Punching auxiliary tool and punching method for green ceramic chip

Abstract

The invention discloses a punching auxiliary tool and a punching method for a green ceramic chip, and the punching method adopts a central impact ablation processing mode to enable a laser spot to directly bombard the circle center of a hole to be processed so as to ablate and remove a material. The auxiliary plate is provided with a first adsorption area, a second adsorption area and a punching area, and the auxiliary plate is provided with a solid structure capable of covering first adsorption holes located in the first adsorption area; in the second adsorption area, the auxiliary plate is provided with a plurality of second adsorption holes penetrating through the upper surface and the lower surface, and the second adsorption holes are aligned and communicated with part of the first adsorption holes; the auxiliary plate is provided with a plurality of blind holes in the punching area, the blind holes are in one-to-one correspondence with the punching positions on the raw ceramic chip to be processed, so that a space for laser energy attenuation is formed below the punching positions of the raw ceramic chip, and the laser energy is prevented from being accumulated on the back face of the raw ceramic chip.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a punching auxiliary tool and a punching method for a green ceramic sheet. Background Art

[0002] Flexible raw ceramic sheets are the main raw materials for the production of low-temperature ceramic sheets LTCC and high-temperature ceramic sheets HTCC. Taking the LTCC production process as an example, it is usually necessary to laser-drill the raw ceramic sheets, and then fill the holes with conductive metal materials to form internal circuits. The traditional processing method, as mentioned in CN114682932A, uses a small spot laser to continuously move and draw the outline of the hole to be processed to complete the drilling. The moving path of the laser spot cuts along the circumference of the hole to be processed, and finally separates the internal material. However, the processing efficiency of this method is very low, and the number of holes that need to be processed in the production process of ceramic sheets is very large, and the drilling process of raw ceramic sheets will take a lot of time. Summary of the invention

[0003] The purpose of the present application is to provide a punching auxiliary plate and a punching method for a raw ceramic sheet, which can avoid the accumulation of laser energy on the back of the raw ceramic sheet at the punching position, thereby achieving efficient punching while ensuring the punching quality.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions: The present application provides a punching auxiliary plate for a raw ceramic sheet, which is used for positioning and installation on a laser processing platform, wherein the laser processing platform is provided with a plurality of first adsorption holes connected to a negative pressure source, and the auxiliary plate has a first adsorption area, a second adsorption area and a punching area, wherein the auxiliary plate has a physical structure capable of covering the first adsorption holes located in the first adsorption area; and in the second adsorption area, the auxiliary plate is provided with a plurality of second adsorption holes that pass through the upper and lower surfaces, and the second adsorption holes are aligned with and connected to part of the first adsorption holes; and the auxiliary plate is provided with a plurality of blind holes in the punching area, and the plurality of blind holes correspond one-to-one to the punching positions on the raw ceramic sheet to be processed, so as to form a space for attenuation of laser energy below the punching positions of the raw ceramic sheet.

[0005] In a possible implementation, the bottom of the blind hole is a rough diffuse reflection surface.

[0006] In a possible implementation, the depth of the blind hole is greater than or equal to 0.2 mm, and the diameter of the blind hole is 20 to 100 um larger than the diameter of the through hole of the green ceramic sheet.

[0007] In a possible implementation, the auxiliary plate is made of a transparent acrylic material.

[0008] In a possible implementation, a positioning and locking structure is provided between the auxiliary plate and the laser processing platform.

[0009] In a possible implementation, the first adsorption area is located at the periphery of the second adsorption area of ​​the green ceramic sheet adsorption area, and the second adsorption area is located at the periphery of the punching area.

[0010] In a possible implementation, the width of the first adsorption zone is ≥30 mm.

[0011] In a possible implementation, the difference between the aperture of the second adsorption hole and the aperture of the first adsorption hole is 0~+0.2 mm.

[0012] In a possible implementation, the auxiliary plate is further engraved with an alignment frame line, and the alignment frame line coincides with the outer peripheral edge of the raw ceramic sheet to be punched.

[0013] The present application also provides a method for punching a raw porcelain sheet, wherein the raw porcelain sheet has a PET layer on the back and a ceramic layer on the front. The punching method is to pre-arrange a number of spaces for laser energy attenuation below the raw porcelain sheet, wherein the spaces correspond one-to-one to the punching positions, and then a carbon dioxide gas laser is used to perform multiple impact punching on the raw porcelain sheet.

[0014] In a possible implementation, the setting parameters of the laser drilling include: aperture size: 1.0 mm-4.0 mm, pulse width: 5 μs-30 μs, pulse energy: 5 mJ-30 mJ; number of pulses: 4 times-20 times.

[0015] In a possible implementation, the punching method includes the following steps: Step 1: Position and install the punching auxiliary plate on the laser processing platform, wherein the auxiliary plate is provided with a plurality of second adsorption holes, so that the second adsorption holes on the auxiliary plate are aligned with the first adsorption holes on the laser processing platform; Step 2, processing a plurality of blind holes on the auxiliary plate, wherein the processing positions of the blind holes are the same as the punching positions of the green ceramic sheets to be punched; Step 3, placing the green ceramic sheet to be punched on the auxiliary plate, and making the outer edge of the green ceramic sheet coincide with the alignment frame line pre-engraved on the auxiliary plate, and fixing the green ceramic sheet by vacuum adsorption through a plurality of second adsorption holes; Step 4: Laser punch the green ceramic sheet using set parameters to form a number of through holes in a predetermined punching area.

[0016] In a possible implementation, the depth of the blind hole is greater than or equal to 0.2 mm, and the diameter of the blind hole is 20 to 100 um larger than the diameter of the through hole of the green ceramic sheet.

[0017] In a possible implementation, the green porcelain sheet includes a PET layer and a ceramic layer, wherein the thickness of the ceramic layer is 20um-300um, and the thickness of the PET layer is 30um-100um; the total thickness of the green porcelain sheet is 50um-400um.

[0018] The present application uses a punching auxiliary plate to open a blind hole in advance at the laser punching position, and utilizes the blind hole to reduce the reflection effect of the laser and the accumulation effect of the laser energy on the back of the raw ceramic sheet, thereby avoiding the melting of the PET layer of the raw ceramic sheet, and then obtaining a ceramic through hole with smooth edges. It can realize high-energy and rapid punching of a carbon dioxide laser, and can effectively improve the punching efficiency and yield of the raw ceramic sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of step 1 of a punching method provided in an embodiment of the present application.

[0020] Figure 2 A schematic diagram of step 2 of a punching method provided in an embodiment of the present application.

[0021] Figure 3 A schematic diagram of step 4 of a punching method provided in an embodiment of the present application.

[0022] Figure 4 A schematic diagram of partitioning of a punching auxiliary plate provided in an embodiment of the present application.

[0023] Figure 5 This is a schematic diagram of a punching auxiliary plate before punching provided in an embodiment of the present application.

[0024] Figure 6a This is the appearance of the through-holes of the green ceramic sheet observed under a microscope in the comparative example.

[0025] Figure 6b The figure shows the appearance of the through hole of the green ceramic sheet in Example 1 observed through a microscope.

[0026] Figure 7a This is the appearance of the through-holes in the green ceramic sheet observed by a stereo electron microscope in the comparative example.

[0027] Figure 7b The figure shows the appearance of the through hole of the green ceramic sheet observed by a stereo electron microscope in Example 1.

[0028] Figure 8a This is a photograph of the edge of the through hole of the green ceramic sheet observed by scanning electron microscope in the comparative example.

[0029] Figure 8b This is a photograph of the edge of the through hole of the green ceramic sheet observed by scanning electron microscope in Example 1.

[0030] Among them: 1. Laser processing platform; 2. First adsorption hole; 3. Vacuum channel; 4. Second adsorption hole; 5. Blind hole; 6. Laser beam; 7. PET film; 8. Ceramic layer; 9. Through hole; 10. Auxiliary plate; 11. Positioning and locking structure; 12. First adsorption area; 13. Second adsorption area; 14. Alignment frame line; 15. Punching area; 16. Precise alignment mark. DETAILED DESCRIPTION

[0031] To describe the technical content, structural features, achieved purpose and effect of the invention in detail, the technical scheme in the embodiment of the present application will be described below in conjunction with the drawings in the embodiment of the present application. Obviously, the described embodiment is only a part of the embodiment of the present application, rather than all the embodiments. In the following description, for the purpose of explanation, many specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments may also be implemented without these specific details or in the case of one or more equivalent arrangements. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0032] This application proposes a method for drilling raw ceramic sheets, which uses a center impact ablation processing method to allow the laser spot to directly bombard the center of the required processing hole to ablate and remove the material. This allows the conductive slurry to be filled in the through hole in the subsequent process and form a circuit after sintering. Therefore, the processing efficiency, yield, size and appearance stability of the through hole are of great significance to the reliability of ceramic sheet products.

[0033] To this end, this application uses a carbon dioxide gas laser to generate a large spot irradiation. Compared with other types of lasers, such as picosecond ultraviolet lasers, picosecond green light lasers, etc., the carbon dioxide laser has a large spot size, high power, high production capacity, and strong stability.

[0034] However, the applicant found in production practice that placing the raw ceramic sheet on the laser processing platform and directly processing the through-holes on the raw ceramic sheet on the platform will cause heat accumulation during the ablation process. Since the raw ceramic sheet is a double-layer composite material, namely, composed of a ceramic layer 8 and a PET layer 7 (polyethylene terephthalate), the ablation behavior of these two materials under the same laser parameters is quite different; in addition, due to the high energy of the carbon dioxide laser, the heat accumulation effect is significant, and after the laser penetrates the raw ceramic sheet and reaches the laser processing platform, part of the laser will be reflected from the surface of the platform. Based on the above two characteristics, the direct use of carbon dioxide gas laser for hole processing has the following disadvantages: 1. The heat accumulation effect is significant, which easily produces larger PET material melt escape or glass precipitate (one of the material components of green porcelain sheets) at the hole mouth and in the hole.

[0035] 2. The heat reflection effect is significant, which can easily cause the back PET layer to deteriorate or deform.

[0036] 3. When the drilling position coincides with the position of the first adsorption hole 2 on the laser processing platform 1, the raw ceramic sheet is sunken and deformed at the drilling position due to the vacuum adsorption effect, so the processing effect is significantly different from that at other positions, resulting in poor processing.

[0037] Therefore, the applicant also proposed a punching auxiliary plate, by means of which the deformation of the green ceramic sheet due to vacuum adsorption can be reduced, and the accumulation of laser energy can also be reduced. Figure 1-5 As shown, a punching auxiliary plate for a raw ceramic sheet is used for positioning and mounting on a laser processing platform 1. The auxiliary plate 10 is made of a transparent acrylic material and has a flat plate structure. The laser processing platform 1 is provided with a plurality of first adsorption holes 12 and a vacuum channel 3 connected to a vacuum source.

[0038] A positioning and locking structure 11 is provided between the auxiliary plate 10 and the laser processing platform 1, which is used to align and fix the two. In a typical positioning and locking structure, the positioning method can be to open a hole in the laser processing platform 1, and to cooperate with the positioning pin structure to achieve positioning and fixing. The positioning pin can be fixed on the auxiliary plate as a whole, or the auxiliary plate can open a hole, and the positioning pin can be detachably connected; the locking method adopts the cooperation of the countersunk hole and the flat head bolt. After the auxiliary plate and the laser processing platform 1 are positioned and locked, the first adsorption hole 2 on the laser processing platform 1 can be aligned with the second adsorption hole 4 on the auxiliary plate 10, thereby realizing the vacuum adsorption and fixing function of the raw ceramic sheet.

[0039] See also Figure 4 As shown, the auxiliary plate 10 has a first adsorption area 12 on its periphery, and a second adsorption area 13 and a punching area 15 are provided inside the first adsorption area 12. In the first adsorption area 12, the auxiliary plate 10 has a physical structure capable of covering the first adsorption holes 2 located in the first adsorption area 12, so that the auxiliary plate 10 can be fixed on the laser processing platform 1 through the first adsorption holes 12 and the vacuum source, as shown in FIG. Figure 1 To ensure that the auxiliary plate 10 does not move relative to the laser processing platform during the movement of the laser processing platform 1 and to ensure the position accuracy of the hole processing, the single side width of the first adsorption area 12 should be ≥30 mm.

[0040] In the second adsorption area 13, the auxiliary plate 10 is provided with a plurality of second adsorption holes 4 that penetrate the upper and lower surfaces, and the second adsorption holes 4 are aligned with and connected to the first adsorption holes 2 in the second adsorption area 13, so that the green ceramic sheet placed in the second adsorption area 13 can be fixed by vacuum adsorption. Preferably, the aperture of the second adsorption hole 4 is greater than or equal to the aperture of the first adsorption hole 2, and the aperture difference between the second adsorption hole 4 and the first adsorption hole 2 is 0~+0.2mm.

[0041] See also Figure 4 , 5 , the auxiliary plate 10 is also engraved with an alignment frame line 14, which coincides with the outer peripheral edge of the raw ceramic sheet to be punched. The alignment frame line is the same size as the raw ceramic sheet, and the edge of the alignment frame line 14 coincides with the second adsorption area 13, that is, when the raw ceramic sheet is placed on the auxiliary plate 10, the edge of the raw ceramic sheet coincides with the quasi-alignment frame line 14, and a part of the raw ceramic sheet is located in the second adsorption area 13, and can be fixed on the auxiliary plate by vacuum adsorption through the second adsorption hole 4. The alignment frame line is the same size as the raw ceramic sheet, and the raw ceramic sheet is aligned with it when loading, and the frame line width is 0.05mm-0.5mm.

[0042] In the punching area 15, the unprocessed auxiliary plate 10 is smooth and has no openings. Before punching the green ceramic sheet, a plurality of blind holes 5 are opened by a laser light source. The plurality of blind holes 5 correspond to the punching positions on the green ceramic sheet to be processed. Figure 2 As shown. In the punching area, there is the area where the laser processes the through hole 9 of the raw ceramic sheet, which is used to receive the laser; no through hole or other structure can be set. Figure 3 As shown, in the punching area 15, the first adsorption hole 2 on the laser processing platform 1 is blocked, and the green ceramic sheet will not be deformed by vacuum adsorption. On the one hand, the structure in the punching area can form a plane support for the edge of the green ceramic sheet, and on the other hand, a plurality of blind holes 5 can form a space for laser energy attenuation below the punching position of the green ceramic sheet, and the blind holes can reduce the reflection effect of the laser and reduce the accumulation effect of the laser energy on the back of the green ceramic sheet.

[0043] In one embodiment, the bottom of the blind hole 5 is a rough diffuse reflection surface, so as to eliminate the reflection of the laser at the bottom of the hole. In one embodiment, the depth of the blind hole 5 is greater than or equal to 0.2 mm. Considering the processing error and the laser heat affected range, the diameter of the blind hole is 20 to 100 um larger than the hole diameter of the green ceramic sheet.

[0044] In a preferred embodiment, in addition to the rough positioning of the alignment frame line 14, a precise alignment mark 16 is also provided. The precise alignment mark 16 is arranged outside the second adsorption area 13 to ensure that each raw ceramic sheet is laser-punched at the same position under the same laser punching drawing. The precise alignment mark 16 can be in the form of a circle, a ring, a cross, etc. that can be recognized by a CCD camera, and the size can be: 0.5mm-2mm.

[0045] More specifically, the method for punching raw porcelain sheets of the present application is to pre-set a number of spaces for laser energy attenuation under the raw porcelain sheets, so that the several laser energy attenuation spaces correspond one-to-one to each punching position, and then use a carbon dioxide gas laser to perform multiple impact punching on the raw porcelain sheets, that is, multiple laser irradiation of the punching positions in a pulsed form.

[0046] The laser spot size is positively correlated with the aperture diameter, and the drilling diameter is positively correlated with the laser spot. The aperture is affected by the combined action of laser ablation and thermal removal. Engineers can set various parameters of the laser equipment according to the actual processing conditions. In one embodiment of the present application, the setting parameters of laser drilling include: aperture size: 1.0mm-4.0mm, pulse width: 5μs-30μs, pulse energy: 5mJ-30mJ; number of pulses: 4 times-20 times.

[0047] In some embodiments, the total thickness of the green ceramic sheet is 50um-400um, the thickness of the ceramic layer 8 is 20um-300um, and the thickness of the PET layer 7 is 30um-100um.

[0048] The implementation steps of the punching method are as follows: Step 1: Position and install the punching auxiliary plate 10 on the laser processing platform 1 through the positioning and locking structure, so that the second adsorption hole 4 on the auxiliary plate 10 is roughly aligned with the first adsorption hole 2 on the laser processing platform 1; Step 2, processing a number of blind holes 5: On the surface of the new auxiliary plate 10, without placing the raw ceramic sheet, run the laser drilling process to form blind holes 5 with the same pattern as the drilling process. The blind holes 5 have the same drilling position and shape (both are circular) as the raw ceramic sheet to be punched, and the diameter is slightly larger than the diameter of the through hole of the raw ceramic sheet by 10-50um; Step 3: Place the green ceramic sheet to be punched on the auxiliary plate 10 manually or automatically, with the ceramic layer on top, and make the outer edge of the green ceramic sheet coincide with the alignment frame line 14 pre-engraved on the auxiliary plate 10, and the edge of the green ceramic sheet passes through a plurality of second adsorption holes 4 so that the green ceramic sheet is fixed by vacuum adsorption; Step 4: Laser punching the green ceramic sheet with set parameters to form a plurality of through holes 9 in a predetermined punching area.

[0049] Step 5: Remove the raw ceramic sheet after the punching process by manual or automatic transport.

[0050] The function of the blind hole is to reduce the reflection effect of the laser and reduce the accumulation effect of the laser energy on the back of the ceramic sheet. The program can be run multiple times until the depth of the blind hole is > 0.2mm and the diameter of the blind hole is slightly larger than the target hole diameter. Embodiment 1

[0051] Carbon dioxide laser drilling is performed on a raw ceramic sheet with a length and width of 400mm. The thickness of the ceramic layer is 100um and the thickness of the PET layer is 50um. The goal is to process an array of straight through holes with a spacing of 1mm within a circular range with a diameter of 300mm.

[0052] For this material and processing drawings, the design of the punching auxiliary plate refers to the following Figure 5 The specific process implementation process is as follows: Step 1: Install the auxiliary plate. Install the auxiliary plate on the laser processing platform through the positioning pins and locking screws, and make sure that the adsorption holes of the auxiliary plate are roughly aligned with the adsorption holes of the platform.

[0053] Step 2: Auxiliary plate preparation: On the surface of the new laser-processed auxiliary plate, run the laser drilling program without placing the raw ceramic sheet to form a blind hole with the same pattern as the drilling process.

[0054] Step 3: Loading. The raw ceramic pieces are placed in the primary alignment frame by manual handling, with the ceramic layer on top.

[0055] Step 4: Processing. Set appropriate parameters for through-hole processing of the green ceramic sheet, such as aperture size, pulse frequency, pulse energy, pulse number and other parameters, and process the through-holes of the green ceramic sheet on the platform. Aperture size: 2.5mm, pulse width: 12μs, pulse energy: 18mJ; pulse number: 6 times.

[0056] Step 5: Unloading. The processed raw ceramic pieces are removed manually.

[0057] The punched green porcelain pieces were observed using an optical microscope, a stereo microscope, and a scanning electron microscope. Figure 6b , Figure 7b , Figure 8b It can be seen that the through-hole edges of the raw ceramic sheet are cut smoothly, there is no melting phenomenon in the PET layer, and the hole mouth and the hole are clean and free of foreign matter.

[0058] 1. Without using laser processing auxiliary tools, the raw ceramic sheet is directly moved manually or automatically to the laser processing platform.

[0059] 2. The raw ceramic sheet is fixed on the platform through the adsorption hole on the laser processing platform connected to the negative pressure source.

[0060] 3. According to the debugged laser parameters, start the processing program and complete the processing of all through holes in sequence.

[0061] Figure 6aThe through hole to be processed just partially overlaps with the position of the adsorption hole of the platform. At this time, the quality of the processed hole is poor, a large amount of molten debris is attached to the surface, which is difficult to remove, the hole diameter does not meet expectations, and the roundness of the hole is insufficient.

[0062] The punched green porcelain pieces were observed using an optical microscope, a stereo microscope, and a scanning electron microscope. Figure 6a , Figure 7a , Figure 8a It can be seen that the edge of the through hole of the raw ceramic sheet is not cut smoothly, the PET layer is severely melted and deformed, protruding to a certain height, and there are precipitated or residual substances in the through hole.

[0063] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and the scope of protection of the present invention is defined by the attached claims, description and their equivalents.

Claims

1. A punching auxiliary plate for a raw ceramic sheet, used for positioning and mounting on a laser processing platform (1), wherein the laser processing platform (1) is provided with a plurality of first adsorption holes (2) connected to a negative pressure source, characterized in that: The auxiliary plate (10) has a first adsorption area (12), a second adsorption area (13) and a punching area (15), wherein the auxiliary plate (10) has a physical structure capable of covering the first adsorption holes (2) located in the first adsorption area (12); and in the second adsorption area (13), the auxiliary plate (10) is provided with a plurality of second adsorption holes (4) penetrating the upper and lower surfaces, and the second adsorption holes (4) are aligned with and connected to some of the first adsorption holes (2); and the auxiliary plate (10) is provided with a plurality of blind holes (5) in the punching area (15), and the plurality of blind holes (5) correspond one-to-one to the punching positions on the raw ceramic sheet to be processed, so as to form a space for attenuation of laser energy below the punching positions of the raw ceramic sheet.

2. The punching auxiliary plate according to claim 1, characterized in that: The bottom of the blind hole (5) is a rough diffuse reflection surface.

3. The punching auxiliary plate according to claim 1, characterized in that: The depth of the blind hole (5) is greater than or equal to 0.2 mm, and the diameter of the blind hole is 20 to 100 μm larger than the diameter of the through hole of the green ceramic sheet.

4. The punching auxiliary plate according to claim 1, characterized in that: The auxiliary plate (10) is made of transparent acrylic material.

5. The punching auxiliary plate according to claim 1, characterized in that: A positioning locking structure is provided between the auxiliary plate (10) and the laser processing platform (1).

6. The punching auxiliary plate according to claim 1, characterized in that: The first adsorption area (12) is located at the periphery of the second adsorption area (13) of the green ceramic sheet adsorption area, and the second adsorption area (13) is located at the periphery of the punching area (15).

7. The punching auxiliary plate according to claim 1, characterized in that: The width of the first adsorption zone (12) is ≥30 mm.

8. The punching auxiliary plate according to claim 1, characterized in that: The difference between the aperture of the second adsorption hole (4) and the aperture of the first adsorption hole (2) is 0~+0.2 mm.

9. The punching auxiliary plate according to claim 1, characterized in that: The auxiliary plate (10) is also engraved with an alignment frame line (14), and the alignment frame line (14) coincides with the outer peripheral edge of the raw ceramic sheet to be punched.

10. A method for punching a raw ceramic sheet, wherein the back of the raw ceramic sheet has a PET layer (7) and the front has a ceramic layer (8), characterized in that: A number of spaces for laser energy attenuation are pre-arranged under the green ceramic sheet, the spaces corresponding to the punching positions one by one, and then a carbon dioxide gas laser is used to perform multiple impact punching on the green ceramic sheet.

11. The punching method according to claim 10, characterized in that: The setting parameters of laser drilling include: aperture size: 1.0mm-4.0mm, pulse width: 5μs-30μs, pulse energy: 5mJ-30mJ; number of pulses: 4 times-20 times.

12. The punching method according to claim 10, characterized in that: The steps include: Step 1: Positioning and installing a punching auxiliary plate (10) on the laser processing platform (1), wherein the auxiliary plate (10) is provided with a plurality of second adsorption holes (4), so that the second adsorption holes (4) on the auxiliary plate (10) are aligned with the first adsorption holes (2) on the laser processing platform (1); Step 2: processing a plurality of blind holes (5) on the auxiliary plate (10), wherein the processing positions of the blind holes (5) are the same as the punching positions of the green ceramic sheet to be punched; Step 3, placing the green ceramic sheet to be punched on the auxiliary plate (10), and making the outer peripheral edge of the green ceramic sheet coincide with the alignment frame line (14) pre-engraved on the auxiliary plate (10), and fixing the green ceramic sheet by vacuum adsorption through a plurality of second adsorption holes (4); Step 4: Laser drilling is performed on the green ceramic sheet using set parameters to form a plurality of through holes (9) in a predetermined drilling area.

13. The punching method according to claim 12, characterized in that: The depth of the blind hole (5) is greater than or equal to 0.2 mm, and the diameter of the blind hole is 20 to 100 μm larger than the diameter of the through hole of the green ceramic sheet.

14. The punching method according to claim 10, characterized in that: The thickness of the ceramic layer (8) is 20um-300um, the thickness of the PET layer (7) is 30um-100um; and the total thickness of the raw ceramic sheet is 50um-400um.

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