Mounting structure of flow board

Abstract

A flow substrate mounting structure (1002) includes a fastener hole (1004A, 1004B) and an alignment feature, where the alignment feature includes at least one of an alignment pin (1016A), an alignment slot, and an alignment step, the alignment pin (1016A) being removably coupled with the flow substrate mounting structure. A structure for coupling a plurality of flow substrates includes a flow substrate mounting structure having a first fastener hole (1004A) and a second fastener hole (1004B), where the first fastener hole is configured to couple with a first fastener (1014A) and the second fastener hole is configured to couple with a second fastener, where the first fastener hole is configured to couple with the first fastener (1014A) and the second fastener hole is configured to couple with the second fastener (1014B). Wherein the alignment device is used for aligning the flow substrate mounting structure with a plurality of flow substrates.

Description

[0001] This application is a divisional application of the invention patent application with an international application date of July 17, 2019, an invention name of “Installation structure of flow substrate” and an application number of 201980047486.5.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority under §119(e) of U.S. Provisional Application No. 62 / 699,196, filed on July 17, 2018, and U.S. Provisional Application No. 62 / 804,086, filed on February 11, 2019, both of which are incorporated herein by reference in their entirety. Technical Field

[0004] The present application relates to mounting structures for fluid delivery systems, and more particularly to extreme flow rate and / or high temperature surface mounted fluid delivery systems for use in semiconductor processing and the petrochemical industry. Background Art

[0005] Fluid delivery systems are used in many modern industrial processes to regulate and manipulate fluid flows so that desired substances can be introduced into the process in a controlled manner. Practitioners have developed a complete class of fluid delivery systems in which fluid handling components are removably connected to flow substrates containing fluid channel conduits. Many fluid delivery systems utilize some intermediate structure to mount the flow substrate, manifold, or fluid delivery rod to a supporting surface. In most cases, these structures are dedicated to a specific fluid delivery system design and cannot be used with other designs.

[0006] The arrangement of such flow substrates establishes a flow sequence, through which the fluid handling components can regulate and control the fluid as needed. The joint between such flow substrates and the removable fluid handling components is standardized and has almost no changes. Such fluid delivery system designs are generally described as modular or surface mounted systems. Representative applications of such surface mounted fluid delivery systems include gas panels used in semiconductor manufacturing equipment and sampling systems used in petrochemical refining. Many types of manufacturing equipment for performing process steps for manufacturing semiconductors are collectively referred to as tools. Embodiments of the present application generally relate to fluid delivery systems, such as fluid delivery systems for semiconductor processing, and particularly to surface mounted fluid delivery systems suitable for use in extreme flow rates and / or high temperature applications (when the process fluid is heated to a temperature higher than the ambient temperature). These aspects of the present application can be applied to structures that mount surface mounted fluid delivery systems to support structures or manifolds, whether the structure is located locally or spread around semiconductor processing tools.

[0007] U.S. Patent No. 8,496,029B2 issued on July 30, 2013 (which is incorporated herein by reference) describes a fluid delivery system, wherein a flow substrate may include a fluid passageway that guides fluid from an inlet of the flow substrate to an outlet of the flow substrate in a longitudinal direction and guides fluid in a lateral direction. As described therein, the fluid passageway may be formed in a surface of a substrate opposite to a surface to which a fluid handling component is attached and then sealed with a cover.

[0008] A group of fluid handling components assembled into a sequence for handling a single fluid is often referred to as a fluid delivery rod. An equipment subsystem consisting of several fluid delivery rods is used to deliver process fluids to a specific semiconductor processing chamber. This equipment subsystem is often referred to as a gas panel. In the 1990s, some inventors solved the maintainability and size problems of the gas panel by creating a fluid delivery rod in which the main fluid flow path is composed of passive metallic structures, including conduits, through which the process fluid moves, and valves and active (and passive) fluid handling components that are detachably connected to it. Passive fluid flow path components are variously called: manifolds, substrates, blocks, etc. The present disclosure uses the term flow substrate to refer to various fluid delivery system components containing one or more passive fluid flow paths, wherein other fluid handling devices may be installed on the fluid flow path.

[0009] The flow substrate may form part of a fluid delivery rod, the entire fluid delivery rod, or even the entire fluid delivery panel, which in conventional designs will include a plurality of individual fluid delivery rods. In the fluid delivery system described in U.S. Pat. No. 8,307,854 B1, individual fluid delivery rod brackets are mounted to a support surface, and the fluid flow substrate described in U.S. Pat. No. 8,496,029 B2 is also mounted on a support surface.

[0010] Applicant realizes that almost all fluid delivery systems utilize some intermediate structure to mount the fluid flow substrate, manifold, or fluid delivery rod to a support surface. In most cases, these structures are specific to the fluid delivery system design and cannot be used for other designs. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1A -D shows a mounting structure consistent with an embodiment of the present application.

[0012] FIG. 2 illustrates various fluid flow substrates consistent with embodiments of the present application.

[0013] Figures 3A-3E Various plan, perspective, and end views of a portion of a fluid delivery system consistent with embodiments of the present application are shown.

[0014] 4 shows two different isometric views of a manner consistent with embodiments of the present application for mounting a fluid flow substrate, and a fluid flow substrate and manifold combination, to a support surface.

[0015] Figure 5 Shown is a manner in which a fluid flow substrate and a manifold are aligned and attached to one another consistent with embodiments of the present application.

[0016] Figure 6 The manner in which the mounting structure of the present application is used with an integrated fluid flow substrate consistent with embodiments of the present application is shown, wherein the integrated fluid flow substrate may form part of or all of a fluid transport panel.

[0017] Fig. 7A Some fluid transfer rod brackets are shown, such as those described in US Pat. No. 8,496,029 B2, which are no longer required according to embodiments of the present application.

[0018] Figure 7B It is shown how embodiments of the present application can be used with conventional fluid transport flow substrates and manifolds, such as the K1S.

[0019] Fig. 8A-J shows a modular flow base 800 consistent with an embodiment of the present application, to which one or more mounting structures of the present application can be attached.

[0020] Fig. 9A Depicted is a top view of an example flow substrate coupled to a substrate mounting structure consistent with an embodiment of the present application.

[0021] Fig.9B1 It shows the embodiment consistent with the present application Fig. 9A Perspective view of the mounting structure.

[0022] Figure 9B2 An example of a device with an alignment fixture consistent with an embodiment of the present application is shown. Fig. 9A -B1 Perspective view of the mounting structure.

[0023] Fig. 9C Depicted is consistent with the embodiments of the present application Fig. 9A -B1 Cross-sectional view of the mounting structure.

[0024] Fig.9D It shows the embodiment consistent with the present application Fig. 9A -B1 Bottom view of the mounting structure.

[0025] Fig. 10A -E depicts another example of a mounting structure consistent with embodiments of the present application.

[0026] Fig.11A -D shows another example of a mounting structure consistent with an embodiment of the present application.

[0027] Fig. 12A -E shows another example of a mounting structure consistent with an embodiment of the present application.

[0028] Fig.13A -E shows several examples of mounting structures with alignment frames for orienting and supporting the mounting structures relative to a flow substrate consistent with embodiments of the present application.

[0029] Fig.14A -D depicts another example of a mounting structure consistent with embodiments of the present application. DETAILED DESCRIPTION

[0030] The present application relates to a fluid delivery system, and more specifically, to a structure for mounting various components of a fluid delivery system, such as a flow base plate and a manifold, to a supporting surface. Several embodiments of modular flow base plates, mounting structures, and systems including combinations thereof are disclosed herein. The details of various embodiments of the present application are described below with specific reference to the accompanying drawings. The modular flow base plates, mounting structures, and systems disclosed herein are not limited to the specific examples set forth in the following description or shown in the accompanying drawings. Likewise, the words and terms used herein are for descriptive purposes and should not be considered limiting. The use of "including," "comprising," or "having," "containing," "involving," and variations thereof herein is intended to cover the items listed thereafter and their equivalents as well as other items.

[0031] It should be understood that the fluid material operated in the fluid transport flow substrate of the present embodiment can be a gaseous, liquid or vaporous substance that changes between liquid and vapor phases according to its specific temperature and pressure. Representative fluid substances can be pure elements such as argon (Ar); vaporized compounds such as boron trichloride (BC13); a mixture of silicon tetrachloride (SiC14) that is usually liquid in a carrier gas; or an aqueous reagent.

[0032] U.S. Patent No. 8,307,854 B1, issued November 13, 2012, and incorporated herein by reference, describes a surface mounted fluid delivery system in which a plurality of individual fluid flow substrates having fluid handling components mounted thereon can be mounted to a standard bracket to form a fluid delivery bar in which fluid passages within the flow substrate direct fluid in a longitudinal direction from an inlet of the fluid delivery bar to an outlet of the fluid delivery bar. As described therein, manifolds form a second layer below the plane of the flow substrate and can be mounted to the flow substrate from above the flow substrate, and these manifolds can be used to direct fluid in a transverse direction between adjacent fluid delivery bars and along respective fluid delivery bars. Advantageously, the fluid flow substrate, manifolds, and fluid delivery bar brackets can be manufactured in a most cost-effective manner, and the individual fluid delivery bars can be removed and replaced as an integral unit, which only requires the removal of fasteners associated with one or more manifolds and any fasteners associated with mounting the fluid delivery bar bracket to the supporting surface.

[0033] U.S. Patent No. 8,496,029B2, issued on July 30, 2013 (which is incorporated herein by reference), describes another surface mounted fluid delivery system, wherein a fluid flow substrate may include a plurality of fluid passages that direct fluid from an inlet of the flow substrate to an outlet of the flow substrate in a longitudinal direction, and that direct fluid in a transverse direction. As described therein, the fluid passages may be formed in a surface on the substrate opposite to the surface to which the fluid handling component is attached, and then sealed with a cover. These flow substrates may form a portion of a fluid delivery rod, an entire fluid delivery rod, or even an entire fluid delivery panel, which in conventional designs includes a plurality of separate fluid delivery rods. In the fluid delivery system described in U.S. Patent No. 8,307,854B1, individual fluid delivery rod brackets are mounted to a support surface, and the fluid flow substrate described in U.S. Patent No. 8,496,029B2 is also mounted on a support surface.

[0034] Applicants recognize that almost all fluid delivery systems utilize some intermediate structure to mount a fluid flow substrate, manifold, or fluid delivery rod to a support surface. In most cases, these structures are proprietary to a specific fluid delivery system design and cannot be used with other designs. In view of this recognition, the embodiments described herein are directed to a mounting structure that can be used to mount a variety of fluid flow substrates, and combinations of fluid flow substrates and manifolds to a support surface. According to one aspect of the embodiments described herein, the mounting structure can be used for conventional fluid substrate designs, such as those described in U.S. Patent No. 6,394,138 (which patent is incorporated herein by reference, and the design is referred to as "K1S" in the semiconductor processing industry), as well as more recent designs, such as U.S. Patent No. 8,307,854 B1 and U.S. Patent No. 8,496,029 B2 and the designs described in Figures 1-14 herein. As further described in detail herein, the embodiments described herein can elevate the substrate and the combination of the substrate and manifold above the surface to which they are to be mounted, thereby allowing air to circulate around and under the fluid substrate and manifold. The mounting structure uses a minimum amount of material, is compact, and can be used to mount the base plate, or a combination of base plate and manifold, to a supporting surface using interchangeable parts.

[0035] The accompanying drawings are not intended to be drawn to scale. In the accompanying drawings, each identical or nearly identical component shown in various figures is represented by the same number. For clarity, not every component is labeled in every figure.

[0036] Figure 1A -D shows an example of the installation structure according to an embodiment of the present application, wherein: Figure 1A A mounting structure including an integral mounting body that can be used to mount a substrate to a support surface is shown. Figure 1BA multi-part mounting body is shown that can be used to mount a base plate and a manifold to a supporting surface. Figure 1C A portion of the multi-component mounting body is shown that can be used to mount a manifold to a base plate. Base plates, base plate and manifold combinations, and the manner in which manifolds can be mounted to a support surface and to each other are shown in Figures 2-7.

[0037] like Figure 1A As shown, in one embodiment of the present application, the mounting structure includes an integrated mounting body 100, which can be used to mount a flow substrate to a support surface, the flow substrate being, for example, the flow substrate of U.S. Pat. No. 8,307,854 B1. Figure 1A and 1B , or the flow base described in U.S. Patent No. 8,496,029 B2. Although not specifically shown, the flow base shown in FIGS. 3-10 of U.S. Patent No. 8,307,854 B1 may also be adapted for use with the integral mounting body 100, as will be described below. The integral mounting body 100 includes a hole 140 extending through the integral mounting body 100 and adapted to receive a fastener 110 and a fastener retainer 120, such as a coil spring. Although in Figure 1A 140, and the fastener 110 is threaded at its distal end and is received in an internally threaded hole in a support surface (not shown). The fastener retainer 120 is received in the hole 140 and serves to hold the fastener 110 in place. The integral mounting body 100 also includes holes 145 and 146 adapted to receive a locking pin 130 that extends through a recess 201 (see FIG. 145 ) in the body of the flow base 200B. Figure 2A ) formed in the hole 202. As can be understood from Figure 3, for example, only from a single direction (eg, from above) to enter, the substrate, fluid treatment components, manifold, and mounting body can be mounted to each other and to the support surface.

[0038] Figure 1B The mounting structure shown includes a multi-component mounting body including a clamp 101 and a support 102. As best shown in FIG. 4, the multi-component mounting body is suitable for mounting a fluid flow substrate (such as fluid flow substrate 200B) and a fluid manifold 300 to a support surface. The clamp 101 includes an aperture 140 extending through the body of the clamp 101 and adapted to be mounted in a manner similar to that described above with respect to Figure 1A The fastener 110 and fastener holder 120 are received in the manner described. The clamp 101 also includes a hole 145 adapted to receive a locking pin 130 extending through a recess 201 in the body of the flow substrate 200B (see Figure 2A) and into the hole 302 on the upper surface of the manifold 300, such as Figure 5 The hole 302 extends through the body of the manifold 300, as shown. Figure 3D The support 102 also includes a hole 141 extending through the body of the support 102 and adapted to receive the fastener 110. The support 102 also includes a hole 146 adapted to receive a second locking pin 131, which is also received in a hole 302 in the lower surface of the manifold 300. The locking pin 131 is used to retain the support 102 on the lower surface of the manifold 300 during assembly. It should be understood that as Figure 3B As shown, the multi-component mounting body, when combined with the body of the manifold 300, forms a mounting structure that is similar in structure and size to the one-piece mounting body 100. As can be understood from FIG. 3 , for example, access from only a single direction (e.g., from above) is required to mount the flow substrate, fluid processing components, manifold, and mounting body to each other and to a support surface.

[0039] Figure 1C A portion of a multi-component mounting body is shown, specifically, a clamp 101 that can be used to mount a manifold (such as manifold 300) to the lower surface of a flow substrate (such as flow substrate 200B). Fasteners 111 are similar to those described with respect to Figure 1A and 1B Fastener 110 is depicted, although not shown, as being threaded at its distal end. However, fastener 111 is shorter in length than fastener 110, and fastener 111 is not received in an internally threaded hole in a support surface, but rather is received in an internally threaded hole 340 (see FIG. 1 ) in an upper surface of manifold 300. Figure 5 When fastener 111 is tightened, it pulls the upper surface of manifold 300 into registration with the lower surface of flow substrate 200B and compresses a metal seal (not shown) received in a counterbore around a manifold port 305a formed in the upper surface of manifold 300, thereby forming a fluid seal with a corresponding manifold connection conduit port 205b formed in the lower surface of flow substrate 200B.

[0040] FIG. 2 shows various fluid flow substrates 200 that can be used in embodiments of the present application. For example, conventional fluid flow substrates such as K1S flow substrate 200A can be used as shown in FIG. Figure 2A The modification shown includes a recess 201 in which a protruding portion of the integral mounting body 100 or the clamp 101 is received. As shown, a hole 202 is formed within the recess 201 to receive the locking pin 130. An integral fluid flow substrate (such as Figure 2B and 2C ) may also be suitable for use with embodiments of the present application. For example, Figure 2BA unitary fluid flow substrate 200B is shown which may be used to form a portion of a fluid delivery stem and which includes a recess 201 and a hole 202 . Figure 2C An integral fluid flow substrate 200C is shown, such as that described in U.S. Pat. No. 8,496,029 B2, which may be used to form a portion of, or even the entire fluid transport panel, and which includes a recess 201 and a hole 202. It should be understood that, although not shown, the various substrates depicted in FIGS. 3-10 of U.S. Pat. No. 8,307,854 B1 may be modified to include recesses 201 and holes 202 in a similar manner.

[0041] Figures 3A-3E Various plan views, perspective views, and end views of a portion of a fluid delivery system that may be used in embodiments of the present application are illustrated. For example, Figure 3D and 3E The manner in which a fluid handling component 350, such as a valve, a pressure regulator, etc., can be mounted to a flow substrate 200B is shown, as well as the possible use of a one-piece mounting body and a multi-component mounting body. As shown in FIG3 , the size of the upper surface of the mounting body is selected to be lower than the top surface of the flow substrate 200B to ensure that a leak-proof seal can be formed between the fluid handling component and the component conduit port formed in the upper surface of the flow substrate.

[0042] FIG4 shows two different isometric views showing examples of how to mount a fluid flow substrate 200B and a combination of a fluid flow substrate 200B and a manifold 300 to a support surface using an embodiment of the present application. In FIG4 , the flow substrate 200B is mounted to a support surface using an integrated mounting body 100, and the combination of the flow substrate 200B and the manifold 300 is mounted to a support surface using a clamp 101 and a support 102.

[0043] Figure 5 2B illustrates an example of how the fluid flow substrate 200B and the manifold 300 may be aligned and attached to each other. Figure 5 As shown, the fluid flow substrate 200B includes a manifold connection conduit port 205b that extends through the body of the fluid flow substrate and is fluidically connected to the component conduit port 205a (FIG. 4) on the top surface of the substrate. The manifold connection conduit port 205b is aligned with the manifold port 305a formed on the upper surface of the manifold 300, with a metal seal therebetween. When fully assembled, the port of the fluid handling component 350 is fluidically connected to the manifold port 305a by means of a channel formed between the component conduit port 205a and the manifold connection conduit port 205b.

[0044] Figure 6The examples show how the mounting structure of the present application can be used with an integrated fluid flow substrate that can form part or all of a fluid delivery panel.

[0045] Fig. 7A Some fluid transfer rod brackets are shown, such as those described in US Pat. No. 8,496,029 B2, which are no longer required for embodiments of the present application. Figure 7B It is illustrated how embodiments of the present application may be used with conventional fluid delivery flow substrates and manifolds such as the K1S.

[0046] Fig. 8A -J shows a modular flow substrate 800 by way of example, to which one or more mounting structures of the present application may be attached according to an embodiment of the present application. In one example, the modular flow substrate 800 may be used with a fluid handling component having an asymmetric port arrangement (e.g., a C-shaped sealing component), wherein one of the ports of the fluid handling component is axially aligned with the center of the fluid handling component, and the other port is located outside the axis. Although not shown in the figure, it should be understood that the embodiments of the present application may be modified to be used with a fluid handling component having a symmetric port arrangement (e.g., a W seal).

[0047] As shown, the flow substrate 800 includes a substrate body 801 formed from a solid block of material and an associated cover 895 (see Figure 8I ), each of which may be formed of a suitable material (e.g., stainless steel, aluminum, brass, polymer, etc.) depending on the intended purpose of the flow substrate. The substrate 800 includes a component attachment surface 805 to which various fluid handling components (such as valves, pressure sensors, filters, regulators, mass flow controllers, etc.) may be attached. One or more component conduit ports 820 may be located in the component attachment surface 805 of the flow substrate 800. Fig. 8A In the example of -J, component conduit port 820a can be fluidly connected to a first port (inlet or outlet) of a first fluid treatment component, and component port 820b can be fluidly connected to a second port (outlet or inlet) of the first fluid treatment component. Component conduit port 820c can be fluidly connected to a port (outlet or inlet) of a second fluid treatment component different from the first fluid treatment component.

[0048] Component conduit ports 820c and 820d and component conduit ports 820e and 820f will be connected to the inlet and outlet of the respective fluid handling components, respectively, and illustrate how the flow substrate 800 is specifically adapted to fluid handling components having an asymmetric port arrangement. Component port 820g is typically associated with an inlet or outlet of a device such as a mass flow controller that can be used to allow process fluids to flow between the various flow substrates of the fluid delivery bar.

[0049] A plurality of internally threaded component mounting holes 810a, 810b, 810c and 810d are associated with the component conduit ports 820a and 820b, each of which will receive a threaded end of a fastener (not shown) for sealingly mounting the fluid handling device to the flow substrate 800. A pair of internally threaded component mounting holes 810y, 810z are associated with the conduit port 820g, each of which will receive a threaded end of a fastener (not shown) for sealingly mounting one port of a fluid handling component such as a mass flow controller to the flow substrate 800. It will be appreciated that an adjacent flow substrate in the fluid delivery bar will typically provide another pair of mounting holes necessary to sealingly mount another port of the fluid handling component to the adjacent flow substrate. Leak ports 825a (for component conduit ports 820a and 820b) and 825b (for component conduit ports 820c and 820d) are associated with each pair of component conduit ports, which allow any leaks between these conduit ports and the corresponding fluid handling components to be detected.

[0050] The flow substrate 800 includes a plurality of fluid passages 875a, 875b, 875c, and 875d for flowing fluid along the flow substrate 800 in the longitudinal direction (ie, Fig. 8A For example, fluid passage 875a extends between tube stub connection 835 and component conduit port 820a, fluid passage 875b extends between component conduit ports 820b and 820c, fluid passage 875c extends between component conduit port 820d and component conduit port 820e, and fluid passage 875d extends between component conduit ports 820f and 820g. Tube stub 835 will typically be fluidly connected (e.g., by welding) to a process fluid source or tank.

[0051] A plurality of dowel pin holes 850a to 850h are formed in the flow base plate 800, extending from the component attachment surface 805 to a connection attachment surface 815, which is located on the side of the flow base plate opposite the component attachment surface 805. The connection attachment surface 815 can be used to connect the base plate 800 to the mounting structure of the fluid delivery rod, to the manifold, or to both, as described in U.S. Patent No. 8,307,854B1. Each of these dowel pin holes 850a-850h can receive a dowel pin (not shown) for performing a different function. The first function can be to align the cover 895 with the body 801 of the flow base plate 800, and the second function can be to align the flow base plate with the fluid delivery rod mounting structure in a manner similar to that described in U.S. Patent No. 8,307,854B1. It should be understood that in some installations, only the first of these functions can be performed, so that after alignment (and welding as further described below), the dowel pin can be removed and reused for another flow base plate body and cover. According to another aspect of the present application, the locating pins may be positioned rearwardly to be compatible with existing modular flow baseboard systems (eg, K1S system).

[0052] Figure 8C 800 is shown with a bottom view of the flow substrate 800, wherein a plurality of flow substrate mounting holes 830 are visible. The plurality of flow substrate mounting holes 830 may be formed in the cover 895 and extend through the cover 895 into the body 801 of the flow substrate ( Figure 8I 800 is more clearly shown). In some examples, when the cover 895 covers only a portion of the body 801, one or more of the plurality of flow substrate mounting holes can be located in the body 801. Within the flow substrate body 801, the flow substrate mounting holes 830 are internally threaded to receive fasteners (not shown) to mount the flow substrate 800 from below to a mounting surface, such as a fluid delivery rod mounting structure. The location of the flow substrate mounting holes 830 can vary depending on the location of the mounting holes in the mounting surface to which the flow substrate 800 is attached.

[0053] As can be seen from these figures, the component conduit ports 820 and fluid passages 875 can be machined in the most cost-effective manner. Thus, each of the component conduit ports 820a-820g can be formed by machining from the component attachment surface 805 into the first or top surface of the body 801 of the flow substrate 800, and the fluid passages 875b, 875c, and 875d can each be formed as shown. Figure 8F As shown, the fluid passage 875a may be formed by machining from the second or bottom surface of the body 801 of the flow substrate. Fig. 8EAs shown, it is formed by machining from the side of the body of the flow substrate. In some examples, each fluid passage 875 can be treated to enhance its corrosion resistance. It should be understood that the dimensions of each fluid passage 875 depicted in these figures are particularly suitable for higher flow rates, such as flow rates greater than about 50 SLM (standard liters per minute). In fact, the dimensions of each fluid passage depicted in these figures allow the flow substrate 800 to be used in high flow rate applications (e.g., about 50 to 100 SLM) and very high flow rate applications (e.g., more than about 200 SLM). Therefore, these flow substrates can be used in emerging semiconductor manufacturing equipment that is designed to operate at extremely high flow rates of about 200 SLM to 1000 SLM. It should be understood that the size of the fluid passage can be scaled down in a straightforward manner for use in lower flow applications, for example, by simply reducing the cross-sectional area of ​​one or more of the fluid passages 875b, 875c and 875d. In fact, because the component conduit port 820 and the fluid passage are formed in different processing steps, the size of the fluid passage is not limited by the size of the component conduit port, and therefore, the cross-sectional area of ​​the fluid passage can be significantly larger than, smaller than, or equal to the cross-sectional area of ​​the component conduit port to accommodate a wide range of flow rates.

[0054] Figure 8H and 8I Various details of the cover 895 are shown. According to one embodiment particularly suitable for semiconductor process fluids that may be frequently heated to above ambient temperature, the cover 895 can be formed from a thin sheet of stainless steel that is approximately 0.02 inches (0.5 mm) thick. The thinness of the stainless steel sheet allows heat to be easily transferred to the process fluid flowing in the flow substrate by applying heat to the connection attachment surface 815 of the substrate. The heat source can be provided by a block heater, by a cartridge heater inserted into a recess in a fluid delivery rod mounting structure (the flow substrate is attached to the mounting structure in a manner similar to that described in U.S. Patent No. 8,307,854 B1), or by a thin film heater (such as the thin film heater described in U.S. Patent No. 7,307,247). It should be understood that the thinness of the cover also allows the fluid flowing in the flow substrate to be cooled if desired.

[0055] The stainless steel plate can be chemically etched to form grooves 823 that surround and define fluid passages 875b, 875c, and 875d. Such chemical etching can be performed accurately and can be cheaper than other methods of forming grooves (e.g., alternative machining methods). According to one embodiment, the grooves can be etched to a thickness of about 0.01 inches (0.25 mm). The presence of each groove 823 that surrounds and defines each fluid passage 875b, 875c, and 875d can serve multiple purposes. For example, the thinness of the grooves allows the cover to be welded to the body 801 of the flow substrate 800, such as by electron beam welding, with less time and energy than when the grooves 823 are not present. The welding will be performed by following the contour of each fluid passage defined by the grooves, thereby forming a fluid seal. Electron beam welding can be performed in a vacuum environment to minimize any contamination. In the case where the material used for the flow substrate body 801 and the cover 895 is a high purity metal (e.g., stainless steel), the vacuum welding environment will further eliminate contamination (e.g., carbon, sulfur, manganese, etc.) at the welding point. Although electron beam welding is generally preferred, it will be appreciated that other types of welding, such as laser welding, may also be used.

[0056] The presence of the groove 823 also acts as a guide during welding because the groove defines the periphery of the fluid passageway. The locating pin holes 850a, 850b in the body 801 of the flow base and the corresponding locating pin holes 850a', 850b' in the cover 895 receive locating pins that align and maintain the cover 895 flush with the body of the flow base 800 during welding. The locating pins can be removed and reused after welding is completed, or they can be kept in place to help align the flow base with the mounting surface.

[0057] In various examples, the flow substrate may also include other configurations, such as those shown and discussed in U.S. Pat. No. 8,496,029 B2. It should be understood that, although only four fluid passages are shown in the drawings, the simplicity and low cost of manufacturing embodiments of the present application readily allow any number of fluid passages and component ports to be defined in the flow substrate. In this regard, all fluid passages and component connection ports for the entire fluid delivery rod may be formed in a single flow substrate. Alternatively, the fluid delivery rod may be formed by using two or more flow substrates, such as the flow substrate 800 described above.

[0058] Fig. 9A A top view of an example flow substrate 900 coupled to a substrate mounting structure 902 is depicted. In the examples shown herein, a mounting structure such as mounting structure 902 can be removably coupled to the flow substrate 900. Fig.9B1 A perspective view of the mounting structure 902 is shown as an example. Fig. 9C depicts a cross-sectional view of the mounting structure 902, Fig.9D A bottom view of the mounting structure 902 is shown as an example.

[0059] like Fig.9B1 As shown in the example of FIG. 9D, the mounting structure 902 may include a first hole 904A and a second hole 904B. The first hole 904A and the second hole 904B may be configured to fasten the mounting structure 902 between the flow substrate 900 and a support surface. A first fastener may be positioned through the first hole 904A to secure the mounting structure 902 to the flow substrate 900, and a second fastener may be positioned through the second hole 904B to secure the mounting structure 902 to a support surface, a backing plate, a mounting structure of a fluid delivery rod, a manifold, or a combination thereof, such as further described in U.S. Patent No. 8,307,854 B1. In one example, the fasteners may engage with respective mounting holes 930 (e.g., holes 830 further described herein) of the flow substrate 900 to attach the mounting structure 902 to the flow substrate 900. The fasteners may include, but are not limited to, bolts, screws, quick-release connectors (e.g., bayonet or other 1 / 4 turn fasteners), rivets, snap fits, latches, and the like. Thus, the mounting structure 902 can support the flow substrate 900 along a support surface.

[0060] like Fig. 9C As illustrated in the example of , the first hole 904A, the second hole 904B, or both may include a countersunk hole or a counterbore, such as Fig. 9C The first counterbore 906A may be located on the first end 908 of the mounting structure 900, and the second counterbore 906B may be located on the second end 910 of the mounting structure 900. The second end 910 may interface with the flow substrate 900 (e.g., the body or cover of the flow substrate 900). In other words, Fig. 9A -D, the first hole 904A can be oriented opposite to the second hole 904B. The inner end of the counterbore can provide a bearing surface. For example, a first fastener can clamp the mounting structure 902 to the flow substrate 900 between the second end 910 and the first bearing surface 912A. The second fastener can clamp the mounting structure 902 to a support surface or another mounting surface between the first end 908 and the second bearing surface 912B.

[0061] In one example, one or more mounting structures, such as mounting structure 902, can support the flow substrate 900 at a distance from the support surface. For example, the height H of the mounting structure 902 can position the flow substrate at a distance above the support surface. The distance can be configured to provide airflow for heat transfer or to arrange fluid lines or manifolds between the flow substrate 900 and the support surface.

[0062] In various examples, when the mounting structure 902 is coupled (eg, fastened) to the flow substrate 900, the flow substrate 900 may cover a portion of the second hole 904B or the second counterbore 906B, such as Fig. 9A For example, when the mounting structure 902 is attached to the flow base 900, the flow base 900 can capture the fastener within the mounting structure 902. Fig.9B1 In the example of FIG. 9A , the fastener may be captured between the second end 910 of the mounting structure 902 and the bearing surface 912B of the counterbore 906B.

[0063] In one example, the longitudinal axis of the second aperture 904B (and accordingly the second fastener) can be offset from the side 901 of the flow substrate 900 by a distance to facilitate access by a tool that engages the head of the fastener. The head of the fastener can include a screw drive, such as a hexagonal, internal six-lobed or other type of screw drive. In one example, the longitudinal axis of the hole can be offset from the side 901 by at least the radius of the corresponding screw drive of the fastener. The radius of the fastener head can be greater than the offset distance so that the fastener can be captured by the flow substrate 900 within the mounting structure 902 (for example, within the counterbore 906B of the hole 904B). The fluid delivery rod 903 can be pre-assembled by coupling one or more mounting structures 902 to the flow substrate 900. Therefore, when the flow substrate 900 is coupled to the mounting structure 902, the fastener used to fasten the mounting structure 902 (and correspondingly the flow substrate 900) to the support surface can be retained by a portion of the flow substrate 900 inside the mounting structure 902 (see Fig. 9A ), at that portion of the flow base 900, the head of the fastener is still accessible to tools. Having a pre-assembled configuration of the fastener held in the mounting structure by the flow base is advantageous, for example, during shipping or installation. Holding the fastener in the mounting structure prevents the fastener from being misplaced, or prevents a customer from replacing or altering the fastener. In another example, the fastener may be recessed or partially recessed in the mounting structure, for example, recessed relative to an upper surface of the flow base.

[0064] In another example, the mounting structure 902 can be aligned with the flow substrate 900. For example, the fixture 907 can be used to align the mounting structure 902 with the flow substrate 900. Fig. 9A -D example, the longitudinal axis A1 of the mounting structure 902 can be arranged at a right angle to the longitudinal axis A2 of the flow substrate 900 (eg, along the main flow direction). Figure 9B2As shown, the fixture 907 can align the mounting structure 902 with the flow substrate 900 at a 90° angle. In other examples, the longitudinal axis A1 or other axis of the mounting structure 902 can be set to have other orientations relative to the longitudinal axis A2 of the flow substrate 900, such as 30 degrees, 45 degrees, 60 degrees, or other angles therebetween. A fastener (e.g., a first fastener positioned through the first hole 904A) can fix the position and orientation of the mounting structure 902 relative to the flow substrate 900. In some examples, the fixture can ensure that the mounting structure 902 (from the manufacturer) is properly aligned to reduce improper installation or customer modifications. Other examples of aligning the mounting structure 902 with the flow substrate 900 are shown in FIG. Fig. 10A -E, 11A-D, 12A-E, 13A-E, and 14A-D are depicted in more examples.

[0065] Fluid delivery rod 903 (such as Fig. 9A -D, 10A-E, 11A-D, 12A-E, 13A-E, and 14A-D) may include a flow substrate 900 and one or more mounting structures (e.g., mounting structure 902 or other structures described herein and described herein) coupled to the flow substrate 900. Fig. 10A 902). Various fasteners may be captured within the mounting structure 902 for attaching the fluid delivery rod 903 to a support surface. Thus, all hardware for attaching the mounting structure 902 to a support surface may be included in the fluid delivery rod 903. The mounting structure 902 may be positioned and aligned relative to the flow substrate 900 for mounting on a support surface.

[0066] Fig. 10A -E depicts another example mounting structure 1002. The mounting structure 1002 may include a first hole 1004A, a second hole 1004B, a first counterbore 1006A, and a second counterbore 1006B. Fig. 9A As arranged and described in the example of -D and further described herein. Fig. 10B As shown in the example of FIG. 1 , the fastener 1014A can be inserted into the interior of the first hole 1004A. One or more fasteners, such as the fastener 1014A, can couple the mounting structure 1002 to the flow substrate 1000. For example, the flow substrate 1000 can include one or more mounting holes 1030, as described above. The fastener 1014A can use the mounting hole 1030 to secure the mounting structure 1002 to the flow substrate 1000.

[0067] The mounting structure 1002, the flow substrate 1000, or both may include one or more alignment features to align the mounting structure 1002 with the flow substrate 1000. Fig. 10B-E example, the alignment features can be alignment pins 1016A-D. The flow substrate 1000 can include a cover (e.g., Figure 8B ,DE,HJ and described herein, in the cover 195), in the body of the flow substrate 1000, or in both. The one or more alignment holes 1032 can be positioned on the flow substrate 1000 so that when corresponding alignment pins 1016A-D of the mounting structure 1002 engage with the mounting holes 1032, the mounting structure 1002 is aligned relative to the flow substrate 1000. Fig. 10B The example depicts a single alignment pin 1016A located on a first side of a first hole 1004A, Fig. 10D The example shows an alignment pin 1016D located on a second side of the hole 1004A, Fig. 10C The example depicts an alignment pin 1016B located on a first side of the first hole 1004A and a second alignment pin 1016C located on a second side (opposite side) of the first hole 1004A. Alignment features of the mounting structure 1002 or the flow substrate 1000 can alleviate or eliminate the need for an alignment fixture to position or orient the mounting structure 1002 relative to the flow substrate 1000. In other examples, one or more alignment holes can be located on the mounting structure 1002, one or more corresponding alignment pins can be located on the flow substrate 1000, or various combinations of alignment pins and holes. Other alignment features are also contemplated. Some other examples of alignment features are described in Fig. 11B -C, 12B-E, and 13B-E are shown in the examples and are further described in this article.

[0068] Fig. 10E An example of a mounting structure 1002 is shown, which includes a fastener 1014A and a fastener 1014B inserted into the corresponding first hole 1004A and the second hole 1004B, respectively. When the mounting structure 1002 is coupled to the flow substrate 1000, the flow substrate 1000 can cover or partially cover the hole 1004B, such as the counterbore 1006B of the hole 1004B, to capture the fastener 1014B in the hole 1004B. Accordingly, as previously described, the fastener 1014B can be retained in the fluid delivery rod 1003 (see Fig. 10A ), such as during shipping or installation. In another example, the fastener 1014B can be recessed or partially recessed within the mounting structure 1002, such as recessed relative to the upper surface of the flow substrate 1000.

[0069] Fig.11A -D shows another example of a mounting structure 1102. The mounting structure 1102 may include a first hole 1104A, a second hole 1104B, a first counterbore 1106A, and a second counterbore 1106B. Fig. 9A -D and Fig. 10A -E example arrangement and depiction. Fastener 1114A can be inserted into the interior of first hole 1104A, such as Fig. 11B Perspective drawing and Fig. 11C One or more fasteners, such as fastener 1114A, can couple mounting structure 1102 to flow substrate 1100. For example, flow substrate 1100 can include one or more mounting holes 1130, as described above. Fastener 1114A can utilize mounting hole 1130 to secure mounting structure 1102 to flow substrate 1100. Fig.11D A bottom view of mounting structure 1102 is shown.

[0070] like Fig. 11B As shown in the example of FIG-C, the mounting structure 1102 may include an alignment feature, such as a step 1116 along one end (e.g., the second end 1110) of the mounting structure 1102, the step 1116 engaging the flow substrate 1100 proximate to the flow substrate edge portion 1105 of the flow substrate 1100. For example, the step 1116 may include a raised portion of the second end 1110 of the mounting structure 1102. For example, along the side 1101 adjacent to the flow substrate edge portion 1105 of the flow substrate 1100, the raised edge 1118 of the step 1116 may engage the flow substrate 1100 proximate to the flow substrate edge portion 1105. The step 1116 may be configured to align the mounting structure 1102 with the flow substrate 1100. For example, the step 1116 can be at 90 degrees, 60 degrees, 45 degrees, 30 degrees, or another angle between 10 degrees and 90 degrees relative to the longitudinal axis of the mounting structure 1102 (e.g., an axis along the second end 1110 and extending through the center axis of the first hole 904A and the second hole 904B). In another example, the step 1116 can be located on the flow substrate 1100 to align the mounting structure 1102 with the flow substrate 1100. The alignment feature (step 1116) of the mounting structure 1102 or the flow substrate 1100 can alleviate or eliminate the need for an alignment fixture to position or orient the mounting structure 1102 relative to the flow substrate 1100.

[0071] The raised edge 1118 of the step 1116 may be positioned along at least a portion of the second hole 1104B or at least a portion of the second counterbore 1106B of the hole 1104B, such as Fig. 11B -C. Fig. 11CAn example of a cross-section of a mounting structure 1102 is shown, the mounting structure 1102 including a fastener 1114A inserted into a first hole 1104A and a second fastener 1114B inserted into a second hole 1104B. When the mounting structure 1102 is coupled to the flow substrate 1100, the flow substrate 1100 can cover or partially cover the second hole 1104B (e.g., a counterbore 1106B of the second hole 1104B) to capture the fastener 1114B within the second hole 1104B. Accordingly, as previously described, the fastener 1114B can be captured within the flow substrate system 1100, such as during shipping or installation. In another example, the fastener 1114B can be recessed or partially recessed within the mounting structure 1102, such as recessed relative to the upper surface of the flow substrate 1100.

[0072] Fig. 12A -E shows another example of a mounting structure 1202. The mounting structure 1202 may include a first hole 1204A, a second hole 1204B, a first counterbore 1206A, and a second counterbore 1206B, as shown in Fig. 9A -D, 10A-E and 11A-D. A fastener, such as fastener 1214A, can be inserted into the interior of first hole 1204A, such as Fig. 12B Perspective drawing and Fig.12D One or more fasteners, such as fastener 1214A, can couple mounting structure 1202 to flow substrate 1200. For example, as described above, flow substrate 1200 can include one or more mounting holes 1230. Fastener 1214A can use mounting hole 1230 to secure mounting structure 1202 to flow substrate 1200. Fig. 12C A bottom view of the mounting structure 1202 is shown, Fig.12E Another cross-sectional view of mounting structure 1202 is shown without fastener 1214A or fastener 1214B.

[0073] like Fig. 12B As shown in the example of FIG. 1-E, the mounting structure 1202 may include an alignment feature, such as a slot 1216 along one end (e.g., the second end 1210) of the mounting structure 1202. For example, the slot 1216 may extend through a thickness of the second end 1210 of the mounting structure 1202, such as Fig. 12B. In one example, the fixture 1205 can be used to orient the mounting structure 1202 relative to the flow substrate 1200. For example, the fixture 1205 can include a plate positioned along the side of the flow substrate 1200. The fixture 1205 can include an edge extending below the lower surface of the flow substrate 1200. The fixture 1205 can be inserted or engaged in the slot 1216. When the fixture 1205 is located in the slot 1216, the slot 1216 can be aligned with the side 1201 of the flow substrate 1200, and thus, the mounting structure 1202 can be aligned relative to the flow substrate 1200. After the mounting structure 1202 is aligned and attached, the fixture can be removed from the fluid delivery rod 1203. In another example, the flow substrate 1200 can include a flange or other engagement feature to engage with the slot 1216 to align the mounting structure 1202 relative to the flow substrate 1200. In some examples, the fixture 1205 can ensure proper alignment from the manufacturer, reducing incorrect installation or customer modifications. The slot 1216 can be configured to align the mounting structure 1202 relative to the flow substrate 1200. For example, the slot 1216 can be configured to be at an angle relative to the longitudinal axis of the mounting structure 1202 (e.g., an axis along the second end 1210 and extending through the center axis of the first hole 1204A and the second hole 1204B), such as 90 degrees, 60 degrees, 45 degrees, 30 degrees, or another angle between 10 degrees and 90 degrees.

[0074] The slot 1216 may be positioned along at least a portion of the second hole 1204B or at least a portion of the second counterbore 1206B of the second hole 1204B, such as Fig. 12B - as depicted in E. Fig.12D , E shows an example of a cross-section of the mounting structure 1202 . Fig.12D A fastener 1214A inserted into a first hole 1204A and a second fastener 1214B inserted into a second hole 1204B are depicted. When the mounting structure 1202 is coupled to the flow substrate 1200, the flow substrate 1200 can cover or partially cover the second hole 1204B, such as a counterbore 1206B of the second hole 1204B, to capture the fastener 1214B within the second hole 1204B. Accordingly, as previously described, the fastener 1214B can be captured within the fluid delivery rod 1203, such as during shipping or installation. In another example, the fastener 1214B can be recessed or partially recessed within the mounting structure 1202, such as recessed relative to the upper surface of the flow substrate 1200.

[0075] Fig.13A-E shows an example of a mounting structure 1302 that includes an alignment frame (i.e., alignment clip) 1316 for orienting and supporting the mounting structure 1302 relative to the flow substrate 1300. In other words, the alignment feature may include an alignment frame 1316 coupled between the flow substrate 1300 and the mounting structure 1302. The mounting structure 1302 may include a first hole 1304A, a second hole 1304B, a first counterbore 1306A, and a second counterbore 1306B, as shown in FIG. Fig. 9A -D, 10A-E, 11A-D, and 12A-E. A fastener, such as fastener 1314A, can be inserted into the interior of first hole 1304A, such as Fig. 13B Perspective drawing and Fig.13E One or more fasteners, such as fastener 1314A, can couple the mounting structure 1302 to the flow substrate 1300. For example, as previously described, the flow substrate 1300 can include one or more mounting holes 1330. The fastener 1314A can use the mounting holes 1330 to secure the mounting structure 1302 to the flow substrate 1300. Fig. 13C A top view of mounting structure 1302 is shown.

[0076] The alignment frame 1316 can be placed on the mounting structure 1302, such as on the second end 1310 of the mounting structure 1302. A hole 1322 can be located in the alignment frame 1316. When the first fastener 1314A is located within the first hole 1304A, the first fastener 1314A can be positioned through the hole 1322 to engage with the mounting hole 1330, thereby coupling the mounting structure 1302 to the flow substrate 1300. In one example, the hole 1322 can allow the fastener 1314A to be flush with the alignment frame 1316 on the mounting structure 1302. Fig. 13B -E, the alignment frame 1316 may include a first flange 1318A and a second flange 1318B. In some examples, the alignment frame 1316 may be constructed of a material including, but not limited to, a metal or a polymer.

[0077] The first flange 1318A and the second flange 1318B can extend from the base 1317 of the alignment frame 1316. The base 1317 can be positioned along the mounting structure 1302, such as along the second end 1310. In one example, the first flange 1318A and the second flange 1318B can be disposed at an angle of 30 to 90 degrees to the base 1317. Fig. 13BIn the example of FIG. 1-E, the first flange 1318A can extend at a 90 degree angle toward the mounting structure 1302, while the flange 1318B can extend at a 90 degree angle away from the mounting structure 1302. For example, the first flange 1318A can engage the mounting structure 1302 to align and orient the alignment frame 1316 with the mounting structure 1302. The second flange 1318B can orient the mounting structure 1302 with the flow substrate 1300 when the mounting structure 1302 is secured to the flow substrate 1300.

[0078] The first flange 1318A or the second flange 1318B, or both, can be configured to align the mounting structure 1302 relative to the flow substrate 1300. For example, the first flange 1318A or the second flange 1318B can be configured to be at an angle relative to the longitudinal axis of the mounting structure 1302 (e.g., an axis along the second end 1310 and extending through the center axis of the first hole 1304A and the second hole 1304B), such as 90 degrees, 60 degrees, 45 degrees, 30 degrees, or another angle between 10 degrees and 90 degrees. The alignment frame 1316 can reduce or eliminate the need for an alignment fixture to position or orient the mounting structure 1302 relative to the flow substrate 1300. In some examples, the alignment frame 1316 can ensure proper alignment from the manufacturer and reduce improper installation or customer modifications.

[0079] Fig.13E An example of a cross-section of a mounting structure 1302 is shown, where the mounting structure 1302 includes a first fastener 1314A inserted into a first hole 1304A and a second fastener 1314B inserted into a second hole 1304B. The alignment frame 1316 is positioned so that it covers at least a portion of the second hole 1304B or at least a portion of the second counterbore 1306B of the hole 1304B, as shown in FIG. Fig. 13B , C and E. Accordingly, the second fastener 1314B can be captured in the second hole 1304B. As a result, as previously described, the fastener 1314B can be retained within the fluid delivery rod 1303, such as during transportation or installation. In another example, the fastener 1304B can be recessed or partially recessed within the mounting structure 1302, such as recessed relative to the upper surface of the flow substrate 1300.

[0080] Fig.14A -D depicts another example mounting structure 1402. The mounting structure 1402 may include a first hole 1404A, a second hole 1404B, a first counterbore 1406A, and a second counterbore 1406B. Fig. 9A -D, 10A-E, 11A-D, 12A-E, and 13A-E are arranged and described in the examples. Fig.14AIn the example of -D, the mounting structure 1402 may include a third hole 1404C. In one example, the third hole 1404C may include a third counterbore 1406C. Fig.14D As shown in the example of FIG. 1 , a fastener 1414A can be inserted into the interior of the first hole 1404A, and another fastener 1414C can be inserted into the interior of the third hole 1404C. One or more fasteners, such as fasteners 1414A and 1414C, can couple the mounting structure 1402 to the flow substrate 1400. For example, the flow substrate 1400 can include one or more mounting holes (as described above), such as mounting holes 1430A, B. Fasteners 1414A and 1414C can use corresponding mounting holes 1430A, B to secure the mounting structure 1402 to the flow substrate 1400.

[0081] like Fig.14A -D, the flow substrate 1400 may include a channel 1416. The channel 1416 may be located between the first hole 1404A and the third hole 1404C. The channel 1416 may provide an opening for a fluid delivery line 1418 in the mounting structure 1402. Thus, one or more fluid delivery lines 1418 may be provided along the underside of the flow substrate 1400 (e.g., along the Figure 8B ,DE,HJ and described herein). In some examples, the mounting structure 1402 can be located between two ports 1420A and 1420B (e.g., catheter ports) of the flow substrate 1400. The channel 1416 can allow the fluid delivery line 1418 to be routed along the flow substrate 1400 at the location where one or more mounting structures 1402 are located. In one example, when the mounting structure 1402 is attached to the flow substrate 1400, the mounting structure 1402 can protect the fluid delivery line 1418.

[0082] The first hole 1414A and the third hole 1414C may be positioned in the mounting structure 1402 to align the mounting structure 1402 relative to the flow substrate 1400. Fig.14A -D, the longitudinal axis of the mounting structure 1402 can be configured at a perpendicular angle to the longitudinal axis of the flow substrate 1400 (e.g., along the primary direction of flow). In other examples, the longitudinal axis or other axes of the mounting structure 1402 can be configured at other orientations relative to the longitudinal axis of the flow substrate 1400, such as at 30 degrees, 45 degrees, 60 degrees, or other angles therebetween. Fasteners 1414A and 1414C can fix the position and orientation of the mounting structure 1402 relative to the flow substrate 1400. In other examples, the mounting structure 1402, the flow substrate 1400, or both can include any alignment features described herein, such as Fig. 9A-D, 10A-E, 11A-D, 12A-E, and 13A-E, and as further described herein.

[0083] When the mounting structure 1402 is coupled to the flow substrate 1400, the flow substrate 1400 can cover or partially cover the second hole 1404B, such as the counterbore 1406B of the hole 1404B, to capture the fastener 1414B in the hole 1404B. Accordingly, as previously described, the fastener 1414B can be retained in the fluid delivery rod 1403, such as during transportation or installation. In another example, the fastener 1414B can be recessed or partially recessed in the mounting structure 1402, such as recessed relative to the upper surface of the flow substrate 1400.

[0084] In FIGS. 3-5 and 7 , the mounting structure may couple the flow substrate to a manifold (e.g., another flow substrate). In some cases, the mounting structure may provide sufficient clamping force or compression force to effectively seal one or more fluid passages of the flow substrate to one or more corresponding fluid passages of the manifold. Accordingly, in some examples, the mounting structure may be constructed of a material having sufficient strength (high-strength material) to provide a clamping force or compression force for sealing the fluid passage between the flow substrate and the manifold. Metal materials (including aluminum alloys, stainless steel, and nickel alloys) having strength exceeding that of aluminum are generally required. For example, the metal material should have sufficient strength to withstand a clamping force or compression force of at least 150 PSI or more in semiconductor applications. In other applications (e.g., medical applications, etc.), the metal material (e.g., aluminum) should have sufficient strength to withstand a clamping force or compression force of at least 50 PSI. In another example, the dimensions of the mounting structure of the examples of FIGS. 3-5 and 7 may be constructed with sufficient precision to provide a clamping force for sealing the fluid passage between the flow substrate and the manifold.

[0085] The mounting structures of FIGS. 9-14 can be used to secure a flow substrate to a support surface or another flow substrate. Thus, in applications where lower clamping or compressive forces are acceptable, the flow substrate can be manufactured with lower precision and lower strength materials because no clamping or compressive forces are needed to provide a seal for fluid communication between the flow substrates. The mounting structures in the examples of FIGS. 9-14 can be constructed of a variety of materials, which can be selected based on properties such as cost, manufacturability, material strength, chemical compatibility, corrosion resistance, etc. In some examples, such materials can be less expensive when lower strength is required. For example, these mounting structures can be made of aluminum, aluminum alloys, polymers, or any material that has sufficient strength to support the flow substrate and related components when coupled to the mounting structure or another flow substrate.

[0086] Although several embodiments have been described in detail above to some extent, those skilled in the art may make various changes to the disclosed embodiments without departing from the spirit of the present application. It is intended that all contents contained in the above description or shown in the accompanying drawings be interpreted as merely exemplary and not restrictive. Changes in details or structure may be made without departing from the present teachings. The foregoing description and the appended claims are intended to cover all such modifications and variations.

[0087] Various embodiments of various devices, systems and methods are described herein. Many specific details are set forth to provide a thorough understanding of the overall structure, function, manufacture and use of the embodiments described in the specification and shown in the drawings. However, those skilled in the art will appreciate that the embodiments can be practiced without such specific details. In other cases, well-known operations, parts and elements are not described in detail so as not to make the embodiments described in the specification unclear. Those of ordinary skill in the art will appreciate that the embodiments described and illustrated herein are non-limiting examples, and it will be appreciated that the specific structural and functional details disclosed herein may be representative and do not necessarily limit the scope of the embodiments, which are defined solely by the appended claims.

[0088] References throughout the specification to "various embodiments," "some embodiments," "one embodiment," "an embodiment," etc., mean that a specific feature, structure, or characteristic described in conjunction with that embodiment is included in at least one embodiment. Thus, phrases "in various embodiments," "in some embodiments," "in one embodiment," "in an embodiment," etc., appearing in various places throughout the specification, do not necessarily all refer to the same embodiment. Furthermore, specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Thus, specific features, structures, or characteristics illustrated or described in conjunction with one embodiment may be combined, in whole or in part, with features, structures, or characteristics of one or more other embodiments without restriction.

[0089] Any patent, publication, or other disclosure material (in whole or in part) that is referred to as being incorporated by reference herein is only incorporated herein to the extent that the incorporated material does not conflict with existing definitions, statements, or other disclosure materials set forth in this application. Therefore, and also necessarily, the disclosure explicitly set forth in this application supersedes any conflicting material incorporated by reference herein. Any material or portion thereof that is referred to as being incorporated by reference herein but conflicts with existing definitions, statements, or other disclosure materials set forth herein is only incorporated to the extent that it does not cause a conflict between the incorporated material and the existing disclosure materials.

Claims

1. A flow substrate mounting structure, comprising: a first hole defined in a first surface of the flow substrate mounting structure; as well as A second hole is defined in a second surface of the flow substrate mounting structure, wherein the first surface is disposed on a side of the flow substrate mounting structure opposite to the second surface.

2. The flow substrate mounting structure according to claim 1, wherein: The first hole defines a first counterbore having a first counterbore axis, and the second hole defines a second counterbore having a second counterbore axis.

3. The flow substrate mounting structure according to claim 2, wherein: The first counterbore axis is axially offset from the second counterbore axis.

4. The flow substrate mounting structure according to claim 2, wherein: The first counterbore is oriented opposite to the second counterbore.

5. The flow substrate mounting structure according to claim 2, wherein: A first fastener is disposed in the first counterbore to secure the flow substrate mounting structure to a flow substrate, and wherein the flow substrate abuts the second surface of the flow substrate mounting structure.

6. The flow substrate mounting structure according to claim 5, wherein: A second fastener is disposed in the second counterbore to secure the flow substrate mounting structure to another structure selected from the group consisting of a backing plate, a mounting structure for a fluid delivery rod, and a manifold, and wherein the flow substrate is spaced apart from the other structure when the flow substrate mounting structure, the flow substrate, and the other structure are connected.

7. The flow substrate mounting structure according to claim 5, wherein: A second fastener is disposed in the second counterbore to secure the flow substrate mounting structure to a support surface.

8. The flow substrate mounting structure according to claim 7, wherein: The first fastener and the second fastener include bolts, screws, quick-release connectors, rivets, snaps, or latches.

9. The flow substrate mounting structure according to claim 5, further comprising: Alignment pins are disposed on the second surface of the flow substrate mounting structure.

10. The flow substrate mounting structure according to claim 9, further comprising: Corresponding alignment holes are defined in the support surface.

11. A flow substrate mounting structure, comprising: a first counterbore having a first counterbore axis defined in a first surface of the flow substrate mounting structure; as well as A second counterbore having a second counterbore axis is defined in a second surface of the flow substrate mounting structure, wherein: The first surface is disposed on a side of the flow substrate mounting structure opposite to the second surface, The first counterbore is oriented opposite to the second counterbore, and The first counterbore is axially offset from the second counterbore.

12. The flow substrate mounting structure according to claim 11, further comprising: A first alignment pin is disposed on the first surface of the flow substrate mounting structure.

13. The flow substrate mounting structure according to claim 12, further comprising: A second alignment pin is disposed on the second surface of the flow substrate mounting structure.

14. The flow substrate mounting structure according to claim 13, further comprising: a flow base connected to the second surface of the flow base mounting structure via a first fastener disposed in the first counterbore; as well as An alignment hole is defined in the flow substrate corresponding to the second alignment pin.

15. The flow substrate mounting structure according to claim 14, further comprising: a support surface connected to the first surface of the flow substrate mounting structure via a second fastener disposed in the second counterbore; as well as An alignment hole is defined in the support surface corresponding to the first alignment pin.

16. A flow substrate mounting structure, comprising: a first counterbore defined in a first surface of the flow substrate mounting structure; a second counterbore defined in a second surface of the flow substrate mounting structure, wherein the first surface is disposed on a side of the flow substrate mounting structure opposite the second surface; a flow base connected to the second surface of the flow base mounting structure via a first fastener disposed in the first counterbore; and A support surface is connected to the first surface of the flow substrate mounting structure via a second fastener disposed in the second counterbore.

17. The flow substrate mounting structure according to claim 16, further comprising: An alignment feature is defined on the second surface of the flow substrate mounting structure, wherein the alignment feature corresponds to a feature on the flow substrate.

18. The flow substrate mounting structure according to claim 16, wherein: The alignment features include pins, raised edges, or slots.

19. The flow substrate mounting structure of claim 16, further comprising: An alignment frame is disposed between the second surface of the flow substrate mounting structure and the flow substrate.

20. The flow substrate mounting structure according to claim 19, wherein: The alignment frame includes first and second flanges disposed at opposite ends of the alignment frame, wherein the first and second flanges extend in opposite directions from each other.

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