Display panels, electronic devices

Abstract

This application discloses a display panel and an electronic device. The display panel includes a panel portion and a bonding portion, with the bonding portion located on the side of the panel portion. The bonding portion includes a first pad and a second pad, with the second pad located on the side of the first pad away from the panel portion. A support post is provided between the first pad and the second pad. When the film layer between the first pad and the second pad is subjected to an upward arching force, the support post generates a downward pressure and a downward reaction force, which slows down the upward arching of the film layer between the first pad and the second pad, maintains the signal transmission between the first pad and the second pad, and helps maintain the good display performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and an electronic device. Background Technology

[0002] With the development of display technology, more and more display panels and devices are being used in people's daily lives and work. However, as display devices become more widespread, people are no longer just pursuing display functionality, but are also placing stricter demands on appearance, such as requiring narrow bezels.

[0003] In the process of narrow bezel design, it is inevitable to compress the spacing between some structures. For example, the spacing between the input pads (input PAD) and output pads (output PAD) on the bottom bezel is reduced. When the bonding part is pressed against the driver chip (IC), the film layer between the input pads and output pads is under pressure, which can easily cause it to arch and deform, or even lead to screen breakage. This affects the signal transmission between the input pads and output pads, resulting in problems such as poor bright lines on the screen. Summary of the Invention

[0004] The display panel and electronic device provided in this application improve the warping deformation of the film layer between the input pad and the output pad.

[0005] To solve the above-mentioned technical problems, the first technical solution provided in this application is: to provide a display panel, including a panel portion and a bonding portion; the bonding portion is disposed on the side of the panel portion; the bonding portion includes a first pad and a second pad, the second pad being disposed on the side of the first pad away from the panel portion; wherein, a support column is provided between the first pad and the second pad.

[0006] In one embodiment, the material of the support post includes metal; preferably, the material of the support post is the same as the material of the first pad, or the material of the support post is the same as the material of the second pad; preferably, the materials of the first pad, the second pad, and the support post are the same.

[0007] In one embodiment, the distance between the support post and the first pad is denoted as L1, the distance between the support post and the second pad is denoted as L2, and L1 = L2; the distance between the first pad and the second pad is denoted as L0; the dimension of the support post along the direction from the first pad to the second pad is denoted as L3; L3 ≥ (2 / 3)L0, 0 < L1 ≤ (1 / 6)L0.

[0008] In one embodiment, the distance between the support post and the first pad is denoted as L1, the distance between the support post and the second pad is denoted as L2, and L1 ≠ L2; the distance between the first pad and the second pad is denoted as L0; the dimension of the support post along the direction from the first pad to the second pad is denoted as L3; L3 ≤ (1 / 6)L0; L1 > L2, L2 ≤ (1 / 4)L0; or, L2 > L1, L1 ≤ (1 / 4)L0.

[0009] In one embodiment, the surface of the support column is provided with an insulating layer, the material of which includes an inorganic material; preferably, the material of the insulating layer includes silicon nitride.

[0010] In one embodiment, the angle between the side surface of the support column and the bottom surface of the support column is less than 50 degrees.

[0011] In one embodiment, the sum of the thickness of the support post and the thickness of the insulating layer is less than or equal to half the thickness of the first pad; and / or, the sum of the thickness of the support post and the thickness of the insulating layer is less than or equal to half the thickness of the second pad.

[0012] In one embodiment, the display panel further includes a driver chip, which is disposed opposite to the bonding portion; the driver chip is electrically connected to the first pad and the second pad via a connecting portion; the spacing between the insulating layer and the driver chip is greater than the height of the connecting portion; preferably, the spacing between the insulating layer and the driver chip is greater than or equal to 15 μm.

[0013] In one embodiment, the spacing between the first pad and the second pad is less than 200 μm.

[0014] To solve the above-mentioned technical problems, the second technical solution provided by this application is: to provide an electronic device, including the display panel described in any of the above claims.

[0015] The beneficial effects of this application are as follows: Unlike the prior art, this application discloses a display panel and an electronic device; the display panel includes a panel portion and a bonding portion, the bonding portion being disposed on the side of the panel portion; the bonding portion includes a first pad and a second pad, the second pad being disposed on the side of the first pad away from the panel portion; a support column is provided between the first pad and the second pad, when the film layer between the first pad and the second pad is subjected to an upward arching force, the support column will generate a downward pressure and a downward reaction force, which will slow down the upward arching of the film layer between the first pad and the second pad, maintain the signal transmission between the first pad and the second pad, and help maintain the good display performance of the display panel. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a force diagram of an implementation method involving an input PAD and an output PAD.

[0018] Figure 2 This is a force diagram illustrating another implementation of the input PAD and output PAD.

[0019] Figure 3 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the structure of the bonding part of the display panel provided in the embodiment of this application;

[0021] Figure 5 yes Figure 3 The diagram shows the forces acting between the first pad, the second pad, and the support pillar.

[0022] Figure 6 yes Figure 3 A schematic diagram showing the positional relationship between the first pad, the second pad, and the support column in one embodiment;

[0023] Figure 7 yes Figure 3 A schematic diagram showing the positional relationship between the first pad, the second pad, and the support column in another embodiment;

[0024] Figure 8 yes Figure 3 The diagram shows a partial structural diagram between the bonding part and the driver chip. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0027] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the stated features. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific posture (as shown in the figures). If the specific posture changes, the directional indications also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] In the process of narrow bezel design, it is inevitable to compress the spacing between some structures to achieve a narrow bezel. This includes the COP area of ​​the bottom bezel. This area is mainly used to connect the PAD signals of the driver chip (IC). This area is designed with input signal area and output signal area with circuit connection, called input PAD and output PAD. The input PAD and output PAD are connected to the IC to transmit signals between the screen and the IC.

[0031] When the distance between the input PAD and the output PAD is large, the COP is subjected to pressure during the IC bonding process. Due to the large distance between the input and output PADs, the film layer between them experiences relatively little stress, resulting in slow deformation or even almost no deformation, and no defects occur (e.g.). Figure 1 As shown, Figure 1This is a force diagram illustrating the implementation of an input PAD and output PAD configuration. To ensure a narrow bezel design, the distance between the output PADs is reduced. This results in the COP area being subjected to pressure during IC bonding, and the film layer between the input and output PADs being subjected to pressure from both ends. This causes the film layer between the input and output PADs to arch and deform. When the deformation reaches a certain extent, the film layer between the input and output PADs may fracture, leading to breakage of the metal traces between the film layers, failure of the metal wires connecting the screen, and resulting in poor screen brightness. Furthermore, water and oxygen can infiltrate at the cracks, affecting signal transmission and impedance testing (e.g., ...). Figure 2 As shown, Figure 2 This is a force diagram of another implementation of the input PAD and output PAD.

[0032] In view of this, this application provides a display panel and an electronic device that improves the film layer arching deformation between the input pad and the output pad, and maintains the good display performance of the display panel.

[0033] Please see Figures 3-8 , Figure 3 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of the bonding part of the display panel provided in the embodiment of this application. Figure 5 yes Figure 3 The diagram shows the forces acting on the first pad, the second pad, and the support pillar. Figure 6 yes Figure 3 The diagram shows the positional relationship between the first pad, the second pad, and the support pillar in one embodiment. Figure 7 yes Figure 3 The diagram shows the positional relationship between the first pad, the second pad, and the support pillar in another embodiment. Figure 8 yes Figure 3 The diagram shows a partial structural diagram between the bonding part and the driver chip.

[0034] The display panel includes a panel portion 11, a mounting portion 12, and a driver chip 13. The panel portion 11 is used to display images. The mounting portion 12 is provided on the side of the panel portion 11; for example, the mounting portion 12 is provided on the bottom edge of the panel portion 11. The driver chip 13 is disposed opposite to the mounting portion 12 and is electrically connected to it.

[0035] The bonding portion 12 includes a first pad 121 and a second pad 122, with the second pad 122 located on the side of the first pad 121 away from the panel portion 11. One of the first pad 121 and the second pad 122 is an input pad, and the other is an output pad. For example, the first pad 121 is an output pad, and the second pad 122 is an input pad. For example, the bonding portion 12 includes a plurality of first pads 121 and a plurality of second pads 122, with the plurality of first pads 121 arranged along a first direction, and the plurality of second pads 122 arranged along the first direction, which intersects the direction from the first pad 121 to the second pad 122.

[0036] A support post 123 is provided between the first pad 121 and the second pad 122. For example... Figure 5 As shown, during the bonding process between the bonding part 12 and the driver chip 13, the first pad 121 and the second pad 122 are subjected to downward pressure. When the pressure causes the film layer between the first pad 121 and the second pad 122 to be subjected to an upward arching force, the support column 123 will generate a downward pressure and a downward reaction force, which inhibit each other with the upward arching force, reduce the upward arching of the film layer between the first pad 121 and the second pad 122, reduce the probability of film layer cracks, thereby reducing the possibility of metal trace breakage between the film layers, maintaining the signal transmission of the first pad 121 and the second pad 122, and at the same time reducing water and oxygen intrusion, which is conducive to maintaining the good display performance of the display panel.

[0037] In one embodiment, the distance between the first pad 121 and the second pad 122 is less than 200 μm. The distance between the first pad 121 and the second pad 122 is small. By providing a support post 123 between the first pad 121 and the second pad 122, the bonding part 12 can significantly alleviate the deformation and arching of the film layer between the first pad 121 and the second pad 122 during the bonding process, and avoid cracks in the film layer between the first pad 121 and the second pad 122.

[0038] In one embodiment, the bonding part 12 is provided with a plurality of support posts 123, which are arranged along the arrangement direction of a plurality of first pads 121 or a plurality of second pads 122, and a support post 123 is provided between a first pad 121 and a second pad 122 respectively.

[0039] In one embodiment, the bonding part 12 is provided with a support post 123, and a plurality of first pads 121 and a plurality of second pads 122 are respectively provided on opposite sides of the support post 123. In other words, the support post 123 is provided between the plurality of first pads 121 and the plurality of second pads 122.

[0040] In one embodiment, the material of the support column 123 includes metal. The metal material has a certain hardness and a high modulus. When the film layer between the first pad 121 and the second pad 122 is subjected to pressure and arches upward, the support column 123 can better suppress the pressure to generate a reaction force and better suppress the deformation of the film layer between the first pad 121 and the second pad 122.

[0041] Optionally, the material of the support column 123 is the same as that of the first pad 121, which makes it easier for the support column 123 and the first pad 121 to be completed in the same process, saving material and time costs without increasing the production schedule, and allowing for better control of the size and height of the support column 123.

[0042] Optionally, the material of the support column 123 is the same as that of the second pad 122, which makes it easier for the support column 123 and the second pad 122 to be completed in the same process, saving material and time costs without increasing the production schedule, and allowing for better control of the size and height of the support column 123.

[0043] Optionally, the first pad 121, the second pad 122, and the support column 123 are made of the same material, which makes it easier for the support column 123 to be completed in the same process as the first pad 121 and the second pad 122. This saves material and time costs without increasing the production schedule, and allows for better control over the size and height of the support column 123.

[0044] In one implementation, such as Figure 6 As shown, the support post 123 is located at the midpoint between the first pad 121 and the second pad 122. Specifically, the distance between the support post 123 and the first pad 121 is denoted as L1, and the distance between the support post 123 and the second pad 122 is denoted as L2, where L1 = L2; the distance between the first pad 121 and the second pad 122 is denoted as L0; the dimension of the support post 123 along the direction from the first pad 121 to the second pad 122 is denoted as L3; L3 ≥ (2 / 3)L0, 0 < L1 ≤ (1 / 6)L0.

[0045] When the support post 123 is positioned in the middle between the first pad 121 and the second pad 122, the design is 0 < L1 = L2 to avoid short circuits between the support post 123 and the first pad 121 and the second pad 122. By designing L1 = L2 ≤ (1 / 6)L0 and L3 ≥ (2 / 3)L0, the support post 123 can achieve a better reaction effect. The spacing between the support post 123 and the first pad 121 and the spacing between the support post 123 and the second pad 122 are smaller. The original binding pressure on the first pad 121 and the second pad 122 will hardly cause deformation of the film layer between the support post 123 and the first pad 121 and the film layer between the support post 123 and the second pad 122, significantly improving the arching deformation of the film layer between the first pad 121 and the second pad 122.

[0046] In one implementation, such as Figure 7 As shown, the support post 123 is offset between the first pad 121 and the second pad 122. Specifically, the distance between the support post 123 and the first pad 121 is denoted as L1, and the distance between the support post 123 and the second pad 122 is denoted as L2, where L1 ≠ L2, L1 > L2, or L2 > L1; the distance between the first pad 121 and the second pad 122 is denoted as L0; the dimension of the support post 123 along the direction from the first pad 121 to the second pad 122 is denoted as L3; L3 ≤ (1 / 6)L0; when L1 > L2, 0 < L2 ≤ (1 / 4)L0; or, when L2 > L1, 0 < L1 ≤ (1 / 4)L0.

[0047] When the support post 123 is offset between the first pad 121 and the second pad 122, the design incorporates 0 < L1 and 0 < L2 to prevent short circuits between the support post 123 and the first pad 121 and the second pad 122. This offset design guides the center point to the area below the support post 123, creating two unequal torques: a distance L1 between the support post 123 and the first pad 121, and a distance L2 between the support post 123 and the second pad 122. The main deformation will occur on the side with the longer torque. Due to the position of the support post 123, the torque at the longer torque point becomes shorter, requiring a greater force to deform it. However, the original binding pressure on the first pad 121 and the second pad 122 remains unchanged and does not reach the maximum force required for deformation at this location. Therefore, the film layers between the support post 123 and the first pad 121, and between the support post 123 and the second pad 122, will not bulge significantly, thus reducing the probability of breakage. By designing L1>L2,L2≤(1 / 4)L0; or L2>L1,L1≤(1 / 4)L0, the film layer arching deformation between the first pad 121 and the second pad 122 is significantly improved.

[0048] It should be noted that whether the support post 123 is located in the middle between the first pad 121 and the second pad 122, or whether the support post 123 is offset between the first pad 121 and the second pad 122, the support post 123 will generate a downward pressure and a downward reaction force, which counteract the upward arching force and slow down the upward arching of the film layer between the first pad 121 and the second pad 122. Figure 5 The force trend shown.

[0049] In one implementation, such as Figure 6 and Figure 7As shown, an insulating layer 124 is provided on the surface of the support pillar 123. The material of the insulating layer 124 includes inorganic materials. When the material of the support pillar 123 is metal, and the material of the insulating layer 124 includes inorganic materials, the bonding force between the metal and the inorganic materials is without covalent bonds, which can form a reliable adhesion relationship and prevent film detachment, that is, it is not easy for the insulating layer 124 to separate from the support pillar 123. In addition to being provided on the surface of the support pillar 123, the insulating layer 124 is also provided on the surface of the film between the support pillar 123 and the first pad 121, and on the surface of the film between the support pillar 123 and the second pad 122. The insulating layer 124 can inhibit the erosion of the support pillar 123, the film between the support pillar 123 and the first pad 121, and the film between the support pillar 123 and the second pad 122 by water and oxygen, which is beneficial to improving the performance of the display panel.

[0050] In one embodiment, the material of the insulating layer 124 includes silicon nitride, and the bonding force between the silicon nitride and the support pillar 123 is non-covalent, which can produce a strong adhesion relationship.

[0051] In one embodiment, the angle between the side surface of the support post 123 and the bottom surface of the support post 123 is less than 50 degrees, so that during the process of forming the insulating layer 124 on the surface of the support post 123, a continuous insulating layer 124 is also formed on the surface of the film layer between the support post 123 and the first pad 121, and on the surface of the film layer between the support post 123 and the second pad 122, thereby reducing the impact of water and oxygen erosion and improving the performance of the display panel.

[0052] In one embodiment, the sum of the thickness of the support post 123 and the thickness of the insulating layer 124 is less than or equal to half the thickness of the first pad 121; and / or, the sum of the thickness of the support post 123 and the thickness of the insulating layer 124 is less than or equal to half the thickness of the second pad 122, so that the depth of the groove formed by the support post 123 and the first pad 121 and the groove formed by the support post 123 and the second pad 122 is not too deep, so that a continuous insulating layer 124 can be formed on the film layer between the support post 123 and the first pad 121 and on the film layer between the support post 123 and the second pad 122; in addition, the insulating layer 124 can be spaced apart from the driver chip 13, keeping the end face of the first pad 121 and the end face of the second pad 122 higher than the surface of the insulating layer 124 away from the support post 123, so as to achieve a stable electrical connection between the first pad 121, the second pad 122 and the driver chip 13.

[0053] In one implementation, such as Figure 8As shown, the driver chip 13 is electrically connected to the first pad 121 and the second pad 122 via the connection portion 131. The spacing between the insulating layer 124 and the driver chip 13 is greater than the height of the connection portion 131, so the insulating layer 124 will not contact the driver chip 13. Since the thickness of the first pad 121 and / or the second pad 122 is greater than the sum of the thickness of the support post 123 and the thickness of the insulating layer 124, by preventing the insulating layer 124 from contacting the driver chip 13, and by ensuring that the spacing between the insulating layer 124 and the driver chip 13 is greater than the height of the connection portion 131, the spacing between the first pad 121 and the second pad 122 and the driver chip 13 can accommodate the connection portion 131, thereby achieving the electrical connection between the first pad 121 and the second pad 122 and the driver chip 13 via the connection portion 131.

[0054] Optionally, the spacing between the insulating layer 124 and the driver chip 13 is greater than or equal to 15 μm. It is understood that the height of the connection portion 131 is typically less than 15 μm, and the spacing between the insulating layer 124 and the driver chip 13 is greater than or equal to 15 μm, so that the spacing between the first pad 121 and the second pad 122 and the driver chip 13 can accommodate the connection portion 131, enabling the first pad 121 and the second pad 122 to be electrically connected to the driver chip 13 through the connection portion 131.

[0055] This application also provides an electronic device, which includes the display panel provided in any of the above embodiments, thereby improving the quality of the electronic device. The electronic device may be a desktop computer, laptop computer, personal digital assistant (PDA), mobile phone, television, etc.

[0056] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A display panel, characterized in that, include: Panel section; A bonding portion is provided on the side of the panel portion; the bonding portion includes a first pad and a second pad, the second pad being provided on the side of the first pad away from the panel portion; Wherein, a support column is provided between the first pad and the second pad; the distance between the support column and the first pad is denoted as L1, the distance between the support column and the second pad is denoted as L2, the distance between the first pad and the second pad is denoted as L0, and the dimension of the support column along the direction from the first pad to the second pad is denoted as L3; L1=L2, L3≥(2 / 3)L0, 0<L1≤(1 / 6)L0; or, L1>L2, L2≤(1 / 4)L0, L3≤(1 / 6)L0; or, L2>L1, L1≤(1 / 4)L0, L3≤(1 / 6)L0; The surface of the support column is provided with an insulating layer, the material of which includes inorganic materials; the sum of the thickness of the support column and the thickness of the insulating layer is less than or equal to half the thickness of the first pad; and / or, the sum of the thickness of the support column and the thickness of the insulating layer is less than or equal to half the thickness of the second pad.

2. The display panel according to claim 1, characterized in that, The material of the support column includes metal.

3. The display panel according to claim 2, characterized in that, The material of the support column is the same as the material of the first pad, or the material of the support column is the same as the material of the second pad.

4. The display panel according to claim 2, characterized in that, The first pad, the second pad, and the support column are made of the same material.

5. The display panel according to any one of claims 1 to 4, characterized in that, The material of the insulating layer includes silicon nitride.

6. The display panel according to claim 1, characterized in that, The angle between the side surface of the support column and the bottom surface of the support column is less than 50 degrees.

7. The display panel according to claim 1, characterized in that, The display panel further includes a driver chip, which is disposed opposite to the bonding portion; the driver chip is electrically connected to the first pad and the second pad via a connecting portion; The distance between the isolation layer and the driver chip is greater than the height of the connection portion.

8. The display panel according to claim 7, characterized in that, The spacing between the isolation layer and the driver chip is greater than or equal to 15 μm.

9. The display panel according to claim 1, characterized in that, The spacing between the first pad and the second pad is less than 200 μm.

10. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1 to 9.

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