Back-side integrated torsion loading mechanism

Abstract

The invention discloses a backside integrated torsional loading mechanism. Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier, the integrated circuit (IC) carrier including: a plurality of walls; a support carried by the wall for supporting the IC from below; and a retaining clip for fixing the IC.

Description

Technical Field

[0001] The present disclosure relates generally to electronic devices, and more particularly, to supports for internal hardware of electronic devices. Background Art

[0002] Electronic devices include different supports for different internal hardware at different life stages. For example, a central processing unit (CPU) may be supported by a CPU carrier during the manufacturing process. During assembly of an electronic device, the CPU carrier carries the CPU as it is moved from a shipping pallet to a land grid array (LGA) socket. The CPU may also be supported by a CPU retention mechanism to secure the CPU to a printed circuit board (PCB). The PCB itself includes structural supports beneath the PCB to support the load carried by the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Figure 1 is a perspective view of an example carrier (“IC carrier”) for an integrated circuit (IC) such as a CPU.

[0004] Figure 2 is an enlarged exploded view of the example removed pins and IC carrier.

[0005] Figure 3A and Figure 3B is a schematic diagram illustrating an example operation of removing pins for removing an IC from an IC carrier.

[0006] Figure 4 is an exploded view of an example IC retention mechanism having an example dual gear transmission assembly.

[0007] Figure 5 yes Figure 4 A separate view of the IC retention mechanism.

[0008] Fig. 6A yes Figure 4 An enlarged top view of the dual gear transmission assembly.

[0009] Figure 6B yes Figure 4 An enlarged side view of the dual gear transmission assembly.

[0010] Figure 6C yes Figure 4 An enlarged perspective view of a dual gear transmission assembly.

[0011] Fig.6D yes Figure 4An enlarged exploded view of the dual gear transmission assembly.

[0012] Figure 7 yes Figure 4 Exploded and partially assembled diagrams of the IC retention mechanism.

[0013] Figure 8 yes Figure 4 Top perspective view of the IC retention mechanism.

[0014] Fig. 9 yes Figure 4 Bottom perspective view of the IC retention mechanism.

[0015] Fig.10 is a sample assembly tool, Figure 4 Top perspective view of the IC retention mechanism.

[0016] Fig.11 is a schematic illustration of the operation of the retention mechanism disclosed herein.

[0017] Fig.12 is a bottom perspective view of another example IC retention mechanism including an example gear / sprocket drive assembly.

[0018] Fig.13A yes Fig.12 Magnified top view of the gear / sprocket drive assembly.

[0019] Fig. 13B yes Fig.12 An enlarged side view of the gear / sprocket drive assembly.

[0020] Fig. 13C yes Fig.12 An enlarged perspective view of the gear / sprocket drive assembly.

[0021] Fig.13D yes Fig.12 An enlarged exploded view of the gear / sprocket drive assembly.

[0022] Fig.14 yes Fig.12 Side view of the gear / sprocket drive assembly.

[0023] Fig.15 is a top perspective view of an example PCB support.

[0024] Fig.16 yes Fig.15 An enlarged view of a portion of an example line of a PCB support.

[0025] In general, the same reference numbers will be used to refer to the same or like parts throughout the drawings(s) and the accompanying written description.The drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0026] A package-heatsink module (PHM) is a subassembly for loading an integrated circuit (IC) (such as a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor and / or other processor circuitry) onto a land grid array (LGA) socket. One of the parts within the subassembly is an IC carrier, which protects the IC during transportation. The functions of the IC carrier include safely moving the IC from a shipping pallet to a socket (e.g., an LGA socket) during assembly of an electronic device and ensuring that the correct product is installed in the correct orientation. The design of the IC, the socket, and the loading mechanism imposes design constraints on the IC carrier. Additionally, in some examples, it is desirable to have the carrier pre-attached to the IC in the shipping pallet so that the customer is exempted from the process of assembling the IC and the IC carrier, and controlling the IC carrier inventory. Although the examples disclosed herein are described using ICs, other components coupled to a printed circuit board (PCB) or other substrate via a socket (e.g., an LGA socket) may also be coupled to the example IC carrier disclosed herein.

[0027] Also disclosed herein is an example IC retention mechanism. The IC retention mechanism retains the IC (or other devices as described above) in the socket assembly. Due to the space limitations within the keep-out zone associated with the socket / connector, the design of the IC retention mechanism may be challenging. The keep-out zone is an area defined near the socket / connector for the IC to prevent the placement or routing of components on the PCB surface or through the PCB layer, thereby preventing interference. In addition, there is a growing demand to increase the mechanical load to compress the IC on the socket, especially on large form factor packages. In other words, although the mechanical load requirements and the number of IC contacts are increasing as electronic devices develop and become more capable, the physical area that allows the implementation of the IC retention mechanism is still restrictive. The example IC retention mechanism disclosed herein implements a robust design that can be assembled and operated within this restricted physical area.

[0028] Furthermore, the pins of an IC are very small, thin, fragile, and numerous. The example IC retention mechanism disclosed herein enables high precision insertion to control the IC angle during insertion and ensure that the IC is not tilted during assembly into a socket.

[0029] Also disclosed herein is an example PCB support. The examples disclosed herein integrate a torsion loading mechanism (such as, for example, a torsion wire or a torsion spring) on ​​one side (e.g., the bottom side) of the PCB. Previous solutions use a load spring on the top side of the PCB. As the CPU package size increases, the loading of the thermal interface material also increases. As the load increases, the typical coil spring grows in diameter to scale proportionally with the load increase. In a space-constrained environment (such as a housing of an electronic device (e.g., a personal computer (PC), a laptop, a mobile device (such as a phone, a tablet, etc.)), there is almost no space for scaling the diameter of the coil spring with other electronic components including thermal components that compete for space without reconfiguring the PCB and reducing the footprint of the pin layout pattern. The example PCB support disclosed herein increases the load that the PCB can support. For example, the PCB support disclosed herein includes a torsion wire that has greatly improved load capacity within a compact geometry. The example PCB support disclosed herein increases the mechanical load of the thermal interface that the PCB can support, which can increase the thermal capacity (i.e., cooling capacity) of the electronic device in which the PCB support is included.

[0030] The example IC carriers, example IC retention mechanisms, and example PCB supports disclosed herein may be included in different electronic devices individually or in any combination. For example, an example electronic device may include one or more of the following: (a) one or more example IC carriers disclosed herein, (b) one or more example IC retention mechanisms disclosed herein, and / or (c) one or more example PCB supports disclosed herein.

[0031] Figure 1 1 is a perspective view of an example IC carrier 100 constructed in accordance with the teachings of the present disclosure. The IC carrier 100 includes an example frame 102. The frame 102 includes an example first wall 104, an example second wall 106, an example third wall 108, and an example fourth wall 110. The first wall 104 is coupled to the second wall 106 at one end and to the fourth wall 110 at another end. The second wall 106 is coupled to the first wall 104 at one end and to the third wall 108 at another end. The third wall 108 is coupled to the second wall 106 at one end and to the fourth wall 110 at another end. The fourth wall 110 is coupled to the first wall 104 at one end and to the third wall 108 at another end.

[0032] The frame 102 includes a housing for carrying an example IC 112 (such as, for example, IC 112) ( Figure 2). For example, the frame 102 also includes an example first support 114 coupled to the first wall 104. The frame 102 includes an example second support coupled to the third wall 108. In some examples, the second support is opposite to the first support 114. In addition, the frame includes an example third support coupled to the second wall 106 and an example fourth support 116 coupled to the fourth wall 110. In some examples, the third support is opposite to the fourth support 116. In some examples, the first support 114 and the second support can be offset and not positioned directly opposite to each other. Similarly, in some examples, the third support and the fourth support 116 can be offset and not positioned directly opposite to each other. In some examples, the first support 114 and the second support are coplanar. In some examples, the third support and the fourth support 116 are coplanar. In some examples, the first support 114, the second support, the third support, and the fourth support 116 are all coplanar. In some examples, there are only two supports (e.g., first support 114 and third support; or second support and fourth support 116). In other examples, there are three supports or more than four supports. In the illustrated example, first support 114, second support, third support, and fourth support 116 are located at or near the respective lower ends of first wall 104, second wall 106, third wall 108, and fourth wall 110.

[0033] IC 112 can be inserted into IC carrier 100 from, for example, the top side of carrier 100 and supported by first support 114, second support, third support, and fourth support 116. In prior designs, the carrier would be pressed down onto the IC (e.g., the IC is inserted from below the carrier). Using the top side to insert the IC into the carrier allows the tooling in the factory to automate the installation of the IC into the IC carrier. Using automation and machines to install the IC into the IC carrier eliminates the ergonomic constraints required to press a clip or carrier onto the IC from above.

[0034] Supporting the IC 112 on the IC carrier 100 from below also enables thinner IC support features (e.g., first support member 114, second support member, third support member, and fourth support member 116) than existing methods. In some examples, the thinner IC support members are about 20% thinner than existing methods. The thinner supports disclosed herein can be more easily assembled in the smaller space between the IC 112 and the socket than existing methods. The thinner IC support features also allow for thinner sockets. The thinner the socket, the shorter the contact, and the better the signal integrity. The shorter the contact, the shorter the distance the signal travels, and the lower the chance of signal degradation, which improves signal integrity.

[0035] Fixed support (such as, for example, first support 114, second support, third support and / or fourth support 116) is stronger than the flexible clip that can be manipulated by humans in the existing method. In addition, since the first support 114, second support, third support and / or fourth support 116 are not positioned to be manipulated by humans, there is greater freedom in the position where the first support 114, second support, third support and / or fourth support 116 can be positioned. Greater flexibility in the support position allows more adjustable, adaptive and / or various pin diagram layouts with higher input / output (I / O) counts, and adds space for strengthening the socket. In the existing IC carrier design used with short sockets, the IC clip is positioned in the corner to be manipulated by humans, which means that the socket needs the cutout opening in the corner to provide clearance for the clip. The clip is removed from the socket corner, removing the need for the cutout opening on the socket. In the absence of the cutout opening, there is more material in the corner of the socket. Thus, there can be a taller reference wall, and a sturdier or stronger socket.The reference wall is an alignment feature on the socket that centers the IC in the socket.

[0036] Additionally, the IC carrier 100 has a thinner overall height that can fit in a Joint Electron Device Engineering Council (JEDEC) shipping tray. In some examples, the height is about 20% thinner than existing methods. Existing IC carrier designs cannot fit in a JEDEC shipping tray.

[0037] The IC carrier 100 also includes a socket key for mating with the LGA socket. In other words, the socket key mates with a complementary socket on the LGA socket. In the illustrated example, the fourth wall 110 includes an example first socket key 118 and an example second socket key 120. In some examples, there is only one socket key. In some examples, the second wall 106 opposite to the fourth wall 110 also includes one or more socket keys. In some examples, one or more socket keys on the second wall 106 are aligned relative to the first socket key 118 and the second socket key 120 of the fourth wall 110. In some examples, there are other numbers (such as three, five, etc.) of socket keys. In some examples, one or more socket keys or additional socket keys are positioned on the first wall 104 and / or the third wall 108.

[0038] The IC carrier 100 also includes a thermal solution attachment clip for coupling the IC carrier 100 to a thermal solution (such as, for example, a heat sink). In the illustrated example, the second wall 106 includes an example first thermal solution attachment clip 122 and an example second thermal solution attachment clip 124. The fourth wall 110 includes an example third thermal solution attachment clip 126 and an example fourth thermal solution attachment clip 128. In some examples, there is only one thermal solution attachment clip. In some examples, there is only one thermal solution attachment clip per wall. In some examples, the first thermal solution attachment clip 122 and the second thermal solution attachment clip 124 on the second wall 106 are aligned relative to the third thermal solution attachment clip 126 and the fourth thermal solution attachment clip 128 of the fourth wall 110. In some examples, there are other numbers (such as three, five, etc.) of thermal solution attachment clips. In some examples, one or more thermal solution attachment clips or additional thermal solution attachment clips are positioned on the first wall 104 and / or the third wall 108.

[0039] The IC carrier 100 also includes alignment holes for aligning and coupling the IC 112 with the LGA socket. In the illustrated example, the second wall 106 includes an example first alignment hole 130 and an example second alignment hole 132, and the fourth wall 110 includes an example third alignment hole 134 and an example fourth alignment hole 136. In some examples, there is only one alignment hole. In some examples, there is only one alignment hole per wall. In some examples, the first alignment hole 130 and the second alignment hole 132 on the second wall 106 are aligned relative to the third alignment hole 134 and the fourth alignment hole 136 of the fourth wall 110. In some examples, there are other numbers (such as three, five, etc.) of alignment holes. In some examples, one or more alignment holes or additional alignment holes are positioned on the first wall 104 and / or the third wall 108.

[0040] IC 112 is held in IC carrier 100 to secure IC 112 and prevent damage to the CPU in the event, for example, that IC carrier 100 is inverted. In some examples, one or more retention clips are used to secure IC 112 in IC carrier 100. In the illustrated example, first wall 104 includes an example first retention clip 138 and an example second retention clip 140. Fourth wall 110 includes an example third retention clip 142 and an example fourth retention clip 144. Third wall 108 includes an example fifth retention clip 146 and an example sixth retention clip 148. Second wall 106 includes an example seventh retention clip and an eighth retention clip. In some examples, there may be other numbers (e.g., one, three, etc.) of retention clips per wall. In some examples, one or more of first wall 104, second wall 106, third wall 108, and / or fourth wall 110 may have a different number of retention clips (e.g., zero, one, two, three, etc.) than another of first wall 104, second wall 106, third wall 108, and / or fourth wall.

[0041] The carrier 100 includes example holes 150 in the first wall 104, the second wall 106, the third wall 108, and / or the fourth wall 110, the example holes 150 corresponding to respective ones of the first retention clip 138, the second retention clip 140, the third retention clip 142, the fourth retention clip 144, the fifth retention clip 146, the sixth retention clip 148, the seventh retention clip, and / or the eighth retention clip. In the illustrated example, respective ones of the holes 150 are collinear with respective ones of the first retention clip 138, the second retention clip 140, the third retention clip 142, the fourth retention clip 144, the fifth retention clip 146, the sixth retention clip 148, the seventh retention clip, and / or the eighth retention clip.

[0042] Figure 2 is an enlarged exploded view of example removal pins 152 for removing IC 112 from IC carrier 100. For example, when the IC is returned to a manufacturer, the IC may be removed from the carrier and work performed on the IC without the carrier. Figure 3A and Figure 3B 1 is a schematic illustration showing an example operation of removing pins 152. The operation of removing pins 152 can be a manual process and / or an automated process. Removing IC 112 from IC carrier 100 is described herein with respect to third retaining clip 142 on fourth wall 110, but the same description applies across retaining clips disclosed herein. Figure 2 , Figure 3A and Figure 3B The further details shown and described for third retention clip 142 are applicable to any of the retention clips disclosed herein.

[0043] To remove the IC 112 from the IC carrier 100, the removal pin 152 is inserted into the hole 150 of the fourth wall 110. The removal pin 152 engages the third retention clip 142. The third retention clip 142 includes an example cavity 154 for receiving the removal pin 152. The third retention clip 142 includes an example first surface 156 that can be engaged with an electronic component (e.g., IC 112). The third retention clip 142 includes an example second surface 158 that can be engaged with the removal pin 152. In some examples, the second surface 158 includes a cam and / or a ramp. The third retention clip 142 is rotatable. When the removal pin 152 engages the second surface 158 and is further pressed into the hole 150 and the cavity 154, the third retention clip 142 rotates due to the engagement of the pin 152 and the second surface 158. In some examples, the third retention clip 142 slides. In the illustrated example, the third retention clip 142 rotates in a clockwise direction, which retracts the first surface 156 into the fourth wall 110. The retracted first surface 156 clears the IC 112. This allows the IC 112 to be removed from the IC carrier 110.

[0044] In some examples, the removal pin 152 is coupled to the example elongated rod 160 ( Figure 2 ). The elongated rod 160 is coupled to the second removal pin. Thus, the elongated rod 160 with two removal pins can simultaneously retract, for example, the third retention clip 142 and the fourth retention clip 144 in response to the two removal pins being inserted (e.g., simultaneously inserted) into corresponding holes on the fourth wall 110. The same process can be repeated on any of the walls. In addition, in some examples, there are multiple elongated rods 160 with removal pins for retracting corresponding ones of the retention clips on the IC carrier 100.

[0045] Figure 4-Figure 14 An example IC retention mechanism, or simply a retention mechanism, is shown. Figure 42 is an exploded view of an example system 200 for retaining an IC. System 200 includes example components such as a thermal solution 202, an example backing plate 204, an example electronic package 206, an example PCB 208, and an example retention mechanism 210. In some examples, thermal solution 202 is a heat sink. In some examples, package 206 is an IC (such as, for example, IC 112). In some examples, retention mechanism 210 is a torsion drive system. In some examples, thermal solution 202 is on a first side of PCB 208, and retention mechanism 210 is on a second side of PCB 208. In the illustrated example, retention mechanism 210 is on the bottom side of PCB 208. Retention mechanism 210 below PCB 208 enables the use of different configurations of retention mechanisms such as torsion drive systems, wherein the elements in such systems fit within a gap between a server chassis sled of an electronic device in which system 200 is positioned and a back plate of retention mechanism 210. In some examples, the gap is about 5 millimeters (mm). In some examples, the height of the elements of the retention mechanism is about 5 mm.

[0046] Retention mechanism 210 pulls thermal solution 202 toward PCB 208, which retains package 206 between thermal solution 202 and PCB 208. The functional principle of system 200 is that package-thermal solution loading utilizes the hard, flat bottom surface of thermal solution 202 to compress the upper surface of package 206 directly.

[0047] Figure 5 yes Figure 4 2. The retention mechanism 210 of the embodiment of the present invention is shown in FIG. 2. The retention mechanism 210 includes a plurality of example screw assemblies 212. A respective screw assembly in the screw assemblies 212 includes an example screw 214 and an example gear 216. The screw assemblies 212 releasably couple the retention mechanism 210 to the thermal solution 202. For example, the screw 214 extends through an example hole 218 in the PCB 208, through an example hole 220 in the backing plate 204, and through an example hole 222 in the thermal solution 202. In some examples, the hole 222 of the thermal solution 202 is a threaded washer that engages with threads on the screw 214. In some examples, there are four sets of each of the following: screw assemblies 212, screws 214, gears 216, holes 218 in the PCB 208, holes 220 in the backing plate 204, and holes 222 in the thermal solution 202. Other examples may include sets of other numbers of these components, such as, for example, two, three, five, and so on.

[0048] The retention mechanism 210 also includes an example dual gear transmission assembly (also referred to herein as a dual gear assembly) 224. The dual gear assembly 224 includes an example first gear 226 and an example second gear 228. Fig. 6A is a top view of the dual gear assembly 224 . Figure 6B is a side view of dual gear assembly 224 . Figure 6C is a perspective view of dual gear assembly 224 . Fig.6D 2 is an exploded view of the dual gear assembly 224. The dual gear assembly 224 also includes an example drive shaft 230 coupled between the first gear 226 and the second gear 228. In some examples, the drive shaft 230 extends through the example rivet nut 232, the example retainer 234, the example washer 236, and the example slotted round nut 238. In other examples, fewer, additional, and / or alternative fasteners may be used to form the dual gear transmission assembly 224.

[0049] The retention mechanism 210 includes an example timing belt 240. In some examples, the timing belt 240 includes silicone with Kevlar reinforcements to provide tension, impact resistance, and the ability to withstand high temperatures. In other examples, other materials may be used additionally and / or alternatively to provide tension, impact resistance, and / or the ability to withstand high temperatures. Similar materials may be used for any of the gears disclosed herein.

[0050] The timing belt 240 is coupled between the screw assembly 212 and the second gear 228 of the dual gear assembly 224. The timing belt 240 has a first side, a second side, and teeth on the first side and the second side for engaging the plurality of screw assemblies 212 and the dual gear assembly 224. In some examples, the teeth on the first side of the timing belt 240 engage the dual gear assembly 224, and the teeth on the second side of the timing belt 240 engage the plurality of screw assemblies 212.

[0051] The retention mechanism 210 includes a plurality of example pulleys 242. In some examples, the pulleys 242 are tensor pulleys. In some examples, the pulleys 242 engage a timing belt 240 between the screw assemblies 212. In the illustrated example, there are three pulleys 242. Other examples may include additional or fewer pulleys 242. In some examples, there are no pulleys 242 between the two screw assemblies 212 where the dual gear assembly 224 is located.

[0052] The retention mechanism 210 includes a main drive gear (also referred to herein as a main gear) 244. The main gear 244 is coupled to the first gear 226 of the dual gear assembly 224. The main gear 244 includes an example tool bit sleeve 246, through which a tool can be used to rotate the main gear 244. In this disclosure, "main" is a naming convention used to distinguish gears, but it is not intended to imply any order, preference, etc. The main gear 244 is manipulated by a user to operate the retention mechanism 210.

[0053] Figure 7 is a partially assembled view of system 200 . Figure 8 is a top perspective view of the assembled system 200 . Fig. 9 is a bottom perspective view of the assembled system 200. Fig. 9 As shown, the system 200 includes an example back plate 248. The gears 216 of the plurality of screw assemblies 212 and the second gear 228 of the dual gear assembly 224 are positioned on a first side (e.g., a lower side or bottom side) of the back plate 248. The PCB 208, the first gear 226 of the dual gear assembly 224, and the main gear 244 are positioned on a second side (e.g., an upper side or top side) of the back plate 248. In this example, the drive shaft 230 extends through the back plate 248 between the first gear 226 and the second gear 228.

[0054] Fig.10 200 and an example assembly tool 250. The assembly tool 250 engages with the tool bit sleeve 246 of the main gear 244. The user manipulates the assembly tool 250 to rotate the main gear 244. In the illustrated example, the assembly tool 250 is a screwdriver. In other examples, other assembly tools (e.g., a hex wrench, etc.) can be used. In some examples, the user gently presses the thermal solution 202 while rotating the assembly tool 250 to initiate threaded engagement between the thermal solution 202 and the threads on the screw 214.

[0055] Fig.11 is a schematic illustration showing an example operation of the retention mechanism 210. If the user rotates the main gear 244 to the right or clockwise, torque is applied to the dual gear assembly 224 and the lower or second gear 228 of the dual gear assembly 224 rotates to the left or counterclockwise. The second gear 228 moves the timing belt 240 in a clockwise direction. The timing belt 240 causes each of the gears 216 of the screw assembly 212 to rotate to the right or clockwise direction.

[0056] Rotation of the screw assembly 212 causes the screw 214 to engage with the thermal solution 202 (e.g., with the hole 222 of the thermal solution 202, which may be a threaded washer). When the screw 214 engages the thermal solution 202, the retention mechanism 210 pulls the thermal solution 202 toward the PCB 208. The retention mechanism 210 applies the force uniformly and simultaneously to the corners of the thermal solution 202. The force applied to the thermal solution 202 causes the thermal solution to compress the package 206. The compression of the package 206 (e.g., IC 112) causes the package 206 to engage into the pins of a socket (e.g., an LGA socket).

[0057] The gears of the retention mechanism 210 are assembled to a back plate 248 located below the PCB 208, which allows the torque force to be transmitted to all of the screws 214 simultaneously by rotating only one main transmission element (e.g., the main gear 244) using an assembly tool 250. The rotation of the screws 214 pulls the screws toward the PCB 208 and then converts the rotational form from the main gear 244 into a downward force, thereby applying a load to the package 206 in a controlled manner as disclosed above. In some examples, the torque applied to the main transmission element (e.g., the main gear 244) can be based on the specific load requirements of the thermal solution 202 and the package 206.

[0058] Fig.12 3 is a bottom perspective view of another example system 300 for retaining an IC package (such as, for example, a CPU) to a PCB and / or a socket. Example system 300 is similar to system 200 disclosed above. Thus, the description of similar elements will not be repeated in this article. On the contrary, the interested reader can refer to the above for a complete discussion of similar elements. Similar reference numerals are used for similar elements to facilitate this reference. However, system 300 includes an example gear / sprocket drive assembly instead of a dual gear drive assembly. In some examples, sprockets replace gears to improve the interaction between the drive elements, which is useful when the load is high.

[0059] The example system 200 includes a thermal solution 202 (eg, a heat sink), a backing plate 204 (eg, Fig.14 ), electronic package 206 (eg, IC) ( Fig.14 ), PCB 208, and example retention mechanism 302. Retention mechanism 302 is a torsion force transmission system. As with system 200, in the illustrated example system 300, thermal solution 202 is on a first side of PCB 208, and retention mechanism 302 is on a second side of PCB 208. In the illustrated example, retention mechanism 302 is on the bottom side of PCB 208.

[0060] The retention mechanism 302 includes a plurality of example screw assemblies 212 that releasably couple the retention mechanism 302 with the thermal solution 202 in a manner similar to that disclosed above with respect to the system 200 .

[0061] The retention mechanism 302 also includes an example gear-sprocket drive assembly 304. The gear-sprocket drive assembly 304 includes an example gear 306 and an example sprocket 308. Fig.13A is a top view of the gear-sprocket drive assembly 304 . Fig. 13B is a side view of the gear-sprocket drive assembly 304 . Fig. 13C is a perspective view of the gear-sprocket drive assembly 304 . Fig.13D304. The gear-sprocket drive assembly 304 also includes an example drive shaft 310 coupled between the gear 306 and the sprocket 308. In some examples, the drive shaft 310 extends through the example rivet nut 312, the example retainer 314, the example washer 316, and the example slotted nut 318. In other examples, fewer, additional, and / or alternative fasteners and / or other components may be used to form the gear-sprocket drive assembly 304.

[0062] The retention mechanism 302 of this example includes an example transmission chain 320. In some examples, the transmission chain 320 includes a lightweight material. In some examples, the transmission chain 320 includes a quiet material. In some examples, the transmission chain 320 includes a reinforced material. In some examples, the transmission chain 320 includes a non-conductive material. In some examples, the transmission chain 320 includes a plastic material (such as, for example, acetal plastic). In other examples, other materials may be used additionally and / or alternatively to provide tension, impact resistance, and the ability to withstand high temperatures. Similar materials can be used for any of the gears disclosed herein.

[0063] The drive chain 320 is coupled between the screw assemblies 212 and the sprocket 308 of the gear-sprocket drive assembly 304. The drive chain 320 includes holes between links for engaging multiple screw assemblies 212 and the sprocket 308. The drive chain 320 has a first side and a second side. A corresponding screw assembly in the screw assemblies 212 engages the first side of the drive chain 320. The sprocket 308 of the gear-sprocket drive assembly 304 engages the second side of the drive chain 320 between two screw assemblies 212 in the screw assemblies 212.

[0064] The retaining mechanism 302 includes a plurality of pulleys 242 as disclosed above in the description of the system 200. The retaining mechanism 302 also includes a main gear 244. The main gear 244 is coupled to a gear 306 of the gear-sprocket drive assembly 304. The main gear 244 includes a tool bit sleeve 246 via which a tool (e.g., an assembly tool 250) can be used to rotate the main gear 244, as disclosed above.

[0065] Fig.14 yes Fig.12 2 is a side view of a system 300. The system 300 includes a back plate 248. The gears 216 of the plurality of screw assemblies 212 and the sprockets 308 of the gear-sprocket drive assembly 304 are positioned on a first side (e.g., a lower side or bottom side) of the back plate 248. The PCB 208, the gears 306 of the gear-sprocket drive assembly 304, and the main gear 244 are positioned on a second side (e.g., an upper side or top side) of the back plate 248. In this example, the drive shaft 310 extends through the back plate 248 between the sprockets 308 and the gears 306 of the gear-sprocket drive assembly 304. Fig.14 Also illustrated are example socket pins 322 via which the package 206 is coupled to the LGA socket. The retention mechanism 302 is similar to Fig.11 The retention mechanism 210 disclosed in the disclosure operates in this manner.

[0066] Fig.15 4 is a top perspective view of an example PCB support 400. PCB support 400 can be used to support a PCB (such as, for example, PCB 208) and electronic components on PCB 208. In some examples, the electronic component is thermal solution 202. PCB support 400 can be positioned below PCB 208 to support thermal solution 202 or other loads above PCB 208. As a result, the top side of PCB 208 can have a small amount (e.g., minimal) of mechanical hardware as a load support structure. In some examples, PCB support 400 is mounted to a cold plate (such as, for example, a cold plate made of copper).

[0067] PCB support 400 includes an example frame 402 and an example torsion loading mechanism 404. In some examples, frame 402 includes steel, aluminum, and / or ceramic. Torsion loading mechanism 404 includes a first example torsion wire 406 and a second example torsion wire 408. In some examples, first torsion wire 406 and second torsion wire 408 are continuous. In some examples, torsion loading mechanism 404 includes a different number of torsion wires (such as, for example, one, three, etc.). In some examples, one or more of first torsion wire 406 and / or second torsion wire 408 has a diameter of about 3 mm (+ / - 20%). In some examples, frame 402 includes a first example channel 410 and a second example channel 412, first torsion wire 406 is at least partially embedded in first example channel 410, and second torsion wire 408 is at least partially embedded or accommodated in second example channel 412. In some examples, first channel 410 and second channel 412 are continuous. In some examples, first torsion wire 406 and / or second torsion wire 408 are adjacent to and / or on frame 402 .

[0068] In some examples, the first torsion wire 406 includes an example first tolerance portion 414, and the second torsion wire 408 includes an example second tolerance portion 416. The first tolerance portion 414 and the second tolerance portion 416 allow movement of the corresponding first torsion wire 406 and / or the second torsion wire 408 based on spring preload and / or retention cover. In some examples, one or more of the first channel 410 and / or the second channel 412 form a pocket for the corresponding first torsion wire 406 and the second torsion wire 408. In some examples, if there is no pocket and the wire (e.g., the first torsion wire 406 and / or the second torsion wire 408) is mounted on the frame 402, a cover can be added to one or more of the first tolerance portion 414 and / or the second tolerance portion 416.

[0069] The torsion loading mechanism 404 includes a plurality of example load studs 418. In the illustrated example, there are load studs 418 coupled to the ends of the first torsion wire 406 and the second torsion wire 408. Thus, in the illustrated example, the plurality of load studs 418 include a first load stud 418 coupled to the first end of the first torsion wire 406, a second load stud 418 coupled to the second end of the first torsion wire 406, a third load stud 418 coupled to the first end of the second torsion wire 408, and a fourth load stud 418 coupled to the second end of the second torsion wire 408. The load studs 418 extend from the torsion loading mechanism 404 through the PCB 208 to support the package 206 and / or another component (e.g., the thermal solution 202).

[0070] When the stack of thermal solution 202, electronic package 206, PCB 208, and PCB support 400 is assembled, load stud 418 is actuated, thereby transferring the existing preload in first torsion wire 406 and second torsion wire 408 to thermal solution 202. The transfer of the existing preload of first torsion wire 406 and second torsion wire 408 deflects first torsion wire 406 and second torsion wire 408 based on their respective spring rates, which absorbs tolerances including manufacturing variations in the connection area of ​​thermal solution 202. The preload in first torsion wire 406 and second torsion wire 408 reduces the distance that first torsion wire 406 and second torsion wire 408 deflect to reach a load target for supporting thermal solution 202.

[0071] Fig.16 yes Fig.15406 and a magnified view of a portion of the frame 402 and a first torsion wire 406 of the PCB support 400. In order to maintain an elongated form factor in examples where the torsion wire 406 is embedded in the first channel 410 of the frame 402, the material of the frame 402 is cut at an angle to allow the torsion wire 406 to rotate deeper within the first channel 410. The angle also allows additional travel to allow for more variation in tolerances of the stacking of the thermal component 202, the package 206, the PCB 208, and the PCB support 400. Thus, in some examples, the first channel 410 has a first depth at the first portion 420 of the frame 402 and a second depth at the second portion 422 of the frame, the second depth being greater than the first depth. The angled configuration of the first channel 410 can also be applied to the second channel 412.

[0072] From the foregoing it will be appreciated that example systems, apparatus, articles of manufacture, and methods have been disclosed that provide support for internal hardware of an electronic device.

[0073] There are many advantages to the example IC carriers disclosed herein. For example, customers no longer need to order and manage IC carrier inventory because the IC can be coupled to the IC carrier. As a result, customers do not need to expend resources on assembling the IC carrier onto the CPU, which may reduce the customer's throughput time, damage the IC, and cause downtime due to incorrect inventory and / or replacement of damaged ICs. In addition, the IC carriers disclosed herein are not manually installed and therefore do not have design features that are limited by ergonomic requirements. In addition, the IC carriers disclosed herein enable greater design flexibility in ICs and LGA sockets.

[0074] The IC retention mechanism disclosed herein enables larger and more complex IC designs to be retained within the same restrictive physical area. In addition, the IC retention mechanism disclosed herein enables the IC to be securely and evenly retained in the LGA socket without tilting during insertion. Unlike previous designs that have separate screws that must be turned individually, causing the IC to be assembled unevenly into the LGA socket. Tilting the IC may damage the fragile pins that connect the IC to the LGA socket. The IC retention mechanism disclosed herein also enables low-load socket technology and an increase in the contact and performance of the IC from the IC.

[0075] The PCB supports disclosed herein enable the top side of the PCB to have minimal mechanical hardware as a load support structure. The backside integrated torsion loading mechanism of the PCB support provides an integrated solution for applying load and supporting high load capacity to the package. This allows for faster integration and easier customer adoption while maintaining a corner package loading strategy that enhances thermal performance and minimizes cost with less topside load support.

[0076] "Include" and "comprising" (and all forms and tenses thereof) are used herein as open-ended terms. Thus, whenever a claim uses any form of "include" and "comprising" (e.g., includes, comprises, includes, contains, has, etc.) as a preamble or in any type of claim recitation, it should be understood that additional elements, items, etc. may be present without falling outside the scope of the corresponding claim or recitation. As used herein, when the phrase "at least" is used as a transitional term, such as in the preamble of a claim, it is open-ended in the same manner as the terms "include" and "comprising" are open-ended. The term "and / or" when used, for example, in a form such as A, B, and / or C, refers to any combination or subset of A, B, C, such as (1) A alone, (2) B alone, (3) C alone, (4) A and B, (5) A and C, (6) B and C, or (7) A and B and C. As used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A and B” is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing structures, components, items, objects, and / or things, the phrase “at least one of A or B” is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. As used herein in the context of describing the performance or execution of processes, instructions, actions, activities, and / or steps, the phrase “at least one of A and B” is intended to refer to implementations that include any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B. Similarly, as used herein in the context of describing the implementation or execution of a process, instruction, action, activity, and / or step, the phrase "at least one of A or B" is intended to refer to an implementation that includes any of the following: (1) at least one A, (2) at least one B, or (3) at least one A and at least one B.

[0077] As used herein, singular references (e.g., "a," "an," "first," "second," etc.) do not exclude plural reference. As used herein, the terms "a," "an" and "an" refer to one or more of the objects. The terms "a" (or "an"), "one or more," and "at least one" are used interchangeably herein. Furthermore, although listed separately, multiple devices, elements or actions may be implemented by, for example, the same entity or object. Additionally, although individual features may be included in different examples or claims, these features may possibly be combined, and the inclusion in different examples or claims does not imply that a combination of features is not feasible and / or not advantageous.

[0078] Unless otherwise specifically stated, descriptors such as "first", "second", "third", etc. are used herein without imposing or otherwise indicating any meaning of priority, physical order, arrangement in a list, and / or ordering in any manner, but are used only as labels and / or arbitrary names to distinguish elements for ease of understanding of the disclosed examples. In some examples, the descriptor "first" may be used to refer to an element in a specific embodiment, while a different descriptor such as "second" or "third" may be used in the claims to refer to the same element. In such cases, it should be understood that such descriptors are only used in the context of this discussion (e.g., in the claims) to distinctively identify elements that might otherwise share the same name.

[0079] As used herein, "approximately" and "about" modify their subject matter / values ​​to recognize the potential for variations that occur in real-world applications. For example, "approximately" and "about" may modify dimensions that may not be exact due to manufacturing tolerances and / or other real-world imperfections as would be understood by one of ordinary skill in the art. For example, "approximately" and "about" may indicate that such dimensions may be within a tolerance range of + / - 10%, unless otherwise specified in the following description.

[0080] Systems, devices, articles, and methods are disclosed for supports for internal hardware of electronic devices. Example 1 includes an integrated circuit (IC) carrier, the integrated circuit (IC) carrier comprising: a plurality of walls; a support carried by the walls for supporting the IC from below the IC; and a retaining clip for securing the IC.

[0081] Example 2 includes the integrated circuit (IC) carrier of Example 1, wherein the supports are coplanar.

[0082] Example 3 includes the integrated circuit (IC) carrier of Example 2, the support member including a first support member, a second support member, a third support member, and a fourth support member.

[0083] Example 4 includes an integrated circuit (IC) carrier as any of Examples 1-3, wherein the IC is a CPU.

[0084] Example 5 includes the integrated circuit (IC) carrier of Example 4, further including a CPU.

[0085] Example 6 includes the integrated circuit (IC) carrier of any of Examples 1-5, wherein at least one of the walls includes a thermal solution attachment clip.

[0086] Example 7 includes the integrated circuit (IC) carrier of any of Examples 1-6, wherein at least one of the walls includes a socket key for mating with a land grid array socket.

[0087] Example 8 includes the integrated circuit (IC) carrier of Example 7, wherein at least two of the walls include socket keys for mating with a land grid array socket.

[0088] Example 9 includes the integrated circuit (IC) carrier of any of Examples 1-8, wherein at least one of the walls includes a plurality of socket keys for mating with a land grid array socket.

[0089] Example 10 includes the integrated circuit (IC) carrier of any of Examples 1-9, wherein the retention clip is carried by a first wall of the plurality of walls, the first wall including a hole for receiving a pin to retract the retention clip.

[0090] Example 11 includes the integrated circuit (IC) carrier of Example 10, wherein the retention clip and the hole are co-linear on the first wall.

[0091] Example 12 includes the integrated circuit (IC) carrier of any of Examples 1-11, wherein the retention clip is rotatable.

[0092] Example 13 includes an integrated circuit (IC) carrier as any of Examples 1-12, wherein the retention clip includes a first surface engageable with the IC and a second surface engageable with the pin to retract the retention clip.

[0093] Example 14 includes the integrated circuit (IC) carrier of Example 13, wherein the second surface includes a slope.

[0094] Example 15 includes an integrated circuit (IC) carrier as any of Examples 1-14, wherein the plurality of walls include alignment holes for aligning the IC carrier with the land grid array socket.

[0095] Example 16 includes a system comprising: a printed circuit board (PCB); a thermal component located on a first side of the PCB; and a gear assembly located on a second side of the PCB, the second side being opposite to the first side, the gear assembly being used to pull the thermal component toward the PCB.

[0096] Example 17 includes the system of Example 16, wherein the thermal component is a heat sink.

[0097] Example 18 includes the system of any of Example 16 or Example 17, further comprising an integrated circuit between the thermal component and the PCB.

[0098] Example 19 includes the system of any of Examples 16-18, wherein the gear assembly comprises: a plurality of screw assemblies, respective ones of the screw assemblies comprising a gear and a screw; a main gear; and a timing belt coupled between the screw assemblies and the main gear.

[0099] Example 20 includes the system of Example 19, wherein the gear assembly includes a dual gear assembly.

[0100] Example 21 includes the system of any of Example 19 or Example 20, wherein the main gear includes a tool bit sleeve.

[0101] Example 22 includes the system of any of Examples 19-21, wherein the timing belt has a first side, a second side, teeth on the first side for engaging the plurality of screw assemblies, and teeth on the second side for being pulled by the main gear.

[0102] Example 23 includes the system of Example 22, wherein the teeth on the first side of the timing belt engage the dual gear assembly.

[0103] Example 24 includes the system of any of Examples 19-23, wherein the timing belt comprises silicone and Kevlar.

[0104] Example 25 includes a system as in any of Examples 16-24, wherein the gear assembly comprises: a plurality of screw assemblies, respective ones of the screw assemblies comprising gears and screws, the screws being releasably coupled to a thermal component; a gear-sprocket drive assembly having gears and sprockets; a chain coupled between the plurality of screw assemblies and the sprockets of the gear-sprocket drive assembly; and a main gear coupled to the gears of the gear-sprocket drive assembly.

[0105] Example 26 includes the system of Example 25, wherein the chain has a first side, a second side, a corresponding screw assembly of the plurality of screw assemblies engages the first side of the chain, and a sprocket of the gear-sprocket drive assembly engages the second side of the chain.

[0106] Example 27 includes a system as in any of Examples 25 or 26, wherein the screw assembly includes a first screw assembly, a second screw assembly, a third screw assembly, and a fourth screw assembly, and the system further includes: a first pulley, the first pulley being between the first screw assembly and the second screw assembly; a second pulley, the second pulley being between the second screw assembly and the third screw assembly; and a third pulley, the third pulley being between the third screw assembly and the fourth screw assembly, the first pulley, the second pulley, and the third pulley being coupled to a chain.

[0107] Example 28 includes the system of Example 27, wherein the sprocket is coupled to the chain between the fourth screw assembly and the first screw assembly.

[0108] Example 29 includes the system of any of Examples 25-28, wherein the chain comprises a non-conductive material.

[0109] Example 30 includes the system of any of Examples 25-29, wherein the chain comprises acetal plastic.

[0110] Example 31 includes the system of any of Examples 16-30, wherein the thermal component has four corners and the gear assembly applies force to the four corners simultaneously.

[0111] Example 32 includes the system of any of Examples 16-31, wherein the thermal component has a plurality of corners and the gear assembly applies the force uniformly to the plurality of corners.

[0112] Example 33 includes a system comprising: a printed circuit board (PCB); a component located on a first side of the PCB; and a torsion loading mechanism located on a second side of the PCB opposite to the first side, the torsion loading mechanism being used to pass through the PCB support component, the torsion loading mechanism comprising a torsion wire.

[0113] Example 34 includes the system of Example 33, wherein the torsion loading mechanism includes a frame and the torsion wire is coupled to the frame.

[0114] Example 35 includes the system of Example 34, wherein the frame includes a channel and the torsion wire is at least partially received in the channel.

[0115] Example 36 includes the system of Example 35, wherein the channel is angled.

[0116] Example 37 includes the system of any of Example 35 or Example 36, wherein the channel has a first depth at the first portion of the frame and a second depth at the second portion of the frame, the second depth being greater than the first depth.

[0117] Example 38 includes the system of any of Examples 34-37, wherein the frame comprises one or more of: steel, aluminum, or ceramic.

[0118] Example 39 includes the system of any of Examples 33-38, wherein the torsion wire is a first torsion wire and the torsion loading mechanism includes a second torsion wire.

[0119] Example 40 includes the system of any of Examples 33-39, further comprising a plurality of load studs extending from the torsion loading mechanism through the PCB to support the component.

[0120] Example 41 includes a system as in Example 40, wherein the torsion line is a first torsion line, the torsion loading mechanism includes a second torsion line, and the plurality of load studs include: a first load stud coupled to a first end of the first torsion line; a second load stud coupled to a second end of the first torsion line; a third load stud coupled to a first end of the second torsion line; and a fourth load stud coupled to a second end of the second torsion line.

[0121] The attached claims are hereby incorporated into the present detailed description by this reference. Although certain example systems, devices, articles, and methods have been disclosed herein, the scope of coverage of this patent is not limited thereto. On the contrary, this patent covers all systems, devices, articles, and methods that fairly fall within the scope of the claims of this patent.

Claims

1. A system, comprising: Printed circuit board PCB; a thermal component on a first side of the PCB; as well as A gear assembly is disposed on a second side of the PCB, the second side being opposite to the first side, the gear assembly being used to pull the thermal component toward the PCB.

2. The system of claim 1, wherein: The thermal component is a heat sink.

3. The system of claim 1, further comprising an integrated circuit disposed between the thermal component and the PCB.

4. The system of claim 1, wherein: The gear assembly comprises: a plurality of screw assemblies, respective ones of the screw assemblies comprising a gear and a screw; main gear; and A timing belt is coupled between the screw assembly and the main gear.

5. The system of claim 4, wherein: The gear assembly includes a dual gear assembly.

6. The system of claim 4, wherein: The main gear includes a cutter head sleeve.

7. The system of claim 4, wherein: The timing belt has a first side, a second side, teeth on the first side for engaging the plurality of screw assemblies, and teeth on the second side for being pulled by the main gear.

8. The system of claim 7, wherein: The teeth on the first side of the timing belt engage a dual gear assembly.

9. The system of claim 4, wherein: The timing belt includes silicone and Kevlar.

10. The system of claim 1, wherein: The gear assembly comprises: a plurality of screw assemblies, respective ones of the screw assemblies comprising a gear and a screw, the screw being releasably coupled to the thermal component; A gear-sprocket transmission assembly, wherein the gear-sprocket transmission assembly has a gear and a sprocket; a chain coupled between the plurality of screw assemblies and the sprocket of the gear-sprocket drive assembly; and A main gear is coupled to a gear of the gear-sprocket drive assembly.

11. The system of claim 10, wherein: The chain has a first side, a second side, a corresponding screw assembly of the plurality of screw assemblies engages the first side of the chain, and a sprocket of the gear-sprocket drive assembly engages the second side of the chain.

12. The system of claim 10, wherein: The screw assembly includes a first screw assembly, a second screw assembly, a third screw assembly and a fourth screw assembly, and the system further includes: a first pulley, the first pulley being located between the first screw assembly and the second screw assembly; a second pulley disposed between the second screw assembly and the third screw assembly; and A third pulley is disposed between the third screw assembly and the fourth screw assembly, and the first pulley, the second pulley, and the third pulley are coupled to the chain.

13. The system of claim 12, wherein: The sprocket is coupled to the chain between the fourth screw assembly and the first screw assembly.

14. The system of claim 10, wherein: The chain comprises a non-conductive material.

15. The system of claim 10, wherein: The chain comprises acetal plastic.

16. The system of claim 1, wherein: The thermal component has four corners, and the gear assembly applies force to the four corners simultaneously.

17. The system of any one of claims 1 to 16, wherein: The thermal component has a plurality of corners, and the gear assembly applies force uniformly to the plurality of corners.

18. The system of claim 1, further comprising: A torsion loading mechanism is on the second side of the PCB opposite the first side, the torsion loading mechanism is used to support the thermal component through the PCB, the torsion loading mechanism includes a torsion wire.

19. The system of claim 18, wherein: The twist loading mechanism includes a frame, and an angled channel in the frame, the twist wire being at least partially in the channel.

20. The system of claim 19, wherein: The channel has a first depth at a first portion of the frame and a second depth at a second portion of the frame, the second depth being greater than the first depth.

21. The system of claim 18, wherein: The torsion line is a first torsion line and the torsion loading mechanism includes a second torsion line.

22. The system of any of claims 18-21, further comprising a plurality of load studs extending from the torsion loading mechanism through the PCB to support the thermal component.

23. The system of claim 1, further comprising a carrier, the carrier comprising: Multiple walls; a support carried by the wall for supporting the thermal component from below the IC; as well as A retaining clip is used to secure the thermal component.

24. The system of claim 23, wherein: At least one of the walls includes a thermal solution attachment clip.

25. The system of any one of claims 23-24, wherein: The retaining clip is carried by a first wall of the plurality of walls, the first wall including an aperture for receiving a pin to retract the retaining clip.

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