A temperature control system and a temperature control method

Abstract

The application provides a temperature control system and a temperature control method. The system comprises a refrigeration device and a circulating device. The refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator and a supercooling liquid accumulator. The circulating device comprises a circulating liquid driving device and a heat exchanger. In the temperature rising process, the heat accumulator can be used to raise the temperature, so as to improve the temperature rising speed. The supercooling liquid accumulator can be used to store the supercooling treatment of the refrigerant, and can be used to lower the temperature in the temperature lowering process, so as to improve the temperature lowering speed. In the temperature rising and lowering process, the factory water of the heat exchanger can be used to pre-raise and lower the temperature of the circulating liquid, so as to further improve the temperature rising and lowering speed. In this way, the temperature rising and lowering waiting time can be reduced, the production efficiency can be improved, the energy can be saved, the cost can be reduced, and the equipment miniaturization is facilitated without increasing the power of the compressor, the condenser and the evaporator.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of control, in particular to a temperature control system and a temperature control method. BACKGROUND

[0002] As an important equipment in the process of semiconductor integrated circuit manufacturing, the semiconductor temperature control device is required to provide the required temperature output for controlling the temperature of the etching equipment process cavity in the etching process of integrated circuit manufacturing. The semiconductor temperature control device precisely controls the temperature through the refrigeration and heating links in actual use. The etching equipment process cavity needs different temperatures to meet the production process in the whole process, and the temperature is generally switched periodically within-20℃ to 90℃. Therefore, the semiconductor temperature control device needs to switch different temperatures according to the process requirements, and the corresponding process production can be carried out only when the process cavity temperature reaches the target value. In the temperature rising and falling process, there will be a waiting time. The waiting time is relatively long when using the traditional temperature control device to switch from high temperature to low temperature or from low temperature to high temperature, which affects the production efficiency. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a temperature control system and a temperature control method to solve the problem of long waiting time in temperature rising and falling of the existing temperature control equipment, which affects the production efficiency.

[0004] The embodiment of the present application provides a temperature control system, which comprises a refrigeration device and a circulating device; the refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator and a subcooled liquid accumulator; the circulating device comprises a circulating liquid driving device and a heat exchanger;

[0005] The outlet end of the first heat exchange channel in the evaporator is connected to the inlet end of the compressor; the outlet end of the compressor comprises two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator, and the second path is connected to the inlet end of the second heat exchange channel in the condenser and the inlet end of the first heat exchange channel in the evaporator together;

[0006] The outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the subcooled liquid accumulator, and the outlet end of the subcooled liquid accumulator is connected to the inlet end of the first heat exchange channel in the evaporator;

[0007] The outlet end of the second heat exchange channel in the evaporator is connected to the inlet end of the circulating liquid driving device; the outlet end of the circulating liquid driving device comprises four circuits, the first circuit connects the inlet end of the second heat exchange channel in the evaporator through the second heat exchange channel in the heat accumulator, the second circuit connects the inlet end of the second heat exchange channel in the evaporator through the second heat exchange channel in the heat accumulator and the second heat exchange channel in the heat accumulator in sequence, the third circuit connects the inlet end of the second heat exchange channel in the evaporator through the second heat exchange channel in the heat exchanger, and the fourth circuit connects the inlet end of the second heat exchange channel in the evaporator;

[0008] The heat accumulator stores heating energy, and the supercooling liquid reservoir performs supercooling treatment on the refrigerant; the first heat exchange channel in the heat exchanger exchanges heat with the circulating liquid in the second heat exchange channel; the temperature of the circulating liquid is adjusted by controlling the temperature rise and fall of the refrigerant in the refrigeration device and the temperature rise and fall of the circulating liquid by adjusting the on-off of the four circuits in the outlet end of the circulating liquid driving device, so that the circulating liquid controls the temperature of the load device.

[0009] Further, the circulating liquid driving device comprises a water tank, a water pump and a heater;

[0010] The inlet end of the water tank serves as the inlet end of the circulating liquid driving device, the outlet end of the water tank is connected to the inlet end of the water pump, the outlet end of the water pump is connected to the inlet end of the heater, the outlet end of the heater is connected to the corresponding liquid inlet of the load device, and the corresponding liquid outlet of the load device serves as the outlet end of the circulating liquid driving device.

[0011] Further, the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the external cooling pipeline of the supercooling liquid reservoir, and the inlet end of the external cooling pipeline is connected to the inlet end of the compressor;

[0012] The external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid reservoir and is used for cooling the coolant stored in the liquid storage space.

[0013] Further, the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator.

[0014] The application also provides a temperature control method, which is applied to the temperature control system as described above; the method comprises:

[0015] According to the received temperature regulation instruction of the load device, the valves on the pipelines in the temperature control system are controlled, so that the refrigerant in the refrigeration device is used to heat or cool the components in the temperature control system, and the four circuits included in the outlet end of the circulating liquid driving device are switched to adjust the heating or cooling link of the circulating liquid to adjust the temperature of the circulating liquid, so that the circulating liquid controls the temperature of the load device.

[0016] Further, the first path of the outlet end of the compressor is connected to the inlet end of the first heat exchange channel in the heat accumulator through the first valve; the second path of the outlet end of the compressor is connected to the outlet end of the first heat exchange channel in the heat accumulator through the second valve, and is commonly connected to the inlet end of the first heat exchange channel in the evaporator through the third valve; the outlet end of the subcooler is connected to the inlet end of the first heat exchange channel in the evaporator through the fourth valve; the outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the external cooling pipeline of the subcooler through the fifth valve; the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator through the sixth valve; the four pipelines included in the outlet end of the circulating liquid driving device are respectively provided with the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve;

[0017] According to the received temperature regulation instruction of the load device, the valves on the pipelines in the temperature control system are controlled, so that the refrigerant in the refrigeration device is used to heat or cool the components in the temperature control system, and the four circuits included in the outlet end of the circulating liquid driving device are switched to adjust the heating or cooling link of the circulating liquid to adjust the temperature of the circulating liquid, so that the circulating liquid controls the temperature of the load device.

[0018] When the temperature regulation instruction is a heating instruction, the first valve, the fourth valve and the sixth valve are closed, and the second valve and the third valve are opened;

[0019] According to the first circulating temperature of the outlet end of the circulating liquid driving device, the second circulating temperature of the inlet end of the second heat exchange channel in the heat exchanger, and the third circulating temperature of the outlet end of the second heat exchange channel in the heat accumulator, the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve are controlled.

[0020] Further, according to the first circulating temperature of the outlet end of the circulating liquid driving device, the second circulating temperature of the inlet end of the second heat exchange channel in the heat exchanger, and the third circulating temperature of the outlet end of the second heat exchange channel in the heat accumulator, the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve are controlled.

[0021] When the first temperature difference between the second circulating temperature and the first circulating temperature is greater than or equal to a first preset threshold, the first circulating valve, the third circulating valve and the fourth circulating valve are closed, and the second circulating valve is opened;

[0022] when the first temperature difference is less than the first preset threshold, closing the second circulating valve, the third circulating valve and the fourth circulating valve, and opening the second circulating valve;

[0023] when a third temperature difference between the third circulating temperature and the first circulating temperature is less than a second preset threshold, closing the first circulating valve, the second circulating valve and the third circulating valve, and opening the fourth circulating valve.

[0024] Further, the method further comprises:

[0025] when the temperature adjustment instruction is a cooling instruction, closing the second valve, the third valve and the sixth valve, and opening the first valve and the fourth valve;

[0026] controlling the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve according to a first circulating temperature at an outlet end of the circulating liquid driving device and a second circulating temperature at an inlet end of the second heat exchange passage in the heat exchanger.

[0027] Further, the method further comprises:

[0028] when a third temperature difference between the first circulating temperature and the second circulating temperature is greater than or equal to a third preset threshold, closing the first circulating valve, the second circulating valve and the fourth circulating valve, and opening the third circulating valve;

[0029] when the third temperature difference is less than the third preset threshold, closing the first circulating valve, the second circulating valve and the third circulating valve, and opening the fourth circulating valve.

[0030] Further, before controlling the valves in the temperature control system according to the received temperature adjustment instruction of the load device, the method further comprises:

[0031] after the temperature control system is started, entering a temperature control preparation stage and lasting for a predetermined time length, so that the heat accumulator stores heating energy, and the supercooling liquid accumulator performs supercooling treatment on the refrigerant and stores the refrigerant;

[0032] In the temperature control preparation stage, the second valve, the third valve, the fourth valve, the first circulation valve, the second circulation valve and the third circulation valve are closed, and the first valve and the fourth circulation valve are opened; and the opening degree of the sixth valve is adjusted according to the fourth circulation temperature of the inlet end of the circulation liquid driving device.

[0033] The embodiment of the present application further provides an electronic device, comprising a processor, a memory and a bus, the memory stores machine readable instructions executable by the processor, when the electronic device is running, the processor and the memory communicate through the bus, and the machine readable instructions are executed by the processor to perform the steps of the temperature control method.

[0034] The embodiment of the present application further provides a computer readable storage medium, the computer readable storage medium stores a computer program, and the computer program is executed by the processor to perform the steps of the temperature control method.

[0035] The temperature control system and the temperature control method provided by the embodiment of the present application can improve the temperature rising speed by using the heat accumulator to rise the temperature of the refrigerating device in the temperature rising process, can improve the temperature falling speed by using the supercooled liquid accumulator to fall the temperature of the refrigerating device in the temperature falling process, and can further improve the temperature rising and falling speed by using the heat exchanger to pre-raise and pre-fall the temperature of the circulation liquid in the temperature rising and falling process of the circulation device. Therefore, the temperature rising and falling waiting time can be reduced, the production efficiency can be improved, the energy can be saved, the cost can be reduced, and the device can be miniaturized.

[0036] In order to make the above objectives, characteristics and advantages of the present application more apparent and understandable, the following preferred embodiments are specifically described below, and the accompanying drawings are referred to, and the detailed description is as follows. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0038] Figure 1 Fig. 1 shows a structure schematic diagram of a temperature control system provided by an embodiment of the present application;

[0039] Figure 2 Fig. 2 shows one of flowcharts of a temperature control method provided by an embodiment of the present application;

[0040] Figure 3 Figure 2 shows a flow chart of another temperature control method according to an embodiment of the present application;

[0041] Figure 4 Figure 3 shows a structural schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the objectives, technical solutions, and superiorities of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below in connection with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, every other embodiment obtained by a person skilled in the art without creative effort falls within the scope of the present application.

[0043] It is found through research that, as an important device in the process of manufacturing semiconductor integrated circuits, a semiconductor temperature control device is required to provide a required temperature output for controlling the temperature of an etching device process cavity in the etching process of integrated circuit manufacturing. The semiconductor temperature control device precisely controls the temperature through refrigeration and heating links in actual use. The etching device process cavity needs different temperatures to meet the production process in the entire process, and the temperature is generally periodically switched within -20℃ to 90℃. Therefore, the semiconductor temperature control device needs to switch different temperatures according to the process requirements, and the corresponding process production can be performed only when the process cavity temperature reaches the target value. In the temperature rising and falling process, a waiting time occurs, and the waiting time is relatively long when using a traditional temperature control device to switch from high temperature to low temperature or from low temperature to high temperature, which affects the production efficiency.

[0044] Based on this, the embodiments of the present application provide a temperature control system to solve the problem that the existing temperature control device has a relatively long temperature rising and falling waiting time, which affects the production efficiency.

[0045] Please refer to Figure 1 , Figure 1 Figure 1 shows a structural schematic diagram of a temperature control system according to an embodiment of the present application. As shown in Figure 1 the temperature control system provided by the embodiments of the present application includes a refrigeration device 100 and a circulating device 200; the refrigeration device 100 includes a compressor 112, a heat accumulator 111, a condenser 113, an evaporator 115, and a subcooled liquid accumulator 114; the circulating device 200 includes a circulating liquid driving device 220 and a heat exchanger 213.

[0046] The refrigeration device 100 has refrigerant (cooling medium), and the temperature of the refrigerant can be controlled by controlling the refrigerant to flow through each component in the refrigeration device 100 to rise and fall; the circulating device 200 has circulating liquid, and the circulating liquid continuously circulates in the circulating device 200 under the driving action of the circulating liquid driving equipment 220, so as to rise and fall the load equipment 300; by controlling the heat exchange between the refrigerant in the refrigeration device 100 and the circulating liquid in the circulating device 200 and the heat exchange between the circulating liquid and the heat exchanger 213, the temperature of the circulating liquid can be adjusted, and then the temperature control of the load equipment 300 is carried out.

[0047] The outlet end of the first heat exchange channel in the evaporator 115 is connected to the inlet end of the compressor 112; the outlet end of the compressor 112 includes two paths, the first path is connected to the inlet end of the first heat exchange channel in the heat accumulator 111, and the second path is connected to the inlet end of the second heat exchange channel in the condenser 113 and the inlet end of the first heat exchange channel in the evaporator 115 together with the outlet end of the first heat exchange channel in the heat accumulator 111;

[0048] The outlet end of the second heat exchange channel in the condenser 113 is connected to the inlet end of the subcooler 114, and the outlet end of the subcooler 114 is connected to the inlet end of the first heat exchange channel in the evaporator 115;

[0049] The outlet end of the second heat exchange channel in the evaporator 115 is connected to the inlet end of the circulating liquid driving equipment 220; the outlet end of the circulating liquid driving equipment 220 includes four paths, the first path is connected to the inlet end of the second heat exchange channel in the evaporator 115 through the second heat exchange channel in the heat accumulator 111, the second path is connected to the inlet end of the second heat exchange channel in the evaporator 115 through the second heat exchange channel in the heat exchanger 213 and the second heat exchange channel in the heat accumulator 111 in turn, the third path is connected to the inlet end of the second heat exchange channel in the evaporator 115 through the second heat exchange channel in the heat exchanger 213, and the fourth path is connected to the inlet end of the second heat exchange channel in the evaporator 115.

[0050] Among them, the compressor 112 sucks the low-temperature and low-pressure gaseous refrigerant in the evaporator 115 by mechanical energy, and then compresses it into high-temperature and high-pressure gaseous refrigerant. This process increases the pressure and temperature of the refrigerant, so that it can effectively release heat. The first heat exchange channel in the condenser 113 is connected to the factory water to cool and condense the refrigerant in the second heat exchange channel; the first heat exchange channel in the heat exchanger 213 is also connected to the factory water to exchange heat with the circulating liquid in the second heat exchange channel.

[0051] The temperature of the circulating liquid is adjusted by controlling the temperature rising and falling of the refrigerant in the refrigeration device 100 in each component of the refrigeration device 100, and by adjusting the on-off of the four circuits included in the outlet end of the circulating liquid driving device 220 to control the temperature rising and falling of the circulating liquid, so as to adjust the temperature of the circulating liquid to control the temperature of the load device 300.

[0052] In one aspect, the heat storage device 111 stores heating energy. Specifically, the high-temperature and high-pressure gaseous refrigerant obtained after being compressed by the compressor 112 can heat the heat storage medium in the heat storage device 111 through the first heat exchange passage; thus, when the circulating liquid flows through the second heat exchange passage, the heat storage medium can heat the circulating liquid. Optionally, in order to improve the heat exchange efficiency, the heat release end (the end flowing through the refrigerant, i.e., the first heat exchange passage end) adopts a coil pipe to increase the heat exchange surface area. Because the heat absorption end (the end flowing through the circulating liquid, i.e., the second heat exchange passage end) has a large flow and a low pressure, in order to reduce the pressure drop, a column pipe type design is adopted to increase the heat exchange area.

[0053] In addition, the factory water flowing in the first heat exchange passage of the heat exchanger 213 can also exchange heat with the circulating liquid in the second heat exchange passage, that is, when the circulating temperature at the inlet of the second heat exchange passage is lower than the factory water temperature at the inlet of the first heat exchange passage, the heat exchanger 213 realizes the pre-heating of the circulating liquid; that is, when the circulating temperature at the inlet of the second heat exchange passage is higher than the factory water temperature at the inlet of the first heat exchange passage, the heat exchanger 213 realizes the pre-cooling of the circulating liquid. In this way, the temperature rising and falling speed is further improved.

[0054] The existing temperature control device can only be heated by the hot gas discharged by the compressor and the heater device, and the temperature rising speed is slow. If the temperature rising speed is increased, the installed power of each component must be increased, thus resulting in problems of large energy consumption, high cost, and being not conducive to miniaturization of the device. In the embodiment of the present application, the heat storage device 111 and the heat exchanger 213 are additionally provided, and the heat storage medium in the heat storage device 111 can first heat the circulating liquid once, and the circulating liquid heated once by the heat storage device 111 enters the evaporator 115 to be heated twice, so that the circulating liquid continuously absorbs heat to increase the temperature, thereby improving the temperature rising speed of the circulating liquid. Through the heat exchange of the heat exchanger 213, the temperature rising speed of the circulating liquid (load device) is further improved.

[0055] In another aspect, the supercooling liquid reservoir 114 performs supercooling treatment on the refrigerant, and the liquid refrigerant obtained after the supercooling treatment is stored in the supercooling liquid reservoir 114. If the existing temperature control device needs to improve the cooling speed, the compressor power needs to be increased, and the condenser and the evaporator also need to be increased accordingly. At this time, the energy consumption and the size of the device are increased, which increases the cost of the device. In the embodiment of the present application, the supercooling liquid reservoir 114 is added, which can perform supercooling treatment on the refrigerant cooled by the condenser 113. The second cooling can improve the supercooling degree of the refrigerant, improve the refrigeration capacity and the cooling speed, and avoid the waste of energy.

[0056] Further, the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the external cooling pipeline of the supercooling liquid reservoir 114, and the inlet end of the external cooling pipeline is connected to the inlet end of the compressor 112.

[0057] The external cooling pipeline is arranged outside the liquid storage space in the supercooling liquid reservoir 114, and is used for cooling the coolant stored in the liquid storage space.

[0058] In this way, the liquid storage space in the supercooling liquid reservoir 114 is cooled by the external cooling pipeline, which can further reduce the temperature of the refrigerant in the liquid storage space and improve the refrigeration speed. Indirectly, the purpose of improving the cooling speed of the circulating liquid is achieved.

[0059] Further, the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the first heat exchange channel in the evaporator 115.

[0060] Further, as shown in Figure 1 Valves are installed on each pipeline in the temperature control system for controlling the on-off of the loop. Optionally, each valve is an electromagnetic valve, which can be controlled by an electromagnetic signal for on-off control and opening degree adjustment. The refrigeration device 100 is provided with a first valve 101, a second valve 102, a third valve 103, a fourth valve 104, a fifth valve 105, and a sixth valve 106. The circulating device 200 is provided with a first circulating valve 212, a second circulating valve 211, a third circulating valve 201, and a fourth circulating valve 202.

[0061] More specifically, the first path of the outlet end of the compressor 112 is connected to the inlet end of the first heat exchange channel in the heat accumulator 111 via the first valve 101; the second path of the outlet end of the compressor 112 is connected to the outlet end of the first heat exchange channel in the heat accumulator 111 via the second valve 102, and together with the second path of the compressor 112 is connected to the inlet end of the first heat exchange channel in the evaporator 115 via the third valve 103; the outlet end of the subcooled liquid receiver 114 is connected to the inlet end of the first heat exchange channel in the evaporator 115 via the fourth valve 104; the outlet end of the second heat exchange channel in the condenser 113 is connected to the inlet end of the external cooling pipe of the subcooled liquid receiver 114 via the fifth valve 105; and the outlet end of the second heat exchange channel in the condenser 113 is also connected to the inlet end of the first heat exchange channel in the evaporator 115 via the sixth valve 106.

[0062] By controlling the opening and closing of each valve, the flow direction of the refrigerant in the refrigeration device 100 and the components through which it flows can be adjusted, thereby controlling the temperature rise and fall of the refrigerant in each component of the refrigeration device 100.

[0063] The outlet end of the circulating liquid drive device 220 includes four pipelines, each equipped with a first circulation valve 212, a second circulation valve 211, a third circulation valve 201, and a fourth circulation valve 202. The first pipeline of the outlet end of the circulating liquid drive device 220 connects to the inlet end of the second heat exchange channel in the evaporator 115 via the first circulation valve 212; the second pipeline connects to the inlet end of the second heat exchange channel in the heat exchanger 213, the outlet end of which connects to the inlet end of the second heat exchange channel in the heat accumulator 111 via the second circulation valve 211, and the outlet end of the second heat exchange channel in the heat accumulator 111 connects to the inlet end of the second heat exchange channel in the evaporator 115; the third pipeline connects to the inlet end of the second heat exchange channel in the heat exchanger 213, the outlet end of which connects to the inlet end of the second heat exchange channel in the evaporator 115 via the third circulation valve 201; and the fourth pipeline connects to the inlet end of the second heat exchange channel in the evaporator 115 via the fourth circulation valve 202.

[0064] By controlling the opening and closing of each valve, the flow direction and components of the circulating liquid in the circulation device 200 can be adjusted, thereby controlling whether the circulating liquid flows through the heat accumulator 111 and the heat exchanger 213, and thus controlling the heating and cooling of the circulating liquid.

[0065] On the other hand, such as Figure 1 As shown, the circulating liquid drive device 220 includes a water tank 206, a water pump 207, a heater 208, and a portion of pipeline connected to the inlet and outlet of the load device 300.

[0066] The inlet end of the water tank 206 is connected to the inlet end of the circulating liquid driving device 220, the outlet end of the water tank 206 is connected to the inlet end of the water pump 207, the outlet end of the water pump 207 is connected to the inlet end of the heater 208, and the outlet end of the heater 208 is connected to the corresponding liquid inlet of the load device. The corresponding liquid outlet of the load device is the outlet end of the circulating liquid driving device 220.

[0067] Under the power of the water pump 207, the circulating liquid is extracted from the water tank 206 and sucked into the water pump 207 and discharged from the water pump 207 to the heater 208. The circulating liquid at the outlet of the heater 208 enters the corresponding position of the load device and exchanges heat with the load device. Then, the circulating liquid returns to the water tank 206 or returns to the water tank 206 through the second heat exchange channel of the heat accumulator 111.

[0068] Here, the temperature of the circulating liquid at the inlet end of the water tank 206 can be collected by the temperature sensor 205, and the temperature T209 of the circulating liquid at the corresponding liquid inlet of the load device can be collected by the temperature sensor 209. By comparing T205 and T209, the heater 208 can be controlled to heat the circulating liquid.

[0069] The temperature control system provided by the embodiment can improve the heating speed by using the heat accumulator to heat the circulating liquid during the heating process of the refrigeration device. The supercooled liquid accumulator can be used to supercool and store the refrigerant, and the supercooled liquid accumulator can be used to cool the circulating liquid during the cooling process, so as to improve the cooling speed. For the circulating device, the heat exchanger can be used to preheat or precool the circulating liquid during the heating and cooling process, so as to further improve the heating and cooling speed. In this way, the heating and cooling waiting time can be reduced without increasing the power of the compressor, the condenser and the evaporator, the production efficiency can be improved, the energy consumption can be reduced, the production cost of the equipment can be reduced, and the miniaturization of the equipment can be facilitated.

[0070] The temperature control method provided by the embodiment can be applied to the temperature control system provided by any of the above embodiments, and can be a controller in the temperature control system. The controller can be connected to each component in the temperature control system, can obtain the current operating parameters of each component, and can send control instructions to each component to adjust the operating parameters of each component. Specifically, the temperature control method comprises the following steps.

[0071] According to the received temperature adjustment instruction of the load device, the valves on each pipeline in the temperature control system are controlled, so that the refrigerant in the refrigeration device 100 is heated and cooled in each component of the temperature control system, and the four circuits included in the outlet end of the circulating liquid driving device 220 are switched to adjust the heating and cooling process of the circulating liquid to adjust the temperature of the circulating liquid, so that the circulating liquid controls the temperature of the load device.

[0072] The heat storage device 111 stores heat energy, and can be used to increase the temperature in the temperature increasing process, so as to increase the temperature increasing speed; the supercooling liquid storage device 114 is used to supercool the refrigerant and store the supercooled refrigerant, and can be used to decrease the temperature in the temperature decreasing process, so as to increase the temperature decreasing speed; the circulating liquid in the second passage of the heat exchanger 213 can exchange heat with the medium in the first passage, such as the plant water, so as to further increase the temperature increasing / decreasing speed.

[0073] In this way, the temperature increasing / decreasing waiting time can be reduced without increasing the power of the compressor 112, the condenser 113 and the evaporator 115, the production efficiency is improved, the energy consumption is reduced, the production cost of the equipment is reduced, and the miniaturization of the equipment is facilitated.

[0074] Here, the type of the temperature adjusting instruction can include a temperature increasing instruction and a temperature decreasing instruction; and the execution process of the temperature control method for each type of temperature adjusting instruction will be described in detail below.

[0075] In one possible implementation, referring to Figure 2 , Figure 2 FIG. 1 is a flowchart of a temperature control method provided by another embodiment of the present application. As shown in FIG. 1, the temperature control method provided by the embodiment of the present application includes the following steps. Figure 2

[0076] In step a1, when the temperature adjusting instruction is a temperature increasing instruction, the first valve 101, the fourth valve 104 and the sixth valve 106 are closed, and the second valve 102 and the third valve 103 are opened.

[0077] When the load device needs high temperature, the temperature control system needs to operate in the temperature increasing mode, and a temperature increasing instruction is generated at this time. The temperature increasing instruction can set a target value of the temperature increasing (which can be the temperature target value of the circulating liquid at the liquid inlet of the load device, i.e., the temperature T209 collected by the temperature sensor 209 in the temperature increasing instruction), and at this time, the valves 101, 104 and 106 are closed, and the valves 102 and 103 are opened. Figure 1

[0078] In step a2, the first circulating valve 212, the second circulating valve 211, the third circulating valve 201 and the fourth circulating valve 202 are controlled according to the first circulating temperature at the outlet end of the circulating liquid driving device 220, the second circulating temperature at the inlet end of the second heat exchange passage of the heat exchanger 213 and the third circulating temperature at the outlet end of the second heat exchange passage of the heat storage device 111.

[0079] ​​In this step, the first circulation temperature T204 can be collected by the temperature sensor 204 arranged at the outlet end of the circulating liquid driving device 220, the second circulation temperature T214 can be collected by the temperature sensor 214 arranged at the inlet end of the second heat exchange channel of the heat exchanger 213, and the third circulation temperature T203 can be collected by the temperature sensor 203 arranged at the outlet end of the second heat exchange channel of the heat accumulator 111. Then, by comparing the circulation temperatures, the four-way pipeline connection or shutdown of the outlet end of the circulating liquid driving device 220 is selected, and the opening and closing of the corresponding valve are controlled.

[0080] In a possible implementation, the step a2 can include:

[0081] The step a21, when the first temperature difference between the second circulation temperature and the first circulation temperature is greater than or equal to a first preset threshold, the first circulation valve 212, the third circulation valve 201 and the fourth circulation valve 202 are closed, and the second circulation valve 211 is opened.

[0082] The step a22, when the first temperature difference is less than the first preset threshold, the second circulation valve 211, the third circulation valve 201 and the fourth circulation valve 202 are closed, and the first circulation valve 212 is opened.

[0083] The step a23, when the temperature difference between the third circulation temperature and the first circulation temperature is less than a second preset threshold, the first circulation valve 212, the second circulation valve 211 and the third circulation valve 201 are closed, and the fourth circulation valve 202 is opened.

[0084] For the above steps, when T214-T204≥TE, the valve 211 is opened, the valves 212, 201 and 202 are closed, and the circulating liquid is once heated by the heat exchanger 213 (TE represents the first preset threshold, which is generally 3-5°C according to experience).

[0085] When T214-T204 is less than TE, the valves 211, 201 and 202 are closed, and the valve 212 is opened. At this time, the circulating liquid once heated enters the heat absorption end heat exchange pipe of the heat accumulator 111, the circulating liquid exchanges heat with the heat storage medium in the heat accumulator 111, and the heat storage medium performs secondary heating on the circulating liquid. Then, the circulating liquid twice heated by the heat accumulator 111 enters the evaporator 115. The hot gas discharged by the compressor 112 enters the evaporator 115 through the valve 103, the circulating liquid exchanges heat with the hot gas in the evaporator 115, and the hot gas flowing through one side of the evaporator 115 performs third heating on the circulating liquid. The circulating liquid continuously absorbs heat to improve the temperature.

[0086] During the heating process, T204 and T203 are compared in real time. TA = T203 - T204, and TA gradually decreases as the heat storage medium releases heat. When TA ≤ TB, it is considered that the heat storage medium in the heat storage tank 111 has basically released all its heat. TB represents the second preset threshold, which is an empirical value, such as 2℃-5℃. The specific value can be set according to different temperature control systems, and this application does not impose any restrictions here. At this time, valve 202 is opened, and valves 201, 211, and 212 are closed. The circulating liquid directly enters the evaporator 115 to exchange heat with the high-temperature hot gas discharged from the compressor 112 and raise the temperature.

[0087] It should be noted that the heating process ends when the temperature reaches the target value set by the heating command. Correspondingly, the temperature control system enters operating mode, where the system requires only minimal energy consumption to maintain the current temperature. For example, the system can adjust valve openings and the power of various components using existing control algorithms such as PID control based on the target value and the actual detected temperature, ensuring stable system operation.

[0088] In another possible implementation, please refer to Figure 3 , Figure 3 This is a second flowchart illustrating a temperature control method according to another embodiment of this application. Figure 3 As shown in the embodiment of this application, the temperature control method includes:

[0089] Step b1: When the temperature regulation command is a cooling command, close the second valve 102, the third valve 103 and the sixth valve 106, and open the first valve 101 and the fourth valve 104.

[0090] When the load equipment requires a low temperature, the temperature control system needs to operate in a cooling mode. This generates a cooling command, which can specify a target cooling value (such as the target temperature of the circulating liquid at the inlet of the load equipment). Figure 1 The temperature T209 is collected by temperature sensor 209. At this time, valves 102, 103, and 106 are closed, and valves 101 and 104 are open.

[0091] Step b2: Based on the first circulation temperature at the outlet of the circulating fluid drive device 220 and the second circulation temperature at the inlet of the second heat exchange channel in the heat exchanger 213, control the first circulation valve 212, the second circulation valve 211, the third circulation valve 201 and the fourth circulation valve 202.

[0092] In this step, the first circulation temperature T204 can be collected by the temperature sensor 204 arranged at the outlet end of the circulating liquid driving device 220, and the second circulation temperature T214 can be collected by the temperature sensor 214 arranged at the inlet end of the second heat exchange channel of the heat exchanger 213. Then, by comparing the circulation temperatures, the four-way pipeline connection or shutdown of the outlet end of the circulating liquid driving device is selected, and the opening and closing of the corresponding valve are controlled.

[0093] In a possible implementation, the step b2 can include:

[0094] The step b21 includes: when the third temperature difference between the first circulation temperature and the second circulation temperature is greater than or equal to a third preset threshold value, closing the first circulation valve 212, the second circulation valve 211 and the fourth circulation valve 202, and opening the third circulation valve 201.

[0095] The step b22 includes: when the third temperature difference is less than the third preset threshold value, closing the first circulation valve 212, the second circulation valve 211 and the third circulation valve 201, and opening the fourth circulation valve 202.

[0096] For the above steps, when T204-T214≥TE, the valves 202, 211 and 212 are closed, the valve 201 is opened, and the circulating liquid is cooled once by the heat exchanger 213 (TE is a constant, generally 3-5℃).

[0097] When T204-T214<TE, the circulating liquid cannot be cooled by the factory water any more, at this time, the valve 202 is opened and the valve 201 is closed. The refrigerant stored in the subcooler and subjected to subcooling treatment enters the heat exchange channel 1 of the evaporator 115 through the valve 104, at this time, the circulating liquid cooled once by the heat exchanger 213 flows through the heat exchange channel 2 of the evaporator 115 through the valve 201, and the subcooled refrigerant is gasified in the evaporator 115 to absorb heat and rapidly cool the circulating liquid.

[0098] It should be noted that when the temperature rises to the target value set by the heating instruction, the heating process ends. Correspondingly, the temperature control system enters the working mode, the valve 104 is closed and the valve 106 is opened, at this time, the system only needs a small energy consumption to maintain the current temperature. For example, the system can adjust the valve opening degree and the power of each component according to the target value and the actual detected temperature value by using the existing control algorithm such as PID, so as to make the system run in a stable state.

[0099] Further, before controlling the valves on each pipeline in the temperature control system according to the received temperature adjustment instruction of the load device, the method further includes:

[0100] Step c, after the temperature control system is started, a temperature control preparation phase is entered and lasts for a predetermined time length, so that the heat storage device 111 stores heat energy, and the supercooling reservoir 114 supercools the refrigerant and stores the supercooled refrigerant.

[0101] In this way, after the predetermined time length, the heat storage device 111 and the supercooling reservoir 114 store sufficient heating energy and cooling energy, and the temperature control system can enter the temperature raising and lowering mode for the load device. The predetermined time length can be set according to the energy storage capacity of the heat storage device 111 and the supercooling reservoir 114, and the present application does not limit the predetermined time length.

[0102] In the temperature control preparation phase, the second valve 102, the third valve 103, the fourth valve 104, the first circulating valve 212, the second circulating valve 211 and the third circulating valve 201 are closed, the first valve 101 and the fourth circulating valve 202 are opened, and the opening degree of the sixth valve 106 is adjusted according to the fourth circulating temperature of the inlet end of the circulating liquid driving device 220.

[0103] In the temperature control preparation phase, the temperature control system has been started, and the compressor 112 and the water pump 207 are running. At this time, the system is generally in an idle state. The default temperature T209 can be set as an initial value of 20°C, at this time, the valves 102, 103, 104, 201, 211 and 212 are closed, and the valves 101 and 202 are opened.

[0104] At this time, the hot gas discharged by the compressor 112 enters the heat storage device 111 through the valve 101 to warm the heat storage medium. The initial temperature of the heat storage medium is equivalent to the ambient temperature, while the temperature of the hot gas discharged by the compressor 112 is generally 80-90°C. The high-temperature hot gas is heat-exchanged in the heat storage device 111, the temperature of the heat storage medium is increased, and the hot gas is cooled down once. The cooled hot gas is cooled down again in the condenser 113. The refrigerant cooled down twice in the condenser 113 is liquefied after the supercooling treatment in the supercooling reservoir 114, and is stored in the supercooling reservoir 114.

[0105] Here, the fourth circulating temperature T205 of the circulating liquid can be collected by the temperature sensor 205 installed at the inlet end of the circulating liquid driving device 220 (i.e., the circulating device 200), that is, the actual temperature value of the inlet end of the water tank 206. Then, according to the T205 and the initial value of T209, the opening degree of the sixth valve 106 is adjusted to maintain the stability of the system.

[0106] Further, in each operating phase (including the temperature raising, temperature lowering and temperature control preparation phase) of the system, the temperature control method further comprises:

[0107] The second refrigeration temperature T109 of the inlet end of the compressor 112 is collected by the temperature sensor 109, and the first refrigeration pressure P110 of the outlet end of the first heat exchange channel in the evaporator 115 is collected by the pressure sensor 110.

[0108] According to the first refrigeration pressure P110 of the outlet end of the evaporator 115, the saturation temperature of the refrigerant (i.e. the temperature when the refrigerant is completely evaporated at this pressure) is found, and then the actual superheat value is obtained from the saturation temperature of the refrigerant and the second refrigeration temperature. In the embodiment of the present application, the actual superheat value = the second refrigeration temperature (T109) of the inlet end of the compressor 112 - the saturation temperature of the refrigerant. Finally, the deviation between the actual superheat value and the preset superheat value is determined, which is used as the input of the control algorithm.

[0109] The control algorithm determines the opening degree of the fifth valve 105 according to the superheat difference. For example, when the superheat difference is too large (the actual subcooling value is too high), the heat of the refrigerant in the subcooling accumulator 114 can be taken away by increasing the opening degree of the fifth valve 105, so as to reduce the superheat and ensure the stable operation of the system.

[0110] The temperature control method provided by the embodiment of the present application can improve the heating speed by heating through the heat accumulator during the heating process of the refrigeration device, can improve the cooling speed by cooling through the subcooling accumulator during the cooling process, and can further improve the heating and cooling speed by preheating and precooling the circulating liquid through the heat exchanger during the heating and cooling process of the circulating device. In this way, the heating and cooling waiting time can be reduced, the production efficiency can be improved, the energy consumption can be reduced, the production cost of the equipment can be reduced, and the miniaturization of the equipment is facilitated, without the need to increase the power of the compressor, the condenser and the evaporator.

[0111] Please refer to Figure 4 , Figure 4 The structure of an electronic device provided by the embodiment of the present application is shown in FIG. 4. Figure 4 As shown in FIG. 4, the electronic device 400 includes a processor 410, a memory 420 and a bus 430.

[0112] The memory 420 stores machine readable instructions executable by the processor 410. When the electronic device 400 is running, the processor 410 communicates with the memory 420 through the bus 430. When the machine readable instructions are executed by the processor 410, the steps of the temperature control method in the method embodiment shown in FIG. 3 and FIG. 4 can be performed. For specific implementation, please refer to the method embodiment, which will not be described here. Figure 2 Figure 3 The memory 420 stores machine readable instructions executable by the processor 410. When the electronic device 400 is running, the processor 410 communicates with the memory 420 through the bus 430. When the machine readable instructions are executed by the processor 410, the steps of the temperature control method in the method embodiment shown in FIG. 3 and FIG. 4 can be performed. For specific implementation, please refer to the method embodiment, which will not be described here.

[0113] ​The embodiment of the present application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program. When the computer program is run by a processor, the computer program can execute the method as described above. Figure 2 and Figure 3 The steps of the temperature control method in the method embodiment are not repeated here.

[0114] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments, and is not repeated here.

[0115] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented by other ways. The device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some communication interfaces, devices or units, and can be electrical, mechanical or other forms.

[0116] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0117] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0118] If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a nonvolatile computer readable storage medium executable by a processor. Based on this understanding, the technical solutions of the present application essentially or the parts of the prior art that make contributions or parts of the technical solutions can be embodied in the form of software products. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (Read-Only Memory, ROM), a random access memory (Random Access Memory, RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0119] Finally, it should be noted that: the above-described embodiments are only specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, but not to limit them. The protection scope of the present application is not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can make modifications or easily think of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed by the present application, or make equivalent replacements to some of the technical features. The modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A temperature control system, characterized by, The system comprises a refrigeration device and a circulating device; the refrigeration device comprises a compressor, a heat accumulator, a condenser, an evaporator and a subcooling accumulator; the circulating device comprises a circulating liquid driving device and a heat exchanger; An outlet end of the first heat exchange channel in the evaporator is connected to an inlet end of the compressor; an outlet end of the compressor comprises two paths, a first path is connected to an inlet end of the first heat exchange channel in the heat accumulator, and a second path is connected to an inlet end of the second heat exchange channel in the condenser and an inlet end of the first heat exchange channel in the evaporator together; An outlet end of the second heat exchange channel in the condenser is connected to an inlet end of the subcooling accumulator, and an outlet end of the subcooling accumulator is connected to an inlet end of the first heat exchange channel in the evaporator; An outlet end of the second heat exchange channel in the evaporator is connected to an inlet end of the circulating liquid driving device; an outlet end of the circulating liquid driving device comprises four paths, a first path is connected to an inlet end of the second heat exchange channel in the evaporator through the second heat exchange channel in the heat accumulator, a second path is connected to an inlet end of the second heat exchange channel in the evaporator through the second heat exchange channel in the heat exchanger and the second heat exchange channel in the heat accumulator in sequence, a third path is connected to an inlet end of the second heat exchange channel in the evaporator through the second heat exchange channel in the heat exchanger, and a fourth path is connected to an inlet end of the second heat exchange channel in the evaporator; The heat accumulator stores heating energy, the subcooling accumulator stores and subcools refrigerant, water in the first heat exchange channel in the heat exchanger exchanges heat with circulating liquid in the second heat exchange channel, the temperature of the circulating liquid is adjusted by controlling the temperature rising and falling of the refrigerant in the refrigeration device and the temperature rising and falling of the circulating liquid by adjusting the on-off of the four paths of the outlet end of the circulating liquid driving device, so that the circulating liquid controls the temperature of the load device.

2. The system of claim 1, wherein, The circulating liquid driving device comprises a water tank, a water pump and a heater; An inlet end of the water tank is the inlet end of the circulating liquid driving device, an outlet end of the water tank is connected to an inlet end of the water pump, an outlet end of the water pump is connected to an inlet end of the heater, an outlet end of the heater is connected to a corresponding liquid inlet of the load device, and a corresponding liquid outlet of the load device is the outlet end of the circulating liquid driving device.

3. The system of claim 1, wherein, The outlet end of the second heat exchange channel in the condenser is also connected to an inlet end of an external cooling pipeline of the subcooling accumulator, and the inlet end of the external cooling pipeline is connected to an inlet end of the compressor; The external cooling pipeline is arranged outside a liquid storage space in the subcooling accumulator and is used for cooling coolant stored in the liquid storage space.

4. The system of claim 1, wherein, The outlet end of the second heat exchange channel in the condenser is also connected to an inlet end of the first heat exchange channel in the evaporator.

5. A temperature control method characterized by, The method is applied to the temperature control system as claimed in any one of claims 1 to 4, and the method comprises: According to the received temperature regulation instruction of the load device, the valves on the pipelines in the temperature control system are controlled, so that the refrigerant in the refrigeration device is used to heat and cool the components in the temperature control system, and the four circuits included in the outlet end of the circulating liquid driving device are switched to adjust the heating and cooling links of the circulating liquid, so as to adjust the temperature of the circulating liquid and control the temperature of the load device by the circulating liquid.

6. The method of claim 5, wherein, The first path of the outlet end of the compressor is connected to the inlet end of the first heat exchange channel in the heat accumulator through the first valve; the second path of the outlet end of the compressor is connected to the outlet end of the first heat exchange channel in the heat accumulator through the second valve, and is commonly connected to the inlet end of the first heat exchange channel in the evaporator through the third valve; the outlet end of the subcooler is connected to the inlet end of the first heat exchange channel in the evaporator through the fourth valve; the outlet end of the second heat exchange channel in the condenser is connected to the inlet end of the external cooling pipeline of the subcooler through the fifth valve; the outlet end of the second heat exchange channel in the condenser is also connected to the inlet end of the first heat exchange channel in the evaporator through the sixth valve; the four pipelines included in the outlet end of the circulating liquid driving device are respectively provided with the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve; The control of the valves on the pipelines in the temperature control system according to the received temperature regulation instruction of the load device comprises: When the temperature regulation instruction is a heating instruction, the first valve, the fourth valve and the sixth valve are closed, and the second valve and the third valve are opened; The control of the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve according to the first circulating temperature of the outlet end of the circulating liquid driving device, the second circulating temperature of the inlet end of the second heat exchange channel in the heat exchanger and the third circulating temperature of the outlet end of the second heat exchange channel in the heat accumulator comprises:

7. The method of claim 6, wherein, The control of the first circulating valve, the second circulating valve, the third circulating valve and the fourth circulating valve according to the first circulating temperature of the outlet end of the circulating liquid driving device, the second circulating temperature of the inlet end of the second heat exchange channel in the heat exchanger and the third circulating temperature of the outlet end of the second heat exchange channel in the heat accumulator comprises: When the first temperature difference between the second circulating temperature and the first circulating temperature is greater than or equal to a first preset threshold, the first circulating valve, the third circulating valve and the fourth circulating valve are closed, and the second circulating valve is opened; When the first temperature difference is less than the first preset threshold, the second circulating valve, the third circulating valve and the fourth circulating valve are closed, and the first circulating valve is opened; When the temperature difference between the third circulating temperature and the first circulating temperature is less than a second preset threshold, the first circulating valve, the second circulating valve and the third circulating valve are closed, and the fourth circulating valve is opened.

8. The method of claim 6, wherein, The control of the valves on the pipelines in the temperature control system according to the received temperature regulation instruction of the load device comprises: When the temperature adjustment instruction is a cooling instruction, the second valve, the third valve and the sixth valve are closed, and the first valve and the fourth valve are opened. According to the first circulation temperature of the outlet end of the circulating liquid driving device and the second circulation temperature of the inlet end of the second heat exchange passage in the heat exchanger, the first circulation valve, the second circulation valve, the third circulation valve and the fourth circulation valve are controlled.

9. The method of claim 8, wherein, According to the first circulation temperature of the outlet end of the circulating liquid driving device and the second circulation temperature of the inlet end of the second heat exchange passage in the heat exchanger, the first circulation valve, the second circulation valve, the third circulation valve and the fourth circulation valve are controlled, including: When a third temperature difference between the first circulation temperature and the second circulation temperature is greater than or equal to a third preset threshold, the first circulation valve, the second circulation valve and the fourth circulation valve are closed, and the third circulation valve is opened. When the third temperature difference is less than the third preset threshold, the first circulation valve, the second circulation valve and the third circulation valve are closed, and the fourth circulation valve is opened.

10. The method of claim 6, wherein, Before controlling the valves on the pipelines in the temperature control system according to the received temperature adjustment instruction of the load device, the method further includes: After the temperature control system is started, a temperature control preparation phase is entered and lasts for a predetermined time length, so that the heat accumulator stores heating energy, and the supercooling liquid accumulator performs supercooling treatment on the refrigerant and stores the refrigerant. In the temperature control preparation phase, the second valve, the third valve, the fourth valve, the first circulation valve, the second circulation valve and the third circulation valve are closed, and the first valve and the fourth circulation valve are opened; the opening degree of the sixth valve is adjusted according to the fourth circulation temperature of the inlet end of the circulating liquid driving device.

Images