A test fixture for half-bridge power module

Abstract

The present invention discloses a test fixture for a half-bridge power module, comprising a fixture shell, a top cover for placing the power module, and a temperature regulating mechanism located in the fixture shell, wherein the temperature regulating mechanism comprises a semiconductor refrigeration plate, a first docking plate is fixed to the cold end of the semiconductor refrigeration plate, a first heat conducting plate is fixed to the hot end of the semiconductor refrigeration plate, the first heat conducting plate is in contact with a plurality of first heat conducting fins distributed at equal intervals, the first heat conducting fins and the second heat conducting plate are an integrated structure, the second heat conducting plate is fixedly connected to the second docking plate, and the first docking plate and the second docking plate are used to cool and heat the power module. The test fixture for a half-bridge power module of the present invention can make full use of the cold air and heat generated by the semiconductor refrigeration plate, avoid the waste of cold air and heat, and at the same time can reduce the energy consumption during the test, which is conducive to energy conservation and emission reduction.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing, and in particular to a testing tool for a half-bridge power module. Background Art

[0002] In the field of power electronics, the half-bridge power module is an extremely important circuit module, which is widely used in many power conversion and control scenarios. As the performance requirements of electronic equipment for power modules continue to increase, ensuring the reliability of half-bridge power modules has become a key link. Therefore, after the packaging is completed, the power module must be fully and accurately tested with the help of special test tools, among which the reliability of the bonding wire and chip welding and the reliability of the chip and base plate DBC welding are particularly important.

[0003] In the prior art, in order to meet the test requirements, it is usually necessary to heat up and cool down the power module to simulate different working environment conditions. For example, the power switch module test fixture with publication number CN117805571A, by setting up a hot and cold mechanism, realizes the rapid heating and cooling of the switch module to a certain extent, and can meet the large shell temperature difference test requirements required by the chip and the baseboard DBC, thereby significantly shortening the test time and improving the verification efficiency and verification effect.

[0004] However, the existing technology has exposed many shortcomings in the actual application process. In terms of heating and cooling mechanisms, when faced with the continuous testing needs of multiple power modules, frequent switching of the cooling and heating states of the hot and cold plates has become an inevitable operation. At this time, traditional test fixtures have serious energy waste problems. Specifically, after the test is completed, the cold air of the hot and cold plates is directly consumed by the heating plate, and the heat is taken away by the cooling water in the water tank. These heat and cold air are not effectively reused and are directly wasted.

[0005] In addition, from the perspective of energy consumption, the process of cooling the hot and cold plates from high temperature to low temperature, or heating from low temperature to high temperature in traditional test fixtures requires a lot of energy. This not only increases the test cost, but also does not conform to the current development trend of energy conservation and emission reduction, and creates an unnecessary energy burden on the environment. In summary, the existing half-bridge power module test fixture technology has obvious defects in energy utilization efficiency and energy consumption control. A more efficient and energy-saving test fixture is urgently needed to solve these problems in order to meet the requirements of the evolving power electronics technology for power module testing. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0007] Therefore, an object of the present invention is to provide a test tool for a half-bridge power module, comprising a tool housing, a top cover for placing the power module, and a temperature regulating mechanism located in the tool housing.

[0008] A group of electric push rods are fixed on the inner wall of the tooling housing, and the output ends of the electric push rods are fixedly connected to the bottom wall of the top cover.

[0009] The temperature regulating mechanism includes a semiconductor refrigeration plate, a first docking plate is fixed to the cold end of the semiconductor refrigeration plate, a first heat conducting plate is fixed to the hot end of the semiconductor refrigeration plate, the first heat conducting plate is in contact with a plurality of first heat conducting fins distributed equidistantly, the first heat conducting fins and the second heat conducting plate are an integrated structure, the second heat conducting plate is fixedly connected to the second docking plate, and the first docking plate and the second docking plate are used to cool down and heat up the power module.

[0010] A first through groove for the first docking plate and the second docking plate to penetrate is opened at the center of the top cover, and the first docking plate and the second docking plate are docked through a group of side plates. A rotating column passes through the side plate, and the rotating column passes through the vertical plate and is movably connected to the vertical plate bearing.

[0011] The vertical plate is fixed on the inner wall of the tooling shell, and a water cooling mechanism for dissipating heat from the first heat-conducting fins is arranged inside the tooling shell.

[0012] As the preferred technical solution:

[0013] In the test fixture for a half-bridge power module as described above, the top cover wall around the first through slot is provided with a plurality of threaded holes distributed in a rectangular array, and limiting bolts for fixing the power module are screwed into the threaded holes.

[0014] Through the above technical solution, the provision of multiple threaded holes makes it possible to place power modules of different sizes at the first through groove. By selecting suitable threaded holes around the power module and screwing limiting bolts into the threaded holes, the heads of the limiting bolts can contact the housing of the power module, thereby fixing and limiting the power module, avoiding displacement during testing and ensuring the test effect.

[0015] In the test fixture for a half-bridge power module as described above, two vertical plates are symmetrically arranged about the fixture housing, an electric motor is bolted to the side wall of the vertical plate, and the electric motor is connected to the rotating column by gear transmission.

[0016] The top wall of the vertical plate extends downward to form a plurality of holes and slots, and a first guide column is inserted into the hole and slot, and the top end of the first guide column is fixedly connected to the top cover.

[0017] Through the above technical solution, gears are provided on the output shaft of the electric motor and the rotating column. In this way, after the electric motor is powered on, the rotating column can be driven to rotate axially through gear transmission, and then the rotating column can drive the first docking plate and the second docking plate to flip through the side plate.

[0018] In the test fixture for a half-bridge power module as described above, the first docking plate, the second docking plate, the first heat conducting plate, the second heat conducting plate and the first heat conducting fin are all made of brass, the second docking plate is a hollow structure, and an electric heating wire is welded and fixed on the inner wall of the second docking plate.

[0019] Through the above technical solution, for conventional semiconductor refrigeration plates, the maximum temperature of the hot end is roughly between 40°C and 80°C, so that the heat transferred from the hot end to the second docking plate is within this temperature range. If the temperature on the second docking plate is not enough to meet the test requirements of the power module, the electric heating wire can be started to heat the second docking plate for the second time. Since the second docking plate itself already has a certain temperature during heating, the energy consumption of the electric heating wire can be reduced.

[0020] In the test fixture for a half-bridge power module as described above, the side plate is made of plastic or ceramic, the side plate and the second docking plate are fixedly bonded, and the side plate and the rotating column are fixedly bonded.

[0021] Through the above technical solution, the plastic or ceramic has a certain strength, and the thermal conductivity of the plastic or ceramic is poor, which can greatly reduce the heat transfer between the first docking plate and the second docking plate.

[0022] The fixed bonding connection mode enables the rotating column to drive the side plate to rotate, and the side plate can drive the first docking plate and the second docking plate to rotate synchronously, and the structure is reasonable.

[0023] As described above, in a test fixture for a half-bridge power module, an end wall of the side plate close to the first docking plate is provided with equidistantly distributed cavities, a piston is arranged in the cavity, and one end of the piston is connected to the bottom wall of the cavity through an elastic spring.

[0024] A plurality of second guide columns distributed equidistantly are vertically welded to the bottom surfaces on both sides of the first docking plate, and one end of the second guide column extends into the cavity and is connected to the piston.

[0025] Through the above technical solution, the second guide column can slide on the side plate through the piston, so that the first docking plate and the side plate are not fixedly connected. When the first docking plate is flipped downward, the first docking plate will move downward under the action of its own weight.

[0026] As described above, a test fixture for a half-bridge power module, the water cooling mechanism includes a water tank fixed in the fixture shell, a heat dissipation pipe passing through the first heat-conducting fin, and a water outlet pipe and a water return pipe connected to the water tank, and both ends of the heat dissipation pipe are connected to the butt pipe through a hollow connecting strip, and the butt pipe passes through a hollow rotating column.

[0027] The water cooling mechanism also includes two guide hole grooves symmetrically opened in the top cover, and the two open ends of the guide hole grooves are connected to the bottom surface of the top cover. One of the open ends of the two guide hole grooves is sealed and bonded to the top of the connecting pipe, and the other open ends of the two guide hole grooves are respectively connected to the water outlet end of the water outlet pipe and the water inlet end of the return pipe.

[0028] Through the above technical scheme, the water outlet pipe can be connected to the connecting pipe by means of the guide hole groove, and the water return pipe can also be connected to the connecting pipe by means of the guide hole groove. In this way, the water outlet pipe, the water return pipe, the butt joint pipe, the heat dissipation pipe and the connecting strip can be connected through the two sets of guide hole grooves and the connecting pipe. A water pump is arranged on the water outlet pipe. After the water pump is powered on, the coolant can be pumped out and the coolant can be driven to circulate in the water outlet pipe, the water return pipe, the butt joint pipe, the heat dissipation pipe and the connecting strip. The structure is reasonable.

[0029] In the test fixture for a half-bridge power module as described above, the butt-joint pipe and one end of the heat dissipation pipe are sealed and bonded to the connecting strip, and a plurality of heat dissipation pipes are provided and are welded to the first heat conducting fins.

[0030] The butt joint pipe is bent at one end away from the connecting strip and extends into the bottom end of the connecting pipe. The bent end of the butt joint pipe, the water outlet end of the outlet pipe and the water inlet end of the return pipe are all fixedly bonded with rubber sealing rings, and a one-way valve is provided at the bent end of the butt joint pipe.

[0031] Through the above technical solution, the rubber sealing ring is provided so that the water outlet end of the water outlet pipe and the water inlet end of the water return pipe can be tightly sealed against the open end of the guide hole groove when inserted into the open end.

[0032] When the bent end of the butt-joint pipe is inserted into the bottom end of the connecting pipe, it can also be tightly sealed against the bottom end of the connecting pipe, so that the coolant will not leak during the circulation process.

[0033] In the test fixture for a half-bridge power module as described above, a second through groove is provided on the top surface of the water tank, a third heat conducting plate made of brass is embedded in the second through groove, the top surface of the third heat conducting plate protrudes from the top surface of the water tank, the side surface of the third heat conducting plate is fixedly bonded to the second through groove, a plurality of second heat conducting fins distributed equidistantly are integrally formed on the bottom surface of the third heat conducting plate, and the second heat conducting fins extend into the coolant inside the water tank.

[0034] Through the above technical solution, the coolant in the water tank can transfer heat to the second heat-conducting fins, the second heat-conducting fins can transfer heat to the third heat-conducting plate, and then conduct the heat to the surrounding air through the third heat-conducting plate, thereby achieving self-cooling of the coolant.

[0035] Compared with the prior art, the present invention has at least the following beneficial effects:

[0036] (1) The present invention provides a test fixture for a half-bridge power module, which is provided with a semiconductor refrigeration plate. The cold end of the semiconductor refrigeration plate can cool the first docking plate. During this process, the hot end of the semiconductor refrigeration plate will generate heat and transfer it to the second docking plate. When the first docking plate cools the power module, the second docking plate itself already has a certain amount of heat. When the power module needs to be heated, the heating energy consumption of the electric heating wire can be reduced. In addition, the first docking plate and the second docking plate can be rotated, and multiple power modules can be continuously tested by switching, which has a good use effect.

[0037] (2) A test fixture for a half-bridge power module of the present invention is provided with a first heat conducting plate, a second heat conducting plate and a first heat conducting fin, which are used to transfer the heat of the hot end of the semiconductor refrigeration plate to the second docking plate. When the temperature of the hot end of the semiconductor refrigeration plate is high, the water cooling mechanism can cool the hot end of the semiconductor refrigeration plate through the three to ensure the cooling effect of the semiconductor refrigeration plate.

[0038] When the second docking plate rotates upward and contacts the power module, the first docking plate will move downward under the action of its own weight and contact the heat conduction plate on the water tank, thereby absorbing the temperature of the coolant in the water tank, cooling the coolant and improving the subsequent cooling effect of the coolant.

[0039] (3) The test fixture for a half-bridge power module of the present invention can fully utilize the cold air and heat generated by the semiconductor refrigeration plate to avoid waste of cold air and heat. At the same time, it can reduce energy consumption during the test process, which is beneficial to energy conservation and emission reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0041] Figure 1 It is an internal front view of the power module of the present invention under a low temperature test environment;

[0042] Figure 2 This is an internal front view of the power module of the present invention under a high temperature test environment;

[0043] Figure 3 It is an internal front view after the top cover of the present invention is moved;

[0044] Figure 4 A three-dimensional diagram of the top cover of the present invention;

[0045] Figure 5 is a cross-sectional view of a second butt joint plate of the present invention;

[0046] Figure 6 A side longitudinal sectional view of a side panel of the present invention;

[0047] Figure 7 It is a three-dimensional diagram of the first heat conducting plate, the second heat conducting plate and the first heat conducting fin of the present invention;

[0048] Figure 8 For the present invention Figure 1 Enlarged view of point A in the middle;

[0049] Fig. 9 It is a three-dimensional diagram of the water tank and the third heat conducting plate of the present invention.

[0050] In the figure: 1. tooling shell; 2. top cover; 201. threaded hole; 202. first through groove; 203. limit bolt; 3. electric push rod; 4. vertical plate; 5. first guide column; 6. water tank; 601. second through groove; 602. third heat conduction plate; 603. second heat conduction fin; 7. water outlet pipe; 8. return pipe; 9. guide hole groove; 10. connecting pipe; 11. semiconductor refrigeration plate; 12. first docking plate; 13. second docking plate; 14. side plate; 15. first heat conduction plate; 16. second heat conduction plate; 17. first heat conduction fin; 18. heat dissipation pipe; 19. connecting strip; 20. rotating column; 21. docking pipe; 22. second guide column; 23. cavity; 24. piston; 25. elastic spring; 26. electric heating wire. DETAILED DESCRIPTION

[0051] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0052] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0053] like Figure 1-4 As shown, an embodiment of the present invention discloses a test tool for a half-bridge power module, including a tool housing 1 , a top cover 2 for placing the power module, and a temperature adjustment mechanism located in the tool housing 1 .

[0054] The temperature regulating mechanism includes a semiconductor refrigeration plate 11, a first docking plate 12 is fixed to the cold end of the semiconductor refrigeration plate 11, a first heat conducting plate 15 is fixed to the hot end of the semiconductor refrigeration plate 11, the first heat conducting plate 15 is in contact with a plurality of first heat conducting fins 17 distributed at equal intervals, the first heat conducting fins 17 and the second heat conducting plate 16 are an integrated structure, the second heat conducting plate 16 is fixedly connected to the second docking plate 13, and the first docking plate 12 and the second docking plate 13 are used to cool down and heat up the power module.

[0055] A first through slot 202 for the first docking plate 12 and the second docking plate 13 to penetrate is provided at the center of the top cover 2, and a plurality of threaded holes 201 distributed in a rectangular array are provided on the wall of the top cover 2 around the first through slot 202, and limiting bolts 203 for fixing the power module are screwed into the threaded holes 201.

[0056] The first docking plate 12 and the second docking plate 13 are docked via a set of side plates 14, a rotating column 20 penetrates the side plate 14, the rotating column 20 penetrates the vertical plate 4 and is movably connected to the vertical plate 4 bearing, two vertical plates 4 are symmetrically arranged about the tooling housing 1, an electric motor is bolted to the side wall of the vertical plate 4, and the electric motor and the rotating column 20 are connected by gear transmission.

[0057] When used for the first time, the first docking plate 12 is located in the first through groove 202 . When testing is required, the power module is placed on the top cover 2 , and the bottom of the power module is located in the first through groove 202 and can fit with the first docking plate 12 .

[0058] Then, the semiconductor refrigeration plate 11 is powered on and operated. The cold end of the semiconductor refrigeration plate 11 can cool the first docking plate 12, and the hot end of the semiconductor refrigeration plate 11 generates heat and transfers it to the second docking plate 13 through the first heat conducting plate 15, the second heat conducting plate 16 and the first heat conducting fin 17, so that the second docking plate 13 itself can reach a certain temperature.

[0059] The first heat conducting plate 15 can provide a low-temperature test environment for the power module to test the reliability of the power module during low-temperature operation. When the low-temperature test is completed, the electric push rod 3 is started, and the electric push rod 3 can push the top cover 2 upward. When the top cover 2 moves, it can drive the first guide column 5 to move synchronously. The first guide column 5 can move along the hole groove. The first guide column 5 cooperates with the hole groove to improve the movement accuracy of the top cover 2, ensuring that after the top cover 2 moves and resets, the first docking plate 12 or the second docking plate 13 can be accurately embedded in the first through groove 202.

[0060] Then, the electric motor drives the rotating column 20 to rotate axially, and the rotating column 20 drives the first docking plate 12 and the second docking plate 13 to flip 180° through the side plate 14. At this time, the second docking plate 13 faces upward and the first docking plate 12 faces downward. Finally, the electric push rod 3 drives the top cover 2 to reset, and the second docking plate 13 can be embedded in the first through groove 202 and contact the bottom of the power module. This can provide a high-temperature test environment for the power module, so as to test the reliability of the power module during high-temperature operation.

[0061] To continue testing, repeat the above steps.

[0062] like Figure 1 and Figure 5 As shown, the first docking plate 12 , the second docking plate 13 , the first heat conducting plate 15 , the second heat conducting plate 16 and the first heat conducting fin 17 are all made of brass. The second docking plate 13 is a hollow structure, and an electric heating wire 26 is welded and fixed on the inner wall of the second docking plate 13 .

[0063] The brass material design can improve the thermal conductivity of the first docking plate 12 and the second docking plate 13, so that the power module can be quickly placed in a low-temperature or high-temperature test environment.

[0064] Since the hot end temperature of the semiconductor refrigeration plate 11 cannot exceed the range of 40°C-80°C, the maximum temperature of the second docking plate 13 is also within this range. When the high temperature test environment of the power module is higher than this temperature range, it is necessary to start the electric heating wire 26 to heat the second docking plate 13 to a higher temperature.

[0065] like Figure 2 and Figure 6 As shown, the side plate 14 is made of plastic or ceramic, the side plate 14 and the second docking plate 13 are fixedly bonded, and the side plate 14 and the rotating column 20 are fixedly bonded.

[0066] An end wall of the side plate 14 close to the first docking plate 12 is provided with equidistantly distributed cavities 23 , a piston 24 is arranged in the cavity 23 , and one end of the piston 24 is connected to the bottom wall of the cavity 23 via an elastic spring 25 .

[0067] A plurality of second guide pillars 22 equidistantly distributed are vertically welded to the bottom surfaces of both sides of the first docking plate 12 . One end of the second guide pillar 22 extends into the cavity 23 and is connected to the piston 24 .

[0068] When the first docking plate 12 and the second docking plate 13 flip over 180 degrees, the first docking plate 12 faces downward, and under the action of gravity of the first docking plate 12 and the semiconductor refrigeration plate 11, the first docking plate 12 will move downward, and the second guide column 22 will move with it, and pull the piston 24 to move in the cavity 23, and the piston 24 will stretch the elastic spring 25 when moving.

[0069] After the first docking plate 12 moves, it will drive the first heat conducting plate 15 to move synchronously, and the first heat conducting plate 15 will be separated from the first heat conducting fin 17. In this way, when the electric heating wire 26 reheats the second docking plate 13, the heat on the second docking plate 13 will not be transferred to the semiconductor cooling plate 11 through the second heat conducting plate 16, the first heat conducting fin 17 and the first heat conducting plate 15, thereby avoiding the hot end of the semiconductor cooling plate 11 from being heated and affecting the subsequent cooling effect.

[0070] When the first docking plate 12 and the second docking plate 13 are flipped over 180 degrees again, the first docking plate 12 is facing upward again, and under the elastic force of the elastic spring 25, the first docking plate 12 is pulled back to its original position through the piston 24 and the second guide column 22.

[0071] like Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 As shown, the vertical plate 4 is fixed on the inner wall of the tooling shell 1 , and a water cooling mechanism for dissipating heat from the first heat-conducting fins 17 is arranged inside the tooling shell 1 .

[0072] The water cooling mechanism includes a water tank 6 fixed in the tooling shell 1, a heat dissipation pipe 18 passing through the first heat-conducting fin 17, and a water outlet pipe 7 and a water return pipe 8 connected to the water tank 6. Both ends of the heat dissipation pipe 18 are connected to the docking pipe 21 through a hollow connecting strip 19, and the docking pipe 21 passes through the hollow rotating column 20.

[0073] The water cooling mechanism also includes two guide hole grooves 9 symmetrically opened in the top cover 2, and the two open ends of the guide hole grooves 9 are connected to the bottom surface of the top cover 2. One of the open ends of the two guide hole grooves 9 is sealed and bonded to the top of the connecting pipe 10, and the other open ends of the two guide hole grooves 9 are respectively connected to the water outlet end of the water outlet pipe 7 and the water inlet end of the return pipe 8.

[0074] The butt-joint pipe 21 and one end of the heat dissipation pipe 18 are sealed and bonded to the connecting strip 19 . A plurality of heat dissipation pipes 18 are provided and are welded to the first heat conducting fins 17 .

[0075] The end of the butt joint 21 away from the connecting strip 19 is bent and extends into the bottom end of the connecting pipe 10. The bent end of the butt joint 21, the water outlet end of the outlet pipe 7 and the water inlet end of the return pipe 8 are all fixedly bonded with rubber sealing rings, and a one-way valve is provided at the bent end of the butt joint 21.

[0076] When the cold end of the semiconductor refrigeration film 11 is cooling the first docking plate 12, the hot end temperature of the semiconductor refrigeration film 11 will rise. When the hot end temperature of the semiconductor refrigeration film 11 does not exceed 40°C-80°C, the refrigeration effect of the semiconductor refrigeration film 11 will not be affected. When the temperature exceeds this temperature, the refrigeration effect of the semiconductor refrigeration film 11 will be greatly reduced. For this reason, it is necessary to start the water pump on the water outlet pipe 7, and the water pump pumps the coolant in the water tank 6 out, and pumps it into the docking pipe 21 through the guide hole groove 9 and the connecting pipe 10, and then diverts it to multiple heat dissipation pipes 18 through the connecting strip 19, and finally pumps it into the return pipe 8 through the connecting strip 19, the docking pipe 21, the guide hole groove 9 and the connecting pipe 10, so that the coolant can flow back to the water tank 6 again, realizing the circulation of the coolant.

[0077] When the coolant flows in the heat dissipation pipe 18 , the heat of the hot end of the semiconductor refrigeration plate 11 can be taken away through the first heat-conducting fins 17 and the second heat-conducting plate 16 , thereby cooling the hot end of the semiconductor refrigeration plate 11 .

[0078] The bent end of the butt-joint pipe 21 and the connecting pipe 10 are not fixedly connected, and the outlet end of the outlet pipe 7 and the inlet end of the return pipe 8 are not fixedly connected to the guide hole groove 9, which will not affect the movement of the top cover 2 and has a reasonable structure.

[0079] When the first docking plate 12 and the second docking plate 13 are flipped 180 degrees, when the first docking plate 12 faces downward, the bent end of the docking tube 21 also faces downward. Since a one-way valve is provided at the bent end of the docking tube 21, the coolant inside can be prevented from flowing back and causing waste.

[0080] like Fig. 9 As shown, a second through groove 601 is provided on the top surface of the water tank 6, and a third heat conducting plate 602 made of brass is embedded in the second through groove 601. The top surface of the third heat conducting plate 602 protrudes from the top surface of the water tank 6, and the side surface of the third heat conducting plate 602 is fixedly bonded to the second through groove 601. A plurality of second heat conducting fins 603 distributed equidistantly are integrally formed on the bottom surface of the third heat conducting plate 602, and the second heat conducting fins 603 extend into the coolant inside the water tank 6.

[0081] When the first docking plate 12 and the second docking plate 13 are flipped 180 degrees, the first docking plate 12 is facing downward and moves vertically downward. Since the top surface of the third heat conducting plate 602 is protruding, the third heat conducting plate 602 will contact the first docking plate 12. The temperature of the first docking plate 12 itself is relatively low. The heat of the coolant in the water tank 6 will be transferred to the first docking plate 12 through the second heat conducting fins 603 and the third heat conducting plate 602, thereby achieving cooling of the coolant. In this way, the low temperature on the first docking plate 12 can be fully utilized.

[0082] In the description of this specification, "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0084] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A test fixture for a half-bridge power module, comprising a fixture housing (1), a top cover (2) for placing the power module, and a temperature adjustment mechanism located in the fixture housing (1); characterized in that: A group of electric push rods (3) are fixed to the inner wall of the tool housing (1), and the output ends of the electric push rods (3) are fixedly connected to the bottom wall of the top cover (2); The temperature regulating mechanism comprises a semiconductor refrigeration plate (11), a first docking plate (12) being fixed to the cold end of the semiconductor refrigeration plate (11), a first heat conducting plate (15) being fixed to the hot end of the semiconductor refrigeration plate (11), the first heat conducting plate (15) being in contact with a plurality of first heat conducting fins (17) distributed at equal intervals, the first heat conducting fins (17) and the second heat conducting plate (16) being an integrated structure, the second heat conducting plate (16) being fixedly connected to the second docking plate (13), the first docking plate (12) and the second docking plate (13) being used for cooling and heating the power module; A first through slot (202) is provided at the center of the top cover (2) for the first docking plate (12) and the second docking plate (13) to penetrate therethrough; the first docking plate (12) and the second docking plate (13) are docked with each other via a set of side plates (14); a rotating column (20) penetrates the side plates (14); the rotating column (20) penetrates the vertical plate (4) and is movably connected to the vertical plate (4) bearing; The vertical plate (4) is fixed on the inner wall of the tool housing (1), and a water cooling mechanism for dissipating heat from the first heat conducting fins (17) is provided inside the tool housing (1); The rotating column (20) can drive the first butt joint plate (12) and the second butt joint plate (13) to flip via the side plate (14).

2. A test fixture for a half-bridge power module according to claim 1, characterized in that: The wall of the top cover (2) around the first through slot (202) is provided with a plurality of threaded holes (201) distributed in a rectangular array, and limiting bolts (203) for fixing the power module are screwed into the threaded holes (201).

3. The test fixture for a half-bridge power module according to claim 1, characterized in that: Two vertical plates (4) are symmetrically arranged with respect to the tooling housing (1); an electric motor is bolted to the side wall of the vertical plate (4); the electric motor is connected to the rotating column (20) via a gear transmission. The top wall of the vertical plate (4) extends downward to form a plurality of holes and slots, into which first guide columns (5) are inserted, and the top ends of the first guide columns (5) are fixedly connected to the top cover (2).

4. The test fixture for a half-bridge power module according to claim 1, characterized in that: The first docking plate (12), the second docking plate (13), the first heat conducting plate (15), the second heat conducting plate (16) and the first heat conducting fin (17) are all made of brass; the second docking plate (13) is a hollow structure; an electric heating wire (26) is welded and fixed to the inner wall of the second docking plate (13).

5. The test fixture for a half-bridge power module according to claim 1, characterized in that: The side plate (14) is made of plastic or ceramic material, the side plate (14) and the second docking plate (13) are fixedly bonded, and the side plate (14) and the rotating column (20) are fixedly bonded.

6. The test fixture for a half-bridge power module according to claim 1, characterized in that: An end wall of the side plate (14) close to the first docking plate (12) is provided with equidistantly distributed cavities (23), a piston (24) is arranged in the cavity (23), and one end of the piston (24) is connected to the bottom wall of the cavity (23) via an elastic spring (25); A plurality of second guide columns (22) distributed equidistantly are vertically welded to the bottom surfaces on both sides of the first docking plate (12), and one end of the second guide column (22) extends into the cavity (23) and is connected to the piston (24).

7. The test fixture for a half-bridge power module according to claim 1, characterized in that: The water cooling mechanism comprises a water tank (6) fixed in the tooling shell (1), a heat dissipation pipe (18) penetrating the first heat-conducting fin (17), and a water outlet pipe (7) and a water return pipe (8) connected to the water tank (6); both ends of the heat dissipation pipe (18) are connected to a butt pipe (21) via a hollow connecting strip (19); and the butt pipe (21) passes through a hollow rotating column (20).

8. The test fixture for a half-bridge power module according to claim 7, characterized in that: The water cooling mechanism further comprises two guide hole grooves (9) symmetrically arranged in the top cover (2), wherein both open ends of the guide hole grooves (9) are connected to the bottom surface of the top cover (2), one of the open ends of the two guide hole grooves (9) is sealed and bonded to the top of the connecting pipe (10), and the other open ends of the two guide hole grooves (9) are respectively connected to the water outlet end of the water outlet pipe (7) and the water inlet end of the return pipe (8).

9. A test fixture for a half-bridge power module according to claim 8, characterized in that: The butt-jointed pipe (21) and one end of the heat dissipation pipe (18) are both sealed and bonded to the connecting strip (19); the heat dissipation pipe (18) is provided with a plurality of heat dissipation pipes (18) and is welded to the first heat conducting fins (17); The end of the butt joint pipe (21) away from the connecting strip (19) is bent and extends into the bottom end of the connecting pipe (10); the bent end of the butt joint pipe (21), the water outlet end of the water outlet pipe (7) and the water inlet end of the water return pipe (8) are all fixedly bonded with a rubber sealing ring; and the bent end of the butt joint pipe (21) is provided with a one-way valve.

10. The test fixture for a half-bridge power module according to claim 7, characterized in that: The top surface of the water tank (6) is provided with a second through groove (601), a third heat conducting plate (602) made of brass is embedded in the second through groove (601), the top surface of the third heat conducting plate (602) protrudes from the top surface of the water tank (6), the side surface of the third heat conducting plate (602) is fixedly bonded to the second through groove (601), and the bottom surface of the third heat conducting plate (602) is integrally formed with a plurality of second heat conducting fins (603) distributed at equal intervals, and the second heat conducting fins (603) extend into the coolant inside the water tank (6).

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