Power supply network, system and server

Abstract

The present invention discloses a power supply network, system, and server, relating to the field of power supply and designed to address the current problem of high power losses during server operation. The power supply network distributes power conductors across multiple areas of a printed circuit board, with the resistance of the power conductors being lower than that of the power lines in the motherboard. This design aims to reduce power losses during transmission and improve power supply efficiency. Furthermore, voltage management is implemented to achieve more efficient power transmission with lower power losses, thereby reducing heat loss and energy waste in the server during power transmission and improving server power supply efficiency. This reduces overall energy consumption in the data center where the server resides during high-load operation, helping to alleviate pressure on power infrastructure.

Description

Technical Field

[0001] The present invention relates to the field of power supply, and in particular to a power supply network, system and server. Background Art

[0002] As the demand for data centers grows, so too does the power they consume. Some data centers, even at full capacity, are consuming more energy than current renewable energy supplies. Rapid technological advancements pose significant challenges to current power infrastructure. Consequently, many cloud service providers and component suppliers are working to reduce power consumption, aiming to extract greater efficiency from chips and servers.

[0003] It can be seen that providing a power supply network to reduce the power loss of the server is a technical problem that the technical personnel in this field urgently need to solve. Summary of the Invention

[0004] The purpose of the present invention is to provide a power supply network, system and server that make power transmission more efficient and lower-loss, reduce heat loss and energy waste of the server during power transmission, improve the power supply efficiency of the server, thereby reducing the overall energy consumption of the data center when operating at high load, and help alleviate the pressure on the power infrastructure.

[0005] In a first aspect, the present application provides a power supply network applied to a server, wherein the server includes a mainboard, a voltage management module, and a module to be powered. The power supply network includes:

[0006] A first power supply wire is provided in the first printed circuit board and is used to connect the power supply and the voltage management module;

[0007] and / or, a second power conductor, provided in a second printed circuit board, for connecting to the voltage management module, a third power conductor, or a power line on the mainboard, the voltage management module being mounted on the second printed circuit board;

[0008] And / or, the third power conductor is provided in a third printed circuit board, and is used to connect the power line on the mainboard or the second power conductor, and the module to be powered, and the module to be powered is installed on the upper layer of the third printed circuit board or the mainboard;

[0009] All power wires and / or the power wires in the mainboard and the voltage management module work together to transfer the power provided by the power supply to the module to be powered; the resistance of each power wire is less than the resistance of the power wire in the mainboard.

[0010] The i-th printed circuit board is installed on the upper layer or lower layer of the main board, and i is one, two or three;

[0011] And when i is three, if the third printed circuit board is installed on the upper layer of the mainboard, the module to be powered is installed on the third printed circuit board; if the third printed circuit board is installed on the lower layer of the mainboard, the module to be powered is installed on the mainboard, and the distance between the module to be powered and the heat dissipation module is greater than the distance between the third printed circuit board and the heat dissipation module.

[0012] Wherein, if the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, j is one or two;

[0013] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper layer or the lower layer of the main board;

[0014] The module to be powered is installed on the first main printed circuit board;

[0015] When j is 2, the module to be powered is installed on the first main printed circuit board or the upper layer of the main board.

[0016] Wherein, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0017] The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper layer or the lower layer of the main board;

[0018] The module to be powered is installed on the second main printed circuit board, and the module to be powered is installed on the second main printed circuit board or the upper layer of the main board.

[0019] Wherein, the upper layer or the lower layer of the main board is provided with an i-th groove;

[0020] The size of the i-th groove is the same as the size of the i-th printed circuit board, and the i-th printed circuit board is installed in the i-th groove.

[0021] Wherein, if the power supply network includes a jth power supply wire and a j+1th power supply wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, j is one or two;

[0022] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first main printed circuit board, and the first main printed circuit board is mounted on an upper layer or a lower layer of the main board; the module to be powered is mounted on the first main printed circuit board; when j is 2, the module to be powered is mounted on the first main printed circuit board or on an upper layer of the main board.

[0023] The j-th groove and the j+1-th groove are integrally formed into a first general groove, and the first general printed circuit board is installed in the first general groove.

[0024] Wherein, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0025] The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper or lower layer of the main board; the module to be powered is installed on the second total printed circuit board, and the module to be powered is installed on the second total printed circuit board or the upper layer of the main board.

[0026] The first groove, the second groove, and the third groove are integrally formed into a second main groove, and the second main printed circuit board is installed in the second main groove.

[0027] Wherein, when the power supply network includes an i-th power wire, the i-th power wire replaces the power wires of the mainboard corresponding to the i-th power wire.

[0028] The thickness of each power wire is greater than the thickness of the power wire of the mainboard, so that the resistance of each power wire is smaller than the resistance of the power wire of the mainboard.

[0029] Among them, the material of each of the power wires is a preset material or a preset composite material, the thickness of the power wire is not less than the thickness of the power wire of the mainboard, and the resistance of the power wire of the first size composed of the preset material or the preset composite material is less than the resistance of the power wire of the mainboard of the first size.

[0030] Wherein, when the power supply network includes all the power supply wires and the power line of the mainboard, the power supply network also includes:

[0031] a switching device, a first end of which is connected to the power supply, a second end of which is connected to the input end of the first power wire, and a third end of which is connected to the power line of the mainboard;

[0032] The switching device is configured to select, according to a control instruction, to conduct a first path between its first end and the second end so that the power supply provides power to the module to be powered through the first path, or to conduct a second path between its first end and the third end so that the power supply provides power to the module to be powered through the second path;

[0033] The control instruction is determined according to the acquired target power supply and the power consumption of the server.

[0034] Wherein, the power supply network further includes:

[0035] A prediction module, whose output end is connected to the switching device, is used to obtain the historical power consumption data of the server in a historical preset time period and the target task of the server in a future preset time period, predict the expected power consumption of the server in the future preset time period based on the target task and the historical power consumption data, and generate the control instruction based on the expected power consumption and the obtained target power supply in the future preset time period.

[0036] The prediction module is specifically configured to generate a first control instruction when the difference between the target power supply and the expected power consumption is greater than a preset threshold, and to generate a second control instruction when the difference between the target power supply and the expected power consumption is not greater than the preset threshold;

[0037] The switching device is specifically used to conduct a first path between its first end and the second end according to the first control instruction so that the power supply provides power to the module to be powered through the first path, and to conduct a second path between its first end and the third end according to the second control instruction so that the power supply provides power to the module to be powered through the second path.

[0038] In a second aspect, the present application provides a power supply system for a server, wherein the server includes a mainboard, a voltage management module, and a module to be powered, including:

[0039] The power supply is the power supply network described above, wherein the input end of the power supply network is connected to the power supply, and the output end of the power supply network is connected to the power supply end of the module to be powered.

[0040] In a third aspect, the present application provides a server comprising the power supply system as described above.

[0041] The present invention provides a power supply network, system, and server for addressing the current problem of high power losses during server operation. This power supply network distributes power conductors across multiple areas of a printed circuit board, with the resistance of the power conductors being lower than that of the power lines on the motherboard. This design aims to reduce power losses during transmission and improve power supply efficiency. Voltage management modules regulate power transmission, resulting in more efficient and lower power losses. This reduces heat loss and energy waste in servers during power transmission, improves server power supply efficiency, and thus reduces overall energy consumption in high-load data centers where the servers are located, helping to alleviate pressure on power infrastructure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0043] Figure 1 A structural block diagram of a power supply network provided by the present invention;

[0044] Figure 2 A schematic diagram of a first embodiment of a power supply network provided by the present invention;

[0045] Figure 3 A schematic diagram of a second embodiment of a power supply network provided by the present invention;

[0046] Figure 4 A schematic diagram of a third embodiment of a power supply network provided by the present invention;

[0047] Figure 5 A schematic diagram of a fourth embodiment of a power supply network provided by the present invention;

[0048] Figure 6 A schematic diagram of a fifth embodiment of a power supply network provided by the present invention;

[0049] Figure 7 A schematic diagram of a sixth embodiment of a power supply network provided by the present invention;

[0050] Figure 8 A schematic diagram of a seventh embodiment of a power supply network provided by the present invention;

[0051] Figure 9 A schematic diagram of an eighth embodiment of a power supply network provided by the present invention;

[0052] Figure 10 A schematic diagram of a ninth embodiment of a power supply network provided by the present invention;

[0053] Figure 11 A schematic diagram of a tenth embodiment of a power supply network provided by the present invention;

[0054] Figure 12 A schematic diagram of an eleventh embodiment of a power supply network provided by the present invention;

[0055] Figure 13 This is a schematic diagram of a twelfth embodiment of the power supply network provided by the present invention. DETAILED DESCRIPTION

[0056] The core of the present invention is to provide a power supply network, system and server, which makes power transmission more efficient and has lower losses, reduces heat loss and energy waste of the server during power transmission, improves the power supply efficiency of the server, and thus reduces the overall energy consumption of the data center when operating at high load, helping to alleviate the pressure on the power infrastructure.

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0058] First, as Figure 1 As shown, Figure 1 The direction indicated by the dotted arrow is the direction of power flow. This application provides a power supply network for use in a server. The server includes a mainboard 31, a voltage management module 33, and a power supply module 34. The power supply network includes:

[0059] The first power supply wire 11 is provided in the first printed circuit board 21 and is used to connect the power supply 32 and the voltage management module 33;

[0060] and / or, the second power conductor 12 is provided in the second printed circuit board 22 and is used to connect to the voltage management module 33, the third power conductor 13, or the power line on the mainboard 31, and the voltage management module 33 is mounted on the second printed circuit board 22;

[0061] and / or, a third power conductor 13 disposed in the third printed circuit board 23 for connecting the power line or the second power conductor 12 on the mainboard and the module to be powered 34, which is mounted on an upper layer of the third printed circuit board 23 or the mainboard 31;

[0062] All power wires and / or the power wires in the mainboard 31 and the voltage management module 33 work together to transfer the power provided by the power supply 32 to the module to be powered 34; the resistance of each power wire is smaller than the resistance of the power wire in the mainboard 31.

[0063] In this embodiment, the power supply network is designed for server systems to improve power transmission efficiency and reduce energy loss. The server contains multiple components requiring power: a motherboard 31, a voltage management module 33 (responsible for voltage regulation), and various power-demanding modules 34 (specific components such as the CPU, GPU, processor, or storage unit). The power supply network delivers power through multiple conductor systems, ensuring that each component receives the required stable power.

[0064] Specifically, power enters the voltage management module via the first power conductor 11, where the voltage is adjusted. The first power conductor 11 is located within the circuit layer of the first printed circuit board 21, ensuring efficient power transmission. Power adjusted by the voltage management module 33 can be further transmitted via the second power conductor 12 and / or the third power conductor 13. The second power conductor 12 and / or the third power conductor 13 are respectively arranged within the second and third printed circuit boards 23, further delivering power to the required modules, such as the CPU or GPU. The resistance of each power conductor (i.e., the conductor's "resistance" to current flow) is designed to be lower than that of ordinary power lines on the motherboard 31, thereby reducing power loss during transmission and ensuring stable and efficient power delivery to the final target module.

[0065] In summary, the power supply network provided in this embodiment makes power transmission more efficient and has lower losses, reduces heat loss and energy waste of the server during power transmission, improves the power supply efficiency of the server, thereby reducing the overall energy consumption of the data center when operating at high load, and helps to alleviate the pressure on the power infrastructure.

[0066] Based on the above embodiment:

[0067] As an optional embodiment, the i-th printed circuit board is mounted on the upper layer or the lower layer of the main board 31, and i is one, two, or three;

[0068] When i is three, if the third printed circuit board 23 is installed on the upper layer of the mainboard 31, the module to be powered 34 is installed on the third printed circuit board 23; if the third printed circuit board 23 is installed on the lower layer of the mainboard 31, the module to be powered 34 is installed on the mainboard 31, and the distance between the module to be powered 34 and the heat dissipation module is greater than the distance between the third printed circuit board 23 and the heat dissipation module.

[0069] In this embodiment, the i-th printed circuit board (i is one, two, or three) can be flexibly installed on either the upper or lower layer of the mainboard 31, providing design flexibility and adaptability. Specifically, installing the i-th printed circuit board on the lower layer of the mainboard 31 effectively reduces the space occupied by the upper layer of the mainboard 31, thereby providing more space for arranging other functional modules on the upper layer. This design principle is based on the need for space optimization. In many servers and electronic devices, the upper layer of the mainboard 31 is typically the preferred area for arranging key functional modules, such as processors, memory, and other high-performance components. By placing certain auxiliary modules (such as the i-th printed circuit board) on the lower layer, space on the upper layer can be freed up to accommodate more important components or functional modules, thereby increasing the functional density of the overall system. This layout not only increases the integration between components but also improves signal transmission efficiency, as short-distance connections reduce signal attenuation and interference. Furthermore, the increased flexibility in the upper layer space allows designers to flexibly configure various functional modules according to specific needs and application scenarios, optimizing system performance and functional scalability.

[0070] When i is three, the installation position of the third printed circuit board 23 directly affects the placement of the module to be powered 34. If the third printed circuit board 23 is located on the upper layer of the mainboard 31, the module to be powered 34 is installed on the third printed circuit board 23. This layout helps shorten the connection path between the power supply module and the power conductor, thereby optimizing the efficiency of power transmission. Conversely, if the third printed circuit board 23 is located on the lower layer of the mainboard 31, the module to be powered 34 is directly installed on the mainboard 31. This design is intended to provide a better heat dissipation solution for the module to be powered 34. Specifically, the distance between the module to be powered 34 and the heat dissipation module is greater than the distance between the third printed circuit board 23 and the heat dissipation module. This takes into account the needs of thermal management, ensures that the module to be powered 34 can dissipate heat in a relatively spacious space, reduces the potential impact of high temperature on power components, and improves the stability and reliability of the module.

[0071] In general, this flexible PCB mounting solution not only improves the efficiency of power transmission, but also provides a better solution for heat dissipation management, helping to optimize overall system performance.

[0072] As an optional embodiment, if the power supply network includes a jth power conductor and a j+1th power conductor, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two;

[0073] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board 41, and the first total printed circuit board 41 is installed on the upper layer or the lower layer of the main board 31;

[0074] The module to be powered 34 is mounted on the first main printed circuit board 41;

[0075] When j is 2, the module to be powered 34 is installed on the upper layer of the first main printed circuit board 41 or the main board 31 .

[0076] First, if the jth and j+1th printed circuit boards are not integrally formed but instead feature separate designs, this will greatly enhance the flexibility and adjustability of the power supply network. This separate design allows designers to more easily adjust the positions and angles of the two printed circuit boards independently based on actual needs and space constraints, thereby optimizing the overall layout. This flexibility means that specific installation requirements can be easily adapted to different application scenarios or device structures. If a printed circuit board fails or needs to be replaced, technicians can operate independently of the other boards without having to disassemble the entire circuit module, saving time and reducing maintenance difficulties. This modular construction approach also opens up more possibilities for future system expansion, allowing users to flexibly add or replace circuit boards as needed, thereby improving system functionality and performance.

[0077] In this embodiment, if the power supply network design incorporates the jth power conductor and the j+1th power conductor, and the jth printed circuit board (PCB) on which these two conductors reside is adjacent to the j+1th PCB, in the specific case (where j is one or two), these two PCBs can be integrated into a first master PCB 41. This integrated design not only simplifies circuit connections and wiring, reduces impedance at the connections, and reduces the number of connectors and the corresponding space occupied, but also reduces power transmission efficiency issues caused by poor contact or connector losses. The first master PCB 41 can be flexibly installed above or below the mainboard 31, providing greater design flexibility and adapting to varying space requirements and heat dissipation needs.

[0078] Furthermore, the power module 34 is mounted on the first main printed circuit board 41, ensuring that it receives a stable and appropriate voltage. This design effectively integrates power management functions into the printed circuit board, simplifying the overall power supply network structure and improving system reliability and maintainability. When j is 2, the power module 34 can be mounted on the upper layer of the first main printed circuit board 41 or the mainboard 31 (specifically, the distance between the power module 34 and the heat sink module is greater than the distance between the third printed circuit board 23 and the heat sink module). This flexible mounting option allows designers to optimally arrange the position of the power module 34 based on specific space and functional requirements, further improving the overall performance and functional expansion capabilities of the circuit.

[0079] In summary, this embodiment optimizes the layout of the power supply network and improves power transmission efficiency through an integrated design and flexible installation method, while enhancing system integration and functional scalability, helping to meet the requirements of modern servers for high performance and high-density integration.

[0080] As an optional embodiment, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0081] The first printed circuit board 21, the second printed circuit board 22 and the third printed circuit board 23 are integrally formed into a second total printed circuit board 51, and the second total printed circuit board 51 is installed on the upper layer or the lower layer of the main board 31;

[0082] The module to be powered 34 is mounted on the second main printed circuit board 51 . The module to be powered 34 is mounted on the second main printed circuit board 51 or the upper layer of the main board 31 .

[0083] In this embodiment, the power supply network utilizes three power conductors, and three printed circuit boards are arranged in a predetermined sequence to achieve more efficient power management and transmission. These three printed circuit boards—the first printed circuit board 21, the second printed circuit board 22, and the third printed circuit board 23—are integrated into a second master printed circuit board 51. This design simplifies the overall circuit structure, reduces the number of connection points, and lowers the impedance at these connections, thereby reducing losses and potential failure points during power transmission. Furthermore, the second master printed circuit board 51 can be flexibly installed above or below the mainboard 31, providing greater spatial flexibility.

[0084] In this embodiment, the module to be powered is mounted on the second main printed circuit board 51 to ensure that the required power can be obtained stably and efficiently. This integrated design not only helps to simplify the power management process, but also improves the overall reliability of the system.

[0085] The standby power module 34 can be installed on the upper layer of the second main printed circuit board 51 or the mainboard 31, depending on specific needs. However, the distance between the standby power module 34 and the heat dissipation module must be considered during design, ensuring that this distance is greater than the distance between the third printed circuit board 23 and the heat dissipation module. This design consideration is primarily intended to optimize heat dissipation and prevent the adverse effects of high temperatures on the standby power module 34. Maintaining an appropriate distance effectively reduces module temperature, improving operational stability and service life.

[0086] In summary, this design, through its integrated overall PCB structure and flexible module mounting method, not only improves power transmission efficiency but also optimizes thermal management, meeting the requirements of modern electronic devices for high performance, high integration, and good heat dissipation performance.

[0087] As an optional embodiment, the upper layer or the lower layer of the main board 31 is provided with an i-th groove;

[0088] The size of the i-th groove is the same as the size of the i-th printed circuit board, and the i-th printed circuit board is installed in the i-th groove.

[0089] In this embodiment, the upper or lower layer of the mainboard 31 is provided with an i-th groove, the dimensions of which are identical to those of the i-th printed circuit board, providing a precisely matched mounting location for the board. This design not only improves installation convenience and accuracy but also enhances the structural stability of the entire system. By installing the i-th printed circuit board in the corresponding groove, the board's secureness during use is ensured, minimizing displacement or damage due to vibration or other external forces, thereby improving system reliability.

[0090] Furthermore, this groove design helps optimize space utilization, ensuring the printed circuit board can be effectively secured to the motherboard 31, thereby avoiding the use of unnecessary connectors or support structures and simplifying circuit layout. Furthermore, the presence of the groove also helps improve heat dissipation performance. This is because the groove acts as a natural heat dissipation channel, allowing heat to be more effectively transferred to the surface of the motherboard 31, thereby improving overall thermal management efficiency.

[0091] This design approach provides better wiring space, facilitates the proper placement of wires and power transmission, and reduces the risk of signal interference. Furthermore, the precise matching of groove dimensions with the circuit board facilitates subsequent maintenance and replacement, allowing technicians to more easily disassemble and assemble, improving system maintainability.

[0092] As an optional embodiment, if the power supply network includes a jth power conductor and a j+1th power conductor, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two;

[0093] The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first main printed circuit board 41, and the first main printed circuit board 41 is mounted on the upper or lower layer of the main board 31; the module to be powered is mounted on the first main printed circuit board 41. When j is 2, the module to be powered 34 is mounted on the upper layer of the first main printed circuit board 41 or the main board 31.

[0094] The j-th groove and the j+1-th groove are integrally formed into a first main groove, and the first main printed circuit board 41 is installed in the first main groove.

[0095] In this embodiment, the first main groove is formed by integrally molding the jth groove and the j+1th groove. This integrated design greatly enhances installation stability and overall structural integrity. By combining two adjacent grooves into a single main groove, the first main printed circuit board 41 is ensured to be securely and accurately positioned during installation. This groove design not only provides suitable space to accommodate the circuit board but also optimizes the fit between the circuit board and the mainboard 31, avoiding poor contact and functional failure due to mismatch or deviation. Furthermore, the presence of the first main groove also provides better conditions for heat dissipation, as the integrated design reduces air flow obstruction, helps improve heat conduction efficiency, and ensures safe and stable operation of the system.

[0096] As an optional embodiment, if the power supply network includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order;

[0097] The first printed circuit board 21, the second printed circuit board 22 and the third printed circuit board 23 are integrally formed into a second main printed circuit board 51, and the second main printed circuit board 51 is installed on the upper or lower layer of the main board 31; the power supply module 34 is installed on the upper layer of the second main printed circuit board 51 or the main board 31.

[0098] The first groove, the second groove, and the third groove are integrally formed into a second main groove, and the second main printed circuit board 51 is installed in the second main groove.

[0099] In this embodiment, the second main groove is formed by integrally forming the first groove, the second groove and the third groove, and is intended to provide a precise fixed position for the second main printed circuit board 51. Such a design not only simplifies the installation process, allowing multiple circuit boards to be firmly placed in one groove at the same time, but also further enhances the structural integrity and stability of the system. By integrating multiple grooves into one main groove, the overall poor installation caused by the displacement or damage of a single groove can be effectively reduced, ensuring a good electrical connection between the power wire and the circuit board, thereby improving the reliability and efficiency of the power supply network. In addition, the design of the second main groove can also optimize the heat dissipation performance, avoid the heat dissipation affected by the air isolation between multiple independent grooves, and thus improve the working stability of the entire device. In short, the design concepts of these two main grooves are aimed at optimizing the performance of the overall circuit by improving the stability and heat dissipation performance of the components, laying the foundation for high efficiency and reliability.

[0100] As an optional embodiment, when the power supply network includes the i-th power wire, the i-th power wire replaces the power wires of the mainboard 31 that correspond to the i-th power wire.

[0101] In this embodiment, when the power supply network includes an i-th power conductor, the i-th power conductor is designed to directly replace the portion of the power line on the motherboard 31 corresponding to the i-th power conductor. The core of this design strategy is to simplify the power transmission path. By removing the corresponding power line on the motherboard 31, the i-th power conductor is used to form a separate power path.

[0102] This replacement design, by eliminating the power cord in the motherboard 31, can reduce the complexity and number of components on the circuit board, thereby reducing manufacturing and maintenance costs. At the same time, the simplified power path helps to reduce interference between power conductors and improve the clarity and stability of signal transmission. This design with fewer connection points can reduce losses during power transmission, improve energy efficiency, and thus optimize the overall performance of the server. This design helps to save space in the motherboard 31, especially in high-density circuit board layouts. Using the i-th power conductor to replace the power cord of the motherboard 31 can free up valuable space for other functional modules or heat dissipation components, thereby improving the functional integration of the system. At the same time, this flexible power management method also makes it more convenient for the device to be upgraded or expanded in the future. Users can easily adjust the configuration of the power conductor according to their needs without having to consider the limitations of the power cord of the motherboard 31.

[0103] As an optional embodiment, the thickness of each power wire is greater than the thickness of the power wire of the mainboard 31 , so that the resistance of each power wire is smaller than the resistance of the power wire of the mainboard 31 .

[0104] In this embodiment, the thickness of each power conductor is greater than the thickness of the power line of the mainboard 31. The core goal of this design choice is to reduce the impedance of the power conductor, thereby achieving more efficient power transmission. Since the resistance of the power conductor is inversely proportional to its cross-sectional area, increasing the thickness of the conductor can effectively increase the cross-sectional area of ​​the conductor, thereby reducing its resistance. This design not only helps to reduce energy loss during power transmission and improve overall power efficiency, but also reduces heat accumulation caused by high current, reduces the risk of heat generation in the equipment, and thus improves the heat dissipation performance of the system. In addition, the larger wire thickness improves the mechanical strength of the power conductor to a certain extent, enhances the reliability of the system, and ensures stable power supply under high load conditions.

[0105] As an optional embodiment, the material of each power conductor is a preset material or a preset composite material, the thickness of the power conductor is not less than the thickness of the power conductor of the mainboard 31, and the resistance of the power conductor of the first size composed of the preset material or the preset composite material is less than the resistance of the power conductor of the mainboard 31 of the first size.

[0106] In this embodiment, the material of the power conductor is selected to be a preset material or a preset composite material, the thickness of which is not less than the thickness of the power line of the mainboard 31, ensuring that the resistance of the power conductor composed of these materials is less than the resistance of the power line of the mainboard 31. By adopting highly conductive materials or optimized composite materials, the conductivity of the power conductor can be effectively improved. Even when the thickness is the same, the impedance of the conductor is still lower than that of the power line of the mainboard 31. This design ensures that under the same space and design constraints, the power conductor can achieve better power transmission efficiency and reduce power consumption. For example, when the power line of the mainboard 31 is a copper wire, the preset material or preset composite material of the power conductor can be aluminum alloy, silver, or highly conductive carbon nanomaterials. These materials have higher conductivity and can provide a lower resistance than copper wire under the same conditions. At the same time, they may have a lighter weight or better corrosion resistance, thereby improving the adaptability of the system in various working environments.

[0107] Specifically, if Figures 2 to 4 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer conductor in the printed circuit board from the power supply 32 outlet to the voltage management module 33 inlet.

[0108] in, Figure 2 The solution demonstrates the use of a low-resistance first printed circuit board (PCB) 21, located above a mainboard 31. This PCB connects a power supply 32 to a voltage management module 33. The voltage management module 33 can provide either a single-stage conversion (e.g., 12V to 1V) or a two-stage conversion (e.g., 48 / 54V to 1V). Mounted on the mainboard 31, the voltage management module 33 connects to a module to be powered 34, forming a power supply path from power supply 32 to first PCB 21 to voltage management module 33 to module to be powered 34.

[0109] Figure 3 The solution of using a low-resistance first printed circuit board 21 is demonstrated. The first printed circuit board 21 replaces a part of the mainboard 31 structure, is embedded in the mainboard 31, and connects the power supply 32 and the voltage management module 33. The voltage management module 33 is installed on the mainboard 31 and connected to the module to be powered 34, forming a power supply path of "power supply 32 → first printed circuit board 21 → voltage management module 33 → module to be powered 34".

[0110] Figure 4The proposed solution utilizes a low-resistance first printed circuit board (PCB) 21, located below a mainboard 31. This first PCB 21 connects a power supply 32 to a voltage management module 33. The voltage management module 33 is mounted on the mainboard 31 and connected to a module to be powered 34, forming a power supply path from power supply 32 to first PCB 21 to voltage management module 33 to module to be powered 34. All three solutions can reduce the resistance of the wiring in the power layer of the first PCB 21, from the power supply 32 outlet to the voltage management module 33 inlet.

[0111] like Figures 5 to 7 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power supply layer conductor in the printed circuit board in the voltage management module 33 area, wherein: Figure 5 The solution using low-resistance first and second printed circuit boards 22 is demonstrated. The second printed circuit board 22 replaces a portion of the mainboard 31 structure and is embedded in the mainboard 31. It connects the low-resistance first printed circuit board 21 with a voltage management module 33. The voltage management module 33 is mounted on the low-resistance second printed circuit board 22 and connected to a module to be powered 34, forming a power supply path of "power supply 32 → low-resistance first printed circuit board 21 → low-resistance second printed circuit board 22 → voltage management module 33 → module to be powered 34".

[0112] Figure 6 The solution using low-resistance first and second printed circuit boards 22 is shown. The second printed circuit board 22 replaces a portion of the mainboard 31 structure and is embedded in the mainboard 31. The second printed circuit board 22 connects the first printed circuit board 21 and the voltage management module 33. The voltage management module 33 is mounted on the second printed circuit board 22 and connected to the module to be powered 34. The first printed circuit board 21 replaces a portion of the mainboard 31 structure and is embedded in the mainboard 31, forming a power supply path of "power supply 32 → low-resistance first printed circuit board 21 → low-resistance second printed circuit board 22 → voltage management module 33 → module to be powered 34";

[0113] Figure 7 The solution demonstrates the use of low-resistance first and second printed circuit boards (PCBs) 22. This second PCB 22 replaces a portion of the mainboard 31 and is embedded within it, connecting the low-resistance first PCB 21 to a voltage management module 33. The voltage management module 33 is mounted on the low-resistance second PCB 22 and connected to a module to be powered 34. The low-resistance first PCB 21 is located on the back of the mainboard 31, forming a power supply path from power source 32 to low-resistance first PCB 21 to low-resistance second PCB 22 to voltage management module 33 to module to be powered 34. All three solutions can reduce the resistance of the power layer conductors on the PCB in the area of ​​the voltage management module 33.

[0114] like Figures 8 to 10 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer conductors in the printed circuit board in the voltage management module 33 area.

[0115] in, Figure 8 The solution using a low-resistance printed circuit board (PCB) is shown. The first main PCB 41 is located above the main board 31 and connects the power supply 32 to the module to be powered 34. The voltage management module 33 is mounted on the low-resistance first main PCB 41, forming a power supply path from "power supply 32 → first main PCB 41 → voltage management module 33 → module to be powered 34."

[0116] Figure 9 The solution using a low-resistance printed circuit board (PCB) is shown. The first main PCB 41 replaces a portion of the mainboard 31 and is embedded within the mainboard 31, connecting the power supply 32 to the module to be powered 34. The voltage management module 33 is mounted on the first main PCB 41, forming a power supply path from the power supply 32 to the first main PCB 41 to the voltage management module 33 to the module to be powered 34.

[0117] Figure 10 A solution using a low-resistance printed circuit board (PCB) is demonstrated. This PCB, located on the back of the mainboard 31, connects the power supply 32 to the module to be powered 34. The voltage management module 33 is mounted on the first main PCB 41, forming a power supply path from power supply 32 to first main PCB 41 to voltage management module 33 to module to be powered 34. All three solutions can reduce the resistance of the power layer conductors on the PCB in the area of ​​the voltage management module 33.

[0118] like Figures 11 to 13 As shown, this embodiment discloses three technical solutions for reducing the resistance of the power layer conductor in the printed circuit board directly below the module to be powered 34.

[0119] in, Figure 11 The solution using a low-resistance second main printed circuit board 51 is shown. This second main printed circuit board 51 is located above the main board 31 and connects the power supply 32 to the module to be powered 34. The voltage management module 33 is mounted on the second main printed circuit board 51, and the module to be powered 34 is also mounted on the second main printed circuit board 51, forming a power supply path of "power supply 32 → second main printed circuit board 51 + voltage management module 33 → module to be powered 34";

[0120] Figure 12The solution using a low-resistance second main printed circuit board 51 is shown. This second main printed circuit board 51 replaces a portion of the main board 31 structure and is embedded in the main board 31, connecting the power supply 32 and the module to be powered 34. The voltage management module 33 is mounted on the second main printed circuit board 51, and the module to be powered 34 is mounted on the second main printed circuit board 51, forming a power supply path of "power supply 32 → second main printed circuit board 51 + voltage management module 33 → module to be powered 34";

[0121] Figure 13 The solution demonstrates the use of a low-resistance second main PCB 51, located on the back of the mainboard 31. This second main PCB 51 replaces a portion of the mainboard 31 structure and is embedded within it, connecting the power supply 32 and the module to be powered 34. The voltage management module 33 is mounted on the second main PCB 51, and the module to be powered 34 is mounted on the mainboard 31, forming a power supply path from "power supply 32 → second main PCB 51 + voltage management module 33 → module to be powered 34." All three solutions can reduce the resistance of the power layer conductors in the PCB directly below the module to be powered 34.

[0122] It should be understood that this application only lists Figure 2-13 These 12 embodiments do not list all the embodiments of the present application.

[0123] The technical solution of the present invention can effectively reduce the resistance of the power layer wire in the printed circuit board from the power bus outlet of the power supply 32 to the entrance of the voltage management module 33, and / or reduce the resistance of the power layer wire in the printed circuit board directly below the voltage management module 33, or reduce the resistance of the power layer wire in the printed circuit board in the integrated module of the voltage management module 33, and / or reduce the resistance of the power layer wire in the printed circuit board directly below the module to be powered 34, thereby helping to reduce the power loss during long-distance transmission in this path, reducing the power loss on the server motherboard 31, and improving energy efficiency.

[0124] As an optional embodiment, when the power supply network includes all power supply wires and the power line of the mainboard 31, the power supply network also includes:

[0125] A switching device, a first end of which is connected to the power supply 32, a second end of which is connected to the input end of the first power conductor 11, and a third end of which is connected to the power line of the mainboard 31;

[0126] The switching device is configured to conduct a second path between the first terminal and the third terminal according to a control instruction so that the power supply 32 provides power to the module to be powered 34 through the second path;

[0127] The switching device receives a control instruction when a first path between the first end and the second end of the switching device fails.

[0128] In this embodiment, the power supply network is designed with reliability and flexibility in mind. The switching device and fault detection module work together to ensure that unexpected faults can be addressed during power transmission. Specifically, the first end of the switching device is connected to the power supply 32, the second end is connected to the input end of the first power conductor 11, and the third end is connected to the power line of the mainboard 31. This layout allows the switching device to flexibly switch between different power conductors, thereby ensuring that the module to be powered 34 always receives the required power.

[0129] Under normal operating conditions, the switching device, in response to control instructions, opens the first path between the first and second ends, allowing the power supply 32 to provide power to the module to be powered 34 through this path. However, to enhance the system's fault tolerance, the switching device also has the function of automatically switching when a fault occurs in the first path. When the fault detection module detects an abnormality or fault in the first path, it immediately sends a control instruction to the switching device, instructing it to open the second path between the first and third ends. This allows the power supply 32 to continue to provide power to the module to be powered 34 via the power cord of the mainboard 31, ensuring the normal operation of the system.

[0130] This mechanism enables the power supply network to quickly respond to faults, improving power supply stability while reducing the risk of power outages caused by single-path failures. Overall, this design approach not only optimizes the flexibility of the power supply system but also enhances the safety and reliability of server power during operation, allowing servers to more confidently respond to various workloads and environmental changes.

[0131] As an optional embodiment, when the power supply network includes all power supply wires and the power line of the mainboard 31, the power supply network also includes:

[0132] A switching device, a first end of which is connected to the power supply 32, a second end of which is connected to the input end of the first power conductor 11, and a third end of which is connected to the power line of the mainboard 31;

[0133] The switching device is configured to select, according to a control instruction, to conduct a first path between the first end and the second end thereof so that the power supply 32 provides power to the module to be powered 34 through the first path, or to conduct a second path between the first end and the third end thereof so that the power supply 32 provides power to the module to be powered 34 through the second path;

[0134] The control instruction is determined based on the acquired target power supply and the power consumption of the server.

[0135] In this embodiment, a switching device is designed to switch between different power supply paths based on control instructions, considering that flexibility and redundancy are very important in specific scenarios. First, the server load may vary over time. For example, during peak usage, the server's power consumption may increase significantly, while decreasing during low load or idle periods. In this case, the ability to switch power paths allows the system to flexibly adjust the source of power supply based on the difference between real-time power consumption and the target power supply, ensuring that the power requirements of system operation are always met, thereby avoiding failures or performance degradation caused by insufficient power supply.

[0136] Furthermore, while the power lines of the motherboard 31 may have high resistance, their presence is still necessary because they likely perform other important functions, such as providing stable power to various modules and components. Simply abandoning the motherboard 31 power lines would affect the stability and reliability of the overall system. Using power lines with lower resistance ensures stable power transmission while maintaining support for the motherboard 31. Therefore, the design of the switching device allows for dynamic selection between different power lines, maximizing the low resistance of the lines while maintaining the essential functionality of the motherboard 31 power lines, thereby achieving efficient, safe, and reliable power management.

[0137] As an optional embodiment, the power supply network further includes: a prediction module, whose output end is connected to the switching device, and is used to obtain historical power consumption data of the server within a historical preset time period, the target task of the server within a future preset time period, predict the expected power consumption of the server within the future preset time period based on the target task and the historical power consumption data, and generate a control instruction based on the expected power consumption and the obtained target power supply within the future preset time period. As an optional embodiment, the prediction module is specifically used to generate a first control instruction when the difference between the target power supply and the expected power consumption is greater than a preset threshold, and to generate a second control instruction when the difference between the target power supply and the expected power consumption is not greater than the preset threshold; the switching device is specifically used to conduct a first path between its first end and the second end according to the first control instruction so that the power supply 32 provides power to the module to be powered 34 through the first path, and to conduct a second path between its first end and the third end according to the second control instruction so that the power supply 32 provides power to the module to be powered 34 through the second path.

[0138] In this embodiment, a prediction module is introduced into the power supply network, aiming to improve server energy efficiency and power supply reliability through intelligent power management. The prediction module's primary function is to analyze the server's power consumption data over a preset historical time period and, combined with the server's target tasks for a preset future time period, conduct a comprehensive assessment and prediction. This prediction process involves identifying past power consumption patterns and anticipating future task requirements, thereby calculating the server's expected power consumption for the preset future time period.

[0139] Based on the assessment of expected power consumption, the prediction module further compares it with the target power supply and generates corresponding control instructions. When the difference between the target power supply and the expected power consumption is greater than a preset threshold, the prediction module generates a first control instruction, instructing the switching device to prioritize the use of power conductors with lower resistance to ensure efficient power supply to cope with possible high-load conditions. When the difference between the target power supply and the expected power consumption is not greater than the preset threshold, a second control instruction is generated, allowing the switching device to continue using the power line of the motherboard 31 to achieve stable power supply. Based on these control instructions, the switching device flexibly conducts its own path, allowing the power supply 32 to effectively provide the required power to the module to be powered 34 through the first path or the second path.

[0140] This design approach not only optimizes power transmission efficiency but also enhances the power supply system's responsiveness to changing load conditions, ensuring that servers receive the power they need under varying operating conditions. Through intelligent prediction and dynamic switching, the power supply network can better adapt to the complex power management requirements of modern data centers, achieving a balance between energy conservation and security.

[0141] In a second aspect, the present application provides a power supply system for a server, wherein the server includes a mainboard 31, a voltage management module 33, and a power supply module 34, including:

[0142] The power supply 32 is a power supply network such as the above, the input end of the power supply network is connected to the power supply 32, and the output end of the power supply network is connected to the power supply end of the module to be powered 34. For other introductions to the power supply network, please refer to the above embodiments, which will not be repeated here.

[0143] In a third aspect, the present application provides a server comprising the power supply system as described above.

[0144] For other introductions to the server, please refer to the above embodiments, and this application will not go into details here.

[0145] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0146] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power supply device, characterized in that: Applied to a server, the server includes a mainboard, a voltage management module and a module to be powered, and the power supply device includes: A first power supply wire is provided in the first printed circuit board and is used to connect the power supply and the voltage management module; and / or, a second power conductor, provided in a second printed circuit board, for connecting to the voltage management module, a third power conductor, or a power line on the mainboard, the voltage management module being mounted on the second printed circuit board; And / or, the third power conductor is provided in a third printed circuit board, and is used to connect the power line on the mainboard or the second power conductor, and the module to be powered, and the module to be powered is installed on the upper layer of the third printed circuit board or the mainboard; All power conductors and / or the power lines in the mainboard and the voltage management module work together to transmit the power provided by the power supply to the module to be powered; the resistance of each power conductor is less than the resistance of the power line in the mainboard; The upper layer or the lower layer of the mainboard is provided with an i-th groove; the size of the i-th groove is the same as the size of the i-th printed circuit board, and the i-th printed circuit board is installed in the i-th groove; i is one, two or three; If the power supply device includes the jth power wire and the j+1th power wire, and the jth printed circuit board is adjacent to the j+1th printed circuit board, j is one or two; the jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper or lower layer of the mainboard; the module to be powered is installed on the first total printed circuit board; when j is two, the module to be powered is installed on the first total printed circuit board or the upper layer of the mainboard; the jth groove and the j+1th groove are integrally formed into a first total groove, and the first total printed circuit board is installed in the first total groove.

2. The power supply device according to claim 1, wherein: The i-th printed circuit board is mounted on the upper layer or the lower layer of the main board, where i is one, two or three; And when i is three, if the third printed circuit board is installed on the upper layer of the mainboard, the module to be powered is installed on the third printed circuit board; if the third printed circuit board is installed on the lower layer of the mainboard, the module to be powered is installed on the mainboard, and the distance between the module to be powered and the heat dissipation module is greater than the distance between the third printed circuit board and the heat dissipation module.

3. The power supply device according to claim 2, wherein: If the power supply device includes a jth power conductor and a j+1th power conductor, and the jth printed circuit board is adjacent to the j+1th printed circuit board, and j is one or two; The jth printed circuit board and the j+1th printed circuit board are integrally formed into a first total printed circuit board, and the first total printed circuit board is installed on the upper layer or the lower layer of the main board; The module to be powered is installed on the first main printed circuit board; When j is 2, the module to be powered is installed on the first main printed circuit board or the upper layer of the main board.

4. The power supply device according to claim 2, wherein: If the power supply device includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order; The first printed circuit board, the second printed circuit board and the third printed circuit board are integrally formed into a second total printed circuit board, and the second total printed circuit board is installed on the upper layer or the lower layer of the main board; The module to be powered is installed on the second main printed circuit board, and the module to be powered is installed on the second main printed circuit board or the upper layer of the main board.

5. The power supply device according to claim 2, wherein: If the power supply device includes three power conductors, and the three printed circuit boards are arranged in sequence according to a preset order; The first printed circuit board, the second printed circuit board, and the third printed circuit board are integrally formed into a second main printed circuit board, and the second main printed circuit board is mounted on the upper layer or lower layer of the main board; the module to be powered is mounted on the second main printed circuit board, and the module to be powered is mounted on the upper layer of the second main printed circuit board or the main board; The first groove, the second groove, and the third groove are integrally formed into a second main groove, and the second main printed circuit board is installed in the second main groove.

6. The power supply device according to claim 1, wherein: When the power supply device includes an i-th power wire, the i-th power wire replaces the power wires of the mainboard corresponding to the i-th power wire, and i is one, two, or three.

7. The power supply device according to claim 1, wherein: The thickness of each power wire is greater than the thickness of the power wire of the mainboard, so that the resistance of each power wire is smaller than the resistance of the power wire of the mainboard.

8. The power supply device according to claim 1, wherein: The material of each power wire is a preset material or a preset composite material, the thickness of the power wire is not less than the thickness of the power wire of the mainboard, and the resistance of the power wire of the first size made of the preset material or the preset composite material is less than the resistance of the power wire of the mainboard of the first size.

9. The power supply device according to any one of claims 1 to 8, characterized in that: When the power supply device includes all the power wires and the power line of the mainboard, the power supply device further includes: a switching device, a first end of which is connected to the power supply, a second end of which is connected to the input end of the first power wire, and a third end of which is connected to the power line of the mainboard; The switching device is configured to select, according to a control instruction, to conduct a first path between its first end and the second end so that the power supply provides power to the module to be powered through the first path, or to conduct a second path between its first end and the third end so that the power supply provides power to the module to be powered through the second path; The control instruction is determined according to the acquired target power supply and the power consumption of the server.

10. The power supply device according to claim 9, wherein: The power supply device further includes: A prediction module, whose output end is connected to the switching device, is used to obtain the historical power consumption data of the server in a historical preset time period and the target task of the server in a future preset time period, predict the expected power consumption of the server in the future preset time period based on the target task and the historical power consumption data, and generate the control instruction based on the expected power consumption and the obtained target power supply in the future preset time period.

11. The power supply device according to claim 10, wherein: The prediction module is specifically configured to generate a first control instruction when the difference between the target power supply and the expected power consumption is greater than a preset threshold, and generate a second control instruction when the difference between the target power supply and the expected power consumption is not greater than the preset threshold; The switching device is specifically used to conduct a first path between its first end and the second end according to the first control instruction so that the power supply provides power to the module to be powered through the first path, and to conduct a second path between its first end and the third end according to the second control instruction so that the power supply provides power to the module to be powered through the second path.

12. A power supply system, characterized in that: Applied to a server, the server includes a mainboard, a voltage management module, and a module to be powered, including: A power supply, a power supply device as described in any one of claims 1 to 11, wherein the input end of the power supply device is connected to the power supply, and the output end of the power supply device is connected to the power supply end of the module to be powered.

13. A server, characterized in that: Comprising the power supply system as claimed in claim 12.

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