An uv-resistant epoxy resin copper clad plate and a manufacturing method thereof

Abstract

The application provides an anti-UV epoxy resin copper-clad plate, and a resin glue solution used in the manufacturing of the anti-UV epoxy resin copper-clad plate is made of the following components in parts by weight: bisphenol A type epoxy resin 45-55 parts, flame retardant 18-22 parts, curing agent 7-10 parts, accelerator 0.1-0.2 parts, filler 45-48 parts, and solvent 60-65 parts. The application also provides a manufacturing method of the epoxy resin copper-clad plate. The epoxy resin copper-clad plate provided by the application has good anti-UV performance, heat resistance and mechanical properties.

Description

TECHNICAL FIELD

[0001] The present application relates to a copper clad plate, in particular to a UV-resistant epoxy resin copper clad plate and a manufacturing method thereof. BACKGROUND

[0002] With the demand of light, thin, short, small and digitalization of electronic products, miniaturization, multifunction, high performance and high reliability become the mainstream development direction, which makes the PCB towards high density, high multi-layer, and the process requirements of line width, line spacing, hole diameter, hole wall and the like in the production of PCB industry also gradually develop towards high integration, high density and high multi-layer. With the development of high density mounting technology, especially the full implementation of lead-free and the rapid development of surface mount technology, the requirements for the performance of copper clad plate are getting higher and higher.

[0003] The copper clad plate is a composite material of resin and reinforcing material, which is formed by hot pressing and covered with copper foil on one side or both sides. The copper clad plate mainly includes glass cloth-based copper clad plate, non-woven cloth-based copper clad plate, composite-based copper clad plate and synthetic fiber cloth-based copper clad plate. Epoxy resin is widely used in copper clad plate, and epoxy resin has the characteristics of small curing shrinkage, high viscosity of cured product and good chemical corrosion resistance. However, with the upgrading of electronic products, the traditional epoxy resin-based copper clad plate does not perform well in terms of heat resistance and UV resistance. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a UV-resistant epoxy resin copper clad plate which has good UV resistance, heat resistance and mechanical properties.

[0005] To solve the above technical problems, the technical scheme of the present application is as follows:

[0006] A UV-resistant epoxy resin copper clad plate, the resin glue solution used in the manufacture of the UV-resistant epoxy resin copper clad plate is made of the following components by weight: 45-55 parts of bisphenol A type epoxy resin, 18-22 parts of flame retardant, 7-10 parts of curing agent, 0.1-0.2 parts of accelerator, 45-48 parts of filler and 60-65 parts of solvent.

[0007] Further, the bisphenol A type epoxy resin of the present application is epoxy resin E-44.

[0008] Further, the flame retardant of the present application is methyl phenyl diphenyl phosphate.

[0009] Further, the curing agent of the present application is 4,4'-diaminodiphenyl methane.

[0010] Further, the accelerator of the present application is 2-ethyl-4-methyl imidazole.

[0011] Further, the filler is prepared by the following steps:

[0012] A1. Add aluminum nitrate into deionized water to mix uniformly to obtain an aluminum nitrate solution, add titanium dioxide into an aqueous ethanol solution to ultrasonically stir for 30 minutes to obtain a titanium dioxide suspension, add the aluminum nitrate solution and ammonia water into the titanium dioxide suspension, adjust the pH value to 10, heat to 110°C and then keep for 4 hours to obtain a reaction liquid one, centrifuge the reaction liquid one to obtain solid one, wash the solid one with anhydrous ethanol and deionized water for 3 times respectively, dry and then place in a muffle furnace to calcine at 500°C for 3 hours to obtain an aluminum-titanium composite oxide;

[0013] A2. Add vinyltriethoxysilane into anhydrous ethanol, adjust the pH value to 5 and then stir to mix uniformly to obtain a silane solution, add the aluminum-titanium composite oxide obtained in step A1 into the silane solution, heat to 65°C and then stir to react for 7 hours to obtain a reaction liquid two, centrifuge the reaction liquid two to obtain solid two, wash the solid two with anhydrous ethanol and deionized water for 3 times respectively, dry to obtain a pretreated aluminum-titanium composite oxide;

[0014] A3. Add the pretreated aluminum-titanium composite oxide obtained in step A2, styrene, PVP and AIBN into an aqueous ethanol solution, pass nitrogen gas, heat to 85°C, stir to react for 9 hours to obtain a reaction liquid three, centrifuge the reaction liquid three to obtain solid three, wash the solid three with anhydrous ethanol and deionized water for 3 times respectively, dry to obtain the filler.

[0015] Further, in step A1, the titanium dioxide is rutile titanium dioxide, the concentration of the aluminum nitrate solution is 0.2 g / mL, the volume concentration of the aqueous ethanol solution is 50%, the ratio of the titanium dioxide to the aqueous ethanol solution is 0.1 g:1 mL, the concentration of the ammonia water is 0.25 g / mL, the volume ratio of the aluminum nitrate solution, the ammonia water and the titanium dioxide suspension is 1:0.2:1, the centrifugation speed is 5000 rpm, the centrifugation time is 10 minutes, the drying temperature is 75°C and the drying time is 8 hours;

[0016] In step A2, the weight ratio of the vinyltriethoxysilane, the anhydrous ethanol and the aluminum-titanium composite oxide obtained in step A1 is 1:50:40, the centrifugation speed is 5000 rpm, the centrifugation time is 10 minutes, the drying temperature is 75°C and the drying time is 8 hours;

[0017] In step A3, the volume concentration of the aqueous ethanol solution is 50%, the weight ratio of the pretreated aluminum-titanium composite oxide obtained in step A2, the styrene, the PVP, the AIBN and the aqueous ethanol solution is 50:2.5:50:100:1000, the centrifugation speed is 5000 rpm, the centrifugation time is 10 minutes, the drying temperature is 75°C and the drying time is 8 hours.

[0018] Further, the solvent of the present application consists of equal weight of butanone and propylene glycol methyl ether.

[0019] Another technical problem to be solved by the present application is to provide a manufacturing method of the above-mentioned UV-resistant epoxy resin copper-clad plate.

[0020] To solve the above-mentioned technical problem, the technical solution is:

[0021] A manufacturing method of a UV-resistant epoxy resin copper-clad plate, comprising the following steps:

[0022] B1. Weigh the components of the resin glue solution by weight parts, mix the bisphenol A type epoxy resin, flame retardant, curing agent, accelerator, filler and solvent, and stir uniformly to obtain the resin glue solution;

[0023] B2. Dip the glass fiber cloth in the resin glue solution obtained in step B1, and bake for 5-10 minutes to obtain a semi-cured sheet;

[0024] B3. Stack 8 semi-cured sheets obtained in step B2 together to obtain a multi-layer semi-cured sheet, cover the upper and lower surfaces of the multi-layer semi-cured sheet with a copper foil respectively, and place it in a hot press for hot pressing. After cooling to room temperature, a UV-resistant epoxy resin copper-clad plate is obtained.

[0025] Further, in step B2 of the present application, the baking temperature is 150-180℃; the hot pressing temperature is 200-230℃, the pressure is 5-8MPa, and the time is 1-3 hours.

[0026] Compared with the prior art, the present application has the following beneficial effects:

[0027] Titanium dioxide has excellent UV absorption and shielding capacity, so it has good UV resistance, but its dispersibility in epoxy resin is poor, and titanium dioxide also has strong photocatalytic performance, which can degrade part of the epoxy resin, resulting in a decrease in mechanical properties, so the application first prepares aluminum-titanium composite oxide with an alumina-coated titanium dioxide structure by hydrothermal reaction, calcination and other steps with aluminum nitrate, titanium dioxide, ammonia and the like, and the alumina can play a good barrier role to inhibit the photocatalytic degradation activity of titanium dioxide, then vinyltriethoxysilane is used to react with the hydroxyl groups on the surface of the aluminum-titanium composite oxide, and a double bond functional group is introduced to prepare pretreated aluminum-titanium composite oxide, and then the pretreated aluminum-titanium composite oxide is crosslinked and polymerized with styrene through PVP and AIBN through the double bond functional groups on the surface of the pretreated aluminum-titanium composite oxide to prepare a filler coated with styrene, the styrene coating layer in the filler can effectively improve the dispersibility of titanium dioxide in the epoxy resin, thereby effectively improving the UV resistance of the resin glue and the epoxy resin copper clad plate, and without losing the mechanical properties of the resin glue and the epoxy resin copper clad plate; In addition, the alumina in the filler prepared by the application has excellent high temperature resistance, so it can also effectively improve the heat resistance of the resin glue and the epoxy resin copper clad plate. DETAILED DESCRIPTION

[0028] The application will be described in detail below with specific examples, and the illustrative examples of the application and their descriptions are used to explain the application, but not as a limitation of the application.

[0029] Example 1

[0030] The epoxy resin copper clad plate has good UV resistance, and the resin glue used to manufacture the epoxy resin copper clad plate is made of the following components by weight: 4450 parts of epoxy resin E, 20 parts of phosphoric acid toluene diphenyl ester, 8 parts of 4,4'-diamino diphenyl methane, 0.1 part of 2-ethyl-4-methyl imidazole, 46 parts of filler, and 63 parts of solvent composed of equal weight of butanone and propylene glycol methyl ether.

[0031] The filler is prepared by the following steps:

[0032] A1. Aluminum nitrate was added to deionized water and mixed to obtain an aluminum nitrate solution having a concentration of 0.2 g / mL. Rutile titanium dioxide was added to an aqueous ethanol solution having a volume concentration of 50% in a ratio of 0.1 g: 1 mL and ultrasonically stirred for 30 minutes to obtain a titanium dioxide suspension. The aluminum nitrate solution and a concentration of 0.25 g / mL of ammonia were added to the titanium dioxide suspension. The volume ratio of the aluminum nitrate solution, ammonia, and the titanium dioxide suspension was 1: 0.2: 1, and the pH value was adjusted to 10. After heating to 110 ° C and holding for 4 hours to obtain a reaction solution, the reaction solution was centrifuged at 5000 rpm for 10 minutes to obtain a solid. The solid was washed three times with anhydrous ethanol and deionized water, respectively, and dried at 75 ° C for 8 hours and placed in a muffle furnace at 500 ° C for 3 hours to obtain an aluminum-titanium composite oxide.

[0033] A2. Vinyl triethoxysilane was added to anhydrous ethanol, and the pH value was adjusted to 5 and stirred until uniformly mixed to obtain a silane solution. The aluminum-titanium composite oxide obtained in step A1 was added to the silane solution. The weight ratio of vinyl triethoxysilane, anhydrous ethanol, and the aluminum-titanium composite oxide obtained in step A1 was 1:50:40. The mixture was heated to 65 ° C and stirred for 7 hours to obtain a reaction solution II. The reaction solution II was centrifuged at 5000 rpm for 10 minutes to obtain a solid material II. The solid material II was washed three times with anhydrous ethanol and deionized water, respectively, and dried at 75 ° C for 8 hours to obtain a pretreated aluminum-titanium composite oxide.

[0034] A3. The pretreated aluminum-titanium composite oxide, styrene, PVP, and AIBN obtained in step A2 were added to a 50% volume concentration of an ethanol aqueous solution. The weight ratio of the pretreated aluminum-titanium composite oxide, styrene, PVP, AIBN, and the ethanol aqueous solution obtained in step A2 was 50:2.5:50:100:1000. After nitrogen was passed through, the mixture was heated to 85°C and stirred for 9 hours to obtain a reaction solution three. The reaction solution three was centrifuged at 5000 rpm for 10 minutes to obtain a solid three. The solid three was washed three times with anhydrous ethanol and deionized water, respectively, and dried at 75°C for 8 hours to obtain a filler.

[0035] The manufacturing method of this embodiment includes the following steps:

[0036] B1 weighed the components of the resin glue in parts by weight, the epoxy resin E-44, toluene diphenyl phosphate, 4,4 '- diaminodiphenylmethane, 2-ethyl-4-methylimidazole, filler, a solvent composed of equal weights of butanone and propylene glycol methyl ether was mixed and stirred to obtain a resin glue;

[0037] B2. The glass fiber cloth was impregnated with the resin solution obtained in step B1 and baked at 170°C for 7 minutes to obtain a prepreg;

[0038] B3. 8 pieces of prepreg obtained in step B2 were stacked to obtain a multilayer prepreg, and one copper foil was respectively covered on the upper and lower surfaces of the multilayer prepreg, and then the multilayer prepreg was hot-pressed in a hot press, to obtain a UV-resistant epoxy resin CCL, the hot-pressing temperature was 220°C, the pressure was 6 MPa, and the time was 2 hours.

[0039] Example 2

[0040] The UV-resistant epoxy resin CCL was prepared by using a resin glue solution prepared from the following components by weight: 45 parts of epoxy resin E-4445, 18 parts of toluene diphenyl phosphate, 7 parts of 4,4'-diaminodiphenyl methane, 0.1 part of 2-ethyl-4-methyl imidazole, 45 parts of filler, and 60 parts of a solvent composed of equal weights of butanone and propylene glycol methyl ether.

[0041] The preparation steps of the filler were the same as those in Example 1.

[0042] The manufacturing method of this example includes the following steps:

[0043] B1. The components of the resin glue solution were weighed by weight parts, and the epoxy resin E-44, toluene diphenyl phosphate, 4,4'-diaminodiphenyl methane, 2-ethyl-4-methyl imidazole, filler, and a solvent composed of equal weights of butanone and propylene glycol methyl ether were mixed and stirred uniformly to obtain a resin glue solution;

[0044] B2. The glass fiber cloth was immersed in the resin glue solution obtained in step B1, and baked at 150°C for 10 minutes to obtain a prepreg;

[0045] B3. 8 pieces of prepreg obtained in step B2 were stacked to obtain a multilayer prepreg, and one copper foil was respectively covered on the upper and lower surfaces of the multilayer prepreg, and then the multilayer prepreg was hot-pressed in a hot press, to obtain a UV-resistant epoxy resin CCL, the hot-pressing temperature was 220°C, the pressure was 6 MPa, and the time was 2 hours.

[0046] Example 3

[0047] The UV-resistant epoxy resin CCL was prepared by using a resin glue solution prepared from the following components by weight: 45 parts of epoxy resin E-4445, 18 parts of toluene diphenyl phosphate, 7 parts of 4,4'-diaminodiphenyl methane, 0.1 part of 2-ethyl-4-methyl imidazole, 45 parts of filler, and 60 parts of a solvent composed of equal weights of butanone and propylene glycol methyl ether.

[0048] The preparation steps of the filler were the same as those in Example 1.

[0049] The manufacturing method of this example includes the following steps:

[0050] B1. The components of the resin glue were weighed by parts by weight, epoxy resin E-44, methyl phenyl diphenyl phosphate, 4,4'-diamino diphenyl methane, 2-ethyl-4-methyl imidazole, filler, a solvent composed of equal weight of butanone and propylene glycol methyl ether were mixed, and the resin glue was obtained after stirring uniformly;

[0051] B2. The glass fiber cloth was immersed in the resin glue obtained in step B1, and a prepreg was obtained by baking at 180°C for 5 minutes;

[0052] B3. Eight prepregs obtained in step B2 were stacked together to obtain a multilayer prepreg, and a copper foil was covered on the upper and lower surfaces of the multilayer prepreg, respectively, and then the multilayer prepreg was hot-pressed in a hot press, and an UV-resistant epoxy resin CCL was obtained after cooling to room temperature, the hot-pressing temperature was 230°C, the pressure was 5MPa, and the time was 1 hour.

[0053] Example 4

[0054] The UV-resistant epoxy resin CCL was prepared using a resin glue prepared from the following components by parts by weight: epoxy resin E-44 51 parts, methyl phenyl diphenyl phosphate 21 parts, 4,4'-diamino diphenyl methane 9 parts, 2-ethyl-4-methyl imidazole 0.2 parts, filler 47 parts, and a solvent composed of equal weight of butanone and propylene glycol methyl ether 64 parts.

[0055] The preparation steps of the filler were the same as those in Example 1.

[0056] The manufacturing method of the present example comprises the following steps:

[0057] B1. The components of the resin glue were weighed by parts by weight, epoxy resin E-44, methyl phenyl diphenyl phosphate, 4,4'-diamino diphenyl methane, 2-ethyl-4-methyl imidazole, filler, a solvent composed of equal weight of butanone and propylene glycol methyl ether were mixed, and the resin glue was obtained after stirring uniformly;

[0058] B2. The glass fiber cloth was immersed in the resin glue obtained in step B1, and a prepreg was obtained by baking at 160°C for 9 minutes;

[0059] B3. Eight prepregs obtained in step B2 were stacked together to obtain a multilayer prepreg, and a copper foil was covered on the upper and lower surfaces of the multilayer prepreg, respectively, and then the multilayer prepreg was hot-pressed in a hot press, and an UV-resistant epoxy resin CCL was obtained after cooling to room temperature, the hot-pressing temperature was 230°C, the pressure was 5MPa, and the time was 1 hour.

[0060] Comparative Example 1

[0061] The difference from Example 1 is that the filler is not included in the components of the resin glue, and the preparation step of the filler is omitted.

[0062] Comparative Example 2

[0063] Different from Example 1: the preparation step of the filler in the resin glue solution component does not include A3, that is, the filler is pretreated aluminum-titanium composite oxide without a styrene coating layer.

[0064] Comparative Example 3

[0065] Different from Example 1: the preparation step of the filler in the resin glue solution component does not include A1, the aluminum-titanium composite oxide used in step A2 is replaced with rutile titanium dioxide, the pretreated titanium dioxide prepared in step A2, the pretreated aluminum-titanium composite oxide used in step A3 is replaced with pretreated titanium dioxide, and the filler prepared does not contain aluminum oxide.

[0066] Experimental Example 1: Mechanical Properties

[0067] Test reference standard / method: IPC-TM-650 2.4.4.

[0068] Test object, target: the bending strength of the epoxy resin copper-clad plate prepared in Examples 1-4, Comparative Example 2, and Comparative Example 3 at room temperature.

[0069] The higher the bending strength, the better the mechanical properties. The test results are shown in Table 1:

[0070]

[0071] Table 1

[0072] As can be seen from Table 1, the bending strength of Examples 1-4 of the present application is relatively high, indicating that the present application has good mechanical properties. The bending strength of Comparative Example 2 is lower than that of Example 1, indicating that the filler prepared by the present application has better dispersibility than the pretreated aluminum-titanium composite oxide without a styrene coating layer, and the effect of improving the mechanical properties of the epoxy resin copper-clad plate is also better. The bending strength of Comparative Example 3 is also lower than that of Example 1, indicating that the aluminum oxide in the filler prepared by the present application can effectively inhibit the photocatalytic degradation activity of titanium dioxide.

[0073] Experimental Example 2: Anti-UV Property Test

[0074] Test method: GB / T 14522-2008.

[0075] Test instrument: LUV ultraviolet accelerated aging test box.

[0076] Test object, target: the flexural strength retention rate of the epoxy resin copper clad plate prepared in Example 1-4, Comparative Example 1 and Comparative Example 2, flexural strength retention rate = flexural strength after UV aging / original flexural strength x 100%, the irradiation light source is UVA-340 fluorescent UV lamp (0.76 W / m 2 ), and the UV aging time is 300 hours.

[0077] The higher the flexural strength retention rate is, the better the UV resistance performance is. The test results are shown in Table 2:

[0078]

[0079] Table 2

[0080] As can be seen from Table 2, the flexural strength retention rates of Examples 1-4 of the present application are all high, which indicates that the present application has good UV resistance performance. The components and preparation steps used in Comparative Example 1 and Comparative Example 2 are different from those of Example 1. Compared with Example 1, the flexural strength retention rate of Comparative Example 1 decreases a lot, which indicates that the filler prepared by the present application can greatly improve the UV resistance performance of the epoxy resin copper clad plate; the flexural strength retention rate of Comparative Example 2 also decreases, which indicates that compared with the pretreated aluminum-titanium composite oxide without a styrene coating layer, the filler prepared by the present application has better dispersibility and better effect of improving the UV resistance performance of the epoxy resin copper clad plate.

[0081] Experimental Example Three: Heat resistance test

[0082] Test reference standard / method: IPC-TM-650 2.4.24.6, TGA method.

[0083] Test instrument: comprehensive thermal analyzer.

[0084] Test object, target: the temperature at which the weight loss of the epoxy resin copper clad plate prepared in Example 1-4 and Comparative Example 3 is 5%.

[0085] The higher the temperature at which the weight loss is 5% is, the better the heat resistance performance is, and the test results are shown in Table 3:

[0086]

[0087]

[0088] Table 3

[0089] As can be seen from Table 3, the temperature at which the weight loss of 5% occurs for Examples 1-4 of the present application is higher, indicating that the present application has good heat resistance. The temperature at which the weight loss of 5% occurs for Comparative Example 3, which uses some components and preparation steps different from Example 1, is lower than that of Example 1, indicating that the alumina in the filler prepared by the present application can effectively improve the heat resistance of the epoxy resin copper-clad plate.

[0090] The above examples are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above examples without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A UV-resistant epoxy resin copper-clad laminate, characterized by: The resin glue used in manufacturing the UV-resistant epoxy resin copper-clad laminate is made of the following components in parts by weight: 45-55 parts of bisphenol A epoxy resin, 18-22 parts of flame retardant, 7-10 parts of curing agent, 0.1-0.2 parts of accelerator, 45-48 parts of filler, and 60-65 parts of solvent; The filler is prepared by the following steps: A1. Aluminum nitrate was added to deionized water and mixed to obtain an aluminum nitrate solution. Titanium dioxide was added to an aqueous ethanol solution and ultrasonically stirred for 30 minutes to obtain a titanium dioxide suspension. The aluminum nitrate solution and aqueous ammonia were added to the titanium dioxide suspension, and the pH value was adjusted to 10. The mixture was heated to 110 ° C and kept warm for 4 hours to obtain a reaction solution. The reaction solution was centrifuged to obtain a solid. The solid was washed three times with anhydrous ethanol and deionized water, respectively, and then dried and calcined in a muffle furnace at 500 ° C for 3 hours to obtain an aluminum-titanium composite oxide. A2. Vinyltriethoxysilane was added to anhydrous ethanol, the pH value was adjusted to 5, and the mixture was stirred until uniformly mixed to obtain a silane solution. The aluminum-titanium composite oxide obtained in step A1 was added to the silane solution, heated to 65 ° C, and stirred for 7 hours to obtain a reaction solution 2. The reaction solution 2 was centrifuged to obtain a solid material 2. The solid material 2 was washed three times with anhydrous ethanol and deionized water, respectively, and dried to obtain a pretreated aluminum-titanium composite oxide; A3. The pretreated aluminum-titanium composite oxide, styrene, PVP, and AIBN obtained in step A2 were added to an ethanol-water solution, heated to 85°C after nitrogen flow, and stirred for 9 hours to obtain a reaction solution three. The reaction solution three was centrifuged to obtain a solid three. The solid three was washed three times with anhydrous ethanol and deionized water, respectively, and dried to obtain a filler.

2. The UV-resistant epoxy resin copper clad laminate according to claim 1, wherein: The bisphenol A type epoxy resin is epoxy resin E-44.

3. The UV-resistant epoxy resin copper clad laminate according to claim 1, wherein: The flame retardant is toluene diphenyl phosphate.

4. The UV-resistant epoxy resin copper clad laminate according to claim 1, wherein: The curing agent is 4,4'-diaminodiphenylmethane.

5. The UV-resistant epoxy resin copper clad laminate according to claim 1, wherein: The accelerator is 2-ethyl-4-methylimidazole.

6. The UV-resistant epoxy resin copper clad laminate according to claim 1, wherein: In step A1, the concentration of the aluminum nitrate solution is 0.2 g / mL, the volume concentration of the ethanol aqueous solution is 50%, the ratio of titanium dioxide to the ethanol aqueous solution is 0.1 g:1 mL, the concentration of the ammonia water is 0.25 g / mL, the volume ratio of the aluminum nitrate solution, the ammonia water, and the titanium dioxide suspension is 1:0.2:1, the centrifugal speed is 5000 rpm, the centrifugal time is 10 minutes, the drying temperature is 75°C, and the drying time is 8 hours; In step A2, the weight ratio of vinyltriethoxysilane, anhydrous ethanol, and the aluminum-titanium composite oxide obtained in step A1 is 1:50:40, the centrifugal speed is 5000 rpm, the centrifugal time is 10 minutes, the drying temperature is 75°C, and the drying time is 8 hours; In step A3, the volume concentration of the ethanol aqueous solution is 50%, the weight ratio of the pretreated aluminum-titanium composite oxide obtained in step A2, styrene, PVP, AIBN, and the ethanol aqueous solution is 50:2.5:50:100:1000, the centrifugation speed is 5000 rpm, the centrifugation time is 10 minutes, the drying temperature is 75°C, and the drying time is 8 hours.

7. The UV-resistant epoxy resin copper clad laminate according to claim 1, characterized in that: The solvent consists of butanone and propylene glycol methyl ether in equal weights.

8. The method for manufacturing a UV-resistant epoxy resin copper clad laminate according to any one of claims 1 to 7, wherein: The following steps are involved: B1 weighed in parts by weight of the components of the resin glue, the bisphenol A epoxy resin, flame retardant, curing agent, accelerator, filler, solvent mixed, stirred to obtain a resin glue; B2. The glass fiber cloth is impregnated with the resin solution obtained in step B1 and baked for 5-10 minutes to obtain a prepreg; B3. Stack eight prepregs obtained in step B2 together to obtain a multilayer prepreg. Cover the upper and lower surfaces of the multilayer prepreg with a copper foil, place them in a hot press, and cool to room temperature to obtain a UV-resistant epoxy resin copper-clad laminate.

9. The method for manufacturing a UV-resistant epoxy resin copper clad laminate according to claim 8, wherein: In the step B2, the baking temperature is 150-180° C.; the hot pressing temperature is 200-230° C., the pressure is 5-8 MPa, and the time is 1-3 hours.

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