Packaging method of display chip and mold

Abstract

The application relates to a display chip packaging method and a mold. The display chip packaging method comprises the following steps: providing a substrate, one side surface of the substrate is provided with a plurality of display chip modules extending along a first direction, and cutting channels extending along the first direction are arranged between adjacent display chip modules; arranging a mold on the side of the substrate provided with the display chip modules, the mold comprises a plurality of strip-shaped structures extending along the first direction, and the strip-shaped structures are located in the cutting channels in the orthographic projection of the substrate; forming a packaging layer on the side of the substrate provided with the display chip modules, the packaging layer covers the display chip modules, the side walls of the strip-shaped structures and the exposed surface of the substrate; and removing the mold. The display chip packaging method makes the chip packaging technology not limited by the shape and size of the substrate, thereby reducing the problem of high Micro LED packaging cost.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a packaging method and mold for a display chip. Background Technology

[0002] As people's lives become increasingly intelligent, display screens are being used in all aspects of life. MicroLED, with its excellent contrast and brightness, has attracted widespread attention in the display industry.

[0003] Micro LED in Package (MIP) technology involves transferring Micro LEDs onto a substrate, which is then cut and packaged into larger units for display screen assembly. This reduces the manufacturing requirements of the display screen and facilitates screen repair. However, due to the thickness requirements of MIP, the encapsulating adhesive thickness is generally required to be below 100μm. Therefore, MIP is limited by the substrate shape and size, and currently, expensive sapphire substrates are mostly used, resulting in poor compatibility with low-cost glass substrates.

[0004] Therefore, how to make chip packaging technology not limited by the shape and size of the substrate, thereby reducing the cost of MIP, is an urgent problem to be solved. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a packaging method and mold for display chips, which aims to make chip packaging technology not limited by the shape and size of the substrate, thereby reducing the cost of Micro LED packaging.

[0006] This application provides a method for packaging a display chip, including the following steps:

[0007] A substrate is provided, and one side surface of the substrate has a plurality of display chip modules extending along a first direction, and a cutting channel extending along the first direction is provided between adjacent display chip modules.

[0008] A mold is disposed on the side of the substrate having the display chip module. The mold includes a plurality of strip-shaped structures extending along a first direction. The orthogonal projection of the strip-shaped structures onto the substrate is located within the cutting channel.

[0009] An encapsulation layer is formed on the side of the substrate with the display chip module, and the encapsulation layer covers the display chip module, the sidewall of the strip structure, and the exposed surface of the substrate;

[0010] Remove the mold.

[0011] In this embodiment, multiple strip-shaped structures extending along a first direction are formed on the side of the substrate with the display chip module. The orthogonal projection of the strip-shaped structures onto the substrate lies within the dicing channel, thus separating the display chip module through the strip-shaped structures. When forming an encapsulation layer covering the display chip module on the substrate based on these strip-shaped structures, the thickness of the encapsulation layer can be controlled to be consistent with the height of the strip-shaped structures, ensuring that the surface of the encapsulation layer facing away from the substrate and the surface of the strip-shaped structures facing away from the substrate are on the same plane. This helps control the thickness of the encapsulation layer and ensures its flatness, making the formation of the encapsulation layer not limited by the shape and size of the substrate, thereby reducing the cost of Micro LED in Package (MIP).

[0012] Optionally, after removing the mold, the process also includes curing the encapsulation layer.

[0013] Optionally, each display chip module includes multiple display chips, which are spaced apart along a first direction; the short side of each display chip is parallel to the first direction; and the long side of each display chip is parallel to a second direction.

[0014] Optionally, forming an encapsulation layer on the side of the substrate having the display chip module includes:

[0015] A squeegee is used to apply encapsulating adhesive to the side of the substrate containing the display chip module to form an encapsulation layer.

[0016] In this embodiment, a scraper is used to apply encapsulating adhesive to the side of the substrate with the display chip module, which can better control the thickness of the encapsulation layer and ensure the flatness of the encapsulation layer.

[0017] Optionally, applying encapsulating adhesive to the side of the substrate with the display chip module using a scraper includes: applying encapsulating adhesive along a third direction on the side of the substrate with the display chip module using a scraper; the third direction intersects with both the first direction and the second direction.

[0018] In this embodiment of the application, compared to applying encapsulating adhesive along the first direction or the second direction, applying encapsulating adhesive along the third direction on the side of the substrate with the display chip module using a squeegee can effectively avoid wear of the squeegee on the mold, and avoid the problems of color deviation and poor visual effect caused by unevenness of the encapsulation layer at the mold position.

[0019] Optionally, the dimension of the strip structure along the second direction is equal to the dimension of the cutting path along the second direction.

[0020] Optionally, the strip structure is perpendicular to the long side of the display chip and parallel to the short side of the display chip;

[0021] The mold also includes a frame, which is fixedly connected to the strip structure.

[0022] Optionally, the dimension of the mold along the first direction is greater than the dimension of the substrate along the first direction; the difference between the dimension of the mold along the first direction and the dimension of the substrate along the first direction is not less than one-quarter of the dimension of the strip structure along the first direction.

[0023] The height of the strip structure is no more than 100 μm.

[0024] In this embodiment, the dimension of the mold along the first direction is larger than the dimension of the substrate along the first direction, i.e., the mold is widened. This helps to further avoid wear on the mold by the scraper and avoids color deviation and poor visual effect caused by unevenness of the encapsulation layer at the mold position.

[0025] Based on the same inventive concept, this application also provides a mold for packaging a display chip, including: a frame, and a plurality of strip-shaped structures disposed within the frame and fixedly connected to the frame. The strip-shaped structures extend along a first direction, and there is a gap between adjacent strip-shaped structures. The gap is used to accommodate a corresponding display chip module on a substrate to form an encapsulation layer covering the display chip module, the sidewalls of the strip-shaped structures, and the exposed surface of the substrate; the first direction is the extending direction of the chip display module.

[0026] In this embodiment, by employing a mold with multiple strip-shaped structures extending along a first direction, the display chip modules can be separated by these strip-shaped structures. When forming an encapsulation layer covering the display chip modules on the substrate based on these strip-shaped structures, the thickness of the encapsulation layer can be controlled to be consistent with the height of the strip-shaped structures, ensuring that the surface of the encapsulation layer facing away from the substrate and the surface of the strip-shaped structures facing away from the substrate are on the same plane. This helps control the thickness of the encapsulation layer and ensures its flatness, making the formation of the encapsulation layer not limited by the shape and size of the substrate, thereby reducing the cost of Micro LED in Package (MIP).

[0027] Optionally, the dimension of the mold along the first direction is larger than the dimension of the substrate along the first direction; the difference between the dimension of the mold along the first direction and the dimension of the substrate along the first direction is not less than one-quarter of the dimension of the strip structure along the first direction. The height of the strip structure is not greater than 100 μm. Attached Figure Description

[0028] Figure 1 This is a flowchart illustrating the chip packaging method according to an embodiment of this application;

[0029] Figure 2(a) is Figure 1 A top view of the structure obtained in step S10;

[0030] Figure 2(b) is a cross-sectional view of the structure shown in Figure 2(a) along the aa' direction;

[0031] Figure 3(a) is Figure 1 A top view of the structure obtained in step S20;

[0032] Figure 3(b) is a cross-sectional view of the structure shown in Figure 3(a) along the aa' direction;

[0033] Figure 4(a) is a top view of a structure obtained by applying encapsulating adhesive with a scraper in a display chip packaging method provided in an embodiment;

[0034] Figure 4(b) is a cross-sectional view of the structure shown in Figure 4(a) along the aa' direction;

[0035] Figure 4(c) is a top view of the structure obtained by applying encapsulating adhesive with a scraper in another packaging method for a display chip provided in an embodiment.

[0036] Figure 5(a) shows Figure 1 A top view of the structure obtained in step S30;

[0037] Figure 5(b) is a cross-sectional view of the structure shown in Figure 5(a) along the aa' direction;

[0038] Figure 6(a) shows Figure 1 A top view of the structure obtained in step S40;

[0039] Figure 6(b) is a cross-sectional view of the structure shown in Figure 6(a) along the aa' direction;

[0040] Figure 7 This is a top view of a mold according to an embodiment of this application;

[0041] Figure 8 for Figure 7 A schematic diagram showing the effect of unevenness in the encapsulation layer on light efficiency when the strip structure is parallel to the long side of the display chip.

[0042] Figure 9 for Figure 7 A schematic diagram showing the effect of unevenness in the encapsulation layer on light efficiency when the strip structure is parallel to the short side of the display chip.

[0043] Figure 10 This is a top view of a structure obtained by applying encapsulating adhesive with a scraper in another method for packaging a display chip according to one embodiment.

[0044] Figure 11 This is a top view of a mold according to another embodiment of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 1-Substrate; 2-Display chip module; 21-Display chip; 211-Red light-emitting diode; 212-Green light-emitting diode; 213-Blue light-emitting diode; 3-Cutting channel; 4-Mold; 41-Strip structure; 42-Frame; 5-Scraper; 60-Encapsulating adhesive; 6-Encapsulation layer. Detailed Implementation

[0047] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0049] It should be understood that spatial relation terms such as "below," "under," "below," "below," "above," "over," etc., can be used here to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, an element or feature described as "below" or "under" or "below" of other elements or features will be oriented "over" of other elements or features. Therefore, the exemplary terms "below" and "under" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0050] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that when the terms “comprise” and / or “comprising” are used in this specification, the presence of the stated feature, integer, step, operation, element, and / or part is established, but the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups is not excluded. Meanwhile, when used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0051] When used here, "deposition" processes include, but are not limited to, physical vapor deposition (PVD), chemical vapor deposition (CVD), or atomic layer deposition (ALD).

[0052] Embodiments of the invention are described herein with reference to cross-sectional views illustrating ideal embodiments (and intermediate structures) of the invention, thus allowing for variations in the illustrated shape due to, for example, manufacturing techniques and / or tolerances. Therefore, embodiments of the invention should not be limited to the specific shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing techniques. For instance, implantation regions shown as rectangular typically have rounded or curved features at their edges and / or implantation concentration gradients, rather than a binary change from implantation regions to non-implantation regions. Similarly, the buried regions formed by implantation can result in some implantation in the region between the buried region and the surface traversed during implantation. Therefore, the regions shown in the figures are substantially schematic, and their shapes do not represent the actual shapes of regions of the device and do not limit the scope of the invention.

[0053] As people's lives become increasingly intelligent, display screens are being used in all aspects of life. MicroLED, with its excellent contrast and brightness, has attracted widespread attention in the display industry.

[0054] Considering the high equipment requirements and difficult rework processes of Micro LED displays, the concept and products of Micro LED in Package (MIP) are now highly regarded in the market. MIP technology transfers Micro LEDs to a MIP substrate, which, after cutting, allows for the fabrication of larger display units, thus reducing the process requirements and facilitating screen rework. However, due to the thickness requirements of MIP, the encapsulant thickness is generally required to be below 100μm. Therefore, MIP is limited by the substrate shape and size (it must be a circular substrate with a size ≤100mm). Currently, expensive sapphire substrates are mostly used, resulting in poor compatibility with low-cost glass substrates.

[0055] Furthermore, square glass substrates can accommodate more MIP cells than circular glass substrates, resulting in higher utilization. Considering the future commercialization of glass substrate-based MIP production, substrate sizes will trend towards larger dimensions. Therefore, semiconductor packaging technology that is limited by the shape and size of the required packaging substrate will no longer be applicable.

[0056] Therefore, how to make chip packaging technology not limited by the shape and size of the substrate, thereby reducing the cost of MIP, is an urgent problem to be solved.

[0057] In view of the above shortcomings, this application proposes a packaging method and mold for display chips, so that chip packaging technology is not limited by the shape and size of the substrate, thereby reducing the packaging cost of Micro LED.

[0058] Please see Figure 1 This application provides a method for packaging a display chip, including the following steps:

[0059] S10: A substrate 1 is provided, and one side surface of the substrate 1 has a plurality of display chip modules 2 extending along a first direction, and a cutting channel 3 extending along the first direction is provided between adjacent display chip modules 2.

[0060] S20: A mold 4 is provided on the side of the substrate 1 where the display chip module 2 is located. The mold 4 includes a plurality of strip structures 41 extending along a first direction. The orthogonal projection of the strip structures 41 on the substrate 1 is located within the cutting channel 3.

[0061] S30: An encapsulation layer 6 is formed on the side of the substrate 1 where the display chip module 2 is located. The encapsulation layer 6 covers the display chip module 2, the sidewall of the strip structure 41, and the exposed surface of the substrate 1.

[0062] S40: Remove mold 4.

[0063] In this embodiment, multiple strip-shaped structures 41 extending along a first direction are formed on the side of the substrate 1 where the display chip module 2 is located. The orthogonal projection of the strip-shaped structures 41 onto the substrate 1 is located within the dicing channel 3, thereby separating the display chip module 2 through the strip-shaped structures 41. When the encapsulation layer 6 covering the display chip module 2 is formed on the substrate 1 based on the strip-shaped structures 41, the thickness of the encapsulation layer 6 can be controlled to be consistent with the height of the strip-shaped structures 41, so that the surface of the encapsulation layer 6 facing away from the substrate 1 and the surface of the strip-shaped structures 41 facing away from the substrate 1 are located on the same plane. This helps to control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6, so that the formation of the encapsulation layer 6 is not limited by the shape and size of the substrate 1, thereby reducing the cost of Micro LED packaging (MicroLED in Package, MIP).

[0064] In some examples, after removing the mold 4 in step S40, the process also includes curing the encapsulation layer 6.

[0065] In some examples, step S30, forming an encapsulation layer 6 on the side of the substrate 1 where the display chip module 2 is located, includes applying encapsulating adhesive 60 to the side of the substrate 1 where the display chip module 2 is located using a scraper 5 to form the encapsulation layer 6.

[0066] In some examples, each display chip module 2 includes a plurality of display chips 21, which are spaced apart along a first direction; the short side of each display chip 21 is parallel to the first direction; and the long side of each display chip 21 is parallel to a second direction.

[0067] In some examples, step S30, applying encapsulating adhesive 60 to the side of the substrate 1 having the display chip module 2 using a scraper 5, includes: applying encapsulating adhesive 60 along a third direction on the side of the substrate 1 having the display chip module 2 using a scraper 5. The third direction intersects both the first and second directions.

[0068] To more clearly illustrate the display chip packaging method provided in the above embodiments, the following is combined with... Figures 2(a) to 10 The packaging method for this display chip is described in detail.

[0069] In step S10, referring to Figures 2(a) and 2(b), a substrate 1 is provided. One side surface of the substrate 1 has a plurality of display chip modules 2 extending along a first direction (e.g., the X direction), and adjacent display chip modules 2 have a cutting channel 3 extending along the first direction (e.g., the X direction).

[0070] In some examples, substrate 1 includes, but is not limited to, a glass substrate. In other embodiments, substrate 1 may also be a sapphire substrate, a semiconductor substrate, a transparent plastic substrate, or other types of substrates, which are not limited herein and are selected according to the actual situation.

[0071] In some examples, each display chip module 2 includes a plurality of display chips 21, which are spaced apart along a first direction (e.g., the X direction); the short side of each display chip 21 is parallel to the first direction (e.g., the X direction); and the long side of each display chip 21 is parallel to a second direction (e.g., the Y direction).

[0072] Here, each display chip 21 in each display chip module 2 corresponds one-to-one with the display chip 21 in the adjacent display chip module 2.

[0073] For example, display chip 21 includes red light-emitting diodes 211, green light-emitting diodes 212, and blue light-emitting diodes 213 arranged in sequence at equal intervals. In other embodiments, a display chip 21 includes red light-emitting diodes 211, green light-emitting diodes 212, and blue light-emitting diodes 213 arranged in sequence at equal intervals, and an adjacent display chip 21 includes green light-emitting diodes 212, red light-emitting diodes 211, and blue light-emitting diodes 213 arranged in sequence at equal intervals; or an adjacent display chip 21 includes green light-emitting diodes 212, blue light-emitting diodes 213, and red light-emitting diodes 211 arranged in sequence at equal intervals, that is, the color of the light-emitting diode in the preceding display chip 21 that is closer to the following display chip 21 is different from the color of the light-emitting diode in the following display chip 21 that is closer to the preceding display chip 21, which can improve color shift. This is not a specific limitation.

[0074] In step S20, please refer to Figures 3(a) and 3(b), a mold 4 is provided on the side of the substrate 1 where the display chip module 2 is located. The mold 4 includes a plurality of strip structures 41 extending along a first direction (e.g., the X direction). The orthogonal projection of the strip structures 41 on the substrate 1 is located within the cutting channel 3.

[0075] In some examples, the material of mold 4 can be steel or other materials that are not easily deformed.

[0076] In some examples, see Figure 3(b), the height H of the strip structure 41 is no greater than 100 μm.

[0077] In some examples, the dimension of the strip structure 41 along the second direction (e.g., the Y direction) is equal to the dimension of the cut track 3 along the second direction (e.g., the Y direction). This facilitates the subsequent separation of the display chip modules 2 from each other.

[0078] Here, the dimension of the strip structure 41 along the second direction (e.g., the Y direction) includes: approximately equal to the dimension of the cutting channel 3 along the second direction (e.g., the Y direction).

[0079] For example, the size range of the strip structure 41 along the second direction (e.g., the Y direction) includes 80 μm to 150 μm. For example, the size of the strip structure 41 along the second direction (e.g., the Y direction) can be 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm, etc.

[0080] Optionally, the strip structure 41 is perpendicular to the long side of the display chip 21 and parallel to the short side of the display chip 21.

[0081] Here, in the second direction (e.g., the Y direction), the distances between the red LED 211, the green LED 212, and the blue LED 213 and the strip structure 41 are all the same, ensuring that the viewing angles of the red LED 211, the green LED 212, and the blue LED 213 are consistent when viewed from a large angle.

[0082] In step S30, referring to Figures 4(a) and 4(b), a scraper 5 is used to apply encapsulating adhesive 60 to the side of the substrate 1 with the display chip module 2 to form an encapsulation layer 6.

[0083] In this embodiment, a scraper 5 is used to apply encapsulating adhesive 60 to the side of the substrate 1 with the display chip module 2, which can better control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6.

[0084] In some examples, referring to Figure 4(c), encapsulating adhesive 60 is applied to the side of the substrate 1 with the display chip module 2 along a third direction (e.g., the Z direction) using a scraper 5 to form an encapsulation layer 6. The third direction (e.g., the Z direction) intersects with both the first direction (e.g., the X direction) and the second direction (e.g., the Y direction).

[0085] In this embodiment of the application, instead of applying the encapsulating adhesive 60 along a first direction (e.g., the X direction) or a second direction (e.g., the Y direction), applying the encapsulating adhesive 60 along a third direction (e.g., the Z direction) on the side of the substrate 1 with the display chip module 2 using a scraper 5 can effectively avoid wear of the mold 4 by the scraper 5, and also avoid the problems of color deviation and poor visual effect caused by unevenness of the encapsulation layer 6 at the position of the mold 4.

[0086] For example, the scraper 5 and the mold 4 are in physical contact.

[0087] Here, please refer to Figures 5(a) and 5(b). Applying the encapsulating adhesive 60 using the scraper 5 can control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6.

[0088] For example, the material of the encapsulating adhesive 60 can be a flexible material.

[0089] In step S40, referring to Figures 6(a) and 6(b), mold 4 is removed.

[0090] In some examples, please refer to Figure 7 If the strip structure 41 is parallel to the long side of the display chip 21, the uneven encapsulation layer 6 at the demolding point will affect the light effect after the mold 4 is removed, causing some positions to have a bluish light and some positions to have a yellowish light.

[0091] For further examples, please refer to Figure 8In this application, the strip structure 41 is parallel to the short side of the display chip 21. Therefore, after removing the mold 4, the uneven encapsulation layer 6 at the demolding point will not affect the light effect, and the color of the light at different positions is consistent.

[0092] In some examples, please refer to Figure 9 The mold 4 also includes a frame 42, which is fixedly connected to the strip structure 41.

[0093] Here, the border 42 and the strip structure 41 can be a single integrated structure.

[0094] In some examples, please refer to Figure 10 The dimension of the mold 4 along the first direction (e.g., the X direction) is larger than the dimension of the substrate 1 along the first direction (e.g., the X direction). For example, the difference between the dimension of the mold 4 along the first direction (e.g., the X direction) and the dimension of the substrate 1 along the first direction (e.g., the X direction) is not less than one-quarter of the dimension of the strip structure 41 along the first direction (e.g., the X direction). In some examples, the width of the frame 42 is greater than or equal to one-quarter of the dimension of the mold 4 along the first direction (e.g., the X direction) or the dimension in the second direction (e.g., the Y direction), which is beneficial for supporting the scraper 5 and extending its lifespan.

[0095] In this embodiment, the dimension of the mold 4 along the first direction (e.g., the X direction) is larger than the dimension of the substrate 1 along the first direction (e.g., the X direction), that is, the mold 4 is widened. This helps to further avoid wear of the mold 4 by the scraper 5, and avoids the problems of color deviation and poor visual effect caused by unevenness of the encapsulation layer 6 at the position of the mold 4, while extending the service life of the mold 4.

[0096] After removing the mold 4 in step S40, the process also includes curing the encapsulation layer 6.

[0097] In some examples, after the encapsulation layer 6 is cured, it can be subsequently cut using a laser or a cutting wheel to separate the different display chip modules 2 from each other.

[0098] As a further example, after the different display chip modules 2 are separated from each other, it is still necessary to use a laser or a cutting wheel to cut the display chip modules 2 to separate the different display chips 21 from each other.

[0099] Here, because the material of the encapsulating adhesive 6 is elastic, it will return to flatness after being cut by laser or cutting wheel together with the substrate 1.

[0100] Based on the same inventive concept, please refer to Figure 11This application embodiment also provides a mold 4 for packaging a display chip 21, including: a frame 42, and a plurality of strip structures 41 disposed within the frame 42 and fixedly connected to the frame 42. The strip structures 41 extend along a first direction (e.g., the X direction), and there is a gap between adjacent strip structures 41. The gap is used to accommodate the corresponding display chip module 2 on the substrate 1 to form an encapsulation layer 6 covering the display chip module 2, the sidewalls of the strip structures 41, and the exposed surface of the substrate 1; the first direction (e.g., the X direction) is the extension direction of the chip display module 2.

[0101] In this embodiment, the shape of the border 42 is a square, rectangle, circle or other shape, which is not limited here and can be selected according to actual needs.

[0102] In this embodiment, by employing a mold 4 with multiple strip structures 41 extending along a first direction (e.g., the X direction), the display chip modules 2 can be separated by the strip structures 41. Thus, when forming the encapsulation layer 6 covering the display chip modules 2 on the substrate 1 based on the strip structures 41, the thickness of the encapsulation layer 6 can be controlled to be consistent with the height of the strip structures 41, ensuring that the surface of the encapsulation layer 6 facing away from the substrate 1 and the surface of the strip structures 41 facing away from the substrate 1 are on the same plane. This helps control the thickness of the encapsulation layer 6 and ensures its flatness, making the formation of the encapsulation layer 6 not limited by the shape and size of the substrate 1, thereby reducing the cost of Micro LED in Package (MIP).

[0103] Here, the border 42 and the strip structure 41 can be a single integrated structure.

[0104] In some examples, the mold 4 is disposed on the surface of a substrate 1 having a plurality of display chip modules 2 extending along a first direction (e.g., the X direction), and there are cutting channels 3 extending along the first direction (e.g., the X direction) between adjacent display chip modules 2.

[0105] In some examples, substrate 1 includes, but is not limited to, a glass substrate. In other embodiments, substrate 1 may also be a sapphire substrate, a semiconductor substrate, a transparent plastic substrate, or other types of substrates, which are not limited herein and are selected according to the actual situation.

[0106] In some examples, please refer to [link / reference]. Figure 9 Each display chip module 2 includes multiple display chips 21, and the multiple display chips 21 are spaced apart along a first direction (e.g., the X direction); the short side of each display chip 21 is parallel to the first direction (e.g., the X direction); and the long side of each display chip 21 is parallel to a second direction (e.g., the Y direction).

[0107] Here, each display chip 21 in each display chip module 2 corresponds one-to-one with the display chip 21 in the adjacent display chip module 2.

[0108] For example, display chip 21 includes red light-emitting diodes 211, green light-emitting diodes 212, and blue light-emitting diodes 213 arranged in sequence at equal intervals. In other embodiments, a display chip 21 includes red light-emitting diodes 211, green light-emitting diodes 212, and blue light-emitting diodes 213 arranged in sequence at equal intervals, and an adjacent display chip 21 includes green light-emitting diodes 212, red light-emitting diodes 211, and blue light-emitting diodes 213 arranged in sequence at equal intervals; or an adjacent display chip 21 includes green light-emitting diodes 212, blue light-emitting diodes 213, and red light-emitting diodes 211 arranged in sequence at equal intervals, that is, the color of the light-emitting diode in the preceding display chip 21 that is closer to the following display chip 21 is different from the color of the light-emitting diode in the following display chip 21 that is closer to the preceding display chip 21, which can improve color shift. This is not a specific limitation.

[0109] In some examples, please continue to combine Figure 8 It is understood that the dimension of the mold 4 along the first direction (e.g., the X direction) is greater than the dimension of the substrate 1 along the first direction (e.g., the X direction). For example, the difference D between the dimension of the mold 4 along the first direction (e.g., the X direction) and the dimension of the substrate 1 along the first direction (e.g., the X direction) is not less than one-quarter of the dimension of the strip structure 41 along the first direction (e.g., the X direction).

[0110] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A packaging method of a display chip, characterized by, The method comprises the following steps: providing a substrate, one side surface of the substrate having a plurality of display chip modules extending along a first direction, and a cutting path extending along the first direction between adjacent display chip modules; disposing a mold on the side of the substrate having the display chip modules, the mold comprising a plurality of strip structures extending along the first direction, the strip structures being located within the cutting path in the orthographic projection of the substrate; forming an encapsulation layer on the side of the substrate having the display chip modules, the encapsulation layer covering the display chip modules, sidewalls of the strip structures, and exposed surfaces of the substrate, and the thickness of the encapsulation layer being consistent with the height of the strip structures; removing the mold.

2. The packaging method of a display chip according to claim 1, wherein, After the mold is removed, the method further comprises curing the encapsulation layer.

3. The packaging method of a display chip according to claim 1, wherein, Each of the display chip modules comprises a plurality of display chips, the plurality of display chips each having a spacing along the first direction; a short side of each of the display chips is parallel to the first direction; and a long side of each of the display chips is parallel to a second direction.

4. The packaging method of a display chip according to claim 3, wherein, The forming of the encapsulation layer on the side of the substrate having the display chip modules comprises: applying encapsulation glue to the side of the substrate having the display chip modules using a doctor blade to form the encapsulation layer.

5. The packaging method of a display chip according to claim 4, wherein, The applying of the encapsulation glue to the side of the substrate having the display chip modules using the doctor blade comprises: applying the encapsulation glue to the side of the substrate having the display chip modules along a third direction using the doctor blade; the third direction intersects the first direction and the second direction.

6. The packaging method of a display chip according to claim 3, wherein, The strip structures have a dimension along the second direction that is equal to a dimension of the cutting path along the second direction.

7. The packaging method of a display chip according to claim 3, wherein, The strip structures are perpendicular to the long sides of the display chips and parallel to the short sides of the display chips. The mold further comprises a bezel, the bezel being fixedly connected to the strip structures.

8. The packaging method of a display chip according to claim 7, wherein, The dimension of the mold along the first direction is greater than the dimension of the substrate along the first direction; the difference between the dimension of the mold along the first direction and the dimension of the substrate along the first direction is not less than one fourth of the dimension of the strip structures along the first direction; and the height of the strip structures is not greater than 100 µm.

9. A mold characterized in that, An encapsulation for a display chip comprises: a bezel; and a plurality of strip structures disposed in the bezel and fixedly connected to the bezel, the strip structures extending along a first direction and having a spacing between adjacent strip structures; wherein the spacing is used to accommodate a corresponding display chip module on a substrate to form an encapsulation layer covering the display chip module, sidewalls of the strip structures, and exposed surfaces of the substrate, and the thickness of the encapsulation layer being consistent with the height of the strip structures; and the first direction being the extension direction of the display chip module.

10. The mold of claim 9, wherein: the dimension of the mold along the first direction is greater than the dimension of the substrate along the first direction; the difference between the dimension of the mold along the first direction and the dimension of the substrate along the first direction is not less than one fourth of the dimension of the strip structures along the first direction; and the height of the strip structures is not greater than 100 µm.

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