Electronic device and its vapor chamber

Abstract

The application provides an electronic device and a vapor chamber thereof, the vapor chamber comprising a first cover plate, a second cover plate, a first intermediate plate and a second intermediate plate; a first accommodating cavity is formed between the first cover plate and the first intermediate plate, a second accommodating cavity is formed between the side of the first intermediate plate away from the first cover plate and the second intermediate plate, and a third accommodating cavity is formed between the side of the second intermediate plate away from the first intermediate plate and the second cover plate; a first liquid guide is arranged in the first accommodating cavity, a second liquid guide is arranged in the second accommodating cavity, and a third liquid guide is arranged in the third accommodating cavity; and heat-conducting medium is arranged in the first accommodating cavity, the second accommodating cavity and the third accommodating cavity. The vapor chamber provided by the application has more layers of accommodating cavities compared with a traditional vapor chamber, and the number of layers of the vapor chamber is increased, so that heat can be quickly transferred and diffused in a three-dimensional (thickness direction and plane direction) manner, and the vapor chamber performance is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation structure, in particular to an electronic equipment and a vapor chamber thereof. BACKGROUND

[0002] With more and more functions and more and more power of electronic products, the heat of the products is more and more serious. The VC vapor chamber can transport the heat at the heat source position to a relatively low temperature position due to the capillary structure and the cooling medium inside, and the phase change latent heat is absorbed or released when the cooling liquid changes in phase, which is an ideal solution to solve the heat dissipation problem of various electronic products.

[0003] The vapor chamber in the prior art is generally a structure in which a liquid accommodating cavity is formed in the middle of two metal plates. The heat equalization performance of this vapor chamber is limited and cannot meet the heat dissipation requirements of electronic equipment. SUMMARY

[0004] The first aspect of the embodiment of the present application provides a vapor chamber, which comprises a first cover plate, a second cover plate, a first intermediate plate and a second intermediate plate. A first accommodating cavity is formed between the first cover plate and the first intermediate plate. A second accommodating cavity is formed between the side of the first intermediate plate away from the first cover plate and the second intermediate plate. A third accommodating cavity is formed between the side of the second intermediate plate away from the first intermediate plate and the second cover plate. A first liquid guide is arranged in the first accommodating cavity. A second liquid guide is arranged in the second accommodating cavity. A third liquid guide is arranged in the third accommodating cavity. Heat conducting medium is arranged in the first, second and third accommodating cavities.

[0005] The second aspect of the embodiment of the present application provides an electronic equipment, which comprises a heat generating device and the vapor chamber described in the above embodiment. The heat generating device is in contact with the outer surface of the vapor chamber.

[0006] The vapor chamber provided by the embodiment of the present application increases the number of accommodating cavities and the number of heat equalization layers compared with the traditional vapor chamber, which can quickly transfer and diffuse the heat in three dimensions (thickness direction and plane direction at the same time) and greatly improve the heat equalization performance of the vapor chamber. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0008] Figure 1is a front structure schematic diagram of an embodiment of the vapor chamber of the electronic device of the present application;

[0009] Figure 2 is Figure 1 is a back structure schematic diagram of the vapor chamber in the embodiment;

[0010] Figure 3 is Figure 2 is a cross-section structure schematic diagram of the vapor chamber at A-A in the embodiment;

[0011] Figure 4 is Figure 2 is a structure split schematic diagram of the vapor chamber in the embodiment;

[0012] Figure 5 is a structure split schematic diagram of another embodiment of the vapor chamber of the present application;

[0013] Figure 6 is a structure split schematic diagram of still another embodiment of the vapor chamber of the present application;

[0014] Figure 7 is a structure schematic diagram of an embodiment of the electronic device of the present application;

[0015] Figure 8 is Figure 7 is a structure split schematic diagram of the electronic device at B-B in the embodiment;

[0016] Figure 9 is a structure composition block diagram schematic diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0017] The present application will be further described below in conjunction with the drawings and embodiments. It is particularly pointed out that the following embodiments are only for illustrating the present application, but not for limiting the scope of the present application. Similarly, the following embodiments are only part of the embodiments of the present application, but not all the embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without making creative efforts are within the scope of protection of the present application.

[0018] The terms "first", "second", "third", etc. in the embodiments of the present application are used only for descriptive purposes and are not to be construed as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second", "third" can include at least one of the features explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited. All directional indications (such as upper, lower, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly. The terms "include" and "have" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the steps or units listed, but can optionally include steps or units not listed, or can optionally include other steps or components inherent to the process, method, product or device.

[0019] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive or alternative embodiments. It is expressly understood that the embodiments described herein can be combined with each other in their various permutations and combinations.

[0020] As used herein, "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive / transmit communication signals via a wired line connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate through a wireless interface can be referred to as a "wireless communication terminal", a "wireless terminal", or a "mobile terminal". Examples of a mobile terminal include, but are not limited to, a satellite or cellular telephone; a personal communication system (PCS) terminal that can combine a cellular radiotelephone with data processing, facsimile, and data communications capabilities; a PDA that can include a wireless radiotelephone, a pager, Internet / intranet access, a Web browser, a notepad, a calendar, and / or a global positioning system (GPS) receiver; and a conventional laptop and / or palmtop receiver, or other electronic devices including a wireless radiotelephone transceiver. A handset is an electronic device configured with a cellular communication module.

[0021] An embodiment of the present application provides a vapor chamber structure. Please refer to Figures 1 to 4 , Figure 1 is a front structure schematic diagram of an embodiment of the vapor chamber for electronic equipment of the present application; Figure 2 is Figure 1 a back structure schematic diagram of the vapor chamber in the embodiment, Figure 3 is Figure 2 a cross-section structure schematic diagram of the vapor chamber at A-A in the embodiment; Figure 4 is Figure 2 a structure split schematic diagram of the vapor chamber in the embodiment. It should be noted that the vapor chamber in the present application can be used for heat dissipation of electronic equipment, and the electronic equipment can include mobile phones, tablet computers, notebook computers, wearable devices, etc. The vapor chamber 100 for electronic equipment includes but is not limited to the following structures: a first cover plate 110, a second cover plate 120, a first intermediate plate 130, and a second intermediate plate 140.

[0022] Specifically, the first cover plate 110, the first intermediate plate 130, the second intermediate plate 140, and the second cover plate 120 can be sequentially stacked. Wherein, the first cover plate 110 and the first intermediate plate 130 form a first accommodating cavity 101 therebetween, the side of the first intermediate plate 130 away from the first cover plate 110 and the second intermediate plate 140 form a second accommodating cavity 102 therebetween, and the side of the second intermediate plate 140 away from the first intermediate plate 130 and the second cover plate 120 form a third accommodating cavity 103 therebetween; wherein, the first accommodating cavity 101 is provided with a first liquid guide 1001, the second accommodating cavity 102 is provided with a second liquid guide 1002, and the third accommodating cavity 103 is provided with a third liquid guide 1003.

[0023] Wherein, the first accommodating cavity 101, the second accommodating cavity 102, and the third accommodating cavity 103 are all provided with a heat conduction medium (not shown in the figure). Optionally, the heat conduction medium can be a liquid heat dissipation medium, such as water or oil, etc., which is not limited here.

[0024] Optionally, the materials of the first cover plate 110, the second cover plate 120, the first intermediate plate 130, and the second intermediate plate 140 can be metal or alloy, such as stainless steel, copper and its alloy, and aluminum and its alloy, etc. The materials of the first liquid guide 1001, the second liquid guide 1002, and the third liquid guide 1003 can be selected from any one of copper mesh, fiber, non-woven fabric, or foam.

[0025] Optionally, please continue to refer to Figure 3 and Figure 4The first accommodating cavity 101 of the uniform heating plate 100 in the embodiment is provided with a plurality of first supporting columns 111. The plurality of first supporting columns 111 are in an integral structure with the first cover plate 110. Of course, in some other embodiments, the plurality of first supporting columns 111 can be in an integral structure with the first intermediate plate 130, which is not specifically limited here. The plurality of first supporting columns 111 are used for supporting the first liquid guide 1001 and for fixing the first liquid guide 1001. The plurality of first supporting columns 111 can be formed by stamping, etching or injection molding in an integral manner with the first cover plate 110.

[0026] Optionally, the second accommodating cavity 102 is provided with a plurality of second supporting columns 112. The plurality of second supporting columns 112 are in an integral structure with the first intermediate plate 130. Of course, in some other embodiments, the plurality of second supporting columns 112 can be in an integral structure with the second intermediate plate 140, which is not specifically limited here. The plurality of second supporting columns 112 are used for supporting the second liquid guide 1002 and for positioning and fixing the second liquid guide 1002. The plurality of second supporting columns 112 can be formed by etching, stamping or injection molding in an integral manner with the second intermediate plate 140.

[0027] Please continue to refer to Figure 3 The third accommodating cavity 103 of the uniform heating plate in the embodiment is provided with a plurality of third supporting columns 113. The plurality of third supporting columns 113 are in an integral structure with the second cover plate 120. The plurality of third supporting columns 113 are used for supporting the third liquid guide 1003 and for fixing the third liquid guide 1003. Of course, in some other embodiments, the plurality of third supporting columns 113 can be in an integral structure with the second intermediate plate 140. Please refer to Figure 5 , Figure 5 is a structural cross-sectional view of another embodiment of the uniform heating plate. In this embodiment, the plurality of third supporting columns 113 are in an integral structure with the second intermediate plate 140. The plurality of third supporting columns 113 are formed by etching, stamping or injection molding in an integral manner with the second intermediate plate 140 or the second cover plate 120. The first cover plate 110 and the second cover plate 120 can be formed by stamping or etching process to form a groove structure for accommodating the corresponding liquid guide. The adjacent plates (the plates are collectively referred to as the first cover plate, the second cover plate, the first intermediate plate and the second intermediate plate) can be connected by welding at the edge of the ring, such as between the first cover plate and the first intermediate plate, between the first intermediate plate and the second intermediate plate, and between the second intermediate plate and the second intermediate plate. The intermediate gap is the first accommodating cavity (the first liquid injection layer), the second accommodating cavity (the second liquid injection layer) and the third accommodating cavity (the third liquid injection layer).

[0028] The technical solutions in the embodiments of the present application creatively change the structure of two layers of metal sandwiching one layer of liquid absorbing material of the traditional VC into the structure of N layers of metal sandwiching N-1 layers of liquid absorbing material (liquid guiding piece). Thus, the one liquid injection layer of the traditional VC is increased to multiple liquid injection layers. Each liquid injection layer can be provided with one liquid injection port. The vapor chamber with such a structure increases the number of the multiple accommodation cavities compared with the traditional vapor chamber, and increases the number of the vapor layers, so that the heat can be quickly transferred and diffused in a three-dimensional manner (in the thickness direction and the plane direction at the same time), and the heat equalization performance of the vapor chamber is greatly improved.

[0029] Optionally, please continue to refer to Figure 4 The area of the adjacent accommodation cavities of the vapor chamber in the thickness direction in the embodiments of the present application can be different, that is, the projections of the first accommodation cavity 101, the second accommodation cavity 102 and the third accommodation cavity 103 in the thickness direction of the vapor chamber do not completely coincide in the embodiments. That is, each layer of metal (the first cover plate 110, the second cover plate 120, the first intermediate plate 130 and the second intermediate plate 140) is not designed according to the equal area, and can be adjusted according to the actual situation. Because the internal space of the mobile phone and other electronic devices is limited, if the multiple layer structure of the entire vapor chamber is designed according to the equal area structure, the thickness of the entire machine will be too large, or too much internal space of the electronic device will be occupied. Therefore, the number of layers (here, the number of layers refers to the number of metal plate layers) can be reduced at the thickness bottleneck position of the entire machine, such as three layers or even two layers at the local position, and four layers or even more layers at the partial position. The number of layers can be adjusted according to the specific situation, and the size of each accommodation cavity can also be adjusted according to the specific situation. In this way, the heat dissipation performance of the vapor chamber can be maximized in the limited space of the entire machine, and the purpose of occupying less space and achieving the maximum heat dissipation efficiency can be achieved.

[0030] In addition, the support columns in the adjacent accommodation cavities can be one-to-one corresponding as shown in Figure 5 In some other embodiments, the support columns in the adjacent accommodation cavities can also not be in the one-to-one corresponding structure, for example, the support columns can be designed to have different cross-sectional areas or different densities. In order to increase the support strength of the adjacent accommodation cavities in the thickness direction, the support column density in the accommodation cavity with a larger projected area in the thickness direction can be greater than that in other positions, or the cross-sectional area of the support column in the accommodation cavity with a larger projected area in the thickness direction can be greater than that in other positions. The advantage of such a structure is that on the one hand, the support strength of the adjacent accommodation cavities in the thickness direction can be ensured, and on the other hand, the support column density or area can be smaller at other positions without the need for large support strength (i.e. positions without adjacent accommodation cavities), thereby reducing the manufacturing difficulty.

[0031] Because the internal heat source (generally a processor chip) of an electronic device such as a mobile phone has a relatively small area and cannot quickly transfer heat to a traditional VC, the heat spreading rate of the traditional VC is limited, thereby affecting the heat dissipation of the entire electronic device. The internal heat source of the electronic device is generally distributed in the upper part of the VC. Compared with the heat spreading structure of the traditional VC, the structure scheme in the embodiment is equivalent to adding a plurality of small VCs between the heat source and the large VC. The small VC can quickly spread the heat of the heat source, which can greatly help the large VC to better spread heat. The heat dissipation efficiency of the entire device is significantly improved. Part of the multi-layer liquid injection structure can only exist in part of the VC, because the internal space of the electronic device is limited, and the lower part of the VC is generally the thickness bottleneck position of the entire device, so the lower part of the VC is generally thinner. The technical scheme of the embodiment creatively adjusts the single-layer liquid injection structure of the traditional VC to a multi-layer liquid injection structure in part, so that the original one-layer heat spreading structure becomes a multi-layer three-dimensional heat spreading. The heat spreading performance of the VC is significantly improved, which helps to solve the problem of rapid heat dissipation of the electronic device, and does not occupy too much internal space of the electronic device.

[0032] Please refer to Figure 6 , Figure 6 is a structure sectional view of another embodiment of the heat spreading plate of the present application. Different from the foregoing embodiments, the heat spreading plate 100 in the embodiment further includes a third cover plate 150, wherein a fourth accommodating cavity 104 is formed between the third cover plate 150 and the side of the second cover plate 120 away from the second intermediate plate 140, and a fourth liquid guide 1004 and a heat conducting medium are arranged in the fourth accommodating cavity 104; a plurality of fourth supporting columns 114 are arranged in the fourth accommodating cavity 104, and the plurality of fourth supporting columns 114 are in an integral structure with the second cover plate 120 or the third cover plate 150 (or part of the plurality of fourth supporting columns 114 are in an integral structure with the second cover plate 120, and part of the plurality of fourth supporting columns 114 are in an integral structure with the third cover plate 150), and the plurality of fourth supporting columns 114 are used for supporting the fourth liquid guide 1004. The structure, material and other characteristics of the fourth liquid guide 1004 and the third cover plate 150 can be the same as those of the same parts in the foregoing embodiments, and will not be described in detail here.

[0033] The embodiment of the present application only schematically shows the structure of four metal plates clamping three liquid guides and five metal plates clamping four liquid guides, and in some other embodiments, those skilled in the art can set the number of layers in different regions and design a heat spreading plate with more layers according to actual heat dissipation requirements and space stacking conditions of the electronic device, which will not be enumerated and described in detail here.

[0034] Further, the embodiment of the present application further provides an electronic device, please refer to Figure 7 and Figure 8 , Figure 7is a structural schematic diagram of an embodiment of an electronic device of the present application, Figure 8 Figure 7 is a structural cross-sectional schematic diagram of an embodiment of an electronic device at B-B, the electronic device in the embodiment can include a display screen 30, a housing 10, a control circuit board 20, a middle frame 40, and a vapor chamber 100.

[0035] Optionally, the display screen 30 in the embodiment cooperates with the housing 10 (which can be a back cover) and the middle frame 40 to form a receiving cavity 1000, the control circuit board 20 is arranged in the receiving cavity 1000, the control circuit board 200 is electrically connected with the display screen 30 and is used for controlling the display screen 30 to display a surface (working state). The control circuit board 20 can be provided with a chip 21, and the chip 21 and the display screen 30 can be heat generating devices of the electronic device. The vapor chamber 100 is attached to the heat generating devices, one end of the vapor chamber 100 is in contact with the heat generating devices (in the embodiment, the chip 21 is taken as an example for description of a heat source). In order to achieve better results, TIMs material (Thermal Interface Material, heat interface material, which is a general term of a material used for coating between heat dissipating devices and heat generating devices to reduce the contact thermal resistance therebetween) can also be used between the heat source and the vapor chamber to strengthen the heat transfer to the vapor chamber. The other end of the vapor chamber extends to a cold region of the electronic device, such as an area far away from the heat source, or is attached to a structural member such as the middle frame, so as to achieve the purpose of uniform heating and heat dissipation.

[0036] Please refer to Figure 9 , Figure 9 is a structural block diagram schematic diagram of an embodiment of an electronic device of the present application, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc. The embodiment takes a mobile phone as an example. The structure of the electronic device can include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which can be the display screen 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which can be the chip 21 in the foregoing embodiment), and a power supply 990, etc. The RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; the power supply 990 is used for providing power for the entire electronic device 10.

[0037] ​Specifically, the RF circuit 910 is configured to send and receive signals; the memory 920 is configured to store data, instructions, and information; the input unit 930 is configured to input information, and specifically can include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 can include a display panel 941 and the like; the sensor 950 includes an infrared sensor, a laser sensor, and the like, and is configured to detect user proximity signals, distance signals, and the like; the speaker 961 and the microphone 962 are connected with the processor 980 through the audio circuit 960, and are configured to send and receive sound signals; the Wi-Fi module 970 is configured to receive and transmit Wi-Fi signals; and the processor 980 is configured to process data information of the electronic device. For specific structural characteristics of the electronic device, please refer to the related descriptions in the above embodiments, which will not be described in detail here.

[0038] The electronic device in the embodiment has a multi-layer accommodating cavity compared with the traditional heat plate, and the number of layers of the heat plate is increased, so that the heat can be quickly transferred and diffused in three dimensions (thickness direction and plane direction at the same time), and the heat plate performance is greatly improved.

[0039] The above only describes some embodiments of the present application, and does not limit the protection scope of the present application. Any equivalent device or equivalent process transformation, or direct or indirect application in other related technical fields based on the content of the specification and drawings is also included in the patent protection scope of the present application.

Claims

1. A heat spreader, characterized in that, The heat spreader includes a first cover plate, a second cover plate, a first intermediate plate, and a second intermediate plate; a first accommodating cavity is formed between the first cover plate and the first intermediate plate; a second accommodating cavity is formed between the side of the first intermediate plate away from the first cover plate and the second intermediate plate; a third accommodating cavity is formed between the side of the second intermediate plate away from the first intermediate plate and the second cover plate; a first liquid guiding element is provided in the first accommodating cavity; a second liquid guiding element is provided in the second accommodating cavity; and a third liquid guiding element is provided in the third accommodating cavity; a heat-conducting medium is provided in the first accommodating cavity, the second accommodating cavity, and the third accommodating cavity. The first accommodating cavity is provided with a plurality of first support columns, which are integrally formed with the first cover plate and / or the first intermediate plate, and the plurality of first support columns are used to support the first liquid guiding component; The second accommodating cavity is provided with a plurality of second support columns, which are integrally formed with the first intermediate plate and / or the second intermediate plate, and are used to support the second liquid guiding component; And / or, the third accommodating cavity is provided with a plurality of third support columns, the plurality of third support columns being integrally formed with the second intermediate plate and / or the second cover plate, the plurality of third support columns being used to support the third liquid guiding component; The areas projected onto adjacent cavities in the thickness direction are different; The distribution density of the internal support columns of the adjacent cavity with the larger projected area in the thickness direction is as follows: the support column density at the location of the adjacent cavity is greater than the support column density at other locations, and / or, the cross-sectional area of ​​the support column at the location of the adjacent cavity is greater than the cross-sectional area of ​​the support column at other locations.

2. The heat spreader according to claim 1, characterized in that, The first liquid guiding component, the second liquid guiding component, and the third liquid guiding component are made of any one of copper mesh, fiber, non-woven fabric, or foam.

3. The heat spreader according to claim 1, characterized in that, The projections of the first accommodating cavity, the second accommodating cavity, and the third accommodating cavity in the thickness direction of the heat spreader do not completely overlap.

4. The heat spreader according to claim 1, characterized in that, The heat spreader also includes a third cover plate, and a fourth accommodating cavity is formed between the third cover plate and the side of the second cover plate away from the second intermediate plate. The fourth accommodating cavity is provided with a heat-conducting medium and a fourth liquid-conducting component. The fourth accommodating cavity is also provided with a plurality of fourth support columns, which are integrally structured with the second cover plate and / or the third cover plate. The plurality of fourth support columns are used to support the fourth liquid-conducting component.

5. An electronic device, characterized in that, The electronic device includes a heating element and a heat spreader as described in any one of claims 1-4, wherein the heating element is in contact with the outer surface of the heat spreader.

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