Optical module

Abstract

The invention provides an optical module, which comprises a circuit board, a power supply chip, a DSP chip, an optical receiving part, an MCU and an optical transmitting part, and is characterized in that the power supply chip is electrically connected with a golden finger on the circuit board, the power supply chip supplies power to the DSP chip, the optical receiving part is electrically connected with the DSP chip, and the MCU is connected with the power supply chip and the DSP chip; wherein the MCU is configured to control the power supply chip to output power supply voltage and obtain the power supply voltage and receiving parameters in the DSP chip, and the receiving parameters comprise a receiving side bit error rate and a signal-to-noise ratio; when the temperature changes, judging whether the receiving parameter exceeds a target range or not; when the receiving parameter does not exceed the target range, controlling the power supply chip to reduce the output power supply voltage value; and when the receiving parameter exceeds the target range, controlling the power supply chip to increase or decrease the output power supply voltage value. When the temperature of the optical module changes, the receiving parameters of the optical module are changed by adjusting the power supply voltage of the DSP chip, so that the high performance and low power consumption of the optical module are ensured.

Description

optical modules

[0001] This application claims the priority of application number 202310792138.9 filed with the China Patent Office on June 29, 2023; the priority of application number 202310745520.4 filed with the China Patent Office on June 21, 2023; the priority of application number 202310779792.6 filed with the China Patent Office on June 29, 2023; and the priority of application number 202310777682.6 filed with the China Patent Office on September 25, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] The optical module provided in the embodiment of the present disclosure includes:

[0006] A circuit board with a gold finger at one end;

[0007] A power chip is mounted on the circuit board, and the power chip is electrically connected to the gold finger;

[0008] A DSP chip is mounted on the circuit board, the DSP chip is electrically connected to the power chip, and the power chip supplies power to the DSP chip;

[0009] A light receiving component is electrically connected to the circuit board, the light receiving component is electrically connected to the DSP chip, and the electrical signal output by the light receiving component is transmitted to the DSP chip;

[0010] MCU, mounted on the circuit board, the MCU is connected to the power chip and the DSP chip respectively;

[0011] The MCU is configured as follows:

[0012] Controlling the power supply chip to output a supply voltage;

[0013] Acquire the power supply voltage and receiving parameters in the DSP chip, wherein the receiving parameters include a receiving side bit error rate and a signal-to-noise ratio;

[0014] When the temperature changes, determining whether the received parameter exceeds a target range;

[0015] When the received parameter does not exceed the target range, controlling the power chip to reduce the output power supply voltage value;

[0016] When the receiving parameter exceeds the target range, controlling the power supply chip to increase or decrease the output supply voltage value to improve the receiving parameter;

[0017] A light emitting component, electrically connected to the circuit board, comprising:

[0018] tube shell;

[0019] An electrical connection component having a first bonding area formed on a surface thereof, wherein the electrical connection component is configured to transmit high-frequency signals or simultaneously transmit low-frequency signals and high-frequency signals;

[0020] an electrical connector, one end of which extends into the tube shell and the other end of which is outside the tube shell, wherein the surface outside the tube shell has a second wiring area;

[0021] A support component is provided between the electrical connection component and the electrical connector / the tube shell, and is configured to support the electrical connection component so that the surfaces of the first bonding area and the second bonding area are flush, thereby enabling bonding connection between the electrical connection component and the electrical connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0024] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0025] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0026] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0027] FIG5 is a partial structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure;

[0028] FIG6 is a first block diagram of a power supply for a DSP chip in an optical module according to some embodiments of the present disclosure;

[0029] FIG7 is a block diagram of bit error rate detection in an optical module according to some embodiments of the present disclosure;

[0030] FIG8 is a second power supply block diagram of a DSP chip in an optical module according to some embodiments of the present disclosure;

[0031] FIG9 is a third power supply block diagram of a DSP chip in an optical module according to some embodiments of the present disclosure;

[0032] FIG10 is a structural diagram of a first light emitting component provided according to some embodiments of the present disclosure;

[0033] FIG11 is a structural diagram 1 of a first electrical connector provided according to some embodiments of the present disclosure;

[0034] FIG12 is a second structural diagram of a first electrical connector provided according to some embodiments of the present disclosure;

[0035] FIG13 is a side view of a first light emitting component provided according to some embodiments of the present disclosure;

[0036] FIG14 is an exploded view of a first light emitting component according to some embodiments of the present disclosure;

[0037] FIG15 is a second exploded view of a first light emitting component according to some embodiments of the present disclosure;

[0038] FIG16 is a side view of a first light emitting component according to some embodiments of the present disclosure;

[0039] FIG17 is a partial diagram of a first light emitting component provided according to some embodiments of the present disclosure;

[0040] FIG18 is a schematic diagram of bonding between the surface of a second flexible circuit board and the surface of a second stepped surface according to some embodiments of the present disclosure;

[0041] FIG19 is a schematic diagram showing a connection between a first tube housing and a first electrical connector according to some embodiments of the present disclosure;

[0042] FIG20 is a schematic diagram illustrating connections between a first housing, a first electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure;

[0043] FIG21 is a schematic diagram of a connection between a first tube housing and a second electrical connector according to some embodiments of the present disclosure;

[0044] FIG22 is a schematic diagram illustrating connections between a first housing, a second electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure;

[0045] FIG23 is a structural diagram of a second light emitting component provided according to some embodiments of the present disclosure;

[0046] FIG24 is a structural diagram of a third electrical connector provided according to some embodiments of the present disclosure;

[0047] FIG25 is an exploded view of a second light emitting component provided according to some embodiments of the present disclosure;

[0048] FIG26 is a schematic diagram illustrating a connection between a second tube housing and a third electrical connector according to some embodiments of the present disclosure;

[0049] FIG27 is a side view of a second light emitting component according to some embodiments of the present disclosure;

[0050] FIG28 is a cross-sectional view of a second light emitting component provided according to some embodiments of the present disclosure;

[0051] FIG29 is a structural diagram of a third light emitting component provided according to some embodiments of the present disclosure;

[0052] FIG30 is an exploded view of a third light emitting component provided according to some embodiments of the present disclosure;

[0053] FIG31 is a partial exploded view of a third light emitting component provided according to some embodiments of the present disclosure;

[0054] FIG32 is a side view of a third light emitting component according to some embodiments of the present disclosure;

[0055] FIG33 is a cross-sectional view of a third light emitting component provided according to some embodiments of the present disclosure;

[0056] FIG34 is a cross-sectional view of a fourth light emitting component according to some embodiments of the present disclosure;

[0057] FIG35 is an exploded view of a fourth light emitting component provided according to some embodiments of the present disclosure;

[0058] FIG36 is a structural diagram of a fourth tube shell provided according to some embodiments of the present disclosure;

[0059] FIG37 is a schematic diagram of a partial structure of a flexible circuit board provided according to some embodiments of the present disclosure;

[0060] FIG38 is a schematic diagram of a cross-sectional structure of a flexible circuit board according to some embodiments of the present disclosure;

[0061] FIG39 is a schematic diagram of welding a gold finger pad according to some embodiments of the present disclosure;

[0062] FIG40 is a first schematic diagram of a partial structure of another flexible circuit board provided according to some embodiments of the present disclosure;

[0063] FIG41 is a second schematic diagram of a partial structure of another flexible circuit board provided according to some embodiments of the present disclosure;

[0064] FIG42 is an exploded schematic diagram of another flexible circuit board provided according to some embodiments of the present disclosure;

[0065] FIG43 is a schematic diagram of a partial structure of yet another flexible circuit board provided according to some embodiments of the present disclosure;

[0066] FIG44 is a schematic diagram of a partial structure of a circuit board provided according to some embodiments of the present disclosure;

[0067] FIG45 is a partial schematic diagram of a connection between a circuit board and a flexible circuit board according to some embodiments of the present disclosure;

[0068] FIG46 is a cross-sectional schematic diagram of a connection between a circuit board and a flexible circuit board according to some embodiments of the present disclosure;

[0069] FIG47 is a schematic diagram of a partial structure of another circuit board provided according to some embodiments of the present disclosure;

[0070] FIG48 is a cross-sectional view illustrating another connection between a circuit board and a flexible circuit board according to some embodiments of the present disclosure;

[0071] FIG49 is a first structural diagram of the other end of another flexible circuit board provided according to some embodiments of the present disclosure;

[0072] FIG50 is a second structural diagram of the other end of another flexible circuit board provided according to some embodiments of the present disclosure;

[0073] FIG51 is a schematic diagram of a partial structure of an electrical connector provided according to some embodiments of the present disclosure;

[0074] FIG52 is a schematic diagram illustrating the connection between a flexible circuit board and an electrical connector according to some embodiments of the present disclosure;

[0075] Figure 53 is a cross-sectional schematic diagram of the connection between a flexible circuit board and an electrical connector according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0076] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0077] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0078] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0079] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0080] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0081] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0082] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0083] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0084] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0085] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0086] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0087] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thus achieving long-distance, low-power information transmission.

[0088] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0089] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0090] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0091] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0092] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0093] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0094] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0095] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0096] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0097] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0098] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located on the side of the optical module 200. The opening 204 is an electrical port, from which the gold finger 301 of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0099] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light-emitting component 400, the light-receiving component 500, and the like within the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for these components. Furthermore, when assembling the circuit board 300, the light-emitting component 400, and the light-receiving component 500, the assembly of the upper housing 201 and the lower housing 202 facilitates the placement of positioning components, heat dissipation components, and electromagnetic shielding components for these components, facilitating automated production.

[0100] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0101] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0102] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0103] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0104] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0105] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0106] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0107] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0108] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0109] In some embodiments, the light emitting component 400 includes a tube shell, and the electrical connection between the tube shell and the circuit board 300 is achieved through an electrical connector and a flexible circuit board. For example, one end of the electrical connector is electrically connected to the tube shell, and the other end is electrically connected to one end of the flexible circuit board, and the other end of the flexible circuit board is point-connected to the circuit board 300, thereby achieving electrical connection between the tube shell and the circuit board 300.

[0110] In the electrical connection method between the electrical connector and the flexible circuit board, for example, the flexible circuit board and the electrical connector are connected by soldering. In this method, it is difficult to control the uniformity of the solder material thickness between the connecting surface of the flexible circuit board and the electrical connector, resulting in uneven solder coating. When the solder material thickness is uneven, the high-frequency signal transmission quality is easily reduced. For example, the high-frequency signal transmission quality is poor at the location where the solder material thickness is large. The uneven solder material thickness affects the stability of the high-frequency signal transmission quality, thereby affecting the transmission performance of the high-frequency signal.

[0111] In order to improve the transmission quality of high-frequency signals and ensure the transmission performance of high-frequency signals, in some embodiments, this can be achieved by improving the electrical connector. In some embodiments, this can also be achieved by improving the tube shell.

[0112] The optical emitting component 400 and the optical receiving component 500 are used to realize the transmission and reception of optical signals respectively. The optical emitting component 400 is electrically connected to the DSP chip. The circuit board 300 transmits electrical signals to the optical emitting component 400 through the DSP chip. The optical emitting component 400 generates an optical signal based on the electrical signal. The optical signal is transmitted through the optical fiber, thereby realizing the transmission of light.

[0113] The optical receiving component 500 is electrically connected to the DSP chip. The optical receiving component 500 receives the external optical signal transmitted by the optical fiber. The optical receiving component 500 converts the external optical signal into an electrical signal. The electrical signal is processed by the DSP chip and transmitted to the circuit board 300. The processed electrical signal is transmitted to the host computer 100 through the gold finger 301 on the circuit board 300, thereby realizing light reception.

[0114] During normal operation of the optical module, the supply voltage of the DSP chip may exceed the optimal operating range due to changes in external temperature, resulting in performance degradation of the optical module.

[0115] In order to solve the above problems, some embodiments of the present disclosure provide an optical module, which obtains the relationship between the power supply voltage of the DSP chip and the receiving parameters of the optical module when the temperature changes, and changes the receiving parameters of the optical module by adjusting the power supply voltage of the DSP chip to achieve stability of the power supply voltage of the DSP chip at different temperatures, thereby ensuring high performance and low power consumption of the optical module.

[0116] To solve the above-mentioned problems, the optical module provided by the present disclosure may include a circuit board, a power chip, a DSP chip, a light receiving component, an MCU and a light emitting component.

[0117] In some embodiments, a gold finger is provided at one end of the circuit board; a power chip is mounted on the circuit board, and the power chip is electrically connected to the gold finger; a DSP chip is mounted on the circuit board, and the DSP chip is electrically connected to the power chip, and the power chip supplies power to the DSP chip; a light receiving component is electrically connected to the circuit board, and the light receiving component is electrically connected to the DSP chip, and the electrical signal output by the light receiving component is transmitted to the DSP chip; an MCU is mounted on the circuit board, and the MCU is respectively connected to the power chip and the DSP chip;

[0118] Among them, the MCU is configured to: control the power supply chip to output the supply voltage; obtain the supply voltage and the receiving parameters in the DSP chip, the receiving parameters including the receiving side bit error rate and signal-to-noise ratio; when the temperature changes, determine whether the receiving parameters exceed the target range; when the receiving parameters do not exceed the target range, control the power supply chip to reduce the output supply voltage value; when the receiving parameters exceed the target range, control the power supply chip to increase or decrease the output supply voltage value to improve the receiving parameters.

[0119] In some embodiments, the optical emitting component is electrically connected to the circuit board and may include a housing, an electrical connection assembly, an electrical connector, and a support assembly. The electrical connection assembly has a first bonding area formed on its surface and is configured to transmit high-frequency signals or simultaneously transmit low-frequency and high-frequency signals; the electrical connector has one end extending into the housing and the other end located outside the housing, wherein the surface located outside the housing has a second bonding area; and the support assembly is disposed between the electrical connection assembly and the electrical connector / housing and is configured to support the electrical connection assembly so that the surfaces of the first bonding area and the second bonding area are flush, thereby enabling a bonding connection between the electrical connection assembly and the electrical connector.

[0120] The optical module provided by the present disclosure measures the relationship between the DSP chip's supply voltage and the module's receiving parameters when the temperature changes. By adjusting the DSP chip's supply voltage, the module's receiving parameters are altered, ensuring the module's high performance and low power consumption. Furthermore, the present disclosure improves the transmission quality of high-frequency signals between a flexible printed circuit board (FPCB) or printed circuit board (PCB) and an electrical connector by selectively improving the structure of the tube shell in the optical transmitting component, thereby ensuring the transmission performance of high-frequency signals in the optical module. This can also be achieved by improving the electrical connector, as will be understood with reference to the following embodiments.

[0121] Figure 5 is a partial structural diagram of a circuit board in an optical module provided according to some embodiments of the present disclosure. As shown in Figure 5, circuit board 300 is provided with an MCU 302, a power chip 303, and a DSP chip 304. One end of the power chip 303 is electrically connected to a gold finger 301 to supply power to the power chip 303 via the gold finger 301; the other end of the power chip 303 is electrically connected to the DSP chip 304 to supply power to the DSP chip 304 via the power chip 303; and the power chip 303 is electrically connected to the MCU 302 to control the supply voltage output by the power chip 303 to the DSP chip 304 via the MCU 302.

[0122] Since the DSP chip 304 transmits electrical signals to the optical transmitting component 400 and the optical receiving component 500 transmits electrical signals to the DSP chip 304 , the operating parameters of the DSP chip 304 are related to the transmitting parameters and the receiving parameters of the optical module.

[0123] In some embodiments, the transmission parameters and receiving parameters of the optical module are not only related to the operating parameters of the DSP chip 304, but also to other operating parameters in the optical module. When the optical module is at room temperature, the operating parameters of the DSP chip 304 are fixed. When the receiving parameters of the optical module are abnormal, the receiving parameters of the optical module are changed by adjusting other operating parameters in the optical module.

[0124] In some embodiments, when the ambient temperature of the optical module changes, such as when the temperature rises, the current required by optoelectronic devices such as lasers in the optical emitting component 400 and detectors in the optical receiving component 500 increases, and the power consumption of the optical module increases. If the operating parameters of the DSP chip 304 (such as the power supply voltage) remain unchanged at this time, the DSP chip 304 may be unable to meet the large current requirements of the optical emitting component 400 and the optical receiving component 500, causing the performance of the optical module to deteriorate.

[0125] When the temperature drops, the current required by optoelectronic devices such as lasers in the optical emitting component 400 and detectors in the optical receiving component 500 decreases, and the power consumption of the optical module decreases. If the power supply voltage of the DSP chip 304 remains unchanged at this time, the DSP chip 304 may exceed the requirements of the optical emitting component 400 and the optical receiving component 500, resulting in higher power consumption of the optical module.

[0126] To ensure the high performance and low power consumption of the optical module, when the ambient temperature of the optical module changes, the relationship between the power supply voltage of the DSP chip 304 and the receiving parameters of the optical module is obtained. The MCU302 controls the power supply voltage output from the power supply chip 303 to the DSP chip 304 to adjust the power supply voltage of the DSP chip 304 at different temperatures to change the receiving parameters of the optical module so that the receiving parameters of the optical module are within the target range.

[0127] Figure 6 is a power supply block diagram for a DSP chip in an optical module according to some embodiments of the present disclosure. As shown in Figure 6, MCU 302 has an I2C interface, and power chip 303 has I2C pins. The I2C interface of MCU 302 is connected to the I2C pins of power chip 303 via an I2C signal line. MCU 302 sends a control signal to power chip 303 via the I2C signal line. Power chip 303 outputs a corresponding voltage value based on the control signal to power DSP chip 304.

[0128] It should be noted that the locations of the above-mentioned I2C interface and I2C pins can be set according to actual needs and are not specifically limited here.

[0129] In some embodiments, the DSP chip 304 has a specified supply voltage range, such as a preset voltage range of 0.6±3% V=0.582-0.618 V. The MCU 302 controls the power supply chip 303 to output a supply voltage within the preset voltage range to ensure the working performance of the DSP chip 302.

[0130] The Vout pin of the power chip 303 is connected to the DSP chip 304 via a cable to output the power supply voltage to the DSP chip 304. Since the cable connecting the power chip 303 and the DSP chip 304 has impedance, this will cause a voltage drop at both ends of the cable, which may cause the power supply voltage value received by the DSP chip 304 to exceed the preset voltage range of the DSP chip 304.

[0131] In order to ensure the stability of the power supply voltage of the DSP chip 304, the sense terminal of the power chip 303 is connected to the DSP chip 304, and the power chip 303 sends a compensation voltage through the sense terminal to compensate for the voltage drop caused by the cable.

[0132] The MCU 302 also has an MDIO interface, and the DSP chip 304 has an MDIO pin. The MDIO interface of the MCU 302 is connected to the MDIO pin of the DSP chip 304 via a signal line, and the MCU 302 obtains the working parameters of the DSP chip 304 via the signal line.

[0133] After MCU302 obtains the working parameters of DSP chip 304, MCU302 adjusts the supply voltage output by power chip 303 according to the working parameters of DSP chip 304 to change the supply voltage value of DSP chip 304, thereby changing the receiving parameters of the optical module to ensure high performance or low power consumption of the optical module.

[0134] In some embodiments, the receiving parameter of the optical module may be the receiving side bit error rate, which is stored in the DSP chip 304. The MCU302 obtains the receiving side bit error rate in the DSP chip 304. When the temperature changes, the MCU302 detects whether the receiving side bit error rate exceeds the bit error threshold, that is, whether the receiving side bit error rate has deteriorated. If the receiving side bit error rate is less than the bit error threshold, it means that the receiving side bit error rate has not deteriorated. At this time, the MCU302 controls the power supply chip 303 to reduce the output power supply voltage value to reduce the power consumption of the optical module.

[0135] If the bit error rate on the receiving side is greater than or equal to the bit error threshold, it indicates that the bit error rate on the receiving side has deteriorated. At this time, MCU302 controls the power chip 303 to increase or decrease the output power supply voltage value to improve the bit error rate on the receiving side and ensure the high performance of the optical module.

[0136] In some embodiments, the receiving parameter of the optical module may also be a signal-to-noise ratio. The signal-to-noise ratio is stored in the DSP chip 304. The MCU 302 obtains the signal-to-noise ratio in the DSP chip 304. When the temperature changes, the MCU 302 detects whether the signal-to-noise ratio exceeds the target signal-to-noise ratio. If the signal-to-noise ratio is greater than the target signal-to-noise ratio, it means that the noise in the received signal is less. At this time, the MCU 302 controls the power supply chip 303 to reduce the output supply voltage value to reduce the power consumption of the optical module.

[0137] If the SNR is less than or equal to the target SNR, it indicates that the received signal contains a lot of noise. In this case, the MCU 302 controls the power supply chip 303 to increase or decrease the output power supply voltage to improve the SNR and ensure the high performance of the optical module.

[0138] The optical module provided in the embodiments of the present disclosure is described by taking the receiving parameter as the receiving side bit error rate as an example.

[0139] Figure 7 is a block diagram for detecting the bit error rate on the receiving side of an optical module according to some embodiments of the present disclosure. As shown in Figure 7, after the optical receiving component 500 converts the optical signal into an electrical signal, the electrical signal is amplified by a trans-impedance amplifier (TIA) and transmitted to the DSP chip 304. The DSP chip 304 processes the amplified electrical signal and calculates the bit error rate on the receiving side based on parameters such as the received electrical signal.

[0140] In some embodiments, an error detection module is provided in the DSP chip 304. The error detection module can obtain the receiving side bit error rate based on parameters such as the electrical signal received by the DSP chip 304 from the optical receiving component 500. The MCU302 can obtain the receiving side bit error rate from the DSP chip 304.

[0141] MCU 302 can use the receive-side bit error rate within DSP chip 304 to characterize the operating status of DSP chip 304. For example, when the receive-side bit error rate is less than a bit error threshold, it indicates that the bit error rate has not degraded and the DSP chip 304 is operating well. When the receive-side bit error rate is greater than the bit error threshold, it indicates that the bit error rate has degraded and the DSP chip 304 is operating poorly. In some embodiments, the bit error threshold may be 1e-10.

[0142] In some embodiments, a register may be further provided in the DSP chip 304, and the error detection module stores the calculated receiving side bit error rate in the register, and the MCU 302 directly reads the receiving side bit error rate in the register so that the MCU 302 obtains the receiving parameters of the optical module.

[0143] When the temperature changes, the receiving side bit error rate may be related to the power supply voltage of the DSP chip 304. After MCU302 obtains the receiving side bit error rate of the optical module, MCU302 controls and adjusts the power supply voltage output by the power chip 303 to change the power supply voltage of the DSP chip 304. MCU302 obtains the receiving side bit error rate under the new power supply voltage of the DSP chip 304 and checks whether the receiving side bit error rate changes after the power supply voltage of the DSP chip 304 changes.

[0144] If the receiving side bit error rate changes with the change of the power supply voltage of the DSP chip 304, the MCU302 controls and adjusts the power supply voltage output by the power chip 303 according to the change of the receiving side bit error rate to change the receiving side bit error rate, thereby optimizing the receiving side bit error rate of the optical module and ensuring the high performance of the optical module.

[0145] If the receiving side bit error rate does not change with the change of the power supply voltage of the DSP chip 304, the MCU 302 does not need to control and adjust the power supply voltage output by the power chip 303, but needs to adjust other parameters to change the receiving side bit error rate of the optical module.

[0146] FIG8 is a second power supply block diagram of a DSP chip in an optical module according to some embodiments of the present disclosure, and FIG9 is a third power supply block diagram of a DSP chip in an optical module according to some embodiments of the present disclosure. As shown in FIG8 and FIG9 , a temperature sensor can be provided in MCU302 or on circuit board 300. The temperature sensor is connected to MCU302, and the ambient temperature of the optical module is collected via the temperature sensor in MCU302 or the temperature sensor on circuit board 300. A first register is provided in power chip 303, and the first register stores the supply voltage value output by power chip 303. An error detection module and a second register are provided in DSP chip 304. The error detection module calculates the receiving side bit error rate based on the parameters of the signal received by optical receiving component 500, and the error detection module stores the obtained receiving side bit error rate in the second register.

[0147] When the optical module is at room temperature, MCU302 reads the first voltage value in the first register and the first bit error rate in the second register. When the temperature changes, MCU302 reads the second voltage value in the first register and the second bit error rate in the second register. MCU302 compares the first bit error rate with the second bit error rate to detect whether the bit error rate on the receiving side of the optical module changes after the temperature changes.

[0148] In some embodiments, when the difference between the first bit error rate and the second bit error rate is less than half an order of magnitude of the bit error rate, it indicates that the bit error rate on the receiving side of the optical module has not changed; when the difference between the first bit error rate and the second bit error rate is greater than half an order of magnitude of the bit error rate, it indicates that the bit error rate on the receiving side of the optical module has changed.

[0149] For example, if the first bit error rate is 1e-6 and the second bit error rate is 1e-5, the difference between the first and second bit error rates is greater than half an order of magnitude, indicating that the bit error rate on the receiving side of the optical module has changed. If the first bit error rate is 1e-6 and the second bit error rate is 5e-5, the difference between the first and second bit error rates is less than half an order of magnitude, indicating that the bit error rate on the receiving side of the optical module has not changed.

[0150] When the temperature changes and the bit error rate of the optical module on the receiving side changes, the second bit error rate is compared with the bit error threshold to detect whether the second bit error rate has deteriorated. If the second bit error rate is less than the bit error threshold, it means that the bit error rate of the optical module on the receiving side has not deteriorated after the temperature changes; if the second bit error rate is greater than the bit error threshold, it means that the bit error rate of the optical module on the receiving side has deteriorated after the temperature changes.

[0151] When the temperature changes, the optical module's receiving-side bit error rate does not deteriorate. To reduce the optical module's power consumption, MCU 302 can control power supply chip 303 to reduce its output voltage, thereby reducing the supply voltage of DSP chip 304. The reduced supply voltage is within a preset voltage range of DSP chip 304, and the receiving-side bit error rate does not deteriorate under the reduced supply voltage. That is, when the temperature changes, while ensuring that the optical module's receiving-side bit error rate does not deteriorate, the supply voltage of DSP chip 304 is minimized to reduce the optical module's power consumption.

[0152] In some embodiments, when the temperature changes and the receiving side bit error rate of the optical module does not deteriorate, the MCU302 controls the voltage output by the power chip 303 to gradually decrease from the second voltage value. When the voltage output by the power chip 303 gradually decreases to the minimum supply voltage value in the preset voltage range, the receiving side bit error rate still does not deteriorate, then the MCU302 controls the power chip 303 to output the minimum supply voltage value to the DSP chip 304 to minimize the power consumption of the optical module.

[0153] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature changes, MCU302 controls the voltage output by the power supply chip 303 to gradually decrease from 0.6V. MCU302 obtains the bit error rate of the DSP chip 304 after the power supply voltage is reduced in real time. When the voltage output by the power supply chip 303 is 0.582V, the receiving side bit error rate obtained by MCU302 has not deteriorated. Then, MCU302 controls the power supply chip 303 to output a power supply voltage of 0.582V to the DSP chip 304.

[0154] In some embodiments, when the temperature changes and the receiving side bit error rate of the optical module does not deteriorate, the MCU302 controls the voltage output by the power supply chip 303 to gradually decrease from the second voltage value. When the voltage output by the power supply chip 303 is the first supply voltage value, the receiving side bit error rate at the first supply voltage value is equal to or greater than the error threshold value, indicating that the receiving side bit error rate at the first supply voltage value begins to deteriorate, then the MCU302 controls the power supply chip 303 to output a second supply voltage value to the DSP chip 304. The second supply voltage value is greater than the first supply voltage value, and the second supply voltage value is the first supply voltage value + 1%.

[0155] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature changes, MCU302 controls the voltage output by the power supply chip 303 to gradually decrease from 0.6V. MCU302 obtains the bit error rate of the DSP chip 304 after the power supply voltage is reduced in real time. When the voltage output by the power supply chip 303 is 0.58V, the receiving side bit error rate obtained by MCU302 begins to deteriorate, and then MCU302 controls the voltage output by the power supply chip 303 to 0.58+1%=0.5858V.

[0156] In some embodiments, when the temperature changes, the receiving side bit error rate of the optical module deteriorates. At this time, in order to ensure the performance of the optical module, the MCU302 adjusts the voltage value output by the power chip 303 to change the power supply voltage of the DSP chip 304, thereby changing the receiving side bit error rate of the optical module, so that the adjusted power supply voltage is within the preset voltage range of the DSP chip 304, and the receiving side bit error rate under the adjusted power supply voltage does not deteriorate, so as to optimize the receiving side bit error rate of the optical module.

[0157] When the optical module is in a high-temperature environment, due to the high heat dissipation efficiency, the current transmitted to the optical emitting component 400 and the optical receiving component 500 is large, and the power consumption of the optical module is large, resulting in a small supply voltage of the DSP chip 304 at room temperature. At this time, in order to ensure the performance of the optical module, the supply voltage of the DSP chip 304 needs to be increased.

[0158] In some embodiments, when the temperature rises and the receiving side bit error rate of the optical module deteriorates, the MCU302 controls the power supply chip 303 to increase the output supply voltage value. When the power supply voltage output by the power supply chip 303 gradually increases and the receiving side bit error rate under the gradually increasing supply voltage gradually decreases, the MCU302 controls the power supply chip 303 to output the maximum supply voltage value within a preset voltage range to the DSP chip 304.

[0159] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature rises, MCU302 controls the voltage output by the power supply chip 303 to gradually increase from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is increased in real time. When the voltage output by the power supply chip 303 gradually increases, the receiving side bit error rate gradually decreases. When the voltage output by the power supply chip 303 increases to 0.618V, the receiving side bit error rate is the best and does not deteriorate. Then MCU302 controls the power supply chip 303 to output a power supply voltage of 0.618V to the DSP chip 304.

[0160] In some embodiments, when the temperature rises and the receiving side bit error rate of the optical module deteriorates, the MCU302 controls the power supply chip 303 to increase the output power supply voltage value, and the receiving side bit error rate gradually decreases as the power supply voltage of the DSP chip 304 increases. When the voltage output by the power supply chip 303 is a third power supply voltage value, the receiving side bit error rate at the third power supply voltage value is less than the bit error threshold value, and as the power supply voltage continues to increase, the receiving side bit error rate stabilizes, then the MCU302 controls the power supply chip 303 to output the third power supply voltage value to the DSP chip 304, and the third power supply voltage value is within the preset voltage range of the DSP chip 304.

[0161] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature changes, MCU302 controls the voltage output by the power supply chip 303 to gradually increase from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is increased in real time. When the power supply voltage output by the power supply chip 303 gradually increases, the receiving side bit error rate gradually decreases. When the voltage output by the power supply chip 303 increases to 0.61V, the receiving side bit error rate is stable and does not deteriorate. Then MCU302 controls the voltage output by the power supply chip 303 to be 0.61V.

[0162] When the optical module is in a low temperature environment, the power consumption of the optical module is low, resulting in a higher supply voltage of the DSP chip 304 at room temperature. To ensure the performance of the optical module, the supply voltage of the DSP chip 304 needs to be reduced.

[0163] In some embodiments, when the temperature decreases and the bit error rate on the receiving side of the optical module deteriorates, the MCU302 controls the power supply chip 303 to reduce the output supply voltage. When the power supply voltage output by the power supply chip 303 gradually decreases and the bit error rate on the receiving side gradually becomes smaller, the MCU302 controls the power supply chip 303 to output the minimum supply voltage value within the preset voltage range to the DSP chip 304.

[0164] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature drops, MCU302 controls the voltage output by the power supply chip 303 to gradually decrease from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is reduced in real time. When the power supply voltage output by the power supply chip 303 gradually decreases, the receiving side bit error rate gradually decreases. When the voltage output by the power supply chip 303 drops to 0.582V, the receiving side bit error rate is the smallest and does not deteriorate. Then MCU302 controls the power supply chip 303 to output a power supply voltage of 0.582V to the DSP chip 304.

[0165] In some embodiments, when the temperature decreases and the receiving side bit error rate of the optical module deteriorates, the MCU302 controls the power supply chip 303 to reduce the output power supply voltage, and the receiving side bit error rate gradually decreases as the power supply voltage of the DSP chip 304 decreases. When the voltage output by the power supply chip 303 is a fourth power supply voltage value, the receiving side bit error rate at the fourth power supply voltage value is less than the bit error threshold value, and as the power supply voltage continues to decrease, the receiving side bit error rate stabilizes, then the MCU302 controls the power supply chip 303 to output a fourth power supply voltage value to the DSP chip 304, and the fourth power supply voltage value is within the preset voltage range of the DSP chip 304.

[0166] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature drops, MCU302 controls the voltage output by the power supply chip 303 to gradually decrease from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is reduced in real time. When the voltage output by the power supply chip 303 gradually decreases, the receiving side bit error rate gradually becomes smaller. When the voltage output by the power supply chip 303 drops to 0.59V, the receiving side bit error rate is stable and does not deteriorate. Then MCU302 controls the voltage output by the power supply chip 303 to be 0.59V.

[0167] In some embodiments, a LUT table can be generated in MCU302 based on the relationship between the DSP power supply voltage value and the receiving side bit error rate at different temperatures. When the ambient temperature of the optical module changes, MCU302 obtains the current temperature value, and MCU302 searches the LUT table for the DSP power supply voltage value and the receiving side bit error rate value corresponding to the current temperature value. MCU302 directly controls the power supply chip 303 to output the corresponding power supply voltage value, so that the receiving side bit error rate of the DSP chip 304 at the power supply voltage value reaches the corresponding receiving side bit error rate value, thereby realizing the adjustment of the DSP power supply voltage and the receiving side bit error rate at different temperatures.

[0168] The optical module provided by the embodiment of the present disclosure reads the value of the first register in the power chip and the value of the second register in the DSP chip through the MCU when the ambient temperature of the optical module changes, obtains the power supply voltage output by the power chip and the receiving side bit error rate of the optical module, and controls the power supply chip to increase or decrease the output power supply voltage according to the degradation of the receiving side bit error rate of the optical module, obtains the relationship between the power supply voltage of the DSP chip and the receiving parameters of the optical module, and changes the receiving parameters of the optical module by adjusting the power supply voltage of the DSP chip so that the receiving parameters of the optical module are within the target range, thereby achieving adjustment of the DSP power supply voltage and the receiving side bit error rate at different temperatures, thereby ensuring high performance and low power consumption of the optical module.

[0169] In order to improve the transmission quality of high-frequency signals and ensure the transmission performance of high-frequency signals, in some embodiments, this can be achieved by improving the electrical connector. In some embodiments, this can also be achieved by improving the tube shell.

[0170] In some embodiments, the electrical connection component includes a flexible circuit board, which may be a first flexible circuit board and a second flexible circuit board; the support component includes a support member or a support structure; the electrical connector may include a first electrical connector, a second electrical connector, and a third electrical connector.

[0171] Figure 10 is a structural diagram of a first optical transmitter component provided according to some embodiments of the present disclosure. As shown in Figure 10, in some embodiments, the optical transmitter component 400 includes a first housing 410a, an electrical connector, and a flexible circuit board. The electrical connection between the first housing 410a and the circuit board 300 is achieved through the electrical connector and the flexible circuit board. For example, the first housing 410a is a transmitter housing, internally provided with a laser array 411a, a lens array 412a, an optical multiplexing assembly 413a, and a collimating lens 414a. The laser array 411a emits light of different wavelengths. Each beam is sequentially processed by the converging lens in the lens array 412a, transitioning from a divergent state to a convergent state. The beams are then combined by the optical multiplexing assembly 413a into a single beam. This beam is then collimated by the collimating lens 414a and converted into parallel light, which is then emitted from the first housing 410a as parallel light.

[0172] In some embodiments, the number of flexible circuit boards is not limited. When there is one flexible circuit board, the flexible circuit board is described as a first flexible circuit board. The first flexible circuit board can transmit both low-frequency signals and high-frequency signals. A first bonding area is formed on the surface of the first flexible circuit board.

[0173] One end of the electrical connector extends into the first tube shell 410a, and the other end is outside the first tube shell 410a. The end outside the first tube shell 410a is formed with a first step surface and a second step surface, and the first step surface has a second wiring area.

[0174] In some embodiments, a wire bonding connection is formed between the first flexible circuit board and the first step surface. In order to make the surfaces of the first wiring area and the second wiring area flush and provide a flat surface and support force for the wiring, a support member is fixedly provided on the surface of the second step surface. The support frame is used to support the first flexible circuit board so that the surfaces of the first wiring area and the second wiring area are flush, thereby making a wire bonding connection between the first flexible circuit board and the first step surface.

[0175] In some embodiments, the number of flexible circuit boards can be two, described as a first flexible circuit board 440 and a second flexible circuit board 430. In this case, one flexible circuit board can transmit low-frequency signals, while the other flexible circuit board transmits high-frequency signals, thereby reducing the width of the flexible circuit boards used. Furthermore, the second flexible circuit board 430 and the first flexible circuit board 440 are stacked one on top of the other to fully utilize the longitudinal space. For example, the second flexible circuit board 430 is used to transmit low-frequency signals, and the first flexible circuit board 440 is used to transmit high-frequency signals.

[0176] Similarly, one end of the electrical connector extends into the first tube shell 410a, and the other end is outside the first tube shell 410a, wherein the end outside the first tube shell 410a is respectively formed with a first step surface and a second step surface, wherein the surface of the first step surface has a second wiring area.

[0177] In some embodiments, the first flexible circuit board 440 is connected to the first step surface by bonding. In order to make the surfaces of the first bonding area and the second bonding area flush and provide a flat surface and support force for bonding, a support member is fixed on the surface of the second step surface. The support member is used to support the first flexible circuit board 440 so that the surfaces of the first bonding area and the second bonding area are flush, thereby making the first flexible circuit board 440 connected to the first step surface by bonding.

[0178] When the flexible circuit board includes a first flexible circuit board 440 and a second flexible circuit board 430 , the electrical connector correspondingly further includes a third step surface, and the third step surface is used for electrically connecting to the second flexible circuit board 430 .

[0179] The following is an exemplary description using an example in which the flexible circuit board may include a second flexible circuit board 430 and a first flexible circuit board 440 .

[0180] In some embodiments, an end portion of the first tube shell 410 a is connected to an electrical connector, and the second flexible printed circuit board 430 and the first flexible printed circuit board 440 are connected to the upper and lower surfaces of the electrical connector respectively.

[0181] One end of the electrical connector extends into the first tube shell 410a, and the other end is outside the first tube shell 410a. In order to improve the transmission performance of high-frequency signals by improving the electrical connector, multiple stepped surfaces are formed on the end of the electrical connector outside the first tube shell 410a to respectively connect to the second flexible circuit board 430 and the first flexible circuit board 440, thereby making the electrical connector compatible with two flexible circuit boards.

[0182] The electrical connector has a plurality of stepped surfaces formed on one end outside the first tube shell 410a. The second flexible circuit board 430 can be electrically connected to one of the stepped surfaces of the electrical connector; the first flexible circuit board 440 can be electrically connected to the other stepped surface of the electrical connector.

[0183] To balance process complexity and high-frequency signal transmission quality, in some embodiments, if the second flexible circuit board 430 is used to transmit low-frequency signals, the second flexible circuit board 430 and one of the stepped surfaces of the electrical connector may be connected by soldering; if the first flexible circuit board 440 is used to transmit high-frequency signals, the first flexible circuit board 440 and the other stepped surface of the electrical connector may be connected by bonding. Bonding can avoid the problem of uneven solder coating during the soldering process and is more conducive to the transmission of high-frequency signals than soldering. It is understood that bonding can also be used to achieve electrical connection between the second flexible circuit board 430 and one of the stepped surfaces of the electrical connector. In this case, the bonding method for the second flexible circuit board 430 can refer to the bonding method for the first flexible circuit board 440.

[0184] The ends of the electrical connector can be configured in various shapes to connect to the second flexible printed circuit board 430 and the first flexible printed circuit board 440, respectively. In some embodiments, the electrical connector includes a first electrical connector 420a1, with the second flexible printed circuit board 430 and the first flexible printed circuit board 440 disposed on the upper and lower surfaces of the first electrical connector 420a1, respectively. Of course, in some embodiments, the electrical connector can also be configured as a second electrical connector, a third electrical connector, or the like.

[0185] When the end of the electrical connector presents different shapes, the direction of providing a flat surface and supporting force for the bonding operation between the first flexible circuit board 440 and the electrical connector is correspondingly different. In some embodiments, a flat surface and supporting force can be provided from above the first flexible circuit board 440 for the bonding operation of the first flexible circuit board 440. In some embodiments, a flat surface and supporting force can also be provided from below the first flexible circuit board 440 for the bonding operation of the first flexible circuit board 440.

[0186] Figure 11 is a first structural diagram of a first electrical connector according to some embodiments of the present disclosure; Figure 12 is a second structural diagram of a first electrical connector according to some embodiments of the present disclosure. As shown in Figures 11 and 12, a third stepped surface 421a1 and a first stepped surface 422a1 are formed on one end of the first electrical connector 420a1 located outside the first tube shell 410a. Both the third stepped surface 421a1 and the first stepped surface 422a1 are provided with solder pads. For example, the second flexible printed circuit board 430 is connected to the third stepped surface 421a1, and the first flexible printed circuit board 440 is connected to the first stepped surface 422a1. The third stepped surface 421a1 is used for soldering to the second flexible printed circuit board 430, while the first stepped surface 422a1 is used for bonding to the first flexible printed circuit board 440.

[0187] A first solder pad area 424a1 and a second solder pad area 425a1 are formed at one end of the first electrical connector 420a1 located on the inner side of the first tube shell 410a. Solder pads are provided on the surfaces of the first solder pad area 424a1 and the second solder pad area 425a1. The first solder pad area 424a1 is used to transmit low-frequency signals, and the second solder pad area 425a1 is used to transmit high-frequency signals. The solder pads on the surface of the first solder pad area 424a1 are electrically connected to the solder pads on the surface of the third step surface 421a1, thereby realizing the transmission of low-frequency signals; the solder pads on the surface of the second solder pad area 425a1 are electrically connected to the solder pads on the surface of the first step surface 422a1, thereby realizing the transmission of high-frequency signals.

[0188] In some embodiments, the surface length of the third step surface 421a1 is greater than the surface length of the first step surface 422a1, so that a second step surface 423a1 can be formed between the third step surface 421a1 and the first step surface 422a1. The second step surface 423a1 is used to support the support member. In some embodiments, the second step surface may not be formed between the third step surface 421a1 and the first step surface 422a1.

[0189] The heights of the third step surface 421a1, the second step surface 423a1 and the first step surface 422a1 decrease in sequence to form a stepped structure.

[0190] The third stepped surface 421a1 is provided with solder pads to achieve a solder connection between the second flexible printed circuit board 430 and the third stepped surface 421a1. The first stepped surface 422a1 is also provided with solder pads, and bonding wires extend from the first stepped surface 422a1 to achieve a bonding connection between the first flexible printed circuit board 440 and the first stepped surface 422a1.

[0191] Figure 13 is a side view of a first optical emitting component according to some embodiments of the present disclosure. As shown in Figure 13, one end of the first electrical connector 420a1 is inserted into the first housing 410a and the other end is located outside the first housing 410a.

[0192] The second flexible circuit board 430 is connected to the third stepped surface 421 a 1 by soldering, and the first flexible circuit board 440 is connected to the first stepped surface 422 a 1 by wire bonding.

[0193] Since the flexible circuit board is relatively soft, the support force for the gold wire during bonding is insufficient, resulting in a certain degree of bending of the gold wire, which is not conducive to the transmission of high-frequency signals. In addition, the bonding operation requires a certain flat surface. Therefore, a certain support force needs to be provided to the first flexible circuit board 440 to support the bonding. At the same time, a flat surface needs to be provided for the bonding operation to realize the bonding process.

[0194] If the second step surface 423a1 is not formed between the third step surface 421a1 and the first step surface 422a1, that is, a solid step surface is formed where the second step surface 423a1 would otherwise be, this solid structure can provide a certain amount of support for the first flexible circuit board 440. In this case, a groove is dug into the surface of the solid step surface to accommodate the first flexible circuit board 440. The first flexible circuit board 440 is then lowered toward the third step surface 421a1 so that the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1. Flexible circuit boards are typically relatively thin, approximately 0.2 mm. To ensure that the flexible circuit board is flush with the step surface and shorten the bonding length, the corresponding groove is shallow. When the first flexible circuit board 440 is bonded to the surface of the groove with glue, the glue bonding surface is close to the bonding area, so glue easily overflows into the bonding area between the surface of the first flexible circuit board 440 and the first step surface 422a1, which can affect the transmission quality of high-frequency signals.

[0195] When a second stepped surface 423a1 is formed between the third stepped surface 421a1 and the first stepped surface 422a1, a support member 450 may be disposed within the second stepped surface 423a1. The support member 450 is connected to the first electrical connector 420a1 and the first flexible printed circuit board 440, respectively. In this case, the support member 450 serves as a carrier for the first flexible printed circuit board 440. The support member 450 is connected to the first flexible printed circuit board 440 to support the first flexible printed circuit board 440. For example, the support member 450 is a metal structural member, and the first electrical connector 420a1 is a ceramic structural member. The support member 450 has a greater hardness than the ceramic structural member, providing a greater rigid support force for the first flexible printed circuit board 440, thereby supporting wire bonding and ensuring wire bonding stability. The support member 450 also provides a flat surface for wire bonding operations, thereby enabling wire bonding processes.

[0196] Exemplarily, the support member 450 and the second step surface 423a1 are connected by glue, for example, the contact surface between the support member 450 and the second step surface 423a1 is coated with glue for bonding.

[0197] In some embodiments, the support member 450 serves as a carrier for the first flexible printed circuit board 440. The first flexible printed circuit board 440 can be first connected to the support member 450 via glue to form a flexible printed circuit board fixed assembly. After the glue has cured, the flexible printed circuit board fixed assembly is then glued to the surface of the second stepped surface 423a1. Because the support member 450 has a certain thickness, the height of the second stepped surface 423a1 is relatively large. As a result, the glue bonding surface between the support member 450 and the second stepped surface 423a1 is far from the bonding area. When the flexible printed circuit board fixed assembly is glued to the surface of the second stepped surface 423a1, the glue is unlikely to overflow into the bonding area, thereby ensuring the quality of the bonding signal. For example, the surface of the support member 450 can also be formed with a notch or groove to collect overflow glue and prevent it from overflowing into the bonding area. Therefore, on the one hand, the support member 450 can provide the first flexible circuit board 440 with relatively large rigid support and a flat surface that is convenient for wiring operations. On the other hand, the support member 450 can pre-load the first flexible circuit board 440, thereby preventing glue from overflowing onto the wiring area when pasting the first flexible circuit board 440. At the same time, through the setting of the second step surface 423a1 and the support member 450, the glue bonding surface is transferred to the surface of the second step surface 423a1, so that the glue bonding surface is away from the wiring area, thereby preventing glue from overflowing into the wiring area, thereby ensuring the transmission quality of high-frequency signals.

[0198] The surface length of the third step surface 421a1 is relatively greater than the length of the first step surface 422a1, so that a second step surface 423a1 can be formed between the third step surface 421a1 and the first step surface 422a1. A support member 450 is set in the second step surface 423a1. At this time, the support member 450 is located above the first flexible circuit board 440. At this time, the support member 450 provides a flat surface and supporting force for the wire bonding operation of the first flexible circuit board 440 from above the first flexible circuit board 440, thereby realizing the wire bonding process.

[0199] Figure 14 is an exploded view of the first light emitting component according to some embodiments of the present disclosure. As shown in Figure 14 , a relief hole 415a is formed at the end of the first tube shell 410a to allow the first electrical connector 420a1 to extend into the first tube shell 410a.

[0200] Figure 15 is a second exploded view of the first light emitting component provided according to some embodiments of the present disclosure. As shown in Figure 15 , solder pads are provided on both the upper and lower surfaces of the end portion of the second flexible printed circuit board 430. The solder pads on the lower surface are used to connect to the solder pads on the third stepped surface 421a1 through soldering, while the solder pads on the upper surface are used to align with the solder pads on the third stepped surface 421a1. For example, alignment of the solder pads can be performed from the side of the first electrical connector 420a1. Correspondingly, the solder pads on the third stepped surface 421a1 face toward the top of the first housing 410a to connect to the solder pads on the lower surface of the second flexible printed circuit board 430 through soldering.

[0201] In some embodiments, a via hole is provided between the upper and lower pads to electrically connect the upper and lower pads. Solder is applied to the bonding surface between the third step surface 421a1 and the second flexible printed circuit board 430. After the third step surface 421a1 and the pads on the second flexible printed circuit board 430 are aligned, the solder is heated and solidified, thereby achieving a solder connection between the two. During soldering, the solder easily overflows. The via hole allows the solder to penetrate into the via hole between the upper and lower pads.

[0202] Figure 16 is a side view of a first optical emitting component provided according to some embodiments of the present disclosure; Figure 17 is a partial view of the first optical emitting component provided according to some embodiments of the present disclosure. As shown in Figures 16 and 17, the second flexible circuit board 430 is fastened to the surface of the third stepped surface 421a1, thereby achieving a solder connection between the second flexible circuit board 430 and the first electrical connector 420a1. The surface of the first flexible circuit board 440 is bonded to the surface of the first stepped surface 422a1, and the surface of the first flexible circuit board 440 is flush with the surface of the first stepped surface 422a1 to shorten the bonding length between the two and improve high-frequency signal transmission performance.

[0203] The support member 450 is arranged in the second step surface 423a1, and the thickness of the support member 450 is less than the height of the second step surface 423a1, so that the first flexible circuit board 440 is arranged within this height difference, and the first flexible circuit board 440 is bonded to the bottom surface of the support member 450, and the top surface of the support member 450 is bonded to the surface of the second step surface 423a1, thereby achieving a fixed connection between the first flexible circuit board 440 and the support member 450, and a fixed connection between the support member 450 and the second step surface 423a1.

[0204] The height of the second step surface 423a1 and the height of the support member 450 are respectively preset heights. Exemplarily, the height of the second step surface 423a1 is such that after the support member 450 and the first flexible circuit board 440 are stacked together, the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1, thereby shortening the wiring length between the surface of the first flexible circuit board 440 and the first step surface 422a1 and improving the high-frequency signal transmission performance.

[0205] Because the second flexible circuit board 430 is mounted on the surface of the third stepped surface 421a1, the surface of the first flexible circuit board 440 is flush with the surface of the first stepped surface 422a1, enabling a wire bond connection. Therefore, the second flexible circuit board 430 is closer to the first electrical connector 420a1 than the first flexible circuit board 440. For example, a gap is provided between the second flexible circuit board 430 and the side of the first electrical connector 420a1 to collect solder that overflows between the second flexible circuit board 430 and the third stepped surface 421a1.

[0206] Because the flexible circuit board has a certain length and flexibility, the bonding wire may bend with it when the flexible circuit board is bent. The support of the support member 450 can increase the stability of the bonding wire. To further enhance the stability of the bonding wire, a reinforcing member 460 is provided between the second flexible circuit board 430 and the first flexible circuit board 440. The reinforcing member 460 binds the second flexible circuit board 430 and the first flexible circuit board 440, thereby increasing the connection force between the second flexible circuit board 430 and the first flexible circuit board 440 and thereby increasing the stability of the first flexible circuit board 440. The reinforcing member 460 is relatively close to the bonding area between the first flexible circuit board 440 and the first step surface 422a1.

[0207] In some embodiments, to facilitate the placement of the reinforcing member 460, the width of the support member 450 is aligned with the width of the second stepped surface 423a1, so that the support member 450 is flush with the end surface of the second stepped surface 423a1. The side surface of the reinforcing member 460 can be connected to the surface of the support member 450 that is aligned with the second stepped surface 423a1, thereby bringing the reinforcing member 460 closer to the bonding area, thereby securing and supporting the bonding wires at the base of the bonding area, thereby increasing the bonding support and stability. For example, the reinforcing member 460 can be formed by applying and curing glue between the second flexible circuit board 430 and the first flexible circuit board 440. By leveraging the bonding strength between the second flexible circuit board 430 and the first flexible circuit board 440, the support and stability of the first flexible circuit board 440 can be further increased.

[0208] Figure 18 is a schematic diagram illustrating bonding between the surface of a second flexible circuit board and the surface of a second stepped surface, according to some embodiments of the present disclosure. As shown in Figure 18 , bonding pads on the surface of the first flexible circuit board 440 are connected to pads on the first stepped surface 422a1, thereby achieving electrical connection between the first flexible circuit board 440 and the first electrical connector 420a1.

[0209] The surface of the first flexible circuit board 440 is flush with the surface of the first stepped surface 422a1, and the soldering pads on the surface of the first flexible circuit board 440 are connected to the soldering pads on the first stepped surface 422a1 to shorten the wiring length between the surface of the first flexible circuit board 440 and the first stepped surface 422a1, thereby improving high-frequency signal transmission performance.

[0210] The soldering pads on the surface of the first flexible circuit board 440 and the soldering pads on the first stepped surface 422a1 are oriented in the same direction, both toward the bottom end of the first tube shell 410a. This provides a relatively large bonding area for wiring, which is not interfered with by other structures, facilitates the bonding operation, and can protect the wiring from being entangled by other structures.

[0211] Figure 19 illustrates a schematic diagram of a connection between a first housing and a first electrical connector according to some embodiments of the present disclosure; Figure 20 illustrates a schematic diagram of a connection between a first housing, a first electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure. As shown in Figures 19 and 20 , as described above, the ends of the electrical connectors can be configured in different configurations to connect to the second flexible printed circuit board 430 and the first flexible printed circuit board 440, respectively. In some embodiments, the electrical connectors include a first electrical connector 420a1.

[0212] A third step surface 421a1, a second step surface 423a1, and a first step surface 422a1 are formed on the end surface of the first electrical connector 420a1 located outside the first tube housing 410a. As described above, the surface length of the third step surface 421a1 is relatively longer than the length of the first step surface 422a1, thereby forming a second step surface 423a1 between the third step surface 421a1 and the first step surface 422a1. A support member 450 is disposed within the second step surface 423a1. In this case, the support member 450 provides rigid support for the first flexible printed circuit board 440 from above.

[0213] The width of the second stepped surface 423a1 can be the same as the width of the support member 450, so that the end surface of the second stepped surface 423a1 is flush with the end surface of the support member 450, which facilitates the installation of the reinforcing member 460. It is understandable that the width of the second stepped surface 423a1 can also be different from the width of the support member 450.

[0214] When the electrical connector is in the form of a first electrical connector 420a1, the solder pads on the surface of the first flexible circuit board 440 and the solder pads on the first step surface 422a1 are both facing the bottom end of the first tube shell 410a. This can provide a relatively large bonding area for wiring, facilitate the wiring operation, and protect the wiring from being entangled by other structures.

[0215] Figure 21 illustrates a connection diagram between a first housing and a second electrical connector according to some embodiments of the present disclosure; Figure 22 illustrates a connection diagram between a first housing, a second electrical connector, and a flexible printed circuit board according to some embodiments of the present disclosure. As shown in Figures 21 and 22, as described above, the ends of the electrical connectors can be configured in different configurations to connect to the second flexible printed circuit board 430 and the first flexible printed circuit board 440, respectively. In some embodiments, the electrical connectors include a second electrical connector 420a2.

[0216] In some embodiments, the second electrical connector 420a2 is formed with a third stepped surface 421a2 and a first stepped surface 422a2 on the end surface outside the first housing 410a. The third stepped surface 421a2 and the first stepped surface 422a2 are located at successively lower heights, forming a stepped structure. The third stepped surface 421a2 is used for soldering to the second flexible printed circuit board 430, while the first stepped surface 422a2 is used for bonding to the first flexible printed circuit board 440.

[0217] The second flexible circuit board 430 is electrically connected to the third stepped surface 421 a 2 . For example, the pads on the surface of the second flexible circuit board 430 are connected to the pads on the surface of the third stepped surface 421 a 2 by soldering.

[0218] The first flexible circuit board 440 is electrically connected to the first stepped surface 422a2. For example, the pads on the surface of the first flexible circuit board 440 are connected to the pads on the surface of the first stepped surface 422a2 by wire bonding, thereby improving the quality of high-frequency signal transmission and ensuring high-frequency signal transmission performance.

[0219] The height difference between the third step surface 421a2 and the first step surface 422a2 provides a larger space for wire bonding operations. Therefore, the solder pads on the surface of the first flexible circuit board 440 and the solder pads on the surface of the first step surface 422a2 are both oriented toward the top of the first tube shell 410a. As a result, wire bonding can be performed within the space formed by the height difference between the third step surface 421a2 and the first step surface 422a2. The space formed by the height difference is relatively large, thereby preventing the wire bonding from being affected by other structures and ensuring the stability of the wire distribution.

[0220] In order to provide rigid support for the first flexible circuit board 440, a second step surface 423a2 is hollowed out below the first step surface 422a2. The second step surface 423a2 is used to set the support member 450. Correspondingly, the support member 450 is also set within the second step surface 423a2. At this time, the support member 450 provides a flat surface and rigid support force for the first flexible circuit board 440 from below, thereby ensuring the stability of the wire bonding and realizing the wire bonding process.

[0221] Exemplarily, the support member 450 and the second step surface 423a2 are connected by glue, for example, the contact surface between the support member 450 and the second step surface 423a2 is coated with glue for bonding.

[0222] The heights of the third step surface 421a2, the first step surface 422a2, and the second step surface 423a2 decrease successively. The second step surface 423a2 is located below the projection area of ​​the root of the first flexible circuit board 440 to provide a rigid support force from the root of the first flexible circuit board 440 to ensure the stability of the first flexible circuit board 440.

[0223] In some embodiments, to further enhance bonding stability, a reinforcing member 460 is provided on the side of the connection surface between the first flexible circuit board 440 and the rigid connector 450. The reinforcing member 460 is relatively close to the bonding area between the first flexible circuit board 440 and the first stepped surface 422a2. For example, the reinforcing member 460 is provided between the bottom of the first flexible circuit board 440 and the end surface of the rigid connector 450. The reinforcing member 460 binds the rigid connector 450 and the first flexible circuit board 440, thereby increasing the connection force between the rigid connector 450 and the first flexible circuit board 440, thereby enhancing the support and stability of the first flexible circuit board 440.

[0224] Similarly, to facilitate the installation of the reinforcing member 460, the width of the support member 450 is the same as the width of the second stepped surface 423a2, so that the end surface of the support member 450 is flush with the end surface of the second stepped surface 423a2. This facilitates the installation of the reinforcing member 460 between the bottom of the first flexible circuit board 440 and the end surface of the rigid connector 450. This brings the reinforcing member 460 closer to the bonding area, securing and supporting the bonding wires at the base of the bonding area, thereby increasing the bonding support and stability. For example, the reinforcing member 460 can be formed by applying and curing glue between the bottom of the first flexible circuit board 440 and the end surface of the rigid connector 450. By relying on the connection force between the first flexible circuit board 440 and the rigid connector 450, the support and stability of the first flexible circuit board 440 are further increased.

[0225] The above-mentioned embodiments improve the structure of the electrical connector to be compatible with two flexible circuit boards, and realize the solder connection between the second flexible circuit board 430 and the electrical connector, and the wire connection between the first flexible circuit board 440 and the electrical connector, thereby improving the quality of high-frequency signal transmission and ensuring high-frequency signal transmission performance. At the same time, a flat surface and rigid support force are provided to the first flexible circuit board 440 from different directions of the first flexible circuit board 440 to ensure the stability of the wire bonding. Among them, the support member 450 serves as a carrier of the first flexible circuit board 440. On the one hand, it can provide a flat surface and rigid support force for its wire bonding operation. On the other hand, the first flexible circuit board 440 can be supported in advance by the support member 450, thereby preventing glue from overflowing onto the wire bonding area when the first flexible circuit board 440 is pasted, thereby ensuring high-frequency signal transmission performance.

[0226] The following embodiments achieve wire bonding connection between the flexible circuit board and the electrical connector by improving the structure of the tube shell, and provide a flat surface and rigid support for the wire bonding operation of the flexible circuit board.

[0227] Figure 23 is a structural diagram of a second optical transmitter component provided according to some embodiments of the present disclosure. As shown in Figure 23, in some embodiments, the optical transmitter component includes a second housing 410b, which is electrically connected to the circuit board 300 via an electrical connector and a flexible circuit board. To distinguish between the first electrical connector 420a1 and the second electrical connector 420a2, the electrical connector electrically connected to the second housing 410b is referred to as a third electrical connector 420b. To distinguish between the second flexible circuit board 430 and the first flexible circuit board 440, the flexible circuit board electrically connected to the second housing 410b is referred to as flexible circuit board 430b.

[0228] In some embodiments, low-frequency signals and high-frequency signals are transmitted simultaneously through the flexible circuit board 430b. The surface of the flexible circuit board 430b is provided with low-frequency signal pads and high-frequency signal pads, which can reduce the number of flexible circuit boards used.

[0229] To improve the transmission quality of high-frequency signals, the flexible printed circuit board 430b is bonded to the third electrical connector 420b. For example, pads on the surface of the flexible printed circuit board 430b are bonded to pads on the surface of the third electrical connector 420b, thereby ensuring high-frequency signal transmission performance. To shorten the bonding length between the flexible printed circuit board 430b and the third electrical connector 420b, the surfaces of the flexible printed circuit board 430b and the third electrical connector 420b should be flush, thereby shortening the bonding length.

[0230] Figure 24 is a structural diagram of a third electrical connector provided according to some embodiments of the present disclosure. As shown in Figure 24, since both low-frequency and high-frequency signals are transmitted via the flexible printed circuit board 430b, the surface of the third electrical connector 420b located inside the second housing 410b only needs to have a third pad area 422b formed thereon, and the surface of the third electrical connector 420b located outside the second housing 410b only needs to have a first pad area 421b formed thereon. The first pad area 421b is electrically connected to the third pad area 422b, thereby enabling signal transmission within and outside the second housing 410b, including both low-frequency and high-frequency signals.

[0231] The flexible circuit board 430b has a second pad area 431b formed on its surface. This area includes pads for transmitting both low-frequency and high-frequency signals. Bonding is performed between the second pad area 431b and the first pad area 421b, enabling transmission of both low-frequency and high-frequency signals between the flexible circuit board 430b and the third electrical connector 420b. When the second pad area 431b is flush with the first pad area 421b, bonding time is shortened, resulting in improved high-frequency signal transmission quality.

[0232] To provide a flat surface and sufficient support for bonding between the flexible circuit board 430b and the third electrical connector 420b, the bottom plate of the second housing 410b extends relative to each other to form an extended surface. A support structure is provided on the extended surface to support bonding between the flexible circuit board 430b and the third electrical connector 420b. In this case, the support structure is provided on the surface of the extended surface, providing a certain amount of support and a flat surface from below the flexible circuit board 430b for bonding operations. Exemplarily, the support structure is used to support the flexible circuit board so that the second pad area 431b is flush with the surface of the first pad area 421b, thereby enabling bonding between the flexible circuit board 430b and the third electrical connector 420b. The support structure provides rigid support and a flat surface for bonding the flexible circuit board, improving bonding stability and thereby ensuring high-frequency signal transmission performance.

[0233] The support structure of the extended surface can take different forms to provide a flat surface and support for the bonding operation between the flexible circuit board 430b and the third electrical connector 420b. In some embodiments, the support structure can be a support block 440b. In some embodiments, the support structure can also take other forms.

[0234] Figure 25 is an exploded view of a second optical transmission component provided according to some embodiments of the present disclosure. As shown in Figure 25 , the base plate of the second housing 410b extends relative to the housing, forming an extended surface 411b. The third electrical connector 420b is partially located within the second housing 410b and partially on the extended surface 411b. Therefore, the extended surface 411b serves to support the third electrical connector 420b.

[0235] The length of the extension surface 411b is relatively longer than the width of the third electrical connector 420b. When the third electrical connector 420b is arranged on the extension surface 411b, there is still a certain distance between the end of the extension surface 411b and the end of the third electrical connector 420b. The end of the extension surface 411b is further away from the second tube shell 410b, so that there is still residual space on the extension surface 411b. The support block 440b is arranged on the surface of the residual space. The flexible circuit board 430b is arranged on the surface of the support block 440b to provide a certain flat surface and support force under the flexible circuit board 430b for the bonding operation of the flexible circuit board 430b.

[0236] In some embodiments, the width of the support block 440b is the same as the width of the third electrical connector 420b, so that the support block 440b is flush with the third electrical connector 420b in width; the support block 440b has a preset height, which makes the surface of the flexible circuit board 430b flush with the surface of the third electrical connector 420b, that is, the surface of the second pad area 431b is flush with the surface of the first pad area 421b, thereby shortening the wiring length.

[0237] Figure 26 is a schematic diagram illustrating the connection between a second housing and a third electrical connector according to some embodiments of the present disclosure. As shown in Figure 26 , in some embodiments, the second housing 410b includes an extension surface 411b and a clearance hole 412b. The bottom plate of the second housing 410b extends relative to the bottom plate, forming the extension surface 411b. The clearance hole 412b allows the third electrical connector 420b to extend into the interior of the second housing 410b.

[0238] The length of the extension surface 411b is sufficient to install the third electrical connector 420b and the support block 440b. The flexible circuit board 430b is installed on the surface of the support block 440b, and the bottom of the flexible circuit board 430b provides a certain flat surface and support force for the wiring operation of the flexible circuit board 430b.

[0239] A row of solder pads is provided on one end surface of the third electrical connector 420b located outside the second tube shell 410b, and bonding wires extend therefrom, thereby achieving a bonding connection between the third electrical connector 420b and the flexible circuit board 430b. At the same time, the support block 440b provides a certain flat surface and support force for the bonding operation of the flexible circuit board 430b.

[0240] Figure 27 is a side view of a second optical emitting component provided according to some embodiments of the present disclosure. As shown in Figure 27, one end of a third electrical connector 420b extends into the interior of the second tube shell 410b, and one end is placed on the surface of the extension surface 411b. A support block 440b is provided on the surface of the extension surface 411b. The support block 440b supports the flexible printed circuit board 430b, and the flexible printed circuit board 430b is connected to the first pad area 421b by wire bonding.

[0241] When securing the third electrical connector 420b to the second tube shell 410b, metal solder is used to solder the third electrical connector 420b to the surface of the extension surface 411b. During the soldering process, the metal solder easily overflows and overflows near the support block 440b, affecting the flatness of the support block 440b and thus affecting the bonding process. In some embodiments, to ensure the integrity of the third electrical connector 420b, a small corner is cut away from the bottom of the support block 440b adjacent to the third electrical connector 420b, forming a notch 441b. This collects the overflowed metal solder and concentrates it at the notch 441b. This protects the bottom surface of the support block 440b from being affected by the metal solder, ensuring the flatness of the support block 440b and thus ensuring the stability of the bonding process. In some embodiments, the integrity of the support block 440b can also be ensured by cutting off a small corner from the bottom of the third electrical connector 420b on the side adjacent to the support block 440b to form a notch. The notch has the same function as the notch 441b and can also collect the overflowed metal solder.

[0242] Figure 28 is a cross-sectional view of a second optical emitting component according to some embodiments of the present disclosure. As shown in Figure 28, the surface of the flexible printed circuit board 430b should be flush with the surface of the third electrical connector 420b. In this case, the surface of the second pad area 431b is flush with the surface of the first pad area 421b. The two are electrically connected via bonding wires to ensure high-frequency signal transmission quality.

[0243] The bottom plate of the second tube shell 410b extends relatively, forming an extended surface 411b. A third electrical connector 420b and a support block 440b are respectively disposed on the surface of the extended surface 411b. The support block 440b and the flexible circuit board 430b are stacked. The support block 440b provides a flat surface and rigid support for the flexible circuit board 430b during the bonding operation, thereby ensuring bonding stability.

[0244] The presence of the notched corner 441b creates a certain gap between the bottom of the third electrical connector 420b and the bottom of the support block 440b. When fixing the third electrical connector 420b, the metal solder that overflows can be concentrated in the gap, so that the bottom surface of the support block 440b is not affected by the metal solder, thereby ensuring the flatness of the support block 440b and thus ensuring the stability of the wire bonding.

[0245] The width of the support block 440b can be set according to the length and bendability of the flexible circuit board 430b. When the length of the flexible circuit board 430b is long, or the bending degree of the flexible circuit board 430b is large, the width of the support block 440b can be set larger, thereby providing a larger flat surface and rigid support force for the wiring operation of the flexible circuit board 430b, thereby ensuring the stability of the wiring.

[0246] Figure 29 is a structural diagram of a third optical transmitter component provided according to some embodiments of the present disclosure. As shown in Figure 29, in some embodiments, the optical transmitter component includes a third housing 410c, which is electrically connected to the circuit board 300 via an electrical connector and a flexible connection board. To distinguish the first electrical connector 420a1, the second electrical connector 420a2, and the third electrical connector 420b, the electrical connector electrically connected to the third housing 410c is referred to as the third electrical connector 420c. To distinguish the second flexible printed circuit board 430 from the first flexible printed circuit board 440, the flexible printed circuit board electrically connected to the third housing 410c is referred to as the flexible printed circuit board 430c.

[0247] The structure of the third tube shell 410c is different from that of the second tube shell 410b and the first tube shell 410a. The structure of the third electrical connector 420c is the same as that of the third electrical connector 420b. The structure of the flexible circuit board 430c is the same as that of the flexible circuit board 430b.

[0248] Part of the structure of the third electrical connector 420c is located inside the third tube shell 410c, and part of the structure is located outside the third tube shell 410c.

[0249] The bottom plate of the third tube shell 410c also extends relative to the top plate to form an extended surface.

[0250] The flexible circuit board 430c is connected to the pads on the surface of the third electrical connector 420c by wire bonding. At the same time, the flexible circuit board 430c is supported by the support plate 440c to provide a flat surface and rigid support for the wire bonding operation.

[0251] Similarly, a first pad area 421c is provided on one end surface of the third electrical connector 420c, located outside the third housing 410c. A second pad area 431c is provided on the surface of the flexible printed circuit board 430c. Bonding wires are formed between the first and second pad areas 421c, 431c, thereby enabling simultaneous transmission of low-frequency and high-frequency signals between the third housing 410c and the flexible printed circuit board 430c. When the surfaces of the first and second pad areas 421c, 431c are flush, the bonding wires between them are shorter, improving the quality of high-frequency signal transmission.

[0252] Figure 30 is an exploded view of a third optical emitting component provided according to some embodiments of the present disclosure. As shown in Figure 30 , as previously described, the support structure of the extended surface can take various forms, providing a flat surface and support for bonding wires between the flexible printed circuit board 430c and the third electrical connector 420c. In some embodiments, the support structure can be a support block 440c. In other embodiments, the support structure can also take other forms.

[0253] In some embodiments, the bottom plate of the third tube shell 410c also extends relative to the top plate to form an extended surface. The tail of the extended surface protrudes upward to form a boss 412c. The boss 412c forms a support structure to provide a flat surface and support force for bonding between the flexible circuit board 430c and the third electrical connector 420c.

[0254] The surface of the boss 412c is relatively lower than the surface of the third electrical connector 420c with the solder pad, so that the flexible circuit board 430b is arranged on the surface of the boss 412c to ensure that the surface of the third electrical connector 420c with the solder pad is flush with the surface of the flexible circuit board 430b.

[0255] In some embodiments, the third electrical connector 420c is positioned between the avoidance hole 413c and the boss 412c. The third electrical connector 420c is a split structure, and the split parts are assembled to form the third electrical connector 420c. For example, when the third electrical connector 420c is secured between the avoidance hole 413c and the boss 412c using metal solder, the metal solder easily overflows. Therefore, a solder collection structure is provided between the third electrical connector 420c and the boss 412c. In some embodiments, the solder collection structure can be in the form of a gap 450c between the third electrical connector 420c and the boss 412c, through which overflowing metal solder can be collected. In some embodiments, the solder collection structure can also have other forms.

[0256] Figure 31 is a partially exploded view of a third optical emitting component according to some embodiments of the present disclosure. As shown in Figure 31 , a clearance hole 413c is formed at the end of the third tube shell 410c, and the third electrical connector 420c extends into the clearance hole 413c, allowing one end of the third electrical connector 420c to extend into the interior of the third tube shell 410c.

[0257] The bottom plate of the third tube shell 410c also extends relative to the top plate to form an extended surface 411c. The third electrical connector 420c is fixed to the surface of the extended surface 411c. The tail of the extended surface 411c protrudes upward to form a boss 412c. The boss 412c forms a support structure, providing a flat surface and support for bonding between the flexible circuit board 430c and the third electrical connector 420c.

[0258] Figure 32 is a side view of a third light emitting component according to some embodiments of the present disclosure. As shown in Figure 32 , as previously described, a gap 450c is provided between the third electrical connector 420c and the boss 412c to collect overflowing metal solder.

[0259] If the flexible circuit board 430c is directly placed on the surface of the boss 412c, and the flexible circuit board 430c is directly connected to the surface of the third electrical connector 420c to ensure a shorter bonding length, the gap 450c causes the flexible circuit board 430c to be suspended above the gap 450c, which is not conducive to bonding. If, to avoid the suspension, the end of the flexible circuit board 430c is aligned with the end of the boss 412c, and the flexible circuit board 430c is then bonded to the surface of the third electrical connector 420c, the flexible circuit board 430c is not directly connected to the surface of the third electrical connector 420c, but is instead some distance away from the surface of the third electrical connector 420c. This increases the bonding length between the flexible circuit board 430c and the surface of the third electrical connector 420c. A longer bonding length is not conducive to the transmission of high-frequency signals.

[0260] To this end, a support plate 440c is provided on the surface of the boss 412c, and the end of the support plate 440c is connected to the surface of the third electrical connector 420c. The support plate 440c spans the gap 450c to cover the gap 450c, and then the flexible circuit board 430c is supported by the support plate 440c, thereby preventing the lower surface of the wiring area of ​​the flexible circuit board 430c from being suspended.

[0261] After the support plate 440 c is disposed on the surface of the boss 412 c , the flexible circuit board 430 c is disposed on the surface of the support plate 440 c . The flexible circuit board 430 c and the support plate 440 c are stacked on the surface of the boss 412 c .

[0262] The boss 412c has a preset height, which allows the surface of the flexible circuit board 430c to be flush with the surface of the third electrical connector 420c on which the pads are provided after the support plate 440c and the flexible circuit board 430c are sequentially arranged on the surface of the boss 412c, that is, the surface of the first pad area 421c is flush with the surface of the second pad area 431c, so as to shorten the wiring length and improve the high-frequency signal transmission performance.

[0263] Figure 33 is a cross-sectional view of a third light emitting component according to some embodiments of the present disclosure. As shown in Figure 33, a third electrical connector 420c is positioned between the avoidance hole 413c and the boss 412c. To collect metal solder that overflows when the third electrical connector 420c is secured, a gap 450c is provided between the third electrical connector 420c and the boss 412c.

[0264] In order to prevent the lower surface of the flexible circuit board's bonding area from being suspended and to shorten the bonding length, a support plate 440c is provided on the surface of the boss 412c. The support plate 440c spans the gap 450c to cover the gap 450c, and then the flexible circuit board 430c is supported by the support plate 440c, thereby preventing the lower surface of the flexible circuit board's bonding area from being suspended.

[0265] A flexible circuit board 430c is arranged on the surface of the support plate 440c. The flexible circuit board 430c and the support plate 440c are stacked on the surface of the boss 412c, so that the boss 412c and the support plate 440c provide a certain flat surface and support force for the bonding area of ​​the flexible circuit board 430c, ensuring the stability of the bonding.

[0266] Figure 34 is a cross-sectional view of a fourth optical emitting component provided according to some embodiments of the present disclosure; Figure 35 is an exploded view of a fourth optical emitting component provided according to some embodiments of the present disclosure; and Figure 36 is a structural diagram of a fourth housing provided according to some embodiments of the present disclosure. As shown in Figures 34-36, in some embodiments, the optical emitting component includes a fourth housing 410d, which is electrically connected to the circuit board 300 via an electrical connector and a flexible connection board. To distinguish between the first electrical connector 420a1 and the second electrical connector 420a2, the electrical connector electrically connected to the fourth housing 410d is referred to as the third electrical connector 420d. To distinguish between the second flexible circuit board 430 and the first flexible circuit board 440, the flexible circuit board electrically connected to the fourth housing 410d is referred to as the flexible circuit board 430d.

[0267] The structure of the fourth tube shell 410d is different from that of the first tube shell 410a, the second tube shell 410b, and the third tube shell 410c. The structures of the third electrical connector 420d, the third electrical connector 420c, and the third electrical connector 420b are the same. The structures of the flexible circuit board 430d, the flexible circuit board 430c, and the flexible circuit board 430b are the same.

[0268] The bottom plate of the fourth tube shell 410d also extends relative to the top plate to form an extension surface 411d. The third electrical connector 420d is disposed on the extension surface 411d.

[0269] The tail of the extended surface 411d protrudes upward to form a boss 412d. Boss 412d forms a support structure, providing a flat surface and support for bonding wires between the flexible printed circuit board 430d and the third electrical connector 420d. Similarly, a first pad area 421d is provided on one end of the third electrical connector 420d, located outside the fourth housing 410d. A second pad area 431d is provided on the surface of the flexible printed circuit board 430d. Bonding wires connect the first and second pad areas 421d and 431d. When the surfaces of the first and second pad areas 421d and 431d are flush, bonding wires are shortened, improving high-frequency signal transmission quality.

[0270] An escape hole 413d is formed at the end of the fourth tube shell 410d, and the third electrical connector 420d extends into the escape hole 413d to extend into the interior of the fourth tube shell 410d. Part of the structure of the third electrical connector 420d is located inside the fourth tube shell 410d, and part of the structure is located on the surface of the extension surface 411d.

[0271] The third electrical connector 420d is clamped between the avoidance hole 413d and the boss 412d. To prevent metal solder from overflowing when the third electrical connector 420d is fixed, a gap 440d is defined between the third electrical connector 420d and the boss 412d.

[0272] In some embodiments, to prevent overhanging beneath the flexible circuit board's bonding area and shorten bonding lengths, the top surface of boss 412d protrudes relative to the body of boss 412d, with the protruding portion covering gap 440d. Flexible circuit board 430d is then placed on the surface of boss 412d. Because the top surface of boss 412d protrudes relative to the body of boss 412d, the protruding portion covers gap 440d, thereby preventing overhanging beneath the flexible circuit board's bonding area and shortening bonding lengths.

[0273] The boss 412d has a preset height, which allows the surface of the flexible circuit board 430d to be flush with the surface of the third electrical connector 420d on which the pads are provided after the flexible circuit board 430d is provided on the surface of the boss 412d, that is, the surface of the first pad area 421d is flush with the surface of the second pad area 431d, so as to shorten the wiring length and improve the high-frequency signal transmission performance.

[0274] As mentioned above, when the third electrical connector 420 c is fixed between the avoidance hole 413 c and the boss 412 c by metal solder, the metal solder easily overflows, and thus a solder collection structure is formed between the third electrical connector 420 c and the boss 412 c.

[0275] In some embodiments, the solder collection structure can be in the form of a gap 450c between the above-mentioned third electrical connector 420c and the boss 412c. The overflowed metal solder can be collected through the gap 450c, and then a support plate 440c is set above the gap 450c to solve the problem of the flexible circuit board being suspended.

[0276] In some embodiments, the solder collection structure can also be in the form of a gap between the above-mentioned third electrical connector 420d and the boss 412d, and then the top surface of the boss 412d is protruded relative to the body of the boss 412d, and the gap 440d is covered by the protruding part, thereby solving the problem of the flexible circuit board being suspended.

[0277] In some embodiments, no gap is required between the third electrical connector and the boss, maintaining the connection between the main structures of the third electrical connector and the boss. Alternatively, to ensure the stability of the third electrical connector, a corner is cut out at the bottom of the boss adjacent to the third electrical connector. In this case, the corner serves as a solder collection structure to collect spilled metal solder. Alternatively, to ensure the stability of the boss, a corner is cut out at the bottom of the third electrical connector adjacent to the boss. In this case, the corner serves as a solder collection structure to collect spilled metal solder. When the main structures of the third electrical connector and the boss are connected, no gap exists between them. Since the third electrical connector is an assemblable structure, the problem of difficulty in installation of the third electrical connector does not arise.

[0278] In the above embodiments, by improving the tube shell, a wire bonding connection between a flexible circuit board and an electrical connector is achieved. Currently, when the number of flexible circuit boards is one, the tube shell structure remains unchanged, and the bottom end of the electrical connector is extended in the same manner as the tube shell is extended, so that a support structure for supporting the wire bonding operation of the flexible circuit board can be set on the extended structure, thereby ensuring the stability of the wire bonding.

[0279] In summary, each third electrical connector is formed with a first solder pad area on the surface outside the tube shell; a second solder pad area is formed on the surface of the flexible circuit board, and the second solder pad area is connected to the first solder pad area by wire bonding. The flexible circuit board is used to simultaneously transmit low-frequency signals and high-frequency signals between the circuit board and the light-emitting component. Since the flexible circuit board and the third electrical connector are connected by wire bonding, the wire bonding method is more conducive to improving the transmission quality of high-frequency signals and ensuring the transmission performance of high-frequency signals. A support structure is provided between the flexible circuit board and the extension surface, and the support structure is connected to the third electrical connector. The support structure is used to support the flexible circuit board, provide a flat surface and a rigid support force for the wiring of the flexible circuit board, improve the stability of the wiring, and thus ensure the transmission performance of the high-frequency signal. The present application improves the tube shell and sets a corresponding support structure on the surface of the tube shell, thereby providing a flat surface and a certain rigid support force for the wiring operation of the flexible circuit board, ensuring the stability of the wiring, which is conducive to the transmission of high-frequency signals.

[0280] In the above-described embodiment, the optical transmitter and optical receiver are each electrically connected to the circuit board 300 via a flexible circuit board. One end of the flexible circuit board, used for electrical connection to the circuit board 300, is provided with a gold finger pad, which is soldered to the circuit board 300 via the gold finger pad. Of course, in the disclosed embodiment, the packaging configuration of the optical transmitter 400 or optical receiver 500 is arranged in a coaxial package, but other packaging structures, such as a BOX package, are also possible, and the flexible circuit board is not limited to having gold finger pads on one end. Therefore, in some embodiments, gold finger pads are provided at each end of the flexible circuit board; the circuit board and the optical transmitter 400 or other device are connected via the gold finger pads at both ends of the flexible circuit board. For example, the optical transmitter 400 includes an electrical connector, and the flexible circuit board is connected to the electrical connector of the optical transmitter 400 via the gold finger pads.

[0281] In some embodiments, the electrical connection assembly may include a first electrical connection component and a second electrical connection component.

[0282] The following description will be mainly made by taking the first electrical connection component being a flexible printed circuit board as an example.

[0283] Figure 37 illustrates a partial structure of a flexible circuit board according to some embodiments of the present disclosure, showing the end structure of a flexible circuit board. As shown in Figure 5 , flexible circuit board 700 includes a dielectric layer 710, a first circuit trace 720 disposed on the surface of dielectric layer 710, and a ground layer 730; ground layer 730 is disposed to the side of first circuit trace 720, surrounding first circuit trace 720.

[0284] In some embodiments, the first circuit trace 720 is arranged on a specific transmission line on the flexible circuit board 700. Multiple circuit traces may be arranged on the flexible circuit board 700. For example, the first circuit trace 720 is arranged on the top surface of the dielectric layer 710, and the ground layer 730 is arranged on the top and bottom surfaces of the dielectric layer 710. A gap is provided between the ground layer 730 on the top surface of the dielectric layer 710 and the first circuit trace 720, thereby insulating the ground layer 730 on the top surface of the dielectric layer 710 from the first circuit trace 720. The ground layer 730 on the top surface of the dielectric layer 710 and the ground layer 730 on the bottom surface of the dielectric layer 710 are electrically connected through vias.

[0285] As shown in FIG37 , a first gold finger pad 721 is provided at the end of the first circuit trace 720. The first gold finger pad 721 extends from the connection with the first circuit trace 720 to the end of the flexible circuit board 700. The first gold finger pad 721 is used to electrically connect the first circuit trace 720 to the components of the circuit board 300 or the light emitting component 400. Exemplarily, the first gold finger pad 721 is connected to the components of the circuit board 300 or the light emitting component 400 by soldering.

[0286] In some embodiments, in order to facilitate the welding connection of the first gold finger pad 721 to the circuit board 300 or the light emitting component 400 and ensure the reliability of the welding connection, the first gold finger pad 721 needs to have sufficient width, so the first gold finger pad 721 will be widened and reinforced.

[0287] FIG38 is a schematic diagram of a cross-sectional structure of a flexible circuit board according to some embodiments of the present disclosure. As shown in FIG38 , the line width of the first circuit trace 720 is W, the thickness of the first circuit trace 720 is T, the distance between the first circuit trace 720 and the reference plane of the ground layer 730 on the back of the flexible circuit board 700 is H, and the impedance of the first circuit trace 720 is Therefore, when the thickness of the dielectric layer 710 and the thickness of the first circuit trace 720 are constant, the line width of the first circuit trace 720 will be fixed to ensure the impedance of the first circuit trace 720, and thus the width of the first circuit trace 720 cannot be increased arbitrarily. Therefore, when the width of the first gold finger pad 721 increases, the width of the first gold finger pad 721 becomes larger than the width of the first circuit trace 720, reducing the impedance at the first gold finger pad 721 and resulting in an impedance mismatch between the first circuit trace 720 and the first gold finger pad 721.

[0288] Taking the example of the soldering connection between the flexible circuit board 700 and the circuit board 300, a corresponding second gold finger pad 310 is provided on the circuit board 300. Figure 39 is a schematic diagram of soldering a gold finger pad according to some embodiments of the present disclosure. As shown in Figure 39, the first gold finger pad 721 is stacked on the second gold finger pad 310. Solder is directly applied to the first gold finger pad 721 and the second gold finger pad 310, and the surface of the first gold finger pad 721 is also covered with solder. Therefore, the metal thickness of the flexible circuit board 700 at the first gold finger pad 721 is much greater than the thickness at the first circuit trace 720, further causing impedance mismatch between the first circuit trace 720 and the first gold finger pad 721.

[0289] Figure 40 is a partial structural schematic diagram of another flexible circuit board provided according to some embodiments of the present disclosure. Figure 40 shows the structure of one end of another flexible circuit board. As shown in Figure 40, a first electrical connection area 740 is provided on the surface of the flexible circuit board 700. The first electrical connection area 740 is used to connect to the circuit board 300. In some embodiments, the first electrical connection area 740 is located at an end of the surface of the flexible circuit board 700, such as one end of the surface of the flexible circuit board 700. The surface of the flexible circuit board 700 can be one surface or both surfaces of the flexible circuit board 700. For example, the first electrical connection area 740 is provided on the first surface of the dielectric layer 710, the first electrical connection area 740 is provided on the second surface of the dielectric layer 710, and the first electrical connection area 740 is provided on both the first and second surfaces of the dielectric layer 710; wherein the first surface of the dielectric layer 710 is the top surface or the bottom surface of the flexible circuit board 700.

[0290] In some embodiments, the first electrical connection region 740 is provided with a plurality of discontinuous A pads, one of which is adjacent to and electrically connected to the first circuit trace 720. Adjacent A pads are spaced apart and insulated from each other on the same side of the dielectric layer 710. For example, the plurality of discontinuous A pads are arranged sequentially along an extension of the end of the first circuit trace 720.

[0291] In some embodiments, a through hole is provided on pad A, so that pad A is an annular pad, such as a circular or elliptical annular pad. For example, the outer contour of pad A is a polygon such as a circle, an ellipse, or a square, and the shape of the through hole can be a circle, an ellipse, or a square.

[0292] In some embodiments, both the first electrical connection region 740 and the first circuit trace 720 are disposed on the first surface of the dielectric layer 710. The first surface of the dielectric layer 710 is positioned proximate to the circuit board 300, such that the first electrical connection region 740 is electrically connected to the circuit board 300. A first A soldering pad 741 and a second A soldering pad 742 are disposed within the first electrical connection region 740 on the first surface. The first A soldering pad 741 is connected to the first circuit trace 720, while the second A soldering pad 742 is disposed on a side of the first A soldering pad 741 away from the first circuit trace 720. A gap is formed between the first A soldering pad 741 and the second A soldering pad 742, discontinuously connecting the first A soldering pad 741 and the second A soldering pad 742. The circuit board 300 is connected by soldering through the first A soldering pad 741 and the second A soldering pad 742. The width of the first A soldering pad 741 or the second A soldering pad is greater than the width of the first circuit trace 720.

[0293] In the disclosed embodiment, the number of A pads provided within the first electrical connection area 740 of the first surface is not limited to two, and three or more pads may be provided. In some embodiments, a fifth A pad 743 is further provided within the first electrical connection area 740 of the first surface. The fifth A pad 743 is located on the side of the second A pad 742 away from the first A pad 741. A gap is provided between the fifth A pad 743 and the second A pad 742, discontinuing the fifth A pad 743 and the second A pad 742. The fifth A pad 743 is soldered to the circuit board 300. Exemplarily, the fifth A pad 743 is located at the edge of one end of the dielectric layer 710, such that the fifth A pad 743 is located at the edge of the end of the flexible circuit board 700; a half hole is provided near the edge of the fifth A pad 743 near the end of the dielectric layer 710.

[0294] Figure 41 is a second schematic diagram of a partial structure of another flexible circuit board provided according to some embodiments of the present disclosure. As shown in Figure 41, in some embodiments, a first circuit trace 720 is disposed on the first surface of a dielectric layer 710. The second surface of the flexible circuit board 700 includes a first electrical connection area 740. The second surface of the dielectric layer 710 is intended to be in close proximity to the circuit board 300, so that the first electrical connection area 740 is electrically connected to the circuit board 300. Exemplarily, the first electrical connection area 740 is located at one end of the flexible circuit board 700. A third A soldering pad 744 and a fourth A soldering pad 745 are disposed within the first electrical connection area 740 on the second surface. The third A soldering pad 744 is located at the end of the first circuit trace 720 projected toward the second surface, while the fourth A soldering pad 745 is located on a side of the third A soldering pad 744 away from the end of the first circuit trace 720 projected toward the second surface. A gap is formed between the third A soldering pad 744 and the fourth A soldering pad 745, discontinuously separating the third A soldering pad 744 and the fourth A soldering pad 745.

[0295] In some embodiments, the third A pad 744 is located in the projection area of ​​the first A pad 741, and the fourth A pad 744 is located in the projection area of ​​the second A pad 742. Exemplarily, the third A pad 744 and the first A pad 741 are symmetrical about the dielectric layer 710, and the fourth A pad 744 and the second A pad 742 are symmetrical about the dielectric layer 710.

[0296] FIG42 is a schematic diagram of another flexible circuit board provided according to some embodiments of the present disclosure, wherein some vias on the dielectric layer are not shown. As shown in FIG42 , in some embodiments, a plurality of connection holes are provided in the first electrical connection area 740, and the third A pad 744 is connected to the first A pad 741 through the connection hole, and the fourth A pad 744 is connected to the second A pad 742 through the connection hole, that is, the first A pad 741 and the third A pad 744 are connected through the connection hole, and the second A pad 742 and the fourth A pad 744 are connected through the connection hole. Exemplarily, the connection hole is a via hole, and the third A pad 744 is electrically connected to the first A pad 741 through the connection hole, and the fourth A pad 744 is electrically connected to the second A pad 742 through the connection hole.

[0297] In some embodiments, first A pad 741 includes a first connection portion 7411 and a second connection portion 7412. One end of first connection portion 7411 is connected to first circuit trace 720, and the other end of first connection portion 7411 is connected to second connection portion 7412. First connection portion 7411 is used to achieve a transition from first circuit trace 720 to second connection portion 7412, providing a smooth transition between first circuit trace 720 and first A pad 741. In some embodiments, third A pad 744 and second connection portion 7412 are symmetrical about dielectric layer 710, and third A pad 744 is electrically connected to second connection portion 7412 via a connection hole.

[0298] In some embodiments, a sixth A pad 746 is further disposed within the first electrical connection region 740 on the second surface. The sixth A pad 746 is located on a side of the fourth A pad 744 away from the third A pad 744. A gap is formed between the sixth A pad 746 and the fourth A pad 744, discontinuing the sixth A pad 746 from the fourth A pad 744. Exemplarily, the sixth A pad 746 is located at an edge of the dielectric layer 710, such that the sixth A pad 746 is located at an edge of the end of the flexible circuit board 700. A half hole is disposed near the edge of the end of the dielectric layer 710.

[0299] In some embodiments, sixth A pad 746 is located within the projection of fifth A pad 743. Exemplarily, sixth A pad 746 and fifth A pad 743 are symmetrical with respect to dielectric layer 710. In some embodiments, a half-hole is provided at the edge of dielectric layer 710, and sixth A pad 746 is connected to fifth A pad 743 through the half-hole, with the half-hole penetrating both sixth A pad 746 and fifth A pad 743. Exemplarily, metal is provided within the half-hole, electrically connecting sixth A pad 746 to fifth A pad 743 through the half-hole.

[0300] Figure 43 is a schematic diagram of a partial structure of another flexible circuit board provided according to some embodiments of the present disclosure. In some embodiments, as shown in Figure 43, a first circuit trace 720 is disposed on the first surface of the flexible circuit board 700. A first gold finger pad 721 is disposed on the first surface of the flexible circuit board 700, and the first circuit trace 720 is electrically connected to the first gold finger pad 721. A first electrical connection area 740 is disposed on the second surface of the flexible circuit board 700. A first A pad 741 and a second A pad 742 are disposed within the first electrical connection area 740. The structures of the first A pad 741 and the second A pad 742 can be referred to as the structures of the third A pad 744 and the fourth A pad 745 in Figure 9. The first A pad 741 and the second A pad 742 are respectively connected to the first gold finger pad 721 on the first surface through connection holes. The first A pad 741 and the second A pad 742 are soldered to the circuit board 300. Exemplarily, the connection hole is a via hole, and the first A pad 741 and the second A pad 742 are electrically connected to the first gold finger pad 721 on the first surface through the connection holes respectively.

[0301] In some embodiments, a first circuit trace 720 is disposed on the first surface of the flexible circuit board 700. A third A pad 744 and a fourth A pad 745 are disposed on the first surface of the flexible circuit board 700. The third A pad 744 connects to the first circuit trace 720, and the fourth A pad 745 is disposed on a side of the third A pad 744 away from the first circuit trace 720. A gap is formed between the third A pad 744 and the fourth A pad 745, discontinuously separating the third A pad 744 and the fourth A pad 745. The first A pad 741 is located within the projection of the third A pad 744, and the second A pad 742 is located within the projection of the fourth A pad 745. Exemplarily, the third A pad 744 and the first A pad 741 are symmetrical with respect to the dielectric layer 710, and the fourth A pad 744 and the second A pad 742 are symmetrical with respect to the dielectric layer 710.

[0302] Figure 44 is a schematic diagram of a partial structure of a circuit board provided according to some embodiments of the present disclosure. As shown in Figure 44, in some embodiments, a second circuit trace 320 is provided on the circuit board 300, and the circuit board 300 includes a second electrical connection area 330. The second electrical connection area 330 is used to electrically connect to the flexible circuit board 700. Exemplarily, the second electrical connection area 330 is used to electrically connect to the first electrical connection area 740.

[0303] In some embodiments, a second gold finger pad 310 is disposed in the second electrical connection region 330 , and one end of the second gold finger pad 310 is electrically connected to the second circuit trace 320 . Exemplarily, the other end of the second gold finger pad 310 extends to an edge of the circuit board 300 .

[0304] Figure 45 is a partial schematic diagram of a connection between a circuit board and a flexible circuit board according to some embodiments of the present disclosure, and Figure 46 is a cross-sectional schematic diagram of a connection between a circuit board and a flexible circuit board according to some embodiments of the present disclosure. As shown in Figures 45 and 46, the first A-pad 741 and the fourth A-pad 742 are respectively connected to the second gold finger pad 310 via solder. The discontinuity between the first A-pad 741 and the second A-pad 742 reduces the soldering area. This eliminates solder in the gap between the first A-pad 741 and the second A-pad 742 in the connection path between the first circuit trace 720 and the second circuit trace 320. Consequently, the thickness of the connection path at this location is less than the thickness at the connection between the A-pad and the second gold finger pad 310. This reduces the average thickness of the connection path, thereby increasing the impedance of the connection path and facilitating impedance matching between the connection path and the first circuit trace 720 or the second circuit trace 320.

[0305] Figure 47 is a schematic diagram of a partial structure of another circuit board provided according to some embodiments of the present disclosure. As shown in Figure 47, in some embodiments, a plurality of discontinuous B pads are provided within the second electrical connection area 330, with one B pad being adjacent to and electrically connected to the second circuit trace 320; adjacent B pads are spaced apart and insulated by the spacers. Exemplarily, the plurality of discontinuous B pads are arranged sequentially along an extension line of the end of the second circuit trace 320. In embodiments of the present disclosure, the B pads may be circular, oval, square, or other various shapes.

[0306] In some embodiments, the second electrical connection region 330 is provided with a first B pad 331 and a second B pad 332. The first B pad 331 is electrically connected to the second circuit trace 320, and the second B pad 332 is located on a side of the first B pad 331 away from the second circuit trace 320. A gap is provided between the first B pad 331 and the second B pad 332, making the first B pad 331 and the second B pad 332 discontinuous. The first B pad 331 and the second B pad 332 are soldered to the first electrical connection region 740. For example, the first B pad 331 and the second B pad 332 are respectively electrically connected to the first gold finger pad 721 of the first electrical connection region 740, or the first B pad 331 and the second B pad 332 are respectively connected to the first A pad 741 and the second A pad 742, and so on.

[0307] In some embodiments, the second electrical connection region 330 further includes a third B pad 333 , which is located on a side of the second B pad 332 away from the first B pad 331 . Exemplarily, the third B pad 333 is located at an edge of the circuit board 300 .

[0308] Figure 48 is a cross-sectional schematic diagram of another connection between a circuit board and a flexible circuit board, according to some embodiments of the present disclosure. As shown in Figure 48, the A pads and B pads are staggered, and the projection of the corresponding A pad in the direction of the circuit board 300 overlaps a portion of the B pad area. The A pads and B pads are soldered together in the overlapping area of ​​the projections, further reducing the solder contact area between the circuit board 300 and the flexible circuit board 700. For example, the third B pad 333 is electrically connected to the first A pad 741 and the second A pad 742, the second B pad 332 is electrically connected to the second A pad 742 and the fifth A pad 743, and the first B pad 331 is electrically connected to the fifth A pad 743. The first A pad 741, the second A pad 742 and the fifth A pad 743 are discontinuous, and the first B pad 331, the second B pad 332 and the third B pad 333 are discontinuous. As a result, in the connection path between the first circuit trace 720 and the second circuit trace 320, no solder is provided in the areas below the third A pad 744, the fourth A pad 745 and the sixth A pad 746, and in the areas above the first B pad 331, the second B pad 332 and the third B pad 333. The thickness of the connection path is reduced at the intervals between adjacent first B pads 331, the second B pad 332 and the third B pad 333, and at the intervals between adjacent first B pads 331, the second B pad 332 and the third B pad 333, thereby reducing the average thickness of the connection path. This can increase the impedance of the connection path, thereby facilitating impedance matching between the connection path and the impedance of the first circuit trace 720 or the second circuit trace 320.

[0309] In some embodiments, when the first electrical connection area 740 is only provided with the first A pad 741 and the second A pad 742, the second B pad 332 connects the first A pad 741 and the second A pad 742, and the interval between the first A pad 741 and the second A pad 742 is from two-fifths to one-half of the length of the second B pad 332, so as to ensure the connection firmness between the flexible circuit board 700 and the circuit board 300 while ensuring the improvement of impedance.

[0310] As shown in Fig. 4, an electrical connector 420 is provided in the optical module, and the electrical connector 420 is electrically connected to the other end of the flexible circuit board 700. Exemplarily, the electrical connector 420 is a ceramic electrical connector.

[0311] FIG49 is a first structural schematic diagram of the other end of another flexible circuit board provided according to some embodiments of the present disclosure. FIG49 illustrates the structure of the other end of another flexible circuit board. As shown in FIG49 , a third electrical connection area 750 is provided on the surface of the flexible circuit board 700. The third electrical connection area 750 is used to connect to the electrical connector 420. In some embodiments, the third electrical connection area 750 is located at an end of the surface of the flexible circuit board 700, such as the other end of the surface of the flexible circuit board 700. The surface of the flexible circuit board 700 can be one surface or both surfaces of the flexible circuit board 700. For example, the third electrical connection area 750 is provided at the other end of the first surface of the dielectric layer 710, the third electrical connection area 750 is provided at the other end of the second surface of the flexible circuit board 700, and the third electrical connection area 750 is provided at the other end of the first and second surfaces of the flexible circuit board 700.

[0312] In some embodiments, the third electrical connection area 750 is provided with a plurality of discontinuous C pads, one of which is close to and electrically connected to the first circuit trace 720; on the same side of the dielectric layer 710, adjacent A pads are spaced apart and insulated by the spacers. Exemplarily, the plurality of discontinuous C pads are arranged in sequence on an extension line of the other end of the first circuit trace 720. In some embodiments, a through hole is provided on the C pad, so that the C pad is an annular pad, such as a circular or elliptical annular pad. Exemplarily, the outer contour of the C pad can be a polygon such as a circle, an ellipse, a square, etc., and the shape of the through hole can be a circle, an ellipse, a square, etc. In some embodiments, the arrangement of the C pad can refer to the arrangement of the A pad.

[0313] In some embodiments, the first circuit trace 720 is disposed on the first surface of the dielectric layer, and the third electrical connection area 750 is disposed on the first and second surfaces of the dielectric layer 710. The second surface of the dielectric layer 710 is positioned proximate to the electrical connector 420, so that the first electrical connection area 740 on the second surface of the dielectric layer 710 is electrically connected to the electrical connector 420. A first C-pad 751 and a second C-pad 752 are disposed within the third electrical connection area 750 on the second surface. The first circuit trace 720 electrically connects to the first C-pad 751 across the dielectric layer 710. The second C-pad 752 is disposed on a side of the first C-pad 751 away from the first circuit trace 720. A gap is formed between the first C-pad 751 and the second C-pad 752, discontinuously connecting the first and second C-pads 751 and 752. The electrical connector 420 is connected by soldering through the first and second C-pads 751 and 752. In some embodiments, the first C-pad 751 and the second C-pad 752 are disposed on the first surface of the dielectric layer 710 , and the first C-pad 751 is directly electrically connected to the first circuit trace 720 .

[0314] In some embodiments, a fifth C-pad 753 is further disposed within the third electrical connection region 750 on the second surface of the flexible circuit board 700. The fifth C-pad 753 is located on a side of the second C-pad 752 away from the first C-pad 751. A gap is formed between the fifth C-pad 753 and the second C-pad 752, discontinuing the fifth C-pad 753 and the second C-pad 752. The fifth C-pad 753 is soldered to the electrical connector 420. Exemplarily, the fifth C-pad 753 is located at the edge of the other end of the dielectric layer 710, such that the fifth C-pad 753 is located at the edge of the end of the flexible circuit board 700.

[0315] Figure 50 is a second schematic structural diagram of the other end of another flexible circuit board provided according to some embodiments of the present disclosure. As shown in Figure 50 , in some embodiments, a first circuit trace 720 is disposed on the first surface of the flexible circuit board 700, and the first surface of the flexible circuit board 700 also includes a third electrical connection area 750. The first circuit trace 720 is disposed on the first surface of the dielectric layer 710. A third C-pad 754 and a fourth C-pad 755 are disposed within the third electrical connection area 750 on the first surface. The third C-pad 754 is connected to the first circuit trace 720, and the fourth C-pad 755 is located on a side of the third C-pad 754 away from the first circuit trace 720. A gap is formed between the third C-pad 754 and the fourth C-pad 755, discontinuously separating the third C-pad 754 and the fourth C-pad 755.

[0316] In some embodiments, the third C-pad 754 is located in the projection area of ​​the first C-pad 751 in the direction of the first surface of the dielectric layer 710, and the fourth C-pad 754 is located in the projection area of ​​the second C-pad 752 in the direction of the first surface of the dielectric layer 710. Exemplarily, the third C-pad 754 is symmetrical to the first C-pad 751 with respect to the dielectric layer 710, and the fourth C-pad 754 is symmetrical to the second C-pad 752 with respect to the dielectric layer 710.

[0317] In some embodiments, a plurality of connection holes are provided in the third electrical connection region 750. The third C-pad 754 is connected to the first C-pad 751 through the connection holes, and the fourth C-pad 754 is connected to the second C-pad 752 through the connection holes. That is, the first C-pad 751 and the third C-pad 754 are connected through the connection holes, and the second C-pad 752 and the fourth C-pad 754 are connected through the connection holes. Exemplarily, the connection holes are vias, and the third C-pad 754 is electrically connected to the first C-pad 751 through the connection holes, and the fourth C-pad 754 is electrically connected to the second C-pad 752 through the connection holes.

[0318] In some embodiments, a sixth C-pad 756 is further disposed within the first electrical connection region 740 on the first surface. The sixth C-pad 756 is located on a side of the fourth C-pad 754 away from the third C-pad 754. A gap is provided between the sixth C-pad 756 and the fourth C-pad 754, discontinuing the sixth C-pad 756 and the fourth C-pad 754. Exemplarily, the sixth C-pad 756 is located at an edge of an end portion of the flexible circuit board 700.

[0319] In some embodiments, the sixth C-pad 756 is located in the projection area of ​​the fifth C-pad 753 on the first surface of the dielectric layer 710. Exemplarily, the sixth C-pad 756 and the fifth C-pad 753 are symmetrical with respect to the dielectric layer 710. In some embodiments, a half-hole is provided at the edge of the third electrical connection region 750, and the sixth C-pad 756 is connected to the fifth C-pad 753 through the half-hole, so that the half-hole passes through the sixth C-pad 756 and the fifth C-pad 753. Exemplarily, metal is provided in the half-hole, and the sixth C-pad 756 is electrically connected to the fifth C-pad 753 through the half-hole.

[0320] In some embodiments, a third circuit trace and a third gold finger pad are provided on the electrical connector 420, with one end of the third gold finger pad electrically connected to the third circuit trace. A first C-pad 751 and a second C-pad 752 are respectively soldered to the third gold finger pad. When the electrical connector 420 is soldered to the third connection area, the first C-pad 751 and the second C-pad 752 are discontinuous, reducing the soldering area. This results in a lack of solder in the gap between the first C-pad 751 and the second C-pad 752 in the connection path between the first circuit trace 720 and the third circuit trace. Consequently, the thickness of the connection path at this location is less than the thickness at the connection between the C-pad and the third gold finger pad. Consequently, the average thickness of the connection path is reduced, thereby increasing the impedance of the connection path and facilitating impedance matching between the connection path and the first circuit trace 720 or the third circuit trace.

[0321] Figure 51 is a schematic diagram of a partial structure of an electrical connector provided in some embodiments of the present disclosure. As shown in Figure 51 , in some embodiments, a third circuit trace 4210 is provided on the electrical connector 420. The electrical connector 420 also includes a fourth electrical connection area 4220, which is used to electrically connect to the other end of the flexible printed circuit board 700. Exemplarily, the fourth electrical connection area 4220 is used to electrically connect to the third electrical connection area 750.

[0322] In some embodiments, the fourth electrical connection region 4220 is provided with a plurality of discontinuous D pads, one of which is located adjacent to and electrically connected to the third circuit trace 4210. For example, the plurality of discontinuous D pads are arranged sequentially along an extension line of the end of the third circuit trace 4210. In the disclosed embodiment, the D pads may be polygonal in shape, such as circular, elliptical, or square.

[0323] In some embodiments, the fourth electrical connection region 4220 is provided with a first D-pad 4221 and a second D-pad 4222. The first D-pad 4221 is electrically connected to the second circuit trace 320, and the second D-pad 4222 is located on a side of the first D-pad 4221 away from the second circuit trace 320. A gap is provided between the first D-pad 4221 and the second D-pad 4222, making the first D-pad 4221 and the second D-pad 4222 discontinuous. The first D-pad 4221 and the second D-pad 4222 are soldered to the second electrical connection region 750. For example, the first D-pad 4221 and the second D-pad 4222 are respectively electrically connected to the gold finger pads of the second electrical connection region 750, or the first D-pad 4221 and the second D-pad 4222 are respectively connected to the first C-pad 751 and the second C-pad 752, and so on.

[0324] In some embodiments, the fourth electrical connection region 4220 further includes a third D-pad 4223. The third D-pad 4223 is disposed on a side of the second D-pad 4222 away from the first D-pad 4221. A gap exists between the third D-pad 4223 and the second D-pad 4222, discontinuing the third D-pad 4223 and the second D-pad 4222. Exemplarily, the third D-pad 4223 is located at an edge of the electrical connector 420.

[0325] Figure 52 is a schematic diagram illustrating the connection between a flexible printed circuit board and an electrical connector according to some embodiments of the present disclosure, and Figure 53 is a cross-sectional schematic diagram illustrating the connection between a flexible printed circuit board and an electrical connector according to some embodiments of the present disclosure. As shown in Figures 52 and 53, the third D-pad 4223 is electrically connected to the first C-pad 751 and the second C-pad 752, the second D-pad 4222 is electrically connected to the second C-pad 752 and the fifth C-pad 753, and the third D-pad 4223 is electrically connected to the fifth C-pad 753. The C-pad and the D-pad are staggered, and the projection of the corresponding A-pad in the direction of the electrical connector 420 covers a portion of the D-pad. The C-pad and the D-pad are welded together in the overlapping area of ​​the projection. The first C pad 751, the second C pad 752, and the fifth C pad 753 are discontinuous, and the first B pad 331, the second B pad 332, and the third B pad 333 are discontinuous. As a result, in the connection path between the first circuit trace 720 and the third circuit trace 4210, no solder is provided in the areas below the first C pad 751, the second C pad 752, and the fifth C pad 753, and in the areas above the first D pad 4221, the second D pad 4222, and the third D pad 4223. The thickness of the connection path is reduced at the intervals between adjacent first D pads 4221, second D pads 4222, and third D pads 4223, as well as the intervals between adjacent first D pads 4221, second D pads 4222, and third D pads 4223. This reduces the average thickness of the connection path, thereby increasing the impedance of the connection path and facilitating impedance matching between the connection path and the first circuit trace 720 or the third circuit trace 4210.

[0326] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: A circuit board, with a gold finger at one end; A power chip is mounted on the circuit board, and the power chip is electrically connected to the gold finger; A DSP chip is mounted on the circuit board, the DSP chip is electrically connected to the power chip, and the power chip supplies power to the DSP chip; A light receiving component is electrically connected to the circuit board, the light receiving component is electrically connected to the DSP chip, and the electrical signal output by the light receiving component is transmitted to the DSP chip; MCU, mounted on the circuit board, the MCU is connected to the power chip and the DSP chip respectively; Wherein, the MCU is configured as: Controlling the power chip to output a supply voltage; Acquire the power supply voltage and receiving parameters in the DSP chip, wherein the receiving parameters include a receiving side bit error rate and a signal-to-noise ratio; When the temperature changes, determining whether the received parameter exceeds a target range; When the received parameter does not exceed the target range, controlling the power chip to reduce the output power supply voltage value; When the receiving parameter exceeds the target range, controlling the power chip to increase or decrease the output power supply voltage value to improve the receiving parameter; The light emitting component is electrically connected to the circuit board and comprises: Tube shell; An electrical connection component having a first wiring area formed on its surface, wherein the electrical connection component is configured to transmit a high-frequency signal or simultaneously transmit a low-frequency signal and a high-frequency signal; An electrical connector, one end of which extends into the tube shell and the other end of which is outside the tube shell, wherein the surface outside the tube shell has a second wiring area; A support component is disposed between the electrical connection component and the electrical connector / the tube shell, and is configured to support the electrical connection component so that the first bonding area is flush with the second bonding area surface, thereby achieving bonding connection between the electrical connection component and the electrical connector.

2. The optical module according to claim 1, wherein: The MCU is further configured such that, when the receiving parameter is a receiving side bit error rate, when the receiving side bit error rate is less than a bit error threshold value, the power supply chip is controlled to reduce the output power supply voltage value; When the bit error rate of the receiving side is greater than or equal to the bit error threshold, the power supply chip is controlled to increase or decrease the output power supply voltage value.

3. The optical module according to claim 1, wherein: The MCU is further configured to, when the received parameter is a signal-to-noise ratio, control the power chip to reduce the output supply voltage value when the signal-to-noise ratio is greater than a target signal-to-noise ratio when the temperature changes; When the signal-to-noise ratio is less than or equal to the target signal-to-noise ratio, the power chip is controlled to increase or decrease the output supply voltage value.

4. The optical module according to claim 2, wherein: The power chip is provided with a first register, and the first register stores the supply voltage value output by the power chip; The DSP chip is provided with a second register, and the second register stores a receiving side bit error rate; The MCU reads the first register and the second register respectively to obtain the supply voltage value and the receiving side bit error rate.

5. The optical module according to claim 4, wherein: The DSP chip is provided with a bit error detection module, which obtains a receiving side bit error rate according to the parameters of the signal received by the optical receiving component, and stores the receiving side bit error rate in the second register.

6. The optical module according to claim 2, wherein: The MCU is also configured to, when the temperature changes and the receiving side bit error rate is less than the bit error threshold value, control the power supply voltage output by the power chip to be reduced to a first power supply voltage value, and when the receiving side bit error rate at the first power supply voltage value is equal to or greater than the bit error threshold value, control the power supply chip to output a second power supply voltage value, and the second power supply voltage value is the first power supply voltage value+1%.

7. The optical module according to claim 2, wherein: The MCU is also configured to, when the temperature rises and the receiving side bit error rate is greater than the bit error threshold value, control the power chip to increase the output power supply voltage value, and when the receiving side bit error rate gradually decreases under the gradually increased power supply voltage, control the power chip to output the maximum power supply voltage value within the power supply range.

8. The optical module according to claim 2, wherein: The MCU is also configured to, when the temperature decreases and the receiving side bit error rate is greater than the bit error threshold value, control the power chip to reduce the output power supply voltage value, and when the receiving side bit error rate gradually decreases under the gradually reduced power supply voltage, control the power chip to output the minimum power supply voltage value within the power supply range.

9. The optical module according to claim 2, wherein: The MCU is also configured to, when the temperature changes and the receiving side bit error rate is greater than the bit error threshold value, control the power supply voltage output by the power chip to increase or decrease to a third power supply voltage value, and when the receiving side bit error rate at the third power supply voltage value is less than or equal to the bit error threshold value and the receiving side bit error rate is stable, control the power supply chip to output the third supply voltage value.

10. The optical module according to claim 1, wherein: The power supply voltage range output by the power chip is 0.6±3%V.

11. The optical module according to claim 1, wherein: The electrical connection assembly includes a first flexible circuit board, the first wiring area is formed on the surface of the first flexible circuit board, and the first flexible circuit board is configured to transmit high-frequency signals; A first step surface and a second step surface are respectively formed on one end of the electrical connector outside the tube shell, wherein the surface of the first step surface has the second wiring area; The support assembly includes a support member, which is arranged on the surface of the second step surface and fixedly connected to the second step surface. The support member is configured to support the first flexible circuit board so that the first wiring area is flush with the surface of the second wiring area, thereby enabling a wiring connection between the first flexible circuit board and the first step surface.

12. The optical module according to claim 11, wherein: The electrical connection assembly further includes a second flexible circuit board, wherein the second flexible circuit board is configured to transmit a low-frequency signal; A third step surface is also formed on one end of the electrical connector outside the tube shell; The first flexible circuit board is connected to the first step surface by wire bonding, and the second flexible circuit board is electrically connected to the third step surface.

13. The optical module according to claim 12, wherein: The electrical connector comprises a first electrical connector; The heights of the third step surface, the second step surface, and the first step surface of the first electrical connector are successively reduced; The supporting member is located above the first flexible circuit board to support the first flexible circuit board from above the first flexible circuit board.

14. The optical module according to claim 12, wherein: The electrical connector includes a second electrical connector; The heights of the third step surface, the first step surface, and the second step surface of the second electrical connector are successively reduced; The supporting member is located below the first flexible circuit board to support the first flexible circuit board from below the first flexible circuit board.

15. The optical module according to claim 12, wherein: The width of the second step surface is flush with the width of the support member, so that a reinforcing member is arranged between the first flexible circuit board and the second flexible circuit board, and the reinforcing member is relatively close to the wiring area between the first flexible circuit board and the second step surface; The side surfaces of the reinforcing member are respectively connected to the second step surface and the end surface of the supporting member.

16. The optical module according to claim 12, wherein: A reinforcing piece is provided on the outer side of the connection surface between the supporting piece and the first flexible circuit board, and the reinforcing piece is relatively close to the wiring area between the first flexible circuit board and the second step surface.

17. The optical module according to claim 13, wherein: The soldering pads on the second stepped surface of the first electrical connector and the soldering pads on the surface of the second flexible circuit board are both facing the bottom end of the tube shell.

18. The optical module according to claim 14, wherein: The soldering pads on the second stepped surface of the second electrical connector and the soldering pads on the surface of the second flexible circuit board are both facing the top of the tube shell.

19. The optical module according to claim 11, wherein: The support member and the second step surface are fixedly connected by glue.

20. The optical module according to claim 1, wherein: The bottom plate of the tube shell extends relative to the top plate so that the bottom plate forms an extension surface; The electrical connector comprises a third electrical connector, one end of the third connector extends into the tube shell, the other end is outside the tube shell and arranged on the surface of the extension surface, and a first pad area is formed on the surface of the third electrical connector outside the tube shell; The electrical connection assembly includes a flexible circuit board, a second pad area is formed on the surface, the second pad area is connected to the first pad area by wire bonding, and the flexible circuit board is configured to simultaneously transmit a low-frequency signal and a high-frequency signal between the circuit board and the light emitting component; The supporting component includes a supporting structure, which is arranged between the flexible circuit board and the extension surface and connected to the third electrical connector to support the flexible circuit board so that the surface of the first pad area is flush with the surface of the second pad area, thereby connecting the third electrical connector and the flexible circuit board by wiring.

21. The optical module according to claim 20, wherein: The support structure comprises a support block, the bottom surface of the support block is arranged on the surface of the extension surface, the top surface is provided with the flexible circuit board, and the side surface is connected to the third electrical connector; The support block has a preset height so that a surface of the second pad region is flush with a surface of the first pad region.

22. The optical module according to claim 21, wherein: The bottom of the support block on the side adjacent to the third electrical connector is provided with a notch to collect glue overflowed when the third electrical connector is fixed; Alternatively, in the third electrical connector, a bottom portion on a side adjacent to the support block is provided with a notch to collect glue overflowing when the third electrical connector is fixed.

23. The optical module according to claim 20, wherein: The tail of the extension surface protrudes upward to form a boss, and the boss forms the support structure to support the flexible circuit board. The third electrical connector is arranged on one side of the boss.

24. The optical module according to claim 23, wherein: A gap is provided between the boss and the third electrical connector to collect glue overflowed when the third electrical connector is fixed; A support plate is provided between the boss and the flexible circuit board, and a side surface of the support plate is connected to the third electrical connector; The support plate spans across the gap to cover the gap; The surface of the support plate is configured to place the flexible circuit board.

25. The optical module according to claim 23, wherein: A gap is provided between the boss and the third electrical connector to collect glue overflowed when the third electrical connector is fixed; The top surface of the boss protrudes relative to the body of the boss to cover the gap; The top surface of the boss is configured to seat the flexible circuit board.

26. The optical module according to claim 23, wherein: When there is no gap between the boss and the third electrical connector, a bottom of the boss on a side adjacent to the third electrical connector is provided with a notch to collect glue overflowing when the third electrical connector is fixed; Alternatively, in the third electrical connector, a bottom portion on a side adjacent to the boss is provided with a notch to collect glue overflowing when the third electrical connector is fixed.

27. The optical module according to claim 24, wherein: The boss has a preset height so that after the support plate is arranged, the surface of the second pad area is flush with the surface of the first pad area.

28. The optical module according to claim 25, wherein: The boss has a preset height so that a surface of the second pad region is flush with a surface of the first pad region.

29. The optical module according to claim 20, wherein: A third pad area is provided on a surface of one end of the third electrical connector located inside the tube shell. The third pad area is electrically connected to the first pad area to simultaneously transmit the low-frequency signal and the high-frequency signal.

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