Welding equipment for IC chip processing

Abstract

The invention discloses welding equipment for IC chip processing. The welding equipment comprises an operation table, a welding box is arranged in the middle of the top end of the operation table, a conveying assembly is arranged at the top end of the operation table, a pre-welding cleaning assembly is arranged at the top end of the operation table close to the conveying end of the welding box, and a post-welding cleaning assembly and a cleaning assembly are arranged at the top end of the operation table close to the output end of the welding box. The pre-welding cleaning assembly, the post-welding cleaning assembly and the cleaning assembly are additionally arranged at the input end and the output end of the welding box for welding the IC chip, so that dust on the chip and residual soldering flux after welding are removed; and through gear racks arranged at the bottom end of the semi-gear and the chip placing frame at equal intervals and intermittent triggering semi-gears, and through cooperation with swinging inertia of a weighting block, reciprocating sweeping of the cleaning brush on the IC chip is realized, and impurities are further cleaned.

Description

Technical Field

[0001] The invention relates to a welding device, in particular to welding equipment for IC chip processing, belonging to the technical field of chip processing. Background Art

[0002] IC chip is the abbreviation of integrated circuit chip. IC chip needs to be formed by welding with other circuits. Currently, laser spot welding equipment for IC chip processing has appeared on the market.

[0003] After searching, Chinese patent number CN116944678A discloses a welding device for IC chip processing. Through the cooperation of a micro camera, a data comparison module and a control module, the telescopic distance of the telescopic component and the rotation speed of the conveying roller group are controlled in real time, thereby adjusting the welding wire conveying speed in real time to reduce the possibility of welding point adhesion and instability. In actual operation, the IC chip needs to be cleaned before and after welding. If there is dust on the surface of the chip before welding, it will affect the welding efficiency; if the solder resist is not completely cleaned after welding, it will reduce the service life of the chip. Summary of the invention

[0004] The object of the present invention is to provide a bonding device for IC chip processing in order to solve the above-mentioned problems.

[0005] The present invention achieves the above-mentioned object through the following technical scheme: a welding device for IC chip processing, comprising an operating table, a welding box is arranged in the middle of the top of the operating table, a conveying component is arranged at the top of the operating table, a pre-welding cleaning component is arranged at the top of the operating table near the conveying end of the welding box, and a post-welding cleaning component and a cleaning component are arranged at the top of the operating table near the output end of the welding box;

[0006] The conveying assembly is used to convey the IC chip to be welded, and the conveying assembly includes a protruding block, a driving motor, a lead screw, a chip placement frame and a moving groove. Two protruding blocks are provided at the middle position of the top of the operating table, and the top of the protruding block is provided with a moving groove, and a lead screw is provided inside the moving groove. A driving motor is provided at one end of the lead screw, and a chip placement frame is provided at the top of the two protruding blocks;

[0007] The cleaning component before welding is used to clean the chip to be welded to avoid the influence of dust on welding. The cleaning component before welding includes a vertical pole, a gear bar, a half gear, a weight block, a connecting rod, a gear plate, a conveyor belt, a rotating roller, a cleaning brush and a placement groove. Vertical poles are provided on opposite sides of the two raised blocks, one of the vertical poles is provided with a placement groove inside, a conveyor belt is vertically provided inside the placement groove, a rotating roller is provided at the top of the conveyor belt, a gear plate is provided at the bottom end of the conveyor belt, a plurality of gear bars are equidistantly provided at the bottom end of one side of the chip placement frame close to the placement groove, a connecting rod is provided at one end of the gear plate close to the raised block, a half gear is provided at one end of the connecting rod away from the gear plate, a weight block is provided at one end of the half gear away from the connecting rod, and a cleaning brush is provided at one end of the rotating roller close to the raised block;

[0008] The post-welding cleaning component is used to spray a cleaning agent on the IC chip after welding to dissolve the soldering flux. The post-welding cleaning component includes an extrusion block, a push switch, a frame, and a cleaning agent atomizing nozzle. A frame is provided at the top of the operating table and located at the output end of the welding box. A plurality of cleaning agent atomizing nozzles are provided at the top of the frame. A card slot is provided at the top of the operating table and located between the two protruding blocks. A push switch is provided at the top of the card slot at the position of the frame. An extrusion block is provided in the middle of the bottom end of the chip placement frame.

[0009] The internal structure of the cleaning component is consistent with the internal structure of the pre-welding cleaning component.

[0010] Preferably, the two protruding blocks are arranged in the middle of the welding box, and the bottom end of the chip placement frame is movably engaged with the protruding blocks.

[0011] Preferably, threaded blocks are provided on both sides of the bottom end of the chip placement frame and located at the position of the movable groove, and the threaded blocks are connected to the lead screw and nut.

[0012] Preferably, a cross bar is provided between the top ends of the two vertical poles, the gear bar is meshed with the half gear, and the gear plate and the outer portion of the rotating roller are meshed with the inner portion of the conveyor belt.

[0013] Preferably, the weight block is rectangular and vertically arranged in the lower middle position of the half gear, and the weight of the weight block is greater than the weight of the cleaning brush.

[0014] Preferably, the brush head of the cleaning brush is positioned perpendicular to the vertical direction of the rectangle of the weight block.

[0015] Preferably, a groove is provided at the top of the operating table near the position of the half gear.

[0016] Preferably, the bottom end of the extrusion block is arranged in an arc shape, the top end of the push switch is arranged in a semicircular shape, and the bottom end position of the extrusion block is higher than the top end height of the push switch.

[0017] Preferably, a transparent observation window is provided on one side of the welding box.

[0018] The present invention has the following beneficial effects:

[0019] 1. By adding pre-welding cleaning components, post-welding cleaning components and cleaning components at the input and output ends of the welding box for welding IC chips, the dust on the chip and the residual flux after welding are removed;

[0020] 2. When the chip is transported by the chip placement frame, the semi-gear is triggered to drive the transmission belt to rotate, so that the cleaning brush rotates to sweep the IC chip placed on the chip placement frame to clean the impurities;

[0021] 3. Through the gear bar equidistantly arranged between the half gear and the bottom of the chip placement frame, the half gear is triggered intermittently, and the swing inertia of the weight block is coordinated to realize the back and forth sweeping of the IC chip by the cleaning brush to further clean the impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional diagram of the overall structure of a welding device for IC chip processing proposed by the present invention;

[0023] Figure 2 A three-dimensional diagram of the structure of a cleaning component before welding of a welding device for processing IC chips proposed by the present invention;

[0024] Figure 3 A three-dimensional diagram of the structure of a cleaning component before welding of a welding device for processing IC chips proposed by the present invention;

[0025] Figure 4 A three-dimensional diagram of the structure of a cleaning component after welding of a welding device for processing IC chips proposed by the present invention;

[0026] Figure 5 A three-dimensional diagram of a chip placement frame mechanism of a welding device for IC chip processing proposed by the present invention;

[0027] Figure 6 A three-dimensional diagram of the structure of a cleaning component before welding of a welding device for processing IC chips proposed by the present invention;

[0028] Figure 7 This is a three-dimensional diagram of the overall structure of a welding device for IC chip processing proposed by the present invention.

[0029] In the figure: 1. operating table; 101. welding box; 102. transparent observation window; 2. conveying assembly; 201. raised block; 202. driving motor; 203. lead screw; 204. chip placement frame; 205. card slot; 206. threaded block; 207. moving slot; 3. cleaning assembly before welding; 301. vertical pole; 302. horizontal pole; 303. gear bar; 304. half gear; 305. weight block; 306. connecting rod; 307. gear plate; 308. conveyor belt; 309. rotating roller; 310. cleaning brush; 311. placement slot; 4. cleaning assembly after welding; 401. extrusion block; 402. push switch; 403. frame; 404. detergent atomizing nozzle; 5. cleaning assembly; 6. groove. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] Embodiment 1:

[0032] Reference Figure 1-4 as well as Figure 7 A welding device for IC chip processing includes an operating table 1, a welding box 101 is arranged in the middle of the top of the operating table 1, a conveying component 2 is arranged at the top of the operating table 1, a pre-welding cleaning component 3 is arranged at the top of the operating table 1 near the conveying end of the welding box 101, and a post-welding cleaning component 4 and a cleaning component 5 are arranged at the top of the operating table 1 near the output end of the welding box 101;

[0033] The conveying component 2 is used to transport the IC chip that needs to be welded. The conveying component 2 includes a protruding block 201, a driving motor 202, a lead screw 203, a chip placement frame 204 and a movable groove 207. Two protruding blocks 201 are provided at the middle position of the top of the operating table 1, and a movable groove 207 is provided at the top of the protruding block 201. A lead screw 203 is provided inside the movable groove 207, and a driving motor 202 is provided at one end of the lead screw 203. A chip placement frame 204 is provided at the top of the two protruding blocks 201.

[0034] Two raised blocks 201 are arranged in the middle position of the welding box 101, and the bottom end of the chip placement frame 204 is movably engaged with the raised blocks 201. Threaded blocks 206 are arranged on both sides of the bottom end of the chip placement frame 204 and at the position of the movable groove 207, and the threaded blocks 206 are connected to the screw 203 and the nut.

[0035] In this embodiment, it should be noted that: the application can be placed in a workshop for welding IC chips. When welding IC chips, the chip to be welded is first placed in the chip placement frame 204, and the drive motor 202 is started to drive the lead screw 203 to rotate. The threaded block 206 connected to the nut of the lead screw 203 will move back and forth on the lead screw 203, thereby driving the chip placement frame 204 to move on the raised block 201, thereby delivering the IC chip to the welding box 101, and after the welding is completed, the welded IC chip is delivered from the welding box 101.

[0036] The welding box 101 and the driving motor 202 are both connected to the PLC controller model: "S7-1500". At the same time, a micro camera, a data comparison module and a control module are arranged inside the welding box 101 to control in real time the telescopic distance of the laser welding head when welding the chip and the rotation speed of the driving motor 202 driving the lead screw 203 to rotate, thereby adjusting the position of the chip in real time and reducing the possibility of adhesion and instability of the solder joints.

[0037] Embodiment 2:

[0038] Different from the first embodiment, Figure 1-7 , this embodiment also has the following further contents: the cleaning assembly 3 before welding is used to clean the chip to be welded to avoid the influence of dust on welding, the cleaning assembly 3 before welding includes a vertical rod 301, a gear bar 303, a half gear 304, a weight block 305, a connecting rod 306, a gear plate 307, a conveyor belt 308, a rotating roller 309, a cleaning brush 310 and a placement groove 311, and vertical rods 301 are provided on the opposite sides of the two raised blocks 201, and a placement groove 311 is provided inside one of the vertical rods 301, and a vertical arrangement is provided inside the placement groove 311 There is a conveyor belt 308, a rotating roller 309 is provided at the inner top end of the conveyor belt 308, a gear plate 307 is provided at the inner bottom end of the conveyor belt 308, a plurality of gear bars 303 are equidistantly provided at the bottom end of one side of the chip placement frame 204 close to the placement groove 311, a connecting rod 306 is provided at one end of the gear plate 307 close to the raised block 201, a half gear 304 is provided at one end of the connecting rod 306 away from the gear plate 307, a weight block 305 is provided at one end of the half gear 304 away from the connecting rod 306, and a cleaning brush 310 is provided at one end of the rotating roller 309 close to the raised block 201.

[0039] A cross bar 302 is provided between the top ends of the two vertical poles 301 , a gear bar 303 is meshed with a half gear 304 , and a gear plate 307 and the outside of a rotating roller 309 are meshed with the inside of a conveyor belt 308 .

[0040] The weight block 305 is rectangular and vertically arranged in the lower middle position of the half gear 304. The weight of the weight block 305 is greater than the weight of the cleaning brush 310. The brush head of the cleaning brush 310 is perpendicular to the vertical direction of the rectangle of the weight block 305. A groove 6 is provided at the top of the operating table 1 near the half gear 304.

[0041] In this embodiment, it should be noted that: before welding, the chip placement frame 204 is moved to the position of the vertical rod 301 under the rotation of the lead screw 203. At this time, multiple gears 303 located at the bottom of the chip placement frame 204 pass through the half gear 304 in sequence. At this time, the half gear 304 rotates and drives the rotation of the connecting rod 306, the gear plate 307 and the first conveyor belt 308, thereby driving the rotation of the rotating roller 309, so that the cleaning brush 310 rotates close to the chip placement frame 204.

[0042] After the gear bar 303 passes through the half gear 304, the half gear 304 will be reset under the gravity of the weight block 305, so that the cleaning brush 310 is reset. Therefore, multiple gear bars 303 pass through the half gear 304 in sequence, and cooperate with the swing inertia of the weight block 305 to achieve the cleaning brush 310 to brush and clean the top of the chip placement frame 204 back and forth.

[0043] Implementation three:

[0044] Reference Figure 1 as well as Figure 4 Compared with the first embodiment and the second embodiment, in the present embodiment: the post-welding cleaning component 4 is used to spray a cleaning agent on the IC chip after welding to dissolve the soldering flux, and the post-welding cleaning component 4 includes an extrusion block 401, a push switch 402, a frame 403 and a cleaning agent atomizing nozzle 404. The frame 403 is provided at the top of the operating table 1 and located at the output end of the welding box 101, and a plurality of cleaning agent atomizing nozzles 404 are provided at the top of the frame 403. A card slot 205 is provided at the top of the operating table 1 and located between the two protruding blocks 201. A push switch 402 is provided at the top of the card slot 205 and located at the position of the frame 403. An extrusion block 401 is provided in the middle of the bottom end of the chip placement frame 204;

[0045] The internal structure of the cleaning component 5 is consistent with the internal structure of the cleaning component 3 before welding.

[0046] The bottom of the squeezing block 401 is arc-shaped, the top of the push switch 402 is semicircular, the bottom of the squeezing block 401 is higher than the top of the push switch 402 , and a transparent observation window 102 is provided on one side of the welding box 101 .

[0047] In this embodiment, it should be noted that: after the IC chip is welded, since flux is used during welding, when the chip placement frame 204 passes through the frame 403, the squeezing block 401 at the bottom of the chip placement frame 204 squeezes the press switch 402, triggering the detergent atomizing nozzle 404 to start, and use a suitable detergent (such as anhydrous ethanol, isopropyl alcohol, etc.) to remove impurities such as flux remaining in the welding process. When the detergent atomizing nozzle 404 is started, the detergent sprays downward to dissolve the residual flux, and then passes through the cleaning component 5. The cleaning component 5 has the same steps as the above-mentioned pre-welding cleaning component 3, so that the cleaning brush 310 brushes the top of the chip to sweep the detergent and impurities.

[0048] Since the swing position of the cleaning brush 310 intersects with the vertical rod 301 , the cleaning brush 310 can sweep the impurities toward the card slot 205 when it moves, thereby preventing the impurities from remaining on the chip placement frame 204 .

[0049] The cleaning brush 310 is a brush with a soft texture and fine bristles, such as a wool brush or an anti-static nylon brush, so that the chip surface and the area around the solder joints can be gently brushed during cleaning to avoid scratching the chip or causing the pins to loosen.

Claims

1. A welding device for IC chip processing, comprising an operating table (1), characterized in that: A welding box (101) is provided in the middle of the top of the operating table (1), a conveying assembly (2) is provided at the top of the operating table (1), a pre-welding cleaning assembly (3) is provided at the top of the operating table (1) close to the conveying end of the welding box (101), and a post-welding cleaning assembly (4) and a cleaning assembly (5) are provided at the top of the operating table (1) close to the output end of the welding box (101); The conveying component (2) is used to convey the IC chip to be welded, and comprises a protruding block (201), a driving motor (202), a lead screw (203), a chip placement frame (204) and a movable groove (207); two protruding blocks (201) are provided at the middle position of the top of the operating table (1); the top of each protruding block (201) is provided with a movable groove (207); a lead screw (203) is provided inside the movable groove (207); one end of each lead screw (203) is provided with a driving motor (202); and the tops of the two protruding blocks (201) are provided with a chip placement frame (204); The pre-welding cleaning assembly (3) is used to clean the chip to be welded to avoid the influence of dust on welding. The pre-welding cleaning assembly (3) comprises a vertical pole (301), a gear bar (303), a half gear (304), a weight block (305), a connecting rod (306), a gear plate (307), a conveyor belt (308), a rotating roller (309), a cleaning brush (310) and a placement groove (311). The vertical poles (301) are arranged on the opposite sides of the two protruding blocks (201), a placement groove (311) is arranged inside one of the vertical poles (301), a conveyor belt (308) is arranged vertically inside the placement groove (311), and the conveyor belt (308) is arranged vertically inside the conveyor belt (308). ) is provided with a rotating roller (309) at the inner top end, a gear plate (307) is provided at the inner bottom end of the conveyor belt (308), a plurality of gear bars (303) are equidistantly provided at the bottom end of one side of the chip placement frame (204) close to the placement groove (311), a connecting rod (306) is provided at one end of the gear plate (307) close to the protruding block (201), a half gear (304) is provided at one end of the connecting rod (306) away from the gear plate (307), a weight block (305) is provided at one end of the half gear (304) away from the connecting rod (306), and a cleaning brush (310) is provided at one end of the rotating roller (309) close to the protruding block (201); The post-welding cleaning component (4) is used to spray a cleaning agent on the IC chip after welding to dissolve the soldering flux. The post-welding cleaning component (4) comprises an extrusion block (401), a push switch (402), a frame (403) and a cleaning agent atomizing nozzle (404). The frame (403) is provided at the top of the operating table (1) and located at the output end of the welding box (101). A plurality of cleaning agent atomizing nozzles (404) are provided at the top of the frame (403). A card slot (205) is provided at the top of the operating table (1) and located between the two protruding blocks (201). A push switch (402) is provided at the top of the card slot (205) located at the position of the frame (403). An extrusion block (401) is provided in the middle of the bottom end of the chip placement frame (204). The internal structure of the cleaning component (5) is consistent with the internal structure of the pre-welding cleaning component (3).

2. The IC chip processing welding equipment according to claim 1, characterized in that: The two protruding blocks (201) are arranged at the middle position of the welding box (101), and the bottom end of the chip placement frame (204) is movably engaged with the protruding blocks (201).

3. The IC chip processing welding equipment according to claim 2, characterized in that: Thread blocks (206) are provided on both sides of the bottom end of the chip placement frame (204) and at the position of the movable groove (207), and the thread blocks (206) are connected to the nut of the lead screw (203).

4. The IC chip processing welding equipment according to claim 3, characterized in that: A crossbar (302) is provided between the top ends of the two vertical poles (301), the gear bar (303) is meshed with the half gear (304), and the gear plate (307) and the outside of the rotating roller (309) are both meshed with the inside of the conveyor belt (308).

5. The IC chip processing welding equipment according to claim 4, characterized in that: The weight block (305) is in a rectangular shape and is vertically arranged at a lower middle position of the half gear (304). The weight of the weight block (305) is greater than the weight of the cleaning brush (310).

6. The IC chip processing welding equipment according to claim 5, characterized in that: The brush head of the cleaning brush (310) is positioned perpendicular to the vertical direction of the rectangular shape of the weight block (305).

7. The IC chip processing welding equipment according to claim 1, characterized in that: A groove (6) is provided at the top of the operating platform (1) near the position of the half gear (304).

8. The IC chip processing welding equipment according to claim 7, characterized in that: The bottom end of the squeezing block (401) is arranged in an arc shape, the top end of the pressing switch (402) is arranged in a semicircular shape, and the bottom end position of the squeezing block (401) is higher than the top end height of the pressing switch (402).

9. The IC chip processing welding equipment according to claim 5, characterized in that: A transparent observation window (102) is provided on one side of the welding box (101).

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