Linkage transport trolley based on IGBT module and its dynamic and static test equipment

Abstract

The present invention provides a linkage transport trolley based on IGBT modules. The linkage transport trolley includes a trolley linkage platform. The trolley linkage platform is provided with three lifting and transporting platforms from right to left in sequence. The three lifting and transporting platforms have the same structure but are located at different workstations. The first lifting and transporting platform is close to the feeding position of the linkage transport trolley, wherein the third lifting and transporting platform is close to the discharging position of the linkage transport trolley. The first lifting and transporting platform includes a lifting platform, a translation stage assembly, and a high and low temperature temperature control assembly. The lifting platform is connected to the translation stage assembly, and the high and low temperature temperature control assembly is provided on the translation stage assembly. The present invention also provides a dynamic and static testing device based on the IGBT module, and the dynamic and static testing device is based on the above-mentioned linkage transport trolley. The linkage transport trolley based on the IGBT module and the dynamic and static testing device thereof described in the present invention can improve the testing efficiency and production efficiency of the IGBT module.

Description

Technical Field

[0001] The invention belongs to the technical field of IGBT equipment, and in particular relates to an IGBT module-based linkage transport trolley and a dynamic and static test device thereof. Background Art

[0002] IGBT modules (insulated gate bipolar transistors) are a type of power semiconductor device that is widely used in new energy vehicles, industrial equipment, rail transit, power grids, etc. After packaging, they need to undergo a series of related performance tests, among which the dynamic and static (AC+DC) parameter tests for IGBTs are particularly important for their quality and reliability.

[0003] The current solution for dynamic and static testing (AC+DC) of IGBT modules is that the first handling arm clamps a single IGBT to a special socket of the dynamic and static test machine DC, and then the first handling arm performs stress testing; after the test, the second handling arm is used to carry the IGBT to a special socket of the dynamic and static test AC, and then the second handling arm performs stress testing. The test time is long, during which the handling arm cannot carry the subsequent IGBT modules to be tested, nor can it perform other actions. The test efficiency is extremely low, and there is no efficient UPH (output per hour).

[0004] IGBT needs to maintain a specific high or low temperature during the test items. However, with current technology, the IGBT will lose temperature during the entire transportation and testing process, and it is impossible to maintain the constant temperature required by the IGBT, which has a serious impact on the test quality and reliability.

[0005] In addition, the market basically adopts single-station single-step transportation, and the test machine is large in size. Most of them adopt horizontal pressure testing, which has an adverse effect on the placement of the test machine and the space utilization of the test equipment. Summary of the invention

[0006] In view of this, the present invention aims to propose a linkage transport trolley based on IGBT modules and dynamic and static testing equipment thereof, so as to solve the problems that the IGBT will suffer from temperature loss during the entire transportation and testing process of the IGBT module, and the constant temperature required by the IGBT cannot be maintained; the IGBT module is transported in a single station and in a single step, and the testing efficiency is low; and the testing machine is large in size, and most of them adopt horizontal pressure testing, which has an adverse effect on the placement of the testing machine and the space utilization of the testing equipment.

[0007] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0008] The present invention provides a linkage transport trolley based on an IGBT module. The linkage transport trolley comprises a trolley linkage platform. Three lifting and transport platforms are arranged on the trolley linkage platform from right to left in sequence, including a first lifting and transport platform, a second lifting and transport platform, and a third lifting and transport platform. The three lifting and transport platforms have the same structure but are located at different workstations. The first lifting and transport platform is close to the feeding position of the linkage transport trolley, and the third lifting and transport platform is close to the discharging position of the linkage transport trolley. The first lifting and transport platform comprises a lifting platform, a translation stage assembly, and a high and low temperature temperature control assembly. The lifting platform is connected to the translation stage assembly, and a high and low temperature temperature control assembly is arranged on the translation stage assembly. The high and low temperature temperature control assembly is used for high and low temperature temperature control testing of the IGBT module.

[0009] Furthermore, a second position sensor is provided at the upper end of the lifting mechanism in the lifting platform, and a first position sensor is provided at the lower end of the lifting mechanism. The lifting mechanism is provided on the left side of the lifting platform substrate, and a jig mounting plate is installed above the lifting mechanism. A jig mounting plate is provided on the jig mounting plate, and a jig KIT for placing the IGBT module is provided on the jig mounting plate. The IGBT module is fixed to the jig KIT by positioning pins and platform positioning pins. The solenoid valve group is fixed on the right side of the lifting platform substrate, and a circuit control board group is provided above the solenoid valve group. The circuit control board group is connected to the lifting mechanism, and a safety partition is provided above the circuit control board group.

[0010] Furthermore, a first telescopic guide assembly, a second telescopic guide assembly and a jig KIT for placing the IGBT module are provided on the jig mounting plate, and the guide base plate in the first telescopic guide assembly is connected to the jig mounting plate by fasteners; one end of the guide member is connected to the second guide connecting member and the first guide connecting member, and the other end is connected to the clamping actuator; the telescopic member is guided by the first guide connecting member and finally acts on the clamping actuator; the first telescopic guide assembly and the second telescopic guide assembly have the same structure, and the two are respectively vertically installed on the adjacent two sides of the IGBT module.

[0011] Furthermore, the main support plate in the translation table assembly is connected to the auxiliary support plate through a connecting plate, main limit members are provided at the left and right ends of the moving guide rail on the main support plate and the moving guide rail is slidably connected to the main mounting plate, auxiliary limit members are provided at the left and right ends of the moving guide rail on the auxiliary support plate and the moving guide rail is slidably connected to the auxiliary mounting plate, two pairs of first sensors are provided between the main support plate and the auxiliary support plate, the translation cylinder is installed on the main support plate and connected to the main mounting plate; a cylinder limit plate is provided on the translation cylinder, and buffer mounting members are fixed at both ends of the translation cylinder to be limited, a fixed second buffer limiter is provided on the buffer mounting member, limit sensors are installed at both ends of the buffer mounting member, and the limit sensors are connected to the translation cylinder, the first sensor and the lifting mechanism.

[0012] Furthermore, the high and low temperature substrates in the high and low temperature temperature control assembly are fixed in cooperation with the translation stage assembly through guide holes, the second temperature sensor is fixed at the center of the high and low temperature substrate and there is a certain gap with the high and low temperature substrate, and the second temperature sensor protrudes from the surface of the high and low temperature substrate, the high and low temperature substrate is connected to the first temperature sensor, the heater, and the pipeline, and the temperature limit protector is connected to the heater; the thermal insulation cover is fixed above the high and low temperature substrate, the high and low temperature temperature control assembly passes through the compression spring through the guide shaft and is locked on the main mounting plate and the auxiliary mounting plate with the limit fastener; when the second temperature sensor is in contact with the surface of the IGBT module, the second temperature sensor detects the surface temperature of the IGBT module, and the first temperature sensor detects the temperature of the high and low temperature substrate.

[0013] Furthermore, a temperature regulating unit is provided in the high and low temperature control component, and the temperature regulating unit is connected to the heater, the first temperature sensor, the second temperature sensor, and the temperature limit protector. A preset temperature value and an alarm temperature value are set in the temperature regulating unit, and the alarm temperature value is greater than the preset temperature value. The temperature regulating unit works together with the heater and the fluid flowing into the high and low temperature substrate through the pipeline to keep the temperature of the high and low temperature substrate at the preset temperature value according to the preset temperature value; when the IGBT module is bonded to the high and low temperature substrate, the real-time temperature difference of the module is calculated according to the real-time temperature of the module fed back by the second temperature sensor and the preset temperature value, and when the real-time temperature difference is a negative value, the heater is adjusted to heat, and when the real-time temperature difference is a positive value, the heater stops heating; when the IGBT module is separated from the high and low temperature substrate, the temperature regulating unit maintains the temperature of the high and low temperature substrate at the preset temperature value; when the real-time temperature reaches the alarm temperature value, the temperature regulating unit controls the temperature limit protector to block the heating process of the heater and performs alarm processing.

[0014] Furthermore, when the linked transport trolley is in a normal temperature test environment, the lifting and transport platform adopts a normal temperature lifting and transport platform; the normal temperature lifting and transport platform includes a lifting platform and a detection component; the detection component includes a mounting part one, a mounting part two, and a second radiation sensor; the second radiation sensor is provided with two groups, which are respectively installed on the upper and lower sides of the mounting part one and the mounting part two.

[0015] Furthermore, the reciprocating motor in the trolley linkage platform is fixed on the base plate through a motor mounting part, a motor adjustment block is arranged between the reciprocating motor and the motor mounting part, the reciprocating motor is connected to the fixed adjustment part through a second moving belt, first limit members are arranged at both ends of the first reciprocating member and a first movable base plate is installed on the top, a return part is arranged on the first movable base plate, a third position sensor is arranged on the reciprocating motor, the first movable base plate is connected to the second moving belt through a belt connecting part, a drag chain fixing part is fixed on the base plate, and the drag chain is connected to the first movable base plate through a drag chain connecting part.

[0016] The present invention also provides a dynamic and static testing device based on IGBT modules. The dynamic and static testing device is based on the linkage transport trolley described in the above aspect, and includes a linkage transport trolley for carrying the IGBT modules at room temperature or constant temperature; a feeding flipping arm, which is located on one side of the feeding position of the linkage transport trolley and is used to flip the IGBT module with the heat dissipation metal plane facing downward from the previous process and clamp it to the linkage transport trolley; a test arm pressure testing mechanism, which is used to perform pressure testing on the IGBT module on the linkage transport trolley, and the test arm pressure testing mechanism is located in front of the linkage transport trolley, and includes a test arm main body, a No. 1 rotating shaft test head assembly, and a test arm pressure testing mechanism. , No. 2 rotating shaft test head assembly, the No. 1 rotating shaft test head assembly has the same structure as the No. 2 rotating shaft test head assembly but different test functions, the No. 1 rotating shaft test head assembly corresponds to the second lifting transport platform of the feeding position of the linked transport trolley, and the No. 2 rotating shaft test head assembly corresponds to the second lifting transport platform of the discharging position of the linked transport trolley; a discharging flipping arm, which is located on one side of the discharging position of the linked transport trolley, and is used to flip the IGBT module out so that the heat dissipating metal plane faces downward, waiting for subsequent processes; an IGBT dynamic and static testing machine, which is used to perform dynamic and static tests on the IGBT module, and the IGBT dynamic and static testing machine is located at the rear of the linked transport trolley.

[0017] Furthermore, the lifting arm seat and the sensor mounting strip in the feeding flipping arm are respectively installed on the flipping arm base plate; the first corresponding sensors are installed at both ends of the sensor adjusting member installed on the sensor mounting strip, the clamping cylinder is installed on the clamping connecting plate, and the clamping cylinder is provided with clamping claws at both ends; the lifting cylinder is installed on the upper end of the lifting arm seat and is connected to the motor shaft mounting member, the lifting arm seat is provided with a first buffer limiter at both ends of the lifting cylinder, the motor shaft mounting member is provided with a rotation limiter and a second sensor, the driving motor, the transmission and the coupling are installed on the motor shaft mounting member and are connected to the flipping arm plate, and the flipping arm plate is connected to the clamping connecting plate; the feeding flipping arm and the discharging flipping arm have the same structure except that the length of the flipping arm plate and the clamping connecting plate is different.

[0018] Compared with the prior art, the IGBT module-based linkage transport trolley and its dynamic and static testing equipment described in the present invention have the following advantages:

[0019] The linkage transport trolley in the present invention is used in both the dynamic and static test process of IGBT and the chip test and handling process. The dynamic and static test equipment adopts a modular combination of temperature-controlled linkage transport trolleys and multi-directional flip arms, which can realize the IGBT module to quickly and efficiently feed and test the IGBT test arm and discharge the material, thus realizing high-speed and high-quality testing of the IGBT module.

[0020] The dynamic and static testing equipment in the present invention adopts a linkage structural design as a whole, which simplifies the structure. Combined with the rotating test arm, it can improve the testing efficiency and production efficiency; the top-mounted temperature control and insulation structural design can achieve precise temperature control throughout the process or a more efficient non-temperature control mode; the overall operating logic is tight and orderly, and the modular design can achieve faster loading and unloading and better customization needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0022] In the attached picture:

[0023] Figure 1 It is an overall axle-side schematic diagram of the IGBT module-based linkage transport trolley and testing equipment according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the layout of the equipment for dynamic and static testing based on the IGBT module according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of a feeding flip arm in a dynamic and static testing device based on an IGBT module according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the first lifting and transporting platform in the linkage transport trolley based on the IGBT module according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the lifting platform in the linkage transport trolley based on the IGBT module according to an embodiment of the present invention;

[0028] Figure 6 This is a schematic structural diagram of a first telescopic guide assembly in a linkage transport trolley based on an IGBT module according to an embodiment of the present invention;

[0029] Figure 7 This is a schematic structural diagram of a translation platform assembly in a linkage transport trolley based on an IGBT module according to an embodiment of the present invention;

[0030] Figure 8 A side view of the structure of a translation platform assembly in a linkage transport trolley based on an IGBT module according to an embodiment of the present invention;

[0031] Fig. 9 This is a schematic diagram of the structure of the high and low temperature temperature control components in the linkage transport vehicle based on the IGBT module according to an embodiment of the present invention;

[0032] Fig.10A top view of the high and low temperature temperature control component structure of the linkage transport trolley based on the IGBT module according to an embodiment of the present invention;

[0033] Fig.11 This is a schematic diagram of the structure of a normal temperature lifting and transporting platform in a linkage transport trolley based on an IGBT module according to an embodiment of the present invention;

[0034] Fig.12 This is a schematic diagram of the structure of a detection component in a linkage transport trolley based on an IGBT module according to an embodiment of the present invention;

[0035] Fig.13 It is a schematic top view of the structure of the linkage platform of the linkage transport trolley based on the IGBT module according to an embodiment of the present invention.

[0036] Description of reference numerals:

[0037] 1. Feeding flip arm; 2. Linkage transport trolley; 3. Test arm pressure measurement mechanism; 4. Discharging flip arm; 5. IGBT dynamic and static test machine; 21. First lifting and transporting platform; 22. Second lifting and transporting platform; 23. Third lifting and transporting platform; 24. Trolley linkage platform; 31. No. 1 rotating shaft test head assembly; 32. No. 2 rotating shaft test head assembly; 210. Lifting platform; 213. First telescopic guide assembly; 214. Second telescopic guide assembly; 215. Translation stage assembly; 218. High and low temperature control assembly; 260. Detection assembly; 610. IGBT module; 1101. Flip arm substrate; 1102. Lifting arm seat; 1103. Lifting cylinder; 1104, motor shaft mounting member; 1105, rotation limiter; 1106, second sensor; 1107, coupling; 1108, transmission; 1109, driving motor; 1110, first buffer limiter; 1111, flip arm plate; 1112, clamping connecting plate; 1113, clamping cylinder; 1114, clamping claw member; 1115, sensor mounting strip; 1116, sensor adjustment member; 1117, first beam sensor; 2101, lifting stage substrate; 2102, lifting mechanism; 2103, first position sensor; 2104, second position sensor; 2105, fixture mounting plate; 2106, fixture KIT; 2107, positioning pin; 2108, carrier positioning pin; 2109, solenoid valve group; 2110, circuit control board group; 2111, safety partition; 2131, guide bottom plate; 2132, fastener; 2133, telescopic member; 2134, first guide limiter; 2135, second guide limiter; 2136, guide member; 2137, first guide connector; 2138, second guide connector; 2139, clamping actuator; 2151, main support plate; 2152, auxiliary support plate; 2153, connecting plate; 2154, first sensor; 2155, motion guide rail; 2156, auxiliary limiter; 2157, main limiter; 2158, auxiliary mounting plate; 2159, guide shaft; 2160, translation cylinder; 2161, main mounting plate; 2162, electrical drag chain; 2 163, drag chain mounting part; 2164, cylinder limit plate; 2165, buffer mounting part; 2166, second buffer limiter; 2167, limit sensor; 2168, compression spring; 2169, limit fastener; 2181, high and low temperature substrate; 2182, insulation cover; 2183, heater; 2184, pipeline; 2185, first temperature sensor; 2186, second temperature sensor; 2187, temperature limit protector; 2188, guide hole; 2401, substrate; 2402, reciprocating motor; 2403, motor mounting part; 2404, motor adjustment block; 2405, first speed change mechanism; 2406, second moving belt; 2407, fixed adjustment part; 2408, first reciprocating member; 2409, first limiter; 2410, first moving substrate;2411, return parts; 2412, third position sensor; 2413, belt connector; 2414, drag chain fixing; 2415, drag chain; 2416, drag chain connector; 2601, mounting part 1; 2602, mounting part 2; 2603, second counter-radiation sensor; A1, feeding position; A2, discharging position. ; DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0041] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0042] See also Figure 1-Figure 13As shown, this embodiment provides a linkage transport trolley based on the IGBT module, the linkage transport trolley 2 includes a trolley linkage platform 24, the trolley linkage platform 24 is provided with three lifting transport platforms from right to left, including a first lifting transport platform 21, a second lifting transport platform 22, and a third lifting transport platform 23. The three lifting transport platforms have the same structure but are located at different workstations. The first lifting transport platform 21 is close to the feeding position of the linkage transport trolley, and the third lifting transport platform 23 is close to the discharging position of the linkage transport trolley. The first lifting transport platform 21 includes a lifting platform 210, a translation stage assembly 215, and a high and low temperature temperature control assembly 218. The lifting platform 210 is connected to the translation stage assembly 215, and the high and low temperature temperature control assembly 218 is provided on the translation stage assembly 215. The high and low temperature temperature control assembly 218 is used for high and low temperature temperature control testing of the IGBT module.

[0043] Specifically, in the present embodiment, a second position sensor 2104 is provided at the upper end of the lifting mechanism 2102 in the lifting platform 210, and a first position sensor 2103 is provided at the lower end of the lifting mechanism 2102. The lifting mechanism 2102 is provided on the left side of the lifting platform substrate 2101. A jig mounting plate 2105 is installed above the lifting mechanism 2102. A jig KIT2106 for placing the IGBT module 610 is provided on the jig mounting plate 2105. The IGBT module 610 is fixed to the jig KIT2106 by means of a positioning pin 2107 and a platform positioning pin 2108. A solenoid valve group 2109 is fixed on the right side of the lifting platform substrate 2101. A circuit control board group 2110 is provided above the solenoid valve group 2109. The circuit control board group 2110 is connected to the lifting mechanism 2102, and a safety partition 2111 is provided above the circuit control board group 2110.

[0044] Specifically, in this embodiment, a first telescopic guide assembly 213, a second telescopic guide assembly 214 and a jig KIT2106 for placing the IGBT module 610 are provided on the jig mounting plate 2105. The guide base plate 2131 in the first telescopic guide assembly 213 is connected to the jig mounting plate 2105 by a fastener 2132. One end of the guide member 2136 is connected to the second guide connecting member 2138 and the first guide connecting member 2137, and the other end is connected to the clamping actuator 2139; the telescopic member 2133 is guided by the first guide connecting member 2137 and finally acts on the clamping actuator 2139; the first telescopic guide assembly 213 and the second telescopic guide assembly 214 have the same structure, and the two are respectively vertically installed on the adjacent two sides of the IGBT module 610.

[0045] Specifically, in this embodiment, the guide base plate 2131, the first guide limiter 2134, the second guide limiter 2135, the guide member 2136, the first guide connector 2137, and the second guide connector 2138 can be an integral part or a split assembly.

[0046] Specifically, in this embodiment, the main support plate 2151 in the translation stage assembly 215 is connected to the auxiliary support plate 2152 through the connecting plate 2153, the left and right ends of the motion guide rail 2155 on the main support plate 2151 are provided with main limit members 2157, and the motion guide rail 2155 is slidably connected to the main mounting plate 2161, the left and right ends of the motion guide rail 2155 on the auxiliary support plate 2152 are provided with auxiliary limit members 2156, and the motion guide rail 2155 is slidably connected to the auxiliary mounting plate 2158, and a main support plate 2151 is provided between the main support plate 2151 and the auxiliary support plate 2152. Two pairs of first sensors 2154 and a translation cylinder 2160 are installed on the main support plate 2151 and connected to the main mounting plate 2161; a cylinder limit plate 2164 is provided on the translation cylinder 2160, and buffer mounting parts 2165 are fixed at both ends of the translation cylinder 2160 to be limited, and a fixed second buffer limiter 2166 is provided on the buffer mounting part 2165. Limit sensors 2167 are installed at both ends of the buffer mounting part 2165, and the limit sensors 2167 are connected to the translation cylinder 2160, the first sensor 2154, and the lifting mechanism 2102.

[0047] Specifically, in this embodiment, the high and low temperature substrate 2181 in the high and low temperature control assembly 218 is fixed with the translation stage assembly 215 through the guide hole 2188, the second temperature sensor 2186 is fixed at the center of the high and low temperature substrate 2181 and there is a certain gap with the high and low temperature substrate 2181, and the second temperature sensor 2186 protrudes from the surface of the high and low temperature substrate 2181, the high and low temperature substrate 2181 is connected to the first temperature sensor 2185, the heater 2183, and the pipeline 2184, and the temperature limit protector 2187 is connected to the heater 2183. The heat exchanger 2183 is connected; the thermal insulation cover 2182 is fixed above the high and low temperature substrate 2181, and the high and low temperature control assembly 218 passes through the compression spring 2168 through the guide shaft 2159 and is locked on the main mounting plate 2161 and the auxiliary mounting plate 2158 by the limiting fastener 2169; when the second temperature sensor 2186 is in contact with the surface of the IGBT module 610, the second temperature sensor 2186 detects the surface temperature of the IGBT module 610, and the first temperature sensor 2185 detects the temperature of the high and low temperature substrate 2181.

[0048] Specifically, in this embodiment, a temperature regulating unit is provided in the high and low temperature control component 218, and the temperature regulating unit is connected to the heater 2183, the first temperature sensor 2185, the second temperature sensor 2186, and the temperature limit protector 2187. A preset temperature value and an alarm temperature value are set in the temperature regulating unit. The alarm temperature value is greater than the preset temperature value. The temperature regulating unit maintains the temperature of the high and low temperature substrate 2181 at the preset temperature value in combination with the heater and the fluid flowing into the high and low temperature substrate through the pipeline according to the preset temperature value; when the IGBT module is bonded to the high and low temperature substrate, the real-time temperature difference of the module is calculated according to the real-time temperature of the module fed back by the second temperature sensor in real time and the preset temperature value, and when the real-time temperature difference is a negative value, the heater is adjusted to heat, and when the real-time temperature difference is a positive value, the heater stops heating; when the IGBT module is separated from the high and low temperature substrate 2181, the temperature regulating unit maintains the temperature of the high and low temperature substrate at the preset temperature value; when the real-time temperature reaches the alarm temperature value, the temperature regulating unit controls the temperature limit protector to block the heating process of the heater and performs alarm processing.

[0049] Specifically, in this embodiment, when the linked transport trolley is in a normal temperature test environment, the lifting and transport platform adopts a normal temperature lifting and transport platform; the normal temperature lifting and transport platform includes a lifting platform 210 and a detection component 260; the detection component 260 includes a mounting part 1 2601, a mounting part 2602, and a second radiation sensor 2603. The second radiation sensor 2603 is provided with two groups, which are respectively installed on the upper and lower sides of the mounting part 1 2601 and the mounting part 2 2602.

[0050] Specifically, in this embodiment, the reciprocating motor 2402 in the trolley linkage platform 24 is fixed on the base plate 2401 through the motor mounting member 2403, and a motor adjustment block 2404 is arranged between the reciprocating motor 2402 and the motor mounting member 2403. The reciprocating motor 2402 is connected to the fixed adjustment member 2407 through the second moving belt 2406. The first reciprocating motion member 2408 is provided with a first limit member 2409 at both ends and a first movable base plate 2410 is installed on the top. The first movable base plate 2410 is provided with a return member 2411, and the reciprocating motor 2402 is provided with a third position sensor 2412. The first movable base plate 2410 is connected to the second moving belt 2406 through a belt connecting member 2413, a drag chain fixing member 2414 is fixed on the base plate 2401, and the drag chain 2415 is connected to the first movable base plate 2410 through a drag chain connecting member 2416.

[0051] The present embodiment also provides a dynamic and static test device based on the IGBT module, the dynamic and static test device is based on the linkage transport trolley described in the above aspect, and includes a linkage transport trolley 2, which is used to transport the IGBT module at room temperature or constant temperature; a feeding flip arm 1, which is located on one side of the feeding position of the linkage transport trolley, and is used to flip the IGBT module with the heat dissipation metal plane facing downward from the previous process and clamp it to the linkage transport trolley; a test arm pressure measurement mechanism 3, which is used to perform pressure measurement on the IGBT module on the linkage transport trolley, and the test arm pressure measurement mechanism is located in front of the linkage transport trolley, and includes a test arm body, a No. 1 shaft test head assembly 31, and a No. 2 shaft test head assembly 32. The test head assembly 32, the No. 1 shaft test head assembly 31 and the No. 2 shaft test head assembly 32 have the same structure but different test functions, the No. 1 shaft test head assembly 31 corresponds to the second lifting and transporting platform 22 of the feeding position of the linkage transport trolley, and the No. 2 shaft test head assembly 32 corresponds to the second lifting and transporting platform 22 of the discharging position of the linkage transport trolley; the discharging flip arm 4, which is located on the side of the discharging position of the linkage transport trolley, is used to flip the IGBT module on the linkage transport trolley so that the heat dissipation metal plane faces downward, waiting for subsequent processes; the IGBT dynamic and static testing machine 5, which is used to perform dynamic and static tests on the IGBT module, and the IGBT dynamic and static testing machine 5 is located at the rear of the linkage transport trolley.

[0052] Specifically, in this embodiment, the lifting arm seat 1102 and the sensor mounting bar 1115 in the feeding flip arm 1 are respectively mounted on the flip arm substrate 1101; the first beam sensors 1117 are installed at both ends of the sensor adjustment member 1116 mounted on the sensor mounting bar 1115, the clamping cylinder 1113 is mounted on the clamping connecting plate 1112, and the clamping claws 1114 are installed at both ends of the clamping cylinder 1113; the lifting cylinder 1103 is mounted on the upper end of the lifting arm seat 1102 and is connected to the motor shaft mounting member 1104, and the lifting arm seat 110 The first buffer limiter 1110 is provided at both ends of the corresponding lifting cylinder 1103, the motor shaft mounting member 1104 is provided with a rotation limiter 1105 and a second sensor 1106, the driving motor 1109, the transmission 1108 and the coupling 1107 are installed on the motor shaft mounting member 1104 and connected with the flip arm plate 1111, and the flip arm plate 1111 is connected with the clamping connecting plate 1112; the feeding flip arm 1 and the discharging flip arm 4 have the same structure except that the length of the flip arm plate 1111 and the clamping connecting plate 1112 is different.

[0053] In the embodiment, the overall steps from feeding and transportation to discharging are: the IGBT module with the heat dissipation metal plane facing downward from the previous process is placed in the feeding flip arm 1 and flipped over to the first lifting and transporting platform 21 of the feeding position A1; after the coordinated test of the linked transport trolley 2 and the test arm, the IGBT module is transported to the third lifting and transporting platform 23 of the discharging position A2; and then the IGBT module is flipped out by the discharging flip arm 4 so that the heat dissipation metal plane faces downward, waiting for subsequent processes.

[0054] In the real-time example, the action logic of the dynamic and static test equipment includes: the feeding flip arm 1 first returns to the initial state, that is, the lifting cylinder 1103 and the clamping cylinder 1113 are in a compressed state, and the flip arm is at the sensor detection end; when the manipulator clamps the IGBT module 610 with the heat dissipation metal plane facing down to the high position of the lifting cylinder 1103, the clamping claw 1114 on the clamping cylinder 1113 opens (the clamping claw 1114 is used to clamp the IGBT module 610), the lifting cylinder 1103 rises to a high position, the clamping cylinder 1113 drives the clamping claw 1114 to clamp, the first matching sensor 1117 detects the IGBT module (the first matching sensor 1117 is used to detect the presence or absence of the IGBT module 610), and the manipulator releases the module and leaves. The driving motor 1109 drives the flip arm plate to flip 180° to one end of the rotation limiter 1105 through the transmission 1108 and the coupling 1107. The rotation limiter 1105 limits the movement angle of the flip arm plate 1111 and the second sensor 1106 detects the rotation angle of the flip arm plate 1111.

[0055] When the linkage transport trolley 2 moves to the feeding position A1 for the first time, the lifting mechanism 2102 of the lifting platform 210 is in the compressed low position state, and the limit sensor 2167 detects that the translation cylinder 2160 of the translation platform assembly 215 is at the far end of the first sensor 2154, the lifting cylinder 1103 of the feeding flip arm 1 is compressed and descends, and the IGBT module is placed in the first lifting and transporting platform 21 at the feeding position A1 at this time. During the descent, the positioning hole on the IGBT module will fall into the positioning pin 2107 on the fixture KIT 2106. At this time, on the one hand, the clamping cylinder 1113 releases the clamping claw 1114, and the lifting cylinder 1103 rises and reverses 180° before waiting for the next IGBT; on the other hand, the first telescopic guide assembly 213 and the second telescopic guide assembly 214 on the side of the first lifting and transporting platform 21 will clamp the IGBT module through the clamping actuator 2139 to prevent shaking and deviation during movement. After the IGBT module is placed and the two pairs of first sensors 2154 on the translation platform assembly 215 detect that the state of the IGBT module is correct, the high and low temperature control assembly 218 with high temperature is translated to the near end of the first sensor 2154 through the translation cylinder 2160 and detected by the limit sensor 2167, the lifting mechanism 2102 rises to the high position and is detected by the second position sensor 2104. The metal plane of the IGBT module is attached to the high and low temperature substrate 2181, and the second temperature sensor 2186 is also attached to the IGBT module and its temperature is fed back in real time. In the entire process thereafter, the second temperature sensors 2186 on the first lifting and transporting platform 21, the second lifting and transporting platform 22, and the third lifting and transporting platform 23 will feed back the temperature of each IGBT module attached thereto in real time, and the fed-back temperature will be regulated by the high and low temperature control assembly 218. When the IGBT module is separated from the high and low temperature control component 218, the lifting mechanism 2102 first descends to a low position and is detected by the first position sensor 2103. Then, the high and low temperature control component 218 is translated to the far end of the first sensor 2154 through the translation cylinder 2160 and needs to be detected by the limit sensor 2167.

[0056] The high and low temperature control component 218 control logic is to preset a high temperature for the device, such as , heater 2183 heats to the target high temperature The first temperature sensor 2185 detects the feedback temperature. When the temperature is too low, heating continues. When the temperature is too high, the cooling liquid or cold air in the pipe 2184 flows into the flow channel in the high and low temperature substrate 2181. Together, the high and low temperature substrate 2181 is kept at the target temperature. When the IGBT module is attached to it, the second temperature sensor 2186 detects and feeds back the temperature of the IGBT module. When the module temperature is detected to be lower than the IGBT target temperature range, the heater 2183 gives priority to heating to ensure that the IGBT temperature is within the target range. When the IGBT module is separated from the high and low temperature substrate 2181, the high and low temperature substrate 2181 is kept at the target temperature. When the temperature is out of control, the temperature limit protector 2187 will immediately block the heating of the heater 2183 and sound an alarm to wait for processing.

[0057] The linked transport trolley 2 moves to the discharge position A2 for the first time. At this time, the first lifting and transporting platform 21 is facing one end of the No. 1 rotating shaft test head assembly 31 of the test arm pressure measuring mechanism 3. At this time, the lifting mechanism 2102 of the lifting platform 210 descends and disengages from the high and low temperature control assembly 218. The high and low temperature control assembly 218 returns to the proximal end of the first sensor 2154 to wait for the next IGBT module, and the first lifting and transporting platform 21 rises to the high position again; at the same time, the No. 1 rotating shaft test head assembly 31 descends and is positioned with the platform positioning pin 2108 on the first lifting and transporting platform 21. After descending to the limit point of the platform positioning pin 2108, the first telescopic guide assembly 213 and the second telescopic guide assembly 214 release the clamping actuator 2139, and one end of the No. 1 rotating shaft test head assembly 31 clamps the IGBT module and retracts, and then rotates forward. , the first IGBT module starts stress testing.

[0058] While the pressure test is being performed, the linked transport trolley moves to the feeding position A1 for the second time; the second IGBT module is placed into the first lifting transport platform 21 through the feeding flip arm 1 and fits with the high and low temperature control component 218 to maintain high temperature. The linked transport trolley 2 moves to the discharge position A2 for the second time, and the pressure test of the first IGBT module on the No. 1 shaft test head assembly 31 is completed. At this time, on the No. 1 shaft test head assembly 31: the second IGBT module is detached from the high and low temperature control component 218, and is clamped and retracted from one end of the No. 1 shaft test head assembly 31, while the end of the No. 1 shaft test head assembly 31 that clamps the first IGBT module is also retracted; then it rotates in the opposite direction. , the second IGBT module starts pressure testing. At this time, on the second shaft test head assembly 32: no IGBT module does not work.

[0059] While the pressure test is being performed, the linkage transport trolley moves to the feeding position A1 three times; the first IGBT module is placed in the second lifting transport platform 22 and fits with the high and low temperature temperature control component 218 to maintain high temperature; the third IGBT module is placed in the first lifting transport platform 21 through the feeding flip arm 1 and fits with the high and low temperature temperature control component 218 to maintain high temperature. The linkage transport trolley 2 moves to the discharge position A2 for the third time, and the pressure test of the second IGBT module on the No. 1 shaft test head assembly 31 is completed. At this time, on the No. 1 shaft test head assembly 31, the third IGBT module is detached from the high and low temperature temperature control component 218, one end of the No. 1 shaft test head assembly 31 is clamped and retracted, and at the same time, one end of the No. 1 shaft test head assembly 31 that clamps the second IGBT module is also retracted; then rotate forward. , the third IGBT module begins pressure testing. At this time, on the second shaft test head assembly 32, the first IGBT module is separated from the high and low temperature control assembly 218, and is clamped and retracted with one end of the second shaft test head assembly 32, and then rotated forward. , the first IGBT module starts the secondary stress test.

[0060] While the pressure test is in progress, the linkage transport trolley moves to the feeding position A1 for the fourth time; the first IGBT module is placed in the third lifting transport platform 23 and fits with the high and low temperature control component 218 to maintain high temperature; the second IGBT module is placed in the second lifting transport platform 22 and fits with the high and low temperature control component 218 to maintain high temperature; the fourth IGBT module is placed in the first lifting transport platform 21 through the feeding flip arm 1 and fits with the high and low temperature control component 218 to maintain high temperature. The linkage transport trolley 2 moves to the discharging position A2 for the fourth time. The pressure test of the third IGBT module on the No. 1 rotating shaft test head assembly 31 is completed. At this time on the No. 1 rotating shaft test head assembly 31: the fourth IGBT module is detached from the high and low temperature control component 218, and is clamped and retracted from one end of the No. 1 rotating shaft test head assembly 31, and at the same time, one end of the No. 1 rotating shaft test head assembly 31 that clamps the third IGBT module is also retracted; then it rotates in the opposite direction. , the third IGBT module begins pressure testing. At this time, on the second shaft test head assembly 32, the second IGBT module is separated from the high and low temperature control assembly 218, one end of the second shaft test head assembly 32 is clamped and retracted, and at the same time, the end of the second shaft test head assembly 32 holding the first IGBT module is also retracted, and then rotated in the opposite direction. , the second IGBT module starts the secondary pressure test. At this time, on the third lifting and transporting platform 23, the first IGBT module is separated from the high and low temperature control component 218, and the initial state of the unloading flip arm 4 is raised to the high position by the lifting cylinder 1103, and then the clamping cylinder 1113 is opened to flip the arm The third lifting and transporting platform 23 rises to a high position, and after the unloading and flipping arm 4 has clamped the first IGBT module, it flips back to the initial state and waits for subsequent processes.

[0061] After the IGBT of the third lifting transport platform 23 is discharged, the linkage transport trolley moves to the feeding position A1 for the fifth time. After that, the transport feeding trolley system repeats the action of the linkage transport trolley moving to the feeding position A1 for the fourth time and the linkage transport trolley 2 moving to the discharging position A2 for the fourth time, and the feeding flip arm 1, the linkage transport trolley, and the discharging flip arm circulate the action, and the test is run quickly and efficiently.

[0062] When the high and low temperature control test is not required, two embodiments are given: the first embodiment is that, while retaining the high and low temperature control component 218, the logical actions of the translation stage component 215 and the high and low temperature control component 218 are cancelled in the above implementation scheme, and the translation cylinder 2160 in the translation stage component 215 always performs the action at the far end of the first sensor 2154, and always detects the existence of the limit sensor 2167 at the far end of the first sensor 2154. The second embodiment is that, while not retaining the high and low temperature control component 218, the translation stage component 215 and the high and low temperature control component 218 are cancelled in the above structure and replaced with the detection component 260, and all three transport platforms with high and low temperature control are replaced with normal temperature lifting transport platforms. Similarly, in the above implementation scheme, it is only necessary to cancel the logical actions of the translation stage assembly 215 and the high and low temperature control assembly 218, and synchronously replace the functional actions of the first sensor 2154 with the second counter-shooting sensor 2603, without the need for additional sensor detection and actuators. A group of second counter-shooting sensors 2603 arranged on one side of the mounting part 1 2601 is used to detect whether the IGBT module is skewed, and a group of second counter-shooting sensors 2603 arranged on one side of the mounting part 2602 is used to detect the presence or absence of the IGBT module.

[0063] When high-temperature and high-low temperature control tests are required, the above embodiment can be used for other high-temperature and low-temperature process test environments and normal temperature test environments after the material is discharged to the discharging flip arm 4. If the subsequent test environment only requires a normal temperature test environment, in the above embodiment, the third lifting and transporting platform 23 can also be directly replaced with a normal temperature lifting and transporting platform, and the logical action of the normal temperature lifting and transporting platform is executed, and the temperature can be lowered after the IGBT module enters the normal temperature lifting and transporting platform. It should be noted that the high and low temperature control components 218 on the first lifting and transporting platform 21, the second lifting and transporting platform 22, and the third lifting and transporting platform 23 can be set with different target temperatures to meet different temperature control requirements. Therefore, when the third lifting and transporting platform 23 is not replaced with a normal temperature lifting and transporting platform, the temperature control and action of the high and low temperature control components 218 on the third lifting and transporting platform 23 can still be turned off to achieve the purpose of natural cooling in advance; or the target temperature of the high and low temperature control components 218 on the third lifting and transporting platform 23 can be set to low temperature to achieve the purpose of rapid cooling.

[0064] The linkage transport trolley is used in both the dynamic and static test process of IGBT and the chip test and handling process. The dynamic and static test equipment adopts a modular combination of temperature-controlled linkage transport trolleys and multi-directional flip arms, which can realize the IGBT module to quickly and efficiently feed and test the IGBT test arm and discharge the material, realizing high-speed and high-quality testing of the IGBT module. The dynamic and static test equipment adopts a linkage structure design as a whole, which simplifies the structure. With the rotating test arm, it can improve the test efficiency and production efficiency; the top-mounted temperature control and insulation structure design can realize precise temperature control throughout the process or a more efficient non-temperature control mode; the overall operation logic is tight and orderly, and the modular design can achieve faster loading and unloading, and better customization needs.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A linkage transport trolley based on IGBT module, characterized in that: The linkage transport trolley includes: A lifting and transporting platform, a trolley linkage platform, and a normal temperature lifting and transporting platform. The trolley linkage platform is provided with three lifting and transporting platforms from right to left, including a first lifting and transporting platform, a second lifting and transporting platform, and a third lifting and transporting platform. The three lifting and transporting platforms have the same structure but are located at different workstations. The first lifting and transporting platform is close to the feeding position of the linkage transport trolley, and the third lifting and transporting platform is close to the discharging position of the linkage transport trolley. The first lifting and transporting platform includes a lifting platform, a translation stage assembly, and a high and low temperature temperature control assembly. The lifting platform is connected to the translation stage assembly, and the high and low temperature temperature control assembly is arranged on the translation stage assembly. The high and low temperature temperature control assembly is used for high and low temperature control testing of IGBT modules; the normal temperature lifting and transporting platform is used for normal temperature testing environment of IGBT modules; a second position sensor is arranged at the upper end of the lifting mechanism in the lifting platform, and a first position sensor is arranged at the lower end of the lifting mechanism. The lifting mechanism is arranged on the lifting platform substrate On the left side, a jig mounting plate is installed above the lifting mechanism, and a jig KIT for placing the IGBT module is provided on the jig mounting plate. The IGBT module is fixed to the jig KIT by a locating pin and a carrier locating pin, and the solenoid valve group is fixed to the right side of the lifting carrier substrate, and a circuit control board group is provided above the solenoid valve group, and the circuit control board group is connected to the lifting mechanism, and a safety partition is provided above the circuit control board group; a first telescopic guide assembly, a second telescopic guide assembly and a jig KIT for placing the IGBT module are provided on the jig mounting plate, and the guide base plate in the first telescopic guide assembly is connected to the jig mounting plate by fasteners; one end of the guide member is connected to the second guide connecting member and the first guide connecting member, and the other end is connected to the clamping actuator; the telescopic member is guided by the first guide connecting member and finally acts on the clamping actuator; the first telescopic guide assembly has the same structure as the second telescopic guide assembly, and the two are respectively vertically installed on the adjacent two sides of the IGBT module.

2. The IGBT module-based linkage transport trolley according to claim 1, characterized in that: The main support plate in the translation table assembly is connected to the auxiliary support plate through a connecting plate, main limit members are arranged at the left and right ends of the moving guide rail on the main support plate, and the moving guide rail is slidably connected to the main mounting plate, auxiliary limit members are arranged at the left and right ends of the moving guide rail on the auxiliary support plate, and the moving guide rail is slidably connected to the auxiliary mounting plate, two pairs of first sensors are arranged between the main support plate and the auxiliary support plate, the translation cylinder is installed on the main support plate and connected to the main mounting plate; a cylinder limit plate is arranged on the translation cylinder, and buffer mounting members are fixed at both ends of the translation cylinder to be limited, a fixed buffer limiter is arranged on the buffer mounting member, and limit sensors are installed at both ends of the buffer mounting member, and the limit sensor is connected to the translation cylinder, the first sensor and the lifting mechanism.

3. The IGBT module-based linkage transport trolley according to claim 1, characterized in that: The high and low temperature substrate in the high and low temperature temperature control assembly is fixed in cooperation with the translation stage assembly through the guide hole, the second temperature sensor is fixed at the center of the high and low temperature substrate and there is a certain gap with the high and low temperature substrate, and the second temperature sensor protrudes from the surface of the high and low temperature substrate, the high and low temperature substrate is connected with the first temperature sensor, the heater, and the pipeline, and the temperature limit protector is connected with the heater; the thermal insulation cover is fixed above the high and low temperature substrate, the high and low temperature temperature control assembly passes through the compression spring through the guide shaft and is locked on the main mounting plate and the auxiliary mounting plate with the limit fastener; when the second temperature sensor is in contact with the surface of the IGBT module, the second temperature sensor detects the surface temperature of the IGBT module, and the first temperature sensor detects the temperature of the high and low temperature substrate.

4. The IGBT module-based linkage transport trolley according to claim 3, characterized in that: A temperature regulating unit is provided in the high and low temperature control assembly, and the temperature regulating unit is connected to the heater, the first temperature sensor, the second temperature sensor, and the temperature limit protector. A preset temperature value and an alarm temperature value are set in the temperature regulating unit, and the alarm temperature value is greater than the preset temperature value. The temperature regulating unit works together with the heater and the fluid flowing into the high and low temperature substrate through the pipeline to keep the temperature of the high and low temperature substrate at the preset temperature value according to the preset temperature value; When the IGBT module is attached to the high and low temperature substrate, the real-time temperature difference of the module is calculated according to the real-time temperature of the module fed back by the second temperature sensor and the preset temperature value. When the real-time temperature difference is a negative value, the heater is adjusted to heat, and when the real-time temperature difference is a positive value, the heater stops heating. When the IGBT module is separated from the high and low temperature substrate, the temperature adjustment unit maintains the temperature of the high and low temperature substrate at the preset temperature value. When the real-time temperature reaches the alarm temperature value, the temperature adjustment unit controls the temperature limit protector to block the heating process of the heater and performs alarm processing.

5. The IGBT module-based linkage transport trolley according to claim 1, characterized in that: When the linked transport trolley is in a normal temperature test environment, the lifting and transport platform adopts a normal temperature lifting and transport platform; the normal temperature lifting and transport platform includes a lifting platform and a detection component; the detection component includes a mounting part 1, a mounting part 2, and a second radiation sensor; the second radiation sensor is provided with two groups, which are respectively installed on the upper and lower sides of the mounting part 1 and the mounting part 2.

6. The IGBT module-based linkage transport trolley according to claim 1, characterized in that: The reciprocating motor in the trolley linkage platform is fixed on the base plate through a motor mounting part, a motor adjustment block is arranged between the reciprocating motor and the motor mounting part, the reciprocating motor is connected to the fixed adjustment part through a second moving belt, first limit members are arranged at both ends of the first reciprocating member and a first movable base plate is installed on the top, a return part is arranged on the first movable base plate, a third position sensor is arranged on the reciprocating motor, the first movable base plate is connected to the second moving belt through a belt connecting part, a drag chain fixing part is fixed on the base plate, and the drag chain is connected to the first movable base plate through a drag chain connecting part.

7. A dynamic and static test device based on IGBT module, characterized in that: The dynamic and static testing equipment is based on the linkage transport trolley described in any one of claims 1 to 6, which includes: a linkage transport trolley, which is used to transport the IGBT module at room temperature or constant temperature; a feeding flipping arm, which is located on one side of the feeding position of the linkage transport trolley, and is used to flip the IGBT module with the heat dissipation metal plane facing downward from the previous process and clamp it to the linkage transport trolley; a test arm pressure testing mechanism, which is used to perform pressure testing on the IGBT module on the linkage transport trolley, and the test arm pressure testing mechanism is located in front of the linkage transport trolley, and includes a test arm body, a No. 1 rotating shaft test head assembly, and a No. 2 rotating shaft test head assembly The No. 1 rotating shaft test head assembly has the same structure as the No. 2 rotating shaft test head assembly but different test functions. The No. 1 rotating shaft test head assembly corresponds to the second lifting and transport platform of the feeding position of the linked transport trolley, and the No. 2 rotating shaft test head assembly corresponds to the second lifting and transport platform of the discharging position of the linked transport trolley; the discharging flipping arm is located on one side of the discharging position of the linked transport trolley, and is used to flip the IGBT module out so that the heat dissipation metal plane faces downward, waiting for subsequent processes; the IGBT dynamic and static testing machine is used to perform dynamic and static tests on the IGBT module, and the IGBT dynamic and static testing machine is located at the rear of the linked transport trolley.

8. The dynamic and static testing equipment based on IGBT module according to claim 7, characterized in that: The lifting arm seat and the sensor mounting strip in the feeding flipping arm are respectively installed on the flipping arm base plate; the first shooting sensors are installed at both ends of the sensor adjusting member installed on the sensor mounting strip, the clamping cylinder is installed on the clamping connecting plate, and the clamping cylinder is provided with clamping claws at both ends; the lifting cylinder is installed on the upper end of the lifting arm seat and is connected to the motor shaft mounting member, and the lifting arm seat is provided with buffer limiters at both ends of the lifting cylinder, and the motor shaft mounting member is provided with a rotation limiter and a second sensor, the driving motor, the transmission and the coupling are installed on the motor shaft mounting member and are connected to the flipping arm plate, and the flipping arm plate is connected to the clamping connecting plate; the feeding flipping arm and the discharging flipping arm have the same structure except that the length of the flipping arm plate and the clamping connecting plate is different.

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