Bipolar plate nickel plating device for hydrogen production electrolytic cell

Abstract

The invention discloses a bipolar plate nickel plating device for a hydrogen production electrolytic cell, and relates to the technical field of nickel plating devices, the bipolar plate nickel plating device comprises a nickel plating treatment pool, a feeding mechanism is installed on the side face of the nickel plating treatment pool, one end of the nickel plating treatment pool is fixedly connected with a filtering mechanism and a stirring mechanism, and the stirring mechanism is located above the filtering mechanism. In the using process, a first connecting shaft and a first stirring paddle are driven by flowing power of a plating solution to rotate anticlockwise, at the moment, the plating solution in the nickel plating treatment pond is stirred anticlockwise by a first impeller and the first stirring paddle, in the same way, the plating solution in a second flow guide pipe is accelerated again through a second flow guide head, and the plating solution in a second flow guide pipe is accelerated again. And a second impeller is impacted to drive a second connecting shaft and a second stirring paddle to rotate clockwise, at the moment, the second impeller and the second stirring paddle stir the plating solution in the nickel plating treatment pool clockwise, and the uniformity of substances in the plating solution in the nickel plating treatment pool is improved.

Description

Technical Field

[0001] The invention relates to the technical field of nickel plating devices, in particular to a bipolar plate nickel plating device for a hydrogen production electrolyzer. Background Art

[0002] The bipolar plates for hydrogen production electrolyzers are key components in hydrogen production electrolyzers. In order to improve their corrosion resistance, enhance conductivity and improve surface properties during use, a nickel plating device is used to nickel-plate the surface of the bipolar plates.

[0003] For example, publication number: CN219490211U discloses "a nickel plating device", comprising: a trough body, a filtering mechanism and a lifting mechanism are respectively installed on one side and the top of the trough body; the filtering mechanism comprises a mounting platform installed on one side of the trough body and a slot constructed on one side of the mounting platform, a transmission motor is installed on the top of the mounting platform, and the output end of the transmission motor passes through the top of the mounting platform and is connected to a filter housing located on the inner side of the slot, a return pipe is inserted into the bottom of one side of the trough body, and an end of the return pipe away from the trough body passes through an outer wall of one side of the mounting platform and extends to the top of the filter housing, a return pump is installed on the return pipe, and one side wall of the slot is evenly bonded with bristles that abut against the corresponding side of the filter housing.

[0004] However, in the prior art, due to the complex shape of the bipolar plate, during the nickel plating process, the components in the plating solution are prone to uneven distribution at different positions, resulting in inconsistent coating thickness. In some corners, edges, holes and other parts, the coating may be too thin or missed. The uniformity of the coating directly affects the uniformity of the current distribution on the surface of the bipolar plate. If the coating is uneven, the current will be concentrated in areas with thinner thickness, resulting in excessive local current density, which may cause overheating and electrode polarization problems, and reduce the hydrogen production efficiency. In areas with thicker thickness, the current density is relatively small, and the bipolar plate may not be able to fully play its role. Summary of the invention

[0005] The purpose of the present invention is to provide a bipolar plate nickel plating device for a hydrogen production electrolyzer, so as to solve the problem raised in the above background technology that due to the complex shape of the bipolar plate, the components in the plating solution are prone to uneven distribution at different positions during the nickel plating process, resulting in inconsistent coating thickness, and the coating will be too thin or missed in some corners, edges and holes.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a bipolar plate nickel plating device for a hydrogen production electrolyzer, comprising a nickel plating treatment tank, a feeding mechanism is installed on the side of the nickel plating treatment tank, and one end of the nickel plating treatment tank is respectively fixedly connected with a filtering mechanism and a stirring mechanism, the stirring mechanism is located above the filtering mechanism, the feeding mechanism is used to feed into the nickel plating treatment tank, the filtering mechanism is used to filter impurities in the plating solution inside the nickel plating treatment tank, the stirring mechanism is used to stir the plating solution inside the nickel plating treatment tank, the stirring mechanism comprises an air compressor, a No. 1 guide pipe, a No. 1 connecting shaft, a No. 2 guide pipe and a No. 2 connecting shaft, the The air compressor is fixedly connected to one end of the nickel plating treatment pool, and an air duct is fixedly connected to the end of the air compressor, a filter box is installed inside the nickel plating treatment pool, the air duct is fixedly connected to the filter box, the No. 1 guide pipe is fixedly connected to the filter box, the No. 1 connecting shaft is rotatably connected to the inside of the nickel plating treatment pool, and the No. 1 connecting shaft surface is fixedly connected to the No. 1 impeller, the No. 1 connecting shaft surface is fixedly connected to the No. 1 stirring paddle, the No. 2 guide pipe is fixedly connected to the filter box, the No. 2 connecting shaft is rotatably connected to the inside of the nickel plating treatment pool, and the No. 2 connecting shaft surface is fixedly connected to the No. 2 impeller, and the No. 2 connecting shaft surface is fixedly connected to the No. 2 stirring paddle.

[0007] Preferably, the bottom of the nickel plating treatment pool is funnel-shaped, and a first reinforcement plate and a second reinforcement plate are fixedly connected inside the nickel plating treatment pool.

[0008] Preferably, the No. 1 connecting shaft is located on the upper part of the No. 1 reinforcement plate, and the No. 1 connecting shaft is rotatably connected to the No. 1 reinforcement plate.

[0009] Preferably, the No. 1 stirring paddle is located above the No. 1 connecting shaft, the end of the No. 1 guide pipe is fixedly connected to a No. 1 guide head, and the No. 1 guide head is located on the side of the No. 1 impeller.

[0010] Preferably, the second connecting shaft is located on the upper part of the second reinforcement plate, and the second connecting shaft is rotatably connected to the second reinforcement plate.

[0011] Preferably, the No. 2 stirring paddle is located above the No. 2 impeller, and the end of the No. 2 guide pipe is fixedly connected with a No. 2 guide head, and the No. 2 guide head is located on the side of the No. 2 impeller.

[0012] Preferably, the No. 1 guide head and the No. 2 impeller are both trumpet tubes.

[0013] Preferably, the filtering mechanism includes a circulation pump, which is fixedly connected to the side of the nickel plating treatment pool, and the end of the circulation pump is fixedly connected to a water pumping main pipe, the end of the water pumping main pipe is fixedly connected to a water pumping branch pipe, the water pumping branch pipe is fixedly connected to the bottom of the nickel plating treatment pool, and the upper part of the circulation pump is fixedly connected to a water outlet pipe, and the water outlet pipe is fixedly connected to the filter box.

[0014] Preferably, a mounting groove is fixedly connected inside the filter box, a mounting plate is plugged into the mounting groove, and a filter plate is fixedly connected to the side of the mounting plate.

[0015] Preferably, the feeding mechanism includes a horizontal moving component, the horizontal moving component is fixedly connected to the side of the nickel plating treatment pool, and the moving end of the horizontal moving component is fixedly connected to the vertical moving component, the moving end of the vertical moving component is fixedly connected to a mounting frame, the bottom of the mounting frame is fixedly connected to a fixed plate, the bottom of the fixed plate is fixedly connected to an electric push rod, a placement rack is installed at the bottom of the electric push rod, the upper part of the placement rack is fixedly connected to a limiting rod, and the limiting rod is slidably plugged into the fixed plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. In the present invention, the high-speed flowing plating solution is accelerated again by the No. 1 guide head, and the No. 1 impeller is impacted. The power of the flow of the plating solution drives the No. 1 connecting shaft and the No. 1 stirring paddle to rotate counterclockwise. At this time, the No. 1 impeller and the No. 1 stirring paddle stir the plating solution inside the nickel-plating treatment tank counterclockwise. Similarly, the plating solution inside the No. 2 guide pipe is accelerated again by the No. 2 guide head, and the No. 2 impeller is impacted, driving the No. 2 connecting shaft and the No. 2 stirring paddle to rotate clockwise. At this time, the No. 2 impeller and the No. 2 stirring paddle stir the plating solution inside the nickel-plating treatment tank clockwise, thereby improving the uniformity of the substances in the plating solution inside the nickel-plating treatment tank.

[0018] 2. In the present invention, the counterclockwise stirring of the No. 1 stirring paddle and the clockwise stirring of the No. 2 stirring paddle make the plating solutions in the nickel plating treatment tank merge and impact each other during the mixing process, thereby further improving the uniformity of the substances in the plating solution.

[0019] 3. In the present invention, during the process of nickel plating the bipolar plates, the plating solution in the nickel plating treatment pool is circulated into the filter box through the pumping branch pipe and the pumping main pipe by a circulating pump, and the impurities in the plating solution are filtered through the filter plate to prevent the impurities in the plating solution from affecting the quality of the nickel plating layer of the bipolar plates. The filter plate is installed and disassembled by plugging the mounting plate and the mounting groove, thereby facilitating the cleaning and replacement of the filter plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the three-dimensional structure of a bipolar plate nickel plating device for a hydrogen production electrolyzer according to the present invention;

[0021] Figure 2 A schematic side view of a nickel plating device for a bipolar plate of a hydrogen production electrolyzer according to the present invention;

[0022] Figure 3 A schematic diagram of the top view of a bipolar plate nickel plating device for a hydrogen production electrolyzer according to the present invention;

[0023] Figure 4 This is a schematic diagram of the internal structure of a filter box in a bipolar plate nickel plating device for a hydrogen production electrolyzer according to the present invention;

[0024] Figure 5 It is a schematic diagram of the top view of the structure of a No. 1 flow guide tube in a bipolar plate nickel plating device for a hydrogen production electrolyzer according to the present invention;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the second flow guide pipe in a bipolar plate nickel plating device for a hydrogen production electrolyzer according to the present invention;

[0026] Figure 7 The present invention is a schematic diagram of the three-dimensional structure of a feeding mechanism in a bipolar plate nickel plating device for a hydrogen production electrolyzer.

[0027] In the figure: 1. nickel plating treatment tank; 2. filtering mechanism; 21. circulating pump; 22. water pumping main pipe; 23. water outlet pipe; 24. filter box; 25. water pumping branch pipe; 26. filter plate; 27. mounting groove; 28. mounting plate; 3. stirring mechanism; 31. air compressor; 32. air guide pipe; 33. No. 1 guide pipe; 34. No. 1 guide head; 35. No. 1 connecting shaft; 36. No. 1 impeller; 37. No. 1 stirring paddle; 38. No. 2 guide pipe; 39. No. 2 guide head; 310. No. 2 connecting shaft; 311. No. 2 impeller; 312. No. 2 stirring paddle; 4. feeding mechanism; 41. horizontal moving assembly; 42. vertical moving assembly; 43. mounting frame; 44. fixing plate; 45. electric push rod; 46. placement frame; 47. limit rod. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Example 1: Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown: a bipolar plate nickel plating device for a hydrogen production electrolyzer, comprising a nickel plating treatment tank 1, a feeding mechanism 4 is installed on the side of the nickel plating treatment tank 1, and one end of the nickel plating treatment tank 1 is respectively fixedly connected with a filtering mechanism 2 and a stirring mechanism 3, the stirring mechanism 3 is located above the filtering mechanism 2, the feeding mechanism 4 is used to feed into the nickel plating treatment tank 1, the filtering mechanism 2 is used to filter impurities in the plating solution in the nickel plating treatment tank 1, and the stirring mechanism 3 is used to stir the plating solution in the nickel plating treatment tank 1. The mechanism 3 includes an air compressor 31, a No. 1 guide pipe 33, a No. 1 connecting shaft 35, a No. 2 guide pipe 38 and a No. 2 connecting shaft 310. The air compressor 31 is fixedly connected to one end of the nickel plating treatment pool 1, and the end of the air compressor 31 is fixedly connected to an air guide pipe 32. A filter box 24 is installed inside the nickel plating treatment pool 1. The air guide pipe 32 is fixedly connected to the filter box 24. The No. 1 guide pipe 33 is fixedly connected to the filter box 24. The No. 1 connecting shaft 35 is rotatably connected to the inside of the nickel plating treatment pool 1, and the No. 1 connecting shaft 35 is rotatably connected to the inside of the nickel plating treatment pool 1. The surface of the No. 1 connecting shaft 35 is fixedly connected to the No. 1 impeller 36, the surface of the No. 1 connecting shaft 35 is fixedly connected to the No. 1 stirring paddle 37, the No. 2 guide pipe 38 is fixedly connected to the filter box 24, the No. 2 connecting shaft 310 is rotatably connected to the inside of the nickel plating treatment tank 1, and the surface of the No. 2 connecting shaft 310 is fixedly connected to the No. 2 impeller 311, the surface of the No. 2 connecting shaft 310 is fixedly connected to the No. 2 stirring paddle 312, the No. 1 connecting shaft 35 is located on the upper part of the No. 1 reinforcement plate, and the No. 1 connecting shaft 35 is rotatably connected to the No. 1 reinforcement plate. The stirring paddle No. 1 37 is located above the connecting shaft No. 1 35, the end of the guide tube No. 1 33 is fixedly connected with the guide head No. 1 34, the guide head No. 1 34 is located on the side of the impeller No. 1 36, the connecting shaft No. 2 310 is located on the upper part of the reinforcing plate No. 2, and the connecting shaft No. 2 310 is rotatably connected with the reinforcing plate No. 2, the stirring paddle No. 2 312 is located above the impeller No. 2 311, the end of the guide tube No. 2 38 is fixedly connected with the guide head No. 2 39, the guide head No. 2 39 is located on the side of the impeller No. 2 311.

[0030] In this embodiment, a plating solution is added to the nickel plating treatment pool 1. While the filter mechanism 2 is filtering the plating solution, the air compressor 31 injects compressed air into the filter box 24 through the air guide pipe 32, thereby increasing the internal pressure of the filter box 24. On the one hand, the filtration speed of the plating solution can be accelerated, and at the same time, the flow speed of the plating solution after the filtration is accelerated. The plating solution is circulated to the inside of the nickel plating treatment pool 1 through the No. 1 guide pipe 33 and the No. 2 guide pipe 38;

[0031] The high-speed flowing plating solution is accelerated again through the No. 1 guide head 34, impacting the No. 1 impeller 36, and the No. 1 connecting shaft 35 and the No. 1 stirring paddle 37 are driven to rotate counterclockwise by the power of the flow. At this time, the No. 1 impeller 36 and the No. 1 stirring paddle 37 stir the plating solution inside the nickel plating treatment tank 1 counterclockwise. Similarly, the plating solution inside the No. 2 guide pipe 38 is accelerated again through the No. 2 guide head 39, impacting the No. 2 impeller 311, driving the No. 2 connecting shaft 310 and the No. 2 stirring paddle 312 to rotate clockwise. At this time, the No. 2 impeller 311 and the No. 2 stirring paddle 312 stir the plating solution inside the nickel plating treatment tank 1 clockwise, thereby improving the uniformity of the substances in the plating solution inside the nickel plating treatment tank 1;

[0032] Through the counterclockwise stirring of the first stirring paddle 37 and the clockwise stirring of the second stirring paddle 312, the plating solutions in the nickel plating treatment tank 1 are combined and impacted with each other during the mixing process, thereby further improving the uniformity of the substances in the plating solution.

[0033] Embodiment 2: According to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the feeding mechanism 4 includes a horizontal moving component 41, the horizontal moving component 41 is fixedly connected to the side of the nickel plating treatment tank 1, and the moving end of the horizontal moving component 41 is fixedly connected to the vertical moving component 42, the moving end of the vertical moving component 42 is fixedly connected to the mounting frame 43, the bottom of the mounting frame 43 is fixedly connected to a fixed plate 44, the bottom of the fixed plate 44 is fixedly connected to an electric push rod 45, the bottom of the electric push rod 45 is installed with a placement frame 46, the upper part of the placement frame 46 is fixedly connected to a limit rod 47, and the limit rod 47 is slidably plugged with the fixed plate 44;

[0034] The bottom of the nickel plating treatment pool 1 is funnel-shaped, and the inside of the nickel plating treatment pool 1 is fixedly connected with a No. 1 reinforcement plate and a No. 2 reinforcement plate, respectively. The No. 1 guide head 34 and the No. 2 impeller 311 are both trumpet tubes. The filtering mechanism 2 includes a circulating pump 21, and the circulating pump 21 is fixedly connected to the side of the nickel plating treatment pool 1, and the end of the circulating pump 21 is fixedly connected to a water pumping main pipe 22, and the end of the water pumping main pipe 22 is fixedly connected to a water pumping branch pipe 25, and the water pumping branch pipe 25 is fixedly connected to the bottom of the nickel plating treatment pool 1. The upper part of the circulating pump 21 is fixedly connected with a water outlet pipe 23, and the water outlet pipe 23 is fixedly connected to a filter box 24. The filter box 24 is fixedly connected with a mounting groove 27, and a mounting plate 28 is inserted into the mounting groove 27. The side of the mounting plate 28 is fixedly connected to a filter plate 26.

[0035] In this embodiment, plating solution is added to the inside of the nickel plating treatment pool 1, and the bipolar plate to be nickel plated is placed inside the placement rack 46. The horizontal position of the bipolar plate is adjusted by the horizontal moving component 41, and then the vertical position of the bipolar plate is adjusted by the vertical moving component 42. Finally, the placement rack 46 and the bipolar plate placed inside are placed inside the nickel plating treatment pool 1 by extending the electric push rod 45 for nickel plating. During the movement of the placement rack 46, the limit rod 47 slides along the fixed plate 44, thereby limiting the movement of the placement rack 46 and improving the stability of the movement of the placement rack 46.

[0036] In the process of nickel plating the bipolar plate, the plating solution in the nickel plating treatment tank 1 is circulated and pumped into the filter box 24 through the circulating pump 21 through the pumping branch pipe 25 and the pumping main pipe 22, and the impurities in the plating solution are filtered through the filter plate 26 to prevent the impurities in the plating solution from affecting the quality of the nickel plating layer of the bipolar plate;

[0037] The filter plate 26 is installed and removed by plugging the installation plate 28 into the installation groove 27 , so that the filter plate 26 can be easily cleaned and replaced.

[0038] The use method and working principle of the device are as follows: a plating solution is added into the nickel plating treatment tank 1, a bipolar plate to be nickel plated is placed in a placement rack 46, the horizontal position of the bipolar plate is adjusted by a horizontal moving assembly 41, and the vertical position of the bipolar plate is adjusted by a vertical moving assembly 42, and finally, the placement rack 46 and the bipolar plate placed therein are placed in the nickel plating treatment tank 1 by extending an electric push rod 45 for nickel plating;

[0039] During the process of nickel plating the bipolar plate, the plating solution in the nickel plating treatment tank 1 is circulated and pumped into the filter box 24 through the circulating pump 21 through the pumping branch pipe 25 and the pumping main pipe 22, and the impurities in the plating solution are filtered through the filter plate 26;

[0040] While the filter mechanism 2 is filtering the plating solution, the air compressor 31 injects compressed air into the filter box 24 through the air guide pipe 32, thereby increasing the internal pressure of the filter box 24, and the plating solution circulates to the inside of the nickel plating treatment tank 1 through the first guide pipe 33 and the second guide pipe 38;

[0041] The high-speed flowing plating solution is accelerated again through the No. 1 guide head 34, impacting the No. 1 impeller 36, and the power of the plating solution flow drives the No. 1 connecting shaft 35 and the No. 1 stirring paddle 37 to rotate counterclockwise. Similarly, the plating solution inside the No. 2 guide tube 38 is accelerated again through the No. 2 guide head 39, impacting the No. 2 impeller 311, driving the No. 2 connecting shaft 310 and the No. 2 stirring paddle 312 to rotate clockwise.

[0042] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A bipolar plate nickel plating device for a hydrogen production electrolyzer, comprising a nickel plating treatment tank (1), a feeding mechanism (4) is installed on the side of the nickel plating treatment tank (1), and a filtering mechanism (2) and a stirring mechanism (3) are fixedly connected to one end of the nickel plating treatment tank (1), respectively, and the stirring mechanism (3) is located above the filtering mechanism (2), characterized in that: The feeding mechanism (4) is used to feed materials into the nickel plating treatment pool (1); the filtering mechanism (2) is used to filter impurities in the plating solution in the nickel plating treatment pool (1); the stirring mechanism (3) is used to stir the plating solution in the nickel plating treatment pool (1); the stirring mechanism (3) comprises an air compressor (31), a No. 1 guide pipe (33), a No. 1 connecting shaft (35), a No. 2 guide pipe (38) and a No. 2 connecting shaft (310); the air compressor (31) is fixedly connected to one end of the nickel plating treatment pool (1); and an air guide pipe (32) is fixedly connected to the end of the air compressor (31); a filter box (24) is installed inside the nickel plating treatment pool (1); and the air guide pipe (32) is fixedly connected to the end of the air compressor (31); The first flow guide pipe (32) is fixedly connected to the filter box (24), the first flow guide pipe (33) is fixedly connected to the filter box (24), the first connecting shaft (35) is rotatably connected to the inside of the nickel plating treatment tank (1), and the surface of the first connecting shaft (35) is fixedly connected to the first impeller (36), and the surface of the first connecting shaft (35) is fixedly connected to the first stirring paddle (37), the second flow guide pipe (38) is fixedly connected to the filter box (24), the second connecting shaft (310) is rotatably connected to the inside of the nickel plating treatment tank (1), and the surface of the second connecting shaft (310) is fixedly connected to the second impeller (311), and the surface of the second connecting shaft (310) is fixedly connected to the second stirring paddle (312).

2. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The bottom of the nickel plating treatment pool (1) is funnel-shaped, and a first reinforcement plate and a second reinforcement plate are respectively fixedly connected inside the nickel plating treatment pool (1).

3. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The No. 1 connecting shaft (35) is located on the upper portion of the No. 1 reinforcing plate, and the No. 1 connecting shaft (35) is rotatably connected to the No. 1 reinforcing plate.

4. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The first stirring paddle (37) is located above the first connecting shaft (35), the end of the first flow guide pipe (33) is fixedly connected to the first flow guide head (34), and the first flow guide head (34) is located on the side of the first impeller (36).

5. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The second connecting shaft (310) is located on the upper part of the second reinforcing plate, and the second connecting shaft (310) is rotatably connected to the second reinforcing plate.

6. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The No. 2 stirring paddle (312) is located above the No. 2 impeller (311), and the end of the No. 2 flow guide pipe (38) is fixedly connected to a No. 2 flow guide head (39), and the No. 2 flow guide head (39) is located on the side of the No. 2 impeller (311).

7. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 4, characterized in that: The first guide head (34) and the second impeller (311) are both trumpet tubes.

8. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The filtering mechanism (2) comprises a circulation pump (21), the circulation pump (21) is fixedly connected to the side of the nickel plating treatment pool (1), and the end of the circulation pump (21) is fixedly connected to a water pumping main pipe (22), the end of the water pumping main pipe (22) is fixedly connected to a water pumping branch pipe (25), the water pumping branch pipe (25) is fixedly connected to the bottom of the nickel plating treatment pool (1), and the upper part of the circulation pump (21) is fixedly connected to a water outlet pipe (23), and the water outlet pipe (23) is fixedly connected to a filter box (24).

9. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The filter box (24) is fixedly connected with a mounting groove (27) inside, a mounting plate (28) is inserted inside the mounting groove (27), and a filter plate (26) is fixedly connected to the side of the mounting plate (28).

10. The bipolar plate nickel plating device for a hydrogen production electrolyzer according to claim 1, characterized in that: The feeding mechanism (4) comprises a horizontal moving component (41), the horizontal moving component (41) is fixedly connected to the side of the nickel plating treatment tank (1), and the moving end of the horizontal moving component (41) is fixedly connected to the vertical moving component (42), the moving end of the vertical moving component (42) is fixedly connected to the mounting frame (43), the bottom of the mounting frame (43) is fixedly connected to a fixed plate (44), the bottom of the fixed plate (44) is fixedly connected to an electric push rod (45), the bottom of the electric push rod (45) is installed with a placement frame (46), the upper part of the placement frame (46) is fixedly connected to a limit rod (47), and the limit rod (47) is slidably plugged with the fixed plate (44).

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