Foldable device, control method thereof, device, medium and program product
By designing the housing components of the foldable equipment in a different thickness, the problem of thicker thickness after folding of existing equipment is solved, and efficient heat dissipation and lightweighting are achieved.
Patent Information
- Application Number
- CN202311076440.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-24
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2043-08-24
AI Technical Summary
Existing foldable devices are thicker after folding, making it difficult to take into account the needs of efficient heat dissipation and lightweighting.
By designing the housing assembly with a different thickness, the heat dissipation module is installed in a thicker position, and the thinner part overlaps with the other housing assembly when folded to achieve thinning.
It realizes the folding thickness of the foldable device while maintaining efficient heat dissipation, and improves the lightness and portability of the device.
Smart Images

Figure CN119520658A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of terminal products, and in particular to a foldable device and a control method, device, medium and program product thereof. Background Art
[0002] With the development of electronic device technologies such as smartphones and tablets, the display screen area of electronic devices is getting larger and larger to improve the user experience. However, when the display screen area of an electronic device is large, the overall size of the electronic device will be larger, making it inconvenient to carry the electronic device. In order to make electronic devices with larger display screens more convenient to carry, foldable devices such as foldable mobile phones and foldable computers with flexible display screens have emerged. Foldable devices can be folded and unfolded. When folded, the foldable device has a smaller size and is easy to carry. When unfolded, the foldable device has a larger display screen area, which provides a better user experience.
[0003] In the related art, a foldable device may include a hinge mechanism and two housing components connected by the hinge mechanism, at least one housing component is equipped with a heat generating module, and as the performance of the foldable device becomes higher and higher, the heat generated by the heat generating module is also increasing. To improve the heat dissipation efficiency of the heat generating module of the foldable device, at least one housing component is also equipped with a heat dissipation module, and the heat dissipation module is used to dissipate heat from the heat generating module. However, in the related art, the thickness of the foldable device equipped with the heat dissipation module is relatively thick after being folded. Summary of the invention
[0004] The embodiments of the present application provide a foldable device and a control method, device, medium and program product thereof. By designing a shell component for installing a heat dissipation module with unequal thickness, the heat dissipation module is installed at a thicker position of the shell component. When the foldable device is in a folded state, the thinner portion of the shell component is used to overlap with another shell component. This allows the foldable device installed with the heat dissipation module to be thinner after folding, thereby taking into account the requirements of efficient heat dissipation and lightweight of the foldable device.
[0005] On one hand, the present application provides a foldable device, comprising a first shell component, a second shell component, a rotating shaft mechanism and a heat dissipation module. The first shell component and the second shell component are connected in rotation through the rotating shaft mechanism. The first shell component comprises a first side wall structure and a second side wall structure, and the first side wall structure and the second side wall structure are respectively located on both sides of the thickness direction of the first shell component. The first side wall structure comprises a first side wall, a second side wall and a third side wall, and the first side wall and the second side wall are both arranged opposite to the second side wall structure, and the first side wall protrudes from the second side wall in a direction away from the second side wall structure, and the spacing between the first side wall and the second side wall structure is greater than the spacing between the second side wall and the second side wall structure, and one end of the first side wall facing the rotating shaft mechanism is connected to one end of the second side wall away from the rotating shaft mechanism through the third side wall. The heat dissipation module is installed in the mounting subcavity between the first side wall and the second side wall structure. In the process of switching the foldable device from the unfolded state to the folded state, the second shell component rotates in the direction of the second side wall. When the foldable device is in a folded state, the orthographic projection of the second side wall along the thickness direction of the first shell component at least partially overlaps with the orthographic projection of the second shell component along the thickness direction of the first shell component, and the orthographic projection of the first side wall along the thickness direction of the first shell component does not overlap with the orthographic projection of the second shell component along the thickness direction of the first shell component.
[0006] In the foldable device of the embodiment of the present application, the first shell component is designed with unequal thickness at the first side wall and the second side wall, and the heat dissipation module is installed at the first side wall of the first shell component where the thickness is thicker, so that the part of the first shell component where the heat dissipation module is installed can be relatively light and thin. In addition, when the foldable device is in a folded state, the thicker part of the first shell component where the heat dissipation module is installed will not overlap with the second shell component, and the second side wall of the first shell component where the thickness is thinner is used to overlap with the second shell component, so that the thickness of the foldable device installed with the heat dissipation module can be relatively thin after folding, which can take into account the requirements of efficient heat dissipation and thinness of the foldable device.
[0007] In a possible implementation, the heat dissipation module includes a fan installed in the mounting sub-cavity. The first housing component has heat dissipation holes, at least some of which are located on the third side wall, and the fan is used to drive air into and out of the mounting sub-cavity through the heat dissipation holes.
[0008] In a possible implementation manner, the heat dissipation holes are all arranged on the third side wall.
[0009] In a possible implementation, the heat dissipation holes include an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are arranged on different side walls of the first shell component.
[0010] In a possible embodiment, the first shell component further includes a surrounding wall structure, and the two ends of the surrounding wall structure in the thickness direction of the first shell component are respectively connected to the first side wall structure and the second side wall structure. The heat dissipation hole provided on the third side wall is an air inlet hole, and at least one of the first side wall, the surrounding wall structure, and the second side wall structure has an air outlet hole.
[0011] In a possible embodiment, the surrounding wall structure includes a fourth side wall, a fifth side wall and a sixth side wall. The first side wall structure is connected to the second side wall structure at one end in the axial direction of the rotating shaft mechanism through the fourth side wall, the first side wall structure is connected to the second side wall structure at the other end in the axial direction of the rotating shaft mechanism through the fifth side wall, and the first side wall is connected to the second side wall structure at one end away from the rotating shaft mechanism through the sixth side wall. The fourth side wall includes a first area connecting the first side wall and the second side wall structure, and the fifth side wall includes a second area connecting the first side wall and the second side wall structure. At least one of the first area, the second area and the sixth side wall has an air outlet.
[0012] In a possible implementation, at least one of the first side wall, the surrounding wall structure, and the second side wall structure has an air inlet hole.
[0013] In a possible implementation, when the foldable device is in a folded state, a gap is provided between an end of the second shell assembly facing away from the hinge mechanism and the third side wall, and the heat dissipation holes provided on the third side wall are connected to the external space through the gap.
[0014] In a possible implementation, the foldable device further includes a sensor and a controller. The sensor is electrically connected to the controller, and the controller is electrically connected to the heat dissipation module. The sensor is used to detect the opening and closing state of the foldable device, and the controller is used to control the heat dissipation module according to the opening and closing state of the foldable device detected by the sensor. The opening and closing state includes an unfolded state and a folded state.
[0015] On the other hand, the present application provides a control method for a foldable device, which is applied to the foldable device in any of the above embodiments. The method can be executed by the foldable device. The method includes: if the foldable device is in a folded state, controlling the foldable device to operate in a low power consumption state, limiting the foldable device from switching from a low power consumption state to a high power consumption state, and controlling the heat dissipation module to dissipate heat in a low power consumption mode.
[0016] In a possible implementation, the foldable device is controlled to operate in a low power consumption state, and the foldable device is restricted from switching from the low power consumption state to the high power consumption state, specifically including: restricting the operation of high power consumption programs of the foldable device.
[0017] In a possible implementation, if the foldable device is in an unfolded state, the restriction on the transition of the foldable device from a low power consumption state to a high power consumption state is lifted, and the operating state of the foldable device is obtained, wherein the operating state includes a low power consumption state and a high power consumption state; if the foldable device is in a high power consumption state, the heat dissipation module is controlled to switch from a low power consumption mode to a high power consumption mode for heat dissipation.
[0018] In a possible implementation, lifting restrictions on the transition of the foldable device from a low power consumption state to a high power consumption state specifically includes: lifting restrictions on the running of high power consumption programs on the foldable device.
[0019] In a possible implementation, obtaining the operating state of the foldable device specifically includes: obtaining a program running on the foldable device; if the obtained program running on the foldable device includes a high power consumption program, the foldable device is in a high power consumption state.
[0020] In a possible implementation, the heat dissipation module is controlled to switch from a low power consumption mode to a high power consumption mode for heat dissipation, specifically including: controlling the fan to switch from an off state to an on state, or controlling the fan to switch from a low power state to a high power state, so as to increase the air volume entering and exiting the mounting sub-cavity through the heat dissipation holes.
[0021] In a possible implementation, if the foldable device is in an unfolded state and in a low power consumption state, the heat dissipation module is controlled to dissipate heat in a low power consumption mode.
[0022] In another aspect, the present application provides an electronic device, including a processor and a memory. The memory stores computer-executable instructions, and the processor executes the computer-executable instructions stored in the memory, so that the processor executes the control method of the foldable device in any of the above embodiments.
[0023] On the other hand, the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the control method of the foldable device in any of the above embodiments is implemented.
[0024] On the other hand, the present application provides a computer program product, which implements the control method of a foldable device in any of the above embodiments when the computer program is executed by a processor. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 A schematic diagram of a foldable device in a folded state provided by an embodiment of the present application;
[0026] Figure 2 for Figure 1 A schematic diagram of a foldable device in a partially unfolded state;
[0027] Figure 3 for Figure 1 A schematic diagram of a foldable device in a fully unfolded state;
[0028] Figure 4 A schematic diagram of another foldable device provided in an embodiment of the present application in a folded state;
[0029] Figure 5 for Figure 4 A schematic diagram of a foldable device in a partially unfolded state;
[0030] Figure 6 for Figure 4 A schematic diagram of a foldable device in a fully unfolded state;
[0031] Figure 7 A schematic diagram of another foldable device provided in an embodiment of the present application in a fully unfolded state;
[0032] Figure 8 for Figure 7 A schematic diagram of a foldable device in a folded state;
[0033] Fig. 9 A schematic diagram of a first housing assembly, a hinge mechanism, and a second housing assembly when another foldable device provided in an embodiment of the present application is in a folded state;
[0034] Fig.10 A schematic diagram of a first housing assembly, a hinge mechanism, and a second housing assembly of another foldable device provided in an embodiment of the present application when the device is in a fully unfolded state;
[0035] Fig.11 A schematic diagram of a fourth side wall of another foldable device provided in an embodiment of the present application;
[0036] Fig.12 A schematic diagram of a fifth side wall of another foldable device provided in an embodiment of the present application;
[0037] Fig.13 A schematic diagram of another foldable device provided in an embodiment of the present application in a fully unfolded state;
[0038] Fig.14 for Fig.13 A schematic diagram of a foldable device in a folded state;
[0039] Fig.15 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0040] Fig.16A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0041] Fig.17 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0042] Fig.18 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0043] Fig.19 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0044] Fig. 20 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0045] Fig.21 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of the present application;
[0046] Fig. 22 A flowchart of a control method for a foldable device provided in an embodiment of the present application;
[0047] Fig.23 A schematic diagram of another foldable device provided in an embodiment of the present application.
[0048] Description of reference numerals:
[0049] 100. A first housing assembly;
[0050] 110, first side wall structure; 111, first side wall; 112, second side wall; 113, third side wall;
[0051] 120. A second side wall structure;
[0052] 130, first surrounding wall structure; 131, fourth side wall; 1311, first region; 1312, third region; 132, fifth side wall; 1321, second region; 1322, fourth region; 133, sixth side wall; 134, seventh side wall;
[0053] 140. heat dissipation hole; 141. air inlet hole; 142. air outlet hole;
[0054] 150, mounting cavity; 151, first mounting sub-cavity; 152, second mounting sub-cavity;
[0055] 200, second housing assembly;
[0056] 210. A third side wall structure;
[0057] 220, fourth side wall structure;
[0058] 230, second surrounding wall structure;
[0059] 300, shaft mechanism;
[0060] 400, flexible display screen; 410, first connection area; 420, second connection area; 430, bendable area;
[0061] 500, heat dissipation module; 510, fan;
[0062] 600, gap;
[0063] 710, processor; 720, memory; 730, communication interface; 740, bus. DETAILED DESCRIPTION
[0064] The terms used in the implementation method part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application. The implementation method of the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0065] The embodiment of the present application provides a foldable device with a folded state and an unfolded state. The foldable device can change its form by folding and unfolding to meet the needs of users in different scenarios. For example, when carrying, it can be folded to reduce the size of the foldable device; when in use, it can be unfolded to increase the area of the display screen for display or operation. It should be noted that the foldable device can also be called user equipment (UE) or terminal, etc.
[0066] The foldable device provided in the embodiment of the present application may include but is not limited to foldable electronic products such as mobile phones, tablet personal computers, laptop computers, notebook computers, personal digital assistants (PDAs), personal computers, multimedia players, e-book readers, vehicle-mounted devices or wearable devices. Among them, wearable devices may include but are not limited to smart bracelets, smart watches, smart head-mounted displays, smart glasses, etc. The embodiment of the present application takes the foldable device as a mobile phone as an example for explanation.
[0067] Figure 1 A schematic diagram of a foldable device in a folded state provided by an embodiment of the present application, Figure 2 for Figure 1 A schematic diagram of a foldable device in a partially unfolded state. Figure 3 for Figure 1Illustration of a foldable device in a fully unfolded state.
[0068] like Figure 1-Figure 3 As shown, in the embodiment of the present application, the foldable device includes a first housing assembly 100, a second housing assembly 200 and a hinge mechanism 300. The first housing assembly 100 and the second housing assembly 200 are rotatably connected via the hinge mechanism 300, so that the foldable device can switch between a folded state and an unfolded state. When the foldable device is in the folded state, the first housing assembly 100 and the second housing assembly 200 rotate to overlap each other.
[0069] The unfolded state includes a fully unfolded state and a partially unfolded state. When the foldable device is in the fully unfolded state, the first housing assembly 100 and the second housing assembly 200 rotate to an angle of approximately 180° between them. Those skilled in the art can understand that the angle referred to in this application document is approximately 180°. Due to design tolerances and other reasons, it may not be an absolute 180°, and a slight deviation is allowed, such as 165°, 177° or 185°.
[0070] The partially unfolded state is the state of the foldable device during the process of switching between the folded state and the fully unfolded state, that is, when the foldable device is in the partially unfolded state, the angle between the first shell assembly 100 and the second shell assembly 200 is smaller than the angle between the first shell assembly 100 and the second shell assembly 200 when the foldable device is in the fully unfolded state, and the angle between the first shell assembly 100 and the second shell assembly 200 when the foldable device is in the partially unfolded state is greater than the angle between the first shell assembly 100 and the second shell assembly 200 when the foldable device is in the folded state.
[0071] It can be understood that when the foldable device is in a fully unfolded state, the axial direction of the hinge mechanism 300 can be the length direction of the foldable device, and the axial direction of the hinge mechanism 300 can also be the width direction of the foldable device.
[0072] In an embodiment of the present application, the foldable device may further include a flexible display screen 400, which is mounted on the first shell component 100 and the second shell component 200. The hinge mechanism 300 can be used to support the flexible display screen 400. When the foldable device is in a fully unfolded state, the side of the first shell component 100 used to mount the flexible display screen 400 is oriented in the same direction as the side of the second shell component 200 used to mount the flexible display screen 400. The flexible display screen 400 can be used to display information and provide an interactive interface for the user.
[0073] Exemplarily, the flexible display screen 400 may be fixedly connected to the first housing assembly 100 and the second housing assembly 200 by bonding, snapping, or the like.
[0074] Exemplarily, the flexible display screen 400 may include, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (miniorganic light-emitting diode) display screen, a micro light-emitting diode (micro light-emitting diode) display screen, a micro organic light-emitting diode (micro organic light-emitting diode) display screen, a quantum dot light-emitting diode (quantum dot light-emitting diode) display screen, etc.
[0075] In the embodiment of the present application, the flexible display screen 400 may include a first connection area 410, a second connection area 420, and a bendable area 430 located between the first connection area 410 and the second connection area 420. The first connection area 410 and the second connection area 420 are connected through the bendable area 430, the first connection area 410 may be fixedly connected to the first housing assembly 100 by bonding, clamping, etc., the second connection area 420 may be fixedly connected to the second housing assembly 200 by bonding, clamping, etc., the bendable area 430 is opposite to the hinge mechanism 300, and the hinge mechanism 300 may be used to support the bendable area 430.
[0076] In some examples, a portion of the bendable region 430 may be bonded and fixed to the hinge mechanism 300 by adhesive, glue or the like.
[0077] In the flexible display screen 400, at least the bendable area 430 is made of flexible material, so that the bendable area 430 can be bent and flattened. The first connection area 410 and the second connection area 420 can be made of flexible material, or can be made of rigid material, or can be made of partly flexible material and partly rigid material.
[0078] When the foldable device switches between the folded state and the unfolded state, the first connection area 410 and the second connection area 420 can rotate with the first shell assembly 100 and the second shell assembly 200 to make the bendable area 430 bend and unfold. Specifically, when the foldable device switches from the unfolded state to the folded state, the bendable area 430 is bent under the drive of the first connection area 410 and the second connection area 420, and the first connection area 410 and the second connection area 420 can be parallel to each other (a small deviation is allowed). When the foldable device switches from the folded state to the fully unfolded state, the bendable area 430 is flattened under the drive of the first connection area 410 and the second connection area 420, and the bendable area 430, the first connection area 410 and the second connection area 420 can be coplanar (a small deviation is allowed).
[0079] Exemplarily, the foldable device may be an inward-folding foldable device, and the flexible display screen 400 is an inward-folding display screen. When the foldable device is in a folded state, the first connection area 410 is located on the side of the first shell component 100 facing the second shell component 200, and the second connection area 420 is located on the side of the second shell component 200 facing the first shell component 100, that is, the first connection area 410 and the second connection area 420 are located between the first shell component 100 and the second shell component 200, and the first connection area 410 and the second connection area 420 can be relatively fitted. When the inward-folding foldable device is in a folded state, the flexible display screen 400 is blocked by the first shell component 100 and the second shell component 200, and the first shell component 100 and the second shell component 200 can protect the flexible display screen 400. If the inward-folding foldable device needs to realize the display function in the folded state, a display screen can be additionally provided on the back of at least one of the first shell component 100 and the second shell component 200, and the inward-folding foldable device can rely on the additional display screen to realize the display function in the folded state.
[0080] Figure 4 A schematic diagram of another foldable device in a folded state provided by an embodiment of the present application, Figure 5 for Figure 4 A schematic diagram of a foldable device in a partially unfolded state. Figure 6 for Figure 4 Illustration of a foldable device in a fully unfolded state.
[0081] like Figure 4-Figure 6As shown, the foldable device may be an outward-folding foldable device, and the flexible display screen 400 is an outward-folding display screen. When the foldable device is in a folded state, the first connection area 410 is located on the side of the first shell component 100 away from the second shell component 200, and the second connection area 420 is located on the side of the second shell component 200 away from the first shell component 100, that is, the first shell component 100 and the second shell component 200 are located between the first connection area 410 and the second connection area 420, and the flexible display screen 400 is surrounded by the first shell component 100, the hinge mechanism 300 and the second shell component 200, and the flexible display screen 400 is visible to the user. When the outward-folding foldable device is in a folded state, the flexible display screen 400 is exposed to the outside, and the flexible display screen 400 can be used to realize the display function. Therefore, there is no need to add a display screen on the back of at least one of the first shell component 100 and the second shell component 200 in order to realize the display function of the foldable device in the folded state.
[0082] In the embodiment of the present application, the foldable device further includes a heating module (not shown), the first shell assembly 100 has an installation cavity 150 therein, and the heating module is installed in the installation cavity 150 of the first shell assembly 100 .
[0083] Exemplarily, the heating module may include one or more heating devices such as a processor, a camera, a battery, an audio device, a memory, etc.
[0084] In order to improve the heat dissipation efficiency of the heat generating module so that the foldable device has better performance, in the embodiment of the present application, the foldable device may further include a heat dissipation module 500 (as shown below): Figure 7 As shown in FIG. 1 , the heat dissipation module 500 may be installed in the installation cavity 150 of the first housing assembly 100 , and the heat dissipation module 500 is used to dissipate the heat generated by the heat generating module to the outside of the first housing assembly 100 .
[0085] In the related art, each part of the first shell component is designed with uniform thickness. Since the heat dissipation module is relatively high, it needs to occupy a larger space in the thickness direction of the first shell component. In order to reserve space for installing the heat dissipation module, the first shell component used to install the heat dissipation module will be larger in the thickness direction, resulting in a thicker thickness of the foldable device equipped with the heat dissipation module after folding.
[0086] Figure 7 A schematic diagram of another foldable device provided in an embodiment of the present application in a fully unfolded state, Figure 8 for Figure 7 A schematic diagram of a foldable device in a folded state, Fig. 9 A schematic diagram of a first housing component, a hinge mechanism, and a second housing component of another foldable device provided in an embodiment of the present application when the foldable device is in a folded state. Fig.10 A schematic diagram of a first housing component, a hinge mechanism, and a second housing component of another foldable device provided in an embodiment of the present application when the device is in a fully unfolded state. The x direction is the first direction, the y direction is the axial direction of the hinge mechanism 300, and the z direction is the thickness direction of the first housing component 100. The first direction is perpendicular to the axial direction of the hinge mechanism 300, the first direction is perpendicular to the thickness direction of the first housing component 100, and the thickness direction of the first housing component 100 is perpendicular to the axial direction of the hinge mechanism 300.
[0087] Based on this, in the embodiment of the present application, the first housing component 100 includes a first side wall structure 110 and a second side wall structure 120, and the first side wall structure 110 and the second side wall structure 120 are respectively located on both sides of the thickness direction of the first housing component 100. The first side wall structure 110 includes a first side wall 111, a second side wall 112 and a third side wall 113, and the first side wall 111 and the second side wall 112 are both arranged opposite to the second side wall structure 120, and the first side wall 111 protrudes from the second side wall 112 in a direction away from the second side wall structure 120, and the spacing between the first side wall 111 and the second side wall structure 120 is greater than the spacing between the second side wall 112 and the second side wall structure 120, and the end of the first side wall 111 facing the rotating shaft mechanism 300 is connected to the end of the second side wall 112 facing away from the rotating shaft mechanism 300 through the third side wall 113. The mounting cavity 150 includes a first mounting sub-cavity 151 located between the first side wall 111 and the second side wall structure 120, and the heat dissipation module 500 is mounted in the first mounting sub-cavity 151. During the process of switching the foldable device from the unfolded state to the folded state, the second housing assembly 200 rotates toward the second side wall 112. When the foldable device is in the folded state, the orthographic projection of the second side wall 112 along the thickness direction of the first housing assembly 100 and the orthographic projection of the second housing assembly 200 along the thickness direction of the first housing assembly 100 at least partially overlap, and the orthographic projection of the first side wall 111 along the thickness direction of the first housing assembly 100 and the orthographic projection of the second housing assembly 200 along the thickness direction of the first housing assembly 100 do not overlap. In other words, when the foldable device is in the folded state, the second housing assembly 200 overlaps the second side wall 112 outside the first side wall 111, the second side wall 112 is at least partially covered by the second housing assembly 200, and the first side wall 111 is not covered by the second housing assembly 200.
[0088] In this way, the first housing component 100 is designed with unequal thickness at the first side wall 111 and the second side wall 112, and the heat dissipation module 500 is installed at the first side wall 111 of the first housing component 100 where the thickness is relatively thick, so that the part of the first housing component 100 where the heat dissipation module 500 is installed can be relatively thin. In addition, when the foldable device is in a folded state, the thicker part of the first housing component 100 where the heat dissipation module 500 is installed will not overlap with the second housing component 200, and the thinner second side wall 112 of the first housing component 100 is used to overlap with the second housing component 200, so that the foldable device installed with the heat dissipation module 500 can be relatively thin after folding, which can take into account the requirements of efficient heat dissipation and thinness of the foldable device.
[0089] It can be understood that the third side wall 113 is used to connect one end of the first side wall 111 and the third side wall 113 is used to connect one end of the second side wall 112 and are spaced apart in the thickness direction of the first shell assembly 100, and the first shell assembly 100 forms a boss structure at the first side wall 111 that protrudes away from the second side wall structure 120.
[0090] Exemplarily, the heat dissipation module 500 may include, but is not limited to, an air-cooled heat dissipation module, a liquid-cooled heat dissipation module, an air-cooled-liquid-cooled hybrid heat dissipation module, and the like.
[0091] Exemplarily, at least some of the heating components of the heating module can be installed in the first installation sub-cavity 151. In this way, it is beneficial to reduce the thickness of the first housing assembly 100 at the second side wall 112, so that the thickness of the foldable device after folding is thinner. In addition, at least some of the heating components of the heating module are close to the heat dissipation module 500, which is beneficial for the heat dissipation module 500 to dissipate the heat generated by the heating module to the outside of the first housing assembly 100 more efficiently.
[0092] Exemplarily, one or more of a processor, a camera, a battery, an audio device, a memory, etc. may be installed in the first installation sub-cavity 151 .
[0093] In the embodiment of the present application, the installation cavity 150 further includes a second installation sub-cavity 152 located between the second side wall 112 and the second side wall structure 120, and the first installation sub-cavity 151 is connected to the second installation sub-cavity 152. In this way, the heat dissipation module 500 can dissipate heat for the device installed in the second installation cavity 150.
[0094] Exemplarily, some heating components of the heating module can be installed in the first installation sub-cavity 151, and some heating components of the heating module can be installed in the second installation sub-cavity 152. For example, the camera and the processor can be installed in the first installation sub-cavity 151, and the memory can be installed in the second installation sub-cavity 152.
[0095] In the embodiment of the present application, the first shell assembly 100 also includes a first surrounding wall structure 130, and the first surrounding wall structure 130 is respectively connected to the first side wall structure 110 and the second side wall structure 120 at both ends in the thickness direction of the first shell assembly 100, and an installation cavity 150 is formed between the first surrounding wall structure 130, the first side wall structure 110 and the second side wall structure 120.
[0096] In the embodiment of the present application, the first surrounding wall structure 130 includes a fourth side wall 131, a fifth side wall 132, a sixth side wall 133 and a seventh side wall 134, the fourth side wall 131 and the fifth side wall 132 are arranged opposite to each other in the axial direction of the rotating shaft mechanism 300, and the sixth side wall 133 and the seventh side wall 134 are arranged opposite to each other in the first direction. The first side wall structure 110 is connected to one end of the axial direction of the rotating shaft mechanism 300 of the second side wall structure 120 through the fourth side wall 131 at one end of the axial direction of the rotating shaft mechanism 300, and the first side wall structure 110 is connected to the other end of the axial direction of the rotating shaft mechanism 300 of the second side wall structure 120 through the fifth side wall 132 at the other end of the axial direction of the rotating shaft mechanism 300. The end of the first side wall 111 facing away from the rotating shaft mechanism 300 is connected to the end of the second side wall structure 120 facing away from the rotating shaft mechanism 300 through the sixth side wall 133. The end of the second side wall 112 facing the rotating shaft mechanism 300 is connected to the end of the second side wall structure 120 facing the rotating shaft mechanism 300 through the seventh side wall 134. The first shell assembly 100 is connected to the rotating shaft mechanism 300 at the seventh side wall 134. A mounting cavity 150 is formed between the fourth side wall 131 , the fifth side wall 132 , the sixth side wall 133 , the seventh side wall 134 , the first side wall structure 110 and the second side wall structure 120 .
[0097] In the embodiment of the present application, the fourth side wall 131 includes a first area 1311 and a third area 1312, the first area 1311 is connected to the first side wall 111 and the second side wall structure 120 at both ends in the thickness direction of the first housing assembly 100, and the third area 1312 is connected to the second side wall 112 and the second side wall structure 120 at both ends in the thickness direction of the first housing assembly 100, and the fifth side wall 132 includes a second area 1321 and a fourth area 1322, the second area 1321 is connected to the first side wall 111 and the second side wall structure 120 at both ends in the thickness direction of the first housing assembly 100, and the fourth area 1322 is connected to the second side wall 112 and the second side wall structure 120 at both ends in the thickness direction of the first housing assembly 100. In the axial direction of the rotating shaft mechanism 300, the first area 1311 is opposite to the second area 1321, and the third area 1312 is opposite to the fourth area 1322. A first mounting sub-cavity 151 is formed between the first region 1311, the second region 1321, the first side wall 111, the sixth side wall 133 and the second side wall structure 120, and a second mounting sub-cavity 152 is formed between the third region 1312, the fourth region 1322, the second side wall 112, the seventh side wall 134 and the second side wall structure 120.
[0098] like Figure 8 As shown, in the thickness direction of the first housing assembly 100 , the size of the sixth side wall 133 is greater than the size of the seventh side wall 134 .
[0099] Fig.11 A schematic diagram of a fourth side wall of another foldable device provided in an embodiment of the present application, Fig.12 A schematic diagram of a fifth side wall of another foldable device provided in an embodiment of the present application.
[0100] like Fig.11 , Fig.12 As shown, in the thickness direction of the first housing assembly 100 , the size of the first region 1311 is larger than the size of the third region 1312 , and the size of the second region 1321 is larger than the size of the fourth region 1322 .
[0101] In the embodiment of the present application, the second housing assembly 200 includes a third side wall structure 210, a fourth side wall structure 220, and a second surrounding wall structure 230. The third side wall structure 210 and the fourth side wall structure 220 are respectively located on both sides of the thickness direction of the second housing assembly 200, and the second surrounding wall structure 230 is respectively connected to the third side wall structure 210 and the fourth side wall structure 220 at both ends of the thickness direction of the second housing assembly 200. When the foldable device is in a folded state, the third side wall structure 210 is located on the side of the second housing assembly 200 facing the second side wall 112, and the fourth side wall structure 220 is located on the side of the second housing assembly 200 away from the second side wall 112.
[0102] When the foldable device is an inward-folding foldable device, that is, when the flexible display screen 400 is an inward-folding display screen, the flexible display screen 400 is installed on the second side wall 112 and the third side wall structure 210, and the first connection area 410 can be fixedly connected to the second side wall 112 by bonding, snapping, etc., and the second connection area 420 can be fixedly connected to the third side wall structure 210 by bonding, snapping, etc.
[0103] Fig.13 A schematic diagram of another foldable device provided in an embodiment of the present application in a fully unfolded state, Fig.14 for Fig.13 A schematic diagram of a foldable device in a folded state.
[0104] like Fig.13 , Fig.14 As shown, when the foldable device is an outward-folding foldable device, that is, when the flexible display screen 400 is an outward-folding display screen, the flexible display screen 400 is installed on the second side wall structure 120 and the fourth side wall structure 220, and the first connection area 410 can be fixedly connected to the second side wall structure 120 by bonding, snapping, etc., and the second connection area 420 can be fixedly connected to the fourth side wall structure 220 by bonding, snapping, etc.
[0105] In an embodiment of the present application, the foldable device further includes a sensor and a controller. The sensor is electrically connected to the controller, and the controller is electrically connected to the heat dissipation module 500. The sensor is used to detect the opening and closing state of the foldable device, and the controller is used to control the heat dissipation module 500 according to the opening and closing state of the foldable device detected by the sensor. Among them, the opening and closing state includes an unfolded state and a folded state. In this way, it is convenient to adjust the working mode of the heat dissipation module 500 according to the opening and closing state of the foldable device, which is conducive to making the heat dissipation module 500 operate more efficiently.
[0106] It will be appreciated that the sensor may be electrically connected to the controller via a processor.
[0107] In the embodiment of the present application, the controller is configured to control the heat dissipation module 500 to be turned off or run in a low-power state when the foldable device is in the folded state. In this way, the noise and energy consumption of the foldable device in the folded state can be reduced, which is conducive to extending the battery life of the foldable device.
[0108] Exemplarily, the controller may be installed in the installation cavity 150 .
[0109] Exemplarily, the sensor may include a Hall sensor. A Hall sensor may be installed on one of the first shell component 100 and the second shell component 200, and a magnetic component may be installed on the other of the first shell component 100 and the second shell component 200. The opening and closing state of the foldable device can be detected based on the change of the magnetic field detected by the Hall sensor.
[0110] Exemplarily, the sensor may include an angle sensor disposed on the hinge mechanism 300, and the opening and closing state of the foldable device may be detected according to the change in the angle detected by the angle sensor. For example, it may be set that when the second housing assembly 200 is rotated toward the second side to the extreme position, the angle detected by the angle sensor is 0°, when the angle detected by the angle sensor is between 0° and a preset angle, the foldable device is determined to be in a folded state, and when the angle detected by the angle sensor is greater than a preset angle, the foldable device is determined to be in an unfolded state. The preset angle may be 1°, 2°, etc.
[0111] Exemplarily, the sensor may include a pressure sensor, and at least one of the first housing assembly 100 and the second housing assembly 200 is provided with a pressure sensor, and the pressure sensor is provided at a position that is squeezed when the foldable device is in a folded state and is not squeezed when the foldable device is in an unfolded state, and the opening and closing state of the foldable device can be detected according to the change in pressure detected by the pressure sensor. For example, the pressure sensor may be a piezoelectric sensor.
[0112] In the embodiment of the present application, the heat dissipation module 500 may include a fan 510, which is installed in the first installation sub-cavity 151, and the first housing assembly 100 has a heat dissipation hole 140. In this way, the fan 510 can drive the air in the first installation sub-cavity 151 to take the heat out of the first housing assembly 100 through the heat dissipation hole 140, so that the heat dissipation efficiency of the heat dissipation module is higher.
[0113] In the example where the first housing assembly 100 has heat dissipation holes 140, at least part of the heat dissipation holes 140 are located on the third side wall 113, and the fan 510 is used to drive air into and out of the first mounting sub-cavity 151 through the heat dissipation holes 140. In this way, when the foldable device is in the folded state, the amount of air that needs to pass through the heat dissipation holes 140 to enter and exit the first mounting sub-cavity 151 is relatively small, and the second housing assembly 200 stacked on the second side wall 112 can block the heat dissipation holes 140 on the third side wall 113, so that fewer heat dissipation holes 140 are exposed when the foldable device is in the folded state. When the foldable device is in the unfolded state, the heat dissipation holes 140 on the third side wall 113 can be exposed, which is conducive to air passing through the heat dissipation holes 140 to enter and exit the first mounting sub-cavity 151, so that the heat generating module can dissipate heat more efficiently.
[0114] Exemplarily, the controller is used to control the fan 510 according to the opening and closing state of the foldable device detected by the sensor, and the controller is configured to control the fan 510 to be turned off or run in a low-power state when the foldable device is in the folded state.
[0115] Exemplarily, the fan 510 may include but is not limited to an axial flow fan, a piezoelectric fan, etc.
[0116] Exemplarily, the fan 510 may be used to drive the air at the heating module to flow out of the first mounting sub-cavity 151 , that is, at least a portion of the heating module is located on the air outlet path of the fan 510 .
[0117] Exemplarily, the heat dissipation module 500 may further include a heat balancing unit, which may be connected to the heating module, and the fan 510 may be used to drive the air at the heat balancing unit to flow out of the first mounting sub-cavity 151, that is, at least part of the heat balancing unit is located on the air outlet path of the fan 510, and the heating module may not be located on the air outlet path of the fan 510. In this way, the heat dissipation efficiency of the heating module can be higher. In addition, it is also convenient to dissipate heat for the device arranged in the second mounting sub-cavity 152.
[0118] Exemplarily, the heat-sinking unit may include one or more of a vapor chamber (VC) plate, a heat pipe, and the like.
[0119] Exemplarily, the heat dissipation module 500 may further include a heat sink, which is connected to the heat absorbing unit, and the fan 510 may be used to drive the air at the heat sink to flow out of the first mounting sub-cavity 151, that is, the heat sink is located on the air outlet path of the fan 510. In this way, the heat dissipation efficiency of the heat dissipation module can be further improved.
[0120] In some examples, when the foldable device is in the folded state, there is a gap 600 between the end of the second housing assembly 200 away from the hinge mechanism 300 and the third side wall 113, and the heat dissipation hole 140 provided on the third side wall 113 is connected to the external space through the gap 600. In this way, when the foldable device is in the folded state, air can enter and exit the first mounting sub-cavity 151 through the gap 600 between the end of the second housing assembly 200 away from the hinge mechanism 300 and the third side wall 113, which is beneficial to the heat dissipation of the foldable device when it is in the folded state.
[0121] Exemplarily, when the foldable device is in the folded state, the orthographic projection of the third side wall 113 along the thickness direction of the first housing assembly 100 does not overlap with the orthographic projection of the second housing assembly 200 along the thickness direction of the first housing assembly 100. That is, when the foldable device is in the folded state, the third side wall 111 is not covered by the second housing assembly 200 in the thickness direction of the first housing assembly 100. In this way, when the foldable device is in the folded state, it is convenient for air to enter and exit the first mounting sub-cavity 151 through the gap 600 between the end of the second housing assembly 200 away from the hinge mechanism 300 and the third side wall 113.
[0122] Fig.15 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0123] like Fig.15 As shown, and see Fig.13 , Fig.14 In the embodiment of the present application, the heat dissipation hole 140 includes an air inlet hole 141 and an air outlet hole 142, and the portion of the first housing assembly 100 opposite to the air outlet end of the fan 510 has the air outlet hole 142. In this way, the backflow of air in the first mounting sub-cavity 151 can be reduced, which is conducive to the fan 510 driving the air to efficiently discharge the first mounting sub-cavity 151 through the air outlet hole 142, so that the heat dissipation efficiency of the heat generating module is higher.
[0124] In some examples, the heat dissipation holes 140 are all disposed on the third side wall 113. That is, all the air inlet holes 141 and all the air outlet holes 142 are disposed on the third side wall 113. In this way, when the foldable device is in the folded state, the second housing assembly 200 can cover all the heat dissipation holes 140, so that none of the heat dissipation holes 140 are exposed.
[0125] In the embodiment where the heat dissipation holes 140 are all arranged on the third side wall 113, the third side wall 113 may include a first air inlet area and a first air outlet area distributed along the axial direction of the rotating shaft mechanism 300, the fan 510 is arranged at one end of the first installation sub-cavity 151 in the axial direction of the rotating shaft, the air outlet end of the fan 510 is opposite to the first air outlet area, the air inlet hole 141 is arranged in the first air inlet area, and the air outlet hole 142 is arranged in the first air outlet area. In this way, when the heat dissipation holes 140 are all arranged on the third side wall 113, the amount of air flowing out of the air outlet hole 142 flowing back into the first installation sub-cavity 151 through the air inlet hole 141 is small, which can reduce the mutual influence between the air inlet and the air outlet, so that the heat dissipation efficiency of the heat dissipation module is higher.
[0126] Fig.16 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0127] like Fig.16As shown, in some examples, the heat dissipation module 500 includes a plurality of fans 510. This helps to improve the heat dissipation efficiency of the heat dissipation module.
[0128] Exemplarily, the heat dissipation module 500 includes two fans 510, and the two fans 510 are respectively arranged at the two ends of the first mounting subcavity 151 in the axial direction of the rotating shaft mechanism 300. When the heat dissipation holes 140 are all arranged on the third side wall 113, the third side wall 113 may include a second air outlet area, a second air inlet area, and a third air outlet area distributed along the axial direction of the rotating shaft mechanism 300. In the axial direction of the rotating shaft mechanism 300, the second air inlet area is located between the second air outlet area and the third air outlet area, the air outlet end of one fan 510 is opposite to the second air outlet area, and the air outlet end of the other fan 510 is opposite to the third air outlet area, the second air outlet area and the third air outlet area both have air outlet holes 142, and the second air inlet area has an air inlet hole 141. In this way, when the heat dissipation holes 140 are all arranged on the third side wall 113, the amount of air flowing out of the air outlet hole 142 and flowing back into the first installation sub-cavity 151 through the air inlet hole 141 is small, which can reduce the mutual influence between the air inlet and the air outlet, so that the heat dissipation efficiency of the heat generating module is higher.
[0129] Fig.17 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0130] like Fig.17 As shown, in some examples, the air inlet 141 and the air outlet 142 are arranged on different side walls of the first housing assembly 100. In this way, the air discharged from the air outlet 142 is not easy to flow back into the first mounting sub-cavity 151 through the air inlet 141, which is conducive to improving the heat dissipation efficiency of the heat generating module.
[0131] In the example where the air inlet 141 and the air outlet 142 are provided on different side walls of the first housing assembly 100, the heat dissipation hole 140 provided on the third side wall 113 is the air inlet 141, and at least one of the first side wall 111, the first surrounding wall structure 130, and the second side wall structure 120 has an air outlet 142. In this way, when the foldable device is in the folded state, the air flowing out of the first mounting sub-cavity 151 through the air outlet 142 will not flow back due to the obstruction of the second housing assembly 200, so that the air flows smoothly between the first mounting sub-cavity 151 and the outside.
[0132] In the example where the air inlet 141 and the air outlet 142 are disposed on different side walls of the first housing assembly 100 , at least one of the first region 1311 , the second region 1321 , and the sixth side wall 133 has the air outlet 142 .
[0133] In this way, the first area 1311, the second area 1321 and the sixth side wall 133 have larger dimensions in the thickness direction of the first housing assembly 100, and the air outlet holes 142 that can be opened have larger dimensions in the thickness direction of the first housing assembly 100. When the maximum air volume that needs to enter and exit the first installation sub-cavity 151 is constant, the number of air outlet holes 142 can be reduced. When the number of air outlet holes 142 is constant, it is beneficial to increase the air volume allowed to enter and exit the first installation sub-cavity 151. In addition, compared with the air inlet holes 141 opened on the first side wall 111 and the second side wall structure 120, the air inlet holes 141 opened on the first area 1311, the second area 1321 and the sixth side wall 133 have less impact on user use and device layout.
[0134] Exemplarily, the first area 1311 and the second area 1321 have air outlet holes 142, and external air flows into the first installation sub-cavity 151 through the air inlet holes 141 on the third side wall 113, and the air in the first installation sub-cavity 151 flows out to the outside through the air outlet holes 142 on the first area 1311 and the second area 1321.
[0135] Fig.18 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0136] like Fig.18 As shown, in some examples, the sixth side wall 133 has an air outlet 142, and external air flows into the first installation sub-cavity 151 through the air inlet 141 on the third side wall 113, and the air in the first installation sub-cavity 151 flows out to the outside through the air outlet 142 on the sixth side wall 133.
[0137] Fig.19 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0138] like Fig.19 As shown, in some examples, at least one of the first side wall 111, the first surrounding wall structure 130, and the second side wall structure 120 has an air inlet hole 141. In this way, when the foldable device is in the folded state, part of the air inlet hole 141 is not blocked by the second shell assembly 200, and external air can enter the first mounting sub-cavity 151 through the air inlet hole 141 that is not blocked by the second shell assembly 200, which is beneficial to the heat dissipation of the foldable device when it is in the folded state.
[0139] Exemplarily, at least one of the first area 1311, the second area 1321 and the sixth side wall 133 has an air inlet hole 141. In this way, the first area 1311, the second area 1321 and the sixth side wall 133 have larger dimensions in the thickness direction of the first shell assembly 100, and the air inlet holes 141 that can be opened have larger dimensions in the thickness direction of the first shell assembly 100. When the maximum amount of air that needs to enter and exit the first installation sub-cavity 151 is constant, the number of air inlet holes 141 can be reduced. When the number of air inlet holes 141 is constant, it is beneficial to increase the amount of air allowed to enter and exit the first installation sub-cavity 151. In addition, compared with the air inlet holes 141 opened on the first side wall 111 and the second side wall structure 120, the air inlet holes 141 opened on the first area 1311, the second area 1321 and the sixth side wall 133 have less impact on user use and device layout.
[0140] Exemplarily, the first area 1311 and the second area 1321 have an air inlet hole 141, and the sixth side wall 133 has an air outlet hole 142. External air can enter the first installation sub-cavity 151 through the air inlet hole 141 on the third side wall 113, the first area 1311, and the second area 1321, and the air in the first installation sub-cavity 151 can flow out to the outside through the air outlet hole 142 on the sixth side wall 133.
[0141] Fig. 20 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0142] like Fig. 20 As shown, exemplarily, the first area 1311 and the second area 1321 have air outlet holes 142, and the sixth side wall 133 has air inlet holes 141, and external air can enter the first installation sub-cavity 151 through the air inlet holes 141 on the third side wall 113 and the sixth side wall 133, and the air in the first installation sub-cavity 151 can flow out to the outside through the air outlet holes 142 on the first area 1311 and the second area 1321.
[0143] Fig.21 A schematic diagram of a first shell assembly of another foldable device provided in an embodiment of the present application.
[0144] like Fig.21 As shown, in some examples, the first side wall 111 has an air inlet hole 141, and at least one of the first area 1311, the second area 1321 and the sixth side wall 133 has an air outlet hole 142. External air can enter the first installation sub-cavity 151 through the air inlet hole 141 on the first side wall 111 and the third side wall 113, and the air in the first installation sub-cavity 151 can flow out to the outside through the air outlet hole 142 on at least one of the first area 1311, the second area 1321 and the sixth side wall 133.
[0145] Fig. 22 A flowchart of a control method for a foldable device provided in an embodiment of the present application.
[0146] like Fig. 22 As shown, based on the foldable device in any of the above embodiments, an embodiment of the present application further provides a control method for the foldable device, which can be executed by the foldable device or other electronic devices, and the method includes:
[0147] S100: Acquire an opening and closing state of a foldable device, wherein the opening and closing state includes a folded state and an unfolded state.
[0148] In some examples, the opening and closing state of the foldable device can be obtained by using a Hall sensor and a magnetic member respectively installed on the first housing assembly 100 and the second housing assembly 200. When the magnetic field strength obtained by the Hall sensor is greater than or equal to the preset magnetic field strength, it can be determined that the foldable device is in the folded state, and when the magnetic field strength obtained by the Hall sensor is less than the preset magnetic field strength, it can be determined that the foldable device is in the unfolded state.
[0149] In other examples, the opening and closing state of the foldable device can be obtained by using a pressure sensor installed on the first shell assembly 100 or the second shell assembly 200. When the foldable device is in the folded state, the pressure sensor is squeezed by the first shell assembly 100 and the second shell assembly 200, and a squeezed signal is generated, so it can be determined that the foldable device is in the folded state. When the foldable device is in the unfolded state, the pressure sensor is not squeezed and does not generate a signal, so it can be determined that the foldable device is in the unfolded state.
[0150] S200: If the foldable device is in the folded state, the foldable device is controlled to operate in a low power consumption state, and the foldable device is restricted from switching from the low power consumption state to the high power consumption state, and the heat dissipation module 500 is controlled to dissipate heat in the low power consumption mode.
[0151] In this way, the foldable device can be kept running in a low power consumption state when in the folded state, so as to reduce the risk of device damage due to insufficient heat dissipation. In addition, when the foldable device is running in a low power consumption state, the heat generation module generates less heat, and the heat dissipation module 500 performs heat dissipation in a low power consumption mode, which can reduce the noise and energy consumption of the foldable device, and is conducive to extending the battery life of the foldable device.
[0152] It should be noted that the high power consumption state and the low power consumption state can be set according to the heat dissipation capability of the heat dissipation module 500 when it is in the low power consumption state. When the power consumption of the foldable device is greater than or equal to the first preset power consumption, the foldable device is in the high power consumption state. When the power consumption of the foldable device is less than or equal to the first preset power consumption, the foldable device is in the low power consumption state. The heat dissipation module 500 performs heat dissipation in the low power consumption mode to meet the heat dissipation requirements of the foldable device when it is in the low power consumption state.
[0153] In some examples, when the heat dissipation module 500 performs heat dissipation in a low power consumption mode, the heat dissipation module 500 is in a closed state, and the heating module performs heat dissipation by natural heat dissipation.
[0154] In other examples, when the heat dissipation module 500 is configured in a low power consumption mode for heat dissipation, the heat dissipation module 500 operates in a low power state.
[0155] In the example where the heat dissipation module 500 includes a fan 510, when the heat dissipation module 500 is in a low power mode, the fan 510 is in an off state or a low power state. When the fan 510 is in a low power state, air can enter and exit the first mounting sub-cavity 151 with a small air volume through the heat dissipation holes 140.
[0156] For example, when the fan 510 is an axial flow fan, the rotation speed of the fan 510 when it is in a low power state is lower than the rotation speed of the fan 510 when it is in a high power state.
[0157] For another example, when the fan 510 is a piezoelectric fan, the vibration frequency of the fan 510 when it is in a low power state is lower than the vibration frequency of the fan 510 when it is in a high power state.
[0158] In some examples, step S200 may specifically include:
[0159] S210: restricting the operation of high-power-consumption programs of the foldable device, that is, when the foldable device is in the folded state, the high-power-consumption programs of the foldable device cannot be switched from a stopped state to a running state.
[0160] In this way, it is easy to implement the restriction of the foldable device from a low power consumption state to a high power consumption state.
[0161] It should be noted that the high-power program can be set according to the heat dissipation capacity of the heat dissipation module 500 when it is in a low-power state. When the power consumption of the program is greater than or equal to the second preset power consumption, the program is a high-power program, and the second preset power consumption can be greater than or equal to the first preset power consumption. When the power consumption of the program is less than the third preset power consumption, the program is a low-power program, and the third preset power consumption is less than the first preset power consumption. The total power consumption of all low-power programs of the foldable device is less than the first preset power consumption, that is, when all low-power programs and high-power programs of the foldable device are not running, the foldable device is in a low-power state.
[0162] In some examples, step S200 specifically includes:
[0163] S220: Obtain a program that runs when the foldable device is in a folded state.
[0164] S230: If the acquired programs running when the foldable device is in the folded state include high power consumption programs, the running of the high power consumption programs is stopped.
[0165] In this way, after the foldable device is switched to the folded state, the foldable device in the high power consumption state can be automatically switched to the low power consumption state.
[0166] In some examples, the method further includes:
[0167] S300: If the foldable device is in the unfolded state, the restriction on the foldable device switching from the low power consumption state to the high power consumption state is lifted, and the operating state of the foldable device is obtained, wherein the operating state includes the low power consumption state and the high power consumption state.
[0168] In this way, the foldable device can be used normally after being unfolded. In addition, after obtaining the operating state of the foldable device in the unfolded state, it is convenient to adjust the working mode of the heat dissipation module 500 according to the operating state of the foldable device in the unfolded state, which is conducive to making the heat dissipation module 500 operate more efficiently.
[0169] In some examples, removing the restriction on the foldable device switching from a low power consumption state to a high power consumption state in step S300 specifically includes:
[0170] S310: Removing the restriction on the running of the high-power-consumption program of the foldable device. That is, after the foldable device is in the unfolded state, the high-power-consumption program of the foldable device can be switched from the stopped running state to the running state.
[0171] In this way, various programs can be run normally after the foldable device is unfolded, so that the foldable device can be used normally.
[0172] In some examples, obtaining the operating status of the foldable device in step S300 specifically includes:
[0173] S320: Obtain a program that runs when the foldable device is in the unfolded state.
[0174] S330: If the acquired programs running when the foldable device is in the unfolded state include high power consumption programs, the foldable device is in a high power consumption state.
[0175] In this way, the operating state of the foldable device can be determined by the program running when the foldable device is in the unfolded state.
[0176] S400: If the foldable device is in the unfolded state and the foldable device is in the high power consumption state, the heat dissipation module 500 is controlled to switch from the low power consumption mode to the high power consumption mode for heat dissipation.
[0177] In this way, when the foldable device is running in a low power consumption state, the heat generation module generates more heat. The heat dissipation module 500 performs heat dissipation in a high power consumption mode to improve the heat dissipation efficiency of the heat generation module, so that the foldable device can operate with high performance.
[0178] In some examples, step S400 specifically includes: controlling the fan 510 to switch from an off state to an on state, or controlling the fan 510 to switch from a low power state to a high power state, so as to increase the air volume entering and exiting the first mounting sub-cavity 151 through the heat dissipation holes 140 .
[0179] In this way, by increasing the air volume entering and exiting the first mounting sub-cavity 151 through the heat dissipation holes 140, the heat dissipation capacity of the foldable device is improved, so that the foldable device can operate with high performance.
[0180] S500: If the foldable device is in the unfolded state and the foldable device is in the low power consumption state, the heat dissipation module 500 is controlled to dissipate heat in the low power consumption mode.
[0181] In this way, when the foldable device is running in a low power consumption state, the heat generated by the heating module is less, and the heat dissipation module 500 performs heat dissipation in a low power consumption mode to reduce the noise and energy consumption of the foldable device, which is beneficial to extending the battery life of the foldable device.
[0182] Fig.23 A schematic diagram of another electronic device provided in an embodiment of the present application.
[0183] like Fig.23As shown, the present application provides an electronic device on another aspect, which includes a processor 710 and a memory 720. The memory 720 stores computer-executable instructions, and the processor 710 executes the computer-executable instructions stored in the memory 720, so that the processor 710 executes the control method of the foldable device in any of the above embodiments.
[0184] It should be understood that the processor 710 in the embodiment of the present application can be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method embodiment can be completed by the hardware integrated logic circuit or software instructions in the processor 710. The above-mentioned processor 710 can be a general-purpose processor, a digital signal processor (digital signal processor, DSP), an application specific integrated circuit (application specific integrated circuit, ASIC), a field programmable gate array (field programmable gate array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general-purpose processor can be a microprocessor. Alternatively, the processor 710 can also be any conventional processor, etc. The steps of the method disclosed in the embodiment of the present application can be directly embodied as a hardware decoding processor to be executed, or the hardware and software modules in the decoding processor can be combined and executed.
[0185] It should also be understood that the memory 720 in the embodiment of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM) and direct RAM bus RAM (DR RAM). It should be noted that the memory 720 in the embodiments of the present application is intended to include but is not limited to these and any other suitable types of memory.
[0186] The foldable device may also include a communication interface 730 for communicating with other devices via a transmission medium, thereby enabling the foldable device to communicate with other devices. The communication interface 730 may be, for example, a transceiver, an interface, a bus, a circuit, or a device capable of implementing transceiver functions. The processor 710 may use the communication interface 730 to send and receive data and / or information.
[0187] The specific connection medium between the processor 710, the memory 720 and the communication interface 730 is not limited in the embodiments of the present application. In some examples, the processor 710, the memory 720 and the communication interface 730 are connected via a bus 740. The bus 740 can be divided into an address bus, a data bus, a control bus, etc.
[0188] The method steps in the embodiments of the present application can be implemented by hardware, or by a processor executing software instructions. The software instructions can be composed of corresponding software modules, and the software modules can be stored in a random access memory, a flash memory, a read-only memory, a programmable read-only memory, an erasable programmable read-only memory, an electrically erasable programmable read-only memory, a register, a hard disk, a mobile hard disk, a CD-ROM, or any other form of storage medium well known in the art. An exemplary storage medium is coupled to the processor so that the processor can read information from the storage medium and can write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can be located in an ASIC. In addition, the ASIC can be located in a network device or a terminal device. Of course, the processor and the storage medium can also be present in a network device or a terminal device as discrete components.
[0189] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer executable instructions. When the computer executable instructions are loaded and executed on the computer, the process or function of the method in the embodiment of the present application is executed in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a network device, a user device or other programmable device. The computer executable instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer executable instructions can be transmitted from one website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, etc.) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, a hard disk, a tape; it can also be an optical medium, such as a digital video disc; it can also be a semiconductor medium, such as a solid-state hard disk.
[0190] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0191] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A foldable device, characterized in that: It includes a first housing component, a second housing component, a rotating shaft mechanism and a heat dissipation module; The first housing component and the second housing component are rotatably connected via the rotating shaft mechanism; The first shell component comprises a first side wall structure and a second side wall structure, wherein the first side wall structure and the second side wall structure are respectively located on two sides of the first shell component in a thickness direction; The first side wall structure comprises a first side wall, a second side wall and a third side wall, the first side wall and the second side wall are both arranged opposite to the second side wall structure, the first side wall protrudes from the second side wall in a direction away from the second side wall structure, the distance between the first side wall and the second side wall structure is greater than the distance between the second side wall and the second side wall structure, and one end of the first side wall facing the rotating shaft mechanism is connected to one end of the second side wall facing away from the rotating shaft mechanism through the third side wall; The heat dissipation module is installed in the installation sub-cavity between the first side wall and the second side wall structure; During the process of switching the foldable device from the unfolded state to the folded state, the second housing component rotates toward the second side wall; When the foldable device is in the folded state, the orthographic projection of the second side wall along the thickness direction of the first shell component at least partially overlaps with the orthographic projection of the second shell component along the thickness direction of the first shell component, and the orthographic projection of the first side wall along the thickness direction of the first shell component does not overlap with the orthographic projection of the second shell component along the thickness direction of the first shell component.
2. The foldable device according to claim 1, characterized in that: The heat dissipation module comprises a fan, and the fan is installed in the installation sub-cavity; The first housing component has heat dissipation holes, at least part of which are located on the third side wall, and the fan is used to drive air to enter and exit the mounting sub-cavity through the heat dissipation holes.
3. The foldable device according to claim 2, characterized in that: The heat dissipation holes are all arranged on the third side wall.
4. The foldable device according to claim 2, characterized in that: The heat dissipation holes include an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are arranged on different side walls of the first shell component.
5. The foldable device according to claim 4, characterized in that: The first shell component further includes a surrounding wall structure, and two ends of the surrounding wall structure in the thickness direction of the first shell component are respectively connected to the first side wall structure and the second side wall structure; The heat dissipation hole provided on the third side wall is the air inlet hole, and at least one of the first side wall, the surrounding wall structure and the second side wall structure has the air outlet hole.
6. The foldable device according to claim 5, characterized in that: The surrounding wall structure includes a fourth side wall, a fifth side wall and a sixth side wall; The first side wall structure is connected to the second side wall structure at one end in the axial direction of the rotating shaft mechanism through the fourth side wall, the first side wall structure is connected to the second side wall structure at the other end in the axial direction of the rotating shaft mechanism through the fifth side wall, and the end of the first side wall facing away from the rotating shaft mechanism is connected to the end of the second side wall structure facing away from the rotating shaft mechanism through the sixth side wall; The fourth sidewall includes a first region connecting the first sidewall and the second sidewall structure, and the fifth sidewall includes a second region connecting the first sidewall and the second sidewall structure; At least one of the first area, the second area and the sixth side wall has the air outlet hole.
7. The foldable device according to claim 5 or 6, characterized in that: At least one of the first side wall, the surrounding wall structure and the second side wall structure has the air inlet hole.
8. The foldable device according to any one of claims 2 to 7, characterized in that: When the foldable device is in the folded state, a gap is provided between an end of the second shell component away from the hinge mechanism and the third side wall, and the heat dissipation hole provided on the third side wall is connected with the external space through the gap.
9. The foldable device according to any one of claims 1 to 8, characterized in that: Also includes sensors and controllers; The sensor is electrically connected to the controller, and the controller is electrically connected to the heat dissipation module; The sensor is used to detect the opening and closing state of the foldable device, and the controller is used to control the heat dissipation module according to the opening and closing state of the foldable device detected by the sensor; The opening and closing state includes the unfolding state and the folding state.
10. A control method for a foldable device, characterized in that: The foldable device comprises a first shell component, a second shell component, a rotating shaft mechanism and a heat dissipation module; the first shell component and the second shell component are rotatably connected through the rotating shaft mechanism; the first shell component comprises a first side wall structure and a second side wall structure, the first side wall structure and the second side wall structure are respectively located on both sides of the thickness direction of the first shell component; the first side wall structure comprises a first side wall, a second side wall and a third side wall, the first side wall and the second side wall are both arranged opposite to the second side wall structure, the first side wall protrudes from the second side wall in a direction away from the second side wall structure, the spacing between the first side wall and the second side wall structure is greater than the spacing between the second side wall and the second side wall structure, and an end of the second side wall facing away from the rotating shaft mechanism is connected to an end of the first side wall facing the rotating shaft mechanism through the third side wall; the heat dissipation module is installed in the installation subcavity between the first side wall and the second side wall structure; during the switching of the foldable device from the unfolded state to the folded state, the second shell component rotates in the direction of the second side wall; When the foldable device is in the folded state, an orthographic projection of the second side wall along the thickness direction of the first shell component at least partially overlaps with an orthographic projection of the second shell component along the thickness direction of the first shell component, and an orthographic projection of the first side wall along the thickness direction of the first shell component does not overlap with an orthographic projection of the second shell component along the thickness direction of the first shell component; The method comprises: If the foldable device is in the folded state, the foldable device is controlled to operate in a low power consumption state, and the foldable device is restricted from switching from the low power consumption state to a high power consumption state, and the heat dissipation module is controlled to dissipate heat in a low power consumption mode.
11. The method according to claim 10, characterized in that The controlling the foldable device to operate in a low power consumption state and limiting the foldable device from switching from the low power consumption state to a high power consumption state specifically includes: The operation of high power consumption programs of the foldable device is restricted.
12. The method according to claim 10 or 11, characterized in that: If the foldable device is in the unfolded state, lifting the restriction on the foldable device switching from the low power consumption state to the high power consumption state, and acquiring the operating state of the foldable device, wherein the operating state includes the low power consumption state and the high power consumption state; If the foldable device is in the high power consumption state, the heat dissipation module is controlled to switch from the low power consumption mode to the high power consumption mode for heat dissipation.
13. The method according to claim 12, characterized in that The lifting of the restriction on the foldable device switching from the low power consumption state to the high power consumption state specifically includes: Remove restrictions on the execution of high-power consumption programs on the foldable device.
14. The method according to claim 12 or 13, characterized in that The obtaining the operating status of the foldable device specifically includes: Obtaining a program running on the foldable device; If the acquired program running by the foldable device includes a high power consumption program, the foldable device is in the high power consumption state.
15. The method according to any one of claims 12 to 14, characterized in that: The heat dissipation module includes a fan, which is installed in the installation sub-cavity; the first housing component has heat dissipation holes, at least part of which is located on the third side wall, and the fan is used to drive air to enter and exit the installation sub-cavity through the heat dissipation holes; The controlling the heat dissipation module to switch from the low power consumption mode to the high power consumption mode for heat dissipation specifically includes: The fan is controlled to switch from an off state to an on state, or the fan is controlled to switch from a low power state to a high power state.
16. The method according to any one of claims 12 to 15, characterized in that: If the foldable device is in the unfolded state and the foldable device is in the low power consumption state, the heat dissipation module is controlled to dissipate heat in the low power consumption mode.
17. An electronic device, characterized in that: including a processor and a memory; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory, so that the processor executes the control method of the foldable device according to any one of claims 10 to 16.
18. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions. When the processor executes the computer-executable instructions, the control method of the foldable device according to any one of claims 10 to 16 is implemented.
19. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the control method of the foldable device according to any one of claims 10 to 16 is implemented.
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