A GaN sealed device

Abstract

The present invention discloses a GaN sealed device, which relates to the technical field of semiconductor devices, and includes: a first packaging shell and a second packaging shell arranged on the top of the first packaging shell; a GaN chip, wherein the GaN chip is installed inside the first packaging shell and the second packaging shell. The present invention provides an exhaust mechanism, and when the first packaging shell and the second packaging shell are packaged, the staff can respectively screw the bolts with a screwdriver, so that the two metal piston plates move toward the GaN chip, thereby exhausting the gas inside the first packaging shell and the second packaging shell to the outside, thereby reducing the gas content inside the first packaging shell and the second packaging shell after packaging, thereby reducing the obstruction of the low thermal conductivity air to heat conduction, thereby improving the overall heat dissipation efficiency of the device.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor devices, in particular to a GaN sealed device. Background Art

[0002] GaN on-package devices are highly integrated power electronic devices. GaN on-package devices usually include components such as main control MUC (micro control unit), flyback controller, GaN driver and GaN switch tube, which are integrated into one package.

[0003] According to the announcement number "CN 117080182 A" published on the China Patent Network, it is a "GaN packaged device", including: a frame; a cascaded GaN HEMT device; the GaN HEMT device includes a SiMOSFET arranged on a first base island, a GaN HEMT arranged on a second base island and cascaded with the SiMOSFET; a flip-chip control chip; multiple pins of the control chip are connected to the gate of the cascaded GaN HEMT device and the third base island through copper pillars; a ceramic substrate arranged above the cascaded GaN HEMT device and the control chip; a first copper layer corresponding to the cascaded GaN HEMT device is arranged on the lower surface of the ceramic substrate; a plastic packaging material; the upper surface of the ceramic substrate is exposed outside the plastic packaging material. The technical solution disclosed in this application realizes double-sided heat dissipation through the top copper-clad ceramic substrate and the bottom frame, thereby improving the heat dissipation efficiency of the GaN packaged device, reducing internal heat accumulation, and improving the reliability of the GaN packaged device.

[0004] Although the above patent can improve the heat dissipation efficiency of GaN sealed devices, the above patent still has the following problems: Since the existing GaN sealed devices are packaged by two shells, the packaged GaN sealed devices contain a large amount of air. During the packaging process, the air inside the device will expand as the temperature rises, generating gas pressure. Since GaN devices usually need to work in high temperature and high power environments, the thermal expansion of the air will impose additional mechanical stress on the shell and chip, thereby reducing the service life of the electrical components inside the device. For this reason, we provide a GaN sealed device to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a GaN sealed device in order to solve the problem that a large amount of air is contained inside the GaN sealed device after packaging so that the internal heat cannot be quickly dissipated during use.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a GaN sealed device, comprising: a first packaging shell and a second packaging shell arranged on the top of the first packaging shell; a GaN chip, the GaN chip is installed inside the first packaging shell and the second packaging shell, pins are arranged on both sides of the GaN chip, and the pins extend from the inside of the first packaging shell and the second packaging shell to the outside; an exhaust mechanism, located inside the first packaging shell and the second packaging shell, and used to reduce the air inside the first packaging shell and the second packaging shell; a sealer, located between the first packaging shell and the second packaging shell, and used to seal the pins and the first packaging shell and the second packaging shell; a release component, located between the first packaging shell and the second packaging shell, and used to cooperate with the exhaust mechanism to reduce the air inside the first packaging shell and the second packaging shell.

[0007] As a further solution of the present invention: the exhaust mechanism includes metal piston plates respectively installed inside the first packaging shell and the second packaging shell, the inner side of the first packaging shell and the second packaging shell are both threadedly connected with a bolt, and the bottom of the bolt is rotatably connected to the metal piston plate, and the interior of the first packaging shell and the second packaging shell are both provided with a thread groove matching the bolt.

[0008] As a further solution of the present invention: the sealer includes a sealing shell fixedly connected to the inner sides of the first packaging shell and the second packaging shell, the sealing shells symmetrically arranged up and down are arranged as a group, a first groove is opened on the inner side of the sealing shell, a sealing rubber is installed on the inner side of the first groove, the sealing rubber is adhered to the outer wall of the pin, the inner sides of the first packaging shell and the second packaging shell are both opened with an air guide groove communicating with the first groove, and a glue injection component is arranged inside the sealing shell to assist the sealing rubber in sealing.

[0009] As a further solution of the present invention: the glue injection assembly includes a second groove opened on the inner side of the sealing shell, a glue injection rubber sleeve is installed inside the second groove, a gap groove is arranged between one side of the glue injection rubber sleeve and the side wall of the second groove, and a first micro one-way valve connecting the second groove and the first groove is installed on the inner side of the sealing shell.

[0010] As a further solution of the present invention: the glue injection assembly also includes a first piston sleeve fixedly connected to the inner side of the second groove, a first air inlet pipe is installed at the air inlet of the first piston sleeve, a first piston rod is slidably connected to the interior of the first piston sleeve, and one end of the first piston rod extends to the interior of the second groove and is fixedly connected to a first piston block, and a puncture cone is fixedly connected to the inner side of the first piston block.

[0011] As a further solution of the present invention: the release component includes a third groove opened on the inner side of the sealing shell, an inert gas rubber sleeve is installed inside the third groove, and a gap is left between one side of the inert gas rubber sleeve and the side wall of the third groove.

[0012] As a further solution of the present invention: the release assembly also includes a second piston sleeve fixedly connected to the inner side of the third groove, a second air inlet pipe is installed at the air inlet of the second piston sleeve, a second piston rod is slidably connected to the interior of the second piston sleeve, one end of the second piston rod extends to the interior of the third groove and is fixedly connected to a second piston block, a second micro one-way valve is fixedly connected to the air outlet of the first piston sleeve, and one end of the second micro one-way valve extends to the interior of the third groove.

[0013] As a further solution of the present invention: a third one-way valve is fixedly connected to the air outlet of the second piston sleeve, one end of the third one-way valve is fixedly connected to an exhaust pipe, and one end of the exhaust pipe passes through the end of the sealing shell and communicates with the outside, and the air inlet of the third one-way valve is communicated with the interior of the second piston sleeve.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. By setting up an exhaust mechanism, after the first packaging shell and the second packaging shell are packaged, the staff can respectively tighten the bolts with a screwdriver, so that the two metal piston plates move toward the GaN chip, thereby discharging the gas inside the first packaging shell and the second packaging shell to the outside, thereby reducing the internal gas content of the first packaging shell and the second packaging shell after packaging, thereby reducing the obstruction of low thermal conductivity air to heat conduction, thereby improving the overall heat dissipation efficiency of the device;

[0016] 2. By setting the cooperation of parts such as metal piston plates, when the bolts are screwed into the designated position and embedded in the inner side of the first packaging shell and the second packaging shell, the two metal piston plates are respectively attached to the upper and lower ends of the GaN chip. Since the GaN chip generates a lot of heat during operation, especially in high-frequency and high-power scenarios, the metal piston plates have good thermal conductivity, such as copper or aluminum, and directly contact the top and bottom of the GaN chip, which can quickly export the heat to the external environment. At the same time, the two metal piston plates are pressed against the top and bottom of the GaN chip as physical supports, which can avoid displacement or deformation of the GaN chip caused by external force or thermal expansion.

[0017] 3. By setting up the cooperation of parts such as the sealing shell, the first packaging shell and the second packaging shell are symmetrically arranged in the upper and lower parts after packaging, so that the sealing rubber arranged inside forms an annular seal and fits the outer wall of the pin. When the metal piston plate moves toward the GaN chip, the internal gas of the first packaging shell and the second packaging shell is squeezed into the first groove through the gas guide groove, so that the sealing rubber is squeezed and shrinks toward the pin direction, so that the sealing rubber arranged in an annular manner forms a seal between the pins, thereby improving the overall sealing effect of the device after packaging;

[0018] 4. By arranging the cooperation of the first micro-check valve and other parts, when the gas enters the first groove and squeezes the sealing rubber to the maximum, the sealing rubber moves away from one side of the first micro-check valve, so that the gas in the first groove can enter the second groove through the first micro-check valve, and then the gas can enter the first piston sleeve through the first air inlet pipe, thereby pushing the first piston rod to drive the puncture cone to move toward the injection rubber sleeve through the first piston block, and the injection rubber sleeve is punctured by the puncture cone. When the injection rubber sleeve is punctured, the extrusion formed by the first piston block can make the glue in the injection rubber sleeve flow along the gap groove to the gap between the pin and the sealing shell, so as to perform a secondary sealing operation after the sealing rubber is sealed, thereby improving the sealing performance of the device after the overall packaging;

[0019] 5. By arranging the cooperation of the second piston block and other parts, a puncture cone is also installed on one side of the second piston block near the gap between the inert gas rubber sleeve and the third groove. When the first piston rod moves to the maximum position, one side of the first piston rod is misaligned with the second micro-one-way valve, so that the internal gas of the first piston sleeve can enter the third groove through the second micro-one-way valve, and then enter the second piston sleeve through the second air inlet pipe, thereby pushing the second piston rod to drive the puncture cone to move toward the inert gas rubber sleeve through the second piston block, thereby puncturing the inert gas rubber sleeve. When the inert gas rubber sleeve is punctured, the inert gas inside it is released and enters into the first packaging shell and the second packaging shell along the gap between the pin and the sealing shell. The released inert gas such as nitrogen or argon can effectively replace the air inside the packaging shell, especially the oxygen and moisture therein, to form a low-oxygen, low-humidity inert environment, avoiding the GaN chip and its welding points and wires from contact with oxygen, reducing the risk of oxidation and corrosion. At the same time, the thermal conductivity of the inert gas is usually better than that of air, especially at high temperatures, and can better conduct the heat generated by the GaN chip to the outside of the packaging shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present invention;

[0021] Figure 2 It is a cross-sectional view of the first packaging shell and the second packaging shell of the present invention;

[0022] Figure 3 It is a schematic diagram of the inner structure of the first packaging shell and the second packaging shell of the present invention;

[0023] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0024] Figure 5 It is a schematic diagram of the partial structure of the first packaging shell of the present invention;

[0025] Figure 6 It is a schematic diagram of the sealing shell structure of the present invention;

[0026] Figure 7 For the present invention Figure 6 Enlarged view of point B in the middle;

[0027] Figure 8 It is a cross-sectional view of the first piston sleeve and the second piston sleeve of the present invention;

[0028] Fig. 9 For the present invention Figure 8 Enlarged view of point C in the middle;

[0029] Fig.10 It is a schematic diagram of the inner structure of the first piston block of the present invention.

[0030] In the figure: 1. first packaging shell; 2. second packaging shell; 3. bolt; 4. pin; 5. sealing shell; 6. GaN chip; 7. metal piston plate; 8. sealing rubber; 9. air guide groove; 10. first groove; 11. injection rubber sleeve; 12. inert gas rubber sleeve; 13. second groove; 14. third groove; 15. first piston sleeve; 16. first micro one-way valve; 17. second micro one-way valve; 18. first piston block; 19. first piston rod; 20. clearance groove; 21. second piston sleeve; 22. exhaust pipe; 23. second piston block; 24. second piston rod; 25. third one-way valve; 26. first air intake pipe; 27. second air intake pipe; 28. puncture cone. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0033] Example 1, please refer to Figures 1 to 10The present embodiment provides a GaN sealed device, comprising: a first packaging shell 1 and a second packaging shell 2 arranged on the top of the first packaging shell 1; a GaN chip 6, the GaN chip 6 is installed inside the first packaging shell 1 and the second packaging shell 2, pins 4 are arranged on both sides of the GaN chip 6, and the pins 4 extend from the inside of the first packaging shell 1 and the second packaging shell 2 to the outside; an exhaust mechanism, located inside the first packaging shell 1 and the second packaging shell 2, for reducing the air inside the first packaging shell 1 and the second packaging shell 2, the exhaust mechanism comprises a metal piston plate 7 respectively installed inside the first packaging shell 1 and the second packaging shell 2, the inner side of the first packaging shell 1 and the second packaging shell 2 are both threadedly connected with a bolt 3, and the bottom of the bolt 3 is rotatably connected to the metal piston plate 7, and the inside of the first packaging shell 1 and the second packaging shell 2 are both provided with a thread groove matching the bolt 3;

[0034] First, after the first packaging shell 1 and the second packaging shell 2 are packaged, the staff can use a screwdriver to respectively tighten the bolts 3, so that the two metal piston plates 7 move toward the GaN chip 6, so as to discharge the gas inside the first packaging shell 1 and the second packaging shell 2 to the outside, thereby reducing the gas content inside the first packaging shell 1 and the second packaging shell 2 after packaging, thereby reducing the obstacle of low thermal conductivity air to heat conduction, thereby improving the overall heat dissipation efficiency of the device;

[0035] After the bolt 3 is screwed into the designated position and embedded in the inner side of the first packaging shell 1 and the second packaging shell 2, the two metal piston plates 7 are respectively attached to the upper and lower ends of the GaN chip 6. Since the GaN chip 6 will generate a lot of heat during operation, especially in high-frequency and high-power scenarios, the metal piston plate 7 has good thermal conductivity, such as being made of copper or aluminum, and directly contacts the top and bottom of the GaN chip 6, which can quickly conduct heat to the external environment. At the same time, the two metal piston plates 7 act as physical supports, pressed tightly against the top and bottom of the GaN chip 6, to avoid displacement or deformation of the GaN chip 6 due to external force or thermal expansion.

[0036] Embodiment 2, a sealer, located between the first packaging shell 1 and the second packaging shell 2, is used to seal the pin 4 and the first packaging shell 1 and the second packaging shell 2, the sealer includes a sealing shell 5 fixedly connected to the inner side of the first packaging shell 1 and the second packaging shell 2, the sealing shells 5 symmetrically arranged up and down are arranged as a group, the inner side of the sealing shell 5 is provided with a first groove 10, the inner side of the first groove 10 is installed with a sealing rubber 8, the sealing rubber 8 is attached to the outer wall of the pin 4, the inner side of the first packaging shell 1 and the second packaging shell 2 are both provided with an air guide groove 9 communicating with the first groove 10, the interior of the sealing shell 5 is provided with a glue injection component for assisting the sealing rubber 8 to perform sealing, the glue injection component includes a sealing groove 10 provided in the sealing shell 5, a second groove 13 inside the second groove 13 is installed with a glue injection rubber sleeve 11, a gap groove 20 is arranged between one side of the glue injection rubber sleeve 11 and the side wall of the second groove 13, a first micro one-way valve 16 connecting the second groove 13 and the first groove 10 is installed on the inner side of the sealing shell 5, the glue injection assembly also includes a first piston sleeve 15 fixedly connected to the inner side of the second groove 13, a first air inlet pipe 26 is installed at the air inlet of the first piston sleeve 15, a first piston rod 19 is slidably connected to the inside of the first piston sleeve 15, and one end of the first piston rod 19 extends to the inside of the second groove 13 and is fixedly connected to a first piston block 18, and a puncture cone 28 is fixedly connected to the inner side of the first piston block 18;

[0037] After packaging, the first packaging shell 1 and the second packaging shell 2 are located in the sealing shell 5 symmetrically arranged above and below and are attached together, so that the sealing rubber 8 arranged inside forms an annular seal and is attached to the outer wall of the pin 4. When the metal piston plate 7 moves toward the GaN chip 6, the internal gas of the first packaging shell 1 and the second packaging shell 2 is squeezed into the first groove 10 through the gas guide groove 9, so that the sealing rubber 8 is squeezed and shrinks toward the pin 4, so that the sealing rubber 8 arranged in an annular manner forms a seal between the pins 4, thereby improving the overall sealing effect of the device after packaging;

[0038] The inside of the injection rubber sleeve 11 is set as a hollow structure, and the inside of the hollow structure is filled with glue. The first micro-one-way valve 16 is symmetrically arranged with the central axis of the sealing shell 5. The gap groove 20 is set in a U shape. The second groove 13 is opened on both sides of the injection rubber sleeve 11, and the injection rubber sleeve 11 is set in a U shape. The size of the first piston block 18 matches the second groove 13. When the gas enters the first groove 10 and squeezes the sealing rubber 8 to the maximum, the sealing rubber 8 moves away from one side of the first micro-one-way valve 16, so that the gas inside the first groove 10 can enter the second groove through the first micro-one-way valve 16. 13, and then the gas can enter the first piston sleeve 15 through the first air inlet pipe 26, so as to push the first piston rod 19 to drive the puncture cone 28 to move toward the injection rubber sleeve 11 through the first piston block 18, and the injection rubber sleeve 11 is punctured by the puncture cone 28. When the injection rubber sleeve 11 is punctured, the extrusion formed by the first piston block 18 can make the glue inside the injection rubber sleeve 11 flow along the gap groove 20 to the gap between the pin 4 and the sealing shell 5, so as to perform a secondary sealing operation after the sealing rubber 8 is sealed, thereby improving the sealing performance of the device after the overall packaging.

[0039] Embodiment 3, a release assembly, located between the first packaging shell 1 and the second packaging shell 2, is used to cooperate with the exhaust mechanism to reduce the air inside the first packaging shell 1 and the second packaging shell 2, the release assembly includes a third groove 14 opened on the inner side of the sealing shell 5, an inert gas rubber sleeve 12 is installed inside the third groove 14, and a gap is left between one side of the inert gas rubber sleeve 12 and the side wall of the third groove 14, the release assembly also includes a second piston sleeve 21 fixedly connected to the inner side of the third groove 14, a second intake pipe 27 is installed at the air inlet of the second piston sleeve 21, and the inner sliding part of the second piston sleeve 21 is provided with a second intake pipe 27. A second piston rod 24 is dynamically connected, one end of the second piston rod 24 extends to the inside of the third groove 14 and is fixedly connected to a second piston block 23, a second micro one-way valve 17 is fixedly connected to the air outlet of the first piston sleeve 15, and one end of the second micro one-way valve 17 extends to the inside of the third groove 14, a third one-way valve 25 is fixedly connected to the air outlet of the second piston sleeve 21, one end of the third one-way valve 25 is fixedly connected to an exhaust pipe 22, and one end of the exhaust pipe 22 passes through the end of the sealing shell 5 and communicates with the outside, and the air inlet of the third one-way valve 25 is communicated with the inside of the second piston sleeve 21;

[0040] The interior of the inert gas rubber sleeve 12 is set as a hollow structure, and the interior of the hollow structure is filled with inert gas. A puncture cone 28 is also installed on one side of the second piston block 23 near the gap between the inert gas rubber sleeve 12 and the third groove 14. When the first piston rod 19 moves to the maximum position, one side of the first piston rod 19 is misaligned with the second micro-one-way valve 17, so that the internal gas of the first piston sleeve 15 can enter the third groove 14 through the second micro-one-way valve 17, and then enter the second piston sleeve 21 through the second air inlet pipe 27, thereby pushing the second piston rod 24 to drive the puncture cone 28 to move toward the inert gas rubber sleeve 12 through the second piston block 23. The inert gas rubber sleeve 12 is moved, thereby puncturing the inert gas rubber sleeve 12. When the inert gas rubber sleeve 12 is punctured, the inert gas inside it is released and enters the first packaging shell 1 and the second packaging shell 2 along the gap between the pin 4 and the sealing shell 5. The released inert gas, such as nitrogen or argon, can effectively replace the air inside the packaging shell, especially the oxygen and moisture therein, to form a low-oxygen, low-humidity inert environment, thereby preventing the GaN chip 6 and its welding points and wires from contacting with oxygen, reducing the risk of oxidation and corrosion. At the same time, the thermal conductivity of the inert gas is usually better than that of air, especially at high temperatures, and can better conduct the heat generated by the GaN chip 6 to the outside of the packaging shell;

[0041] In order to improve the propulsion effect of the gas, the first micro-one-way valve 16 can be connected to the first air intake pipe 26 through a pipeline, so that the gas can directly enter the first piston sleeve 15. Similarly, the second micro-one-way valve 17 can be connected to the second air intake pipe 27 through a pipeline. When the second piston rod 24 moves to the maximum position, the second piston rod 24 and the third one-way valve 25 are misaligned, so that the gas entering the second piston sleeve 21 can be discharged to the outside through the third one-way valve 25 and the exhaust pipe 22.

[0042] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A GaN sealed device, characterized in that: include: A first packaging shell (1) and a second packaging shell (2) arranged on top of the first packaging shell (1); A GaN chip (6), the GaN chip (6) being mounted inside the first packaging shell (1) and the second packaging shell (2), pins (4) being provided on both sides of the GaN chip (6), and the pins (4) extending from inside the first packaging shell (1) and the second packaging shell (2) to the outside; An exhaust mechanism, located inside the first encapsulating shell (1) and the second encapsulating shell (2), and used to reduce the air inside the first encapsulating shell (1) and the second encapsulating shell (2); A sealer is located between the first packaging shell (1) and the second packaging shell (2), and is used to seal the pin (4) and the first packaging shell (1) and the second packaging shell (2), the sealer comprising a sealing shell (5), a sealing rubber (8) and a first groove (10), and a glue injection component is provided inside the sealing shell (5) to assist the sealing rubber (8) in sealing; A release component, located between the first encapsulating shell (1) and the second encapsulating shell (2), and used to cooperate with the exhaust mechanism to reduce the air inside the first encapsulating shell (1) and the second encapsulating shell (2); The glue injection assembly comprises a second groove (13) provided on the inner side of the sealing shell (5); a glue injection rubber sleeve (11) is installed inside the second groove (13); a clearance groove (20) is provided between one side of the glue injection rubber sleeve (11) and a side wall of the second groove (13); and a first micro one-way valve (16) connecting the second groove (13) and the first groove (10) is installed on the inner side of the sealing shell (5); The glue injection assembly also includes a first piston sleeve (15) fixedly connected to the inner side of the second groove (13); a first air inlet pipe (26) is installed at the air inlet of the first piston sleeve (15); a first piston rod (19) is slidably connected to the interior of the first piston sleeve (15); one end of the first piston rod (19) extends to the interior of the second groove (13) and is fixedly connected to a first piston block (18); a puncturing cone (28) is fixedly connected to the inner side of the first piston block (18).

2. A GaN sealed device according to claim 1, characterized in that: The exhaust mechanism comprises a metal piston plate (7) respectively installed inside the first encapsulating shell (1) and the second encapsulating shell (2); the inner side of each of the first encapsulating shell (1) and the second encapsulating shell (2) is threadedly connected with a bolt (3); the bottom of the bolt (3) is rotatably connected to the metal piston plate (7); and the inside of each of the first encapsulating shell (1) and the second encapsulating shell (2) is provided with a thread groove matching the bolt (3).

3. A GaN sealed device according to claim 2, characterized in that: The sealer comprises a sealing shell (5) fixedly connected to the inner side of the first packaging shell (1) and the second packaging shell (2); the sealing shells (5) symmetrically arranged up and down are arranged as a group; a first groove (10) is provided on the inner side of the sealing shell (5); a sealing rubber (8) is installed on the inner side of the first groove (10); the sealing rubber (8) is attached to the outer wall of the pin (4); and an air guide groove (9) communicating with the first groove (10) is provided on the inner side of the first packaging shell (1) and the second packaging shell (2).

4. The GaN sealed device according to claim 3, characterized in that: The release assembly comprises a third groove (14) opened on the inner side of the sealing shell (5), an inert gas rubber sleeve (12) is installed inside the third groove (14), and a gap is left between one side of the inert gas rubber sleeve (12) and the side wall of the third groove (14).

5. The GaN sealed device according to claim 4, characterized in that: The release assembly also includes a second piston sleeve (21) fixedly connected to the inner side of the third groove (14); a second air inlet pipe (27) is installed at the air inlet of the second piston sleeve (21); a second piston rod (24) is slidably connected to the interior of the second piston sleeve (21); one end of the second piston rod (24) extends to the interior of the third groove (14) and is fixedly connected to a second piston block (23); a second micro one-way valve (17) is fixedly connected to the air outlet of the first piston sleeve (15), and one end of the second micro one-way valve (17) extends to the interior of the third groove (14).

6. The GaN sealed device according to claim 5, characterized in that: A third one-way valve (25) is fixedly connected to the air outlet of the second piston sleeve (21), one end of the third one-way valve (25) is fixedly connected to an exhaust pipe (22), and one end of the exhaust pipe (22) passes through the end of the sealing shell (5) and communicates with the outside, and the air inlet of the third one-way valve (25) is communicated with the interior of the second piston sleeve (21).

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