Dry etching equipment for silicon wafer and method thereof

Abstract

The invention belongs to the technical field of dry etching, and particularly relates to dry etching equipment for silicon wafers and a method thereof.The dry etching equipment comprises a support and placement assemblies used for bearing the silicon wafers and further comprises a bearing plate, and the placement assemblies are arranged at the two ends of the top of the bearing plate; the rotating assembly is used for driving the bearing plate to rotate, and the rotating assembly is arranged at the bottom end of the support; and the annular grooves are formed in the two ends of the bearing plate correspondingly, and the placing assemblies are located on the inner sides of the annular grooves. The placing assemblies are arranged at the two ends of the top of the bearing plate, and the vacuum assembly used for extracting air in the sealing cover and the etching assembly used for etching the silicon wafers are arranged, so that when one group of silicon wafers is etched, the other group of silicon wafers can be subjected to feeding, discharging and vacuumizing operation, and the efficiency is improved. And the silicon wafer can be continuously etched to a certain extent, so that the etching efficiency of the silicon wafer can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of dry etching, in particular to a dry etching device for silicon wafers and a method thereof. Background Art

[0002] Silicon wafers are important materials for making integrated circuits. Integrated circuits and various semiconductor devices can be made by photolithography, ion implantation and other methods. Silicon wafers are the basic materials of the semiconductor industry and are widely used in electronic equipment, computers, communications and other fields.

[0003] At present, when processing silicon wafers, dry etching is usually performed on the silicon wafers. However, when the existing dry etching equipment is in operation, only one group of silicon wafers can be etched at a time, which results in that only after etching of one group of silicon wafers is completed, another group of silicon wafers can be loaded and etched, which in turn affects the etching efficiency of the silicon wafers. Therefore, a dry etching equipment and method for silicon wafers are invented. Summary of the invention

[0004] In view of the above-mentioned and / or existing problems in a dry etching device and method for a silicon wafer, the present invention is proposed.

[0005] Therefore, the object of the present invention is to provide a dry etching device and method for silicon wafers, which can solve the above-mentioned existing problems.

[0006] To solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0007] A dry etching device for silicon wafers, comprising a support and a placement component for carrying the silicon wafers, and further comprising:

[0008] A carrying plate, with placement components provided at both ends of the top of the carrying plate;

[0009] A rotating assembly for driving the bearing plate to rotate, and the rotating assembly is arranged on the bottom end of the bracket;

[0010] Annular grooves, both ends of the carrier plate are provided with annular grooves, and the placement components are located inside the annular grooves;

[0011] A sealing cover, the bottom end of which is inserted into the annular groove;

[0012] A lifting assembly is used to adjust the height of the sealing cover, and both ends of the top of the bearing plate are provided with lifting assemblies;

[0013] A vacuum assembly for extracting air from the sealing cover, wherein the vacuum assembly is disposed on the left side of the top end of the bracket;

[0014] The etching component is used for etching the silicon wafer, and the etching component is arranged on the right side of the top end of the support.

[0015] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the support comprises:

[0016] Base plate;

[0017] A side panel, the side panel being fixedly mounted on the top right side of the bottom panel;

[0018] A top plate is fixedly mounted on the top of the side plates.

[0019] As a preferred solution of the dry etching device for silicon wafers described in the present invention, the rotating assembly comprises:

[0020] A first box body, the first box body is fixedly mounted on the top of the bottom plate;

[0021] The first servo motor is fixedly mounted in the first box body, and the output shaft of the first servo motor is fixedly mounted on the bearing plate.

[0022] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the placement component includes:

[0023] A placing plate, with both ends of the top of the carrying plate being fixedly mounted with placing plates;

[0024] Light sensors, a plurality of light sensors are fixedly installed on the top of the placement plate;

[0025] A limit frame is fixedly mounted on the top of the placement plate.

[0026] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the lifting assembly comprises:

[0027] A square plate, with both ends of the top of the bearing plate being fixedly mounted with square plates;

[0028] Side panels, both ends of one side of the square plate are fixedly mounted with side panels;

[0029] A screw rod, the screw rod being rotatably connected between the two sets of side plates through a bearing;

[0030] The slider is threadedly connected to the screw rod, and a sealing cover is fixedly installed on one side of the slider.

[0031] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the lifting assembly further comprises:

[0032] A second box body, the second box body is fixedly mounted on a set of side panels;

[0033] A second servo motor, wherein the second servo motor is fixedly installed in the second housing, and an output shaft of the second servo motor is fixedly connected to the screw rod;

[0034] A guide rod is fixedly installed between the two sets of side plates, and a sliding block is slidably connected to the guide rod.

[0035] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the vacuum component comprises:

[0036] A hollow tube with a valve disposed thereon, the hollow tube being fixedly mounted on the top end of the sealing cover;

[0037] A first box body, wherein the first box body is fixedly mounted on the left side of the top plate;

[0038] A first cylinder, wherein the first cylinder is fixedly installed in the first box body;

[0039] A first connecting plate, the first cylinder is fixedly mounted with the first connecting plate via a piston rod;

[0040] A hard tube, the hard tube is fixedly mounted on the bottom of the first connecting plate, and the hollow tube can be inserted into the hard tube;

[0041] A vacuum pump, wherein the vacuum pump is fixedly mounted on the top of the first connecting plate;

[0042] The pipeline is fixedly installed on the air inlet end of the vacuum pump, and one end of the pipeline is arranged on the top side wall of the hard pipe.

[0043] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the etching component comprises:

[0044] A second box body, the second box body is fixedly mounted on the right side of the top plate;

[0045] a second cylinder, the second cylinder being fixedly mounted in the second box body;

[0046] A second connecting plate, the second cylinder is fixedly mounted with the second connecting plate via a piston rod;

[0047] A U-shaped plate, the U-shaped plate being fixedly mounted on the bottom of the second connecting plate;

[0048] A third box body, a plurality of third boxes are fixedly mounted on the U-shaped plate, and a light sensor is disposed directly below the third box body;

[0049] A third cylinder, the third cylinder being fixedly installed in the third box body;

[0050] A cylinder, wherein the third cylinder is fixedly mounted with the cylinder via a piston rod;

[0051] The electrode coil is fixedly mounted on the bottom of the cylinder.

[0052] As a preferred solution of the dry etching equipment for silicon wafers described in the present invention, the etching component further comprises:

[0053] Through holes, a plurality of through holes are opened on the top of the sealing cover, and the through holes are located directly below the electrode coil, and the cylinder can be inserted into the through holes;

[0054] A horizontal plate is fixedly installed in the sealing cover at one side of the through hole;

[0055] A third box body, the third box body is fixedly mounted on the horizontal plate;

[0056] A third servo motor, wherein the third servo motor is fixedly installed in the third box;

[0057] A sealing plate is fixedly mounted on the output shaft of the third servo motor, and the sealing plate is located directly below the through hole and contacts the top end of the inner cavity of the sealing cover.

[0058] A dry etching method for a silicon wafer comprises the following specific steps:

[0059] Step 1: Place the silicon wafer on the placement plate and place the silicon wafer in the limit frame. Then, the screw is rotated by the second servo motor. When the screw rotates, the sealing cover is lowered until the bottom end of the sealing cover is inserted into the annular groove.

[0060] Step 2: The carrier plate is rotated by the first servo motor until the silicon wafer is directly under the vacuum assembly. Then, the hard tube is lowered by the first cylinder until the hollow tube is inserted into the hard tube. After that, the air in the sealing cover can be extracted by the vacuum pump to put the silicon wafer in a vacuum environment. At this time, the hard tube is restored to its original position.

[0061] Step three: The carrier plate is rotated by the first servo motor until the silicon wafer is directly under the etching component. Then, the electrode coil is lowered by the second cylinder. When the bottom end of the cylinder is inserted into the top end of the through hole, the sealing plate is rotated by the third servo motor until the sealing plate is separated from the through hole. At this time, the height of the electrode coil can be adjusted by the third cylinder to etch the silicon wafer. During this process, the etching degree of the silicon wafer will be judged by the light sensor according to the transmittance.

[0062] Compared with existing technologies:

[0063] By arranging placement components at both ends of the top of the carrier plate, and by arranging a vacuum component for extracting the air in the sealing cover and an etching component for etching the silicon wafers, it is possible to achieve loading and unloading and vacuuming operations on another group of silicon wafers while etching one group of silicon wafers, thereby being able to continuously etch the silicon wafers to a certain extent, thereby improving the etching efficiency of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a front view schematic diagram of the structure of the present invention;

[0065] Figure 2 For the present invention Figure 1 A schematic diagram of the structure enlargement in the middle;

[0066] Figure 3 It is a schematic front view of a local structure of the present invention;

[0067] Figure 4 For the present invention Figure 3 A magnified schematic diagram of the structure at B in the middle;

[0068] Figure 5 This is a schematic diagram of the support structure of the present invention;

[0069] Figure 6 It is a schematic diagram of the sealing cover structure of the present invention.

[0070] In the figure: bottom plate 10, side plate 11, top plate 12, bearing plate 20, first box body 21, first servo motor 22, placement plate 30, light sensor 31, limit frame 32, sealing cover 40, annular groove 41, square plate 50, side plate 51, screw 52, ​​slider 53, second box body 54, second servo motor 55, guide rod 56, hollow tube 70, first box body 71, first cylinder 72, first connecting plate 73, hard tube 74, vacuum pump 75, pipeline 76, second box body 80, second cylinder 81, second connecting plate 82, U-shaped plate 83, third box body 84, third cylinder 85, cylinder 86, electrode coil 87, through hole 88, cross plate 89, third box body 891, third servo motor 892, sealing plate 893. DETAILED DESCRIPTION

[0071] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0072] The present invention provides a dry etching device for silicon wafers. Figure 1-Figure 6 , including a bracket and a placement component for carrying the silicon wafer;

[0073] The invention also includes: a carrier plate 20, a rotating assembly for driving the carrier plate 20 to rotate, an annular groove 41, a sealing cover 40, a lifting assembly for adjusting the height of the sealing cover 40, a vacuum assembly for extracting air from the sealing cover 40, and an etching assembly for etching the silicon wafer;

[0074] Placing components are provided at both ends of the top of the carrier plate 20, and the rotating component is arranged on the bottom end of the bracket, annular grooves 41 are opened at both ends of the carrier plate 20, and the placing component is located on the inner side of the annular groove 41, and the bottom end of the sealing cover 40 is inserted into the annular groove 41. A sealing ring can be arranged between the sealing cover 40 and the annular groove 41 as required, and lifting components are provided at both ends of the top of the carrier plate 20, and the vacuum component is arranged on the left side of the top of the bracket, and the etching component is arranged on the right side of the top of the bracket.

[0075] The bracket includes: a bottom plate 10, a side plate 11, and a top plate 12;

[0076] The side plate 11 is fixedly mounted on the top right side of the bottom plate 10 , and the top plate 12 is fixedly mounted on the top of the side plate 11 .

[0077] The rotating assembly includes: a first box body 21, a first servo motor 22;

[0078] The first box body 21 is fixedly mounted on the top of the bottom plate 10 , the first servo motor 22 is fixedly mounted in the first box body 21 , and the output shaft of the first servo motor 22 is fixedly mounted on the supporting plate 20 .

[0079] The placement component includes: a placement plate 30, a light sensor 31, and a limit frame 32;

[0080] The two ends of the top of the carrying plate 20 are fixedly mounted with a placing plate 30 , a plurality of light sensors 31 are fixedly mounted on the top of the placing plate 30 , and a limiting frame 32 is fixedly mounted on the top of the placing plate 30 .

[0081] The lifting assembly includes: a square plate 50, a side plate 51, a screw rod 52, a slider 53, a second box 54, a second servo motor 55, and a guide rod 56;

[0082] Square plates 50 are fixedly installed at both ends of the top of the supporting plate 20, side plates 51 are fixedly installed at both ends of one side of the square plate 50, the screw 52 is rotatably connected between the two groups of side plates 51 through a bearing, the slider 53 is threadedly connected to the screw 52, ​​and a sealing cover 40 is fixedly installed on one side of the slider 53, the second box body 54 is fixedly installed on a group of side plates 51, the second servo motor 55 is fixedly installed in the second box body 54, and the output shaft of the second servo motor 55 is fixedly connected to the screw 52, ​​the guide rod 56 is fixedly installed between the two groups of side plates 51, and the slider 53 is slidably connected to the guide rod 56.

[0083] The vacuum assembly includes: a hollow tube 70 with a valve thereon, a first box body 71, a first cylinder 72, a first connecting plate 73, a hard tube 74, a vacuum pump 75, and a pipeline 76;

[0084] The hollow tube 70 is fixedly mounted on the top of the sealing cover 40, the first box body 71 is fixedly mounted on the left side of the top plate 12, the first cylinder 72 is fixedly mounted in the first box body 71, the first cylinder 72 is fixedly mounted on the first connecting plate 73 through a piston rod, the hard tube 74 is fixedly mounted on the bottom of the first connecting plate 73, and the hollow tube 70 can be inserted into the hard tube 74, and a sealing ring can be arranged between the hollow tube 70 and the hard tube 74 as required, the vacuum pump 75 is fixedly mounted on the top of the first connecting plate 73, the pipe 76 is fixedly mounted on the air inlet end of the vacuum pump 75, and one end of the pipe 76 is arranged on the top side wall of the hard tube 74.

[0085] The etching assembly includes: a second box body 80, a second cylinder 81, a second connecting plate 82, a U-shaped plate 83, a third box body 84, a third cylinder 85, a cylinder 86, an electrode coil 87, a through hole 88, a horizontal plate 89, a third box body 891, a third servo motor 892, and a sealing plate 893;

[0086] The second box body 80 is fixedly mounted on the right side of the top plate 12, the second cylinder 81 is fixedly mounted in the second box body 80, the second cylinder 81 is fixedly mounted on the second connecting plate 82 through a piston rod, the U-shaped plate 83 is fixedly mounted on the bottom of the second connecting plate 82, a plurality of third boxes 84 are fixedly mounted on the U-shaped plate 83, and a light sensor 31 is provided directly below the third box body 84, the third cylinder 85 is fixedly mounted in the third box body 84, the third cylinder 85 is fixedly mounted on the cylinder 86 through a piston rod, the electrode coil 87 is fixedly mounted on the bottom of the cylinder 86, and the top of the sealing cover 40 A plurality of through holes 88 are provided, and the through holes 88 are located directly below the electrode coil 87, and the cylinder 86 can be inserted into the through holes 88. A sealing ring can be provided between the cylinder 86 and the through holes 88 as required. A transverse plate 89 is fixedly installed in the sealing cover 40 on one side of the through holes 88, a third box body 891 is fixedly installed on the transverse plate 89, a third servo motor 892 is fixedly installed in the third box body 891, a sealing plate 893 is fixedly installed on the output shaft of the third servo motor 892, and the sealing plate 893 is located directly below the through holes 88 and contacts with the top of the inner cavity of the sealing cover 40.

[0087] A dry etching method for a silicon wafer comprises the following specific steps:

[0088] Step 1: Place the silicon wafer on the placement plate 30 and place the silicon wafer in the limit frame 32. Then, the screw 52 is rotated by the second servo motor 55. When the screw 52 rotates, the sealing cover 40 is lowered until the bottom end of the sealing cover 40 is inserted into the annular groove 41.

[0089] Step 2: The carrier plate 20 is rotated by the first servo motor 22 until the silicon wafer is located directly below the vacuum assembly. Then, the hard tube 74 is lowered by the first cylinder 72 until the hollow tube 70 is inserted into the hard tube 74. After that, the air in the sealing cover 40 can be extracted by the vacuum pump 75 to put the silicon wafer in a vacuum environment. At this time, the hard tube 74 is restored to its original position.

[0090] Step three: The carrier plate 20 is rotated by the first servo motor 22 until the silicon wafer is located directly below the etching component. Then, the electrode coil 87 is lowered by the second cylinder 81. When the bottom end of the cylinder 86 is inserted into the top end of the through hole 88, the sealing plate 893 is rotated by the third servo motor 892 until the sealing plate 893 is separated from the through hole 88. At this time, the height of the electrode coil 87 can be adjusted by the third cylinder 85 to enable etching of the silicon wafer. During this process, the etching degree of the silicon wafer is judged by the light sensor 31 according to the transmittance.

[0091] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A dry etching device for silicon wafers, comprising a support and a placement component for carrying the silicon wafer, characterized in that: Also includes: A carrying plate (20), with placement components provided at both ends of the top of the carrying plate (20); A rotating assembly used for driving the carrying plate (20) to rotate, and the rotating assembly is arranged on the bottom end of the bracket; An annular groove (41), both ends of the carrier plate (20) are provided with an annular groove (41), and the placement component is located inside the annular groove (41); A sealing cover (40), wherein the bottom end of the sealing cover (40) is inserted into the annular groove (41); A lifting assembly for adjusting the height of the sealing cover (40), with the lifting assemblies being provided at both ends of the top of the carrying plate (20); A vacuum component for extracting air from the sealing cover (40), wherein the vacuum component is arranged on the left side of the top end of the bracket; The etching component is used for etching the silicon wafer, and the etching component is arranged on the right side of the top end of the support.

2. The dry etching device for silicon wafer according to claim 1, characterized in that: The support comprises: Bottom plate (10); A side plate (11), the side plate (11) being fixedly mounted on the top right side of the bottom plate (10); A top plate (12), wherein the top plate (12) is fixedly mounted on the top of the side plate (11).

3. The dry etching device for silicon wafer according to claim 1, characterized in that: The rotating assembly comprises: A first box (21), the first box (21) is fixedly mounted on the top of the bottom plate (10); A first servo motor (22), wherein the first servo motor (22) is fixedly mounted in the first box body (21), and an output shaft of the first servo motor (22) is fixedly mounted on the bearing plate (20).

4. The dry etching device for silicon wafer according to claim 1, characterized in that: The placement component comprises: A placement plate (30), the placement plates (30) being fixedly mounted on both ends of the top of the carrier plate (20); Light sensors (31), a plurality of light sensors (31) are fixedly mounted on the top of the placement plate (30); A limiting frame (32) is fixedly mounted on the top of the placement plate (30).

5. The dry etching device for silicon wafer according to claim 1, characterized in that: The lifting assembly comprises: A square plate (50), the square plates (50) being fixedly mounted on both ends of the top of the bearing plate (20); A side plate (51), with the side plates (51) being fixedly mounted on both ends of one side of the square plate (50); A screw rod (52), wherein the screw rod (52) is rotatably connected between the two sets of side plates (51) via a bearing; A slider (53) is threadedly connected to the screw rod (52), and a sealing cover (40) is fixedly mounted on one side of the slider (53).

6. The dry etching device for silicon wafer according to claim 5, characterized in that: The lifting assembly also includes: A second box body (54), wherein the second box body (54) is fixedly mounted on a set of side panels (51); A second servo motor (55), wherein the second servo motor (55) is fixedly installed in the second box (54), and an output shaft of the second servo motor (55) is fixedly connected to the screw rod (52); A guide rod (56) is fixedly installed between the two sets of side plates (51), and a slider (53) is slidably connected to the guide rod (56).

7. The dry etching device for silicon wafer according to claim 2, characterized in that: The vacuum assembly comprises: A hollow tube (70) having a valve thereon, wherein the hollow tube (70) is fixedly mounted on the top end of the sealing cover (40); A first box body (71), the first box body (71) is fixedly mounted on the left side of the top plate (12); A first cylinder (72), wherein the first cylinder (72) is fixedly installed in the first box body (71); A first connecting plate (73), the first cylinder (72) being fixedly mounted with the first connecting plate (73) via a piston rod; A hard tube (74), wherein the hard tube (74) is fixedly mounted on the bottom of the first connecting plate (73), and the hollow tube (70) can be inserted into the hard tube (74); A vacuum pump (75), wherein the vacuum pump (75) is fixedly mounted on the top of the first connecting plate (73); A pipeline (76) is fixedly installed on the air inlet end of the vacuum pump (75), and one end of the pipeline (76) is arranged on the top side wall of the hard pipe (74).

8. The dry etching device for silicon wafer according to claim 2, characterized in that: The etching assembly comprises: A second box body (80), the second box body (80) is fixedly mounted on the right side of the top plate (12); A second cylinder (81), the second cylinder (81) being fixedly installed in the second box body (80); A second connecting plate (82), the second cylinder (81) being fixedly mounted with the second connecting plate (82) via a piston rod; A U-shaped plate (83), wherein the U-shaped plate (83) is fixedly mounted on the bottom of the second connecting plate (82); A third box body (84), a plurality of third box bodies (84) are fixedly mounted on the U-shaped plate (83), and a light sensor (31) is disposed directly below the third box body (84); A third cylinder (85), wherein the third cylinder (85) is fixedly installed in the third box body (84); A cylinder (86), wherein the third cylinder (85) is fixedly mounted on the cylinder (86) via a piston rod; The electrode coil (87) is fixedly mounted on the bottom of the cylinder (86).

9. The dry etching device for silicon wafer according to claim 8, characterized in that: The etching assembly also includes: Through holes (88), the top of the sealing cover (40) is provided with a plurality of through holes (88), and the through holes (88) are located directly below the electrode coil (87), and the cylinder (86) can be inserted into the through holes (88); A transverse plate (89) is fixedly installed in the sealing cover (40) at one side of the through hole (88); A third box (891), wherein the third box (891) is fixedly mounted on the transverse plate (89); A third servo motor (892), wherein the third servo motor (892) is fixedly installed in the third box (891); A sealing plate (893), wherein the sealing plate (893) is fixedly mounted on the output shaft of the third servo motor (892), and the sealing plate (893) is located directly below the through hole (88) and in contact with the top end of the inner cavity of the sealing cover (40).

10. A dry etching method for a silicon wafer, characterized in that: The specific steps are as follows: Step 1: placing a silicon wafer on a placement plate (30) and placing the silicon wafer in a limiting frame (32), and then rotating the screw rod (52) by a second servo motor (55), so that the sealing cover (40) is lowered when the screw rod (52) rotates until the bottom end of the sealing cover (40) is inserted into the annular groove (41); Step 2: The carrier plate (20) is rotated by the first servo motor (22) until the silicon wafer is located directly below the vacuum assembly. Then, the hard tube (74) is lowered by the first cylinder (72) until the hollow tube (70) is inserted into the hard tube (74). After that, the air in the sealing cover (40) can be extracted by the vacuum pump (75) to place the silicon wafer in a vacuum environment. At this time, the hard tube (74) is restored to its original position. Step 3: The carrier plate (20) is rotated by the first servo motor (22) until the silicon wafer is located directly below the etching assembly. Then, the electrode coil (87) is lowered by the second cylinder (81). When the bottom end of the cylinder (86) is inserted into the top end of the through hole (88), the sealing plate (893) is rotated by the third servo motor (892) until the sealing plate (893) is separated from the through hole (88). At this time, the height of the electrode coil (87) can be adjusted by the third cylinder (85) to enable etching of the silicon wafer. During this process, the etching degree of the silicon wafer is judged according to the transmittance by the light sensor (31).

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