Liquid cooling inductor and inverter

Abstract

The invention provides a liquid-cooled inductor and an inverter, relates to the technical field of inductor packaging, and is used for solving the problems of low internal heat dissipation efficiency and poor heat dissipation performance of the inductor, the liquid-cooled inductor comprises a shell, the shell is provided with a containing cavity with an opening in the top, and the containing cavity is used for containing cooling liquid; the inductor body is arranged in the accommodating cavity; and the heat dissipation piece covers the opening and is in sealing connection with the shell, and one side, facing the accommodating cavity, of the heat dissipation piece is provided with a first concave-convex structure. The liquid cooling inductor and the inverter provided by the invention have relatively high heat transfer efficiency and relatively good heat dissipation performance.

Description

Technical Field

[0001] The present application relates to the technical field of inductor packaging, and in particular to a liquid-cooled inductor and an inverter. Background Art

[0002] As a core device for energy storage and energy conversion, inductors have shown wide application value in such applications as Boost circuits, inverter circuits, PFC (power factor correction) circuits, and DC / DC conversion circuits.

[0003] In practical applications, the operating temperature of the inductor is crucial to its performance. If the operating temperature of the inductor is too high, it will not only accelerate the aging of the material and increase the probability of failure, but also increase the internal loss of the inductor. At present, the heat dissipation of the inductor is carried out by using air as the medium, relying on natural cooling and forced air cooling to improve the heat dissipation efficiency. Common heat dissipation methods include using high thermal conductivity potting glue to promote heat transfer and using advanced packaging materials to reduce thermal resistance.

[0004] However, traditional inductors have low heat dissipation efficiency and poor heat dissipation performance. Summary of the invention

[0005] The present application provides a liquid-cooled inductor and inverter, which have high heat transfer efficiency and good heat dissipation performance.

[0006] In a first aspect, the present application provides a liquid-cooled inductor, comprising: a shell, the shell having a containing cavity with an opening at the top, the containing cavity being used to contain cooling liquid; an inductor body, disposed in the containing cavity; a heat sink, a cover disposed at the opening and sealedly connected to the shell, the heat sink having a first concave-convex structure on a side facing the containing cavity.

[0007] As in the above-mentioned liquid-cooled inductor, the heat sink has a second concave-convex structure on a side away from the accommodating cavity.

[0008] As in the above-mentioned liquid-cooled inductor, the heat sink includes a heat sink substrate, the first concave-convex structure is arranged on the side of the heat sink substrate facing the accommodating cavity, and the second concave-convex structure is arranged on the side of the heat sink substrate away from the accommodating cavity.

[0009] As in the above-mentioned liquid-cooled inductor, the accommodating cavity includes a liquid cooling zone and a gas-liquid conversion zone, the liquid cooling zone is configured to accommodate cooling liquid, the gas-liquid conversion zone is arranged above the liquid cooling zone, and the height of the gas-liquid conversion zone is greater than or equal to 0.

[0010] As in the above-mentioned liquid-cooled inductor, part of the first concave-convex structure is located in the liquid-cooling area.

[0011] As in the above-mentioned liquid-cooled inductor, the distance between the first concave-convex structure and the liquid-cooling area is greater than 0.

[0012] As in the above-mentioned liquid-cooled inductor, the first concave-convex structure includes a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are arranged at equal intervals along the first direction on a side of the heat dissipation substrate facing the accommodating cavity;

[0013] And / or, the second concave-convex structure includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are arranged at equal intervals along the first direction on a side of the heat dissipation substrate away from the accommodating cavity.

[0014] As in the above-mentioned liquid-cooled inductor, the heat dissipation substrate further has a cooling pipeline, and the cooling pipeline is configured to be connected to a cooling liquid source; and / or,

[0015] The heat dissipation substrate comprises a semiconductor cooling sheet, and the semiconductor cooling sheet is arranged between the first concave-convex structure and the second concave-convex structure.

[0016] As in the above-mentioned liquid-cooled inductor, a liquid replenishing port that can be opened and closed is further provided on the shell, and the liquid replenishing port is configured to be connected to a cooling liquid source; and / or a pressure relief valve is further provided on the top of the shell.

[0017] The liquid-cooled inductor as mentioned above further includes a controller and a pressure detection component. The pressure detection component is arranged in the shell. The pressure detection component and the pressure relief valve are respectively connected to the controller signal.

[0018] The liquid-cooled inductor as described above also includes a liquid level detector and a liquid replenishing valve;

[0019] The controller is electrically connected to the liquid level detector and the liquid replenishing valve. The controller is configured to control the liquid replenishing valve to open according to the value detected by the liquid level detector so as to automatically replenish liquid into the accommodating cavity.

[0020] In a second aspect, an embodiment of the present application provides an inverter, comprising the above-mentioned liquid-cooled inductor.

[0021] The present application provides a liquid-cooled inductor and inverter. By placing the inductor body inside the shell and injecting coolant into the shell, the inductor body is in direct contact with the coolant for heat exchange, which can reduce thermal resistance and improve heat conduction efficiency. In addition, by arranging a heat sink on the top of the shell, the coolant after heat exchange with the inductor body can exchange heat with the heat sink, thereby releasing the heat inside the shell to the outside of the shell. A first concave-convex structure is arranged on the side of the heat sink facing the accommodating cavity to increase the heat exchange area and improve the heat exchange efficiency. The device can realize circulating heat dissipation inside the shell without the need for other equipment to assist in heat exchange. Compared with traditional inductors, the device has a shorter heat transfer path, faster heat transfer speed, higher heat dissipation efficiency and better heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the structure of a liquid-cooled inductor provided in an embodiment of the present application;

[0023] Figure 2 is a schematic diagram of the structure of another liquid-cooled inductor provided in an embodiment of the present application;

[0024] Figure 3 It is a schematic diagram of the structure of a heat sink in a liquid-cooled inductor provided in an embodiment of the present application.

[0025] Description of reference numerals:

[0026] 10-Liquid-cooled inductor;

[0027] 100-shell; 110-accommodating chamber; 111-liquid cooling area; 112-gas-liquid conversion area; 114-liquid replenishing port;

[0028] 200-inductor body;

[0029] 300-heat sink; 310-first concave-convex structure; 311-first heat sink fin; 320-second concave-convex structure; 321-second heat sink fin; 330-heat sink substrate;

[0030] 400-cable. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] As a core device for energy storage and energy conversion, inductors have shown wide application value in such applications as Boost circuits, inverter circuits, PFC (power factor correction) circuits, and DC / DC conversion circuits.

[0033] In practical applications, the operating temperature of the inductor is crucial to its performance. If the operating temperature of the inductor is too high, it will not only accelerate the aging of the material and increase the probability of failure, but also increase the internal loss of the inductor. At present, the heat dissipation of the inductor is carried out by using air as the medium, relying on natural cooling and forced air cooling to improve the heat dissipation efficiency. Common heat dissipation methods include using high thermal conductivity potting glue to promote heat transfer and using advanced packaging materials to reduce thermal resistance.

[0034] However, traditional inductors have low heat dissipation efficiency and poor heat dissipation performance.

[0035] To this end, the present application provides a liquid-cooled inductor and inverter, which can reduce thermal resistance and improve heat conduction efficiency by placing the inductor body inside the shell and injecting coolant into the shell so that the inductor body is in direct contact with the coolant for heat exchange; in addition, by arranging a heat sink on the top of the shell, the coolant after heat exchange with the inductor body can be heat exchanged with the heat sink, thereby releasing the heat inside the shell to the outside of the shell; and a first concave-convex structure is arranged on the side of the heat sink facing the accommodating cavity to increase the heat exchange area and improve the heat exchange efficiency. The device can realize circulating heat dissipation inside the shell without the need for other equipment to assist in heat exchange. Compared with traditional inductors, the device has a shorter heat transfer path, faster heat transfer speed, higher heat dissipation efficiency and better heat dissipation performance.

[0036] A liquid-cooled inductor in this embodiment is further described below.

[0037] Figure 1 is a schematic diagram of the structure of a liquid-cooled inductor provided in an embodiment of the present application; Figure 2 is a schematic diagram of the structure of another liquid-cooled inductor provided in an embodiment of the present application; Figure 3 It is a schematic diagram of the structure of a heat sink in a liquid-cooled inductor provided in an embodiment of the present application.

[0038] like Figure 1 As shown, the embodiment of the present application provides a liquid-cooled inductor 10, including: a shell 100, the shell 100 has a receiving cavity 110 with an opening at the top, the receiving cavity 110 is used to contain a cooling liquid, and the inductor body 200 is immersed in the cooling liquid, so that each surface of the inductor body 200 is in contact with the cooling liquid to reduce the temperature of the inductor body 200, so that the temperature of the inductor body 200 is maintained within a normal working range, thereby extending the service life of the inductor body 200.

[0039] It should be noted that in order to ensure that the coolant does not interfere with the performance of the inductor body 200 while satisfying the heat transfer requirement, the coolant should have good insulation and heat transfer properties. Specifically, in this embodiment, the process parameters of the coolant are as follows: (1) the dielectric constant is less than 2.5 at 1kHz, so that the inductor body 200 will not significantly lose signal integrity when immersed in the coolant; (2) the coolant should have excellent insulation properties, be non-conductive, and have a resistivity greater than 1×10 12 Ω·cm; (3) The coolant also needs to have a certain voltage resistance, with a dielectric strength greater than 24kV (2.54mm gap); (4) The material has good compatibility, high chemical stability, is non-flammable, and does not cause any corrosion when in contact with the inductor; (5) The ozone depletion potential (ODP) value is zero, the global warming potential (GWP) value is less than 50, and it will not have a harmful impact on the environment.

[0040] In the heat exchange process between the inductor body 200 and the coolant, the temperature of the coolant after heat exchange with the inductor body 200 increases and the density decreases, so that the coolant after heat exchange flows upward, and this flow helps to take away the heat generated by the inductor body 200, improve the heat exchange efficiency, and prevent the inductor body 200 from overheating. In addition, the flow of the coolant can also make the temperature distribution inside the entire housing 100 more uniform, further improving the heat dissipation effect.

[0041] Specifically, in order to reduce the temperature of the cooling liquid, the cooling liquid can continuously cool the inductor body 200. In this embodiment, refer to Figure 1 As shown, a heat sink 300 is provided at the top of the accommodating cavity 110 so that the coolant after heat exchange with the inductor body 200 contacts the heat sink 300 for heat conduction, so that the heat sink 300 forces heat exchange with the coolant, thereby releasing the heat inside the shell 100 to the outside of the shell 100 to reduce the temperature of the coolant.

[0042] Specifically, in order to prevent the cooling liquid from leaking during the heat exchange process with the heat sink 300, resulting in poor heat dissipation effect, in this embodiment, the contact surface between the heat sink 300 and the shell 100 should be connected by a seal. Exemplarily, the type of the seal can be an O-ring, a gasket, a sealing tape, etc. This embodiment does not limit this, as long as it can play a sealing role. This embodiment takes the type of seal as a gasket as an example for explanation.

[0043] Continue to refer to Figure 1 As shown, the heat sink 300 has a first concave-convex structure 310 on one side facing the accommodating cavity 110. The purpose of such a configuration is to increase the heat dissipation area of ​​the coolant and the heat sink 300, reduce thermal resistance, and improve the heat dissipation effect.

[0044] It should be noted that, in addition to heat exchange through the heat sink 300 , the coolant can also exchange heat through the housing 100 in contact therewith. Therefore, in order to achieve a better heat exchange effect, the housing 100 should be made of a material with good thermal conductivity.

[0045] Exemplarily, the material of the housing 100 may be aluminum alloy, copper alloy, stainless steel, etc. In this embodiment, the material of the housing 100 is aluminum alloy as an example for description. The purpose of such setting is that the aluminum alloy has good heat transfer performance and can effectively dissipate the heat of the inductor body 200 when working, and the aluminum alloy is light in weight, which can reduce the weight of the liquid-cooled inductor 10.

[0046] In an achievable implementation, the heat dissipation element 300 has a second concave-convex structure 320 on a side facing away from the accommodating cavity 110 .

[0047] In this embodiment, continue to refer to Figure 1As shown, the heat sink 300 has a second concave-convex structure 320 on one side away from the accommodating cavity 110, so that the coolant near the inductor body 200 will perform one-dimensional heat transfer along the vertical direction after heat exchange with the inductor body 200, wherein the vertical direction is Figure 1 The "Z" direction in the diagram.

[0048] Specifically, the heat transfer process of the coolant is that the coolant first exchanges heat with the inductor body 200, and the heat of the coolant after the heat exchange is first transferred to the first concave-convex structure 310, and then transferred from the first concave-convex structure 310 to the second concave-convex structure 320, and finally released to the outside air from the second concave-convex structure 320. Therefore, in order to improve the heat transfer efficiency, make the coolant cool down quickly, and prevent the inductor body 200 from being locally overheated, in the design process, it should be ensured that the heat exchange efficiency between the second concave-convex structure 320 and the outside air is greater than the heat exchange efficiency between the first concave-convex structure 310 and the coolant.

[0049] It should be noted that the area sizes of the first concave-convex structure 310 and the second concave-convex structure 320 can be set in a variety of ways. The following examples are given to illustrate the area sizes of the first concave-convex structure 310 and the second concave-convex structure 320 in turn.

[0050] As an optional implementation, in this embodiment, the surface area of ​​the second concave-convex structure 320 is larger than the surface area of ​​the first concave-convex structure 310 to improve the heat exchange effect and achieve the purpose of rapid cooling.

[0051] As another optional implementation, in this embodiment, the surface area of ​​the second concave-convex structure 320 is equal to the surface area of ​​the first concave-convex structure 310. Such a symmetrical design helps the air to flow evenly on both sides of the heat sink to improve the heat dissipation efficiency.

[0052] It is understandable that the area sizes of the first concave-convex structure 310 and the second concave-convex structure 320 are not limited and can be selected according to actual conditions, as long as the first concave-convex structure 310 and the second concave-convex structure 320 have good heat transfer effects.

[0053] In a feasible implementation, the heat sink 300 includes a heat sink substrate 330 , the first concave-convex structure 310 is disposed on the side of the heat sink substrate 330 facing the accommodating cavity 110 , and the second concave-convex structure 320 is disposed on the side of the heat sink substrate 330 facing away from the accommodating cavity 110 .

[0054] In this embodiment, continue to refer to Figure 1As shown, the first concave-convex structure 310 and the second concave-convex structure 320 are respectively fixedly connected to the heat dissipation substrate 330 to ensure the continuity of the heat dissipation path. Specifically, the first concave-convex structure 310 and the second concave-convex structure 320 can be combined with the heat dissipation substrate 330 by welding, or can be prepared by an integrated molding process, which is not limited in this embodiment.

[0055] Exemplarily, the first concave-convex structure 310, the second concave-convex structure 320 and the heat dissipation substrate 330 can be made of the same material or different materials, and this embodiment does not limit this, as long as a good heat conduction effect can be achieved. In this embodiment, the first concave-convex structure 310, the second concave-convex structure 320 and the heat dissipation substrate 330 are all made of aluminum alloy as an example for description.

[0056] In one feasible implementation, the type of coolant is single-phase coolant, which relies on direct contact with the heat sink 300 for conduction heat exchange. In this scenario, the single-phase coolant will not undergo phase change, and the accommodating cavity 110 only has a liquid cooling zone 111 for accommodating the coolant.

[0057] Exemplarily, the single-phase coolant may be a mixture of silicone oil, ethylene glycol and water, etc., which is not limited in this embodiment.

[0058] In another optional embodiment, the type of coolant is a two-phase coolant, which relies on a boiling-condensation cycle to form an efficient heat transfer mechanism. Specifically, when the two-phase coolant contacts the inductor body 200, it will undergo a phase change and vaporize to absorb the heat generated by the inductor body 200 during operation. When the vaporized steam encounters the heat dissipation substrate 330, it will condense to release the heat stored in the coolant. In this scenario, the accommodating cavity 110 includes a liquid cooling zone 111 and a gas-liquid conversion zone 112. The liquid cooling zone 111 is configured to accommodate the coolant. The gas-liquid conversion zone 112 is disposed above the liquid cooling zone 111. The gas-liquid conversion zone 112 is used to accommodate the evaporated coolant.

[0059] Exemplarily, the type of the two-phase coolant may be deionized water, electronic fluorinated liquid, etc., which is not limited in this embodiment.

[0060] It should be noted that in two-phase liquid cooling, in order to ensure that the vaporized cooling steam can be effectively condensed in the gas-liquid conversion zone 112 and re-liquefied, so that the cooling liquid can smoothly flow back into the accommodating cavity 110, the gas-liquid conversion zone 112 should have sufficient space, which will be explained in combination with two embodiments below.

[0061] In one possible implementation, see Figure 1As shown, part of the structure of the first concave-convex structure 310 is located in the liquid cooling zone 111. The purpose of this arrangement is to increase the contact area between the first concave-convex structure 310 and the coolant, so that the first concave-convex structure 310 can exchange heat through contact with the coolant and through contact with the evaporated coolant to improve the heat exchange efficiency.

[0062] In another achievable implementation, the distance between the first concave-convex structure 310 and the liquid cooling area 111 is greater than 0. Figure 2 As shown, the purpose of such a configuration is to avoid direct contact between the first concave-convex structure 310 and the liquid cooling zone 111 , so as to prevent the cooling liquid from corroding the first concave-convex structure 310 and extend the service life of the first concave-convex structure 310 .

[0063] It is understandable that the distance between the first concave-convex structure 310 and the coolant can be determined according to actual conditions, and this embodiment does not impose any limitation thereto, as long as it can ensure that the gas-liquid conversion zone 112 has sufficient space so that the evaporated coolant can smoothly flow back into the accommodating cavity 110 .

[0064] Specifically, in two-phase liquid cooling, in order to prevent the coolant from undergoing phase change and vaporization, which would cause excessive internal pressure in the shell 100 and thus create a safety hazard, in this embodiment, a pressure relief valve, a controller and a pressure detection device are also provided on the top of the shell 100. The pressure detection device and the pressure relief valve are respectively connected to the controller signal. When the pressure detection device detects that the pressure inside the shell 100 is greater than the working pressure, the controller controls the pressure relief valve to open to reduce the temperature inside the shell 100.

[0065] As another optional implementation, the pressure relief valve may be a manual pressure relief valve, and the operator manually operates to relieve pressure inside the housing 100. In this embodiment, the type of the pressure relief valve is not limited, as long as it can achieve the purpose of pressure relief.

[0066] It should be noted that, in order to speed up the heat conduction speed and improve the heat conduction efficiency, heat dissipation fins may be provided on the surface of the first concave-convex structure 310 or the second concave-convex structure 320. The following will be described in combination with three embodiments.

[0067] In a first achievable implementation, the first concave-convex structure 310 includes a plurality of first heat dissipation fins 311, and the plurality of first heat dissipation fins 311 are arranged at equal intervals along a first direction on a side of the heat dissipation substrate 330 facing the accommodating cavity 110, wherein the first direction is Figure 3 In the "Y" direction, the first heat dissipation fins 311 are arranged equidistantly along the first direction, so that the coolant can be cooled evenly, so that the inductor body 200 is in a "uniform temperature" state.

[0068] In a second achievable embodiment, the second concave-convex structure 320 includes a plurality of second heat dissipating fins 321, and the plurality of second heat dissipating fins 321 are arranged at equal intervals along the first direction on the side of the heat dissipating substrate 330 away from the accommodating cavity 110 to accelerate convection between the second concave-convex structure 320 and the air, thereby improving heat exchange efficiency.

[0069] In a third possible implementation, referring to Figure 3 As shown, both the first concave-convex structure 310 and the second concave-convex structure 320 are provided with heat dissipation fins, which can increase the heat dissipation area, thereby more effectively dissipating the heat inside the shell 100, and can dissipate the heat more evenly, reducing the risk of local overheating.

[0070] It can be understood that the structures of the first concave-convex structure 310 and the second concave-convex structure 320 can be determined according to actual conditions, as long as they can achieve a good heat dissipation effect.

[0071] For example, the heat dissipation fins may adopt unique geometric structures such as corrugations, sawtooth structures or spiral structures to further improve the heat dissipation efficiency and enhance the heat exchange capacity, but this embodiment does not impose any limitation on this.

[0072] Specifically, the total heat dissipation area can be expanded by increasing the number of heat dissipation fins or increasing the size of a single fin to provide a wider path for heat dissipation, or the distance and thickness between the heat dissipation fins can be adjusted to ensure unimpeded air circulation and efficient removal of heat.

[0073] In order to improve the heat conduction efficiency inside the shell 100, a cooling pipeline can be set on the heat dissipation substrate 330. Specifically, the cooling pipeline is connected to a cooling liquid source, and a cooling medium circulates inside the cooling pipeline to remove heat, thereby reducing the temperature of the heat dissipation substrate 330.

[0074] In a feasible embodiment, the heat dissipation substrate 330 includes a semiconductor refrigeration plate. By arranging the semiconductor refrigeration plate between the first concave-convex structure 310 and the second concave-convex structure 320, the refrigeration plate absorbs heat on the side close to the first concave-convex structure 310 and releases heat on the side close to the second concave-convex structure 320, thereby quickly releasing the heat inside the heat dissipation substrate 330.

[0075] In another achievable implementation, cooling pipes and cooling fins are provided on the heat dissipation substrate 330 to achieve the purpose of dual heat dissipation.

[0076] It is understandable that the structure of the heat dissipation substrate 330 can be designed according to actual conditions, as long as it can achieve the purpose of effective heat dissipation.

[0077] In a feasible implementation, the shell 100 is also provided with an openable and closable liquid replenishing port 114, which is configured to be connected to a cooling liquid source to provide timely liquid replenishment to prevent the inductor body 200 from being unable to dissipate heat due to the coolant level in the accommodating cavity 110 being too low.

[0078] In a feasible implementation, the inductor 10 also includes a liquid level detector and a liquid replenishing valve, and the controller is electrically connected to the liquid level detector and the liquid replenishing valve. When the liquid level detector detects that the liquid level of the coolant is too low, the controller controls the liquid replenishing valve to open to automatically replenish liquid into the accommodating cavity 110.

[0079] For details, please refer to Figure 1 and Figure 2 As shown, the heat sink 300 is also provided with a mounting hole, and the cable 400 passes through the mounting hole to be electrically connected with other electronic components.

[0080] The present embodiment provides a liquid-cooled inductor 10, comprising: a shell 100, the shell 100 having a receiving cavity 110 with an opening at the top, the receiving cavity 110 being used to contain cooling liquid; an inductor body 200, disposed in the receiving cavity 110; a heat sink 300, which is covered at the opening and sealed with the shell 100, and the heat sink 300 has a first concave-convex structure 310 on a side facing the receiving cavity 110. In this way, by placing the inductor body 200 inside the shell 100 and injecting coolant into the shell 100, the inductor body 200 is in direct contact with the coolant for heat exchange, which can reduce thermal resistance and improve heat conduction efficiency; in addition, by arranging a heat sink 300 on the top of the shell 100, the coolant after heat exchange with the inductor body 200 can be heat exchanged with the heat sink 300, thereby releasing the heat inside the shell 100 to the outside of the shell 100; and a first concave-convex structure 310 is arranged on the side of the heat sink 300 facing the accommodating cavity 110 to increase the heat exchange area and improve the heat exchange efficiency. The device can realize circulating heat dissipation inside the shell without the need for other equipment to assist in heat exchange. Compared with traditional inductors, the device has a shorter heat transfer path, faster heat transfer speed, higher heat dissipation efficiency and better heat dissipation performance.

[0081] This embodiment further provides an inverter, including the above-mentioned liquid-cooled inductor 10, wherein the specific structure, function and working principle of the liquid-cooled inductor 10 have been described in detail in the above-mentioned embodiments and will not be repeated here.

[0082] Exemplarily, the inverter can be applied to fields such as solar inverters, wind power inverters, electric vehicles and other industrial equipment. This embodiment does not limit the application field of the inverter.

[0083] In this embodiment, taking a 25kW photovoltaic inverter inductor as an example, the magnetic core is made of iron silicon aluminum material with an initial magnetic permeability of 60u, and different liquid media are used to experimentally verify the normal glue-encapsulated inductor (the maximum test temperature is 115°C). The results are as follows: the maximum temperature of the inductor encapsulated with silicone oil is 80°C, the maximum temperature of the inductor encapsulated with deionized water is 54°C, and the maximum temperature of the inductor encapsulated with electronic fluoride liquid is 67°C. Compared with the traditional normal glue-encapsulated inductor, the inductor encapsulated with liquid has a better heat dissipation effect.

[0084] The terms "first", "second", etc. in the embodiments of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present application described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0085] In the embodiments of the present application, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have specific orientations, or to be constructed and operated in specific orientations. Moreover, in addition to being used to indicate orientations or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present application can be understood according to the specific circumstances.

[0086] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0087] It should be noted that the embodiments represented by "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing specific features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments that are explicitly or not explicitly described.

[0088] In general, terms should be understood, at least in part, by the context in which they are used. For example, the terms "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "an" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid-cooled inductor, characterized in that: include: A housing (100), the housing (100) having a receiving cavity (110) with an opening at the top, the receiving cavity (110) being used to receive a cooling liquid; An inductor body (200) is disposed in the accommodating cavity (110); A heat sink (300) is covered at the opening and is sealed and connected to the housing (100); a side of the heat sink (300) facing the accommodating cavity (110) has a first concave-convex structure (310).

2. The liquid-cooled inductor according to claim 1, characterized in that: The heat dissipation element (300) has a second concave-convex structure (320) on a side facing away from the accommodating cavity (110).

3. The liquid-cooled inductor according to claim 2, characterized in that: The heat sink (300) comprises a heat sink substrate (330), the first concave-convex structure (310) being arranged on a side of the heat sink substrate (330) facing the accommodating cavity (110), and the second concave-convex structure (320) being arranged on a side of the heat sink substrate (330) facing away from the accommodating cavity (110).

4. The liquid-cooled inductor according to claim 3, characterized in that: The accommodating chamber (110) comprises a liquid cooling zone (111) and a gas-liquid conversion zone (112); the liquid cooling zone (111) is configured to accommodate the cooling liquid; the gas-liquid conversion zone (112) is arranged above the liquid cooling zone (111); and a height of the gas-liquid conversion zone (112) is greater than or equal to 0.

5. The liquid-cooled inductor according to claim 4, characterized in that: Part of the first concave-convex structure (310) is located in the liquid cooling area (111).

6. The liquid-cooled inductor according to claim 4, characterized in that: The distance between the first concavo-convex structure (310) and the liquid cooling area (111) is greater than 0.

7. The liquid-cooled inductor according to any one of claims 3 to 6, characterized in that: The first concave-convex structure (310) comprises a plurality of first heat dissipation fins (311), and the plurality of first heat dissipation fins (311) are arranged at equal intervals along a first direction on a side of the heat dissipation substrate (330) facing the accommodating cavity (110); And / or, the second concave-convex structure (320) comprises a plurality of second heat dissipation fins (321), and the plurality of second heat dissipation fins (321) are arranged at equal intervals along the first direction on a side of the heat dissipation substrate (330) away from the accommodating cavity (110).

8. The liquid-cooled inductor according to any one of claims 3 to 6, characterized in that: The heat dissipation substrate (330) also has a cooling pipeline, and the cooling pipeline is configured to be connected to a cooling liquid source; and / or, The heat dissipation substrate (330) includes a semiconductor cooling sheet.

9. The liquid-cooled inductor according to claim 8, characterized in that: The shell (100) is also provided with an openable and closable liquid replenishing port (114), and the liquid replenishing port (114) is configured to be connected to the cooling liquid source; and / or, a pressure relief valve is also provided on the top of the shell (100).

10. The liquid-cooled inductor according to claim 9, characterized in that: It also comprises a controller and a pressure detection component, wherein the pressure detection component is arranged in the housing (100), and the pressure detection component and the pressure relief valve are respectively connected to the controller signal.

11. The liquid-cooled inductor according to claim 10, characterized in that: It also includes a liquid level detector and a liquid filling valve. The controller is electrically connected to the liquid level detector and the liquid replenishing valve. The controller is configured to control the liquid replenishing valve to open according to the value detected by the liquid level detector so as to automatically replenish liquid into the accommodating chamber 110 .

12. An inverter, characterized in that: The invention comprises a liquid-cooled inductor as described in any one of claims 1 to 11.

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