High-frequency copper clad laminate manufacturing method and high-frequency copper clad laminate

Abstract

The present application relates to a method for manufacturing a high-frequency copper clad laminate and a high-frequency copper clad laminate. The manufacturing method includes: coating glue on a glass fiber cloth; baking to obtain a bonding sheet; shearing; preparing a flexible mesh film, which is made of an insulating material. One side of the flexible mesh film is set as a glossy surface, and the other side is provided with microstructures, which are evenly distributed. The flexible mesh film also includes a plurality of micro mesh holes, which are evenly distributed and are arranged in a dislocation manner with the microstructures; performing a lamination combination to obtain a product to be pressed; and hot pressing the product to be pressed to obtain a high-frequency copper clad laminate. By preparing the flexible mesh film, the present application can support and limit the glass fiber cloth through the microstructures of the flexible mesh film, so that the flexible mesh film can be laid flat and evenly distributed, ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the micro mesh holes of the flexible mesh film reduce the influence of the setting of the flexible mesh film on the structural stability of the glass fiber cloth-based double-sided copper clad laminate.

Description

Technical Field

[0001] The present application relates to the technical field, and in particular to a method for manufacturing a high-frequency copper clad laminate and a high-frequency copper clad laminate. Background Art

[0002] A copper clad laminate (CCL) is a plate-like material formed by impregnating a reinforcing material with a resin adhesive and laminating copper foil on one or both sides. It undertakes the three major functions of a printed circuit board (PCB), namely conduction, insulation, and support. Taking a glass cloth-based double-sided copper clad laminate as an example, its main raw materials are copper foil, glass cloth, and resin, and the glass cloth and resin constitute the matrix layer of the copper clad laminate. A high-frequency copper clad laminate is a type of PCB substrate material that has high-speed signal and low-loss transmission characteristics when applied at high frequencies, also known as a low-loss copper clad laminate. In a high-frequency copper clad laminate, the uniformity of the composition of the dielectric layer affects the uniformity and consistency of the dielectric properties when high-frequency signals are transmitted inside it, that is, the output performance of high-frequency signals will vary with the non-uniformity of the composition structure of the dielectric layer. However, in the prior art, the glass cloth of a glass cloth-based double-sided copper clad laminate is usually difficult to achieve uniform distribution in the resin during the lamination process due to the certain fluidity of the resin, and thus it is difficult to ensure the performance of high-frequency signal transmission of the high-frequency copper clad laminate. Summary of the Invention

[0003] In order to improve the problem that the glass cloth of a glass cloth-based double-sided copper clad laminate in the prior art is usually difficult to achieve uniform distribution in the resin and thus difficult to ensure the performance of high-frequency signal transmission, the present application provides a method for manufacturing a high-frequency copper clad laminate and a high-frequency copper clad laminate.

[0004] In a first aspect, the present application provides a method for manufacturing a high-frequency copper clad laminate, characterized in that the method for manufacturing the high-frequency copper clad laminate includes:

[0005] Coating glue on the glass cloth, the glue including brominated epoxy resin;

[0006] Baking the glass cloth coated with the glue so that the glue is in a semi-cured state and obtaining a bonding sheet;

[0007] Cutting the bonding sheet into a corresponding size according to the size of the copper foil;

[0008] Preparing a flexible web, the flexible web being made of an insulating material and having a melting point higher than that of the brominated epoxy resin. One side of the flexible web is set as a glossy surface, and the other side is provided with microstructures. The microstructures are uniformly distributed. The flexible web further includes a plurality of micro-mesh holes. The micro-mesh holes are uniformly distributed and are arranged in a staggered manner with the microstructures;

[0009] Stack and combine in the stacking order of the copper foil, the flexible mesh, the adhesive sheet, the flexible mesh, and the copper foil to obtain a product to be laminated.

[0010] Hot press the product to be laminated so that the glue of the adhesive sheet remelts and flows through the micro-mesh holes to the copper foil, and at the same time, the micro-structure passes through the pores of the fiberglass cloth, and finally obtain a high-frequency copper clad laminate.

[0011] Optionally, preparing a flexible mesh includes:

[0012] A mold for preparing the flexible mesh;

[0013] Pour and mold the flexible mesh through the mold of the flexible mesh.

[0014] Optionally, the mold for preparing the flexible mesh includes:

[0015] A lower mold for preparing the flexible mesh, and the lower mold is provided with a pouring space opposite to the configuration of the flexible mesh;

[0016] An upper mold for preparing the flexible mesh, the upper mold is provided with a glossy surface, and the upper mold abuts against the lower mold through its glossy surface.

[0017] Optionally, after hot pressing the product to be laminated so that the glue of the adhesive sheet remelts and flows through the micro-mesh holes to the copper foil, and at the same time, the micro-structure passes through the pores of the fiberglass cloth, and finally obtain a high-frequency copper clad laminate, the method for manufacturing the high-frequency copper clad laminate further includes:

[0018] Heat the two sides where the copper foil of the high-frequency copper clad laminate is located separately.

[0019] Optionally, heating the two sides where the copper foil of the high-frequency copper clad laminate is located separately includes:

[0020] Prepare a heating body corresponding to the size of the copper foil;

[0021] Align and attach the heating body to the copper foil to heat the copper foil through the heating body.

[0022] Optionally, after hot pressing the product to be laminated so that the glue of the adhesive sheet remelts and flows through the micro-mesh holes to the copper foil, and at the same time, the micro-structure passes through the pores of the fiberglass cloth, and finally obtain a high-frequency copper clad laminate, the method for manufacturing the high-frequency copper clad laminate further includes:

[0023] Trim the edges of the high-frequency copper clad laminate.

[0024] Optionally, the flexible web includes a trimmed edge portion and a functional portion. The trimmed edge portion is arranged in a frame shape, and the functional portion is arranged within the frame of the trimmed edge portion and is only partially connected to the trimmed edge portion. The microstructures and the micro-mesh holes are both arranged on the functional portion;

[0025] Trimming the high-frequency copper clad laminate includes:

[0026] Trimming the high-frequency copper clad laminate with the connection between the trimmed edge portion and the functional portion as the boundary.

[0027] Optionally, the functional portion is connected to the trimmed edge portion through a connecting portion, and the connecting portion is arranged on the side of the flexible web away from its glossy surface.

[0028] Optionally, the connecting portion is arranged in a strip shape or a sheet shape, and there are several of them. The several connecting portions are spaced apart within the frame of the trimmed edge portion.

[0029] In a second aspect, the present application provides a high-frequency copper clad laminate, which is prepared by using any one of the high-frequency copper clad laminate manufacturing methods provided by the present application.

[0030] By preparing the flexible web, in the processes of "sheet matching" and "hot pressing", the glass fiber cloth can be supported and limited by the microstructures of the flexible web, so that the flexible web can be laid flat and evenly distributed, ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the melted glue in the matrix can contact the copper foil through the micro-mesh holes of the flexible web to achieve effective bonding, reducing the influence of the setting of the flexible web on the structural stability of the glass fiber cloth-based double-sided copper clad laminate. Description of the Drawings

[0031] Figure 1 is a longitudinal sectional view of the high-frequency copper clad laminate prepared by the high-frequency copper clad laminate manufacturing method provided in Embodiment 1 of the present application.

[0032] Figure 2 is a schematic structural diagram of the flexible web of the high-frequency copper clad laminate prepared by the high-frequency copper clad laminate manufacturing method provided in Embodiment 1 of the present application.

[0033] Figure 3 is an axonometric view of the high-frequency copper clad laminate prepared by the high-frequency copper clad laminate manufacturing method provided in Embodiment 1 of the present application when the adhesive sheet is hidden;

[0034] Figure 4 is Figure 3 the enlarged view of part A in

[0035] Explanation of reference numerals: 100, copper foil; 200, flexible mesh; 210, trimming portion; 220, functional portion; 230, connecting portion; 300, adhesive sheet; 310, glass fiber cloth; 320, glue; 400, microstructure; 500, micromesh. DETAILED DESCRIPTION

[0036] The following is combined with Figures 1-4 This application is described in further detail.

[0037] Embodiment 1

[0038] Embodiment 1 of the present application provides a method for manufacturing a high-frequency copper-clad laminate. Figures 1 to 4 As shown, the method for manufacturing a high-frequency copper clad laminate includes the following steps:

[0039] S1, coating glue 320 on the glass fiber cloth 310, wherein the glue 320 includes brominated epoxy resin;

[0040] S2, baking the glass fiber cloth 310 coated with the glue 320 to make the glue 320 in a semi-cured state, and obtaining the adhesive sheet 300;

[0041] S3, cutting the adhesive sheet 300 into corresponding sizes according to the size of the copper foil 100;

[0042] S4, preparing a flexible mesh 200, the flexible mesh 200 is made of an insulating material, and its melting point is greater than that of brominated epoxy resin, one side of the flexible mesh 200 is set as a glossy surface, and the other side is provided with a microstructure 400, the microstructure 400 is evenly distributed, and the flexible mesh 200 also includes a plurality of micro meshes 500, the micro meshes 500 are evenly distributed, and are staggered with the microstructure 400;

[0043] S5, laminating and assembling the copper foil 100, the flexible web 200, the adhesive sheet 300, the flexible web 200 and the copper foil 100 in the order of lamination to obtain a product to be laminated;

[0044] S6. The laminated product is hot pressed to make the glue 320 of the adhesive sheet 300 melt again and flow through the micro mesh 500 to the copper foil 100, and at the same time make the micro structure 400 pass through the pores of the glass fiber cloth 310, so as to finally obtain a high-frequency copper clad laminate.

[0045] In this embodiment, for exemplary illustration, steps S1 and S2 can be abbreviated as "applying glue". In step S1, it is necessary to ensure the uniformity of the glue 320 coated on the fiberglass cloth 310, and this step can be completed by a glue applicator. In step S2, the fiberglass cloth 310 coated with the glue 320 can also be baked by the glue applicator to obtain the bonding sheet 300. During baking, the fluidity of the glue 320 needs to be strictly controlled. The fluidity reflects the semi-curing index of the glue 320. If the fluidity is too large, the thickness of the glue 320 is likely to be uneven due to the "skidding" phenomenon when it contacts the copper foil 100; if the fluidity is too small, the bonding force of the glue 320 is not ideal. Before steps S1 and S2, the glue 320 can also be prepared first. The glue 320 can be obtained by uniformly mixing raw materials such as brominated epoxy resin, curing agent, accelerator, and solvent in a certain proportion. This process can be abbreviated as "mixing glue", or simply "pulp making". Step S3 can be abbreviated as "slicing", that is, cutting the bonding sheet 300 into the required size. It is not difficult to understand that steps S1 to S3 need to be carried out in sequence.

[0046] Step S4 can be abbreviated as "film making", and it can be a parallel step to steps S1 to S3; in other words, step S4 can be carried out at any position of steps S1 to S3, for example, before step S1, or after step S3, or synchronously with step S1, etc. It is not difficult to understand that the size of the flexible web 200 prepared in step S4 also corresponds to the size of the copper foil 100. The material of the flexible web 200 needs to meet the insulating characteristics to prevent the flexible web 200 from being electrically connected to the copper foil 100 and affecting signal transmission.

[0047] As Figure 1 shown, step S5 can be abbreviated as "assembling sheets", that is, stacking the various layer structures in the required order to obtain the product to be laminated. In this embodiment, the stacking order is: copper foil 100, flexible web 200, bonding sheet 300, flexible web 200, and copper foil 100. When "assembling sheets", the side where the glossy surface of the flexible web 200 is located contacts and fits with the copper foil 100, and the side where the microstructure 400 of the flexible web 200 is located fits with the bonding sheet 300.

[0048] As Figure 1 and Figure 2As shown, step S6 can be abbreviated as "hot pressing", and this step can be completed by a laminator. Through step S6, a high-frequency copper clad laminate can finally be prepared. In step S6, the laminator remelts the semi-cured glue 320 by heating and pressing the product to be laminated, so that it flows under pressure. In this embodiment, the material of the flexible web 200 can be silicone rubber, PET (Polyethylene Terephthalat), or TPU (Thermoplastic Urethane). The melting point of silicone rubber is usually around 400 °C, the melting point of PET is generally between 245 - 260 °C, and the melting point of TPU is usually between 170 - 230 °C; while the melting point of brominated epoxy resin is usually less than 150 °C. During "hot pressing", by controlling the temperature of "hot pressing", the glue 320 can be remelted while the flexible web 200 is prevented from melting. In other words, the temperature during "hot pressing" can be between the melting point of brominated epoxy resin and the melting point of the material of the flexible web 200. At this time, since the melting point of the material of the flexible web 200 is higher than that of brominated epoxy resin, the melted glue 320 can fill between the microstructures 400 and flow through the micro-mesh holes 500 to reach the copper foil 100. When the remelted glue 320 is cooled and completely cured, it can be bonded to the copper foil 100. At the same time, when the glue 320 is remelted, the fiberglass cloth 310 is pressed on the microstructures 400. Due to the flexible characteristics of the microstructures 400, the microstructures 400 can undergo a certain deformation and pass through the pores of the fiberglass cloth 310 to support and position the fiberglass cloth 310, and the fiberglass cloth 310 can be laid flat on the flexible web 200. To facilitate the microstructures 400 passing through the fiberglass cloth 310, the microstructures 400 can be set to a conical shape, such as a cylindrical shape, a triangular pyramid shape, a quadrangular pyramid shape, etc. Since the height difference during the distribution of the fiberglass cloth 310 is less than the compressible height when the microstructures 400 undergo deformation, and it is much smaller than the height of the dielectric layer, the microstructures 400 can make the fiberglass cloth 310 evenly distributed between the two copper foils 100. In other words, the existing dielectric layer can be replaced by two flexible webs 200 and one bonding sheet 300, and the fiberglass cloth 310 in the bonding sheet 300 is not likely to be unevenly distributed due to the flow of the glue 320.

[0049] It can be understood that by preparing the flexible web 200, in the processes of "sheet matching" and "hot pressing", the glass fiber cloth 310 can be supported and limited by the microstructure 400 of the flexible web 200, so that the flexible web 200 can be laid flat and distributed evenly, ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the melted glue 320 in the matrix can contact the copper foil 100 through the micro-mesh holes 500 of the flexible web 200 to achieve effective bonding, reducing the influence of the setting of the flexible web 200 on the structural stability of the glass fiber cloth-based double-sided copper clad laminate.

[0050] Specifically, preparing the flexible web 200 (i.e., step S4) includes the following steps:

[0051] S41. Prepare the mold for the flexible web 200;

[0052] S42. Cast and form the flexible web 200 through the mold of the flexible web 200.

[0053] In this embodiment, by way of example, for step S41, materials with good high-temperature resistance and high structural stability are selected to prepare the mold for the flexible web 200, such as metal materials like copper alloy and aluminum alloy. Step S42 can be to prepare and form the flexible web 200 by pouring the melted raw material into the mold of the flexible web 200, and step S42 can adopt the vacuum casting method to ensure the forming accuracy of the flexible web 200.

[0054] It can be understood that by reasonably setting the preparation method of the flexible web 200 in this embodiment, it is easy to realize the batch production of the flexible web 200, and at the same time reduce the preparation and processing cost, thereby ensuring the smooth preparation of the high-frequency copper clad laminate.

[0055] More specifically, the mold for preparing the flexible web 200 (i.e., step S41) includes the following steps:

[0056] S411. Prepare the lower mold for the flexible web 200, and the lower mold is provided with a casting space opposite to the configuration of the flexible web 200;

[0057] S412. Prepare the upper mold for the flexible web 200, the upper mold is provided with a glossy surface, and the upper mold abuts against the lower mold through its glossy surface.

[0058] In this embodiment, by way of example, it is illustrated that in step S411, the lower mold of the flexible web 200 can be prepared by an etching process. For example, a picture opposite to the configuration of the flexible web 200 is etched on one side of a copper alloy plate or an aluminum alloy plate to form a pouring space for pouring the flexible web 200. And in step S412, the upper mold can be a machined copper alloy plate or aluminum alloy plate. When machining, the copper alloy plate or aluminum alloy plate is machined with a shiny surface having a small surface roughness, so as to facilitate the upper mold to abut against the lower mold to close the pouring space, and further facilitate pouring.

[0059] Of course, in some embodiments, the lower mold of the flexible web 200 can also be prepared by means such as 3D printing.

[0060] It can be understood that by reasonably setting the preparation method of the mold of the flexible web 200 in this embodiment, it is easy to ensure the machining accuracy of the mold of the flexible web 200, and further ensure the forming accuracy of the flexible web 200 during the pouring process of the flexible web 200.

[0061] Specifically, after hot pressing the article to be laminated so that the glue 320 of the adhesive sheet 300 remelts and flows through the micro-mesh holes 500 to the copper foil 100, and at the same time the micro-structure 400 passes through the pores of the glass fiber cloth 310, and finally a high-frequency copper clad laminate is obtained (i.e., step S6), the method for manufacturing a high-frequency copper clad laminate further includes the following steps:

[0062] S7. Heat the two sides where the copper foil 100 of the high-frequency copper clad laminate is located separately.

[0063] In this embodiment, by way of example, step S7 can be abbreviated as "film melting". In step S7, the two sides where the copper foil 100 of the high-frequency copper clad laminate is located, that is, the two sides in the thickness direction of the high-frequency copper clad laminate, are heated separately, that is, the high-frequency copper clad laminate is heated from the sides where the two copper foils 100 are away from each other. After "hot pressing" is completed and the glue 320 is completely cured, through step S7, the side of the flexible web 200 attached to the copper foil 100 can be instantaneously heated and melted, and has a certain bonding force. When the side of the flexible web 200 attached to the copper foil 100 is cooled, the flexible web 200 and the copper foil 100 can also form a certain bonding effect. It should be noted that when heating the sides where the two copper foils 100 are away from each other, it is necessary to ensure that the heating time is short and the heating temperature is high to avoid the phenomenon that the flexible web 200 and the glue 320 are melted as a whole.

[0064] It can be understood that by heating the two sides where the copper foil 100 of the high-frequency copper clad laminate is located separately in this embodiment, the structural stability of the high-frequency copper clad laminate can be further increased.

[0065] More specifically, the two sides where the copper foil 100 of the high-frequency copper clad laminate is located are heated separately (i.e., step S7), including the following steps:

[0066] S71. Prepare a heating body corresponding to the size of the copper foil 100;

[0067] S72. Align and attach the heating body to the copper foil 100 so as to heat the copper foil 100 through the heating body.

[0068] In this embodiment, by way of example, in step S71, the heating body can be a metal material with high temperature resistance and high thermal conductivity, and it can be set as a block. At least a contact surface corresponding to the size of the copper foil 100 is provided on the heating body, and it can be in contact with the copper foil 100 through the contact surface. In step S72, when the heating body is heated to the specified temperature, the contact surface of the heating body is attached to the copper foil 100, and thus the copper foil 100 can be instantaneously heated separately.

[0069] It can be understood that in this embodiment, by attaching the heating body corresponding to the size of the copper foil 100 to the copper foil 100, it is easy to separately heat the two sides where the copper foil 100 of the high-frequency copper clad laminate is located.

[0070] Specifically, after hot pressing the article to be laminated so that the glue 320 of the adhesive sheet 300 remelts and flows through the micro-mesh holes 500 to the copper foil 100, and at the same time the micro-structure 400 passes through the pores of the glass fiber cloth 310, and finally after obtaining the high-frequency copper clad laminate (i.e., step S6), the method for manufacturing the high-frequency copper clad laminate further includes the following steps:

[0071] S8. Trim the high-frequency copper clad laminate.

[0072] As Figure 3 shown, in this embodiment, by way of example, the method for manufacturing the high-frequency copper clad laminate may include steps S1 to S6, and further includes steps S7 and S8. Of course, in some embodiments, the method for manufacturing the high-frequency copper clad laminate may include steps S1 to S6, and only includes step S8. Step S8 can be simply referred to as "cutting". In step S8, the edges of the high-frequency copper clad laminate can be cut according to actual needs so that the size of the high-frequency copper clad laminate meets the usage requirements.

[0073] More specifically, the flexible web 200 includes a trimming portion 210 and a functional portion 220. The trimming portion 210 is arranged in a frame shape, the functional portion 220 is arranged inside the frame of the trimming portion 210, and is only partially connected to the trimming portion 210. The micro-structure 400 and the micro-mesh holes 500 are both arranged on the functional portion 220;

[0074] Trimming the high-frequency copper clad laminate (i.e., step S8) includes the following steps:

[0075] S81. Trim the high-frequency copper clad laminate with the connection between the trimming part 210 and the functional part 220 as the boundary.

[0076] As Figure 2 and Figure 3 shown, in this embodiment, by way of example, the trimming part 210 can be set in the shape of a rectangular frame, and the functional part 220 is arranged within the rectangular frame of the trimming part 210 and is spaced from the trimming part 210. The trimming part 210 and the functional part 220 are only connected at some positions. In step S81, when trimming the high-frequency copper clad laminate, the trimming position is the connection between the trimming part 210 and the functional part 220.

[0077] It can be understood that in this embodiment, by reasonably setting the structure of the flexible web 200 and at the same time reasonably selecting the trimming position of the high-frequency copper clad laminate after it is prepared, it can be made that only a small part of the flexible web 200 exists on the outer edge of the high-frequency copper clad laminate, while there is relatively more adhesive 320, thereby improving the structural stability of the high-frequency copper clad laminate.

[0078] More specifically, the functional part 220 and the trimming part 210 are connected through a connecting part 230, and the connecting part 230 is arranged on the side of the flexible web 200 away from its shiny surface.

[0079] As Figure 2 and Figure 3 shown, in this embodiment, by way of example, the thickness of the trimming part 210 can be equal to the thickness of the functional part 220 and greater than the thickness of the connecting part 230. The connecting part 230 can be arranged on the side of the flexible web 200 away from its shiny surface, that is, the side not in contact with the copper foil 100. When the adhesive 320 melts, it can also fill between the connecting part 230 and the copper foil 100. When trimming the high-frequency copper clad laminate, the outer edge position of the high-frequency copper clad laminate is in direct contact with the copper foil 100 through the adhesive 320.

[0080] It can be understood that in this embodiment, by further setting the structure of the flexible web 200, the structural stability of the outer edge position of the high-frequency copper clad laminate can be particularly improved.

[0081] More specifically, the connecting part 230 is set in a strip shape or a sheet shape and there are several of them, and the several connecting parts 230 are spaced apart within the frame of the trimming part 210.

[0082] As Figure 2 and Figure 4As shown, in this embodiment, by way of example, a number of strips or sheets may be provided in both the length direction and the width direction of the trimming portion 210, and they are arranged at equal intervals. When the flexible web 200 is demolded from its mold, the trimming portion 210 and the functional portion 220 are not likely to be completely separated due to the existence of a number of connecting portions 230. During the "hot pressing" process, the melted glue 320 can be filled between the connecting portion 230 and the copper foil 100 through the gap between two adjacent connecting portions 230.

[0083] It can be understood that through the further reasonable setting of the structure of the flexible web 200 in this embodiment, it is not only easy to prepare and process the flexible web 200, but also facilitates the melted glue 320 to fill all the voids in the flexible web 200 to ensure the structural stability of the outer edge position of the high-frequency copper clad laminate.

[0084] Embodiment Two

[0085] Embodiment Two of the present application provides a high-frequency copper clad laminate, which is prepared by using any one of the high-frequency copper clad laminate manufacturing methods provided by the present application.

[0086] By preparing the flexible web 200 in the present application, during the processes of "sheet matching" and "hot pressing", the glass fiber cloth 310 can be supported and limited by the micro-structure 400 of the flexible web 200, so that the flexible web 200 can be laid flat and evenly distributed, ensuring the high-frequency signal transmission performance of the glass fiber cloth-based double-sided copper clad laminate; at the same time, the melted glue 320 in the matrix can contact the copper foil 100 through the micro-mesh holes 500 of the flexible web 200 to achieve effective bonding, reducing the influence of the setting of the flexible web 200 on the structural stability of the glass fiber cloth-based double-sided copper clad laminate.

[0087] The above are all the preferred embodiments of the present application. The protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A method for manufacturing a high-frequency copper-clad laminate, characterized in that: The high-frequency copper-clad laminate manufacturing method comprises: Applying glue (320) on the glass fiber cloth (310), wherein the glue (320) includes brominated epoxy resin; The glass fiber cloth (310) coated with the glue (320) is baked so that the glue (320) is in a semi-cured state and an adhesive sheet (300) is obtained; According to the size of the copper foil (100), the adhesive sheet (300) is cut into a corresponding size; A flexible mesh (200) is prepared, wherein the flexible mesh (200) is made of an insulating material with a melting point greater than that of the brominated epoxy resin, one side of the flexible mesh (200) is set as a glossy surface, and the other side is provided with a microstructure (400), wherein the microstructure (400) is evenly distributed, and the flexible mesh (200) further comprises a plurality of micro-meshes (500), wherein the micro-meshes (500) are evenly distributed and are arranged in a staggered manner with respect to the microstructure (400); Laminating and assembling the copper foil (100), the flexible web (200), the adhesive sheet (300), the flexible web (200) and the copper foil (100) in the order of stacking to obtain a product to be laminated; The product to be pressed is subjected to hot pressing so that the glue (320) of the adhesive sheet (300) melts again and flows through the micro mesh (500) to the copper foil (100), and at the same time, the microstructure (400) passes through the pores of the glass fiber cloth (310), so as to finally obtain a high-frequency copper clad laminate.

2. The method for manufacturing a high-frequency copper-clad laminate according to claim 1, characterized in that: A method for preparing a flexible mesh film (200) includes: Preparing a mold for the flexible mesh (200); The flexible mesh (200) is cast into shape using a mold of the flexible mesh (200).

3. The method for manufacturing a high-frequency copper-clad laminate according to claim 2, characterized in that: The mold for preparing the flexible mesh (200) comprises: Preparing a lower mold of the flexible mesh (200), wherein the lower mold is provided with a casting space having a configuration opposite to that of the flexible mesh (200); An upper mold for preparing the flexible web film (200) is provided with a glossy surface, and the upper mold abuts against the lower mold through its glossy surface.

4. The method for manufacturing a high-frequency copper-clad laminate according to claim 1, characterized in that: After the product to be pressed is hot-pressed so that the glue (320) of the adhesive sheet (300) is melted again to flow through the micro-mesh (500) to the copper foil (100), and the microstructure (400) passes through the pores of the glass fiber cloth (310), and finally a high-frequency copper-clad laminate is obtained, the high-frequency copper-clad laminate manufacturing method further includes: The two sides of the high-frequency copper-clad laminate where the copper foil (100) is located are heated separately.

5. The method for manufacturing a high-frequency copper-clad laminate according to claim 4, characterized in that: The two sides of the high-frequency copper-clad laminate where the copper foil (100) is located are heated separately, comprising: preparing a heating body having a size corresponding to the copper foil (100); The heating body is placed face-to-face with the copper foil (100) so as to heat the copper foil (100) through the heating body.

6. The method for manufacturing a high-frequency copper-clad laminate according to claim 1 or 4, characterized in that: After the product to be pressed is hot-pressed so that the glue (320) of the adhesive sheet (300) is melted again to flow through the micro-mesh (500) to the copper foil (100), and the microstructure (400) passes through the pores of the glass fiber cloth (310), and finally a high-frequency copper-clad laminate is obtained, the high-frequency copper-clad laminate manufacturing method further includes: The high-frequency copper-clad laminate is trimmed.

7. The method for manufacturing a high-frequency copper-clad laminate according to claim 6, characterized in that: The flexible mesh (200) comprises a trimming portion (210) and a functional portion (220), the trimming portion (210) being arranged in a frame shape, the functional portion (220) being arranged in the frame of the trimming portion (210) and only partially connected to the trimming portion (210), and the microstructure (400) and the micromesh (500) being arranged on the functional portion (220); The high-frequency copper-clad laminate is trimmed, including: The high-frequency copper-clad laminate is trimmed with the connection between the trimming portion (210) and the functional portion (220) as the boundary.

8. The method for manufacturing a high-frequency copper-clad laminate according to claim 7, characterized in that: The functional portion (220) is connected to the trimming portion (210) via a connecting portion (230), and the connecting portion (230) is arranged on a side of the flexible web (200) away from its glossy surface.

9. The method for manufacturing a high-frequency copper-clad laminate according to claim 8, characterized in that: The connecting portion (230) is configured in a strip or sheet shape, and is provided in plurality, and the plurality of connecting portions (230) are distributed at intervals within the frame of the trimming portion (210).

10. A high frequency copper clad laminate, characterized in that: The high-frequency copper clad laminate is prepared by the high-frequency copper clad laminate manufacturing method according to any one of claims 1 to 9.

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