Micro-jet heat exchange device for heating and cooling semiconductor chip

Abstract

The invention provides a micro-jet heat exchange device for heating and cooling a semiconductor chip, which comprises a box body, a double-layer micro-jet heat exchange device, a cooling liquid circulation system, a refrigerant heat exchange system and a chip fixing device, and is characterized in that the double-layer micro-jet heat exchange device is arranged in the box body; the cooling liquid circulation system is connected with the left end and the right end of the double-layer micro-jet heat exchange device, the refrigerant heat exchange system is arranged in the double-layer micro-jet heat exchange device, and the chip fixing device is arranged over the box body. The TEC chip is in direct contact with the cooling liquid for heat exchange, when the TEC chip needs to be cooled, heat generated by the chip is taken away through the cooling liquid subjected to jet flow impact and ultrasonic acceleration disturbance, and the problems that the local temperature of the TEC chip is too high and heat flow density concentrated areas are rapidly cooled can be effectively solved.

Description

Technical Field

[0001] The invention belongs to the field of chip equipment, and in particular relates to a microfluidic heat exchange device for heating and cooling a semiconductor chip. Background Art

[0002] Traditional TEC chips are heated and cooled by metal surface contact heat transfer, that is, the heat generated by the TEC chip is taken away by the metal heat sink through the contact between the cold or hot surface of the TEC chip and the surface of the metal heat sink. This heat dissipation method has a large thermal resistance and slow heat dissipation due to the influence of metal materials and contact area, and cannot meet the application scenarios with high power and high heat flux density. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the above technical problems, the present invention provides a micro-jet heat exchange device for raising and lowering the temperature of a semiconductor chip. Heat exchange is performed through direct contact between the TEC chip and the coolant. When the TEC chip needs to be cooled, the coolant is disturbed by the jet impact and ultrasonic acceleration and takes away the heat generated by the chip. This can effectively solve the problem of excessive local temperature of the TEC chip and rapid heat dissipation in concentrated areas of heat flux density.

[0005] (II) Technical solution

[0006] The present invention provides a micro-jet heat exchange device for raising and lowering the temperature of a semiconductor chip, comprising a box body, a double-layer micro-jet heat exchange device, a coolant circulation system, a refrigerant heat exchange system and a chip fixing device. The double-layer micro-jet heat exchange device is arranged inside the box body, the coolant circulation system is connected to the left and right ends of the double-layer micro-jet heat exchange device, the refrigerant heat exchange system is arranged inside the double-layer micro-jet heat exchange device, and the chip fixing device is arranged directly above the box body.

[0007] In some embodiments of the present invention, the double-layer microjet heat exchange device includes an injection chamber, a retention chamber, an ultrasonic excitation device, a microjet tube, a coolant inlet, a coolant outlet, a refrigerant inlet and a refrigerant outlet, the injection chamber is arranged above the retention chamber, the ultrasonic excitation device is arranged inside the retention chamber, the microjet tube connects the injection chamber and the retention chamber, the coolant inlet is arranged on the left side of the retention chamber, the coolant outlet is arranged on the right side of the injection chamber, and the refrigerant inlet and the refrigerant outlet are both arranged on the right side of the retention chamber.

[0008] In some embodiments of the present invention, the coolant circulation system includes a liquid storage and circulation device, a coolant circulation pipeline and a coolant. The coolant circulation pipeline is arranged around the outer ring of the box body, and the two ends of the coolant circulation pipeline are respectively connected to the coolant inlet and the coolant outlet. The liquid storage and circulation device is arranged on the coolant circulation pipeline on the back of the box body, and the coolant is driven by the liquid storage and circulation device to circulate in the double-layer micro-jet heat exchange device.

[0009] In some embodiments of the present invention, the refrigerant heat exchange system includes a refrigerant heat exchange tube and a refrigerant. The refrigerant heat exchange tube is arranged inside a retention cavity above the ultrasonic excitation device, and the refrigerant flows in the refrigerant heat exchange tube.

[0010] In some embodiments of the present invention, an opening is provided at the box below the chip fixing device.

[0011] In some embodiments of the present invention, a plurality of microfluidic tubes are provided and distributed in a rectangular array.

[0012] In some embodiments of the present invention, the microfluidic tube is disposed directly below the opening.

[0013] In some embodiments of the present invention, the refrigerant heat exchange tube is bent and surrounded inside the retention cavity.

[0014] In some embodiments of the present invention, a gap is provided between the injection chamber and the retention chamber, and the gap is smaller than the height of the microfluidic tube.

[0015] In some embodiments of the present invention, the injection chamber and the retention chamber are of the same size.

[0016] (III) Beneficial effects

[0017] It can be seen from the above technical solution that the present invention has the following beneficial effects:

[0018] The present invention adopts a combination of semi-immersion cooling and jet cooling technology, fully utilizing the coldness of the refrigerant in the refrigerant heat exchange tube, rapidly raising and lowering the temperature of the coolant in the heat exchanger, and absorbing the heat generated by the TEC chip by the jet impact and ultrasonic acceleration disturbance in the liquid. The heat generated by the TEC chip is taken away by heat exchange between the coolant and the refrigerant heat exchange tube, thereby achieving the purpose of rapid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0020] Figure 2 It is a front view of the present invention.

[0021] Figure 3It is a top view of the present invention.

[0022] Figure 4 Schematic diagram of the structure of the double-layer micro-jet heat exchange device.

[0023] [Description of the main components of the present invention]

[0024] 1. Chip fixing device; 2. Double-layer micro-jet heat exchange device; 3. Refrigerant heat exchange tube; 4. Ultrasonic excitation device; 5. Coolant circulation pipeline; 6. Liquid storage and circulation device;

[0025] 7. Coolant inlet; 8. Micro jet tube; 9. Coolant outlet;

[0026] 10. Refrigerant import; 11. Refrigerant export. DETAILED DESCRIPTION

[0027] The present invention provides a microfluidic heat exchange device for raising and lowering the temperature of a semiconductor chip. To make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. Specific embodiments

[0029] Example

[0030] like Figure 1-4 As shown, the present invention provides a micro-jet heat exchange device for raising and lowering the temperature of a semiconductor chip, comprising a box, a double-layer micro-jet heat exchange device 2, a coolant circulation system, a refrigerant heat exchange system and a chip fixing device 1, wherein the double-layer micro-jet heat exchange device 2 is arranged inside the box, and the double-layer micro-jet heat exchange device 2 comprises an injection chamber, a retention chamber, an ultrasonic excitation device 4, a micro-jet tube 8, a coolant inlet 7, a coolant outlet 9, a refrigerant inlet 10 and a refrigerant outlet 11, wherein the injection chamber is arranged above the retention chamber, The ultrasonic excitation device 4 is arranged inside the retention chamber, the microjet tube 8 connects the injection chamber and the retention chamber, the coolant inlet 7 is arranged on the left side of the retention chamber, the coolant outlet 9 is arranged on the right side of the injection chamber, the refrigerant inlet 10 and the refrigerant outlet 11 are both arranged on the right side of the retention chamber, and a gap is provided between the injection chamber and the retention chamber, and the gap is smaller than the height of the microjet tube 8. A plurality of microjet tubes 8 are provided and distributed in a rectangular array, and the injection chamber and the retention chamber have the same size.

[0031] The coolant circulation system is connected to the left and right ends of the double-layer micro-jet heat exchange device 2. The coolant circulation system includes a liquid storage and circulation device 6, a coolant circulation pipeline 5 and a coolant. The coolant circulation pipeline 5 is arranged around the outer ring of the box body. The two ends of the coolant circulation pipeline 5 are respectively connected to the coolant inlet 7 and the coolant outlet 9. The liquid storage and circulation device 6 is arranged at the coolant circulation pipeline 5 on the back of the box body. The coolant is driven by the liquid storage and circulation device 6 to circulate in the double-layer micro-jet heat exchange device 2.

[0032] The refrigerant heat exchange system is arranged inside the double-layer micro-jet heat exchange device 2, and the refrigerant heat exchange system includes a refrigerant heat exchange tube 3 and a refrigerant. The refrigerant heat exchange tube 3 is arranged above the ultrasonic excitation device 4. The refrigerant heat exchange tube 3 is bent and surrounded inside the retention cavity, and the refrigerant flows in the refrigerant heat exchange tube.

[0033] The chip fixing device 1 is arranged directly above the box body, an opening is arranged at the box body below the chip fixing device 1, and the micro fluidic tube 8 is arranged directly below the opening.

[0034] Work Scene

[0035] Cooling scenario: the coolant is driven by the liquid storage and circulation device 6 from the storage chamber of the double-layer micro-jet heat exchange device 2 into the injection chamber to take away the heat of the TEC chip; the coolant exchanges heat with the refrigerant heat exchange tube 3 during the circulation process to cool the coolant in the storage chamber. The cooled coolant enters the injection chamber through the micro-jet tube 8 and is sprayed onto the surface of the TEC chip to cool the TEC chip. The ultrasonic excitation device 4 vibrates to enhance the convective heat exchange between the refrigerant heat exchange tube 3 and the coolant and reduce the effect of thermal resistance.

[0036] Heating scenario: The refrigerant is heated by an external device, and then the coolant is heated by the refrigerant heat exchange tube 3. The heated coolant is sprayed onto the surface of the TEC chip by the micro-jet tube 8 to compensate the temperature of the cold surface of the TEC chip, thereby meeting the chip heating requirements.

[0037] So far, the present embodiment has been described in detail with reference to the accompanying drawings. Based on the above description, those skilled in the art should have a clear understanding of the present invention.

[0038] It should be noted that the implementation methods not shown or described in the drawings or the text of the specification are all forms known to ordinary technicians in the relevant technical field and are not described in detail. In addition, the above definitions of each element and method are not limited to the various specific structures, shapes or methods mentioned in the embodiments.

[0039] It should also be noted that this document may provide demonstrations of parameters containing specific values, but these parameters do not need to be exactly equal to the corresponding values, but can be approximated to the corresponding values ​​within an acceptable error tolerance or design constraint. The directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only reference directions of the accompanying drawings and are not intended to limit the scope of protection of the present invention. In addition, unless the steps are specifically described or must occur in sequence, the order of the above steps is not limited to those listed above, and can be changed or rearranged according to the desired design. And the above embodiments can be mixed and matched with each other or with other embodiments based on design and reliability considerations, that is, the technical features in different embodiments can be freely combined to form more embodiments.

[0040] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip, characterized in that: It includes a box body, a double-layer micro-jet heat exchange device, a coolant circulation system, a refrigerant heat exchange system and a chip fixing device. The double-layer micro-jet heat exchange device is arranged inside the box body, the coolant circulation system is connected to the left and right ends of the double-layer micro-jet heat exchange device, the refrigerant heat exchange system is arranged inside the double-layer micro-jet heat exchange device, and the chip fixing device is arranged directly above the box body.

2. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 1, characterized in that: The double-layer micro-jet heat exchange device includes an injection chamber, a retention chamber, an ultrasonic excitation device, a micro-jet tube, a coolant inlet, a coolant outlet, a refrigerant inlet and a refrigerant outlet. The injection chamber is arranged above the retention chamber, the ultrasonic excitation device is arranged inside the retention chamber, the micro-jet tube connects the injection chamber and the retention chamber, the coolant inlet is arranged on the left side of the retention chamber, the coolant outlet is arranged on the right side of the injection chamber, and the refrigerant inlet and the refrigerant outlet are both arranged on the right side of the retention chamber.

3. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 2, characterized in that: The coolant circulation system includes a liquid storage and circulation device, a coolant circulation pipeline and a coolant. The coolant circulation pipeline is arranged around the outer ring of the box body, and the two ends of the coolant circulation pipeline are respectively connected to the coolant inlet and the coolant outlet. The liquid storage and circulation device is arranged at the coolant circulation pipeline on the back of the box body. The coolant is driven by the liquid storage and circulation device to circulate in the double-layer micro-jet heat exchange device.

4. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 2, characterized in that: The refrigerant heat exchange system includes a refrigerant heat exchange tube and a refrigerant. The refrigerant heat exchange tube is arranged inside a storage cavity above the ultrasonic excitation device, and the refrigerant flows in the refrigerant heat exchange tube.

5. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 2, characterized in that: An opening is provided at the box body below the chip fixing device.

6. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 5, characterized in that: The micro fluidic tubes are provided in a plurality and distributed in a rectangular array.

7. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 6, characterized in that: The microfluidic tube is arranged directly below the opening.

8. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 4, characterized in that: The refrigerant heat exchange tube is bent and surrounded inside the storage cavity.

9. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 2, characterized in that: A gap is provided between the injection cavity and the storage cavity, and the gap is smaller than the height of the micro jet tube.

10. The microfluidic heat exchange device for increasing or decreasing the temperature of a semiconductor chip according to claim 2, characterized in that: The injection chamber and the retention chamber have the same size.

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