Light-emitting device and reflective sighting telescope

Abstract

The invention discloses a light-emitting device and a reflective sighting telescope, the light-emitting device comprises a first substrate, a first light-emitting element, a second light-emitting element and a diaphragm, the first light-emitting element, the second light-emitting element and the first light-emitting element are arranged in a die bonding area of the first substrate, and the first light-emitting element and the second light-emitting element are connected to the first substrate in parallel; the second light-emitting element and the first light-emitting element are arranged along a first direction, and in the first direction, the spacing distance between one side, close to the second light-emitting element, of the first light-emitting element and the second light-emitting element is 1-50 microns; the diaphragm is arranged on the light-emitting sides of the first light-emitting element and the second light-emitting element, and the orthographic projection of a light through hole of the diaphragm on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element, so that light emitted by the first light-emitting element and the second light-emitting element can pass through. The light-emitting device can be used as a point light source with different brightness or different color adjustments for the reflective sighting telescope.

Description

Technical Field

[0001] The present application relates to the technical field of reflective sights, and in particular to a light emitting device and a reflective sight. Background Art

[0002] A reflex sight is a commonly used sight, including a reflective lens and a light-emitting device. The light-emitting device serves as the light source of the sight, and the light source is set at the focal position of the reflective lens. The light source of the reflex sight, also called the aiming point, is usually a red dot or a green dot. The red aiming point uses a point light source that emits red light, and the green aiming point uses a point light source that emits green light. Users will choose aiming points of different colors according to different usage scenarios. The red aiming point is suitable for color backgrounds that are significantly different from red light, such as cold-toned environments such as forests and oases; the green aiming point is suitable for color backgrounds that are significantly different from green light, such as warm-toned environments such as deserts and Gobi. Red light aiming points and green light aiming points can basically cover all usage scenarios.

[0003] The light-emitting device in the reflex sight in the related art is usually a monochromatic light source, that is, a reflex sight has either a red aiming point or a green aiming point, and the application scenario is single. If the user uses the reflex sight in the related art in different environmental backgrounds, an additional light-emitting device of a different color is required, which not only increases the cost, but also requires recalibration of the aiming point of the reflex sight and the impact point of the firearm after each replacement of the light-emitting device, and the calibration steps are cumbersome and complicated. Summary of the invention

[0004] The embodiments of the present application provide a light emitting device and a reflective sight, which are used to solve the problem that the light emitting device in the reflective sight in the related art has a single color and low versatility.

[0005] In the first aspect, an embodiment of the present application provides a light-emitting device, comprising a first substrate, a first light-emitting element, a second light-emitting element and an aperture, wherein the first substrate comprises a solid crystal region; the first light-emitting element is arranged inside the solid crystal region, and the first light-emitting element is electrically connected to the first substrate; the second light-emitting element is arranged inside the solid crystal region, and the second light-emitting element is electrically connected to the first substrate, so that the second light-emitting element is connected in parallel with the first light-emitting element; the second light-emitting element and the first light-emitting element are arranged along a first direction, and in the first direction, the spacing distance between the side of the first light-emitting element close to the second light-emitting element and the second light-emitting element is 1 to 50 microns; the aperture is arranged on the light-emitting side of the first light-emitting element and the second light-emitting element, and the orthographic projection of the light hole of the aperture on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element, so that the light emitted by the first light-emitting element and the second light-emitting element can pass through; wherein the first direction is perpendicular to the thickness direction of the first substrate.

[0006] In some embodiments, the first light emitting element can emit a first light signal, and the second light emitting element can emit a second light signal, and a wavelength of the second light signal is different from a wavelength of the first light signal.

[0007] In some embodiments, the light-through hole is a circular hole, and the diameter of the light-through hole is 5 micrometers to 80 micrometers.

[0008] In some embodiments, the first light-emitting element is welded to the first substrate via a first bonding wire, and the second light-emitting element is welded to the first substrate via a second bonding wire. A protective glue is also provided on the first substrate, and the protective glue is used to completely cover the first bonding wire, the second bonding wire, and the welding points at both ends of the first bonding wire and the second bonding wire.

[0009] In some embodiments, the first light-emitting element includes a first LED chip, which is a single-electrode chip or a double-electrode chip; the second light-emitting element includes a second LED chip, which is a single-electrode chip or a double-electrode chip.

[0010] In some embodiments, the first substrate is provided with two first welding points and two second welding points, and the first welding points and the second welding points are located outside the solid crystal area; one of the third welding points corresponding to the two first welding points is arranged on the first light-emitting element and the other of the third welding points is arranged on the solid crystal area, or, the two third welding points corresponding to the two first welding points are both arranged on the first light-emitting element; one of the fourth welding points corresponding to the two second welding points is arranged on the second light-emitting element, and the other of the fourth welding points is arranged on the solid crystal area, or, the two fourth welding points corresponding to the two second welding points are arranged on the second light-emitting element; one end of the first bonding wire is welded to the first welding point, and the other end is welded to the third welding point; one end of the second bonding wire is welded to the second welding point, and the other end is welded to the fourth welding point.

[0011] In some embodiments, in the second direction, one of the first solder joints and one of the second solder joints located on one side of the solid crystal area are an integrated structure; another of the first solder joints and another of the second solder joints located on the other side of the solid crystal area are arranged at intervals; wherein the second direction, the first direction and the thickness direction of the first substrate are perpendicular to each other.

[0012] In some embodiments, a transparent encapsulation layer is provided on the first substrate, the transparent encapsulation layer is located on the light emitting side of the first light emitting element and the second light emitting element, and the orthographic projection of the transparent encapsulation layer on the first substrate completely covers the first substrate; the aperture is fixed on a side of the transparent encapsulation layer away from the first substrate.

[0013] In some embodiments, the first light emitting element is any one of a surface light source, a line light source and a point light source, and the second light emitting element is any one of a surface light source, a line light source and a point light source.

[0014] In a second aspect, an embodiment of the present application further provides a reflective sight, comprising: a reflective lens and a light-emitting device as described in the first aspect, wherein a light hole of an aperture in the light-emitting device is located at a focus of the reflective lens.

[0015] In some embodiments, the light-through hole is a circular hole, and the center of the light-through hole coincides with the focus of the reflective lens.

[0016] In some embodiments, the reflective surface of the reflective lens is provided with a high-reflective film.

[0017] In some embodiments, the light emitting device is electrically connected to a power source and a key switch through a control unit, and the key switch is used for the control unit to control turning on and off at least one of the first light emitting element and the second light emitting element in the light emitting device.

[0018] In some embodiments, the light emitting device is connected to a power source via a knob switch, and at least one of the first light emitting element and the second light emitting element is turned on and off by rotating the knob switch.

[0019] The light-emitting device provided in the embodiment of the present application is configured by arranging the first light-emitting element and the second light-emitting element inside the solid crystal area of ​​the first substrate. When the spacing distance between the first light-emitting element and the second light-emitting element in the first direction is adjusted to meet the range of 1 to 50 microns, the orthographic projection of the light hole of the aperture on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element. In this way, it is beneficial to enable the light emitted by the first light-emitting element and the second light-emitting element to be emitted through the light hole of the aperture at the same time, thereby converting multiple light sources into point light sources; at the same time, the first light-emitting element and the second light-emitting element are electrically connected to the first substrate respectively to realize the parallel connection of the first light-emitting element and the second light-emitting element, that is, the first light-emitting element and the second light-emitting element can be controlled separately, that is, by controlling the first light-emitting element and the second light-emitting element, the brightness or color of the light emitted through the light hole of the aperture is different. When the wavelengths of the light emitted by the first light-emitting element and the second light-emitting element are the same, compared with setting a light-emitting element inside the solid crystal area of ​​the first substrate, the light-emitting element has the same structure as one of the first light-emitting element and the second light-emitting element, and the first light-emitting element and the second light-emitting element are controlled to emit light at the same time, thereby increasing the brightness of the light-emitting device; when controlling the first light-emitting element or the second light-emitting element to emit light, one of the first light-emitting element and the second light-emitting element can be used as the main light-emitting element, and the other can be used as a backup light-emitting element, thereby not only achieving the adjustment of different brightness, but also improving the service life of the light-emitting device and reducing the frequency of replacement; when the wavelengths of the light emitted by the first light-emitting element and the second light-emitting element are different, thus providing a light-emitting device capable of achieving two-color light-emitting, which is suitable for a variety of different scenarios and has a wide range of applications.

[0020] When the light-emitting device is applied to a reflective sight, the light hole of the aperture is located at the focus of the reflective lens of the reflective sight. In this way, if the wavelengths of the light signals emitted by the first light-emitting element and the second light-emitting element are the same, the switch of at least one of the first light-emitting element and the second light-emitting element can be controlled to serve as a point light source for the reflective sight that can achieve multiple brightness adjustments. If the wavelengths of the light signals emitted by the first light-emitting element and the second light-emitting element are different, for example, the first light-emitting element emits red light and the second light-emitting element emits green light, a point light source with different color adjustments of red light and green light can be provided for the reflective sight by switching the switches of the first light-emitting element and the second light-emitting element. In this way, the user can purchase one less set of reflective sights of other colors, and the correction operation caused by replacing the reflective sight is also eliminated, which brings great convenience to the user. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the structure of the light-emitting device in some embodiments of the present application; Figure 2 for Figure 1 AA cross-sectional view of the light emitting device in; Figure 3 It is a schematic diagram of the structure of a reflective sight in some embodiments of the present application; Figure 4 A schematic diagram of the top view of the light hole of the aperture and the first light-emitting element and the second light-emitting element in the light-emitting device in some embodiments of the present application; Figure 5 A schematic diagram of the structure of a light-emitting device in which the first light-emitting element is a dual-electrode chip and the second light-emitting element is a single-electrode chip in some embodiments; Figure 6 is a schematic structural diagram of a light-emitting device in which both the first light-emitting element and the second light-emitting element are dual-electrode chips in some embodiments; Figure 7 Schematic diagram of the structure of a light-emitting device in which both the first light-emitting element and the second light-emitting element are dual-electrode chips in some other embodiments; Figure 8 A schematic diagram of the electric control connection of the light emitting device in some embodiments of the present application; Fig. 9 A schematic diagram of manual control connection of a light emitting device in some embodiments of the present application; Fig.10 for Figure 1 A structural diagram of a semi-finished product of a finished light-emitting device during the preparation process; Fig.11 for Figure 1 A flow chart for preparing a finished light emitting device; Fig.12 is a flow chart for preparing finished light-emitting devices in some embodiments; Fig.13 It is a flow chart of preparing finished light-emitting devices in other embodiments.

[0023] Description of reference numerals: 100, substrate; 200, outer frame; 300, cutting path; 1. First welding point; 2. Second welding point; 3. Third welding point; 4. Fourth welding point; 10. first substrate; 101. die-bonding region; 11. first light-emitting element; 12. second light-emitting element; 13. first bonding wire; 14. second bonding wire; 15. transparent encapsulation layer; 201, light hole; 30. reflecting lens; 301. reflecting surface; 40. Power supply; 41. Control unit; 42. Push switch; 43. Rotary switch. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0028] A reflex sight is a commonly used sight, including a reflective lens and a light-emitting device. The light-emitting device serves as the light source of the sight, and the light source is set at the focal position of the reflective lens. The light source of the reflex sight, also called the aiming point, is usually a red dot or a green dot. The red aiming point uses a point light source that emits red light, and the green aiming point uses a point light source that emits green light. Users will choose aiming points of different colors according to different usage scenarios. The red aiming point is suitable for color backgrounds that are significantly different from red light, such as cold-toned environments such as forests and oases; the green aiming point is suitable for color backgrounds that are significantly different from green light, such as warm-toned environments such as deserts and Gobi. Red light aiming points and green light aiming points can basically cover all usage scenarios.

[0029] The light-emitting device in the reflex sight in the related art is usually a monochromatic light source, that is, a reflex sight has either a red aiming point or a green aiming point, and the application scenario is single. If the user uses the reflex sight in the related art in different environmental backgrounds, an additional light-emitting device of a different color is required, which not only increases the cost, but also requires recalibration of the aiming point of the reflex sight and the impact point of the firearm after each replacement of the light-emitting device, and the calibration steps are cumbersome and complicated.

[0030] In order to solve the above problems, the embodiments of the present application provide a light emitting device and a manufacturing method thereof and a reflective sight. The reflective sight includes a reflective lens and a light emitting device. Generally, the light emitting device provides a point light source for the reflective sight.

[0031] like Figure 1~Figure 3 As shown, the embodiment of the present application provides a light-emitting device, including a first substrate 10, a first light-emitting element 11, a second light-emitting element 12 and a stop (not shown in the figure, Figure 3 , only the positional relationship between the light-through hole 201 and the first light-emitting element 11 and the second light-emitting element 12 is shown), the first substrate 10 includes a solid crystal region 101; the first light-emitting element 11 is arranged inside the solid crystal region 101, and the first light-emitting element 11 is electrically connected to the first substrate 10; the second light-emitting element 12 is arranged inside the solid crystal region 101, and the second light-emitting element 12 is electrically connected to the first substrate 10, so that the second light-emitting element 12 is connected in parallel with the first light-emitting element 11; the second light-emitting element 12 and the first light-emitting element 11 are arranged along a first direction, and in the first direction, the spacing distance between the side of the first light-emitting element 11 close to the second light-emitting element 12 and the second light-emitting element 12 ( Figure 1The distance t in the first direction is 1 to 50 microns; the aperture is arranged on the light-emitting side of the first light-emitting element 11 and the second light-emitting element 12, and the orthographic projection of the aperture 201 of the aperture on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12, so that the light emitted by the first light-emitting element 11 and the second light-emitting element 12 can pass through; wherein, the first direction ( Figure 1 The horizontal direction of the first substrate 10 is perpendicular to the thickness direction of the first substrate 10.

[0032] The aperture is an aperture piece, and a light hole 201 for light to pass through is provided in the center of the aperture piece. The light hole 201 of the aperture can be, but is not limited to, a circular hole, so that the surface light source, line light source or point light source emitted by the light emitting device can be converted into a point light source of target size, and used in conjunction with the reflective lens 30 to form a reflective sight. The orthographic projection of the light hole 201 of the aperture on the first substrate 10 is located at the adjacent center of the first light emitting element 11 and the second light emitting element 12, such as Figure 3 shown.

[0033] The first light emitting element 11 is used to emit a first light signal, and the second light emitting element 12 is used to emit a second light signal. The center wavelengths of the first light signal and the second light signal may be the same or different. The first light emitting element 11 may be any one of a surface light source, a line light source, and a point light source. The structure of the second light emitting element 12 is the same as that of the first light emitting element 11, and is also any one of a surface light source, a line light source, and a point light source. Figure 1 The shape outlines of the first light emitting element 11 and the second light emitting element 12 are only drawn for example, and the specific sizes of the first light emitting element 11 and the second light emitting element 12 are not specifically limited. Figure 1 The first light emitting element 11 includes a first LED chip, and the second light emitting element 12 includes a second LED chip. Figure 1 , the first LED chip and the second LED chip are both dual-electrode chips, that is, the first light-emitting element 11 and the second light-emitting element 12 are both dual-electrode chips. The first LED chip and the second LED chip can also be single-electrode chips, or the first LED chip is a dual-electrode chip and the second LED chip is a single-electrode chip; the first LED chip is a single-electrode chip and the second LED chip is a dual-electrode chip, that is, the first light-emitting element 11 and the second light-emitting element 12 are specifically connected to the first substrate 10, refer to the following and Figure 5~Figure 7As shown. The structures of the first LED chip and the second LED chip in the first light-emitting element 11 and the second light-emitting element 12 can be the same or different, and the number of chips included in the first light-emitting element 11 and the second light-emitting element 12 can be the same or different. This application is described by taking the first light-emitting element 11 including a first LED chip, the second light-emitting element 12 including a second LED chip, and the first LED chip and the second LED chip as a double-electrode chip of a small surface light source as an example. Two connection solder joints are provided on the double-electrode chip, one connection solder joint is provided on the single-electrode chip, and the other connection solder joint is provided on the die-bonding area 101.

[0034] By arranging the first light-emitting element 11 and the second light-emitting element 12 inside the solid crystal region 101 of the first substrate 10, and adjusting the spacing distance between the first light-emitting element 11 and the second light-emitting element 12 in the first direction to meet the range of 1 to 50 microns, the orthographic projection of the aperture 201 on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12, and the adjacent center of the first light-emitting element 11 and the second light-emitting element 12 refers to the geometric center area of ​​the two side edges close to each other between the first light-emitting element 11 and the second light-emitting element 12, so that, This is advantageous in that the light emitted by the first light-emitting element 11 and the second light-emitting element 12 can be emitted through the light-through hole 201 of the aperture at the same time, thereby converting multiple light sources into point light sources; at the same time, the first light-emitting element 11 and the second light-emitting element 12 are electrically connected to the first substrate 10 respectively, so that the first light-emitting element 11 and the second light-emitting element 12 are connected in parallel, that is, the first light-emitting element 11 and the second light-emitting element 12 can be controlled separately, that is, by controlling the first light-emitting element 11 and the second light-emitting element 12, the brightness or color of the light emitted through the light-through hole 201 of the aperture is different.

[0035] When the wavelengths of the light emitted by the first light-emitting element 11 and the second light-emitting element 12 are the same, compared with setting a light-emitting element inside the solid crystal area 101 of the first substrate 10, the light-emitting element has the same structure as one of the first light-emitting element 11 and the second light-emitting element 12, and the first light-emitting element 11 and the second light-emitting element 12 are controlled to emit light at the same time, thereby increasing the brightness of the light-emitting device; when the first light-emitting element 11 or the second light-emitting element 12 is controlled to emit light, one of the first light-emitting element 11 and the second light-emitting element 12 can be used as the main light-emitting element, and the other can be used as a backup light-emitting element, thereby not only achieving the adjustment of different brightness, but also improving the service life of the light-emitting device and reducing the frequency of replacement; when the wavelengths of the light emitted by the first light-emitting element 11 and the second light-emitting element 12 are different, thereby providing a light-emitting device capable of achieving two-color light-emitting, which is suitable for a variety of different scenarios and has a wide range of applications.

[0036] The above-mentioned light-emitting device can be applied to, but not limited to, a reflective sight, and can also be applied to a lamp or light-emitting device with multi-brightness adjustment or dual-color or multi-color adjustment.

[0037] The following description will be made by taking the application of the light emitting device in a reflective sight as an example.

[0038] When the light emitting device is applied to a reflective sight, the aperture 201 of the aperture is located at the focus (f in 3 in the figure) of the reflective lens 30 of the reflective sight. The light emitted by the light emitting device is irradiated to the reflective lens 30, and after being converged and reflected by the reflective surface 301 of the reflective lens 30, it enters the human eye in the form of parallel light and forms an image on the retina. The light path diagram is as follows: Figure 3 As shown. Among them, Figure 3 F in refers to the focal length of the reflecting lens 30 . Figure 3 The positional relationship between the reflective lens 30, the focus and the focal length is only given as an example.

[0039] In some embodiments, the wavelength of the first light signal and the second light signal is the same. For example, the central wavelength of the first light signal and the second light signal is 650nm, that is, the first light signal and the second light signal are red light, or the central wavelength of the first light signal and the second light signal is 525nmnm, that is, the first light signal and the second light signal are green light. In this way, by controlling the switching of the first light-emitting element 11 and the second light-emitting element 12, a point light source with different brightness adjustments of red light or green light can be provided for the reflective sight.

[0040] In other embodiments, the wavelengths of the first light signal and the second light signal are different. For example, the central wavelength of the first light signal is 650nm, that is, the first light signal is red light, and the central wavelength of the second light signal is 525nmnm, that is, the second light signal is green light. In this way, by controlling the switching of the first light-emitting element 11 and the second light-emitting element 12, a point light source with different color adjustments of red light and green light can be provided for the reflective sight.

[0041] In summary, when the light-emitting device of the present application is used in a reflective sight, if the wavelengths of the first light signal and the second light signal are the same, the light-emitting device can be used as a point light source for the reflective sight that can achieve multiple brightness adjustments; if the wavelengths of the first light signal and the second light signal are different, for example, the first light-emitting element 11 emits red light, and the second light-emitting element 12 emits green light, it can be used as a point light source for the reflective sight that can adjust both red and green light in different colors by switching the switches of the first light-emitting element 11 and the second light-emitting element 12. In this way, the user can buy one less set of reflective sights of other colors, and also avoid the calibration operation caused by replacing the reflective sight, which brings great convenience to the user.

[0042] like Figure 1~Figure 4As shown, a transparent encapsulation layer 15 is provided on the first substrate 10, and the transparent encapsulation layer 15 is located on the light emitting side of the first light emitting element 11 and the second light emitting element 12. The orthographic projection of the transparent encapsulation layer 15 on the first substrate 10 completely covers the first substrate 10, and the aperture is fixed on the side of the transparent encapsulation layer 15 away from the first substrate 10, that is, the aperture is fixed on the transparent encapsulation layer 15.

[0043] The transparent encapsulation layer 15 is formed of a transparent protective adhesive, so that the transparent encapsulation layer 15 has a high transparency. For example, the transparent encapsulation layer 15 can be made of epoxy resin.

[0044] By providing a transparent encapsulation layer 15 on the first substrate 10, that is, providing a transparent encapsulation layer 15 on the top surface of the first substrate 10, the orthographic projection of the transparent encapsulation layer 15 on the first substrate 10 completely covers the first substrate 10, so that the first light-emitting element 11, the second light-emitting element 12, the first bonding wire 13 and the second bonding wire 14 can be completely covered to form an effective sealing layer, that is, the light-emitting device is encapsulated as a whole, and the influence of external factors on the internal structure and circuit of the first light-emitting element 11, the second light-emitting element 12 and other components on the first substrate 10 is blocked, which is conducive to improving the reliability and durability of the operation of the light-emitting device. In addition, the aperture is directly fixed on the transparent encapsulation layer 15, so that on the basis of the aperture being firmly connected to the first substrate 10, there is no need to provide other adhesive layers for fixing the aperture, which is conducive to reducing the thickness of the light-emitting device. In addition, the processing process is simple and the cost is low.

[0045] It should be noted that, after many tests, the spacing distance t between the first light-emitting element 11 and the second light-emitting element 12 in the first direction can be 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns... 19 microns, 20 microns,... 25 microns,... 30 microns,... 35 microns,... 40 microns,... 45 microns,... 50 microns.

[0046] In the design process of the reflective sight, the position of the light hole 201 of the aperture and the diameter of the light hole 201 are also relatively important parameters.

[0047] When the diameter of the light hole 201 is small, it is not conducive to the passage of light, so that the aiming point seen by the user is not obvious, and the user experience is poor; when the diameter of the light hole 201 is large, the range of the aiming point is large. Under the condition of the same light passing through, the aiming positioning accuracy is low, and it is easy to aim incorrectly. After many practices, it is found that when the diameter of the light hole 201 can be 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13, microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns, 20 microns, ... 30 microns, ... 40 microns, ... 50 microns, ... 60 microns, ... 70 microns, ... 80 microns, etc., when it meets 5 microns to 80 microns, the aiming point meets the optical requirements.

[0048] Figure 3 The diameter of the light hole 201 shown is larger than the spacing t between the first light emitting element 11 and the second light emitting element 12 in the first direction, thus further ensuring that the first light emitting element 11 and the second light emitting element 12 are emitted through the light hole 201 as much as possible, thereby improving the brightness of the aiming point.

[0049] like Figure 1 As shown, in some embodiments, the first light-emitting element 11 is welded to the first substrate 10 through the first bonding wire 13, and the second light-emitting element 12 is welded to the first substrate 10 through the second bonding wire 14. A protective glue is also provided on the first substrate 10, and the protective glue is used to completely cover the first bonding wire 13, the second bonding wire 14, and the welding points at both ends of the first bonding wire 13 and the second bonding wire 14.

[0050] Through the above arrangement, the protective glue can completely cover the first bonding wire 13, the second bonding wire 14 and the welding points at both ends of the first bonding wire 13 and the second bonding wire 14. In this way, the influence of dust and impurities on the first bonding wire 13 and the second bonding wire 14 is avoided, which is beneficial to improving the reliability of the light-emitting device.

[0051] like Figure 1 As shown, a first substrate 10 is provided with a first solder joint 1 and a second solder joint 2 on one side of a solid crystal region 101, the first solder joint 1 and the second solder joint 2 are located outside the solid crystal region 101, a third solder joint 3 corresponding to the first solder joint 1 is provided on the first light-emitting element 11, and a fourth solder joint 4 corresponding to the second solder joint 2 is provided on the second light-emitting element 12; one end of a first bonding wire 13 is welded to the first solder joint 1, and the other end is welded to the third solder joint 3; one end of a second bonding wire 14 is welded to the second solder joint 2, and the other end is welded to the fourth solder joint 4.

[0052] Through the above arrangement, the arrangement of the solder joints is staggered with the arrangement of the two light-emitting elements, which not only facilitates the electrical connection between the two light-emitting elements and the first substrate 10, but also helps to improve the space utilization of the electrical elements on the first substrate 10, thereby facilitating the miniaturization of the light-emitting device.

[0053] Specifically, when the first light-emitting element 11 and the second light-emitting element 12 are both dual-electrode chips, the first light-emitting element 11 and the second light-emitting element 12 are electrically connected to the first substrate 10 as follows: Figure 1 As shown. The first light emitting element 11 is in the second direction ( Figure 1 The second light emitting element 12 has a third solder joint 3 at both ends in the second direction, the number of the first solder joint 1 is two, and the two first solder joints 1 correspond to the two third solder joints 3 in a one-to-one manner; the second light emitting element 12 has a fourth solder joint 4 at both ends in the second direction, the number of the second solder joint 2 is two, and the two second solder joints 2 correspond to the two fourth solder joints 4 in a one-to-one manner; in the second direction, ... Figure 1 A first welding spot 1 and a second welding spot 2 are an integral structure, that is, located at Figure 1 A first solder joint 1 and a second solder joint 2 above the die-bonding region 101 share a solder joint, which can be used as the positive electrode of the light-emitting device; Figure 1 Another first welding point 1 and another second welding point 2 are arranged at intervals, that is, located at Figure 1 Another first welding point 1 below the solid crystal area 101 is used as the cathode of the first light-emitting element 11, and another second welding point 2 is used as the cathode of the second light-emitting element 12, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12; wherein the second direction, the first direction and the thickness direction of the substrate 100 are perpendicular to each other.

[0054] Through the above arrangement, the number of solder joints is reduced, the positioning accuracy and soldering difficulty of the first light emitting element 11 and the second light emitting element 12 and the first solder joint 1 and the second solder joint 2 are lowered, and soldering is facilitated.

[0055] When the first light emitting element 11 is a dual-electrode chip and the second light emitting element 12 is a single-electrode chip, the electrical connection between the first light emitting element 11 and the second light emitting element 12 and the first substrate 10 is as follows: Figure 5 shown.

[0056] exist Figure 5 The light emitting device shown is Figure 1The main difference of the light-emitting device shown is that the second light-emitting element 12 is a single-electrode chip. In this case, one of the fourth solder joints 4 corresponding to the two second solder joints 2 is arranged on the second light-emitting element 12, and the other fourth solder joint 4 is arranged in the die-bonding area 101, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. Figure 5 Other structures in the light emitting device shown are as follows Figure 1 The light emitting devices shown are the same and will not be described again.

[0057] When the first light emitting element 11 and the second light emitting element 12 are both single-electrode chips, there are two different ways to electrically connect the first light emitting element 11 and the second light emitting element 12 to the first substrate 10, such as Figure 6 and Figure 7 shown.

[0058] exist Figure 6 The light emitting device shown is Figure 1 The main difference between the light-emitting device shown is that the first light-emitting element 11 and the second light-emitting element 12 are single-electrode chips. At this time, one of the third solder joints 3 corresponding to the two first solder joints 1 is arranged on the first light-emitting element 11, and the other third solder joint 3 is arranged in the solid crystal area 101; one of the fourth solder joints 4 corresponding to the two second solder joints 2 is arranged on the second light-emitting element 12, and the other fourth solder joint 4 is arranged in the solid crystal area 101. Since a third solder joint 3 and a fourth solder joint 4 need to be arranged on the solid crystal area 101, the two first solder joints 1 and the two second solder joints 2 arranged on the first substrate 10 are arranged in pairs, so as to realize the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. Figure 6 Other structures in the light emitting device shown are as follows Figure 1 The light emitting devices shown are the same and will not be described again.

[0059] exist Figure 7 The light emitting device shown is Figure 6 The main difference of the light-emitting device shown is that the solid crystal region 101 is divided into two, that is, the solid crystal region 101 includes a first region 101a connected to the first light-emitting element 11 and a second region 101b connected to the second light-emitting element 12, and the first region 101a and the second region 101b are spaced apart along the first direction, so that a first solder joint 1 on one side of the first region 101a of the solid crystal region 101 and a second solder joint 2 on the same side of the second region 101b are an integrated structure, and another first solder joint 1 on the other side of the first region 101a of the solid crystal region 101 and another second solder joint 2 on the same side of the second region 101b are spaced apart, so that the first light-emitting element 11 and the second light-emitting element 12 are connected in parallel. Figure 7 Other structures in the light emitting device shown are as follows Figure 1 The light emitting devices shown are the same and will not be described again.

[0060] like Figure 1 , Figure 3 and Figure 4 As shown, the embodiment of the present application further provides a reflective sight, comprising: a reflective lens 30 and a light emitting device. The light hole 201 of the aperture in the light emitting device is located at the focus of the reflective lens 30.

[0061] By placing the aperture 201 of the aperture at the focus of the reflective lens 30 of the reflective sight, Figure 3 As shown, in this way, the reflective sight can emit aiming points of different brightness or colors and switch freely. It is not only suitable for different application scenarios and has a wide range of applications, but also the user can buy one less set of reflective sights of other colors. It also eliminates the correction operation caused by replacing the reflective sight, which brings great convenience to the user.

[0062] In the design process of the reflective sight, the closer the center of the light hole 201 is to the focus of the reflective lens 30, the better the effect, until the center of the light hole 201 coincides with the focus of the reflective lens 30, the aiming effect is better.

[0063] The structure of the light emitting device in the reflective sight is the same as that in the above embodiment, and will not be described in detail here.

[0064] In order to further improve the reflection effect, the reflection surface 301 of the reflection lens 30 is provided with a high reflection film (not shown in the figure), and at the same time, an anti-reflection film is plated on the side of the reflection lens 30 away from the reflection surface 301. Figure 3 As shown, by setting a high-reflection film on the reflective surface 301 of the reflective lens 30, the utilization rate of the light energy irradiated by the light-emitting device on the reflective lens 30 is improved, the light energy loss in the reflection process is reduced, and the brightness of the aiming point is higher; the setting of the anti-reflection film further improves the transmittance of light, which is beneficial to take into account both the brightness of the aiming point and the accuracy of positioning.

[0065] The above-mentioned high-reflection film refers to an optical film with an increased reflective function. The working principle of the high-reflection film is based on thin film interference. When light is irradiated onto the film, the light will be reflected on the upper and lower surfaces of the film, and the two beams of reflected light will interfere with each other. By adjusting the thickness and refractive index of the film, the optical path difference of the two beams of reflected light can be made to meet specific conditions, thereby enhancing the reflectivity of a certain band. Specifically, the design of the high-reflection film allows the two beams of reflected light to interfere and add, thereby significantly improving the reflectivity.

[0066] In the process of designing the high-reflection film, the reflective surface 301 of the reflective lens 30 needs to be coated with high-reflection films of different wavelength ranges in a targeted manner. If the wavelengths of the first light signal emitted by the first light-emitting element 11 and the second light signal emitted by the second light-emitting element 12 are the same, the wavelength range of the high-reflection film is set with an error of plus or minus 10nm based on the center wavelength of the first light signal of the first light-emitting element 11. For example, when the center wavelength of the first light signal is 650nm, that is, the first light signal is red light, the wavelength requirement of the high-reflection film is to have a higher reflectivity within the wavelength range of 650nm±10nm and a higher transmittance outside the above wavelength range. If the wavelengths of the first light signal emitted by the first light-emitting element 11 and the second light signal emitted by the second light-emitting element 12 are different, the wavelength range of the high-reflection film needs to simultaneously meet the range of the center wavelengths of the above-mentioned first light signal and the second light signal. For example, when the central wavelength of the first optical signal is 650nm, that is, the first optical signal is red light, and when the central wavelength of the second optical signal is 525nm, that is, the second optical signal is green light, the wavelength requirement of the high reflective film is to have a high reflectivity within the wavelength range of 650nm±10nm and 525nm±10nm, and a high transmittance outside the above wavelength range, that is, the above two wavelength ranges are in an and relationship, and need to be satisfied at the same time. In this way, the first optical signal and the second optical signal emitted by the light-emitting device can be used as much as possible, and the brightness of the aiming point is higher, while at the same time, it does not affect the light of other bands passing through the reflective lens 30, and does not affect the user's observation of the target through the reflective lens 30.

[0067] The control and switching of the first light emitting element 11 and the second light emitting element 12 in the light source device of the above-mentioned reflective sight can be electrically controlled by using an electric key switch 42, or the user can realize manual control by rotating the knob switch 43.

[0068] like Figure 5 As shown, in some embodiments, the light-emitting device is electrically connected to a power supply 40 and a key switch 42 through a control unit 41 (MCU in FIG. 5 ), and the key switch 42 is used for the control unit 41 to control the opening and closing of the first light-emitting element 11 and the second light-emitting element 12 in the light-emitting device.

[0069] Through the above arrangement, the electric switching of the first light emitting element 11 and the second light emitting element 12 is realized, which is suitable for some scenarios where electric control operation is required to switch the light emitting device.

[0070] like Figure 6 As shown, in some embodiments, the light emitting device is connected to the power source 40 via a knob switch 43 , and the first light emitting element 11 and the second light emitting element 12 are turned on and off by rotating the knob switch 43 .

[0071] Through the above arrangement, the user can realize manual switching between the first light emitting element 11 and the second light emitting element 12 by rotating the knob switch 43 , which is suitable for some scenarios that require manual control operation to switch the light emitting device.

[0072] It should be noted that the light emitting device needs to have the following modes: the first light emitting element 11 is on, the first light emitting element 11 is off, the second light emitting element 12 is on, the second light emitting element 12 is off, the first light emitting element 11 is on and the second light emitting element 12 is on, the first light emitting element 11 is off and the second light emitting element 12 is on. Alternatively, only three modes are required: the first light emitting element 11 is on or the second light emitting element 12 is on, the first light emitting element 11 is off and the second light emitting element 12 is on.

[0073] The two control modes of the light emitting device can be selected according to different customer requirements or application scenarios, and are not specifically limited here.

[0074] like Figure 7~Figure 10 As shown, the embodiment of the present application also provides a method for preparing a light-emitting device, which is used to prepare the light-emitting device as in the above embodiment, and the preparation method comprises the following steps: Step S100 : an outer frame 200 and a cutting path 300 are arranged around the periphery of the substrate 100 , and a plurality of die-bonding regions 101 are arranged on the substrate 100 within the outer frame 200 .

[0075] The above-mentioned substrate 100 needs to be pre-processed, and a frame is processed on the substrate 100 instead of an expensive mold, so that an outer frame 200, a cutting path 300 and a plurality of array-arranged solid crystal areas 101 are set on the pre-processed substrate 100; the cutting path 300 includes de-scaled marks and numbers set at the outer edge of the substrate 100; that is, the substrate 100 in the present application is only provided with a large outer frame 200 on the periphery, and then a plurality of solid crystal areas 101 are set in the outer frame 200, so that the periphery of the fixed area is no longer provided with a frame structure, which effectively solves the problem of halo caused by the reflection of light of the light-emitting device by the frame, and effectively reduces the production cost of the light-emitting device.

[0076] like Figure 8 As shown, after step S100, step S200 is further included: arranging the first light emitting element 11 and the second light emitting element 12 along the first direction in each die-bonding region 101, and baking the die-bonding adhesive.

[0077] The first light emitting element 11 and the second light emitting element 12 are arranged in the first direction (horizontal direction in the figure) inside the die-bonding region 101 , and the spacing distance between the two adjacent sides of the first light emitting element 11 and the second light emitting element 12 in the first direction is 1 to 50 microns.

[0078] The above-mentioned bonding region 101 is provided with bonding adhesive, and the first light emitting element 11 and the second light emitting element 12 are arranged inside the bonding region 101, and the bonding adhesive is baked to melt the bonding adhesive, and then cooled and solidified, so that the first light emitting element 11 and the second light emitting element 12 are fixed inside the bonding region 101. Yes.

[0079] In some embodiments, the die bonding process in step S200 is performed using an ASM862 die bonding machine, and the die bonding baking process specifically includes the following two stages: The first stage of the bonding adhesive baking temperature is 140℃-150℃, and the first stage of the bonding adhesive baking time is 55-65min; The second stage of the die bonding baking temperature is 170° C.-180° C., and the second stage of the die bonding adhesive baking time is 235-245 min, so that the first light emitting element 11 and the second light emitting element 12 are fixed to the die bonding area 101 .

[0080] In summary, during the first stage of baking, at 150°C, after 1 hour of baking, the bonding glue can be effectively softened and initially flowed; in the second stage, at 180°C, after 240 minutes of baking, the first light-emitting element 11 and the second light-emitting element 12 can be fixed in the bonding area 101, thereby improving the bonding effect of the first light-emitting element 11 and the second light-emitting element 12.

[0081] like Figure 8~Figure 10 As shown, after step S200 , step S300 is further included: welding the first light-emitting element 11 to the substrate 100 through the first bonding wire 13 , and welding the second light-emitting element 12 to the substrate 100 through the second bonding wire 14 .

[0082] It should be noted that before the above step S300, step S110 is also included: setting a first welding point 1 and a second welding point 2 on the substrate 100, setting a third welding point 3 corresponding to the first welding point 1 on the first light-emitting element 11, and setting a fourth welding point 4 corresponding to the second welding point 2 on the second light-emitting element 12.

[0083] It should be noted that the above step S110 is aimed at Figure 1 The electrical connection between the first light emitting element 11 and the second light emitting element 12 and the first substrate 10 in the light emitting device shown in FIG. Figure 5~Figure 7 When the light emitting device is shown, it is only necessary to set the positions of one of the third welding point 3 and the fourth welding point 4 accordingly. The preparation steps are similar to step S110 and will not be described in detail here.

[0084] The above step S110 only needs to be set before step S300, and can be set between step S200 and step S300. Fig. 9It can also be set between step S100 and step S200, such as Fig.10 As shown. That is to say, after the solid crystal region 101 is set on the substrate 100, the positions of the first solder joint 1 and the second solder joint 2 are set, and then the first light-emitting element 11 and the second light-emitting element 12 are set in the solid crystal region 101 in combination with the positions of the first solder joint 1 and the second solder joint 2, and finally the third solder joint 3 is set on the first light-emitting element 11 and the fourth solder joint 4 is set on the second light-emitting element 12; or after the solid crystal region 101 is set on the substrate 100, the first light-emitting element 11 and the second light-emitting element 12 are first set in the solid crystal region 101, and then the first solder joint 1 and the second solder joint 2 are set outside the solid crystal region 101 of the substrate 100 according to the positions of the first light-emitting element 11 and the second light-emitting element 12, and the positions of the third solder joint 3 on the first light-emitting element 11 and the fourth solder joint 4 on the second light-emitting element 12. It is only necessary to complete step S110 before step S300, and the specific details are not specifically limited here.

[0085] On this basis, in the above step S300 , the first light emitting element 11 is welded to the substrate 100 via the first bonding wire 13 , and the second light emitting element 12 is welded to the substrate 100 via the second bonding wire 14 .

[0086] In some embodiments, the above step S300 specifically includes: S310: welding one end of the first bonding wire 13 to the first welding point 1 and the other end to the third welding point 3; S320: welding one end of the second bonding wire 14 to the second welding point 2 and the other end to the fourth welding point 4.

[0087] It should be noted that the structures obtained after step S310 and step S320 are the same, and there is no requirement for the order of step S310 and step S320.

[0088] like Figure 8 As shown, after step S300, step S400 is further included: applying wire protection glue on the first bonding wire 13 and the second bonding wire 14 and drying them.

[0089] In the preparation process of the above step S400, wire protection glue is not only required to be applied on the first bonding wire 13 and the second bonding wire 14, but also required to be applied on the first solder joint 1, the second solder joint 2, the third solder joint 3 and the fourth solder joint 4, so as to protect the first bonding wire 13 and the second bonding wire 14.

[0090] It should be noted that the above-mentioned wire protection glue is light-absorbing glue.

[0091] like Figure 8As shown, after step S400 , the process further includes step S500 : injecting transparent protective glue into the outer frame 200 and drying it to obtain a transparent encapsulation layer 15 .

[0092] In some embodiments, the above step S500 specifically includes: injecting transparent protective glue into the outer frame 200 until the transparent protective glue covers the substrate 100 , and then drying the transparent protective glue to form a transparent encapsulation layer 15 .

[0093] When drying the transparent protective glue, it is not dried directly at one time, but needs to be dried multiple times in three stages. Specifically: In the first stage of drying, the drying temperature is controlled at 75℃-80℃, and the drying time is controlled at 28min-32min (specifically 30min); In the second stage, the drying temperature is controlled at 125℃-130℃ and the drying time is controlled at 28min-32min. In the third stage of drying, the drying temperature is controlled at 145°C-150°C, and the drying time is controlled at 235min-245min.

[0094] In summary, in the first stage of drying, at 80°C, after 30 minutes of drying, the solid crystal glue can be effectively softened and initially flowed; the second stage of drying, at 130°C, after 30 minutes of drying, and the third stage of drying, at 150°C, after 240 minutes of drying, through the above three stages of drying, it can be ensured that the transparent protective glue is effectively melted on the basis of drying the moisture of the transparent protective glue, so that the transparent protective glue can be fully leveled and fully and evenly cover the first light-emitting element 11, the second light-emitting element 12 and other components on the substrate 100, thereby effectively controlling the thickness of the transparent encapsulation layer 15.

[0095] like Figure 8 As shown, after step S500 , step S600 is further included: an aperture is arranged outside the transparent encapsulation layer 15 , so that the orthographic projection of the light hole 201 of the aperture on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12 .

[0096] By arranging an aperture on the outside of the transparent encapsulation layer 15, the aperture can be directly fixed on the first substrate 10 through the transparent encapsulation layer 15. In this way, the aperture is firmly connected to the first substrate 10 without the need to arrange other layers, which is beneficial to reducing the thickness of the light-emitting device. In addition, the processing process is simple and the cost is low.

[0097] like Figure 8 As shown, after step S600, step S700 is further included: cutting along the cutting road 300 to obtain a light-emitting device.

[0098] During cutting, the cutting path 300 is pre-set, thereby effectively avoiding damage to the structure of the light emitting device during cutting. While solving the halo problem, the structural integrity of the light emitting device and the cutting efficiency are guaranteed.

[0099] The light-emitting device obtained through the above preparation process, by setting an outer frame 200 and a cutting path 300 around the periphery of the substrate 100, not only eliminates the frame corresponding to each solid crystal area 101, avoids the use of molds, and reduces costs; moreover, the finished light-emitting device no longer has a frame. When the light-emitting device of the product is used for a reflective sight, it effectively avoids the problem of halo appearing on the periphery of the light source caused by the light reflected by the frame, thereby improving the aiming accuracy of the reflective sight. In addition, transparent protective glue is directly injected into the outer frame 200, and all glue application can be completed in one injection, without the need to use expensive special molds for sealing, which further reduces the production cost of the finished light-emitting device and greatly improves the production and preparation efficiency of the light-emitting device.

[0100] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A light emitting device for a reflective sight, characterized in that: include: A first substrate (10) comprising a crystal bonding area (101); A first light-emitting element (11) is arranged inside the die-bonding region (101), and the first light-emitting element (11) is electrically connected to the first substrate (10); a second light-emitting element (12) disposed inside the die-bonding region (101), the second light-emitting element (12) being electrically connected to the first substrate (10) so that the second light-emitting element (12) and the first light-emitting element (11) are connected in parallel; the second light-emitting element (12) and the first light-emitting element (11) are arranged along a first direction, and in the first direction, a distance between a side of the first light-emitting element (11) close to the second light-emitting element (12) and the second light-emitting element (12) is 1 to 50 micrometers; an aperture, arranged on the light-emitting side of the first light-emitting element (11) and the second light-emitting element (12), the orthographic projection of the light-through hole (201) of the aperture on the first substrate (10) being located at the adjacent center of the first light-emitting element (11) and the second light-emitting element (12), so that the light emitted by the first light-emitting element (11) and the second light-emitting element (12) can all pass through; Wherein, the first direction is perpendicular to the thickness direction of the first substrate (10).

2. The light emitting device according to claim 1, characterized in that: The first light emitting element (11) is capable of emitting a first light signal, and the second light emitting element (12) is capable of emitting a second light signal, wherein the wavelength of the second light signal is different from the wavelength of the first light signal.

3. The light emitting device according to claim 1, characterized in that: The light-through hole (201) is a circular hole, and the diameter of the light-through hole (201) is 5 micrometers to 80 micrometers.

4. The light emitting device according to claim 1, characterized in that: The first light-emitting element (11) is welded to the first substrate (10) via a first bonding wire (13), and the second light-emitting element (12) is welded to the first substrate (10) via a second bonding wire (14). A protective adhesive is also provided on the first substrate (10), and the protective adhesive is used to completely cover the welding points of the first bonding wire (13), the second bonding wire (14), and the welding points at both ends of the first bonding wire (13) and the second bonding wire (14).

5. The light emitting device according to claim 4, characterized in that: The first light-emitting element (11) comprises a first LED chip, and the first LED chip is a single-electrode chip or a double-electrode chip; The second light-emitting element (12) comprises a second LED chip, and the second LED chip is a single-electrode chip or a double-electrode chip.

6. The light emitting device according to claim 5, characterized in that: The first substrate (10) is provided with two first welding points (1) and two second welding points (2), wherein the first welding points (1) and the second welding points (2) are located outside the die-bonding area (101); One of the third welding points (3) corresponding to the two first welding points (1) is arranged on the first light-emitting element (11) and the other of the third welding points (3) is arranged on the die-bonding area, or the two third welding points (3) corresponding to the two first welding points (1) are both arranged on the first light-emitting element (11); One of the fourth welding points (4) corresponding to the two second welding points (2) is arranged on the second light-emitting element (12), and the other of the fourth welding points (4) is arranged on the die-bonding region, or the two fourth welding points (4) corresponding to the two second welding points (2) are arranged on the second light-emitting element (12); One end of the first bonding wire (13) is welded to the first welding point (1), and the other end is welded to the third welding point (3); one end of the second bonding wire (14) is welded to the second welding point (2), and the other end is welded to the fourth welding point (4).

7. The light emitting device according to claim 6, characterized in that: In the second direction, one of the first welding points (1) and one of the second welding points (2) located on one side of the crystal bonding area are an integrated structure; another of the first welding points (1) and another of the second welding points (2) located on the other side of the crystal bonding area are arranged at intervals; The second direction, the first direction and the thickness direction of the first substrate are perpendicular to each other.

8. The light emitting device according to any one of claims 1 to 7, characterized in that: A transparent encapsulation layer (15) is provided on the first substrate (10), the transparent encapsulation layer (15) is located on the light-emitting sides of the first light-emitting element (11) and the second light-emitting element (12), and the orthographic projection of the transparent encapsulation layer (15) on the first substrate (10) completely covers the first substrate (10); the aperture is fixed on a side of the transparent encapsulation layer (15) away from the first substrate (10).

9. A reflex sight, characterized in that: include: A reflecting lens (30) and a light-emitting device as claimed in any one of claims 1 to 8, wherein the light-through hole (201) of the aperture in the light-emitting device is located at the focus of the reflecting lens (30).

10. The reflex sight according to claim 9, characterized in that: The light-through hole (201) is a circular hole, the center of the light-through hole (201) coincides with the focus of the reflective lens (30), and / or the reflective surface (301) of the reflective lens (30) is provided with a high-reflective film.

11. The reflex sight according to claim 9 or 10, characterized in that: The light-emitting device is electrically connected to a power source (40) and a key switch (42) via a control unit (41); the key switch (42) is used to control the turning on and off of at least one of the first light-emitting element (11) and the second light-emitting element (12) in the light-emitting device; Alternatively, the light emitting device is connected to a power source (40) via a rotary switch (43), and at least one of the first light emitting element (11) and the second light emitting element (12) is turned on and off by rotating the rotary switch (43).

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