Optical module

Abstract

The optical module provided by the invention comprises a circuit board, a base, a first light emitting component, a second light emitting component, a first light receiving component and a second light receiving component. The surface of the circuit board is provided with a first notch part and a second notch part, and the base is embedded in the first notch part and the second notch part, so that the base is fixed on the circuit board. The first light emitting component and the second light emitting component are located on the top surface of the base. The first light emitting component and the second light emitting component are respectively located in different gap portions, so that the first light emitting component and the second light emitting component can utilize a circuit board routing space between the first gap portion and the second gap portion to increase the wiring area. The top surface of the base is used for bearing the first light emitting component and the second light emitting component, and the bottom surface of the base is used for bearing a first refraction piece in the first light receiving component and bearing two second refraction pieces at the terminal of the second light receiving component. The top surface and the bottom surface of the base are fully utilized, three-dimensional deployment and integrated deployment are achieved, wiring is better facilitated, and the occupied space of a circuit board is better reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase. Summary of the Invention

[0003] The embodiments of the present disclosure provide an optical module that rationally deploys multiple light transmitting paths and multiple light receiving paths to improve the transmission rate.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] A circuit board has a first notch portion and a second notch portion on its surface;

[0006] a base, embedded in the first notch portion and the second notch portion;

[0007] A first light emitting component is provided on the top surface of the base, the top surface of the base faces the upper surface of the circuit board and is located in the first notch, and the first light emitting component includes:

[0008] a first laser configured to output light that does not carry a signal;

[0009] a first optical modulation chip configured to modulate the light not carrying a signal to generate an optical signal;

[0010] a first optical fiber array, coupled to an end face of the first optical modulation chip to transmit the optical signal;

[0011] a first modulation driver chip, electrically connected to the first optical modulation chip and connected to the surface of the circuit board between the first notch and the second notch by wire bonding;

[0012] The second light emitting component is provided on the top surface of the base and located in the second notch, and includes:

[0013] a first laser configured to output light that does not carry a signal;

[0014] a first optical modulation chip configured to modulate the light not carrying a signal to generate an optical signal;

[0015] a first optical fiber array, coupled to an end face of the first optical modulation chip to transmit the optical signal;

[0016] a second modulation driver chip, electrically connected to the second optical modulation chip and connected to the surface of the circuit board between the first notch and the second notch by wire bonding;

[0017] The first light receiving component comprises:

[0018] a first refracting member disposed on the bottom surface of the base, wherein an end surface of the first refracting member is formed with a first reflective end surface;

[0019] A first light receiving chip array is located on the lower surface of the circuit board and on the reflected light path of the first reflective end face;

[0020] The second light receiving component comprises:

[0021] a second refracting member disposed on the bottom surface of the base, wherein an end surface of the second refracting member is formed with a second reflective end surface;

[0022] The second light receiving chip array is located on the lower surface of the circuit board and on the light reflection path of the second reflection end surface.

[0023] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a base, a first light emitting component, a second light emitting component, a first light receiving component, and a second light receiving component. The circuit board has a first notch and a second notch on its surface, and the base is embedded in the first and second notches, thereby securing the base to the circuit board. The first light emitting component and the second light emitting component are located on the top surface of the base. Attaching the first and second light emitting components to the same base surface provides a larger base area than attaching them to separate bases, which facilitates heat dissipation for the first and second light emitting components. The first light emitting component is located in the first notch, and the second light emitting component is located in the second notch. Attaching the first and second light emitting components to separate notches allows them to utilize the wiring space between the first and second notches, thereby increasing the wiring area. The first light emitting component includes a first laser, a first optical modulation chip, a first optical fiber array, and a first modulation driver chip. The second light receiving component includes a second laser, a second optical modulation chip, a second optical fiber array, and a second modulation driver chip. The first laser is configured to output light that does not carry a signal. The first optical modulation chip is configured to modulate the light that does not carry a signal to generate an optical signal. The first optical fiber array is coupled to the end face of the first optical modulation chip to transmit the optical signal. The first modulation driver chip is electrically connected to the first optical modulation chip to provide a modulation drive signal to the first optical modulation chip. Because a circuit board is connected between the first and second notches, the space can be used for wiring, increasing the wiring area. The first modulation driver chip is connected to the circuit board surface between the first and second notches by wire bonding. The first optical receiving component includes a first deflecting element and a first optical receiving chip array. The first deflecting element is disposed on the bottom surface of the base, and a first reflective end face is formed on the end face of the first deflecting element. The first optical receiving chip array is located on the lower surface of the circuit board and is located in the reflective light path of the first reflective end face. The first reflective end face can reflect the optical signal toward the first optical receiving chip array, thereby enabling optical signal reception. Similarly, the second optical receiving component includes a second deflecting element and a second optical receiving chip array. The second deflecting element is disposed on the bottom surface of the base, and a second reflective end face is formed on the end face of the second deflecting element. The second light receiving chip array is located on the lower surface of the circuit board and is positioned in the reflective light path of the second reflective end surface. The second reflective end surface reflects the optical signal toward the second light receiving chip array, thereby enabling optical signal reception. As can be seen, the top surface of the base is used to support the first and second light transmitting components, while the bottom surface of the base is used to support the first deflecting element of the first light receiving component and the second deflecting element at the terminal of the second light receiving component. Fully utilizing the top and bottom surfaces of the base allows for three-dimensional and integrated deployment, which facilitates wiring and reduces circuit board space.

[0024] In some embodiments, the surfaces of the first light emitting component and the second light emitting component are covered with a protective cover;

[0025] The base includes a blocking portion;

[0026] The enclosure portion is placed on the surface of the circuit board, and the surface of the circuit board surrounded by the enclosure portion is exposed, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board surrounded by the enclosure portion;

[0027] A cover plate is provided above the first light receiving component and the second light receiving component. One end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the enclosure portion.

[0028] The above technical solution has the following advantages or beneficial effects: when liquid cooling is used to dissipate heat from the optical module, the cooling medium used for liquid cooling will affect the optical path. For this reason, a protective cover is projected onto the surface of the first light emitting component and the second light emitting component, thereby wrapping the first light emitting component and the second light receiving component to prevent the cooling medium from entering their interior and affecting their optical path. In order to protect the first light receiving component and the second light receiving component, the base includes a barrier portion. A cover plate is provided above the first light receiving component and the second light receiving component, one end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the barrier portion. The first light receiving component and the second light receiving component are located in the enclosing cavity formed by the cover plate and the barrier portion, thereby preventing the cooling medium from entering the interior of the first light receiving component and the second light receiving component during liquid cooling and affecting their optical path. In addition, the barrier portion is placed on the surface of the circuit board, and the surface of the circuit board enclosed by the barrier portion is exposed, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board enclosed by the barrier portion.

[0029] In some embodiments, the first light-bending member includes a first fiber-supporting portion and a second fiber-supporting portion, an optical fiber is clamped between the first fiber-supporting portion and the second fiber-supporting portion, and a reflective end face is formed at an end of the optical fiber;

[0030] The first light receiving component includes:

[0031] The first converging lens, the second optical fiber supporting portion extends below the reflective end surface, so that the first converging lens is fixed on the second optical fiber supporting portion, and the first converging lens is located between the reflective end surface and the first light receiving chip array.

[0032] The above technical solution has the following advantages or beneficial effects: The first refracting element includes a first fiber support portion and a second fiber support portion, with an optical fiber sandwiched between the first and second fiber support portions. The end of the optical fiber is formed with a reflective end face, which reflects the optical signal to the surface of the first light receiving chip array. The top surface of the base is used to support the first and second light transmitting components, and the bottom surface of the base is used to support the first refracting element in the first light receiving component and the second refracting element at the end of the second light receiving component. This requires the base to have strong support to ensure the stability of the optical path. To this end, the second fiber support portion is diffracted below the reflective end face, so that the first converging lens is fixed at the bottom end of the second fiber support portion and positioned between the reflective end face and the second light receiving chip array. The light emitting surface of the first converging lens faces the first light receiving chip array. The first converging lens converges the optical signal reflected from the reflective end face so that the optical signal reflected from the reflective end face falls within the photosensitive surface area of ​​the light receiving chips in the first light receiving chip array. This can move the reflective end face away from the circuit board surface, increase the distance between the reflective end face and the first light receiving chip array, and thereby increase the thickness between the top and bottom surfaces of the base, increase the base's support for the optical device, and ensure the stability of the optical path.

[0033] In some embodiments, a first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator passes through air and is incident on the first optical modulation chip;

[0034] An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip. The optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

[0035] The above technical solution has the following advantages or beneficial effects: a first lens and a first isolator are provided between the first laser and the first optical modulator chip. The light emitted by the first laser is in a divergent state, and the first lens can collimate the divergent light emitted by the first laser, which is beneficial to improving the coupling efficiency. The light output by the first lens is coupled to the first isolator. The first isolator is provided on one side of the light inlet of the first optical modulator chip, and the light output by the first isolator is coupled into the first optical modulator chip after being transmitted through the air for signal modulation. An optical refractive index matching glue is provided between the first optical fiber array and the first optical modulator chip to realize the coupling connection between the first optical fiber array and the end face of the first optical modulator chip. The optical signal generated by the modulation of the first optical modulator chip is coupled into the first optical fiber array through the optical refractive index matching glue. The two are coupled and connected by the refractive index matching glue, which is beneficial to improving the coupling efficiency.

[0036] In some embodiments, the input light waveguide of the first light modulation chip is arranged perpendicular to the end face of the first light modulation chip, and the output light waveguide is arranged non-perpendicular to the end face of the first light modulation chip;

[0037] The first laser is arranged perpendicularly to the light input and output end face of the first optical modulation chip so as to be consistent with the extension direction of the light input waveguide of the first optical modulation chip;

[0038] The first optical fiber array is arranged at an angle relative to the light input and output end face of the first optical modulation chip to be consistent with the extension direction of the light output waveguide of the first optical modulation chip.

[0039] The above technical solution has the following advantages or beneficial effects: the input waveguide of the first optical modulator chip is arranged perpendicular to the end face of the first optical modulator chip, and the first laser is arranged perpendicular to the input and output light end faces of the first optical modulator chip to be consistent with the extension direction of the input waveguide of the first optical modulator chip. The output waveguide of the first optical modulator chip is not arranged perpendicular to the end face of the first optical modulator chip, which is conducive to reducing the end face reflection of the light signal at the output end face and ensuring the light output power. The first optical fiber array is arranged at an angle relative to the input and output light end faces of the first optical modulator chip, which is conducive to reducing the end face reflection of the light signal input to the first optical fiber array. The first optical fiber array and the output waveguide of the first optical modulator chip are consistent in extension direction to improve coupling efficiency.

[0040] In some embodiments, the end face of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength;

[0041] The light input port faces the first laser to receive a light beam output by the first laser;

[0042] The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array.

[0043] The above technical solution has the following advantages or beneficial effects: The end face of the first optical modulation chip is formed with an optical input port and multiple optical output ports, and the multiple optical output ports have the same output wavelength. In other words, the first optical modulation chip can internally modulate a single input beam of non-signal light to produce multiple optical signals of the same wavelength. The optical input port faces the first laser to receive the single beam of non-signal light output by the first laser. The optical output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array and output them through the first optical fiber array.

[0044] In some embodiments, the first light-bending member includes an optical fiber fixing portion, the optical fiber fixing portion is connected to the second optical fiber supporting portion, and the optical fiber passes through the interior of the optical fiber fixing portion;

[0045] A groove is formed on one side of the surface where the second optical fiber supporting portion is located, and the groove can make the surface where the optical fiber fixing portion is located lower than the surface where the second optical fiber supporting portion is located.

[0046] The above technical solution has the following advantages or beneficial effects: the first refractive portion includes a fiber fixing portion, the fiber fixing portion is connected to the second fiber supporting portion, and the optical fiber passes through the interior of the fiber fixing portion. A groove is formed on one side of the surface where the second fiber supporting portion is located. The fiber fixing portion extends from the groove. The groove can make the surface where the fiber fixing portion is located lower than the surface where the second fiber supporting portion is located, thereby preventing the fiber fixing portion from adhering to the surface where the second fiber supporting portion is located, thereby maintaining the wrapping force of the fiber fixing portion on the optical fiber and continuously protecting the optical fiber.

[0047] In some embodiments, the first light receiving component includes:

[0048] The first TIA is located on the surface of the circuit board, and the first light receiving chip array is carried on the surface of the first TIA.

[0049] The above technical solution has the following advantages or beneficial effects: the first light receiving chip array can be located on the surface of the first TIA, so the first light receiving chip array is at a certain distance from the surface of the circuit board, which can make the reflective end face further away from the surface of the circuit board, further increase the distance between the reflective end face and the first light receiving chip array, and thus increase the thickness between the top and bottom surfaces of the base, increase the support of the base for the optical device, and ensure the stability of the optical path.

[0050] In some embodiments, an optical module is provided, comprising:

[0051] A circuit board having a first notch portion on its surface;

[0052] A base is embedded in the first notch, and the top surface of the base is provided with:

[0053] a first laser, located in the first notch, configured to output light that does not carry a signal;

[0054] a first optical modulation chip, located in the first notch, and configured to modulate the light not carrying a signal to generate an optical signal;

[0055] a first optical fiber array, located in the first notch and coupled to an end face of the first optical modulation chip to transmit the optical signal;

[0056] a first modulation driver chip, located in the first notch, electrically connected to the first optical modulation chip, and connected to the surface of the circuit board;

[0057] a first refracting member disposed on the bottom surface of the base, wherein an end surface of the first refracting member is formed with a first reflective end surface;

[0058] The first light receiving chip array is located on the surface of the circuit board and on the light reflection path of the first reflection end surface.

[0059] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a base, a first deflecting element, and a first light receiving chip array. The circuit board surface has a first notch and a second notch, and the base is embedded in the first and second notches, thereby securing the base to the circuit board. The top surface of the base is provided with a first laser, a first optical modulation chip, a first optical fiber array, and a first modulation driver chip. The first laser is configured to output light that does not carry a signal. The first optical modulation chip is configured to modulate the light that does not carry a signal to generate an optical signal. The first optical fiber array is coupled to the end face of the first optical modulation chip to transmit the optical signal. The first modulation driver chip is electrically connected to the first optical modulation chip to provide a modulation drive signal to the first optical modulation chip. The first laser, the first optical modulation chip, the first optical fiber array, and the first modulation driver chip are each located within the first notch. The first deflecting element is provided on the bottom surface of the base, and the end face of the first deflecting element forms a first reflective end face. The first light receiving chip array is located on the circuit board surface and is located in the light path reflected by the first reflective end face. The first reflective end surface can reflect the optical signal toward the first optical receiving chip array, thereby achieving optical signal reception. The top and bottom surfaces of the base are fully utilized to achieve three-dimensional deployment and integrated deployment, which is more conducive to wiring and more conducive to reducing the occupied circuit board space.

[0060] In some embodiments, the surfaces of the first light emitting component and the second light emitting component are covered with a protective cover;

[0061] The base includes a blocking portion;

[0062] The enclosure portion is placed on the surface of the circuit board, and the surface of the circuit board surrounded by the enclosure portion is exposed, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board surrounded by the enclosure portion;

[0063] A cover plate is provided above the first light receiving component and the second light receiving component. One end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the enclosure portion.

[0064] The above technical solution has the following advantages or beneficial effects: when liquid cooling is used to dissipate heat from the optical module, the cooling medium used for liquid cooling will affect the optical path. For this reason, a protective cover is projected onto the surface of the first light emitting component and the second light emitting component, thereby wrapping the first light emitting component and the second light receiving component to prevent the cooling medium from entering their interior and affecting their optical path. In order to protect the first light receiving component and the second light receiving component, the base includes a barrier portion. A cover plate is provided above the first light receiving component and the second light receiving component, one end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the barrier portion. The first light receiving component and the second light receiving component are located in the enclosing cavity formed by the cover plate and the barrier portion, thereby preventing the cooling medium from entering the interior of the first light receiving component and the second light receiving component during liquid cooling and affecting their optical path. In addition, the barrier portion is placed on the surface of the circuit board, and the surface of the circuit board enclosed by the barrier portion is exposed, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board enclosed by the barrier portion.

[0065] In some embodiments, the first light-bending member includes a first fiber-supporting portion and a second fiber-supporting portion, an optical fiber is clamped between the first fiber-supporting portion and the second fiber-supporting portion, and a reflective end face is formed at an end of the optical fiber;

[0066] The first light receiving component includes:

[0067] The first converging lens, the second optical fiber supporting portion extends below the reflective end surface, so that the first converging lens is fixed on the second optical fiber supporting portion, and the first converging lens is located between the reflective end surface and the first light receiving chip array.

[0068] The above technical solution has the following advantages or beneficial effects: The first refracting element includes a first fiber support portion and a second fiber support portion, with an optical fiber sandwiched between the first and second fiber support portions. The end of the optical fiber is formed with a reflective end face, which reflects the optical signal to the surface of the first light receiving chip array. The top surface of the base is used to support the first and second light transmitting components, and the bottom surface of the base is used to support the first refracting element in the first light receiving component and the second refracting element at the end of the second light receiving component. This requires the base to have strong support to ensure the stability of the optical path. To this end, the second fiber support portion is diffracted below the reflective end face, so that the first converging lens is fixed at the bottom end of the second fiber support portion and positioned between the reflective end face and the second light receiving chip array. The light emitting surface of the first converging lens faces the first light receiving chip array. The first converging lens converges the optical signal reflected from the reflective end face so that the optical signal reflected from the reflective end face falls within the photosensitive surface area of ​​the light receiving chips in the first light receiving chip array. This can move the reflective end face away from the circuit board surface, increase the distance between the reflective end face and the first light receiving chip array, and thereby increase the thickness between the top and bottom surfaces of the base, increase the base's support for the optical device, and ensure the stability of the optical path.

[0069] In some embodiments, a first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator passes through air and is incident on the first optical modulation chip;

[0070] An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip. The optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

[0071] The above technical solution has the following advantages or beneficial effects: a first lens and a first isolator are provided between the first laser and the first optical modulator chip. The light emitted by the first laser is in a divergent state, and the first lens can collimate the divergent light emitted by the first laser, which is beneficial to improving the coupling efficiency. The light output by the first lens is coupled to the first isolator. The first isolator is provided on one side of the light inlet of the first optical modulator chip, and the light output by the first isolator is coupled into the first optical modulator chip after being transmitted through the air for signal modulation. An optical refractive index matching glue is provided between the first optical fiber array and the first optical modulator chip to realize the coupling connection between the first optical fiber array and the end face of the first optical modulator chip. The optical signal generated by the modulation of the first optical modulator chip is coupled into the first optical fiber array through the optical refractive index matching glue. The two are coupled and connected by the refractive index matching glue, which is beneficial to improving the coupling efficiency.

[0072] In some embodiments, the input light waveguide of the first light modulation chip is arranged perpendicular to the end face of the first light modulation chip, and the output light waveguide is arranged non-perpendicular to the end face of the first light modulation chip;

[0073] The first laser is arranged perpendicularly to the light input and output end face of the first optical modulation chip so as to be consistent with the extension direction of the light input waveguide of the first optical modulation chip;

[0074] The first optical fiber array is arranged at an angle relative to the light input and output end face of the first optical modulation chip to be consistent with the extension direction of the light output waveguide of the first optical modulation chip.

[0075] The above technical solution has the following advantages or beneficial effects: the input waveguide of the first optical modulator chip is arranged perpendicular to the end face of the first optical modulator chip, and the first laser is arranged perpendicular to the input and output light end faces of the first optical modulator chip to be consistent with the extension direction of the input waveguide of the first optical modulator chip. The output waveguide of the first optical modulator chip is not arranged perpendicular to the end face of the first optical modulator chip, which is conducive to reducing the end face reflection of the light signal at the output end face and ensuring the light output power. The first optical fiber array is arranged at an angle relative to the input and output light end faces of the first optical modulator chip, which is conducive to reducing the end face reflection of the light signal input to the first optical fiber array. The first optical fiber array and the output waveguide of the first optical modulator chip are consistent in extension direction to improve coupling efficiency.

[0076] In some embodiments, the end face of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength;

[0077] The light input port faces the first laser to receive a light beam output by the first laser;

[0078] The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array.

[0079] The above technical solution has the following advantages or beneficial effects: The end face of the first optical modulation chip is formed with an optical input port and multiple optical output ports, and the multiple optical output ports have the same output wavelength. In other words, the first optical modulation chip can internally modulate a single input beam of non-signal light to produce multiple optical signals of the same wavelength. The optical input port faces the first laser to receive the single beam of non-signal light output by the first laser. The optical output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array and output them through the first optical fiber array.

[0080] In some embodiments, the first light-bending member includes an optical fiber fixing portion, the optical fiber fixing portion is connected to the second optical fiber supporting portion, and the optical fiber passes through the interior of the optical fiber fixing portion;

[0081] A groove is formed on one side of the surface where the second optical fiber supporting portion is located, and the groove can make the surface where the optical fiber fixing portion is located lower than the surface where the second optical fiber supporting portion is located.

[0082] The above technical solution has the following advantages or beneficial effects: the first refractive portion includes a fiber fixing portion, the fiber fixing portion is connected to the second fiber supporting portion, and the optical fiber passes through the interior of the fiber fixing portion. A groove is formed on one side of the surface where the second fiber supporting portion is located. The fiber fixing portion extends from the groove. The groove can make the surface where the fiber fixing portion is located lower than the surface where the second fiber supporting portion is located, thereby preventing the fiber fixing portion from adhering to the surface where the second fiber supporting portion is located, thereby maintaining the wrapping force of the fiber fixing portion on the optical fiber and continuously protecting the optical fiber.

[0083] In some embodiments, the first light receiving component includes:

[0084] The first TIA is located on the surface of the circuit board, and the first light receiving chip array is carried on the surface of the first TIA.

[0085] The above technical solution has the following advantages or beneficial effects: the first light receiving chip array can be located on the surface of the first TIA, so the first light receiving chip array is at a certain distance from the surface of the circuit board, which can make the reflective end face further away from the surface of the circuit board, further increase the distance between the reflective end face and the first light receiving chip array, and thus increase the thickness between the top and bottom surfaces of the base, increase the support of the base for the optical device, and ensure the stability of the optical path. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0087] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0088] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0089] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0090] Figure 4An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0091] Figure 5 is a diagram of the internal structure of a coherent optical component according to some embodiments;

[0092] Figure 6a is a diagram of the internal structure of an optical module according to some embodiments;

[0093] Figure 6b An internal decomposition of an optical module according to some embodiments Figure 1 ;

[0094] Figure 7a is a diagram of the internal structure of another optical module according to some embodiments;

[0095] Figure 7b is an exploded view of another optical module according to some embodiments;

[0096] Figure 8a An internal decomposition of an optical module according to some embodiments Figure 2 ;

[0097] Figure 8b A refractive element structure according to some embodiments Figure 1 ;

[0098] Figure 8c is an exploded view of a refraction element according to some embodiments;

[0099] Figure 8d is a structural diagram of a light receiving component according to some embodiments;

[0100] Figure 8e A refractive element structure according to some embodiments Figure 2 ;

[0101] Figure 9a is an assembly diagram of a light emitting component and a circuit board according to some embodiments;

[0102] Figure 9b is an exploded view of a light emitting component according to some embodiments;

[0103] Figure 9c A cross-sectional view of an assembly of a light emitting component and a circuit board according to some embodiments;

[0104] Figure 9d is a partial structural diagram of a light emitting component according to some embodiments;

[0105] Figure 10a A cross-sectional structure of a light receiving component according to some embodiments Figure 1 ;

[0106] Figure 10b A cross-sectional structure of a light receiving component according to some embodiments Figure 2 ;

[0107] Figure 10c A cross-sectional structure of a light receiving component according to some embodiments Figure 1 ;

[0108] Figure 10d A cross-sectional structure of a light receiving component according to some embodiments Figure 2 ;

[0109] Figure 11a is an exploded structural diagram of another light receiving component according to some embodiments;

[0110] Figure 11b is a cross-sectional structural diagram of another light receiving component according to some embodiments;

[0111] Figure 12a Another internal structure of an optical module according to some embodiments Figure 1 ;

[0112] Figure 12b Another internal structure of an optical module according to some embodiments Figure 2 ;

[0113] Figure 13a Another internal structure of an optical module according to some embodiments Figure 2 ;

[0114] Figure 13b Assembly and disassembly of another optical module according to some embodiments Figure 1 ;

[0115] Figure 13c Assembly and disassembly of another optical module according to some embodiments Figure 2 ;

[0116] Figure 13d is a diagram of a base and circuit board assembly according to some embodiments;

[0117] Figure 13e Assembly and disassembly of another optical module according to some embodiments Figure 3 ;

[0118] Figure 14a Another cross-section of an optical module according to some embodiments is shown in FIG. Figure 1 ;

[0119] Figure 14b FIG. 1 is a cross-sectional diagram of another optical module according to some embodiments. Figure 1 ;

[0120] Figure 14cAnother cross-section of an optical module according to some embodiments is shown in FIG. Figure 1 ;

[0121] Figure 14d FIG. 1 is a cross-sectional diagram of another optical module according to some embodiments. Figure 1 ;

[0122] Figure 15 is a structural diagram of another optical module layout according to some embodiments;

[0123] Figure 16 is a side structural diagram of another optical module according to some embodiments;

[0124] Figure 17 is a cross-sectional structural diagram of another optical module according to some embodiments;

[0125] Figure 18 A circuit board upper surface structure according to some embodiments Figure 1 ;

[0126] Figure 19 A circuit board upper surface structure according to some embodiments Figure 2 ;

[0127] Figure 20 A circuit board lower surface structure according to some embodiments Figure 1 ;

[0128] Figure 21 A circuit board lower and upper surface structure according to some embodiments Figure 2 ;

[0129] Figure 22 is an exploded view of another optical module according to some embodiments;

[0130] Figure 23a A diagram of a circuit board upper surface mounting structure according to some embodiments;

[0131] Figure 23b An exploded view of a base and a light emitting component according to some embodiments;

[0132] Figure 23c is a structural diagram of a first light emitting component according to some embodiments;

[0133] Figure 24 An assembly diagram of the top and bottom surface structures of a base according to some embodiments;

[0134] Figure 25 A bottom surface assembly structure diagram of a base according to some embodiments;

[0135] Figure 26ais a structural diagram of an assembly of a first refractive element and a first converging lens according to some embodiments;

[0136] Figure 26b is an exploded view of an assembly of a first refraction member and a first converging lens according to some embodiments;

[0137] Figure 27 A bottom surface assembly structure diagram of a base according to some embodiments;

[0138] Figure 28 A cross-sectional view of a bottom surface assembly of a base according to some embodiments;

[0139] Figure 29 is a structural diagram of a bottom surface of a base according to some embodiments;

[0140] Figure 30 Another cross-sectional structure of an optical module according to some embodiments Figure 1 ;

[0141] Figure 31 Another cross-sectional structure of an optical module according to some embodiments Figure 2 ;

[0142] Figure 32 FIG. 4 is a partial cross-sectional view of another optical module according to some embodiments. DETAILED DESCRIPTION

[0143] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0144] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0145] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0146] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0147] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0148] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0149] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0150] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0151] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0152] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0153] Figure 2 FIG1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB 105 disposed within the housing, a cage 106 disposed on the surface of the PCB 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0154] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0155] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, an optical module 200 includes a housing, which includes an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the housing forms a single opening that serves as both an electrical port and an optical port.

[0156] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0157] The upper shell 201 and the lower shell 202 are combined to form an assembly method, which facilitates the installation of the circuit board 300 and the like into the above shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the above components.

[0158] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200.

[0159] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0160] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0161] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed in a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0162] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably support the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0163] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0164] In some embodiments, the circuit board further includes a gold finger formed on an end surface thereof, wherein the gold finger is composed of a plurality of independent pins.

[0165] In some implementations, the gold finger 301 is disposed on a surface of one side of the circuit board 300 (eg Figure 4 In some implementations, the gold fingers 301 are provided on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required.

[0166] In some implementations, the circuit board's gold fingers extend from opening 204 and insert into an electrical connector on the host computer 100. The circuit board is inserted into cage 106, with gold fingers 301 electrically connected to the electrical connector within cage 106. Gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (I2C) signal transmission, and data signal transmission.

[0167] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0168] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0169] In some embodiments, the optical module includes a coherent optical component 302. The coherent optical component 302 is configured to modulate and demodulate optical signals to achieve transmission and reception of optical signals.

[0170] In some embodiments, the optical module includes a tunable laser 303 .

[0171] In some embodiments, a tunable laser 303 serves as an external light source, and the light beam it emits is split into a first light beam and a second light beam. The first light beam is transmitted as the light to be modulated into the coherent optical component 302. The coherent optical component 302 modulates the light to be modulated using a built-in optical chip, generating an optical signal. The second light beam is transmitted as the local oscillator light into the coherent optical component 302. The coherent optical component 302 performs coherent demodulation on the received optical signal based on the second light beam, generating an electrical signal.

[0172] In some embodiments, the coherent optical assembly 302 includes a cover plate 3021. The cover plate 3021 is located on the top.

[0173] Figure 5 FIG. 1 is a diagram showing the internal structure of a coherent optical component according to some embodiments. Figure 5 As shown, in some embodiments, the coherent optical component 302 may include an optical modulation and demodulation chip 3022. The optical modulation and demodulation chip 3022 performs modulation and demodulation of optical signals to achieve transmission and reception of optical signals.

[0174] In some embodiments, the optical modem chip 3022 may be a silicon photonic chip. Both the transmission and reception of optical signals are implemented within the silicon photonic chip. Silicon material is easily etched, allowing functional devices to be integrated within the silicon photonic chip.

[0175] In some embodiments, when the optical modem chip 3022 is a silicon photonic chip, since silicon is an indirect bandgap material, spontaneous photon emission cannot be achieved, and a light source cannot be realized in the silicon photonic chip. Therefore, a tunable laser 303 can be used to provide a light source for the optical modem chip 3022.

[0176] In some embodiments, the optical modem chip 3022 may be a thin-film lithium niobate chip. Both transmission and reception of optical signals are implemented within the thin-film lithium niobate chip. Thin-film lithium niobate exhibits a linear electro-optic effect, where an applied electric field causes a linear change in its refractive index in the corresponding direction. This allows the light waves transmitted through the medium to have controllable intensity, phase, and other information. Therefore, thin-film lithium niobate can be selected as the material for the optical modulator, thereby achieving, for example, a higher modulation rate.

[0177] In some embodiments, the optical modulation and demodulation chip 3022 may be a III-V / Si hybrid integrated optical chip. Both optical signal transmission and reception are implemented within the III-V / Si hybrid integrated optical chip. In a III-V / Si hybrid integrated optical chip, the optical modulator is grown using III-V semiconductor materials. III-V semiconductors are direct-bandgap semiconductors with a strong quantum well-confined Stark effect. By controlling the applied electric field, carrier changes, and thus refractive index changes, optical signal modulation is achieved.

[0178] In some embodiments, optical modem chip 3022 may be a thin-film lithium niobate / Si hybrid integrated optical chip. Both optical signal transmission and reception are implemented within the thin-film lithium niobate / Si hybrid integrated optical chip. Compared to III-V / Si hybrid integrated optical chips, the optical modulator in the thin-film lithium niobate / Si hybrid integrated optical chip is a thin-film lithium niobate-based optical modulator.

[0179] In some embodiments, the coherent optical component 302 may include a driver chip 3023. The driver chip 3023 is located on one side of the optical modem chip 3022. The driver chip 3023 provides a driving signal for the modulation of the optical modem chip 3022.

[0180] In some embodiments, the coherent optical component 302 may include a TIA 3024. The TIA 3024 is located on one side of the optical modem chip 3022. The electrical signal generated after demodulation by the optical modem chip 3022 is amplified and processed by the TIA 3024 before being transmitted to the next stage.

[0181] In some embodiments, the coherent optical component 302 may include an optical fiber array 3025 .

[0182] In some embodiments, the tunable laser 900 is used as an external light source, and the light beam emitted is split into a first light beam and a second light beam. The first light beam and the second light beam are respectively coupled and transmitted to the optical modem chip 3022 via the optical fiber array 3025.

[0183] In some embodiments, the optical signal modulated and generated by the optical modem chip 3022 is transmitted to the outside via the optical fiber array 3025 .

[0184] In some embodiments, the optical modem chip 3022 integrates a Mach-Zehnder (MZ) modulator to modulate optical signals. The MZ modulator has a high modulation bandwidth, enabling it to handle high-speed data transmission. The MZ modulator also has low insertion loss, maintaining signal integrity. It also has low power consumption and a fast response speed.

[0185] In some embodiments, the modulation and demodulation of optical signals within the coherent optical component 302 may result in crosstalk between the signals. In some embodiments, optical signal demodulation is separated from the coherent optical component 302 to reduce crosstalk between the signals. In this case, the optical modulation and demodulation chip 3022 is converted into an optical modulation chip, performing the optical signal modulation function. Optical signal demodulation can also be implemented using other packaging structures, such as micro-optical packaging structures and COB (chip on board) packaging.

[0186] Figure 6a is a diagram of the internal structure of an optical module according to some embodiments. Figure 6bAn internal decomposition of an optical module according to some embodiments Figure 1 .like Figure 6a-6b As shown, in some embodiments, a signal processing chip 304 is provided on the surface of the circuit board 300. The signal processing chip 304 processes the electrical signals input / output inside the optical module and is electrically connected to the gold finger 301. The signal processing chip 304 can be a DSP chip.

[0187] In some embodiments, the optical module includes a light emitting component 400 a . The light emitting component 400 a is configured to transmit an optical signal and can be located on one side of the signal processing chip 304 .

[0188] In some embodiments, the optical module includes a light receiving component 500a. The light receiving component 500a is configured to receive optical signals and can be located side by side with the light emitting component 400a on one side of the signal processing chip 304.

[0189] In some embodiments, the optical emitting component 400a includes an optical modulation chip to modulate and generate an optical signal to transmit the optical signal, and the optical receiving component 500a adopts a micro-optical packaging solution to receive the optical signal.

[0190] In some embodiments, the light emitting component 400a may include a laser 401a. In some embodiments, the light emitting component 400a may include an optical modulation chip 404a. In some embodiments, the light emitting component 400a may include an optical fiber array 405a. Light emitted by the laser 401a is transmitted to the optical modulation chip 404a, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 404a and transmitted via the optical fiber array 405a. The optical modulation chip 404a may be a silicon-based chip or a thin-film lithium niobate-based chip.

[0191] In some embodiments, the optical receiving component 500a includes an optical fiber 513, which extends toward the optical receiving chip until its end is exposed above the optical receiving chip. A reflective end surface 514 is formed at the end of the optical fiber 513, and the reflective end surface 514 is exposed above the optical receiving chip. The reflective end surface 514 is used to reflect and redirect the optical signal transmitted by the optical fiber 513, thereby reflecting the optical signal transmitted by the optical fiber 513 to the optical receiving chip, thereby achieving a turn in the optical path.

[0192] Figure 7a FIG. 1 is another internal structure diagram of an optical module according to some embodiments. Figure 7b FIG. 1 is another exploded view of an optical module according to some embodiments. Figure 7a 、 7bAs shown, in some embodiments, a signal processing chip 304 is provided on the surface of the circuit board 300. The signal processing chip 304 processes the electrical signals input / output inside the optical module and is electrically connected to the gold finger 301. The signal processing chip 304 can be a DSP chip.

[0193] In some embodiments, the optical module includes a light emitting component 400 a . The light emitting component 400 a is configured to transmit an optical signal and can be located on one side of the signal processing chip 304 .

[0194] In some embodiments, the optical module includes a light receiving component 500b. The light receiving component 500b is configured to receive optical signals and can be located side by side with the light emitting component 400a on one side of the signal processing chip 304.

[0195] In some embodiments, the optical transmitting component 400a includes an optical modulation chip to modulate and generate an optical signal to transmit the optical signal, and the optical receiving component 500b adopts a COB packaging solution to receive the optical signal.

[0196] In some embodiments, Figure 7a The light emitting component 400a can be taken as Figure 6b The light emitting component 400a has the same structure as the light emitting component 400a. That is, the light emitting component 400a with the same structural features can be combined with the light receiving component 500a or the light receiving component 500b.

[0197] In some embodiments, the light receiving component 500b includes a lens assembly 510, which is disposed on the surface of the circuit board 300. The light receiving chip is located on the surface of the circuit board 300, and the lens assembly 510 is disposed above the light receiving chip. A reflective surface 511 is formed on the surface of the lens assembly 510, and the reflective surface 511 is formed above the light receiving chip. The reflective surface 511 can be used to redirect the light path toward the surface of the light receiving chip, thereby coupling the optical signal into the light receiving chip.

[0198] For example Figure 6b As shown, in some embodiments, the optical module includes a cover plate 305. The cover plate 305 covers the surface of the light emitting component 400a and the light receiving component 500a, thereby protecting the light emitting component 400a and the light receiving component 500a.

[0199] In some embodiments, limiting holes 306 are formed on both sides of the surface of the circuit board 300. Limiting portions 3051 are formed on both sides of the bottom surface of the cover 305. The limiting portions 3051 are embedded in the limiting holes 306, thereby fixing the cover 305 to the circuit board 300 and facilitating the insertion and removal of the cover 305.

[0200] In some embodiments, when there is a trace on the inner layer of the circuit board 300 at the location of the limiting hole 306, the limiting hole 306 is a blind hole. When there is no trace on the inner layer of the circuit board 300 at the location of the limiting hole 306, the limiting hole 306 is a through hole.

[0201] In some embodiments, the optical module may include a base 700a for supporting and carrying the light emitting component 400a.

[0202] In some embodiments, a notch 307 is formed on the surface of the circuit board 300 to embed the base 700 a .

[0203] In some embodiments, the light emitting component 400a may include a laser 401a. The laser 401a is located on the surface of the base 700a. The laser 401a may emit light along the side without modulating the optical signal, so that the light emitted by the laser 401a does not carry an optical signal. Exemplarily, the laser 401a is a DFB laser.

[0204] In some embodiments, the light emitting component 400a may include a lens 402a. The lens 402a is located on the surface of the base 700a.

[0205] In some embodiments, lens 402a is located on the light path of laser 401a. Lens 402a is a converging lens for converging the light emitted by laser 401a.

[0206] In some embodiments, the light emitting component 400a may include an isolator 403a. The isolator 403a is located on the surface of the base 700a. The isolator 403a is located on the light output path of the lens 402a to prevent the light emitted by the laser 401a from returning to the laser 401a.

[0207] In some embodiments, the optical emitting component 400a may include an optical modulation chip 404a. The optical modulation chip 404a is located on the surface of the base 700a. The optical modulation chip 404a is located in the optical path of the isolator 403a and receives the light output from the isolator 403a. The optical modulation chip 404a performs phase modulation on the light output from the isolator 403a to generate an optical signal.

[0208] In some embodiments, the optical modulation chip 404a integrates an MZ modulator to modulate optical signals and transmit optical signals. For example, the optical modulation chip 404a can be a silicon photonic chip, a thin-film lithium niobate chip, or a III-V chip.

[0209] In some embodiments, the optical path corresponding to light reception is separated from the optical modulation and demodulation chip by the optical receiving component 500a. Therefore, the laser 401a does not need to provide the local oscillator optical signal for the optical receiving component 500a, but only needs to provide the light source to be modulated for the optical transmitting component 400a. Therefore, the laser 401a is placed in the optical path of the optical modulation chip 404a. This is different from the tunable laser 900: the tunable laser 900 provides both the light source to be modulated for the optical transmitting end and the local oscillator optical signal for the optical receiving end.

[0210] In some embodiments, the light emitting component 400a may include an optical fiber array 405a. The optical fiber array 405a is located on the surface of the base 700a. The optical fiber array 405a is end-face coupled to the optical modulation chip 404a. The optical fiber array 405a is located on the optical output path of the optical modulation chip 404a to transmit the optical signal modulated by the optical modulation chip 404a to the outside.

[0211] In some embodiments, light emitted by the laser 401a is transmitted to the optical modulation chip 404a, where it is modulated to generate an optical signal. The optical signal is then output from the optical modulation chip 404a and transmitted via the optical fiber array 405a.

[0212] In some embodiments, a laser 401a, lens 402a, and isolator 403a are located on the light path of an optical modulation chip 404a, providing the optical modulator chip 404a with a light source to be modulated. An optical fiber array 405a is coupled to the light output port of the optical modulation chip 404a. If the light input and light output ports of the optical modulation chip 404a are located on the same side, the laser 401a, lens 402a, isolator 403a, and optical fiber array 405a are located on the same side of the optical modulation chip 404a.

[0213] In some embodiments, the optical modulation chip 404a is electrically connected to the signal processing chip 304, and the modulation driving signal required by the optical modulation chip 404a can be provided by the signal processing chip 304. Alternatively, the modulation signal required by the optical modulation chip 404a can be provided by an independent driver chip.

[0214] Figure 8a An internal decomposition of an optical module according to some embodiments Figure 2 .like Figure 8a As shown, in some embodiments, a notch 307 is formed on the surface of the circuit board 300 to embed the base 700a. The notch 307 is configured as a through hole.

[0215] In some embodiments, the light receiving part 500a may include a light folding member 510a.

[0216] In some embodiments, the light receiving part 500 a may include a light receiving chip 520 a .

[0217] In some embodiments, the light receiving component 500 a may include a TIA 530 a .

[0218] In some embodiments, the deflecting element 510a includes an optical fiber 513. The optical fiber 513 extends toward the light receiving chip 520a, with the end of the optical fiber 513 exposed above the light receiving chip 520a. A reflective end surface 514 is formed at the end of the optical fiber 513, and the reflective end surface 514 is exposed above the light receiving chip 520a. The reflective end surface 514 is used to reflect and redirect the optical signal transmitted by the optical fiber 513, thereby reflecting the optical signal transmitted by the optical fiber 513 to the light receiving chip 520a, thereby achieving a deflection in the optical path.

[0219] In some embodiments, the TIA 530 a is located on the surface of the circuit board 300 and on one side of the light receiving chip 520 a. The light receiving chip 520 a converts the received light signal into a photocurrent signal. The TIA 530 a converts the photocurrent signal into a photovoltage signal, amplifies the photovoltage signal, and transmits it to the signal processing chip 304.

[0220] Figure 8b A refractive element structure according to some embodiments Figure 1 , Figure 8c FIG. 1 is an exploded view of a refraction member according to some embodiments. Figure 8b 、 8c As shown, in some embodiments, the deflecting member 510a may include a first fiber support portion 511 and a second fiber support portion 512. The first fiber support portion 511 and the second fiber support portion 512 are disposed in a vertically opposed relationship, with a plurality of optical fibers 513 sandwiched therebetween. The plurality of optical fibers 513 form a fiber array. The bottom surface of the first fiber support portion 511 is formed with a V-shaped groove 517 for embedding the optical fibers 513.

[0221] In some embodiments, the deflecting member 510a may include a fiber fixing portion 515. The fiber fixing portion 515 is located at the rear end of the second fiber support portion 512 to securely connect the optical fiber 513. The fiber fixing portion 515 protects and cushions the optical fiber 513, thereby preventing fiber breakage. Exemplarily, the fiber fixing portion 515 is made of a soft adhesive that provides protection and cushioning for the optical fiber 513.

[0222] In some embodiments, the first fiber supporting portion 511 is longer than the second fiber supporting portion 512 , and there is space between the second fiber supporting portion 512 and the end of the first fiber supporting portion 511 , reserving coating space for the fiber fixing portion 515 .

[0223] In some embodiments, a reflective end face 514 is formed at the end of the optical fiber 513, and the reflective end face 514 is located above the optical receiving chip 520a. The reflective end face 514 is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513 to reflect the optical signal transmitted by the optical fiber 513 to the optical receiving chip 520a.

[0224] In some embodiments, the reflective end surface 514 is an inclined surface, and the received light signal transmitted by the optical fiber 513 is totally reflected at the reflective end surface 514. Exemplarily, the inclination angle of the reflective end surface 514 is 46-50°, such as 48°.

[0225] In some embodiments, the optical fiber 513 passes through one end of the first optical fiber support portion 511 and extends outside the other end of the first optical fiber support portion 511, so that the reflective end surface 514 is located outside the other end of the first optical fiber support portion 511. One end of the optical fiber fixing portion 515 is connected to one end of the second optical fiber support portion 512, and the other end of the optical fiber fixing portion 515 is fixedly connected to the end of the optical fiber 513 to support the end of the optical fiber 513.

[0226] In some embodiments, a protective surface 516 is formed on the end surface of the first optical fiber support portion 511. The protective surface 516 surrounds the side of the reflective end surface 514 and is used to protect the reflective end surface 514. Exemplarily, the protective surface 516 is an inclined surface, and the inclination angle of the protective surface 516 is 46-50 degrees, such as 48 degrees.

[0227] In some embodiments, the reflective end face 514 and the protective surface 516 are formed by grinding and polishing. The end face of the optical fiber 513 is ground to a predetermined angle to form the reflective end face 514. The optical fiber 513 is cylindrical, and after grinding, the cross-section of the reflective end face 514 is elliptical, so that the bottom of the optical fiber 513 is exposed relative to the first optical fiber support portion 511.

[0228] Figure 8d FIG. 1 is a structural diagram of a light receiving component according to some embodiments. Figure 8d As shown, in some embodiments, a certain gap is left between the optical fiber fixing portion 515 and the surface of the circuit board 300 to prevent the optical fiber fixing portion 515 from adhering to the optical glue on the surface of the circuit board 300 for fixing the second optical fiber support portion 512, thereby maintaining the binding force of the optical fiber fixing portion 515 on the optical fiber 513.

[0229] In some embodiments, the light receiving chip 520 is located on the surface of the circuit board 300. When the model of the light receiving chip 520 is fixed, its thickness is fixed, and the distance between its photosensitive surface and the surface of the circuit board 300 is fixed.

[0230] In some embodiments, the preset distance between the reflective end face 514 and the light receiving chip 520a is relatively small to ensure that the optical signal reflected by the reflective end face 514 can be transmitted to the photosensitive surface of the light receiving chip 520a and then received by the light receiving chip 520a. The second optical fiber support portion 512 has a relatively small thickness to ensure that the distance between the reflective end face 514 and the light receiving chip 520a meets the preset distance. Exemplarily, the second optical fiber support portion 512 is thinner than the first optical fiber support portion 511 to ensure that the distance between the reflective end face 514 and the light receiving chip 520a meets the preset distance.

[0231] In some embodiments, the second fiber support portion 512 does not extend below the reflective end face 514, leaving space for the light receiving chip 520a. Thus, while ensuring that the distance from the reflective end face 514 to the light receiving chip 520a meets a predetermined distance, the thickness of the second fiber support portion 512 can be appropriately increased to enhance its support for the optical fiber 513 and ensure optical path stability. For example, the thickness of the second fiber support portion 512 is greater than the distance from the reflective end face 514 to the light receiving chip 520a, and the bottom surface of the second fiber support portion 512 is below the top surface of the light receiving chip 520a.

[0232] In some embodiments, the optical receiving chip 520 is located on the surface of the circuit board 300. A groove is formed on the surface of the circuit board 300 where the second optical fiber support portion 512 is located, so that the second optical fiber support portion 512 extends downward and increases the thickness of the second optical fiber support portion 512.

[0233] In some embodiments, the second fiber support portion 512 extends below the reflective end surface 514, allowing it to protect the end of the optical fiber 513. In this case, a groove is formed on the circuit board surface where the light receiving chip 520a resides, allowing the light receiving chip 520a to be lowered, thereby ensuring that the distance from the reflective end surface 514 to the light receiving chip 520a meets a predetermined distance. For example, the bottom surface of the second fiber support portion 512 is above the top surface of the light receiving chip 520a.

[0234] In some embodiments, when the thickness of the second optical fiber supporting portion 512 is relatively small and its material can ensure sufficient supporting force, the length of the second optical fiber supporting portion 512 can be extended to below the reflective end surface 514 .

[0235] Figure 8e A refractive element structure according to some embodiments Figure 2 .like Figure 8e As shown, in some embodiments, the second fiber support portion 512 extends below the reflective end surface 514 so that the second fiber support portion 512 can protect the end of the optical fiber 513. At this time, the light receiving chip 520a is located on the surface of the circuit board 300.

[0236] like Figure 8b As shown, the bottom of the reflective end surface 514 of the optical fiber 513 is exposed relative to the first optical fiber support portion 511, and the second optical fiber support portion 512 does not extend to the bottom of the reflective end surface 514, so the bottom of the reflective end surface 514 is not protected. When the second optical fiber support portion 512 is extended to below the reflective end surface 514, the second optical fiber support portion 512 can protect the end of the optical fiber 513.

[0237] In some embodiments, when the second fiber support portion 512 extends below the reflective end face 514, the bottom surface of the second fiber support portion 512 is above the top surface of the light receiving chip 520a, increasing the distance between the reflective end face 514 and the light receiving chip 520a. To ensure that the optical signal reflected from the reflective end face 514 falls on the photosensitive surface of the light receiving chip 520a, the second fiber support portion 512 extends below the second fiber support portion 512 to support a converging lens 518. The converging lens 518 is located between the reflective end face 514 and the light receiving chip 520a and can converge the optical signal reflected from the reflective end face 514, thereby ensuring that the optical signal reflected from the reflective end face 514 falls on the photosensitive surface of the light receiving chip 520a.

[0238] Figure 9a FIG1 is an assembly diagram of a light emitting component and a circuit board according to some embodiments. Figure 9b is an exploded view of a light emitting component according to some embodiments, Figure 9c FIG1 is a cross-sectional view of an assembly of a light emitting component and a circuit board according to some embodiments. Figures 9a-9c As shown, in some embodiments, the surface of the base 700a carries a laser 401a, a lens 402a, an isolator 403a, an optical modulation chip 404a, and an optical fiber array 405a.

[0239] In some embodiments, the laser 401a, optical modulation chip 404a, and the like generate a large amount of heat. The base 700a provides a large heat dissipation surface and has excellent heat dissipation performance, allowing the heat generated by the laser 401a and optical modulation chip 404a to be dissipated through the base 700a. For example, the base 700a can be metal. Furthermore, the base 700a exhibits minimal thermal deformation, thereby ensuring optical path stability.

[0240] In some embodiments, a notch 307 is formed on the surface of the circuit board 300 to accommodate the base 700a. The notch 307 can accommodate the laser 401a, the lens 402a, the isolator 403a, the optical modulation chip 404a, and the optical fiber array 405a.

[0241] In some embodiments, a receiving portion 701 is formed at one end of the base 700 a to receive the circuit board 300 .

[0242] In some embodiments, the optical modulation chip 404 a is electrically connected to the signal processing chip 304 , and the signal processing chip 304 can provide a driving signal for the optical signal modulation of the optical modulation chip 404 a .

[0243] In some embodiments, the signal processing chip 304 can be flip-chip mounted on the surface of the circuit board 300. For example, the solder bumps on the bottom surface of the signal processing chip 304 are connected downward to the surface of the circuit board 300. In some embodiments, after the solder bumps of the signal processing chip 304 are connected to the pads on the surface of the circuit board 300 through heating and pressurization, a viscous filler is bidirectionally filled along the edges of the signal processing chip 304. The gap between the signal processing chip 304 and the circuit board 300 has a capillary wicking effect, and the filled viscous filler is sucked in and flows toward the center, thereby filling the gap between the signal processing chip 304 and the circuit board 300, achieving a stable bond between the signal processing chip 304 and the circuit board 300.

[0244] In some embodiments, one end of the signal processing chip 304 is electrically connected to the gold finger 301 through a trace on the surface of the circuit board 300 from a solder bump.

[0245] In some embodiments, the optical modulation chip 404a is wired to the surface of the circuit board 300 through surface solder pads, and then electrically connected to the solder bumps of the signal processing chip 304 through traces on the surface of the circuit board 300 to achieve electrical connection between the optical modulation chip 404a and the signal processing chip 304.

[0246] In some embodiments, a raised surface 703 is formed on the surface of the base 700a. The raised surface 703 protrudes from the surface of the receiving portion 701. For some models of optical modulation chip 404a, its thickness is less than that of the circuit board 300. The raised surface 703 can compensate for the thickness difference between the optical modulation chip 404a and the circuit board 300, bringing the surface of the optical modulation chip 404a closer to the circuit board 300, shortening the bonding length between the optical modulation chip 404a and the circuit board 300, and optimizing high-frequency signal transmission performance.

[0247] In some embodiments, the raised mesa 703 may include surfaces of varying heights to match the optical axis heights between the laser 401a and the optical modulation chip 404a, and between the optical modulation chip 404a and the optical fiber array 405a. In some embodiments, to accommodate various optical devices, the raised mesa 703 may also be a uniformly heighted surface, thereby improving the adaptability of the base 700a.

[0248] In some embodiments, the light modulator chip 404a is fixed to the raised mesa 703 by optical glue, and the optical fiber array 405a is also fixed to the raised mesa 703 by optical glue. A recessed portion 704 is formed between the raised mesa where the light modulator chip 404a and the optical fiber array 405a are located to collect overflowing optical glue and reduce glue bridging.

[0249] In some embodiments, the boss surface 703 includes a loading surface 7031 . The optical fiber array 405 a is located on the loading surface 7031 .

[0250] In some embodiments, the optical fiber array 405a may include a first support portion 415 and a second support portion 425. The optical fibers are sandwiched between the first support portion 415 and the second support portion 425 to support and secure the optical fibers. In some embodiments, the second support portion 425 is securely connected to the support surface 7031 by applying optical adhesive.

[0251] In some embodiments, the optical fiber array 405a may include a fixing portion 435. The fixing portion 435 is connected to the end of the second support portion 425. The fixing portion 435 protects and cushions the optical fibers, thereby preventing fiber breakage. For example, the fixing portion 435 may be a soft adhesive that protects and cushions the optical fibers 513.

[0252] In some embodiments, the length of the first supporting portion 415 is longer than that of the second supporting portion 425 , and there is space between the second supporting portion 425 and the end of the first supporting portion 415 , which reserves coating space for the fixing portion 435 .

[0253] In some embodiments, the ends of the second support portion 425 are exposed to a certain extent relative to the support surface 7031. This prevents the optical adhesive from being applied to the ends of the second support portion 425, thereby preventing the ends of the second support portion 425 from being subjected to stress and breaking. In some embodiments, the first support portion 415 and the second support portion 425 can be made of glass, which is fragile.

[0254] In some embodiments, the support surface 7031 does not provide support for the fixing portion 435, and the fixing portion 435 is suspended relative to the support surface 7031. This prevents the fixing portion 435 from being optically adhered to the surface of the support surface 7031, thereby ensuring that the fixing portion 435 continues to wrap around the optical fiber.

[0255] In some embodiments, the optical fiber should pass horizontally along the surface of the circuit board 300 to prevent stress and breakage of the optical fiber when in contact with the circuit board 300. In some embodiments, the fiber outlet of the fixing portion 435 can be raised to a certain degree so that the optical fiber can pass horizontally and buffered when it lands on the surface of the circuit board 300, reducing interference with the circuit board 300 surface and ensuring smooth horizontal fiber outlet.

[0256] In some embodiments, the optical fiber segment covered by the fixing portion 435 is fixed inside, and the optical fiber segment exposed outside the fixing portion 435 is movable. The tail of the fixing portion 435 can be used as a fulcrum to lift the fiber outlet of the fixing portion 435 upward to a certain extent, so that the optical fiber can pass horizontally and buffered when it falls on the surface of the circuit board 300.

[0257] In some embodiments, there is a distance between the end of the fixing portion 435 and the circuit board 300, and the fixing portion 435 is suspended relative to the surface of the base 700a. When the fixing portion 435 is lifted upward to release the fiber, this distance can provide bending space for the optical fiber, and the optical fiber is not subjected to stress in the bending space, thereby protecting the optical fiber.

[0258] In some embodiments, the base 700a may include an extension portion 702. The surface of the extension portion 702 is lower than the surface of the carrier surface 7031. The fixing portion 435 and the fiber outlet are located above the extension portion 702. There is a certain gap in the longitudinal direction between the fixing portion 435 and the surface of the extension portion 702, which provides bending space for the fiber outlet of the fixing portion 435 to avoid fiber breakage. The fiber outlet of the fixing portion 435 passes along the top of the extension portion 702, and the fiber outlet of the fixing portion 435 is lifted upward by a certain amount with the tail of the fixing portion 435 as a fulcrum. When the optical fiber falls on the surface of the circuit board 300, it can pass horizontally and buffered, thereby ensuring smooth horizontal fiber outlet.

[0259] Figure 9d FIG. 1 is a partial structural diagram of a light emitting component according to some embodiments. Figure 9d As shown, in some embodiments, optical modulation chip 404a is end-face coupled to optical fiber array 405a. Optical modulation chip 404a has a built-in MZ modulator that applies a signal to the light wave emitted by laser 401a, modulating it to generate an optical signal. Optical fiber array 405a transmits the optical signal modulated by optical modulation chip 404a.

[0260] In some embodiments, the end face of the optical modulation chip 404a includes an optical input port 414 and an optical output port 424. The optical input port 414 faces the isolator 403a. The optical output port 424 faces the optical fiber array 405a. For example, at a 400G transmission rate or a single-wavelength 100G transmission rate, the end face of the optical modulation chip 404a is formed with four optical output ports 424 to output four optical carrier signals.

[0261] In some embodiments, the angle between the input waveguide corresponding to the input port 414 and the end face of the optical modulation chip 404a can be acute, so that the input waveguide is not perpendicular to the end face, thereby reducing end face reflection. The output waveguide corresponding to the output port 424 adopts the same configuration to reduce end face reflection.

[0262] In some embodiments, the light-entering end face of fiber array 405a is beveled, as are the light-entering end faces of its internal optical fibers. This prevents light signals incident on fiber array 405a from returning to optical modulation chip 404a, thereby improving return loss and allowing more light to be transmitted through the optical fibers. For example, the light-entering end face of fiber array 405a is polished to an 8° bevel.

[0263] In some embodiments, combined Figure 9a The optical modulator chip 404a is tilted, meaning the optical input and output surfaces of the optical modulator chip 404a are non-perpendicular to the long side of the circuit board 300. By tilting the optical modulator chip 404a so that the input and output waveguides are parallel to the long side of the circuit board 300, the laser 401a and optical fiber array 405a can be placed parallel to the surface of the circuit board 300. This reduces the area of ​​the notch 307 on the surface of the circuit board 300 and maximizes the signal transmission performance of the circuit board 300.

[0264] In some embodiments, the shape of the notch 307 is adapted to the structural features of the light emitting component 400a. The notch 307 can be configured as a through hole. The base 700a supports the circuit board 300 from its bottom surface upward, with the bearing surface of the base 700a facing the top surface of the circuit board 300. This supports the laser 401a, lens 402a, isolator 403a, optical modulation chip 404a, and optical fiber array 405a toward the top surface of the circuit board 300, and each component is electrically connected to the top surface of the circuit board 300.

[0265] In some embodiments, the notch 307 may include a first through-hole 3071. The laser 401a, lens 402a, isolator 403a, and optical fiber array 405a are embedded in the first through-hole 3071. Since the laser 401a, lens 402a, isolator 403a, and optical fiber array 405a are arranged parallel to the surface of the circuit board 300, the first through-hole 3071 is also arranged parallel to the surface of the circuit board 300.

[0266] In some embodiments, the notch portion 307 may include a second through hole portion 3072. The optical modulation chip 404a is embedded in the second through hole portion 3072. The second through hole portion 3072 is connected to one end of the first through hole portion 3071. Figure 9a In the orientation shown, the second through hole portion 3072 is tilted downward relative to the first through hole portion 3071 to adapt to the configuration of the optical modulation chip 404a.

[0267] In some embodiments, the notch portion 307 may include a third through-hole portion 3073. The third through-hole portion 3073 is connected to the other end of the first through-hole portion 3071. Along the width direction of the circuit board 300, the size of the third through-hole portion 3073 becomes smaller relative to the first through-hole portion 3071 to reduce the digging area. The optical fiber array 405a passes through the third through-hole portion 3073. As mentioned above, the third through-hole portion 3073 provides a bending space for the fixed portion 435 to output the fiber, thereby avoiding fiber breakage. The fixed portion 435 outputs the fiber through the third through-hole portion 3073, and the tail of the fixed portion 435 is used as a fulcrum to lift the output of the fixed portion 435 upward by a certain amplitude. When the optical fiber falls on the surface of the circuit board 300, it can pass through horizontally and buffered, thereby ensuring smooth horizontal fiber output.

[0268] Figure 10a A cross-sectional structure of a light receiving component according to some embodiments Figure 1 , Figure 10b A cross-sectional structure of a light receiving component according to some embodiments Figure 2 .like Figure 10a 、 10b As shown, in some embodiments, the light receiving component 500a may include a light folding member 510a.

[0269] In some embodiments, the deflecting element 510a includes an optical fiber 513, which extends toward the light receiving chip 520a. A reflective end surface 514 is formed at the end of the optical fiber 513. The reflective end surface 514 is formed above the light receiving chip 520a. The reflective end surface 514 is used to reflect and redirect the optical signal transmitted by the optical fiber 513, thereby reflecting the optical signal transmitted by the optical fiber 513 toward the light receiving chip 520a, thereby achieving a deflection in the optical path.

[0270] In some embodiments, the light receiving chip 520a is located on the surface of the circuit board 300. The TIA 530a is located on the surface of the circuit board 300. The light receiving chip 520a and the TIA 530a are connected by wire bonding, so as to transmit the photocurrent signal converted by the light receiving chip 520a to the TIA 530a.

[0271] In some embodiments, the circuit board 300 has a large thermal expansion coefficient and relatively poor surface optical path stability.

[0272] In some embodiments, a recess 308a is formed on the surface of the circuit board 300, and a substrate 540a is disposed on the surface of the recess 308a. The substrate 540a supports the deflecting element 510a and the light receiving chip 520a. The thermal expansion coefficient of the substrate 540a is relatively lower than that of the circuit board 300, thereby ensuring the stability of the light receiving optical path. The deflecting element 510a and the light receiving chip 520a can be fixed to the surface of the substrate 540a using optical adhesive.

[0273] In some embodiments, a preset distance exists between the reflective end surface 514 and the light receiving chip 520 a , so that the optical signal output by the reflective end surface 514 can reach the photosensitive surface of the light receiving chip 520 a .

[0274] In some embodiments, the depth of the recessed portion 308a and the thickness of the substrate 540a are matched to meet a predetermined distance between the reflective end face 514 and the light receiving chip 520a. Furthermore, the light receiving chip 520a and the TIA 530a are flush with each other, shortening the bonding distance between them and facilitating high-frequency signal transmission between them.

[0275] In some embodiments, the deflecting element 510a may include a first fiber support portion 511 and a second fiber support portion 512, between which an optical fiber 513 is clamped. The first fiber support portion 511 is relatively thick to facilitate clamping during coupling of the deflecting element 510a. Because the predetermined distance between the reflective end face 514 and the light receiving chip 520a is typically relatively short, the second fiber support portion 512 is relatively thin, making it difficult to support the first fiber support portion 511, which may result in breakage of the second fiber support portion 512.

[0276] In some embodiments, the surface of the substrate 540a used to support the refractive element 510a is recessed downward to form a concave surface 541, and the thickness of the second optical fiber support portion 512 can be extended downward, thereby increasing the thickness of the second optical fiber support portion 512 and increasing the upward support force of the second optical fiber support portion 512, thereby maintaining the stable transmission performance of the optical fiber supported between the first optical fiber support portion 511 and the second optical fiber support portion 512.

[0277] In some embodiments, the concave surface 541 causes the surface of the substrate 540a supporting the light receiving chip 520a to bulge out, forming a raised platform 542. The light receiving chip 520a is positioned on the surface of the raised platform 542. The height of the raised platform 542 ensures that the distance between the reflective end surface 514 and the light receiving chip 520a meets a predetermined distance. Furthermore, the light receiving chip 520a is flush with the surface of the TIA 530a.

[0278] In some embodiments, the concave surface 541 and the convex platform 542 may also be configured as two independent structures, that is, the convex platform 542 is located on the surface of the concave surface 541 .

[0279] In some embodiments, a hard material may be selected for the second optical fiber supporting portion 512 to increase the supporting strength, and in this case, there is no need to form the concave surface 541 .

[0280] Figure 10c A cross-sectional structure of a light receiving component according to some embodiments Figure 1 , Figure 10d A cross-sectional structure of a light receiving component according to some embodiments Figure 2 .like Figure 10c 、 10d As shown, in some embodiments, the deflecting member 510a may include an optical fiber fixing portion 515. The optical fiber fixing portion 515 protects and buffers the optical fiber 513, thereby preventing fiber breakage. Exemplarily, the optical fiber fixing portion 515 is a soft glue that can play a protective and buffering role.

[0281] In some embodiments, the fiber fixing portion 515 is not provided on the surface of the substrate 540a. The substrate 540a does not provide support for the fiber fixing portion 515, and the fiber fixing portion 515 is suspended relative to the substrate 540a. This prevents adhesion between the fiber fixing portion 515 and the optical adhesive on the surface of the substrate 540a used to secure the second fiber support portion 512, preventing the optical fiber from escaping from the fiber fixing portion 515, thereby ensuring that the fixing portion 435 continues to wrap around the optical fiber.

[0282] In some embodiments, one end of the groove portion 308a extends close to the TIA 530a, and the other end extends a certain distance from the end of the substrate 540a. This allows the optical fiber fixture 515 to extend a certain distance before reaching the surface of the circuit board 300. In some embodiments, the tail of the optical fiber fixture 515 can be used as a fulcrum to lift the optical fiber fixture 515 upward by a certain amount. This allows the optical fiber to pass horizontally and buffered when it lands on the surface of the circuit board 300, thereby ensuring smooth horizontal fiber extension.

[0283] In some embodiments, the fiber outlet of the optical fiber fixing portion 515 is suspended relative to the groove portion 308a. When the fiber outlet of the optical fiber fixing portion 515 is lifted upward, a bending space can be provided for the optical fiber. The optical fiber is not subjected to stress in the bending space, thereby preventing fiber breakage.

[0284] Figure 11a FIG. 1 is another exploded structural diagram of a light receiving component according to some embodiments. Figure 11b FIG. 1 is a cross-sectional structural diagram of another light receiving component according to some embodiments. Figure 11a 、 11b As shown, in some embodiments, the light receiving component 500b is located on the surface of the circuit board 300. The light receiving component 500b can be located side by side with the light emitting component 400a on one side of the signal processing chip 304.

[0285] In some embodiments, the structure of the light emitting component 400a may refer to the structure of the light emitting component 400a and will not be described in detail.

[0286] In some embodiments, the light receiving component 500b may include a lens assembly 510, which is buckled onto the surface of the circuit board 300. A receiving cavity is formed between the inner wall of the lens assembly 510 and the surface of the circuit board 300. A reflective surface 511 is formed on the outer wall of the lens assembly 510. The reflective surface 511 is tilted, with its light incident surface facing the optical fiber 540b. The optical fiber 540b transmits the external optical signal to the reflective surface 511. The light emitting surface of the reflective surface 511 faces the surface of the circuit board 300.

[0287] In some embodiments, the light receiving component 500b may include a light receiving chip 520b. The light receiving chip 520b is located in a receiving cavity formed between the inner wall of the lens assembly 510 and the circuit board 300. The light receiving chip 520b is located on the surface of the circuit board 300.

[0288] In some embodiments, the lens assembly 510 is disposed above the light receiving chip 520b. A reflective surface 511 is formed above the light receiving chip 520b. The reflective surface 511 can be used to redirect the light path toward the surface of the light receiving chip 520b, thereby coupling the optical signal into the light receiving chip 520b.

[0289] In some embodiments, the light receiving component 500b may include a TIA 530b. The TIA 530b is located in a receiving cavity formed between the inner wall of the lens assembly 510 and the circuit board 300. The TIA 530b is located on the surface of the circuit board 300 and is located on one side of the light receiving chip 520b.

[0290] In some embodiments, light receiving chip 520b is electrically connected to TIA 530b via bonding wires, thereby transmitting the photocurrent signal generated by light receiving chip 520b to TIA 530b. TIA 530b converts the photocurrent signal into a photovoltage signal and amplifies the photovoltage signal. TIA 530b is electrically connected to signal processing chip 304 via traces on the surface of circuit board 300, transmitting the amplified photovoltage signal to signal processing chip 304.

[0291] Figure 12a Another internal structure of an optical module according to some embodiments Figure 1 .like Figure 12a As shown, in some embodiments, the circuit board 300 is provided with two sets of light emitting components: a first light emitting component 400b and a second light emitting component 400c. The circuit board 300 is also provided with two sets of light receiving components: a first light receiving component 500c and a second light receiving component 500d. Compared to the transmission rate of the aforementioned combination of light emitting components 400a and light receiving components 500a, the transmission rate is doubled.

[0292] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are disposed side by side on the same surface of the circuit board 300. In some embodiments, the first light receiving component 500c and the second light receiving component 500d are disposed side by side on the same surface of the circuit board 300.

[0293] In some embodiments, the first light emitting component 400 b , the second light emitting component 400 c , the first light receiving component 500 c and the second light receiving component 500 d are designed to be planar and are located on the same surface of the circuit board 300 .

[0294] In some embodiments, the first light emitting component 400b and the second light emitting component 400c can have the same structure as the light emitting component 400a. The first light receiving component 500c and the second light receiving component 500d can have the same structure as the light receiving component 500a.

[0295] Figure 12b Another internal structure of an optical module according to some embodiments Figure 2 .like Figure 12b As shown, in some embodiments, the circuit board 300 is provided with two sets of light emitting components: a first light emitting component 400b and a second light emitting component 400c. The circuit board 300 is also provided with two sets of light receiving components: a first light receiving component 500e and a second light receiving component 500f. Compared to the transmission rate of the aforementioned combination of light emitting components 400a and light receiving components 500a, the transmission rate is doubled.

[0296] In some embodiments, the first light emitting component 400b and the second light emitting component 400c are disposed side by side on the same surface of the circuit board 300. In some embodiments, the first light receiving component 500e and the second light receiving component 500f are disposed side by side on the same surface of the circuit board 300.

[0297] In some embodiments, the first light emitting component 400 b , the second light emitting component 400 c , the first light receiving component 500 e and the second light receiving component 500 f are designed to be planar and are all located on the same surface of the circuit board 300 .

[0298] In some embodiments, the first light emitting component 400b and the second light emitting component 400c may have the same structure as the light emitting component 400a. The first light receiving component 500e and the second light receiving component 500f may have the same structure as the light receiving component 500b.

[0299] In some embodiments, the first light emitting component 400b and the second light emitting component 400c serve as a dual emitting structure, which can be combined with a dual receiving structure consisting of a first light receiving component 500c and a second light receiving component 500d, or with a dual receiving structure consisting of a first light receiving component 500e and a second light receiving component 500f.

[0300] Figure 13a Another internal structure of an optical module according to some embodiments Figure 2 , Figure 13b Assembly and disassembly of another optical module according to some embodiments Figure 1 .like Figure 13a 、 13b As shown, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500e, and the second light receiving component 500f are all located on the same surface of the circuit board 300. If the space on the circuit board 300 is limited, a reasonable design is required to arrange them together on the same surface of the circuit board 300.

[0301] In some embodiments, a recess 308b is formed on the surface of the circuit board 300. The recess 308b is positioned near an edge of the circuit board 300. A first light receiving component 500c and a second light receiving component 500d are positioned on the surface of the recess 308b. Compared to positioning the first light receiving component 500c and the second light receiving component 500d on two separate recesses, positioning the first light receiving component 500c and the second light receiving component 500d on the same recess 308b reduces the area of ​​the recess 308b, thereby reducing the occupied circuit board area and reserving more circuit board space for the first light emitting component 400b and the second light emitting component 400c.

[0302] In some embodiments, the first light receiving component 500c and the second light receiving component 500d can be disposed on the surfaces of two separate grooves. In this case, the groove walls of the two grooves have a certain thickness, and the two grooves are separated by a certain distance to avoid damaging the groove walls of the milled groove during the current milling process. The thickness of the adjacent groove walls of the two grooves and the distance between the adjacent groove walls increase the occupied circuit board surface.

[0303] In some embodiments, the structural features of the first light receiving component 500c may be the same as those of the light receiving component 500a, and will not be further described. The structural features of the second light receiving component 500d may be the same as those of the light receiving component 500a, and will not be further described. The groove portion 308b has the same function as the groove portion 308a, which is to accommodate a substrate with a smaller thermal expansion coefficient.

[0304] In some embodiments, when the first light receiving component 500c and the second light receiving component 500d are both disposed on the surface of the same recess 308b, the distance between the first light receiving component 500c and the second light receiving component 500d is relatively small. Thus, the TIA 530c in the first light receiving component 500c and the TIA 530d in the second light receiving component 500d can share a pad on the surface of the circuit board 300, which is located between the TIA 530c and the TIA 530d. This pad is relatively close to the TIA 530c or the TIA 530d, thereby shortening the bonding distance between the pad and the TIA 530c or the TIA 530d.

[0305] In some embodiments, a first substrate 540c and a second substrate 540d are disposed on the surface of the groove portion 308b. The first substrate 540c is used to support the first deflecting member 510c and the first light receiving chip 520c in the first light receiving component 500c. The second substrate 540d is used to support the second deflecting member 510d and the second light receiving chip 520d in the second light receiving component 500d. The thermal expansion coefficients of the first substrate 540c and the second substrate 540d are both smaller than the thermal expansion coefficient of the circuit board 300.

[0306] In some embodiments, the first substrate 540c and the second substrate 540d may be connected together to form one substrate.

[0307] In some embodiments, the bottom end of the first deflecting member 510c is fixed to the surface of the first substrate 540c. The first light receiving chip 520c is disposed at the end of the first substrate 540c. Similarly, the bottom end of the second deflecting member 510d is fixed to the surface of the second substrate 540d. The second light receiving chip 520d is disposed at the end of the second substrate 540d.

[0308] In some embodiments, a substrate is provided on the surface of the groove portion 308b, and part of the substrate area is used to support the refractive element 510c and the light receiving chip 520c in the first light receiving component 500c, and part of the substrate area is used to support the refractive element 510d and the light receiving chip 520d in the second light receiving component 500d.

[0309] In some embodiments, the width of the end of the groove portion 308b through which the optical fiber passes is relatively smaller, so as to reserve space for the first light emitting component 400b and the second light emitting component 400c.

[0310] In some embodiments, the first substrate 540c is located on the upper surface of the circuit board 300, and the second substrate 540d is located on the upper or lower surface of the circuit board 300. The first substrate 540c and the second substrate 540d can be located on the same surface of the circuit board 300 or on different surfaces of the circuit board 300.

[0311] In some embodiments,

[0312] In some embodiments, the optical module may include a base 700b , which supports the first light emitting component 400b and the second light emitting component 400c , that is, the first light emitting component 400b and the second light emitting component 400c are located on the same base.

[0313] In some embodiments, a first raised surface 703a and a second raised surface 703b are formed on the surface of the base 700b. The first raised surface 703a and the second raised surface 703b are spaced apart. The first raised surface 703a supports the first light emitting component 400b. The second raised surface 703b supports the second light emitting component 400c. In some embodiments, the first light emitting component 400b is secured to the first raised surface 703a using optical glue. The second light emitting component 400c is secured to the second raised surface 703b using optical glue.

[0314] In some embodiments, a first notch portion 307a and a second notch portion 307b are formed on the surface of the circuit board 300. The first notch portion 307a and the second notch portion 307b are separated from each other and are not connected.

[0315] In some embodiments, the base 700b is embedded in the circuit board 300. In the base 700b, the first boss 703a extends into the first notch 307a, and the second boss 703b extends into the second notch 307b, thereby embedding the base 700a in the surface of the circuit board 300.

[0316] In some embodiments, the excavation areas of the first notch portion 307 a and the second notch portion 307 b are minimized so that the first light emitting component 400 b and the second light emitting component 400 c can be disposed in a limited space.

[0317] In some embodiments, the first light emitting component 400b may include a first laser 401b. The second light emitting component 400c may include a second laser 401c.

[0318] In some embodiments, the first optical transmitter 400b may include a first optical modulation chip 404b and a first optical fiber array 405b. The second optical transmitter 400c may include a second optical modulation chip 404c and a second optical fiber array 405c. As previously described, the first optical modulation chip 404b and the second optical modulation chip 404c have similar structural features to the optical modulation chip 404a, with the internal input and output optical waveguides being arranged at an angle relative to the end face.

[0319] In some embodiments, the end face of the first optical modulation chip 404b is formed with an optical input port and multiple optical output ports. The multiple optical output ports have the same output wavelength. In other words, the first optical modulation chip 404b can internally modulate a single input beam of light carrying no signal to produce multiple optical signals of the same wavelength. The optical input port faces the first laser 401b to receive the single beam of light carrying no signal output by the first laser 401b. The optical output port faces the first optical fiber array 405b to couple the multiple optical signals modulated by the first optical modulation chip into the first optical fiber array 405b and output them through the first optical fiber array 405b. The optical input waveguide and optical output waveguide of the first optical modulation chip 404b are non-perpendicular to the end face of the first optical modulation chip 404b, thereby preventing optical signals from being reflected at the end face of the first optical modulation chip 404b. The optical input end face of the first optical fiber array 405b is configured as an inclined surface to prevent optical signals from being reflected at the optical input end face of the first optical fiber array 405b.

[0320] In some embodiments, because the first optical fiber array 405b and the second optical fiber array 405c are relatively long, and the first optical modulation chip 404b and the second optical modulation chip 404c are arranged at an angle relative to the surface of the circuit board 300, the first laser 401b and the first optical fiber array 405b can be arranged parallel to the surface of the circuit board 300, thereby reducing the excavation area of ​​the first notch 307a. Similarly, the second laser 401c and the second optical fiber array 405c can also be arranged parallel to the surface of the circuit board 300, thereby also reducing the excavation area of ​​the second notch 307b.

[0321] In some embodiments, the first optical emitting component 400b may include a first modulation driver chip 406b. The first modulation driver chip 406b is located on one side of the first optical modulation chip 404b. The first modulation driver chip 406b is electrically connected to the first optical modulation chip 404b to provide a modulation drive signal to the first optical modulation chip 404b to drive the first optical modulation chip 404b to modulate the optical signal.

[0322] In some embodiments, the second optical emitting component 400c may include a second modulation driver chip 406c. The second modulation driver chip 406c is located on one side of the second optical modulation chip 404c. The second modulation driver chip 406c is electrically connected to the second optical modulation chip 404c to provide a modulation drive signal to the second optical modulation chip 404c to drive the second optical modulation chip 404c to modulate the optical signal.

[0323] In some embodiments, the first boss surface 703 a and the second boss surface 703 b have the same structure, and the first boss surface 703 a is taken as an example to illustrate its structural features.

[0324] In some embodiments, the first protruding mesa surface 703 a may include a first supporting surface 713 to support the first optical modulation chip 404 b .

[0325] In some embodiments, the first boss surface 703a may include a second supporting surface 723. The second supporting surface 723 includes a first supporting surface 733 and a second supporting surface 743. The first supporting surface 733 is used to support the first laser 401b. The second supporting surface 743 is used to support the first optical fiber array 405b.

[0326] In some embodiments, the length of the second loading surface 743 is smaller than that of the first loading surface 733, so that the optical fiber fixing portion in the first optical fiber array 405b is suspended relative to the second loading surface 743, preventing the optical fiber fixing portion from being optically adhered to the surface of the second loading surface 743, thereby ensuring that the optical fiber fixing portion continues to wrap the optical fiber.

[0327] In some embodiments, a gap is provided between the first supporting surface 713 and the second supporting surface 723 to collect any optical glue that overflows when the first optical modulation chip 404b is coupled to the end faces of the first optical fiber array 405b. In some embodiments, a gap is provided between the first carrying surface 733 and the second carrying surface 743 to collect any optical glue that overflows when the first laser 401b and the first optical fiber array 405b are attached.

[0328] In some embodiments, the gold finger 301 can be electrically connected to the TIA 530c and TIA 530d, respectively, or can be electrically connected to the first modulation driver chip 406b and the second modulation driver chip 406c, respectively, thereby eliminating the need for a signal processing chip, such as a DSP chip. In other words, a linear-drive pluggable optical module (LPO) is used to reduce the power consumption of the optical module. The LPO optical module removes the DSP / CDR chip from the optical module and integrates the related functions into the ASIC switch chip on the device side.

[0329] Figure 13c Assembly and disassembly of another optical module according to some embodiments Figure 2 .like Figure 13c As shown, in some embodiments, the base 700b supports the first light emitting component 400b and the second light emitting component 400c at the same time. The base 700b has a larger extension surface and a larger heat dissipation area. More heat can be conducted through the base 700b, thereby improving the heat dissipation efficiency, which is more conducive to the heat dissipation of the first light emitting component 400b and the second light emitting component 400c.

[0330] In some embodiments, the first modulation and driving chip 406b is located on the surface of the circuit board 300. The first modulation and driving chip 406b is located outside the first notch 307a.

[0331] In some embodiments, the second modulation and driving chip 406 c is located on the surface of the circuit board 300 , and the second modulation and driving chip 406 c is located outside the second notch 307 b .

[0332] In some embodiments, the surface of the base 700b is provided with: a first laser 401b, a first optical modulation chip 404b, a first optical fiber array 405b, a first modulation driver chip 406b, a second laser 401c, a second optical modulation chip 404c, a second optical fiber array 405c, and a second modulation driver chip 406c. The first laser 401b, the first optical modulation chip 404b, and the first optical fiber array 405b are located within the first notch. The second laser 401c, the second optical modulation chip 404c, and the second optical fiber array 405c are located within the second notch.

[0333] Figure 13d FIG. 1 is a diagram of a base and circuit board assembly according to some embodiments. Figure 13e Assembly and disassembly of another optical module according to some embodiments Figure 3 .like Figure 13d and Figure 13e As shown, in some embodiments, the surface of the base 700b for supporting the first light emitting component 400b and the second light emitting component 400c faces the lower surface of the circuit board, that is, the back surface of the circuit board, which faces the lower housing 202. The bottom surface of the base 700b faces the upper surface of the circuit board, that is, the front surface of the circuit board, which faces the upper housing 201.

[0334] In some embodiments, the upper housing 201 of the optical module forms a heat dissipation duct with the cage 106 of the host computer 100, thereby providing better heat dissipation for the upper housing 201 than for the lower housing 202. When the bottom surface of the base 700b faces the upper surface of the circuit board, the heat generated by the first and second light emitting components 400b, 400c carried by the base 700b is conducted upward to the base 700b, then upward through the base 700b to the upper housing 201, where it is then conducted to the outside through the heat dissipation duct. This allows the heat dissipation path of the first and second light emitting components 400b, 400c to be smooth and upward, and fully utilizes the heat dissipation duct of the upper housing, thereby providing an optimal heat dissipation solution.

[0335] Figure 14a Another cross-section of an optical module according to some embodiments is shown in FIG. Figure 1 , Figure 14b FIG. 1 is a cross-sectional diagram of another optical module according to some embodiments. Figure 1 .like Figure 14a 、 14bAs shown, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d are disposed in a planar manner on the same surface of the circuit board 300. For example, they are disposed in a planar manner on the lower surface of the circuit board 300.

[0336] In some embodiments, the first laser 401b, the first optical modulation chip 404b, and the first optical fiber array 405b are supported by the base 700b and embedded in the first notch 307a. This configuration is more conducive to heat dissipation of the first laser 401b, the first optical modulation chip 404b, and the first optical fiber array 405b, and ensures optical path stability.

[0337] In some embodiments, the second laser 401c, the second optical modulation chip 404c, and the second optical fiber array 405c are supported by the base 700b and embedded within the second notch 307b. Similarly, this configuration is more conducive to heat dissipation of the second laser 401c, the second optical modulation chip 404c, and the second optical fiber array 405c, and ensures optical path stability.

[0338] In some embodiments, the location of the gold finger 301 extends along the length of the circuit board 300, which is the direction of the high-frequency signal line routing. A wire bond is formed between the first optical modulation chip 404b and the first modulation driver chip 406b. The first modulation driver chip 406b is bonded to the surface of the circuit board 300 in the direction toward the gold finger 301, enabling high-frequency signal transmission between the first modulation driver chip 406b and the circuit board 300.

[0339] In some embodiments, the first optical modulation chip 404b is wire-bonded to the surface of the circuit board 300 along the width of the circuit board 300 to enable low-frequency signal transmission between the first optical modulation chip 404b and the circuit board 300. The first modulation driver chip 406b is wire-bonded to the surface of the circuit board 300 along the width of the circuit board 300 to enable low-frequency signal transmission between the first modulation driver chip 406b and the circuit board 300.

[0340] In some embodiments, the area of ​​the circuit board 300 between the first optical modulation chip 404b and the second optical modulation chip 404c is a common bonding area. The first optical modulation chip 404b and the second optical modulation chip 404c are respectively bonded to the common bonding area to achieve electrical connection with the circuit board 300.

[0341] In some embodiments, the area of ​​the circuit board 300 between the first modulation driver chip 406b and the second modulation driver chip 406c is a common bonding area. The first modulation driver chip 406b and the second modulation driver chip 406c are respectively bonded to the common bonding area to achieve electrical connection with the circuit board 300.

[0342] In some embodiments, from a heat dissipation perspective, the first modulation and driving chip 406b can be supported by the base 700b and embedded in the first notch 307a. The heat generated by the first modulation and driving chip 406b is conducted through the base 700b, which is more conducive to the heat dissipation of the first modulation and driving chip 406b. The second modulation and driving chip 406c is arranged similarly.

[0343] In some embodiments, wire bonding is performed on four directions of the surface of the first modulation driver chip 406b. The first modulation driver chip 406b is electrically connected to the first optical modulation chip 404b by wire bonding, and the remaining three directions are connected to the surface of the circuit board 300 by wire bonding. For example, the first modulation driver chip 406b is wire bonded to the surface of the circuit board between the first notch 307a and the second notch 307b. Similarly, the second modulation driver chip 406c is wire bonded to the surface of the circuit board between the first notch 307a and the second notch 307b.

[0344] In some embodiments, when the first modulation driver chip 406b and the second modulation driver chip 406c are respectively embedded in the first notch portion 307a and the second notch portion 307b, the surface of the circuit board 300 where the first modulation driver chip 406b and the second modulation driver chip 406c are located is hollowed out, and the wiring area of ​​the inner layer of the circuit board 300 is reduced.

[0345] In some embodiments, when the first modulation driver chip 406b and the second modulation driver chip 406c are embedded within the first notch 307a and the second notch 307b, respectively, the area of ​​the first notch 307a and the second notch 307b for embedding the first modulation driver chip 406b and the second modulation driver chip 406c is expanded beyond the chip size of the first modulation driver chip 406b and the second modulation driver chip 406c to avoid mounting interference with the first modulation driver chip 406b and the second modulation driver chip 406c. This expansion of the area of ​​the first notch 307a and the second notch 307b inevitably reduces the common bonding area between the first modulation driver chip 406b and the second modulation driver chip 406c, making wiring impossible. Furthermore, the expansion of the area of ​​the second notch 307b may extend beyond the edge of the circuit board 300.

[0346] In some embodiments, the first modulation driver chip 406b is located on the surface of the circuit board 300, and the first modulation driver chip 406b is located outside the first notch 307a. The second modulation driver chip 406c is located on the surface of the circuit board 300, and the second modulation driver chip 406c is located outside the second notch 307b. The inner layer of the circuit board 300 where the first modulation driver chip 406b and the second modulation driver chip 406c are located is available for wiring, which is more suitable for scenarios where space on the circuit board 300 is limited. At the same time, within the limited space on the circuit board 300, the excavation range of the first notch 307a and the second notch 307b allows for a common bonding area between the first optical modulation chip 404b and the second optical modulation chip 404c, as well as a common bonding area between the first modulation driver chip 406b and the second modulation driver chip 406c, to meet bonding requirements.

[0347] In some embodiments, when the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500e, and the second light receiving component 500f are all disposed on the surface of the circuit board 300, the first modulation and driving chip 406b can be positioned on the surface of the circuit board 300, and the first modulation and driving chip 406b can be positioned outside the first notch 307a. Similarly, the second modulation and driving chip 406c can be positioned on the surface of the circuit board 300, and the second modulation and driving chip 406c can be positioned outside the second notch 307b.

[0348] In some embodiments, the first modulation and driver chip 406b is located on the surface of the circuit board 300, and the second modulation and driver chip 406c is located on the surface of the circuit board 300. The circuit board 300 is disposed between the first modulation and driver chip 406b and the base 700b. The base 700b has a larger supporting area corresponding to the first modulation and driver chip 406b to facilitate heat dissipation from the first modulation and driver chip 406b. Heat dissipation from the first modulation and driver chip 406b is achieved through the first modulation and driver chip 406b, the circuit board 300, and the base 700b.

[0349] In some embodiments, the first optical modulation chip 404b is located on the surface of the base 700b, and the first modulation driver chip 406b is located on the surface of the circuit board 300. The first optical modulation chip 404b is embedded in the first notch 307a so that the surface of the first optical modulation chip 404b is flush with the surface of the first modulation driver chip 406b. This shortens the bonding length between the surfaces of the first optical modulation chip 404b and the first modulation driver chip 406b, facilitating high-frequency signal transmission.

[0350] Figure 14c Another cross-section of an optical module according to some embodiments is shown in FIG. Figure 1 , Figure 14d FIG. 1 is a cross-sectional diagram of another optical module according to some embodiments. Figure 1 .like Figure 14c、 14d As shown, in some embodiments, the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d are disposed in a planar manner on the same surface of the circuit board 300. For example, they are disposed in a planar manner on the lower surface of the circuit board 300.

[0351] In some embodiments, the base 700b supports the first laser 401b, the first optical modulation chip 404b, and the first optical fiber array 405b in the first optical emitting component 400b, and also supports the second laser 401c, the second optical modulation chip 404c, and the second optical fiber array 405c in the second optical emitting component 400c.

[0352] In some embodiments, the first notch portion 307a and the second notch portion 307b are separated by the circuit board 300, and the first notch portion 307a and the second notch portion 307b are not connected to reserve the circuit board area between the first notch portion 307a and the second notch portion 307b, and reserve the common wiring area between the first optical modulation chip 404b and the second optical modulation chip 404c, and the common wiring area between the first modulation driver chip 406b and the second modulation driver chip 406c, so as to facilitate the deployment of wiring, so that the first light emitting component 400b, the second light emitting component 400c, the first light receiving component 500c and the second light receiving component 500d can be deployed in a plane on the same surface of the circuit board 300.

[0353] In some embodiments, the first notch 307a is connected to the second notch 307b, i.e., the two constitute a single notch. This is suitable for scenarios where no shared bonding area is required between the first optical modulation chip 404b and the second optical modulation chip 404c, and no shared bonding area is required between the first modulation driver chip 406b and the second modulation driver chip 406c. For example, the bonding pads for low-frequency signal transmission in the first optical modulation chip 404b and the second optical modulation chip 404c are mirror images, with the first optical modulation chip 404b bonding toward one edge of the circuit board 300 and the second optical modulation chip 404c bonding toward the other edge of the circuit board 300. The first modulation driver chip 406b and the second modulation driver chip 406c are designed identically.

[0354] Figure 15 FIG. 1 is another optical module layout diagram according to some embodiments. Figure 15 As shown, in some embodiments, a first light receiving component 500e and a second light receiving component 500f are provided on the surface of the circuit board 300. In some embodiments, the first light receiving component 500e and the second light receiving component 500f can adopt the structure of the light receiving component 500b.

[0355] In some embodiments, the first light receiving component 500e may include a first lens assembly 510e. The first lens assembly 510e is projected onto the surface of the circuit board 300, and a first reflective surface is formed on the surface of the first lens assembly 510e. The first light receiving component 500e may include a first light receiving chip, which is located on the surface of the circuit board and in the reflected light path of the first reflective surface. For more details, please refer to the structure of the light receiving component 500b.

[0356] In some embodiments, the second light receiving component 500f may include a second lens assembly 510f.

[0357] In some embodiments, the first lens assembly 510e and the second lens assembly 510f are relatively large, making it unsuitable to position them side by side along the width of the circuit board 300. In some embodiments, the first lens assembly 510e and the second lens assembly 510f are staggered and positioned on the same surface of the circuit board 300. This not only fully utilizes the space on the circuit board 300 for arranging them simultaneously, but also prevents the optical fiber array connected to the first lens assembly 510e from passing along the second lens assembly 510f.

[0358] In some embodiments, the second lens assembly 510f is buckled onto the surface of the circuit board 300 to form a wrapping cavity with the surface of the circuit board 300. A second reflective surface is formed on the surface of the second lens assembly 510f.

[0359] In some embodiments, the second light receiving component 500f may include a light receiving chip 520f. The light receiving chip 520f is located within the enclosed cavity formed by the second lens assembly 510f and the circuit board 300. The light receiving chip 520f is located on the surface of the circuit board 300 and is illuminated by the second lens assembly 510f. The light receiving chip 520f is located in the reflected light path of the second reflective surface.

[0360] In some embodiments, the second light receiving component 500f may include a TIA 530f. The TIA 530f is located on one side of the light receiving chip 520f. The TIA 530f is located in a cavity enclosed by the second lens assembly 510f and the circuit board 300. The TIA 530f is located on the surface of the circuit board 300 and is illuminated by the second lens assembly 510f.

[0361] In some embodiments, a reflective surface 511f is formed on the surface of the second lens assembly 510f. The reflective surface 511f is formed above the light receiving chip 520f. The reflective surface 511f can redirect the light along a path parallel to the surface of the circuit board 300 toward the surface of the light receiving chip 520f, thereby coupling the optical signal into the light receiving chip.

[0362] In some embodiments, the circuit board 300 has a large coefficient of thermal expansion, resulting in relatively poor optical path stability. A groove 309 is formed on the surface of the circuit board 300, and a substrate 521 is disposed on the surface of the groove 309. The surface of the substrate 521 supports the light receiving chip 520f. The coefficient of thermal expansion of the substrate 521 is relatively lower than that of the circuit board 300, thereby ensuring the stability of the optical path transmission of the light receiving chip 520f.

[0363] In some embodiments, the thickness of the substrate 521 allows the light receiving chip 520 f to be flush with the surface of the TIA 530 f , thereby shortening the bonding length between the substrate 521 and the TIA 530 f .

[0364] In some embodiments, the first light receiving part 500e may adopt the same structure as the second light receiving part 500f.

[0365] Figure 16 FIG. 1 is a side structural diagram of another optical module according to some embodiments. Figure 16 As shown, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed toward one surface of the circuit board, and the first light receiving component 500g and the second light receiving component 500h are disposed toward the other surface of the circuit board. The upper and lower surfaces of the circuit board 300 are fully utilized to fully utilize the packaging space.

[0366] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed toward the upper surface of the circuit board, and the first light receiving component 500g and the second light receiving component 500h are disposed toward the lower surface of the circuit board.

[0367] In some embodiments, the first light emitting component 400 d and the second light emitting component 400 e are located in a cavity formed by the circuit board 300 and the upper housing 201 .

[0368] In some embodiments, the first light receiving component 500 g and the second light receiving component 500 h are located in a cavity formed by the circuit board 300 and the lower housing 202 .

[0369] In some embodiments, the surfaces of the first light emitting component 400d and the second light emitting component 400e are covered with a protective cover 400f to protect the first light emitting component 400d and the second light emitting component 400e.

[0370] Figure 17 FIG. 1 is a cross-sectional structural diagram of another optical module according to some embodiments. Figure 17 As shown, in some embodiments, the optical module may include a base 800 . The base 800 is embedded in the circuit board 300 and fixed on the circuit board 300 .

[0371] In some embodiments, a surface of the base 800 faces the upper housing 201 , and the surface is used to support the first light emitting component 400 d and the second light emitting component 400 e .

[0372] In some embodiments, the other surface of the base 800 faces the lower housing 202 , and is used to support the first light receiving component 500 g and the second light receiving component 500 h .

[0373] Figure 18 A circuit board upper surface structure according to some embodiments Figure 1 , Figure 19 A circuit board upper surface structure according to some embodiments Figure 2 .like Figure 18 and Figure 19 As shown, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are disposed toward the upper surface of the circuit board 300. The surfaces of the first light emitting component 400d and the second light emitting component 400e are covered with a protective cover 400f.

[0374] In some embodiments, the first light emitting component 400 d and the second light emitting component 400 e are located on a surface of the base 800 facing the upper housing 201 .

[0375] In some embodiments, a first signal processing chip 304a is provided on one side of the first light emitting component 400d, and a second signal processing chip 304b is provided on one side of the second light emitting component 400e, thereby preventing high-frequency signal crosstalk between the first light emitting component 400d and the second light emitting component 400e.

[0376] Figure 20 A circuit board lower surface structure according to some embodiments Figure 1 .like Figure 20 As shown, in some embodiments, the first light receiving component 500g and the second light receiving component 500h are disposed toward the lower surface of the circuit board 300. The surfaces of the first light receiving component 500g and the second light receiving component 500h are covered with a cover plate 305a.

[0377] In some embodiments, the first light receiving component 500 g and the second light receiving component 500 h are located on a surface of the base 800 facing the lower housing 202 .

[0378] Figure 21 A circuit board lower and upper surface structure according to some embodiments Figure 2 .like Figure 21 As shown, in some embodiments, the first light receiving component 500 i and the second light receiving component 500 j are disposed toward the lower surface of the circuit board 300 .

[0379] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located in the cavity formed by the circuit board 300 and the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located in the cavity formed by the circuit board 300 and the lower housing 201.

[0380] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500g and the second light receiving component 500h are located on the surface of the base 800 facing the lower housing 202. Exemplarily, the first light receiving component 500g and the second light receiving component 500h adopt a micro-optical packaging solution.

[0381] In some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board 300. Exemplarily, the first light receiving component 500i and the second light receiving component 500j are packaged using a COB solution.

[0382] In some embodiments, the optical fiber ribbons in the first light receiving component 500 i and the second light receiving component 500 j shuttle along the base 800 toward the surface of the lower housing 202 .

[0383] Figure 22 FIG. 1 is another exploded view of an optical module according to some embodiments. Figure 22 As shown, in some embodiments, a first notch 307c and a second notch 307d are formed on the surface of the circuit board 300. The first notch 307c is provided with a first signal processing chip 304a on one side, and the second notch 307d is provided with a second signal processing chip 304b on one side.

[0384] In some embodiments, the first notch portion 307c and the second notch portion 307d are independent of each other and are not connected to each other, so as to reserve a wiring space on the surface of the circuit board 300 between the first notch portion 307c and the second notch portion 307d.

[0385] In some embodiments, a first boss 810 and a second boss 820 are formed on the top surface of the base 800. The first boss 810 extends into the first notch 307c, and the second boss 820 extends into the second notch 307d, thereby embedding the base 800 on the circuit board 300.

[0386] In some embodiments, the first raised surface 810 is used to support the first light emitting component 400d, and the second raised surface 820 is used to support the second light emitting component 400e. The first raised surface 810 extends into the first notch 307c, thereby positioning the first light emitting component 400d toward the top surface of the circuit board 300. The second raised surface 820 extends into the second notch 307d, thereby positioning the second light emitting component 400e toward the top surface of the circuit board 300. The base 800 has excellent heat dissipation properties and can conduct heat generated by the first and second light emitting components 400d and 400e.

[0387] Figure 23a FIG. 1 is a diagram of a circuit board surface mounting structure according to some embodiments. Figure 23b FIG1 is an exploded view of a base and a light emitting component according to some embodiments. Figure 23a and Figure 23b As shown, in some embodiments, the first light emitting component 400 d is embedded in the first notch portion 307 c by the base 800 , and the second light emitting component 400 e is embedded in the second notch portion 307 d by the base 800 .

[0388] In some embodiments, the first light emitting component 400d may include a first laser 401d. The first light emitting component 400d may include a first lens 402d. The first light emitting component 400d may include a first isolator 403d. The first light emitting component 400d may include a first optical modulation chip 404d. The first light emitting component 400d may include a first optical fiber array 405d. The first light emitting component 400d may include a first modulation driver chip 406d. The optical path principle can be referred to the first light emitting component 400b.

[0389] In some embodiments, the second light emitting component 400e may include a second laser 401e. The second light emitting component 400e may include a second lens 402e. The second light emitting component 400e may include a second isolator 403e. The second light emitting component 400e may include a second optical modulation chip 404e. The second light emitting component 400e may include a second optical fiber array 405e. The second light emitting component 400e may include a second modulation driver chip 406e. The optical path principle can be referred to the first light emitting component 400b.

[0390] In some embodiments, the first isolator 403d is disposed on one side of the light entrance of the first optical modulation chip 404d, and the light output by the first isolator 403d passes through the air and enters the first optical modulation chip 404d.

[0391] In some embodiments, an optical refractive index matching glue is provided between the first optical fiber array 405d and the end face of the first optical modulation chip 404d, and the optical signal modulated by the first optical modulation chip 404d is coupled into the first optical fiber array 405d through the optical refractive index matching glue.

[0392] In some embodiments, the first modulation driver chip 406d is wire-bonded in four directions. The first modulation driver chip 406d is wire-bonded to the first optical modulation chip 404d, and the remaining three directions are wire-bonded to the circuit board 300. For example, the circuit board 300 surface between the first notch 307c and the second notch 307d is wire-bonded. Similarly, the second modulation driver chip 406e is wire-bonded to the circuit board 300 surface between the first notch 307c and the second notch 307d, so that the first light emitting component 400d is embedded in the first notch 307c, and the second light emitting component 400e is embedded in the second notch 307d.

[0393] In some embodiments, the second boss surface 820 may include a first supporting surface 821. The first supporting surface 821 supports the second laser 401e, the second lens 402e, the second isolator 403e, and the second optical fiber array 405e.

[0394] In some embodiments, the second protruding mesa 820 may include a second supporting surface 822. The second supporting surface 822 supports the second optical modulation chip 404e.

[0395] In some embodiments, the second protruding mesa 820 may include a third supporting surface 823. The third supporting surface 823 supports the second modulation driving chip 406e.

[0396] Figure 23c FIG. 1 is a structural diagram of a first light emitting component according to some embodiments. Figure 23c As shown, in some embodiments, the first optical modulation chip 404d is coupled to the end face of the first optical fiber array 405d.

[0397] In some embodiments, the optical input and output end face of the first optical modulation chip 404d includes an optical input port 414d and an optical output port 424d. The optical input port 414d and the optical output port 424d are located on the same end face. The optical input port 414d faces the first isolator 403d. The optical output port 424d faces the first optical fiber array 405d.

[0398] In some embodiments, the input waveguide corresponding to the input port 414d is perpendicular to the input end face of the first optical modulation chip 404d, and the output waveguide corresponding to the output port 424d is tilted relative to the output end face of the first optical modulation chip 404d.

[0399] In some embodiments, the light input and output end surface of the first optical modulation chip 404 d is arranged perpendicular to the long side of the circuit board 300 .

[0400] In some embodiments, the first laser 401d, the first lens 402d, and the first isolator 403d are arranged perpendicularly relative to the light incident end face of the first optical modulation chip 404d, so that the light output axis of the first laser 401d is consistent with the light incident axis of the first optical modulation chip 404d, thereby improving the efficiency of coupling the light source emitted by the first laser 401d to the light input waveguide.

[0401] In some embodiments, the first optical fiber array 405d is tilted relative to the light-emitting end face of the first optical modulation chip 404d so that the light-input axis of the first optical fiber array 405d is consistent with the light-output axis of the first optical modulation chip 404d, thereby improving the coupling efficiency between the first optical modulation chip 404d and the first laser 401d.

[0402] In some embodiments, the light-entering end face of the first optical fiber array 405d is beveled, as are the light-entering end faces of its internal optical fibers. This prevents optical signals incident on the first optical fiber array 405d from returning to the first optical modulation chip 404d, thereby improving return loss and allowing more light to be transmitted through the optical fibers. For example, the light-entering end face of the optical fiber array 405a is polished to an 8° bevel.

[0403] In some embodiments, the first optical fiber array 405d is relatively long and tilted relative to the light-emitting end face of the first optical modulation chip 404d. Therefore, the first notch 307c has a larger excavation area to accommodate the tilted placement of the first optical fiber array 405d. Similarly, the second notch 307d has a larger excavation area to accommodate the tilted placement of the second optical fiber array 405e. This reduces the available space on the top surface of the circuit board 300, making it impossible to deploy the first and second optical fiber receiving components 500g and 500h on the top surface of the circuit board 300.

[0404] Figure 24 FIG1 is an assembly diagram of the top and bottom surface structures of a base according to some embodiments. Figure 24 As shown, in some embodiments, both ends of the top surface of the base 800 support the circuit board 300 , and the circuit board 300 is embedded in the base 800 .

[0405] In some embodiments, the second boss 820 is used to support the second light emitting component 400 e . The second boss 820 extends into the second notch 307 d , thereby positioning the second light emitting component 400 e toward the upper surface of the circuit board 300 .

[0406] In some embodiments, since the first light receiving component 500g and the second light receiving component 500h are located in the cavity formed by the circuit board 300 and the lower shell 201, the area of ​​the first notch portion 307c and the second notch portion 307d on the upper surface of the circuit board 300 is larger, so that the first modulation driving chip 406d can be set on the surface of the base 800 and embedded in the first notch portion 307c, and the second modulation driving chip 406e can be set on the surface of the base 800 and embedded in the second notch portion 307d, which is beneficial to the heat dissipation of the first modulation driving chip 406d and the second modulation driving chip 406e.

[0407] In some embodiments, the second optical fiber array 405e is located on the first supporting surface 821 , the second optical modulation chip 404e is located on the second supporting surface 822 , and the second modulation driver chip 406e is located on the third supporting surface 823 .

[0408] In some embodiments, the height of the third supporting surface 823 allows the surface of the second modulation and driver chip 406e to be flush with the surface of the circuit board 300, or as close as possible to the surface of the circuit board 300, thereby shortening the bonding length between the second modulation and driver chip 406e and the surface of the circuit board 300. The second modulation and driver chip 406e is electrically connected to the second signal processing chip via wiring on the surface of the circuit board 300.

[0409] In some embodiments, the height difference between the third supporting surface 823 and the second supporting surface 822 allows the optical axes of the second modulation driver chip 406e and the second optical modulation chip 404e to align. The height difference between the second supporting surface 822 and the first supporting surface 821 allows the optical axes of the second optical modulation chip 404e and the second optical fiber array 405e to align.

[0410] In some embodiments, the second optical fiber array 405e is glued to the surface of the first supporting surface 821. The second optical modulation chip 404e is also glued to the surface of the second supporting surface 822. A groove 824 is formed between the first supporting surface 821 and the second supporting surface 822 to collect glue that overflows from the first supporting surface 821 and the second supporting surface 822, as well as glue that overflows when the second optical fiber array 405e is coupled to the end face of the second optical modulation chip 404e.

[0411] In some embodiments, the top surface of base 800 supports first light emitting component 400d and second light emitting component 400e. The bottom surface of base 800 supports the first deflecting element of first light receiving component 500g and the second deflecting element of second light receiving component 500h. By fully utilizing the top and bottom surfaces of base 800, a three-dimensional and integrated deployment is achieved, facilitating wiring and reducing circuit board space.

[0412] In some embodiments, a first light emitting component may be disposed on the top surface of the base 800. A first light receiving component may be disposed on the bottom surface of the base 800. For detailed structure, see the top surface of the base 800 for supporting the first and second light emitting components. The bottom surface of the base 800 supports the first deflecting element in the first light receiving component and the second deflecting element in the second light receiving component. The packaging structures can be mutually referenced and will not be further described.

[0413] Figure 25 FIG. 1 is a diagram of a bottom surface assembly structure of a base according to some embodiments. Figure 25 As shown, in some embodiments, the bottom surface of the base 800 carries optical devices, so that both the top and bottom surfaces of the base 800 carry optical devices, making full use of the base 800.

[0414] In some embodiments, the first light receiving component 500g may include a first deflector 510g, a first focusing lens 520g, a first light receiving chip array 530g, and a first TIA 540g.

[0415] In some embodiments, the second light receiving component 500h may include a second deflector 510h, the second light receiving component 500g may include a second condensing lens 520h, the second light receiving component 500h may include a second light receiving chip array 530h, and the second light receiving component 500h may include a second TIA 540h.

[0416] In some embodiments, the first deflector 510g and the second deflector 510h are located on the bottom surface of the base 800. The first TIA 540g and the second TIA 540h are located on the surface of the circuit board 300.

[0417] In some embodiments, as the communication rate increases, the overall power consumption of the optical module increases, and the heat dissipation demand increases accordingly. Currently, air cooling, liquid cooling and other methods can be used for heat dissipation. According to the heat exchange method, the liquid cooling method includes immersion, spraying and the like. The immersion and spraying liquid cooling systems achieve heat exchange through direct contact between the cooling medium and the heat dissipation device. The immersion liquid cooling system directly immerses the host computer and the optical module in the cooling medium. The cooling medium absorbs the heat generated by the heat dissipation device and transfers the heat to the water in the heat exchange, and then transfers the heat to the heat dissipation device through water circulation. Exemplarily, the cooling medium is a refrigerant, such as a fluorinated liquid.

[0418] In some embodiments, the surfaces of the first light receiving component 500g and the second light receiving component 500h are covered with a cover plate 305a.

[0419] In some embodiments, the cover 305a can extend along the surface of the first light receiving component 500g and the second light receiving component 500h and bend toward the surface of the circuit board 300 to cover and wrap the first light receiving component 500g and the second light receiving component 500h to prevent the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical path.

[0420] In some embodiments, when liquid cooling is used to dissipate heat from the optical module, the cooling medium used in the liquid cooling may affect the optical path. To this end, a protective cover 400f is provided on the surface of the first light emitting component 400d and the second light emitting component 400e, thereby enclosing the first light emitting component 400d and the second light emitting component 400e to prevent the cooling medium from entering the interior and affecting the optical path.

[0421] In some embodiments, to protect the first light receiving component 500g and the second light receiving component 500h, the base 800 includes a barrier portion 830. A cover plate 305a is provided above the first light receiving component 500g and the second light receiving component 500h. One end of the cover plate 305a is provided on the surface of the base 800 body, and the other end is provided on the surface of the barrier portion 830. The first light receiving component 500g and the second light receiving component 500h are located within the enclosure formed by the cover plate 305a and the barrier portion 830, thereby preventing the cooling medium from entering the first and second light receiving components during liquid cooling and affecting their optical paths.

[0422] In some embodiments, the enclosure 830 is placed on the surface of the circuit board 300 and exposes the surface of the circuit board 300 surrounded by the enclosure 830, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board surrounded by the enclosure 380.

[0423] In some embodiments, a barrier portion 830 is formed on one side of the first light receiving component 500g and the second light receiving component 500h. The barrier portion 830 can be a C-shaped frame. The barrier portion 830 encloses the first light receiving component 500g and the second light receiving component 500h to support the cover plate 305a, so that the cover plate 305a covers the surface of the first light receiving component 500g and the second light receiving component 500h, preventing the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical paths.

[0424] In some embodiments, the cover 305a is disposed on the bottom surface of the main structure of the base 800 and the bottom surface of the enclosure 830, thereby covering the surfaces of the first light receiving component 500g and the second light receiving component 500h.

[0425] In some embodiments, one end of the cover plate 305a is mounted on the bottom surface of the base 800 body structure, and the other end is mounted on the bottom surface of the enclosure 830, thereby shielding the first light receiving component 500g and the second light receiving component 500h. The first light receiving component 500g and the second light receiving component 500h are located within the enclosure formed by the cover plate 305a and the enclosure 830, thereby preventing the cooling medium from entering the first light receiving component 500g and the second light receiving component 500h and affecting their optical paths.

[0426] In some embodiments, an embedding groove 850 is formed along the bottom surface of the base 800 main structure and the bottom surface of the enclosure 830 to embed the cover 305a in the surface of the base 800 main structure and the surface of the enclosure 830, thereby fixing the cover 305a to the bottom surface of the base 800.

[0427] In some embodiments, the shape of the embedding groove 850 is adapted to the cover plate 305 a so as to fix the cover plate 305 a on the base 800 . Figure 26a FIG. 1 is a diagram illustrating an assembly structure of a first refractive element and a first converging lens according to some embodiments. Figure 26b FIG. 1 is an exploded view of the assembly of a first refractive element and a first converging lens according to some embodiments. Figure 26a and Figure 26b As shown, in some embodiments, the first refraction member 510g is fixedly connected to the first converging lens 520g.

[0428] In some embodiments, the first light-bending element 510g may include a first fiber-supporting portion 511g and a second fiber-supporting portion 512g. An optical fiber 513g is sandwiched between the first fiber-supporting portion 511g and the second fiber-supporting portion 512g. The first fiber-supporting portion 511g is relatively thick to facilitate clamping and coupling with the first light-bending element 510g.

[0429] In some embodiments, a reflective end face 514g is formed at the end of the optical fiber 513g, and the reflective end face 514g is located above the first light receiving chip array 530g. The reflective end face 514g is used to reflect and change the transmission direction of the optical signal transmitted by the optical fiber 513g, so as to reflect the optical signal transmitted within the optical fiber 513g to the first light receiving chip array 530g. Exemplarily, the reflective end face 514g is an inclined surface, and the received optical signal transmitted by the optical fiber 513g is totally reflected at the reflective end face 514g. Exemplarily, the inclination angle of the reflective end face 514g is 46-50°, such as 48°.

[0430] In some embodiments, a protective surface 516g is formed on the end surface of the first optical fiber support portion 511g. The protective surface 516g surrounds the side of the reflective end surface 514g and is used to protect the reflective end surface 514g. Exemplarily, the protective surface 516g is an inclined surface with an inclination angle of 46-50°, such as 48°.

[0431] In some embodiments, the reflective end face 514g and the protective surface 516g are formed by grinding and polishing. The reflective end face 514g is formed by grinding the end face of the optical fiber 513g to a certain angle. The optical fiber 513g is cylindrical, and after grinding, the cross-section of the reflective end face 514g is elliptical. As a result, the bottom of the optical fiber 513g is exposed relative to the first optical fiber support portion 511g. The optical fiber 513g is soft, and the exposed section relative to the first optical fiber support portion 511g may break if unprotected.

[0432] In some embodiments, the first deflecting member 510g may include a fiber fixing portion 515g. The fiber fixing portion 515g is located below the first fiber supporting portion 511g and within the space enclosed by the end of the second fiber supporting portion 512g. The fiber fixing portion 515g provides protection and cushioning for the optical fiber 513g. The fiber fixing portion 515g may be made of soft rubber to provide protection and cushioning for the optical fiber 513g.

[0433] In some embodiments, a preset distance, such as a first preset value, is provided between the reflective end surface 514g and the first light receiving chip array 530g to ensure that the light signal reflected by the reflective end surface 514g falls within the photosensitive surface of the light receiving chips in the first light receiving chip array 530g. For example, the first preset value is relatively small, such as 0.02 mm.

[0434] In some embodiments, since the top and bottom surfaces of the base 800 both support optical devices, the base 800 is required to have a strong supporting force to ensure a stable optical path.

[0435] In some embodiments, the first converging lens 520g is fixed to the surface of the second optical fiber support portion 512g facing the first light receiving chip array 530g. The second optical fiber support portion 512g extends below the reflective end surface 514g, so that the first converging lens 520g is located between the reflective end surface 514g and the first light receiving chip array 530g, with the light emitting surface of the first converging lens 520g facing the first light receiving chip array 530g. The first converging lens 520g converges the optical signal reflected from the reflective end surface 514g, so that the optical signal reflected from the reflective end surface 514g falls within the photosensitive surface range of the light receiving chips in the first light receiving chip array 530g. This can move the reflective end surface 514g away from the surface of the circuit board 300, increase the distance between the reflective end surface 514g and the first light receiving chip array 530g, and thereby increase the thickness between the top and bottom surfaces of the base 800, thereby increasing the support of the base 800 for the optical device and ensuring the stability of the optical path.

[0436] In some embodiments, the first converging lens 520g converges the light signal reflected from the reflective end surface 514g to compensate for the optical path difference from the reflective end surface 514g to the first light receiving chip array 530g caused by increasing the thickness of the base 800, so that the light signal reflected from the reflective end surface 514g falls within the photosensitive surface range of the light receiving chip in the first light receiving chip array 530g.

[0437] In some embodiments, the thickness of the base 800 can ensure that the first converging lens 520g is disposed between the reflective end surface 514g and the first light receiving chip array 530g, and can ensure the focal length from the first converging lens 520g to the first light receiving chip array 530g.

[0438] In some embodiments, the second optical fiber supporting portion 512g extends to below the reflective end surface 514g to wrap the reflective end surface 514g to prevent fiber breakage.

[0439] In some embodiments, the protective surface 516g, the reflective end surface 514g, and the end surface of the second fiber support portion 512g have the same inclination, and the protective surface 516g and the second fiber support portion 512g adapt to the inclination of the reflective end surface 514g.

[0440] In some embodiments, the first light receiving chip array 530g can be located on the surface of the first TIA 540g. This allows the first light receiving chip array 530g to be located a certain distance from the surface of the circuit board 300. This allows the reflective end surface 514g to be moved further away from the surface of the circuit board 300, further increasing the distance between the reflective end surface 514g and the first light receiving chip array 530g. This in turn increases the thickness between the top and bottom surfaces of the base 800, thereby enhancing the base 800's support for optical components. Furthermore, the distance between the first light receiving chip array 530g and the first converging lens 520g can be shortened, increasing coupling efficiency. This also improves high-frequency signal transmission performance between the first light receiving chip array 530g and the first TIA 540g.

[0441] Figure 27 This is a diagram of a bottom surface assembly structure of a base according to some embodiments. Figure 28 is a cross-sectional view of a bottom surface assembly of a base according to some embodiments. Figure 29 FIG. 1 is a structural diagram of the bottom surface of a base according to some embodiments. Figures 27-29 As shown, in some embodiments, the bottom surface of the base 800 carries a first deflecting element 510g and a second deflecting element 510h.

[0442] In some embodiments, the surface where the second optical fiber supporting portion 512g is located is recessed from the surface through which the optical fiber 513g passes, thereby providing bending space for the optical fiber 513g and preventing fiber breakage.

[0443] In some embodiments, the optical fiber 513g passes through the interior of the optical fiber fixing portion 515g. The second optical fiber supporting portion 512g is fixed to the surface of the base 800 by gluing.

[0444] In some embodiments, a groove 840 is formed on one side of the surface where the second optical fiber support portion 512g is located. The optical fiber fixing portion 515g extends from the groove 840. The groove 840 allows the surface where the optical fiber fixing portion 515g is located to be lower than the surface where the second optical fiber support portion 512g is located, thereby preventing the optical fiber fixing portion 515g from adhering to the surface where the second optical fiber support portion 512g is located, thereby maintaining the wrapping force of the optical fiber fixing portion 515g on the optical fiber 513g.

[0445] In some embodiments, a partition 860 is formed on the bottom surface of the base 800. The partition 860 can be located in the middle, dividing the surface through which the optical fiber 513g passes into a first channel 870 and a second channel 880, thereby providing shuttle channels for the optical fiber ribbons of the first light receiving component 500g and the second light receiving component 500h, respectively, to prevent fiber entanglement.

[0446] Figure 30 Another cross-sectional structure of an optical module according to some embodiments Figure 1 , Figure 31Another cross-sectional structure of an optical module according to some embodiments Figure 2 , Figure 32 FIG is a partial cross-sectional view of another optical module according to some embodiments. Figure 30-32 As shown, in some embodiments, the first light emitting component 400d and the second light emitting component 400e are located on the surface of the base 800 facing the upper housing 201. The first light receiving component 500i and the second light receiving component 500j are located on the lower surface of the circuit board 300.

[0447] In some embodiments, the first light receiving component 500i may include a first lens assembly 510i. The first lens assembly 510i is located on one side of the base 800 and is buckled onto the lower surface of the circuit board 300.

[0448] In some embodiments, the second light receiving component 500j may include a second lens assembly 510j. The second lens assembly 510j is located on one side of the base 800 and is buckled onto the lower surface of the circuit board 300.

[0449] In some embodiments, the optical fiber ribbons in the first light receiving component 500 i and the second light receiving component 500 j shuttle along the base 800 toward the surface of the lower housing 202 .

[0450] In some embodiments, the first light receiving component 500i and the second light receiving component 500j may have the same structure. In some embodiments, the structures of the first light receiving component 500i and the second light receiving component 500j may be the same as those of the light receiving component 500b. In some embodiments, the structures of the first light receiving component 500i and the second light receiving component 500j may be the same as those of the second light receiving component 500f. Detailed description is omitted.

[0451] In some embodiments, the top surface of the base 800 is used to support the first light emitting component 400d and the second light emitting component 400e. The first light receiving component 500i and the second light receiving component 500j are located on the bottom surface of the circuit board, achieving a three-dimensional and integrated deployment, which is more conducive to wiring and more conducive to reducing the occupied circuit board space.

[0452] In some embodiments, a first light emitting component 400d may also be disposed on the top surface of the base 800. A first light receiving component 500i is located on the bottom surface of the circuit board. For detailed structure, see the top surface of the base 800 for supporting the first light emitting component 400d and the second light emitting component 400e. The first light receiving component 500i and the second light receiving component 500j are located on the bottom surface of the circuit board. The packaging structures can be mutually referenced and will not be further described.

[0453] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, characterized in that: include: A circuit board has a first notch portion and a second notch portion on its surface; a base, embedded in the first notch portion and the second notch portion; A first light emitting component is provided on the top surface of the base, the top surface of the base faces the upper surface of the circuit board and is located in the first notch, and the first light emitting component includes: a first laser configured to output light that does not carry a signal; a first optical modulation chip configured to modulate the light not carrying a signal to generate an optical signal; a first optical fiber array, coupled to an end face of the first optical modulation chip to transmit the optical signal; a first modulation driver chip, electrically connected to the first optical modulation chip and connected to the surface of the circuit board between the first notch and the second notch by wire bonding; The second light emitting component is provided on the top surface of the base and located in the second notch, and includes: a first laser configured to output light that does not carry a signal; a first optical modulation chip configured to modulate the light not carrying a signal to generate an optical signal; a first optical fiber array, coupled to an end face of the first optical modulation chip to transmit the optical signal; a second modulation driver chip, electrically connected to the second optical modulation chip and connected to the surface of the circuit board between the first notch and the second notch by wire bonding; The first light receiving component comprises: a first refracting member disposed on the bottom surface of the base, wherein an end surface of the first refracting member is formed with a first reflective end surface; The first light receiving chip array is located on the lower surface of the circuit board and is located on the light path reflected by the first reflective end face; the second light receiving component includes: a second refracting member disposed on the bottom surface of the base, wherein an end surface of the second refracting member is formed with a second reflective end surface; The second light receiving chip array is located on the lower surface of the circuit board and on the light reflection path of the second reflection end surface.

2. The optical module according to claim 1, wherein The surfaces of the first light emitting component and the second light emitting component are covered with a protective cover; The base includes a blocking portion; The enclosure portion is placed on the surface of the circuit board, and the surface of the circuit board surrounded by the enclosure portion is exposed, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board surrounded by the enclosure portion; A cover plate is provided above the first light receiving component and the second light receiving component. One end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the enclosure portion.

3. The optical module according to claim 1, wherein: The first light-bending member includes a first optical fiber supporting portion and a second optical fiber supporting portion, an optical fiber is clamped between the first optical fiber supporting portion and the second optical fiber supporting portion, and a reflective end face is formed at the end of the optical fiber; The first light receiving component includes: The first converging lens, the second optical fiber supporting portion extends below the reflective end surface, so that the first converging lens is fixed on the second optical fiber supporting portion, and the first converging lens is located between the reflective end surface and the first light receiving chip array.

4. The optical module according to claim 1, wherein: A first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator passes through the air and enters the first optical modulation chip; An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip. The optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

5. The optical module according to claim 1, wherein: The input light waveguide of the first light modulation chip is arranged perpendicular to the end face of the first light modulation chip, and the output light waveguide is arranged non-perpendicular to the end face of the first light modulation chip; The first laser is arranged perpendicularly to the light input and output end face of the first optical modulation chip so as to be consistent with the extension direction of the light input waveguide of the first optical modulation chip; The first optical fiber array is arranged at an angle relative to the light input and output end face of the first optical modulation chip to be consistent with the extension direction of the light output waveguide of the first optical modulation chip.

6. The optical module according to claim 1, wherein: The end face of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength; The light input port faces the first laser to receive a light beam output by the first laser; The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array.

7. The optical module according to claim 3, wherein: The first light-bending member includes an optical fiber fixing portion, the optical fiber fixing portion is connected to the second optical fiber supporting portion, and the optical fiber passes through the interior of the optical fiber fixing portion; A groove is formed on one side of the surface where the second optical fiber supporting portion is located, and the groove can make the surface where the optical fiber fixing portion is located lower than the surface where the second optical fiber supporting portion is located.

8. The optical module according to claim 1, wherein: The first light receiving component includes: The first TIA is located on the surface of the circuit board, and the first light receiving chip array is carried on the surface of the first TIA.

9. An optical module, characterized in that: include: A circuit board having a first notch portion on its surface; A base is embedded in the first notch, and the top surface of the base is provided with: a first laser, located in the first notch, configured to output light that does not carry a signal; a first optical modulation chip, located in the first notch, and configured to modulate the light not carrying a signal to generate an optical signal; a first optical fiber array, located in the first notch and coupled to an end face of the first optical modulation chip to transmit the optical signal; a first modulation driver chip, located in the first notch, electrically connected to the first optical modulation chip, and connected to the surface of the circuit board; a first refracting member disposed on the bottom surface of the base, wherein an end surface of the first refracting member is formed with a first reflective end surface; The first light receiving chip array is located on the bottom surface of the circuit board and on the light reflection path of the first reflection end surface.

10. The optical module according to claim 9, wherein: The surface of the first light emitting component is covered with a protective cover; The base includes a blocking portion; The enclosure portion is placed on the surface of the circuit board, and the surface of the circuit board surrounded by the enclosure portion is exposed, so that the first light receiving chip array and the second light receiving chip array are located on the surface of the circuit board surrounded by the enclosure portion; A cover plate is provided above the first light receiving component and the second light receiving component. One end of the cover plate is provided on the surface of the base body, and the other end is provided on the surface of the enclosure portion.

11. The optical module according to claim 9, wherein: The first light-bending member includes a first optical fiber supporting portion and a second optical fiber supporting portion, an optical fiber is clamped between the first optical fiber supporting portion and the second optical fiber supporting portion, and a reflective end face is formed at the end of the optical fiber; The first light receiving component includes: The first converging lens, the second optical fiber supporting portion extends below the reflective end surface, so that the first converging lens is fixed on the second optical fiber supporting portion, and the first converging lens is located between the reflective end surface and the first light receiving chip array.

12. The optical module according to claim 9, wherein: A first lens and a first isolator are provided between the first laser and the first optical modulation chip; the first isolator is provided on one side of the light entrance of the first optical modulation chip, and the light output by the first isolator passes through the air and enters the first optical modulation chip; An optical refractive index matching glue is provided between the first optical fiber array and the end face of the first optical modulation chip. The optical signal modulated by the first optical modulation chip is coupled into the first optical fiber array through the optical refractive index matching glue.

13. The optical module according to claim 9, wherein: The input light waveguide of the first light modulation chip is arranged perpendicular to the end face of the first light modulation chip, and the output light waveguide is arranged non-perpendicular to the end face of the first light modulation chip; The first laser is arranged perpendicularly to the light input and output end face of the first optical modulation chip so as to be consistent with the extension direction of the light input waveguide of the first optical modulation chip; The first optical fiber array is arranged at an angle relative to the light input and output end face of the first optical modulation chip to be consistent with the extension direction of the light output waveguide of the first optical modulation chip.

14. The optical module according to claim 9, wherein: The end face of the first optical modulation chip is formed with a light input port and a plurality of light output ports, and the plurality of light output ports have the same output wavelength; The light input port faces the first laser to receive a light beam output by the first laser; The light output port faces the first optical fiber array to couple the multiple optical signals modulated by the first optical modulation chip to the first optical fiber array.

15. The optical module according to claim 11, wherein: The first light-bending member includes an optical fiber fixing portion, the optical fiber fixing portion is connected to the second optical fiber supporting portion, and the optical fiber passes through the interior of the optical fiber fixing portion; A groove is formed on one side of the surface where the second optical fiber supporting portion is located, and the groove can make the surface where the optical fiber fixing portion is located lower than the surface where the second optical fiber supporting portion is located.

16. The optical module according to claim 9, wherein: The first light receiving component includes: The first TIA is located on the surface of the circuit board, and the first light receiving chip array is carried on the surface of the first TIA.

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