Foldable devices and their control methods, equipment, media and procedures

Abstract

This application provides a foldable device and its control method, apparatus, medium, and program product, relating to the field of terminal product technology. The foldable device includes a heat dissipation module and a first housing assembly and a second housing assembly rotatably connected via a pivot mechanism. The first housing assembly has an unequal thickness design; the thicker portion of the first housing assembly is used to install the heat dissipation module, and when the foldable device is in a folded state, the thinner portion of the first housing assembly overlaps with the second housing assembly. This allows the foldable device with the heat dissipation module to be relatively thin after folding, thus balancing the requirements of efficient heat dissipation and a slim profile.

Description

Technical Field

[0001] This application relates to the field of terminal product technology, and in particular to a foldable device and its control method, device, medium and program product. Background Technology

[0002] With the development of smartphones, tablets, and other electronic devices, the screen size of these devices is increasing to improve user experience. However, a large screen size leads to a larger overall size, making these devices inconvenient to carry. To make these larger devices more portable, foldable devices with flexible displays, such as foldable phones and foldable computers, have emerged. Foldable devices can be folded and unfolded. When folded, they are small and easy to carry; when unfolded, they have a large screen, resulting in a better user experience.

[0003] In related technologies, foldable devices may include a pivot mechanism and two housing assemblies rotatably connected via the pivot mechanism. At least one housing assembly houses a heating module. As the performance of foldable devices increases, the heat generated by the heating module also increases. To improve the heat dissipation efficiency of the heating module, at least one housing assembly also houses a heat dissipation module for cooling the heating module. However, in related technologies, foldable devices with heat dissipation modules are relatively thick when folded. Summary of the Invention

[0004] This application provides a foldable device and its control method, device, medium, and program product. By designing a housing component for installing a heat dissipation module with unequal thickness, the heat dissipation module is installed in the thicker part of the housing component. When the foldable device is in a folded state, the thinner part of the housing component is used to overlap with another housing component. This allows the foldable device with the heat dissipation module to be thinner after folding, thus meeting the requirements of efficient heat dissipation and thinness of the foldable device.

[0005] This application provides a foldable device, including a first housing assembly, a second housing assembly, a pivot mechanism, and a heat dissipation module. The first housing assembly and the second housing assembly are rotatably connected via the pivot mechanism. The first housing assembly includes a first sidewall structure and a second sidewall structure, which are located on opposite sides of the thickness direction of the first housing assembly. The first sidewall structure includes a first sidewall, a second sidewall, and a third sidewall. Both the first and second sidewalls are disposed opposite to the second sidewall structure. The first sidewall protrudes from the second sidewall structure in a direction away from it. The distance between the first and second sidewall structures is greater than the distance between the two second sidewall structures. The end of the first sidewall facing the pivot mechanism is connected to the end of the second sidewall facing away from the pivot mechanism via the third sidewall. The heat dissipation module is installed in a mounting cavity between the first and second sidewall structures. During the process of switching the foldable device from an unfolded state to a folded state, the second housing assembly rotates towards the second sidewall. When the foldable device is in a folded state, the orthographic projection of the second sidewall along the thickness direction of the first housing assembly at least partially overlaps with the orthographic projection of the second housing assembly along the thickness direction of the first housing assembly, while the orthographic projection of the first sidewall along the thickness direction of the first housing assembly does not overlap with the orthographic projection of the second housing assembly along the thickness direction of the first housing assembly.

[0006] In the foldable device of this application embodiment, the first housing assembly has an unequal thickness design at the first and second sidewalls. The heat dissipation module is installed on the thicker first sidewall of the first housing assembly, which makes the portion of the first housing assembly where the heat dissipation module is installed relatively thin. Furthermore, when the foldable device is in a folded state, the thicker portion of the first housing assembly used to install the heat dissipation module does not overlap with the second housing assembly, while the thinner second sidewall of the first housing assembly overlaps with the second housing assembly. This allows the foldable device with the heat dissipation module to be relatively thin after folding, thus balancing the requirements of efficient heat dissipation and a thinner profile for the foldable device.

[0007] In one possible implementation, the heat dissipation module includes a fan mounted within the mounting sub-cavity. A first housing assembly has heat dissipation holes, at least partially located on a third sidewall, and the fan is used to drive air through these holes into and out of the mounting sub-cavity.

[0008] In one possible implementation, the heat dissipation holes are all located on the third side wall.

[0009] In one possible implementation, the heat dissipation holes include air inlets and air outlets, which are located on different sidewalls of the first housing assembly.

[0010] In one possible implementation, the first housing assembly further includes a surrounding wall structure, which is connected to a first side wall structure and a second side wall structure at both ends in the thickness direction of the first housing assembly, respectively. A heat dissipation hole on the third side wall serves as an air inlet, and at least one of the first side wall, the surrounding wall structure, and the second side wall structure has an air outlet.

[0011] In one possible implementation, the enclosure structure includes a fourth sidewall, a fifth sidewall, and a sixth sidewall. One end of the first sidewall structure is connected axially to one end of the second sidewall structure via the fourth sidewall at one axial end of the rotating shaft mechanism. The other end of the first sidewall structure is connected axially to the other end of the second sidewall structure via the fifth sidewall at the same axial direction. The end of the first sidewall facing away from the rotating shaft mechanism is connected to the end of the second sidewall structure facing away from the rotating shaft mechanism via the sixth sidewall. The fourth sidewall includes a first region connecting the first and second sidewall structures, and the fifth sidewall includes a second region connecting the first and second sidewall structures. At least one of the first region, the second region, and the sixth sidewall has an air outlet.

[0012] In one possible implementation, at least one of the first sidewall, the enclosure structure, and the second sidewall structure has an air inlet.

[0013] In one possible implementation, when the foldable device is in a folded state, there is a gap between the end of the second housing assembly away from the pivot mechanism and the third sidewall, and the heat dissipation holes provided on the third sidewall communicate with the external space through the gap.

[0014] In one possible implementation, the foldable device further includes a sensor and a controller. The sensor is electrically connected to the controller, and the controller is electrically connected to the heat dissipation module. The sensor is used to detect the open / closed state of the foldable device, and the controller is used to control the heat dissipation module based on the open / closed state detected by the sensor. The open / closed state includes an unfolded state and a folded state.

[0015] This application also provides a control method for a foldable device, applicable to the foldable device in any of the above embodiments. The method can be executed by the foldable device. The method includes: if the foldable device is in a folded state, controlling the foldable device to operate in a low-power state, restricting the foldable device from transitioning from a low-power state to a high-power state, and controlling the heat dissipation module to dissipate heat in a low-power mode.

[0016] In one possible implementation, the foldable device is controlled to operate in a low-power state, and the transition of the foldable device from a low-power state to a high-power state is restricted, specifically including: restricting the execution of high-power programs on the foldable device.

[0017] In one possible implementation, if the foldable device is in the unfolded state, the restriction on the foldable device to switch from a low-power state to a high-power state is lifted, and the operating state of the foldable device is obtained, wherein the operating state includes a low-power state and a high-power state; if the foldable device is in a high-power state, the heat dissipation module is controlled to switch from a low-power mode to a high-power mode for heat dissipation.

[0018] In one possible implementation, the restriction on the transition of the foldable device from a low-power state to a high-power state is lifted, specifically including: lifting the restriction on the execution of high-power programs on the foldable device.

[0019] In one possible implementation, obtaining the operating state of the foldable device specifically includes: obtaining the program running on the foldable device; if the obtained program running on the foldable device includes a high-power program, then the foldable device is in a high-power state.

[0020] In one possible implementation, the heat dissipation module is controlled to switch from a low-power mode to a high-power mode for heat dissipation. Specifically, this includes controlling the fan to switch from a closed state to an open state, or controlling the fan to switch from a low-power state to a high-power state, so as to increase the airflow into and out of the mounting cavity through the heat dissipation holes.

[0021] In one possible implementation, if the foldable device is in an unfolded state and in a low-power state, the heat dissipation module is controlled to dissipate heat in a low-power mode.

[0022] This application further provides an electronic device including a processor and a memory. The memory stores computer-executable instructions, and the processor executes the computer-executable instructions stored in the memory, causing the processor to perform the control method of the foldable device in any of the above embodiments.

[0023] In another aspect, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the control method of the foldable device in any of the above embodiments.

[0024] In another aspect, this application provides a computer program product, which, when executed by a processor, implements the control method for the foldable device in any of the above embodiments. Attached Figure Description

[0025] Figure 1 A schematic diagram of a foldable device in a folded state, provided as an embodiment of this application;

[0026] Figure 2 for Figure 1 A schematic diagram of the foldable device in a partially unfolded state;

[0027] Figure 3 for Figure 1 A schematic diagram of the foldable device in its fully unfolded state;

[0028] Figure 4 A schematic diagram of another foldable device provided in an embodiment of this application in a folded state;

[0029] Figure 5 for Figure 4 A schematic diagram of the foldable device in a partially unfolded state;

[0030] Figure 6 for Figure 4 A schematic diagram of the foldable device in its fully unfolded state;

[0031] Figure 7 A schematic diagram of another foldable device provided in the embodiments of this application in its fully unfolded state;

[0032] Figure 8 for Figure 7 A schematic diagram of a foldable device in a folded state;

[0033] Figure 9 A schematic diagram of a first housing assembly, a pivot mechanism, and a second housing assembly in a folded state, provided for an embodiment of this application;

[0034] Figure 10 A schematic diagram of a first housing assembly, a pivot mechanism, and a second housing assembly in the fully unfolded state of another foldable device provided in this application embodiment;

[0035] Figure 11 A schematic diagram of the fourth sidewall of another foldable device provided in an embodiment of this application;

[0036] Figure 12 A schematic diagram of the fifth sidewall of another foldable device provided in an embodiment of this application;

[0037] Figure 13 A schematic diagram of another foldable device provided in the embodiments of this application in its fully unfolded state;

[0038] Figure 14 for Figure 13 A schematic diagram of a foldable device in a folded state;

[0039] Figure 15 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0040] Figure 16A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0041] Figure 17 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0042] Figure 18 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0043] Figure 19 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0044] Figure 20 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0045] Figure 21 A schematic diagram of a first housing assembly of another foldable device provided in an embodiment of this application;

[0046] Figure 22 A flowchart illustrating a control method for a foldable device provided in this application embodiment;

[0047] Figure 23 This is a schematic diagram of another foldable device provided in an embodiment of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 100. First housing assembly;

[0050] 110. First sidewall structure; 111. First sidewall; 112. Second sidewall; 113. Third sidewall;

[0051] 120. Second sidewall structure;

[0052] 130. First enclosure structure; 131. Fourth side wall; 1311. First area; 1312. Third area; 132. Fifth side wall; 1321. Second area; 1322. Fourth area; 133. Sixth side wall; 134. Seventh side wall;

[0053] 140. Heat dissipation vent; 141. Air inlet vent; 142. Air outlet vent;

[0054] 150. Mounting cavity; 151. First mounting sub-cavity; 152. Second mounting sub-cavity;

[0055] 200. Second housing assembly;

[0056] 210. Third sidewall structure;

[0057] 220. Fourth sidewall structure;

[0058] 230. Second enclosure structure;

[0059] 300. Rotating shaft mechanism;

[0060] 400. Flexible display screen; 410. First connecting area; 420. Second connecting area; 430. Bendable area;

[0061] 500. Heat dissipation module; 510. Fan;

[0062] 600, gap;

[0063] 710. Processor; 720. Memory; 730. Communication interface; 740. Bus. Detailed Implementation

[0064] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0065] This application provides a foldable device with folded and unfolded states. This foldable device can change its shape by folding and unfolding to meet the needs of users in different scenarios. For example, it can be folded to reduce its size when carried, and unfolded to increase the area of ​​the display screen used for display or operation when in use. It should be noted that the foldable device can also be referred to as user equipment (UE) or terminal, etc.

[0066] The foldable devices provided in this application can include, but are not limited to, foldable electronic products such as mobile phones, tablet computers, laptop computers, laptops, personal digital assistants (PDAs), personal computers, multimedia players, e-book readers, in-vehicle devices, or wearable devices. Wearable devices can include, but are not limited to, smart bracelets, smartwatches, smart head-mounted displays, and smart glasses. This application uses a mobile phone as an example of a foldable device for illustration.

[0067] Figure 1 This is a schematic diagram of a foldable device in a folded state, provided as an embodiment of this application. Figure 2 for Figure 1 A schematic diagram of the foldable device in a partially unfolded state. Figure 3 for Figure 1A schematic diagram of the foldable device in its fully unfolded state.

[0068] like Figures 1-3 As shown in the embodiment of this application, the foldable device includes a first housing assembly 100, a second housing assembly 200, and a pivot mechanism 300. The first housing assembly 100 and the second housing assembly 200 are rotatably connected via the pivot mechanism 300, so that the foldable device can switch between a folded state and an unfolded state. When the foldable device is in the folded state, the first housing assembly 100 and the second housing assembly 200 rotate to overlap each other.

[0069] The unfolded state includes a fully unfolded state and a partially unfolded state. When the foldable device is in the fully unfolded state, the first housing assembly 100 and the second housing assembly 200 rotate until the included angle between them is approximately 180°. As those skilled in the art will understand, the included angle referred to in this application as approximately 180° may not be an absolute 180° due to design tolerances and other reasons, and slight deviations are allowed, such as 165°, 177°, or 185°.

[0070] The partially unfolded state is the state of the foldable device during the transition between the folded state and the fully unfolded state. That is, when the foldable device is in the partially unfolded state, the angle between the first housing assembly 100 and the second housing assembly 200 is smaller than the angle between the first housing assembly 100 and the second housing assembly 200 when the foldable device is in the fully unfolded state, and the angle between the first housing assembly 100 and the second housing assembly 200 when the foldable device is in the partially unfolded state is greater than the angle between the first housing assembly 100 and the second housing assembly 200 when the foldable device is in the folded state.

[0071] It is understandable that when the foldable device is in a fully unfolded state, the axial direction of the pivot mechanism 300 can be either the length direction of the foldable device or the width direction of the foldable device.

[0072] In this embodiment, the foldable device may further include a flexible display screen 400, which is mounted on the first housing assembly 100 and the second housing assembly 200. The pivot mechanism 300 can be used to support the flexible display screen 400. When the foldable device is in a fully unfolded state, the side of the first housing assembly 100 used to mount the flexible display screen 400 and the side of the second housing assembly 200 used to mount the flexible display screen 400 have the same orientation. The flexible display screen 400 can be used to display information and provide an interactive interface for the user.

[0073] For example, the flexible display screen 400 can be fixedly connected to the first housing assembly 100 and the second housing assembly 200 by means of adhesive bonding, snap-fitting, etc.

[0074] For example, the flexible display screen 400 may include, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MOLED) display screen, a micro light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QD) display screen, etc.

[0075] In this embodiment, the flexible display screen 400 may include a first connecting region 410, a second connecting region 420, and a bendable region 430 located between the first connecting region 410 and the second connecting region 420. The first connecting region 410 and the second connecting region 420 are connected through the bendable region 430. The first connecting region 410 can be fixedly connected to the first housing assembly 100 by means of bonding, snap-fitting, etc., and the second connecting region 420 can be fixedly connected to the second housing assembly 200 by means of bonding, snap-fitting, etc. The bendable region 430 is opposite to the pivot mechanism 300, and the pivot mechanism 300 can be used to support the bendable region 430.

[0076] In some examples, portions of the bendable area 430 can be bonded and fixed to the pivot mechanism 300 using adhesive backing, dispensing, or other methods.

[0077] In the flexible display screen 400, at least the bendable area 430 is made of a flexible material so that the bendable area 430 can be bent and flattened. The first connecting area 410 and the second connecting area 420 can be made of flexible material, or they can be made of rigid material, or they can be made of a combination of flexible and rigid materials.

[0078] When the foldable device switches between a folded state and an unfolded state, the first connecting area 410 and the second connecting area 420 can rotate with the first housing assembly 100 and the second housing assembly 200, causing the bendable area 430 to bend and unfold. Specifically, when the foldable device switches from an unfolded state to a folded state, the bendable area 430 bends under the action of the first connecting area 410 and the second connecting area 420, and the first connecting area 410 and the second connecting area 420 can be parallel to each other (a slight deviation is allowed). When the foldable device switches from a folded state to a fully unfolded state, the bendable area 430 flattens out under the action of the first connecting area 410 and the second connecting area 420, and the bendable area 430, the first connecting area 410 and the second connecting area 420 can be coplanar (a slight deviation is allowed).

[0079] For example, the foldable device can be an inward-folding foldable device, and the flexible display screen 400 is an inward-folding display screen. When the foldable device is in the folded state, the first connecting area 410 is located on the side of the first housing assembly 100 facing the second housing assembly 200, and the second connecting area 420 is located on the side of the second housing assembly 200 facing the first housing assembly 100. That is, the first connecting area 410 and the second connecting area 420 are located between the first housing assembly 100 and the second housing assembly 200, and the first connecting area 410 and the second connecting area 420 can be relatively close together. When the inward-folding foldable device is in the folded state, the flexible display screen 400 is blocked by the first housing assembly 100 and the second housing assembly 200, and the first housing assembly 100 and the second housing assembly 200 can protect the flexible display screen 400. If the inward-folding foldable device needs to realize the display function in the folded state, a display screen can be additionally added to the back of at least one of the first housing assembly 100 and the second housing assembly 200. The inward-folding foldable device can realize the display function by relying on the added display screen in the folded state.

[0080] Figure 4 This is a schematic diagram of another foldable device provided in an embodiment of this application in a folded state. Figure 5 for Figure 4 A schematic diagram of the foldable device in a partially unfolded state. Figure 6 for Figure 4 A schematic diagram of the foldable device in its fully unfolded state.

[0081] like Figure 4-Figure 6As shown, the foldable device can be an outward-folding foldable device, and the flexible display screen 400 is an outward-folding display screen. When the foldable device is in the folded state, the first connecting area 410 is located on the side of the first housing assembly 100 opposite to the second housing assembly 200, and the second connecting area 420 is located on the side of the second housing assembly 200 opposite to the first housing assembly 100. That is, the first housing assembly 100 and the second housing assembly 200 are located between the first connecting area 410 and the second connecting area 420. The flexible display screen 400 surrounds the first housing assembly 100, the pivot mechanism 300, and the second housing assembly 200, and is visible to the user. When the outward-folding foldable device is in the folded state, the flexible display screen 400 is exposed, and the display function can be realized using the flexible display screen 400. Therefore, it is not necessary to add a display screen on the back of at least one of the first housing assembly 100 and the second housing assembly 200 in order to realize the display function of the foldable device in the folded state.

[0082] In this embodiment of the application, the foldable device further includes a heating module (not shown), and the first housing assembly 100 has a mounting cavity 150, in which the heating module is installed.

[0083] For example, the heat-generating module may include one or more heat-generating devices such as a processor, camera, battery, audio device, and memory.

[0084] To improve the heat dissipation efficiency of the heat-generating module and thus enhance the performance of the foldable device, in this embodiment, the foldable device may further include a heat dissipation module 500 (as follows). Figure 7 As shown in the figure, the heat dissipation module 500 can be installed in the mounting cavity 150 of the first housing assembly 100. The heat dissipation module 500 is used to dissipate the heat generated by the heat dissipation module to the outside of the first housing assembly 100.

[0085] In related technologies, each part of the first housing assembly is designed with uniform thickness. Since the heat dissipation module is relatively tall, it needs to occupy a large space in the thickness direction of the first housing assembly. In order to reserve space for installing the heat dissipation module, the first housing assembly used to install the heat dissipation module will have a large dimension in the thickness direction, resulting in a thicker foldable device after folding.

[0086] Figure 7 This is a schematic diagram of another foldable device provided in an embodiment of this application in its fully unfolded state. Figure 8 for Figure 7 A schematic diagram of the foldable device in its folded state. Figure 9 This is a schematic diagram of a first housing assembly, a pivot mechanism, and a second housing assembly in a folded state, according to another embodiment of this application. Figure 10 This is a schematic diagram of a first housing assembly, a pivot mechanism, and a second housing assembly in the fully unfolded state of another foldable device provided in this application embodiment. Wherein, the x-direction is the first direction, the y-direction is the axial direction of the pivot mechanism 300, and the z-direction is the thickness direction of the first housing assembly 100. The first direction is perpendicular to the axial direction of the pivot mechanism 300, the first direction is perpendicular to the thickness direction of the first housing assembly 100, and the thickness direction of the first housing assembly 100 is perpendicular to the axial direction of the pivot mechanism 300.

[0087] Based on this, in this embodiment of the application, the first housing assembly 100 includes a first sidewall structure 110 and a second sidewall structure 120, which are located on opposite sides of the thickness direction of the first housing assembly 100. The first sidewall structure 110 includes a first sidewall 111, a second sidewall 112, and a third sidewall 113. The first sidewall 111 and the second sidewall 112 are both disposed opposite to the second sidewall structure 120. The first sidewall 111 protrudes from the second sidewall 112 in a direction away from the second sidewall structure 120. The distance between the first sidewall 111 and the second sidewall structure 120 is greater than the distance between the second sidewall 112 and the second sidewall structure 120. The end of the first sidewall 111 facing the rotating shaft mechanism 300 is connected to the end of the second sidewall 112 away from the rotating shaft mechanism 300 through the third sidewall 113. The mounting cavity 150 includes a first mounting sub-cavity 151 located between the first sidewall 111 and the second sidewall structure 120, and the heat dissipation module 500 is mounted in the first mounting sub-cavity 151. During the transition of the foldable device from an unfolded state to a folded state, the second housing assembly 200 rotates toward the second sidewall 112. When the foldable device is in the folded state, the orthographic projection of the second sidewall 112 along the thickness direction of the first housing assembly 100 at least partially overlaps with the orthographic projection of the second housing assembly 200 along the thickness direction of the first housing assembly 100, while the orthographic projection of the first sidewall 111 along the thickness direction of the first housing assembly 100 does not overlap with the orthographic projection of the second housing assembly 200 along the thickness direction of the first housing assembly 100. That is, when the foldable device is in the folded state, the second housing assembly 200 overlaps with the second sidewall 112 outside the first sidewall 111, and the second sidewall 112 is at least partially covered by the second housing assembly 200, while the first sidewall 111 is not covered by the second housing assembly 200.

[0088] In this way, the first housing assembly 100 has an unequal thickness design at the first sidewall 111 and the second sidewall 112. The heat dissipation module 500 is installed on the thicker first sidewall 111 of the first housing assembly 100, which makes the part of the first housing assembly 100 where the heat dissipation module 500 is installed relatively thin. In addition, when the foldable device is in the folded state, the thicker part of the first housing assembly 100 where the heat dissipation module 500 is installed will not overlap with the second housing assembly 200, while the thinner second sidewall 112 of the first housing assembly 100 will overlap with the second housing assembly 200. This makes the foldable device with the heat dissipation module 500 thinner when folded, which can meet the requirements of efficient heat dissipation and thinness of the foldable device.

[0089] It is understood that the third sidewall 113 is provided at a distance from one end of the first sidewall 111 to one end of the second sidewall 112 in the thickness direction of the first housing assembly 100, and the first housing assembly 100 forms a boss structure at the first sidewall 111 that protrudes in a direction away from the second sidewall structure 120.

[0090] For example, the heat dissipation module 500 may include, but is not limited to, an air-cooled heat dissipation module, a liquid-cooled heat dissipation module, or a hybrid air-cooled and liquid-cooled heat dissipation module.

[0091] For example, at least some of the heating elements of the heating module can be installed within the first mounting cavity 151. This helps to reduce the thickness of the first housing assembly 100 at the second sidewall 112, resulting in a thinner foldable device. Furthermore, the proximity of at least some of the heating elements of the heating module to the heat dissipation module 500 facilitates more efficient heat dissipation from the heating module to the outside of the first housing assembly 100.

[0092] For example, the first mounting cavity 151 may house one or more of the following: a processor, a camera, a battery, an audio device, a memory, etc.

[0093] In this embodiment, the mounting cavity 150 further includes a second mounting sub-cavity 152 located between the second sidewall 112 and the second sidewall structure 120, with the first mounting sub-cavity 151 and the second mounting sub-cavity 152 communicating with each other. This facilitates the heat dissipation module 500 in dissipating heat from the devices mounted within the second mounting cavity 150.

[0094] For example, some of the heating elements of the heating module can be installed in the first mounting sub-cavity 151, and some of the heating elements of the heating module can be installed in the second mounting sub-cavity 152. For instance, a camera and a processor can be installed in the first mounting sub-cavity 151, and a memory can be installed in the second mounting sub-cavity 152.

[0095] In this embodiment of the application, the first housing assembly 100 further includes a first enclosure structure 130, which is connected to a first side wall structure 110 and a second side wall structure 120 at both ends of the thickness direction of the first housing assembly 100, and an installation cavity 150 is formed between the first enclosure structure 130, the first side wall structure 110 and the second side wall structure 120.

[0096] In this embodiment of the application, the first enclosure structure 130 includes a fourth side wall 131, a fifth side wall 132, a sixth side wall 133 and a seventh side wall 134. The fourth side wall 131 and the fifth side wall 132 are arranged opposite each other in the axial direction of the rotating shaft mechanism 300, and the sixth side wall 133 and the seventh side wall 134 are arranged opposite each other in a first direction. The first sidewall structure 110 is connected to the second sidewall structure 120 at one axial end of the rotating shaft mechanism 300 via the fourth sidewall 131 at one axial end of the rotating shaft mechanism 300. The first sidewall structure 110 is connected to the second sidewall structure 120 at the other axial end of the rotating shaft mechanism 300 via the fifth sidewall 132 at the other axial end of the rotating shaft mechanism 300. The end of the first sidewall 111 facing away from the rotating shaft mechanism 300 is connected to the end of the second sidewall structure 120 facing away from the rotating shaft mechanism 300 via the sixth sidewall 133. The end of the second sidewall 112 facing the rotating shaft mechanism 300 is connected to the end of the second sidewall structure 120 facing the rotating shaft mechanism 300 via the seventh sidewall 134. The first housing assembly 100 is connected to the rotating shaft mechanism 300 at the seventh sidewall 134. An installation cavity 150 is formed between the fourth sidewall 131, the fifth sidewall 132, the sixth sidewall 133, the seventh sidewall 134, the first sidewall structure 110, and the second sidewall structure 120.

[0097] In this embodiment, the fourth sidewall 131 includes a first region 1311 and a third region 1312. The first region 1311 is connected to the first sidewall 111 and the second sidewall structure 120 at both ends in the thickness direction of the first housing assembly 100, respectively. The third region 1312 is connected to the second sidewall 112 and the second sidewall structure 120 at both ends in the thickness direction of the first housing assembly 100, respectively. The fifth sidewall 132 includes a second region 1321 and a fourth region 1322. The second region 1321 is connected to the first sidewall 111 and the second sidewall structure 120 at both ends in the thickness direction of the first housing assembly 100, respectively. The fourth region 1322 is connected to the second sidewall 112 and the second sidewall structure 120 at both ends in the thickness direction of the first housing assembly 100, respectively. In the axial direction of the rotating shaft mechanism 300, the first region 1311 is opposite to the second region 1321, and the third region 1312 and the fourth region 1322 are opposite to each other. A first mounting cavity 151 is formed between the first region 1311, the second region 1321, the first sidewall 111, the sixth sidewall 133, and the second sidewall structure 120; a second mounting cavity 152 is formed between the third region 1312, the fourth region 1322, the second sidewall 112, the seventh sidewall 134, and the second sidewall structure 120.

[0098] like Figure 8 As shown, in the thickness direction of the first housing assembly 100, the size of the sixth sidewall 133 is larger than the size of the seventh sidewall 134.

[0099] Figure 11 This is a schematic diagram of the fourth sidewall of another foldable device provided in an embodiment of this application. Figure 12 This is a schematic diagram of the fifth sidewall of another foldable device provided in an embodiment of this application.

[0100] like Figure 11 , Figure 12 As shown, in the thickness direction of the first housing assembly 100, the size of the first region 1311 is larger than the size of the third region 1312, and the size of the second region 1321 is larger than the size of the fourth region 1322.

[0101] In this embodiment, the second housing assembly 200 includes a third sidewall structure 210, a fourth sidewall structure 220, and a second enclosure structure 230. The third sidewall structure 210 and the fourth sidewall structure 220 are located on opposite sides of the second housing assembly 200 in the thickness direction. The second enclosure structure 230 is connected to the third sidewall structure 210 and the fourth sidewall structure 220 at both ends of the second housing assembly 200 in the thickness direction. When the foldable device is in a folded state, the third sidewall structure 210 is located on the side of the second housing assembly 200 facing the second sidewall 112, and the fourth sidewall structure 220 is located on the side of the second housing assembly 200 away from the second sidewall 112.

[0102] When the foldable device is an inward-folding foldable device, that is, when the flexible display screen 400 is an inward-folding display screen, the flexible display screen 400 is installed on the second side wall 112 and the third side wall structure 210. The first connecting area 410 can be fixedly connected to the second side wall 112 by means of adhesive, snap-fit, etc., and the second connecting area 420 can be fixedly connected to the third side wall structure 210 by means of adhesive, snap-fit, etc.

[0103] Figure 13 This is a schematic diagram of another foldable device provided in an embodiment of this application in its fully unfolded state. Figure 14 for Figure 13 A schematic diagram of the foldable device in its folded state.

[0104] like Figure 13 , Figure 14 As shown, when the foldable device is an outward-folding foldable device, that is, when the flexible display screen 400 is an outward-folding display screen, the flexible display screen 400 is installed on the second side wall structure 120 and the fourth side wall structure 220. The first connecting area 410 can be fixedly connected to the second side wall structure 120 by means of adhesive, snap-fit, etc., and the second connecting area 420 can be fixedly connected to the fourth side wall structure 220 by means of adhesive, snap-fit, etc.

[0105] In this embodiment, the foldable device further includes a sensor and a controller. The sensor is electrically connected to the controller, and the controller is electrically connected to the heat dissipation module 500. The sensor is used to detect the opening / closing state of the foldable device, and the controller is used to control the heat dissipation module 500 according to the opening / closing state detected by the sensor. The opening / closing state includes an unfolded state and a folded state. This facilitates adjusting the operating mode of the heat dissipation module 500 according to the opening / closing state of the foldable device, enabling the heat dissipation module 500 to operate more efficiently.

[0106] Understandably, the sensor can be electrically connected to the controller via the processor.

[0107] In this embodiment, the controller is configured to shut down or operate the heat dissipation module 500 in a low-power state when the foldable device is in a folded state. This reduces noise and energy consumption when the foldable device is folded, thus extending its battery life.

[0108] For example, the controller can be installed within the mounting cavity 150.

[0109] For example, the sensor may include a Hall sensor, and a Hall sensor may be mounted on one of the first housing assembly 100 and the second housing assembly 200, while a magnetic element may be mounted on the other of the first housing assembly 100 and the second housing assembly 200. The opening and closing state of the foldable device can be detected based on the change in the magnetic field detected by the Hall sensor.

[0110] For example, the sensor may include an angle sensor mounted on the rotating shaft mechanism 300, which can detect the opening and closing state of the foldable device based on changes in the angle detected by the angle sensor. For instance, the angle sensor may be set to detect an angle of 0° when the second housing assembly 200 rotates to its limit position toward the second side. When the angle detected by the angle sensor is between 0° and a preset angle, the foldable device is determined to be in a folded state; when the angle detected by the angle sensor is greater than the preset angle, the foldable device is determined to be in an unfolded state. The preset angle may be 1°, 2°, etc.

[0111] For example, the sensor may include a pressure sensor, with at least one of the first housing assembly 100 and the second housing assembly 200 having a pressure sensor disposed at a position that is compressed when the foldable device is in a folded state and not compressed when the foldable device is in an unfolded state. The opening and closing state of the foldable device can be detected based on the pressure change detected by the pressure sensor. For example, the pressure sensor may be a piezoelectric sensor.

[0112] In this embodiment, the heat dissipation module 500 may include a fan 510, which is installed in the first mounting sub-cavity 151. The first housing assembly 100 has heat dissipation holes 140. In this way, the fan 510 can drive the air in the first mounting sub-cavity 151 to carry heat out of the first housing assembly 100 through the heat dissipation holes 140, thereby achieving high heat dissipation efficiency for the heat-generating module.

[0113] In the example where the first housing assembly 100 has heat dissipation holes 140, at least a portion of the heat dissipation holes 140 are located on the third sidewall 113. The fan 510 drives air through the heat dissipation holes 140 to enter and exit the first mounting sub-cavity 151. Thus, when the foldable device is in the folded state, the airflow required to enter and exit the first mounting sub-cavity 151 through the heat dissipation holes 140 is relatively small. The second housing assembly 200, stacked on the second sidewall 112, can shield the heat dissipation holes 140 on the third sidewall 113, reducing the number of exposed heat dissipation holes 140 when the foldable device is in the folded state. When the foldable device is in the unfolded state, the heat dissipation holes 140 on the third sidewall 113 are exposed, facilitating airflow through the heat dissipation holes 140 to enter and exit the first mounting sub-cavity 151, allowing the heat-generating module to dissipate heat more efficiently.

[0114] For example, the controller is used to control the fan 510 based on the open / closed state of the foldable device detected by the sensor. The controller is configured to control the fan 510 to turn off or operate in a low-power state when the foldable device is in a folded state.

[0115] For example, fan 510 may be, but is not limited to, an axial fan, a piezoelectric fan, etc.

[0116] For example, the fan 510 can be used to drive airflow from the heating module out of the first mounting cavity 151, that is, at least a portion of the heating module is located in the airflow path of the fan 510.

[0117] For example, the heat dissipation module 500 may further include a heat dissipation unit, which can be connected to the heat-generating module. A fan 510 can be used to drive airflow from the heat dissipation unit out of the first mounting sub-cavity 151. That is, at least a portion of the heat dissipation unit is located in the airflow path of the fan 510, in which case the heat-generating module may not be located in the airflow path of the fan 510. This allows for higher heat dissipation efficiency for the heat-generating module. Furthermore, it also facilitates heat dissipation for devices located in the second mounting sub-cavity 152.

[0118] For example, a heat exchanger unit may include one or more of the following: a heat exchanger (VC) plate, a heat pipe, etc.

[0119] For example, the heat dissipation module 500 may further include a heat sink connected to a heat dissipation unit. The fan 510 can be used to drive airflow from the heat sink out of the first mounting cavity 151, meaning the heat sink is located in the airflow path of the fan 510. This further improves the heat dissipation efficiency of the heat-generating module.

[0120] In some examples, when the foldable device is in the folded state, there is a gap 600 between the end of the second housing assembly 200 away from the pivot mechanism 300 and the third sidewall 113, and the heat dissipation hole 140 provided on the third sidewall 113 communicates with the external space through the gap 600. In this way, when the foldable device is in the folded state, air can enter and exit the first mounting cavity 151 through the gap 600 between the end of the second housing assembly 200 away from the pivot mechanism 300 and the third sidewall 113, which is beneficial to the heat dissipation of the foldable device when it is in the folded state.

[0121] For example, when the foldable device is in the folded state, the orthographic projection of the third sidewall 113 along the thickness direction of the first housing assembly 100 does not overlap with the orthographic projection of the second housing assembly 200 along the thickness direction of the first housing assembly 100. That is, when the foldable device is in the folded state, the third sidewall 111 is not covered by the second housing assembly 200 in the thickness direction of the first housing assembly 100. In this way, when the foldable device is in the folded state, air can easily enter and exit the first mounting cavity 151 through the gap 600 between the end of the second housing assembly 200 away from the pivot mechanism 300 and the third sidewall 113.

[0122] Figure 15 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0123] like Figure 15 As shown, and see Figure 13 , Figure 14 In this embodiment, the heat dissipation hole 140 includes an air inlet 141 and an air outlet 142. The portion of the first housing assembly 100 opposite to the air outlet end of the fan 510 has the air outlet 142. This reduces the backflow of air within the first mounting cavity 151, facilitating efficient airflow through the air outlet 142 to the first mounting cavity 151 driven by the fan 510, resulting in higher heat dissipation efficiency for the heat-generating module.

[0124] In some examples, the heat dissipation holes 140 are all located on the third sidewall 113. That is, all the air inlets 141 and all the air outlets 142 are located on the third sidewall 113. In this way, when the foldable device is in the folded state, the second housing assembly 200 can cover all the heat dissipation holes 140, so that the heat dissipation holes 140 are not exposed.

[0125] In the embodiment where all heat dissipation holes 140 are located on the third sidewall 113, the third sidewall 113 may include a first air inlet area and a first air outlet area distributed along the axial direction of the rotating shaft mechanism 300. A fan 510 is located at one end of the first mounting cavity 151 along the axial direction of the rotating shaft, with the air outlet end of the fan 510 opposite to the first air outlet area. An air inlet hole 141 is located in the first air inlet area, and an air outlet hole 142 is located in the first air outlet area. Thus, when all heat dissipation holes 140 are located on the third sidewall 113, the amount of air flowing out of the air outlet hole 142 returning to the first mounting cavity 151 through the air inlet hole 141 is relatively small, minimizing the mutual influence between the air inlet and outlet, and resulting in higher heat dissipation efficiency for the heat-generating module.

[0126] Figure 16 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0127] like Figure 16As shown, in some examples, the heat dissipation module 500 includes multiple fans 510. This helps to improve the heat dissipation efficiency of the heat-generating module.

[0128] For example, the heat dissipation module 500 includes two fans 510, which are respectively disposed at both ends of the first mounting cavity 151 in the axial direction of the rotating shaft mechanism 300. When the heat dissipation holes 140 are all disposed on the third sidewall 113, the third sidewall 113 may include a second air outlet area, a second air inlet area, and a third air outlet area distributed along the axial direction of the rotating shaft mechanism 300. In the axial direction of the rotating shaft mechanism 300, the second air inlet area is located between the second air outlet area and the third air outlet area, the air outlet end of one fan 510 is opposite to the second air outlet area, and the air outlet end of the other fan 510 is opposite to the third air outlet area. Both the second air outlet area and the third air outlet area have air outlet holes 142, and the second air inlet area has air inlet holes 141. In this way, when the heat dissipation holes 140 are all located on the third side wall 113, the amount of air flowing out of the air outlet 142 and returning to the first mounting sub-cavity 151 through the air inlet 141 is relatively small, which can reduce the mutual influence between the air inlet and outlet, and make the heat dissipation efficiency of the heat-generating module higher.

[0129] Figure 17 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0130] like Figure 17 As shown, in some examples, the air inlet 141 and the air outlet 142 are located on different side walls of the first housing assembly 100. In this way, the air discharged from the air outlet 142 is less likely to flow back into the first mounting cavity 151 through the air inlet 141, which helps to improve the heat dissipation efficiency of the heat-generating module.

[0131] In an example where the air inlet 141 and air outlet 142 are located on different side walls of the first housing assembly 100, the heat dissipation hole 140 on the third side wall 113 serves as the air inlet 141, and at least one of the first side wall 111, the first enclosure structure 130, and the second side wall structure 120 has an air outlet 142. Thus, when the foldable device is in a folded state, the air flowing out of the first mounting cavity 151 through the air outlet 142 will not be reversed by the obstruction of the second housing assembly 200, allowing for smoother airflow between the first mounting cavity 151 and the outside.

[0132] In an example where the air inlet 141 and the air outlet 142 are located on different sidewalls of the first housing assembly 100, at least one of the first region 1311, the second region 1321, and the sixth sidewall 133 has an air outlet 142.

[0133] Thus, the dimensions of the first region 1311, the second region 1321, and the sixth sidewall 133 are relatively large in the thickness direction of the first housing assembly 100, and the dimensions of the available air outlets 142 in the thickness direction of the first housing assembly 100 are also relatively large. When the maximum airflow required to enter and exit the first mounting sub-cavity 151 is constant, the number of air outlets 142 can be reduced. When the number of air outlets 142 is constant, it is beneficial to increase the allowable airflow into and out of the first mounting sub-cavity 151. In addition, compared with the air inlets 141 opened on the first sidewall 111 and the second sidewall structure 120, the air inlets 141 opened on the first region 1311, the second region 1321, and the sixth sidewall 133 have less impact on user operation and device arrangement.

[0134] For example, the first region 1311 and the second region 1321 have air outlets 142. External air flows into the first mounting cavity 151 through the air inlet 141 on the third sidewall 113, and the air in the first mounting cavity 151 flows out to the outside through the air outlets 142 on the first region 1311 and the second region 1321.

[0135] Figure 18 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0136] like Figure 18 As shown, in some examples, the sixth sidewall 133 has an air outlet 142, and external air flows into the first mounting cavity 151 through the air inlet 141 on the third sidewall 113, and the air in the first mounting cavity 151 flows out to the outside through the air outlet 142 on the sixth sidewall 133.

[0137] Figure 19 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0138] like Figure 19 As shown, in some examples, at least one of the first sidewall 111, the first enclosure structure 130, and the second sidewall structure 120 has an air inlet 141. Thus, when the foldable device is in the folded state, part of the air inlet 141 is not blocked by the second housing assembly 200, allowing external air to enter the first mounting cavity 151 through the unblocked air inlet 141, facilitating heat dissipation when the foldable device is in the folded state.

[0139] For example, at least one of the first region 1311, the second region 1321, and the sixth sidewall 133 has an air inlet 141. Thus, the first region 1311, the second region 1321, and the sixth sidewall 133 have a larger dimension in the thickness direction of the first housing assembly 100, and the available air inlets 141 have a larger dimension in the thickness direction of the first housing assembly 100. When the maximum airflow required to enter and exit the first mounting sub-cavity 151 is constant, the number of air inlets 141 can be reduced, and when the number of air inlets 141 is constant, it is advantageous to increase the allowable airflow into and out of the first mounting sub-cavity 151. Furthermore, compared to the air inlets 141 formed on the first sidewall 111 and the second sidewall structure 120, the air inlets 141 formed on the first region 1311, the second region 1321, and the sixth sidewall 133 have less impact on user operation and device arrangement.

[0140] For example, the first region 1311 and the second region 1321 have air inlets 141, and the sixth sidewall 133 has air outlets 142. External air can enter the first mounting cavity 151 through the air inlets 141 on the third sidewall 113, the first region 1311 and the second region 1321, and the air in the first mounting cavity 151 can flow out to the outside through the air outlets 142 on the sixth sidewall 133.

[0141] Figure 20 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0142] like Figure 20 As shown, for example, the first region 1311 and the second region 1321 have air outlets 142, and the sixth sidewall 133 has an air inlet 141. External air can enter the first mounting cavity 151 through the air inlet 141 on the third sidewall 113 and the sixth sidewall 133, and the air in the first mounting cavity 151 can flow out to the outside through the air outlets 142 on the first region 1311 and the second region 1321.

[0143] Figure 21 A schematic diagram of the first housing assembly of another foldable device provided in an embodiment of this application.

[0144] like Figure 21 As shown, in some examples, the first sidewall 111 has an air inlet 141, and at least one of the first region 1311, the second region 1321 and the sixth sidewall 133 has an air outlet 142. External air can enter the first mounting cavity 151 through the air inlet 141 on the first sidewall 111 and the third sidewall 113, and the air in the first mounting cavity 151 can flow out to the outside through the air outlet 142 on at least one of the first region 1311, the second region 1321 and the sixth sidewall 133.

[0145] Figure 22 A flowchart illustrating a control method for a foldable device provided in an embodiment of this application.

[0146] like Figure 22 As shown, based on the foldable device in any of the above embodiments, this application also provides a control method for the foldable device. This method can be executed by the foldable device or other electronic devices, and includes:

[0147] S100: Obtain the opening / closing state of the foldable device, wherein the opening / closing state includes a folded state and an unfolded state.

[0148] In some examples, the opening / closing state of the foldable device can be obtained using Hall sensors and magnetic components respectively mounted on the first housing assembly 100 and the second housing assembly 200. When the magnetic field strength detected by the Hall sensor is greater than or equal to a preset magnetic field strength, the foldable device can be determined to be in a folded state; when the magnetic field strength detected by the Hall sensor is less than the preset magnetic field strength, the foldable device can be determined to be in an unfolded state.

[0149] In other examples, the opening and closing state of the foldable device can be obtained by a pressure sensor installed on the first housing assembly 100 or the second housing assembly 200. When the foldable device is in the folded state, the pressure sensor is squeezed by the first housing assembly 100 and the second housing assembly 200, generating a squeezed signal, which can determine that the foldable device is in the folded state. When the foldable device is in the unfolded state, the pressure sensor is not squeezed and does not generate a signal, which can determine that the foldable device is in the unfolded state.

[0150] S200: If the foldable device is in a folded state, control the foldable device to operate in a low-power state, restrict the foldable device from switching from a low-power state to a high-power state, and control the heat dissipation module 500 to dissipate heat in a low-power mode.

[0151] This allows the foldable device to operate in a low-power state when folded, reducing the risk of damage due to insufficient heat dissipation. Furthermore, when the foldable device operates in a low-power state, the heat-generating module produces less heat, and the heat dissipation module 500's low-power mode reduces noise and energy consumption, thus extending the battery life of the foldable device.

[0152] It should be noted that the high-power and low-power states can be set based on the heat dissipation capacity of the heat dissipation module 500 when operating in low-power mode. When the power consumption of the foldable device is greater than or equal to the first preset power consumption, the foldable device is in high-power mode. When the power consumption of the foldable device is less than or equal to the first preset power consumption, the foldable device is in low-power mode. The heat dissipation module 500 operating in low-power mode can meet the heat dissipation requirements of the foldable device when it is in low-power mode.

[0153] In some examples, when the heat dissipation module 500 is in a low-power mode, the heat dissipation module 500 is in a turned-off state, and the heat dissipation module dissipates heat through natural heat dissipation.

[0154] In other examples, when the heat dissipation module 500 is installed in a low-power mode for heat dissipation, the heat dissipation module 500 operates in a low-power state.

[0155] In the example where the heat dissipation module 500 includes a fan 510, when the heat dissipation module 500 is in a low-power mode, the fan 510 is in a closed state or a low-power state. When the fan 510 is in a low-power state, air can enter and exit the first mounting sub-cavity 151 in a small volume through the heat dissipation hole 140.

[0156] For example, when fan 510 is an axial fan, the speed of fan 510 in low power mode is less than the speed of fan 510 in high power mode.

[0157] For example, when the fan 510 is a piezoelectric fan, the vibration frequency of the fan 510 in the low power state is less than the vibration frequency of the fan 510 in the high power state.

[0158] In some examples, step S200 may specifically include:

[0159] S210: Restrict the operation of high-power programs on foldable devices. In other words, when a foldable device is in a folded state, the high-power programs on the foldable device cannot switch from a stopped state to a running state.

[0160] This makes it easier to restrict the transition of foldable devices from a low-power state to a high-power state.

[0161] It should be noted that the high-power program can be set based on the heat dissipation capacity of the heat dissipation module 500 when it is running in a low-power state. When the power consumption of the program is greater than or equal to the second preset power consumption, the program is a high-power program. The second preset power consumption can be greater than or equal to the first preset power consumption. When the power consumption of the program is less than the third preset power consumption, the program is a low-power program. The third preset power consumption is less than the first preset power consumption. The total power consumption of all low-power programs running on the foldable device is less than the first preset power consumption. In other words, when all low-power programs and high-power programs of the foldable device are not running, the foldable device is in a low-power state.

[0162] In some examples, step S200 specifically includes:

[0163] S220: Obtain the program that runs when the foldable device is in a folded state.

[0164] S230: If the program running when the foldable device is in a folded state includes a high-power program, then stop the running of the high-power program.

[0165] This makes it easier for a foldable device that is in a high-power state to automatically switch to a low-power state after it switches to a folded state.

[0166] In some examples, the method also includes:

[0167] S300: If the foldable device is in the unfolded state, the restriction on the transition of the foldable device from a low power state to a high power state is lifted, and the operating state of the foldable device is obtained, wherein the operating state includes a low power state and a high power state.

[0168] This ensures that the foldable device can be used normally after it is unfolded. Furthermore, by obtaining the operating status of the foldable device in its unfolded state, it is easy to adjust the operating mode of the heat dissipation module 500 according to this status, thus enabling the heat dissipation module 500 to operate more efficiently.

[0169] In some examples, step S300 removes the restriction on the transition of the foldable device from a low-power state to a high-power state, specifically including:

[0170] S310: Removes restrictions on the operation of high-power programs on foldable devices. In other words, when a foldable device is in the unfolded state, the high-power programs of the foldable device can switch from a stopped state to a running state.

[0171] This ensures that various programs can run normally after the foldable device is unfolded, allowing the foldable device to be used normally.

[0172] In some examples, step S300 involves obtaining the operating status of the foldable device, specifically including:

[0173] S320: Obtain the program that runs when the foldable device is in the unfolded state.

[0174] S330: If the program running when the foldable device is in the unfolded state includes a high-power program, then the foldable device is in a high-power state.

[0175] In this way, the operating status of the foldable device can be determined by the program that runs when the foldable device is in the unfolded state.

[0176] S400: If the foldable device is in the unfolded state and the foldable device is in a high power consumption state, the heat dissipation module 500 is controlled to switch from low power consumption mode to high power consumption mode for heat dissipation.

[0177] In this way, when the foldable device is running in a low-power state, the heat-generating module generates a lot of heat. The heat dissipation module 500 can improve the heat dissipation efficiency of the heat-generating module by dissipating heat in a high-power mode, so that the foldable device can operate at high performance.

[0178] In some examples, step S400 specifically includes: controlling the fan 510 to switch from a closed state to an open state, or controlling the fan 510 to switch from a low power state to a high power state, so as to increase the airflow entering and exiting the first mounting sub-cavity 151 through the heat dissipation hole 140.

[0179] In this way, by increasing the airflow into and out of the first mounting cavity 151 through the heat dissipation hole 140, the heat dissipation capacity of the foldable device is improved, enabling the foldable device to operate at high performance.

[0180] S500: If the foldable device is in the unfolded state and the foldable device is in a low power state, the heat dissipation module 500 is controlled to dissipate heat in the low power mode.

[0181] In this way, when the foldable device is running in a low-power mode, the heat generated by the heat dissipation module is less. The heat dissipation module 500 can reduce the noise and energy consumption of the foldable device by dissipating heat in a low-power mode, which helps to extend the battery life of the foldable device.

[0182] Figure 23 This is a schematic diagram of yet another electronic device provided in an embodiment of this application.

[0183] like Figure 23As shown, this application further provides an electronic device, which includes a processor 710 and a memory 720. The memory 720 stores computer-executable instructions, and the processor 710 executes the computer-executable instructions stored in the memory 720, causing the processor 710 to perform the control method of the foldable device in any of the above embodiments.

[0184] It should be understood that the processor 710 in the embodiments of this application can be an integrated circuit chip with signal processing capabilities. During implementation, the steps of the above method embodiments can be completed by the integrated logic circuits in the hardware of the processor 710 or by instructions in software form. The processor 710 can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor can be a microprocessor. Alternatively, the processor 710 can also be any conventional processor, etc. The steps of the methods disclosed in the embodiments of this application can be directly manifested as being executed by a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor.

[0185] It should also be understood that the memory 720 in the embodiments of this application can be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM). It should be noted that the memory 720 in the embodiments of this application is intended to include, but is not limited to, these and any other suitable types of memory.

[0186] The foldable device may also include a communication interface 730 for communicating with other devices via a transmission medium, thereby enabling the foldable device to communicate with other devices. The communication interface 730 may be, for example, a transceiver, interface, bus, circuit, or device capable of transmitting and receiving functions. The processor 710 may utilize the communication interface 730 to transmit and receive data and / or information.

[0187] This application does not limit the specific connection medium between the processor 710, memory 720, and communication interface 730. In some examples, the processor 710, memory 720, and communication interface 730 are connected via a bus 740. The bus 740 may be divided into an address bus, a data bus, a control bus, etc.

[0188] The method steps in the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in random access memory, flash memory, read-only memory, programmable read-only memory, erasable programmable read-only memory, electrically erasable programmable read-only memory, registers, hard disks, portable hard disks, CD-ROMs, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Additionally, the ASIC can reside in a network device or terminal device. Alternatively, the processor and storage medium can exist as discrete components in the network device or terminal device.

[0189] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially as a computer program product. A computer program product includes one or more computer-executable instructions. When the computer-executable instructions are loaded and executed on a computer, the flow or function of the methods in the embodiments of this application is performed, in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a network device, a user equipment, or other programmable device. The computer-executable instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer-executable instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, optical fiber, etc.) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, hard disk, or magnetic tape; it can also be an optical medium, such as a digital video optical disc; or it can be a semiconductor medium, such as a solid-state drive.

[0190] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0191] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A foldable device, characterized in that, It includes a first housing assembly, a second housing assembly, a rotating shaft mechanism, and a heat dissipation module; The first housing assembly and the second housing assembly are rotatably connected via the rotating shaft mechanism; The first housing assembly includes a first sidewall structure and a second sidewall structure, the first sidewall structure and the second sidewall structure being located on both sides of the thickness direction of the first housing assembly; The first sidewall structure includes a first sidewall, a second sidewall, and a third sidewall. The first sidewall and the second sidewall are both disposed opposite to the second sidewall structure. The first sidewall protrudes from the second sidewall in a direction away from the second sidewall structure. The distance between the first sidewall and the second sidewall structure is greater than the distance between the second sidewall and the second sidewall structure. The end of the first sidewall facing the rotating shaft mechanism is connected to the end of the second sidewall away from the rotating shaft mechanism through the third sidewall. The heat dissipation module is installed in the mounting cavity between the first sidewall and the second sidewall structure; During the process of switching the foldable device from an unfolded state to a folded state, the second housing assembly rotates toward the second sidewall. When the foldable device is in the folded state, the orthographic projection of the second sidewall along the thickness direction of the first housing assembly at least partially overlaps with the orthographic projection of the second housing assembly along the thickness direction of the first housing assembly, and the orthographic projection of the first sidewall along the thickness direction of the first housing assembly does not overlap with the orthographic projection of the second housing assembly along the thickness direction of the first housing assembly.

2. The foldable device according to claim 1, characterized in that, The heat dissipation module includes a fan, which is installed inside the mounting sub-cavity; The first housing assembly has heat dissipation holes, at least a portion of which are located on the third sidewall, and the fan is used to drive air through the heat dissipation holes into and out of the mounting sub-cavity.

3. The foldable device according to claim 2, characterized in that, The heat dissipation holes are all located on the third side wall.

4. The foldable device according to claim 2, characterized in that, The heat dissipation holes include air inlets and air outlets, which are located on different side walls of the first housing assembly.

5. The foldable device according to claim 4, characterized in that, The first housing assembly further includes a enclosure structure, which is connected to the first side wall structure and the second side wall structure at both ends in the thickness direction of the first housing assembly, respectively. The heat dissipation hole on the third sidewall is the air inlet, and at least one of the first sidewall, the enclosure structure, and the second sidewall structure has the air outlet.

6. The foldable device according to claim 5, characterized in that, The enclosure structure includes a fourth side wall, a fifth side wall, and a sixth side wall; The first sidewall structure is connected to the second sidewall structure at one axial end of the rotating shaft mechanism via the fourth sidewall at one axial end of the rotating shaft mechanism. The first sidewall structure is connected to the second sidewall structure at the other axial end of the rotating shaft mechanism via the fifth sidewall at the other axial end of the rotating shaft mechanism. The end of the first sidewall away from the rotating shaft mechanism is connected to the end of the second sidewall structure away from the rotating shaft mechanism via the sixth sidewall. The fourth sidewall includes a first region connecting the first sidewall and the second sidewall structure, and the fifth sidewall includes a second region connecting the first sidewall and the second sidewall structure; At least one of the first region, the second region, and the sixth sidewall has the air outlet.

7. The foldable device according to claim 5 or 6, characterized in that, At least one of the first sidewall, the enclosure structure, and the second sidewall structure has the air inlet.

8. The foldable device according to any one of claims 2-7, characterized in that, When the foldable device is in the folded state, there is a gap between the end of the second housing assembly away from the pivot mechanism and the third sidewall, and the heat dissipation hole provided on the third sidewall communicates with the external space through the gap.

9. The foldable device according to any one of claims 1-8, characterized in that, It also includes sensors and controllers; The sensor is electrically connected to the controller, and the controller is electrically connected to the heat dissipation module; The sensor is used to detect the opening and closing state of the foldable device, and the controller is used to control the heat dissipation module according to the opening and closing state of the foldable device detected by the sensor. The opening / closing state includes the unfolded state and the folded state.

10. A control method for a foldable device, characterized in that, The foldable device includes a first housing assembly, a second housing assembly, a pivot mechanism, and a heat dissipation module. The first housing assembly and the second housing assembly are rotatably connected via the pivot mechanism. The first housing assembly includes a first sidewall structure and a second sidewall structure, which are located on opposite sides of the thickness direction of the first housing assembly. The first sidewall structure includes a first sidewall, a second sidewall, and a third sidewall. The first sidewall and the second sidewall are both disposed opposite to the second sidewall structure. The first sidewall protrudes from the second sidewall in a direction away from the second sidewall structure. The distance between the first sidewall and the second sidewall structure is greater than the distance between the second sidewall and the second sidewall structure. The end of the second sidewall away from the pivot mechanism is connected to the end of the first sidewall facing the pivot mechanism via the third sidewall. The heat dissipation module is installed in a mounting cavity between the first sidewall and the second sidewall structure. During the process of switching the foldable device from an unfolded state to a folded state, the second housing assembly rotates towards the second sidewall. When the foldable device is in the folded state, the orthographic projection of the second sidewall along the thickness direction of the first housing assembly at least partially overlaps with the orthographic projection of the second housing assembly along the thickness direction of the first housing assembly, and the orthographic projection of the first sidewall along the thickness direction of the first housing assembly does not overlap with the orthographic projection of the second housing assembly along the thickness direction of the first housing assembly. The method includes: If the foldable device is in the folded state, the foldable device is controlled to operate in a low-power state, and the foldable device is restricted from switching from the low-power state to the high-power state. The heat dissipation module is also controlled to dissipate heat in a low-power mode.

11. The method according to claim 10, characterized in that, The control of the foldable device to operate in a low-power state and the restriction of the foldable device from transitioning from the low-power state to a high-power state specifically includes: Limit the high-power program execution of the foldable device.

12. The method according to claim 10 or 11, characterized in that, If the foldable device is in the unfolded state, the restriction on the foldable device to switch from the low power state to the high power state is lifted, and the operating state of the foldable device is obtained, wherein the operating state includes the low power state and the high power state. If the foldable device is in the high power consumption state, the heat dissipation module is controlled to switch from the low power consumption mode to the high power consumption mode for heat dissipation.

13. The method according to claim 12, characterized in that, The removal of the restriction on the transition of the foldable device from the low-power state to the high-power state specifically includes: Remove the restriction on the high-power program execution of the foldable device.

14. The method according to claim 12 or 13, characterized in that, The process of obtaining the operating status of the foldable device specifically includes: Obtain the program running on the foldable device; If the program running on the foldable device includes a high-power program, then the foldable device is in the high-power state.

15. The method according to any one of claims 12-14, characterized in that, The heat dissipation module includes a fan, which is installed in the mounting sub-cavity; the first housing assembly has heat dissipation holes, at least a portion of which are located on the third sidewall, and the fan is used to drive air through the heat dissipation holes into and out of the mounting sub-cavity. The control of the heat dissipation module to switch from the low-power mode to the high-power mode for heat dissipation specifically includes: Control the fan to switch from off to on, or control the fan to switch from low power to high power.

16. The method according to any one of claims 12-15, characterized in that, If the foldable device is in the unfolded state and the foldable device is in the low-power state, then the heat dissipation module is controlled to dissipate heat according to the low-power mode.

17. An electronic device, characterized in that, Including processor and memory; The memory stores computer-executable instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the control method for the foldable device as described in any one of claims 10-16.

18. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, implement the control method for the foldable device as described in any one of claims 10-16.

19. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the control method for the foldable device as described in any one of claims 10-16.

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