Shaping and welding assembly apparatus

Abstract

The application discloses a shaping and welding assembly device, which comprises a rack, a supply mechanism, a transfer positioning device, a first material moving mechanism, a shaping mechanism, a welding mechanism, a PCB feeding mechanism and a second material moving mechanism, wherein the rack is provided with a welding assembly station; the transfer positioning device is used for positioning a capacitor and is arranged on the rack; the first material moving mechanism is arranged on one side of the transfer positioning device and is used for conveying the capacitor from the supply mechanism to the transfer positioning device; the shaping mechanism is arranged on one side of the transfer positioning device; the second material moving mechanism is used for conveying the capacitor from the transfer positioning device to the shaping mechanism and conveying the capacitor on the shaping mechanism to the welding assembly station; the PCB feeding mechanism is used for conveying a PCB to the welding assembly station; and the welding mechanism is arranged on one side of the PCB feeding mechanism. The shaping and welding assembly device can improve the overall work efficiency.

Description

Technical Field

[0001] This invention relates to the field of PCB board welding and assembly of electronic components, and particularly to a shaping welding and assembly equipment. Background Technology

[0002] In the PCB manufacturing process, various electronic components, including capacitors, need to be assembled and soldered onto the PCB. Capacitors are typically soldered to their corresponding positions on the PCB using shaping and soldering assembly equipment. Existing shaping and soldering assembly equipment usually involves a supply unit providing capacitors one by one to a robotic arm. The robotic arm then clamps and fixes the capacitors onto a lead-shaping mechanism for shaping. Next, the robotic arm transports the shaped capacitors to the soldering assembly station, where the soldering mechanism solders them to their corresponding positions on the PCB. However, in existing shaping and soldering assembly equipment, the robotic arm needs to work with the lead-shaping mechanism to clamp and position the capacitors as they sequentially transport them from the supply unit to the lead-shaping mechanism and then to the soldering assembly station. Only after the capacitors are shaped can the robotic arm transport them to the soldering assembly station before moving on to the next capacitor. This setup results in low overall efficiency for the shaping and soldering assembly equipment. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a shaping and welding assembly device that can improve overall work efficiency.

[0004] According to an embodiment of the present invention, a shaping and welding assembly equipment includes a frame, a supply mechanism, a transfer and positioning device, a first material transfer mechanism, a shaping mechanism, a welding mechanism, a PCB loading mechanism, and a second material transfer mechanism. The frame is provided with a welding assembly station. The transfer and positioning device is used to position capacitors and is disposed on the frame. The first material transfer mechanism is disposed on one side of the transfer and positioning device and is used to transport capacitors from the supply mechanism to the transfer and positioning device. The shaping mechanism is used to clamp capacitors and shape the leads of the capacitors and is disposed on one side of the transfer and positioning device. The second material transfer mechanism is used to transport capacitors from the transfer and positioning device to the shaping mechanism and to transport capacitors on the shaping mechanism to the welding assembly station. The PCB loading mechanism is used to transport PCB boards to the welding assembly station. The welding mechanism is disposed on one side of the PCB loading mechanism and is used to weld and assemble the capacitors located at the welding assembly station to the PCB board.

[0005] The shaping and welding assembly equipment according to embodiments of the present invention has at least the following beneficial effects: In the process of the shaping mechanism shaping the previous capacitor and the second material transfer mechanism transferring the capacitor to the welding assembly station, the first material transfer mechanism can transport the capacitor from the supply mechanism to the transfer positioning device and pre-position the capacitor by the transfer positioning device. After the second material transfer mechanism transports the previous capacitor to the welding assembly station, the second material transfer mechanism can directly transport the positioned next capacitor to the shaping mechanism so that the shaping mechanism can clamp and shape the next capacitor. Thus, the overall working efficiency of the shaping and welding assembly equipment can be improved.

[0006] According to some embodiments of the present invention, the frame is provided with a first station, a second station, and a third station. The supply mechanism is capable of conveying capacitors one by one to the first station. The first transfer mechanism includes a first moving platform, a second moving platform, and a first gripping device. The transfer positioning device is installed on the first moving platform, and the first gripping device is installed on the second moving platform. The second moving platform is capable of driving the first gripping device to transfer capacitors between the first station and the second station. The first moving platform is capable of driving the transfer positioning device to first move to the second station to receive capacitors and then move to the third station. The second transfer mechanism is capable of conveying capacitors from the transfer positioning device located at the third station to the shaping mechanism.

[0007] According to some embodiments of the present invention, the second mobile platform includes a horizontal moving device and a rotating device, wherein the rotating device is mounted on the horizontal moving device or the horizontal moving device is mounted on the rotating device, the rotating device is used to drive the first gripping device to rotate, and the horizontal moving device is used to drive the first gripping device to move between the first workstation and the second workstation.

[0008] According to some embodiments of the present invention, the supply mechanism includes: a vibratory feeder for holding capacitors, the vibratory feeder having a discharge port; a linear vibratory conveying device including a linear vibrator and a first receiving plate and a second receiving plate mounted on the linear vibrator, the first receiving plate and the second receiving plate being arranged at an angle, one end of the second receiving plate being connected to or close to one end of the first receiving plate, so that the first receiving plate and the second receiving plate enclose a linear vibratory material channel, the linear vibratory material channel communicating with the discharge port, the first receiving plate being inclined relative to the horizontal direction, the first receiving plate being used to support the peripheral sidewalls of the capacitor, and the second receiving plate being used to support the top end of the capacitor; a hanging plate being disposed at the end of the first receiving plate away from the second receiving plate, the hanging plate being used to suspend the leads of the capacitor; and a guiding structure being disposed on one side of the first receiving plate, the guiding structure being used to suspend the leads of the capacitor on the hanging plate in a uniform bending direction.

[0009] According to some embodiments of the present invention, the linear vibrating conveyor is provided with a separation structure for separating the capacitors at the bottom away from the hanging plate from the linear vibrating conveyor channel.

[0010] According to some embodiments of the present invention, the separation structure includes a capacitor drop-out port, the capacitor drop-out port is disposed on the second receiving plate, the capacitor drop-out port is disposed opposite to the hanging plate, and a capacitor recycling device is disposed on the side of the capacitor drop-out port away from the hanging plate.

[0011] According to some embodiments of the present invention, the guiding structure includes: a guiding plate disposed on the side of the mounting plate opposite to the second receiving plate, the guiding plate having a guiding gap with the mounting plate for the lead of the capacitor to pass through; and / or a magnet mounted on the side of the mounting plate opposite to the second receiving plate, wherein when the lead of the capacitor is suspended on the mounting plate, the magnet is located on one side of the lead of the capacitor to attract and guide the lead of the capacitor.

[0012] According to some embodiments of the present invention, the transfer positioning device includes a positioning seat for receiving capacitors, a positioning plate, a first driving module, and a clamping module. One end of the positioning seat is provided with a first positioning part, and the positioning plate is disposed opposite to the first positioning part. The first driving module can drive the positioning plate to move closer to or away from the first positioning part. The positioning plate and the first positioning part are used to cooperate with each other to axially position the capacitor on the positioning seat. The clamping module is used to radially clamp the capacitor on the positioning seat.

[0013] According to some embodiments of the present invention, the shaping mechanism includes: a shaping positioning block mounted on the frame; a clamping device for clamping a capacitor, the clamping device being mounted on the frame; a first shaping device arranged axially with the clamping device along the capacitor axis, the shaping positioning block being located between the clamping device and the first shaping device, the first shaping device including a second driving module and a first shaping plate, the second driving module being used to drive the first shaping plate to move in a direction inclined to the axial direction of the capacitor to move closer to or further away from the shaping positioning block, the first shaping plate being provided with two spaced-apart... The first shaping plate moves closer to the shaping positioning block, and the shaping positioning block is at least partially inserted between the two shaping parts. The two shaping parts are used to shape the two leads of the capacitor in a one-to-one correspondence with the shaping positioning block. The second shaping device and the third shaping device are arranged opposite each other along the radial direction of the capacitor. The shaping positioning block is located between the third shaping device and the second shaping device. The second shaping device is used to shape one lead of the capacitor in cooperation with the shaping positioning block, and the third shaping device is used to shape the other lead of the capacitor in cooperation with the shaping positioning block.

[0014] According to some embodiments of the present invention, the shaping and positioning block includes a second positioning part and a third positioning part. The third positioning part is located on the side of the second positioning part away from the first shaping device. One end of the third positioning part facing the second shaping device protrudes from the second positioning part, and the other end of the third positioning part facing the third shaping device protrudes from the second positioning part. The side of the third positioning part away from the second positioning part is used to abut against a positioning capacitor. The end of the third positioning part facing the second shaping device and the end facing the third shaping device are used to cooperate with the two shaping parts one-to-one to shape the pins of the capacitor. The opposite sides of the second positioning part are used to cooperate with the second shaping device and the third shaping device one-to-one to shape the pins of the capacitor.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the shaping and welding assembly equipment according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram of the shaping and welding assembly equipment (with the second material transfer mechanism and welding mechanism hidden);

[0019] Figure 3 for Figure 1 A schematic diagram of the supply mechanism for the shaping and welding assembly equipment is shown.

[0020] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0021] Figure 5 for Figure 3 Enlarged view of point B in the middle;

[0022] Figure 6 for Figure 3 The diagram shown illustrates the connection between the supply mechanism of the shaping and welding assembly equipment and the vibratory feeder and the linear vibratory feed channel.

[0023] Figure 7 for Figure 1 A schematic diagram showing the relationship between the shaping mechanism, the transfer positioning device, and the first material transfer mechanism of the shaping and welding assembly equipment;

[0024] Figure 8 for Figure 6 A schematic diagram showing the relationship between the first shaping device and the shaping positioning block of the shaping mechanism of the shaping welding assembly equipment;

[0025] Figure 9 for Figure 6 A schematic diagram showing the relationship between the shaping positioning block and the second and third shaping devices in the shaping mechanism of the shaping welding assembly equipment;

[0026] Figure 10 for Figure 1 A schematic diagram of the transfer and positioning device of the shaping and welding assembly equipment is shown;

[0027] Figure 11 for Figure 1 A schematic diagram of the second material transfer mechanism and welding mechanism of the shaping and welding assembly equipment is shown.

[0028] Figure 12 for Figure 1 A schematic diagram of the welding mechanism of the shaping and welding assembly equipment is shown.

[0029] Figure 13 for Figure 1 A schematic diagram of the second material transfer mechanism of the shaping and welding assembly equipment is shown;

[0030] Figure 14 for Figure 1 The diagram shows a schematic of the PCB loading device of the shaping and welding assembly equipment;

[0031] Figure 15 for Figure 1A schematic diagram of the capacitors processed by the shaping and welding assembly equipment is shown.

[0032] Figure label:

[0033] Frame 100, Second vision imaging device 110, Supply mechanism 200, Vibratory feeder 210, Spiral feeding track 211, Discharge port 212, Straight vibrator 220, First receiving plate 230a, Second receiving plate 230b, Capacitor drop port 231, Straight vibratory feed channel 232, Feed port 233, Material blocking device 240, Baffle 241, Reset component 242, Hanging plate 250, Capacitor recovery device 260, Guiding structure 270, Guiding plate 271, Magnet 272, Material guiding and deflecting component 280, Transition section 281, Transition groove 2 811, Guide steering unit 282, Steering channel 2821, Transfer positioning device 300, Positioning seat 310, First positioning unit 311, Positioning plate 320, First drive module 330, Clamping module 340, First material transfer mechanism 400, First moving platform 410, Lifting drive device 411, Horizontal drive device 412, Platform plate 413, Second moving platform 420, Horizontal moving device 421, Rotating device 422, First gripping device 430, Shaping mechanism 500, Shaping positioning block 510, Second positioning unit 511. Third positioning part; 512. Mounting plate; 513. Clamping device; 520. Clamping jaw; 521. Sixth drive module; 522. First shaping device; 530. Second drive module; 531. First shaping plate; 532. Shaping part; 5321. Second shaping device; 540. Second shaping component; 541. Third drive module; 542. Third shaping device; 550. Third shaping component; 551. Fourth drive module; 552. PCB loading mechanism; 600. PCB conveying device; 610. PCB positioning device; 620. PCB inspection device. 630, Spacing adjustment device 640, Second material transfer mechanism 700, Second gripping device 710, Fifth drive module 711, Gripping claw 712, Radial positioning claw 713, Radial positioning groove 7131, First vision imaging device 720, Third moving platform 730, Welding mechanism 800, Third vision imaging device 810, Fourth moving platform 821, Soldering iron 830, Solder feeding device 840, Angle adjustment device 850, Fixing component 851, Adjustment plate 852, Guide hole 8521, Capacitor 900, Pin 910. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0036] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0037] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0038] When supplying capacitor 900, existing suppliers cannot guarantee that the bottom orientation, axial position, and pin 910 orientation of capacitor 900 are all consistent. Therefore, when the robotic arm of existing forming and welding assembly equipment transports capacitor 900 to the forming mechanism for clamping, the robotic arm generally needs to work with the forming mechanism to adjust the position of capacitor 900 in order for the forming mechanism to accurately clamp capacitor 900, resulting in a slow clamping speed.

[0039] Reference Figure 1 and Figure 2According to an embodiment of the present invention, a shaping and welding assembly equipment includes a frame 100, a supply mechanism 200, a transfer positioning device 300, a first material transfer mechanism 400, a shaping mechanism 500, a PCB loading mechanism 600, a second material transfer mechanism 700, and a welding mechanism 800. The frame 100 is provided with a welding assembly station. The transfer positioning device 300 is used to position a capacitor 900 and is disposed on the frame 100. The first material transfer mechanism 400 is disposed on one side of the transfer positioning device 300 and is used to transport the capacitor 900 from the supply mechanism 200 to the transfer positioning device 300. The forming mechanism 500 is used to clamp the capacitor 900 and shape the pins 910 of the capacitor 900. The forming mechanism 500 is located on one side of the transfer positioning device 300. The second material transfer mechanism 700 is used to transport the capacitor 900 from the transfer positioning device 300 to the forming mechanism 500, and to transport the capacitor 900 on the forming mechanism 500 to the welding assembly station. The PCB loading mechanism 600 is used to transport the PCB board to the welding assembly station. The welding mechanism 800 is located on one side of the PCB loading mechanism 600. The welding mechanism 800 is used to weld and assemble the capacitor 900 located at the welding assembly station to the PCB board.

[0040] The shaping and welding assembly equipment provided by this invention allows for the following process: during the shaping mechanism 500 shaping the previous capacitor 900 and the second transfer mechanism 700 transferring the capacitor 900 to the welding assembly station, the first transfer mechanism 400 can transport the capacitor 900 from the supply mechanism 200 to the transfer positioning device 300, where the transfer positioning device 300 pre-positions the capacitor 900. After the second transfer mechanism 700 transports the previous capacitor 900 to the welding assembly station, the second transfer mechanism 700 can directly transport the positioned next capacitor 900 to the shaping mechanism 500 for clamping and shaping. Since the next capacitor 900 has already been positioned, the shaping mechanism 500 can quickly clamp the capacitor 900 without the second transfer mechanism 700 needing to adjust the position of the capacitor 900. This improves the clamping speed of the shaping mechanism 500 and ensures clamping accuracy, thereby improving the overall working efficiency of the shaping and welding assembly equipment.

[0041] Reference Figure 1 , Figure 2 and Figure 7According to some embodiments of the present invention, the frame 100 is provided with a first station, a second station and a third station. The supply mechanism 200 can transport the capacitors 900 one by one to the first station. The first transfer mechanism 400 includes a first moving platform 410, a second moving platform 420 and a first gripping device 430. The transfer positioning device 300 is installed on the first moving platform 410 and the first gripping device 430 is installed on the second moving platform 420. The second moving platform 420 can drive the first gripping device 430 to transfer the capacitors 900 between the first station and the second station. The first moving platform 410 can drive the transfer positioning device 300 to move to the second station to receive the capacitors 900 and then move to the third station. The second transfer mechanism 700 can transport the capacitors 900 from the transfer positioning device 300 at the third station to the shaping mechanism 500. With the above configuration, on the one hand, the process of the first transfer mechanism 400 conveying the capacitor 900 is separated into the process of the first moving platform 410 driving the transfer positioning device 300 to move and the process of the second moving platform 420 driving the first gripping device 430 to move, which can be carried out simultaneously, thereby improving the efficiency of the first transfer mechanism 400 in conveying the capacitor 900. On the other hand, when the transfer positioning device 300 moves to the third station, the transfer positioning device 300 can avoid the first gripping device 430 and approach the shaping mechanism 500, thereby facilitating the second transfer mechanism 700 to convey the capacitor 900 from the transfer positioning device 300 at the third station to the shaping mechanism 500.

[0042] like Figure 15 As shown, capacitor 900 has two ends along its axial direction, with one end of lead 910 being the bottom end and the other end being the top end. In actual production, the lead 910 of capacitor 900 is pre-bent before loading, typically with one or two bends. Figure 15 Taking capacitor 900 as an example, the lead 910 of capacitor 900 has two bends. Lead 910 extends from the bottom of capacitor 900 along its axial direction, then bends radially and then axially again. (Reference) Figure 15 When there is a bend in pin 910 of capacitor 900, pin 910 is led out from the bottom of capacitor 900 along the axial direction of capacitor 900 and then bent in the radial direction of capacitor 900.

[0043] Reference Figure 2 and Figure 7According to some embodiments of the present invention, the second mobile platform 420 includes a horizontal moving device 421 and a rotating device 422. The rotating device 422 is mounted on the horizontal moving device 421 or the horizontal moving device 421 is mounted on the rotating device 422. The rotating device 422 is used to drive the first gripping device 430 to rotate, and the horizontal moving device 421 is used to drive the first gripping device 430 to move between the first workstation and the second workstation. Thus, the first gripping device 430 can be rotated by the rotating device 422, thereby adjusting the axial direction of the capacitor 900 gripped by the first gripping device 430, and also adjusting the bottom orientation of the capacitor 900. The subsequent transfer positioning device 300 can more quickly achieve axial direction positioning of the capacitor 900.

[0044] Reference Figures 2 to 5 According to some embodiments of the present invention, the supply mechanism 200 includes a vibratory feeder 210, a direct vibration conveying device, a hanging plate 250, and a guiding structure 270. The vibratory feeder 210 is used to hold the capacitor 900 and is provided with a discharge port 212. The direct vibration conveying device includes a vibrator 220 and a first receiving plate 230a and a second receiving plate 230b mounted on the vibrator 220. The first receiving plate 230a and the second receiving plate 230b are arranged at an angle. One end of the second receiving plate 230b is connected to one end of the first receiving plate 230a or they are close to each other so that the first receiving plate 230a and the second receiving plate 230b enclose each other. A straight vibrating material channel 232 is formed, which is connected to the discharge port 212. The first receiving plate 230a is inclined relative to the horizontal direction and is used to support the peripheral sidewall of the capacitor 900. The second receiving plate 230b is used to support the top of the capacitor 900. The hanging plate 250 is set at the end of the first receiving plate 230a away from the second receiving plate 230b and is used to suspend the pins 910 of the capacitor 900. The guiding structure 270 is set on one side of the first receiving plate 230a and is used to suspend the pins 910 of the capacitor 900 in a uniform bending direction on the hanging plate 250.

[0045] For example, refer to Figure 3 The length direction of the second receiving plate 230b is the extension direction of the direct vibration channel 232. The lower end of the second receiving plate 230b is connected to or close to the lower end of the first receiving plate 230a. After the capacitor 900 is input into the direct vibration channel 232, the first receiving plate 230a is below the capacitor 900 to support the peripheral wall of the capacitor 900, and the second receiving plate 230b supports the top of the capacitor 900. That is, the axial direction of the capacitor 900 is along the width direction of the first receiving plate 230a, and the radial direction of the capacitor 900 is along the length direction of the first receiving plate 230a. Thus, the direct vibration channel 232 conveys the capacitor 900 radially.

[0046] With the above configuration, during operation, the vibratory feeder 210 can feed the capacitors 900 stored inside it one by one from the discharge port 212 into the direct vibration channel 232. The direct vibration channel 232 can transport the capacitors 900 radially. Before the capacitors 900 reach the abutment plate 250, due to the frictional resistance between the first receiving plate 230a and the peripheral wall of the capacitors 900, the capacitors 900 can roll on the first receiving plate 230a. Among them, when the capacitors 900 with their bottoms facing the abutment plate 250 roll to the abutment plate 250, their bottom pins 910 can rotate and abut against the abutment plate 250. Under the action of the guiding structure 270, the pins 910 of the capacitor 900 will be attached to the mounting plate 250 in a uniform bending direction. Thus, the supply mechanism 200 provided by the present invention can transport the capacitor 900 to the vibrating feed channel 232 and use the mounting plate 250 to screen out capacitors 900 with uniform bottom orientation and uniform pin 910 bending direction, so that the first transfer mechanism 400 can take away the capacitors 900 with pins 910 suspended on the mounting plate 250 from the vibrating feed channel 232. This allows the subsequent first transfer mechanism 400 or transfer positioning device 300 to save the step of adjusting the bottom orientation and pin 910 bending direction of the capacitor 900, further improving efficiency.

[0047] Reference Figure 3 , Figure 4 According to some embodiments of the present invention, the linear vibrating conveyor is provided with a separation structure, which is used to separate the capacitors 900 whose bottoms face away from the hanging plate 250 from the linear vibrating conveyor 232, so that the capacitors 900 conveyed to the end of the linear vibrating conveyor 232 away from the vibrating plate 210 are all capacitors 900 whose bottoms face the hanging plate 250 and whose leads 910 are suspended on the hanging plate 250 in a uniform bending direction, so that the first material transfer mechanism 400 can pick up materials from the end of the linear vibrating conveyor 232 away from the vibrating plate 210 without distinguishing the capacitors 900.

[0048] Reference Figure 3 , Figure 4 According to some embodiments of the present invention, the separation structure includes a capacitor drop-off port 231, which is disposed on the second receiving plate 230b. The capacitor drop-off port 231 is disposed opposite to the hanging plate 250, and a capacitor recycling device 260 is disposed on the side of the capacitor drop-off port 231 away from the hanging plate 250. (Refer to...) Figure 3As shown in the diagram, the capacitor drop outlet 231 is located below the mounting plate 250, and the capacitor recycling device 260 is located below the capacitor drop outlet 231. With this configuration, during the conveying of capacitors 900 via the vibrating feed channel 232, when capacitors 900 with their bottoms facing away from the mounting plate 250 pass through the capacitor drop outlet 231, since their leads 910 are not suspended on the mounting plate 250, these capacitors 900 with their bottoms facing away from the mounting plate 250 will fall into the capacitor recycling device 260. This separates the capacitors 900 with their bottoms facing away from the mounting plate 250 from the vibrating feed channel 232, ensuring that the capacitors 900 conveyed to the end of the vibrating feed channel 232 away from the vibrating plate 210 are all capacitors with their bottoms facing the mounting plate 250 and their leads 910 suspended on the mounting plate 250 in a uniform bending direction. This facilitates the first material transfer mechanism 400 in retrieving materials from the end of the vibrating feed channel 232 away from the vibrating plate 210.

[0049] Of course, it is conceivable that in other embodiments, the separation structure described above can also be configured in other ways. For example, the separation structure includes a separation groove, which is disposed on the side of the second receiving plate 230b facing the hanging plate 250. The separation groove is inclined relative to the length direction of the first receiving plate 230a to the inner wall of the first receiving plate 230a. Thus, during the process of conveying the capacitor 900 in the vibrating channel 232, the pins 910 of the capacitor 900 with its bottom facing away from the hanging plate 250 will fall into the separation groove. Then, the inner wall of the separation groove near the first receiving plate 230a abuts against the pins 910 of the capacitor 900 with its bottom facing away from the hanging plate 250, thereby pushing the bottom of the capacitor 900 with its bottom facing away from the hanging plate 250 to detach from the second receiving plate 230b, thereby separating the capacitor 900 with its bottom facing away from the hanging plate 250 from the vibrating channel 232.

[0050] Reference Figure 3 and Figure 5 According to some embodiments of the present invention, a feeding port 233 is provided at the end of the direct vibration feed channel 232 away from the discharge port 212. The feeding port 233 is located at the first working position, and a baffle device 240 for opening and closing the feeding port 233 is provided at the feeding port 233. Thus, when the downstream mechanism is not picking up material, the baffle device 240 closes the feeding port 233, so that the capacitor 900 conveyed to the feeding port 233 is temporarily stored in the feeding port 233 for the next material picking by the first material transfer mechanism 400. When the first material transfer mechanism 400 picks up material, the baffle device 240 opens the feeding port 233. With the above configuration, the automatic feeding mechanism of capacitor 900 feeds material at a fixed point, making it more convenient for the first material transfer mechanism 400 to pick up material.

[0051] Reference Figure 2 and Figure 7 For example, with Figure 7Taking the first material transfer mechanism 400 as an example, the loading port 233 is located at the first station, the first gripping device 430 is arranged opposite to the loading port 233, and the second moving platform 420 is located on the side of the first gripping device 430 away from the loading port 233. Thus, during the operation of the first material transfer mechanism 400, the horizontal moving device 421 of the second moving platform 420 first drives the first gripping device 430 to move from the second station to the first station. After the first gripping device 430 grips the capacitor 900 at the loading port 233, the horizontal moving device 421 drives the first gripping device 430 to carry the capacitor 900 back to the second station. Then, the rotating device 422 drives the first gripping device 430 to rotate, so that the axial direction of the capacitor 900 gripped by the first gripping device 430 is tilted from the relative horizontal direction to the horizontal. Then, the first gripping device 430 releases the capacitor 900 so that the transfer positioning device 300 at the second station can receive the capacitor 900.

[0052] It is conceivable that in other embodiments, the first material transfer mechanism 400 may also adopt other configurations. For example, the first material transfer mechanism 400 may include a multi-degree-of-freedom robotic arm, on which a vision imaging device and a first gripping device 430 are mounted. Thus, during the material handling process of the first material transfer mechanism 400, the position of the capacitor 900 with pin 910 suspended on the mounting plate 250 can be determined by the vision imaging device. Then, the multi-degree-of-freedom robotic arm drives the first gripping device 430 to directly remove the capacitor 900 with pin 910 suspended on the mounting plate 250. In this case, the separation structure and the material blocking device 240 mentioned above may not be necessary.

[0053] Reference Figure 3 , Figure 4 and Figure 15 According to some embodiments of the present invention, the guiding structure 270 includes a guiding plate 271, which is disposed on the side of the mounting plate 250 opposite to the second receiving plate 230b. A guiding gap exists between the guiding plate 271 and the mounting plate 250 to allow the leads 910 of the capacitor 900 to pass through. The length direction of the mounting plate 250 is along the conveying direction of the linear vibrating channel 232, and the guiding plate 271 is disposed along the length direction of the mounting plate 250. Therefore, for a capacitor 900 with two bends in its leads 910, the guiding plate 271 can press the second bend of the two leads 910 of the capacitor 900 onto the side of the guiding plate 271 closest to the first receiving plate 230a, so that the two leads 910 of the capacitor 900 are arranged along the length direction of the mounting plate 250, thereby achieving uniformity in the bending direction of the leads 910 of the capacitor 900.

[0054] Reference Figure 4According to some embodiments of the present invention, the guiding structure 270 includes a magnet 272, which is mounted on the side of the mounting plate 250 opposite to the second receiving plate 230b. The magnet 272 extends along the length of the mounting plate 250. When the leads 910 of the capacitor 900 are suspended on the mounting plate 250, the magnet 272 is located on one side of the leads 910 of the capacitor 900 to attract and guide the leads 910 of the guiding capacitor 900. Thus, when the two leads 910 of the capacitor 900 are made of iron, cobalt, nickel, or other materials that can be attracted by the magnet 272, the magnet 272 can hold the two leads 910 of the capacitor 900, so that the two leads 910 of the capacitor 900 are arranged along the length of the mounting plate 250, thereby achieving uniformity in the bending direction of the leads 910 of the capacitor 900. In addition, it can also prevent the leads 910 of the capacitor 900 from falling off the mounting plate 250.

[0055] In the specific implementation process, only one of the above-mentioned guide plate 271 and magnet 272 may be provided, or both may be provided at the same time.

[0056] It is conceivable that in other embodiments, the above-mentioned guiding structure 270 may also adopt other configuration methods. For example, the guiding structure 270 includes a guiding plate, which is disposed above the mounting plate 250. The guiding plate and the upper end of the mounting plate 250 enclose a pin guiding groove. Thus, when the pins 910 of the capacitor 900 are mounted on the mounting plate 250, the roots of the two pins 910 of the capacitor 900 are located in the pin guiding groove, so that the two pins 910 of the capacitor 900 are arranged along the length direction of the mounting plate 250, thereby achieving a uniform bending direction of the pins 910 of the capacitor 900. With this configuration method, regardless of whether the pins 910 of the capacitor 900 have undergone one or two preliminary bends, the guiding plate can achieve a uniform bending direction of the pins 910 of the capacitor 900 mounted on the mounting plate 250.

[0057] Reference Figure 3 and Figure 6 According to some embodiments of the present invention, the vibratory feeder 210 has a spiral feeding track 211, the upper end of which extends to the discharge port 212. The linear vibratory feed channel 232 is arranged along the feeding direction of the upper end of the spiral feeding track 211. The first receiving plate 230a is connected to the spiral feeding track 211 through a guide deflector 280. The guide deflector 280 is used to guide the axial direction of the capacitor 900 from the feeding direction along the upper end of the spiral feeding track 211 to the width direction along the first receiving plate 230a. With the above arrangement, the capacitor 900 output from the discharge port 212 can enter the linear vibratory feed channel 232 in an axial position along the width direction of the first receiving plate 230a, so as to achieve the goals of suspending the leads 910 of the capacitor 900 on the hanging plate 250 and aligning the leads 910.

[0058] Reference Figure 6 The material guiding and deflecting component 280 may include a transition portion 281 and a guiding and deflecting portion 282. The transition portion 281 has a transition groove 2811 that connects with the linear vibrating material channel 232. The inner wall of the transition groove 2811 transitions with the lower side wall of the discharge port 212 in an arc shape. The upper and lower projections of the guiding and deflecting portion 282 are arc-shaped. The lower end of the guiding and deflecting portion 282 is connected to the inner wall of the transition groove 2811. Thus, the guiding and deflecting portion 282 and the transition portion 281 enclose and form a deflecting channel 2821 with an arc-shaped upper and lower projection. The spiral feeding track 211 is connected to the turning channel 2821. With the above configuration, the capacitor 900 output by the spiral feeding track 211 can smoothly enter the transition groove 2811 through the turning channel 2821 and then enter the direct vibration material channel 232. When the capacitor 900 moves along the turning channel 2821, under the guidance of the turning channel 2821, the axial direction of the capacitor 900 changes from the feeding direction along the upper end of the spiral feeding track 211 to the width direction along the first receiving plate 230a.

[0059] It is conceivable that in some other embodiments, the linear vibrating feed channel 232 is perpendicular to the feeding direction of the upper end of the spiral feeding track 211. The linear vibrating feed channel 232 is connected to the upper end of the spiral feeding track 211, that is, the first receiving plate 230a and the second receiving plate 230b extend to the upper end of the spiral feeding track 211. The first receiving plate 230a is below the capacitor 900 that is fed to the upper end of the spiral feeding track 211. At this time, the upper end of the spiral feeding track 211 can push the capacitor 900 into the linear vibrating feed channel 232 in the horizontal direction. Since the first receiving plate 230a is inclined relative to the horizontal direction, during this process, the capacitor 900 rotates and tilts under the action of gravity until it is supported by the first receiving plate 230a. Thus, the axial rotation of the capacitor 900 is along the width direction of the first receiving plate 230a.

[0060] Reference Figure 3 and Figure 5 According to some embodiments of the present invention, the material blocking device 240 may include a reset member 242 and a baffle 241 rotatably disposed on the second receiving plate 230b. The reset member 242 is disposed between the baffle 241 and the second receiving plate 230b. Thus, when the first material transfer mechanism 400 takes the capacitor 900 from the feeding port 233, the capacitor 900 can push the material blocking plate to rotate from the blocking position to the clearance position so that the capacitor 900 can leave the feeding port 233. After the capacitor 900 leaves the feeding port 233, the material blocking plate automatically rotates to the blocking position under the action of the reset structure to close the feeding port 233. In this way, the material blocking device 240 does not require additional control and is convenient to use.

[0061] In other embodiments, the material blocking device 240 may also include a spring ball disposed between the second receiving plate 230b and the first receiving plate 230a, which automatically extends or retracts to open or close the feeding port 233.

[0062] Reference Figure 7 and Figure 10 The transfer positioning device 300 includes a positioning seat 310 for receiving a capacitor 900, a positioning plate 320, a first driving module 330, and a clamping module 340. One end of the positioning seat 310 is provided with a first positioning part 311. The positioning plate 320 is disposed opposite to the first positioning part 311. The first driving module 330 can drive the positioning plate 320 to move closer to or away from the first positioning part 311. The positioning plate 320 and the first positioning part 311 cooperate to axially position the capacitor 900 on the positioning seat 310. The clamping module 340 is used to radially clamp the capacitor 900 on the positioning seat 310. Thus, the transfer positioning device 300 can position the capacitor 900 axially and radially. Since the supply mechanism 200 provided by this invention has unified the positioning of the bottom orientation of the capacitor 900 and the bending direction of the pins 910, after the transfer positioning device 300 positions the capacitor 900, the bottom orientation, the bending direction of the pins 910, and the axial position of the capacitor 900 are all positioned.

[0063] In specific implementation, the clamping module 340 may include two positioning jaws and a clamping drive unit that drives the two positioning jaws to clamp or release the capacitor 900. The specific setting method will not be described in detail here.

[0064] Reference Figure 10 According to some embodiments of the present invention, the first mobile platform 410 includes a lifting drive device 411, a horizontal drive device 412, and a platform plate 413. The lifting drive device 411 is mounted on the frame 100, the platform plate 413 is mounted on the lifting drive device 411, the positioning seat 310 is horizontally slidably mounted on the platform plate 413, the clamping module 340 is mounted on the positioning seat 310, the horizontal drive device 412 is mounted on the platform plate 413, and the first drive module 330 is mounted on either the platform plate 413 or the positioning seat 310. The lifting drive device 411 drives the platform plate 413 to rise and fall, and the horizontal drive device 412 drives the positioning seat 310 to slide horizontally. With the above configuration, the first mobile platform 410 can drive the positioning seat 310 to rise and fall and slide horizontally, so that the positioning seat 310 can move between the third station and the second station.

[0065] In practice, the lifting drive device 411 can be configured as a lifting cylinder, a linear motor or other drive device.

[0066] In specific implementation, the horizontal drive device 412 may include a motor and a lead screw-nut transmission assembly driven by the motor. Of course, the horizontal drive device 412 may also be configured as a lifting cylinder or other drive device.

[0067] It is conceivable that in other embodiments, the aforementioned transfer positioning device 300 may also adopt other configuration methods. For example, the transfer positioning device 300 includes a positioning base 310, which is provided with a V-shaped placement groove. One end of the V-shaped placement groove is open and the other end is provided with a positioning wall. An adsorption module is provided on the positioning wall to adsorb and abut the top of the capacitor 900 against the positioning wall. An adsorption module may be provided on the bottom wall of the V-shaped placement groove to fix the capacitor 900 in the V-shaped placement groove.

[0068] It is conceivable that in some other embodiments, if a conventional supply mechanism 200 is used, since the conventional supply mechanism 200 cannot make the bottom of the capacitor 900 face the same direction and the bending direction of the pin 910 be the same, the first transfer mechanism 400 and the transfer positioning device 300 can be configured to make the bottom of the capacitor 900 face the same direction and the bending direction of the pin 910 be the same.

[0069] Reference Figures 7 to 9According to some embodiments of the present invention, the shaping mechanism 500 includes: a shaping positioning block 510, mounted on a frame 100; a clamping device 520 for clamping a capacitor 900, the clamping device 520 being mounted on the frame 100; and a first shaping device 530, arranged along the axial direction of the capacitor 900 with the clamping device 520. The shaping positioning block 510 is located between the clamping device 520 and the first shaping device 530. The first shaping device 530 includes a second driving module 531 and a first shaping plate 532. The second driving module 531 drives the first shaping plate 532 to move in a direction inclined to the axial direction of the capacitor 900 to approach or move away from the shaping positioning block 510. The first shaping plate 532 is provided with two spaced-apart shaping portions. 5321, when the first shaping plate 532 moves closer to the shaping positioning block 510, the shaping positioning block 510 is at least partially inserted between the two shaping parts 5321. The two shaping parts 5321 are used to shape the two pins 910 of the capacitor 900 in a one-to-one correspondence with the shaping positioning block 510. The second shaping device 540 and the third shaping device 550 are arranged opposite each other along the radial direction of the capacitor 900. The shaping positioning block 510 is located between the third shaping device 550 and the second shaping device 540. The second shaping device 540 is used to cooperate with the shaping positioning block 510 to shape one pin 910 of the capacitor 900, and the third shaping device 550 is used to cooperate with the shaping positioning block 510 to shape the other pin 910 of the capacitor 900. Therefore, the left and right pins 910 of the capacitor 900 can be bent by the first shaping plate 532 in conjunction with the shaping positioning block 510, and the left pin 910 of the capacitor 900 can be shaped from the left side by the second shaping device 540 in conjunction with the shaping positioning block 510, and the right pin 910 of the capacitor 900 can be shaped from the right side by the third shaping device 550 in conjunction with the shaping positioning block 510. Thus, the shaping mechanism 500 can replace the workers to complete the shaping of the pins 910 of the capacitor 900, reduce the intensity of manual labor, improve production efficiency, and the bending consistency of the pins 910 of the capacitor 900 is good, and the shaping accuracy is improved.

[0070] With the above configuration, the first shaping device 530, the second shaping device 540, and the third shaping device 550 can all cooperate with the same shaping positioning block 510 to shape the pins 910 of the capacitor 900. There is no need to perform shaping in different directions at different shaping stations, and the capacitor 900 is not transferred between different shaping stations. As a result, the capacitor 900 pin 910 shaping mechanism 500 has a compact layout, simple structure, and high shaping efficiency.

[0071] Reference Figure 7 and Figure 9In specific implementation, the clamping device 520 may include two clamping jaws 521 and a sixth drive module 522 for driving the two clamping jaws 521. Of course, the clamping device 520 may also adopt other configurations. For example, the clamping device 520 may include a clamping base with a V-shaped clamping groove and an adsorption module disposed on the clamping base. The specific configuration will not be described in detail here.

[0072] Reference Figure 8 and Figure 9 According to some embodiments of the present invention, the shaping and positioning block 510 includes a second positioning part 511 and a third positioning part 512. The third positioning part 512 is located on the side of the second positioning part 511 away from the first shaping device 530. One end of the third positioning part 512 facing the second shaping device 540 protrudes from the second positioning part 511, and the other end of the third positioning part 512 facing the third shaping device 550 protrudes from the second positioning part 511. The side of the third positioning part 512 away from the second positioning part 511 is used to abut against the positioning capacitor 900. The end of the third positioning part 512 facing the second shaping device 540 and the end facing the third shaping device 550 are used to cooperate with the two shaping parts 5321 one-to-one to shape the pins 910 of the capacitor 900. The two opposite sides of the second positioning part 511 are used to cooperate with the second shaping device 540 and the third shaping device 550 one-to-one to shape the pins 910 of the capacitor 900. Therefore, the second positioning part 511 can make the two pins 910 of the capacitor 900 parallel to each other after bending and shaping. The third positioning part 512, in cooperation with the shaping part 5321, can shape the bent parts of the two pins 910 of the capacitor 900. The third positioning part 512 can separate the pins 910 from the capacitor 900 to avoid the pins 910 squeezing the capacitor 900 during the shaping process.

[0073] Reference Figure 8 and Figure 9 According to some embodiments of the present invention, the shaping and positioning block 510 includes a mounting plate 513 mounted on a base, a second positioning part 511 mounted on the upper surface of the mounting plate 513, and a shaping part 5321 whose surface facing the mounting plate 513 can cooperate with the mounting plate 513 to shape the pins 910 of the capacitor 900. Thus, for a capacitor 900 that requires two bends in its pins 910, only the first shaping plate 532 and the shaping and positioning block 510 need to cooperate to simultaneously shape both bends in each pin 910 of the capacitor 900.

[0074] Reference Figure 7 and Figure 9According to some embodiments of the present invention, the second shaping device 540 includes a second shaping member 541 and a third driving module 542 for driving the second shaping member 541 to move, wherein one side of the second shaping member 541 facing the second positioning portion 511 is parallel to one side of the second positioning portion 511 facing the second shaping member 541; the third shaping device 550 includes a third shaping member 551 and a fourth driving module 552 for driving the third shaping member 551 to move, wherein one side of the third shaping member 551 facing the second positioning portion 511 is parallel to one side of the second positioning portion 511 facing the third shaping member 551.

[0075] Reference Figure 11 and Figure 13 In some embodiments, the second material transfer mechanism 700 includes a third moving platform 730, a second gripping device 710, and a first visual imaging device 720. The third moving platform 730 is mounted on the frame 100, and the second gripping device 710 and the first visual imaging device 720 are mounted on the third moving platform 730. The third moving platform 730 is used to drive the second gripping device 710 to move horizontally and move vertically. The frame 100 is provided with a second visual imaging device 110 for detecting the shaping quality of the pins 910 of the capacitor 900. Therefore, when the second transfer mechanism 700 picks up the capacitor 900 from the transfer positioning device 300, places the capacitor 900 to the shaping mechanism 500, and places the capacitor 900 to the PCB board at the welding assembly station, it can take pictures and correct deviations through the first vision imaging device 720 to ensure that the capacitor 900 is accurately picked up and placed. After the capacitor 900 has been shaped, it can be transferred by the second transfer mechanism 700 to the second vision imaging device 110 for imaging to check the shaping quality. The shaped capacitor 900 is then transported by the second transfer mechanism 700 to the PCB board at the welding assembly station.

[0076] Reference Figure 13 In some embodiments, the second gripping device 710 includes a fifth drive module 711 and two gripping claws 712. The two gripping claws 712 are arranged opposite to each other. The fifth drive module 711 can drive the two gripping claws 712 to move relative to each other to grip or release the capacitor 900 along the axial direction of the capacitor 900. In order to radially position the capacitor 900, a radial positioning claw 713 is installed on one side of the two gripping claws 712. The radial positioning claw 713 has a radial positioning groove 7131. When the two gripping claws 712 grip the capacitor 900 along the axial direction of the capacitor 900, the peripheral sidewall of the capacitor 900 abuts against the inner wall of the radial positioning groove 7131 to radially position the capacitor 900.

[0077] In other embodiments, the second gripping device 710 described above may also be configured in other ways. For example, the second gripping device 710 may include a gripping seat and a vacuum suction cup. A radial positioning groove 7131 is provided on the gripping seat, and a mounting hole is provided on the inner wall of the radial positioning groove 7131. The vacuum suction cup is installed in the mounting hole. Thus, the second material transfer mechanism 700 first moves the gripping seat to allow the capacitor 900 to enter the radial positioning groove 7131, and then the vacuum suction cup adsorbs and fixes the capacitor 900 on the inner wall of the radial positioning groove 7131.

[0078] It is conceivable that the first gripping device 430 described above can adopt a similar structure to the second gripping device 710. The specific arrangement of the first gripping device 430 will not be described in detail here.

[0079] Reference Figure 11 In some embodiments, the welding mechanism 800 is equipped with a third vision imaging device 810. Thus, the welding mechanism 800 welds the pins 910 of the capacitor 900 onto the PCB board, and then detects whether the welding is qualified by visual imaging.

[0080] Reference Figure 11 and Figure 12 In some embodiments, the soldering mechanism 800 includes a fourth moving platform 820, a soldering iron 830, and a solder feeding device 840. The solder feeding device 840 is mounted on the fourth moving platform 820. The soldering iron 830 is mounted on the fourth moving platform 820 via an angle adjustment device 850. The fourth moving platform 820 is used to drive the soldering iron 830 to move up and down and horizontally. The angle adjustment device 850 is used to adjust the soldering angle of the soldering iron 830. The solder feeding device 840 is used to feed solder to the soldering iron 830.

[0081] Reference Figure 11 and Figure 12 In some embodiments, the angle adjustment device 850 includes a fixing member 851 and an adjustment plate 852. The fixing member 851 is mounted on the fourth moving platform 820, and a locking bolt (not shown in the figure) is connected to the fixing member 851. The adjustment plate 852 has a guide hole 8521, which is arc-shaped. The locking bolt passes through the guide hole 8521 and can slide along the guide hole 8521. The locking bolt is used to lock the adjustment plate 852 to the fixing member 851. The soldering iron 830 is mounted on one end of the adjustment plate 852. Therefore, when the locking bolt is loosened, the adjustment plate 852 can rotate relative to the fixing member 851 around the center of the guide hole 8521, thereby adjusting the soldering angle of the soldering iron 830. After the adjustment is completed, the locking bolt is tightened again.

[0082] It is conceivable that in other embodiments, the angle adjustment device 850 may also adopt other configurations. For example, the angle adjustment device 850 may include an angle adjustment motor, which directly drives the soldering iron 830 to rotate.

[0083] Reference Figure 1 and Figure 14 In some embodiments, the PCB feeding mechanism 600 includes two PCB conveying devices 610, a PCB positioning device 620, and a PCB sensing device. The two PCB conveying devices 610 are spaced apart and are used to support the opposite ends of the PCB board in a one-to-one correspondence to cooperate in conveying the PCB board to the soldering assembly station. The PCB positioning device 620 and the PCB detection device 630 are located at the soldering assembly station. Both the PCB positioning device 620 and the PCB detection device 630 are electrically connected to the control system of the shaping and soldering assembly equipment. Thus, during the operation of the PCB feeding mechanism 600, the two PCB conveying devices 610 cooperate in conveying the PCB board to the soldering assembly station. During this process, the PCB conveying devices 610 can avoid electronic components on the lower surface of the PCB board. When the PCB detection device 630 detects that a PCB board has been conveyed to the soldering assembly station, the control system controls the PCB positioning device 620 to position the PCB board at the soldering assembly station. After the PCB board and the capacitor 900 are soldered and assembled, the PCB positioning device 620 releases the PCB board so that the PCB feeding mechanism 600 can convey the PCB board to the downstream equipment.

[0084] Reference Figure 14 In some embodiments, the PCB loading mechanism 600 further includes a spacing adjustment device 640, which is disposed on the frame 100. At least one of the two PCB conveying devices 610 is slidably disposed on the frame 100. The spacing adjustment device 640 is used to drive the two PCB conveying devices 610 to move relative to each other to adjust the spacing between the two PCB conveying devices 610. Thus, the PCB loading mechanism 600 can be used to convey PCBs of different widths.

[0085] During the operation of the shaping and welding assembly equipment, the detection data of each vision imaging device can be stored. When the product enters the downstream process, the detection data is transmitted to the downstream equipment together until the product is completed. The detection data of each product will serve as the traceability source of the product.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A shaping and welding assembly equipment, characterized in that, include: The frame (100) is equipped with a welding and assembly station; Supply organization (200); A transfer positioning device (300) is used to position the capacitor (900), and the transfer positioning device (300) is disposed on the frame (100). The first material transfer mechanism (400) is disposed on one side of the transfer positioning device (300) and is used to transfer the capacitor from the supply mechanism (200) to the transfer positioning device (300). A shaping mechanism (500) is used to clamp a capacitor (900) and shape the pins (910) of the capacitor (900). The shaping mechanism (500) is located on one side of the transfer positioning device (300). The second material transfer mechanism (700) is used to transfer the capacitor (900) from the transfer positioning device (300) to the shaping mechanism (500), and to transfer the capacitor (900) on the shaping mechanism (500) to the welding assembly station; PCB loading mechanism (600) is used to transport PCB boards to the soldering assembly station; A welding mechanism (800) is disposed on one side of the PCB loading mechanism (600), and the welding mechanism (800) is used to weld and assemble the capacitor (900) located at the welding assembly station to the PCB board. The supply mechanism (200) includes: a vibratory feeder (210) for holding capacitors (900), the vibratory feeder (210) having a discharge port (212); and a direct vibration conveying device including a direct vibrator (220) and a first receiving plate (230a) and a second receiving plate (230b) mounted on the direct vibrator (220), the first receiving plate (230a) and the second receiving plate (230b) being arranged at an angle, one end of the second receiving plate (230b) being connected to or close to one end of the first receiving plate (230a), so that the first receiving plate (230a) and the second receiving plate (230b) enclose to form a direct vibration material channel (232), the direct vibration material channel (232) and the discharge port The port (212) is connected. The first receiving plate (230a) is inclined relative to the horizontal direction. The first receiving plate (230a) is used to support the peripheral sidewall of the capacitor (900). The second receiving plate (230b) is used to support the top of the capacitor (900). The hanging plate (250) is set at the end of the first receiving plate (230a) away from the second receiving plate (230b). The hanging plate (250) is used to suspend the pins (910) of the capacitor (900). The guiding structure (270) is set on one side of the first receiving plate (230a). The guiding structure (270) is used to make the pins (910) of the capacitor (900) hang on the hanging plate (250) in a uniform bending direction. The guiding structure (270) includes: a guiding plate (271), which is disposed on the side of the mounting plate (250) away from the second receiving plate (230b), and there is a guiding gap between the guiding plate (271) and the mounting plate (250) for the lead (910) of the capacitor (900) to pass through; and / or a magnet (272), which is mounted on the side of the mounting plate (250) away from the second receiving plate (230b), and when the lead (910) of the capacitor (900) is suspended on the mounting plate (250), the magnet (272) is located on one side of the lead (910) of the capacitor (900) to attract and guide the lead (910) of the capacitor (900).

2. The shaping and welding assembly equipment according to claim 1, characterized in that, The frame (100) is provided with a first station, a second station, and a third station. The supply mechanism (200) can transport capacitors (900) one by one to the first station. The first transfer mechanism (400) includes a first moving platform (410), a second moving platform (420), and a first gripping device (430). The transfer positioning device (300) is installed on the first moving platform (410), and the first gripping device (430) is installed on the second moving platform (420). The second moving platform (420) can drive the first gripping device (430) to transfer the capacitor (900) between the first station and the second station. The first moving platform (410) can drive the transfer positioning device (300) to move to the second station to receive the capacitor (900) and then to the third station. The second material transfer mechanism (700) can transport the capacitor (900) from the transfer positioning device (300) at the third station to the shaping mechanism (500).

3. The shaping and welding assembly equipment according to claim 2, characterized in that, The second mobile platform (420) includes a horizontal moving device (421) and a rotating device (422). The rotating device (422) is mounted on the horizontal moving device (421) or the horizontal moving device (421) is mounted on the rotating device (422). The rotating device (422) is used to drive the first gripping device (430) to rotate. The horizontal moving device (421) is used to drive the first gripping device (430) to move between the first workstation and the second workstation.

4. The shaping and welding assembly equipment according to claim 1, characterized in that, The linear vibrating conveyor is provided with a separation structure, which is used to separate the capacitor (900) whose bottom is away from the hanging plate (250) from the linear vibrating channel (232).

5. The shaping and welding assembly equipment according to claim 4, characterized in that, The separation structure includes a capacitor drop-out port (231), which is disposed on the second receiving plate (230b). The capacitor drop-out port (231) is disposed opposite to the hanging plate (250), and a capacitor recycling device (260) is disposed on the side of the capacitor drop-out port (231) away from the hanging plate (250).

6. The shaping and welding assembly equipment according to claim 1, characterized in that, The transfer positioning device (300) includes a positioning seat (310) for receiving a capacitor (900), a positioning plate (320), a first drive module (330), and a clamping module (340). One end of the positioning seat (310) is provided with a first positioning part (311). The positioning plate (320) is disposed opposite to the first positioning part (311). The first drive module (330) can drive the positioning plate (320) to move closer to or away from the first positioning part (311). The positioning plate (320) and the first positioning part (311) are used to cooperate with each other to axially position the capacitor (900) on the positioning seat (310). The clamping module (340) is used to radially clamp the capacitor (900) on the positioning seat (310).

7. The shaping and welding assembly equipment according to claim 1, characterized in that, The shaping mechanism (500) includes: A shaping and positioning block (510) is installed on the frame (100). A clamping device (520) is used to clamp a capacitor (900), the clamping device (520) being mounted on the frame (100). A first shaping device (530) and a clamping device (520) are arranged along the axial direction of the capacitor (900). A shaping positioning block (510) is located between the clamping device (520) and the first shaping device (530). The first shaping device (530) includes a second driving module (531) and a first shaping plate (532). The second driving module (531) drives the first shaping plate (532) to move in a direction inclined to the axial direction of the capacitor (900). As the first shaping plate (532) moves closer to or away from the shaping positioning block (510), it is provided with two spaced-apart shaping parts (5321). When the first shaping plate (532) moves closer to the shaping positioning block (510), the shaping positioning block (510) is at least partially inserted between the two shaping parts (5321). The two shaping parts (5321) are used to shape the two pins (910) of the capacitor (900) in a one-to-one correspondence with the shaping positioning block (510). The second shaping device (540) and the third shaping device (550) are arranged opposite each other along the radial direction of the capacitor (900). The shaping positioning block (510) is located between the third shaping device (550) and the second shaping device (540). The second shaping device (540) is used to cooperate with the shaping positioning block (510) to shape one pin (910) of the capacitor (900). The third shaping device (550) is used to cooperate with the shaping positioning block (510) to shape the other pin (910) of the capacitor (900).

8. The shaping and welding assembly equipment according to claim 7, characterized in that, The shaping and positioning block (510) includes a second positioning part (511) and a third positioning part (512). The third positioning part (512) is located on the side of the second positioning part (511) away from the first shaping device (530). One end of the third positioning part (512) facing the second shaping device (540) protrudes from the second positioning part (511), and the other end of the third positioning part (512) facing the third shaping device (550) protrudes from the second positioning part (511). The third positioning part (512) is located away from the first shaping device (530). One side of the second positioning part (511) is used to abut against the positioning capacitor (900). The end of the third positioning part (512) facing the second shaping device (540) and the end facing the third shaping device (550) are used to cooperate with the two shaping parts (5321) to shape the pin (910) of the capacitor (900). The two opposite sides of the second positioning part (511) are used to cooperate with the second shaping device (540) and the third shaping device (550) to shape the pin (910) of the capacitor (900).

Images