A double-station eutectic heating machine and eutectic method

Abstract

The application relates to a double-station eutectic heating machine and a eutectic method, and relates to the technical field of semiconductor packaging equipment. The eutectic heating machine comprises a workbench, a eutectic table for heating and bonding a substrate, a first chip and a second chip, the eutectic table is arranged on the workbench, and the eutectic table is provided with a first station and a second station at intervals. A first chip feeding device is arranged on the workbench and used for conveying the first chip towards the eutectic table. A second chip feeding device is arranged on the workbench and used for conveying the second chip towards the eutectic table. A substrate feeding and discharging device is arranged on the workbench and used for conveying the substrate towards the first station and the second station and discharging finished products of the first station and the second station. The double-station eutectic table can reduce unnecessary time waste in the finished product production process, thereby improving the production efficiency of the eutectic heating machine.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging equipment, and particularly relates to a double-station eutectic heating machine and a eutectic method. BACKGROUND

[0002] The eutectic heating machine is a device used in the microelectronic packaging process, which melts solder by precisely controlling the temperature curve to bond the substrate and the chip together. Such a device is very important in the COB and COC processes.

[0003] At present, the existing eutectic heating machine mainly comprises a first chip feeding mechanism, a second chip feeding mechanism, a substrate feeding mechanism and a eutectic table. The substrate feeding mechanism transports the substrate towards the eutectic table, the first chip feeding mechanism transports the first chip towards the eutectic table, and the second chip feeding mechanism transports the second chip towards the eutectic table. When the substrate, the first chip and the second chip exist on the eutectic table, the eutectic table is heated, thereby heating and bonding the substrate, the first chip and the second chip, and thereby obtaining a finished product.

[0004] The existing eutectic heating machine is mainly provided with a single station, that is, only one finished product can be prepared on the single eutectic table at the same time. Therefore, after the eutectic table completes the eutectic operation of one finished product, the eutectic table needs to be cooled, and the finished product needs to be taken out, and then the next finished product can be processed. This will cause unnecessary time waste, thereby reducing the production efficiency of the eutectic heating machine. SUMMARY

[0005] The present application provides a double-station eutectic heating machine and a eutectic method, which aims to reduce unnecessary time waste in the finished product production process, thereby improving the production efficiency of the eutectic heating machine.

[0006] In a first aspect, the double-station eutectic heating machine provided by the present application adopts the following technical scheme:

[0007] The double-station eutectic heating machine comprises a workbench, a eutectic table for heating and bonding a substrate, a first chip and a second chip, the eutectic table being arranged on the workbench, and first and second stations being arranged on the eutectic table at intervals; a first chip feeding device for transporting the first chip towards the eutectic table, the first chip feeding device being arranged on the workbench; a second chip feeding device for transporting the second chip towards the eutectic table, the second chip feeding device being arranged on the workbench; and a substrate feeding and discharging device for transporting the substrate towards the first and second stations and discharging finished products from the first and second stations, the substrate feeding and discharging device being arranged on the workbench.

[0008] By adopting the above technical solution, through the cooperation of the eutectic table, the substrate loading and unloading device, the first chip loading device and the second chip loading device, the substrate, the first chip and the second chip can be transported in sequence on the eutectic table, which can realize the stacking of the substrate, the first chip and the second chip, and then through heating on the eutectic table, the substrate, the first chip and the second chip can be heated and bonded to obtain a finished product, and finally the finished product can be unloaded from the eutectic table through the substrate loading and unloading device, thereby realizing fully automatic production of the eutectic heating machine.

[0009] Since the eutectic table is equipped with a first and second workstations, while the first workstation is performing eutectic processing, the second workstation can load the substrate, first chip, and second chip. Similarly, while the second workstation is performing eutectic processing, the first workstation can load the substrate, first chip, and second chip. The dual-workstation configuration enables continuous eutectic processing, thereby improving production efficiency.

[0010] Therefore, by setting up a double-station eutectic table, unnecessary time waste in the finished product production process can be reduced, thereby improving the production efficiency of the eutectic heating machine.

[0011] Optionally, the substrate loading and unloading device includes a feeding and receiving mechanism, which is used to provide substrates and store finished products, and the feeding and receiving mechanism is arranged on the workbench; the substrate loading and unloading device also includes a material picking robot and a robot driving mechanism, the material picking robot is used to pick up substrates and finished products, the robot driving mechanism is arranged on the workbench, and the material picking robot is arranged on the robot driving mechanism, and the robot driving mechanism is used to drive the material picking robot to reciprocate between the eutectic table and the feeding and receiving mechanism and to reciprocate between the first workstation and the second workstation.

[0012] By adopting the above technical solution, the substrate loading and unloading device realizes substrate supply and finished product recovery through the feeding and receiving mechanism, and the coordinated setting of the material picking robot and the robot driving mechanism can reciprocate between the feeding and receiving mechanism and the eutectic table, which can realize the substrate transportation and finished product transportation between the feeding and receiving mechanism and the eutectic table, thereby realizing the function of the substrate loading and unloading device.

[0013] Optionally, the material picking robot is provided with two suction nozzles, and both of the suction nozzles are used to pick up substrates or finished products; the robot drive mechanism includes two Z-axis driving components, and the Z-axis driving components are arranged in a one-to-one correspondence with the suction nozzles. The Z-axis driving components are arranged on the material picking robot, and the suction nozzles are arranged on the corresponding Z-axis driving components, and the Z-axis driving components are used to drive the suction nozzles to move in a vertical direction.

[0014] By adopting the above technical solution, since the retrieving robot is equipped with two suction nozzles, each nozzle can operate independently under the drive of the corresponding Z-axis drive component, so each suction nozzle can independently pick up the substrate and the finished product. The configuration of the two suction nozzles on the retrieving robot enables one suction nozzle to load the substrate and the other suction nozzle to unload the eutectic finished product. Therefore, the dual suction nozzle configuration on the retrieving robot can effectively increase the speed of unloading and loading the eutectic table. Furthermore, the coordinated configuration of the dual suction nozzles and the dual workstations can effectively improve the continuity of the eutectic operation of the eutectic heating machine and improve the production efficiency of the eutectic heating machine.

[0015] Optionally, the material supply and receiving mechanism includes a frame, which is arranged on the workbench, and the frame is spaced apart from the eutectic table; the frame is provided with a loading station, a working station and an unloading station in sequence along its own length direction, and a substrate silo and a finished product silo for storing material trays are provided on the frame, and the substrate silo and the finished product silo are both provided on the frame, and the substrate silo is located at the loading station, the material picking robot is located at the working station, and the finished product silo is located at the unloading station; a conveying member for conveying material trays is provided on the frame, and the conveying direction of the conveying member is provided along the length direction of the frame; a tray taking component for moving the material tray in the substrate material tray to the conveying member is provided on the substrate silo; and a tray placing component for moving the material tray on the conveying member to the finished product silo is provided on the finished product silo.

[0016] By adopting the above technical solution, the feeding and receiving mechanism, through the arrangement of the substrate hopper, finished product hopper and conveyor on the frame, allows the tray filled with substrates to be moved from the loading station to the working station, and then the material-retrieving robot can remove the substrates in the tray and convey the finished products from the eutectic table to the tray. After the tray is filled with finished products, it can be conveyed to the unloading station and then stored in the finished product hopper. This structural arrangement can realize the loading of substrates and the unloading of finished products.

[0017] Optionally, a third workstation is further provided on the eutectic table, a vacuum adsorption hole is opened on the eutectic table, the vacuum adsorption hole is located at the third workstation, and a vacuum pump is provided on the eutectic table, and the vacuum pump is connected to the vacuum adsorption hole.

[0018] By adopting the above-mentioned technical solution, the third workstation is set up, and a vacuum adsorption hole and an exhaust component are opened at the third workstation. With the cooperation of the vacuum adsorption hole and the exhaust component, the first chip sent to the third workstation can be fixed by the vacuum adsorption hole, and then the second chip can be stacked on the first chip. At this time, the eutectic table is heated to achieve heating and bonding of the first chip and the second chip, which can realize the COC packaging process, and then the eutectic heating machine of the present application can realize two packaging processes, thereby broadening the scope of application of the eutectic heating machine of the present application.

[0019] Optionally, a eutectic visual element is provided on the eutectic table, and the eutectic visual element is arranged on the upper side of the eutectic table in the vertical direction, and the eutectic visual element and the eutectic table are arranged opposite to each other in the vertical direction.

[0020] By adopting the above technical solution and setting the eutectic visual element, the eutectic condition of the finished product on the eutectic table can be monitored in real time.

[0021] Optionally, a compensation drive mechanism is further provided on the workbench, and the eutectic table is provided on the compensation drive mechanism, and the compensation drive mechanism is used to drive the eutectic table to move on the workbench.

[0022] By adopting the above technical solution and the setting of the compensation drive mechanism, the first workstation can be adjusted to face the eutectic visual element, or the second workstation can be adjusted to face the eutectic visual element, so that when eutectic is performed at the corresponding first workstation or second workstation, the eutectic visual element can be aligned with the corresponding workstation.

[0023] In a second aspect, the present application provides a eutectic method using the following technical solutions:

[0024] A eutectic method utilizes the above-mentioned double-station eutectic heating machine for eutectic, comprising the following steps: S1, loading a tray filled with a substrate; S2, simultaneously conveying the substrate toward a first station and a second station; S3, conveying a first chip and a second chip in sequence toward the first station; S4, eutecticizing at the first station to obtain a finished product, while simultaneously conveying the first chip and the second chip in sequence toward the second station; S5, eutecticizing at the second station to obtain a finished product, while simultaneously unloading the finished product and loading the substrate, the first chip and the second chip in sequence at the first station; S6, eutecticizing at the first station to obtain a finished product, while simultaneously unloading the finished product and loading the substrate, the first chip and the second chip in sequence at the second station; S7, repeating steps S5-S6 until the tray is filled with finished products; S8, unloading the tray filled with finished products.

[0025] By adopting the above technical solution, this method uses a dual-station configuration. While eutectic formation is taking place at the first station, the second station can also perform loading and preheating. This eutectic method can speed up the eutectic process and improve the production efficiency of the eutectic heating machine.

[0026] Optionally, in step S5, the first station sequentially unloads finished products and loads substrates, first chips, and second chips, including the following steps: the material picking robot moves to the material tray, and a suction nozzle of the material picking robot picks up the substrate; the material picking robot moves to the upper side of the eutectic table, and a suction nozzle of the material picking robot picks up the finished product of the first station, and the other suction nozzle places the substrate at the first station; the material picking robot moves to the material tray, the material picking robot loads the finished product onto the material tray, and at the same time conveys the first chip and the second chip to the first station in sequence.

[0027] By adopting the above technical solution, this method uses a dual suction nozzle configuration, enabling one nozzle to pick up the finished product at the first station, while the other nozzle can load the substrate onto the first station. Similarly, one nozzle can pick up the finished product at the second station, while the other nozzle can load the substrate onto the second station. This speeds up loading and unloading, thereby increasing the eutectic operation speed and improving the production efficiency of the eutectic heating machine.

[0028] Optionally, a eutectic method, using the above-mentioned double-station eutectic heating machine for eutectic, includes the following steps: S1, loading an empty tray; S2, conveying the first chip and the second chip to the third station in sequence; S3, eutecticizing at the third station to obtain a finished product; S4, unloading the finished product from the third station, and unloading the finished product into the tray; S5, repeating steps S2-S4 until the tray is filled with finished products; S6, unloading the tray filled with finished products.

[0029] By adopting the above technical solution, the present method can realize the loading of the first chip and the second chip, and then realize the heating bonding of the first chip and the second chip, which can meet the COC packaging process requirements.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. This application can reduce unnecessary time waste in the finished product production process by setting up a double-station eutectic table, thereby improving the production efficiency of the eutectic heating machine.

[0032] 2. This application can effectively increase the speed of unloading and loading materials on the eutectic table by setting up double suction nozzles on the material-retrieving robot, and then the coordinated setting of double suction nozzles and double workstations can effectively improve the continuity of the eutectic operation of the eutectic heating machine and improve the production efficiency of the eutectic heating machine.

[0033] 3. This application can realize the COC subpackaging process by setting up the third workstation, thereby enabling the eutectic heating machine of this application to realize two packaging processes, thereby expanding the scope of application of the eutectic heating machine of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the overall structure of the eutectic heating machine of this application.

[0035] Figure 2 It is a schematic diagram of the overall structure of the first chip loading device, the second chip loading device and the eutectic table of the present application.

[0036] Figure 3 It is a schematic diagram of the overall structure of the eutectic table of this application.

[0037] Figure 4 It is a schematic diagram of the cross-sectional structure of the eutectic table of this application.

[0038] Figure 5 It is a schematic diagram of the overall structure of the substrate loading and unloading device of the present application.

[0039] Figure 6 This is a schematic diagram of the overall structure of the substrate loading and unloading device of the present application from another perspective.

[0040] Figure 7 It is a partial structural diagram of the substrate loading and unloading device of the present application.

[0041] In the figure, 1. workbench; 2. eutectic table; 21. first station; 22. second station; 23. third station; 24. heating tank; 25. heating table; 251. heating rod; 252. heating cavity; 253. vacuum adsorption hole; 254. exhaust part; 255. auxiliary heating element; 2551. air supply part; 2552. heating tube; 256. air knife; 2561. air hole; 2562. auxiliary tube; 26. transparent plate; 261. first hole; 262. second hole; 263. third hole; 264. eutectic chamber; 27. air storage part; 271. air duct; 28. eutectic visual element; 29. ​​compensation drive mechanism; 291. first drive member; 292. second drive member; 3. first chip loading device; 31. feeding mechanism; 32. material transfer mechanism Transport mechanism; 33. Calibration mechanism; 34. Loading and transferring mechanism; 4. Second chip loading device; 5. Substrate loading and unloading device; 51. Material picking robot; 511. Suction nozzle; 52. Robot driving mechanism; 521. Y-axis driving member; 522. X-axis driving member; 523. Z-axis driving member; 53. Material supply and receiving mechanism; 531. Rack; 5311. Loading station; 5312. Working station; 5313. Unloading station; 532. Conveying member; 533. Substrate silo; 534. Finished product silo; 535. First locking assembly; 5351. Limiting member; 5352. Limiting plate; 5353. Limiting driving member; 536. Second locking assembly; 537. Plate picking assembly; 5371. Lifting driving member; 5372. Lifting platform; 538. Plate placing assembly. DETAILED DESCRIPTION

[0042] The following is combined with Figure 1 -Attached Figure 7 , further details of this application are given.

[0043] Example 1: A double-station eutectic heating machine, referring to Figure 1 , including a workbench 1, a eutectic table 2, a first chip loading device 3, a second chip loading device 4, and a substrate loading and unloading device 5. The eutectic table 2, the first chip loading device 3, the second chip loading device 4, and the substrate loading and unloading device 5 are all arranged on the workbench 1, and the first chip loading device 3, the second chip loading device 4, and the substrate loading and unloading device 5 are arranged around the eutectic table 2.

[0044] The substrate loading and unloading device 5 conveys a substrate onto the eutectic table 2. The first chip loading device 3 conveys a first chip onto the eutectic table 2 and superimposes the first chip on the substrate. The second chip loading device 4 conveys a second chip onto the eutectic table 2 and superimposes the second chip on the first chip. At this time, the eutectic table 2 is heated, and the substrate, first chip, and second chip are heat-bonded to obtain a finished product. The finished product is then unloaded by the substrate loading and unloading device 5 for recycling. This device can achieve fully automated production.

[0045] With reference to Figure 1 and Figure 2 In the embodiment, the first chip loading device 3 and the second chip loading device 4 are the same in structure, and the first chip loading device 3 is taken as an example for description.

[0046] With reference to Figure 1 and Figure 2 The first chip loading device 3 comprises a feeding mechanism 31, which is arranged on the workbench 1 and is spaced apart from the eutectic table 2. The side of the feeding mechanism 31 facing the eutectic table 2 is sequentially provided with a material taking and transferring mechanism 32, a calibration mechanism 33 and a loading and transferring mechanism 34, and the material taking and transferring mechanism 32, the calibration mechanism 33 and the loading and transferring mechanism 34 are all located between the feeding mechanism 31 and the eutectic table 2.

[0047] The feeding mechanism 31 provides corresponding first chips; the material taking and transferring mechanism 32 reciprocates between the feeding mechanism 31 and the calibration mechanism 33, and the material taking and transferring mechanism 32 transfers the first chips provided by the feeding mechanism 31 to the calibration mechanism 33; the calibration mechanism 33 calibrates the angle and position of the first chips; the loading and transferring mechanism 34 reciprocates between the calibration mechanism 33 and the eutectic table 2, and the loading and transferring mechanism 34 obtains the first chips calibrated by the calibration mechanism 33 and delivers the first chips to the eutectic table 2. Through the structural arrangement of the first chip loading device 3, the first chips can be automatically taken, calibrated and delivered to the eutectic table 2, so that full-automatic loading of the first chips can be realized.

[0048] With reference to Figure 3 and Figure 4 The eutectic table 2 is provided with a heating groove 24, and the heating groove 24 is provided with a heating table 25. The heating table 25 is connected with the groove bottom of the heating groove 24, and the eutectic table 2 is embedded with a heating rod 251. One end of the heating rod 251 is arranged in the heating table 25, and the other end extends to the outside of the eutectic table 2. The arrangement of the heating table 25 and the heating rod 251 can realize the heating function of the eutectic table 2.

[0049] With reference to Figure 3 and Figure 4 The eutectic table 2 is provided with a transparent plate 26, and the transparent plate 26 seals the heating groove 24. The transparent plate 26 is provided with a first hole 261 and a second hole 262, and the first hole 261 and the second hole 262 are spaced apart. The first hole 261 and the second hole 262 can accommodate the substrate, the first chips and the second chips, so that the substrate can contact the heating table 25, thereby ensuring the heating effect of the eutectic table 2.

[0050] With reference to Figure 3 and Figure 4The eutectic table 2 is provided with a first station 21 and a second station 22, the first station 21 and the second station 22 are arranged at intervals, and the first hole 261 is located at the first station 21 and the second hole 262 is located at the second station 22. The first station 21 and the second station 22 on the eutectic table 2 can both perform heating bonding of the substrate, the first chip and the second chip, so that the eutectic table 2 of the application can work in double stations at the same time.

[0051] With reference to Figure 3 and Figure 4 , the transparent plate 26 is arranged at intervals with the heating table 25, and a eutectic chamber 264 is formed between the transparent plate 26 and the heating table 25. The eutectic table 2 is provided with a gas storage member 27 on one side, and a plurality of air pipes 271 are arranged between the gas storage member 27 and the eutectic table 2. One end of the air pipe 271 is connected with the gas storage member 27, the other end is connected with the eutectic table 2, and the air pipe 271 is in communication with the eutectic chamber 264. This can inject cold nitrogen gas into the eutectic chamber 264 to form a nitrogen atmosphere, so that the molten tin effect is better during the eutectic process.

[0052] With reference to Figure 3 and Figure 4 , the eutectic table 2 is further provided with an air knife 256 on one side, and a plurality of air holes 2561 are formed on the side of the air knife 256 facing the eutectic table 2, and the air holes 2561 are arranged on the upper side of the transparent plate 26. An auxiliary pipe 2562 is arranged between the air knife 256 and the gas storage member 27, one end of the auxiliary pipe 2562 is connected with the gas storage member 27, the other end is connected with the air knife 256, and the air holes 2561 are in communication with the auxiliary pipe 2562. This can blow cold nitrogen gas towards the transparent plate 26, thereby reducing the temperature difference between the inside and outside of the transparent plate 26 and reducing the possibility of fogging of the transparent plate 26.

[0053] With reference to Figure 3 and Figure 4 , the eutectic table 2 is further provided with a third station 23, and the first station 21, the second station 22 and the third station 23 are arranged at intervals. A third hole 263 is formed through the transparent plate 26, and the third hole 263 is located at the third station 23. The third hole 263 can accommodate the first chip and the second chip, so that the first chip can contact the heating table 25, thereby realizing the bonding of the first chip and the second chip and realizing the COC packaging process.

[0054] With reference to Figure 3 and Figure 4A heating cavity 252 is defined within the heating table 25, with one end of a heating rod 251 inserted into the heating cavity 252. A vacuum hole 253 is defined on the heating table 25, communicating with the heating cavity 252. A vacuum element 254 is provided on one side of the eutectic table 2. The vacuum element 254 is connected to the heating table 25 via a pipe, and the vacuum element 254 is also connected to the heating cavity 252 via a pipe. The vacuum hole 253 is located at the third station 23, and is positioned directly opposite the third hole 263.

[0055] When bonding the first chip to the second chip, the air in the heating cavity 252 is extracted by the vacuum member 254 , which can form a negative pressure at the vacuum adsorption hole 253 , thereby adsorbing the first chip and fixing the first chip.

[0056] Reference Figure 3 and Figure 4 An auxiliary heating element 255 is provided on one side of the eutectic table 2. The auxiliary heating element 255 includes a gas supply member 2551 and a heating tube 2552. A heating wire is provided on the inner wall of the heating tube 2552. One end of the heating tube 2552 is connected to the gas supply member 2551, and the other end is connected to the heating table 25. The heating tube 2552 is also connected to the heating cavity 252. This allows the gas supply member 2551 to inject nitrogen into the heating tube 2552. The nitrogen is heated by the heating tube 2552 and then discharged into the heating cavity 252. The hot nitrogen can fill the gaps in the heating cavity 252, thereby improving the heating uniformity of the heating table 25.

[0057] Reference Figure 2 Eutectic visual elements 28 are provided on the upper side of the eutectic table 2. The eutectic visual elements 28 are vertically spaced and face the eutectic table 2. The provision of the eutectic visual elements 28 enables real-time monitoring of the bonding effect of the corresponding finished product.

[0058] Reference Figure 2 A compensating drive mechanism 29 is disposed between the eutectic table 2 and the workbench 1. The compensating drive mechanism 29 includes a first drive member 291 and a second drive member 292. Both the first drive member 291 and the second drive member 292 utilize linear modules driven by servo motors. The first drive member 291 is disposed on the workbench 1, the second drive member 292 is disposed on the first drive member 291, and the eutectic table 2 is disposed on the second drive member 292. The driving directions of the first drive member 291 and the second drive member 292 are both horizontal and perpendicular to each other. The compensating drive mechanism 29 allows the position of the eutectic table 2 to be adjusted, thereby ensuring that when the first workstation 21, the second workstation 22, or the third workstation 23 is operating, the eutectic visual element 28 is aligned with the first workstation 21, the second workstation 22, or the third workstation 23 is operating.

[0059] Reference Figure 1 and Figure 5 The substrate loading and unloading device 5 includes a retrieving robot 51 and a robot drive mechanism 52. The robot drive mechanism 52 includes a Y-axis drive 521. The Y-axis drive 521 is a linear module driven by a servo motor. The drive direction of the Y-axis drive 521 is set in the horizontal direction, and one end of the Y-axis drive 521 is set in the longitudinal direction toward the eutectic table 2. The robot drive mechanism 52 also includes an X-axis drive 522. The X-axis drive 522 is a linear module driven by a servo motor. The drive direction of the X-axis drive 522 is set in the horizontal direction and along the spacing direction between the first station 21 and the second station 22. The X-axis drive 522 is arranged perpendicular to the drive direction of the Y-axis drive 521. The X-axis drive 522 is arranged on the Y-axis drive 521, and the retrieving robot 51 is arranged on the X-axis drive 522. Driven by the Y-axis drive 521, the material-retrieving robot 51 moves toward or away from the eutectic table 2; driven by the X-axis drive 522, the material-retrieving robot 51 can reciprocate between the first station 21, the second station 22 and the third station 23, so the cooperation between the Y-axis drive 521 and the X-axis drive 522 can realize substrate loading and finished product unloading at the three stations.

[0060] Reference Figure 5 The retrieving robot 51 is provided with two suction nozzles 511. Both suction nozzles 511 are arranged in the vertical direction. The two suction nozzles 511 are arranged at intervals in the horizontal direction, and the spacing direction of the two suction nozzles 511 is arranged along the driving direction of the X-axis driving member 522. The robot driving mechanism 52 also includes two Z-axis driving members 523. The Z-axis driving member 523 adopts a linear module or a gear rack mechanism driven by a servo motor. The driving direction of the Z-axis driving member 523 is arranged in the vertical direction. The Z-axis driving member 523 is arranged in a one-to-one correspondence with the suction nozzle 511, and the suction nozzle 511 is connected to the corresponding Z-axis driving member 523. This makes it possible for the two suction nozzles 511 on the retrieving robot 51 to both retrieve and unload substrates and retrieve and unload finished products, which can meet the requirements of the eutectic table 2 working at the same time in both stations.

[0061] Reference Figure 5 and Figure 6The substrate loading and unloading device 5 also includes a feeding and receiving mechanism 53, which includes a frame 531. The frame 531 is connected to the workbench 1. The length of the frame 531 is arranged horizontally and perpendicularly along the driving direction of the X-axis driver 522. The frame 531 is located vertically below the Y-axis driver 521 and is spaced apart from the eutectic table 2 along its width. This allows the retrieving robot 51 to reciprocate between the frame 531 and the eutectic table 2 under the drive of the Y-axis driver 521.

[0062] Reference Figure 5 and Figure 6 The frame 531 is provided with a conveying member 532, which includes two linear modules driven by servo motors. The two linear modules are arranged parallel to each other and spaced apart along their width directions. The length directions of the two linear modules are arranged along the length direction of the frame 531. This ensures that the conveying direction of the conveying member 532 is arranged along the length direction of the frame 531.

[0063] The frame 531 is sequentially provided with a loading station 5311, a working station 5312 and a blanking station 5313 along its length direction. This enables the conveying member 532 to convey the material tray from the loading station 5311 to the working station 5312 in sequence, and finally to the blanking station 5313.

[0064] Reference Figure 5 and Figure 6 The frame 531 is provided with a substrate hopper 533 and a finished product hopper 534. The substrate hopper 533 is stacked with a plurality of trays containing substrates, while the finished product hopper 534 is stacked with a plurality of hoppers containing finished products. In this embodiment, both the substrate hopper 533 and the finished product hopper 534 can stack five trays. Both the substrate hopper 533 and the finished product hopper 534 are located on the upper side of the frame 531. The substrate hopper 533 is located at the loading station 5311, the finished product hopper 534 is located at the unloading station 5313, and the retrieving robot 51 is located at the working station 5312.

[0065] Reference Figure 5 and Figure 7The first locking assembly 535 is arranged in the substrate material bin 533, and the first locking assembly 535 comprises two limiting pieces 5351 arranged on opposite sides of the substrate material bin 533. The limiting piece 5351 comprises a limiting plate 5352 and a limiting driving piece 5353. The limiting driving piece 5353 is a gas cylinder. The two limiting driving pieces 5353 drive the two limiting plates 5352 to move close to each other. At this time, the two limiting plates 5352 can clamp and fix the lowermost tray in the substrate material bin 533, and can further fix a plurality of stacked trays.

[0066] With reference to Figure 5 and Figure 6 The tray taking assembly 537 is arranged on the lower side of the substrate material bin 533. The tray taking assembly 537 comprises a lifting driving piece 5371 and a lifting table 5372. The lifting driving piece 5371 is a linear module driven by a servo motor. The driving direction of the lifting driving piece 5371 is arranged along the vertical direction. The lifting table 5372 is connected with the output end of the lifting driving piece 5371. The tray placing assembly 538 is arranged on the lower side of the finished product material bin 534. The tray placing assembly 538 has the same structure as the tray taking assembly 537.

[0067] With reference to Figure 5 Through cooperation of the conveying piece 532, the substrate material bin 533, the finished product material bin 534, the first locking assembly 535, the second locking assembly 536, the tray taking assembly 537 and the tray placing assembly 538, substrate feeding and finished product discharging can be realized. The specific process is as follows:

[0068] With reference to Figure 5 Substrate feeding: The tray taking assembly 537 rises to contact the tray in the substrate material bin 533. The first locking assembly 535 releases the locking of the tray. The tray taking assembly 537 descends by the height of one tray. At this time, the lowermost tray in the substrate material bin 533 is located on the tray taking assembly 537. The first locking assembly 535 relocks the tray. Then the tray taking assembly 537 descends to the height of the conveying piece 532. The tray is placed on the conveying piece 532. At this time, the tray is located on the feeding station 5311. Under the action of the conveying piece 532, the tray is conveyed to the working station 5312. Under the cooperation of the Y-axis driving piece 521, the Z-axis driving piece 523, the material taking manipulator 51 and the conveying piece 532, the tray in the working station 5312 can convey the substrate in the tray to the eutectic table 2, and can also convey the finished product on the eutectic table 2 back to the tray. In this process, the cooperation of the conveying piece 532 and the Y-axis driving piece 521 enables the material taking manipulator 51 to cover the entire tray, so as to feed all the substrates in the tray and load all the finished products into the tray.

[0069] Specifically, the tray removal assembly 537 rises and falls from the space between the two linear modules of the conveyor 532 to retrieve the material tray, which then falls onto the two linear modules. At this time, the two linear modules work together to transport the material tray. In addition, the conveyor 532 also uses a conveyor belt mechanism.

[0070] Reference Figure 5 Finished product unloading: After the tray at work station 5312 is filled with finished products, the conveyor 532 transports the tray to the unloading station 5313. At this point, the tray placement assembly 538 descends beneath the conveyor 532, which transfers the tray onto the tray placement assembly 538. The tray placement assembly 538 rises until the tray contacts the lowest tray in the finished product bin 534. The second locking assembly 536 then releases the tray lock. The tray placement assembly 538 continues to rise one tray's height, and the tray is then transported into the finished product bin 534. The second locking assembly 536 then re-locks the tray, completing the unloading of the finished product.

[0071] The implementation principle of the embodiment of the present application is as follows: First, the design of the first station 21 and the second station 22 on the eutectic table 2 is such that when the first station 21 is performing eutectic operation, the second station 22 can load the substrate, the first chip and the second chip; when the second station 22 is performing eutectic operation, the first station 21 can load the substrate, the first chip and the second chip. By setting up the dual stations, the continuity of the eutectic operation can be achieved, thereby improving production efficiency. Moreover, when the first station 21 is performing eutectic operation, the second station 22 can be preheated. Similarly, when the second station 22 is performing eutectic operation, the first station 21 can be preheated. This can speed up the eutectic operation and improve the quality of the final product.

[0072] Secondly, the two suction nozzles 511 on the retrieving robot 51 enable one nozzle 511 to load the substrate and the other nozzle 511 to unload the finished eutectic product. The dual suction nozzles 511 on the retrieving robot 51, combined with the dual stations on the eutectic table 2, effectively improve the continuity of the eutectic heating machine's eutectic operation and enhance its production efficiency.

[0073] In addition, the third station 23 on the eutectic table 2 can heat and bond the first chip to the second chip to obtain a finished product, while the substrate loading and unloading device 5 is used to unload the finished product. At this time, the COC packaging process can be realized. This enables the eutectic heating machine of the present application to realize two different eutectic packaging processes, thereby expanding the scope of application of the eutectic heating machine of the present application.

[0074] This embodiment also discloses a eutectic method, comprising the following steps:

[0075] S1. The tray in the substrate hopper 533 is transported from the loading station 5311 to the working station 5312 to load the tray. In the embodiment, the tray in the substrate hopper 533 is a tray full of substrates.

[0076] S2 , transporting the substrate toward the first station 21 and the second station 22 simultaneously.

[0077] Specifically, the two suction nozzles 511 of the material-taking robot 51 both pick up substrates from the material tray of the working station 5312 , and under the drive of the robot driving mechanism 52 , the two substrates are placed in the first station 21 and the second station 22 , respectively.

[0078] S3, loading at the first workstation 21.

[0079] Specifically, the first chip is transported to the first station 21 of the eutectic table 2 so as to be stacked on the upper side of the substrate. Then, the second chip is transported to the first station 21 of the eutectic table 2 so as to be stacked on the upper side of the first chip.

[0080] The first chip is loaded via the first chip loading device 3, and the second chip is loaded via the second chip loading device 4. Since the first chip loading device 3 and the second chip loading device 4 have the same structure, the loading steps for the first and second chips are the same. This embodiment uses the specific loading steps for the first chip as an example for description. The specific loading steps for the first chip are as follows:

[0081] The feeding mechanism 31 provides the first chip.

[0082] The material taking and transferring mechanism 32 absorbs the first chip provided by the material feeding mechanism 31 and transfers the first chip to the calibration mechanism 33 .

[0083] The calibration mechanism 33 calibrates the position and angle of the first chip.

[0084] The loading and transferring mechanism 34 absorbs the first chip calibrated by the calibrating mechanism 33 and transports the first chip to the first workstation 21 of the eutectic table 2 .

[0085] S4, the first station 21 eutectics, and the second station 22 loads materials at the same time.

[0086] Specifically, the first station 21 eutectic: the heating stage 25 is heated to the eutectic temperature, at which time the substrate, the first chip and the second chip located at the first station 21 are heated and bonded to obtain a finished product.

[0087] Specifically, during loading at the second station 22, a first chip is fed to the second station 22 of the eutectic table 2, stacked on top of the substrate. A second chip is then fed to the second station 22 of the eutectic table 2, stacked on top of the first chip. The loading steps for the second station 22 are identical to those for the first station 21 in step S3.

[0088] S5 , the second station 22 performs eutectic crystallization, and at the same time the first station 21 sequentially performs finished product unloading and substrate, first chip and second chip loading.

[0089] Specifically, S51, eutectic crystallization at the second station 22: the substrate, the first chip, and the second chip at the second station 22 are heated and bonded to obtain a finished product.

[0090] S52, the first workstation 21 sequentially unloads finished products and loads substrates, first chips, and second chips, and step S51 and step S52 are performed synchronously.

[0091] The specific steps of step S52 are as follows:

[0092] The picking robot 51 moves to the material tray of the working station 5312, and a suction nozzle 511 of the picking robot 51 sucks the substrate.

[0093] The picking robot 51 moves to the upper side of the eutectic table 2 , and one suction nozzle 511 of the picking robot 51 picks up the finished product from the first station 21 , and the other suction nozzle 511 places the substrate on the first station 21 .

[0094] The material picking robot 51 moves to the material tray of the working station 5312, and the material picking robot 51 loads the finished product onto the material tray; and at the same time performs the above step S3, conveying the first chip and the second chip to the first station 21 in sequence.

[0095] S6. The first station 21 performs eutectic crystallization, and simultaneously the second station 22 sequentially performs unloading of finished products and loading of substrates, first chips, and second chips.

[0096] Specifically, S61 , the eutectic in the first workstation 21 is the same as step S4 .

[0097] S62: The second workstation 22 sequentially unloads finished products and loads substrates, first chips, and second chips, and steps S61 and S62 are performed simultaneously. The specific steps of step S62 are the same as those of step S52.

[0098] S7. Repeat the above steps S5-S6 until the finished product fills the material tray of the working station 5312.

[0099] S8, when the finished product fills the tray, the tray of the working station 5312 is transported to the unloading station 5313, and the tray is stored into the finished product warehouse 534, realizing the tray unloading.

[0100] S9, repeat the above steps S1-S8 until the substrate in the substrate warehouse 533 is used up or the finished product warehouse 534 is full of trays.

[0101] The implementation principle of the embodiment of the application is that: through the cooperation of the double stations and the double nozzles 511, when the eutectic is carried out in the first station 21, the second station 22 can carry out feeding and preheating. When the eutectic is carried out in the second station 22, the first station 21 can carry out feeding and preheating. Such a eutectic method can speed up the eutectic operation speed and improve the production efficiency of the eutectic heating machine.

[0102] Embodiment 2: a eutectic method, comprising the following steps:

[0103] S1, the tray is in place, and the tray in the substrate warehouse 533 is transported from the feeding station 5311 to the working station 5312. In the embodiment, the tray in the substrate warehouse 533 is an empty tray.

[0104] S2, the first chip and the second chip are sequentially transported to the third station 23, and the second chip is stacked on the upper side of the first chip.

[0105] S3, the third station 23 eutectic, obtaining the finished product.

[0106] Specifically, the heating table 25 is heated to the eutectic temperature, at which time the first chip and the second chip located in the first station 21 are heated and bonded to obtain the finished product.

[0107] S4, the finished product of the third station 23 is unloaded, and the finished product is unloaded into the tray.

[0108] Specifically, the following steps are included:

[0109] The material taking manipulator 51 moves to the third station 23, and the material taking manipulator 51 sucks the finished product.

[0110] The material taking manipulator 51 moves to the working station, and the material taking manipulator 51 loads the finished product into the tray located in the working station.

[0111] S5, repeat the above steps S2-S4 until the finished product fills the tray of the working station.

[0112] S6, when the finished product fills the tray, the tray of the working station 5312 is transported to the unloading station 5313, and the tray is stored into the finished product warehouse 534.

[0113] S7. Repeat the above steps S1-S6 until the substrates in the substrate silo 533 are used up or the finished product silo 534 is full of trays.

[0114] The implementation principle of the embodiment of the present application is as follows: the present method can bond the first chip and the second chip, thereby realizing the COC packaging process. Therefore, the eutectic heating machine of the present application can realize two packaging processes, which can expand the practical scope of the eutectic heating machine of the present application.

[0115] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A double-station eutectic heating machine, characterized in that: include: Workbench (1); A eutectic table (2) is used for heating and bonding the substrate, the first chip, and the second chip, wherein the eutectic table (2) is arranged on the workbench (1), and a first workstation (21) and a second workstation (22) are arranged on the eutectic table (2) at intervals; a first chip loading device (3) for conveying a first chip toward the eutectic table (2), wherein the first chip loading device (3) is arranged on the workbench (1); a second chip loading device (4) for conveying a second chip toward the eutectic table (2), wherein the second chip loading device (4) is arranged on the workbench (1); a substrate loading and unloading device (5) for transporting substrates toward the first workstation (21) and the second workstation (22), and unloading finished products from the first workstation (21) and the second workstation (22); the substrate loading and unloading device (5) is arranged on the workbench (1); The substrate loading and unloading device (5) comprises a material taking robot (51), and the material taking robot (51) is provided with two suction nozzles (511), and the two suction nozzles (511) are both used for sucking substrates or finished products.

2. A double-station eutectic heating machine according to claim 1, characterized in that: The substrate loading and unloading device (5) comprises a material supply and receiving mechanism (53), the material supply and receiving mechanism (53) is used to provide substrates and store finished products, and the material supply and receiving mechanism (53) is arranged on the workbench (1); The substrate loading and unloading device (5) further includes a manipulator driving mechanism (52), wherein the manipulator driving mechanism (52) is arranged on the workbench (1), and the material-retrieving manipulator (51) is arranged on the manipulator driving mechanism (52), and the manipulator driving mechanism (52) is used to drive the material-retrieving manipulator (51) to reciprocate between the eutectic table (2) and the material-feeding mechanism (53) and to reciprocate between the first station (21) and the second station (22).

3. A double-station eutectic heating machine according to claim 2, characterized in that: The manipulator drive mechanism (52) includes two Z-axis drive members (523), and the Z-axis drive members (523) are arranged in a one-to-one correspondence with the suction nozzles (511). The Z-axis drive members (523) are arranged on the material-retrieving manipulator (51), and the suction nozzles (511) are arranged on the corresponding Z-axis drive members (523), and the Z-axis drive members (523) are used to drive the suction nozzles (511) to move in a vertical direction.

4. A double-station eutectic heating machine according to claim 2, characterized in that: The material supply and receiving mechanism (53) comprises a frame (531), the frame (531) is arranged on the workbench (1), and the frame (531) and the eutectic table (2) are spaced apart; The frame (531) is provided with a loading station (5311), a working station (5312) and an unloading station (5313) in sequence along its length direction; a substrate silo (533) and a finished product silo (534) for storing material trays are provided on the frame (531); the substrate silo (533) and the finished product silo (534) are both provided on the frame (531); the substrate silo (533) is located at the loading station (5311); the material retrieving manipulator (51) is located at the working station (5312); and the finished product silo (534) is located at the unloading station (5313); A conveying member (532) for conveying a material tray is provided on the frame (531), and a conveying direction of the conveying member (532) is provided along the length direction of the frame (531); The substrate silo (533) is provided with a tray removal assembly (537) for moving a tray in the substrate silo (533) to the conveying member (532); The finished product bin (534) is provided with a tray placement assembly (538) for moving the tray on the conveying member (532) into the finished product bin (534).

5. The double-station eutectic heating machine according to claim 1, characterized in that: A third workstation (23) is further provided on the eutectic table (2), a vacuum adsorption hole (253) is opened on the eutectic table (2), and the vacuum adsorption hole (253) is located at the third workstation (23). An exhaust component (254) is provided on the eutectic table (2), and the exhaust component (254) is communicated with the vacuum adsorption hole (253).

6. The double-station eutectic heating machine according to claim 1, characterized in that: A eutectic visual element (28) is provided on the eutectic table (2), the eutectic visual element (28) is arranged on the upper side of the eutectic table (2) in the vertical direction, and the eutectic visual element (28) and the eutectic table (2) are arranged facing each other in the vertical direction.

7. The double-station eutectic heating machine according to claim 6, characterized in that: A compensation drive mechanism (29) is also provided on the workbench (1), and the eutectic table (2) is provided on the compensation drive mechanism (29). The compensation drive mechanism (29) is used to drive the eutectic table (2) to move on the workbench (1).

8. A eutectic method, comprising: utilizing a dual-station eutectic heating machine according to any one of claims 1 to 7 to perform eutectic formation; wherein: The following steps are involved: S1, loading the tray filled with substrates; S2, simultaneously conveying the substrate toward the first station (21) and the second station (22); S3, conveying the first chip and the second chip in sequence toward the first workstation (21); S4, eutecticizing at the first station (21) to obtain a finished product, while simultaneously conveying the first chip and the second chip in sequence to the second station (22); S5, the second station (22) performs eutectic crystallization to obtain a finished product, while the first station (21) sequentially performs unloading of the finished product and loading of the substrate, the first chip, and the second chip; S6, the first station (21) performs eutectic crystallization to obtain a finished product, while the second station (22) sequentially performs unloading of the finished product and loading of the substrate, the first chip, and the second chip; S7, repeat steps S5-S6 until the tray is filled with finished products; S8. Unload the tray filled with finished products.

9. A eutectic method according to claim 8, characterized in that: In step S5, the first station (21) sequentially performs unloading of finished products and loading of substrates, first chips, and second chips, including the following steps: The material taking robot (51) moves onto the material tray, and a suction nozzle (511) of the material taking robot (51) sucks the substrate; The material taking robot (51) moves to the upper side of the eutectic table (2), and one suction nozzle (511) of the material taking robot (51) sucks the finished product of the first station (21), and the other suction nozzle (511) places the substrate on the first station (21); The material picking robot (51) moves to the material tray, loads the finished product onto the material tray, and simultaneously sequentially conveys the first chip and the second chip toward the first workstation (21).

10. A eutectic method, comprising: utilizing a double-station eutectic heating machine according to any one of claims 5 to 7 to perform eutectic formation; wherein: The following steps are involved: S1, empty tray loading; S2, conveying the first chip and the second chip in sequence toward the third station (23); S3, the third station (23) eutectic to obtain the finished product; S4, unloading the finished product from the third station (23), and unloading the finished product into the tray; S5. Repeat steps S2-S4 until the tray is filled with finished products; S6. Unload the tray filled with finished products.

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