Mask assembly

Abstract

A mask assembly includes: a mask frame having a frame opening defined therein; and a mask disposed on an upper surface of the mask frame, and clamping grooves defined in the mask on at least one of two sides opposite to each other in the first direction. The mask includes: a cell region having a deposition portion and a dummy portion extending in a first direction from the deposition portion toward the clamp groove; and a peripheral region surrounding the unit region and having a clamping groove defined therein. An inner surface of the peripheral region defining the clamping groove has a shape corresponding to an outer surface of the dummy portion.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2023-0188025, filed on December 21, 2023, and all rights and benefits therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure herein relates to a mask assembly. Background Art

[0003] The display device outputs a video or image through a display area to provide a user with various visual information. An organic light-emitting display device in a display device has the advantages of a wide viewing angle, excellent contrast, and fast response speed. The display area of ​​such an organic light-emitting display device is composed of a plurality of pixels, and the plurality of pixels can form a display area by a process of depositing a deposition material.

[0004] The deposition apparatus may include a mask, a mask frame, and a stage. The mask may be stretched and fixed on the mask frame. Summary of the invention

[0005] The present disclosure provides a mask assembly having a reduced amount of deformation of a mask when the mask is stretched and fixed on an upper surface of a mask frame.

[0006] One embodiment of the present invention provides a mask assembly, comprising: a mask frame having a frame opening defined therein; and a mask, which is arranged on an upper surface of the mask frame, and a clamping groove is defined in the mask in at least one of two sides opposite to each other in a first direction, wherein the mask has: a unit area having a deposition portion and a dummy portion extending from the deposition portion toward the clamping groove in the first direction; and a peripheral area surrounding the unit area and having the clamping groove defined therein, and an inner surface of the peripheral area defining the clamping groove has a shape corresponding to an outer surface of the dummy portion.

[0007] In one embodiment of the present invention, a mask assembly includes: a mask frame having a frame opening defined therein; and a mask disposed on an upper surface of the mask frame and having a plurality of protrusions disposed on at least one of two sides opposite to each other in a first direction, wherein the mask has: a deposition portion; a dummy portion extending from at least one of two sides opposite to each other in the first direction of the deposition portion; and a peripheral area surrounding the deposition portion and the dummy portion, and a clamping groove is defined between the plurality of protrusions arranged in a second direction intersecting the first direction, and in a plan view, a ratio of an area of ​​the dummy portion to an area of ​​the clamping groove is approximately 0.95 to approximately 1.05, and the clamping groove is defined as an area enclosed by an imaginary line extending in the second direction and connecting the ends of the protrusions and the protrusions. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention.

[0009] In the figure:

[0010] Figure 1 is a cross-sectional view of a deposition apparatus according to an embodiment of the present invention;

[0011] Figure 2A for Figure 1 A perspective view of the mask assembly illustrated in FIG.

[0012] Figure 2B for Figure 2A An exploded perspective view of the mask assembly illustrated in FIG.

[0013] Figure 3 for Figure 2A A plan view of the mask illustrated in FIG.

[0014] Figure 4 is a plan view of a mask according to another embodiment of the present invention;

[0015] Figure 5A Example Figure 3 The mask illustrated in has been deformed;

[0016] Figure 5B For along Figure 5A A cross-sectional view taken along line II' illustrated in FIG.

[0017] FIG. 6A to FIG. 6I A mask according to a comparative example is illustrated;

[0018] Fig. 7A and Figure 7B exemplifies a mask according to another embodiment of the present invention;

[0019] FIG. 8A to FIG. 8F A mask according to a comparative example is illustrated;

[0020] Fig. 9A and Fig. 9B exemplifies a mask according to another embodiment of the present invention;

[0021] FIG. 10A to FIG. 10F A mask according to a comparative example is illustrated;

[0022] Fig.11 For use Figure 2A A plan view of a display panel manufactured using the mask assembly illustrated in FIG.

[0023] Fig.12Exemplarily illustrate Fig.11 A cross section of a pixel as illustrated in FIG. ; and

[0024] Fig.13 Example Figure 1 The deposition process illustrated in FIG. DETAILED DESCRIPTION

[0025] The advantages and features of the present invention and the methods for achieving these advantages and features will be clear when referring to the embodiments that will be described in detail with reference to the accompanying drawings later. However, the present invention will not be limited to the embodiments to be disclosed below, and will be implemented in different and various forms. Only these embodiments are provided so that the disclosure of the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. The present invention is determined by the scope of the claims. Throughout the specification, the same reference numerals or symbols refer to the same elements.

[0026] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. The term "and / or" includes each and all of one or more combinations of the items recited.

[0027] For ease of description, spatially relative terms such as "below," "under," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.

[0028] It will be understood that although the terms "first," "second," etc., may be used herein to describe various elements, components, and / or sections, these elements, components, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, or section from another element, component, or section. Therefore, the first element, component, or section discussed below may be referred to as a second element, component, or section without departing from the teachings of the present invention.

[0029] The embodiments described herein will be described with reference to the plan views and cross-sectional views which are ideal schematic diagrams of the present invention. Accordingly, the form of the illustrated examples may be modified due to manufacturing techniques and / or tolerances, etc. Therefore, embodiments of the present invention are not limited to the illustrated specific shapes, but include deformations caused by the manufacturing process. Therefore, the areas illustrated in the figures have schematic properties, and the shapes of the areas illustrated in the figures are intended to represent the specific shapes of the areas of the elements, and are not intended to limit the scope of the present invention.

[0030] The terms used herein are only used for the purpose of describing a particular embodiment, and are not intended to be restrictive. As used herein, "one", "said" and "at least one" do not represent a limitation on quantity, and are intended to include both singular and plural forms, unless the context clearly indicates otherwise. For example, "element" has the same meaning as "at least one element", unless the context clearly indicates otherwise. "At least one" will not be interpreted as limiting "one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Throughout the disclosure, the statement "at least one of a, b and c" means only a, only b, only c, a and b both, a and c both, b and c both, a, b and c all or its variant. It will be further understood that the terms "include" and / or "comprising" when used in this specification specify the existence of stated features, regions, integers, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, regions, integers, steps, operations, elements, parts and / or its groups. Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0031] Figure 1 is a cross-sectional view of a deposition apparatus according to an embodiment of the present invention. Figure 2A for Figure 1 A perspective view of the mask assembly illustrated in FIG. Figure 2B for Figure 2A Exploded perspective view of the mask assembly illustrated in .

[0032] refer to Figure 1 , a deposition apparatus ED according to an embodiment of the present invention may include a chamber CB, a mask assembly MSA, a stage STG, a deposition source EP, and a fixing member PP. The mask assembly MSA may include a mask frame MF and a mask MK.

[0033] The chamber CB may provide an internal space, and the deposition source EP, the stage STG, the mask assembly MSA, and the fixing member PP may be disposed inside the chamber CB. The chamber CB may form a sealed space, and the deposition condition may be set to a vacuum. The chamber CB may provide at least one door, and the chamber CB may be opened and closed by the door. The stage STG, the mask assembly MSA, and the substrate SUB may enter and leave through the door provided in the chamber CB.

[0034] The chamber CB may include a bottom surface BP, a top surface, and side surfaces. The bottom surface BP of the chamber CB may be parallel to a plane defined by a first direction DR1 and a second direction DR2 crossing the first direction DR1.

[0035] Hereinafter, a direction substantially perpendicularly crossing a plane defined by the first direction DR1 and the second direction DR2 may be defined as a third direction DR3. In addition, in this specification, the wording "when viewed on a plane" (ie, in a plan view) may be defined as a state viewed on the third direction DR3.

[0036] The fixing member PP may be disposed inside the chamber CB and may face the deposition source EP in the third direction DR3. The fixing member PP may allow the substrate SUB to be attached to the mask MK. The fixing member PP may include a magnetic substance to allow the substrate SUB to be attached to the mask MK. For example, the magnetic substance may fix the mask MK by generating a magnetic force, and the substrate SUB disposed between the mask MK and the fixing member PP may be attached to the mask MK. However, embodiments of the present invention are not limited thereto, and in another embodiment, the fixing member PP may include a clamp or a robot arm for holding the mask MK.

[0037] The substrate SUB may be disposed between the mask MK and the fixing member PP. The substrate SUB may be a processing target on which a deposition material is deposited. The substrate SUB may include a support substrate and a synthetic resin material disposed on the support substrate. The substrate SUB may include an organic light emitting material to form a display panel DP (see Fig.11 ). The sublimated or evaporated deposition material EV may be sprayed toward the substrate SUB through the nozzle NZ. The deposition material EV may be sprayed toward the substrate SUB through the mask opening OP-MK (see Figure 2B ) is deposited on a substrate SUB.

[0038] The stage STG may be disposed between the deposition source EP and the fixing member PP. The stage STG may support a rear surface of a mask frame MF to be described later, and may be disposed in a moving path of a deposition material EV supplied from the deposition source EP to the substrate SUB. The stage opening OP-ST may be defined by the stage STG. The deposition material EV may be provided to the mask MK through the stage opening OP-ST.

[0039] The stage STG may include a mounting surface SE1 and a back surface SE2 facing away from the mounting surface SE1. The mounting surface SE1 and the back surface SE2 of the stage STG may be surfaces parallel to the first direction DR1 and the second direction DR2. The mounting surface SE1 and the back surface SE2 of the stage STG may be provided to be substantially parallel to the bottom surface BP of the chamber CB. Accordingly, the mask frame MF and the back surface of the mask MK mounted on the mounting surface SE1 of the stage STG may each be provided to be substantially parallel to the bottom surface BP of the chamber CB, and thus a deposition process may be performed.

[0040] However, embodiments of the present invention are not limited thereto, and the seating surface SE1 and the back surface SE2 of the stage STG according to an embodiment may be provided to be substantially perpendicular to the bottom surface BP of the chamber CB. The back surfaces of the mask frame MF and the mask MK may each be provided to be substantially perpendicular to the bottom surface BP of the chamber CB, and thus a vertical deposition process may be performed.

[0041] refer to Figures 1 to 2B , the mask frame MF may be disposed on the seating surface SE1 of the stage STG. The stage STG may support the mask frame MF. For example, both sides of the mask frame MF may be disposed at an inner side compared to both sides of the stage STG.

[0042] The mask frame MF may have a quadrangular frame shape in a plan view having short sides extending in the first direction DR1 and long sides extending in the second direction DR2. A frame opening OP-MF may be defined in the mask frame MF having the quadrangular frame shape. The shape of the frame opening OP-MF may be a quadrangle.

[0043] like Figure 1 As illustrated in FIG. 1 , the frame opening OP-MF may overlap with the stage opening OP-ST in a plan view. The frame opening OP-MF and the stage opening OP-ST may be sequentially defined in the third direction DR3 .

[0044] The first groove GR1 and the second groove GR2 may be defined in the upper surface of the mask frame MF. The first groove GR1 may extend from the upper surface of the mask frame MF toward the lower surface of the mask frame MF. For example, the first groove GR1 may have a shape corresponding to a portion of a quadrangle.

[0045] The first grooves GR1 may be arranged along the long sides of the mask frame MF in the second direction DR2 when viewed on a plane. Intervals between the first grooves GR1 adjacent to each other in the second direction DR2 may be uniform.

[0046] The second groove GR2 may extend from the upper surface of the mask frame MF toward the lower surface of the mask frame MF. For example, the second groove GR2 may have a shape corresponding to a portion of a quadrangle.

[0047] In an embodiment, for example, the first groove GR1 may extend further toward the lower surface of the mask frame MF than the second groove GR2. For example, a bottom surface of the first groove GR1 may be closer to the lower surface of the mask frame MF than a bottom surface of the second groove GR2.

[0048] The second grooves GR2 may be arranged along the short sides of the mask frame MF in the first direction DR1 when viewed on a plane. Intervals between the second grooves GR2 adjacent to each other in the first direction DR1 may be uniform.

[0049] The mask frame MF may have predetermined rigidity. For example, the mask frame MF may include a metal material such as stainless steel (SUS), Invar, nickel (Ni), cobalt (Co), or the like.

[0050] The mask assembly MSA may further include a rod ST. The rod ST may include a first rod ST1 and a second rod ST2. The first rod ST1 may be disposed on an upper surface of the mask frame MF. The first rod ST1 may be disposed in the first groove GR1.

[0051] The first rod ST1 may extend in the first direction DR1 and may be arranged in the second direction DR2. The first rod ST1 may cross the frame opening OP-MF. The center portion of the first rod ST1 may overlap the frame opening OP-MF. The first rod ST1 may pass through the first groove GR1, and thus the opposite ends of the first rod ST1 may be disposed outside the mask frame MF.

[0052] The second rod ST2 may be disposed in the second groove GR2. The second rod ST2 may be disposed on the first rod ST1. The second rod ST2 may be disposed to cross the first rod ST1. For example, the second rod ST2 may be directly disposed on the first rod ST1. However, embodiments of the present invention are not limited thereto, and in another embodiment, the first rod ST1 may be disposed on the second rod ST2.

[0053] The second rod ST2 may be arranged in the first direction DR1 and extend in the second direction DR2. For example, the length of the second rod ST2 in the second direction DR2 may be longer than the length of the first rod ST1 in the first direction DR1. The second rod ST2 may cross the frame opening OP-MF. The center portion of the second rod ST2 may overlap the frame opening OP-MF. The second rod ST2 may pass through the second groove GR2, and the opposite end of the second rod ST2 may be disposed on the outside of the mask frame MF.

[0054] The first rod ST1 and the second rod ST2 may include a non-magnetic material. For example, the first rod ST1 and the second rod ST2 may include aluminum. However, this is an example, and the materials of the first rod ST1 and the second rod ST2 may not be limited thereto.

[0055] The mask MK may be disposed between the mask frame MF and the substrate SUB. A plurality of masks MK may be disposed on an upper surface of the mask frame MF. Both sides of the mask MK may be connected to the mask frame MF. The mask MK may extend in a first direction DR1 and may be arranged in a second direction DR2. The mask MK may have a rectangular shape having a long side extending in the first direction DR1 and a short side extending in the second direction DR2. The thickness direction of the mask MK is a third direction DR3.

[0056] In an embodiment, for example, the mask MK may be stretched in the first direction DR1 to cover the frame opening OP-MF. The stretched mask MK may be connected to the mask frame MF by laser welding.

[0057] The mask MK may be disposed on the first and second rods ST1 and ST2. By the first and second rods ST1 and ST2, the mask MK may not be detached from the mask frame MF. That is, in order to prevent the mask MK from sagging due to gravity, the first and second rods ST1 and ST2 may serve as supports of the mask MK.

[0058] A plurality of clamping grooves CGR may be defined in at least one side (e.g., both sides) of the mask MK opposite to each other in the first direction DR1. For example, three clamping grooves CGR may be defined in each of the ends of the mask MK opposite to each other in the first direction DR1. The clamping grooves CGR may be recessed from both sides of the mask MK toward the center of the mask MK. Figure 3 The clamping groove CGR is described in detail.

[0059] The mask MK may have a predetermined rigidity. For example, the mask MK may include a metal material such as stainless steel (SUS), Invar, nickel (Ni), cobalt (Co), or the like.

[0060] The cell area CEA and the peripheral area NCE may be defined on the upper surface of the mask MK. For example, one cell area CEA may be defined on the upper surface of each mask MK. However, the number of cell areas CEA defined on the upper surface of each mask MK may not be limited thereto. The peripheral area NCE may surround the cell area CEA.

[0061] The cell area CEA may overlap with the frame opening OP-MF in a plan view. The cell area CEA may overlap with the stage opening OP-ST in a plan view. The cell area CEA may not overlap with the mask frame MF in a plan view.

[0062] The cell area CEA may not overlap with the first rod ST1 in a plan view. The first rod ST1 may overlap with a peripheral area NCE disposed between the cell areas CEA adjacent to each other in the second direction DR2 in a plan view. The cell area CEA may overlap with the second rod ST2 in a plan view. The first rod ST1 and the second rod ST2 may overlap with an area between the masks MK in a plan view, thereby preventing the deposition material from being introduced into an area between the masks MK adjacent to each other.

[0063] The unit area CEA may include a plurality of deposition portions DPA and a plurality of dummy portions DPT. For example, when viewed on a plane, the deposition portion DPA may be parallel to a plane defined by the first direction DR1 and the second direction DR2. The dummy portion DPT may extend in the first direction DR1 from at least one side (e.g., both sides) of the deposition portion DPA that are opposite to each other in the first direction DR1. In one embodiment, the dummy portion DPT may extend in the first direction DR1 from the deposition portion DPA toward the clamping groove CGR. Three dummy portions DPT may be provided in each of one side and the other side of each deposition portion DPA, but the number of the dummy portions DPT is not limited thereto.

[0064] The deposition portion DPA and the dummy portion DPT may not overlap with the first rod ST1 in a plan view. The deposition portion DPA and the dummy portion DPT may overlap with the second rod ST2 in a plan view. Figure 4 The dummy part DPT is described in detail.

[0065] A plurality of mask openings OP-MK may be defined in the cell area CEA. The mask openings OP-MK may be defined in the dummy portion DPT and the deposition portion DPA. The mask openings OP-MK may be arranged in the first direction DR1 and the second direction DR2.

[0066] The mask opening OP-MK may overlap with the frame opening OP-MF in a plan view. That is, the stage opening OP-ST, the frame opening OP-MF, and the mask opening OP-MK may be defined sequentially in the third direction DR3. Figure 1 As illustrated in FIG. 1 , the deposition material EV may pass through the stage openings OP-ST, the frame openings OP-MF, and the mask openings OP-MK, and may be deposited on the substrate SUB.

[0067] The mask assembly MSA may further include a plurality of alignment rods AST. The alignment rods AST may be disposed on an upper surface of the mask frame MF. The alignment rods AST may be coupled to the upper surface of the mask frame MF by welding. The alignment rods AST may extend in a first direction DR1 and may be arranged in a second direction DR2. The mask MK may be disposed between the alignment rods AST. The alignment rods AST and the mask frame MF may be arranged in the second direction DR2.

[0068] The alignment rods AST may fix the position of the mask MK relative to the mask frame MF. The alignment rods AST may fix the mask MK so that the mask opening OP-MK and the frame opening OP-MF overlap each other in a plan view. However, in an embodiment, the alignment rods AST may be omitted.

[0069] refer to Figure 1 The deposition source EP may be disposed inside the chamber CB and may face the fixing member PP in the third direction DR3. The deposition source EP may include a storage space containing a deposition material EV and at least one nozzle NZ. The deposition material EV may include an inorganic material, a metal, or an organic material that can be sublimated or evaporated. For example, the deposition material EV may include a material for forming the light emitting layer EML (see Fig.12 ) of an organic light emitting material. The sublimated or evaporated deposition material EV may be sprayed toward the substrate SUB through a plurality of nozzles NZ. The deposition material EV may pass through the mask opening OP-MK of the mask MK and may be patterned and deposited on the substrate SUB.

[0070] In addition to the above configuration, the deposition device ED may further include an additional mechanical device for realizing an inline system. The deposition device ED according to an embodiment may further include a coupling member. The coupling member may be fixed to the side wall of the chamber CB, and the stage STG may be connected to the coupling member and stably fixed inside the chamber CB. Therefore, the deposition process can be stably performed.

[0071] The deposition device ED according to an embodiment may further include an alignment device. The alignment device may adjust the positions of the stage STG and the mask frame MF. Accordingly, when the deposition material EV passes through the stage opening OP-ST of the stage STG and the frame opening OP-MF of the mask frame MF and is deposited on the substrate SUB, defects may be prevented from occurring.

[0072] Figure 3 for Figure 2A A plan view of the mask illustrated in FIG. Figure 4 is a plan view of a mask according to another embodiment of the present invention.

[0073] because Figure 3 and Figure 4 The mask openings in OP-MK and Figure 2A and Figure 2B The mask opening OP-MK in is the same, so its description will be omitted or simplified.

[0074] refer to Figure 3 The clamping grooves CGR may be defined in both ends of the mask MK that are opposite to each other in the first direction DR1. The clamping grooves CGR may be arranged in the second direction DR2. For example, three clamping grooves CGR may be defined in each end of the mask MK, but the number of the clamping grooves CGR is not limited thereto.

[0075] Hereinafter, a portion of the mask MK disposed between the clamping grooves CGR adjacent to each other in the second direction DR2 may be defined as a protrusion PTR. The clamping grooves CGR may be defined by the protrusions PTR adjacent to each other in the second direction DR2. In one embodiment, the mask MK may include a plurality of protrusions PTR disposed on at least one of two sides opposite to each other in the first direction DR1.

[0076] The clamping groove CGR may extend from both ends of the mask MK toward the center of the mask MK in the first direction DR1. For example, when viewed on a plane, the clamping groove CGR may have a shape corresponding to a portion of a circle. For example, an inner surface of the mask MK defining the clamping groove CGR may have a curved surface concave toward the center. However, the shape of the clamping groove CGR is not limited thereto. Fig. 7A and Fig. 9A The shape of the clamping groove CGR is described in detail.

[0077] refer to Figure 3 and Figure 4 , when viewed on a plane, the deposition parts DPA and DPA1 may each have a rectangular shape defined by the first direction DR1 and the second direction DR2. The dummy part DPT may be disposed adjacent to at least one of two sides of the deposition part DPA or DPA1 that are opposite to each other in the first direction DR1. Figure 3 As illustrated in FIG. 1 , the dummy portion DPT may be disposed adjacent to both sides of the deposition portion DPA facing the clamping groove CGR. The dummy portion DPT may extend from both sides of the deposition portion DPA facing the clamping groove CGR in the first direction DR1 .

[0078] However, the embodiments of the present invention are not limited thereto. Figure 4 , when a plurality of deposition portions DPA1 are arranged in the first direction DR1, the dummy portion DPT may be disposed adjacent to one side of both sides of the deposition portion DPA1 that are opposite to each other in the first direction DR1. The dummy portion DPT may not be disposed on the other side of both sides of the deposition portion DPA1. The peripheral area NCE may be disposed between the deposition portions DPA1 that are adjacent to each other in the first direction DR1. One side of both sides of the deposition portion DPA1 that are opposite to each other in the first direction DR1 may be defined as a side facing the clamping groove CGR.

[0079] The dummy portions DPT may each be arranged together with corresponding ones of the clamping grooves CGR in the first direction DR1 when viewed on a plane. The dummy portions DPT may each face corresponding ones of the clamping grooves CGR in the first direction DR1 when viewed on a plane.

[0080] The number of dummy portions DPT may be the same as the number of clamping grooves CGR. Figure 3The three dummy portions DPT in the second direction DR2 may be arranged in the second direction DR2. Intervals between the dummy portions DPT adjacent to each other in the second direction DR2 may be uniform.

[0081] When viewed on a plane (ie, in a plan view), the shape of each of the dummy portions DPT may correspond to the shape of a corresponding one of the clamping grooves CGR. When viewed on a plane, the shape of the dummy portion DPT may be symmetrical to the shape of the clamping groove CGR with respect to the second direction DR2.

[0082] In one embodiment, for example, the dummy portion DPT may have a convex shape toward the clamping groove CGR when viewed on a plane. The inner surface of the peripheral area NCE defining the clamping groove CGR may have a shape corresponding to the outer surface of the dummy portion DPT when viewed on a plane.

[0083] When viewed on a plane, the imaginary line IDL may extend in the second direction DR2 and connect ends of the protrusion PTR adjacent to each other in the second direction DR2. Hereinafter, the clamping groove CGR may be defined as a region closed by the imaginary line IDL and the protrusion PTR.

[0084] When viewed on a plane, a ratio of an area of ​​the dummy portion DPT to an area of ​​the clamping groove CGR may be about 0.95 to about 1.05. For example, an area of ​​each of the clamping grooves CGR may be the same as an area of ​​a corresponding one of the dummy portions DPT.

[0085] Figure 5A Example Figure 3 The mask illustrated in has been deformed. Figure 5B For along Figure 5A A cross-sectional view taken along line II' illustrated in FIG. FIG. 6A to FIG. 6I A diagram illustrating a mask according to a comparative example.

[0086] In one embodiment, for example, Fig. 6A , Fig.6D and Figure 6G For the floor plan. Figure 6C , Fig. 6F and Fig.6I A cross-sectional view.

[0087] In one embodiment, for example, Figure 6C For along Figure 6B A cross-sectional view taken along line II-II', Fig. 6F For along Fig. 6E A cross-sectional view taken along line III-III', and Fig.6I For along Figure 6H A cross-sectional view taken along line IV-IV'.

[0088] In one embodiment, for example, Figure 5A , Figure 6B , Fig. 6E and Figure 6H The results obtained by analyzing the sizes of wrinkles appearing on the surfaces of the masks MK, MKa, MKb, and MKc when the masks MK, MKa, MKb, and MKc are stretched using a computer program are exemplified.

[0089] In one embodiment, for example, Figure 5B , Figure 6C , Fig. 6F and Fig.6I , masks MK, MKa, MKb and MKc are briefly illustrated as lines. Figure 5B , Figure 6C , Fig. 6F and Fig.6I The line illustrated in may correspond to any one of the upper and lower surfaces of the mask MK, MKa, MKb, or MKc in a side view, or to a plane passing through the center of the mask.

[0090] For ease of explanation, Figure 5A , Figure 6B , Fig. 6E and Figure 6H The unit area CEA can be omitted in Figure 3 ).

[0091] because FIG. 5A to FIG. 6I The deposition part DPA, the peripheral area NCE, the clamping groove CGR, the protrusion PTR and the imaginary line IDL in Figure 3 The deposition portion DPA, peripheral area NCE, clamping groove CGR, protrusion PTR and imaginary line IDL are the same, so their description will be simplified or omitted.

[0092] refer to Figure 2A , Figure 5A and Figure 5B , when the mask MK is connected to the upper surface of the mask frame MF, the mask MK may be stretched. The mask MK may be stretched in the first direction DR1 and in the opposite direction of the first direction DR1.

[0093] When the mask MK is stretched, the mask MK may be deformed. The upper and lower surfaces of the mask MK may be uneven. Figure 5B As illustrated in FIG. 1 , the upper and lower surfaces of the mask MK may include curved surfaces. Wrinkles may appear on the upper and lower surfaces of the mask MK.

[0094] refer to Figure 5A and Figure 5BIn the upper surface of the mask MK, a portion of the upper surface of the mask MK that is upwardly convex than the surrounding may be defined as a peak portion PE. In the upper surface of the mask MK, a portion of the upper surface of the mask MK that is concave than the surrounding may be defined as a concave portion VA. For example, the first length L1 defined by the difference between the height of the peak portion PE and the height of the concave portion VA may be about 27.5 micrometers (μm).

[0095] refer to FIG. 6A to FIG. 6C , the unit area CEAa may not include a dummy part DPT (see Figure 3 When viewed on a plane, two sides of the deposition portion DPA opposite to each other in the first direction DR1 may be straight lines parallel to the second direction DR2.

[0096] when Fig. 6A The mask MKa in the embodiment is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MKa can be deformed. Figure 6B and Figure 6C As illustrated in , wrinkles may appear on the upper surface of the mask MKa. The second length L2 defined by the difference between the height of the peak portion PEa and the height of the concave portion VAa in the mask MKa may be about 368.5 μm.

[0097] refer to FIG. 6D to FIG. 6F , the unit area CEAb may include a deposition portion DPA and a dummy portion DPTa. When viewed on a plane, the area of ​​the dummy portion DPTa may be smaller than the area of ​​the clamping groove CGR. For example, the ratio of the area of ​​the dummy portion DPTa to the area of ​​the clamping groove CGR may be less than about 0.95.

[0098] When the mask MKb is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MKb may be deformed. Fig. 6E and Fig. 6F As illustrated in , wrinkles may appear on the upper surface of the mask MKb. The third length L3 defined by the difference between the height of the peak portion PEb and the height of the concave portion VAb in the mask MKb may be about 143.44 μm.

[0099] refer to FIG. 6G to FIG. 6I , the unit area CEAc may include a deposition portion DPA and a dummy portion DPTb. When viewed on a plane, the area of ​​the dummy portion DPTb may be greater than the area of ​​the clamping groove CGR. For example, the ratio of the area of ​​the dummy portion DPTb to the area of ​​the clamping groove CGR may be greater than about 1.05.

[0100] When the mask MKc is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MKc can be deformed. Figure 6H and Fig.6IAs illustrated in , wrinkles may appear on the upper surface of the mask MKc. The fourth length L4 defined by the difference between the height of the peak portion PEc and the height of the concave portion VAc in the mask MKc may be about 53.4 μm.

[0101] refer to Figure 1 , Figure 5B , Figure 6C , Fig. 6F and Fig.6I , when the deposition material EV is deposited on the substrate SUB, the substrate SUB may be disposed on the masks MK, MKa, MKb, and MKc. Here, when wrinkles appear on the upper surfaces of the masks MK, MKa, MKb, and MKc, the substrate SUB may not be attached to the upper surfaces of the masks MKa, MKb, and MKc. The upper surfaces of the substrate SUB and the masks MKa, MKb, and MKc may be spaced apart from each other.

[0102] Accordingly, the mask opening OP-MK (see Figure 3 ) may not be deposited on the substrate SUB in a uniform size. Therefore, in the display panel DP (see Fig.11 ) may cause deposition defects.

[0103] However, when the deposition material EV is deposited on the substrate SUB by using the mask MK according to an embodiment of the present invention, the size of the wrinkles appearing on the upper surface of the mask MK may be smaller than the size of the wrinkles appearing on the upper surfaces of the masks MKa, MKb, and MKc according to the comparative example. The wrinkles appearing on the upper surface of the mask MK may be stretched to be flat by the magnetic force between the mask MK and the fixing member PP. Accordingly, the substrate SUB may be attached to the mask MK. Therefore, the reliability of the deposition process may be improved.

[0104] Fig. 7A and Figure 7B A mask according to another embodiment of the present invention is illustrated. FIG. 8A to FIG. 8F A diagram illustrating a mask according to a comparative example.

[0105] In one embodiment, for example, Fig. 7A , Fig. 8A , Figure 8C and Fig. 8E Illustrated as a plan view.

[0106] In one embodiment, for example, Figure 7B , Figure 8B , Fig.8D and Figure 8F The results obtained by analyzing the sizes of wrinkles appearing on the surfaces of the masks MK1, MK1a, MK1b, and MK1c when the masks MK1, MK1a, MK1b, and MK1c are stretched using a computer program are exemplified.

[0107] For ease of explanation, Figure 7B , Figure 8B , Fig.8D and Figure 8F The unit area CEA can be omitted in Figure 3 ).

[0108] because Fig. 7A , Fig. 8A , Figure 8C and Fig. 8E The imaginary line IDL and the deposition part DPA in Figure 3 The imaginary line IDL in FIG. 1 is the same as the deposition portion DPA, so the description thereof will be omitted or simplified.

[0109] refer to Fig. 7A , the cell area CEA1 may include a dummy portion DPT1 and a deposition portion DPA. Fig. 7A and Figure 7B , when viewed on a plane, the clamping grooves CGRa may each have a shape corresponding to a portion of a quadrilateral. When viewed on a plane, the dummy portions DPT1 may have a shape corresponding to the shape of the clamping grooves CGRa. The dummy portions DPT1 may each have a quadrilateral shape.

[0110] When the clamping groove CGRa is defined as a region enclosed by the protrusion PTR and the imaginary line IDL, the ratio of the area of ​​the dummy portion DPT1 to the area of ​​the clamping groove CGRa may be about 0.95 to about 1.05. For example, the area of ​​the clamping groove CGRa and the area of ​​the dummy portion DPT1 may be the same. The area of ​​each of the clamping grooves CGRa may be the same as the area of ​​the corresponding dummy portion DPT1 in the dummy portion DPT1.

[0111] When the mask MK1 is connected to the mask frame MF (see Figure 2A ), the mask MK1 may be stretched. The mask MK1 may be stretched in the first direction DR1 and in the opposite direction of the first direction DR1.

[0112] like Figure 7B As illustrated in , when the mask MK1 is stretched, the mask MK1 may be deformed. The upper and lower surfaces of the mask MK1 may be uneven. Figure 7B As illustrated in , the upper surface of the mask MK1 may include a curved surface. Wrinkles may appear on the upper surface of the mask MK1. For example, a difference between a height of the peak portion PE1 and a height of the concave portion VA1 in the mask MK1 may be about 161.21 μm.

[0113] refer to Fig. 8A and Figure 8B , the unit area CEA1a may not include the dummy part DPT1 (see Fig. 7AWhen viewed on a plane, two sides of the deposition portion DPA opposite to each other in the first direction DR1 may be straight lines parallel to the second direction DR2.

[0114] when Fig. 8A The mask MK1a in the embodiment is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MK1a can be deformed. Figure 8B As illustrated in FIG. 1 , wrinkles may appear on the upper surface of the mask MK1 a . A difference between the height of the peak portion PE1 a and the height of the concave portion VA1 a may be about 354.1 μm.

[0115] refer to Figure 8C and Fig.8D , the cell area CEA1b may include a dummy portion DPT1a and a deposition portion DPA. The area of ​​the dummy portion DPT1a may be smaller than the area of ​​the clamping groove CGRa. For example, the ratio of the area of ​​the dummy portion DPT1a to the area of ​​the clamping groove CGRa may be less than about 0.95.

[0116] When the mask MK1b is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MK1b may be deformed. Fig.8D As illustrated in FIG. 1 , wrinkles may appear on the upper surface of the mask MK1 b . A difference between the height of the peak portion PE1 b and the height of the concave portion VA1 b in the mask MK1 b may be about 201.39 μm.

[0117] refer to Fig. 8E and Figure 8F , the cell area CEA1c may include a dummy portion DPT1b and a deposition portion DPA. The area of ​​the dummy portion DPT1b may be greater than the area of ​​the clamping groove CGRa. For example, the ratio of the area of ​​the dummy portion DPT1b to the area of ​​the clamping groove CGRa may be greater than about 1.05.

[0118] When the mask MK1c is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MK1c can be deformed. Figure 8F As illustrated in , wrinkles may appear on the upper surface of the mask MK1c. A difference between the height of the peak portion PE1c and the height of the concave portion VA1c in the mask MK1c may be about 394.4 μm.

[0119] refer to Figure 7B , Figure 8B , Fig.8D and Figure 8F ,exist Figure 7B The size of the wrinkles appearing on the upper surface of the mask MK1 in the Figure 8B , Fig.8D and Figure 8FThe size of the wrinkles that appear on the upper surfaces of the masks MK1a, MK1b, and MK1c in FIG. Figure 7B When the deposition process is performed while the mask MK1 is in the substrate SUB, the distance between the substrate SUB and the upper surface of the mask MK1 can be effectively reduced. Therefore, the deposition material EV can be deposited on the substrate SUB in a uniform size, and the reliability of the process can be improved.

[0120] Fig. 9A and Fig. 9B A mask according to another embodiment of the present invention is illustrated. FIG. 10A to FIG. 10F A diagram illustrating a mask according to a comparative example.

[0121] In one embodiment, for example, Fig. 9A , Fig. 10A , Fig. 10C and Fig. 10E The example is shown as a plan view.

[0122] In one embodiment, for example, Fig. 9B , Fig. 10B , Fig. 10D and Fig.10F The results obtained by analyzing the sizes of wrinkles appearing on the surfaces of the masks MK2, MK2a, MK2b, and MK2c when the masks MK2, MK2a, MK2b, and MK2c are stretched using a computer program are exemplified.

[0123] For ease of explanation, Fig. 9B , Fig. 10B , Fig. 10D and Fig.10F The unit area CEA can be omitted in Figure 3 ).

[0124] because Fig. 9A , Fig. 10A , Fig. 10C and Fig. 10E The peripheral area NCE, imaginary line IDL and deposition part DPA in Figure 3 The peripheral area NCE, imaginary line IDL and deposition part DPA are the same, so their description will be omitted or simplified.

[0125] refer to Fig. 9A , the cell area CEA2 may include a dummy portion DPT2 and a deposition portion DPA. Fig. 9A and Fig. 9B , when viewed on a plane, for example, the clamping grooves CGRb may each have a shape corresponding to a portion of a polygon (eg, a pentagon). However, embodiments of the present invention are not limited thereto, and the clamping grooves CGRb may each have a shape corresponding to a portion of another polygon.

[0126] When viewed on a plane, the dummy portions DPT2 may have a shape corresponding to the clamping groove CGRb. For example, the dummy portions DPT2 may each have a shape corresponding to a portion of a pentagon.

[0127] The ratio of the area of ​​the dummy portion DPT2 to the area of ​​the clamping groove CGRb defined as the area closed by the protrusion PTR and the imaginary line IDL may be about 0.95 to about 1.05. For example, the area of ​​the clamping groove CGRb and the area of ​​the dummy portion DPT2 may be the same. The area of ​​each of the clamping grooves CGRb may be the same as the area of ​​the corresponding dummy portion DPT2 in the dummy portion DPT2.

[0128] When the mask MK2 is connected to the mask frame MF (see Figure 2A ), the mask MK2 may be stretched. The mask MK2 may be stretched in the first direction DR1 and in the opposite direction of the first direction DR1.

[0129] When the mask MK2 is stretched, the mask MK2 may be deformed. The upper and lower surfaces of the mask MK2 may be uneven. Fig. 9B As illustrated in , the upper surface of the mask MK2 may include a curved surface. Wrinkles may appear on the upper surface of the mask MK2. For example, the difference between the height of the peak portion PE2 and the height of the concave portion VA2 in the mask MK2 may be about 76.71 μm.

[0130] refer to Fig. 10A and Fig. 10B , the cell area CEA2a may not include the dummy portion DPT2 (see Fig. 9A When viewed on a plane, two sides of the deposition portion DPA opposite to each other in the first direction DR1 may be straight lines parallel to the second direction DR2.

[0131] when Fig. 10A The mask MK2a in the embodiment is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MK2a can be deformed. Fig. 10B As illustrated in , wrinkles may appear on the upper surface of the mask MK2a. A difference between the height of the peak portion PE2a and the height of the concave portion VA2a in the mask MK2a may be about 196.58 μm.

[0132] refer to Fig. 10C and Fig. 10D , the cell area CEA2b may include a dummy portion DPT2a and a deposition portion DPA. The area of ​​the dummy portion DPT2a may be smaller than the area of ​​the clamping groove CGRb. For example, the ratio of the area of ​​the dummy portion DPT2a to the area of ​​the clamping groove CGRb may be less than about 0.95.

[0133] When the mask MK2b is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MK2b can be deformed. Fig. 10D As illustrated in FIG. 1 , wrinkles may appear on the upper surface of the mask MK2 b . A difference between the height of the peak portion PE2 b and the height of the concave portion VA2 b may be about 196.58 μm.

[0134] refer to Fig. 10E and Fig.10F , the cell area CEA2c may include a dummy portion DPT2b and a deposition portion DPA. The area of ​​the dummy portion DPT2b may be greater than the area of ​​the clamping groove CGRb. For example, the ratio of the area of ​​the dummy portion DPT2b to the area of ​​the clamping groove CGRb may be greater than about 1.05.

[0135] When the mask MK2c is stretched and connected to the mask frame MF (see Figure 2A ), the upper surface of the mask MK2c may be deformed. Fig.10F As illustrated in , wrinkles may appear on the upper surface of the mask MK2c. A difference between the height of the peak portion PE2c and the height of the concave portion VA2c in the mask MK2c may be about 394.4 μm.

[0136] refer to Fig. 9B , Fig. 10B , Fig. 10D and Fig.10F , appears in Fig. 9B The size of the wrinkles on the upper surface of the mask MK2 in the embodiment may be smaller than that appearing in Fig. 10B , Fig. 10D and Fig.10F The size of the wrinkles on the upper surfaces of the masks MK2a, MK2b and MK2c in FIG. Fig. 9B When the deposition process is performed while the mask MK2 is in the substrate SUB, the distance between the substrate SUB and the upper surface of the mask MK2 can be effectively reduced. Therefore, the deposition material EV can be deposited on the substrate SUB in a uniform size, and the reliability of the process can be improved.

[0137] Fig.11 For use Figure 2A A plan view of a display panel manufactured using the mask assembly illustrated in FIG.

[0138] refer to Fig.11 The display panel DP may have a rectangular shape having short sides extending in the first direction DR1 and long sides extending in the second direction DR2, but the shape of the display panel DP is not limited thereto. The display panel DP may include a display portion DA and a non-display portion NDA surrounding the display portion DA.

[0139] The display panel DP may be a light-emitting display panel. The display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, the display panel DP will be described as an organic light-emitting display panel.

[0140] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, first and second control lines CSL1 and CSL2, first and second power lines PLL1 and PLL2, connection lines CNL, and a plurality of pads PD. m and n are natural numbers greater than 1.

[0141] The pixel PX may be disposed in the display portion DA. The scanning driver SDV and the light emitting driver EDV may be disposed in the non-display portion NDA adjacent to each long side of the display panel DP. The data driver DDV may be disposed in the non-display portion NDA adjacent to any one of the short sides of the display panel DP. When viewed on a plane, the data driver DDV may be adjacent to the lower end of the display panel DP.

[0142] The scan lines SL1 to SLm may extend in the first direction DR1 and may be connected to the pixels PX and the scan driver SDV. The data lines DL1 to DLn may extend in the second direction DR2 and may be connected to the pixels PX and the data driver DDV. The emission lines EL1 to ELm may extend in the first direction DR1 and may be connected to the pixels PX and the light emitting driver EDV.

[0143] The first power line PLL1 may extend in the second direction DR2 and may be disposed in the non-display portion NDA. The first power line PLL1 may be disposed between the display portion DA and the light emitting driver EDV. However, the embodiment of the present invention is not limited thereto, and in another embodiment, the first power line PLL1 may be disposed between the display portion DA and the scan driver SDV.

[0144] The connection line CNL may extend in the first direction DR1 and may be arranged in the second direction DR2. The connection line CNL may be connected to the first power line PLL1 and the pixel PX. The first voltage may be applied to the pixel PX through the first power line PLL1 and the connection line CNL connected to each other.

[0145] The second power line PLL2 may be disposed in the non-display portion NDA. The second power line PLL2 may extend along the long side of the display panel DP and another short side of the display panel DP where the data driver DDV is not disposed. The second power line PLL2 may be disposed outside the scan driver SDV and the light emitting driver EDV.

[0146] Although not illustrated, the second power line PLL2 may extend toward the display portion DA and may be connected to the pixel PX. A second voltage having a level lower than the first voltage may be applied to the pixel PX through the second power line PLL2.

[0147] The first control line CSL1 may be connected to the scan driver SDV and may extend toward the lower end of the display panel DP when viewed on a plane. The second control line CSL2 may be connected to the light emitting driver EDV and may extend toward the lower end of the display panel DP when viewed on a plane. The data driver DDV may be disposed between the first control line CSL1 and the second control line CSL2.

[0148] The pad PD may be disposed on the display panel DP. The pad PD may be adjacent to the lower end of the display panel DP compared to the data driver DDV. The data driver DDV, the first power line PLL1, the second power line PLL2, the first control line CSL1, and the second control line CSL2 may be connected to the pad PD. The data lines DL1 to DLn may be connected to the data driver DDV, and the data driver DDV may be connected to the pads corresponding to the data lines DL1 to DLn.

[0149] The light emitting elements of the display panel DP may be Figure 2A and Figure 2B The unit area CEA illustrated in FIG. is formed.

[0150] A unit area corresponding to such a display panel DP may be defined in the substrate SUB. A light emitting element is disposed in the unit area, and then the unit area may be cut. Thus, a display panel DP may be manufactured. Fig.11 The display panel DP illustrated in FIG.

[0151] Although not illustrated, a timing controller for controlling operations of the scan driver SDV, the data driver DDV, and the light emitting driver EDV and a voltage generator for generating the first voltage and the second voltage may be disposed on the printed circuit board. The timing controller and the voltage generator may be connected to the corresponding pads PD through the printed circuit board.

[0152] The scan driver SDV may generate a plurality of scan signals and may apply the scan signals to the pixels PX through the scan lines SL1 to SLm. The data driver DDV may generate a plurality of data voltages and may apply the data voltages to the pixels PX through the data lines DL1 to DLn. The light emitting driver EDV may generate a plurality of light emitting signals and may apply the light emitting signals to the pixels PX through the emission lines EL1 to Elm.

[0153] The pixel PX may receive a data voltage in response to the scan signal. The pixel PX may display an image by emitting light having brightness corresponding to the data voltage in response to the light emitting signal. The emission time of the pixel PX may be controlled by the light emitting signal.

[0154] The wirings may include data lines DL1 to DLn. The pads connected to the wirings may include Fig.11 The display panel DP on which the light emitting layer of the pixel PX is not formed may be defined as a substrate SUB.

[0155] The following will refer to Fig.13 Describes the cross-sectional structure of the substrate SUB on which the light emitting layer is not formed. The pad PD may be provided in the substrate SUB, and the substrate SUB may be defined as a state where the printed circuit board is not connected. The pad PD may be connected to a ground terminal, and the pad PD and the data lines DL1 to DLn may be grounded.

[0156] Fig.12 Exemplarily illustrate Fig.11 A cross section of a pixel is illustrated in FIG.

[0157] refer to Fig.11 and Fig.12 The pixel PX may be disposed on the base substrate BS and may include a transistor TR and a light emitting element OLED. The transistor TR and the light emitting element OLED of the pixel PX may be connected to the above-mentioned data lines DL1 to DLn and the first and second power lines PLL1 and PLL2.

[0158] The transistor TR and the light emitting element OLED of the pixel PX can be connected through the data lines DL1 to DLn (see Fig.11 ) and the first power line PLL1 and the second power line PLL2 (see Fig.11 )Connect to Fig.11 The pad PD in.

[0159] The light emitting element OLED may include a first electrode AE, a second electrode CE, a hole control layer HCL, an electron control layer ECL, and a light emitting layer EML. The first electrode AE ​​may be an anode, and the second electrode CE may be a cathode.

[0160] The transistor TR and the light emitting element OLED may be disposed on the base substrate BS. One transistor TR is exemplarily illustrated, but the pixel PX may basically include a plurality of transistors for driving the light emitting element OLED and at least one capacitor.

[0161] The display portion DA may include a light emitting portion PA corresponding to the pixel PX and a non-light emitting portion NPA around the light emitting portion PA. The light emitting element OLED may be provided in the light emitting portion PA.

[0162] The base substrate BS may include a flexible plastic substrate. For example, the base substrate BS may include transparent polyimide (PI). The buffer layer BFL may be disposed on the base substrate BS, and the buffer layer BFL may be an inorganic layer.

[0163] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, the embodiments of the present invention are not limited thereto, and the semiconductor pattern may also include amorphous silicon or metal oxide.

[0164] The semiconductor pattern may be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a heavily doped region and a lightly doped region. The heavily doped region may have a higher conductivity than the lightly doped region and may be substantially used as a source electrode and a drain electrode of the transistor TR. The lightly doped region may substantially correspond to an active portion (or channel) of the transistor.

[0165] The source S, active portion A, and drain portion D of the transistor TR may be formed of a semiconductor pattern. A first insulating layer INS1 may be disposed on the semiconductor pattern. A gate portion G of the transistor TR may be disposed on the first insulating layer INS1. A second insulating layer INS2 may be disposed on the gate portion G. A third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0166] The connection electrode CNE may be disposed between the transistor TR and the light emitting element OLED, and may connect the transistor TR and the light emitting element OLED. The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2.

[0167] The first connection electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain D through a first contact hole CH1 defined in the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 may be disposed on the first connection electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0168] The second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a second contact hole CH2 defined in the fifth insulating layer INS5 and the fourth insulating layer INS4. The sixth insulating layer INS6 may be disposed on the second connection electrode CNE2. Each of the first to sixth insulating layers INS1 to INS6 may be an inorganic layer or an organic layer.

[0169] The first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connection electrode CNE2 through a third contact hole CH3 defined in the sixth insulating layer INS6. A pixel defining film PDL exposing a predetermined portion of the first electrode AE ​​may be disposed on the first electrode AE ​​and the sixth insulating layer INS6. An opening PX_OP for exposing a predetermined portion of the first electrode AE ​​may be defined in the pixel defining film PDL.

[0170] The hole control layer HCL may be disposed on the first electrode AE ​​and the pixel definition layer PDL. The hole control layer HCL may be disposed in both the light emitting portion PA and the non-light emitting portion NPA. The hole control layer HCL may include a hole transport layer and a hole injection layer.

[0171] The light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed in a region corresponding to the opening PX_OP. The light emitting layer EML may include an organic material and / or an inorganic material. The light emitting layer EML may generate any one of red light, green light, and blue light.

[0172] The electron control layer ECL may be disposed on the light emitting layer EML and the hole control layer HCL. The electron control layer ECL may be disposed in both the light emitting portion PA and the non-light emitting portion NPA. The electron control layer ECL may include an electron transport layer and an electron injection layer.

[0173] The second electrode CE may be disposed on the electronic control layer ECL. The second electrode CE may be commonly disposed in the pixel PX. A layer from the buffer layer BFL to the light emitting element OLED may be defined as a pixel layer.

[0174] The thin film encapsulation layer TFE may be disposed on the light emitting element OLED. The thin film encapsulation layer TFE may be disposed on the second electrode CE to cover the pixel PX. The thin film encapsulation layer TFE may include at least two inorganic layers and an organic layer between the inorganic layers. The inorganic layer may protect the pixel PX from moisture and / or oxygen. The organic layer may protect the pixel PX from foreign substances such as dust particles.

[0175] A first voltage may be applied to the first electrode AE ​​through the transistor TR, and a second voltage having a level lower than the first voltage may be applied to the second electrode CE. Holes and electrons injected into the light emitting layer EML combine to form excitons, and when the excitons transition to a ground state, the light emitting element OLED may emit light.

[0176] Fig.13 Example Figure 1 The deposition process illustrated in FIG.

[0177] refer to Figure 1 , Fig.12 and Fig.13, the layers from the base substrate BS to the layer on which the first electrode AE ​​is disposed may be defined as a substrate SUB. As described above, the transistor TR may be connected to the pad PD through the data lines DL1 to DLn. That is, the substrate SUB may include the data lines DL1 to DLn defined as wirings and the pad PD connected to the data lines DL1 to DLn.

[0178] The mask MK may be disposed to face the substrate SUB. The mask MK may be disposed close to the substrate SUB. The deposition material EV may be provided on the substrate SUB through the mask opening OP-MK defined in the upper surface of the mask MK. The light emitting layer EML may be disposed on the substrate SUB through the deposition material EV.

[0179] According to an embodiment of the present invention, the mask may include a dummy portion. When viewed on a plane, the shape of the dummy portion may correspond to the shape of each of the clamping grooves defined in both ends of the mask. The area of ​​the dummy portion may be the same as the area of ​​the clamping groove, which is defined as an area closed by an imaginary line connecting the ends of the mask. Accordingly, when the mask is stretched, the size of the wrinkles appearing on the upper surface of the mask can be effectively reduced. Therefore, the reliability of the deposition process can be improved.

[0180] In the above, description has been made with reference to the embodiments, but those skilled in the art or those of ordinary skill in the relevant technical field can understand that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the present invention described in the claims. In addition, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, and all technical ideas within the scope of the attached claims and their equivalents should be interpreted as included within the scope of the present invention.

Claims

1. A mask assembly, comprising: a mask frame having a frame opening defined therein; as well as a mask disposed on an upper surface of the mask frame, and a clamping groove is defined in the mask in at least one of two sides opposite to each other in a first direction, The mask comprises: a unit area having a deposition portion and a dummy portion extending from the deposition portion toward the clamping groove in the first direction, and a peripheral region surrounding the unit region and having the clamping groove defined therein, and The inner surface of the peripheral area defining the clamping groove has a shape corresponding to the outer surface of the dummy portion. 2 . The mask assembly according to claim 1 , wherein a shape of the dummy portion corresponds to a shape of the clamping groove in a plan view. 3 . The mask assembly according to claim 2 , wherein in the plan view, the shape of the clamping groove is symmetrical to the shape of the dummy portion with respect to an axis parallel to a second direction intersecting the first direction. 4 . The mask assembly of claim 3 , wherein the clamping groove has a shape corresponding to a portion of a circle in the plan view. 5 . The mask assembly of claim 3 , wherein the clamping groove has a shape corresponding to a portion of a polygon in the plan view. 6 . The mask assembly of claim 1 , wherein a plurality of mask openings are defined in the deposition part and the dummy part, and the plurality of mask openings overlap the frame opening in a plan view.

7. The mask assembly according to claim 1, further comprising: a first rod, disposed between the mask frame and the mask and extending in the first direction; and A second rod is disposed between the mask frame and the mask and extends in a second direction intersecting the first direction. The mask assembly of claim 7 , wherein the second rod overlaps the dummy portion in a plan view.

9. The mask assembly according to claim 7, wherein in a plan view, the mask frame has a quadrilateral frame shape having short sides extending in the first direction and long sides extending in the second direction, The first rod is disposed in a first slot defined in the upper surface of the mask frame along the long side, and The second rod is disposed in a second groove defined in the upper surface of the mask frame along the short side.

10. The mask assembly according to claim 1, wherein each of the clamping groove and the dummy portion is provided in plural, and The total number of the clamping grooves is the same as the total number of the dummy portions.

11. The mask assembly of claim 1, wherein each of the mask and the mask frame comprises Invar.

12. A mask assembly comprising: a mask frame having a frame opening defined therein; as well as a mask disposed on an upper surface of the mask frame and including a plurality of protrusions disposed on at least one of two sides opposite to each other in a first direction, The mask comprises: Sedimentation Department, a dummy portion extending from at least one of two sides of the deposition portion that are opposite to each other in the first direction, and a peripheral region surrounding the deposition portion and the dummy portion, and wherein the clamping groove is defined between the plurality of protrusions arranged in a second direction intersecting the first direction, and in a plan view, a ratio of an area of ​​the virtual portion to an area of ​​the clamping groove is 0.95 to 1.05, and the clamping groove is defined as an area enclosed by an imaginary line extending in the second direction and connecting the ends of the protrusions and the protrusions. 13 . The mask assembly of claim 12 , wherein the clamping groove has a shape corresponding to the dummy portion in the plan view. 14 . The mask assembly of claim 13 , wherein in the plan view, the shape of the clamping groove is symmetrical to a shape of the dummy portion with respect to an axis parallel to the second direction. 15 . The mask assembly of claim 13 , wherein the dummy portion has a shape corresponding to a portion of a circle in the plan view. 16 . The mask assembly of claim 13 , wherein the dummy portion has a shape corresponding to a portion of a polygon in the plan view.

17. The mask assembly according to claim 12, wherein each of the clamping groove and the dummy portion is provided in plural, and The total number of the clamping grooves is the same as the total number of the dummy portions.

18. The mask assembly of claim 12, further comprising: a first rod, disposed between the mask frame and the mask and extending in the first direction; and A second rod is disposed between the mask frame and the mask and extends in the second direction, wherein the dummy portion overlaps the second rod in the plan view.

19. The mask assembly according to any one of claims 12 to 18, wherein a plurality of mask openings are defined in the dummy portion and the deposition portion, the plurality of mask openings are arranged in the first direction and the second direction, and the plurality of mask openings overlap with the frame opening in the plan view.

20. The mask assembly of claim 12, further comprising a plurality of alignment rods disposed on the upper surface of the mask frame, wherein the mask is disposed between the plurality of alignment rods arranged in the second direction.

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