Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a first electrode layer, a pixel definition layer and an isolation structure. The first electrode layer is arranged on one side of the substrate, the pixel definition layer is arranged on the side of the first electrode layer away from the substrate, and the isolation structure is arranged on the side of the pixel definition layer away from the substrate. The pixel definition layer comprises a pixel definition part and a pixel opening. The pixel definition part comprises a first side wall in contact with the first electrode layer, and the angle between the first side wall and the plane of the substrate is a right angle.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as low power consumption, high brightness, wide viewing angle, high contrast, and the ability to realize flexible displays.

[0003] However, current electronic display products suffer from poor display quality, which urgently needs to be addressed. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel and its manufacturing method, as well as a display device, to solve the problem of poor display effect in existing electronic display products.

[0005] To achieve the above objectives, the present invention provides a display panel comprising a substrate, a first electrode layer, a pixel defining layer, and an isolation structure. The first electrode layer is disposed on one side of the substrate and includes a plurality of spaced-apart first electrodes. The pixel defining layer is disposed on the side of the first electrode layer opposite to the substrate, and includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion. The pixel openings are correspondingly disposed to the first electrodes, and a portion of the first electrodes is exposed through the corresponding pixel opening. The isolation structure is disposed on the side of the pixel defining portion away from the substrate. The pixel defining portion includes a first sidewall that contacts the first electrodes, and the angle between the first sidewall and the plane of the substrate is a right angle.

[0006] Furthermore, along a direction perpendicular to the substrate, the height of the first sidewall is less than or equal to 500 angstroms. Preferably, the height of the first sidewall is greater than or equal to 200 angstroms.

[0007] Furthermore, the pixel defining portion also includes a second sidewall connected to the side of the first sidewall away from the first electrode. The first sidewall and the corresponding second sidewall enclose the pixel opening, and the angle between the second sidewall and the plane of the substrate is smaller than the angle between the first sidewall and the plane of the substrate. Preferably, the angle between the second sidewall and the plane of the substrate is less than 90 degrees. Preferably, the angle between the second sidewall and the plane of the substrate is less than or equal to 30 degrees.

[0008] Further, the isolation structure encloses and forms a plurality of isolation openings, which are correspondingly disposed to the pixel openings, and the orthographic projection of the pixel opening on the substrate lies within the orthographic projection of the corresponding isolation opening on the substrate. Preferably, the isolation structure includes a support layer and a barrier layer. The support layer is disposed on the side of the pixel defining portion away from the substrate. The barrier layer is disposed on the side of the support layer away from the substrate. The orthographic projection of the support layer on the substrate lies within the orthographic projection of the barrier layer on the substrate. Preferably, the support layer includes a first sub-support layer and a second sub-support layer. The second sub-support layer is located on the side of the first sub-support layer away from the substrate, and the orthographic projection of the first sub-support layer on the substrate lies within the orthographic projection of the second sub-support layer on the substrate.

[0009] Furthermore, the pixel defining portion further includes a first surface correspondingly connected to the second sidewall, and a third sidewall connected to the first surface. The first surface is parallel to the plane containing the substrate; the third sidewall is perpendicular to the plane containing the substrate. Preferably, the height of the first sidewall and the height of the third sidewall are equal in a direction perpendicular to the substrate.

[0010] Furthermore, the edge of the orthographic projection of the third sidewall onto the substrate overlaps with the orthographic projection of the edge of the barrier layer onto the substrate.

[0011] Further, the materials of the support layer and the barrier layer include metallic materials. Preferably, the material of the support layer includes at least one of aluminum and molybdenum, and the material of the barrier layer includes titanium. Preferably, the material of the first sub-support layer includes molybdenum, and the material of the second sub-support layer includes aluminum.

[0012] Furthermore, the display panel further includes a light-emitting layer and a second electrode layer. The light-emitting layer is disposed on the side of the first electrode layer facing away from the substrate, and includes a plurality of light-emitting units at least partially located in the corresponding pixel openings. The light-emitting units cover the exposed surface of the first electrode in the corresponding pixel opening. The second electrode layer is disposed on the side of the light-emitting layer facing away from the substrate, and includes a plurality of second electrodes. The second electrodes are disposed on the side of the corresponding light-emitting unit facing away from the substrate and are electrically connected to the isolation structure. Preferably, the orthographic projection of the light-emitting unit on the substrate is within the orthographic projection range of the corresponding second electrode on the substrate.

[0013] Furthermore, the display panel further includes an encapsulation layer disposed on the side of the second electrode layer opposite to the substrate. The encapsulation layer includes a plurality of encapsulation portions, which are correspondingly disposed with respect to the light-emitting unit. Preferably, the orthographic projection of the second electrode on the substrate is located within the orthographic projection range of the encapsulation portion on the substrate.

[0014] Furthermore, the material of the pixel defining layer includes organic materials.

[0015] The present invention also provides a display panel, the display panel comprising a substrate, a first electrode layer, and a pixel defining layer. The first electrode layer is disposed on one side of the substrate and includes a plurality of spaced-apart first electrodes. The pixel defining layer is disposed on the side of the first electrode layer opposite to the substrate, the pixel defining layer including pixel defining portions and a plurality of pixel openings formed by the pixel defining portions, the pixel openings corresponding to the first electrodes, and a portion of the first electrodes being exposed through the corresponding pixel openings. The pixel defining portion includes a first sidewall in contact with the first electrodes, and the angle between the first sidewall and the plane of the substrate is a right angle.

[0016] Furthermore, along a direction perpendicular to the substrate, the height of the first sidewall is less than or equal to 500 angstroms. Preferably, the height of the first sidewall is greater than or equal to 200 angstroms.

[0017] Furthermore, the pixel defining portion also includes a second sidewall connected to the side of the first sidewall away from the first electrode. The first sidewall and the corresponding second sidewall enclose the pixel opening, and the angle between the second sidewall and the plane of the substrate is smaller than the angle between the first sidewall and the plane of the substrate. Preferably, the angle between the second sidewall and the plane of the substrate is less than 90 degrees. Preferably, the angle between the second sidewall and the plane of the substrate is less than or equal to 30 degrees.

[0018] Furthermore, the display panel further includes a light-emitting layer and a second electrode layer. The light-emitting layer is disposed on the side of the first electrode layer opposite to the substrate, and the light-emitting layer includes a plurality of light-emitting units at least partially located in the corresponding pixel openings, the light-emitting units covering the exposed surface of the first electrode in the corresponding pixel openings. The second electrode layer is disposed on the side of the pixel defining portion opposite to the substrate and covers the light-emitting units.

[0019] Furthermore, the display panel further includes an encapsulation layer disposed on the side of the second electrode layer opposite to the substrate. Preferably, the encapsulation layer is made of an inorganic material.

[0020] The present invention also provides a display device, the display device comprising at least one of the display panels described above.

[0021] This invention also provides a method for manufacturing a display panel, comprising the following steps: preparing a substrate; forming a first electrode layer on one side of the substrate, the first electrode layer including a plurality of spaced-apart first electrodes; forming a pixel defining material layer on the side of the first electrode layer opposite to the substrate; forming an isolation structure on the side of the pixel defining material layer opposite to the substrate; patterning the pixel defining material layer to form pixel defining portions, the pixel defining portions enclosing a plurality of pixel openings. The pixel defining portion includes a first sidewall in contact with the first electrodes, and the angle between the first sidewall and the plane of the substrate is a right angle.

[0022] Further, the step of forming a pixel defining material layer on the side of the first electrode layer away from the substrate includes: forming an initial pixel defining material layer on the side of the first electrode layer away from the substrate, and patterning the initial pixel defining material layer using a gray-tone mask or a halftone mask to form the pixel defining material layer, wherein a groove is formed on the side of the pixel defining material layer away from the first electrode layer, and the depth of the groove is less than the thickness of the pixel defining material layer.

[0023] Further, the step of forming an isolation structure on the side of the pixel-defining material layer opposite to the substrate includes: forming the support material layer on the side of the pixel-defining layer opposite to the substrate; forming the barrier material layer on the side of the support material layer opposite to the substrate; and patterning the support material layer and the barrier material layer to form a plurality of isolation openings. Preferably, the step of patterning the pixel-defining material layer to form a pixel defining portion includes: patterning the groove to form the pixel opening penetrating the pixel-defining material layer. Preferably, the groove is patterned to penetrate the pixel-defining material layer by an ashing process.

[0024] Furthermore, the method for manufacturing the display panel further includes: forming a light-emitting unit on the side of the first electrode layer facing away from the substrate; and forming a second electrode on the side of the light-emitting unit facing away from the substrate. Preferably, the method for manufacturing the display panel further includes: forming an encapsulation portion on the side of the second electrode facing away from the substrate.

[0025] The advantages of the present invention are: In the display panel and its manufacturing method of the present invention, by redesigning the structure of its pixel limiting layer, the first electrode layer is protected by retaining part of the pixel limiting layer material in the manufacturing method, so as to prevent the first electrode layer from being corroded by the etching solution used in subsequent processes, thereby solving the problem of poor display effect such as dark spots in the display screen and improving the yield of the display panel. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the layered structure of the display panel in an embodiment of the present invention;

[0028] Figure 2 for Figure 1 An enlarged schematic diagram of the display panel structure within frame A;

[0029] Figure 3 This is a schematic diagram of the layered structure of the display panel in another embodiment of the present invention;

[0030] Figure 4 for Figure 3 An enlarged schematic diagram of the display panel structure within frame B;

[0031] Figure 5 This is a schematic flowchart of a display panel manufacturing method according to another embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the layered structure of the display panel in step S30 of this embodiment of the invention;

[0033] Figure 7 This is a schematic diagram of the layered structure after the pixel-defining layer is patterned in step S30 of this embodiment of the invention;

[0034] Figure 8 This is a schematic diagram of the layered structure after the protrusions have been leveled in step S30 of this embodiment of the invention;

[0035] Figure 9 This is a top view of the pixel-defining layer in step S30 of this embodiment of the invention.

[0036] Figure 10 This is a schematic diagram of the layered structure of the display panel in step S40 of this embodiment of the invention;

[0037] Figure 11 This is a schematic diagram of the layered structure of the display panel in step S50 of this embodiment of the invention;

[0038] Figure 12 This is a schematic diagram of the layered structure of the display panel in step S50 of this embodiment of the invention;

[0039] Figure 13This is a schematic diagram of the layered structure of the display panel in step S60 of this embodiment of the invention;

[0040] Figure 14 This is a schematic diagram of the layered structure of the display panel in step S70 of this embodiment of the invention.

[0041] The components in the diagram are shown below:

[0042] Display panels 1 and 2; substrates 110 and 210;

[0043] First electrode layers 120, 220; First electrodes 121, 221;

[0044] Pixel limiting layers 130 and 230; Pixel limiting sections 131 and 231;

[0045] Pixel openings 132, 232; First sidewalls 1311, 2311;

[0046] Second sidewalls 1312, 2312; Third sidewalls 1313, 2313;

[0047] First surfaces 1314, 2314; Isolation structure 140;

[0048] Isolation opening 141; Support layer 142;

[0049] Barrier layer 143; Light-emitting layers 150, 250;

[0050] Light-emitting units 151, 251; Second electrode layers 160, 260;

[0051] Second electrodes 161, 261; Encapsulation layers 170, 270;

[0052] Encapsulation part 171; Recess 132A;

[0053] Protrusion 132B; Pixel-limited material layer 130';

[0054] Support material layer 142'; Barrier material layer 143'. Detailed Implementation

[0055] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0056] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0057] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0058] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0059] In related display technologies, the manufacturing process of the light-emitting film group requires a wet etching process. The etching solution used in wet etching will simultaneously etch the film layer (such as the ITO film layer) in the anode. The film layer that the anode avoids cannot completely shield the anode, which will damage the anode and result in a large number of dark spots, affecting the display effect of the display panel.

[0060] In view of the technical problems that have emerged in related display technologies, this embodiment of the invention provides a display panel 1, such as... Figure 1As shown, the display panel 1 includes a substrate 110, a first electrode layer 120, a pixel defining layer 130, and an isolation structure 140. The substrate 110 drives light-emitting devices, each of which acts as an independent pixel unit. Driven by the substrate 10, each device can be turned on or off according to a corresponding display signal, providing a light source for the display panel 1. The pixel defining layer 130 is disposed on one side of the substrate and defines the size of the self-emissive devices. The isolation structure 140 is disposed on one side of the substrate 110 and blocks the vapor-deposited material, disconnecting the vapor-deposited material in adjacent isolation openings 141, thereby isolating multiple light-emitting devices. (The composition and preparation of the isolation structure mentioned below are specified in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072.) Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0061] The substrate 110 is an array substrate, comprising multiple thin-film transistors arranged in an array. The first electrode 121 in the first electrode layer 120 is electrically connected to at least one thin-film transistor. The substrate 110 also includes signal traces, one end of which is electrically connected to a driver chip, and the other end of which is electrically connected to a thin-film transistor. The driver chip transmits display signals to the corresponding thin-film transistors via the signal traces. The thin-film transistors activate the corresponding light-emitting devices according to the display signals, thus illuminating the light-emitting devices at the corresponding positions to form a display image. Simultaneously, the driver chip can also change the display image by sending different display signals.

[0062] The first electrode layer 120 is disposed on one side of the substrate and includes a plurality of first electrodes 121. Each light-emitting device is provided with a first electrode 121 and is electrically connected to the corresponding thin-film transistor through the first electrode 121.

[0063] A pixel limiting layer 130 is disposed on the side of the first electrode layer 120 away from the substrate 110. It includes a pixel limiting portion 131 and a plurality of pixel openings 132 formed by the pixel limiting portion 131. The pixel openings 132 are disposed in a one-to-one correspondence with the first electrode 121, and a portion of the surface of the first electrode 121 is exposed in the corresponding pixel opening 132.

[0064] Furthermore, the display panel 1 also includes a light-emitting layer 150 and a second electrode layer 160. The light-emitting layer 150 is disposed on the side of the first electrode layer 120 facing away from the substrate 110, and includes a plurality of light-emitting units 151. A portion of each light-emitting unit 151 is located in a corresponding pixel opening 132, covering the exposed surface of the first electrode 121 in the pixel opening 132, and extending from the exposed surface of the first electrode 121 to the side of the pixel defining layer 130 facing away from the substrate 110. A second electrode 161 is stacked and disposed on the side of the light-emitting layer 150 facing away from the substrate 110, and includes a plurality of second electrodes 161. Each light-emitting unit 151 is provided with a corresponding second electrode 161, and the orthographic projection of the light-emitting unit 151 on the substrate 110 is located within the orthographic projection range of the second electrode 161 on the substrate 110, that is: the second electrode 161 covers the surface of the light-emitting unit 151 facing away from the substrate 110, and extends to the sidewall of the isolation structure 140, and is electrically connected to the isolation structure 140. The light-emitting layer 150 and the second electrode 161 are isolated by the isolation structure 140, which separates multiple light-emitting units 151 and the second electrode 161, at least partially located in the corresponding isolation openings 141. Simultaneously, the second electrode 161 can obtain a power signal through electrical connection with the isolation structure 140. The first electrode 121 in the first electrode layer 120, together with the corresponding light-emitting unit 151 and the corresponding second electrode 161, forms a light-emitting device. After electrical conduction, the first electrode 121 and the second electrode 161 of this light-emitting device respectively transmit electrons and holes to the light-emitting unit 151. The electrons and holes combine in the light-emitting unit 151 to form excitons, thereby converting electrical energy into light energy, causing the light-emitting unit 151 to emit light and illuminating the corresponding light-emitting device.

[0065] Specifically, such as Figure 2As shown, the pixel defining portion 131 includes a first sidewall 1311, a second sidewall 1312, a first surface 1314, and a third sidewall 1313. The first sidewall 1311 contacts the surface of the first electrode 121 facing away from the substrate 110, and the angle between the first sidewall 1311 and the plane containing the substrate 110 is a right angle. One side of the second sidewall 1312 is connected to the side of the first sidewall 1311 facing away from the first electrode 121, and the angle between the second sidewall 1312 and the plane containing the substrate 110 is less than 90 degrees. One side of the first surface 1314 is connected to the side of the second sidewall 1312 away from the first sidewall 1311, and the first surface 1314 is parallel to the plane containing the substrate 110, that is, the first sidewall 1311 and the first surface 1314 are perpendicular to each other. The third sidewall 1313 is connected to the side of the first surface 1314 away from the second sidewall 1312, and the third sidewall 1313 is perpendicular to the plane of the substrate 110, that is, the third sidewall 1313 is also perpendicular to the first surface 1314 and parallel to the first sidewall 1311. The first sidewall 1311 and the corresponding second sidewall 1312 enclose to form a pixel opening 132, and a stepped pixel limiting part 131 structure is formed between the third sidewall 1313, the first surface 1314, and the first sidewall 1311. In the direction perpendicular to the plane of the substrate 110, the height of the first sidewall 1311 is equal to the height of the third sidewall 1313, and the heights of both the first sidewall 1311 and the third sidewall 1313 are less than or equal to 500 angstroms. Preferably, the height of the first sidewall 1311 and the third sidewall 1313 is greater than or equal to 200 angstroms, for example, the height of the first sidewall 1311 and the third sidewall 1313 can be 250 angstroms, 300 angstroms or 400 angstroms.

[0066] Furthermore, the pixel defining layer 130 contains organic materials. Since organic materials have better fluidity than inorganic materials, the angle between the second sidewall 1312 of the pixel defining portion 131 and the plane of the substrate 110 can be reduced to 30 degrees or less. For example, this angle can be 25 degrees, 20 degrees, or 15 degrees. A smaller sidewall angle further reduces the difficulty of the second electrode 161 climbing the slope, lowering the risk of breakage and effectively preventing the second electrode 161 from breaking off on the sidewall of the pixel opening 132. Specifically, the second sidewall 1312 can be arc-shaped, further reducing the difficulty of the second electrode 161 climbing the slope.

[0067] like Figure 1As shown, the isolation structure 140 includes a support layer 142 and a barrier layer 143, which together form an isolation opening 141 that communicates with a corresponding pixel opening 132. The support layer 142 is disposed on the side of the pixel limiting layer 130 facing away from the substrate 110, and the barrier layer 143 is stacked on the side of the support layer 142 facing away from the substrate 110. The materials of the support layer 142 and the barrier layer 143 include metallic materials; the material of the support layer 142 can be at least one of aluminum and molybdenum, and the material of the barrier layer 143 can be titanium. The end of the barrier layer 143 facing the isolation opening 141 protrudes from the support layer 142, that is, the orthographic projection of the support layer 142 on the substrate 110 is located within the orthographic projection of the barrier layer 143 on the substrate 110, so that the barrier layer 143 can completely block the support layer 142, thereby preventing the material of the light-emitting layer 150 from being deposited onto the support layer 142 when the light-emitting layer 150 is prepared. When the second electrode 161 is prepared, the deposition angle of the material of the second electrode 161 can be adjusted to make the coverage area of ​​the second electrode 161 larger than the coverage area of ​​the light-emitting unit 151, so that the second electrode 161 extends from the surface of the light-emitting unit 151 to the side wall of the support layer 142 facing the isolation opening 141, so that the second electrode 161 can be electrically connected to the support layer 142. The cross-sectional profile of the support layer 142 located between two adjacent isolation openings 141 is trapezoidal, and the width of the support layer 142 on the side near the barrier layer 143 is smaller than the width on the side near the substrate 110, so as to facilitate the climbing of the second electrode 161 and reduce the difficulty of the overlap between the second electrode 161 and the support layer 142.

[0068] Furthermore, the support layer 142 includes a first sub-support layer and a second sub-support layer. The second sub-support layer is located on the side of the first sub-support layer away from the substrate 110, and the first sub-support layer is within its orthographic projection onto the substrate 110. The first sub-support layer is made of molybdenum, and the second sub-support layer is made of aluminum. The electrical connection between the support layer 242 and the second electrode 161 can be improved by providing the first sub-support layer 2.

[0069] like Figure 1As shown, the display panel also includes an encapsulation layer 170, which is disposed on the side of the second electrode 161 facing away from the substrate 110. The encapsulation layer 170 includes a plurality of encapsulation portions 171, each corresponding to a light-emitting unit 151, and extending from the surface of the second electrode 161 facing away from the substrate 110 to the surface of the barrier layer 143 facing away from the substrate 110. This ensures that the orthographic projections of the second electrode 161 and the light-emitting unit 151 onto the substrate 110 are within the orthographic projection range of the encapsulation portion 171 onto the substrate 110, thereby enabling the encapsulation portion 171 to encapsulate and protect the light-emitting device, preventing water and oxygen from intruding and corroding it. The material of the encapsulation layer 170 includes inorganic materials, such as silicon oxide (SiOx) and silicon nitride (SiNx).

[0070] Another embodiment of the present invention also provides a display panel 2, such as Figure 3 As shown, the display panel 2 includes a substrate 210, a first electrode layer, and a 220-pixel defining layer 230. The substrate 210 drives light-emitting devices, each of which acts as an independent pixel unit. Under the drive of the substrate 210, each device can be turned on or off according to a corresponding display signal, thus increasing the light intensity of the display panel 2. The pixel defining layer 230 is disposed on one side of the substrate 210 and defines the size of the self-emissive devices.

[0071] The substrate 210 is an array substrate, which includes multiple thin-film transistors arranged in an array. The first electrode 221 in the first electrode layer 220 is electrically connected to at least one thin-film transistor. The substrate also has signal traces, one end of which is electrically connected to a driver chip, and the other end of which is electrically connected to a thin-film transistor. The driver chip transmits display signals to the corresponding thin-film transistors through the signal traces. The thin-film transistors turn on the corresponding light-emitting devices according to the display signals, thereby forming a display image by lighting up the light-emitting devices at the corresponding positions. At the same time, the driver chip can also change the display image by sending different display signals.

[0072] The first electrode layer 220 is disposed on one side of the substrate 210 and includes a plurality of first electrodes 221. Each light-emitting device is provided with a first electrode 221 and is electrically connected to the corresponding thin-film transistor through the first electrode 221.

[0073] A pixel limiting layer 230 is disposed on the side of the first electrode layer 220 away from the substrate 210. It includes a pixel limiting portion 231 and a plurality of pixel openings 232 formed by the pixel limiting portion 231. The pixel openings 232 are disposed in a one-to-one correspondence with the first electrode 221, and a portion of the surface of the first electrode 221 is exposed in the corresponding pixel opening 232.

[0074] Furthermore, the display panel 2 also includes a light-emitting layer 250 and a second electrode layer 260. The light-emitting layer 250 is disposed on the side of the first electrode layer 220 away from the substrate 210, and includes a plurality of light-emitting units 251. A portion of each light-emitting unit 251 is located in a corresponding pixel opening 232, covering the exposed surface of the first electrode 221 in the pixel opening 232. The second electrode layer 260 is stacked on the side of the pixel limiting portion 231 away from the substrate 210 and covers the surface of the light-emitting unit 251 away from the substrate 210. The first electrode 221 in the first electrode layer 220, together with the corresponding light-emitting unit 251 and the corresponding second electrode layer 260, forms a light-emitting device. After the first electrode 221 and the second electrode layer 260 of the light-emitting device are electrically connected, electrons and holes are respectively transferred to the light-emitting unit 251. Electrons and holes combine in the light-emitting unit 251 to form excitons, thereby converting electrical energy into light energy, causing the light-emitting unit 251 to emit light and illuminating the corresponding light-emitting device. In one embodiment of the invention, the second electrode layer 260 is a conductive film layer vapor-deposited across the entire surface. In other embodiments of the invention, the second electrode layer 260 can be disconnected by an isolation structure 240 or an undercut structure.

[0075] Specifically, such as Figure 4As shown, the pixel defining portion 231 includes a first sidewall 2311, a second sidewall 2312, a first surface 2314, and a third sidewall 2313. The first sidewall 2311 contacts the surface of the first electrode 221 facing away from the substrate 210, and the angle between the first sidewall 2311 and the plane containing the substrate 210 is a right angle. One side of the second sidewall 2312 is connected to the side of the first sidewall 2311 facing away from the first electrode 221, and the angle between the second sidewall 2312 and the plane containing the substrate 210 is less than 90 degrees. One side of the first surface 2314 is connected to the side of the second sidewall 2312 away from the first sidewall 2311, and the first surface 2314 is parallel to the plane containing the substrate 210, that is, the first sidewall 2311 and the first surface 2314 are perpendicular to each other. The third sidewall 2313 is connected to the side of the first surface 2314 away from the second sidewall 2312, and the third sidewall 2313 is perpendicular to the plane of the substrate 210, that is, the third sidewall 2313 is also perpendicular to the first surface 2314 and parallel to the first sidewall 2311. The first sidewall 2311 and the corresponding second sidewall 2312 enclose to form a pixel opening 232. A stepped pixel limiting part 231 structure is formed between the third sidewall 2313, the first surface 2314 and the first sidewall 2311. The stepped pixel limiting part 231 structure can reduce the slope of the sidewall of the pixel opening 232, thereby reducing the difficulty of the second electrode 261 in the second electrode layer 260 to climb the slope and preventing the second electrode 261 from breaking on the sidewall of the pixel opening 232. In a direction perpendicular to the plane of substrate 210, the height of the first sidewall 2311 is equal to the height of the third sidewall 2313, and the heights of both the first sidewall 2311 and the third sidewall 2313 are less than or equal to 500 angstroms. Preferably, the heights of the first sidewall 2311 and the third sidewall 2313 are greater than or equal to 200 angstroms, for example, the heights of the first sidewall 2311 and the third sidewall 2313 can be 250 angstroms, 300 angstroms, or 400 angstroms.

[0076] Furthermore, the pixel defining layer 230 contains organic materials. Since organic materials have better fluidity than inorganic materials, the angle between the second sidewall 2312 of the pixel defining portion 231 and the plane of the substrate 210 can be reduced to 30 degrees or less. For example, the angle can be 25 degrees, 20 degrees or 15 degrees. By using a smaller sidewall angle, the climbing difficulty of the second electrode 261 can be further reduced, the risk of breakage of the second electrode 261 can be reduced, and the second electrode 261 can be effectively prevented from breaking on the sidewall of the pixel opening 232.

[0077] like Figure 3As shown, the display panel 2 also includes an encapsulation layer 70. This encapsulation layer 170 covers the surface of the second electrode layer 260 facing away from the substrate 210. This encapsulation layer is used to encapsulate and protect the light-emitting device, preventing water and oxygen from penetrating and corroding it. The material of the encapsulation layer 170 includes inorganic materials, such as silicon oxide (SiOx) and silicon nitride (SiNx). Furthermore, the encapsulation layer 170 can be fabricated using TFE (Thin Film Encapsulation), meaning that the encapsulation layer 170 can include at least two inorganic film layers and at least one organic film layer located between adjacent inorganic film layers.

[0078] Another embodiment of the present invention also provides a display device, which can be an OLED display device, including display panel 1 or display panel 2 as described above. Display panel 1 or display panel 2 can both be used to display image information for the display device. The display device can be any display device with display function, such as a mobile phone, laptop computer, tablet computer, automotive display, etc.

[0079] Another embodiment of the present invention also provides a method for manufacturing a display panel 1, used to manufacture the display panel 1 as described above. The process of this method for manufacturing the display panel 1 is as follows: Figure 5 As shown, it includes steps S10-S80.

[0080] Step S10) Fabrication of substrate 110: A substrate 110 containing multiple thin-film transistors is formed by an array process.

[0081] Step S20) Forming a first electrode layer 120 on one side of the substrate 110: Depositing a conductive material on the surface of the substrate 110 to form the first electrode layer 120; Patterning the first electrode layer 120 by an etching process, thereby forming a plurality of spaced first electrodes 121 in the first electrode layer 120; wherein, the conductive material in the first electrode layer 120 may include at least one of metal and metal oxide, which may be a single-layer metal structure formed by a single material through a single deposition process, or a stacked structure formed by multiple different materials through multiple deposition processes; for example, the first electrode layer 120 may be an indium tin oxide / silver / indium tin oxide (ITO / Ag / ITO) stacked structure, an indium tin oxide / silver (ITO / Ag) stacked structure, a titanium / aluminum / titanium (Ti / Al / Ti) stacked structure, etc.

[0082] Step S30) Forming a pixel defining material layer 130' on the side of the first electrode layer 120 opposite to the substrate 110: Depositing an insulating material on the substrate 110 to form an initial pixel defining material layer; forming a pixel defining material layer on the side of the initial pixel defining material layer opposite to the first electrode layer 120 by photolithography. Figure 6The pixel defining material layer 130' shown has a groove 132A that does not penetrate the pixel defining material layer 130', that is, the depth of the groove 132A is less than the thickness of the pixel defining material layer 130', and the bottom surface of the groove 132A is located on the side of the pixel defining layer 130 facing the substrate 110 away from the substrate 110; wherein, the insulating material used for the pixel defining material layer 130' can be an organic material, such as polyimide or organic planarization adhesive (that is, the same organic adhesive used for the planarization layer in the substrate 110).

[0083] Specifically, the step of forming a groove 132A on the pixel-defining material layer 130' using photolithography includes: etching a plurality of protrusions 132B on the surface of the pixel-defining material layer 130' opposite to the first electrode layer 120 using a gray-tone photomask; such as Figure 7 and Figure 8 As shown, the protrusion 132B extends along the first direction X and is arranged along the second direction Y perpendicular to the first direction X. Its orthographic projection on the substrate 110 can be a rectangular, elliptical, or other thin strip shape extending along the first direction X. There is a recess between two adjacent protrusions 132B. Since the pixel limiting material layer 130' is made of organic material, according to the fluidity of organic material, the protrusions 132B flow towards the recessed positions on both sides, automatically leveling, forming a shape like... Figure 9 The bottom surface of the groove 132A is flat. The thickness of the pixel-defining material layer 130' is less than or equal to 8000 angstroms, and the depth of the groove 132A is less than or equal to 7000 angstroms. This means that the groove 132A retains at least 1000 angstroms of organic material within its orthogonal projection area onto the pixel-defining material layer 130'. This protects the first electrode layer 120 in subsequent processes, preventing corrosion of the first electrode layer 120 by the etching solution used in subsequent film patterning, effectively reducing damage to the first electrode layer 120 in subsequent processes, and thus improving product yield. For example, the thickness of the pixel-defining material layer 130' can be 7000 angstroms or 7500 angstroms, and the depth of the groove 132A can be 5000 angstroms or 6000 angstroms.

[0084] Furthermore, in another embodiment of the present invention, a plurality of grooves 132A can be etched on the surface of the initial pixel defining material layer away from the first electrode layer 120 using a half-tone mask. The half-tone mask has a light-blocking area and a semi-transparent area. The light-blocking area can be correspondingly positioned with the area where the pixel defining portion 131 needs to be formed, and the semi-transparent area can be correspondingly positioned with the location where the grooves 132A need to be formed. Exposure, development, etching, and other processes are then performed to pattern the grooves 132A on the initial pixel defining material layer. Specifically, in this embodiment, the semi-transparent area of ​​the half-tone mask can be correspondingly positioned with the location where the grooves 132A need to be formed, and the transmittance of the semi-transparent area of ​​the half-tone mask is less than 100% and greater than 0%. Preferably, the transmittance of the semi-transparent area of ​​the half-tone mask can be one of 30%, 40%, or 50%.

[0085] Step S40) Forming an isolation structure 140 on the side of the pixel defining material layer 130' facing away from the substrate 110: Depositing a metal material on the surface of the pixel defining layer material 130' facing away from the substrate 110 to form a support material layer 142'; Depositing a metal material on the surface of the support material layer 142' facing away from the substrate 110 to form a barrier material layer 143'; Support material layer 142' and barrier material layer 143'; Patterning the support material layer 142' and barrier material layer 143' sequentially to form as shown in the figure. Figure 10 Multiple isolation openings 141 penetrate the support material layer 142' and the barrier material layer 143', and the isolation openings 141 are respectively provided with corresponding grooves 132A. The remaining support material layer 142' and barrier material layer 143' form the support layer 142 and the barrier layer 143. The deposition thickness of the support material layer 142' is greater than the deposition thickness of the barrier material layer 143'.

[0086] Step S50) Patterning the pixel defining material layer 130' to form the pixel defining portion 131 and a plurality of pixel openings 132: The pixel defining material layer 130' is patterned a second time to remove the pixel defining material layer 130' in the orthographic projection area of ​​the groove 132A on the substrate 110, so as to form as Figure 12 The pixel limiting portion 131 and the pixel opening 132 penetrating the pixel limiting portion 131 are shown. Preferably, since the pixel limiting material layer 130' is made of organic material, the secondary patterning of the pixel limiting material layer 130' can be carried out using an ashing process, and a metal isolation structure 140 is used as a mask, so that there is no need to set up a photomask for patterning, thereby saving a photomask and reducing production costs.

[0087] Specifically, such as Figure 11As shown, during the secondary patterning of the pixel defining layer 130 through an ashing process, the pixel defining layer material 130' located directly below the groove 132A is completely removed, thereby forming a first sidewall 1311 perpendicular to the plane of the substrate 110. To prevent the isolation structure 140 from affecting the fabrication of the light-emitting layer 150, the diameter of the isolation opening 141 is larger than the diameter of the pixel opening 132, such as... Figure 12 As shown, the pixel defining material layer 130' around the groove 132A cannot be blocked by the isolation structure 140. Therefore, during the ashing process, a portion of the unblocked pixel defining material layer 130' will be removed, causing the thickness of the pixel defining portion 131 within the orthographic projection range of the isolation structure 140 on the substrate 110 to be greater than the thickness of the pixel defining portion 130 outside the orthographic projection range of the isolation structure 140 on the substrate 110, thereby forming a stepped pixel defining portion 131. The orthographic projection of the third sidewall 1313 of this stepped pixel defining portion 131, parallel to the first sidewall 1311, on the substrate 110 overlaps with the orthographic projection of the edge of the barrier layer 143 on the substrate 110. Furthermore, the third sidewall 1313 and the sidewall of the barrier layer 143 can be located in the same plane.

[0088] Step S60) Forming a light-emitting unit 151 on the side 132 of the first electrode layer 120 opposite to the substrate 110: Depositing or printing an organic material in the pixel opening 132 to form a light-emitting unit 151. Figure 13 The light-emitting layer 150 shown in the figure is divided into multiple light-emitting units 151 by an isolation structure 140. The orthographic projection of the light-emitting unit 151 on the substrate 110 overlaps with the orthographic projection of the pixel opening 132 on the substrate 110, but does not overlap with the orthographic projection of the support layer 142 on the substrate 110. That is, the deposition range of the material of the light-emitting unit 151 covers the exposed surface of the first electrode 131 in the pixel opening 132 and is smaller than the orthographic projection range of the isolation opening 141, thereby ensuring that the light-emitting unit 151 can contact and connect with the corresponding first electrode 121 and maintain a disconnection from the support layer 142.

[0089] Step S70) Forming a second electrode 161 on the side of the light-emitting unit 151 facing away from the substrate 110: Depositing a layer of conductive material in the isolation opening 132 to form as shown in the figure. Figure 14 The second electrode layer 160 shown is divided into multiple second electrodes 161 by an isolation structure 140. During the deposition of the second electrodes 161, the deposition angle can be adjusted to make the deposition area of ​​the second electrodes 161 larger than that of the light-emitting unit 151. This allows the second electrodes 161 in the same isolation opening 141 to cover the light-emitting unit 151 and extend from the surface of the light-emitting unit 151 to the sidewall of the support layer 142, thereby electrically connecting the second electrodes 161 to the support layer 142.

[0090] Step S80) Forming an encapsulation portion on the side of the second electrode 161 away from the substrate 110: Depositing one or more layers of encapsulation material on the side of the second electrode layer 160 away from the substrate 110 to form an encapsulation layer 170. This encapsulation layer includes multiple encapsulation portions extending from the surface of the second electrode layer 160 away from the substrate 110 to the side of the barrier layer 143 away from the substrate 110, thereby forming an encapsulation portion as shown in the image. Figure 1 The display panel 1 shown is shown.

[0091] In the display panel provided in this embodiment of the invention, the sidewall slope of the pixel opening / pixel defining portion is improved by redesigning the structure of its pixel defining layer, facilitating the climbing of the second electrode layer and preventing the second electrode layer from breaking on the sidewall of the pixel opening / pixel defining portion. Secondly, during the fabrication of this display panel, the first electrode layer can be protected by retaining a portion of the pixel defining layer material, preventing it from being corroded by the etching solution used in subsequent processes. This solves problems such as dark spots in the displayed image and improves the yield rate of the display panel. Simultaneously, when removing the residual pixel defining layer material, the material used for the pixel defining layer can be removed through an ashing process, reducing the use of a photomask in the fabrication method of this display panel, thereby reducing the number of production processes and lowering production costs.

[0092] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A method for manufacturing a display panel, characterized by, Comprising: preparing a substrate; forming a first electrode layer on one side of the substrate, the first electrode layer comprising a plurality of first electrodes arranged at intervals; forming a pixel defining material layer on the side of the first electrode layer away from the substrate, forming an initial pixel defining material layer on the side of the first electrode layer away from the substrate, and patterning the initial pixel defining material layer with a gray-tone mask or a half-tone mask to form the pixel defining material layer, wherein the side of the pixel defining material layer away from the first electrode layer forms a groove, and the depth of the groove is less than the thickness of the pixel defining material layer; forming an isolation structure on the side of the pixel defining material layer away from the substrate; patterning the pixel defining material layer to form a pixel defining portion, and patterning the groove by an ashing process to form a pixel opening through the pixel defining material layer; wherein the pixel defining portion comprises a first sidewall in contact with the first electrode, and the angle between the first sidewall and the plane of the substrate is a right angle.

2. The method of claim 1, wherein the pixel defining portion further comprises a second sidewall connected to the first sidewall away from the first electrode, a first surface connected to the second sidewall, and a third sidewall connected to the first surface, and the angle between the first sidewall and the plane of the substrate is a right angle, the angle between the second sidewall and the plane of the substrate is less than 90 degrees, and the edge of the projection of the third sidewall on the substrate overlaps with the edge of the projection of the blocking layer in the isolation structure on the substrate.

3. The method of claim 2, wherein the height of the first sidewall in a direction perpendicular to the substrate is less than or equal to 500 angstroms.

4. The method of claim 2, wherein the height of the first sidewall is greater than or equal to 200 angstroms.

5. The method of claim 2, wherein the angle between the second sidewall and the plane of the substrate is less than or equal to 30 degrees.

6. The method of claim 1, wherein the pixel defining portion further comprises a second sidewall connected to the first sidewall away from the first electrode, the angle between the first sidewall and the plane of the substrate is a right angle, the first sidewall and the corresponding second sidewall enclose the pixel opening, the angle between the second sidewall and the plane of the substrate is less than the angle between the first sidewall and the plane of the substrate, and the height of the first sidewall is equal to the height of the third sidewall in a direction perpendicular to the substrate.

7. The method of claim 6, wherein the height of the first sidewall in a direction perpendicular to the substrate is less than or equal to 500 angstroms, and the height of the first sidewall is greater than or equal to 200 angstroms.

8. The method of claim 1, wherein the step of forming an isolation structure on the side of the pixel defining material layer away from the substrate comprises: ​ ​ ​ ​ ​ ​ ​ forming a support material layer on a side of the pixel defining material layer facing away from the substrate; forming a barrier material layer on a side of the support material layer facing away from the substrate; patterning the support material layer and the barrier material layer to form a plurality of isolated openings.

9. The method of producing a display panel according to claim 1, wherein Further comprising: forming a light emitting unit on a side of the first electrode layer facing away from the substrate; forming a second electrode on a side of the light emitting unit facing away from the substrate.

10. The method of claim 9, wherein: the method of manufacturing the display panel further comprises forming an encapsulation portion on a side of the second electrode facing away from the substrate.

11. A display panel, characterized by, The display panel is manufactured by the method of any one of claims 1-10.

12. A display device, characterized by comprising: The display panel of claim 11.

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