A construction method and device for the secondary piping assembly process of a semiconductor production line

Abstract

The present invention discloses a method and device for constructing a secondary piping assembly process of a semiconductor production line. According to the user's primary input, the data of secondary piping components in a pre-constructed database is retrieved; based on a preset secondary piping component assembly logic, a two-dimensional pipeline logic diagram of the connection of two-dimensional graphics of each secondary piping component is given, and combined with the legends of the corresponding two-dimensional graphics, an initial assembly process of the secondary piping of the semiconductor production line is formed; based on the user's secondary input, the initial assembly process of the secondary piping of the semiconductor production line is optimized to construct the assembly process of the secondary piping of the semiconductor production line. The construction scheme of the secondary piping assembly process of the semiconductor production line given by the present invention not only improves the standardization and automation of the assembly process design, improves the design efficiency, but also enhances the consistency and scalability of the secondary piping assembly, improves the accuracy and readability of the secondary piping assembly process, and reduces the pipeline construction cost of the secondary piping.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and particularly relates to a construction method and device for the secondary piping assembly process of a semiconductor production line. Background Art

[0002] In the process of semiconductor manufacturing, the secondary piping of a semiconductor production line refers to the process of connecting main process equipment with auxiliary systems (such as gases, chemicals, pure water, etc.). The traditional drawing of the secondary piping assembly process relies on manual work, which is not only time-consuming and laborious but also error-prone.

[0003] At the same time, with the continuous development of semiconductor manufacturing processes, the complexity of the main process equipment, auxiliary systems, and their connections in semiconductor manufacturing is increasing day by day. The traditional method of drawing the secondary piping assembly process has been difficult to meet the rapidly developing requirements.

[0004] Currently, there have been some studies on automated software, model platforms, etc. for process flow drawing. For example, Patent CN117077458A provides a method and device for constructing a dynamic simulation model of an electronic product production line. The method includes: based on the process route of the electronic product production line, providing the layout information, manufacturing information, and logistics task information of the electronic product production line; according to the layout information of the electronic product production line, building a layout model of the electronic product production line; according to the layout model of the electronic product production line, combining a preset coding strategy, providing layout link parameters for the electronic product production line, and the layout link parameters are used to associate the layout information and manufacturing information of the electronic product production line; embedding a call module in the layout model of the electronic product production line to obtain a dynamic simulation model of the electronic product production line, and the call module is used to call logistics task information according to the layout link parameters. This solution can quickly and accurately obtain a dynamic simulation model from the layout model of the electronic product production line, has strong universality, and improves the dynamic simulation effect of the electronic product production line.

[0005] However, current automated software, model platforms, etc. lack corresponding processing capabilities for the graphic conversion, data storage of secondary piping components, and the standardized output process of secondary piping assembly.

[0006] Therefore, how to design a construction scheme for the secondary piping assembly process suitable for a semiconductor production line to achieve the automated output of the secondary piping assembly process and improve the accuracy and readability of the secondary piping assembly process is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0007] In view of the defects existing in the above-mentioned prior art, the present invention provides a method and device for constructing the secondary piping assembly process of a semiconductor production line. According to the user's first input, the secondary piping component data in a pre-constructed database is retrieved; based on a preset secondary piping component assembly logic, a two-dimensional pipeline logic relationship diagram of the connection of the two-dimensional graphics of each secondary piping component is given, and combined with the legends of the corresponding two-dimensional graphics, an initial assembly process of the secondary piping of the semiconductor production line is formed; based on the user's second input, the initial assembly process of the secondary piping of the semiconductor production line is optimized to construct the assembly process of the secondary piping of the semiconductor production line. The construction scheme of the secondary piping assembly process of the semiconductor production line provided by the present invention not only improves the automation degree of the assembly process design, but also improves the design efficiency through the standardized setting of legends and two-dimensional graphics, enhances the consistency and scalability in the construction process of the secondary piping assembly process of the semiconductor production line, and improves the accuracy and readability of the secondary piping assembly process of the semiconductor production line, and reduces the pipeline construction cost of the secondary piping.

[0008] In a first aspect, the present invention provides a method for constructing a secondary piping assembly process of a semiconductor production line, which specifically includes the following steps:

[0009] According to the user's first input, the secondary piping component data in a pre-constructed database is retrieved, wherein the secondary piping component data includes the legends and two-dimensional graphics of the secondary piping components, and the two-dimensional graphics are formed by converting the three-dimensional models of the secondary piping components according to defined model conversion rules;

[0010] Based on a preset secondary piping component assembly logic, a two-dimensional pipeline logic relationship diagram of the connection of the two-dimensional graphics of each secondary piping component is given, and combined with the legends of the corresponding two-dimensional graphics, an initial assembly process of the secondary piping of the semiconductor production line is formed;

[0011] Based on the user's second input, the initial assembly process of the secondary piping of the semiconductor production line is optimized to construct the assembly process of the secondary piping of the semiconductor production line.

[0012] Further, the user's first input includes the process requirements of semiconductor production and the attribute information of semiconductor production equipment, and the attribute information of semiconductor production equipment includes the interface information and layout information of semiconductor production equipment.

[0013] Further, the database includes a legend library and a two-dimensional graphics library. The legend library includes the legends of secondary piping components, and the two-dimensional graphics library includes the two-dimensional graphics of secondary piping components;

[0014] The construction of the database specifically includes the following steps:

[0015] Based on the defined legend rules, a legend associated with the secondary piping assembly is given to form a legend library. Among them, the graphical rules are the rules between the secondary piping assembly and the symbols and colors of the corresponding legend;

[0016] Collect the 3D model of the secondary piping assembly, and through the defined model conversion rules, convert the 3D model into a 2D graphic to form a 2D graphic library.

[0017] Furthermore, the definition of the model conversion rules specifically includes the following steps:

[0018] Based on the type of the secondary piping assembly, determine the view type for converting the model into a 2D graphic;

[0019] Define the projection plane according to the view type of the 2D graphic, and combine the view direction of the 3D model and the preset presentation size of the 2D graphic to obtain the initial 2D graphic by means of projection offset, specifically expressed as:

[0020]

[0021] Among them, X i 、Y i 、Z i are the abscissa, ordinate, and vertical coordinate of the i-th point of the 3D model in the 3D space, x i 、y i are the abscissa and ordinate of the i-th point of the 3D model on the projection plane, k x is the scaling ratio of the abscissa of the projection plane, k y is the scaling ratio of the ordinate of the projection plane, m is the coordinate of the axis corresponding to the abscissa of the projection plane in the 3D space coordinate system, n is the coordinate of the axis corresponding to the ordinate of the projection plane in the 3D space coordinate system, l is the coordinate of the axis other than m and n in the 3D space coordinate system, α m is the angle between the axis where m is located and the abscissa of the projection plane, α n is the angle between the axis where n is located and the ordinate of the projection plane, d x is the offset of the i-th point of the 3D model on the abscissa of the projection plane, d y is the offset of the i-th point of the 3D model on the ordinate of the projection plane;

[0022] Optimize the initial 2D graphic to obtain the 2D graphic.

[0023] Furthermore, the secondary piping assembly includes the pipes of the secondary piping and the functional controls of the secondary piping;

[0024] Based on the preset assembly logic of the secondary piping assembly, a 2D pipeline logic relationship diagram for connecting the 2D graphics of each secondary piping assembly is given, specifically including the following steps:

[0025] Determine the assembly path of the pipes for secondary piping based on the attribute information of semiconductor production equipment;

[0026] Based on the assembly path of the pipes for secondary piping, determine the connection relationships of the pipes for each secondary piping and the functional controls of the secondary piping;

[0027] Combining the connection relationships of each secondary piping component and the attribute information of the secondary piping component, present a two-dimensional pipeline logic diagram of the two-dimensional graphic connection of each secondary piping component.

[0028] Furthermore, the functional controls of the secondary piping include secondary piping equipment, secondary piping tees, secondary piping valves, and accessory pipes;

[0029] Based on the assembly path of the pipes for secondary piping, determine the connection relationships of the pipes for each secondary piping and the functional controls of the secondary piping, specifically including the following steps:

[0030] Based on the assembly path of the pipes for secondary piping, determine the semiconductor production area for secondary piping assembly, and give the assembly position of the secondary piping equipment;

[0031] Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, and connect the secondary piping equipment, the pipes for secondary piping, and the secondary piping tee;

[0032] Determine the assembly positions of the secondary piping valves and the accessory pipes to form the connection relationships of the pipes for each secondary piping and the functional controls of the secondary piping.

[0033] Furthermore, determine the semiconductor production area for secondary piping assembly, and give the assembly position of the secondary piping equipment, specifically including the following steps:

[0034] Define the area hierarchy of the semiconductor production area, and set sequence numbers in the order of the area hierarchy;

[0035] Based on the sequence number of the area hierarchy, with the first area hierarchy as the starting point for the assembly position of the secondary piping equipment, layout from left to right according to the equipment size and the preset interval;

[0036] Enter the next area hierarchy, and re-determine the starting point, assembly orientation, and assembly direction of the assembly position of the secondary piping equipment, where the assembly orientation and assembly direction of the next area hierarchy are the same as those of the previous area hierarchy;

[0037] Until the assembly of the secondary piping equipment in all area hierarchies is completed.

[0038] Furthermore, based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, specifically including the following steps:

[0039] Match the assembly position of the secondary piping equipment with the area level of the production area, and label the sequence number of the area level for the secondary piping equipment;

[0040] Combine the pipes of the assembled secondary piping, and form a secondary piping equipment group by grouping the secondary piping equipment of adjacent area levels;

[0041] Determine the assembly position of the secondary piping tee at the path intersection of the secondary piping equipment group and the pipes of the secondary piping.

[0042] Furthermore, the secondary input of the user includes at least one of the size change information, attribute change information, and assembly position change information of the secondary piping components.

[0043] In a second aspect, the present invention also provides a construction device for the secondary piping assembly process of a semiconductor production line, which adopts the construction method of the secondary piping assembly process of the semiconductor production line as described above, and specifically includes:

[0044] An analysis unit, configured to retrieve the secondary piping component data in a pre-constructed database according to the user's primary input, wherein the secondary piping component data includes the legend and two-dimensional graph of the secondary piping component, and the two-dimensional graph is formed by converting the three-dimensional model of the secondary piping component according to the defined model conversion rules;

[0045] An automatic generation unit, configured to give a two-dimensional pipeline logic relationship diagram of the connection of the two-dimensional graphs of each secondary piping component based on the preset secondary piping component assembly logic, and form an initial assembly process of the secondary piping of the semiconductor production line in combination with the legend of the corresponding two-dimensional graph;

[0046] An optimization unit, configured to optimize the initial assembly process of the secondary piping of the semiconductor production line based on the user's secondary input, and construct the assembly process of the secondary piping of the semiconductor production line.

[0047] The construction method and device for the secondary piping assembly process of a semiconductor production line provided by the present invention have at least the following beneficial effects:

[0048] (1) The construction scheme of the secondary piping assembly process of the semiconductor production line given by the present invention not only improves the automation degree of the assembly process design, but also enhances the consistency, scalability of the construction of the secondary piping assembly process of the semiconductor production line through the standardized setting of the legend and two-dimensional graph, and improves the accuracy and readability of the secondary piping assembly process of the semiconductor production line, reducing the pipeline construction cost of the secondary piping.

[0049] (2) According to the assembly logic of the secondary piping components, the assembly process of the secondary piping is constructed by calling the data of the secondary piping components stored in the database. This can make the construction plan of the assembly process easier to expand, and new legends and two-dimensional graphics can be easily added to meet the changing process requirements of semiconductor production. In addition, the automated assembly process construction plan of the secondary piping can serve as the basis for user collaboration, and different users can work under the same set of standardized processes, improving the efficiency of user collaboration.

[0050] (3) The assembly of the secondary piping equipment varies according to different semiconductor production areas. The connection between the secondary piping equipment with different assembly methods and the pipes of the secondary piping requires the installation of compatible secondary piping tees at corresponding positions. Finally, based on the positions and connection relationships of the secondary piping equipment, the pipes of the secondary piping, etc., the installation positions of the secondary piping valves and accessory pipes are determined to form the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping. In this way, it can ensure that the secondary piping assembly process meets the process requirements of semiconductor production and can adapt to the attribute information of semiconductor production equipment. Description of the Drawings

[0051] Figure 1 It is a schematic flow chart of a method for constructing an assembly process of secondary piping in a semiconductor production line provided by the present invention;

[0052] Figure 2 It is a schematic flow chart of the construction of a database in a certain embodiment provided by the present invention;

[0053] Figure 3 It is a schematic flow chart of the definition of model conversion rules in a certain embodiment provided by the present invention;

[0054] Figure 4 It is an example diagram of the conversion of a three-dimensional model of a secondary piping fitting into a two-dimensional graphic provided by the present invention;

[0055] Figure 5 It is a schematic flow chart of a certain embodiment provided by the present invention for giving the two-dimensional pipeline logic relationship diagram of the connection of two-dimensional graphics of each secondary piping component based on the preset assembly logic of the secondary piping components;

[0056] Figure 6 It is an example diagram of the two-dimensional pipeline logic relationship diagram of the connection of two-dimensional graphics of secondary piping components provided by the present invention;

[0057] Figure 7 It is a schematic flow chart of a certain embodiment provided by the present invention for determining the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping based on the assembly path of the pipes of the secondary piping;

[0058] Figure 8The flowchart showing the semiconductor production area for secondary piping assembly provided by an embodiment of the present invention and giving the assembly positions of secondary piping equipment;

[0059] Figure 9 The example diagram showing the assembly positions of the secondary piping equipment provided by the present invention;

[0060] Figure 10 The flowchart showing the determination of the assembly positions of secondary piping tees based on the assembly positions of secondary piping equipment provided by an embodiment of the present invention;

[0061] Figure 11 The architecture diagram of a device for constructing the secondary piping assembly process of a semiconductor production line provided by the present invention. Detailed implementation manners

[0062] To better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific implementation manners. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0063] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. "Plural" generally includes at least two.

[0064] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, so that a commodity or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such commodity or device. Without more limitations, the element defined by the statement "including one..." does not exclude the existence of another identical element in the commodity or device including the said element.

[0065] For the assembly process of secondary piping in a semiconductor production line, in order to achieve automated output, it is necessary to automate and intelligentize the whole process from the selection of secondary piping components, the generation of legends and two-dimensional graphics, to the connection of two-dimensional graphics representing secondary piping components.

[0066] Based on the transformation of the graphics and legends of the secondary piping components and combined with the data storage in the database, through the data mapping of the graphic logic assembly, the automatic drawing of the secondary piping assembly process of the semiconductor production line can be realized. Of course, for the automatically drawn secondary piping assembly process of the semiconductor production line, subsequent manual / automatic adjustment and optimization can be carried out to complete the optimized assembly method of the secondary piping components, and finally a more perfect secondary piping assembly process of the semiconductor production line can be obtained. Through this construction method of the secondary piping assembly process of the semiconductor production line, the data mapping and connection problems between the secondary piping components and the semiconductor production line are solved, and the full process coverage of the semiconductor secondary piping design field is realized.

[0067] As Figure 1 shown, the present invention provides a method for constructing a secondary piping assembly process of a semiconductor production line, which specifically includes the following steps:

[0068] According to the user's first input, retrieve the secondary piping component data in the pre-constructed database, where the secondary piping component data includes the legends and two-dimensional graphics of the secondary piping components, and the two-dimensional graphics are formed by converting the three-dimensional model of the secondary piping components according to the defined model conversion rules;

[0069] Based on the preset secondary piping component assembly logic, give the two-dimensional pipeline logic relationship diagram of the connection of the two-dimensional graphics of each secondary piping component, and combine the legends of the corresponding two-dimensional graphics to form the initial assembly process of the secondary piping of the semiconductor production line;

[0070] Based on the user's second input, optimize the initial assembly process of the secondary piping of the semiconductor production line and construct the assembly process of the secondary piping of the semiconductor production line.

[0071] The user's first input includes the process requirements of semiconductor production and the attribute information of semiconductor production equipment, and the attribute information of semiconductor production equipment includes the interface information and layout information of semiconductor production equipment.

[0072] The process requirements of semiconductor production refer to the specific requirements of each process step of the semiconductor production line, including the types and specifications of gases, liquids, and chemicals to be used, as well as the pressure and flow requirements when using gases, liquids, and chemicals. In addition, the process requirements of semiconductor production also include requirements for pipeline materials, construction processes, etc.

[0073] The interface information of semiconductor production equipment includes the interface location, interface type, number of interfaces, interface size, and interface model of the semiconductor production equipment; the layout information of the semiconductor production equipment includes the overall layout diagram of the semiconductor production equipment, specifically including the size, location, and operating space of the semiconductor production equipment. The above semiconductor production equipment attribute information including the interface information and layout information of the semiconductor production equipment is crucial for determining the connection method and component size selection of the secondary piping assembly; at the same time, the path distribution and orientation of the secondary piping assembly can be accurately planned according to the above information in the secondary piping assembly process.

[0074] The database includes a legend library and a 2D graphics library. The legend library includes the legends of secondary piping components, and the 2D graphics library includes the 2D graphics of secondary piping components.

[0075] Such as Figure 2 As shown, the construction of the database specifically includes the following steps:

[0076] Based on the defined legend rules, give the legends associated with the secondary piping components to form a legend library, where the graphic rules are the rules between the symbols and colors of the secondary piping components and the corresponding legends;

[0077] Collect the 3D models of the secondary piping components, and through the defined model conversion rules, convert the 3D models into 2D graphics to form a 2D graphics library.

[0078] Legends are symbols and colors that can visually present secondary piping components. The legends of secondary piping components are determined through graphic rules, representing different types of secondary piping components, such as pipes, valves, instruments, etc., which can ensure the readability and uniformity of the secondary piping assembly process.

[0079] Generally speaking, there is a large amount of 3D model data for secondary piping components. Through the model conversion rules applicable to the secondary piping assembly process, the 3D models can be converted into 2D graphics, and each secondary piping component is represented by 2D graphics. As Figure 3 As shown, the definition of the model conversion rules specifically includes the following steps:

[0080] Based on the type of secondary piping components, determine the view type for converting the model into a 2D graphic;

[0081] Define the projection plane with the view type of the 2D graphic, combine the view direction of the 3D model and the preset presentation size of the 2D graphic, and obtain the initial 2D graphic by the method of projecting and offsetting;

[0082] Perform optimization processing on the initial 2D graphic to obtain the 2D graphic.

[0083] For the secondary piping assembly, the conversion of its 3D model to a 2D drawing needs to determine the projection plane, and then complete it through the view direction change during the 3D-to-2D conversion and the dimension requirements for the 2D drawing. Thus, it is possible to present the 3D models of all secondary piping assemblies in the appropriate proportion and position, and ensure that all key features can be clearly displayed.

[0084] Among them, taking the point i in a certain 3D model as an example, the transformation process of the position coordinates when converting from a 3D model to a 2D drawing is described as follows:

[0085]

[0086] Among them, X i 、Y i 、Z i are the abscissa, ordinate, and vertical coordinate of the point i in the 3D model in the 3D space, x i 、y i are the abscissa and ordinate of the point i in the 3D model on the projection plane, k x is the scaling ratio of the abscissa of the projection plane, k y is the scaling ratio of the ordinate of the projection plane, m is the coordinate of the axis corresponding to the abscissa of the projection plane in the 3D space coordinate system, n is the coordinate of the axis corresponding to the ordinate of the projection plane in the 3D space coordinate system, l is the coordinate of the axis other than m and n in the 3D space coordinate system, α m is the angle between the axis where m is located and the abscissa of the projection plane, α n is the angle between the axis where n is located and the ordinate of the projection plane, d x is the offset of the point i in the 3D model on the abscissa of the projection plane, d y is the offset of the point i in the 3D model on the ordinate of the projection plane;

[0087] As Figure 4 shown, for the 3D model of a right-angled frustum, select an appropriate view direction (that is, determine the view type for converting the model to a 2D drawing). For example, determine it as the top view direction, define the projection plane with the top view type, and project the 3D model of the right-angled frustum onto the 2D plane along the selected view direction. Then, according to the expected use of the right-angled frustum and the detail requirements of the side lines, perform dimension transformation through an appropriate scaling ratio. Finally, set an appropriate offset to ensure that all important features can be clearly displayed in the 2D drawing.

[0088] In a semiconductor production line, the required secondary piping assemblies include the pipes of the secondary piping and the functional controls of the secondary piping. Among them, the functional controls of the secondary piping include secondary piping equipment, secondary piping tees, secondary piping valves, and accessory pipes.

[0089] AsFigure 5 As shown, based on the preset assembly logic of the secondary piping components, a two-dimensional pipeline logic relationship diagram for the connection of the two-dimensional graphics of each secondary piping component is given. The specific steps are as follows:

[0090] According to the attribute information of the semiconductor production equipment, determine the assembly path of the pipes of the secondary piping.

[0091] Based on the assembly path of the pipes of the secondary piping, determine the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping.

[0092] Combining the connection relationships of each secondary piping component and the attribute information of the secondary piping component, give a two-dimensional pipeline logic relationship diagram for the connection of the two-dimensional graphics of each secondary piping component.

[0093] The assembly logic of the secondary piping components is to determine the assembly path of the pipes of the secondary piping, then successively determine the positions of the secondary piping equipment, secondary piping tees, secondary piping valves and accessory pipes, and complete the connection of all secondary piping components, and give a two-dimensional pipeline logic relationship diagram for the connection of the two-dimensional graphics of each secondary piping component. As Figure 6 Shown is an example diagram of a two-dimensional pipeline logic relationship diagram for the connection of the two-dimensional graphics of each secondary piping component formed after the connection relationship of the two-dimensional graphics of the secondary piping components in a certain application scenario.

[0094] For the assembly path of the pipes of the secondary piping, the following conditions are met: avoid interfering with the operation area and maintenance area of the semiconductor production equipment, have appropriate safety distances and orientations, and follow the best flow path. The best flow path requires the shortest path and the fewest elbows. For example, in a certain application scenario, the semiconductor production equipment is a chemical vapor deposition equipment, and the pipes of the secondary piping mainly supply gas to this chemical vapor deposition equipment. The pipes of the secondary piping are directly connected to the gas input interface of the chemical vapor deposition equipment, and it is ensured that all the pipes of the secondary piping have sufficient flexibility to adapt to the slight movement of the chemical vapor deposition equipment.

[0095] As Figure 7 Shown, based on the assembly path of the pipes of the secondary piping, determine the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping. The specific steps are as follows:

[0096] Based on the assembly path of the pipes of the secondary piping, determine the semiconductor production area for secondary piping assembly, and give the assembly position of the secondary piping equipment.

[0097] Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, and connect the secondary piping equipment, the pipes of the secondary piping and the secondary piping tee.

[0098] Determine the assembly positions of the secondary piping valves and the attached pipes, and form the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping.

[0099] The assembly of the secondary piping equipment varies according to different semiconductor production areas, specifically reflected in the different rotation angles and assembly directions of the secondary piping equipment. The connection of the secondary piping equipment with different assembly methods to the pipes of the secondary piping requires the installation of compatible secondary piping tees at corresponding positions. Finally, based on the positions and connection relationships of the secondary piping equipment, the pipes of the secondary piping, etc., determine the assembly positions of the secondary piping valves and the attached pipes, and form the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping. In this way, it can ensure that the secondary piping assembly process meets the technological requirements of semiconductor production and can adapt to the attribute information of semiconductor production equipment.

[0100] Such as Figure 8 As shown, determine the semiconductor production area for secondary piping assembly, and give the assembly positions of the secondary piping equipment, which specifically includes the following steps:

[0101] Define the area hierarchy of the semiconductor production area, and set the sequence numbers according to the area hierarchy setting order;

[0102] Based on the sequence number of the area hierarchy, with the first area hierarchy as the starting point for the assembly position of the secondary piping equipment, layout from left to right according to the equipment size and the preset interval;

[0103] Enter the next area hierarchy, and re-determine the starting point of the assembly position, the assembly orientation, and the assembly direction of the secondary piping equipment. Among them, the assembly orientation and the assembly direction of the next area hierarchy are the same as those of the previous area hierarchy;

[0104] Until the assembly of the secondary piping equipment in all area hierarchies is completed.

[0105] In addition, set an area for supply points between two adjacent area hierarchies. The arrangement orientation and arrangement direction of the supply points are rotated by 90° compared with the assembly orientation and assembly direction of the adjacent area hierarchies. The supply points are the connectable points reserved for the secondary piping and the functional controls of the secondary piping.

[0106] In a certain application scenario, the semiconductor production area is divided by floors. The semiconductor production area has three floors. Among them, the first floor is the first area hierarchy, the second floor is the area for supply points (taking plant utilities as an example), and the third floor is the second area hierarchy. The three areas share a set of plane coordinate systems. When assembling (or arranging) the secondary piping equipment on the first floor, determine the starting point of the assembly position and layout from left to right according to the equipment size and the preset interval. Among them, the equipment size of the secondary piping equipment can be set in advance. For example, as Figure 9As shown, the equipment length of the secondary piping equipment is a, and the width is b. The preset interval is determined according to specific applications. After completing the assembly of the first layer, enter the second layer, determine the starting point, arrangement orientation, and arrangement direction of the supply points. The arrangement orientation and arrangement direction of the supply points in the second layer are rotated 90° clockwise compared to the assembly orientation and assembly direction of the first layer. Finally, perform the assembly of the third layer. The assembly orientation and assembly direction of the second area level are rotated 90° clockwise compared to the arrangement orientation and arrangement direction of the supply points in the second layer. Finally, complete the assembly of the three-layer secondary piping equipment. Through the settings of the assembly position, assembly orientation, and assembly direction, the secondary piping components in each semiconductor production area can be arranged on the same two-dimensional plane.

[0107] As Figure 10 shown, based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, which specifically includes the following steps:

[0108] Match the assembly position of the secondary piping equipment with the area level of the production area, and mark the sequence number of the area level for the secondary piping equipment;

[0109] Combine the pipes of the assembled secondary piping, and form a secondary piping equipment group by grouping the secondary piping equipment of adjacent area levels;

[0110] Determine the assembly position of the secondary piping tee based on the path intersection points of the secondary piping equipment group and the pipes of the secondary piping.

[0111] The user's secondary input includes at least one of the size change information, attribute change information, and assembly position change information of the secondary piping components. The size change information of the secondary piping components usually includes the change in the pipe diameter size of the secondary piping. The attribute change information includes changes in flow rate, pressure, temperature, etc. The assembly position change information includes the position change information of the secondary piping valves and the attached pipes.

[0112] The user's secondary input mainly provides a step for redrawing, modifying, and improving again, allowing the user to fine-tune and optimize the automatically generated secondary piping assembly process.

[0113] As Figure 11 shown, the present invention also provides a device for constructing a secondary piping assembly process of a semiconductor production line, which adopts the method for constructing a secondary piping assembly process of a semiconductor production line as described above, and specifically includes:

[0114] An analysis unit for retrieving the secondary piping component data in a pre-constructed database according to the user's primary input, where the secondary piping component data includes the legend and two-dimensional graph of the secondary piping component, and the two-dimensional graph is formed by converting the three-dimensional model of the secondary piping component according to the defined model conversion rules;

[0115] An automatic generation unit, configured to provide a two-dimensional pipeline logic relationship diagram of the connection of two-dimensional graphics of each secondary piping component based on a preset secondary piping component assembly logic, and combine with the legends of the corresponding two-dimensional graphics to form an initial assembly process of the secondary piping of the semiconductor production line;

[0116] An optimization unit, configured to optimize the initial assembly process of the secondary piping of the semiconductor production line based on the secondary input of the user, and construct the assembly process of the secondary piping of the semiconductor production line.

[0117] A method and device for constructing an assembly process of secondary piping of a semiconductor production line provided by the present invention at least include the following beneficial effects:

[0118] (1) The construction scheme of the assembly process of the secondary piping of the semiconductor production line given by the present invention not only improves the automation degree of the assembly process design, but also enhances the consistency, scalability of the construction of the assembly process of the secondary piping of the semiconductor production line through the standardized setting of legends and two-dimensional graphics, and improves the accuracy and readability of the assembly process of the secondary piping of the semiconductor production line, reducing the pipeline construction cost of the secondary piping.

[0119] (2) According to the secondary piping component assembly logic, the assembly process of the secondary piping is constructed by calling the secondary piping component data stored in the database. This can make the construction scheme of the assembly process easier to expand, and new legends and two-dimensional graphics can be easily added to adapt to the changing process requirements of semiconductor production; in addition, the automatic assembly process construction scheme of the secondary piping can be used as the basis for user collaboration, and different users can work under the same set of standardized processes, improving the efficiency of user collaboration.

[0120] (3) The assembly of the secondary piping equipment varies according to different semiconductor production areas. The connection of the secondary piping equipment with different assembly methods to the pipes of the secondary piping requires the setting of appropriate secondary piping tees at the corresponding positions. Finally, according to the positions and connection relationships of the secondary piping equipment, the pipes of the secondary piping, etc., the assembly positions of the secondary piping valves and the accessory pipes are determined to form the connection relationships of the pipes of each secondary piping and the functional controls of the secondary piping. In this way, it can ensure that the secondary piping assembly process meets the process requirements of semiconductor production and can adapt to the attribute information of semiconductor production equipment.

[0121] Although the preferred embodiments of the present invention have been described, additional changes and modifications can be made to these embodiments by those skilled in the art once they learn the basic inventive concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art can make various changes and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A method for constructing the secondary piping assembly process of a semiconductor production line, characterized in that, Specifically, the following steps are included: According to the user's first input, retrieve the secondary piping component data in the pre-constructed database. Among them, the secondary piping component data includes the legend and 2D graphics of the secondary piping components. The 2D graphics are formed by converting the 3D model of the secondary piping components according to the defined model conversion rules. The secondary piping components include the pipes of the secondary piping and the functional controls of the secondary piping. The functional controls of the secondary piping include secondary piping equipment, secondary piping tees, secondary piping valves, and accessory pipes; According to the attribute information of the semiconductor production equipment, determine the assembly path of the pipes of the secondary piping. Define the regional hierarchy of the semiconductor production area based on the assembly path of the pipes of the secondary piping, and set the sequence number according to the order of the regional hierarchy. Based on the sequence number of the regional hierarchy, use the first regional hierarchy as the starting point for the assembly position of the secondary piping equipment, and layout from left to right according to the equipment size and the preset interval. Enter the next regional hierarchy, and re-determine the starting point, assembly orientation, and assembly direction of the assembly position of the secondary piping equipment. Among them, the assembly orientation and assembly direction of the next regional hierarchy are the same as those of the previous regional hierarchy. Until the assembly of the secondary piping equipment in all regional hierarchies is completed. Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, and connect the secondary piping equipment, the pipes of the secondary piping, and the secondary piping tee. Determine the assembly positions of the secondary piping valves and the accessory pipes to form the connection relationship of the pipes of each secondary piping and the functional controls of the secondary piping. Combine the connection relationships of each secondary piping component and the attribute information of the secondary piping component to give the 2D pipeline logic relationship diagram of the connection of the 2D graphics of each secondary piping component, and combine with the legend of the corresponding 2D graphics to form the initial assembly process of the secondary piping of the semiconductor production line; Based on the user's second input, optimize the initial assembly process of the secondary piping of the semiconductor production line and construct the assembly process of the secondary piping of the semiconductor production line.

2. The construction method of the secondary piping assembly process of the semiconductor production line according to claim 1, characterized in that The user's first input includes the process requirements of semiconductor production and the attribute information of the semiconductor production equipment. The attribute information of the semiconductor production equipment includes the interface information and layout information of the semiconductor production equipment.

3. The construction method of the secondary piping assembly process of the semiconductor production line according to claim 1, characterized in that, The database includes a legend library and a 2D graphics library. The legend library includes the legends of the secondary piping components, and the 2D graphics library includes the 2D graphics of the secondary piping components; The construction of the database specifically includes the following steps: Based on the defined legend rules, give the legends associated with the secondary piping components to form a legend library. Among them, the graphic rules are the rules between the symbols and colors of the secondary piping components and the corresponding legends; Collect the 3D models of the secondary piping components, and convert the 3D models into 2D graphics through the defined model conversion rules to form a 2D graphics library.

4. The construction method of the secondary piping assembly process of the semiconductor production line according to claim 3, characterized in that, The definition of the model conversion rules specifically includes the following steps: Based on the type of the secondary piping components, determine the view type for converting the model into 2D graphics; Define the projection plane based on the view type of the 2D graphics, and combine the view direction of the 3D model and the preset 2D graphic presentation size. Obtain the initial 2D graphics by the way of projecting and offsetting, specifically expressed as: ； Among them, X i , Y i , Z i are the abscissa, ordinate, and vertical coordinate of the i-th point of the three-dimensional model in three-dimensional space, x i , y i are the abscissa and ordinate of the i-th point of the three-dimensional model on the projection plane, k x is the scaling ratio of the abscissa of the projection plane, k y is the scaling ratio of the ordinate of the projection plane, m is the coordinate of the axis corresponding to the abscissa of the projection plane in the three-dimensional space coordinate system, n is the coordinate of the axis corresponding to the ordinate of the projection plane in the three-dimensional space coordinate system, l is the coordinate of the axis other than m and n in the three-dimensional space coordinate system, is the angle between the axis where m is located and the abscissa of the projection plane, is the angle between the axis where n is located and the ordinate of the projection plane, d x,i is the offset of the i-th point of the three-dimensional model on the abscissa of the projection plane, d y,i is the offset of the i-th point of the three-dimensional model on the ordinate of the projection plane; Optimize the initial two-dimensional graph to obtain a two-dimensional graph.

5. The construction method of the secondary piping assembly process of the semiconductor production line according to claim 1, characterized in that Based on the assembly position of the secondary piping equipment, determine the assembly position of the secondary piping tee, which specifically includes the following steps: Match the assembly position of the secondary piping equipment with the regional hierarchy of the production area, and label the sequential numbers of the regional hierarchy for the secondary piping equipment; Combine the pipes of the assembled secondary piping, and group the secondary piping equipment of adjacent regional hierarchies to form a secondary piping equipment group; Determine the assembly position of the secondary piping tee with the path intersection point of the secondary piping equipment group and the pipes of the secondary piping.

6. The construction method of the secondary piping assembly process of the semiconductor production line according to claim 1, characterized in that The secondary input of the user includes at least one of the size change information, attribute change information, and assembly position change information of the secondary piping components.

7. An apparatus for constructing a secondary piping assembly process of a semiconductor production line, characterized in that, Adopt the construction method of the secondary piping assembly process of the semiconductor production line as described in any one of claims 1-6, which specifically includes: An analysis unit for retrieving the secondary piping component data in the pre-constructed database according to the primary input of the user, wherein the secondary piping component data includes the legend and two-dimensional graph of the secondary piping component, and the two-dimensional graph is formed by converting the three-dimensional model of the secondary piping component according to the defined model conversion rules; An automatic generation unit for giving the two-dimensional pipeline logic relationship diagram of the connection of the two-dimensional graphs of each secondary piping component based on the preset secondary piping component assembly logic, and combining with the legend of the corresponding two-dimensional graph to form the initial assembly process of the secondary piping of the semiconductor production line; An optimization unit for optimizing the initial assembly process of the secondary piping of the semiconductor production line based on the secondary input of the user and constructing the assembly process of the secondary piping of the semiconductor production line.

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