Mini LED and Micro LED binding offset inspection device and process

Abstract

The invention provides a Mini LED and Micro LED binding offset checking device and process, the Mini LED and Micro LED binding offset checking device comprises an upper checking light source and a lower checking light source, the upper checking light source and the lower checking light source both comprise a coaxial light source and an annular light source, the annular light source is arranged on the lower side of the coaxial light source, the coaxial light source comprises a first shell, a first light source and a semi-transparent and semi-reflecting mirror, and the first shell is arranged in the first shell; the first light source is arranged on the left side in the first shell, the semi-transparent and semi-reflecting mirror is arranged on the right side in the first shell, and an inclined included angle is formed between the semi-transparent and semi-reflecting mirror and the horizontal line; the annular light source comprises a second shell and a second light source, the second light source is arranged in the shell and composed of a plurality of annular lamps arranged in parallel, a penetrating hole is formed in the middle of the top of the second shell, and the coaxial light source and the annular light source are infrared light sources. According to the invention, lighting imaging is carried out in a mode of combining infrared coaxial light and low-angle infrared annular light, and the binding precision of a lightproof MINI / MICRO LED is checked.

Description

Technical Field

[0001] The present invention relates to the technical field of binding detection equipment in display panel manufacturing, and specifically to a Mini LED and Micro LED binding offset inspection device and process. Background Art

[0002] In the manufacturing process of display panels, bonding is a key link. The external connection of the display panel's drive or control signal needs to rely on the pressing of the display panel and the flexible wiring substrate, or the pressing of the display panel and the driver chip to achieve the connection. However, due to factors such as mechanical errors and material deformation, the bonding process may be offset, affecting the display effect and performance of the final product.

[0003] The post-binding precision inspection equipment on the market mainly relies on cameras to capture the Mark on the Panel and the Mark on the COF (Chip On Film), and calculate the spacing between the two Marks and the spacing between the ITO Bumps. For light-transmitting materials such as OLED Panel and COF, it is easy to take images with a post-illumination camera. However, when inspecting MINI LED and MICRO LED, the visual recognition becomes complicated and confusing due to the chip-mounted circuit on the back. Traditional inspection equipment cannot identify the Panel and COF position Marks, making it impossible to perform accurate offset inspection. Summary of the invention

[0004] In order to solve the above defects, the present invention provides a Mini LED and Micro LED binding offset inspection device and process, which can automatically, efficiently and accurately complete the detection of Mini LED and Micro LED binding offset, thereby improving the production quality and efficiency of Mini LED and Micro LED.

[0005] In a first aspect, the present invention provides a Mini LED and Micro LED binding offset inspection device, which includes:

[0006] A CCD camera, which is set on one side of the product to be inspected and is used for product loading position compensation;

[0007] A CCD light source, arranged on one side of the product to be inspected, to provide light for the CCD camera to shoot;

[0008] An upper inspection camera is arranged on the upper side of the product to be inspected, and is used to photograph the upper side of the product to be inspected and obtain a clear image;

[0009] An upper inspection light source is arranged on the upper side of the product to be inspected to provide light for the upper inspection camera to shoot; the upper inspection light source includes a coaxial light source and an annular light source, the upper side of the coaxial light source is arranged as the upper inspection camera, the lower side of the coaxial light source is arranged as the annular light source, the coaxial light source includes a first shell, a first light source and a semi-transparent and semi-reflective mirror, the first light source is arranged on the left side inside the first shell, the semi-transparent and semi-reflective mirror is arranged on the right side inside the first shell, and the semi-transparent and semi-reflective mirror forms an inclined angle with the horizontal line; the annular light source includes a second shell and a second light source, the second light source is arranged inside the shell, the second light source is composed of a plurality of annular lights, and a through hole is arranged in the middle of the top of the second shell;

[0010] A lower inspection camera is arranged on the lower side of the product to be inspected, and is used to photograph the lower side of the product to be inspected and obtain a clear image;

[0011] The lower inspection light source is arranged at the lower side of the product to be inspected, and provides light source for the lower inspection camera to shoot.

[0012] In one embodiment of the present invention, the lower inspection light source includes a coaxial light source and an annular light source. The lower side of the coaxial light source is set as a lower inspection camera, and the upper side is configured with an annular light source. The coaxial light source includes a first shell, a first light source and a semi-transparent and semi-reflective mirror. The first light source is set on the left side inside the first shell, and the semi-transparent and semi-reflective mirror is tilted on the right side inside the first shell; the annular light source includes a second shell and a second light source. The second light source is set inside the second shell. The second light source is composed of multiple annular lights, and a through hole is set in the middle of the bottom of the second shell.

[0013] In one embodiment of the present invention, the interior of the second shell is in a truncated cone shape, and a plurality of annular lights are distributed at intervals from top to bottom.

[0014] In one embodiment of the present invention, both the upper inspection light source and the lower inspection light source are infrared light sources.

[0015] In one embodiment of the present invention, the upper inspection camera and the lower inspection camera are respectively arranged on the Z-axis linear module through a bracket, the Z-axis linear module is installed on the module mounting frame, the bottom of the module mounting frame is connected to the X-axis linear module through a slider, and one end of the X-axis linear module is connected to the X-axis servo motor.

[0016] In one embodiment of the present invention, the product to be inspected is mounted on a platform, the platform is disposed on a Y-axis linear module, and one end of the Y-axis linear module is connected to a Y-axis servo motor.

[0017] In a second aspect, the present invention provides a Mini LED and Micro LED binding offset inspection process, which includes the following steps:

[0018] S1. Bind the fields of view of the upper inspection camera and the lower inspection camera;

[0019] S2. The robot picks up the product, moves to the top of the loading camera, and takes pictures of the left and right mark points. The PLC controller or main control PC receives the signal through the motion control card and controls the picture taking. The visual feedback of the picture taking result is OK / NG.

[0020] After S3, the PLC controller or the main control PC receives the photo result through the motion control card, it triggers the vision to perform alignment calculation and position and angle compensation;

[0021] S4, the PLC controller or the main control PC drives the manipulator to place the product on the platform according to the alignment calculation result, and the platform moves along the Y direction to just below the upper inspection camera of the device as described above;

[0022] S5, PLC controller or main control PC sends a single side detection command;

[0023] S6, the detection system drives the Z axis to move to the COF shooting height, and drives the X axis to move from right to left to complete the offset inspection of the COF and the panel;

[0024] S7, the platform moves the Y axis to the FPC photo position, the PLC controller or the main control PC triggers the left Mark photo again, and then the detection system drives the X axis to move to complete the right Mark photo, and finally completes the offset calculation of the binding area between the FPC and the panel.

[0025] In one embodiment of the present invention, step S1 includes the following process:

[0026] S11. Place a transparent calibration plate at the product location;

[0027] S12, the upper inspection camera and the lower inspection camera take photos simultaneously, photographing the transparent calibration plate;

[0028] S13, through the transparent calibration plate, the two inspection cameras calibrate the internal reference matrix respectively;

[0029] S14. Using a transparent calibration plate, the images taken by the two inspection cameras are flipped and overlapped after being calibrated with the internal reference matrix, and their projection relationship matrix is ​​calculated.

[0030] In one embodiment of the present invention, after step S7, step S8 is also included, and step S8 includes the following process: when there are other bonding sides, the platform moves to the corresponding position, the robot picks up the product to the top of the CCD camera, and takes pictures of the left Mark and the right Mark respectively, the PLC controller or the main control PC sends the left and right Mark shooting instructions in turn, and the detection system completes the shooting and performs the alignment calculation; the platform moves the Y axis to the FPC shooting position, the PLC controller or the main control PC receives the side completion signal, and triggers the left Mark shooting again, and then the detection system drives the X axis to move to complete the right Mark shooting, and finally completes the offset calculation of the binding area between the FPC and the panel.

[0031] In one implementation of the present invention, in step S6, a distance measuring device is added, and the adjustment of the Z axis is triggered by the distance measurement of the distance measuring device.

[0032] In summary, the present invention provides a Mini LED and Micro LED binding offset inspection device and process, and the beneficial effects of the present invention are:

[0033] The present invention uses a combination of infrared coaxial light and low-angle infrared ring light for lighting and imaging, successfully solving the problem of checking the binding accuracy of opaque Mini LEDs and Micro LEDs. This method replaces the current manual inspection method or the method of measuring resistance only through ART (Automated Resistance Testing).

[0034] The present invention reduces manual intervention through automated testing process, greatly improves the testing speed, and promptly finds Bonding offset problems, which helps to prevent unqualified products from flowing into subsequent production links and ensures the stability of product quality. At the same time, the infrared ring light source is used to take clear photos from the front, and can take photos on multi-layer materials. Combined with high-precision image recognition technology, the accuracy of the test results is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the three-dimensional structure of a Mini LED and Micro LED binding offset inspection device provided by an embodiment of the present invention.

[0036] Figure 2 A schematic structural diagram of an upper infrared light source provided by an embodiment of the present invention.

[0037] Figure 3 This is a schematic diagram of a general product structure.

[0038] Figure 4 Schematic diagram of the offset calculation parameters of the offset system for opaque COF products.

[0039] Figure 5 A product that binds FPC to the upper and lower parts of COF

[0040] Figure 6 Two side products.

[0041] Figure 7 For bending products.

[0042] Figure 8 This is the effect of lighting and imaging an opaque COF product.

[0043] Fig. 9 This is the effect of lighting and imaging an opaque COF product.

[0044] Fig.10 Schematic diagram of the calculation parameters of the offset system for the opaque FPF product offset.

[0045] Explanation of the symbols of the main elements: 1. Base; 2. Platform; 21. Y-axis linear module; 3. X-axis linear module; 4. Z-axis linear module; 41. Module mounting frame; 5. Bracket; 6. Upper inspection camera; 61. Lens; 7. Upper infrared light source; 71. Infrared coaxial light source; 711. First light source; 712. Semi-transparent and semi-reflective mirror; 72. Infrared ring light source; 721. Second light source; 722. Through hole; 8. Lower inspection camera; 9. Lower infrared light source. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0047] like Figure 1 As shown, a Mini LED and Micro LED binding offset inspection device includes: a base 1, a CCD camera, a white light source, an upper inspection camera 6, an upper infrared light source 7, a lower inspection camera 8 and a lower infrared light source 9.

[0048] The CCD camera is set on one side of the product to be inspected. The CCD camera is used to photograph the mark on the product to be inspected and to calculate the position of the product to be inspected.

[0049] The CCD light source is set on one side of the product to be inspected and provides light for the CCD camera to shoot.

[0050] The upper inspection camera 6 is arranged on the upper side of the product to be inspected, and is used to photograph the upper side of the product to be inspected and to obtain a clear image. A lens 61 is arranged on the lower side of the upper inspection camera 6 .

[0051] The upper inspection light source 7 is arranged on the upper side of the product to be inspected and provides light source for the upper inspection camera 6 to shoot. Figure 2 As shown, the upper inspection light source 7 includes a coaxial light source 71 and an annular light source 72. The upper side of the coaxial light source 71 is set as the upper inspection camera 6, and the lower side of the coaxial light source 71 is set as the annular light source 72. The coaxial light source 71 includes a first shell, a first light source 711 and a semi-transparent and semi-reflective mirror 712. The first light source 711 is arranged on the left side of the first shell, and the semi-transparent and semi-reflective mirror 712 is arranged on the right side of the first shell. The semi-transparent and semi-reflective mirror 712 is at an inclined angle to the horizontal line; the annular light source 72 includes a second shell and a second light source 721. The second light source 721 is arranged inside the shell. The second light source 721 is composed of a plurality of parallel annular lights, and a through hole 722 is arranged in the middle of the top of the second shell. Preferably, the interior of the second shell is truncated cone-shaped, and the plurality of annular lights are spaced from top to bottom. The present invention adopts a combination of coaxial light and low-angle annular light for lighting and imaging to check the binding accuracy of the opaque MINI (MICRO) LED.

[0052] The lower inspection camera 8 is disposed on the lower side of the product to be inspected, and is used to photograph the lower side of the product to be inspected and obtain a clear image.

[0053] The lower inspection light source 9 is arranged at the lower side of the product to be inspected, and provides light source for the lower inspection camera 8 to shoot. The lower inspection light source 9 has the same structural principle as the upper inspection light source 7. The lower inspection light source 9 includes a coaxial light source and an annular light source. The lower side of the coaxial light source is arranged as the lower inspection camera 8, and the upper side of the coaxial light source is arranged as the annular light source. The coaxial light source includes a first shell, a first light source and a semi-transparent and semi-reflective mirror. The first light source is arranged on the left side of the first shell, and the semi-transparent and semi-reflective mirror is arranged on the right side of the first shell. The semi-transparent and semi-reflective mirror is at an inclined angle with the horizontal line; the annular light source includes a second shell and a second light source. The second light source is arranged inside the second shell. The second light source is composed of a plurality of parallel annular lights, and a through hole is arranged in the middle of the bottom of the second shell. Preferably, the interior of the second shell is in the shape of an inverted truncated cone, and the plurality of annular lights are spaced from top to bottom.

[0054] Furthermore, the semi-transparent and semi-reflective mirrors in the upper inspection light source 7 and the lower inspection light source 9 can be further provided with band-pass / high-pass filtering effects as required, which all fall within the protection scope of the present invention.

[0055] Furthermore, the upper inspection light source and the lower inspection light source both use infrared light sources, only infrared light sources (wavelength greater than 800nm), and the specific wavelength can be further optimized according to product characteristics. For example, 930, 960, 1100 and other bands have different penetration effects on electronic product substrates.

[0056] Furthermore, the upper inspection camera 6 and the lower inspection camera 8 are respectively installed on the Z-axis linear module 4 through the bracket 5, the Z-axis linear module 4 is installed on the module mounting frame 41, the bottom of the module mounting frame 41 is connected to the X-axis linear module 3 through a slider, the X-axis linear module 3 is installed on the upper side of the base 1, and one end of the X-axis linear module 3 is connected to the X-axis servo motor.

[0057] Furthermore, the upper inspection camera 6 and the lower inspection camera 8 are preferably area array cameras.

[0058] Furthermore, the product to be inspected is mounted on the platform 2, the platform 2 is disposed on the Y-axis linear module 21, and the Y-axis linear module 21 is mounted on the upper side of the base 1. One end of the Y-axis linear module 21 is connected to the Y-axis servo motor.

[0059] like Figure 3 As shown, a single product panel has multiple sides, and each side contains multiple sets of COG / FOC. The current inspection product contains a COG (IC) side and a FOG (FPC) side at the top of the panel, and each side contains a set of COG / FOC. The offset inspection system is also compatible with the situation where the number of COG / FOCs on different sides of the panel is different.

[0060] Mini LED and Micro LED bonding offset inspection process, which includes the following steps:

[0061] S1. Binding the fields of view of the upper inspection camera and the lower inspection camera includes the following processes:

[0062] S11. Place a transparent calibration plate at the position of the product to be tested;

[0063] S12, the upper inspection camera and the lower inspection camera take photos simultaneously, photographing the transparent calibration plate;

[0064] S13, through the transparent calibration plate, the two inspection cameras calibrate the internal reference matrix respectively;

[0065] S14. Using a transparent calibration plate, the images taken by the two inspection cameras are flipped and overlapped after being calibrated with the internal reference matrix, and their projection relationship matrix is ​​calculated.

[0066] By using the transparent calibration plate as a bridge, the fields of view of the upper inspection camera and the lower inspection camera can be closely linked. When the two cameras capture the top and bottom images of an opaque object respectively, the relative position relationship between the upper and lower surfaces of the object can be accurately calculated based on the principle of field of view projection.

[0067] In addition, if the fields of view of the upper and lower cameras are partially misaligned, the transparent calibration plate can be used as a calibration medium to accurately calibrate and convert the relative position relationship between the two camera fields of view to ensure measurement accuracy.

[0068] S2. The robot picks up the product and moves to the top of the loading camera. It first moves to the left Mark point. The PLC controller or the main control PC receives the signal through the motion control card and controls the photo taking. After the left Mark photo is taken, the robot moves to the right Mark point. The PLC controller or the main control PC receives the signal through the motion control card and controls the photo taking. After the right Mark photo is taken, the visual feedback of the photo taking result is OK / NG.

[0069] S3, after the PLC controller or the main control PC receives the OK signal of the photo result through the motion control card, it triggers the visual system to perform alignment calculation and position and angle compensation;

[0070] S4, the PLC controller or the main control PC drives the manipulator to place the product on the platform 2 according to the alignment calculation result, and the platform 2 moves along the Y direction to the bottom of the inspection camera 6;

[0071] S5, PLC controller or main control PC sends a single side detection command;

[0072] S6, the detection system drives the Z axis to move to the COF shooting height, drives the X axis to move from right to left to complete the offset shooting of the COF and the panel, performs image preprocessing on the image, then performs binary segmentation, and finally completes the offset calculation;

[0073] Furthermore, a distance measuring device is added in step S6, and the distance measured by the distance measuring device triggers the adjustment of the Z axis.

[0074] Since the offset inspection requires a high detection accuracy, the depth of field of the camera is very shallow (for example, at 5x magnification, the depth of field of the lens is only 0.09mm). You can get a better photo effect by adding a distance measuring device:

[0075] The measurement of the distance measuring device (laser distance meter / spectral confocal distance meter, etc.) can be linked with the Z axis to achieve more accurate control of the shooting position and obtain better shooting effects. There are two ways to implement this measurement action:

[0076] (1) With the rangefinder trigger mechanism, the distance measuring device and the camera lens do not share the same axis. The distance is first measured through precise movement of the Y axis, and then the necessary compensation adjustment is made along the Z axis based on the measurement result, ultimately ensuring that the camera is taken at the best position to achieve accurate image capture.

[0077] (2) For coaxial measurement technology, a triangular laser layout that deviates from the main optical axis of the lens is used, or a specially designed lens is introduced to achieve active ranging function through the lens itself. This technology can accurately control the distance between the product to be inspected and the lens, thereby significantly improving the clarity and overall image quality of the photo.

[0078] In step S6, if Figure 4 As shown, the detection system is provided with a COF inspection box, a Panel ITO inspection box and an ITOPattern box. The COF inspection box is used for the detected COF Lider line and center line; the Panel ITO inspection box is used for the detected Panel ITO line and center line; the ITO Pattern box is used for the detected Panel ITO offset detection area; offset calculation X: the distance between the center of the COF Lider line and the center line of the Panel ITO line; offset calculation Y: the distance between the center of the ITO Pattern and the center of the COFMark in the Y direction; offset angle calculation T: the difference LY-RY between the left and right offsets Y.

[0079] S7, platform 2 moves the Y axis to the FPC photo position, the PLC controller or the main control PC triggers the left mark photo again, and then the detection system drives the X axis to move to complete the right mark photo, and finally completes the offset calculation of the binding area between the FPC and the panel.

[0080] There are generally several possibilities for product bonding: (1) one-sided bonding, bonding is performed on only one of the four sides; (2) two-sided bonding, bonding is performed on two opposite sides of the product (up and down or left and right); (3) L-shaped bonding, bonding is performed on two adjacent sides of the product.

[0081] The mobile stage needs to be compatible with the above bonding arrangements. The following steps need to be repeated once for each bonding edge.

[0082] For example, when the product has a second bottom side Bonding, step S8 is also included. Step S8 includes the following process: the platform returns to the loading camera position, the product is rotated 180°, and the loading and photographing inspection process is repeated. The robot picks up the product to the top of the CCD camera, and takes pictures of the left Mark and the right Mark respectively. The PLC controller or the main control PC sends the left and right Mark photographing instructions in turn, and the detection system completes the photographing and performs the alignment calculation; the platform moves the Y axis to the FPC photographing position, the PLC controller or the main control PC receives the side completion signal, and triggers the left Mark photographing again, and then the detection system drives the X axis to move to complete the right Mark photographing, and finally completes the offset calculation of the binding area between the FPC and the panel.

[0083] Further examples:

[0084] like Figure 5 As shown in the figure, the process is COF+FOF, first the COF is bonded to the glass cover, and then the FPC is bonded to the glass cover with COF. Figure 5 In the figure, the upper part is the process of binding the FPC to the upper part of the COF, and the lower part is the process of binding the FPC to the lower part of the COF. Depending on the process, choose to use the upper camera or the lower camera of the area array.

[0085] Inspection method: Use the offset inspection system to take pictures of the binding area between the COF and the panel through the upper array camera for offset inspection; then use the upper array camera or the lower array camera to perform the FPC binding offset inspection based on the lighting imaging.

[0086] like Figure 6 As shown, the process is as follows: COF+FOF: First, COF is bonded to the glass cover at the top, and then FPC is bonded to the glass cover with COF. FOG: FPC is bonded to the glass cover at the bottom.

[0087] Inspection method: Use the upper array camera to take a photo of the binding area between COF and panel for offset inspection; use the upper array camera or the lower array camera to detect the binding offset of FPC according to the lighting imaging; rotate the product 180°, and use the upper array camera to take a photo of the binding area between FPC and panel for offset inspection.

[0088] like Figure 7 As shown, the process is: FPC ON COF + COF ON GLASS: first bind the FPC to the COF at the top, and then bind the COF with FPC to the glass cover. FOG: attach the FPC to the glass cover at the bottom.

[0089] Inspection method: Use the upper array camera to take a photo of the binding area between COF and panel for offset inspection; rotate the product 180°, use the upper array camera to take a photo of the binding area between FPC and panel for offset inspection.

[0090] For opaque COF products, white light cannot penetrate the surface to reveal the mark image behind it. However, by using infrared light for illumination and combining it with the image processing technology of the offset inspection system, the image quality is significantly improved. Figure 8 As shown, the optimized image features are as follows: the transition pixels are controlled at 4 pixels or less, and the contrast achieves obvious differences of 118 to 52 (i.e., 66 grayscale differences) and 92 to 50 (i.e., 42 grayscale differences).

[0091] For opaque FOF products, white light sources cannot penetrate their surface to capture the image of the Mark behind them. However, by introducing infrared light sources for illumination and applying an offset inspection system for subsequent imaging, the image quality is significantly improved. Fig. 9 As shown, the optimized image presents the following characteristics: the transition pixels are controlled at 6 pixels or less; in terms of contrast, significant grayscale differences of 226 to 62 (i.e., 164 grayscale differences), 234 to 87 (i.e., 147 grayscale differences), 193 to 91 (i.e., 102 grayscale differences), and 188 to 63 (i.e., 125 grayscale differences) are achieved.

[0092] Generally, the algorithm can more stably calculate the offset value of the image when the grayscale difference exceeds 20. In contrast, if the surface layer cannot be penetrated, the grayscale difference will be zero and no effective measurement can be performed.

[0093] For opaque FOF products, such as Fig.10 As shown in the figure, for the case where COF is blocked: the FPC cross mark will block 1 to 3 COF reference frames, resulting in the inability to locate the COF cross reference line. Therefore, when locating to 1 to 4 COF reference frames, add a reference offset:

[0094] Offset calculation X = FPC cross reference line X-(COFMarkX+reference offset X);

[0095] Offset calculation Y = FPC cross reference line Y-(COFMarkY+reference offset Y);

[0096] exist Fig.10 middle:

[0097] FPC cross reference line: the center reference line obtained by detecting FPC;

[0098] COF reference frame: 4 reference frames on COF;

[0099] COF cross reference line: the center cross line of the 4 reference frames on the COF;

[0100] Reference offset: the actual distance from the COF cross reference line to the COF reference frame;

[0101] Offset calculation method:

[0102] Offset calculation X: the distance between the FPC cross reference line and the COF cross reference line in the X direction;

[0103] Offset calculation Y: Y direction distance between FPC cross reference line and COF cross reference line;

[0104] Offset calculation T (angle): the difference between the left and right offset Y (LY-RY).

[0105] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A Mini LED and Micro LED binding offset inspection device, characterized in that: It includes: A CCD camera, which is set on one side of the product to be inspected and is used for product loading position compensation; A CCD light source, arranged on one side of the product to be inspected, to provide light for the CCD camera to shoot; An upper inspection camera is arranged on the upper side of the product to be inspected, and is used to photograph the upper side of the product to be inspected and obtain a clear image; An upper inspection light source is arranged on the upper side of the product to be inspected to provide light for the upper inspection camera to shoot; the upper inspection light source includes a coaxial light source and an annular light source, the upper side of the coaxial light source is arranged as the upper inspection camera, the lower side of the coaxial light source is arranged as the annular light source, the coaxial light source includes a first shell, a first light source and a semi-transparent and semi-reflective mirror, the first light source is arranged on the left side inside the first shell, the semi-transparent and semi-reflective mirror is arranged on the right side inside the first shell, and the semi-transparent and semi-reflective mirror forms an inclined angle with the horizontal line; the annular light source includes a second shell and a second light source, the second light source is arranged inside the shell, the second light source is composed of a plurality of annular lights, and a through hole is arranged in the middle of the top of the second shell; A lower inspection camera is arranged on the lower side of the product to be inspected, and is used to photograph the lower side of the product to be inspected and obtain a clear image; The lower inspection light source is arranged at the lower side of the product to be inspected, and provides light source for the lower inspection camera to shoot.

2. The Mini LED and Micro LED binding offset inspection device according to claim 1, characterized in that: The lower inspection light source includes a coaxial light source and an annular light source. The lower side of the coaxial light source is set as a lower inspection camera, and the upper side is configured with an annular light source. The coaxial light source includes a first shell, a first light source and a semi-transparent and semi-reflective mirror. The first light source is set on the left side inside the first shell, and the semi-transparent and semi-reflective mirror is tilted on the right side inside the first shell; the annular light source includes a second shell and a second light source. The second light source is set inside the second shell. The second light source is composed of multiple annular lights, and a through hole is set in the middle of the bottom of the second shell.

3. The Mini LED and Micro LED binding offset inspection device according to claim 1 or 2, characterized in that: The interior of the second shell is in a frustum shape, and a plurality of annular lights are distributed at intervals from top to bottom.

4. The Mini LED and Micro LED binding offset inspection device according to claim 1 or 2, characterized in that: The upper inspection light source and the lower inspection light source are both infrared light sources.

5. The Mini LED and Micro LED binding offset inspection device according to claim 1, characterized in that: The upper inspection camera and the lower inspection camera are respectively arranged on the Z-axis linear module through brackets, the Z-axis linear module is installed on the module mounting frame, the bottom of the module mounting frame is connected to the X-axis linear module through a slider, and one end of the X-axis linear module is connected to the X-axis servo motor.

6. The Mini LED and Micro LED binding offset inspection device according to claim 1, characterized in that: The product to be inspected is installed on a platform, the platform is set on a Y-axis linear module, and one end of the Y-axis linear module is connected to the Y-axis servo motor.

7. Mini LED and Micro LED binding offset inspection process, characterized in that: It includes the following steps: S1. Bind the fields of view of the upper inspection camera and the lower inspection camera; S2. The robot picks up the product, moves to the top of the loading camera, and takes pictures of the left and right mark points. The PLC controller or main control PC receives the signal through the motion control card and controls the picture taking. The visual feedback of the picture taking result is OK / NG. After S3, the PLC controller or the main control PC receives the photo result through the motion control card, it triggers the vision to perform alignment calculation and position and angle compensation; S4, the PLC controller or the main control PC drives the manipulator to place the product on the platform according to the alignment calculation result, and the platform moves along the Y direction to directly below the upper inspection camera of the device as described in any one of claims 1 to 6; S5, PLC controller or main control PC sends a single side detection command; S6, the detection system drives the Z axis to move to the COF shooting height, and drives the X axis to move from right to left to complete the offset inspection of the COF and the panel; S7, the platform moves the Y axis to the FPC photo position, the PLC controller or the main control PC triggers the left Mark photo again, and then the detection system drives the X axis to move to complete the right Mark photo, and finally completes the offset calculation of the binding area between the FPC and the panel.

8. The Mini LED and Micro LED binding offset inspection process according to claim 7, characterized in that: Step S1 includes the following process: S11. Place a transparent calibration plate at the product location; S12, the upper inspection camera and the lower inspection camera take photos simultaneously, photographing the transparent calibration plate; S13, through the transparent calibration plate, the two inspection cameras calibrate the internal reference matrix respectively; S14. Using a transparent calibration plate, the images taken by the two inspection cameras are flipped and overlapped after being calibrated with the internal reference matrix, and their projection relationship matrix is ​​calculated.

9. The Mini LED and Micro LED binding offset inspection process according to claim 7, characterized in that: After step S7, step S8 is also included. Step S8 includes the following process: when there are other bonding sides, the platform moves to the corresponding position, the robot picks up the product to the top of the CCD camera, and takes pictures of the left mark and the right mark respectively. The PLC controller or the main control PC sends the left and right mark shooting instructions in turn, and the detection system completes the shooting and performs the alignment calculation; the platform moves the Y axis to the FPC shooting position, the PLC controller or the main control PC receives the side completion signal, and triggers the left mark shooting again, and then the detection system drives the X axis to move to complete the right mark shooting, and finally completes the offset calculation of the binding area between the FPC and the panel.

10. The Mini LED and Micro LED bonding offset inspection process according to claim 7, characterized in that: In step S6, a distance measuring device is added, and the adjustment of the Z axis is triggered by the distance measurement of the distance measuring device.

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