A fluorescent epoxy adhesive film for epoxy CSP lamp beads, its preparation method and application

Abstract

The present invention relates to the technical field of CSP, and specifically relates to a fluorescent epoxy adhesive film for epoxy CSP lamp beads, its preparation method and application. The preparation raw materials thereof at least include: transparent liquid epoxy adhesive, phosphor powder; the preparation raw materials of the transparent liquid epoxy adhesive at least include: epoxy resin solution, curing agent, defoaming agent, antioxidant, anti-precipitation agent, catalyst; the epoxy resin solution at least includes organosilicon-modified epoxy resin, trifunctional epoxy compound, epoxy resin containing alicyclic structure; the molten viscosity of the epoxy resin solution at 150 °C is 400-1000 Pa·s, which overcomes the problems of low hardness and low adhesion between the existing silicone aqueous solution and the subsequent epoxy resin during actual encapsulation, improves the product yield of the subsequently prepared CSP lamp beads and ensures its aging resistance performance.

Description

Technical Field

[0001] The present invention relates to the technical field of CSP, and specifically to a fluorescent epoxy adhesive film for epoxy CSP lamp beads, its preparation method and application. Background Art

[0002] With the development of the LED display application industry, the shooting effect of RGB LED virtual studios can no longer meet the production requirements of high-quality film and television dramas. The current RGB LED virtual studios can only display three colors: red, green, and blue, and cannot adjust the brightness and color temperature of white light, resulting in inconsistent lighting conditions between the real scene and the virtual scene, and affecting the reduction degree and naturalness of skin color. To solve the problems of RGB LED virtual studios at the present stage, industry technicians add a flip-chip white light CSP lamp bead with a high color rendering index to the flip-chip RGB LED lamp beads to develop RGBW virtual studios.

[0003] Currently, most white light CSP lamp beads are obtained by exciting yellow fluorescent powder with blue light chips. To meet the low light decay requirements of white light lamp beads, silicone resin materials are usually used in the industry to encapsulate blue light chips. However, due to the low hardness of silicone resin, after vibration sorting, the encapsulation layer is easily damaged, greatly reducing the product yield of white light lamp beads. To avoid the problem of dead lights caused by external collision of the display screen, RGB virtual studios prefer to use epoxy resin materials with greater hardness to encapsulate chips. On this premise, if silicone glue is used to encapsulate white light CSP lamp beads, the problem of epoxy-silicone interface peeling will occur because the adhesion between silicone resin and epoxy resin is low, and after PCT aging (high-pressure accelerated aging), the silicone white light lamp beads and the outer epoxy resin are easily peeled off. For example, Chinese Patent (publication number CN 113659053 A) discloses a manufacturing process for a CSP lamp bead encapsulation structure, which uses silicone, silicone or epoxy resin for encapsulation and cannot effectively solve the above problems. Summary of the Invention

[0004] To solve the above problems, the present invention provides a fluorescent epoxy adhesive film for epoxy CSP lamp beads, which overcomes the problems of low hardness and low adhesion to subsequent epoxy resins existing in existing silicone glue during actual encapsulation, improves the product yield of CSP lamp beads prepared subsequently, and ensures its aging resistance.

[0005] On the one hand, the present invention provides a fluorescent epoxy adhesive film for epoxy CSP lamp beads, and its preparation raw materials at least include: transparent liquid epoxy glue, fluorescent powder; the preparation raw materials of the transparent liquid epoxy glue at least include: epoxy resin solution, curing agent, defoaming agent, antioxidant, anti-precipitation agent, catalyst;

[0006] The epoxy resin solution at least includes organosilicon-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure; the epoxy resin solution has a melt viscosity of 400 - 1000 Pa·s at 150 °C.

[0007] As a preferred technical solution, the epoxy resin solution has a melt viscosity of 500 - 800 Pa·s at 150 °C, preferably 600 ± 50 Pa·s.

[0008] As a preferred technical solution, the mass ratio of the organosilicon-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure is 1:(0.5 - 2):(2 - 5), preferably 1:1:(2 - 4), and most preferably 1:1:3.

[0009] As a preferred technical solution, the organosilicon-modified epoxy resin is Dow EP2601 organosilicon-modified epoxy resin, the trifunctional epoxy compound is tris(2,3-epoxypropyl)isocyanurate, model Tepic-s (Nissan Chemical), and the epoxy resin containing an alicyclic structure is CELLOXIDE 2021P liquid aliphatic epoxy resin.

[0010] As a preferred technical solution, by weight, the raw materials for preparing the transparent liquid epoxy adhesive at least include: 80 - 120 parts of epoxy resin solution, 60 - 90 parts of curing agent, 1 - 2 parts of defoaming agent, 0.5 - 2 parts of antioxidant, 1 - 3 parts of anti-precipitant, and 0.1 - 1 part of catalyst.

[0011] As a preferred technical solution, the addition amount of the phosphor in the fluorescent epoxy adhesive film is 20 - 80 wt%, preferably 45 - 60 wt%.

[0012] In the present invention, by optimizing the epoxy resin solution to include organosilicon-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure, further optimizing the melt viscosity of the epoxy resin solution to be 400 - 1000 Pa·s at 150 °C, and cooperating with other raw materials, it can simultaneously meet the application requirements of high hardness, low light decay, and high adhesion during the subsequent preparation of CSP lamp beads, and has excellent stability. Further, by controlling the mass ratio of the transparent liquid epoxy adhesive and the phosphor, adjustable luminous flux and color temperature can be obtained. Increasing the content of the phosphor in the transparent liquid epoxy adhesive can increase the luminous flux and decrease the color temperature. In particular, by controlling the addition amount of the phosphor in the fluorescent epoxy adhesive film to be 45 - 60 wt%, the applicability of the fluorescent epoxy adhesive film in epoxy CSP can be ensured.

[0013] As a preferred technical solution, the curing agent is at least one of methyltetrahydrophthalic anhydride, maleic anhydride, tetrahydrophthalic anhydride, and pyromellitic dianhydride, preferably methyltetrahydrophthalic anhydride.

[0014] As a preferred technical solution, the defoamer is a silicone defoamer, preferably BYK-024 defoamer.

[0015] As a preferred technical solution, the antioxidant is at least one of antioxidant 1010, antioxidant 168, antioxidant 626, and antioxidant 1135, preferably antioxidant 1010.

[0016] As a preferred technical solution, the anti-settling agent is H-18 anti-settling powder.

[0017] As a preferred technical solution, the catalyst is triphenylphosphine.

[0018] As a preferred technical solution, the phosphor is Intematix YAG-04 phosphor.

[0019] On the other hand, the present invention provides a method for preparing a fluorescent epoxy adhesive film for epoxy CSP lamp beads, which at least includes the following steps:

[0020] (1) Intermittently stirring silicone-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure at 140-160 °C for 1-3 h to obtain an epoxy resin solution;

[0021] (2) Sequentially adding a defoamer, an antioxidant, an anti-settling agent, and a curing agent to the epoxy resin solution, continuously stirring at 90-110 °C for 60-120 min, then cooling to 70-80 °C and adding a catalyst, manually stirring for 5-15 min while maintaining the temperature, stirring with a dispersion disc at a rotational speed of 500-800 rpm for 3-8 min, and finally controlling the vacuum degree and stirring at a rotational speed of 800-1200 rpm for 3-5 min to obtain a transparent liquid epoxy adhesive;

[0022] (3) Adding a phosphor to the transparent liquid epoxy adhesive, stirring and defoaming to obtain a fluorescent epoxy adhesive;

[0023] (4) Coating the fluorescent epoxy adhesive on a release film, placing it in a forced-air drying oven at 70-90 °C, baking for 20-40 min to obtain a fluorescent epoxy adhesive film in the B-stage state.

[0024] The obtained fluorescent epoxy adhesive in the present invention is stored in a constant-temperature heating jacket at 50 °C for standby, ensuring that it is used up within 3-5 hours.

[0025] Regarding the explanation of "B-Stage state" in the present invention, the curing reaction of thermosetting resin can be divided into three stages: A / B / C:

[0026] A Stage: The resin is in the early stages of the reaction. Due to the low degree of polymerization, the molecular weight is still very low and the material is in a liquid state.

[0027] B Stage: The resin continues to react, and most of the structure is linear and partially cross-linked. The molecular weight is large enough to be semi-cured. At this stage, the material can be dissolved by specific solvents and can flow or melt at a specific temperature. The reaction of some resins is not obvious at this stage.

[0028] C Stage: This stage is the late stage of the resin reaction. The molecular structure presents a network cross-linked structure. The material can no longer be heated and melted, nor can it be dissolved by solvents. It is the final state of the material after the curing reaction. The surface is usually non-sticky and has a stable Tg.

[0029] Preparation of epoxy CSP lamp beads, the epoxy CSP lamp bead structure includes a chip, an adhesive layer, a solid crystal plate, and a fluorescent epoxy film. The adhesive layer is attached to the upper surface of the solid crystal plate, the chip is fixed on the upper surface of the adhesive layer, and the fluorescent epoxy film covers the exposed surface of the chip.

[0030] As a preferred technical solution, the thickness of the chip is 50-150 μm, and the chip size is (4-10)×(5-20) mil. Preferably, the thickness of the chip is 80-120 μm, and the chip size is (4-6)×(8-20) mil.

[0031] The preparation process of the epoxy CSP lamp beads at least includes the following steps:

[0032] S1. Die bonding: The adhesive layer is adhered to the substrate, and the chip is bonded in a step of 0.7*0.4mm. The die bonding area is 35*24mm.

[0033] S2. Lamination: Place the fluorescent epoxy film on the die-bonding board, and place a square gasket with a thickness of 238μm and a functional area size of 60*60mm on the fluorescent epoxy film. Place it in a vacuum laminating machine at a temperature of 140-160℃ for 240-360s to complete the chip packaging.

[0034] S3, post-curing: then place in a 140-160℃ oven and bake for 3-5 hours to complete the post-curing of the fluorescent epoxy film, and then cut and mold it to obtain.

[0035] The low light decay and high hardness epoxy CSP lamp beads provided by the present invention improve the overall stability of the RGBW lamp beads, thereby improving the picture quality and visual effects of virtual shooting, and the production process is simple, easy to realize large-scale industrial production, and has high market promotion value.

[0036] The epoxy CSP lamp beads provided by the present invention can obtain epoxy CSP lamp beads with different brightness and color temperatures by adjusting the chip size and thickness. Moreover, the larger the chip size and thickness, the lower the brightness and the higher the color temperature of the epoxy CSP lamp beads.

[0037] Beneficial effects

[0038] 1. The present invention provides a fluorescent epoxy adhesive film for epoxy CSP lamp beads, which overcomes the problems of low hardness and low adhesion between the existing silicone resin and the subsequent epoxy resin during actual encapsulation, improves the product yield of the CSP lamp beads prepared subsequently, and ensures its aging resistance.

[0039] 2. The present invention optimizes the epoxy resin solution to include organosilicon-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing alicyclic structure, and further optimizes the melt viscosity of the epoxy resin solution at 150 °C to be 400-1000 Pa·s. Cooperating with other raw materials, it simultaneously meets the application requirements of high hardness, low light decay, and high adhesion during the subsequent preparation of CSP lamp beads, and has excellent stability.

[0040] 3. The present invention obtains adjustable luminous flux and color temperature by controlling the mass ratio of transparent liquid epoxy adhesive and phosphor. Increasing the content of phosphor in the transparent liquid epoxy adhesive can increase the luminous flux and decrease the color temperature. In particular, controlling the addition amount of phosphor in the fluorescent epoxy adhesive film to be 45-60 wt% ensures the applicability of the fluorescent epoxy adhesive film in epoxy CSP subsequently.

[0041] 4. The epoxy CSP lamp beads with low light decay and high hardness provided by the present invention improve the overall stability of RGBW lamp beads, thereby improving the picture quality and visual effect of virtual shooting. Moreover, the production process is simple and easy to realize large-scale industrial production, and has high market promotion value.

[0042] 5. The epoxy CSP lamp beads provided by the present invention can obtain epoxy CSP lamp beads with different brightness and color temperatures by adjusting the chip size and thickness. Moreover, the larger the chip size and thickness, the lower the brightness and the higher the color temperature of the epoxy CSP lamp beads. Description of the drawings

[0043] Figure 1 The structure of the epoxy CSP lamp beads provided in Example 1. In the figure, 1 is the chip, 2 is the bonding layer, 3 is the die bonding plate, and 4 is the fluorescent epoxy adhesive film.

[0044] Figure 2 The physical picture of the sample when the hardness of the fluorescent epoxy adhesive provided in Example 1 is tested.

[0045] Figure 3 、 Figure 4 The test result diagrams of the adhesion of Example 1 and Comparative Example 1 respectively.

[0046] Figure 5 and Figure 6 They are respectively the stability test result diagrams of Example 1 and Comparative Example 2. Detailed implementation manners

[0047] Example 1

[0048] On the one hand, Example 1 of the present invention provides a fluorescent epoxy adhesive film for epoxy CSP lamp beads. The preparation raw materials of the fluorescent epoxy adhesive film include: transparent liquid epoxy adhesive and fluorescent powder; by weight, the preparation raw materials of the transparent liquid epoxy adhesive include: 100 parts of epoxy resin solution, 75.25 parts of curing agent, 1.50 parts of defoaming agent, 1.00 part of antioxidant, 1.50 parts of anti-precipitation agent, and 0.50 part of catalyst.

[0049] The epoxy resin solution includes organosilicon-modified epoxy resin, trifunctional epoxide, and epoxy resin containing alicyclic structure; the mass ratio of the organosilicon-modified epoxy resin, trifunctional epoxide, and epoxy resin containing alicyclic structure is 1:1:3; the melt viscosity of the epoxy resin solution at 150 °C is 600 ± 50 Pa·s.

[0050] The organosilicon-modified epoxy resin is Dow EP2601 organosilicon-modified epoxy resin, the trifunctional epoxide is tris(2,3-epoxypropyl) isocyanurate, model Tepic-s (manufactured by Nissan Chemical Industries, Ltd.), and the epoxy resin containing alicyclic structure is CELLOXIDE 2021P liquid aliphatic epoxy resin.

[0051] The addition amount of the fluorescent powder in the fluorescent epoxy adhesive film is 60 wt%.

[0052] The curing agent is methyltetrahydrophthalic anhydride.

[0053] The defoaming agent is BYK-024 defoaming agent.

[0054] The antioxidant is antioxidant 1010.

[0055] The anti-precipitation agent is H-18 anti-precipitation powder.

[0056] The catalyst is triphenylphosphine.

[0057] The fluorescent powder is Intematix YAG-04 fluorescent powder.

[0058] On the other hand, Example 1 of the present invention provides a preparation method of a fluorescent epoxy adhesive film for epoxy CSP lamp beads, including the following steps:

[0059] (1) Intermittently stir the silicone-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure at 150 °C for 2 h to obtain an epoxy resin solution;

[0060] (2) Add an antifoaming agent, an antioxidant, an anti-precipitation agent, and a curing agent to the epoxy resin solution in sequence. After continuously stirring at 100 °C for 90 min, cool to 80 °C and then add a catalyst. After manual stirring for 10 min while maintaining the temperature, stir with a dispersion disc at a rotational speed of 600 rpm for 5 min. Finally, control the vacuum degree to -98 Kpa and stir at a rotational speed of 1000 rpm for 3 min to obtain a transparent liquid epoxy adhesive;

[0061] (3) Add fluorescent powder to the transparent liquid epoxy adhesive, stir with a glass rod by hand for 5 min, and then place it in a double planetary vacuum degassing machine. Stir at a vacuum degree of -98 KPa and a rotational speed of 1000 rpm for 3 min to obtain a fluorescent epoxy adhesive;

[0062] (4) Coat the fluorescent epoxy adhesive on a PET release film, place it in a forced-air drying oven at 80 °C, and bake for 30 min to obtain a fluorescent epoxy adhesive film in the B-stage state (with dimensions of 55×55 mm and a thickness of 287 μm).

[0063] See Figure 1 , the third aspect of Example 1 of the present invention provides an application of a fluorescent epoxy adhesive film for epoxy CSP lamp beads, which is applied to the preparation of epoxy CSP lamp beads. The structure of the epoxy CSP lamp bead includes a chip 1, an adhesive layer 2, a die bonding plate 3, and a fluorescent epoxy adhesive film 4. The upper surface of the die bonding plate 3 is adhesively attached with the adhesive layer 2, the upper surface of the adhesive layer 2 is fixed with the chip 1, and the fluorescent epoxy adhesive film 4 covers the exposed surface of the chip 1.

[0064] The thickness of the chip is 80 μm, and the chip size is 4×8 mil.

[0065] The preparation process of the epoxy CSP lamp bead includes the following steps:

[0066] S1. Die bonding: Adhere the adhesive layer to the substrate, and perform die bonding on the chip step by step at 0.7*0.4 mm. The die bonding area is 35*24 mm;

[0067] S2. Laminating: Place the fluorescent epoxy adhesive film on the die bonding plate, place a square gasket with a thickness of 238 μm and a functional area size of 60*60 mm on the fluorescent epoxy adhesive film, and place it in a vacuum laminating machine at a temperature of 150 °C for 300 s to complete the encapsulation of the chip.

[0068] S3. Post-curing: Then place it in an oven at 150 °C and bake for 4 hours to complete the post-curing of the fluorescent epoxy adhesive film;

[0069] S4. Post-treatment of LED beads: Cut with a knife with a thickness of 100 μm at a knife speed of 80 mm / s to obtain white light epoxy CSP LED beads with a size of 0.6 * 0.3 mm.

[0070] Example 2

[0071] Example 2 of the present invention provides a fluorescent epoxy film for epoxy CSP LED beads, its preparation method and application. The specific implementation manner is the same as that of Example 1, except that the addition amount of phosphor in the fluorescent epoxy film is 45 wt%.

[0072] Example 3

[0073] Example 3 of the present invention provides a fluorescent epoxy film for epoxy CSP LED beads, its preparation method and application. The specific implementation manner is the same as that of Example 1, except that the thickness of the chip is 120 μm and the chip size is 6 × 20 mil.

[0074] Comparative Example 1

[0075] Comparative Example 1 of the present invention provides a fluorescent film for CSP LED beads, its preparation method and application. The specific implementation manner is the same as that of Example 1, except that the transparent liquid epoxy adhesive is replaced with Dow Corning® OE-7842 silicone rubber.

[0076] Comparative Example 2

[0077] Comparative Example 2 of the present invention provides a fluorescent epoxy film for epoxy CSP LED beads, its preparation method and application. The specific implementation manner is the same as that of Example 1, except that the preparation method of the fluorescent epoxy film for epoxy CSP LED beads is as follows:

[0078] (1) Intermittently stir the organosilicon-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure at 150 °C for 2 h to obtain an epoxy resin solution;

[0079] (2) Add an antifoaming agent, an antioxidant, an anti-precipitation agent, and a curing agent to the epoxy resin solution in sequence, and continuously stir at 100 °C for 30 min. Other steps are the same as those in Example 1.

[0080] Comparative Example 3

[0081] Comparative Example 3 of the present invention provides a fluorescent epoxy film for epoxy CSP LED beads, its preparation method and application. The specific implementation manner is the same as that of Example 1, except that the preparation method of the fluorescent epoxy film for epoxy CSP LED beads is as follows:

[0082] (1) Intermittently stir the silicone-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure at 150 °C for 2 h to obtain an epoxy resin solution;

[0083] (2) Sequentially add an antifoaming agent, an antioxidant, an anti-settling agent, and a curing agent to the epoxy resin solution, continuously stir at 100 °C for 60 min, and other steps are the same as those in Example 1.

[0084] Comparative Example 4

[0085] Comparative Example 4 of the present invention provides a fluorescent epoxy adhesive film for epoxy CSP lamp beads, its preparation method and application. The specific implementation manner is the same as that of Example 1, except that the preparation method of the fluorescent epoxy adhesive film for epoxy CSP lamp beads:

[0086] (1) Intermittently stir the silicone-modified epoxy resin, trifunctional epoxy compound, and epoxy resin containing an alicyclic structure at 150 °C for 2 h to obtain an epoxy resin solution;

[0087] (2) Sequentially add an antifoaming agent, an antioxidant, an anti-settling agent, and a curing agent to the epoxy resin solution, continuously stir at 100 °C for 120 min, and other steps are the same as those in Example 1.

[0088] Performance test method

[0089] 1. Hardness test: Prepare the fluorescent epoxy adhesives provided in the examples and comparative examples into samples with a diameter of 25 mm and a thickness of 4 mm. After complete curing, use a Shore D hardness tester to test the hardness of the samples. For the physical diagram of the sample during the hardness test of the fluorescent epoxy adhesive provided in Example 1, see Figure 1 , and the hardness test results of the fluorescent epoxy adhesives provided in the examples and comparative examples are shown in Table 1.

[0090] Table 1

[0091]

[0092] By comparing the hardness test data of Example 1 and Comparative Example 1, it shows that the hardness of the epoxy material is significantly higher than that of the silicone rubber; by comparing Example 1 and Example 2, it shows that the content of the phosphor has little effect on the hardness of the material itself, and the glue skeleton plays a decisive role in the hardness of the material.

[0093] 2. Optical test: Weld the single 0.6*0.3 mm epoxy CSP lamp beads cut from the examples and comparative examples on a hexagonal substrate, and use a 10 mA current to test the luminous flux and color temperature of the CSP. The results are shown in Table 2.

[0094] Table 2

[0095]

[0096] By comparing Example 1 and Comparative Example 1, it can be seen that the difference in materials has a slight impact on the luminous flux and color temperature. By fine-tuning the formula, the optoelectronic parameters of both can be made consistent. By comparing Example 1 and Example 2, it shows that at a certain color temperature, as the phosphor content increases, the luminous flux can be increased and the color temperature decreases. By comparing Example 1 and Example 3, it shows that with the same phosphor content and test current, the larger the chip size, the lower the brightness and the higher the color temperature.

[0097] 3. Luminous flux decay test method:

[0098] (1) Solder the white light CSP lamp beads obtained in the examples and comparative examples on a hexagonal substrate, and use an integrating sphere to measure the initial luminous flux;

[0099] (2) Place the lamp beads in (1) on a lamp bead aging platform;

[0100] (3) Place the aging platform in (2) in a double 85 aging chamber, and continuously light it for 168 h with a current of 10 mA;

[0101] (4) Calculate the luminous flux decay through the formula (luminous flux decay = (luminous flux before aging - luminous flux after aging) / luminous flux before aging * 100%).

[0102] (5) See Table 3 for the test results.

[0103] Table 3

[0104]

[0105] By comparing the luminous flux decay data, it can be seen that the luminous flux decay performance of the epoxy resin encapsulation material of the present inventor is basically the same as that of the silicone resin material.

[0106] 4. Adhesion test method: Package the white light CSP lamp beads obtained in Example 1 and Comparative Example 1 into RGBW lamp beads and place them in a PCT aging chamber; age them at 121 °C for 24 hours, take out the RGBW lamp beads, observe whether there is any abnormality at the interface, and see the test results in Figure 3 、 Figure 4 , Figure 3 and Figure 4 are all RGBW lamp beads. After PCT aging test, Figure 3 has a normal surface, Figure 4 has bubbles on the surface, indicating that Figure 3 has better adhesion.

[0107] 5. Stability test of the glue system:

[0108] (1) Cool the transparent glues of Example 1 and Comparative Example 2 to 30 °C at the same time;

[0109] (2) Observe whether there is precipitation of solid resin in the glue system.

[0110] See the test results in Figure 5 and Figure 6 . By comparison, it can be seen that the glue in Example 1 is the most stable and there is no resin precipitation. The transparent glue system in Comparative Example 2 is unstable and there is obvious resin precipitation. Thus, by controlling the pre-reaction time of the glue and preliminarily reacting the solid resin with the liquid anhydride curing agent, the stability of the glue can be improved.

Claims

1. A fluorescent epoxy film for epoxy CSP lamp beads, characterized in that: The raw materials for preparing the transparent liquid epoxy glue at least include: transparent liquid epoxy glue and fluorescent powder; in parts by weight, the raw materials for preparing the transparent liquid epoxy glue include: 80-120 parts of epoxy resin solution, 60-90 parts of curing agent, 1-2 parts of defoaming agent, 0.5-2 parts of antioxidant, 1-3 parts of anti-precipitation agent and 0.1-1 parts of catalyst; the epoxy resin solution includes organosilicon-modified epoxy resin, trifunctional epoxy compound and epoxy resin containing alicyclic structure; the mass ratio of the organosilicon-modified epoxy resin, trifunctional epoxy compound and epoxy resin containing alicyclic structure is 1:1:(2-4), and the melt viscosity of the epoxy resin solution at 150°C is 500-800 Pa.s; the organosilicon-modified epoxy resin is Dow EP2601 organosilicon-modified epoxy resin, the trifunctional epoxy compound is tri(2,3-epoxypropyl)isocyanurate, and the epoxy resin containing alicyclic structure is CELLOXIDE 2021P Liquid aliphatic epoxy resin; The method for preparing the fluorescent epoxy film for epoxy CSP lamp beads at least comprises the following steps: (1) intermittently stirring an organosilicon-modified epoxy resin, a trifunctional epoxy compound, or an epoxy resin containing an alicyclic structure at 140-160° C. for 1-3 hours to obtain an epoxy resin solution; (2) Add defoamer, antioxidant, anti-precipitant and curing agent to the epoxy resin solution in sequence, stir continuously for 90 minutes at 90-110°C, cool to 70-80°C and add catalyst, stir manually for 5-15 minutes while keeping warm, stir for 3-8 minutes with a dispersing disk at a speed of 500-800 rpm, and finally control the vacuum degree and stir at a speed of 800-1200 rpm for 3-5 minutes to obtain a transparent liquid epoxy adhesive; (3) Adding fluorescent powder to the transparent liquid epoxy glue, stirring and degassing to obtain the fluorescent epoxy glue; (4) Coating the fluorescent epoxy adhesive on the release film, placing it in a forced air drying oven at 70-90° C., and baking it for 20-40 minutes to obtain a fluorescent epoxy adhesive film in a B-stage state; the amount of fluorescent powder added in the fluorescent epoxy adhesive film is 45-60wt%; the curing agent is methyltetrahydrophthalic anhydride; the catalyst is triphenylphosphine; and the antioxidant is antioxidant 1010.

2. A method for preparing a fluorescent epoxy film for epoxy CSP lamp beads according to claim 1, characterized in that: At least the following steps are included: (1) intermittently stirring an organosilicon-modified epoxy resin, a trifunctional epoxy compound, or an epoxy resin containing an alicyclic structure at 140-160° C. for 1-3 hours to obtain an epoxy resin solution; (2) Add defoamer, antioxidant, anti-precipitant and curing agent to the epoxy resin solution in sequence, stir continuously for 90 minutes at 90-110°C, cool to 70-80°C and add catalyst, stir manually for 5-15 minutes while keeping warm, stir for 3-8 minutes with a dispersing disk at a speed of 500-800 rpm, and finally control the vacuum degree and stir at a speed of 800-1200 rpm for 3-5 minutes to obtain a transparent liquid epoxy adhesive; (3) Adding fluorescent powder to the transparent liquid epoxy glue, stirring and degassing to obtain the fluorescent epoxy glue; (4) Coat the fluorescent epoxy adhesive on the release film, place it in a 70-90°C forced air drying oven, and bake it for 20-40 minutes to obtain a fluorescent epoxy adhesive film in the B-stage state.

3. An application of the fluorescent epoxy film for epoxy CSP lamp beads according to claim 1, characterized in that: The invention is applied to the preparation of epoxy CSP lamp beads. The epoxy CSP lamp bead structure comprises a chip, an adhesive layer, a solid crystal plate, and a fluorescent epoxy film. The adhesive layer is attached to the upper surface of the solid crystal plate, the chip is fixed on the upper surface of the adhesive layer, and the fluorescent epoxy film covers the exposed surface of the chip.

4. The use of the fluorescent epoxy film for epoxy CSP lamp beads according to claim 3, characterized in that: The chip has a thickness of 50-150 μm and a chip size of (4-10)×(5-20) mil.

Images