Sound production part

Abstract

One or more embodiments of the present specification relate to a sound emitting unit comprising: a diaphragm; a magnetic circuit assembly; the coil is connected with the vibrating diaphragm, at least part of the coil is located in a magnetic gap formed by the magnetic circuit assembly, the coil drives the vibrating diaphragm to vibrate to generate sound after being powered on, the vibrating diaphragm comprises a main body area and a folded ring area arranged around the main body area, and the folded ring area is located between the main body area and the folded ring area. The main body area comprises a first inclined section and a first connecting section connected with the coil, the first inclined section is attached to a part of the folded ring area, and the first inclined section inclines in the direction away from the coil relative to the first connecting section.

Description

A vocal part

[0001] Cross-references

[0002] This application claims priority to Chinese application No. 202211336918.4 filed on October 28, 2022, priority to Chinese application No. 202223239628.6 filed on December 1, 2022, and priority to international application No. PCT / CN2022 / 144339 filed on December 30, 2022, all of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to the field of acoustics, and in particular to a sound-producing part. Background Art

[0004] With the development of acoustic output technology, sound-emitting parts (e.g., headphones) have been widely used in people's daily lives. They can be used in conjunction with electronic devices such as mobile phones and computers to provide users with an auditory feast. The output performance of the sound-emitting part has a great impact on the user's comfort. The structure of the diaphragm in the sound-emitting part and the supporting structure that cooperates with the diaphragm usually affect the output performance of the sound-emitting part. Therefore, it is necessary to propose a sound-emitting part with high output performance.

[0005] Summary of the Invention

[0006] An embodiment of the present specification provides a sound-emitting part, comprising: a diaphragm; a magnetic circuit assembly; and a coil, wherein the coil is connected to the diaphragm and is at least partially located in a magnetic gap formed by the magnetic circuit assembly, and when energized, the coil drives the diaphragm to vibrate to generate sound, wherein the diaphragm comprises a main body area and a folding ring area arranged around the main body area, the main body area comprises a first inclined section and a first connecting section connected to the coil, the first inclined section is in contact with a portion of the folding ring area, and the first inclined section is inclined relative to the first connecting section in a direction away from the coil.

[0007] In some embodiments, the fold area includes a second inclined segment, and the second inclined segment is at least partially aligned with the first inclined segment.

[0008] In some embodiments, the second inclined section is located on a side of the first inclined section facing away from the coil.

[0009] In some embodiments, the fold area includes an arc segment, and a ratio of a height of the arc segment to a span of the arc segment is in the range of 0.35-0.4.

[0010] In some embodiments, an inclination angle of the first inclined section relative to the first connecting section is in a range of 5°-30°, and the first connecting section is perpendicular to a vibration direction of the diaphragm.

[0011] In some embodiments, the main body area includes a spherical top, which is located at an end of the first connecting section away from the first inclined section, has a span of 2 mm to 8 mm, and a height of 0.7 mm to 1.2 mm.

[0012] In some embodiments, the ratio of the height of the dome to the span is in the range of 0.1-0.3.

[0013] In some embodiments, the frequency at which the high frequency split vibration occurs is not less than 20 kHz.

[0014] In some embodiments, the magnetic circuit assembly includes a container, and at an input voltage of 0.1V-0.7V and a frequency range of 20Hz-6.1kHz, the distance from the bottom of the coil to the bottom of the container is in the range of 0.8mm-0.9mm.

[0015] In some embodiments, the sound-emitting portion further includes a bracket disposed around the magnetic circuit assembly, and a first portion of the bracket is connected to the second connecting section of the folding ring area.

[0016] In some embodiments, the second connecting section of the folding ring area is connected to the first portion of the bracket through a fixing ring.

[0017] In some embodiments, the thickness of the first part where the bracket is connected to the folding ring area is in the range of 0.3mm-3mm, and the thickness of the first part is the minimum distance between the connection area between the bracket and the folding ring area and the area where the bracket is directly in contact with the magnetic circuit assembly in the vibration direction of the diaphragm.

[0018] In some embodiments, the sound-emitting part further includes a shell, a pressure relief hole is provided on the shell, a rear cavity is formed between the pressure relief hole and the back surface of the diaphragm, and a resonance frequency of the rear cavity is not less than 3.3 kHz.

[0019] In some embodiments, the volume of the rear cavity is 60 mm 3 -110mm 3 within the range.

[0020] In some embodiments, the sound-emitting part also includes a shell, a pressure relief hole is provided on the shell, and a plurality of air holes are provided on the bracket, and the sound from the back of the diaphragm is transmitted to the pressure relief hole through the plurality of air holes, and the plurality of air holes include at least a first air hole and a second air hole, the distance between the center of the first air hole and the center of the pressure relief hole is greater than the distance between the center of the second air hole and the center of the pressure relief hole, and the area of ​​the first air hole is greater than the area of ​​the second air hole.

[0021] In some embodiments, the sound-emitting part also includes a shell, the shell is provided with a pressure relief hole, and the bracket is provided with multiple air holes. The sound from the back of the diaphragm is transmitted to the pressure relief hole through the multiple air holes. In the vibration direction of the diaphragm, the ratio of the total area of ​​the multiple air holes to the projected area of ​​the diaphragm is in the range of 0.008-0.3.

[0022] In some embodiments, the projection area of ​​the diaphragm is 90 mm in the vibration direction of the diaphragm. 2 -560mm 2 The total area of ​​the plurality of vent holes is within 4.54 mm 2 -12.96mm 2 within the range.

[0023] In some embodiments, the sound-emitting part further includes a shell, and in the vibration direction of the diaphragm, the ratio of the projected area of ​​the diaphragm to the projected area of ​​the shell is not less than 0.5.

[0024] In some embodiments, in the vibration direction of the diaphragm, a ratio of a projected area of ​​the diaphragm to a projected area of ​​the shell is in the range of 0.8-0.95.

[0025] In some embodiments, the major axis dimension of the diaphragm is in the range of 13 mm to 25 mm, and the minor axis dimension of the diaphragm is in the range of 4 mm to 13 mm.

[0026] In some embodiments, a plurality of ventilation holes are provided on the bottom wall of the container of the magnetic circuit assembly or on the side wall in contact with the bracket.

[0027] In some embodiments, the dome is formed by interlacing carbon fibers, and at least some of the carbon fibers are interlaced at a first angle, and the first angle is in the range of 45°-90°.

[0028] In some embodiments, in the vibration direction of the diaphragm, the thickness of the dome is less than 80 um.

[0029] In some embodiments, the minimum distance between the coil and the first inclined segment is not less than 0.3 mm.

[0030] In some embodiments, the magnetic circuit assembly includes a magnetic conductive plate and a magnet, wherein the magnetic conductive plate is located between the magnet and the diaphragm and attached to the surface of the magnet. In the vibration direction of the diaphragm, the distance between the center of the coil and the center of the magnetic conductive plate is less than 0.3 mm.

[0031] In some embodiments, in the vibration direction of the diaphragm, the distance from the lowest point of the spherical top to the upper surface of the magnetic conductive plate is greater than 0.8 mm.

[0032] In some embodiments, the magnetic circuit assembly includes a housing, and in the vibration direction of the diaphragm, the distance between the bottom of the coil and the bottom wall of the housing is in the range of 0.2 mm to 4 mm.

[0033] In some embodiments, the distance between the coil and the side wall of the container is in the range of 0.1 mm to 0.5 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0035] FIG1 is a schematic diagram of an exemplary ear according to some embodiments of the present application;

[0036] FIG2 is an exemplary wearing diagram of an open-earphone according to some embodiments of this specification;

[0037] FIG3 is a schematic diagram of an exemplary wearing method of an open-earphone according to some embodiments of this specification;

[0038] FIG4 is an exemplary wearing diagram of another open-ear headset according to some embodiments of this specification;

[0039] FIG5 is a schematic diagram showing an exemplary distribution of a cavity structure disposed around one of the dual sound sources according to some embodiments of this specification;

[0040] FIG6 is a schematic diagram of an exemplary internal structure of a sound-producing part according to some embodiments of this specification;

[0041] FIG7 is an exemplary external view of a transducer according to some embodiments of the present specification;

[0042] FIG8 is an exemplary exploded view of a transducer according to some embodiments of the present specification;

[0043] FIG9 is a diagram illustrating an exemplary internal structure of a sound-producing part according to some embodiments of the present specification;

[0044] FIG10 is an exemplary structural diagram of a diaphragm according to some embodiments of the present specification;

[0045] FIG11A is a schematic diagram showing an exemplary high-frequency bandwidth of a sound-emitting part according to some embodiments of the present specification;

[0046] FIG11B is a schematic diagram of an exemplary carbon fiber weaving structure according to some embodiments of the present specification;

[0047] FIG12 is a schematic diagram of the amplitude of the sound-emitting part under different driving voltages according to some embodiments of this specification;

[0048] FIG13 is an exemplary structural diagram of a rear cavity according to some embodiments of the present specification;

[0049] FIG14 is a graph showing frequency response of the rear cavity corresponding to different thicknesses of the first portion according to some embodiments of this specification;

[0050] FIG15 is a frequency response curve diagram of a sound-emitting portion under different driving voltages according to some embodiments of this specification;

[0051] FIG16 is a schematic diagram of exemplary positions of a bracket, a first pressure relief hole, and a second pressure relief hole according to some embodiments of this specification; and

[0052] FIG. 17 is a frequency response curve of the rear cavity corresponding to different total areas of the air holes according to some embodiments of this specification. DETAILED DESCRIPTION

[0053] To more clearly illustrate the technical solutions of the embodiments of this specification, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this specification. Those skilled in the art can apply this specification to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0054] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are a method for distinguishing different components, elements, parts, portions, or assemblies at different levels. However, if other terms can achieve the same purpose, the terms may be replaced by other expressions.

[0055] As used in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not refer to the singular but also include the plural. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0056] In the description of this specification, it should be understood that the terms "first," "second," "third," "fourth," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of such features. In the description of this specification, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0057] In this specification, unless otherwise specified or limited, terms such as "connected" and "fixed" should be interpreted broadly. For example, the term "connected" can refer to a fixed connection, a removable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; and can refer to internal communication between two components or an interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this specification based on the specific circumstances.

[0058] Flowcharts are used throughout this specification to illustrate the operations performed by systems according to embodiments of this specification. It should be understood that preceding or following operations do not necessarily need to be performed in exact order. Instead, the steps may be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0059] FIG1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. Referring to FIG1 , the ear 100 may include an external auditory canal 101, a cavum concha 102, a cymba concha 103, a triangular fossa 104, an antihelix 105, a scaphoid 106, an auricle 107, an earlobe 108, and a crus helix 109. In some embodiments, the wearing and stabilization of an acoustic device can be achieved with the help of one or more parts of the ear 100. In some embodiments, parts such as the external auditory canal 101, the cavum concha 102, the cymba concha 103, and the triangular fossa 104 have a certain depth and volume in three-dimensional space, which can be used to meet the wearing requirements of the acoustic device. For example, an acoustic device (e.g., an in-ear headphone) can be worn in the external auditory canal 101. In some embodiments, the wearing of the acoustic device can be achieved with the help of other parts of the ear 100 other than the external auditory canal 101. For example, the acoustic device can be worn by utilizing the cymba concha 103, the triangular fossa 104, the antihelix 105, the scaphoid 106, the helix 107, or a combination thereof. In some embodiments, to improve the comfort and reliability of the acoustic device when worn, it can further utilize the user's earlobe 108 or other parts. By utilizing other parts of the ear 100 other than the external auditory canal 101 to achieve the wearing of the acoustic device and the transmission of sound, the user's external auditory canal 101 can be "liberated" and the impact of the acoustic device on the user's ear health can be reduced. When the user wears the acoustic device on the road, the acoustic device will not block the user's external auditory canal 101. The user can receive both the sound from the acoustic device and the sound from the environment (e.g., horns, car bells, surrounding human voices, traffic signals, etc.), thereby reducing the probability of traffic accidents. For example, when the user wears the acoustic device, the entire or partial structure of the acoustic device can be located in front of the crus helix 109 (e.g., area J surrounded by dotted lines in FIG1 ). For another example, when a user wears the acoustic device, the entire or partial structure of the acoustic device may contact the upper portion of the external auditory canal 101 (e.g., the location of one or more of the crus helix 109, cymba concha 103, triangular fossa 104, antihelix 105, scaphoid 106, and helix 107). For another example, when a user wears the acoustic device, the entire or partial structure of the acoustic device may be located within one or more locations of the ear (e.g., the cavum concha 102, cymba concha 103, and triangular fossa 104) (e.g., the areas M1 and M2 enclosed by dashed lines in FIG1 ).

[0060] Different users may have individual differences, resulting in different shapes, sizes and other dimensional differences in the ears. For the sake of ease of description and understanding, unless otherwise specified, this manual will mainly use an ear model with a "standard" shape and size as a reference to further describe how the acoustic device in different embodiments is worn on the ear model. For example, a simulator containing a head and its (left and right) ears made based on ANSI: S3.36, S3.25 and IEC: 60318-7 standards, such as GRAS KEMAR, HEAD Acoustics, B&K 4128 series or B&K 5128 series, can be used as a reference for wearing an acoustic device, thereby presenting a scenario in which most users normally wear the acoustic device. Taking GRAS KEMAR as an example, the ear simulator can be any one of GRAS 45AC, GRAS45BC, GRAS 45CC or GRAS 43AG. Taking HEAD Acoustics as an example, the ear simulator can be any one of HMS II.3, HMS II.3LN, or HMS II.3LN HEC. It should be noted that the data range measured in the embodiments of this specification is based on the GRAS 45BC KEMAR, but it should be understood that there may be differences between different head models and ear models, and the relevant data range may fluctuate by ±10% when using other models. As an example only, the reference ear can have the following relevant characteristics: the size of the projection of the auricle on the sagittal plane in the vertical axis direction can be in the range of 49.5mm-74.3mm, and the size of the projection of the auricle on the sagittal plane in the sagittal axis direction can be in the range of 36.6mm-55mm. The projection of the auricle on the sagittal plane refers to the projection of the edge of the auricle on the sagittal plane. The edge of the auricle is composed of at least the outer contour of the helix, the contour of the earlobe, the contour of the tragus, the intertragic notch, the antitragic cusp, and the annular notch. Therefore, in this application, descriptions such as "worn by a user," "in a worn state," and "in a worn state" may refer to the acoustic device described in this application being worn on the ear of the aforementioned simulator. Of course, considering the individual differences between different users, the structure, shape, size, thickness, etc. of one or more parts of the ear 100 may be designed differently according to ears of different shapes and sizes. These differentiated designs may be manifested in that the characteristic parameters of one or more parts of the acoustic device (for example, the sound-emitting part, ear hook, etc. described below) may have different ranges of values ​​to adapt to different ears.

[0061] It should be noted that in fields such as medicine and anatomy, the human body can be defined as three basic planes: the sagittal plane, the coronal plane, and the horizontal plane, as well as three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane refers to a plane perpendicular to the ground, drawn along the front-to-back direction of the body, dividing the body into left and right parts; the coronal plane refers to a plane perpendicular to the ground, drawn along the left-to-right direction of the body, dividing the body into front and back parts; and the horizontal plane refers to a plane perpendicular to the ground, drawn along the top-to-bottom direction of the body, dividing the body into top and bottom parts. Accordingly, the sagittal axis refers to the axis along the front-to-back direction of the body and perpendicular to the coronal plane; the coronal axis refers to the axis along the left-to-right direction of the body and perpendicular to the sagittal plane; and the vertical axis refers to the axis along the top-to-bottom direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" as used herein refers to the side of the ear that faces the human face, along the sagittal axis. When observing the ear of the simulator along the coronal axis of the human body, the front side outline of the ear shown in FIG1 can be obtained.

[0062] The description of the ear portion 100 is for illustrative purposes only and is not intended to limit the scope of this application. A person skilled in the art can make various changes and modifications based on the description of this application. For example, a portion of the structure of the acoustic device can shield part or all of the external auditory canal 101. Such changes and modifications are still within the scope of protection of this application.

[0063] Figure 2 is an exemplary wearing diagram of an open-type earphone according to some embodiments of this specification, Figure 3 is an exemplary wearing diagram of an open-type earphone according to some embodiments of this specification, and Figure 4 is an exemplary wearing diagram of another open-type earphone according to some embodiments of this specification. In some embodiments, the open-type earphone 10 may include but is not limited to air conduction earphones and bone air conduction earphones. In some embodiments, the open-type earphone 10 may be combined with products such as glasses, headphones, head-mounted display devices, AR / VR helmets, etc. As shown in Figures 2 to 4, the open-type earphone 10 may include a sound-emitting part 11 and an ear hook 12. In some embodiments, the open-type earphone 10 can wear the sound-emitting part 11 on the user's body (for example, the head, neck or upper torso of the human body) through the ear hook 12.

[0064] In some embodiments, when the open earphones 10 are in the worn state, the first part of the ear hook 12 is hung between the user's auricle and the head, and the second part extends toward the side of the auricle away from the head and connects to the sound-emitting part 11, which is used to fix the sound-emitting part 11 near the ear canal but not blocking the ear canal. In some embodiments, the ear hook 12 can be an arc structure that adapts to the user's auricle, so that the ear hook 12 can be hung on the user's upper auricle. In some embodiments, the ear hook 12 can also be a clamping structure that adapts to the user's auricle, so that the ear hook 12 can be clamped on the user's auricle. In some embodiments, the ear hook 12 can include but is not limited to a hook structure, an elastic band, etc., so that the open earphones 10 can be better fixed to the user to prevent the user from falling off during use.

[0065] In some embodiments, the sound-emitting portion 11 can be worn on the user's body, and a transducer (e.g., transducer 112) can be provided within the sound-emitting portion 11 to generate sound for input into the user's ear 100. In some embodiments, the open-back earphones 10 can be combined with products such as glasses, headphones, head-mounted displays, and AR / VR helmets. In such cases, the sound-emitting portion 11 can be worn near the user's ear 100 by hanging or clamping. In some embodiments, the sound-emitting portion 11 can be annular, elliptical, polygonal (regular or irregular), U-shaped, V-shaped, or semicircular, so that the sound-emitting portion 11 can be directly attached to the user's ear 100.

[0066] In conjunction with Figures 1 and 2, in some embodiments, when the user wears the open earphones 10, at least part of the sound-emitting part 11 may be located in area J on the front side of the tragus of the user's ear 100 shown in Figure 1 or in areas M1 and M2 inside the auricle. The following will provide an exemplary description in conjunction with different wearing positions of the sound-emitting part 11 (11A, 11B, and 11C shown in Figure 2). It should be noted that the anterior and lateral side of the auricle mentioned in the embodiments of this specification refers to the side of the auricle away from the head along the coronal axis, and correspondingly, the posterior and medial side of the auricle refers to the side of the auricle facing the human head along the coronal axis. In some embodiments, the sound-emitting part 11 being located at 11A means that the sound-emitting part 11 is located on the side of the user's ear 100 facing the human facial area along the sagittal axis, that is, the sound-emitting part 11 is located in area J on the front side of the ear 100.

[0067] Furthermore, a transducer (e.g., transducer 112) is provided inside the shell of the sound-emitting part 11, and at least one sound outlet (e.g., sound outlet 111a, not shown in FIG2 ) may be provided on the shell of the sound-emitting part 11 (e.g., shell 111). The sound outlet may be located on the side wall of the shell of the sound-emitting part facing or close to the external auditory canal 101 of the user, and the transducer may output sound to the external auditory canal 101 of the user through the sound outlet. The transducer is an element that can receive an electrical signal and convert it into a sound signal for output. In some embodiments, the type of transducer 112 may include a low-frequency (e.g., 30Hz-150Hz) speaker, a mid-low-frequency (e.g., 150Hz-500Hz) speaker, a mid-high-frequency (e.g., 500Hz-5kHz) speaker, a high-frequency (e.g., 5kHz-16kHz) speaker, or a full-range (e.g., 30Hz-16kHz) speaker, or any combination thereof, differentiated by frequency. The terms "low frequency" and "high frequency" used here only represent approximate frequency ranges. Different divisions can be used in different application scenarios. For example, a crossover point can be determined, with "low frequency" representing the frequency range below the crossover point and "high frequency" representing the frequency range above the crossover point. This crossover point can be any value within the audible range of the human ear, for example, 500Hz, 600Hz, 700Hz, 800Hz, 1000Hz, etc.

[0068] In some embodiments, the transducer may include a diaphragm (e.g., diaphragm 1121). When the diaphragm vibrates, sound may be emitted from the front and rear sides of the diaphragm, respectively. The chamber inside the shell of the sound-emitting portion 11 is divided by the diaphragm into at least a front chamber (e.g., front chamber 114) located in front of the diaphragm and a rear chamber (e.g., rear chamber 116) located behind the diaphragm. The sound outlet is acoustically coupled with the front chamber. The vibration of the diaphragm drives the air in the front chamber to vibrate to produce air-conducted sound. The air-conducted sound produced in the front chamber is transmitted to the outside through the sound outlet. In some embodiments, the shell of the sound-emitting portion 11 may further include one or more pressure relief holes (e.g., a first pressure relief hole 111c and a second pressure relief hole 111d). The pressure relief hole may be located on a side wall of the shell adjacent to or opposite to the side wall where the sound outlet is located. The pressure relief hole is acoustically coupled with the rear chamber. The vibration of the diaphragm also drives the air in the rear chamber to vibrate to produce air-conducted sound. The air-conducted sound produced in the rear chamber may be transmitted to the outside through the pressure relief hole. Exemplarily, in some embodiments, the transducer in the sound-emitting part 11 can output sound with a phase difference (for example, opposite phase) through the sound outlet and the pressure relief hole. The sound outlet can be located on the side wall of the shell of the sound-emitting part 11 facing the external auditory canal 101 of the user, and the pressure relief hole can be located on the side of the shell of the sound-emitting part 11 away from the external auditory canal 101 of the user. At this time, the shell can act as a baffle to increase the sound path difference between the sound outlet and the pressure relief hole to the external auditory canal 101, so as to increase the sound intensity at the external auditory canal 101 while reducing the volume of far-field sound leakage.

[0069] In some embodiments, the sound-emitting portion 11 may have a long axis direction Y and a short axis direction Z that are perpendicular to the thickness direction X and orthogonal to each other. The long axis direction Y may be defined as the direction with the maximum extension dimension in the shape of the two-dimensional projection surface of the sound-emitting portion 11 (for example, the projection of the sound-emitting portion 11 on the plane where its outer side surface is located, or the projection on the sagittal plane) (for example, when the projection shape is a rectangle or an approximate rectangle, the long axis direction is the length direction of the rectangle or the approximate rectangle), and the short axis direction Z may be defined as the direction perpendicular to the long axis direction Y in the shape of the projection of the sound-emitting portion 11 on the sagittal plane (for example, when the projection shape is a rectangle or an approximate rectangle, the short axis direction is the width direction of the rectangle or the approximate rectangle). The thickness direction X may be defined as a direction perpendicular to the two-dimensional projection surface, for example, consistent with the direction of the coronal axis, both pointing to the left and right directions of the body. In some embodiments, when the sound-emitting portion 11 is tilted when worn, the major axis Y and minor axis Z remain parallel or approximately parallel to the sagittal plane. The major axis Y can be angled with the sagittal axis, meaning that the major axis Y is also tilted accordingly. The minor axis Z can be angled with the vertical axis, meaning that the minor axis Z is also tilted, as shown in FIG2 , where the sound-emitting portion 11 is worn in position 11B, and FIG4 , where the sound-emitting portion 11 is worn. In some embodiments, all or part of the sound-emitting portion 11 can extend into the cavum concha, meaning that the projection of the sound-emitting portion 11 on the sagittal plane overlaps with the projection of the cavum concha on the sagittal plane. For details regarding the placement of the sound-emitting portion 11 in position 11B, please refer to other sections of this specification, such as FIG3 and its corresponding specification. In some embodiments, the sound-emitting portion 11 may also be in a horizontal state or an approximately horizontal state when worn, as shown in the sound-emitting portion 11 worn at 11C in FIG2 and the sound-emitting portion 11 shown in FIG3 , the long axis direction Y may be consistent or approximately consistent with the direction of the sagittal axis, both pointing to the front-to-back direction of the body, and the short axis direction Z may be consistent or approximately consistent with the direction of the vertical axis, both pointing to the up-down direction of the body. It should be noted that, when worn, the sound-emitting portion 11 being in an approximately horizontal state may mean that the angle between the long axis direction of the sound-emitting portion 11 shown in FIG2 and the sagittal axis is within a specific range (for example, not greater than 20°). In addition, the wearing position of the sound-emitting portion 11 is not limited to 11A, 11B, and 11C shown in FIG2 , and may satisfy the region J, region M1, or region M2 shown in FIG1 . For example, the entire or partial structure of the sound-emitting portion 11 may be located in the region J surrounded by the dotted line in FIG1 . For another example, the entire or partial structure of the sound-producing part 11 may contact one or more parts of the external auditory canal 101, such as the crus helix 109, cymba concha 103, fossa triangularis 104, antihelix 105, scaphoid 106, and helix 107.For another example, the entire or partial structure of the sound-producing part 11 can be located in a cavity formed by one or more parts of the ear 100 (for example, the cavum concha 102, the bacula concha 103, the fossa triangularis 104, etc.) (for example, the area M1 surrounded by the dotted line in Figure 1, which at least includes the bacula concha 103 and the fossa triangularis 104, and the area M2 which at least includes the cavum concha 102).

[0070] In some embodiments, to improve the stability of the open-back earphones 10 when worn, the open-back earphones 10 may adopt any one or a combination of the following methods. For example, at least a portion of the ear hook 12 may be configured as a contoured structure that fits at least one of the back of the ear and the head, thereby increasing the contact area between the ear hook 12 and the ear and / or the head, thereby increasing the resistance of the open-back earphones 10 to falling off the ear. For example, at least a portion of the ear hook 12 may be configured as an elastic structure so that it has a certain amount of deformation when worn, thereby increasing the positive pressure of the ear hook 12 on the ear and / or the head, thereby increasing the resistance of the open-back earphones 10 to falling off the ear. For example, at least a portion of the ear hook 12 may be configured to rest against the head when worn, thereby forming a reaction force that presses against the ear, so that the sound-emitting portion 11 is pressed against the front of the ear, thereby increasing the resistance of the open-back earphones 10 to falling off the ear. For example, the sound-producing portion 11 and ear hook 12 are configured to clamp physiological areas such as the antihelix and the cavum concha from both sides of the ear when worn, thereby increasing resistance to the open-ear earphone 10 falling off the ear. For another example, the sound-producing portion 11 or an auxiliary structure connected thereto is configured to at least partially extend into physiological areas such as the cavum concha, cymba concha, fossa triangularis, and scaphoid, thereby increasing resistance to the open-ear earphone 10 falling off the ear.

[0071] The sound-emitting portion 11 may have a connection end CE connected to the ear hook 12 and a free end FE not connected to the ear hook 12. For example, in conjunction with Figure 4, in the worn state, the free end FE of the sound-emitting portion 11 may extend into the cavum concha. Optionally, the sound-emitting portion 11 and the ear hook 12 may be configured to jointly clamp the ear region corresponding to the cavum concha from the front and back sides of the ear region, thereby increasing the resistance of the open-type earphone 10 to falling off the ear, thereby improving the stability of the open-type earphone 10 in the worn state. For example, the free end FE of the sound-emitting portion is pressed against the cavum concha in the thickness direction X. For another example, the free end FE abuts against the cavum concha in the major axis direction Y and / or the minor axis direction Z (for example, abuts against the inner wall of the cavum concha opposite to the free end FE). The free end FE of the sound-emitting portion 11 refers to the end portion of the sound-emitting portion 11 that is arranged opposite to the fixed end connected to the ear hook 12. The sound-emitting portion 11 can be a regular or irregular structure. Here, an exemplary illustration is given to further illustrate the free end FE of the sound-emitting portion 11. For example, when the sound-emitting portion 11 is a rectangular parallelepiped structure, the end wall surface of the sound-emitting portion 11 is a plane. In this case, the free end FE of the sound-emitting portion 11 is the end side wall of the sound-emitting portion 11 that is arranged opposite to the fixed end connected to the ear hook 12. For another example, when the sound-emitting portion 11 is a sphere, an ellipsoid or an irregular structure, the free end FE of the sound-emitting portion 11 can refer to a specific area away from the fixed end obtained by cutting the sound-emitting portion 11 along the YZ plane (the plane formed by the short axis direction Z and the thickness direction X). It should be noted that: in the worn state, in addition to extending into the concha cavity, the free end FE of the sound-emitting portion 11 can also be projected onto the antihelix, or it can be projected onto the left and right sides of the head and located in front of the ear on the sagittal axis of the human body. In other words, the ear hook 12 can support the sound-producing part 11 to be worn at a wearing position such as the concha cavity, the antihelix, or the front of the ear.

[0072] The following describes the open-back earphone 10 in detail, taking the open-back earphone 10 shown in FIG4 as an example. It should be noted that the structure and corresponding parameters of the open-back earphone 10 in FIG4 can also be applied to the other open-back earphone configurations mentioned above without violating the corresponding acoustic principles.

[0073] By extending at least a portion of the sound-emitting portion 11 into the cavum concha, the listening volume at the listening position (e.g., at the opening of the ear canal), especially the listening volume of mid- and low-frequency sounds, can be increased, while still maintaining a good far-field sound leakage cancellation effect. For illustrative purposes only, when the entire or partial structure of the sound-emitting portion 11 extends into the cavum concha, the sound-emitting portion 11 and the cavum concha form a structure similar to a cavity (hereinafter referred to as a quasi-cavity). In the embodiments of the specification, the quasi-cavity can be understood as a semi-enclosed structure enclosed by the side walls of the sound-emitting portion 11 and the cavum concha structure. This semi-enclosed structure is not completely sealed and isolated from the external environment, but has a leakage structure (e.g., an opening, a gap, a pipe, etc.) that is acoustically connected to the external environment. When the user wears the open-ear earphones 10, one or more sound outlet holes may be provided on the side of the shell of the sound-emitting portion 11 close to or facing the user's ear canal, and one or more pressure relief holes may be provided on the other side walls of the shell of the sound-emitting portion 11 (for example, the side walls away from or facing away from the user's ear canal). The sound outlet holes are acoustically coupled with the front cavity of the open-ear earphones 10, and the pressure relief holes are acoustically coupled with the back cavity of the open-ear earphones 10. Taking the sound-emitting portion 11 including a sound outlet hole and a pressure relief hole as an example, the sound output by the sound outlet hole and the sound output by the pressure relief hole can be approximately regarded as two sound sources, the sound waves of the two sound sources are in opposite phases, and the sound-emitting portion 11 and the corresponding inner wall of the cavum concha form a cavity-like structure, wherein the sound source corresponding to the sound outlet hole is located inside the cavity-like structure, and the sound source corresponding to the pressure relief hole is located outside the cavity-like structure, forming the acoustic model shown in FIG5 .

[0074] FIG5 is a schematic diagram illustrating an exemplary arrangement of a cavity structure around one of the dual sound sources shown in some embodiments of this specification. As shown in FIG5 , the cavity-like structure 502 may include a listening position and at least one sound source 501A. The term "include" here may mean that at least one of the listening position and the sound source 501A is within the cavity-like structure 502, or at least one of the listening position and the sound source 501A is at the inner edge of the cavity-like structure 502. The listening position may be equivalent to the entrance of the ear canal, an acoustic reference point of the ear such as the ear reference point (ERP) or the ear-drum reference point (DRP), or an entrance structure directed toward the listener. Because the sound source 501A is enclosed by the cavity-like structure 502, most of the sound radiated from it will reach the listening position through direct radiation or reflection. In contrast, in the absence of the cavity-like structure 502, most of the sound radiated from the sound source 501A will not reach the listening position. Therefore, the cavity structure significantly increases the volume of sound reaching the listening position. At the same time, only a small portion of the reverse-phase sound radiated by reverse-phase sound source 501B outside cavity-like structure 502 enters cavity-like structure 502 through leakage structure 503 within cavity-like structure 502. This is equivalent to generating a secondary sound source 501B' at leakage structure 503, whose intensity is significantly lower than that of sound source 501B and also significantly lower than that of sound source 501A. The sound generated by secondary sound source 501B' has a minimal effect of canceling out the reverse phase of sound source 501A within the cavity, significantly increasing the volume at the listening position. Regarding sound leakage, the radiation of sound source 501A to the outside world through the cavity's leaky structure 503 is equivalent to the generation of a secondary sound source 501A' at the leaky structure 503. Since almost all of the sound radiated by sound source 501A is output from the leaky structure 503, and the scale of the cavity-like structure 502 is much smaller than the spatial scale of the sound leakage (by at least an order of magnitude), the intensity of secondary sound source 501A' can be considered comparable to that of sound source 501A. For the outside world, secondary sound source 501A' and sound source 501B form a dual sound source cancellation, reducing sound leakage.

[0075] In a specific application scenario, the outer wall surface of the shell of the sound-emitting part 11 is usually a plane or a curved surface, while the contour of the user's cavum concha 102 is an uneven structure. By extending part or all of the sound-emitting part 11 into the cavum concha, a cavity-like structure connected to the outside world is formed between the sound-emitting part 11 and the contour of the cavum concha. Furthermore, the sound outlet is set at a position where the shell of the sound-emitting part 11 faces the user's ear canal opening and close to the edge of the cavum concha 102, and the pressure relief hole is set at a position where the sound-emitting part 11 is away from or far away from the ear canal opening, so as to construct the acoustic model shown in Figure 5, so that the user can improve the listening position at the ear opening when wearing the open-ear headphones 10, and reduce the sound leakage effect in the far field.

[0076] Figure 6 is a schematic diagram of an exemplary internal structure of the sound-emitting part according to some embodiments of the present specification. As shown in Figure 6, in some embodiments, the sound-emitting part 11 may include a transducer 112 and a shell 111 that accommodates the transducer 112, and the transducer 112 may include a diaphragm 1121. A front cavity 114 located on the front side of the diaphragm 1121 and a rear cavity 116 located on the rear side of the diaphragm 1121 may be formed between the diaphragm 1121 and the shell 111. The shell 111 is provided with a sound outlet hole 111a acoustically coupled with the front cavity 114 and a pressure relief hole acoustically coupled with the rear cavity 116 (for example, a first pressure relief hole 111c and a second pressure relief hole 111d, wherein the second pressure relief hole 111d is not shown in Figure 6). A connecting frame 115 may be provided in the shell 111. An acoustic channel 1151 is provided on the connecting frame 115 for connecting the first pressure relief hole 111c and the rear cavity 116 so that the rear cavity 116 is connected with the external environment, that is, air can freely enter and exit the rear cavity 116, thereby helping to reduce the resistance of the diaphragm of the transducer 112 during vibration.

[0077] FIG7 is an exemplary external view of a transducer according to some embodiments of the present specification, and FIG8 is an exemplary exploded view of a transducer according to some embodiments of the present specification. Referring to FIG7 and FIG8 , in some embodiments, the sound-generating portion 11 may include a diaphragm 1121, a coil 1122, a bracket 1123, a terminal 1124, and a magnetic circuit assembly 1125. The bracket 1123 provides a mounting platform, through which the speaker 112 can be connected to the housing 111. The terminal 1124 is fixed to the bracket 1123 and can be used for circuit connections (e.g., connecting leads, etc.). The coil 1122 is connected to the diaphragm 1121 and is at least partially located within the magnetic gap formed by the magnetic circuit assembly 1125. The magnetic circuit assembly 1125 exerts a force on the energized coil 1122, thereby driving the diaphragm 1121 to produce mechanical vibrations, thereby generating sound through a medium such as air. The magnetic circuit assembly 1125 may include a magnetic conductive plate 11251, a magnet 11252, and a receiving member 11253. The magnetic conductive plate 11251 is located between the magnet 11252 and the diaphragm 1121 and is attached to the surface of the magnet 11252 .

[0078] FIG9 is an exemplary internal structure diagram of the sound-emitting portion according to some embodiments of the present specification, and FIG10 is an exemplary structure diagram of the diaphragm according to some embodiments of the present specification. The sound-emitting portion 11 includes a diaphragm 1121, a coil 1122, a bracket 1123, and a magnetic circuit assembly 1125. The bracket 1123 is arranged around the diaphragm 1121, the coil 1122, and the magnetic circuit assembly 1125 to provide a mounting and fixing platform. The sound-emitting portion 11 can be connected to the housing 111 through the bracket 1123. The coil 1122 extends into the magnetic circuit assembly 1125 and is connected to the diaphragm 1121. The magnetic circuit assembly 1125 will exert a force on the energized coil 1122, thereby driving the diaphragm 1121 to generate mechanical vibration, thereby generating sound through the propagation of a medium such as air, and the sound is output through the sound outlet. In some embodiments, the magnetic circuit assembly 1125 includes a magnetic conductive plate 11251, a magnet 11252, and a container 11253. The magnetic conductive plate 11251 and the magnet 11252 are interconnected. The side of the magnet 11252 facing away from the magnetic conductive plate 11251 is mounted on the bottom wall of the container 11253, and a gap is formed between the peripheral side of the magnet 11252 and the peripheral inner side wall of the container 11253. In some embodiments, the peripheral outer side wall of the container 11253 is connected and fixed to the bracket 1123. In some embodiments, both the container 11253 and the magnetic conductive plate 11251 can be made of a magnetic conductive material (e.g., iron). In some embodiments, the peripheral side of the diaphragm 1121 can be connected to the bracket 1123 via a fixing ring 1155. In some embodiments, the fixing ring 1155 can be made of stainless steel or other metal materials to accommodate the processing and manufacturing process of the diaphragm 1121. Referring to Figure 8, the magnetic circuit assembly 1125 may include a magnetic conductive plate 11251, a magnet 11252, and a container 11253. Both the container 11253 and the magnetic conductive plate 11251 may be made of a magnetically conductive material (e.g., iron). In some embodiments, the container 11253 includes a bottom 11253a and a peripheral sidewall 11253b. The bottom 11253a and the sidewall 11253b of the container define a storage space within which the magnetic conductive plate 11251 and the magnet 11252 are stored. The magnetic conductive plate 11251 and the magnet 11252 are interconnected. The side of the magnet 11252 facing away from the magnetic conductive plate 11251 is mounted on the bottom 11253a of the container, and a gap is formed between the peripheral side of the magnet 11252 and the peripheral sidewall 11253b of the container 11253. In some embodiments, the coil 1122 can extend into the gap between the magnet 11252 and the sidewall 11253b.

[0079] In some embodiments, to ensure that at least a portion of the coil 1122 is located in a region of high magnetic flux density within the magnetic circuit assembly 1125 during the vertical vibration of the diaphragm 1121, thereby improving the magnetic field utilization efficiency of the magnetic circuit assembly 1125, the distance dd between the center point J of the coil 1122 and the center point K of the magnetic conductive plate 11251 is less than 0.3 mm in the vibration direction of the diaphragm 1121. For example, the center point J of the coil 1122 and the center point K of the magnetic conductive plate 11251 may be substantially co-level, so that the magnetic circuit assembly 1125 exerts a greater force on the coil 1122, thereby providing power for the vibration of the diaphragm 1121.

[0080] Referring to Figures 9 and 10, in some embodiments, the diaphragm 1121 may include a main body region 11211 and a surround region 11212 disposed around the main body region 11211. In some embodiments, the main body region 11211 includes a first inclined section 11211a and a first connecting section 11211b connected to the coil 1122. As shown in Figure 9, the first connecting section 11211b is used to connect to the coil 1122. The first connecting section 11211b is arranged parallel to the short axis Z and perpendicular to the vibration direction of the diaphragm. The first inclined section 11211a is aligned with a portion of the surround region 11212. In some embodiments, the first inclined section 11211a is tilted relative to the first connecting section 11211b in a direction away from the coil 1122. As shown in Figures 9 and 10, the coil 1122 is located below the first connecting section 11211b, and the first inclined section 11211a is tilted upward (i.e., away from the coil 1122) relative to the first connecting section 11211b. The above arrangement can prevent the glue used for bonding the coil 1122 to the diaphragm 1121 from overflowing into the rim area 11212 , causing the glue to corrode the rim area 11212 and affect the vibration performance of the diaphragm 1121 .

[0081] In some embodiments, the magnetic circuit system 1125 primarily comprises a magnetic conductive plate 11251, a magnet 11252, and a container 11253. The magnetic conductive plate 11251 and magnet 11252 are interconnected. The side of the magnet 11252 facing away from the magnetic conductive plate 11251 is mounted on the bottom wall of the container 11253, and a gap is defined between the periphery of the magnet 11252 and the inner periphery of the container 11253. The coil 1122 can extend into the gap between the magnet 11252 and the container 11253. If the distance between the coil 1122 and the sidewall of the container 11253 is too large, the coil will not be located in the area with high magnetic flux density of the magnetic circuit assembly 1125, thereby reducing the power provided by the magnetic circuit assembly 1125 to the diaphragm 1121. If the distance is too small, the coil 1121 may collide with the container 11253. Therefore, to avoid collisions with coil 1121 and ensure that the magnetic field provides sufficient power to diaphragm 1121, in some embodiments, within the aforementioned gap, the distance wt between coil 1122 and the sidewalls of magnet 11252 can be 0.1 mm to 0.25 mm, and the distance ww between coil 1122 and the inner circumferential wall of container 11253 can be 0.1 mm to 0.5 mm. In some embodiments, the distance wt between coil 1122 and the sidewalls of magnet 11252 can be 0.12 mm to 0.24 mm, and the distance ww between coil 1122 and the inner circumferential wall of container 11253 can be 0.15 mm to 0.3 mm. In some embodiments, within the aforementioned gap, the distance wt between coil 1122 and the sidewalls of magnet 11252 can be 0.17 mm to 0.21 mm, and the distance ww between coil 1122 and the inner circumferential wall of container 11253 can be 0.19 mm to 0.23 mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 can be 0.2 mm, and the distance ww between the coil 1122 and the inner circumferential wall of the container 11253 can be 0.2 mm. If the distance h3 between the coil 1122 and the bottom 11253a of the container 11253 is too large, the volume of the entire sound-emitting portion 11 increases. If the distance h3 between the coil 1122 and the bottom 11253a of the container 11253 is too small along the vibration direction of the diaphragm 1121, there is a risk that the coil 1121 will collide with the container 11253. Therefore, to prevent the sound-emitting portion 11 from being too large and to prevent the coil 1121 from colliding, in some embodiments, the distance h3 between the coil 1122 and the bottom 11253a of the container 11253 (i.e., the distance between the end of the coil 1122 away from the diaphragm 1121 and the bottom wall of the container 11253) can be 0.2 mm to 4 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the receiving member 11253 can be 0.6 mm-3 mm.In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the container 11253 may be 1 mm to 2 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the container 11253 may be 1.4 mm to 1.6 mm.

[0082] In some embodiments, by designing the inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b, the relative position of the coil 1122 and the magnetic circuit assembly 1125 can be changed, thereby making the thrust applied to the coil 1122 substantially consistent, thereby adjusting the low-frequency distortion of the sound-emitting portion 11 and enhancing the low-frequency listening experience. Furthermore, by designing the inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b, it is also possible to prevent glue from overflowing from the coil 1122 onto the fold area 11212, thereby preventing corrosion of the fold area 11212 and affecting the vibration of the fold area 11212. The inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b refers to the angle between the first inclined section 11211a and the line containing the first connecting section 11211b in a direction away from the first connecting section 11211b, as shown in FIG. 10 .

[0083] In some embodiments, to reduce distortion of the sound-emitting portion 11 and avoid corrosion of the fold area 11212 and affecting the vibration of the fold area 11212, the inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b can be in the range of 5°-30°. In some embodiments, to further reduce distortion of the sound-emitting portion 11, the inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b can be in the range of 10°-25°. For example, the inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b can be 15°. For another example, the inclination angle β of the first inclined section 11211a relative to the first connecting section 11211b can be 22°.

[0084] In some embodiments, the minimum distance between the coil 1122 and the first inclined section 11212a is not less than 0.3 mm, that is, the distance between the connection point between the first inclined section 11212a and the first connecting section 11211b and the connection area between the coil 1122 and the first connecting section 11211b is not less than 0.3 mm, so that the folding ring area 11212 and the installation position of the coil 1122 maintain a safe distance to prevent the glue used to install the coil 1122 from overflowing into the folding ring area 11212.

[0085] In some embodiments, the fold area 11212 includes a second inclined section 11212a, which at least partially aligns with the first inclined section 11211a. The main body area 11211 and the fold area 11212 are connected via the first inclined section 11211a and the second inclined section 11212a. In some embodiments, to simplify the mounting process, the first inclined section 11211a and the second inclined section 11212a can be connected using glue. In some embodiments, to achieve the connection between the main body area 11211 and the fold area 11212, the second inclined section 11212a can be positioned on a side of the first inclined section 11211a closer to the coil 1122. In some embodiments, in order to achieve the connection between the main body area 11211 and the folding ring area 11212, and at the same time to further reduce the degree of corrosion of the folding ring area 11212 by the glue when the coil 1122 is bonded, the second inclined section 11212a can be arranged on the side of the first inclined section 11211a away from the coil 1122.

[0086] Since the vibration amplitude of the diaphragm 1121 is large at low frequencies, if the surround region 11212 adopts a planar structure, its deformation ability is poor, thus affecting the vibration amplitude of the diaphragm 1121. Therefore, to improve the deformation ability of the diaphragm 1121, in some embodiments, the surround region 11212 may include an arc segment 11212c.

[0087] In some embodiments, the ratio of the height h1 of the arc segment 11212c to the span w1 can affect the deformability of the arc segment 11212c. The height of the arc segment 11212c refers to the distance between the highest point of the arc segment 11212c and the lowest point of the arc segment in the vibration direction of the diaphragm 1121. As shown in FIG10 , the height of the arc segment 11212c is recorded as h1. The span of the arc segment 11212c refers to the maximum distance between the two upper points of the arc segment 11212c. As shown in FIG10 , the span of the arc segment 11212c is recorded as w1. If the ratio of the height h1 of the arc segment 11212c to the span w1 is too small, the convexity of the arc segment 11212c is too small, the shape may be close to a planar structure, and the deformability is poor. If the ratio of the height h1 of the arc segment 11212c to its span w1 is too large, the arc segment 11212c protrudes too much, significantly hindering the vibration of the diaphragm 1121, thus affecting the output of the sound-emitting portion 11. Therefore, in some embodiments, to ensure better output and lower distortion of the sound-emitting portion 11, the ratio of the height h1 of the arc segment 11212c to its span w1 can be within a range of 0.35-0.4. In some embodiments, to further improve the output of the sound-emitting portion 11, the ratio of the height h1 of the arc segment 11212c to its span w1 can be within a range of 0.36-0.39. In some embodiments, to further reduce distortion of the sound-emitting portion 11, the ratio of the height h1 of the arc segment 11212c to its span w1 can be within a range of 0.37-0.38. For example, the ratio of the height h1 of the arc segment 11212c to its span w1 can be 0.38.

[0088] In some embodiments, the height h1 of the arc segment 11212c can be in the range of 0.5 mm to 0.7 mm. For example, the height h1 of the arc segment 11212c can be in the range of 0.55 mm to 0.65 mm. In some embodiments, the height h1 of the arc segment 11212c can be 0.6 mm. Taking into account the tolerance dimension, in some embodiments, the height h1 of the arc segment 11212c can be 0.6 mm ± 0.05 mm. In some embodiments, the span (width) w2 of the arc segment 11212c of the bend area 11212 can be less than twice the radius of curvature r1. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the bend area 11212 can be in the range of 0.7 mm to 0.9 mm. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the bend area 11212 can be in the range of 0.75 mm to 0.88 mm. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the bend region 11212 may be 0.8 mm to 0.83 mm. In some embodiments, the span w1 of the arc segment 11212c of the bend region 11212 may be 1.2 mm to 1.7 mm. In some embodiments, the span w1 of the arc segment 11212c of the bend region 11212 may be 1.3 mm to 1.65 mm. In some embodiments, the span w1 of the arc segment 11212c of the bend region 11212 may be 1.5 mm to 1.6 mm. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the bend region 11212 may be 0.82 mm, and the span w1 of the arc segment 11212c of the bend region 11212 may be 1.58 mm. Taking into account the error size, in some embodiments, the curvature radius r1 of the arc segment 11212c of the fold area 11212 can be 0.82mm±0.05mm, and the span w1 of the arc segment 11212c of the fold area 11212 can be 1.58mm±0.1mm.

[0089] In some embodiments, the surround region 11212 may also include a wavy structure composed of multiple arc segments 11212c, where any two adjacent arc segments 11212c face opposite directions. This wavy structure can ensure that the degree of obstruction to the upward and downward vibrations of the diaphragm 1121 is as symmetrical as possible, reducing distortion in the sound-emitting portion 11 and improving the low-frequency output of the sound-emitting portion 11. In some embodiments, the height-to-span ratio of each arc segment 11212c in the multiple arc segments 11212c can be consistent with the height-to-span ratio of the single arc segment 11212c described above. In some embodiments, the height-to-span ratio of each arc segment 11212c in the multiple arc segments 11212c can differ. For example, along the radial direction of the diaphragm 1121, the height of each arc segment 11212c in the multiple arc segments 11212c can gradually decrease from the center to the edge of the diaphragm 1121, while each arc segment 11212c has the same span.

[0090] To constrain the diaphragm 1121 during high-amplitude vibrations and prevent the coil 1122 from colliding with the magnetic circuit assembly 1125, in some embodiments, the main body region 11211 may include a domed dome 11211c located at the end of the first connecting section 11211b away from the first inclined section 11211a. The dome 11211c and the arcuate section 11212c arch in the same direction, that is, the dome 11211c protrudes toward the side away from the coil 1122. The dome 11211c prevents the diaphragm 1121 from shaking during high-amplitude vibrations, ensuring that the coil 1122 and the magnetic assembly 1125 do not collide. Furthermore, the dome 11211c also has high strength and rigidity, which, to a certain extent, suppresses the split vibration of the main body region 11211, thereby improving the high-frequency vibration characteristics of the transducer 112. In the absence of a front cover, the dome aspect ratio (i.e., the ratio of height to span) increases, and the high-frequency bandwidth increases, but an excessively high dome aspect ratio will result in increased unevenness and an increase in overall size.

[0091] In some embodiments, the height h2 of dome 11211c is related to the dimension of dome 11211c in the direction in which the arch extends (i.e., the span dimension w2). The height of dome 11211c refers to the distance between the highest point of dome 11211c and the lowest point of dome 11211c (i.e., the endpoint connected to first connecting section 11211b) in the vibration direction of diaphragm 1121. As shown in FIG10 , the height of dome 11211c is h2. The span of dome 11211c refers to the maximum distance between the two upper points of dome 11211c. As shown in FIG10 , the span of dome 11211c is w2. The larger the span w2 of the dome 11211c, the larger the height h2 of the dome 11211c will be in order to maintain the arched structure of the dome 11211c (for example, so that the curvature corresponding to the dome 11211c remains within a preset curvature range), which may cause the overall thickness of the transducer 112 to be too large. Taking into account the overall thickness and structural design of the transducer 112, in some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 may be 0.5263 rad-3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 may be 0.7869 rad-3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 may be 1.0526 rad-3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 may be 1.5789 rad-3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 may be 2.1053 rad-3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 may be 2.6316 rad-3.1416 rad. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 2 mm-8 mm. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 3 mm-7 mm. In some embodiments, the width dimension w2 of the dome 11211c of the main body region 11211 may be 4 mm-6 mm. In some embodiments, the width w2 of the dome 11211c of the main body region 11211 can be 4.8 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 (i.e., the distance between the highest and lowest points of the dome 11211c in the direction of diaphragm vibration) can range from 0.7 mm to 1.2 mm.In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 0.9 mm to 1.1 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 1 mm to 1.05 mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 may be 0.8 mm. In some embodiments, due to manufacturing errors, the height h2 of the dome 11211c of the main body region 11211 may be 0.8 mm ± 0.08 mm.

[0092] In some embodiments, the ratio of the height h2 of dome 11211c to its span w2 may affect the overall size of the sound-emitting portion 11 and the vibration of the diaphragm 1121. If the ratio is too small, the dome 11211c is too slightly raised, and its shape is close to a planar structure. The strength and rigidity of the dome 11211c are low, and the dome 11211c is prone to split vibration, resulting in more peaks and valleys in the high-frequency region, affecting the high-frequency vibration characteristics of the transducer 112. If the ratio is too large, the dome 11211c is too raised, and the overall thickness of the transducer 112 may be excessive, increasing unevenness and overall size. Therefore, to ensure that the entire sound-emitting portion 11 has an appropriate thickness and improve the high-frequency vibration characteristics of the sound-emitting portion 11, the ratio of the height h2 of the dome 11211c to the span w2 can be within a range of 0.1-0.6. In some embodiments, to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 of the dome 11211c to the span w2 can be within a range of 0.1-0.4. In some embodiments, to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 of the dome 11211c to the span w2 can be within a range of 0.1-0.3.

[0093] In some embodiments, taking into account the structural strength, process implementation difficulty, and overall thickness limitations of the sound-emitting portion 11, while also ensuring the maximum amplitude of the diaphragm 1121 so that the diaphragm 1121 does not collide with the magnetic plate 11251 during vibration, the distance between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic plate 11251 in the magnetic circuit assembly 1125 in the vibration direction of the diaphragm (the distance hd shown in FIG9 ) can be greater than 0.8 mm. In some embodiments, the distance hd between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic plate 11251 in the magnetic circuit assembly 1125 can be 0.85 mm to 0.95 mm, i.e., 0.9 mm ± 0.05 mm. Here, 0.9 mm is the structural dimension, and 0.05 mm is the error range dimension. In some embodiments, the distance hd between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic conductive plate 11251 in the magnetic circuit system 1125 can be 0.86 mm to 0.93 mm. In some embodiments, the distance hd between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic conductive plate 11251 in the magnetic circuit system 1125 can be 0.88 mm to 0.92 mm.

[0094] FIG11A is a schematic diagram of an exemplary high-frequency bandwidth of a sound-emitting portion according to some embodiments of this specification. As shown in FIG11A , in the frequency response curve of the sound-emitting portion 11, there is a first inflection point f0 in the low-frequency region, which is approximately around 300 Hz. f0 is related to the hardness and softness of the surround area 11212 of the diaphragm 1121 and the vibration weight (mainly the weight of the main body area 11211). The second inflection point f h is around 25kHz, f h It can be determined based on the overall trend of the frequency response curve. h =25kHz, the curve has a small local peak, but the overall trend is downward. h The peak values ​​of the frequency band between 300Hz and 25kHz are averaged to form the first reference line L. m , as shown in the upper straight line in Figure 11A, the reference straight line drops 10dB to form the second straight line L n (The lower straight line in FIG. 11A ) is the selected bandwidth of 100 Hz-45 kHz.

[0095] In some embodiments, the frequency of the high-frequency split vibration of the diaphragm 1121 is proportional to E / ρ. Here, E is the Young's modulus of the diaphragm 1121, and ρ is the equivalent density of the diaphragm 1121. Therefore, E / ρ can determine the high-frequency bandwidth. When E is constant, the smaller the mass of the diaphragm 1121, the smaller the equivalent density ρ of the diaphragm 1121, the larger E / ρ, and the wider the high-frequency bandwidth. When ρ is constant, the larger the Young's modulus E of the diaphragm 1121, the larger E / ρ, the higher the high-frequency split vibration frequency of the diaphragm 1121, and the wider the high-frequency bandwidth.

[0096] In some embodiments, the high frequency segmented vibration region of the sound-emitting portion 11 refers to the region where the frequency response curve reaches the highest peak and the frequency response drops sharply and alternately shows peaks and valleys. As shown in FIG11A , the frequency response curve reaches the highest peak (i.e., f h The corresponding sound pressure level) after the frequency response drops sharply and the peak and valley values ​​appear alternately. h The area on the right is the high-frequency segmentation vibration area. The frequency at which the corresponding curve reaches its highest peak is the frequency at which high-frequency segmentation vibration occurs (as shown in FIG11A ). h ). In some embodiments, in order to avoid large differences in vibrations between different parts of the main body area 11211, resulting in poor high-frequency effects, the frequency of the high-frequency segmentation vibration of the main body area 11211 (dome 11211c) can be designed so that the diaphragm 1121 has a wider high-frequency bandwidth while reducing the occurrence of high-frequency segmentation vibrations within the bandwidth area. In some embodiments, the frequency of the high-frequency segmentation vibration of the dome 11211c can be no less than 20kHz. For example, the frequency of the high-frequency segmentation vibration of the dome 11211c can be no less than 25kHz. In some embodiments, in order to ensure that the output of the main body area 11211 within the effective frequency band is high, the mass of the main body area 11211 needs to be small to reduce the difficulty of vibration of the main body area 11211 within the effective frequency band. Therefore, the material of the main body area 11211 can be selected from materials and structures with lower density and higher strength. Therefore, the Young's modulus of the dome 11211c can be no less than 6GPa. In some embodiments, the Young's modulus of the dome 11211c can be in the range of 6GPa-7GPa. For example, the Young's modulus of the spherical top 11211c may be 6.5 GPa. The Young's modulus of the spherical top 11211c may be measured by a static method or a dynamic method (eg, a pulse excitation method, an acoustic resonance method, a sound velocity method, etc.).

[0097] In some embodiments, the main body area 11211 can be made of carbon fiber material. Figure 11B is a schematic diagram of the weaving structure of exemplary carbon fibers shown in some embodiments of this specification. Carbon fiber materials have low density and high strength, which is beneficial for weakening the high-order modes of the speaker 112. In some embodiments, in order to further increase the strength of the main body area 11211 and reduce the equivalent density of the main body area 11211, the main body area 11211 can be formed by interlacing carbon fibers, and at least some of the carbon fibers are interlaced at a first angle. In some embodiments, the first angle is in the range of 45°-90°. For example, the weaving of multiple independent carbon fibers can be interlaced at any angle such as 45°, 60°, 90°, etc. As shown in Figure 11B, multiple carbon fibers 112111 and multiple 112112 can be interlaced at an angle close to 90°. In some embodiments, because the carbon fibers are very thin, multiple carbon fibers 112111 and multiple 112112 can be laid at an angle close to 90° and connected by gluing. In some embodiments, the main body area 11211 may include a structure of interlaced weaving of multiple layers (e.g., 2 layers, 3 layers, etc.) of carbon fibers. In order to facilitate the interlaced weaving of carbon fibers, in some embodiments, the length of a single carbon fiber is not less than 5 mm. In some embodiments, the length of a single carbon fiber may be in the range of 5 mm to 10 mm. For example, the length of a single carbon fiber may be 7 mm. Because a single carbon fiber is too thin, it is difficult to weave them one by one and it is not easy to achieve. In some embodiments, multiple carbon fibers may be laid and connected together (e.g., by gluing, etc.) to form multiple groups of carbon fibers, which are interlaced in warp and weft.

[0098] In some embodiments, to reduce the weight of the main body region 11211, the thickness of the main body region 11211, which utilizes a super-aligned carbon fiber structure, can be designed to achieve a selected high-frequency bandwidth. In some embodiments, the thickness of the main body region 11211 can be less than 80 μm. In some embodiments, the thickness of the main body region 11211 can be in the range of 10 μm to 60 μm. In some embodiments, the thickness of the main body region 11211 can be 25 μm.

[0099] FIG12 is a schematic diagram of the amplitude of the sound-emitting part under different driving voltages shown in some embodiments of the present specification. As shown in FIG12 , under the same voltage, the diaphragm 1121 of the transducer 112 vibrates in two opposite directions (the positive and negative directions of the thickness direction X as shown in FIG6 , i.e., the positive and negative directions of the vertical axis in FIG12 ) with different amplitudes, which is due to the asymmetry of the diaphragm 1121. In FIG12 , the unit Vrms represents the effective voltage value of the sinusoidal AC signal. For example, 0.7 Vrms represents the effective voltage value of the input sinusoidal AC signal of 0.7 V. As shown in FIG12 , when the input voltage is in the range of 0.4 V to 0.7 V, the amplitude of the downward (negative direction of the vertical axis) vibration of the diaphragm 1121 (about 0.8 mm) is greater than the amplitude of the upward (positive direction of the vertical axis) vibration (about 0.6 mm). The upward vibration of the diaphragm 1121 refers to the vibration of the diaphragm 1121 toward the front cavity 114, and the downward vibration of the diaphragm 1121 refers to the vibration of the diaphragm 1121 toward the rear cavity 116 (toward the magnetic circuit assembly 1125). As shown in FIG12 , as the input voltage continues to increase (for example, from 0.7V to 1V), the amplitude of the diaphragm 1121 gradually decreases and eventually approaches a threshold value, wherein the amplitude of the downward vibration of the diaphragm 1121 approaches a first threshold value (approximately 0.9mm), and the amplitude of the upward vibration approaches a second threshold value (approximately 0.8mm). Since the amplitude of the downward vibration of the diaphragm 1121 is greater than the amplitude of the upward vibration, the amplitude of the diaphragm 1121 appearing in this specification refers to the larger downward vibration amplitude of the diaphragm 1121. In some embodiments, to prevent the coil 1122 from colliding with the magnetic circuit assembly 1125 when the diaphragm 1121 vibrates, the maximum amplitude of the diaphragm 1121 can be limited to no more than 0.8 mm. That is, the amplitude of the diaphragm 1121 can be within the range of 0 mm to 0.8 mm. In some embodiments, the amplitude of the diaphragm 1121 can be within the range of 0 mm to 0.75 mm. In some embodiments, the amplitude of the diaphragm 1121 can be within the range of 0 mm to 0.7 mm.

[0100] In some embodiments, within an amplitude range of 0 mm to 0.8 mm, the difference in amplitude between the vibrations of the diaphragm 1121 in two opposite directions (i.e., upward vibration and downward vibration) may be less than 0.05 mm, thereby reducing the degree of distortion of the transducer 112. In some embodiments, to further reduce the degree of distortion of the transducer 112, the difference in amplitude between the vibrations of the diaphragm 1121 in two opposite directions (i.e., upward vibration and downward vibration) may be less than 0.04 mm. In some embodiments, to further reduce the degree of distortion of the transducer 112, the difference in amplitude between the vibrations of the diaphragm 1121 in two opposite directions (i.e., upward vibration and downward vibration) may be less than 0.03 mm.

[0101] Referring to Figures 8 and 9, in some embodiments, the bracket 1123 is disposed around the magnetic circuit assembly 1125. As shown in Figure 9, along the vibration direction of the diaphragm, the bracket 1123 may include a first portion 112311, a second portion 11232, and a third portion 11233. The first portion 112311 refers to the portion along the vibration direction of the diaphragm 1121, extending from the highest point D of the region where the bracket 1123 connects to the diaphragm 1121 to the highest point of the region where the bracket 1123 connects to the container 11253. The second portion 11232 refers to the region of the bracket 1123 where the vent is provided. As shown in Figure 9, the second portion 11232 refers to the portion along the vibration direction of the diaphragm 1121, extending from the highest point of the region where the bracket 1123 connects to the container 11253 to the sidewall of the bracket 1123 where the bottom of the vent is located (i.e., facing the bottom 11253a of the container 11253). The third portion 11233 refers to the portion between the side wall where the bottom of the air vent on the bracket 1123 is located and the bottom of the bracket 1123 near the magnetic circuit assembly 1125 (i.e., near the bottom 11253a of the container 11253). As shown in Figure 10, a second connecting segment 11212b is provided on the end of the folding ring area 11212 away from the main body area 11211 for connecting the bracket 1123. The second connecting segment 11212b is arranged parallel to the short axis direction Z and perpendicular to the vibration direction of the diaphragm. In some embodiments, the first portion 112311 of the bracket 1123 is connected to the second connecting segment 11212b of the folding ring area 11212. In some embodiments, the second connecting segment 11212b of the folding ring area 11212 is connected to the first portion 112311 of the bracket 1123 via a fixing ring 1155 to achieve fixation of the diaphragm 1121 and the bracket 1123.

[0102] FIG13 is an exemplary structural diagram of a portion of the rear cavity structure according to some embodiments of this specification. Referring to FIG6 and FIG13 , in some embodiments, a connecting frame 115 may be provided within the housing 111. A second acoustic cavity may be formed between the connecting frame 115 and the bracket 1123 of the transducer 112. The second acoustic cavity may serve as the rear cavity 116. The rear cavity 116 is separated from other structures within the housing 111 (e.g., the main control circuit board), which helps improve the acoustic performance of the sound-emitting portion 11. The housing 111 is provided with pressure relief holes (e.g., a first pressure relief hole 111c and / or a second pressure relief hole 111d). The connecting frame 115 is provided with an acoustic channel 1151 connecting the pressure relief holes and the rear cavity 116. This facilitates communication between the rear cavity 116 and the external environment, allowing air to freely flow in and out of the rear cavity 116, thereby reducing the resistance experienced by the diaphragm 1121 of the transducer 112 during vibration.

[0103] In some embodiments, the cross-section of the rear cavity 116 can be composed of two perpendicular sides and a curved side. By connecting the two endpoints of the curved side, the cross-section (for example, cross-section ABC) can be approximately regarded as a triangle. Among them, the hypotenuse AC is formed by the line connecting the two endpoints formed by the contact between the curved surface formed on the connecting frame 115 and the two straight sides of the bracket 1123. In some embodiments, the thickness h4 of the first part 112311 of the bracket 1123 along the vibration direction of the diaphragm 1121 can affect the volume of the rear cavity 116. When the thickness h4 of the first part 112311 increases, the volume of the rear cavity 116 decreases while the volume of the entire sound-emitting part 11 remains unchanged; accordingly, when the thickness h4 of the first part 112311 decreases, the volume of the rear cavity 116 increases. In some embodiments, the thickness of the first part 112311 of the bracket 1123 can affect the volume of the rear cavity 116, thereby affecting the resonant frequency of the rear cavity 116. In some embodiments, the rear cavity 116 may refer to the cavity formed by the rear side of the diaphragm. At this time, the thickness h4 of the first part 112311 of the bracket 1123 increases, and the volume of the rear cavity 116 increases while the volume of the entire sound-emitting part 11 remains unchanged; correspondingly, the thickness h4 of the first part 112311 decreases, and the volume of the rear cavity 116 decreases.

[0104] In some embodiments, the combination of the rear cavity 116 and the pressure relief holes (e.g., the first pressure relief hole 111c and / or the second pressure relief hole 111d) provided on the shell 111 can be regarded as a Helmholtz resonance cavity model. In which, the rear cavity 116 can serve as the cavity of the Helmholtz resonance cavity model, and the pressure relief holes can serve as the neck of the Helmholtz resonance cavity model. At this time, the resonant frequency of the Helmholtz resonance cavity model is the resonant frequency f2 of the rear cavity 116. In the Helmholtz resonance cavity model, the volume of the cavity (e.g., the rear cavity 116) can affect the resonant frequency f of the cavity (e.g., the rear cavity 116). The specific relationship is shown in formula (1):

[0105] Wherein, c represents the speed of sound, S represents the cross-sectional area of ​​the neck (eg, the pressure relief hole), V represents the volume of the cavity (eg, the rear cavity 116 ), and L represents the depth of the neck (eg, the pressure relief hole).

[0106] It can be seen from formula (1) that when the cross-sectional area S and the depth L of the pressure relief hole (for example, the first pressure relief hole 111c and / or the second pressure relief hole 111d) remain unchanged, the volume of the rear cavity 116 increases, and the resonant frequency f2 of the rear cavity 116 decreases, that is, moves toward a lower frequency.

[0107] Figure 14 is a graph showing the frequency response of the rear cavity corresponding to different thicknesses of the first portion 112311, as shown in some embodiments of this specification. As shown in Figure 14, as the thickness h4 of the first portion 112311 of the bracket 1123 gradually increases from 0.3 mm to 3 mm, the volume of the rear cavity 116 gradually increases, and the resonance peak of the rear cavity 116 gradually shifts toward lower frequencies, reducing the flatness of the frequency response curve and affecting the output performance of the sound-emitting portion 11.

[0108] If the thickness h4 of first portion 112311 is too small, the vibration amplitude of diaphragm 1121 will be limited by bracket 1123. If the thickness h4 of first portion 112311 is too large, the overall size of sound-producing portion 11 will be too large, and the resonance peak of rear cavity 116 will shift toward lower frequencies, reducing the flat region of the frequency response curve of rear cavity 116 and affecting the sound quality of sound-producing portion 11. The thickness of first portion 112311 refers to the minimum distance between the connection area between bracket 1123 and surround area 11212 and the area directly contacting magnetic circuit assembly 1125 in the vibration direction of diaphragm 1121.

[0109] In some embodiments, to ensure that the sound-emitting portion 112 has a higher low-frequency output and that the frequency response curve of the rear cavity 116 has a relatively wide flat region, the thickness h4 of the first portion 112311 of the bracket 1123 can be in the range of 0.3 mm to 3 mm. In some embodiments, to further improve the low-frequency output of the transducer 112, the thickness h4 of the first portion 112311 can be in the range of 0.5 mm to 2 mm. In some embodiments, to further increase the flat region of the frequency response curve of the rear cavity 116, the thickness h4 of the first portion 112311 can be in the range of 0.8 mm to 1 mm. In some embodiments, the thickness h4 of the first portion 112311 can be 0.9 mm. In this case, the resonance peak of the rear cavity 116 is around 6.1 kHz, the sound-emitting portion 112 has a relatively good low-frequency output, and the frequency response curve of the rear cavity 116 has a relatively wide flat region.

[0110] In some embodiments, the weight of the transducer 112 is mainly related to the bracket 1123 and the magnetic circuit assembly 1125, wherein the weight of the magnetic circuit assembly 1125 accounts for a relatively large proportion. In some embodiments, the weight of the bracket 1123 increases, and when the material of the bracket 1123 remains unchanged, the size of the bracket 1123 increases, which can correspond to an increase in the area of ​​the diaphragm 1121. In some embodiments, the increase in the weight of the magnetic circuit assembly 1125 increases the magnetic induction intensity near the coil 1122, and increases the driving force generated on the coil, thereby increasing the vibration amplitude of the diaphragm 1121, and making the transducer 112 have higher sensitivity and better low-frequency effect. However, if the weight of the transducer 112 is too large, the weight of the sound-emitting part 11 will be too large, affecting the wearing stability and comfort of the open earphones 10.

[0111] Taking into account the two wearing conditions described above, namely, the sound-emitting portion 11 at least partially covering the antihelix region as shown in FIG3 and the sound-emitting portion 11 extending entirely or partially into the concha cavity as shown in FIG4 , the volume audible to the ear 100 is increased (equivalent to higher sound production efficiency). Therefore, the weight of the transducer 112 can be reduced by reducing the size of the diaphragm 1121 or the weight of the magnetic circuit assembly 1125. This allows the transducer 112 to have higher sensitivity and low-frequency output while also providing greater wearing stability and comfort for the open-ear headphone 10. In some embodiments, the weight of the transducer 112 can be in the range of 1.1g-3.3g. In some embodiments, to further improve the sensitivity and low-frequency output of the transducer 112, the weight of the transducer 112 can be in the range of 1.5g-3g. In some embodiments, to further improve the wearing stability and comfort of the open-ear headphone 10, the weight of the transducer 112 can be in the range of 2g-2.5g. In some embodiments, the weight of the transducer 112 can be 2.2g.

[0112] FIG15 is a frequency response curve diagram of the sound-emitting part under different driving voltages according to some embodiments of the present specification. The diaphragm surface of the speaker 112 is facing the test microphone at a distance of 4 mm, and a voltage in the range of 0.1V-0.7V is applied to the speaker 112. The test frequency range is set to 20Hz-20000Hz to obtain the frequency response curve of the speaker 112 under different driving voltages (as shown in FIG15 ). Combining FIG12 and FIG15 , when the input voltage is in the range of 0.1V-0.7V and the frequency is in the range of 20Hz-6.1kHz, the amplitude of the diaphragm 1121 is in the range of 0mm-0.8mm. At this time, in order to prevent the vibration of the coil 1122 from contacting the bottom 11253a of the container, the distance h3 (as shown in FIG9 ) between the bottom of the coil 1122 and the bottom 11253a of the container can be greater than 0.8mm. In some embodiments, to reduce the size of the sound-emitting portion 11 and improve user comfort, the distance h3 (as shown in FIG9 ) between the bottom of the coil 1122 and the bottom 11253a of the container can be no more than 0.9 mm. Therefore, at an input voltage of 0.1V-0.7V and within a range of 20Hz-6.1kHz, the distance h3 (as shown in FIG9 ) between the bottom of the coil 1122 and the bottom 11253a of the container can be within a range of 0.8mm-0.9mm.

[0113] As shown in Figure 15 , as the input voltage gradually increases from 100mV to 700mV, the output of the sound-emitting portion 11 gradually increases, and its sensitivity gradually increases, but the resonant peak frequency remains essentially unchanged at approximately 6.1kHz. Considering the two wearing conditions (Figure 3 ), where the sound-emitting portion 11 at least partially covers the antihelix area, and Figure 4 , where the sound-emitting portion 11 extends entirely or partially into the concha cavity, the sound-emitting portion 11 exhibits higher sensitivity by controlling the distance h3 (as shown in Figure 9 ) between the bottom of the coil 1122 and the bottom of the receiving member 11253a within the range of 0.8mm-0.9mm. As shown in Figure 15 , when the input voltage is between 100mV and 700mV, the sound pressure level (SPL) of the sound-emitting portion 11 at a frequency of 1kHz is within the range of 85dB-103dB.

[0114] In some embodiments, as previously mentioned, the thickness h4 of the first portion 112311 of the bracket 1123 is within the range of 0.3 mm to 3 mm. When the thickness h4 of the first portion 112311 increases to 3 mm, the corresponding resonant frequency f2 of the rear cavity 116 decreases to 3.3 kHz, reducing the flat zone and affecting the sound quality. In some embodiments, to increase the flat zone and improve the sound quality of the sound-emitting portion 11, the thickness h4 of the first portion 112311 can be less than 3 mm, and the resonant frequency f2 of the rear cavity 116 can be no less than 3.3 kHz. In some embodiments, to further improve the sound quality of the sound-emitting portion 11, the resonant frequency f2 of the rear cavity 116 can be no less than 3.5 kHz. In some embodiments, to further improve the sound quality of the sound-emitting portion 11, the resonant frequency f2 of the rear cavity 116 can be no less than 4 kHz. In some embodiments, to further improve the sound quality of the sound-emitting portion 11, the resonant frequency f2 of the rear cavity 116 can be no less than 6 kHz.

[0115] In some embodiments, according to formula (1), the volume of the rear cavity 116 can affect the resonant frequency f2 of the rear cavity 116. The volume of the rear cavity 116 is affected by the thickness h4 of the first portion 112311 of the bracket 1123. The value range of the volume of the rear cavity 116 can be determined by the value range of the thickness h4 of the first portion 112311 and the value range of the resonant frequency f2 of the rear cavity 116. In some embodiments, the volume of the rear cavity 116 can be 60 mm 3 -110mm 3 .

[0116] Figure 16 is a schematic diagram illustrating exemplary locations of a bracket, first pressure relief holes, and second pressure relief holes, according to some embodiments of this specification. As shown in Figure 16 , in some embodiments, bracket 1123 is provided with a plurality of air holes 11231. The provision of air holes 11231 allows sound from the back of diaphragm 1121 to be transmitted through the plurality of air holes 11231 to rear cavity 116 and the pressure relief holes, and then to the outside world, providing a good channel for sound radiation on both sides of diaphragm 1121.

[0117] In some embodiments, to better balance the airflow and balance the air pressure within the rear cavity 116, the multiple air holes 11231 can be designed asymmetrically. For example, with the short axis of the bracket 1123 as the center, the multiple air holes 11231 can be arranged asymmetrically. Specifically, the bracket 1123 is provided with a first air hole 11231a and a second air hole 11231b. As shown in FIG16 , the distance La between the center of the first air hole 11231a and the center of the second pressure relief hole 111d is greater than the distance Lb between the center of the second air hole 11231b and the center of the second pressure relief hole 111d. In some embodiments, the air pressure in the rear cavity 116 is higher at a location farther from the second pressure relief hole 111d. Therefore, in order to balance the air pressure within the rear cavity 116, the area of ​​the first air hole 11231a is greater than the area of ​​the second air hole 11231b. In other words, to balance the air pressure within the rear cavity 116, the area of ​​the vent holes closer to the second pressure relief hole 111d (or first pressure relief hole 111c) is smaller, while the area of ​​the vent holes farther from the second pressure relief hole 111d (or first pressure relief hole 111c) is larger. The distance between the vent hole 11231 and the pressure relief hole refers to the distance between the center of the vent hole 11231 and the center of the corresponding pressure relief hole. In this specification, the center of the vent hole or pressure relief hole refers to the geometric center of the hole-like structure.

[0118] In the rear cavity 116, at locations farther from the first pressure relief hole 111c and / or the second pressure relief hole 111d, the air pressure is relatively high, so the area of ​​the air vent 11231 can be set larger; at locations closer to the first pressure relief hole 111c and / or the second pressure relief hole 111d, the air pressure is lower, so the area of ​​the air vent 11231 can be set smaller. If the areas of multiple air vents 11231 are the same, the air pressure is higher at locations farther from the first pressure relief hole 111c and / or the second pressure relief hole 111d in the rear cavity 116. Since the area of ​​the air vent 11231 at this location is smaller, the air pressure in the rear cavity 116 cannot be well balanced, resulting in greater air resistance at this location when the diaphragm 1121 vibrates. Similarly, at locations closer to the first pressure relief hole 111c and / or the second pressure relief hole 111d in the rear cavity 116, the resistance encountered by the diaphragm 1121 during vibration is smaller. This results in uneven force on the diaphragm 1121, causing unstable vibration of the diaphragm 1121. Therefore, by adjusting the area of ​​the air holes 11231, the low-frequency vibration of the sound-emitting part 11 can be made more stable.

[0119] In some embodiments, because the air holes 11231 can balance the air pressure within the rear cavity 116 and influence the uniformity of the air resistance experienced by the diaphragm 1121 during vibration, the total area of ​​the air holes 11231 can affect the output performance of the sound-emitting portion 11. Furthermore, the ratio of the total area of ​​the multiple air holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction can influence the air resistance experienced by the diaphragm 1121 during vibration. If the ratio of the total area of ​​the multiple air holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction is too small, the air pressure within the rear cavity 116 will be high, resulting in greater air resistance experienced by the diaphragm 1121 during vibration, thus affecting the low-frequency output performance of the diaphragm 1121. When the ratio of the total area of ​​the multiple air holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction reaches a certain threshold, increasing this ratio will reduce the effect of the air within the rear cavity 116 on the vibration of the diaphragm 1121, while also affecting the structural strength of the bracket. Therefore, in some embodiments, in order to ensure that the diaphragm 1121 is subjected to uniform and small air resistance during vibration, thereby ensuring good output performance of the sound-emitting portion 11, the ratio of the total area of ​​the plurality of air holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction may be in the range of 0.008-0.3. In some embodiments, in order to further reduce the air resistance encountered by the diaphragm 1121 during vibration, the ratio of the total area of ​​the plurality of air holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction may be in the range of 0.1-0.25. In some embodiments, in order to further reduce the air resistance encountered by the diaphragm 1121 during vibration, the ratio of the total area of ​​the plurality of air holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction may be in the range of 0.11-0.23.

[0120] FIG17 is a frequency response curve of the rear cavity corresponding to different total areas of air holes according to some embodiments of this specification. Among them, the different total areas of the air holes 11231 can be achieved by plugging the air holes 11231 with plasticine. The diaphragm surface of the speaker 112 is facing the test microphone at a distance of 4mm, and a voltage of 0.4V is applied to the speaker 112. The test frequency range is set to 20Hz-20000Hz to obtain the frequency response curve of the speaker 112 at different air hole areas (as shown in FIG17). Among them, 0mm 2 It means that the vent holes 11231 are completely blocked, that is, there are no holes on the bracket. As shown in FIG17, as the total area of ​​the vent holes 11231 increases from 0 mm 2 Gradually increases to 4.54mm 2 , the frequency response curve of the rear cavity 116 gradually moves up in the low frequency (eg 100Hz-1000Hz) region, that is, the low frequency response of the rear cavity 116 gradually increases. 2Gradually increases to 12.96mm 2 During the process, the low frequency response of the rear cavity 116 does not change significantly. This is because when the total area of ​​the vent holes 11231 increases to a certain area (for example, 4.54mm 2 ), under low-frequency vibration, the influence of the air in the rear cavity 116 on the vibration of the diaphragm 1121 gradually weakens. Therefore, even if the total area of ​​the air holes 11231 is increased, the influence on the frequency response curve of the low-frequency region of the rear cavity 116 is not significant.

[0121] As shown in FIG17 , as the total area of ​​the vent holes 11231 increases from 0 mm 2 Gradually increases to 12.96mm 2 , the resonance peak of the rear cavity 116 gradually moves to high frequencies, and the frequency response curve in the low frequency region (e.g., 100 Hz-1000 Hz) gradually becomes flat. In some embodiments, in order to make the rear cavity 116 have a good low frequency response, the total area of ​​the sound-permeable holes 11231 can be 4.54 mm 2 -12.96mm 2 In some embodiments, in order to make the rear cavity 116 have a good low-frequency response, the total area of ​​the sound-permeable holes 11231 can be within 5mm 2 -11mm 2 In some embodiments, in order to make the rear cavity 116 have a good low-frequency response, the total area of ​​the sound-permeable holes 11231 can be within 7mm 2 -10mm 2 In some embodiments, in order to make the rear cavity 116 have a good low-frequency response, the total area of ​​the sound-permeable holes 11231 can be within 8mm 2 -10mm 2 within the range.

[0122] In some embodiments, to improve structural strength, the bracket 1123 may be provided with multiple ventilation holes 11231, with the connecting portions between the multiple ventilation holes 11231 forming reinforcing ribs. In some embodiments, while the total area of ​​the ventilation holes 11231 is sufficient, the number of ventilation holes 11231 may be set to only one to simplify the hole-forming process.

[0123] In some embodiments, multiple ventilation holes may be provided on the bottom 11253a or sidewall 11253b of the container 11253 of the magnetic circuit assembly 1125. Sound from the back of the diaphragm 1121 can be transmitted to the rear cavity 116 and the pressure relief holes through the multiple ventilation holes. The ventilation holes provide a good channel for sound radiation on both sides of the diaphragm 1121.

[0124] In some embodiments, the projected area of ​​the diaphragm 1121 in the vibration direction affects the amount of air displaced by the diaphragm 1121 during vibration, thereby affecting the efficiency of the diaphragm 1121 in producing sound and the acoustic output of the sound-emitting portion 11. If the projected area of ​​the diaphragm 1121 in the vibration direction is too small, the amount of air displaced by the diaphragm 1121 during vibration is small, resulting in poor acoustic output from the sound-emitting portion 11. If the projected area of ​​the diaphragm 1121 in the vibration direction is too large, the size of the bracket 1123 is too large, increasing the weight of the bracket 1123 and the weight of the sound-emitting portion 11. This affects the structure and weight of the sound-emitting portion 11, and thus affects wearing comfort and stability. Combining the two wearing conditions (as shown in FIG3 ) in which the sound-emitting portion 11 at least partially covers the antihelix area and as shown in FIG4 , in which the sound-emitting portion 11 extends entirely or partially into the concha cavity, the volume audible to the ear 100 is increased (equivalent to higher sound production efficiency), and therefore the size of the diaphragm 1121 does not need to be excessively large. In some embodiments, the sound outlet 111a is disposed on the side wall of the housing 111 of the sound-emitting portion 11, near the user's ear. The sound outlet 111a is disposed in front of the diaphragm 1121 and communicates with the front cavity 114. The vibration direction of the diaphragm 1121 is or is approximately equal to the thickness direction X of the sound-emitting portion 11. The projected area of ​​the diaphragm 1121 in the vibration direction is or is approximately equal to the projected area of ​​the diaphragm 1121 in the sagittal plane. The projected area of ​​the diaphragm 1121 in the vibration direction can affect the projected area of ​​the sound-emitting portion 11 in the user's sagittal plane. The overlap ratio between the projected area of ​​the sound-emitting portion 11 in the user's sagittal plane and the projected area of ​​the cavum concha in the sagittal plane can influence the cavity-like structure formed by the sound-emitting portion 11 extending into the cavum concha, thereby affecting the acoustic output of the sound-emitting portion 11. Furthermore, the major and minor axis dimensions of the diaphragm 1121 can influence the major and minor axis dimensions of the projected area of ​​the sound-emitting portion 11 in the sagittal plane.

[0125] In some embodiments, considering the two situations that the sound-emitting portion 11 shown in FIG3 at least partially covers the antihelix area and the sound-emitting portion 11 shown in FIG4 extends entirely or partially into the concha cavity, in order to ensure that the sound-emitting portion 11 has a good acoustic output and the projection of the sound-emitting portion 11 on the sagittal plane has an appropriate area or the sound-emitting portion 11 has an appropriate thickness, the projection area of ​​the diaphragm 1121 in the vibration direction can be 90 mm 2 -560mm 2 Preferably, the projection area of ​​the diaphragm 1121 in the vibration direction can be 120mm 2 -300mm 2 Preferably, the projection area of ​​the diaphragm 1121 in the vibration direction can be 150mm 2 -200mm 2 .

[0126] Taking into account the above-mentioned two situations, namely, that the sound-emitting portion 11 at least partially covers the antihelix region as shown in FIG3 and that the sound-emitting portion 11 extends entirely or partially into the cavum concha as shown in FIG4 , in order to maximize the area of ​​the diaphragm 1121 within the limited dimensions of the sound-emitting portion 11, thereby enhancing the acoustic output performance of the sound-emitting portion 11, in some embodiments, when the vibration direction of the diaphragm 1121 is parallel to the thickness direction X of the sound-emitting portion 11, the ratio of the projected area of ​​the diaphragm 1121 in the vibration direction of the diaphragm (i.e., the projected area of ​​the diaphragm 1121 on the sagittal plane) to the projected area of ​​the housing 111 in the vibration direction of the diaphragm (i.e., the projected area of ​​the housing 111 on the sagittal plane) may be no less than 0.5. In some embodiments, in order to maximize the area of ​​the diaphragm 1121 within the limited dimensions of the sound-emitting portion 11, thereby enhancing the acoustic output performance of the sound-emitting portion 11, the ratio of the projected area of ​​the diaphragm 1121 in the vibration direction of the diaphragm to the projected area of ​​the housing 111 in the vibration direction of the diaphragm may be no less than 0.8. In some embodiments, the diaphragm 1121 is made to have as large an area as possible to enhance the acoustic output performance of the sound-emitting part 11, and the ratio of the projected area of ​​the diaphragm 1121 in the diaphragm vibration direction to the projected area of ​​the shell 111 in the diaphragm vibration direction can be in the range of 0.8-0.95.

[0127] In some embodiments, in combination with the wearing method in which the sound-emitting portion 11 at least partially covers the antihelix area as shown in FIG3 , the long axis size of the diaphragm 1121 may be in the range of 13mm-25mm, and the short axis size of the diaphragm may be in the range of 4mm-13mm. In combination with the wearing method in which the sound-emitting portion 11 is entirely or partially extended into the cavum concha as shown in FIG4 , in order to facilitate the entirety or part of the sound-emitting portion 11 to extend into the cavum concha to form an effective cavity-like body, the short axis size of the diaphragm 1121 may be in the range of 4mm-13mm. On the basis of the above-mentioned short axis size, based on the projection area of ​​the diaphragm 1121 (for example, the projection area of ​​the diaphragm 1121 in the vibration direction is 52mm 2 -325mm 2 The major axis dimension of the diaphragm 1121 is further determined to be within the range of 13 mm to 25 mm. For example, the major axis dimension of the diaphragm 1121 may be within the range of 15 mm to 20 mm, and the minor axis dimension of the diaphragm may be within the range of 5 mm to 10 mm. For another example, the major axis dimension of the diaphragm 1121 may be within the range of 17 mm to 18 mm, and the minor axis dimension of the diaphragm may be within the range of 7 mm to 8 mm.

[0128] The basic concepts have been described above. It will be apparent to those skilled in the art that the detailed disclosure above is merely illustrative and does not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to the present application. Such modifications, improvements, and amendments are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0129] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0130] In addition, it will be understood by those skilled in the art that various aspects of the present application can be illustrated and described by a number of patentable categories or situations, including any new and useful process, machine, product or combination of substances, or any new and useful improvements thereto. Accordingly, various aspects of the present application can be performed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The above hardware or software may all be referred to as "data blocks", "modules", "engines", "units", "components" or "systems". In addition, various aspects of the present application may be represented as a computer product located in one or more computer-readable media, which includes computer-readable program code.

[0131] A computer storage medium may include a propagated data signal embodying the computer program code, for example, in baseband or as part of a carrier wave. The propagated signal may be in a variety of forms, including electromagnetic, optical, or any suitable combination thereof. A computer storage medium may be any computer-readable medium other than a computer-readable storage medium that can be connected to an instruction execution system, apparatus, or device to communicate, propagate, or transfer the program for use. The program code on the computer storage medium may be transmitted via any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of these.

[0132] The computer program code required for the operation of each part of the present application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C language, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby and Groovy, or other programming languages. The program code can be run entirely on the user's computer, or as a separate software package on the user's computer, or partly on the user's computer and partly on a remote computer, or entirely on a remote computer or processing device. In the latter case, the remote computer can be connected to the user's computer through any network form, such as a local area network (LAN) or a wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as software as a service (SaaS).

[0133] In addition, unless expressly stated in the claims, the order of the processing elements and sequences described in this application, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this application. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing processing device or mobile device.

[0134] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0135] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

[0136] Each patent, patent application, patent application disclosure, and other materials, such as articles, books, specifications, publications, documents, etc., cited in this application is hereby incorporated by reference in its entirety. This includes application history documents that are inconsistent with or conflict with the content of this application, as well as documents (currently or subsequently attached to this application) that limit the broadest scope of the claims of this application. It should be noted that if the descriptions, definitions, and / or use of terms in the accompanying materials of this application are inconsistent or conflicting with the content of this application, the descriptions, definitions, and / or use of terms in this application shall prevail.

[0137] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this application may be considered consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application.

Claims

1. A sound producing part, comprising: diaphragm; Magnetic circuit components; and A coil is connected to the diaphragm and is at least partially located in the magnetic gap formed by the magnetic circuit assembly. When the coil is energized, it drives the diaphragm to vibrate to generate sound, wherein: The diaphragm includes a main body area and a folding ring area arranged around the main body area. The main body area includes a first inclined section and a first connecting section connected to the coil. The first inclined section is in contact with a partial area of ​​the folding ring area, and the first inclined section is inclined relative to the first connecting section in a direction away from the coil.

2. The sound-generating part according to claim 1, wherein: The folding ring area includes a second inclined section, and the second inclined section is at least partially in contact with the first inclined section.

3. The sound-generating part according to claim 2, wherein: The second inclined section is located on a side of the first inclined section facing away from the coil.

4. The sound-generating part according to claim 1, wherein: The folding ring area includes an arc segment, and the ratio of the height of the arc segment to the span of the arc segment is in the range of 0.35-0.

4.

5. The sound-generating part according to claim 1, wherein: An inclination angle of the first inclined section relative to the first connecting section is in the range of 5°-30°, and the first connecting section is perpendicular to the vibration direction of the diaphragm.

6. The sound-generating part according to claim 4, wherein: The main body area includes a spherical top, which is located at an end of the first connecting section away from the first inclined section. The span of the spherical top is in the range of 2mm-8mm, and the height of the spherical top is in the range of 0.7mm-1.2mm.

7. The sound-generating part according to claim 6, wherein: The ratio of the height of the dome to the span is in the range of 0.1-0.

3.

8. The sound-generating part according to claim 6, wherein: The frequency of high-frequency split vibration is not less than 20kHz.

9. The sound-generating part according to claim 1, wherein: The magnetic circuit assembly includes a container. Under an input voltage of 0.1V-0.7V and a frequency range of 20Hz-6.1kHz, the distance from the bottom of the coil to the bottom of the container is within a range of 0.8mm-0.9mm.

10. The sound-generating part according to claim 1, wherein: It also includes a bracket arranged around the magnetic circuit component, and the first part of the bracket is connected to the second connecting section of the folding ring area.

11. The sound-generating part according to claim 10, wherein: The second connecting section of the folding ring area is connected to the first part of the bracket through a fixing ring.

12. The sound-generating part according to claim 10 or 11, characterized in that: The thickness of the first part where the bracket is connected to the folding ring area is in the range of 0.3mm-3mm. The thickness of the first part is the minimum distance between the connection area between the bracket and the folding ring area and the area where the bracket is directly in contact with the magnetic circuit assembly in the vibration direction of the diaphragm.

13. The sound-generating part according to claim 12, wherein: It also includes a shell, which is provided with a pressure relief hole. A rear cavity is formed between the pressure relief hole and the back of the diaphragm, and the resonance frequency of the rear cavity is not less than 3.3kHz.

14. The sound-generating part according to claim 13, wherein: The volume of the rear cavity is 60mm 3 -110mm 3 within the range.

15. The sound-generating part according to claim 10, wherein: It also includes a shell, which is provided with a pressure relief hole, and a plurality of air holes are opened on the bracket. The sound on the back of the diaphragm is transmitted to the pressure relief hole through the plurality of air holes. The plurality of air holes include at least a first air hole and a second air hole. The distance between the center of the first air hole and the center of the pressure relief hole is greater than the distance between the center of the second air hole and the center of the pressure relief hole, and the area of ​​the first air hole is greater than the area of ​​the second air hole.

16. The sound-generating part according to claim 10, wherein: It also includes a shell, which is provided with a pressure relief hole, and a plurality of air holes are provided on the bracket. The sound from the back of the diaphragm is transmitted to the pressure relief hole through the plurality of air holes. In the vibration direction of the diaphragm, the ratio of the total area of ​​the plurality of air holes to the projected area of ​​the diaphragm is in the range of 0.008-0.

3.

17. The sound-generating part according to claim 16, wherein: In the vibration direction of the diaphragm, the projection area of ​​the diaphragm is 90mm 2 -560mm 2 The total area of ​​the plurality of vent holes is within 4.54 mm 2 -12.96mm 2 within the range.

18. The sound-generating part according to claim 1, wherein: It also includes a shell, and in the vibration direction of the diaphragm, the ratio of the projected area of ​​the diaphragm to the projected area of ​​the shell is not less than 0.

5.

19. The sound-generating part according to claim 18, wherein: In the vibration direction of the diaphragm, the ratio of the projected area of ​​the diaphragm to the projected area of ​​the shell is in the range of 0.8-0.

95.

20. The sound-generating part according to claim 18, wherein: The long axis size of the diaphragm is in the range of 13 mm to 25 mm, and the short axis size of the diaphragm is in the range of 4 mm to 13 mm.

21. The sound-generating part according to claim 10, wherein: A plurality of ventilation holes are provided on the bottom wall of the container of the magnetic circuit assembly or on the side wall in contact with the bracket.

22. The sound-generating part according to claim 6, wherein: The dome is formed by interlacing carbon fibers, and at least part of the carbon fibers are interlaced at a first angle, which is within a range of 45°-90°.

23. The sound-generating part according to claim 6, wherein: In the vibration direction of the diaphragm, the thickness of the dome is less than 80 μm.

24. The sound-generating part according to claim 1, wherein: The minimum distance between the coil and the first inclined section is not less than 0.3 mm.

25. The sound-generating part according to claim 1, wherein: The magnetic circuit assembly includes a magnetic conductive plate and a magnet. The magnetic conductive plate is located between the magnet and the diaphragm and attached to the surface of the magnet. In the vibration direction of the diaphragm, the distance between the center of the coil and the center of the magnetic conductive plate is less than 0.3 mm.

26. The sound-producing part according to claim 23, wherein: In the vibration direction of the diaphragm, the distance from the lowest point of the spherical top to the upper surface of the magnetic conductive plate is greater than 0.8 mm.

27. The sound-generating part according to claim 1, wherein: The magnetic circuit assembly includes a container, and in the vibration direction of the diaphragm, the distance between the bottom of the coil and the bottom wall of the container is in the range of 0.2 mm to 4 mm.

28. The sound-generating part according to claim 27, wherein: The distance between the coil and the side wall of the container is within the range of 0.1 mm to 0.5 mm.

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