Earphone

Abstract

The invention mainly relates to an earphone, which comprises a movement module, a hook-shaped structure and an auxiliary structure, the hook-shaped structure and the auxiliary structure are connected with the movement module, the movement module is located at the front side of an ear in a wearing state, at least part of the hook-shaped structure is located at the rear side of the ear in the wearing state, and at least part of the auxiliary structure is located at the front side of the ear in the wearing state; the movement module is pressed and held in a first ear region corresponding to a conchae of an ear, and the auxiliary structure is pressed and held in a second ear region corresponding to an antihelix of the ear, so that the contact area of the earphone and the front side of the ear is increased, and the acting force of the earphone and the front side of the ear is prevented from being concentrated in a relatively small region. The staggered distance between the auxiliary structure and the hook-shaped structure is smaller than the staggered distance between the movement module and the hook-shaped structure when being observed along the thickness direction of the movement module, so that the shear stress generated by the clamping force of the earphone to the ear is weakened and even converted into the pressure stress, and the stability and comfort of the earphone in a wearing state are improved.

Description

A headset Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular to a headset. Background Art

[0002] With the increasing popularity of electronic devices, they have become indispensable social and entertainment tools in people's daily lives, and people's expectations of electronic devices are becoming increasingly higher. Electronic devices such as headphones and smart glasses have also become widely used in people's daily lives. They can be used in conjunction with terminal devices such as mobile phones and computers to provide users with an auditory feast.

[0003] Summary of the Invention

[0004] The present application provides an earphone, which includes a movement module, and a hook-shaped structure and an auxiliary structure connected to the movement module. The movement module is located on the front side of the ear when worn, at least part of the hook-shaped structure is located on the back side of the ear when worn, and at least part of the auxiliary structure is located on the front side of the ear when worn; wherein the movement module is pressed against a first ear area corresponding to the cymba concha of the ear, and the auxiliary structure is pressed against a second ear area corresponding to the antihelix of the ear.

[0005] In some embodiments, when worn and observed along the thickness direction, the extension direction of the auxiliary structure points to the back of the head, and the angle between it and the positive direction of the vertical axis of the human body pointing to the top of the head is an acute angle; wherein the thickness direction is defined as the direction in which the movement module approaches or moves away from the ear when worn.

[0006] In some embodiments, the movement module has a first inner side surface facing the ear and a first outer side surface facing away from the ear along the thickness direction when worn, and a connecting surface connecting the first inner side surface and the first outer side surface, and the auxiliary structure is at least connected to the connecting surface.

[0007] In some embodiments, the movement module has a length direction and a width direction that are perpendicular to the thickness direction and orthogonal to each other. The size of the movement module in the length direction is larger than the size of the movement module in the width direction. The connecting surface includes an upper side surface of the external auditory canal facing away from the ear along the width direction in the wearing state and a lower side surface facing the external auditory canal, as well as a rear side surface facing the back of the head and a front side surface facing away from the back of the head along the length direction in the wearing state. The auxiliary structure is connected to at least the rear side surface.

[0008] In some embodiments, the thickness of the auxiliary structure is smaller than the dimension of the movement module in the thickness direction, and when viewed along the length direction or the width direction, the position where the auxiliary structure is connected to the movement module is located between one-third and two-thirds of the thickness of the movement module in the thickness direction.

[0009] In some embodiments, the hook structures and the auxiliary structures are staggered in the thickness direction.

[0010] In some embodiments, the movement module includes a movement shell connected to the hook-shaped structure and a speaker arranged in the movement shell, the auxiliary structure includes a connecting portion connected to the movement module and an extension portion connected to the connecting portion, the hardness of the extension portion is less than the hardness of the movement shell, and the auxiliary structure contacts the anti-helix through the extension portion.

[0011] In some embodiments, the auxiliary structure includes a flexible insert connected to the extension portion, the flexible insert is disposed inside the extension portion or on a side of the extension portion facing the antihelix, and the hardness of the flexible insert is less than that of the extension portion.

[0012] In some embodiments, the movement module has a first inner side surface facing the ear and a first outer side surface facing away from the ear along the thickness direction when worn, and a connecting surface connecting the first inner side surface and the first outer side surface. The thickness direction is defined as the direction in which the movement module approaches or moves away from the ear when worn, and the connecting portion covers at least a portion of the first outer side surface.

[0013] In some embodiments, the extension portion has a second inner side surface facing the anti-helix and a second outer side surface facing away from the anti-helix in the worn state, and at least one of the second inner side surface and the second outer inner side surface is inclined toward the anti-helix.

[0014] In some embodiments, the movement module has a first inner side surface facing the ear and a first outer side surface away from the ear along the thickness direction when worn, and a connecting surface connecting the first inner side surface and the first outer side surface. The thickness direction is defined as the direction in which the movement module approaches or moves away from the ear when worn. A mounting groove extending along the circumference of the movement module is provided on the connecting surface, and the connecting part is fixed in the mounting groove.

[0015] In some embodiments, the mounting groove is arranged in an annular shape, the connecting portion is arranged in an annular structure, and the connecting portion is nested in the mounting groove.

[0016] In some embodiments, the auxiliary structure is detachably connected to the movement module.

[0017] In some embodiments, the movement module includes a movement shell connected to the hook-shaped structure and a speaker arranged in the movement shell. The movement shell is provided with a sound outlet hole on the inner side facing the ear when worn, and the sound waves generated by the speaker are transmitted out through the sound outlet hole. The movement module covers at least a portion of the concha cavity when worn to cooperate in forming an auxiliary cavity connected to the external auditory canal of the ear, and the sound outlet hole is at least partially located in the auxiliary cavity.

[0018] In some embodiments, the auxiliary cavity is semi-open.

[0019] In some embodiments, the earphones include a main control circuit board disposed in a core housing, and the core housing or an auxiliary structure is provided with electrode terminals on the inner side facing the ear when worn, and the electrode terminals and the speakers are respectively coupled to the main control circuit board.

[0020] The beneficial effects of the present application are as follows: compared to related technologies, when the earphones provided by the present application are worn, the movement module is pressed against the first ear region corresponding to the cylindrica concha, and the auxiliary structure is pressed against the second ear region corresponding to the antihelix. That is, the movement module and the auxiliary structure are located on the same side of the ear when worn, and are respectively pressed against different regions of the ear. This not only increases the contact area between the earphone and the front side of the ear, but also prevents the force acting on the earphone and the front side of the ear from being concentrated in a smaller area, which is beneficial to improving the stability and comfort of the earphones when worn. In addition, when observed along the thickness direction of the movement module, the offset distance between the auxiliary structure and the hook structure is smaller than the offset distance between the movement module and the hook structure, so that the shear stress generated by the clamping force of the earphone on the ear is weakened, or even converted into compressive stress, which is beneficial to further improving the stability and comfort of the earphones when worn. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] FIG1 is a schematic diagram of the front profile of a user's ear as described in the present application;

[0023] FIG2 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0024] FIG3 is a schematic diagram of an embodiment of the earphone in FIG2 in a worn state;

[0025] FIG4 is a schematic structural diagram of the earphone in FIG2 from one perspective;

[0026] FIG5 is a schematic structural diagram of the earphone in FIG2 from another perspective;

[0027] FIG6 is a schematic structural diagram of the earphone in FIG2 from another perspective;

[0028] FIG7 is a schematic structural diagram of an embodiment of an auxiliary structure provided by the present application;

[0029] FIG8 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0030] FIG9 is a schematic structural diagram of the earphone from one perspective in FIG8 ;

[0031] FIG10 is a schematic structural diagram of the earphone in FIG8 from another perspective;

[0032] FIG11 is a schematic structural diagram of an embodiment of a headset provided by the present application;

[0033] FIG12 is a comparison diagram of frequency response curves measured at the same listening position when the movement module is located at different positions on the ear in an embodiment of the earphone provided by the present application;

[0034] FIG13 is a schematic cross-sectional view of the structure of an embodiment of the earphone in FIG10 along the B1-B1 section direction;

[0035] FIG14 is a schematic structural diagram of an embodiment of a movement housing provided by the present application;

[0036] FIG15 is a schematic structural diagram of an embodiment of a movement housing provided by the present application;

[0037] FIG16 is a schematic structural diagram of an embodiment of a bracket provided in the present application;

[0038] FIG17 is an enlarged structural diagram of the earphone embodiment in FIG13 in the C1 area;

[0039] FIG18 is an enlarged structural diagram of the earphone embodiment in FIG13 in the C2 area;

[0040] FIG19 is a schematic diagram of the exploded structure of an embodiment of a speaker provided by the present application;

[0041] FIG20 is a schematic cross-sectional view of the structure of an embodiment of the loudspeaker in FIG19 taken along the B2-B2 section direction;

[0042] FIG21 is a schematic cross-sectional view of the structure of an embodiment of the loudspeaker in FIG19 taken along the B3-B3 section direction;

[0043] FIG22 is an enlarged structural diagram of the loudspeaker embodiment in FIG21 in area C3;

[0044] FIG23 is a schematic diagram of a partial structure of an embodiment of the speaker in FIG19;

[0045] FIG24 is a schematic cross-sectional view of an embodiment of the basin stand in FIG19 taken along the B2-B2 section direction;

[0046] FIG25 is a schematic diagram of the exploded structure of an embodiment of the basin stand in FIG19. DETAILED DESCRIPTION

[0047] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application and do not limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application and not all embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0048] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of this application. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0049] In conjunction with Figure 1 , the user's ear 100 may include physiological parts such as the external auditory canal 101, the cavum concha 102, the cymba concha 103, the triangular fossa 104, the antihelix 105, the scaphoid 106, the helix 107, and the antitragus 108. Although the external auditory canal 101 has a certain depth and extends to the eardrum, for ease of description and in conjunction with Figure 1 , this application, unless otherwise specified, specifically refers to the external auditory canal 101 as its entrance away from the eardrum (i.e., the ear canal). Furthermore, physiological parts such as the cavum concha 102, the cymba concha 103, and the triangular fossa 104 have a certain volume and depth; and the cavum concha 102 is directly connected to the external auditory canal 101, which means that the aforementioned ear canal can be simply regarded as being located at the bottom of the cavum concha 102.

[0050] Furthermore, different users may have individual differences, resulting in different shapes, sizes and other dimensional differences in the ears. In order to facilitate description, and to reduce (or even eliminate) individual differences between different users, a simulator containing a head and its (left and right) ears can be made based on ANSI: S3.36, S3.25 and IEC: 60318-7 standards, such as GRAS 45BC KEMAR. Therefore, in this application, descriptions such as "the user wears headphones", "the headphones are in a wearing state" and "in a wearing state" may refer to the headphones described in this application being worn on the ears of the aforementioned simulator. Of course, precisely because different users have individual differences, there may be certain differences between the headphones worn by different users and the headphones worn on the ears of the aforementioned simulator, but such differences should be tolerated.

[0051] It should be noted that in fields such as medicine and anatomy, the human body can be defined as three basic planes: the sagittal plane, the coronal plane, and the horizontal plane, as well as three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane refers to a plane perpendicular to the ground, along the anterior-posterior direction of the body, dividing the body into left and right halves. The coronal plane refers to a plane perpendicular to the ground, along the lateral direction of the body, dividing the body into anterior-posterior halves. The horizontal plane refers to a plane parallel to the ground, along the lateral direction of the body, dividing the body into upper and lower halves. Accordingly, the sagittal axis refers to the axis along the lateral direction of the body and perpendicular to the coronal plane; the coronal axis refers to the axis along the lateral direction of the body and perpendicular to the sagittal plane; and the vertical axis refers to the axis along the lateral direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" as used herein is a concept relative to the "back side of the ear." The former refers to the side of the ear facing away from the head, while the latter refers to the side of the ear facing toward the head. Both refer to the user's ear. Observing the ear of the simulator along the coronal axis of the human body yields the front outline diagram shown in Figure 1.

[0052] As an example, in conjunction with Figures 2 and 3, the earphone 10 may include a movement module 11 and a hook-shaped structure 12 connected to the movement module 11, the movement module 11 is located on the front side of the ear when worn, and at least part of the hook-shaped structure 12 is located on the back side of the ear when worn, so that the earphone 10 is hung on the ear when worn. Among them, the movement module 11 can be configured not to block the external auditory canal when worn, so that the earphone 10 acts as an "open earphone". It is worth noting that due to individual differences among different users, when the earphone 10 is worn by different users, the movement module 11 may partially block the external auditory canal, but the external auditory canal is still not blocked.

[0053] In order to improve the stability of the earphone 10 when worn, the earphone 10 can adopt any one of the following methods or a combination thereof. First, at least a portion of the hook-like structure 12 is configured as a contoured structure that fits at least one of the back of the ear and the head, so as to increase the contact area between the hook-like structure 12 and the ear and / or the head, thereby increasing the resistance of the earphone 10 to falling off the ear. Second, at least a portion of the hook-like structure 12 is configured as an elastic structure so that it has a certain amount of deformation when worn, so as to increase the positive pressure of the hook-like structure 12 on the ear and / or the head, thereby increasing the resistance of the earphone 10 to falling off the ear. Third, at least a portion of the hook-like structure 12 is configured to rest against the head when worn, so as to form a reaction force that presses the ear, so that the movement module 11 is pressed against the front side of the ear, thereby increasing the resistance of the earphone 10 to falling off the ear. Fourth, the movement module 11 and hook-shaped structure 12 are configured to clamp physiological areas such as the antihelix and cavum concha from both sides of the ear when worn, thereby increasing resistance to the earphone 10 falling off the ear. Fifth, the movement module 11 or the auxiliary structure connected thereto is configured to at least partially extend into physiological areas such as the cavum concha, cymba concha, fossa triangularis, and scaphoid, thereby increasing resistance to the earphone 10 falling off the ear.

[0054] By way of example, in conjunction with Figures 1 to 3 , the earphone 10 may include an auxiliary structure 15 connected to the movement module 11. When worn, at least a portion of the auxiliary structure 15 is located on the front side of the ear. That is, at least a portion of the auxiliary structure 15 and the movement module 11 are located on the same side of the ear when worn, thereby assisting the movement module 11 when worn. In the worn state, the movement module 11 is pressed against a first ear region corresponding to the cymba concha, while the auxiliary structure 15 is pressed against a second ear region corresponding to the antihelix. That is, the movement module 11 and the auxiliary structure 15 are pressed against different areas of the ear. Thus, compared to earphones 10 having only the movement module 11, the earphone 10 further includes the auxiliary structure 15 that cooperates with the movement module 11. This not only increases the contact area between the earphone 10 and the front side of the ear, but also prevents the forces acting on the earphone 10 from being concentrated in a smaller area, thereby improving the stability and comfort of the earphone 10 when worn. Furthermore, when viewed along the thickness direction of the core module 11, the offset distance between the auxiliary structure 15 and the hook structure 12 is smaller than the offset distance between the core module 11 and the hook structure 12. This reduces the shear stress generated by the clamping force of the earphone 10 on the ear, and even converts it into compressive stress, which helps improve the stability and comfort of the earphone 10 when worn. The thickness direction X can be defined as the direction in which the core module 11 moves closer to or further away from the ear when worn.

[0055] Furthermore, the auxiliary structure 15 can be detachably connected to the core module 11 by any one of buckles, double-sided tape, threads, etc. Among them, the earphone 10 can be prepared with multiple auxiliary structures 15 of the same or different specifications to facilitate replacement or use by different users.

[0056] As an example, referring to Figure 3 , when worn and viewed along the thickness direction X, the extension direction of the auxiliary structure 15 (e.g., dashed arrow A1 in Figure 3 ) points toward the back of the head, and forms an acute angle with the positive direction of the human body perpendicular axis pointing toward the top of the head (e.g., dashed arrow A2 in Figure 3 ). This not only facilitates the auxiliary structure 15's application to the ear area corresponding to the antihelix, but also allows the auxiliary structure 15 to be applied to the larger central area of ​​the antihelix, thereby improving the stability and comfort of the earphone 10 when worn.

[0057] As an example, in conjunction with Figures 2 to 6, the movement module 11 may have a first inner side surface IS1 facing the ear and a first outer side surface OS1 facing away from the ear along the thickness direction X in the wearing state, as well as a connecting surface connecting the first inner side surface IS1 and the first outer side surface OS1. Among them, the auxiliary structure 15 may be connected to at least the aforementioned connecting surface, for example, the auxiliary structure 15 is only connected to the aforementioned connecting surface, and for another example, the auxiliary structure 15 is not only connected to the aforementioned connecting surface but also further connected to the first outer side surface OS1. In this way, it is beneficial to control the distance between the auxiliary structure 15 and the hook-shaped structure 12 in the thickness direction X within a reasonable range, avoiding the aforementioned distance being too small, resulting in too much pressure on the auxiliary structure 15, or the aforementioned distance being too large, resulting in too little pressure on the auxiliary structure 15.

[0058] It should be noted that, when viewed along the thickness direction X, the movement module 11 can be configured in a circular, elliptical, rounded square, or rounded rectangular shape, among others. When the movement module 11 is configured in a circular, elliptical, or other shape, the aforementioned connection surface may refer to the curved side surface of the movement module 11; when the movement module 11 is configured in a rounded square, rounded rectangular, or other shape, the aforementioned connection surface may include the lower side surface LS, upper side surface US, front side surface FS, and rear side surface RS, as described below. Furthermore, the movement module 11 may have a length direction Y and a width direction Z that are perpendicular to the thickness direction X and orthogonal to each other. The length direction Y may be defined as the direction in which the movement module 11 moves closer to or further from the back of the user's head when worn, and the width direction Z may be defined as the direction in which the movement module 11 moves closer to or further from the top of the user's head when worn. Therefore, for ease of description, this application uses the example of the movement module 11 configured in a rounded rectangular shape as an example. The length of the movement module 11 in the length direction Y may be greater than the width of the movement module 11 in the width direction Z. Based on this, the aforementioned connection surfaces can include an upper side surface US facing away from the external auditory canal along the width direction Z and a lower side surface LS facing the external auditory canal when worn, as well as a posterior side surface RS facing the back of the head and an anterior side surface FS facing away from the back of the head along the length direction Y when worn. The auxiliary structure 15 can be connected to at least the posterior side surface RS, or, for example, only to the posterior side surface RS. Another example is that the auxiliary structure 15 is connected not only to the posterior side surface RS but also to the upper side surface US. This advantageously allows the auxiliary structure 15 to be primarily pressed against the larger central area of ​​the antihelix.

[0059] Furthermore, the thickness of the auxiliary structure 15 can be smaller than the dimension of the core module 11 in the thickness direction, so as to take into account both the weight and size of the earphone 10. Specifically, when viewed along the length direction Y or the width direction Z, the position where the auxiliary structure 15 is connected to the core module 11 can be located between one-third and two-thirds of the thickness of the core module 11 in the thickness direction X. For example, the position where the auxiliary structure 15 is connected to the core module 11 is located at one-half of the thickness of the core module 11 in the thickness direction X. This helps to control the spacing between the auxiliary structure 15 and the hook-shaped structure 12 in the thickness direction X within a reasonable range, avoiding the aforementioned spacing being too small, resulting in excessive pressure on the auxiliary structure 15, or the aforementioned spacing being too large, resulting in excessive pressure on the auxiliary structure 15.

[0060] For example, as shown in Figures 5 and 6, and in Figures 9 and 10, the hook structure 12 and the auxiliary structure 15 are staggered in the thickness direction X. This allows the earphone 10 to better adapt to the thickness of the ear, preventing the auxiliary structure 15 from exerting excessive pressure on the antihelix, which could cause discomfort, and also preventing the auxiliary structure 15 from lifting the movement module 11, which could cause instability.

[0061] As an example, referring to FIG7 , the auxiliary structure 15 may include a connecting portion 151 connected to the movement module 11 and an extension portion 152 connected to the connecting portion 151. The auxiliary structure 15 may contact the anti-helix via the extension portion 152. The hardness of the extension portion 152 may be less than that of the movement module 11. For example, the extension portion 152 may be made of plastic, rubber, or the like. In this way, the extension portion 152 may undergo different elastic deformations when the earphone 10 is worn by different users, thereby ensuring that the pressure exerted by the auxiliary structure 15 on the anti-helix is ​​appropriate. Of course, the hardness of the connecting portion 151 may also be less than that of the movement module 11 (specifically, the movement housing 111 described below). For example, the connecting portion 151 may be made of the same material as the extension portion 152. Accordingly, the connection between the connecting portion 151 and the movement module 11 may be configured as a detachable or non-detachable connection, as required.

[0062] Furthermore, the auxiliary structure 15 may include a flexible insert 153 connected to the extension 152. The flexible insert 153 may be disposed within the extension 152 or on the side of the extension 152 facing the anti-helix. The hardness of the flexible insert 153 may be less than that of the extension 152, so that the portion of the auxiliary structure 15 that contacts the anti-helix is ​​softer, thereby improving the stability and comfort of the earphone 10 when worn.

[0063] As an example, in conjunction with Figures 5 and 6, the above-mentioned connecting surface may be provided with a mounting groove extending along the circumference of the movement module 11, and the connecting portion 151 is fixed in the aforementioned mounting groove. Among them, the aforementioned mounting groove may be arranged in an annular shape, and the connecting portion 151 may also be arranged in an annular structure that matches it (for example, as shown in Figure 7), and the connecting portion 151 is nested in the aforementioned mounting groove. Of course, the aforementioned mounting groove may also be arranged in a C-shape or a U-shape, for example, the aforementioned mounting groove is arranged on the rear side surface RS and further extends to the lower side surface LS and the upper side surface US, and the connecting portion 151 may also be arranged in a C-shape or a U-shape structure that matches it, and the connecting portion 151 is embedded in the aforementioned mounting groove.

[0064] As an example, referring to Figures 8 to 10 , the connecting portion 151 may cover at least a portion of the first lateral side surface OS1. For example, the entire first lateral side surface OS1 may be covered by the connecting portion 151, meaning that the first lateral side surface OS1 shown in Figures 2 to 6 is not visible in Figures 8 to 10 . This helps increase the connection area between the connecting portion 151 and the movement module 11. The two may also be connected via gluing, injection molding, or other methods. The extension portion 152 may have a second inner side surface IS2 that faces the antihelix when worn, and a second outer side surface OS2 that faces away from the antihelix. At least one of the second inner side surface IS2 and the second outer inner side surface OS2 is inclined toward the antihelix in the direction of extension of the auxiliary structure 15. For example, both the second inner side surface IS2 and the second outer inner side surface OS2 are inclined toward the antihelix in the direction of extension of the auxiliary structure 15. In other words, the extension portion 152 is bent relative to the connecting portion 151 toward the first inner side surface IS1. This facilitates better contact between the extension portion 152 and the antihelix while also ensuring a stable thickness. Furthermore, referring to Figures 14 and 15 , the connecting portion 151 may cover at least a portion of the connecting surface (e.g., rear side RS) in addition to covering at least a portion of the first outer side surface OS1. This not only helps increase the connection area between the connecting portion 151 and the core module 11, but also helps improve the comfort of the core module 11 in contact with the ear at the rear side RS.

[0065] As an example, in combination with Figures 4 and 13, the movement module 11 may include a movement shell 111 connected to the hook structure 12 and a speaker 112 arranged in the movement shell 111. Among them, the movement shell 111 is provided with a sound outlet 111a on the inner side surface facing the ear (such as the first inner side surface IS1 mentioned above) in the wearing state, and the sound waves generated by the speaker 112 are transmitted through the sound outlet 111a to be transmitted into the external auditory canal. It is worth noting that the sound outlet 111a can also be provided on the side of the movement shell 111 corresponding to the lower side surface LS, and can also be provided at the corner between the aforementioned inner side surface and the lower side surface LS.

[0066] Furthermore, in conjunction with FIG13 and FIG2 to FIG11 , the earphone 10 may include a main control circuit board 13 disposed within the movement housing 111 and a battery 14 disposed at an end of the hook-shaped structure 12 away from the movement module 11. The battery 14 and the speaker 112 are respectively coupled to the main control circuit board 13 to allow the battery 14 to power the speaker 112 under the control of the main control circuit board 13. Of course, the battery 14 and the speaker 112 may also be disposed within the movement housing 111.

[0067] As an example, in conjunction with Figure 4 or Figure 11, the movement housing 111 or the auxiliary structure 15 (specifically, the extension portion 152) can be provided with an electrode terminal 16 on the inner side facing the ear in the worn state, and the electrode terminal 16 can be coupled to the main control circuit board 13. The number of electrode terminals 16 can be two, which are respectively used as the positive charging terminal and the negative charging terminal of the earphone 10 to facilitate the charging function of the earphone 10; the number of electrode terminals 16 can also be three, two of which are respectively used as the positive charging terminal and the negative charging terminal of the earphone 10, and the remaining one is used as a detection terminal of the earphone 10 to facilitate the earphone 10 to realize charging detection, detection of the earphone 10 being placed in or taken out of the charging box, and other detection functions.

[0068] As an example, in conjunction with Figures 3 and 1 , because the cylindrica and the cavum concha connected thereto both have a certain volume and depth, after the movement module 11 is pressed against the ear region corresponding to the antihelix, a certain distance can be provided between the inner side surface of the movement housing 111 (e.g., the first inner side surface IS1 mentioned above) and the cylindrica and cavum concha. In other words, when the movement module 11 is worn, it can cooperate with the cylindrica and cavum concha to form an auxiliary cavity connected to the external auditory canal, and the sound outlet 111a is at least partially located within the auxiliary cavity. In this way, when the earphones are worn, the sound waves generated by the speaker 112 and transmitted through the sound outlet 111a are restricted by the auxiliary cavity. That is, the auxiliary cavity can gather the sound waves, allowing more of the sound waves to propagate into the external auditory canal, thereby increasing the volume and sound quality of the sound heard by the user in the near field, which is conducive to improving the acoustic effect of the earphones 10. Furthermore, since the movement module 11 can be configured to not block the external auditory canal when worn, the auxiliary cavity can be configured to be semi-open. In this way, the sound waves generated by the speaker 112 and propagated through the sound outlet 111a, in addition to most of them being propagated to the external auditory canal, a small part is propagated to the outside of the earphone 10 and the ear through the gap between the movement module 11 and the ear (for example, a part of the concha cavity not covered by the movement module 11), thereby forming a first sound leakage in the far field; at the same time, the movement module 11 generally has an acoustic hole (for example, the pressure relief hole 111c mentioned later), and the sound waves propagated through the acoustic hole generally form a second sound leakage in the far field, and the phase of the first sound leakage and the phase of the second sound leakage are (close to) opposite to each other, so that the two can cancel each other out of phase in the far field, which is conducive to reducing the sound leakage of the earphone 10 in the far field.

[0069] Furthermore, the earphone 10 may include an adjustment mechanism connecting the movement module 11 and the hook structure 12. Different users can use the adjustment mechanism to adjust the relative position of the movement module 11 on the ear to ensure that the movement module 11 is located in a suitable position, thereby forming the auxiliary cavity described above with the movement module 11, the bacula concha, and the cavum concha. Furthermore, the presence of the adjustment mechanism allows users to adjust the earphone 10 to a more stable and comfortable wearing position.

[0070] As an example, in conjunction with Figure 12, the earphone 10 is first worn on the above-mentioned simulator, and then the position of the movement module 11 on the ear of the above-mentioned simulator is adjusted. Then, the frequency response curve of the earphone 10 is measured by a detector (such as a microphone) arranged in the external auditory canal of the above-mentioned simulator (for example, the position where the eardrum is located, that is, the listening position), thereby simulating the listening effect after the user wears the earphone 10. Among them, the above-mentioned frequency response curve can be used to characterize the changing relationship between the vibration magnitude and the frequency; the horizontal axis of the above-mentioned frequency response curve can represent the frequency, in Hz; the vertical axis of the above-mentioned frequency response curve can represent the vibration magnitude, in dB. In Figure 12, curve 12_1 can represent the frequency response curve when the movement module 11 does not form the above-mentioned auxiliary cavity with the cavum concha in the wearing state, and curve 12_2 can represent the frequency response curve when the movement module 11 cooperates with the cavum concha to form the above-mentioned auxiliary cavity in the wearing state. Based on this, it can be directly and unambiguously concluded from the comparison diagram of the frequency response curves shown in Figure 12 that curve 12_2 is generally located above curve 12_1, that is, compared with the case where the movement module 11 does not form the above-mentioned auxiliary cavity with the cavum concha when worn, the case where the movement module 11 forms the above-mentioned auxiliary cavity with the cavum concha when worn is more conducive to improving the acoustic effect of the earphone 10.

[0071] As an example, in conjunction with Figures 14 and 15, the movement housing 111 may include a movement inner shell 1111 and a movement outer shell 1112 that are fastened to each other along the thickness direction X, and the movement inner shell 1111 is closer to the ear than the movement outer shell 1112 when worn. Among them, the parting surface 111b between the movement outer shell 1112 and the movement inner shell 1111 is inclined toward the side where the movement inner shell 1111 is located in the direction away from the end (hereinafter referred to as the "connecting end") where the movement module 11 is connected to the hook-shaped structure 12 (for example, the direction indicated by the arrow Y in Figure 14). In this way, the connecting portion 151 can be mainly connected to the movement outer shell 1112, which is not only conducive to increasing the connection area between the auxiliary structure 15 and the movement module 11 without increasing the size of the movement module 11 in the length direction Y, but also conducive to simplifying the connection structure between the auxiliary structure 15 and the movement module 11.

[0072] As an example, in conjunction with Figures 14 and 15, the movement inner shell 1111 may include a bottom wall 1113 and a first side wall 1114 connected to the bottom wall 1113, and the movement outer shell 1112 may include a top wall 1115 and a second side wall 1116 connected to the top wall 1115. The second side wall 1116 and the first side wall 1114 are interlocked with each other along the parting surface 111b, and the two can support each other. When viewed along the width direction Z and in the length direction Y (specifically, the positive direction indicated by the arrow Y in Figures 14 and 15), the portion of the first side wall 1114 away from the above-mentioned connection end gradually approaches the bottom wall 1113 in the thickness direction X, and the portion of the second side wall 1116 away from the above-mentioned connection end gradually moves away from the top wall 1115 in the thickness direction X, so that the parting surface 111b is inclined toward the side of the movement inner shell 1111 in the direction away from the above-mentioned connection end. Accordingly, the sound outlet 111a can be provided on the bottom wall 1113. Of course, the sound outlet 111 a may also be provided on a side of the first side wall 1114 corresponding to the lower side surface LS, or may be provided at a corner between the first side wall 1114 and the bottom wall 1113 .

[0073] Furthermore, the movement outer shell 1112 can be provided with an embedding groove 1117 that is at least partially located on the second side wall 1116, and the auxiliary structure 15 is partially embedded in the groove 1117, so that the outer surface of the area of ​​the movement inner shell 1111 not covered by the auxiliary structure 15 is continuously transitioned to the outer surface of the auxiliary structure 15, which is conducive to improving the appearance continuity of the earphone 10.

[0074] As an example, in conjunction with Figure 14, the movement housing 111 can be provided with a pressure relief hole 111c, which allows the space on the side of the speaker 112 facing the main control circuit board 13 to be connected to the external environment, that is, the air can freely enter and exit the aforementioned space. In this way, it is helpful to reduce the resistance of the diaphragm of the speaker 112 during the vibration process. Among them, the pressure relief hole 111c can be facing the top of the head when worn, which is helpful to avoid the sound waves propagating through the pressure relief hole 111c from leaking sound (that is, the above-mentioned second leakage sound) and being heard. Based on the Helmholtz resonance cavity, the aperture of the pressure relief hole 111c can be as large as possible, so that the resonant frequency of the second leakage sound is shifted to a higher frequency band (for example, a frequency range greater than 4kHz) as much as possible, which is helpful to further avoid the second leakage sound from being heard.

[0075] Furthermore, the movement housing 111 may be provided with a sound-tuning hole 111d, which shifts the resonant frequency of the second sound leakage as much as possible to a higher frequency band (e.g., a frequency range greater than 4kHz), which helps to further prevent the second sound leakage from being heard. The area of ​​the sound-tuning hole 111d may be smaller than the area of ​​the pressure relief hole 111c, so that the space on the side of the speaker 112 facing the main control circuit board 13 is more connected to the external environment through the pressure relief hole 111c. Furthermore, the spacing between the sound outlet hole 111a and the pressure relief hole 111c in the width direction Z is greater than the spacing between the sound outlet hole 111a and the sound-tuning hole 111d in the width direction Z, so as to avoid the sound waves propagating through the sound outlet hole 111a and the pressure relief hole 111c respectively from canceling each other out in the near field, which helps to increase the volume of the sound propagated through the sound outlet hole 111a heard by the user. Accordingly, the spacing between the sound-tuning hole 111d and the sound outlet hole 111a in the length direction Y can be reasonably designed according to actual needs.

[0076] As an example, with reference to FIG14 , the sound outlet 111a, pressure relief hole 111c, and sound adjustment hole 111d can be provided on the movement inner shell 1111. For example, the sound outlet 111a is provided on the bottom wall 1113, while the pressure relief hole 111c and the sound adjustment hole 111d are respectively provided on the first side wall 1114. The pressure relief hole 111c and the sound adjustment hole 111d can be respectively provided on opposite sides of the first side wall 1114 along the width direction Z. Thus, since the sound outlet 111a, pressure relief hole 111c, and sound adjustment hole 111d are all provided on the movement inner shell 1111, the structure of the movement outer shell 1112 is simplified, which helps reduce processing costs. In addition, since the pressure relief hole 111c and the sound adjustment hole 111d are respectively arranged on opposite sides of the first side wall 1114 along the width direction Z, the above-mentioned parting surface 111b can be symmetrically arranged about a reference plane perpendicular to the width direction Z, which is beneficial to improving the appearance quality of the movement module 11.

[0077] As an example, in conjunction with Figure 15, the movement module 11 may include metal functional patterns such as an antenna pattern 1141 and / or a touch pattern 1142 arranged between the movement housing 1112 and the auxiliary structure 15 (such as the connecting portion 151). Among them, the antenna pattern 1141 can be formed on the outside of the movement housing 1112 by means of laser direct structuring (LDS); the touch pattern 1142 can be formed on the outside of the movement housing 1112 by means of laser direct structuring technology, or it can be a flexible touch circuit board attached to the outside of the movement housing 1112. Furthermore, the movement housing 1112 is provided with metallized holes connected to the antenna pattern 1141 and the touch pattern 1142 respectively. At this time, since the main control circuit board 13 is disposed within the movement housing 111, for example, the main control circuit board 13 is connected to the movement housing 1112, the main circuit board 13 can contact the inner wall of the corresponding metallized hole through elastic metal parts such as pogo pins, metal springs, etc. For example, the antenna pattern 1141 and the touch pattern 1142 are respectively connected to the pogo pin 131 and pogo pin 132 soldered to the main circuit board 13. Accordingly, the speaker 112 is located on the side of the main circuit board 13 facing away from the movement housing 1112. In this way, compared with the antenna pattern 1141 and the touch pattern 1142 being respectively arranged on the inner side of the movement housing 1112 facing the speaker 112, the antenna pattern 1141 being arranged on the outer side of the movement housing 1112 can increase the distance between it and the main control circuit board 13, that is, increase the antenna clearance area, thereby increasing the anti-interference ability of the antenna pattern 1141; the touch pattern 1142 being arranged on the outer side of the movement housing 1112 can shorten the distance between it and the external signal trigger source (such as the user's finger), that is, reduce the touch distance, thereby increasing the sensitivity of the touch pattern 1142 being triggered by the user.

[0078] Furthermore, the antenna pattern 1141 can surround the touch pattern 1142 to fully utilize the space outside the core housing 1112. The antenna pattern 1141 can be U-shaped, and the touch pattern 1142 can be square. Accordingly, the antenna pattern 1141 and the touch pattern 1142, along with their respective metallized holes, can be disposed on the top wall 1115.

[0079] As an example, in conjunction with Figure 13, the movement module 11 may include a bracket 115 arranged in the movement shell 111, and the bracket 115 and the speaker 112 can be arranged to form an acoustic cavity 116, so that the acoustic cavity 116 is separated from other structures in the movement shell 111 (such as the main control circuit board 13, etc.), which is conducive to improving the acoustic performance of the movement module 11. Among them, the movement shell 111 is provided with an acoustic hole, for example, the acoustic hole is at least one of the pressure relief hole 111c and the sound adjustment hole 111d, and the bracket 115 is provided with an acoustic channel 1151 connecting the acoustic hole and the acoustic cavity 116, so that the acoustic cavity 116 is connected to the external environment, that is, air can freely enter and exit the acoustic cavity 116, which is conducive to reducing the resistance of the diaphragm of the speaker 112 during the vibration process.

[0080] Furthermore, the bracket 115 cooperates with the movement housing 111 to form a first glue-containing groove 1171 surrounding at least a portion of the acoustic hole. The first glue-containing groove 1171 contains a first glue for sealing the assembly gap between the bracket 115 and the movement housing 111. In other words, the first glue is used to provide a waterproof seal, which helps prevent external droplets such as sweat and rain from invading the space within the movement housing 111 where the main control circuit board 13 is located. Thus, based on the Helmholtz resonant cavity, compared to the related art method of pressing a silicone sleeve against the movement housing 111 through the bracket 115 for waterproof sealing, the present technical solution uses the first glue to provide a waterproof seal, which can eliminate the aforementioned silicone sleeve in the related art. This helps shorten the length of the portion of the acoustic cavity 116 that communicates with the external environment (including the acoustic channel 1151 and the acoustic hole), so that the resonant frequency of the leaked sound (i.e., the second leaked sound) generated by propagating through the pressure relief hole 111c is shifted as much as possible to a higher frequency band (e.g., a frequency range greater than 4 kHz), thereby further preventing the second leaked sound from being heard.

[0081] It should be noted that: when the above-mentioned acoustic hole is a pressure relief hole 111c, the first adhesive groove 1171 surrounds at least a portion of the pressure relief hole 111c; when the above-mentioned acoustic hole is a sound tuning hole 111d, the first adhesive groove 1171 surrounds at least a portion of the sound tuning hole 111d; when the above-mentioned acoustic holes are the pressure relief hole 111c and the sound tuning hole 111d, the first adhesive groove 1171 surrounds at least a portion of the pressure relief hole 111c and the sound tuning hole 111d respectively. For the sake of convenience of description, and in conjunction with Figure 14, this application takes the above-mentioned acoustic holes as the pressure relief hole 111c and the sound tuning hole 111d, and the first adhesive groove 1171 surrounds at least a portion of the pressure relief hole 111c and the sound tuning hole 111d as an example for exemplary description. Furthermore, if the gap between the bracket 115 and the movement shell 111 (for example, its bottom wall 1113) is large enough, or the bottom wall 1113 and the first side wall 1114 in the movement shell 111 are not one-piece molded structural parts (that is, two separate structural parts), then the first glue groove 1171 can surround the entire above-mentioned acoustic hole, that is, the first glue groove 1171 is a complete annular structure.

[0082] As an example, in conjunction with Figures 16 and 13 , the bracket 115 may include an annular main portion 1152 and a docking portion 1153 connected to the annular main portion 1152. The annular main portion 1152 is sleeved around the periphery of the speaker 112 to form the acoustic cavity 116, and the acoustic channel 1151 extends through the docking portion 1153 and the annular main portion 1152. Furthermore, the docking portion 1153 is located between the annular main portion 1152 and the core housing 111 and surrounds at least a portion of the acoustic hole. The docking portion 1153 cooperates with the core housing 111 to form a first adhesive groove 1171. Since the acoustic hole can be a pressure relief hole 111c and a sound adjustment hole 111d, two docking portions 1153 are provided, and two first adhesive grooves 1171 are also provided. Accordingly, the docking portion 1153 cooperates with the first sidewall 1114 to form the first adhesive groove 1171. In this way, since the bracket 115 is arranged in a ring shape, the speaker 112 is exposed toward the side of the main control circuit board 13, which is conducive to reducing the thickness of the movement module 11 in the thickness direction X.

[0083] As an example, in conjunction with Figures 17 and 14, a recessed area 1119 may be provided on the inner side of the movement housing 111, the acoustic hole may be provided at the bottom of the recessed area 1119, and the movement module 11 may include an acoustic resistance mesh 118 provided in the recessed area 1119, with the docking portion 1153 pressing the acoustic resistance mesh 118 against the bottom of the recessed area 1119. This not only helps prevent the bracket 115 from scraping the acoustic resistance mesh 118 during assembly, but also helps reduce the assembly gap between the bracket 115, the acoustic resistance mesh 118, and the movement inner housing 1111, and prevents the acoustic resistance mesh 118 from shaking. The acoustic resistance mesh 118 may be pre-fixed to the bottom of the recessed area 1119 using double-sided tape or glue; the acoustic resistance mesh 118 may also be pre-fixed to the protective steel mesh 119, which is then pre-fixed to the bottom of the recessed area 1119 using double-sided tape or glue. Correspondingly, since the above-mentioned acoustic holes can be the pressure relief hole 111c and the sound adjustment hole 111d, two recessed areas 1119 are correspondingly provided, and two acoustic resistance nets 118 are also correspondingly provided.

[0084] Furthermore, the above-mentioned first glue can be further used to seal the assembly gap between the bracket 115 and the acoustic resistance net 118 and / or the assembly gap between the acoustic resistance net 118 and the movement shell 111 (such as the side wall of the recessed area 1119), which is conducive to further waterproof sealing.

[0085] As an example, in conjunction with Figures 13, 14 and 16, the docking portion 1153 can be used to form the bottom wall and one side wall of the first glue containing groove 1171, and the movement housing 111 can be used to form the other side wall of the first glue containing groove 1171. The groove wall on the movement housing 111 and the groove wall on the docking portion 1153 are arranged opposite to each other, so that the first glue containing groove 1171 has a certain width and depth. Of course, the docking portion 1153 can be used to form one side wall of the first glue containing groove 1171, and the movement housing 111 can be used to form the bottom wall and the other side wall of the first glue containing groove 1171; or, the docking portion 1153 can be used to form one side wall and a portion of the bottom wall of the first glue containing groove 1171, and the movement housing 111 can be used to form the other side wall and another portion of the bottom wall of the first glue containing groove 1171.

[0086] By way of example, with reference to Figures 17 to 25, the speaker 112 may include a frame 1121 and a magnetic cover 1122 connected to the frame 1121. The lower end of the bracket 115 may be supported on the frame 1121. The acoustic channel 1151 may be open on the side facing the frame 1121, and the frame 1121 further blocks the open portion of the acoustic channel 1151. In this case, the first glue groove 1171 may be simply considered to surround a portion of the acoustic hole, facilitating subsequent filling of the first glue groove 1171 with glue using methods such as a dispensing process.

[0087] Furthermore, the speaker 112 may include a diaphragm 1123 and a folding ring 1124, wherein the folding ring 1124 connects the diaphragm 1123 and the frame 1121. After the speaker 112 is assembled in the movement housing 111, the diaphragm 1123 and the folding ring 1124, as well as the surrounding frame 1121 and the movement housing 111, can prevent droplets of sweat, rainwater, and the like that have intruded through the sound outlet 111a from further invading the space within the movement housing 111 where the main control circuit board 13 is located. Based on this, the speaker 112 may include a magnet 1125 disposed within a magnetically conductive cover 1122 and a coil 1126 connected to the diaphragm 1123. The magnet 1125 and the magnetically conductive cover 1122 form a magnetic gap, and the coil 1126 extends into the aforementioned magnetic gap. Among them, the speaker 112 may include a magnetic plate 1127 arranged on the side of the magnet 1125 facing the diaphragm 1123, and the magnetic plate 1127, the magnetic cover 1122 and the coil 1126 overlap in the vibration direction of the speaker 112 (for example, the thickness direction X, which will not be repeated below) so that the magnetic lines of force of the magnetic field generated by the magnet 1125 pass through the coil 1126 more.

[0088] In some embodiments, the basin frame 1121 may include a first annular table 11211 and a second annular table 11212 arranged in a stepped manner, and the second annular table 11212 is arranged around the periphery of the first annular table 11211; a portion of the lower end of the bracket 115 can be supported on the first annular table 11211, and another portion of the lower end of the bracket 115 can form a spacing area between the second annular table 11212, so that the bracket 115, the basin frame 1121 and the movement shell 111 cooperate to form a second glue groove 1172, and the second glue groove 1172 contains a second glue for sealing the assembly gap between any two of the bracket 115, the basin frame 1121 and the movement shell 111 to perform corresponding waterproof sealing.

[0089] In some embodiments, the upper end of the bracket 115 can be placed on the basin frame 1121, and cooperate with the basin frame 1121 and the magnetic cover 1122 to form a third glue groove 1173. The third glue groove 1173 contains a third glue for sealing the assembly gap between the bracket 115 and the basin frame 1121 and the magnetic cover 1122 to perform corresponding waterproof sealing.

[0090] It should be noted that: in the specific assembly process of the movement module 11, the following process steps can be included, and the order of all process steps can be adjusted as needed: 1) pre-fix the sound resistance mesh 118 and the protective steel mesh 119 at the bottom of the recessed area 1119 by double-sided tape; 2) fix the speaker 112 on the bottom wall 1113, and dispense glue to the assembly gap between the two, and the corresponding glue portion is accumulated on the second annular table 11212 of the speaker 112; 3) before the glue in step 2) is cured, fix the bracket 115 on the speaker 112, wherein the lower end of the bracket 115 supports On the first annular table 11211 of the speaker 112, the space between the lower end of the bracket 115 and the second annular table 11212 is also filled with glue, and the docking portion 1153 of the bracket 115 presses the acoustic resistance net 118 and cooperates with the first side wall 1114 to form a first glue groove 1171. The upper end of the bracket 115 is placed on the basin 1121 and cooperates with the basin 1121 and the magnetic cover 1122 to form a third glue groove 1173; 4) Glue is dispensed on the first glue groove 1171, the third glue groove 1173 and the assembly gap between the lower end of the bracket 115 and the speaker 112 and the inner shell 1111 of the movement. Among them, since the assembly gap between the lower end of the bracket 115 and the speaker 112 and the inner shell 1111 of the movement is very close to the first glue groove 1171, the assembly gap between the lower end of the bracket 115 and the speaker 112 and the inner shell 1111 of the movement can be simply regarded as a continuation of the first glue groove 1171, that is, the first glue groove 1171 and the second glue groove 1172 can be connected.

[0091] Based on the detailed description above, whether through the first glue (and the second glue) or the silicone sleeve, the waterproof performance of the earphone 10 at the assembly point of the bracket 115 and the movement shell 111 can be improved, so that the space where the main control circuit board 13 is located in the movement shell 111 has a higher waterproof level. Based on this, the interior of the speaker 112 can be provided with a first accommodation space connected to the acoustic cavity 116, and the speaker 112, the bracket 115 and the movement shell 111 can further cooperate on the outside of the speaker 112 to form a second accommodation space that is not connected to the acoustic cavity 116. Among them, the aforementioned first accommodation space can be formed by the basin frame 1121, the magnetic cover 1122, the diaphragm 1123 and the folding ring 1124, so that structures such as the magnet 1125, the coil 1126 and the magnetic plate 1127 can be arranged in the aforementioned first accommodation space; structures such as the main control circuit board 13 can be arranged in the aforementioned second accommodation space. In other words, for the speaker 112, the aforementioned first accommodating space and the aforementioned second accommodating space can be two spaces with a certain volume inside and outside the speaker 112, respectively. It is worth noting that the aforementioned first accommodating space can be connected to the acoustic cavity 116 through the through hole 11213 on the basin frame 1121. In the embodiment where the above-mentioned acoustic hole is the pressure relief hole 111c (or the sound tuning hole 111d), the through hole 11213 can be set on the side of the basin frame 1121 close to the pressure relief hole 111c (sound tuning hole 111d) or; and in the embodiment where the above-mentioned acoustic hole is the pressure relief hole 111c and the sound tuning hole 111d, the through holes 11213 can be set in two groups, wherein one group of through holes 11213 can be set on one side of the basin frame 1121 close to the pressure relief hole 111c, and the other group of through holes 11213 can be set on the other side of the basin frame 1121 close to the sound tuning hole 111d.

[0092] As an example, in conjunction with Figures 23 and 25, the speaker 112 may include a metal piece 1128 disposed on the frame 1121. There may be two metal pieces 1128, one of which serves as the positive terminal of the speaker 112, and the other of which serves as the negative terminal of the speaker 112. Each metal piece 1128 may include a first soldering pad 11281 and a second soldering pad 11282, and a transition portion 11283 connecting the first soldering pad 11281 and the second soldering pad 11282. The first soldering pad 11281 and the second soldering pad 11282 may be exposed from the frame 1121. In this case, the first soldering pad 11281 may be located in the first accommodating space and connected to the coil 1126, and the second soldering pad 11282 may be located in the second accommodating space, so that the coil 1126 can be connected to the main control circuit board 13 via the metal piece 1128. The spacing between the first soldering pads 11281 of the two metal parts 1128 can be greater than the spacing between the second soldering pads 11282 of the two metal parts 1128. Thus, on the one hand, although the first soldering pads 11281 are disposed in the first accommodating space having a lower waterproof rating, the spacing between the first soldering pads 11281 of the two metal parts 1128 is larger, so that droplets of sweat, rainwater, or the like that intrude into the first accommodating space through the acoustic holes (e.g., the pressure relief holes 111c or the sound adjustment holes 111d) and the acoustic channel 1151 are less likely to cause a short circuit between the first soldering pads 11281 of the two metal parts 1128, thereby preventing the earphone 10 from being damaged. On the other hand, because the second soldering pads 11282 are disposed in the second accommodating space having a higher waterproof rating, even a smaller spacing between the second soldering pads 11282 of the two metal parts 1128 prevents the short circuit from occurring, thereby preventing the earphone 10 from being damaged. In addition, since the distance between the second solder pads 11282 of the two metal parts 1128 is small, the wires or flexible circuit boards connecting the two metal parts 1128 and the main control circuit board 13 can be shortened, thereby simplifying the wiring structure of the speaker 112 and reducing costs.

[0093] As an example, in conjunction with Figure 23, the basin frame 1121 can have a long axis direction (for example, a length direction Y) and a short axis direction (for example, a width direction Z) that are perpendicular to the vibration direction of the speaker 112 and orthogonal to each other. Among them, the size of the basin frame 1121 in the long axis direction can be larger than the size of the basin frame 1121 in the short axis direction, for example, the length-width relationship of the basin frame 1121 matches the length-width relationship of the movement module 11. At this time, the two metal parts 1128 can be located at the same end in the long axis direction to simplify the routing of the earphone 10. Accordingly, the two metal parts 1128 can be located between the two groups of through holes 11213 in the width direction.

[0094] In some embodiments, the transition portion 11283 can be embedded within the frame 1121, for example, by injection molding the metal member 1128 and the frame 1121 using a metal insert process. In this manner, since the transition portion 11283 is not exposed from the frame 1121, even a small distance between the transition portions 11283 of the two metal members 1128 will not cause a short circuit, thereby preventing damage to the earphone 10.

[0095] In some embodiments, the transition portion 11283 can be waterproofly sealed to the frame 1121. For example, the metal member 1128 is first fixed to the frame 1121 and then the transition portion 11283 is covered with glue. In this way, even if the distance between the transition portions 11283 of the two metal members 1128 is small, the transition portion 11283 is waterproofly sealed to the frame 1121, preventing the transition portions 11283 of the two metal members 1128 from short-circuiting, thereby preventing the earphone 10 from being burned.

[0096] By way of example, with reference to FIG25 , the second pads 11282 of the two metal parts 1128 can be arranged side by side and spaced apart, one end of each transition portion 11283 can be connected to the corresponding second pad 11282, the two transition portions 11283 extend in directions away from each other, and each first pad 11281 can be connected to the other end of the corresponding transition portion 11283, so that the spacing between the first pads 11281 of the two metal parts 1128 is greater than the spacing between the second pads 11282 of the two metal parts 1128. The curvature of the transition portion 11283 can be consistent with the changing trend of the area on the basin frame 1121 where the metal parts 1128 are arranged.

[0097] As an example, in conjunction with FIG25 , the frame 1121 may include an annular circumferential wall 11214, an annular flange 11215 connected to the inner wall surface of the annular circumferential wall 11214, and a boss 11216 provided at the connection between the annular flange 11215 and the annular circumferential wall 11214. The magnetic cover 1122 may be fixed to the annular flange 11215 to facilitate connection between the magnetic cover 1122 and the frame 1121; the boss 11216 is used to support the metal member 1128, so that the transition portion 11283 can be hidden within the boss 11216 while the second soldering pad 11282 can be exposed from the boss 11216, thereby facilitating connection between the coil 1126 and the metal member 1128 and preventing short circuit between the transition portions 11283 of the two metal members 1128.

[0098] As an example, in conjunction with Figures 23 and 25 , two bosses 11216 can be spaced apart along the circumference of the annular circumferential wall 11214. For example, a single boss 11216 can be split into two at its center. In this case, each boss 11216 can support a metal member 1128, meaning that the transition portions 11283 of the two metal members 1128 can be hidden within the bosses 11216. In this manner, even if droplets of sweat, rain, or the like accumulate on one of the bosses 11216 and its exposed second soldering pad 11282, the droplets are unlikely to flow to the other boss 11216 and its exposed second soldering pad 11282, thereby preventing the second soldering pads 11282 of the two metal members 1128 from short-circuiting.

[0099] As an example, in conjunction with Figures 19 and 23, the coil 1126 may include an annular body 11261 and a lead 11262 connected to the annular body 11261. The annular body 11261 and the lead 11262 may be the same wire. Based on this, the annular body 11261 can be obtained by winding the aforementioned wire a certain number of turns according to actual needs, and the annular body 11261 can be connected to the diaphragm 1123; the lead 11262 can be the two ends of the aforementioned wire, that is, the number of the lead 11262 can be two, and the two lead 11262 can be connected one by one to the second pads 11282 of the two metal parts 1128. Furthermore, the annular body 11261 can be located on the inner side of the basin frame 1121, for example, extending into the magnetic gap formed by the magnet 1125 and the magnetic cover 1122. After the speaker 112 receives an excitation signal, the lead wire 11262 moves with the annular body 11261 relative to the frame 1121 , and the annular body 11261 pushes the diaphragm 1123 to generate sound waves.

[0100] As an example, in conjunction with FIG23 , a relief groove 11217 can be provided on the frame 1121, and the orthographic projection of the lead wire 11262 along the vibration direction of the speaker 112 can at least partially fall within the relief groove 11217. The depth of the relief groove 11217 can be greater than 0 and less than or equal to 0.2 mm. In this way, the relief groove 11217 can increase the distance between the lead wire 11262 and the frame 1121 to a certain extent. This reduces the risk of the lead wire 11262 colliding with the frame 1121 as the lead wire 11262 follows the annular body 11261 relative to the frame 1121, especially when the speaker 112 operates at a small amplitude. It also reduces the travel of the lead wire 11262 after the collision with the frame 1121, especially when the speaker 112 operates at a large amplitude. This helps improve the reliability of the speaker 112.

[0101] In some embodiments, in the vibration direction of the speaker 112, when no excitation signal is input to the speaker 112, the distance between the lead 11262 and the bottom of the avoidance groove 11217 can be greater than the maximum amplitude of the movement of the lead 11262 relative to the basin 1121, so as to further reduce the risk of collision between the lead 11262 and the basin 1121 and reduce the travel of the lead 11262 after the collision with the basin 1121.

[0102] In some embodiments, the avoidance groove 11217 can be close to the end where the lead 11262 is connected to the annular body 11261, that is, the avoidance groove 11217 can be set corresponding to a position where the lead 11262 has a relatively large amount of movement following the movement of the annular body 11261. The aforementioned position is also a position where the risk of the lead 11262 colliding with the basin frame 1121 is relatively high, so as to further reduce the risk of the lead 11262 colliding with the basin frame 1121 and reduce the travel of the lead 11262 after the collision with the basin frame 1121.

[0103] By way of example, with reference to FIG23 , lead wire 11262 may include a first extension portion 11263 connected to annular body 11261 and a second extension portion 11264 bent relative to first extension portion 11263. The orthographic projection of first extension portion 11263 along the vibration direction of speaker 112 may at least partially fall within avoidance groove 11217, thereby reducing the risk of lead wire 11262 colliding with frame 1121 and reducing the travel of lead wire 11262 after colliding with frame 1121. Furthermore, at least the portion of the orthographic projection of second extension portion 11264 along the vibration direction of speaker 112 near first extension portion 11263 may fall within avoidance groove 11217, further reducing the risk of lead wire 11262 colliding with frame 1121 and reducing the travel of lead wire 11262 after colliding with frame 1121. Accordingly, one end of the second extension portion 11264 away from the first extension portion 11263 may be connected to the second pad 11282. Of course, in some other embodiments, the lead 11262 may be arranged as a straight line or an arc as a whole.

[0104] In some embodiments, the ratio of the length of the second extension portion 11264 to the length of the first extension portion 11263 can be between 2 and 15. If this ratio is too small, the vibration amplitude of the second extension portion 11264 at the end away from the first extension portion 11263 can remain large, which can easily cause the second extension portion 11264 to break or become desoldered at the second solder pad 11282. If this ratio is too large, the weight of the second extension portion 11264 can be too large, causing excessive pulling on the first extension portion 11263, which can also increase the overall size of the speaker 112, hindering product miniaturization. Furthermore, the spacing between the second extension portion 11264 and the annular body 11261 in a direction perpendicular to the vibration direction of the speaker 112 (e.g., the width direction Z) can be between 1.1 mm and 2.1 mm. Among them, if the aforementioned spacing is too small, it is easy to cause the amplitude of the second extension part 11264 to remain large, which may easily cause the second extension part 11264 to collide with the basin frame 1121, and the second extension part 11264 to break or desolder at the second solder pad 11282; if the aforementioned ratio is too large, it is easy to cause the first extension part 11263 to deform excessively toward the basin frame 1121 due to its excessive weight, which may easily collide with the basin frame 1121, and may also easily cause the overall size of the speaker 112 to be larger, which is not conducive to product miniaturization.

[0105] In some embodiments, such as FIG. 23 , the angle between the second extension portion 11264 and the first extension portion 11263 may be an obtuse angle, which helps reduce the stress between the second extension portion 11264 and the first extension portion 11263 , thereby increasing the reliability of the lead 11262 .

[0106] In some embodiments, such as Figure 24, the distance between at least a portion of the second extension portion 11264 and the basin frame 1121 in the vibration direction of the speaker 112 can gradually decrease in the extension direction away from the first extension portion 11263 (for example, the opposite direction of arrow Y), so that the portion of the second extension portion 11264 close to the first extension portion 11263 and the first extension portion 11263 are as far away from the basin frame 1121 as possible in the vibration direction of the speaker 112, thereby reducing the risk of collision between the lead wire 11262 and the basin frame 1121 and reducing the travel of the lead wire 11262 after the collision with the basin frame 1121.

[0107] In some embodiments, the frame 1121 may be provided with a plurality of through-holes 11213 spaced around the annular body 11261. The avoidance grooves 11217 may communicate with the through-holes 11213, simplifying the structure of the frame 1121. The orthographic projection of the second extension 11264 along the vibration direction of the speaker 112 may at least partially fall within the through-holes 11213, reducing the area where the second extension 11264 may collide with the frame 1121, thereby improving the reliability of the speaker 112. The plurality of through-holes 11213 may be divided into two groups, with the orthographic projections of the second extensions 11264 of the two leads 11262 along the vibration direction of the speaker 112 each at least partially falling within a through-hole 11213. Each group of through-holes 11213 may include multiple, spaced-apart through-holes 11213, such as the four shown in FIG. Alternatively, each group of through-holes 11213 may include only one, relatively large through-hole 11213.

[0108] By way of example, referring to Figures 23 and 25 , the frame 1121 may be provided with solder pads connected to the lead wire 11262. There may be two such pads, one of which serves as the positive terminal of the speaker 112, and the other as the negative terminal of the speaker 112. The solder pads may be the metal member 1128 mentioned above, or may be provided in other configurations known to those skilled in the art, which will not be described in detail below. Furthermore, the lead wire 11262 has a first end 1126a proximal to the annular body 11261 and a second end 1126b distal to the annular body 11261. The second end 1126b may be secured to a corresponding solder pad, for example, the end of the lead wire 11262 distal to the annular body 11261 may be soldered to the first solder pad 11281. The ratio between the length of the lead wire 11262 and the maximum amplitude of the movement of the coil 1126 relative to the frame 1121 may be between 8 and 75. If the ratio is too small, the amplitude of the vibration at the second end 1126b may remain large, which could lead to breakage of the lead 11262 or desoldering at the pad. If the ratio is too large, the lead 11262 may be excessively deformed toward the frame 1121 due to its own weight, causing it to collide with the frame 1121. This may also increase the overall size of the speaker 112, hindering product miniaturization. In short, this technical solution helps to alleviate the technical problem of stress concentration in the lead 11262.

[0109] In some embodiments, the ratio of the wire diameter of the lead 11262 to the length of the lead 11262 can be between 50 and 1000. If the ratio is too small, the lead 11262 may break due to insufficient rigidity. If the ratio is too large, the lead 11262 may be excessively deformed toward the frame 1121 due to its own weight, thereby colliding with the frame 1121.

[0110] In some embodiments, the lead 11262 can be further fixed to the frame 1121 at a fixed position 1126c between the first end 1126a and the second end 1126b, so that the vibration of the lead 11262 following the annular body 11261 is difficult to be transmitted to the above-mentioned pad. This helps to prevent the end of the lead 11262 near the pad from resonating or the peak frequency of the resonance from shifting to a higher frequency band (e.g., above 10 kHz), thereby reducing the risk of the lead 11262 breaking or becoming desoldered at the pad. The portion of the lead 11262 between the first end 1126a and the fixed position 1126c can be suspended relative to the frame 1121, and the portion of the lead 11262 between the second end 1126b and the fixed position 1126c can also be suspended relative to the frame 1121 to reduce the risk of the lead 11262 colliding with the frame 1121.

[0111] As an example, in conjunction with Figures 19 and 23, a support block 11218 can be provided on the frame 1121. The support block 11218 is located between the first end 1126a and the second end 1126b and can correspond to the fixed position 1126c. In this case, the lead 11262 can be fixed to the support block 11218 at the fixed position 1126c, so that at least a portion of the lead 11262 is suspended relative to the frame 1121. In this way, because the support block 11218 is part of the structure of the frame 1121, the fixed position 1126c is more accurate, which helps prevent workers from arbitrarily fixing a certain position on the lead 11262 to the frame 1121. This helps improve the product consistency of the loudspeaker 112 in mass production, thereby increasing the yield rate.

[0112] It should be noted that in embodiments where the frame 1121 is provided with multiple through-holes 11213 spaced around the annular body 11261, the support block 11218 can be located between two adjacent through-holes 11213, resulting in a simple and reliable structure. Furthermore, the support block 11218 can also serve as a reinforcing rib for the frame 1121, thereby increasing the structural strength of the frame 1121. Furthermore, for the lead 11262 corresponding to the positive or negative terminal of the speaker 112, multiple fixed locations 1126c and corresponding support blocks 11218 can be provided, for example, two or three.

[0113] In some embodiments, lead 11262 can be secured to support block 11218 using glue 11219. After curing, glue 11219 can be elastic, such as a soft glue like silicone. This helps absorb vibrations of lead 11262 caused by annular body 11261, reducing stress on lead 11262 at securing position 1126c, and thus reducing the risk of lead 11262 breaking. Of course, in applications where the risk of breakage is lower, glue 11219 can also be a hard glue.

[0114] In some embodiments, a retaining groove can be provided on the side of support block 11218 that contacts lead 11262. This helps ensure consistency in the relative positions of support block 11218 and lead 11262 during mass production, thereby improving product yield. It is worth noting that in embodiments where lead 11262 is secured to support block 11218 with glue 11219, the retaining groove can also serve as a glue reservoir, allowing sufficient glue 11219 to accumulate on support block 11218 to secure lead 11262.

[0115] In some embodiments, the first length of lead 11262 between first end 1126a and support block 11218 can be greater than the second length of lead 11262 between second end 1126b and support block 11218. This reduces the risk of lead 11262 breaking due to a too-short first length, while maintaining the overall length of lead 11262. For example, the ratio of the first length to the second length can be between 1 and 12. If this ratio is too small, the amplitude of lead 11262 at support block 11218 can remain large, which can easily lead to lead 11262 breaking.

[0116] In some embodiments, when no excitation signal is input to the speaker 112, the first end 1126a and the fixed position 1126c where the lead 11262 is supported by the support block 11218 are co-located on a reference plane perpendicular to the vibration direction of the speaker 112. This helps reduce stress in the lead 11262, thereby reducing the risk of the lead 11262 breaking.

[0117] 23 , second extension portion 11264 may be fixed to support block 11218 and the aforementioned soldering pad. For example, second extension portion 11264 may be soldered to the aforementioned soldering pad at second end 1126b and fixed to support block 11218 at fixing position 1126c using glue 11219. The end of second extension portion 11264 connected to first extension portion 11263 serves as the starting point of second extension portion 11264, and second end 1126b serves as the ending point of second extension portion 11264. The position where second extension portion 11264 is fixed to support block 11218 (for example, fixing position 1126c) may be located between one-half and three-quarters of the length of second extension portion 11264.

[0118] By way of example, referring to Figures 19, 21, and 22, the diaphragm 1123 may include an integrally connected main body 11231, a first annular connecting portion 11232, and a second annular connecting portion 11233. The first annular connecting portion 11232 is connected to the coil 1126, and the second annular connecting portion 11233 is connected to the fold 1124. The main body 11231 may be configured as a dome-shaped structure that bulges away from the coil 1126. Furthermore, the orthographic projection of the second annular connecting portion 11233 in the vibration direction of the speaker 112 may cover the lead wire 11262. The second annular connecting portion 11233 is bent relative to the first annular connecting portion 11232 toward a side away from the coil 1126, creating a gap between the lead wire 11262 and the fold 1124 or the diaphragm 1123 connected thereto. This helps prevent unnecessary collision between the lead wire 11262 and the fold 1124 or the diaphragm 1123 connected thereto.

[0119] By way of example, in conjunction with Figures 19 to 22 , the folded ring 1124 may include an integrally connected third annular connecting portion 11241, a pleated portion 11242, and a fourth annular connecting portion 11243. The third annular connecting portion 11241 may be connected to a side of the second annular connecting portion 11233 facing away from the coil 1126, and the fourth annular connecting portion 11243 may be connected to the frame 1121 (e.g., the annular peripheral wall 11214) via a reinforcing member 11244. Furthermore, the pleated portion 11242 may be raised in a direction away from the lead wire 11262, thereby preventing unnecessary collision between the two.

[0120] Based on the above-mentioned related description, the present application provides an electronic device, which may include a support component and a movement module 11. The aforementioned support component can be connected to the movement housing 111 to support the movement module 11 to be worn to the wearing position. Among them, the aforementioned support component can be configured as an ear hook structure (such as a hook-shaped structure 12) hung on the ear in the worn state, or it can be configured as a headband structure that passes around the top of the head in the worn state. Furthermore, the aforementioned wearing position can be the position of the user's cheek close to the ear, a certain position on the front side of the ear, or other physiological parts of the user. Based on this, in addition to being headphones 10, the aforementioned electronic device can also be a terminal device such as smart glasses that includes the movement module 11. In addition to including a speaker 112, the movement module 11 can also include a transducer based on the bone conduction principle. As an example, the electronic device can include a speaker 112, and the speaker 112 is used to generate air conduction sound. Among them, for an electronic device including a speaker 112, the electronic device can also be a terminal device such as a mobile phone or a smart watch.

[0121] The above descriptions are only some embodiments of the present application and do not limit the scope of protection of the present application. Any equivalent device or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the scope of patent protection of this application.

Claims

1. A headset, characterized in that: The earphones include a core module, and a hook-shaped structure and an auxiliary structure connected to the core module. The core module is located on the front side of the ear when worn, at least part of the hook-shaped structure is located on the back side of the ear when worn, and at least part of the auxiliary structure is located on the front side of the ear when worn. The core module is pressed against a first ear region corresponding to the cymba concha of the ear, and the auxiliary structure is pressed against a second ear region corresponding to the antihelix of the ear.

2. The earphone according to claim 1, wherein When worn and observed along the thickness direction, the extension direction of the auxiliary structure points to the back of the head, and the angle between it and the positive direction of the vertical axis of the human body pointing to the top of the head is an acute angle; wherein, the thickness direction is defined as the direction in which the movement module approaches or moves away from the ear when worn.

3. The earphone according to claim 2, wherein The movement module has a first inner side surface facing the ear and a first outer side surface away from the ear along the thickness direction in the wearing state, and a connecting surface connecting the first inner side surface and the first outer side surface, and the auxiliary structure is connected to at least the connecting surface.

4. The earphone according to claim 3, wherein The core module has a length direction and a width direction that are perpendicular to the thickness direction and orthogonal to each other. The size of the core module in the length direction is larger than the size of the core module in the width direction. The connecting surface includes an upper side surface of the external auditory canal facing away from the ear along the width direction in the wearing state and a lower side surface facing the external auditory canal, as well as a rear side surface facing the back of the head and a front side surface facing away from the back of the head along the length direction in the wearing state. The auxiliary structure is connected to at least the rear side surface.

5. The earphone according to claim 4, characterized in that The thickness of the auxiliary structure is smaller than the dimension of the movement module in the thickness direction, and when viewed along the length direction or the width direction, the position where the auxiliary structure is connected to the movement module is located between one-third and two-thirds of the thickness of the movement module in the thickness direction.

6. The earphone according to claim 3, wherein The hook structure and the auxiliary structure are staggered in the thickness direction.

7. The earphone according to claim 1, wherein The movement module includes a movement shell connected to the hook-shaped structure and a speaker arranged in the movement shell. The auxiliary structure includes a connecting portion connected to the movement module and an extension portion connected to the connecting portion. The hardness of the extension portion is less than the hardness of the movement shell. The auxiliary structure contacts the anti-helix through the extension portion.

8. The earphone according to claim 7, wherein: The auxiliary structure includes a flexible insert connected to the extension portion, the flexible insert is arranged in the extension portion or on a side of the extension portion facing the antihelix, and the hardness of the flexible insert is less than the hardness of the extension portion.

9. The earphone according to claim 7, wherein The movement module has a first inner side surface facing the ear and a first outer side surface away from the ear along the thickness direction when worn, and a connecting surface connecting the first inner side surface and the first outer side surface. The thickness direction is defined as the direction in which the movement module approaches or moves away from the ear when worn, and the connecting portion covers at least a portion of the first outer side surface.

10. The earphone according to claim 9, characterized in that The extension portion has a second inner side surface facing the anti-helix and a second outer side surface facing away from the anti-helix in a worn state, and at least one of the second inner side surface and the second outer inner side surface is inclined toward the anti-helix.

11. The earphone according to claim 7, wherein The movement module has a first inner side surface facing the ear and a first outer side surface away from the ear along the thickness direction when worn, and a connecting surface connecting the first inner side surface and the first outer side surface. The thickness direction is defined as the direction in which the movement module approaches or moves away from the ear when worn. A mounting groove extending along the circumference of the movement module is provided on the connecting surface, and the connecting part is fixed in the mounting groove.

12. The earphone according to claim 11, wherein The installation groove is arranged in an annular shape, the connecting portion is arranged in an annular structure, and the connecting portion is nested in the installation groove.

13. The earphone according to claim 1, wherein The auxiliary structure is detachably connected to the core module.

14. The earphone according to claim 1, wherein The movement module includes a movement shell connected to the hook-shaped structure and a speaker arranged in the movement shell. When worn, the movement shell is provided with a sound outlet hole facing the inner side of the ear, and the sound waves generated by the speaker are transmitted through the sound outlet hole. When worn, the movement module covers at least a portion of the cavum concha to cooperate in forming an auxiliary cavity connected to the external auditory canal of the ear, and the sound outlet hole is at least partially located in the auxiliary cavity.

15. The earphone according to claim 14, characterized in that The auxiliary cavity is semi-open.

16. The earphone according to claim 14, wherein The earphone includes a main control circuit board arranged in the core shell. The core shell or the auxiliary structure is provided with electrode terminals facing the inner side of the ear when worn. The electrode terminals and the speaker are respectively coupled to the main control circuit board.

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