the light-receiving device so that the light emitted by the light-emitting device reaches the light-receiving device through the first surface and the second surface, and the input interface and the output interface are respectively located on the opposite sides of the light-emitting device and the light-receiving device, so that no wiring is required between the light-emitting device and the light-receiving device, so as to maximize the effective area of ​​the optical coupler, reduce the optical coupling distance between the light-emitting device and the light-receiving device, reduce the volume of the optical coupler, and shorten the transmission distance of the optical signal, reduce the reaction time of the optical coupler, receive more light sources at the same time, and improve the optical coupling efficiency.

[0060] like Figures 1 to 10 As shown, an embodiment of the present application provides a method for preparing an optical coupler, comprising:

[0061] S1100, providing a light emitting device 110, wherein the light emitting device 110 has a first surface and a first electrode port opposite to the first surface;

[0062] S1200, providing a light receiving device 120, wherein the light receiving device 120 has a second surface and a second electrode port opposite to the second surface;

[0063] S1300, stacking the light receiving device 120 on the first surface of the light emitting device 110 through the second surface, and disposing the first electrode port and the second electrode port back to back, so that the light emitted by the light emitting device 110 reaches the light receiving device 120 through the first surface and the second surface.

[0064] In implementation, the optocoupler is a device that integrates a light-emitting device 110 and a light-receiving device 120, wherein the light-emitting device 110 corresponds to the input side of the optocoupler, and the light-receiving device 120 corresponds to the output side of the optocoupler. The input side and the output side of the optocoupler are electrically insulated, and information is transmitted through optical signals.

[0065] The light-emitting device 110 refers to a semiconductor device that can convert electrical energy into light energy. By way of example, the light-emitting device 110 includes but is not limited to light-emitting diodes (LEDs), laser diodes (Laser Diodes, LD), organic light-emitting diodes (Organic Light-Emitting Diodes, OLEDs), quantum dot light-emitting diodes (Quantum Dot Light-Emitting Diodes, QD-LEDs or QLEDs), vertical-cavity surface-emitting lasers (Vertical-Cavity Surface-Emitting Lasers, VCSELs), phosphor-converted LEDs (Phosphor-Converted LEDs, pc-LEDs), LED chips, micro-LEDs (Micro-LEDs) and perovskite light-emitting diodes (Perovskite Light-Emitting Diodes, PeLEDs), etc. During implementation, the type of light-emitting device 110 can be selected according to specific application requirements, for example, the type of light-emitting device 110 can be selected based on factors such as the required light output power, color quality, life span and cost, without specific limitation.

[0066] The light receiving device 120 refers to a component that can detect light and allow current to flow. The light receiving device 120 includes but is not limited to a photoresistor, a photodiode, a phototransistor, a silicon-controlled rectifier (SCR), a triac or an LED chip, etc., without specific limitation.

[0067] The light-emitting device 110 and the light-receiving device 120 are stacked, that is, the light-receiving device 120 is stacked on the first surface of the light-emitting device 110 through the second surface, so that the first surface and the second surface are arranged opposite to each other, and the first electrode port and the second electrode port are respectively located on the outer sides of the light-emitting device 110 and the light-receiving device 120 opposite to each other.

[0068] The first electrode port and the second electrode port are used to connect to an external circuit. For example, the first electrode port is connected to a transmitting circuit, and the second electrode port is connected to a receiving circuit. During use, the transmitting circuit outputs a voltage signal to the first electrode port so that the light-emitting device 110 emits light. The light passes through the first surface and the second surface in turn and is received by the light-receiving device 120. The light-receiving device 120 outputs an electrical signal to the receiving circuit, thereby realizing a signal transmission function between the transmitting circuit and the receiving circuit.

[0069] Through the above arrangement, there is no need to run wires between the light-emitting device 110 and the light-receiving device 120, and there is no wiring obstruction. At the same time, the distance between the light-emitting device 110 and the light-receiving device 120 can be shortened, the optical coupler can be made smaller, and the optical transmission path between the light-emitting device 110 and the light-receiving device 120 can be shortened.

[0070] As a possible implementation, the first electrode port and the second electrode port may also be connected to an external circuit via a wire, that is, the first electrode port and the second electrode port are used to connect to one end of the wire, and the other end of the wire is used to connect to the external circuit.

[0071] The optical coupler preparation method provided in the present application includes providing a light-emitting device 110 and a light-receiving device 120, wherein the light-emitting device 110 has a first surface and a first electrode port opposite to each other, and the light-receiving device 120 has a second surface and a second electrode port opposite to each other, and the light-receiving device 120 is stacked on the first surface of the light-emitting device 110 through the second surface, and the first electrode port and the second electrode port are arranged opposite to each other, so that the light emitted by the light-emitting device 110 is used to reach the light-receiving device 120 through the first surface and the second surface. The present application stacks the light-emitting device 110 and the light-receiving device 120 so that the first surface is arranged relative to the second surface, and the first electrode port and the second electrode port are arranged opposite to each other. The light emitted by the light-emitting device 110 reaches the light-receiving device 120 through the first surface and the second surface, thereby realizing optical signal transmission between the light-emitting device 110 and the light-receiving device 120. Since the input interface and the output interface are respectively located on the opposite sides of the light-emitting device 110 and the light-receiving device 120, no wiring is required between the light-emitting device 110 and the light-receiving device 120, thereby maximizing the effective area of ​​the optical coupler. At the same time, the optical coupling distance between the light-emitting device 110 and the light-receiving device 120 can be reduced, the volume of the optical coupler can be reduced, and the transmission distance of the optical signal can be shortened. The response time of the optical coupler can be shortened, more light sources can be received at the same time, and the optical coupling efficiency is improved.

[0072] In some optional embodiments, the method for preparing the optical coupler provided in the present application further includes: disposing a transparent connecting layer 130 between the light receiving device 120 and the light receiving device 120 .

[0073] The transparent connection layer 130 refers to a film layer having a transparent light-transmitting property, so that the light emitted by the light-emitting device 110 can reach the light-receiving device 120 through the first surface, the transparent connection layer 130 and the second surface in sequence.

[0074] During implementation, the transparent connecting layer 130 can be a finished transparent film layer, for example, the finished transparent film layer is directly attached to the first surface, and the second surface is stacked on the first surface through the transparent connecting layer 130 to ensure the connection stability and reliability between the emitting chip and the light receiving device 120.

[0075] As a possible implementation manner, the transparent connecting layer 130 is made by coating with a transparent substance. For example, the transparent substance is coated on a first surface to form the transparent connecting layer 130, and then the second surface is adhered to the side of the transparent connecting layer 130 away from the first surface. The transparent substance coating method can make the transparent connecting layer 130 and the chip more tightly combined to ensure product quality.

[0076] Optionally, the transparent material includes at least one of aluminum oxide, silicon carbide and gallium nitride, which is not specifically limited. Through the above configuration, the transparent connection layer 130 has good transparency and can transmit light better, while ensuring the support of the transparent connection layer 130, that is, the transparent connection layer 130 can well support the light receiving device 120.

[0077] In some optional embodiments, the transparent connection layer 130 has an insulating property, and the light emitting device 110 and the light receiving device 120 are insulated and isolated by the transparent connection layer 130, thereby improving the reliability of the optical coupler.

[0078] In some optional embodiments, the method for preparing the optical coupler provided in the present application further includes: setting an isolation layer 140 between the light receiving devices 120 and the light receiving devices 120, and the isolation layer 140 is located between the first surface and the second surface.

[0079] like Figure 5 As shown, the optocoupler also includes an isolation layer 140 arranged between the first surface and the second surface. For example, the isolation layer 140 is directly attached to the first surface, and the second surface is stacked on the first surface through the isolation layer 140. That is to say, the first surface and the second surface are respectively attached to the two side surfaces of the isolation layer 140, and the isolation layer 140 can play a role in electrical isolation and increasing the isolation voltage.

[0080] Optionally, the isolation layer 140 includes, but is not limited to, glass, sapphire, organic transparent materials, inorganic transparent materials, and other devices capable of achieving electrical isolation and increasing isolation voltage, without specific limitation.

[0081] In some possible embodiments, the first surface and the second surface are connected via a transparent connecting layer 130 and an isolation layer 140. For example, the transparent connecting layer 130 is directly attached to the first surface, and then the isolation layer 140 is stacked on the transparent connecting layer 130, and the second surface is then attached to the isolation layer 140. At this time, the second surface of the light receiving device 120 is stacked on the first surface via the isolation layer 140 and the transparent connecting layer 130, which will not be elaborated.

[0082] In some optional embodiments, the method for preparing the optical coupler provided in the present application also includes: providing an electrical connection layer 150, and stacking the light receiving device 120 or the light emitting device 110 on the electrical connection layer 150, so that the electrical connection layer 150 is electrically connected to the first electrode port, or the electrical connection layer 150 is electrically connected to the second electrode port.

[0083] The electrical connection layer 150 may be a PCB board. PCB, namely Printed Circuit Board, is also called a printed circuit board. It is a support for electronic components and a provider of electrical connections for electronic components.

[0084] For example, taking the electrical connection layer 150 including an input side circuit board and an output side circuit board as an example, the first electrode port is electrically connected to the input side circuit board, and the second electrode port is electrically connected to the output side circuit board. During use, the input side circuit board outputs a voltage signal to the first electrode port, so that the light emitting device 110 emits light, and the light passes through the first surface and the second surface in sequence and is received by the light receiving device 120, and the light receiving device 120 outputs an electrical signal to the output side circuit board, which is then output by the output side circuit board to other circuits such as the main control chip.

[0085] Optionally, the electrical connection layer 150 may also be a FPC (Flexible Printed Circuit) or a lead, etc., without limitation.

[0086] As a possible implementation, when the light emitting device 110 is connected to the electrical connection layer 150, there is a gap between the light emitting device 110 and the electrical connection layer 150. Similarly, when the light receiving device 120 is installed and connected to the electrical connection layer 150, there is also a gap between the light receiving device 120 and the electrical connection layer 150. The present application improves the connection reliability between the light emitting device 110 and the electrical connection layer 150, or between the light receiving device 120 and the electrical connection layer 150, by filling the insulating filler 160 in the gap, and can also better support the light emitting device 110 or the light receiving device 120 by the electrical connection layer 150, thereby improving product quality.

[0087] Optionally, the insulating filler 160 includes at least one of resin, rubber and silicone. For example, taking resin as an example, the resin includes but is not limited to at least one of epoxy resin, polyester resin, phenolic resin, diphenyl ether resin, polyimide, melamine formaldehyde resin, silicone resin and fluororesin, without specific limitation.

[0088] In some optional embodiments, the preparation method provided in the present application further comprises:

[0089] Prepare a pad, the pad is used to be electrically connected to the first electrode port, and / or the pad is used to be electrically connected to the second electrode port. In other words, the pad includes an input pad 190 and an output pad 200, the input pad 190 is electrically connected to the first electrode port, and the output pad 200 is electrically connected to the second electrode port.

[0090] By setting pads on the first electrode port and the second electrode port, it is convenient to electrically connect the first electrode port and the second electrode port to other circuits or leads through the pads. For example, when the light receiving device 120 is installed and connected to the electrical connection layer 150, the input pad 190 is used to electrically connect to the line of the electrical connection layer 150, thereby realizing the transmission of electrical signals between the electrical connection layer 150 and the light receiving device 120.

[0091] Exemplarily, taking the electrical connection layer 150 as a PCB board, the first electrode port of the light receiving device 120 is electrically connected to the PCB board through a pad, and the PCB board outputs an electrical signal to the light emitting device 110 to control the light emitting device 110 to emit light. The light passes through the first surface, the transparent layer and the second surface in turn to reach the light receiving device 120, and the light receiving device 120 outputs the electrical signal to other circuits through the second electrode port and the output pad 200 to realize signal transmission.

[0092] Exemplarily, when preparing an optical coupler, a light emitting device 110 is provided, such as Figure 7 As shown in (a), the light emitting device 110 has a first surface and a first electrode port facing each other, and the first surface can be regarded as a light emitting surface of the light emitting device 110. The first electrode port can be an embedded electrode port or a protruding port, which is not limited here.

[0093] It should be noted that the first surface, as the light emitting surface, can be a directly emitting surface (the first surface has a luminescent material), or the light emitting device 110 can have a luminescent layer between the first surface and the first electrode port, and the light emitted by the luminescent layer passes through the first surface.

[0094] For example, when the light emitting device 110 is an LED flip chip, the light emitting layer (active region) inside it is usually a multiple quantum well (MQW, Multiple Quantum Well) structure, which is composed of alternating thin layers, one layer is a narrow bandgap material (such as InGaN), and the other layer is a wide bandgap material (such as GaN). The light emitting layer is located between the n-type semiconductor and the p-type semiconductor. When current passes through, electrons jump from the n-type semiconductor to the p-type semiconductor, and recombine with holes in the multiple quantum well region, releasing energy in the form of light.

[0095] In some embodiments, an input pad 190 is prepared at the first electrode port, such as Figure 7 As shown in (b), the light-emitting device 110 is electrically connected to other external circuits through the input pad 190. For example, when the light-emitting device 110 is mounted on the electrical connection layer 150, the input pad 190 is electrically connected to the circuit on the electrical connection layer 150, thereby realizing the transmission of electrical signals between the electrical connection layer 150 and the light-emitting device 110.

[0096] When the light emitting device 110 is mounted on the electrical connection layer 150, as shown in FIG. Figure 7 As shown in (c) of FIG. 1 , the input pad 190 is electrically connected to the electrical connection layer 150 .

[0097] Then, a transparent connecting layer 130 is prepared or coated on the first surface of the light emitting device 110, such as Figure 7 As shown in (d).

[0098] After the transparent connection layer 130 is prepared, the light receiving device 120 is disposed on a side surface of the transparent connection layer 130 away from the first surface. Figure 7 That is, there is a transparent connection layer 130 between the light emitting device 110 and the light receiving device 120 , and the transparent connection layer 130 is light-transmissive, so that optical signal transmission is achieved between the light emitting device 110 and the light receiving device 120 .

[0099] The light receiving device 120 has opposite second surfaces and second electrode ports, which are located on opposite outer sides of the light receiving device 120, and the second surface faces the transparent connecting layer 130. That is, the light emitting device 110 and the light receiving device 120 are stacked.

[0100] Prepare an output pad 200 at the second electrode port, such as Figure 7 As shown in (f), the input pad 190 and the output pad 200 are respectively arranged on the outside of the light emitting device 110 and the light receiving device 120, so there is no need to route between the light emitting device 110 and the light receiving device 120, and there is no wiring shielding. At the same time, the distance between the light emitting device 110 and the light receiving device 120 can be shortened, the optical coupler can be made smaller, and the light transmission path between the light emitting device 110 and the light receiving device 120 can be shortened.

[0101] It should be noted that, in the process of preparing the optical coupler, it is not necessary to strictly follow the above steps in sequence, and the execution order of each step can also be adjusted according to actual needs, for example, the transparent connection layer 130 is prepared first and then the input pad 190 is prepared, without limitation.

[0102] In some possible embodiments, the optical coupler manufacturing method provided in the present application further includes: providing a bonding wire 210, one end of the bonding wire 210 is used to be electrically connected to the pad, and the other end of the bonding wire 210 is used to be electrically connected to an external circuit. Figure 8 , Figure 8 compared to Figure 7 There is an additional step (g).

[0103] In some optional embodiments, the optical coupler manufacturing method provided in the present application further includes: providing an active device, electrically connecting the active device to the electrode of the light emitting device 110, and / or electrically connecting the active device to the electrode of the light receiving device 120. Fig. 9 , Fig. 9 compared to Figure 7 There are additional steps shown in (h) and (i).

[0104] Active devices refer to electronic components that require power to achieve their specific functions. Active devices include, but are not limited to, electron tubes, transistors, and integrated circuits. The first active device 170 is electrically connected to the electrodes of the light-emitting device 110, so that the optical coupler can achieve other functions, such as signal amplification and conversion functions, through the first active device 170, without specific limitation.

[0105] During implementation, the electrodes of the second active device 180 and the light receiving device 120 are electrically connected, so that the optical coupler can achieve other functions through the second active device 180, such as signal amplification and conversion functions, etc., without specific limitation.

[0106] As a possible implementation, the optical coupler manufacturing method provided in the present application includes:

[0107] Providing a prefabricated board, the prefabricated board having a plurality of PCB boards;

[0108] A plurality of light emitting devices 110 are arranged on the prefabricated board in a one-to-one correspondence according to the positions of the plurality of PCB boards, and then the prefabricated board is divided into a plurality of independent unit modules according to the positions of the PCB boards.

[0109] In practice, a large prefabricated board can be provided, and the large prefabricated board can be divided into several small PCB boards. In the preparation process, a plurality of light emitting devices 110 are first arranged in a matrix on the large prefabricated board, that is, one light emitting device 110 corresponds to a small PCB board, and then the large prefabricated board is cut into several independent unit modules, each of which includes a PCB board and a light emitting device 110, thereby improving production efficiency.

[0110] Optionally, during the preparation process, a plurality of light-emitting devices 110 may be arranged in a matrix on a large prefabricated board, that is, one light-emitting device 110 corresponds to a small PCB board, and then a transparent material is coated on the entire surface of the large prefabricated board to prepare a transparent connecting layer 130, and then the large prefabricated board is cut into a plurality of independent unit modules, each unit module including a PCB board, a transparent connecting layer 130 and a light-emitting device 110, which can effectively improve production efficiency.

[0111] In some optional embodiments, the light emitting device 110 and the light receiving device 120 are flip chips.

[0112] The light emitting device 110 and the light receiving device 120 of the conventional optical coupler adopt upright chips, which means that the P-type and N-type electrodes are usually located on the same side of the chip, that is, the light emitting side. However, the light emitting device 110 and / or the light receiving device 120 of the optical coupler of the present application adopts a flip chip, which means that the P-type and N-type electrodes are located at the bottom of the chip, that is, the side in contact with the substrate. Specifically, the light emitting device 110 and / or the light receiving device 120 in the present embodiment is a kind of LED flip chip, that is, the light emitting surface or the light receiving surface is located on a different side of the chip from the P-type and N-type electrodes. The flip-chip design does not dissipate heat through the substrate, and the electrodes do not block the light emitting surface, thereby improving the light emission efficiency. Preferably, the light-emitting device 110 and the light-receiving device 120 both adopt LED flip chips. Therefore, the light-emitting surface of the light-emitting device 110 is directly opposite to the light-receiving surface of the light-receiving device 120, and the first electrode port of the light-emitting device 110 and the second electrode port of the light-receiving device 120 are arranged back to back, which greatly reduces the distance between the light-emitting device 110 and the light-receiving device 120 and improves the coupling efficiency of the optical coupler.

[0113] In some optional embodiments, the wavelength of the light emitted by the light emitting device 110 is smaller than the wavelength of the light received by the light receiving device 120, and the difference between the wavelength of the light emitted by the light emitting device 110 and the wavelength of the light received by the light receiving device 120 is greater than 20 nanometers. Preferably, the difference is greater than 40 nanometers. Through the above configuration, the wavelength of the light emitted by the light emitting device 110 matches or substantially matches the sensitive wavelength of the light received by the light receiving device 120, which can effectively improve the energy conversion efficiency.

[0114] In some optional embodiments, the preparation method provided in the present application further comprises:

[0115] A package 220 is provided, and the package 220 is used to package the light emitting device 110 and the light receiving device 120 . The package 220 is provided with a window for exposing the first electrode port and the second electrode port.

[0116] The package 220 can be the shell of the optocoupler, and the package 220 has a built-in accommodating cavity, and the light-emitting device 110 and the light-receiving device 120 are both arranged in the accommodating cavity. The package 220 is also provided with a window, and the first electrode port and the second electrode port are exposed from the corresponding window, so that the first electrode port and the second electrode port can be coupled and connected with the pad, wire or other circuit structure through the window.

[0117] The packaging component 220 may be a plastic packaging component, or a silicone packaging component, a rubber packaging component, etc., and is used to package and protect the light-emitting device 110 and the light-receiving device 120 to prevent corrosion by water vapor and the like.

[0118] In some embodiments, the isolation layer 140 may also be covered or partially covered by the encapsulation member 220, such as Fig.10 , which is a schematic diagram of a structure in which the isolation layer 140 is partially covered.

[0119] In some optional embodiments, in the optocoupler, in order to increase the isolation voltage (i.e., improve the voltage resistance), a layer of transparent insulating material, such as glass, is usually added between the light-emitting device 110 and the light-receiving device 120. The purpose of this design is to increase electrical isolation, improve the isolation voltage, and prevent electrical breakdown under high voltage.

[0120] For example, taking the isolation layer 140 as glass, glass is a good insulating material that can effectively prevent current from passing through, thereby increasing the isolation voltage of the optical coupler. At the same time, the glass layer acts as a physical barrier to prevent direct contact between the light emitting device 110 and the light receiving device 120, reducing the risk of short circuit.

[0121] As a possible implementation, under high voltage conditions, the electric field strength will be significantly enhanced at the edge of the isolation layer 140 because the curvature of these areas is larger and the electric field lines are more concentrated. This phenomenon is called the "edge effect" or "edge high electric field effect". The edge high electric field will cause the local electric field strength to exceed the breakdown strength of the medium, thereby causing preferential breakdown and reducing the overall withstand voltage performance. In this embodiment, the width of the glass layer is greater than the width of the light-emitting device 110, that is, the projection area of ​​the isolation layer 140 on the plane where the first surface is located covers and is greater than the area of ​​the first surface, such as Fig.10 As shown. Taking the isolation layer 140 as glass as an example, by extending the isolation layer 140 beyond the area of ​​the light-emitting device 110 and the light-receiving device 120, the extended glass can effectively block the electrical breakdown between the edges of the upper and lower LEDs (light-emitting device 110 and light-receiving device 120), greatly increasing the insulation voltage value of the device, with better isolation performance, and expanding the area of ​​electric field distribution, reducing the electric field concentration at the edge, so that the electric field is evenly distributed over a larger area, reducing the electric field strength at the edge, thereby reducing the risk of edge-preferential breakdown, and there is no obvious high electric field area, thereby improving the overall voltage resistance.

[0122] Optionally, in addition to the width, the thickness of the glass layer (isolation layer 140 ) also needs to be precisely controlled to ensure sufficient electrical isolation and mechanical strength.

[0123] In some possible embodiments, the glass surface may be properly processed, such as polishing and flattening, to reduce defects and irregularities and further improve the pressure resistance performance.

[0124] Optionally, the active layer of the light receiving device 120 includes a direct bandgap material, and the active layer refers to the active region of the semiconductor device, that is, the pn junction of the semiconductor device. Direct bandgap means that in a semiconductor device, there is no direct connection between the conduction band and the valence band. For direct bandgap materials, since the electron transition process is more direct and there is no additional momentum change requirement, the probability of photon absorption is higher, thereby improving the light quantum efficiency.

[0125] Optionally, common direct bandgap includes GaAs (gallium arsenide), GaN (gallium nitride), InP (indium phosphide), etc.

[0126] Optionally, the light emitting portion of the light emitting device 110 and the light receiving portion of the light receiving device 120 are directly opposite to ensure the photoelectric conversion efficiency.

[0127] In some optional embodiments, the embodiments of the present application provide an optical coupler, which is manufactured by adopting the manufacturing method as described above.

[0128] In some optional embodiments, the present application provides an optical coupler, comprising:

[0129] A light emitting device 110 having a first surface and a first electrode port opposite to the first surface; and

[0130] The light receiving device 120 has a second surface and a second electrode port opposite to the second surface;

[0131] The light receiving device 120 is stacked on the first surface of the light emitting device 110 through the second surface, the first electrode port and the second electrode port are arranged opposite to each other, and the light emitted by the light emitting device 110 reaches the light receiving device 120 through the first surface and the second surface.

[0132] The light emitting device 110 and the light receiving device 120 are stacked, that is, the first surface and the second surface are arranged opposite to each other, so that the first electrode port and the second electrode port are respectively located on the outside of the light emitting device 110 and the light receiving device 120. The first electrode port and the second electrode port are used to connect with an external circuit, for example, the first electrode port is connected with the transmitting end circuit, and the second electrode port is connected with the receiving end circuit. During use, the transmitting end circuit outputs a voltage signal to the first electrode port, so that the light emitting device 110 emits light, and the light passes through the first surface and the second surface in sequence and is received by the light receiving device 120. The light receiving device 120 outputs an electrical signal to the receiving end circuit, thereby realizing the signal transmission function between the transmitting end circuit and the receiving end circuit.

[0133] Through the above arrangement, since the light-emitting device 110 and the light-receiving device 120 are arranged so that light reaches the light-receiving device through the first surface and the second surface, there is no need to run a wire between the light-emitting device 110 and the light-receiving device 120, and there is no wiring obstruction. At the same time, the distance between the light-emitting device 110 and the light-receiving device 120 can be shortened, the optical coupler can be made smaller, and the light transmission path between the light-emitting device 110 and the light-receiving device 120 can be shortened.

[0134] As a possible implementation, the first electrode port and the second electrode port may also be connected to an external circuit via a wire, that is, the first electrode port and the second electrode port are used to connect to one end of the wire, and the other end of the wire is used to connect to the external circuit.

[0135] The optical coupler provided in the present application includes a light-emitting device 110 and a light-receiving device 120, wherein the light-emitting device 110 has a first surface and a first electrode port opposite to each other, and the light-receiving device 120 has a second surface and a second electrode port opposite to each other, wherein the first surface is arranged relative to the second surface, and the first electrode port and the second electrode port are arranged opposite to each other, and the light emitted by the light-emitting device 110 reaches the light-receiving device 120 through the first surface and the second surface. The present application arranges the light-emitting device 110 and the light-receiving device 120 so that the first surface is arranged relative to the second surface. When working, the light emitted by the light-emitting device 110 reaches the light-receiving device 120 through the first surface and the second surface, thereby realizing the transmission of optical signals between the light-emitting device 110 and the light-receiving device 120. Since the input interface and the output interface are respectively located on the outward sides of the light-emitting device 110 and the light-receiving device 120, there are no electrodes or other wirings between the light-emitting device 110 and the light-receiving device 120, thereby maximizing the effective area of ​​the optical coupler. At the same time, the optical coupling distance between the light-emitting device 110 and the light-receiving device 120 can be reduced, the volume of the optical coupler can be reduced, and the transmission distance of the optical signal can be shortened. The reaction time of the optical coupler can be reduced, more light sources can be received at the same time, and the optical coupling efficiency is improved.

[0136] In some optional embodiments, such as Figure 3 and 4 As shown, the optical coupler provided in the present application further includes a transparent connection layer 130. Since the transparent connection layer 130 has a transparent property, the light emitted by the light emitting device 110 can sequentially pass through the first surface, the transparent connection layer 130 and the second surface to reach the light receiving device 120. In implementation, the transparent connection layer 130 can be a finished transparent film layer, for example, the finished transparent film layer is directly arranged between the first surface and the second surface, and the two side surfaces of the transparent connection layer 130 are respectively adhered to the first surface and the second surface to ensure the connection stability and reliability between the emitting chip and the light receiving device 120.

[0137] As a possible implementation manner, the transparent connecting layer 130 is made by coating with a transparent substance, that is, the transparent substance is coated on the first surface by coating to form the transparent connecting layer 130, and then the second surface is adhered to the side of the transparent connecting layer 130 away from the first surface. The transparent substance coating method can make the transparent connecting layer 130 and the chip more tightly combined to ensure product quality.

[0138] Optionally, the transparent material includes at least one of aluminum oxide, silicon carbide and gallium nitride, which is not specifically limited. Through the above configuration, the transparent connection layer 130 has good transparency and can transmit light better, while ensuring the support of the transparent connection layer 130, that is, the transparent connection layer 130 can well support the light receiving device 120.

[0139] In some optional embodiments, the transparent connection layer 130 has an insulating property, and the light emitting device 110 and the light receiving device 120 are insulated and isolated by the transparent connection layer 130, thereby improving the reliability of the optical coupler.

[0140] As a possible implementation, Figure 5 As shown, the optical coupler provided in the present application also includes an isolation layer 140 arranged between the light receiving device 120 and the light emitting device 110, and the isolation layer 140 is located between the first surface and the second surface. The first surface and the second surface are respectively bonded to the two side surfaces of the isolation layer 140, and the isolation layer 140 can play a role in electrical isolation and increasing the isolation voltage.

[0141] Optionally, the isolation layer 140 includes, but is not limited to, glass, sapphire, organic transparent materials, inorganic transparent materials, and other devices capable of achieving electrical isolation and increasing isolation voltage, without specific limitation.

[0142] In some possible embodiments, a transparent connection layer 130 and an isolation layer 140 may be disposed between the first surface and the second surface at the same time, which will not be described in detail.

[0143] In some optional embodiments, the optical coupler provided in the present application also includes an electrical connection layer 150, and the light receiving device 120 or the light emitting device 110 is stacked on the electrical connection layer 150 so that the electrical connection layer 150 is electrically connected to the first electrode port, or the electrical connection layer 150 is electrically connected to the second electrode port.

[0144] In implementation, the electrical connection layer 150 may be a PCB board. For example, taking the electrical connection layer 150 including an input side circuit board and an output side circuit board as an example, the first electrode port is electrically connected to the input side circuit board, and the second electrode port is electrically connected to the output side circuit board. During use, the input side circuit board outputs a voltage signal to the first electrode port so that the light emitting device 110 emits light, and the light is received by the light receiving device 120 after passing through the first surface and the second surface in sequence, and the light receiving device 120 outputs an electrical signal to the output side circuit board, which is then output by the output side circuit board to other circuits such as the main control chip.

[0145] Optionally, the electrical connection layer 150 may also be a FPC (Flexible Printed Circuit) or a lead, etc., without limitation.

[0146] As a possible implementation, when the light emitting device 110 is installed and connected to the electrical connection layer 150, there is a gap between the light emitting device 110 and the electrical connection layer 150. Similarly, when the light receiving device 120 is installed and connected to the electrical connection layer 150, there is also a gap between the light receiving device 120 and the electrical connection layer 150. The present application improves the connection reliability between the light emitting device 110 and the electrical connection layer 150, or between the light receiving device 120 and the electrical connection layer 150, by filling the insulating filler 160 in the gap, and can also better support the light emitting device 110 or the light receiving device 120 by the electrical connection layer 150, thereby improving product quality.

[0147] Optionally, the insulating filler 160 includes at least one of resin, rubber and silicone. For example, taking resin as an example, the resin includes but is not limited to at least one of epoxy resin, polyester resin, phenolic resin, diphenyl ether resin, polyimide, melamine formaldehyde resin, silicone resin and fluororesin, without specific limitation.

[0148] In some optional embodiments, the optical coupler provided in the present application further includes an active device, and the active device is electrically connected to an electrode of the light-emitting device 110 , and / or the active device is electrically connected to an electrode of the light-receiving device 120 .

[0149] Active devices refer to electronic components that require power to achieve their specific functions. Active devices include but are not limited to electron tubes, transistors, and integrated circuits, etc.

[0150] When implementing, Figure 6As shown, the active device includes a first active device 170 and a second active device 180, the first active device 170 is electrically connected to the electrode of the light-emitting device 110, and the second active device 180 is electrically connected to the electrode of the light-receiving device 120, so that the optical coupler can achieve other functions through the first active device 170 and the second active device 180, such as signal amplification, conversion function, etc., without specific limitation.

[0151] In some optional embodiments, the optical coupler provided in the present application further includes pads, and the pads include an input pad 190 and an output pad 200 , the input pad 190 is electrically connected to the first electrode port, and the output pad 200 is electrically connected to the second electrode port.

[0152] By setting pads on the first electrode port and the second electrode port, it is convenient to electrically connect the first electrode port and the second electrode port to other circuits or leads through the pads. For example, when the light receiving device 120 is installed and connected to the electrical connection layer 150, the input pad 190 is used to electrically connect to the line of the electrical connection layer 150, thereby realizing the transmission of electrical signals between the electrical connection layer 150 and the light receiving device 120.

[0153] Exemplarily, taking the electrical connection layer 150 as a PCB board, the first electrode port of the light receiving device 120 is electrically connected to the PCB board through a pad, and the PCB board outputs an electrical signal to the light emitting device 110 to control the light emitting device 110 to emit light. The light passes through the first surface, the transparent layer and the second surface in turn to reach the light receiving device 120, and the light receiving device 120 outputs the electrical signal to other circuits through the second electrode port and the output pad 200 to realize signal transmission.

[0154] In some optional embodiments, the optical coupler provided in the present application further includes a bonding wire 210, one end of the bonding wire 210 is used to be electrically connected to the pad, and the other end of the bonding wire 210 is used to be electrically connected to an external circuit.

[0155] The pad can be led out through wire bond (bonding lead 210). The bonding lead 210 is a thin metal wire that can be tightly welded to the output pad 200 by using heat, pressure, and ultrasonic energy to achieve electrical interconnection and information exchange between the light receiving device 120 and the light receiving device 120 and the external circuit. By setting the bonding lead 210, the connection between the optical coupler and the external circuit can be more convenient.

[0156] In some optional embodiments, the light emitting device 110 and / or the light receiving device 120 is a flip chip, that is, any one of the light emitting device 110 and the light receiving device 120 may be a flip chip, and the other may be another type of chip (e.g., upright, vertical, etc.) or a flip chip.

[0157] The light emitting device 110 and the light receiving device 120 of the conventional optical coupler adopt upright chips, which means that the P-type and N-type electrodes are usually located on the same side of the chip, that is, the light emitting side. However, the light emitting device 110 and / or the light receiving device 120 of the optical coupler of the present application adopts a flip chip, which means that the P-type and N-type electrodes are located at the bottom of the chip, that is, the side in contact with the substrate. Specifically, the light emitting device 110 and / or the light receiving device 120 in the present embodiment is a kind of LED flip chip, that is, the light emitting surface or the light receiving surface is located on a different side of the chip from the P-type and N-type electrodes. The flip-chip design does not dissipate heat through the substrate, and the electrodes do not block the light emitting surface, thereby improving the light emission efficiency.

[0158] In some optional embodiments, the wavelength of the light emitted by the light emitting device 110 is smaller than the wavelength of the light received by the light receiving device 120, and the difference between the wavelength of the light emitted by the light emitting device 110 and the wavelength of the light received by the light receiving device 120 is greater than 20 nanometers. Through the above configuration, the wavelength of the light emitted by the light emitting device 110 matches the sensitive wavelength of the light received by the light receiving device 120, which can effectively improve the energy conversion efficiency.

[0159] In some optional embodiments, the optical coupler provided in the present application further includes a package 220, and the package 220 is used to package the light-emitting device 110 and the light-receiving device 120, and the package 220 is provided with a window for exposing the first electrode port and the second electrode port.

[0160] The package 220 can be the shell of the optocoupler, and the package 220 has a built-in accommodating cavity, and the light-emitting device 110 and the light-receiving device 120 are both arranged in the accommodating cavity. The package 220 is also provided with a window, and the first electrode port and the second electrode port are exposed from the corresponding window, so that the first electrode port and the second electrode port can be coupled and connected with the pad, wire or other circuit structure through the window.

[0161] The packaging component 220 may be a plastic packaging component, or a silicone packaging component, a rubber packaging component, etc., and is used to package and protect the light-emitting device 110 and the light-receiving device 120 to prevent corrosion by water vapor and the like.

[0162] In some optional embodiments, in the optical coupler, in order to increase the isolation voltage (i.e., to improve the withstand voltage), a layer of transparent insulating material, such as glass, is usually added between the light emitting device 110 and the light receiving device 120 as an isolation layer. The purpose of this design is to increase electrical isolation and prevent electrical breakdown under high voltage. In this embodiment, the isolation layer 140 can also be covered or partially covered by the encapsulation member 220, such as Fig.10 , which is a schematic diagram of a structure in which the isolation layer 140 is partially covered.

[0163] For example, taking the isolation layer 140 as glass, glass is a good insulating material that can effectively prevent current from passing through, thereby increasing the isolation voltage of the optocoupler.

[0164] As a possible implementation, under high voltage conditions, the electric field strength will be significantly enhanced at the edge of the isolation layer 140 because the curvature of these areas is larger and the electric field lines are more concentrated. This phenomenon is called the "edge effect" or "edge high electric field effect". The edge high electric field will cause the local electric field strength to exceed the breakdown strength of the medium, thereby inducing preferential breakdown and reducing the overall withstand voltage performance. By making the width of the glass layer larger than the width of the light-emitting device 110, that is, the projection area of ​​the isolation layer 140 on the plane where the first surface is located covers and is larger than the area of ​​the first surface, such as Fig.10 As shown. Taking the isolation layer 140 as glass as an example, by extending the isolation layer 140 beyond the area of ​​the light-emitting device 110 and the light-receiving device 120, the extended glass can effectively block the electrical breakdown between the edges of the upper and lower LEDs (light-emitting device 110 and light-receiving device 120), greatly increasing the insulation voltage value of the device, with better isolation performance, and expanding the area of ​​electric field distribution, reducing the electric field concentration at the edge, so that the electric field is evenly distributed over a larger area, reducing the electric field strength at the edge, thereby reducing the risk of edge-preferential breakdown. There is no obvious high electric field area, thereby improving the overall voltage resistance.

[0165] Optionally, in addition to the width, the thickness of the glass layer (isolation layer 140 ) also needs to be precisely controlled to ensure sufficient electrical isolation and mechanical strength.

[0166] In some possible embodiments, the glass surface may be properly processed, such as polishing and flattening, to reduce defects and irregularities and further improve the pressure resistance performance.

[0167] In some embodiments, the present application further provides an electronic device, including the above-mentioned optical coupler. The electronic device can be a power supply and related devices, a communication device, an automotive electronic device, a medical device, a household appliance, and the like.

[0168] The present application directly stacks the light-emitting device 110 and the light-receiving device 120 so that the first surface is arranged relative to the second surface. The light emitted by the light-emitting device 110 is used to reach the light-receiving device 120 through the first surface and the second surface, thereby realizing the transmission of optical signals between the light-emitting device 110 and the light-receiving device 120, thereby reducing the optical coupling distance between the light-emitting device 110 and the light-receiving device 120 and shortening the transmission distance of the optical signal. Furthermore, since the input interface and the output interface are respectively located on the opposite sides of the light-emitting device 110 and the light-receiving device 120, no wiring is required between the light-emitting device 110 and the light-receiving device 120, thereby maximizing the effective area of ​​the optical coupler, reducing the volume of the optical coupler, receiving more photons at the same time, and improving the optical coupling efficiency.

[0169] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for preparing an optical coupler, characterized in that: include: Providing a light emitting device, the light emitting device having a first surface and a first electrode port opposite to the first surface; Providing a light receiving device, the light receiving device having a second surface and a second electrode port opposite to the second surface; The light receiving device is stacked on the first surface of the light emitting device through the second surface, and the first electrode port and the second electrode port are arranged opposite to each other, so that the light emitted by the light emitting device reaches the light receiving device through the first surface and the second surface.

2. The preparation method according to claim 1, characterized in that Also includes: An isolation layer is provided between the light receiving device and the light emitting device, and the isolation layer is located between the first surface and the second surface.

3. The preparation method according to claim 1, characterized in that: Also includes: A transparent connection layer is provided between the light receiving device and the light emitting device.

4. The preparation method according to claim 1, characterized in that: Also includes: An electrical connection layer is provided, and the light receiving device or the light emitting device is stacked on the electrical connection layer, so that the electrical connection layer is electrically connected to the first electrode port, or the electrical connection layer is electrically connected to the second electrode port.

5. The preparation method according to claim 1, characterized in that: Also includes: An active device is provided, and the active device is electrically connected to the electrode of the light-emitting device, and / or the active device is electrically connected to the electrode of the light-receiving device.

6. The preparation method according to claim 1, characterized in that: Also includes: A pad is prepared, wherein the pad is used to be electrically connected to the first electrode port, and / or the pad is used to be electrically connected to the second electrode port.

7. The preparation method according to claim 1, characterized in that: The light emitting device and / or the light receiving device is a flip chip.

8. The preparation method according to claim 1, characterized in that: The wavelength of the light emitted by the light emitting device is smaller than the wavelength of the light received by the light receiving device, and the difference between the wavelength of the light emitted by the light emitting device and the wavelength of the light received by the light receiving device is greater than 20 nanometers.

9. The preparation method according to claim 2, characterized in that: The projection area of ​​the isolation layer on the plane where the first surface is located covers and is larger than the area of ​​the first surface.

10. The preparation method according to claim 2, characterized in that: Also includes: A package is provided, the package being used to package the light emitting device and the light receiving device, the package being provided with a window for exposing the first electrode port and the second electrode port.

11. The preparation method according to claim 1, characterized in that: The active layer of the light receiving device includes a direct bandgap material.

12. An optical coupler, characterized in that: The optical coupler is manufactured by adopting the manufacturing method according to any one of claims 1 to 11.

13. An electronic device, characterized in that: Comprising the optical coupler of claim 12.

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