Mapping of replacement component storage containers

Abstract

A method for detecting the position of a replacement part, a wafer or an empty carrier for a replacement part stored at a replacement part storage container is provided. A container is received at a load port of a plant interface of an electronic processing system. The container is configured to store replacement components for a processing chamber of an electronic processing system. The robotic arm is moved according to a first mapping pattern to identify a position of one or more replacement components in the container using a detection system at a distal end of an end effector of the robotic arm. An area of the container that does not contain the replacement component is determined. The robot arm is moved according to a second mapping pattern to identify a position in the container of at least one of the wafer or an empty carrier for the replacement component within a region of the container that does not contain the replacement component using the detection system. A mapping of positions of one or more replacement components in the container and a mapping of positions of at least one of an empty carrier or a wafer in the container are recorded in a storage medium.

Description

This application is a divisional application with application date of August 18, 2020, application number 202080065879.1, and titled “Mapping of Replacement Parts Storage Containers”. Technical Field

[0001] Embodiments of the present disclosure generally relate to methods and systems for detecting and mapping the status of replacement parts storage containers. Background Art

[0002] The electronic processing system may include one or more load ports for receiving storage containers, such as front opening unification units (FOUPs) storing substrates (e.g., wafers). In order to determine the slots in the FOUP that contain substrates and the slots that do not contain substrates, a mapping routine may be performed. However, if the FOUP contains other objects besides substrates, collisions may occur, which may damage the robot, the FOUP, and / or the objects in the FOUP. Summary of the invention

[0003] Some of the described embodiments include a method, the method comprising: receiving a container at a load port of a factory interface of an electronic processing system, the container configured to store replacement parts for a processing chamber of the electronic processing system. The method further comprises: moving a robot according to a first mapping pattern to identify the location of one or more replacement parts in the container. The robot uses a detection system at a distal end of an end effector of the robot to identify the location. The detection system includes a transmitting component and a sensing component. The detection system detects the object in response to a beam directed from the transmitting component to the sensing component being blocked by the object. The method further comprises: determining an area of ​​the container that does not contain replacement parts. The method further comprises: moving the robot according to a second mapping pattern to identify the location of at least one of a wafer or an empty carrier for replacement parts in the container in the area of ​​the container that does not contain replacement parts. The location is identified using the detection system at the distal end of the end effector. The method further comprises: recording in a storage medium a mapping of the location of the one or more replacement parts in the container and a mapping of the location of at least one of the empty carrier or the wafer in the container.

[0004] In some embodiments, a method includes: receiving a container at a load port of a factory interface of an electronic processing system, the container configured to store replacement parts for a process chamber of the electronic processing system. The method further includes: using a detection system at a distal end of an end effector of a robotic arm to determine whether the container is configured to store replacement process accessory rings for the process chamber. The detection system includes a transmitting assembly and a sensing assembly. The detection system detects an object in response to a beam directed from the transmitting assembly to the sensing assembly being blocked by the object. The method further includes: in response to determining that the container is configured to store replacement process accessory rings, executing a first container mapping recipe. The first container mapping recipe includes: moving the robot arm according to a first mapping pattern to use a detection system at the distal end of the terminal effector to identify the position of one or more replacement processing accessory rings in the container; determining an area of ​​the container that does not contain replacement processing accessory rings; moving the robot arm according to a second mapping pattern to use a detection system at the distal end of the terminal effector to identify the position of at least one of a wafer or an empty carrier for processing accessory rings in the container; and recording a mapping of the position of the replacement processing accessory rings in the container and a mapping of the position of at least one of the empty carrier or the wafer in the container in a storage medium.

[0005] In some embodiments, the electronic processing system includes a factory interface, the factory interface including a robotic arm. The robotic arm includes a detection system at a distal end of an end effector of the robotic arm. The detection system includes a transmitting assembly and a sensing assembly. The detection system detects an object in response to a beam directed from the transmitting assembly to the sensing assembly being blocked by the object. The electronic processing system further includes a loading port connected to the factory interface. The electronic processing system further includes a container connected to the loading port. The electronic processing system further includes a controller operatively connected to the robotic arm. The controller is used to determine whether the container is configured to store replacement parts for a processing chamber of the electronic processing system. The controller is then further used to move the robotic arm according to a first mapping pattern to identify a position in the container using the detection system at the distal end of the end effector of the robotic arm. The controller is further used to determine an area of ​​the container that does not contain a replacement part. The controller is further used to move the robotic arm according to a second mapping pattern to identify a position in the container of at least one of a wafer or an empty carrier for a replacement part using the detection system at the distal end of the end effector. The controller is further configured to record in the storage medium a map of the location of the replacement part in the container and a map of the location of at least one of the empty carrier or the wafer in the container. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The present disclosure is illustrated by way of example and not limitation in the illustrations of the accompanying drawings; in the drawings, like reference numerals indicate similar elements. It should be noted that different references to "an" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0007] Figure 1 is a top view schematic diagram of an example electronic processing system according to aspects of the present disclosure.

[0008] Figure 2 An elevation view of an example replacement parts storage container is shown in accordance with aspects of the present disclosure.

[0009] Figure 3 A top view of a verification wafer, a process kit ring carrier, and a process kit ring disposed on the process kit ring carrier is shown in accordance with aspects of the present disclosure.

[0010] Figure 4 A top view of a detection system at the distal end of an end effector of a robotic arm is shown in accordance with aspects of the present disclosure.

[0011] Figure 5A A first mapping scheme for identifying locations of replacement parts at a first portion of a replacement part storage container in accordance with aspects of the present disclosure is shown.

[0012] Figure 5B A second mapping pattern for identifying the location of a wafer or an empty carrier for a replacement part at a second portion of the replacement part storage container is shown in accordance with aspects of the present disclosure.

[0013] Figure 6 is a flow chart of a method for detecting a position of a replacement part, a wafer, or an empty carrier for a replacement part stored at a replacement part storage container according to aspects of the present disclosure.

[0014] Figure 7 is a flow chart of a method for determining whether a replacement part storage container is configured to store a replacement process accessory ring in accordance with aspects of the present disclosure.

[0015] Figure 8 is a flow chart of another method for detecting a location of a replacement part, a wafer, or an empty carrier for a replacement part stored at a replacement part storage container according to aspects of the present disclosure.

[0016] Fig. 9 A schematic representation of a machine in the example form of a computing device is shown within which a set of instructions may be executed, for causing the machine to perform any one or more of the methodologies discussed herein. DETAILED DESCRIPTION

[0017] Embodiments described herein relate to methods and systems for detecting and mapping objects stored in replacement part storage containers. A replacement part storage container may store one or more replacement parts to replace used parts of one or more stations at an electronic processing system. In some embodiments, the replacement part storage container may be a process accessory ring closed system in which one or more replacement process accessory rings (also referred to as edge rings) are stored. The replacement process accessory rings may replace used process accessory rings at a processing chamber of the electronic processing system. In some embodiments, the replacement parts may be disposed on a replacement part carrier. For example, the process accessory rings stored at the process accessory closed system may be disposed on a process accessory ring carrier. An empty replacement part carrier (i.e., a replacement part carrier without replacement parts) may also be stored in the process accessory ring closed system. Other items may also be stored at the replacement part storage container. For example, a placement verification wafer (i.e., a wafer with a camera, a wafer with a light reflection detector, etc.) may be stored in the process accessory ring closed system.

[0018] Each object stored in the replacement parts storage container may be stored in a region (i.e., a slot) of the replacement parts storage container. Each slot of the replacement parts storage container may be defined by one or more sets of support fins configured to support each object in the replacement parts storage container. Objects stored in the replacement parts storage container may be retrieved from the replacement parts storage container by an end effector of the robotic arm. The end effector may be configured to pick up and process specific objects, such as wafers, process accessory rings, and / or process accessory ring carriers.

[0019] Sometimes, one or more objects may be incorrectly stored in a replacement parts storage container. For example, an object may be cross-slotted between two slots of a replacement parts storage container (i.e., a first portion of the object is placed on a first set of support fins of a first slot, and a second portion of the object is placed on a second set of support fins of a second slot). In another example, two or more objects may be double-slotted at a slot of a replacement parts storage container (i.e., a first object is placed directly on top of a second object so that both objects are in a single slot). One or more objects may also be incorrectly stored at a replacement parts storage container if an object of a first type is stored in a slot designated for an object of a second type (e.g., a replacement part is stored in a slot designated for a replacement parts carrier).

[0020] The methods and systems disclosed herein use a detection system at the distal end of the end effector to detect the position of one or more objects stored at a replacement part storage container. The detection system may include an emitting assembly (e.g., a laser emitter, an LED emitter, etc.) and a sensing assembly (also referred to herein as a sensor). The detection system may detect an object in response to a beam (e.g., a laser beam) directed from the emitting assembly to the sensor being blocked by the object. A replacement part storage container may be received at a loading port of a factory interface of an electronic processing system. A robot arm of a factory interface robot may move according to a first mapping pattern to identify the position of one or more replacement parts in a replacement part storage container. One or more slots of a replacement part storage container that do not contain replacement parts may be determined. The robot arm may additionally move according to a second mapping pattern to identify the position of a wafer or an empty replacement part carrier in one or more slots that do not contain replacement parts. In response to determining one or more slots containing replacement parts and one or more slots containing wafers or empty replacement part carriers, a mapping of the positions of multiple different types of objects in the slots may be generated and the mapping may be recorded in a storage medium. The stored information about the location may include the number of slots that contain the object, the minimum and maximum heights of the object, the amount the object protrudes from the interior of the container, an indicator of the object type, and so forth.

[0021] In an alternative or additional embodiment, the detection system can be used to detect one or more objects that are improperly stored in the replacement part storage container. The top portion and the bottom portion of the object in the slot can be identified. The position of the top portion and the position of the bottom portion can be measured. The appropriate thickness of the object can be determined based on the difference between the position (e.g., vertical position or height) of the top portion of the object and the position (e.g., vertical position or height) of the bottom portion of the object. Based on the approximate thickness of the object, the type of object (e.g., replacement part, replacement part carrier, wafer, etc.) can be determined. In response to determining that the determined approximate thickness does not correspond to any of a replacement part, replacement part carrier, or wafer, it can be determined that the object is improperly stored in the replacement part storage container.

[0022] Generally, a load port receives a FOUP containing substrates. However, as described in embodiments, a container (e.g., a FOUP) storing replacement parts may also be connected to a load port. A standard mapping routine may be used to detect the position of substrates in a conventional FOUP. However, running such a standard mapping routine on a container holding replacement parts may result in damage to the end effector, the container, and / or objects stored in the container. Embodiments provide a resilient mapping routine that avoids damage that would otherwise be caused by running a standard mapping routine configured to detect the position of substrates (which have uniform sizes).

[0023] As described in embodiments herein, by detecting the position of one or more objects in a replacement part storage container, the likelihood that an end effector and / or an object to be retrieved by the end effector will be damaged is reduced because the end effector is more likely to successfully retrieve the object from the slot. By increasing the likelihood that the end effector will successfully retrieve each object, the number of damaged objects will be greatly reduced, thereby reducing the costs associated with the operation of the electronic processing system. Additionally, in embodiments, the time it takes to correctly retrieve a replacement part from a replacement part storage container can be reduced by increasing the likelihood that the correct replacement part is correctly retrieved. As a result, overall system latency can be reduced.

[0024] Figure 1 1 is a top view schematic diagram of an example electronic processing system 100 according to aspects of the present disclosure. The electronic processing system 100 can perform one or more processes on a substrate 102. The substrate 102 can be any suitable rigid, fixed-size planar article suitable for fabricating electronic devices or circuit assemblies thereon, such as, for example, a disk or wafer containing silicon, a patterned wafer, a glass plate, etc.

[0025] The electronic processing system 100 may include a processing tool 104 and a factory interface 106 coupled to the processing tool 104. The processing tool 104 may include a housing 108 having a transfer chamber 110 therein. The transfer chamber 110 may include one or more processing chambers (also referred to as process chambers) 114, 116, 118 disposed about and coupled to the transfer chamber 110. The processing chambers 114, 116, 118 may be coupled to the transfer chamber 110 through corresponding ports such as slit valves.

[0026] The processing chambers 114, 116, 118 may be adapted to perform any number of processes on the substrate 102. The same or different substrate processes may be performed in each of the processing chambers 114, 116, 118. The substrate processes may include atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, curing, pre-cleaning, removal of metals or metal oxides, etc. In one example, a PVD process may be performed in one or both of the processing chambers 114, an etching process may be performed in one or both of the processing chambers 116, and an annealing process may be performed in one or both of the processing chambers 118. Other processes may be performed on the substrates therein. The processing chambers 114, 116, 118 may each include a substrate support assembly. The substrate support assembly may be configured to hold the substrate in place while performing the substrate processes.

[0027] As described above, an etching process may be performed at one or more of the processing chambers 114, 116, 118. Therefore, some of the processing chambers 114, 116, 118, such as etching chambers, may include an edge ring (also referred to as a process accessory ring) 132 placed at a surface of the substrate support assembly. In some embodiments, the process accessory ring may occasionally undergo replacement. Although replacement of the process accessory ring in conventional systems includes disassembly of the processing chamber 114, 116, 118 by an operator to replace the process accessory ring, the electronic processing system 100 may be configured to facilitate replacement of the process accessory ring without disassembly of the processing chamber 114, 116, 118 by an operator.

[0028] The transfer chamber 110 may also include a transfer chamber robot 112. The transfer chamber robot 112 may include one or more arms, wherein each arm includes one or more end effectors at the end of each arm. The end effectors may be configured to handle specific objects such as wafers. Alternatively or additionally, the end effectors may be configured to handle objects such as handling accessory rings. In some embodiments, the transfer chamber robot 112 may be a selectively compliant assembly robot arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, and the like.

[0029] A load lock 120 may also be coupled to the housing 108 and the transfer chamber 110. The load lock 120 may be configured to dock and couple with the transfer chamber 110 on one side and to dock and couple with the factory interface 106. In some embodiments, the load lock 120 may have an environmentally controlled atmosphere that may vary from a vacuum environment (in which substrates may be transferred to and from the transfer chamber 110) to an atmospheric pressure or near-atmospheric pressure inert gas environment (in which substrates may be transferred to and from the factory interface 106). In some embodiments, the load lock 120 may be a stacked load lock having a pair of upper interior chambers and a pair of lower interior chambers located at different vertical heights (e.g., one above the other). In some embodiments, the pair of upper interior chambers may be configured to receive processed substrates from the transfer chamber 110 for removal from the processing tool 104, and the pair of lower interior chambers may be configured to receive substrates from the factory interface 106 for processing in the processing tool 104. In some embodiments, the load lock 120 may be configured to perform substrate processing (eg, etching or pre-cleaning) on ​​one or more substrates 102 received in the load lock 120 .

[0030] The factory interface 106 may be any suitable enclosure, such as, for example, an equipment front end module (EFEM). The factory interface 106 may be configured to receive substrates 102 from substrate carriers 122 (e.g., front opening unit (FOUP)) docked at respective load ports 124 of the factory interface 106. A factory interface robot 126 (shown as a dashed line) may be configured to transfer substrates 102 between substrate carriers (also referred to as containers) 122 and load locks 120. In other and / or similar embodiments, the factory interface 106 may be configured to receive replacement parts from a replacement part storage container 123. The factory interface robot 126 may include one or more robotic arms and may be or include a SCARA robot. In some embodiments, the factory interface robot 126 may have more links and / or more degrees of freedom than the transfer chamber robot 112. The factory interface robot 126 may include an end effector on the end of each robotic arm. The end effector may be configured to pick up and process specific objects such as wafers. Alternatively or additionally, the end effector may be configured to process objects such as processing accessory rings. In some embodiments, the factory interface robot 126 may include multiple end effectors. In such embodiments, one or more of the end effectors may be configured to pick up and process a particular type of object. For example, a first end effector may be configured and / or optimized for picking up and processing a processing accessory ring, and a second end effector may be configured and / or optimized for picking up and processing a wafer.

[0031] Any conventional robot type may be used for the factory interface robot 126. The transfers may be made in any order or direction. In some embodiments, the factory interface 106 may be maintained in a non-reactive gas environment, such as with a slightly positive pressure (eg, using nitrogen as the non-reactive gas).

[0032] In some embodiments, the transfer chamber 110, the process chambers 114, 116, and 118, and the load lock 120 may be maintained at a vacuum level. The electronic processing system 100 may include one or more vacuum ports coupled to one or more stations of the electronic processing system 100. For example, a first vacuum port 130a may couple the factory interface 106 to the load lock 120. A second vacuum port 130b may be coupled to the load lock 120 and disposed between the load lock 120 and the transfer chamber 110.

[0033] The electronic processing system 100 may also include a system controller 128. The system controller 128 may be and / or include a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. The system controller 132 may include one or more processing devices, which may be general-purpose processing devices such as a microprocessor, a central processing unit (CPU), etc. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or multiple processors implementing a combination of instruction sets. The processing device may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The system controller 128 may include a data storage device (e.g., one or more disk drives and / or solid-state drives), a main memory, a static memory, a network interface, and / or other components.

[0034] The system controller 128 may execute instructions to perform any one or more of the methods and / or embodiments described herein. The instructions may be stored on a computer-readable storage medium; the computer-readable storage medium may include main memory, static memory, secondary memory, and / or a processing device (during execution of the instructions). In one embodiment, the instructions include a mapping recipe; the mapping recipe may be executed to map the contents of a replacement part storage container. The processing device of the system controller 128 may execute the instructions to control the factory interface robot 126 and map the contents of the replacement part storage container. The processing device of the system controller 128 may also execute the instructions to control the factory interface robot 126 to map the contents of a conventional FOUP that stores substrates. In an embodiment, the execution of the instructions by the system controller 128 causes the system controller to execute Figures 6 to 8 The system controller 128 may also be configured to allow input and display of data, operating commands, etc. by a human operator.

[0035] Figure 1Schematically illustrated is an edge ring (or other process accessory ring) 132 that may be transferred into a process chamber 114, 116, 118. According to one aspect of the present disclosure, the edge ring 132 is removed from a replacement part storage container 123 (e.g., a process accessory ring enclosure system or FOUP) via a factory interface robot 126 located in the factory interface 106. While edge rings are discussed herein, it should be understood that the embodiments described with reference to edge rings are also applicable to other process accessory rings and other replaceable parts or components of a process chamber other than process accessory rings. The replacement part storage container 123 may be configured to store at least one of an edge ring, an edge ring carrier, or a wafer (e.g., a placement verification wafer). In an embodiment, the replacement part storage container 123 may be distinguished from a substrate carrier 122 and / or other types of replacement part storage containers based on a registration identifier 134. In other or similar embodiments, the replacement part storage container 123 may be distinguished from a substrate carrier 122 based on one or more external features associated with the replacement part storage container 123. Further details regarding detecting that a replacement part storage container 123 is not a conventional substrate carrier 122 are discussed herein.

[0036] Figure 2 2 shows a front view of an example replacement part storage container 200 according to aspects of the present disclosure. The replacement part storage container 200 can be used to securely hold a process accessory ring 220 and enable the replacement of the process accessory ring 220 in a wafer processing system (e.g., Figure 1 Replace the processing accessory ring 220 in the electronic processing system 100).

[0037] The replacement part storage container 200 includes a surface that at least partially encloses an interior volume 202 of the replacement part storage container 200. The surface that encloses the interior volume 202 of the replacement part storage container 200 may include one or more of a side wall 204, a bottom surface 206, a bottom plate 208, a top cover 201, a door frame (not shown), and a door (not shown). The door may be removed from the replacement part storage container 200 to expose a front interface of the processing accessory enclosure system 200 to allow the replacement part storage container 200 to be connected to a wafer processing system (e.g., see Figure 1The replacement part storage container 200 may be docked with a loading port of a wafer processing system 100). The replacement part storage container 200 may meet one or more FOUP standards (e.g., size, weight, interface, handle clearance, etc.). For example, the replacement part storage container 200 may be docked with the same loading port of a wafer processing system as a substrate FOUP. The replacement part storage container 200 may meet one or more Semiconductor Equipment and Materials International (SEMI) standards (e.g., using a FOUP door in accordance with SEMI E15.1, docking on a loading port in accordance with SEMI 47.1, being placed on motion pins in accordance with SEMI E57, etc.). The replacement part storage container 200 may also meet one or more standards for manufacturing automation (e.g., overhead transport (OHT) automation, automated guided vehicle (AGV) automation, people guided vehicle (PGV) automation, etc.), and may be managed by existing factory automation. For example, an outer surface of an OHT-compatible replacement parts storage container 200 may include one or more features configured to engage with an OHT automation component, such as a flange at a top surface (i.e., a roof surface) of the replacement parts storage container 200, one or more motion couplers at a bottom surface (i.e., a base surface) of the replacement parts storage container 200 configured to engage with one or more lifting rods of an OHT automation component, etc. In another example, a size or shape of the replacement parts storage container 200 (e.g., a body of the replacement parts storage container 200 having a handle at one or more outer surfaces) may be compatible with OHT automation.

[0038] One or more support structures 210 may be included in the interior volume 202 of the replacement part storage container 200. In some embodiments, two support structures 210 are disposed in the interior volume 202 to support one or more objects. In some embodiments, the support structure 210 is a comb-like structure. The support structure 210 may be made of plastic (e.g., polyethylene), and reinforcing materials (e.g., carbon fiber fillers, one or more vertical reinforcing material rods passing through the support structure, etc.) may be disposed within the support structure 210. Each support structure 210 may include one or more fins 212 (e.g., approximately horizontal fins) to support each object. Each object may be supported by two or more fins 212 that are approximately horizontal and approximately parallel to each other. The two or more fins 212 may define a slot 214 of the replacement part storage container 200. The support structure 210 may support each object so that the end effector on the robot arm of the wafer processing system can be inserted under the object, lift the object, and retrieve the object from the replacement part storage container 200.

[0039] The interior volume 202 of the replacement part storage container 200 may include at least one process accessory ring 220 (e.g., supported by corresponding fins 212 of the support structure 210) for automatic transfer to the wafer processing system. In some embodiments, the process accessory ring 220 may have an expected thickness of between about 0.5 cm and about 3.0 cm. In some embodiments, the process accessory ring 220 may have an approximate thickness of about 1.0 cm. The robot arm may remove the process accessory ring 220 from the process accessory enclosure system 200 to automatically transfer the process accessory ring 220 to the processing chamber of the wafer processing system. The robot arm may remove the used process accessory ring from the processing chamber for automatic transfer to the process accessory enclosure system 200.

[0040] The process accessory ring 220 in the process accessory enclosure system 200 can be secured to an upper surface of a process accessory ring carrier 230. In some embodiments, the process accessory ring carrier 230 can have an expected thickness between about 2.0 mm and about 3.0 mm. In some embodiments, the process accessory ring carrier 230 can have an expected thickness of about 2.5 mm. The robot can remove the process accessory ring 242 from the process accessory enclosure system 200 by inserting an end effector into the process accessory enclosure system 200 under the process accessory ring carrier 230, lifting the process accessory ring carrier 230 and the process accessory ring 220, and extracting the process accessory ring carrier 230 with the process accessory ring 220. The space between the fins 212 of the support structure 210 can allow the end effector to enter and lift the object without contacting the fins 212.

[0041] As described herein, a process accessory ring 220 on a process accessory ring carrier 230 may refer to one or more process accessory rings disposed on the process accessory ring carrier 230. For example, the process accessory ring 220 may include two or more of an edge ring, a process ring, a support ring, a slide ring, a quartz ring, and / or the like disposed on the process accessory ring carrier 230.

[0042] In some embodiments, the process accessory ring 220 can be disposed directly on the fin 212, and the robot can obtain the process accessory ring carrier 230 (e.g., from within the wafer handling system) to lift the process accessory ring 220. In some embodiments, the robot can lift the process accessory ring 220 without using the process accessory ring carrier 230. One or more process accessory rings 220 can be disposed on each process accessory ring carrier 230. For example, two or three process accessory rings 330 can be nested within each other on the process accessory ring carrier 230 (e.g., a first process accessory ring having a first diameter, a second process accessory ring having a second diameter sized to fit within the first process accessory ring, and a third process accessory ring having a third diameter sized to fit within the second process accessory ring).

[0043] A set of substantially parallel fins 212 of the support structure 210 may support a placement verification wafer 240 (e.g., a multifunctional wafer). In some embodiments, the placement verification wafer 240 may have a size similar to that of a wafer processed by a processing system. In some embodiments, the verification wafer 240 may have an expected thickness between about 0.5 mm and about 12 mm. In some embodiments, the verification wafer 240 may have an expected thickness of about 0.8 mm or between 0.5 mm and 1.5 mm. In some embodiments, the thickness of the placement verification wafer 240 may correspond to the thickness of the processing accessory ring and / or the processing accessory ring carrier. For example, the thickness of the placement verification wafer 240 may be between about 8 mm and about 10 mm. The placement verification wafer 240 may be located on a set of substantially parallel fins 212 so that the placement confirmation wafer 240 can be automatically transferred to the wafer processing system to verify the placement of the processing ring accessory 220 in the wafer processing system. The fins 212 for supporting the placement verification wafer 240 may have a different spacing and / or size than the fins for supporting the processing accessory ring and / or the processing accessory ring carrier.

[0044] As described above, each set of substantially parallel fins 212 may create a slot 214 to support an object. Each of the one or more lower slots 214 (e.g., the lowest slot) of the replacement part storage container 200 may support an empty process accessory ring carrier 232. The upper slot 214 (e.g., the top slot) of the replacement part storage container 200 may support a placement verification wafer 240. Each of the one or more intermediate slots 214 (e.g., above the empty process accessory ring carrier 232 and below the placement verification wafer 240) may support a process accessory ring carrier 230, which supports a process accessory ring 220. One or more sets of substantially parallel fins 212 (e.g., slots for process accessory rings 220 on process accessory ring carriers 230) may include corresponding process accessory ring orientation brackets. Each of the process accessory ring orientation brackets may have one or more protrusions (e.g., pins) that engage with a flat portion of the inner surface of the process accessory ring 220 to limit movement (e.g., rotation, movement in the x-direction and y-direction, etc.) of the process accessory ring 220. The one or more protrusions of the process accessory ring orientation bracket and one or more features of the process accessory ring carrier 230 (e.g., pin contacts, notches, etc.) may limit movement of the process accessory ring 220.

[0045] In some embodiments, one or more objects may be incorrectly placed within a slot 214. For example, a first portion of an object may be supported by a first set of fins 212 of a first slot 214, and a second portion of the object may be supported by a second set of fins 212 of a second slot 214. The first slot may be an upper slot 214 of the process accessory enclosure system 200, and the second slot may be a lower slot 214 of the process accessory enclosure system 200. This may be referred to as cross slot placement. In some embodiments, the process accessory ring 220 disposed on the process accessory ring carrier 230 may be cross slotted. In some embodiments, one or more objects of the process accessory enclosure system 200 may be incorrectly placed on top of another object within a slot 214. This may be referred to as double slot placement.

[0046] As described above, one or more protrusions of one or more of the set of fins 212 are configured to engage one or more features of the process fitting ring carrier 220 to constrain movement of the process fitting ring 220. In some embodiments, the process fitting ring carrier 220 may be improperly placed within the slot 214 such that one or more pins of the process fitting ring carrier 230 do not engage with one or more protrusions of the set of fins 212. For example, the process fitting ring carrier 220 may be placed in an incorrect orientation relative to the set of fins 212 such that the process fitting ring carrier 220 is rotated approximately 15° from a target orientation, thereby preventing one or more pins of the process fitting ring carrier 230 from engaging with the one or more protrusions. In such an embodiment, the one or more pins that do not engage with the one or more protrusions may rest on another portion of the one or more fins 212, thereby causing the process fitting ring carrier 220 to be placed within the slot 214 at a certain angle.

[0047] The robot can remove objects (e.g., an empty process accessory ring carrier 232, a process accessory ring carrier 230 holding a process accessory ring 220) from the lower slot and place the used object in the vacated lower slot to avoid contamination from the used object (e.g., a used process accessory ring from a wafer handling system) onto other objects (e.g., a new process accessory ring 220, a placed verification wafer 240). For example, one or more robots can remove an empty process accessory ring carrier 232 from a first slot, retrieve a used process accessory ring using the empty process accessory ring carrier 232, and replace the now full process accessory ring carrier 230 and the supported used process accessory ring at the first slot. The robot (s) can then remove a new process accessory ring 220 held to a process accessory ring carrier 220 from a third slot above the first and second slots, place the process accessory ring 220 into a processing chamber, and then replace the now empty process accessory ring carrier 232 back into the third slot.

[0048] The process accessory enclosure system 200 may include a registration feature 260 (e.g., coupled to or integral with the bottom surface 206). The registration feature 260 may enable identification of the replacement part storage container 200 as not being a wafer enclosure system (e.g., not being a conventional FOUP carrying wafers). The registration feature 260 may enable identification of the process accessory enclosure system 200 as a process accessory enclosure system 200. In some embodiments, the registration feature 260 may enable identification of a particular process accessory enclosure system 200 or type of process accessory enclosure system 200 object. For example, the registration feature 260 may indicate that the process accessory enclosure system 200 is supporting a process accessory ring 220 disposed on a process accessory ring carrier 230. In some embodiments, the registration feature 260 is a simple tab, peg, protrusion, etc. In some embodiments, the registration feature 260 may be configured to be in a first position when a door of the process accessory enclosure system 200 is closed and in a second position when the door of the process accessory enclosure system 200 is open. For example, the registration feature 260 may be stored in a first position when the door is closed and spring to a second position when the door is opened.

[0049] In some embodiments, the system controller 128 may determine that the process accessory enclosure 200 is not a conventional FOUP based on one or more external features of the process accessory enclosure 200. For example, a registration feature 260 may be disposed on an outer surface of the process accessory enclosure 200. For example, the registration feature 260 may be a registration identifier (e.g., a registration number, a bar code, etc.) etched onto an outer wall of the process accessory enclosure 200. The registration feature 260 may be detected by an identification component of the electronic processing system 100 or an identification component external to the electronic processing system 100. For example, the registration feature 260 may be scanned by an identification device (e.g., a handheld identification device) before the process accessory enclosure 200 is docked with a load port of a wafer processing system.

[0050] The system controller 128 may determine that the process accessory enclosure 200 is not a conventional FOUP based on other external features associated with the process accessory enclosure 200. For example, the exterior surface of the process accessory enclosure 200 may include one or more structural features that are not included on the exterior surface of a conventional FOUP. Additionally or alternatively, the exterior surface of a conventional FOUP may include one or more structural features that are not included on the exterior surface of the process accessory enclosure 200. According to previously described embodiments, the identification component of the electronic processing system 100 may identify one or more structural features on the exterior surface of the process accessory enclosure 200 (or identify the lack of one or more structural features on the exterior surface of the process accessory enclosure 200).

[0051] The factory interface robot may be configured to perform mapping of objects in the FOUP to determine the presence and location of the objects in the FOUP. In some embodiments, the factory interface robot may be configured to perform mapping in response to determining that the outer surface treatment accessory closure system 200 includes structural features that are not included on the outer surface of a traditional FOUP or does not include structural features that are included on the outer surface of a traditional FOUP. The robot arm may move the end effector to the first portion of the replacement part storage container 200 to start the mapping process. In some embodiments, the end effector may encounter a registration feature 260. The presence of the registration feature 260 may provide a signal that indicates to the system controller 128 that the replacement part storage container 200 is engaged to the load port instead of a traditional FOUP containing wafers. In response to encountering the registration feature 260, the robot arm may perform mapping according to a first container mapping recipe. In response to not encountering the alignment feature 260, the robot arm may perform mapping according to a second container mapping recipe. In some embodiments, in response to encountering the registration feature 260, the robot arm may terminate the mapping process.

[0052] Figure 3A top view of a verification wafer 310, a process fitting ring carrier 320, and a process fitting ring 330 disposed on the process fitting ring carrier 320 is shown in accordance with aspects of the present disclosure. The verification wafer 310 may be associated with a first diameter 312, the process fitting ring carrier 320 may be associated with a second diameter 322, and the process fitting ring 330 may be associated with a third diameter 332. In some embodiments, the first diameter 312, the second diameter 322, and the third diameter 332 may be equal. In other embodiments, the first diameter 312, the second diameter 322, and the third diameter 332 may be unequal. For example, the third diameter 332 may be greater than the second diameter 322, and the second diameter 322 may be greater than the first diameter 312. Because the first diameter 312, the second diameter 322, and the third diameter 332 are not equal, when the verification wafer 310, the process accessory ring carrier 320, and the process accessory ring 330 are positioned in the replacement part storage container (e.g., at the center reference point 340), the verification wafer 310, the process accessory ring carrier 320, and the process accessory ring 330 may extend to different portions of the replacement part storage container (e.g., different horizontal distances from the center reference point 340). For example, the verification wafer 310 may extend a first distance to the first point 314, the process accessory ring carrier 320 may extend a second distance to the second point 324, and the process tool ring 330 disposed on the process accessory ring carrier 320 may extend a third distance to the third point 334. The diameter of each type of object that may be stored in the replacement part storage container (e.g., may be stored in configuration data accessible to the system controller 128) may be known. The various points at which an object is detected (e.g., the horizontal distance from the center point) may be used to determine the type of object detected. For example, in response to the system controller 128 detecting an object at the first point 314, the system controller may determine based on the configuration data that the detected object is the verification wafer 310. In response to detecting an object at the second point 324, the system controller 128 may determine based on the configuration data that the detected object is an empty process accessory ring carrier 320. In response to detecting an object at the third point 334, the system controller 128 may determine based on the configuration data that the detected object is the process accessory ring 330.

[0053] Figure 4A top view of a detection system 410 at a distal end of an end effector 400 of a robotic arm is shown in accordance with aspects of the present disclosure. In some embodiments, the end effector 400 may include two or more blades 412. Each blade 412 may be configured to interact with a portion of an object 450 stored in a slot of a replacement part storage container. The distal end of at least one blade 412 may include one or more components of the detection system 410. The detection system 410 may include at least a transmitting assembly 420 and a sensing assembly 430 (also referred to as a sensor 430). In some embodiments, the transmitting assembly 420 may be a laser emitter or an LED emitter. The transmitting assembly 420 may emit a beam 440 (e.g., a laser beam) directed to the sensor 430. The detection system 410 may detect the object 450 in response to the beam 440 being blocked by the object 450. In response to the beam 440 being blocked, the sensor 430 may send a signal to the system controller 128. The system controller 128 may determine the x-, y-, and z-positions of the points at which the beam 440 of the end effector is blocked and may store this information in memory.

[0054] In some embodiments, the end effector 400 of the robot arm may further include a z-direction encoder (referred to as a z-encoder) (not shown). The z-encoder may be configured to determine the position of the end effector 400 at a particular location. In response to the detection system 410 detecting the object 450, the z-encoder may detect the position of the end effector 400 at the location where the object 450 is detected. The position of the end effector 400 may be transmitted to a controller (e.g., the system controller 128), wherein the position may be used to determine a region of the replacement part storage container containing the object 450. In some embodiments, the z-encoder may be further configured to determine a first position of the end effector 400, in which the beam 440 is first blocked by the object 450, and a second position of the end effector 400, in which the beam 440 is first blocked by the object 450, and in which the beam 440 is detected by the sensor 430. The first position and the second position may be sent to the system controller 128, and the system controller 128 may use the received first position and the second position to determine the approximate thickness of the object at the region of the replacement part storage container.

[0055] Figure 5A A first mapping pattern 510 is shown in accordance with aspects of the present disclosure; the first mapping pattern 510 is used to identify the location of replacement parts at a first portion of a replacement part storage container 500. In some embodiments, the replacement part storage container 500 may be a replacement part storage container (e.g., a processing accessory closed system), such as Figure 2The replacement component storage container described herein. According to the previously described embodiments, the replacement component storage container 500 may be received at a load port of a factory interface of an electronic processing system. The replacement component storage container 500 may be configured to store: a replacement component 220 (e.g., Figure 2 20); a replacement part carrier 230 having a replacement part 220 disposed thereon; an empty replacement part carrier 232; and / or a wafer 240. In some embodiments, the replacement part storage container 500 may further include a registration feature 260 to enable identification of the replacement part storage container 500 as a process accessory closed system.

[0056] Mapping of the replacement parts storage container 500 may be initiated in response to receiving the replacement parts storage container 500 at a load port of the factory interface. As previously described herein, the mapping may be performed by a detection system 550 at a distal end of an end effector 552 of a robotic arm (not shown) under the control of the system controller 128. In some embodiments, the robotic arm may be a robotic arm of a factory interface robot.

[0057] In response to receiving a replacement part storage container 500 at a load port of a factory interface, it may be determined whether the replacement part storage container 500 is configured to store a replacement process accessory ring. In some embodiments, an indication that the replacement part storage container 500 is a process accessory closed system may be received. For example, a user (e.g., an operator of the electronic processing system 100) may provide user input indicating that the replacement part storage container 500 has been connected to a particular load port. In such an embodiment, the detection system 550 may move to a first portion of the replacement part storage container 500 to detect a registration identifier 560 indicating that the replacement part storage container 500 is a process accessory closed system. In other embodiments, an indication that the replacement part storage container 500 is a process accessory closed system may not be received. In such an embodiment, according to embodiments described herein, the detection system 550 may detect the registration identifier 560 in response to executing a first mapping pattern 510 (in some embodiments, the first mapping pattern 510 may be part of a second container mapping recipe for detecting substrates in a substrate carrier system).

[0058] Detection system 550 may be moved to first position 512 of replacement parts storage container 500. At first position 512, detection system 550 may detect registration identifier 560. In response to detecting registration identifier 560, it may be determined that replacement parts storage container 500 is a disposal accessory closed system. Additionally or alternatively, as previously described, replacement parts storage container 500 may be determined to be a disposal accessory closed system based on one or more structural features on an outer surface of replacement parts storage container 500. Thus, a first container mapping recipe may be executed. The first container mapping recipe may include a first mapping pattern (e.g., regarding Figure 5A as shown) and the second mapping mode (as shown in Figure 5B In response to not detecting the registration identifier 560, it may be determined that the replacement part storage container 500 is not a processing accessory closed system. Therefore, a second container mapping recipe may be executed. The second container mapping recipe may include a first mapping pattern and may not include a second mapping pattern. According to the embodiments described herein, the first mapping pattern may detect the areas 562 (i.e., slots) of the replacement part storage container 500 that include the replacement parts 220, and detect whether each replacement part 220 is correctly stored at each detected area 562.

[0059] As described above, in response to determining that the replacement parts storage container 500 is a processing accessory closed system, the first mapping mode 510 may be executed. The detection system 550 may be positioned at a first horizontal distance 514a from a portion of the replacement parts storage container 500. In some embodiments, the detection system 550 may be positioned at a first horizontal distance 514a from the rear wall 564 or the center of the replacement parts storage container 500. When the detection system 550 is positioned at the first horizontal distance 514a, the detection system 550 may move from a first height 516a to a second height 516b. When the detection system 550 moves from the first height 516a to the second height 516b, the detection system 550 may determine whether an object of the replacement parts storage container 500 extends from the portion of the container to the first horizontal distance 514a. Based on the Figure 4 In the described embodiment, detection system 550 can detect objects.

[0060] In response to determining that the object extends to the first horizontal distance 514a, it can be determined whether the object is a replacement part 220. Figure 3As described above, the replacement part may extend to the first horizontal distance 514a, while the empty replacement part carrier 532 and / or wafer 240 may not extend to the first horizontal distance 514a because the diameter of the replacement part 220 may be larger than the empty replacement part carrier 352 and / or wafer 240. In response to determining that the object is a replacement part 220, a zone 562 (e.g., a slot) of the replacement part container 500 that contains the replacement part 220 may be determined. The zone 562 (i.e., the slot) containing the replacement part 220 may be determined based on the vertical position of the detection system 550 at the point where the replacement part 220 is identified. The position may be associated with a particular portion of the replacement part storage container 500. Based on the information regarding Figure 4 In the depicted embodiment, the position of the detection system 550 may be detected by a z encoder (not shown) of the end effector 552. Additionally, the horizontal distance may be determined based on the x and y positions of the end effector (which may be determined by the system controller 128).

[0061] In some embodiments, a top portion 518a and a bottom portion 518b of an object extending to a first horizontal distance 514a may be identified. A detection system 550 may be used to measure a first position of the top portion 518a and a second position of the bottom portion 518b. According to the previously described embodiments, the first position and the second position may be measured by a z encoder of a robotic arm to which the end effector 560 is attached. An approximate thickness of the object may be determined based on the first position and the second position. Based on the determined approximate thickness of the object, it may be determined that the first object is a replacement part 220. For example, the replacement part 220 may have a desired thickness between about 0.5 cm and about 2.0 cm. In response to determining that the approximate thickness of the object is about 1.0 cm, it may be determined that the object is a replacement part 220. Additionally, the amount by which the object extends from the center or rear 564 of the container may also be used to determine that the object is a replacement part 220. For example, the replacement part may have a known diameter and / or a known horizontal extension from the rear or center of the container. In some embodiments, the x position, y position of the end effector at which the object is detected, and the detected thickness of the object are used together to determine the identification of the object.

[0062] In some embodiments, the determined approximate thickness may not indicate that the object extending to first horizontal distance 514a is replacement part 220. Based on the above example, the approximate thickness of the object may be approximately 3.0 cm, which does not correspond to the expected thickness of replacement part 220. In other or additional embodiments, it may be determined that the object is not replacement part 220 based on a determination that the first position of top portion 518a does not correspond to the expected first position of replacement part 220 and / or the second position of bottom portion 518b does not correspond to the expected second position of replacement part 220.

[0063] In some embodiments, it may be determined whether the object has been incorrectly placed at the zone 562 of the replacement part storage container 500. In some embodiments, the determined approximate thickness may indicate that the object is a wafer 240 or an empty replacement part carrier 232 rather than a replacement part 220. Therefore, it may be determined that the wafer or the empty replacement part carrier has been erroneously moved in the replacement part storage container 500, extending to the first horizontal distance 514a. In some embodiments, it may be determined that the determined approximate thickness does not correspond to a replacement part 220, a wafer 240, or an empty replacement part carrier 232. Instead, it may be determined that the determined approximate thickness of the object exceeds the expected thickness of each of the replacement part 220, the wafer 240, or the empty replacement part carrier 232. In such embodiments, the determined approximate thickness may indicate that the object is cross-grooved (i.e., a first portion of the object is in the first zone 750 and a second portion of the object is in the second zone 562 of the replacement part storage container 500).

[0064] In some embodiments, it may be determined that the first position of the top portion 518a does not correspond to an expected first position of one or more detected replacement parts 220 and / or the second position of the bottom portion 518b does not correspond to an expected second position of the replacement part 220. For example, the first position of the first detected replacement part 220 and the first position of the second detected replacement part 220 may be measured. The difference between the first position of the first detected replacement part 220 and the first position of the second detected replacement part 220 may be less than the expected height of the zone 562 of the replacement part storage container 500. In such an example, the difference between the first position of the first detected replacement part 220 and the first position of the second detected replacement part 220 may indicate that the first detected replacement part 220 and the second detected replacement part 220 are doubly slotted. It may be similarly determined that the first detected replacement part 220 and the second detected replacement part 220 are doubly slotted based on the difference between the second position of the first detected replacement part 220 and the second position of the second detected replacement part 220.

[0065] In response to determining that the object extending to first horizontal distance 514a is not a replacement part 220, or that the object has been incorrectly placed at region 562 of replacement part storage container 500, an error message may be transmitted to a controller of the electronic processing system (e.g., system controller 128). The error message may indicate a defect at region 562 of replacement part storage container 500.

[0066] When executing the first mapping mode 510, it may be determined that no objects extend to the first horizontal distance 514a. In such an embodiment, the detection system 550 may be positioned at a second horizontal distance 514b from the portion of the container. The second horizontal distance 514b may be less than the first horizontal distance 514a. When the detection system 550 is positioned at the second horizontal distance 514b, the detection system 550 may move from the second height 516b to the first height 516a. The detection system 550 may identify one or more objects extending to the second horizontal distance 514b. This process may continue, wherein the distance between the end effector and the portion of the container is reduced by a fixed amount, and then a vertical sweep is performed until one or more objects are detected.

[0067] Figure 5B A second mapping pattern is shown in accordance with aspects of the present disclosure for identifying the location of a wafer or an empty carrier for a replacement part at a second portion of replacement part storage container 500. In some embodiments, detection system 550 may determine one or more areas that do not contain replacement parts 220 while executing first mapping pattern 510. In such embodiments, the robot may be moved according to second mapping pattern 520 to identify the location of at least one wafer 240 and / or the location of at least one empty replacement part carrier 232 within the area that does not contain replacement parts 220.

[0068] The detection system 550 may be positioned within a first area 530 within a replacement part storage container 500 that does not contain replacement parts 220. According to previously described embodiments, the detection system 550 may be positioned at a third horizontal distance 514c from a portion of the replacement part storage container 500. In some embodiments, the third horizontal distance 514c may be less than the second horizontal distance 514b. The detection system 550 may move from a third height 516c within the first area 530 to a fourth height 516d within the first area 530 while the detection system is positioned at the third horizontal distance 514c from a portion of the container. When the detection system 550 moves from the third height 516c to the fourth height 516d within the first area 530, the detection system 550 may determine whether an object of the replacement part storage container 500 extends to the third horizontal distance 514c. According to the embodiments described above, the detection system 550 may be positioned within a first area 530, wherein the detection system 550 may be positioned within a third horizontal distance 514c from a portion of the replacement part storage container 500. Figure 4 In the described embodiment, detection system 550 can detect an object. In some embodiments, it can be determined whether the object extends a third horizontal distance 514c at any height between third height 516c and fourth height 516d.

[0069] In response to determining that the object extends to the third horizontal distance 514c, it can be determined whether the object is a wafer 240 or an empty replacement part carrier 232. In some embodiments, according to the previously described embodiments, it can be determined whether the object is a wafer 240 or an empty replacement part carrier 232 based on the determined approximate thickness of the object and / or the horizontal extension from the back or center of the container. In response to determining whether the object is a wafer or an empty replacement part carrier 232, the zone 562 containing the object can be determined based on the vertical position of the detection system 550 at the point where the object was identified. The position can be associated with a specific zone 562 of the replacement part storage container 500. According to the previously described embodiments, it can also be determined whether the object is correctly stored in the zone 562.

[0070] According to the previously described embodiments, in response to determining that one or more objects extend to third horizontal distance 514c into first area 530, second mapping mode 520 may be performed at one or more additional areas determined not to include replacement parts 220. In response to determining the presence and location of objects in each zone 562 of replacement parts storage container 500, a map of each object of replacement parts storage container 500 may be generated and stored in a storage medium.

[0071] As previously described, the first mapping process 510 and the second mapping process 520 may be performed by the factory interface robot in response to receiving the replacement part storage container 500 at the load port. In further embodiments, the first mapping process 510 and / or the second mapping process 520 may be performed by the factory interface robot and / or the transfer chamber robot in response to receiving the replacement part storage container 500 at any station of the electronic processing system.

[0072] In some embodiments, the load port may include an integrated mapping system configured to perform one or more mapping processes, such as the first mapping process 510 and the second mapping process 520. In such an embodiment, a mapping of each object of the replacement part storage container 500 may be generated and stored in a storage medium according to the previously described embodiments. The factory interface robot and / or the transfer chamber robot or the electronic processing system 100 may retrieve the replacement part from the replacement part storage container 500 or place the replacement part at the replacement part storage container 500 based on the mapping generated by the integrated mapping system at the load port.

[0073] Figures 6 to 8 800 are flow charts of various embodiments of methods 600 to 800 for mapping replacement component storage containers for an electronic processing system. The methods are performed by processing logic, which may include hardware (circuitry, dedicated logic, etc.), software (such as software running on a general purpose computer system or a dedicated machine), firmware, or some combination of the above. The processing logic may be performed by a computing device (such as a computer that controls a robotic arm) to map a replacement component storage container of an electronic processing system. Figure 1system controller 128) to perform some of the methods 600 to 800.

[0074] For simplicity of explanation, the method is depicted and described as a series of actions. However, the actions according to the present disclosure may occur in various orders and / or simultaneously, and occur together with other actions not presented and described herein. In addition, it is not necessary to perform all the actions shown to implement the method according to the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that the method may alternatively be represented as a series of interrelated states via a state diagram or an event.

[0075] Figure 6 6 is a flow chart of a method 600 for detecting the location of a replacement part, a wafer, or an empty carrier thereof for a replacement part stored in a replacement part storage container according to various aspects of the present disclosure. At box 610, a container is received at a loading port of a factory interface of an electronic processing system. The container can be configured to store replacement parts for a processing chamber of the electronic processing system. At box 620, a robot is moved according to a first mapping pattern to identify the location of one or more replacement parts in the container. A detection system at a distal end of the end effector of the robot is used to identify the location. The detection system includes a transmitting component and a sensing component. The detection system detects an object in response to a beam directed from the transmitting component to the sensing component being blocked by the object. At box 630, an area of ​​the container that does not contain a replacement part is determined. At box 640, the robot is moved according to a second mapping pattern to identify the location of a wafer or an empty carrier for a replacement part in the container within the area of ​​the container that does not contain a replacement part. The detection system at the distal end of the end effector can be used to identify the location. At block 650, a mapping of the location of one or more replacement parts in the container and the location of at least one of an empty carrier or a wafer in the container.

[0076] Figure 7 is a flow chart of a method 700 for determining whether a replacement part storage container is configured to store a replacement process accessory ring according to aspects of the present disclosure. At box 710, a container is received at a load port of a factory interface of an electronic processing system. The container can be configured to store replacement parts for a processing chamber of the electronic processing system. At box 712, it can be determined whether the container is configured to store a replacement process accessory ring for the processing chamber. A detection system at a distal end of an end effector of a robotic arm can be used, wherein the detection system includes a transmitting assembly and a sensing assembly. The detection system can detect an object in response to a beam directed from the transmitting assembly to the sensing assembly being blocked by the object. In response to determining that the container is configured to store a replacement process accessory ring, the method 700 can continue to box 714. In response to determining that the container is not configured to store a replacement process accessory ring, the method 700 can continue to box 722.

[0077] At block 714, the robot may be moved according to a first mapping pattern to identify the location of one or more replacement process accessory rings in the container using a detection system at a distal end of the end effector. At block 716, an area of ​​the container that does not contain a replacement process accessory ring may be determined. At block 718, the robot may be moved according to a second mapping pattern to identify the location of a wafer or an empty carrier for a process accessory ring in the container using a detection system. At block 720, a mapping of the location of the replacement process accessory ring, the empty carrier, or the wafer may be recorded. At block 722, a detection system of the robot is positioned at a first horizontal distance from a portion of the container. At block 724, the detection system is moved from a first height to a second height at the first horizontal distance to identify the one or more replacement parts. At block 726, it may be determined that the one or more replacement parts do not extend to the first horizontal distance. At block 728, the detection system may be positioned at a second horizontal distance from the first portion of the container. At block 730, the detection system may be moved from a first height to a second height at the second horizontal distance.

[0078] Figure 8 8 is a flow chart of another method 800 for detecting the location of a replacement part, a wafer, or an empty carrier for a replacement part stored in a replacement part storage container according to various aspects of the present disclosure. At box 810, a controller operatively coupled to a robotic arm may determine that a container connected to a load port is configured to store replacement parts for a processing chamber of an electronic processing system. At box 820, the controller then moves the robotic arm according to a first mapping pattern to identify the location in the container using a detection system at a distal end of the robotic arm's end effector. At box 830, an area of ​​the container that does not contain a replacement part is determined. At box 840, the controller moves the robotic arm according to a second mapping pattern to identify the location of a wafer or replacement part in the container using a detection system at a distal end of the end effector. At box 850, the controller records a mapping of the location of the replacement part in the container and the location of at least one of the empty carrier or wafer in the container in a storage medium.

[0079] Fig. 9A schematic representation of a machine in the example form of a computing device 900 is shown, in which a set of instructions may be executed, the set of instructions being used to cause the machine to perform any one or more of the methodologies discussed herein. In alternative embodiments, the machine may be connected (e.g., networked) to other machines in a local area network (LAN), an intranet, an extranet, or the Internet. The machine may operate in the capacity of a server or a client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), a tablet computer, a set-top box (STB), a personal digital assistant (PDA), a cellular phone, a web appliance, a server, a network router, a switch or a bridge, or any machine capable of executing (sequentially or otherwise) a set of instructions that specify actions to be performed by the machine. In addition, while only a single machine is shown, the term "machine" shall also be taken to include any collection of machines (e.g., computers) that individually or collectively execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein. In an embodiment, the computing device 900 may correspond to Figure 1 system controller 128.

[0080] The exemplary computer 900 includes a processing device 902, a main memory 904 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) (such as synchronous DRAM (SDRAM)), etc.), a static memory 906 (e.g., flash memory, static random access memory (SRAM), etc.), and a secondary memory (e.g., a data storage device 928) that communicate with each other via a bus 908.

[0081] The processing device 902 may represent one or more general-purpose processors, such as a microprocessor, a central processing unit, etc. More specifically, the processing device 902 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. The processing device 902 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The processing device 902 may also be or include a system on a chip (SoC), a programmable logic controller (PLC), or other types of processing devices. The processing device 902 is configured to execute processing logic (instructions 926 for mapping recipe 950) for executing the operations and steps discussed herein.

[0082] The computing device 900 may further include a network interface device 922 for communicating with a network 964. The computing device 900 may also include a video display unit 910 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)), an alphanumeric input device 912 (e.g., a keyboard), a cursor control device 914 (e.g., a mouse), and a signal generating device 920 (e.g., a speaker).

[0083] The data storage device 928 may include a machine-readable storage medium (or more specifically, a non-transitory computer-readable storage medium) 924, on which is stored one or more sets of instructions 926 that embody any one or more of the methods or functions described herein. A non-transitory storage medium refers to a storage medium other than a carrier wave. During the execution of the instructions 926 by the computer device 900, the instructions 926 may also reside in the main memory 904 and / or the processing device 902 in whole or in part, and the main memory 904 and the processing device 902 also constitute computer-readable storage media.

[0084] The computer-readable storage medium 924 may also be used to store the mapping recipe 950. The computer-readable storage medium 924 may also store a software library containing methods for calling the mapping recipe 950. Although the computer-readable storage medium 924 is shown as a single medium in the example embodiment, the term "computer-readable storage medium" should be considered to include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) that store one or more sets of instructions. The term "computer-readable storage medium" should also be considered to include any medium that is capable of storing or encoding a set of instructions for execution by a machine and causing the machine to perform any one or more methods of the present invention. Therefore, the term "computer-readable storage medium" should be considered to include, but is not limited to, solid-state memories and optical and magnetic media.

[0085] The foregoing description sets forth many specific details, such as examples of specific systems, components, methods, etc., in order to provide a good understanding of several embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure may be implemented without these specific details. In other cases, well-known components or methods are not described in detail or presented in simple block diagram form to avoid unnecessary confusion of the present disclosure. Therefore, the specific details set forth are merely exemplary. Specific embodiments may differ from these exemplary details and are still expected to be within the scope of the present disclosure.

[0086] References throughout the specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, phrases such as "in one embodiment" or "in an embodiment" that appear throughout the specification are not necessarily all referring to the same embodiment. Additionally, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the term "about" or "approximately" is used herein, it is intended to mean that the nominal value provided is accurate to within ±10%.

[0087] Although the operations of the methods herein are shown and described in a particular order, the order of operations of each method may be changed so that certain operations may be performed in a reverse order, thereby performing certain operations at least partially simultaneously with other operations. In another embodiment, instructions or sub-operations of different operations may be performed in an intermittent and / or alternating manner.

[0088] It should be understood that the above description is intended to be illustrative, rather than restrictive. After reading and understanding the above description, many other embodiments will be apparent to those skilled in the art. Therefore, the scope of the present disclosure should be determined with reference to the appended claims and the full range of equivalents to which these claims are entitled.

Claims

1. A method for mapping a container, comprising: detecting, by a system controller of the electronic processing system, receipt of a container at a load port of a factory interface of the electronic processing system, wherein the factory interface includes a robotic arm; causing, by the system controller, in response to determining that the received container is configured to store replacement parts for a processing chamber of the electronic processing system, to move a robotic arm according to a first mapping pattern to identify a location of one or more replacement parts in the container using a detection system at a distal end of an end effector of the robotic arm, wherein the detection system includes a transmitting assembly and a sensing assembly, and wherein the detection system detects an object in response to a beam directed from the transmitting assembly to the sensing assembly being interrupted by the object; determining, by the system controller, an area of ​​the container that does not contain a replacement part; causing, by the system controller, the robot to move according to a second mapping pattern to identify, using the detection system at the distal end of the end effector, a location of at least one of a wafer or an empty carrier for a replacement part in the container within the region of the container that does not contain a replacement part; as well as; Based on the identified location of the one or more replacement parts and the identified location of at least one of the wafer or the empty carrier for the replacement parts: extracting at least one of the one or more replacement parts, the empty carrier, or the wafer from the container, or At least one of one or more additional replacement parts, additional empty carriers, or the wafers are placed in one or more areas of the container.

2. The method of claim 1, wherein the one or more replacement parts include a process fitting ring.

3. The method of claim 1 , wherein moving the robotic arm according to the first mapping mode comprises: the detection system being positioned a first horizontal distance from a portion of the container; moving the detection system from a first height to a second height to identify the one or more replacement parts in the container while the detection system is positioned the first horizontal distance from the portion of the container; determining whether the one or more replacement components extend from the portion of the container to the first horizontal distance; in response to determining that the one or more replacement components do not extend to the first horizontal distance from the container, positioning the detection system a second horizontal distance from the portion of the container, wherein the second horizontal distance is less than the first horizontal distance; as well as The detection system is moved from the first height to the second height to identify the one or more replacement parts in the container while the detection system is positioned the second horizontal distance from the portion of the container.

4. The method of claim 3, wherein moving the robotic arm according to the second mapping mode comprises: positioning the detection system at a third horizontal distance from the portion of the container within a first region of the container that does not contain a replacement component, wherein the third horizontal distance is less than the second horizontal distance; as well as moving the detection system from a third height within the first area to a fourth height within the first area while the detection system is positioned at the third horizontal distance from the portion of the container, The method further includes determining whether at least one of the empty carrier or the wafer extends to the third horizontal distance from the portion of the container at any height between the third height and the fourth height.

5. The method of claim 1, further comprising: identifying, using the detection system, a first object placed at a first region of the container, the first object comprising a top portion and a bottom portion, wherein the first object extends into the first portion of the container; measuring a first position of the top portion of the first object and a second position of the bottom portion of the first object using the detection system; determining an approximate thickness of the first object based on the first position and the second position; determining, based at least in part on the approximate thickness of the first object, that the first object comprises a replacement part for a processing chamber; as well as The position of the replacement component in the container is recorded in the storage medium.

6. The method of claim 5, further comprising: determining, based on the approximate thickness of the first object, that the replacement part has been improperly placed at the first region of the container; as well as An error message is sent to a controller of the electronic processing system, the error message indicating a defect at the first region of the container including the replacement part.

7. The method of claim 6, wherein determining that the replacement part has been incorrectly placed comprises: Determining at least one of: a) the first position does not correspond to an expected first position of the replacement component, b) the second position does not correspond to an expected second position of the replacement component, or c) an approximate thickness of the replacement component does not correspond to an expected thickness of the replacement component.

8. An electronic processing system comprising: a factory interface comprising a robotic arm, wherein the robotic arm comprises a detection system at a distal end of an end effector of the robotic arm; a load port connected to the factory interface; a container connected to the loading port; as well as a controller operatively connected to the robotic arm, wherein the controller is configured to: causing the robotic arm to move according to a first mapping pattern to identify a location in the container using the detection system; determining an area of ​​the container that does not contain a replacement part; moving the robot according to a second mapping pattern to identify a location of at least one of a wafer or an empty carrier for a replacement part in the container using the detection system at the distal end of the end effector; as well as Based on the identified positions of the one or more replacement parts and the identified position of at least one of the wafer or the empty carrier for the replacement parts: extracting at least one of the one or more replacement parts, the empty carrier, or the wafer from the container, or At least one of one or more additional replacement parts, additional empty carriers, or the wafers are placed in one or more areas of the container.

9. The electronic processing system of claim 8, wherein the detection system at the distal end of the end effector of the robotic arm comprises a transmitting component and a sensing component, and wherein the detection system detects an object in response to a beam directed from the transmitting component to the sensing component being interrupted by the object.

10. The electronic processing system of claim 8, wherein the one or more replacement parts include a processing accessory ring.

11. The electronic processing system of claim 8, wherein to cause the manipulator to move according to the first mapping pattern, the controller is configured to: positioning the detection system a first horizontal distance from a portion of the container; moving the detection system from a first height to a second height to identify the one or more replacement parts in the container while the detection system is positioned the first horizontal distance from the portion of the container; determining whether the one or more replacement components extend from the portion of the container to the first horizontal distance; in response to determining that the one or more replacement components do not extend to the first horizontal distance from the container, positioning the detection system a second horizontal distance from the portion of the container, wherein the second horizontal distance is less than the first horizontal distance; as well as The detection system is moved from the first height to the second height to identify the one or more replacement parts in the container while the detection system is positioned the second horizontal distance from the portion of the container.

12. The electronic processing system of claim 11, wherein to cause the manipulator to move according to the second mapping pattern, the controller is configured to: positioning the detection system a third horizontal distance from the portion of the container within a first region of the container that does not contain a replacement part, wherein the third horizontal distance is less than the second horizontal distance; and moving the detection system from a third height within the first area to a fourth height within the first area while the detection system is positioned at the third horizontal distance from the portion of the container, And wherein the controller is further for determining whether at least one of the empty carrier or the wafer extends to the third horizontal distance from the portion of the container at any height between the third height and the fourth height.

13. The electronic processing system of claim 8, wherein the controller is further configured to: identifying, using the detection system, a first object placed at a first region of the container, the first object comprising a top portion and a bottom portion, wherein the first object extends into the first portion of the container; measuring a first position of the top portion of the first object and a second position of the bottom portion of the first object using the detection system; determining an approximate thickness of the first object based on the first position and the second position; determining, based at least in part on the approximate thickness of the first object, that the first object comprises a replacement part for a processing chamber; as well as The position of the replacement component in the container is recorded in the storage medium.

14. The electronic processing system of claim 8, wherein the controller is further configured to: A mapping of the location of the one or more replacement parts in the container and a mapping of the location of at least one of the empty carrier or the wafer in the container are recorded in a storage medium.

15. The electronic processing system of claim 8, wherein to determine whether the container connected to the loadport is configured to store a replacement part, the controller is to: A notification is received indicating that the container is a replacement part container.

16. An electronic processing system comprising: a factory interface comprising a robotic arm, wherein the robotic arm comprises a detection system at a distal end of an end effector of the robotic arm, and wherein the detection system comprises a transmitting assembly and a sensing assembly, and wherein the detection system detects an object in response to a beam directed from the transmitting assembly to the sensing assembly being interrupted by the object; a load port connected to the factory interface, wherein the load port is configured to receive a container; as well as a controller operatively connected to the robotic arm, wherein the controller is configured to: receiving a detection container at the loading port; determining, using the detection system at a distal end of the robot arm's end effector, whether the container is configured to store replacement parts for a process chamber; In response to determining that the container is configured to store the replacement part for the processing chamber, executing a first container mapping recipe, the first container mapping recipe comprising: moving the robotic arm according to a first mapping pattern to identify a location of one or more replacement parts in the container using the detection system at the distal end of the end effector; determining an area of ​​the container that does not contain a replacement part; moving the robot according to a second mapping pattern to identify a location of at least one of a wafer or an empty carrier for processing a part ring in the container using the detection system at the distal end of the end effector; and Based on the identified location of the one or more replacement parts and the identified location of at least one of the wafer or the empty carrier for the process kit ring: extracting at least one of one or more replacement parts, the empty carrier, or the wafer from the container, or At least one of one or more additional replacement parts, additional empty carriers, or the wafers are placed in one or more areas of the container.

17. The electronic processing system of claim 16, wherein moving the robotic arm according to the first mapping pattern comprises: positioning the detection system a first horizontal distance from a portion of the container; moving the detection system from a first height to a second height to identify the one or more replacement parts in the container while the detection system is positioned the first horizontal distance from the portion of the container; determining whether the one or more replacement components extend from the portion of the container to the first horizontal distance; in response to determining that the one or more replacement components do not extend to the first horizontal distance from the container, positioning the detection system a second horizontal distance from the portion of the container, wherein the second horizontal distance is less than the first horizontal distance; as well as The detection system is moved from the first height to the second height to identify the one or more replacement parts in the container while the detection system is positioned the second horizontal distance from the portion of the container.

18. The electronic processing system of claim 17, wherein Moving the robotic arm according to the second mapping mode comprises: positioning the detection system at a third horizontal distance from the portion of the container within a first region of the container that does not contain a replacement component, wherein the third horizontal distance is less than the second horizontal distance; as well as moving the detection system from a third height within the first area to a fourth height within the first area while the detection system is positioned at the third horizontal distance from the portion of the container, And wherein the controller is further for determining whether at least one of the empty carrier or the wafer extends to the third horizontal distance from the portion of the container at any height between the third height and the fourth height.

19. The electronic processing system of claim 16, wherein the controller is further configured to: identifying, using the detection system, a first object placed at a first region of the container, the first object comprising a top portion and a bottom portion, wherein the first object extends into the first portion of the container; measuring a first position of the top portion of the first object and a second position of the bottom portion of the first object using the detection system; determining an approximate thickness of the first object based on the first position and the second position; determining, based at least in part on the approximate thickness of the first object, that the first object comprises a replacement part for a processing chamber; as well as The position of the replacement component in the container is recorded in the storage medium.

20. The electronic processing system of claim 16, wherein to determine whether the container is configured to store replacement parts for the processing chamber, the controller is to: causing the robotic arm to move to a first portion of the container to detect a component identifier indicating that the container is a processing accessory ring; determining whether the container includes the component identifier; and In response to determining whether the container includes the component identifier, the robotic arm is then moved according to the first mapping mode.

21. A system comprising: a factory interface, the factory interface comprising one or more robotic arms; a load port connected to the factory interface; as well as a system controller operatively connected to the one or more robotic arms, wherein the system controller is configured to: responsive to detecting receipt of a container at the loadport, determining a type of component of the system for storage at the container; identifying one or more mapping modes associated with the determined type of component; causing an inspection system of the one or more robotic arms to move according to the identified one or more mapping patterns to inspect one or more components stored by the container; determining, based on the movement of the one or more robotic arms, a mapping of the storage container according to the identified one or more mapping patterns, wherein the mapping indicates an area of ​​the container storing one or more detected components and a location of each of the one or more detected components stored in the corresponding area; as well as Based on the determined mapping, causing the one or more robotic arms to perform at least one of the following: removing at least one of the one or more detected components from the container, or Additional components are placed in the container.

22. The system of claim 21, wherein the system controller is further configured to: moving the one or more robotic arms to a first region of the container to detect an identifier component, wherein the identifier component indicates the type of the component for storage at the container, Wherein the type of component of the system for storage at the container is determined based on detection of the identifier component at the first region.

23. The system of claim 21, wherein the system controller is further configured to: determining a characteristic of one or more external features of the container, wherein the type of component of the system for storage at the container is determined in view of the characteristic of the one or more external features of the container.

24. The system of claim 21, wherein to identify the one or more mapping modes associated with the determined type of component, the system controller is to: accessing memory storage instructions associated with a plurality of mapping modes; and Among the plurality of mapping modes, the one or more mapping modes associated with the determined type of the component are determined.

25. The system of claim 21, wherein the identified one or more mapping patterns include: a first mapping pattern associated with identifying the area of ​​the container storing the one or more detected components and a second mapping pattern associated with determining a position of each of the one or more detected components, and wherein to move the detection system according to the identified one or more mapping patterns, the system controller is configured to: moving the detection system according to the first mapping mode; as well as The detection system is then moved according to the second mapping pattern.

26. The system of claim 25, wherein in order to move the detection system according to the first mapping pattern, the system controller is configured to: positioning the detection system a first horizontal distance from a portion of the container; while the inspection system is positioned the first horizontal distance from the portion of the container, moving the inspection system from a first height to a second height to identify the one or more components in the container; determining whether the one or more components extend from the portion of the container to the first horizontal distance; in response to determining that the one or more components do not extend to the first horizontal distance from the container, positioning the detection system a second horizontal distance from the portion of the container, wherein the second horizontal distance is less than the first horizontal distance; as well as The inspection system is moved from the first height to the second height to identify the one or more components in the container while the inspection system is positioned the second horizontal distance from the portion of the container.

27. The system of claim 26, wherein in order to move the detection system according to the second mapping pattern, the system controller is configured to: positioning the detection system a third horizontal distance from the portion of the container within a first region of the container that does not contain a component, wherein the third horizontal distance is less than the second horizontal distance; and moving the detection system from a third height within the first area to a fourth height within the first area while the detection system is positioned at the third horizontal distance from the portion of the container, And wherein the controller is further for determining whether at least one of an empty carrier or a wafer extends to the third horizontal distance from the portion of the container at any height between the third height and the fourth height.

28. The system of claim 21, wherein the one or more components include a process fitting ring.

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