High-integration active comprehensive feed module

Abstract

The invention discloses a high-integration active comprehensive feed module, which comprises 37 LRM connectors, 2 HJ30J connectors, 7 passive multilayer boards, 5 groups of active networks and corresponding interconnection lines among internal modules / connectors, and the 37 LRM connectors and the 2 HJ30J connectors realize a radio frequency signal and low frequency signal interconnection function with an external module; the seven passive multilayer boards are divided into two architectures, namely a digital-analog hybrid board and a digital multilayer board, wherein the digital-analog hybrid board is integrated with a plurality of passive power dividers and low-frequency signal wires; the five groups of active networks are divided into a power division amplification type and a power division amplification switch type. According to the invention, by adding the passive multilayer board and the active network in the comprehensive feed network, the advantages of high integration level, small signal crosstalk, good amplitude-phase consistency, flexible configuration, simple and reliable structure and the like are realized, and the working requirements of flexible comprehensive feed of a large-scale phased array plane are met.

Description

Technical Field

[0001] The invention relates to the field of multifunctional active phased arrays, in particular to a highly integrated active integrated feeding module. Background Art

[0002] The integrated feed module is the core component of the active phased array. It is a transmission network that provides RF, control, clock and other signals to the front-end modules of the array. The interconnection signals between modules must be transferred through the integrated feed module. For large-scale phased array systems, the number of channels and modules at the front end is huge. The number and types of signals that need to be transmitted also increase with the increase of system scale. At the same time, the distance of signal transmission also increases. This brings the following difficulties to the design of the integrated feed module: (1) The crosstalk between different electrical properties worsens because there are more signal power distribution channels and the power difference at different nodes is large.

[0003] (2) Increased transmission loss brings inconvenience to the application end. Typical requirements include the AD control board clock power requirement of 0±3dBm. However, after the source end signal has been multi-channel power splitter and long-distance transmission, it no longer meets the use requirements. If the end is amplified again, on the one hand, the power consumption and size of the equipment will increase. On the other hand, the clock signal end power is low, and the relative value of the introduced crosstalk signal power will increase, affecting the signal quality.

[0004] (3) The amplitude and phase consistency of the signal is difficult to guarantee, mainly because the transmission line becomes longer and the number of channels increases with the scale.

[0005] (4) The network is complex, limited in size, and difficult to design. Summary of the invention

[0006] The purpose of the present invention is to provide a highly integrated active integrated feeding module for a large-scale active phased array system, improve the integration of the integrated feeding module, reduce the performance degradation caused by the signal transmission process, and ensure the terminal signal quality.

[0007] The technical solution to achieve the purpose of the present invention is: a highly integrated active integrated feed module, including 37 LRM connectors, 2 HJ30J connectors, 7 passive multilayer boards, and 5 active networks, wherein: LRM connectors YFB1 and YFB2 are interconnected with the passive multilayer board 5 to transmit control signals, radio frequency signals and clock signals; LRM connectors XS1~XS32, each 8 LRMs form a group, are interconnected with passive multilayer boards 1~4 respectively to transmit control signals, radio frequency signals and clock signals; LRM connectors ZH1 and ZH2 are interconnected with the passive multilayer board 6 to transmit +12V power supply, control signals, radio frequency signals and clock signals; LRM connector CB1 is interconnected with the passive multilayer board 6 to transmit clock signals and baseband signals; Two HJ30J connectors CB2 are interconnected with the passive multilayer board 7 to transmit cabinet control signals and network message signals respectively; Multilayer boards 1 to 4 are mixed digital and analog boards. The high-frequency part contains 5 groups of 1-to-8 passive power dividers, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation. Multilayer board 5 is a mixed digital and analog board. The high-frequency part contains 5 groups of 1-to-2 passive power dividers, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation. Multilayer board 6 is a mixed digital and analog board. The high-frequency part contains 2 groups of 1-to-2 passive power dividers, and the corresponding electrical properties are LO1 and LO2. Multilayer board 7 is a multi-layer digital board with no high-frequency signal. The 5 groups of active networks involve 5 groups of high-frequency signals, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation. The input end is the passive multilayer board 6, and the output end is the passive multilayer board 1~5. Signal interconnection is achieved through HJ30J and RF cables.

[0008] Furthermore, the model of LRM connector YFB1 and LRM connector YFB2 is LRM16F-A15H18R; the model of LRM connector XS1~XS32 is LRM10F-A30T12; the model of LRM connector ZH1 and LRM connector ZH2 is LRM1F-AT20, and the model of LRM connector CB1 is JRF65-24GZJ.

[0009] Furthermore, among the two HJ30J connectors, the model HJ30JC_100ZKNY connector transmits the cabinet control signal, and the model HJ30JC_12ZKWY connector transmits the network message signal.

[0010] Furthermore, during the interconnection between the passive multilayer board 1-4 and the LRM connector XS1-32LRM, the pins in the LRM connector transmit low-frequency signals through the holes opened on the passive multilayer board 1-4, and the pins directly pass through the holes and are welded on the passive multilayer board 1-4 to achieve interconnection; the RF cavity in the LRM connector carries high-frequency signals, through a short cable, one end of which is inserted into the LRM high-frequency cavity and the other end is inserted into the RF connector of the passive multilayer board 1-4 to achieve RF signal interconnection. The low-frequency signal interconnection between the passive multilayer boards is achieved through the J30J connector on the board, and the high-frequency signal interconnection between the boards is achieved through the RF connectors on the boards.

[0011] Furthermore, the two active networks of CLK1 and CLK2 have 1 input and 5 outputs, which are power divider amplifier networks, inputted by the passive multilayer board 6, and outputted after 1-34 power division through the active networks 1-5 and the passive multilayer boards 1-5.

[0012] Furthermore, the electrical properties are LO1, LO2, and three active networks of excitation, with 4 inputs and 5 outputs. They are power divider amplification switch networks with three different working modes, supporting full-array collaborative working mode, half-array working mode, and sub-array independent working mode.

[0013] Furthermore, when the phased array system is working, the LRM connector CB1 and the HJ30J connector CB2 receive control signals, baseband signals, and reference signals from the phased array system, which are transferred by the passive multilayer board 6 and the passive multilayer board 7 and input into the array surface by the LRM connector ZH1 and the LRM connector ZH2 connectors; then, the control signals, RF signals, clock signals, and +12V power supply signals processed inside the array surface enter the passive multilayer board 6 in the active integrated feed module by the LRM connector ZH1 and the LRM connector ZH2, wherein the control signals are interconnected to the passive multilayer boards 1~5 through the J30J type connector, and the RF, clock, and power supply signals are connected to the active network 1~5 through cables for processing, and then pass through the passive multilayer boards 1~5, and are output together with the control signals by the LRM connectors YFB1, the LRM connector YFB2, and the LRM connectors XS1~XS32.

[0014] Compared with the prior art, the present invention has the following significant advantages: (1) By using multiple digital-analog mixed-pressure multilayer boards, the PCB signal control backplane is jointly designed with multiple passive power dividers, which reduces the size of the passive circuit, improves the integration of the integrated feed module, and reduces the difficulty of design and processing.

[0015] (2) The active network with integrated power divider and amplifier function reduces the degree of signal crosstalk between different electrical properties. It also alleviates the power requirement for amplifying the main signal in large-scale arrays and ensures the arrival power of the branch port signal.

[0016] (3) The active network with integrated power divider and amplifier switching functions reduces the difficulty of designing the RF signal amplitude consistency and the complexity of the phased array system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a principle block diagram of a highly integrated active integrated feeding module of the present invention.

[0018] Figure 2 It is a three-dimensional diagram of a highly integrated active integrated feeding module of the present invention.

[0019] Figure 3 It is a stacking diagram of a passive multilayer board 1-4 digital-analog mixed pressure multilayer board of the present invention.

[0020] Figure 4 It is an assembly diagram of the passive multilayer board 1-4 and LRM of the present invention.

[0021] Figure 5 It is a power division amplification function active network signal link diagram of the present invention.

[0022] Figure 6 It is a schematic diagram of the active network of the present invention for reducing signal crosstalk.

[0023] Figure 7 It is a signal link diagram of an active network with a power divider and amplifying switch function according to the present invention. DETAILED DESCRIPTION

[0024] The following is combined with Figure 1-7 The present invention is described in further detail.

[0025] like Figure 1 , Figure 2 As shown, a highly integrated active integrated feeding module of the present invention includes 35 LRM connectors, 2 HJ30J connectors, 7 passive multilayer boards, 5 groups of active networks, and corresponding interconnection lines between internal modules / connectors.

[0026] When the phased array system is working, CB1 and CB2 receive control, baseband, reference and other signals from the system, which are transferred by passive multilayer boards 6 and 7 and input into the array through ZH1 and ZH2 connectors. Then, the control, RF, clock, +12V power and other signals processed inside the array enter the passive multilayer board 6 in the active integrated feed module through ZH1 and ZH2 connectors, where the control signal is interconnected to the passive multilayer boards 1~5 through J30J connectors, and the RF, clock and power signals are connected to the active network 1~5 through cables for processing, and then pass through the passive multilayer boards 1~5 and are output together with the control signal through the LRM connector.

[0027] The 37 LRM connectors are used to interconnect the internal electrical signals of the integrated module with the phased array surface and the main control of the equipment. The LRM connector transmits low-frequency signals such as power supply and control, as well as high-frequency signals such as radio frequency and clock. The low-frequency pins are directly welded on the passive multilayer boards 1 to 6 to realize the interconnection of control and power supply signals, and the high-frequency cavity is directly inserted into the passive multilayer boards 1 to 7 through cables to realize the interconnection of radio frequency, clock and baseband signals.

[0028] Furthermore, the LRMs numbered YFB1 and YFB2, model number LRM16F-A15H18R, are interconnected with the passive multilayer board 5 and include control signals, RF signals and clock signals.

[0029] Furthermore, the LRMs numbered XS1 to XS32 are of model LRM10F-A30T12, and each group of 8 LRMs are interconnected with passive multilayer boards 1 to 4 respectively, including control signals, RF signals and clock signals.

[0030] Furthermore, LRMs numbered ZH1 and ZH2, model number LRM1F-AT20, are interconnected with the passive multilayer board 6, and include a +12V power supply, a control signal, a radio frequency signal, and a clock signal.

[0031] Furthermore, the LRM numbered CB1, model JRF65-24GZJ, is interconnected with the passive multilayer board 6, and includes a clock signal and a baseband signal.

[0032] The two HJ30J connectors are used to realize the control interconnection between the internal electrical signals of the integrated feed module and the main control of the equipment. The corresponding number is CB2, which is interconnected with the passive multilayer board 7. The model HJ30JC_100ZKNY connector transmits the cabinet control signal, and the model HJ30JC_12ZKWY connector transmits the network message signal.

[0033] The 7 passive multilayer boards: contain control, power supply, RF, clock and other types of signals, one end is interconnected with the external LRM / HJ30J, and the other end is interconnected with other multilayer boards and active networks inside the module. Among them, multilayer boards 1 to 6 are digital-analog hybrid boards, containing low-frequency control, power supply signals and high-frequency clock, RF and other signals. Multilayer board 7 is a multilayer digital board without high-frequency signals.

[0034] Preferably, the multilayer boards 1 to 6 have the advantage of high integration, with the middle layer integrating multiple groups of passive power dividers and low-frequency interconnection lines and the top layer being interconnection connectors.

[0035] Preferably, multilayer boards 1-4: the circuits are completely identical, and the high-frequency part includes 5 groups of one-to-eight passive power dividers, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation.

[0036] Preferably, the multilayer board 5 is a digital-analog hybrid board, and the high-frequency part includes 5 groups of one-to-two passive power dividers, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation.

[0037] Preferably, the multilayer board 6 is a digital-analog hybrid board, and the high-frequency part includes two sets of one-to-two passive power dividers, and the corresponding electrical properties are LO1 and LO2 respectively.

[0038] Figure 3 The figure shows the stacking diagram of the passive multilayer board 1-4, which has a total of 22 layers, including 5 groups of 1-to-8 power divider passive networks and low-frequency control signals, where each group of power dividers occupies 4 layers and is implemented in the form of stripline circuits; the low-frequency routing occupies the last 2 layers.

[0039] Figure 4 The figure shows the interconnection diagram of the passive multilayer board 1-4 and the LRM numbered XS1-32. The pins in the LRM transmit low-frequency signals. The PCB board has holes, and the pins pass directly through the holes and are soldered to the PCB board to achieve interconnection. The RF cavity in the LRM carries high-frequency signals. Through a short cable, one end is inserted into the LRM high-frequency cavity and the other end is inserted into the RF connector on the multilayer board to achieve RF signal interconnection. The low-frequency signal interconnection between passive multilayer boards is achieved through the J30J connector on the board; the high-frequency signal between boards is achieved through the RF connector on the board.

[0040] The composition and interconnection method of passive multilayer boards have the advantages of small space and high integration.

[0041] The five groups of active networks involve five groups of high-frequency signals, whose corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation, respectively. The input end is the passive multilayer board 6, and the output end is the passive multilayer board 1~5. Signal interconnection is achieved through connectors such as J30J and RF cables.

[0042] The two active networks with electrical properties of CLK1 and CLK2 have 1 input and 5 outputs, which are power splitter amplifier networks, inputted by passive multilayer board 6, and outputted after 1-34 power splitting through active networks 1-5 and passive multilayer boards 1-5. The amplification function of the active network makes the power difference between the input and output signals close to 0, reducing the degree of signal crosstalk between different electrical properties, and also reducing the power requirement of the total signal amplification in the case of large-scale arrays, ensuring the arrival power of the branch port signal.

[0043] Figure 5The figure shows the signal chain schematic diagram of the active network with power division and amplification function. Taking the CLK2 signal as an example, it is fed into the passive multilayer board 6 by the ZH1 connector and divided into two paths. One path is transmitted to the passive multilayer board 5 and then output by YFB1 and YFB2 after power division; the other path is transmitted to the active network 3, and then transmitted to the passive multilayer boards 1-4 after power division and amplification, and then output by XS1~32 after power division into 32 paths. The advantages of the active network of power division and amplification in large-scale integrated feeding networks are: (1) The signal arrival power at the end is ensured by intermediate amplification. The disadvantage of source-end amplification is that the required power is very high, and a power amplifier is needed, which affects the signal parameters such as phase noise and jitter. The disadvantage of end-end amplification is that there are many amplifiers, the signal arrival power is small, and it is easy to be interfered.

[0044] (2) The signal crosstalk phenomenon is improved. The principle is as follows Figure 6 shown. Figure 6-1 This is a block diagram of a traditional passive network. The insertion loss of the internal transmission path of networks with the same electrical properties is recorded as L, the crosstalk loss between networks with different electrical properties is recorded as A, the input power is recorded as Pi, the power of the CLK2 signal leaked to the end of the CLK1 network is Pi-A, and the CLK1 output power is Pi-L, so the relative value of the crosstalk signal is LA. Figure 6-2 This is a transmission block diagram using an active network. After the active network is inserted in the middle (gain G≈L), the power of the CLK2 signal leaked to the end of the CLK1 network is Pi-L1+GA<Pi+LA, and the CLK1 output power is Pi, so the relative value of the crosstalk signal is <LA.

[0045] The electrical properties are three active networks of LO1, LO2, and excitation, with 4 inputs and 5 outputs. It is a power divider amplification switch network with three different working modes, supporting full array collaborative work, half array work, and sub-array independent work. Compared with the layout mode in the array, the power divider amplification switch network set inside the module has an output port closer to the application end and fewer intermediate interconnection structures, so the amplitude and phase consistency is easier to ensure.

[0046] Figure 7The figure shows the signal chain schematic diagram of the active network with power divider and amplifier switch function. Taking the LO1 signal as an example, the ZH1 connector feeds 4 LO1 signals to the passive multilayer board 6, which are LO1-A, LO1-B, LO1-C, and LO1-D. Each signal is divided into two paths. One path is transmitted to the passive multilayer board 5 and then output by YFB1 and YFB2; the other path is transmitted to the active network 4, and after power division, switch selection, and amplification, it is transmitted to the passive multilayer boards 1-4, and then divided into 32 paths and output by XS1~32. The network supports three modes: full array collaborative work, half array work, and sub-array independent work. The advantage of the power divider and amplifier switch active network in the large-scale integrated feeding network is that it reduces the number of active devices on the array surface and reduces the difficulty of achieving signal amplitude consistency under large-scale arrays.

[0047] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A highly integrated active integrated feed module, characterized in that: Includes 37 LRM connectors, 2 HJ30J connectors, 7 passive multilayer boards, and 5 active networks, including: LRM connectors YFB1 and YFB2 are interconnected with the passive multilayer board 5 to transmit control signals, radio frequency signals and clock signals; LRM connectors XS1~XS32, each 8 LRMs form a group, are interconnected with passive multilayer boards 1~4 respectively to transmit control signals, radio frequency signals and clock signals; LRM connectors ZH1 and ZH2 are interconnected with the passive multilayer board 6 to transmit +12V power supply, control signals, radio frequency signals and clock signals; LRM connector CB1 is interconnected with the passive multilayer board 6 to transmit clock signals and baseband signals; Two HJ30J connectors CB2 are interconnected with the passive multilayer board 7 to transmit cabinet control signals and network message signals respectively; Multilayer boards 1 to 4 are mixed digital and analog boards. The high-frequency part contains 5 groups of 1-to-8 passive power dividers, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation. Multilayer board 5 is a mixed digital and analog board. The high-frequency part contains 5 groups of 1-to-2 passive power dividers, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation. Multilayer board 6 is a mixed digital and analog board. The high-frequency part contains 2 groups of 1-to-2 passive power dividers, and the corresponding electrical properties are LO1 and LO2. Multilayer board 7 is a multi-layer digital board with no high-frequency signal. The 5 groups of active networks involve 5 groups of high-frequency signals, and the corresponding electrical properties are LO1, LO2, CLK1, CLK2, and excitation. The input end is the passive multilayer board 6, and the output end is the passive multilayer board 1~5. Signal interconnection is achieved through HJ30J and RF cables.

2. The highly integrated active integrated feed module according to claim 1, characterized in that: The model of LRM connector YFB1 and LRM connector YFB2 is LRM16F-A15H18R; the model of LRM connector XS1~XS32 is LRM10F-A30T12; the model of LRM connector ZH1 and LRM connector ZH2 is LRM1F-AT20, and the model of LRM connector CB1 is JRF65-24GZJ.

3. The highly integrated active integrated feed module according to claim 1, characterized in that: Among the two HJ30J connectors, the model HJ30JC_100ZKNY connector transmits the cabinet control signal, and the model HJ30JC_12ZKWY connector transmits the network message signal.

4. The highly integrated active integrated feed module according to claim 1, characterized in that: During the interconnection between the passive multilayer board 1-4 and the LRM connector XS1-32LRM, the pins in the LRM connector transmit low-frequency signals. The holes on the passive multilayer board 1-4 are opened, and the pins directly pass through the through holes and are welded on the passive multilayer board 1-4 to achieve interconnection; the RF cavity in the LRM connector carries high-frequency signals, through a short cable, one end of which is inserted into the LRM high-frequency cavity and the other end is inserted into the RF connector of the passive multilayer board 1-4 to achieve RF signal interconnection. The low-frequency signal interconnection between the passive multilayer boards is achieved through the J30J connector on the board, and the high-frequency signal interconnection between the boards is achieved through the RF connectors on the boards.

5. The highly integrated active integrated feed module according to claim 1, characterized in that: The two active networks of CLK1 and CLK2 have 1 input and 5 outputs, which are power divider amplifier networks. They are input by the passive multilayer board 6, and are output after 1-to-34 power division through the active networks 1-5 and the passive multilayer boards 1-5.

6. The highly integrated active integrated feed module according to claim 1, characterized in that: The electrical properties are three active networks: LO1, LO2, and excitation. The input is 4-way and the output is 5-way. It is a power divider amplification switch network with three different working modes, supporting full array collaborative working mode, half array working mode, and sub-array independent working mode.

7. The highly integrated active integrated feed module according to claim 1, characterized in that: When the phased array system is working, the LRM connector CB1 and the HJ30J connector CB2 receive the control signal, baseband signal and reference signal from the phased array system, and after being transferred by the passive multilayer board 6 and the passive multilayer board 7, they are input into the array surface by the LRM connector ZH1 and the LRM connector ZH2 connectors; then the control signal, RF signal, clock signal and +12V power signal processed inside the array surface enter the passive multilayer board 6 in the active integrated feed module through the LRM connector ZH1 and the LRM connector ZH2, wherein the control signal is interconnected to the passive multilayer boards 1~5 through the J30J type connector, and the RF, clock and power signals are connected to the active network 1~5 through cables for processing, and then pass through the passive multilayer boards 1~5, and are output together with the control signal by the LRM connector YFB1, the LRM connector YFB2 and the LRM connector XS1~XS32.

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