Optical module

Abstract

An optical module (200) includes an upper housing (201), a lower housing (202), a circuit board (300), optical components (400, 500), and an optical connection component (900) mounted on the circuit board (300). A cavity formed by the upper shell (201) and the lower shell (202) is only provided with an opening (204) for placing the optical connection part (900) and a golden finger (301) on the circuit board (300); an optical device of the optical component (400, 500) is electrically connected with the circuit board (300), and comprises a first light emitting component connected with the optical connecting component (900) through a first optical fiber ribbon and a second light emitting component connected with the optical connecting component (900) through a second optical fiber ribbon; the optical connection part (900) comprises an optical fiber fixing part (902), a plug connector (904) and an insertion core assembly (905) connected with the plug connector (904), the optical fiber fixing part (902) comprises a connecting part and an insertion part (9021) which are connected with each other, a containing cavity for the plug connector (904) to be inserted is formed in the connecting part, a cavity (910) communicated with the containing cavity is formed in the insertion part (9021), the insertion core assembly (905) is inserted into the cavity (910) through the plug connector (904), and the insertion core assembly (905) is connected with the optical part (400). An optical fiber connected with the connector (904, 500) penetrates through the containing cavity to be optically connected with the insertion core assembly (905), an avoiding gap (9045) is formed in the connector (904), and the first optical fiber ribbon and the second optical fiber ribbon penetrate through the avoiding gap (9045).

Description

optical modules

[0001] This disclosure claims the priority of application number 202311227398.8 filed with the China Patent Office on September 21, 2023; the priority of application number 202311227445.9 filed with the China Patent Office on September 21, 2023; the priority of application number 202310798498.X filed with the China Patent Office on June 30, 2023; and the priority of application number 202310800649.0 filed with the China Patent Office on June 30, 2023. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] Optical communication technology is used in new services and application models such as cloud computing, mobile Internet, and video. In optical communications, optical modules are devices that realize the conversion of optical and electrical signals and are one of the key components in optical communication equipment.

[0004] Summary of the Invention

[0005] According to an embodiment of the present disclosure, an optical module is provided, comprising:

[0006] lower shell;

[0007] The upper shell is covered on the lower shell, and the upper shell and the lower shell form a cavity, and the cavity has only one opening;

[0008] A circuit board is located in the cavity, and a gold finger is formed on one end of the circuit board;

[0009] An optical component, wherein the optical device of the optical component is electrically connected to the circuit board, and the optical component is used to generate or receive an optical signal; wherein the optical component includes: a first light emitting component and a second light emitting component;

[0010] An optical connection component is mounted on a circuit board. The optical connection component and the gold finger are located at the opening. The optical connection component is optically connected to the first light emitting component via a first optical fiber ribbon. The optical connection component is optically connected to the second light emitting component via a second optical fiber ribbon. The first optical fiber ribbon passes through both sides of the second light emitting component and is connected to the optical connection component. The optical connection component is used to transmit optical signals. The optical connection component includes:

[0011] The optical fiber fixing member includes a connecting portion and an inserting portion connected to each other, wherein the connecting portion is mounted on the circuit board and the inserting portion is not connected to the circuit board; a receiving cavity is formed in the connecting portion, and sockets are formed at both ends of the receiving cavity; a cavity with two ends open is formed in the inserting portion, and the cavity is connected to the receiving cavity;

[0012] The ferrule assembly is inserted into the cavity through the socket, the ferrule assembly is not connected to the circuit board, and the first optical fiber ribbon and the second optical fiber ribbon pass through the accommodating cavity and are optically connected to the ferrule assembly;

[0013] The connector is inserted into the accommodating cavity through the socket. The connector is not connected to the circuit board. The connector is plugged and fixed to the core assembly. The connector is fixed in the accommodating cavity so that the core assembly can be installed in the cavity through the connector. An avoidance gap is formed on the connector, and the first optical fiber ribbon and the second optical fiber ribbon pass through the avoidance gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0015] FIG1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure;

[0016] FIG2 is a partial structural diagram of a host computer according to some embodiments of the present disclosure;

[0017] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0018] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0019] FIG5 is a partial structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0020] FIG6 is a partial exploded view of an optical module according to some embodiments of the present disclosure;

[0021] FIG7 is a structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure;

[0022] FIG8 is a partial exploded view of a light emitting component and a circuit board in an optical module according to some embodiments of the present disclosure;

[0023] FIG9 is a structural diagram of a light emitting component in an optical module according to some embodiments of the present disclosure;

[0024] FIG10 is a partial structural diagram of a light emitting component in an optical module according to some embodiments of the present disclosure;

[0025] FIG11 is a structural diagram of a fixing base in an optical module according to some embodiments of the present disclosure;

[0026] FIG12 is a partial top view of a light emitting component in an optical module according to some embodiments of the present disclosure;

[0027] FIG13 is a first cross-sectional view of an assembly of a light emitting component and a circuit board in an optical module according to some embodiments of the present disclosure;

[0028] FIG14 is a second cross-sectional view of the assembly of the light emitting component and the circuit board in the optical module according to some embodiments of the present disclosure;

[0029] FIG15 is another structural diagram of the first light emitting component in the optical module according to some embodiments of the present disclosure;

[0030] FIG16 is another partial structural diagram of the first light emitting component in the optical module according to some embodiments of the present disclosure;

[0031] FIG17 is a structural diagram of a first emitting housing in an optical module according to some embodiments of the present disclosure;

[0032] FIG18 is another cross-sectional view of the first light emitting component in the optical module according to some embodiments of the present disclosure;

[0033] FIG19 is a diagram illustrating an emission light path of a first light emitting component in an optical module according to some embodiments of the present disclosure;

[0034] FIG20 is a structural diagram of a photodetector in an optical module according to some embodiments of the present disclosure;

[0035] FIG21 is a structural diagram of a photodetector in an optical module provided at another angle according to some embodiments of the present disclosure;

[0036] FIG22 is an assembled cross-sectional view of a circuit board, a first light emitting component, and a second light emitting component in an optical module according to some embodiments of the present disclosure;

[0037] FIG23 is a structural diagram of an optical connection component in an optical module according to some embodiments of the present disclosure;

[0038] FIG24 is an exploded view of an optical connection component in an optical module according to some embodiments of the present disclosure;

[0039] FIG25 is a first structural diagram of an optical fiber fixing member in an optical module according to some embodiments of the present disclosure;

[0040] FIG26 is a second structural diagram of an optical fiber fixing member in an optical module according to some embodiments of the present disclosure;

[0041] FIG27 is a third structural diagram of an optical fiber fixing member in an optical module according to some embodiments of the present disclosure;

[0042] FIG28 is a structural diagram of a support frame in an optical module according to some embodiments of the present disclosure;

[0043] FIG29 is a first cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure;

[0044] FIG30 is a structural diagram 1 of a connector in an optical module according to some embodiments of the present disclosure;

[0045] FIG31 is a second structural diagram of a connector in an optical module according to some embodiments of the present disclosure;

[0046] FIG32 is a second cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure;

[0047] FIG33 is a third cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure;

[0048] FIG34 is a structural diagram of a cover in an optical module according to some embodiments of the present disclosure;

[0049] FIG35 is a third cross-sectional view of the optical connection component in the optical module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0050] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0051] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0052] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0053] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0054] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0055] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0056] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0057] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0058] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0059] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0060] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0061] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0062] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and FIG4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in FIG3 and FIG4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, a light emitting component 400, a light receiving component 500, and an optical connecting component 900. In some examples, the light emitting component 400 and the light receiving component 500 may also be referred to as optical components. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0063] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form the above-mentioned shell with at least one end open (right end opening 204 and / or left end opening); the outer contour of the shell is generally square.

[0064] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0065] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0066] The direction of the line connecting the two openings may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in FIG3 ), and the opening formed by the optical connecting component 900 is also located at the end of the optical module 200 (the right end in FIG3 ). That is, the optical module 200 has only one opening 204, which is an electrical port. The gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100. The opening 204 is also an optical port and is configured to be inserted into the optical connector of the host computer 100, so that the optical component in the optical module 200 is connected to the optical connector in the host computer 100.

[0067] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the optical connecting component 900 within the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for the aforementioned components. Furthermore, when assembling the circuit board 300, the light emitting component 400, the light receiving component 500, and the optical connecting component 900, the combined assembly of the upper housing 201 and the lower housing 202 facilitates the placement of positioning components, heat dissipation components, and electromagnetic shielding components for these components, facilitating automated production.

[0068] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0069] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer 100, or to release the fixed connection between the optical module 200 and the host computer 100.

[0070] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0071] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0072] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0073] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0074] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0075] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0076] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0077] FIG5 is a partial structural diagram of an optical module provided according to some embodiments of the present disclosure, and FIG6 is a partial exploded diagram of an optical module provided according to some embodiments of the present disclosure. As shown in FIG5 and FIG6, the cavity formed by the upper housing 201 and the lower housing 202 has only one opening 204, and the gold finger 301 is located at the opening 204. The optical components, such as the light emitting component 400 and the light receiving component 500, can be arranged on the circuit board 300 in a left-right direction (in some examples, the optical components can also be separated from the circuit board 300, and in some embodiments of the present disclosure, the optical components are arranged on the circuit board 300 as an example). The light emitting component 400 is located at the end of the circuit board 300 away from the gold finger 301, and the light receiving component 500 is located between the light emitting component 400 and the gold finger 301. The optical connecting component 900 is located at the end of the circuit board 300 near the gold finger 301. The light emitting component 400 and the light receiving component 500 are connected to the optical connecting component 900 via an optical fiber ribbon (in some examples, also referred to as an optical fiber) to achieve optical and electrical synchronization of the optical module 200.

[0078] The electrical connector in the host computer 100 is electrically connected to the gold finger 301 on the circuit board 300. The host computer 100 transmits an electrical signal to the circuit board 300. The optical emitting component 400 generates an optical signal driven by the electrical signal transmitted by the circuit board 300. The optical signal is transmitted to the optical connecting component 900 via the optical fiber ribbon. The optical connecting component 900 is optically connected to the optical connector in the host computer 100. In this way, the optical signal generated by the optical emitting component 400 is transmitted to the host computer 100 via the optical fiber ribbon and the optical connecting component 900 to realize light emission.

[0079] The external optical signal transmitted by the host computer 100 is transmitted to the optical receiving component 500 via the optical connecting component 900 and the optical fiber ribbon. The optical receiving component 500 converts the optical signal into an electrical signal, which is then transmitted to the host computer 100 via the gold finger 301 on the circuit board 300 to realize light reception.

[0080] In some embodiments, to avoid mutual interference between the optical fiber ribbons connecting the light emitting component 400 and the light receiving component 500, the central axis of the light emitting component 400 and the central axis of the light receiving component 500 do not coincide, so that the light emitting component 400 and the light receiving component 500 are staggered.

[0081] In some embodiments, the light receiving component 500 can be replaced by a light emitting component, that is, the optical module includes two light emitting components, and the two light emitting components and the optical connecting component 900 are arranged on the circuit board 300 along the left and right directions. The two light emitting components are respectively connected to the optical connecting component 900 through the optical fiber ribbon, and the optical signals emitted by the two light emitting components are transmitted to the optical connector of the host computer 100 via the optical connecting component 900 to realize the emission of multi-path light.

[0082] In some embodiments, to avoid mutual interference between the optical fiber ribbons connecting the two light emitting components, the central axes of the two light emitting components do not overlap, so that the two light emitting components are staggered.

[0083] The light emitting component 400 can also be replaced by a light receiving component, that is, the optical module includes two light receiving components, and the two light receiving components and the optical connecting component 900 are arranged on the circuit board 300 along the left and right directions. The two light receiving components are connected to the optical fiber ribbon and the optical connecting component 900 respectively. The external light signal transmitted by the upper computer 100 is transmitted to the two light receiving components via the optical connecting component 900 and the optical fiber ribbon. The two light receiving components convert the external light signal into an electrical signal, and the electrical signal is transmitted to the upper computer 100 via the circuit board 300 to realize the reception of multi-path light.

[0084] In some embodiments, to avoid mutual interference between the optical fiber ribbons connecting the two light receiving components, the central axes of the two light receiving components do not overlap, so that the two light receiving components are staggered.

[0085] In some embodiments, optical components, such as the light emitting component 400 and the light receiving component 500, or two light emitting components, or two light receiving components can be directly set on the circuit board 300, and the laser of the light emitting component 400 and / or the detector of the light receiving component 500 are electrically connected to the circuit board 300 through bonding, so that the light emitting component 400 generates an optical signal and the light receiving component 500 receives the optical signal.

[0086] In some embodiments, in order to ensure layout space on the circuit board 300 , the optical component and the circuit board 300 may be separated, and the optical component may be electrically connected to the circuit board 300 via a flexible circuit board.

[0087] Figure 7 is a structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure, and Figure 8 is a partial exploded view of the optical emitting component and circuit board in an optical module according to some embodiments of the present disclosure. As shown in Figures 7 and 8, in some embodiments of the present disclosure, the optical component is directly disposed on the circuit board 300 as an example for illustration. To reduce the bonding length between the circuit board 300 and the optical component, a mounting hole is formed on the circuit board 300, into which the optical component can be embedded. This allows the bonding surface of the optical component's laser or detector to be flush with the front surface of the circuit board 300, thereby reducing the loss of high-frequency signals in the optical module.

[0088] When the optical module 200 includes a first light emitting component and a second light emitting component, a first mounting hole 303 and a second mounting hole 305 are formed on the circuit board 300. The first mounting hole 303 and the second mounting hole 305 pass through the front and back sides of the circuit board 300. The first mounting hole 303 and the second mounting hole 305 are not connected. The first light emitting component is embedded in the first mounting hole 303, and the second light emitting component is embedded in the second mounting hole 305, so that the wiring surface of the laser of the first light emitting component and the wiring surface of the laser of the second light emitting component are flush with the front side of the circuit board 300.

[0089] In some embodiments, a first solder pad group 306 is provided on the edge of the circuit board 300 near the first mounting hole 303, and the laser of the first light emitting component embedded in the first mounting hole 303 is electrically connected to the first solder pad group 306 through bonding to achieve electrical connection between the laser and the circuit board 300, so as to drive the first light emitting component to generate multiple laser beams.

[0090] A second solder pad group 307 is provided on the edge of the circuit board 300 near the second mounting hole 305. The laser of the second light emitting component embedded in the second mounting hole 305 is electrically connected to the second solder pad group 307 through bonding to realize the electrical connection between the laser and the circuit board 300, so as to drive the second light emitting component to generate multiple laser beams.

[0091] In some embodiments, when the first light emitting component is embedded in the first mounting hole 303 and the second light emitting component is embedded in the second mounting hole 305, the first light emitting component can be completely embedded in the first mounting hole 303 and the second light emitting component can be completely embedded in the second mounting hole 305. The first light emitting component can also be partially embedded in the first mounting hole 303 and the second light emitting component can also be partially embedded in the second mounting hole 305.

[0092] When the first light emitting component is partially embedded in the first mounting hole 303 and the second light emitting component is partially embedded in the second mounting hole 305, in order to limit the first light emitting component and the second light emitting component, a first limiting hole 302 and a second limiting hole 304 may also be formed on the circuit board 300. The first mounting hole 303 is located between the first limiting hole 302 and the second mounting hole 305, and the second limiting hole 304 is located between the first mounting hole 303 and the second mounting hole 305. The first soldering pad group 306 is located between the first limiting hole 302 and the first mounting hole 303. The limiting component of the first light emitting component is embedded in the first limiting hole 302, and the light emitting assembly of the first light emitting component is embedded in the first mounting hole 303, so as to limit the first light emitting component through the first limiting hole 302, thereby reducing the distance between the laser of the first light emitting component and the first soldering pad group 306 on the circuit board 300.

[0093] The second solder pad group 307 is located between the second limiting hole 304 and the second mounting hole 305, the limiting component of the second light emitting component is embedded in the second limiting hole 304, and the light emitting component of the second light emitting component is embedded in the second mounting hole 305, so as to limit the second light emitting component through the second limiting hole 304, thereby reducing the distance between the laser of the second light emitting component and the second solder pad group 307 on the circuit board 300.

[0094] Referring to Figure 8, when the first light emitting component is partially embedded in the first mounting hole 303, the first light emitting component is placed under the circuit board 300, and then the first light emitting component is moved from bottom to top so that the limiting component of the first light emitting component is embedded in the first limiting hole 302, and the light emitting component of the first light emitting component is embedded in the first mounting hole 303 until the shell of the first light emitting component is bonded and fixed to the back of the circuit board 300.

[0095] When partially embedding the second light emitting component into the second mounting hole 305, place the second light emitting component under the circuit board 300, and then move the second light emitting component from bottom to top so that the limiting component of the second light emitting component is embedded in the second limiting hole 304, and the light emitting component of the second light emitting component is embedded in the second mounting hole 305 until the shell of the second light emitting component is bonded and fixed to the back of the circuit board 300.

[0096] In some embodiments, the width dimension of the first mounting hole 303 (the dimension perpendicular to the left-right direction) may be larger than the width dimension of the first limiting hole 302, the length dimension of the first mounting hole 303 (the dimension along the left-right direction) may be larger than the length dimension of the first limiting hole 302, the width dimension of the second mounting hole 305 may be larger than the width dimension of the second limiting hole 304, and the length dimension of the second mounting hole 305 may be larger than the length dimension of the second limiting hole 304.

[0097] The width dimension of the first mounting hole 303 may also be equal to the width dimension of the second mounting hole 305, the length dimension of the first mounting hole 303 may also be equal to the length dimension of the second mounting hole 305, the width dimension of the first limiting hole 302 may also be equal to the width dimension of the second limiting hole 304, and the length dimension of the first limiting hole 302 may also be equal to the length dimension of the second limiting hole 304.

[0098] FIG9 is a structural diagram of a light emitting component in an optical module according to some embodiments of the present disclosure, and FIG10 is a partial structural diagram of a light emitting component in an optical module according to some embodiments of the present disclosure. As shown in FIG9 and FIG10, when the optical module 200 includes a first light emitting component and a second light emitting component, the structure of the first light emitting component and the second light emitting component are the same. In some embodiments of the present disclosure, the first light emitting component is used as a specific example for illustration. In some examples of the embodiments of the present disclosure, the first light emitting component includes a fixed base 401, a cover shell 402 and a light emitting assembly. The cover shell 402 covers the fixed base 401 to form an emission cavity, and the light emitting assembly is located in the emission cavity.

[0099] The width of the fixed base 401 can be less than or equal to the width of the first mounting hole 303. A limiting boss 409 is provided at one end of the fixed base 401 away from the gold finger 301. The limiting boss 409 is embedded in the first limiting hole 302. The right end of the fixed base 401 is embedded in the first mounting hole 303. The side of the fixed base 401 can be bonded and fixed to the side wall of the first mounting hole 303, so that the optical emission component installed on the fixed base 401 is located in the first mounting hole 303.

[0100] In some embodiments, the top surface of the fixed base 401 can also be fixed to the back surface of the circuit board 300, that is, the width of the fixed base 401 is greater than the width of the first mounting hole 303, and a portion of the top surface of the fixed base 401 is exposed through the first mounting hole 303, so that the light emitting component can be installed on the exposed fixed base 401, so that the light emitting component is embedded in the first mounting hole 303. A limiting boss 409 is provided at one end (left end) of the fixed base 401 away from the gold finger 301. The limiting boss 409 protrudes from the top surface of the fixed base 401 and is embedded in the first limiting hole 302, so that the first light emitting component is limited by the limiting boss 409.

[0101] The light emitting component includes a laser group 403, a collimating lens group 404 and a first optical fiber bracket 407. The laser group 403, the collimating lens group 404 and the first optical fiber bracket 407 are installed on the fixed base 401 in sequence along the left and right directions. The laser group 403 is located on the left side of the fixed base 401. The laser group 403 is close to the limiting boss 409, and there is a gap between the laser group 403 and the limiting boss 409 in the left and right directions. The gap is set corresponding to the gap between the first limiting hole 302 and the first mounting hole 303, so that the laser group 403 is close to the first solder pad group 306.

[0102] The top surface of the fixed base 401 is glued and fixed to the back surface of the circuit board 300, the limiting boss 409 is embedded in the first limiting hole 302, and the light emitting component installed on the fixed base 401 is embedded in the first mounting hole 303. The laser group 403 is close to the first solder pad group 306, and the wiring surface of the laser group 403 is flush with the top surface of the circuit board 300, so as to facilitate the electrical connection between the laser group 403 and the first solder pad group 306 through wiring.

[0103] The first optical fiber bracket 407 is fixedly installed on the right side of the fixed base 401. An emitting optical fiber ribbon 408 is fixed in the first optical fiber bracket 407. The optical signal generated by the laser group 403 is transmitted from left to right to the emitting optical fiber ribbon 408 in the first optical fiber bracket 407. The emitting optical fiber ribbon 408 is optically connected to the optical connecting component 900, so that the optical signal is transmitted to the optical connecting component 900 via the emitting optical fiber ribbon.

[0104] The collimating lens group 404 is located in the light emitting direction of the laser group 403 . The multiple signal lights generated by the laser group 403 are converted into multiple collimated lights by the collimating lens group 404 . The multiple collimated lights are then emitted into the transmitting optical fiber ribbon 408 in the first optical fiber holder 407 .

[0105] The laser group 403 includes multiple lasers, and the collimating lens group 404 includes multiple collimating lenses. Each laser emits a laser beam. The collimating lens corresponds to the laser one-to-one, and the collimating lens is set in the light output direction of the laser. The collimating lens converts the laser beam emitted by the laser into a collimated beam. One collimated beam is transmitted to an optical fiber of the emitting optical fiber ribbon 408, thereby realizing the emission of multiple light paths.

[0106] In some embodiments, the laser group 403 can emit multiple signal lights of the same wavelength, and the multiple signal lights of the same wavelength are transmitted to the host computer 100 through the transmitting optical fiber ribbon 408 and the optical connecting component 900; the laser group 403 can also emit signal lights of multiple different wavelengths, and the multiple signal lights of different wavelengths are transmitted to the host computer 100 through the transmitting optical fiber ribbon 408 and the optical connecting component 900.

[0107] To facilitate the transmission of the collimated light beam to the optical fiber of the emitting optical fiber ribbon 408, the optical emission component also includes a converging lens group 405, which is located between the collimating lens group 404 and the first optical fiber bracket 407. The converging lens group 405 includes multiple converging lenses, which correspond one-to-one to the collimating lenses, and the converging lenses are arranged in the direction of the output light of the collimating lens. The converging lenses converge the collimated light beam output by the collimating lens into the emitting optical fiber ribbon 408 in the first optical fiber bracket 407.

[0108] In some embodiments, the optical emission component also includes an isolator group 406, which is located between the converging lens group 405 and the first optical fiber bracket 407. The isolator group 406 includes multiple isolators. The converging light beam output by the converging lens is emitted into the optical fiber through the isolator. Part of the light beam is reflected at the end face of the optical fiber. The reflected light is isolated by the isolator and cannot pass through the isolator. In this way, the reflected light will not return to the laser group 403 along the original path, thereby ensuring the luminescence performance of the laser group 403.

[0109] In some embodiments, the laser group 403 further includes a semiconductor cooler (TEC) 410, which is attached to the top surface of the fixed base 401. The TEC 410 is used to support the fixed substrate, which is used to support the fixed laser group 403 and the collimating lens group 404. In this way, the heat generated by the laser is transferred to the substrate and the TEC 410 in turn, and the heat dissipation of the laser is effectively achieved through the TEC 410, thereby preventing the temperature of the laser from affecting the wavelength of the emitted light beam.

[0110] In some embodiments, each laser of the laser group 403 can be mounted on a laser heat sink, the laser heat sink is mounted on a substrate, the substrate is mounted on the cooling surface of TEC410, and the heating surface of TEC410 is mounted on the top surface of the fixed base 401 to adjust the temperature of the laser through TEC410.

[0111] TEC410 can adjust the temperature of the laser and also raise the installation height of the laser so that the installation height of the laser is the same as the front height of the circuit board 300, thereby shortening the bonding length between the laser and the pad group on the circuit board 300.

[0112] In some embodiments, when TEC410 is installed on the top surface of the fixed base 401, there is a preset gap between the left end surface of TEC410 and the right end surface of the limiting boss 409, so that the gap between the first limiting hole 302 and the first mounting hole 303 is placed within the preset gap to ensure that the limiting boss 409 is embedded in the first limiting hole 302, and the laser group 403 and TEC410 are embedded in the first mounting hole 303.

[0113] In some embodiments, a positioning groove can be set on the top surface of the fixed base 401, and the positioning groove is close to the limiting boss 409. There is a preset gap between the left side of the positioning groove and the right end surface of the limiting boss 409. The TEC410 is installed in the positioning groove to facilitate the installation of the TEC410 on the fixed base 401 and ensure that there is a preset gap between the TEC410 and the limiting boss 409.

[0114] Figure 11 is a structural diagram of a fixed base in an optical module according to some embodiments of the present disclosure. As shown in Figure 11, to allow the fixed base 401 to mount the fixed optical transmission assembly, a mounting boss 412 is formed on the top surface of the fixed base 401. The top surface of the mounting boss 412 protrudes from the top surface of the fixed base 401. The top surface of the limiting boss 409 protrudes from the top surface of the mounting boss 412. The converging lens assembly 405 and the isolator assembly 406 are mounted on the top surface of the mounting boss 412.

[0115] Because the laser assembly 403 and the collimating lens assembly 404 are mounted on the TEC 410, the TEC 410 raises the mounting height of the laser assembly 403 and the collimating lens assembly 404. To ensure the coupling accuracy of the laser beams, the central axes of the laser assembly 403, the collimating lens assembly 404, the converging lens assembly 405, the isolator assembly 406, and the transmitting optical fiber ribbon 408 must coincide. Therefore, the mounting height of the converging lens assembly 405 and the isolator assembly 406 is raised by the mounting boss 412, and the transmitting optical fiber ribbon 408 is fixed and raised by the first optical fiber bracket 407. This ensures that the central axes of the laser assembly 403, the collimating lens assembly 404, the converging lens assembly 405, the isolator assembly 406, and the transmitting optical fiber ribbon 408 coincide, thereby improving the coupling accuracy of the optical transmission assembly.

[0116] Since the width of the first limiting hole 302 is smaller than that of the first mounting hole 303 , the limiting boss 409 is embedded in the first limiting hole 302 and the fixing base 401 is embedded in the first mounting hole 303 . Therefore, the width of the limiting boss 409 is smaller than that of the fixing base 401 .

[0117] In some embodiments, since the top surface of the fixing base 401 is bonded and fixed to the back surface of the circuit board 300 and the mounting boss 412 is embedded in the first mounting hole 303 , the width of the mounting boss 412 is smaller than that of the fixing base 401 .

[0118] In some embodiments, a first glue guide groove 414 is also formed on the top surface of the fixed base 401. The first glue guide groove 414 is located between the right side of the mounting boss 412 and the right side of the fixed base 401. The first optical fiber bracket 407 is adhered to the first glue guide groove 414 by glue. The staff injects glue into the first glue guide groove 414 and then places the first optical fiber bracket 407 on the fixed base 401. The glue in the first glue guide groove 414 fills the gap between the first optical fiber bracket 407 and the top surface of the fixed base 401 to adhere the first optical fiber bracket 407 to the top surface of the fixed base 401.

[0119] In some embodiments, the first optical fiber bracket 407 is adhered to the top surface of the fixed base 401, and the isolator assembly 406 is mounted on the mounting boss 412. To prevent direct contact between the isolator assembly 406 and the optical fiber end face, a relief boss 413 is provided on the mounting boss 412. The relief boss 413 extends from the right end surface of the mounting boss 412 toward the first glue guide groove 414. The width of the relief boss 413 is less than or equal to the width of the mounting boss 412, and the height of the relief boss 413 is less than the height of the mounting boss 412, thereby facilitating the positioning and installation of the isolator assembly 406.

[0120] In some embodiments, to facilitate processing, the avoidance boss 413 and the installation boss 412 are an integrated structure, and a notch is formed downwardly from the top surface of the integrated boss, and the isolator assembly 406 is positioned and installed through the notch.

[0121] When the first optical fiber bracket 407 is pasted on the top surface of the fixed base 401, the left end face of the first optical fiber bracket 407 is in contact with the right end face of the avoidance boss 413, so that there is a gap between the left end face of the first optical fiber bracket 407 and the light-emitting end face of the isolator group 406 to ensure the coupling efficiency of the optical fiber.

[0122] In some embodiments, an identification surface 415 is formed on the right end face of the fixed base 401. The identification surface 415 is tilted so that the fixed base 401 is missing a corner. The identification surface 415 is used for direction identification to facilitate identification of the direction in which the fixed base 401 is embedded in the first mounting hole 303, thereby facilitating identification of the emission direction of the laser beam.

[0123] Figure 12 is a partial top view of the light emitting component in the optical module provided according to some embodiments of the present disclosure, Figure 13 is an assembly cross-sectional view 1 of the light emitting component and the circuit board in the optical module provided according to some embodiments of the present disclosure, and Figure 14 is an assembly cross-sectional view 2 of the light emitting component and the circuit board in the optical module provided according to some embodiments of the present disclosure. As shown in Figures 12, 13 and 14, in some embodiments of the present disclosure, the TEC410 is adhered to the top surface of the fixed base 401, the substrate is adhered to the cooling surface of the TEC410, the laser group 403 is adhered to the substrate, and the collimating lens group 404 is adhered to the substrate along the light output direction of the laser; then the converging lens group 405 and the isolator group 406 are adhered to the mounting boss 412, and the first optical fiber bracket 407 is adhered to the first glue guide groove 414, so that there is a gap between the first optical fiber bracket 407 and the isolator group 406; then the light emitting assembly on the fixed base 401 is embedded in the first mounting hole 303 from bottom to top, and the limiting boss 409 on the fixed base 401 is embedded in the first limiting hole 302, and then the top surface of the fixed base 401 is adhered and fixed to the back surface of the circuit board 300, thereby fixing the fixed base 401 and the light emitting assembly mounted on the fixed base 401 to the circuit board 300.

[0124] Then, the laser is connected to the first pad group 306 by bonding wires. The circuit board 300 transmits electrical signals to the laser group 403 through the first pad group 306 and the bonding wires, so that the laser group 403 generates multiple laser beams.

[0125] Multiple laser beams are converted into multiple collimated beams through the collimating lens group 404, and the multiple collimated beams are converted into multiple convergent beams through the converging lens group 405. The multiple convergent beams are directly coupled to the transmitting optical fiber ribbon 408 in the first optical fiber bracket 407 through the isolator group 406. The multiple optical signals are transmitted to the optical connection component 900 through the transmitting optical fiber ribbon 408, so as to transmit the multiple optical signals to the host computer 100 through the optical connection component 900, thereby realizing the emission of multiple lights.

[0126] In some embodiments, the optical emission component may not include the first optical fiber bracket 407 and the emission optical fiber ribbon 408. The optical emission component includes a laser group 403, a collimating lens group 404, an optical multiplexer, an isolator, a converging lens and an optical connector. The optical multiplexer is located between the collimating lens group and the isolator. The laser group 403 generates multiple laser beams driven by the electrical signal transmitted by the circuit board 300. The multiple laser beams are converted into multiple collimated beams by the collimating lens group 404. The multiple collimated beams are multiplexed into one composite light by the optical multiplexer. The composite light is transmitted to the converging lens through the isolator. The composite light is converged to the optical connector through the converging lens. The optical connector is optically connected to the optical connecting component 900 through the emission optical fiber to realize the optical connection between the optical emission component and the optical connecting component 900.

[0127] 8 , in some embodiments of the present disclosure, a cover 402 is placed on the fixed base 401, so that the optical emission assembly is located in the emission cavity formed by the fixed base 401 and the cover 402. The cover 402 includes a top plate and four side plates connected to the top plate. The four side plates can be placed on the top surface of the fixed base 401, and the bottom surfaces of the four side plates can be bonded to the top surface of the fixed base 401, so that the fixed cover 402 is supported by the fixed base 401.

[0128] A first avoidance groove can be formed on the side panel of the cover shell 402 facing the limiting boss 409, and the limiting boss 409 is embedded in the first avoidance groove to achieve bonding and fixation of the limiting boss 409 and the cover shell 402; a second avoidance groove is formed on the side panel of the cover shell 402 facing away from the limiting boss 409, and the second avoidance groove is used to avoid the first optical fiber bracket 407, so that the transmitting optical fiber ribbon 408 fixed in the first optical fiber bracket 407 passes through the second avoidance groove.

[0129] In some embodiments, when the limiting boss 409 is embedded in the first avoidance groove, the top plate of the cover shell 402 may be flush with the top surface of the limiting boss 409, or the top plate of the cover shell 402 may be recessed in the top surface of the limiting boss 409, and the groove wall of the first avoidance groove may be bonded and fixed to the side surface of the limiting boss 409 to achieve a sealed connection between the cover shell 402 and the limiting boss 409. In some examples, the top surface of the limiting boss 409 may also be lower than the top plate of the cover shell 402, and the top plate of the cover shell 402 may be placed on the top surface of the limiting boss 409, thereby achieving a sealed connection between the cover shell 402 and the limiting boss 409.

[0130] In some embodiments, the fixed base 401 can be first embedded in the first mounting hole 303, and the limiting boss 409 on the fixed base 401 can be embedded in the first limiting hole 302, so that the top surface of the fixed base 401 is bonded and fixed to the back surface of the circuit board 300; then the TEC410 is pasted on the top surface of the fixed base 401, and the laser group 403 and the collimating lens group 404 are bonded to the cooling surface of the TEC410 through the substrate, and there is a preset gap between the laser group 403 and the limiting boss 409.

[0131] Then, the converging lens group 405 and the isolator group 406 are pasted on the mounting boss 412 of the fixed base 401, and the first optical fiber bracket 407 is pasted on the first glue guide groove 414 on the fixed base 401; then, the lasers in the laser group 403 are electrically connected to the first solder pad group 306 on the circuit board 300 through bonding to drive the laser group 403 to generate multiple laser beams; then, the cover shell 402 is closed on the fixed base 401 to place the laser group 403, the collimating lens group 404, the converging lens group 405, the isolator group 406 and the first optical fiber bracket 407 in the emission cavity formed by the fixed base 401 and the cover shell 402.

[0132] Multiple laser beams are converted into multiple collimated beams through the collimating lens group 404, and the multiple collimated beams are converted into multiple convergent beams through the converging lens group 405. The multiple convergent beams are converged into the transmitting optical fiber in the first optical fiber bracket 407 through the isolator group 406. The multiple beams are transmitted to the optical connection component 900 via the transmitting optical fiber ribbon, and the multiple beams are then transmitted to the host computer 100 via the optical connection component 900, thereby realizing the emission of multiple lights.

[0133] FIG15 is another structural diagram of the first light emitting component in the optical module provided according to some embodiments of the present disclosure, FIG16 is another partial structural diagram of the first light emitting component in the optical module provided according to some embodiments of the present disclosure, and FIG17 is a structural diagram of the first emission housing in the optical module provided according to some embodiments of the present disclosure. As shown in FIG15-17, in some embodiments of the present disclosure, the optical component can also be separated from the circuit board, for example, the optical component is electrically connected to the circuit board via a flexible circuit board. In some examples, the optical component can include two light emitting components, namely a first light emitting component and a second light emitting component, wherein the first light emitting component can be electrically connected to the circuit board 300 via a first flexible circuit board 430; the first light emitting component also includes a first emission housing 411 and a first light emitting assembly, the first emission housing 411 is covered on the circuit board 300, and the first light emitting assembly is installed in the first emission housing 411, and there is a gap between the first light emitting assembly and the surface of the circuit board 300, and electrical components can be arranged on the circuit board 300 corresponding to the gap.

[0134] The side of the first flexible circuit board 430 facing away from the circuit board 300 is welded to one end of the first transmitting shell 411. A soldering pad is provided on the side of the first flexible circuit board 430 facing the circuit board 300. The first optical transmitting component is connected to the soldering pad by bonding wires. The first optical transmitting component generates an optical signal based on the electrical signal transmitted by the first flexible circuit board 430.

[0135] In some embodiments, the first optical emission component includes a laser group 4101, a collimating lens group 4102 and a second optical fiber bracket 4105. The laser group 4101, the collimating lens group 4102 and the second optical fiber bracket 4105 are arranged in sequence along the left and right directions. The laser group 4101 is located on the left side of the first emission shell 411, so that the laser group 4101 is close to the first flexible circuit board 430, and the installation height of the laser group 4101 is the same as the installation height of the first flexible circuit board 430; the second optical fiber bracket 4105 is located on the right side of the first emission shell 411, and the optical signal generated by the laser group 4101 is transmitted from left to right to the first optical fiber ribbon in the second optical fiber bracket 4105. The first optical fiber ribbon is optically connected to the optical connection component 900, so that the optical signal is transmitted to the optical connection component 900 via the first optical fiber ribbon.

[0136] In some embodiments, the second light emitting component can be electrically connected to the circuit board 300 through a second flexible circuit board. The second light emitting component includes a second emitting shell and a second light emitting assembly. The second emitting shell cover is arranged on the circuit board 300, and the second light emitting assembly is installed in the second emitting shell. There is a gap between the second light emitting assembly and the surface of the circuit board 300, and electrical devices can be arranged on the circuit board 300 corresponding to the gap.

[0137] The side of the second flexible circuit board facing away from the circuit board 300 is welded to one end of the second transmitting shell. A soldering pad is provided on the side of the second flexible circuit board facing the circuit board 300. The second optical transmitting component is connected to the soldering pad by bonding wires. The second optical transmitting component generates an optical signal based on the electrical signal transmitted by the second flexible circuit board.

[0138] The first transmitting housing 411 has the same structure as the second transmitting housing, and the second optical transmitting assembly has the same structure as the first optical transmitting assembly. The second optical transmitting assembly is connected to the optical connecting component 900 via a second optical fiber ribbon. The multi-channel signal light generated by the second optical transmitting assembly is transmitted to the host computer 100 via the second optical fiber ribbon and the optical connecting component 900. Figure 18 is another cross-sectional view of the first optical transmitting assembly in the optical module provided according to some embodiments of the present disclosure. As shown in Figures 17 and 18, the first transmitting housing 411 includes a second top plate 4110, a fifth side plate 4112, and a sixth side plate 4113. One end of the fifth side plate 4112 and the sixth side plate 4113 are respectively fixedly connected to the inner side surface of the second top plate 4110. The fifth side plate 4112 and the sixth side plate 4113 are arranged opposite each other. In this way, the second top plate 4110, the fifth side plate 4112, and the sixth side plate 4113 form a U-shaped housing.

[0139] A first boss 4114 is formed on one end of the second top plate 4110 facing the first flexible circuit board 430. The first boss 4114 extends from the left side of the second top plate 4110 to the right side. The left-right dimension of the first boss 4114 is smaller than the left-right dimension of the second top plate 4110. One side of the first flexible circuit board 430 is fixedly connected to the first boss 4114 so as to connect the first flexible circuit board 430 to the first launching shell 411 through the first boss 4114.

[0140] A first mounting surface 4111 is formed on the inner side surface of the second top plate 4110. The first mounting surface 4111 is located between the first boss 4114 and the right side surface of the second top plate 4110. The first mounting surface 4111 is recessed in the first boss 4114. The laser group 4101 is located on the first mounting surface 4111 to facilitate electrical connection of the laser group 4101 to the first flexible circuit board 430 through bonding.

[0141] 18 , in some embodiments, the laser group 4101 includes multiple laser heat sinks and multiple lasers. One laser is disposed on one laser heat sink, with the front of the laser facing the collimating lens to emit a laser beam. The laser heat sink is used to dissipate heat from the laser.

[0142] The laser group 4101 also includes a substrate 4108, which is located on the first mounting surface 4111. The substrate 4108 is used to support multiple laser heat sinks and collimating lens groups 4102, that is, multiple laser heat sinks and collimating lens groups 4102 can be glued to the substrate 4108 in sequence, and the laser is glued to the laser heat sink to support and fix the laser group 4101 through the substrate 4108.

[0143] In some embodiments, the laser group 4101 also includes a semiconductor cooler (TEC), which is attached to the first mounting surface 4111. The TEC is used to support and fix the substrate 4108, and the substrate 4108 is used to support and fix multiple laser heat sinks. The laser heat sink is used to support and fix the laser. In this way, the heat generated by the laser is transferred to the laser heat sink, the substrate 4108 and the TEC in turn, effectively realizing the heat dissipation of the laser.

[0144] The TEC can adjust the temperature of the laser and also raise the installation height of the laser so that the installation height of the laser is the same as that of the first flexible circuit board 430 , thereby shortening the bonding length between the laser and the first flexible circuit board 430 .

[0145] A second boss 4115 is also formed on the inner side surface of the second top plate 4110, and the first mounting surface 4111 is located between the first boss 4114 and the second boss 4115. The height of the second boss 4115 may be the same as that of the first boss 4114. The converging lens group 4103 and the isolator group 4104 are installed on the second boss 4115 so that the optical axis of the converging lens, the optical axis of the isolator and the optical axis of the collimating lens are located on the same plane, so that the collimated light emitted by the collimating lens can pass through the converging lens and the isolator smoothly.

[0146] A second mounting surface 4116 is also formed on the inner side surface of the second top plate 4110. The second boss 4115 is located between the first mounting surface 4111 and the second mounting surface 4116. The second mounting surface 4116 is recessed in the first mounting surface 4111. The second optical fiber holder 4105 is mounted on the second mounting surface 4116. An optical fiber ribbon is mounted on the upper part of the second optical fiber holder 4105. The optical axis of the optical fiber and the optical axis of the isolator are located on the same plane so that the light passing through the isolator can be converged into the optical fiber.

[0147] In some embodiments, the second optical fiber bracket 4105 is adhered to the second mounting surface 4116 by glue. To facilitate the injection of glue, a second glue guide groove 4117 is formed on the second mounting surface 4116. The second glue guide groove 4117 surrounds the second mounting surface 4116. The staff injects glue into the second glue guide groove 4117 and then places the second optical fiber bracket 4105 on the second mounting surface 4116. The glue in the second glue guide groove 4117 fills the gap between the second optical fiber bracket 4105 and the second mounting surface 4116 to adhere the second optical fiber bracket 4105 to the second mounting surface 4116.

[0148] Figure 19 is a diagram of the emission optical path of the first light emitting component in an optical module according to some embodiments of the present disclosure. As shown in Figure 19, a TEC is attached to a first mounting surface 4111, a substrate 4108 is attached to the TEC, multiple laser heat sinks are attached to the substrate 4108, multiple lasers are attached to the multiple laser heat sinks, and a collimating lens assembly 4102 is attached to the substrate 4108 along the laser light output direction. A converging lens assembly 4103 and an isolator assembly 4104 are then attached to a second boss 4115, a second fiber holder 4105 is attached to a second mounting surface 4116, and a first flexible printed circuit board 430 is attached to the first boss 4114. The first flexible printed circuit board 430 is connected to the laser assembly 4101 by bonding wires. The first flexible printed circuit board 430 is electrically connected to the circuit board 300. The circuit board 300 transmits electrical signals to the laser assembly 4101 through the first flexible printed circuit board 430, causing the laser assembly 4101 to generate multiple paths of light with different wavelengths.

[0149] Multiple channels of light with different wavelengths are converted into multiple collimated light beams by the collimating lens group 4102, and the multiple collimated light beams are converted into multiple convergent light beams by the converging lens group 4103. The multiple convergent light beams are directly coupled to the optical fiber ribbon in the second optical fiber bracket 4105 through the isolator group 4104. The multiple optical signals are transmitted to the optical connection component 900 through the optical connection component 900, so that the multiple optical signals are transmitted to the host computer 100 through the optical connection component 900, thereby realizing the emission of multiple lights.

[0150] 16 , in some embodiments, to monitor the luminous power of the laser, the first optical emission assembly further includes a photodetector group 4106. The photodetector group 4106 includes a plurality of photodetectors, each corresponding to a laser. The photodetectors are located in the direction of light emission from the back of the laser, and collect the emitted light from the back of the laser. Since the optical power of the light emitted from the front of the laser is the same as the optical power of the light emitted from the back, the optical power emitted from the front of the laser can be obtained based on the optical power emitted from the back of the laser, and the optical power of the laser emission can be adjusted according to actual conditions.

[0151] Figure 20 is a structural diagram of a photodetector in an optical module according to some embodiments of the present disclosure, and Figure 21 is a structural diagram of a photodetector in an optical module according to some embodiments of the present disclosure from another angle. As shown in Figures 20 and 21, the photodetector includes a bottom surface, a top surface 4121, and an inclined surface 4122. The bottom surface is attached to the laser heat sink to secure the photodetector to the laser heat sink. An anode 4124 and a cathode 4123 are formed on the top surface 4121. The anode 4124 and cathode 4123 are electrically connected to the first flexible printed circuit board 430 via gold wires. The photodetector converts the collected emitted light into an electrical signal, which is transmitted via the first flexible printed circuit board 430 to the printed circuit board 300. The electrical signal is then calculated by the electrical components on the printed circuit board 300 to obtain the emitted light power of the laser.

[0152] In some embodiments, a groove 4125 is formed on the inclined surface 4122, and the groove 4125 has an opening at one end facing the laser. A photosensitive surface 4126 is formed in the groove 4125. When the laser beam emitted from the back of the laser inputs the photosensitive surface 4126, the laser beam enters the photodetector through the photosensitive surface 4126, and part of the laser beam may be reflected on the photosensitive surface 4126.

[0153] In some embodiments, the photosensitive surface 4126 is tilted so that when the laser beam is reflected on the photosensitive surface 4126, the reflected beam is set at a certain angle to the incident beam, and the reflected beam will not return to the laser along the incident light path, thereby ensuring the luminous performance of the laser.

[0154] 19 , in some embodiments, the photodetector is not located on the front or back side of the laser. Since the laser beam emitted from the back side of the laser is divergent light, the receiving direction of the photodetector is set at a preset angle to the light emitting direction from the back side of the laser, so that part of the laser beam emitted from the back side of the laser enters the photodetector to avoid the reflected light of the laser beam at the photosensitive surface 4126 returning to the laser.

[0155] In some embodiments, the photodetector is staggered with respect to the light emitting direction from the back of the laser, and the staggered distance between the photodetector and the light emitting direction from the back of the laser is 2 to 3 mm, so that 1% of the laser beam emitted from the back of the laser enters the photodetector, so as to monitor the emitted light power of the laser in real time through the photodetector.

[0156] Figure 22 is a cross-sectional view of the assembly of a circuit board, a first light emitting component, and a second light emitting component in an optical module according to some embodiments of the present disclosure. As shown in Figure 22, the first light emitting component's first emission housing 411 is mounted on the circuit board 300, and the first light emitting assembly of the first light emitting component is mounted on the first emission housing 411. A gap is provided between the first light emitting assembly and the surface of the circuit board 300, allowing the first light emitting component to be flip-mounted on the circuit board 300. The left end of the first flexible circuit board 430 is electrically connected to the circuit board 300, and the right end of the first flexible circuit board 430 is fixed to the first emission housing 411. The first light emitting assembly is electrically connected to the first flexible circuit board 430 via bonding wires, so that electrical signals transmitted from the circuit board 300 are transmitted to the first light emitting assembly via the first flexible circuit board 430, thereby driving the first light emitting component to generate multiple optical signals of different wavelengths. The multiple optical signals of different wavelengths are then transmitted to the optical connection component 900 via the first optical fiber ribbon.

[0157] The second emission shell cover of the second light emitting component is arranged on the circuit board 300, and the second light emitting assembly of the second light emitting component is arranged on the second emission shell. There is a gap between the second light emitting assembly and the surface of the circuit board 300, so that the second light emitting component can be flipped on the circuit board 300; the left end of the second flexible circuit board 440 is electrically connected to the circuit board 300, and the right end of the second flexible circuit board 440 is fixed on the second emission shell. The second light emitting assembly is electrically connected to the second flexible circuit board 440 through wiring, so as to transmit the electrical signal transmitted by the circuit board 300 to the second light emitting assembly through the second flexible circuit board 440, so as to drive the second light emitting component to generate multiple optical signals of different wavelengths, and the multiple optical signals of different wavelengths are transmitted to the optical connection component 900 through the second optical fiber ribbon.

[0158] As shown in Figure 22, a first electrical connection area and a second electrical connection area are formed on the circuit board 300. The first electrical connection area is located on the left side of the circuit board 300, and the second electrical connection area is located between the first electrical connection area and the gold finger 301. A first electrical socket 310 is provided on the first electrical connection area, and the first electrical socket 310 is electrically connected to the circuit board 300; a second electrical socket 320 is provided on the second electrical connection area, and the second electrical socket 320 is electrically connected to the circuit board 300.

[0159] A first electrical plug 4301 is provided on the side of the first flexible circuit board 430 that faces the circuit board 300. Due to the elasticity of the first flexible circuit board 430, one end of the first flexible circuit board 430 can be bent toward the circuit board 300. When the first electrical plug 4301 is inserted into the first electrical socket 310, the first flexible circuit board 430 is electrically connected to the circuit board 300 through the first electrical plug 4301 and the first electrical socket 310.

[0160] A second electrical plug 4401 is provided on the side of the second flexible circuit board 440 facing the circuit board 300. Due to the elasticity of the second flexible circuit board 440, one end of the second flexible circuit board 440 can be bent toward the circuit board 300. When the second electrical plug 4401 is inserted into the second electrical socket 320, the second flexible circuit board 440 is electrically connected to the circuit board 300 through the second electrical plug 4401 and the second electrical socket 320.

[0161] It can be understood that in other examples of the embodiments of the present application, the first socket can also be set on the first flexible circuit board, and accordingly, the first plug can be set on the circuit board 300. When the first plug is plugged into the first socket, the electrical connection between the first flexible circuit board and the circuit board is realized; in addition, the second socket can also be set on the second flexible circuit board, and the second plug can be set on the circuit board 300. When the second plug is plugged into the second socket, the electrical connection between the second flexible circuit board and the circuit board is realized.

[0162] In some embodiments, the optical axis of the first light emitting component 410 may coincide with the optical axis of the second light emitting component, or the optical axis of the first light emitting component 410 may not coincide with the optical axis of the second light emitting component, so that the first light emitting component and the second light emitting component are staggered, so that the optical fiber ribbon of the first light emitting component and the optical fiber ribbon of the second light emitting component are staggered, thereby avoiding signal crosstalk caused by the close distance between the optical fibers.

[0163] In some embodiments, the first optical fiber ribbon passes through both sides of the second light emitting component and is connected to the optical connecting component 900, so that the first optical fiber ribbon avoids the second light emitting component. Compared with the first optical fiber ribbon passing over the second light emitting component, the first optical fiber ribbon is avoided from being excessively bent when passing through both sides of the second light emitting component.

[0164] In some embodiments, in the optical module provided by the embodiments of the present disclosure, the light emitting component and / or the light receiving component are connected to the optical connecting component 900 through an optical fiber, and the optical connecting component 900 and the gold finger 301 are located on the same side (right side) of the optical module. When the optical module 200 is inserted into the upper computer 100, the gold finger 301 on the circuit board 300 is inserted into the electrical connector of the upper computer 100 to transmit the electrical signal from the upper computer 100 to the circuit board 300 through the gold finger 301; the optical connecting component 900 of the optical module is inserted into the optical connector of the upper computer 100 to transmit the optical signal emitted by the light emitting component to the upper computer 100 through the optical connecting component 900, so that the upper computer 100 has optoelectronic functions at the same time.

[0165] FIG23 is a structural diagram of an optical connection component in an optical module according to some embodiments of the present disclosure, and FIG24 is an exploded diagram of an optical connection component in an optical module according to some embodiments of the present disclosure. As shown in Figures 23 and 24, the optical connection component 900 includes an optical fiber fixing part 902, a support frame 903, a plug-in component 904 and a core assembly 905. The optical fiber fixing part 902 is fixed to the right side of the circuit board 300, and the optical fiber fixing part 902 is located above the gold finger 301; the support frame 903 is pasted on the circuit board 300, and the support frame 903 supports the optical fiber fixing part 902, so that the optical fiber fixing part 902 is fixed to the circuit board 300 through the support frame 903; the plug-in component 904 is located in the optical fiber fixing part 902, and the plug-in component 904 is fixed in the optical fiber fixing part 902, and the core assembly 905 is inserted into the optical fiber fixing part 902 through the plug-in component 904, so that when the optical connection component 900 is inserted into the optical connector of the host computer 100, the core assembly 905 is connected to the plug in the optical connector to realize the optical connection between the optical connection component 900 and the optical connector, thereby realizing the optical connection between the optical module 200 and the host computer 100.

[0166] In some embodiments, the optical connection component 900 also includes a cover body 901, which is covered on the circuit board 300. The optical fiber fixing component 902 is wrapped by the cover body 901. When the upper shell 201 is covered on the lower shell 202, the upper shell 201 is pressed on the cover body 901 to ensure the installation stability of the optical fiber fixing component 902 through the cover body 901.

[0167] Figure 25 is a structural diagram of a fiber optic fixing member in an optical module according to some embodiments of the present disclosure, Figure 26 is a structural diagram of a fiber optic fixing member in an optical module according to some embodiments of the present disclosure, and Figure 27 is a structural diagram of a fiber optic fixing member in an optical module according to some embodiments of the present disclosure. As shown in Figures 25-27, the fiber optic fixing member 902 includes a connecting portion and an inserting portion 9021. The connecting portion faces the light emitting component, and the inserting portion 9021 faces the gold finger 301. The connecting portion is fixed to the circuit board 300, and the inserting portion 9021 is fixedly connected to the connecting portion. When the optical connecting component 900 is inserted into the optical connector of the host computer 100, the inserting portion 9021 is inserted into the optical connector.

[0168] The connecting part includes a first top plate 9020, a first side plate 9022, a second side plate 9023 and a third side plate 9024. The first side plate 9022, the second side plate 9023 and the third side plate 9024 are respectively fixedly connected to the inner side surface of the first top plate 9020. The first side plate 9022 and the second side plate 9023 are arranged opposite to each other, and the third side plate 9024 is arranged opposite to the left side surface of the first top plate 9020. In this way, the first top plate 9020, the first side plate 9022, the second side plate 9023 and the third side plate 9024 form a square cavity. Openings are formed on the left and lower sides of the square cavity. The optical fiber ribbon connecting the first light emitting component 410 and the second light emitting component 420 is inserted into the connecting part through the opening on the left side of the connecting part.

[0169] 27 , a through hole 910 (also referred to as a cavity in some examples) is formed in the insertion portion 9021, and the through hole 910 is communicated with the cavity in the connecting portion (also referred to as a accommodating cavity in some examples), and the ferrule assembly 905 is inserted into the through hole 910 through the opening on the left side of the connecting portion, so that when the insertion portion 9021 is inserted into the optical connector of the host computer 100, the ferrule assembly 905 is connected to the plug in the optical connector.

[0170] In some embodiments, a first positioning post 9025 is provided on the side of the first side plate 9022 facing the circuit board 300, a second positioning post 9026 is provided on the side of the second side plate 9023 facing the circuit board 300, and a third positioning post and a fourth positioning post are provided on the side of the third side plate 9024 facing the circuit board 300. A plurality of positioning holes are formed on the circuit board 300, into which the first positioning post 9025, the second positioning post 9026, the third positioning post, and the fourth positioning post are respectively inserted. The optical fiber fixture 902 is fixedly connected to the plurality of positioning holes and the circuit board 300 via the first positioning post 9025, the second positioning post 9026, the third positioning post, and the fourth positioning post. In some examples, the first positioning post, the second positioning post, the third positioning post, and the second positioning post may also be provided on the circuit board 300, and correspondingly, positioning holes are provided on the sides of the first side plate 9022, the second side plate 9023, and the third side plate 9024 facing the circuit board 300. The optical fiber fixture 902 is fixed to the circuit board 300 through the engagement of the positioning posts with the positioning holes.

[0171] Figure 28 is a structural diagram of a support frame in an optical module according to some embodiments of the present disclosure, and Figure 29 is a first cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure. As shown in Figures 28 and 29, when the optical fiber fixture 902 is fixedly connected to the circuit board 300 via positioning posts and positioning holes, a support frame 903 is placed in the cavity between the connecting portion and the circuit board 300 to ensure the stability of the optical fiber fixture 902. The support frame 903 is attached to the circuit board 300, and the optical fiber fixture 902 is supported and fixed by the support frame 903.

[0172] The support frame 903 includes a support body 9030, the bottom surface of the support body 9030 can be adhered to the circuit board 300, and an avoidance groove 9035 is formed on the top surface of the support body 9030, which runs through the left and right sides. The optical fiber ribbon connected to the light emitting component passes over the avoidance groove 9035 and is inserted into the core assembly 905 to support the optical fiber ribbon through the avoidance groove 9035.

[0173] In some embodiments, the bottom surface of the bracket body 9030 may be provided with a first support platform 9033 and a second support platform 9034, and the first support platform 9033 and the second support platform 9034 are fixedly connected to the surface of the circuit board 300, so that there is a certain gap between the bottom surface of the bracket body 9030 and the circuit board 300, so as to facilitate the arrangement of electrical components and wiring in the gap, thereby saving the layout space of the circuit board 300.

[0174] The bracket body 9030 includes a first side surface 9031 and a second side surface 9032, and the first side surface 9031 and the second side surface 9032 respectively face the two lower side panels 2022 of the lower shell 202. The top surface of the first support platform 9033 is connected to the first side surface 9031, and the first support platform 9033 extends from the first side surface 9031 toward the lower side panel 2022; the top surface of the second support platform 9034 is connected to the second side surface 9032, and the second support platform 9034 extends from the second side surface 9032 toward the lower side panel 2022.

[0175] 25 and 29 , a first notch 906 is formed on the bottom surface of the first side plate 9022, located between the first positioning post 9025 and the third side plate 9024. A second notch 907 is formed on the bottom surface of the second side plate 9023, located between the second positioning post 9026 and the third side plate 9024. When the optical fiber fixture 902 is secured to the circuit board 300 via the positioning posts and positioning holes, the top surface of the bracket body 9030 abuts against the inner surface of the first top plate 9020, the first support platform 9033 is inserted into the first notch 906, and the second support platform 9034 is inserted into the second notch 907, thereby supporting the optical fiber fixture 902 via the support frame 903.

[0176] Figure 30 is a structural diagram of a connector in an optical module according to some embodiments of the present disclosure, and Figure 31 is a structural diagram of a connector in an optical module according to some embodiments of the present disclosure. As shown in Figures 30 and 31, to facilitate the insertion of the ferrule assembly 905 into the insertion portion 9021 of the optical fiber fixture 902, the connector 904 includes a connecting plate 9040, a first mounting platform 9041, and a second mounting platform 9042. The first mounting platform 9041 and the second mounting platform 9042 are respectively fixed to the connecting plate 9040. The first mounting platform 9041 and the second mounting platform 9042 are respectively adjacent to the two lower side panels 2022 of the lower housing 202. There is an avoidance gap 9045 between the first mounting platform 9041 and the second mounting platform 9042. The first optical fiber ribbon and the second optical fiber ribbon connecting the two optical emitting components are inserted into the ferrule assembly 905 through the avoidance gap 9045 to avoid the first and second optical fiber ribbons.

[0177] A first pin 9046 is provided on the right side of the first mounting platform 9041 (the side facing the gold finger 301), and the first pin 9046 extends from the right side of the first mounting platform 9041 toward the gold finger 301; a second pin 9047 is provided on the right side of the second mounting platform 9042, and the second pin 9047 extends from the right side of the second mounting platform 9042 toward the gold finger 301.

[0178] 24 , the ferrule assembly 905 is formed with pinholes extending through the left and right sides. The first pin 9046 and the second pin 9047 of the connector 904 are respectively inserted into the pinholes of the ferrule assembly 905. The left side of the ferrule assembly 905 contacts the right side of the connector 904, thereby securely connecting the connector 904 and the ferrule assembly 905. After securely connecting the connector 904 and the ferrule assembly 905, the connector 904 is secured within the optical fiber fixture 902, such that the ferrule assembly 905 is positioned within the insertion portion 9021 of the optical fiber fixture 902.

[0179] 30 , in some embodiments, a first inserting platform 9043 is formed on the side of the first mounting platform 9041 facing a lower side plate 2022, and the first inserting platform 9043 extends from the side of the first mounting platform 9041 toward a lower side plate 2022, and the size of the first inserting platform 9043 in the left and right directions is the same as the size of the first mounting platform 9041 in the left and right directions.

[0180] A second insertion platform 9044 is formed on the side of the second mounting platform 9042 facing the other lower side plate 2022, and the second insertion platform 9044 extends from the side of the second mounting platform 9042 toward the other lower side plate 2022, and the left-right dimensions of the second insertion platform 9044 are the same as the left-right dimensions of the second mounting platform 9042.

[0181] Referring to Figure 26, in some embodiments, a first slot 9081 is formed on the inner side surface of the first side plate 9022, the first slot 9081 is arranged along the left-right direction, and an opening is formed on the left side surface of the first slot 9081; a second slot is formed on the inner side surface of the second side plate 9023, the second slot is arranged along the left-right direction, and an opening is formed on the left side surface of the second slot.

[0182] Figure 32 is a second cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure, and Figure 33 is a third cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure. As shown in Figures 32 and 33, when securing the connector 904 to the optical fiber fixture 902, the first insert 9043 is inserted into the first slot 9081, and the second insert 9044 is inserted into the second slot, thereby achieving a fixed connection between the connector 904 and the optical fiber fixture 902.

[0183] In some embodiments, when assembling the optical connection component 900, the connector 904 and the core assembly 905 are first fixedly connected through pins and sockets, and then the connector 904 and the core assembly 905 are inserted through the opening on the left side of the optical fiber fixing component 902, so that the core assembly 905 is inserted into the insertion part 9021 of the optical fiber fixing component 902, and the connector 904 is fixed in the optical fiber fixing component 902 through the plug-in platform and the slot, thereby realizing the assembly of the optical fiber fixing component 902, the connector 904 and the core assembly 905.

[0184] After completing the assembly of the optical fiber fixing part 902, the connector 904 and the core assembly 905, the support frame 903 is fixedly installed on the circuit board 300, and then the positioning column at the bottom of the optical fiber fixing part 902 is inserted into the positioning hole on the circuit board 300 until the top surface of the support frame 903 abuts against the inner surface of the first top plate 9020, so as to support the optical fiber fixing part 902 through the support frame 903 and realize the fixation of the optical fiber fixing part 902 and the circuit board 300.

[0185] In some embodiments, after the connector 904 is fixed in the optical fiber fixing member 902 through the socket and the slot, in order to ensure the installation stability of the connector 904 and the core assembly 905, the left side of the connector 904 can be adhered to the right side of the support frame 903 to fix the connector 904 through the support frame 903.

[0186] After completing the assembly of the optical connection component 900, the first optical fiber ribbon connected to the first optical emitting component and the second optical fiber ribbon connected to the second optical emitting component are respectively inserted into the core assembly 905 through the support frame 903 and the connector 904, thereby realizing the optical connection between the first optical emitting component, the second optical emitting component and the optical connection component 900.

[0187] In some embodiments, to protect the optical fiber fixture 902 , the optical connection component 900 further includes a cover 901 , which is buckled onto the circuit board 300 , placing the optical fiber fixture 902 in a cavity formed by the cover 901 and the circuit board 300 .

[0188] Figure 34 is a structural diagram of a cover in an optical module according to some embodiments of the present disclosure, and Figure 35 is a third cross-sectional view of an optical connection component in an optical module according to some embodiments of the present disclosure. As shown in Figures 34 and 35, the cover body 901 includes a third top plate 9010, a first side wall 9011, and a second side wall 9012. The first side wall 9011 and the second side wall 9012 are respectively fixedly connected to the third top plate 9010. The first side wall 9011 and the second side wall 9012 are arranged opposite each other. The third top plate 9010, the first side wall 9011, and the second side wall 9012 form a U-shaped cover body, so that the left and right sides of the cover body 901 are formed with openings to facilitate the cover body 901 to cover the optical fiber fixing member 902.

[0189] In some embodiments, a first positioning member 9013 is formed on the inner side surface of the first side wall 9011, and the first positioning member 9013 may be a column extending from the inner side surface of the third top plate 9010 toward the circuit board 300; a first limiting column 9015 is also formed on the inner side surface of the first side wall 9011, and the first limiting column 9015 extends from the inner side surface of the third top plate 9010 toward the circuit board 300, and the first positioning member 9013 and the first limiting column 9015 are arranged in the left and right directions.

[0190] A second positioning member is formed on the inner side surface of the second side wall 9012, and the second positioning member extends from the inner side surface of the third top plate 9010 toward the direction of the circuit board 300; a second limiting column is also formed on the inner side surface of the second side wall 9012, and the second limiting column extends from the inner side surface of the third top plate 9010 toward the direction of the circuit board 300, and the second positioning member and the second limiting column are arranged in the left and right directions.

[0191] Referring to Figure 25, a first positioning groove 9027 is formed on the outer surface of the first side panel 9022, and the first positioning groove 9027 extends from the top surface of the first top panel 9020 toward the circuit board 300, and the first positioning groove 9027 is close to the third side panel 9024; a first limiting groove 908 is also formed on the outer surface of the first side panel 9022, and the first limiting groove 908 is recessed in the outer surface of the first side panel 9022, and the upper side surface and the left side surface of the first limiting groove 908 form openings.

[0192] A second positioning groove 9028 is formed on the outer surface of the second side plate 9023, and the second positioning groove 9028 extends from the top surface of the first top plate 9020 toward the circuit board 300, and the second positioning groove 9028 is close to the third side plate 9024; a second limiting groove 909 is also formed on the outer surface of the second side plate 9023, and the second limiting groove 909 is recessed in the outer surface of the second side plate 9023, and the upper side and left side of the second limiting groove 909 are formed with openings.

[0193] When the cover body 901 is covered on the optical fiber fixing part 902 from top to bottom, the first positioning part 9013 is inserted into the first positioning groove 9027, and the second positioning part is inserted into the second positioning groove 9028 to realize the positioning connection between the cover body 901 and the optical fiber fixing part 902; the right side surface of the first limiting column 9015 abuts against the right side wall of the first limiting groove 908, and the right side surface of the second limiting column abuts against the right side wall of the second limiting groove 909, so as to realize the limitation of the cover body 901 and the optical fiber fixing part 902 in the left and right directions through the positioning groove and the limiting wall.

[0194] In some embodiments, the bottom surface of the first positioning member 9013 and the bottom surface 9014 of the second positioning member may be recessed in the bottom surfaces of the first side wall 9011 and the second side wall 9012. When the cover body 901 is buckled onto the circuit board 300, the bottom surface of the first positioning member 9013 and the bottom surface 9014 of the second positioning member contact the front of the circuit board, and the first side wall 9011 and the second side wall 9012 wrap around the side wall of the circuit board 300, so that the cover body 901 wraps around the circuit board 300 to facilitate positioning and connection of the cover body 901.

[0195] In some embodiments, the left-right size of the cover body 901 may be larger than the left-right size of the connecting portion of the optical fiber fixing part 902, and the right side of the cover body 901 may be flush with the right side of the connecting portion. When the optical fiber ribbon is inserted into the core assembly 905, the cover body 901 can protect the optical fiber ribbon.

[0196] In some embodiments, the cover body 901 can be moved independently, and the cover body 901 can also be fixed on the inner side of the upper shell 201. When the upper shell 201 is covered on the lower shell 202, the cover body 901 is buckled on the optical fiber fixing part 902 to protect the optical fiber ribbon and the optical fiber fixing part 902 through the cover body 901.

[0197] The optical module provided by the embodiment of the present disclosure includes an upper shell, a lower shell, a circuit board, a first light emitting component, a second light emitting component and an optical connecting component. The upper shell is covered on the lower shell, and the upper shell and the lower shell form a cavity, which has only one opening; the circuit board is located in the cavity formed by the upper shell and the lower shell, and the gold finger on the right side of the circuit board is located at the opening of the cavity; the optical connecting component is installed on the circuit board, and the optical connecting component is located at the opening, that is, the optical connecting component and the gold finger are located on the same side of the circuit board, so that the optical port and the electrical port of the optical module are located at the same opening; the first light emitting component and the second light emitting component are installed on the circuit board through the mounting hole, and the first light emitting component and the second light emitting component are arranged in the left and right directions. The electrical signal transmitted by the upper computer is transmitted to the first light emitting component and the second light emitting component through the circuit board, so that the first light emitting component and the second light emitting component generate optical signals.

[0198] The first optical emitting component is optically connected to the optical connecting component through the first transmitting optical fiber ribbon, and the second optical emitting component is optically connected to the optical connecting component through the second transmitting optical fiber ribbon. When the optical module is inserted into the host computer, the optical connecting component is optically connected to the optical connector in the host computer to transmit the optical signal generated by the first optical emitting component and the second optical emitting component to the host computer. The host computer can use the optical signal as a signal source for its own use, or it can separate an optical fiber from itself to transmit the optical signal to other devices.

[0199] The optical module provided by the embodiment of the present disclosure sets the optical port and the electrical port at the same opening of the optical module. When the optical module is inserted into the host computer, the optical port and the electrical port are connected to the host computer respectively. The optoelectronic connection between the optical module and the host computer is realized by one plug and unplug, and the coupling between the optical port and the optical fiber is avoided, so that the coupling process between the optical port of the optical module and the host computer is simple and the coupling efficiency is improved.

[0200] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Lower housing; An upper shell, covering the lower shell, the upper shell and the lower shell forming a cavity, the cavity having only one opening; A circuit board is located in the cavity, and a gold finger is formed at one end of the circuit board; An optical component, wherein the optical device of the optical component is electrically connected to the circuit board, and the optical component is used to generate or receive an optical signal; wherein the optical component comprises: a first light emitting component and a second light emitting component; An optical connection component is mounted on the circuit board, the optical connection component and the gold finger are located at the opening, the optical connection component is optically connected to the first light emitting component through a first optical fiber ribbon, the optical connection component is optically connected to the second light emitting component through a second optical fiber ribbon, the first optical fiber ribbon passes through both sides of the second light emitting component and is connected to the optical connection component; the optical connection component is used to transmit an optical signal; wherein the optical connection component includes: The optical fiber fixing part comprises a connecting part and an inserting part connected to each other, wherein the connecting part is mounted on the circuit board, and the inserting part is not connected to the circuit board; a receiving cavity is formed in the connecting part, and sockets are formed at both ends of the receiving cavity; a cavity with two ends opened is formed in the inserting part, and the cavity is connected to the receiving cavity; A ferrule assembly is inserted into the cavity through the socket, the ferrule assembly is not connected to the circuit board, and the first optical fiber ribbon and the second optical fiber ribbon pass through the accommodating cavity and are optically connected to the ferrule assembly; A connector is inserted into the accommodating cavity through the socket, the connector is not connected to the circuit board, the connector is plugged and fixed to the core assembly, and the connector is fixed in the accommodating cavity so that the core assembly can be installed in the cavity through the connector; an avoidance gap is formed on the connector, and the first optical fiber ribbon and the second optical fiber ribbon pass through the avoidance gap.

2. The optical module according to claim 1, wherein: The connecting portion comprises: A first top plate, facing the upper shell, the first top plate being in contact with and connected to the upper shell; A first side plate, connected to the first top plate for supporting, and the first side plate is fixedly connected to the circuit board; A second side plate is supported and connected to the first top plate, the second side plate is fixedly connected to the circuit board, and the second side plate is arranged opposite to the first side plate; A third side plate is supported and connected to the first top plate, the third side plate is fixedly connected to the circuit board, the insertion portion is connected to the third side plate, and a socket is formed on the third side plate; The fourth side plate is supported and connected to the first top plate, the fourth side plate is fixedly connected to the circuit board, the fourth side plate is arranged opposite to the third side plate, another socket is formed on the fourth side plate, and the first top plate, the first side plate, the second side plate, the third side plate and the fourth side plate form a accommodating cavity with the sockets at both ends.

3. The optical module according to claim 2, wherein: The optical connection component also includes: The cover body is disposed on the circuit board, the connecting portion is position-limitingly connected to the cover body, the connecting portion is located inside the cover body, and the inserting portion is located outside the cover body.

4. The optical module according to claim 3, wherein: The cover body includes a third top plate, a first side wall and a second side wall, the inner side surface of the third top plate abuts against the first top plate, and the first side wall and the second side wall support and connect the third top plate; A first positioning member is formed on the inner side surface of the first side wall, a first positioning groove is formed on the outer side surface of the third side plate, and the first positioning member is inserted into the first positioning groove; A second positioning member is formed on the inner side surface of the second side wall, a second positioning groove is formed on the outer side surface of the fourth side plate, and the second positioning member is inserted into the second positioning groove.

5. The optical module according to claim 4, wherein: A first limiting column is formed on the inner side surface of the first side wall, and a first limiting groove is formed on the outer side surface of the third side plate, the first limiting groove is recessed in the outer side surface of the third side plate, and one side of the first limiting column abuts against the first limiting groove; A second limiting column is formed on the inner side surface of the second side wall, a second limiting groove is formed on the outer side surface of the fourth side plate, the second limiting groove is recessed in the outer side surface of the fourth side plate, and one side of the second limiting column abuts against the second limiting groove.

6. The optical module according to claim 2, wherein: A first positioning post is provided on the side of the first side plate facing the circuit board, a second positioning post is provided on the side of the second side plate facing the circuit board, and a third positioning post and a fourth positioning post are provided on the side of the third side plate facing the circuit board. The first positioning post, the second positioning post, the third positioning post and the fourth positioning post are inserted into the positioning holes on the circuit board to achieve the connection between the connecting part and the circuit board.

7. The optical module according to claim 6, wherein: The optical connection component also includes: A support frame is installed on the circuit board, the support frame is inserted into the accommodating cavity through a socket at the bottom of the accommodating cavity, and the support frame supports and connects the first top plate.

8. The optical module according to claim 7, wherein: A first notch is formed on a side of the first side plate facing the circuit board, and the first notch is located between the first positioning column and the third side plate; A second notch is formed on a side of the second side plate facing the circuit board, and the second notch is located between the second positioning column and the third side plate; The top surface of the support frame abuts against the inner side surface of the first top plate, and the bottom end of the support frame is inserted into the first notch and the second notch.

9. The optical module according to claim 8, wherein: The support frame comprises a support body, a top surface of which is formed with an escape groove, and the optical fiber ribbon passes through the escape groove and is inserted into the ferrule assembly; The bottom surface of the bracket body is provided with a first support platform and a second support platform, the first support platform and the second support platform are installed on the circuit board, and there is a gap between the bottom surface of the bracket body and the circuit board; the first support platform is inserted into the first notch, and the second support platform is inserted into the second notch.

10. The optical module according to claim 2, wherein: The plug-in connector comprises: Connecting plate; A first mounting platform is located on the connecting plate, a first pin is arranged on a side of the first mounting platform facing the gold finger, and the first pin is inserted into the plug core assembly; a first plug platform is formed on one side of the first mounting platform, and the first plug platform is inserted into a first slot on the inner side surface of the first side plate; A second mounting platform is located on the connecting plate, with a gap between the second mounting platform and the first mounting platform; a second pin is provided on the side of the second mounting platform facing the gold finger, and the second pin is inserted into the plug core assembly; a second plugging platform is formed on one side of the second mounting platform, the first mounting platform and the second mounting platform are located between the first plugging platform and the second plugging platform, and the second plugging platform is inserted into the second slot on the inner side surface of the second side panel.

11. The optical module according to claim 1, wherein: A limiting hole, a mounting hole and a pad group are formed on the circuit board, the limiting hole is not connected to the mounting hole, and the pad group is located on one side of the mounting hole; The optical component comprises: A fixed base is embedded in the mounting hole, the top surface of the fixed base is bonded and fixed to the back surface of the circuit board, a limiting boss is provided at one end of the fixed base, the limiting boss protrudes from the top surface of the fixed base, and the limiting boss is embedded in the limiting hole; An optical component is installed on the fixed base, the optical component is located in the mounting hole, there is a gap between the optical device and the limiting boss, the bonding height of the optical device is equal to the mounting height of the pad group, and the optical device is electrically connected to the pad group through bonding.

12. The optical module according to claim 11, wherein: The limiting hole and the mounting hole are arranged along the light transmission direction, the mounting hole is located between the limiting hole and the gold finger, and the pad group is located between the limiting hole and the mounting hole.

13. The optical module according to claim 11, wherein: The limiting hole includes a first limiting hole and a second limiting hole, and the mounting hole includes a first mounting hole and a second mounting hole; the first mounting hole is located between the first limiting hole and the gold finger, and the first limiting hole is not connected to the first mounting hole, and the pad group includes a first pad group and a second pad group, and the first pad group is located between the first limiting hole and the first mounting hole; The second limiting hole is located between the first mounting hole and the gold finger, the second mounting hole is located between the second limiting hole and the gold finger, the second limiting hole is not connected to the second mounting hole, and the second pad group is located between the second limiting hole and the second mounting hole.

14. The optical module according to claim 13, wherein: The width dimension of the first mounting hole is greater than the width dimension of the first limiting hole, and the length dimension of the first mounting hole is greater than the length dimension of the first limiting hole; The width dimension of the second mounting hole is greater than the width dimension of the second limiting hole, and the length dimension of the second mounting hole is greater than the length dimension of the second limiting hole; Alternatively, the width dimension of the first limiting hole is the same as the width dimension of the second limiting hole, and the length dimension of the first limiting hole is the same as the length dimension of the second limiting hole; The width dimension of the first mounting hole is the same as the width dimension of the second mounting hole, and the length dimension of the first mounting hole is the same as the length dimension of the second mounting hole.

15. The optical module according to claim 13, wherein: Central axes of the first limiting hole, the first mounting hole, the second limiting hole, and the second mounting hole do not coincide with a central axis of the circuit board.

16. The optical module according to claim 13, wherein: The optical component includes a first light emitting component and a second light emitting component, the limiting boss of the first light emitting component is embedded in the first limiting hole, the fixed base of the first light emitting component is embedded in the first mounting hole, and the optical device in the first light emitting component is electrically connected to the first pad group through wire bonding; the limiting boss of the second light emitting component is embedded in the second limiting hole, the fixed base of the second light emitting component is embedded in the second mounting hole, and the optical device in the second light emitting component is electrically connected to the second pad group through wire bonding.

17. The optical module according to claim 16, wherein: The fixed base is provided with a mounting boss and an avoidance boss connected to each other, the mounting boss is located between the limiting boss and the avoidance boss, the top surface of the avoidance boss protrudes from the top surface of the fixed base, the top surface of the mounting boss protrudes from the top surface of the avoidance boss, the top surface of the limiting boss protrudes from the top surface of the mounting boss, and the optical device connected to the first pad group by wire bonding is located between the limiting boss and the mounting boss; The first light emitting component and the second light emitting component have the same structure. The optical components of the first light emitting component include a converging lens group, an isolator group and a first optical fiber bracket. The converging lens group and the isolator group are installed on the mounting boss. The first optical fiber bracket is installed on the fixed base. The first optical fiber bracket is abutted against the avoidance boss so that there is a gap between the first optical fiber bracket and the isolator group.

18. The optical module according to claim 1, wherein: The first light emitting component comprises: A first transmitting housing, which is covered on the circuit board; A first light emitting assembly is installed in the first emitting housing, and the first light emitting assembly is used to generate an optical signal; A first flexible circuit board, one end of which is fixed to the first transmitting housing, the other end of which is electrically connected to the circuit board, and the first optical transmitting assembly is connected to the first flexible circuit board by wire bonding; The second light emitting component comprises: A second transmitting housing is covered on the circuit board; A second optical emission component is installed in the second emission housing, and the second optical emission component is used to generate an optical signal; One end of the second flexible circuit board is fixed on the second transmitting shell, the other end of the second flexible circuit board is electrically connected to the circuit board, and the second optical transmitting component is connected to the second flexible circuit board by wire bonding.

19. The optical module according to claim 18, wherein: The first launch housing comprises: A second top plate, facing the front of the circuit board, the first light emitting assembly is mounted on the second top plate, one end of the first flexible circuit board is fixedly connected to the second top plate; a first boss is formed on the second top plate, the first boss is located at one end of the second top plate, and a side of the first flexible circuit board facing away from the circuit board is fixedly connected to the first boss; a fifth side plate, located on the circuit board, the fifth side plate supporting the second top plate; A sixth side plate is located on the circuit board, the sixth side plate is arranged opposite to the fifth side plate, and the sixth side plate supports the second top plate.

20. The optical module according to claim 19, wherein: The second top plate is also formed with: A first mounting surface, located on the second top plate, wherein the first mounting surface is recessed into the first boss; The second boss is located on the second top plate, the first mounting surface is located between the first boss and the second boss, and the second boss protrudes from the the first mounting surface; The second mounting surface is located at the other end of the second top plate, the second boss is located between the first mounting surface and the second mounting surface, and the second mounting surface is recessed in the first mounting surface.

21. The optical module according to claim 20, wherein: The first light emitting assembly comprises: A laser group, comprising a plurality of lasers and a plurality of laser heat sinks, wherein the laser heat sink is mounted on the first mounting surface, the laser is mounted on the laser heat sink, and the laser is connected to the flexible circuit board by wire bonding; the laser group is used to generate signal light; A collimating lens group, mounted on the first mounting surface, the collimating lens group is located in the light emitting direction of the laser group, and the collimating lens group is used to convert the signal light generated by the laser into collimated light; A converging lens group is mounted on the second boss, and the converging lens group is used to convert the collimated light into converging light; The optical fiber bracket is installed on the second installation surface, the optical fiber ribbon is located in the optical fiber bracket, and the converged light is coupled into the optical fiber ribbon.

22. The optical module according to claim 21, wherein: The first light emitting assembly further comprises: The photoelectric detector group includes a plurality of photoelectric detectors, wherein the photosensitive surfaces of the photoelectric detectors are located in the light emitting direction of the back side of the laser, and the light receiving directions of the photoelectric detectors are arranged at a preset angle to the light emitting direction of the back side of the laser.

23. The optical module according to claim 22, wherein: The misalignment distance between the photoelectric detector and the back light emitting direction of the laser is 2-3 mm.

24. The optical module according to claim 18, wherein: A first electrical socket is provided on the circuit board, and the first electrical socket is electrically connected to the circuit board; A first electrical plug is disposed on a side of the first flexible circuit board facing the circuit board, and the first electrical plug is inserted into the first electrical socket to electrically connect the first flexible circuit board to the circuit board.

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