Gas-liquid array jet-assisted floating polishing device and method

Abstract

The application provides a gas-liquid array jet flow assisted floating polishing device and method, and relates to the technical field of polishing equipment. The device comprises a polishing box arranged on a base frame, a polishing disc arranged in the polishing box, a plurality of annular grooves arranged in a concentric circle on the upper end surface of the polishing disc, a group of annular jet flow holes arranged on the ridge of each groove, and a fixed distance between each hole; a sample clamping device capable of floating is arranged above the polishing disc, the device has axial freedom through the cooperation of a connecting rod and a vertical channel; a jet flow device is arranged below the polishing disc; a base is arranged in the polishing box, a rotary table is fixed on the base, a rotating disc is connected to the rotary table, the polishing disc is arranged on the rotating disc, the rotating disc has a recess, the upper end of the recess is connected with the polishing disc to form a jet flow cavity, the jet flow cavity is connected with a pressurizing device, and the jet flow holes penetrate through the polishing disc and are in communication with the jet flow cavity; compared with the prior art, the device can realize rough polishing, fine polishing and atomic level polishing, greatly reduces polishing work steps and time, and saves equipment cost.

Description

Technical Field

[0001] This invention relates to the field of polishing equipment technology, and more specifically, to a floating polishing device and method assisted by a gas-liquid array jet. Background Technology

[0002] The development of polishing equipment involves a broad evolution from traditional manual grinding to modern automated equipment. Initially, polishing technology relied on manual operation, using abrasives and tools to finely polish surfaces. With industrialization, this process gradually shifted towards mechanization, resulting in various polishing methods. Among them, floating polishing and jet polishing are two common non-contact polishing techniques, each with its own advantages in different working conditions.

[0003] Floating polishing is a non-contact, ultra-precision polishing method that can achieve sub-nanometer roughness and atomically flat surfaces. Its working principle primarily relies on a high-rotational-precision polishing machine. This machine uses a tin polishing disc with high flatness and concentric or spiral grooves. During polishing, the polishing slurry covers the entire surface of the polishing disc. When the polishing disc and the workpiece rotate relatively at high speed under micrometer-level non-contact conditions, the polishing slurry between them is in a dynamic pressure fluid state. The formed liquid film further supports the workpiece and achieves a state of force equilibrium. The abrasive particles in the polishing slurry interact with the atoms on the workpiece material surface under the action of fluid force, thus achieving non-contact polishing of the workpiece surface. The advantages of this method are that there is no plastic deformation of the workpiece surface and no defects such as lattice displacement, making it extremely effective for processing functional crystalline materials. Furthermore, since there is no frictional heat or tool wear during processing, atomically precise polished surfaces can be obtained, making it common in high-precision fields such as optical lenses and semiconductor manufacturing. However, floating polishing has disadvantages such as low polishing efficiency, long cycle time, and high cost, which limits its application scenarios.

[0004] Jet polishing is also a non-contact polishing technology, commonly including water jet polishing and air jet polishing. The principle of water jet polishing is to use a polishing slurry mixed with fine abrasive particles, sprayed at high speed from a small nozzle, to act on the workpiece surface. The high-speed collision and shearing action of the abrasive particles achieves the effect of grinding and removing material. By controlling process parameters such as the pressure, angle, and spraying time of the polishing slurry, the surface roughness of the workpiece can be quantitatively corrected to achieve the polishing purpose. Air jet polishing builds upon water jet polishing by using a "gas-liquid displacement" method. The nozzle and the workpiece to be polished are immersed together in the polishing slurry. The small nozzle sprays pressurized gas, and the resulting airflow jet entrains and drives the abrasive particles in the polishing slurry to act on the target workpiece surface to achieve material removal. Air jet polishing can achieve material removal efficiency hundreds of times higher than water jet polishing. Jet polishing technology combines fluid mechanics and surface technology, and has advantages such as low cutting force, no thermal deformation, no pollution, high material utilization, and the ability to polish almost all materials and geometries. Especially in the precision polishing of small and complex curved surface parts, jet polishing technology has unparalleled flexibility compared to other traditional technologies. However, compared to floating polishing, jet polishing is slightly limited in terms of surface precision.

[0005] Floating polishing offers excellent surface uniformity and high surface quality, but it requires high initial surface quality. Poor initial surface quality leads to excessively long polishing times, making it difficult to achieve the final atomic-level surface precision. Existing air-jet and water-jet polishing technologies offer significantly higher removal rates than floating polishing, but they are typically used for spot polishing of workpiece surfaces. Achieving large-area polishing requires scanning the entire workpiece surface using a path trajectory, making it difficult to directly achieve large-area polishing of the workpiece. To overcome the shortcomings of the above technologies and to achieve integrated large-area rough polishing, fine polishing, and atomic-level polishing of planar samples, this paper proposes a floating polishing device assisted by a gas-liquid array jet. This device combines the high efficiency of gas-liquid jet polishing with the uniformity and high precision of floating polishing, realizing integrated polishing of different stages of the same workpiece.

[0006] The development of this device can not only significantly improve polishing efficiency and precision, but also reduce polishing costs, and is expected to become a technological innovation with important application prospects in modern industrial fields. Summary of the Invention

[0007] The purpose of this invention is to provide a floating polishing device and method assisted by gas-liquid array jet, which has a simple structure and is easy to use. It can complete multi-stage polishing in one go with the same equipment, greatly reducing the polishing steps and time, and saving equipment costs.

[0008] The embodiments of the present invention are implemented as follows:

[0009] This application provides a floating polishing device assisted by a gas-liquid array jet, which includes a polishing box mounted on a base frame, a polishing disc mounted inside the polishing box, and multiple annular grooves concentrically arranged on the upper surface of the polishing disc. Each groove has a set of annular jet holes, and each hole is spaced at a fixed distance. A floating sample clamping device is mounted above the polishing disc, and the sample clamping device has axial freedom through a connecting rod and a vertical through groove. A jetting device is mounted below the polishing disc, and the jetting device includes a jetting cavity and a pressurizing device. A base is mounted inside the polishing box, and a turntable is fixed on the base. A rotating disc is connected to the turntable, and the polishing disc is mounted on the rotating disc. The rotating disc has a recessed portion, and its upper end is connected to the polishing disc to form a jetting cavity. The jetting cavity is connected to the pressurizing device through a rotary joint, and the jet holes penetrate the polishing disc and communicate with the jetting cavity.

[0010] In some embodiments of the present invention, the polishing disc is provided with a plurality of annular grooves in a concentric circle manner, the spacing between two annular grooves is set to be the same, and the jet hole group is disposed on the groove ridge of the annular groove.

[0011] In some embodiments of the present invention, the annular groove and jet hole group on the polishing disk have a diameter of at least 200 mm; the spacing between the two holes on each ring group of jet holes is the same.

[0012] In some embodiments of the present invention, the spacing between each group of the above-mentioned jet hole rings is set to be the same, and the spacing between the two holes in any ring group is a fixed value array.

[0013] In some embodiments of the present invention, a horizontally movable frame is fixed on the base frame; a horizontal slide rail is provided on the horizontally movable frame, a vertically movable frame is slidably connected to the horizontal slide rail, a vertical slide rail is provided on the vertically movable frame, a main shaft rotating device is slidably connected to the vertical slide rail, a floating sample clamping device is connected to the main shaft rotating device, the sample clamping device includes a coupling rod, a connecting rod, and a clamping seat, the clamping seat is sleeved on the coupling rod through the connecting rod, and the clamping seat can clamp the sample.

[0014] In some embodiments of the present invention, a rotary motor is provided on the main shaft rotating device, and the output end of the rotary motor is connected to the coupling rod; the coupling rod is sleeved with the clamping seat through a connecting rod, and vertical through slots are provided on both sides of the top of the clamping seat, and the connecting rod passes through the vertical through slots and extends outward.

[0015] This application provides a gas-liquid array jet-assisted floating polishing method, which includes the following steps:

[0016] Step 1: Identify the part to be polished and determine the expected degree of polishing.

[0017] Step 2: Adjust the sample clamping device to clamp the part to be polished;

[0018] Step 3: Determine the polishing time for gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, and floating polishing. Use a pressurizing device to pressurize the fluid and begin segmented polishing through gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, and floating polishing.

[0019] Step 4: Monitor the polishing degree of the workpiece to be polished and complete the polishing process.

[0020] In some embodiments of the present invention, in step three above, the polishing time is selected according to the roughness of the workpiece to be polished, using gas array jet-assisted floating polishing for rough polishing, liquid array jet-assisted floating polishing for fine polishing, or floating polishing for atomic-level polishing.

[0021] In some embodiments of the present invention, in step four above, the polishing degree is judged and monitored based on the surface finish and roughness of the polished part by the sample clamping device.

[0022] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0023] Commercially available polishing equipment has relatively limited functionality. A single polishing device cannot simultaneously handle rough polishing, fine polishing, and atomic-level polishing of the workpiece, failing to meet the needs of one-time polishing. This invention provides a gas-liquid array jet-assisted floating polishing device, comprising a polishing box mounted on a base, a polishing disc within the polishing box, and multiple concentric annular grooves on the upper surface of the polishing disc. Each groove has a set of annular jet holes at a fixed distance from each other. Above the polishing disc is a floating sample clamping device, which allows axial freedom through a connecting rod and a vertical through-slot. Below the polishing disc is a jetting device, including a jetting cavity and a pressurizing device. A base is located within the polishing box, with a turntable fixed on the base. A rotating disc is connected to the turntable, and the polishing disc is positioned on the rotating disc. The rotating disc has a recessed portion, the upper end of which connects to the polishing disc to form a jetting cavity. The jetting cavity is connected to the pressurizing device via a rotary joint, and the jet holes penetrate the polishing disc and communicate with the jetting cavity.

[0024] This invention utilizes a jet orifice array. Gas and liquid fluids are pressurized in the jet chamber by a pressurizing device and then ejected through the jet orifices. Polishing liquid is injected above the polishing disc, slightly submerging the workpiece surface. A motor below drives the polishing disc to rotate. The microstructures on the polishing disc generate hydrodynamic pressure during rotation, which, combined with the array jet assistance, causes a floating sample holder to float and perform non-contact polishing of the sample surface. The combination of gas and liquid jet modes, along with the floating polishing of the microstructured polishing disc, allows the device to switch between coarse, fine, and atomic-level polishing during operation. This enables a single polishing operation to be completed in one step, significantly reducing polishing steps and time, and saving equipment costs. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present invention;

[0027] Figure 2 This is a top view of the polishing disc according to an embodiment of the present invention;

[0028] Figure 3 This is a cross-sectional view of the polishing disc according to an embodiment of the present invention;

[0029] Figure 4 This is a front view of the floating sample clamping device according to an embodiment of the present invention;

[0030] Figure 5 This is a cross-sectional view of the floating sample clamping device according to an embodiment of the present invention;

[0031] Figure 6 This is a partial cross-sectional view of the polishing disc according to an embodiment of the present invention;

[0032] Figure 7 This is a cross-sectional view of the annular ball groove according to an embodiment of the present invention.

[0033] Icons: 1. Base frame; 2. Polishing box; 3. Polishing disc; 4. Jet hole; 5. Rotary disc; 6. Recess; 7. Annular groove; 8. Annular fence; 9. Through groove; 10. Horizontal moving frame; 11. Horizontal slide rail; 12. Vertical moving frame; 13. Vertical slide rail; 14. Coupling rod; 15. Clamping seat; 16. Connecting rod; 17. Vertical through groove; 18. Rotating motor; 19. Sliding ball; 20. Annular ball groove; 21. Auxiliary fixing frame; 22. Telescopic connecting rod; 23. Slide groove. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention. Example

[0036] Please refer to Figure 1-5 This embodiment provides a gas-liquid array jet-assisted floating polishing device, which includes a polishing box 2 mounted on a base frame 1, a polishing disc 3 mounted inside the polishing box 2, and multiple annular grooves 7 concentrically arranged on the upper surface of the polishing disc 3. Each annular groove 7 has a set of annular jet holes 4 on its ridge, with a fixed distance between each hole. A floating clamping device is mounted above the polishing disc 3. The sample clamping device has axial freedom through the cooperation of a connecting rod 16 and a vertical through groove 17. A jetting device is mounted below the polishing disc 3. The jetting device includes a jetting cavity and a fluid pressurizing device. A base is mounted inside the polishing box 2. A turntable is fixed on the base. A rotating disc 5 is connected to the turntable. The polishing disc 3 is mounted on the rotating disc 5. The rotating disc 5 has a recess 6, and its upper end is connected to the polishing disc to form a jetting cavity. The jetting cavity is connected to the pressurizing device through a rotary joint. The jetting holes 4 penetrate the polishing disc 3 and communicate with the jetting cavity.

[0037] Commercially available polishing equipment has relatively limited functionality and cannot simultaneously handle both rough and fine polishing of the workpiece, failing to meet polishing requirements. This invention addresses this by using a jet orifice array. Gas and liquid jets are pressurized in the gas and liquid chambers by a pressurizing device and then enter the recessed portion 6, exiting through jet orifices 4. Polishing liquid is injected above the polishing disc 3, slightly submerging the workpiece surface. A motor below drives the polishing disc 3 to rotate. The microstructures on the polishing disc 3 generate hydrodynamic pressure during rotation, which, combined with the array of jets, causes a floating clamping tool to float and perform non-contact polishing on the disc surface. The combination of gas and liquid jets, along with the polishing disc 3, allows the device to switch between rough, fine, and atomic-level polishing during operation, enabling a single polishing cycle on a single device. This significantly reduces polishing steps and time, and saves equipment costs.

[0038] In some embodiments of the present invention, at least 30 rings of jet holes are arranged on the polishing disk 3; in each jet hole group, the spacing between adjacent jet holes 4 is 2π. The at least 30 rings of jet holes, combined with the same spacing between adjacent jet holes 4, make the jet holes 4 more uniform, enabling the device to adapt to various different parts to be polished and to effectively polish them.

[0039] In some embodiments of the present invention, the jet holes 4 are inclined along the tangent direction of the concentric circles, and the inclination directions of three adjacent jet holes 4 in the same jet hole group are different, which can effectively avoid the gas and liquid flow ejected from the jet holes 4 from merging and causing unnecessary displacement of the workpiece to be polished.

[0040] In some embodiments of the present invention, the top of the polishing disk 3 is provided with a plurality of annular grooves 7 arranged in concentric circles, and the jet holes 4 are disposed on the ridges of the annular grooves 7. The jet holes 4 are disposed on the ridges of the annular grooves 7, so that the groove walls of the annular grooves 7 can effectively form an upward focusing effect on the gas and liquid flow, and better apply the polishing and auxiliary effects of the gas and liquid jets to the surface of the workpiece.

[0041] like Figure 6 As shown, furthermore, the tops of both the inner and outer sides of the annular groove 7 are inclined from the outside to the inside, which can effectively prevent the water liquid from forming a water film due to tension and hindering the running-in process, and the water liquid remaining in the groove can effectively cooperate with the jet to polish the material.

[0042] In some embodiments of the present invention, an annular fence 8 is provided on the top of the polishing disc 3, and the jet hole 4 is provided inside the annular fence 8; a plurality of through grooves 9 are provided around the bottom of the annular fence 8. The annular fence 8, in conjunction with the through grooves 9, enables it to achieve a certain retention effect on the liquid flow on the polishing disc 3 without causing accumulation.

[0043] like Figure 7 As shown, further, an auxiliary fixing frame 21 is provided above the polishing disc 3, and a telescopic connecting rod 22 is provided at the bottom of the auxiliary fixing frame 21. A sliding groove 23 is provided at the bottom of the telescopic connecting rod 22. The upper end of the annular fence 8 is slidably connected to the sliding groove 23, and multiple sliding balls 19 are arranged in a ring at the lower end of the annular fence 8. An annular ball groove 20 is provided on the outer side of the polishing disc 3, and the sliding balls 19 are adapted to the annular ball groove 20. The telescopic connecting rod 22 allows the operator to effectively control the distance between the annular fence 8 and the polishing disc 3 to adjust the liquid accumulation above the polishing disc 3. The annular fence 8 effectively buffers the two through the sliding groove 23 and the telescopic connecting rod 22, reducing equipment damage caused by hard contact; at the same time, it can effectively adjust itself according to the degree of liquid accumulation, showing strong adaptability.

[0044] In some embodiments of the present invention, a horizontal moving frame 10 is fixed on the base frame, a horizontal slide rail 11 is provided on the horizontal moving frame 10, a vertical moving frame 12 is slidably connected to the horizontal slide rail 11, a vertical slide rail 13 is provided on the vertical moving frame 12, a main shaft rotating device is slidably connected to the vertical slide rail 13, and a floating clamping device is connected to the main shaft rotating device; including a coupling rod 14, a connecting rod 16, and a clamping seat 15, the coupling rod 14 is sleeved on the clamping seat 15 through the connecting rod 16, vertical through grooves 17 are provided on both sides of the top of the clamping seat 15, the connecting rod 16 passes through the vertical through grooves 17 and is outside them, the sample to be polished can be pasted to the bottom of the clamping seat 15 with paraffin wax; a linear motion motor is provided on both the horizontal slide rail 11 and the vertical slide rail 13. A rotating motor 18 is installed on the main spindle rotating device, and the output end of the rotating motor 18 is connected to the coupling rod 14; the floating clamping device has axial floating space, which can adapt to the height of the polishing liquid in the polishing box 2, so that the abrasive particles in the polishing liquid can better contact the sample surface; the sample clamping device is driven to rotate by the rotating motor 18, and its position can be adjusted and moved laterally by the cooperation of the horizontal moving frame 10 and the vertical moving frame 12.

[0045] This application provides a gas-liquid jet floating polishing method, which includes the following steps:

[0046] Step 1: Identify the part to be polished and determine the expected degree of polishing.

[0047] Step 2: Adjust the sample clamping device to clamp the part to be polished;

[0048] Step 3: Determine the polishing time for gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, and floating polishing. Use a pressurizing device to pressurize the fluid and begin segmented polishing through gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, and floating polishing.

[0049] Step 4: Monitor the polishing degree of the workpiece to be polished and complete the polishing process.

[0050] In some embodiments of the present invention, in step three above, the polishing time is selected based on the roughness of the workpiece to be polished, using gas array jet-assisted floating polishing for rough polishing, liquid array jet-assisted floating polishing for fine polishing, or floating polishing for atomic-level polishing.

[0051] In some embodiments of the present invention, in step four, the polishing degree is judged and monitored based on the surface finish and roughness of the polished part by the sample clamping device. Furthermore, pressure sensors can be installed at the bottom of the clamping seat 15 and on the side of the vertical through groove 17 to effectively monitor the force feedback on the part to be polished during the polishing process, thereby achieving real-time monitoring of the polishing degree.

[0052] In summary, an embodiment of the present invention provides a gas-liquid array jet-assisted floating polishing device, which includes a polishing box 2 mounted on a base frame 1, a polishing disc 3 disposed within the polishing box 2, and multiple annular grooves 7 concentrically arranged on the upper surface of the polishing disc 3. Each groove 7 has a set of annular jet holes 4 arranged on its ridge, with a fixed distance between each hole. A floating sample clamping device is disposed above the polishing disc 3, the sample clamping device having axial freedom through a connecting rod 16 and a vertical through groove 17. A jetting device is disposed below the polishing disc 3, the jetting device including a jet... The polishing chamber 2 is equipped with a base, on which a turntable is fixed. A rotating disk 5 is connected to the turntable, and a polishing disk 3 is placed on the rotating disk 5. The rotating disk 5 has a recess 6, and its upper end is connected to the polishing disk to form a jet cavity. The jet cavity is connected to the pressurizing device through a rotary joint, and the jet hole 4 penetrates the polishing disk 3 and communicates with the jet cavity. Compared with the prior art, its structure is simple and easy to use. It can realize the transformation from coarse polishing to fine polishing to atomic-level polishing with the same equipment, greatly reducing the polishing work steps and time, and saving equipment costs.

[0053] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A floating polishing device assisted by a gas-liquid array jet, characterized in that, The system includes a base frame, on which a polishing box is mounted. A polishing disc is housed within the polishing box. The upper surface of the polishing disc has multiple concentric annular grooves, and each annular groove has a set of annular jet holes on its ridge, with a fixed distance between each hole. A floating sample clamping device is positioned above the polishing disc, allowing axial freedom through a connecting rod and a vertical through-slot. A jetting device, including a jetting cavity and a pressurizing device, is positioned below the polishing disc. A base is located within the polishing box, and a turntable is fixed to the base. A rotating disc is connected to the turntable, and the rotating disc has a recessed portion. Its upper end connects to the polishing disc to form the jetting cavity, which is connected to the pressurizing device via a rotary joint. The jet holes penetrate the polishing disc and communicate with the jetting cavity. The tops of both the inner and outer sides of the annular grooves slope inwards. The floating polishing device can selectively use gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, or floating polishing.

2. The floating polishing device assisted by gas-liquid array jet according to claim 1, characterized in that, The polishing disc has multiple annular grooves arranged in a concentric circle, with the same spacing between two annular grooves, and the jet hole group is arranged on the ridge of the annular grooves.

3. The floating polishing device assisted by gas-liquid array jet according to claim 2, characterized in that, The annular groove and jet hole group on the polishing disk have a diameter of at least 200 mm; the spacing between the two holes on each ring group of jet holes is the same.

4. The gas-liquid array jet-assisted floating polishing device according to claim 3, characterized in that, The jet orifice rings are spaced at the same intervals, with the interval between the two holes in any ring group being a fixed value array.

5. The gas-liquid array jet-assisted floating polishing device according to claim 1, characterized in that, A horizontally movable frame is fixed on the base frame; a horizontal slide rail is provided on the horizontally movable frame, and a vertically movable frame is slidably connected to the horizontal slide rail; a vertical slide rail is provided on the vertically movable frame, and a main shaft rotating device is slidably connected to the vertical slide rail; a floating sample clamping device is connected to the main shaft rotating device; the sample clamping device includes a coupling rod, a connecting rod, and a clamping seat; the clamping seat is sleeved on the coupling rod through the connecting rod, and the clamping seat can clamp the sample.

6. The gas-liquid array jet-assisted floating polishing device according to claim 5, characterized in that, A rotary motor is installed on the main shaft rotation device, and the output end of the rotary motor is connected to the coupling rod; the coupling rod is sleeved with the clamping seat through a connecting rod, and vertical through slots are provided on both sides of the top of the clamping seat, through which the connecting rod passes and extends to the outside.

7. A gas-liquid jet floating polishing method, characterized in that, Using the gas-liquid array jet-assisted floating polishing apparatus as described in any one of claims 1-6 includes the following steps: Step 1: Identify the part to be polished and determine the expected degree of polishing. Step 2: Adjust the sample clamping device to clamp the part to be polished; Step 3: Determine the polishing time for gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, and floating polishing. Use a pressurizing device to pressurize the fluid and begin segmented polishing through gas array jet-assisted floating polishing, liquid array jet-assisted floating polishing, and floating polishing. Step 4: Monitor the polishing degree of the workpiece to be polished and complete the polishing process.

8. The gas-liquid jet floating polishing method according to claim 7, characterized in that, In step three, the polishing time is selected based on the roughness of the workpiece to be polished, using gas array jet-assisted floating polishing for rough polishing, liquid array jet-assisted floating polishing for fine polishing, or floating polishing for atomic-level polishing.

9. The gas-liquid jet floating polishing method according to claim 7, characterized in that, In step four, the polishing degree is judged and monitored based on the smoothness and roughness of the polished part.

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