Plasma enhanced chemical vapor deposition device and method

Abstract

The invention provides a plasma enhanced chemical vapor deposition device and method, and relates to the technical field of plasma surface treatment. The first electric field and the first magnetic field can be formed in the coating area, the coating gas can be ionized into the first charged particles and the first active particles under the action of the first electric field, and the first charged particles can spirally move under the dual action of the first electric field and the first magnetic field; therefore, the energy of the first charged particles is improved, the movement path of the first charged particles is prolonged, and the collision opportunity of the first charged particles and the coating gas molecules is greatly increased, so that the first charged particles can effectively transfer the energy to the coating gas molecules and promote chemical bond breakage of the coating gas molecules; in this way, more first charged particles and first active particles can be generated, when the number of the first active particles is increased, the chemical reaction speed of the first active particles on the surface of the substrate is correspondingly increased, and finally the coating efficiency of the substrate is remarkably improved.

Description

Technical Field

[0001] The present application relates to the technical field of plasma surface treatment, and in particular to a plasma enhanced chemical vapor deposition device and method. Background Art

[0002] Vacuum deposition is a technology that deposits materials on the surface of a substrate and forms a film layer by physical or chemical methods under a vacuum environment. There are many ways to implement it, such as physical vapor deposition (PVD), chemical vapor deposition (CVD) and molecular beam epitaxy (MBE). Generally, for the coating of flexible substrates (such as polyethylene coils, etc.), both PVD and CVD can be used. Although CVD has better winding and conformal properties than PVD, the efficiency of coating is low. In the related art, in order to improve the efficiency of coating flexible substrates using CVD, an electrode roller with a permanent magnet inside can be used to perform plasma enhanced chemical vapor deposition (PECVD) on the flexible substrate. However, due to the limited contact area between the electrode roller and the flexible substrate, and the few adjustable process parameters of the permanent magnet inside the electrode roller, PECVD has little effect on improving the coating efficiency, and the uniformity of the film layer is not ideal. Summary of the invention

[0003] The present application provides a plasma enhanced chemical vapor deposition device and method, aiming to solve the problem of low efficiency of coating a flexible substrate using PECVD in the related art.

[0004] In order to solve the above-mentioned drawbacks existing in the relevant technology, the first aspect of the present application provides a plasma enhanced chemical vapor deposition device, including a vacuum chamber, a vacuum pumping device, a coating device, a coating gas supply device, an unwinding motor, a winding motor, an unwinding roller, a winding roller and a plurality of guide rollers, the vacuum pumping device is connected to the vacuum chamber, the vacuum chamber is divided into a plurality of functional cavities, the plurality of functional cavities include an unwinding chamber, a coating chamber and a winding chamber connected in sequence, the unwinding motor and the unwinding roller are both arranged in the unwinding chamber, the unwinding roller is arranged on the output shaft of the unwinding motor, the winding motor and the winding roller are both arranged in the winding chamber, the winding roller is arranged on the output shaft of the winding motor, the coating device is arranged in the coating chamber, the coating gas supply device is connected to the coating chamber, and the plurality of guide rollers are distributed in the plurality of functional cavities. Specifically, the coating device includes a first electromagnetic component, a first electromagnet driver and a first electrode plate driver. The first electromagnetic component includes two first electrode plates with opposite polarities and parallel to each other. Each first electrode plate is electrically connected to the first electrode plate driver. A plurality of first electromagnets are provided on a surface of each first electrode plate away from the other first electrode plate. Each first electromagnet is electrically connected to the first electromagnet driver. The two first electrode plates are separated to form a coating area in the middle. The substrate to be coated is wound on an unwinding roller. One end of the substrate enters the coating chamber from the unwinding chamber under the guidance of a plurality of guide rollers. The substrate entering the coating chamber enters the winding chamber after passing through the coating area and is arranged on the winding roller. Furthermore, the vacuum pumping device is used to evacuate the vacuum chamber; the unwinding motor and the winding motor are used to drive the unwinding roller and the winding roller to rotate respectively, so as to wind the substrate from the unwinding roller to the winding roller; the coating gas supply device is used to provide coating gas into the coating chamber; the first electrode plate driver is used to drive the two first electrode plates in the first electromagnetic assembly to generate a first electric field in the coating area; the first electromagnet driver is used to drive each first electromagnet in the first electromagnetic assembly to generate a first magnetic field in the coating area; the coating gas is used to be ionized in the first electric field and generate a corresponding first plasma, and the first plasma includes first charged particles and first active particles; the first charged particles are used to generate spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized; the first active particles are used to diffuse to the opposite sides of the substrate and undergo chemical reactions to form a corresponding film layer.

[0005] In some implementations, the coating device includes a plurality of first electromagnetic components, which are arranged at intervals along the height direction of the vacuum chamber, and a coating area is formed between two first electrode plates in each first electromagnetic component. The substrate entering the coating chamber from the unwinding chamber passes through the plurality of coating areas in sequence and then enters the winding chamber and is arranged on the winding roller. In one of the implementations, the first electromagnet is shared between two adjacent first electrode plates in any two adjacent first electromagnetic components.

[0006] In some implementations, the first electromagnet driver includes a first DC power supply and a first current regulator, the first DC power supply is electrically connected to the first current regulator, and the first current regulator is electrically connected to each first electromagnet in each first electromagnetic assembly. The first current regulator is used to: distribute the DC power provided by the first DC power supply to each first electromagnet in each first electromagnetic assembly; and adjust the DC current delivered by the first DC power supply to each first electromagnet in each first electromagnetic assembly to adjust the strength and / or direction of the first magnetic field in each coating area.

[0007] In some implementations, the first electrode plate driver includes a first RF power supply, a first RF matcher, and two conductive plates, each first electrode plate of the same polarity in a plurality of first electromagnetic components is electrically connected to the same conductive plate, and the two conductive plates are electrically connected to two poles of the first RF power supply through the first RF matcher. Specifically, the first RF matcher is used to couple the RF power provided by the first RF power supply to the two first electrode plates in each first electromagnetic component.

[0008] In some implementation schemes, the multiple functional chambers also include a cleaning chamber, which is connected between the unwinding chamber and the coating chamber; the chemical vapor deposition device also includes a cleaning device and a cleaning gas supply device, the cleaning device is arranged in the cleaning chamber, and the cleaning gas supply device is connected to the cleaning chamber; the cleaning device includes a second electromagnetic component, a second electromagnet driver and a second electrode plate driver, the second electromagnetic component includes two second electrode plates with opposite polarities and parallel to each other, each second electrode plate is electrically connected to the second electrode plate driver, and each second electrode plate is provided with a plurality of second electromagnets on a surface away from the other second electrode plate, each second electromagnet is electrically connected to the second electromagnet driver, the two second electrode plates are separated to form a cleaning area in the middle, one end of the substrate wound on the unwinding roller enters the cleaning chamber from the unwinding chamber under the guidance of a plurality of guide rollers, the substrate entering the cleaning chamber enters the coating chamber after passing through the cleaning area, and the substrate entering the coating chamber enters the winding chamber and is arranged on the winding roller after passing through a plurality of coating areas in sequence. Specifically, the clean gas supply device is used to provide clean gas into the clean chamber; the second electrode plate driver is used to drive the two second electrode plates in the second electromagnetic assembly to generate a second electric field in the clean area; the second electromagnet driver is used to drive each second electromagnet in the second electromagnetic assembly to generate a second magnetic field in the clean area; the clean gas is used to be ionized in the second electric field and generate a corresponding second plasma, and the second plasma includes second charged particles and second active particles; the second charged particles are used to generate spiral motion in the second electric field and the second magnetic field to stimulate the clean gas to be ionized; the second active particles are used to diffuse to the opposite sides of the substrate and undergo chemical reactions to clean the opposite sides of the substrate.

[0009] In one of the implementation schemes, the second electromagnet driver includes an electrically connected second DC power supply and a second current regulator, the second current regulator is electrically connected to each second electromagnet in the second electromagnetic assembly, and the second current regulator is used to: distribute the DC power provided by the second DC power supply to each second electromagnet; and adjust the DC current delivered by the second DC power supply to each second electromagnet to adjust the strength and / or direction of the second magnetic field. In one of the implementation schemes, the second electrode plate driver includes a second RF power supply and a second RF matcher, the two second electrode plates in the second electromagnetic assembly are electrically connected to the two poles of the second RF power supply through the second RF matcher, and the second RF matcher is used to couple the RF power provided by the second RF power supply to the two second electrode plates. In one of the implementation schemes, for adjacent second electromagnetic assemblies and first electromagnetic assemblies, the adjacent second electrode plates and first electrode plates share the electromagnets.

[0010] In some implementations, the chemical vapor deposition apparatus further includes a plurality of baffles disposed in the vacuum chamber, each of which is provided with a passage for the substrate to pass through, and the plurality of baffles are used to separate the vacuum chamber into an unwinding chamber, a cleaning chamber, a coating chamber, and a winding chamber that are connected in sequence. The cleaning chamber and the coating chamber are both located on one side of the vacuum chamber, the unwinding chamber and the winding chamber are both located on the other side opposite to the vacuum chamber, the cleaning chamber and the unwinding chamber are both located above the vacuum chamber, and the coating chamber and the winding chamber are both located below the vacuum chamber.

[0011] In some implementation schemes, the chemical vapor deposition device also includes a central controller, and the vacuum pumping device, the coating device, the coating gas supply device, the unwinding motor, the winding motor, the cleaning device and the cleaning gas supply device are respectively communicatively connected to the central controller, and the central controller is used to control the operation of the vacuum pumping device, the coating device, the coating gas supply device, the unwinding motor, the winding motor, the cleaning device and the cleaning gas supply device.

[0012] In some implementation schemes, the chemical vapor deposition device further includes a first measuring roller and a second measuring roller, the first measuring roller and the second measuring roller are respectively connected to the central controller by communication, the first measuring roller and the second measuring roller are respectively arranged in the unwinding chamber and the winding chamber, one end of the substrate wound on the unwinding roller enters the cleaning chamber under the guidance of the first measuring roller, and the substrate entering the winding chamber from the coating chamber is arranged on the winding roller under the guidance of the second measuring roller. Specifically, the first measuring roller is used to measure the first pressure data of the substrate on itself in real time during the process of the substrate being wound from the unwinding roller to the winding roller. The second measuring roller is used to measure the second pressure data of the substrate on itself in real time during the process of the substrate being wound from the unwinding roller to the winding roller. The central controller is used to: calculate the first tension data of the substrate according to the first pressure data; calculate the second tension data of the substrate according to the second pressure data; respectively determine whether the first tension data and the second tension data are within the preset tension range; when the first tension data is not within the preset tension range, adjust the speed of the unwinding motor so that the first tension data is within the preset tension range; when the second tension data is not within the preset tension range, adjust the speed of the winding motor so that the second tension data is within the preset tension range.

[0013] In one of the implementation schemes, the first measuring roller includes a first roller body, on which is provided a first pressure sensing component which is communicatively connected to the central controller, and the first pressure sensing component is used to measure in real time the first pressure data of the substrate on the first roller body during the process of the substrate being wound from the unwinding roller to the winding roller; the second measuring roller includes a second roller body, on which is provided a second pressure sensing component which is communicatively connected to the central controller, and the second pressure sensing component is used to measure in real time the second pressure data of the substrate on the second roller body during the process of the substrate being wound from the unwinding roller to the winding roller.

[0014] In some implementation schemes, the chemical vapor deposition device also includes a first monitoring roller and a second monitoring roller that are communicatively connected to the central controller, the first monitoring roller and the second monitoring roller are respectively arranged in the unwinding chamber and the winding chamber, one end of the substrate wound on the unwinding roller enters the cleaning chamber under the guidance of the first measuring roller and the first monitoring roller, and the substrate entering the winding chamber from the coating chamber is arranged on the winding roller under the guidance of the second monitoring roller and the second measuring roller; wherein the first monitoring roller is used to measure the first number of revolutions of the substrate in real time during the process of the substrate being wound from the unwinding roller to the winding roller; the second monitoring roller is used to measure the second number of revolutions of the substrate in real time during the process of the substrate being wound from the unwinding roller to the winding roller; the central controller is also used to calculate the first length traveled by the substrate according to the first number of revolutions, and calculate the second length traveled by the substrate according to the second number of revolutions. In one of the implementation schemes, the first monitoring roller includes a first roller body and a first encoder having a first gear, the first gear is arranged on one end of the first roller body to rotate synchronously with the first roller body, and the first encoder is used to record the number of revolutions rotated by the first gear to obtain a first number of revolutions; the second monitoring roller includes a second roller body and a second encoder having a second gear, the second gear is arranged on one end of the second roller body to rotate synchronously with the second roller body, and the second encoder is used to record the number of revolutions rotated by the second gear to obtain a second number of revolutions.

[0015] In some implementations, the vacuum pumping device includes a first vacuum pumping assembly, a second vacuum pumping assembly, a third vacuum pumping assembly, and a fourth vacuum pumping assembly, which are respectively arranged on the outer wall of the vacuum chamber, wherein the first vacuum pumping assembly is connected to the unwinding chamber, the second vacuum pumping assembly is connected to the winding chamber, the third vacuum pumping assembly is connected to the cleaning chamber, and the fourth vacuum pumping assembly is connected to the coating chamber. Specifically, the first vacuum pumping assembly is used to vacuum the unwinding chamber; the second vacuum pumping assembly is used to vacuum the winding chamber; the third vacuum pumping assembly is used to vacuum the cleaning chamber; and the fourth vacuum pumping assembly is used to vacuum the coating chamber.

[0016] In one of the implementation schemes, the first vacuum pumping component includes a first screw pump and a first vacuum valve, and the first screw pump is connected to the unwinding chamber through the first vacuum valve; the second vacuum pumping component includes a second screw pump and a second vacuum valve, and the second screw pump is connected to the winding chamber through the second vacuum valve; the third vacuum pumping component includes a third screw pump and a plurality of third vacuum valves, one end of the plurality of third vacuum valves is respectively connected to the cleaning chamber, and the other end is respectively connected to the third screw pump; the fourth vacuum pumping component includes a plurality of vacuum pumping units, and the plurality of vacuum pumping units are spaced apart along the height direction of the vacuum chamber, and each vacuum pumping unit includes a fourth screw pump and a plurality of fourth vacuum valves, one end of the plurality of fourth vacuum valves is respectively connected to the coating chamber, and the other end is respectively connected to the fourth screw pump.

[0017] In some implementation schemes, a plurality of observation windows are provided on the outer wall of the vacuum chamber, and the plurality of observation windows correspond to the plurality of functional cavities; the chemical vapor deposition also includes a cooling water pipe, which is coiled on the outer wall of the vacuum chamber and is used to transport cooling water.

[0018] The second aspect of the present application provides a plasma enhanced chemical vapor deposition method, which is applied to the chemical vapor deposition device provided in the first aspect of the present application, comprising: winding a substrate to be coated on an unwinding roller; using a plurality of guide rollers to guide one end of the substrate from the unwinding chamber into the coating chamber, and allowing the substrate entering the coating chamber to enter the winding chamber after passing through the coating area to be arranged on the winding roller; using a vacuum pumping device to evacuate the vacuum chamber; using a coating gas supply device to provide coating gas into the coating chamber; using the coating device to generate a first electric field and a first magnetic field in the coating area, The coating gas entering the coating area is ionized in the first electric field and generates a first plasma, the first plasma includes first charged particles and first active particles, the first charged particles generate a spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized; the unwinding roller and the winding roller are driven to rotate by the unwinding motor and the winding motor respectively, so as to wind the substrate from the unwinding roller to the winding roller; in the process of winding the substrate from the unwinding roller to the winding roller, the first active particles diffuse to the opposite sides of the substrate and undergo a chemical reaction to form a corresponding film layer.

[0019] The chemical vapor deposition device provided in the first aspect of the present application is composed of a vacuum chamber, a vacuum pumping device, a coating device, a coating gas supply device, an unwinding motor, a winding motor, an unwinding roller, a winding roller and a plurality of guide rollers. The vacuum pumping device is connected to the vacuum chamber. The vacuum chamber is divided into a plurality of functional chambers (i.e., an unwinding chamber, a coating chamber and a winding chamber connected in sequence). The unwinding motor is driven and connected to the unwinding roller and both are arranged in the unwinding chamber. The winding motor is driven and connected to the winding roller and both are arranged in the winding chamber. The coating device is arranged in the coating chamber. The coating gas supply device is connected to the unwinding motor, and the winding motor is driven and connected to the winding roller. The air device is connected to the coating chamber, and multiple guide rollers are distributed in multiple functional chambers; wherein, the coating device is composed of a first electromagnetic component, a first electromagnet driver and a first electrode plate driver, the first electromagnetic component includes two first electrode plates with opposite polarities and parallel to each other, each first electrode plate is electrically connected to the first electrode plate driver, and each first electrode plate is provided with multiple first electromagnets on a surface away from the other first electrode plate, each first electromagnet is electrically connected to the first electromagnet driver, and the two first electrode plates are separated to form a coating area in the middle. In practical applications, the substrate to be coated can be wound on the unwinding roller, and then a plurality of guide rollers are used to guide one end of the substrate from the unwinding chamber into the coating chamber, and the substrate entering the coating chamber enters the winding chamber after passing through the coating area, so that one end of the substrate can be set on the winding roller, and then the vacuum chamber can be evacuated by the vacuum pumping device. After the vacuum pumping is completed, the coating air supply device and the coating device are started, and the unwinding motor and the winding motor are used to drive the unwinding roller and the winding roller to rotate respectively, so as to wind the substrate from the unwinding roller to the winding chamber. On the roller, during this process, the coating gas supply device will provide coating gas into the coating chamber, and the coating device will generate a first electric field and a first magnetic field in the coating area, so that the coating gas entering the coating area is ionized in the first electric field and generates a corresponding first plasma (including first charged particles and first active particles), and the first charged particles will generate a spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized, and the first active particles will diffuse to the opposite sides of the substrate and undergo a chemical reaction to form a corresponding film layer.It can be seen that the present application can form a first electric field and a first magnetic field in the coating area. Under the action of the first electric field, the coating gas will be ionized into first charged particles and first active particles, and the first charged particles will produce spiral motion under the dual action of the first electric field and the first magnetic field, which increases the energy of the first charged particles and prolongs their movement path, greatly increasing the chance of collision between the first charged particles and the coating gas molecules, so that the first charged particles can effectively transfer energy to the coating gas molecules and cause the chemical bonds of the coating gas molecules to break, so that more first charged particles and first active particles can be generated. When the number of first active particles increases, the rate at which the first active particles undergo chemical reactions on the surface of the substrate is also accelerated accordingly, that is, more first active particles can form a film layer on the surface of the substrate faster, ultimately significantly improving the coating efficiency of the substrate. At the same time, the existence of the first magnetic field can also make the distribution of the first active particles on the surface of the substrate more uniform, thereby improving the uniformity and quality of the film layer. In addition, compared with the limited contact area between the substrate and the electrode roller in the traditional solution, the present application designs the coating area between two parallel first electrode plates and allows the substrate to pass through the coating area, which is equivalent to increasing the contact area between the substrate and the electrode roller in the traditional solution, and can further improve the coating efficiency of the substrate.

[0020] Regarding the chemical vapor deposition method provided in the second aspect of the present application, since it is implemented based on the chemical vapor deposition device provided in the first aspect of the present application, the chemical vapor deposition method has all the advantages of the chemical vapor deposition device provided in the first aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the related technologies or the embodiments of the present application, the drawings required for use in the description of the related technologies or the embodiments of the present application will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, not all embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of a chemical vapor deposition device provided in an embodiment of the present application;

[0023] Figure 2 A schematic diagram of the structure of a chemical vapor deposition device provided in an embodiment of the present application;

[0024] Figure 3 A front view of a chemical vapor deposition device provided in an embodiment of the present application;

[0025] Figure 4 A left side view of a chemical vapor deposition device provided in an embodiment of the present application;

[0026] Figure 5 A schematic flow chart of a chemical vapor deposition method provided in an embodiment of the present application.

[0027] The symbols in the above drawings represent:

[0028] 1-vacuum chamber, 2-vacuum pumping device, 3-coating device, 4-coating air supply device, 5-unwinding roller, 6-winding roller, 7-guide roller, 8-cleaning device, 9-cleaning air supply device, 101-first measuring roller, 102-second measuring roller, 103-first monitoring roller, 104-second monitoring roller, 105-baffle, 106-observation window, 107-cooling water pipe, 108-flange interface, 11-unwinding chamber, 12-coating chamber, 13-winding chamber, 14-cleaning chamber, 21-first vacuum pumping assembly, 22-second vacuum pumping assembly, 23-third vacuum pumping assembly, 24-fourth vacuum pumping assembly, 211-first screw pump, 212 -first vacuum valve, 221-second screw pump, 222-second vacuum valve, 231-third screw pump, 232-third vacuum valve, 241-vacuum unit, 2411-fourth screw pump, 2412-fourth vacuum valve, 31-first electromagnetic assembly, 311-first electrode plate, 312-first electromagnet, 3111-coating area, 71-small size guide roller, 72-large size guide roller, 81-second electromagnetic assembly, 811-second electrode plate, 812-second electromagnet, 8111-cleaning area, 1031-first roller body, 1032-first gear, 1041-second roller body, 1042-second gear. DETAILED DESCRIPTION

[0029] In the related art, in order to improve the efficiency of coating a flexible substrate using CVD, an electrode roller with a permanent magnet inside can be used to perform PECVD (plasma enhanced chemical vapor deposition) on the flexible substrate. However, due to the limited contact area between the electrode roller and the flexible substrate and the small number of adjustable process parameters of the permanent magnet inside the electrode roller, PECVD has little effect on improving the coating efficiency, and the uniformity of the film layer is not ideal. Therefore, the present application proposes a plasma enhanced chemical vapor deposition device and method in the following embodiments to solve the above-mentioned drawbacks in the related art.

[0030] In order to make the purpose, technical solutions and advantages of the present application more obvious and easy to understand, the present application will be clearly and completely described below in conjunction with the embodiments of the present application and the corresponding drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. It should be understood that the embodiments of the present application described below are only used to explain the present application and are not used to limit the present application, that is, based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0031] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 This is the schematic diagram of the chemical vapor deposition device. Figure 2 It is a schematic diagram of the structure of a chemical vapor deposition device. Figure 3 is a front view of a chemical vapor deposition apparatus. Figure 4It is a left side view of the chemical vapor deposition apparatus. The present embodiment provides a plasma enhanced chemical vapor deposition device, comprising a vacuum chamber 1, a vacuum pumping device 2, a coating device 3, a coating gas supply device 4, an unwinding motor (not shown), a winding motor (not shown), an unwinding roller 5, a winding roller 6 and a plurality of guide rollers 7. The vacuum chamber 1 is divided into a plurality of functional chambers (not shown). The plurality of functional chambers comprise an unwinding chamber 11, a coating chamber 12 and a winding chamber 13 connected in sequence. The vacuum pumping device 2 is connected to the vacuum chamber 1. The unwinding motor and the unwinding roller 5 are both arranged in the unwinding chamber 11. The unwinding roller 5 is arranged on the output shaft of the unwinding motor (that is, the unwinding motor is driven and connected to the unwinding roller 5). The winding motor and the winding roller 6 are both arranged in the winding chamber 13. The winding roller 6 is arranged on the output shaft of the winding motor (that is, the winding motor is driven and connected to the winding roller 6). The coating device 3 is arranged in the coating chamber 12. The coating gas supply device 4 is connected to the coating chamber 12. The plurality of guide rollers 7 are distributed in the plurality of functional chambers. Specifically, the coating device 3 includes a first electromagnetic component 31, a first electromagnet driver (not shown) and a first electrode plate driver (not shown). The first electromagnetic component 31 includes two first electrode plates 311 with opposite polarities and in parallel. Each first electrode plate 311 is electrically connected to the first electrode plate driver. A plurality of first electromagnets 312 are provided on a surface of each first electrode plate 311 away from the other first electrode plate 311. Each first electromagnet 312 is electrically connected to the first electromagnet driver. The two first electrode plates 311 are separated to form a coating area 3111 in the middle. The substrate to be coated is wound on the unwinding roller 5. One end of the substrate enters the coating chamber 12 from the unwinding chamber 11 under the guidance of a plurality of guide rollers 7. The substrate entering the coating chamber 12 enters the winding chamber 13 after passing through the coating area 3111 and is arranged on the winding roller 6.

[0032] In this embodiment, the vacuum pumping device 2 is used to evacuate the vacuum chamber 1; the unwinding motor and the winding motor are used to drive the unwinding roller 5 and the winding roller 6 to rotate respectively, so as to wind the substrate from the unwinding roller 5 to the winding roller 6. During this process, the substrate moves at a uniform speed along the winding path, which is the unwinding chamber 11→the coating chamber 12 (i.e., the coating area 3111)→the winding chamber 13; the coating gas supply device 4 is used to provide the coating gas into the coating chamber 12; the first electrode plate driver is used to drive the two first electrode plates 311 in the first electromagnetic assembly 31 to A first electric field is generated in the coating area 3111; the first electromagnet driver is used to drive each first electromagnet 312 in the first electromagnet assembly 31 to generate a first magnetic field in the coating area 3111; the coating gas is used to be ionized in the first electric field and generate a corresponding first plasma (including first charged particles and first active particles); the first charged particles are used to generate a spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized; the first active particles are used to diffuse to the opposite sides of the substrate and undergo a chemical reaction to form a corresponding film layer.

[0033] That is to say, the actual coating process of the substrate is: winding the substrate on the unwinding roller 5; using multiple guide rollers 7 to guide one end of the substrate from the unwinding chamber 11 into the coating chamber 12, and allowing the substrate entering the coating chamber 12 to enter the winding chamber 13 after passing through the coating area 3111, and then placing the end of the substrate entering the winding chamber 13 on the winding roller 6; using the vacuum pumping device 2 to evacuate the vacuum chamber 1; after the vacuum pumping is completed, the vacuum degree in the vacuum chamber 1 meets the coating requirements, and the coating gas supply device 4 and the coating device 3 are started; using the unwinding motor and the winding motor to drive the unwinding roller 5 and the winding roller 6 to rotate respectively, so as to wind the substrate from the unwinding roller 5 to the winding roller 6; when the substrate moves at a uniform speed along the winding path, the coating gas supply device 4 will provide coating gas to the coating chamber 12, and the first electrode plate driver will drive the second electrode plate driver to ... Two first electrode plates 311 in an electromagnetic component 31 are used to generate a first electric field in the coating area 3111. The first electromagnet driver drives each first electromagnet 312 in the first electromagnetic component 31 to generate a first magnetic field in the coating area 3111. The coating gas entering the coating area 3111 is ionized in the first electric field and generates a corresponding first plasma. The first charged particles in the first plasma generate a spiral motion under the dual effects of the first electric field and the first magnetic field to stimulate the coating gas to be ionized, and the first active particles in the first plasma diffuse to the opposite sides of the substrate and undergo a chemical reaction, and finally form corresponding film layers on the opposite sides of the substrate. After the substrate is completely wound onto the winding roller 6, the finished product (i.e., the substrate with the film layer) can be removed from the winding roller 6.

[0034] In this embodiment, after the vacuum chamber 1 is evacuated by the vacuum pumping device 2, that is, after the vacuum degree in the vacuum chamber 1 is reduced to a target value that meets the chemical vapor deposition, it is not necessary to turn off the vacuum pumping device 2, but it is necessary to keep the vacuum pumping device 2 working continuously until the chemical vapor deposition of the substrate is completed. The reason is as follows: Chemical vapor deposition belongs to a continuous production method, which requires that the vacuum degree in the vacuum chamber 1 remain highly stable throughout the production process. Even if the vacuum degree in the vacuum chamber 1 fluctuates briefly, it will lead to uneven film thickness, composition deviation or defects, which ultimately affect the quality of the product. Keeping the vacuum pumping device 2 working continuously is the key to maintaining a highly stable vacuum degree in the vacuum chamber 1. In addition, it should be noted that the function of the vacuum pumping device 2 is not limited to maintaining the vacuum degree in the vacuum chamber 1. The vacuum pumping device 2 is also used to discharge the exhaust gas in the vacuum chamber 1 during the chemical vapor deposition process. The exhaust gas here refers to the residual coating gas in the coating chamber 12 and the gaseous substances generated when the first active particles undergo a chemical reaction on the substrate surface. Of course, it also refers to the residual cleaning gas in the cleaning chamber 14 described below and the gaseous substances generated when the second active particles undergo a chemical reaction on the substrate surface.

[0035] In this embodiment, since the substrate needs to be wound from the unwinding roller 5 to the winding roller 6, the substrate should be made of a material with good flexibility in the field, such as aluminum foil, copper foil, carbon fiber reinforced composite material (CFRP), polyimide (PI), polycarbonate (PC), polyester (PET), polyethylene (PE), polypropylene (PP), etc., which can be selected according to actual needs, and this embodiment does not make a sole limitation on this. In addition to the gases (such as silane, ammonia, oxygen, etc.) necessary for forming a film layer on the surface of the substrate, the coating gas in this embodiment may also include some carrier gases (such as argon, nitrogen and helium, etc.). When the film layer coated on the substrate is different, the coating gas used is also different, which can be selected according to actual needs, and this embodiment does not make a sole limitation on this. For example, with a polyimide coil as the substrate and silane and ammonia as the coating gas, a silicon nitride film can be formed on the opposite sides of the polyimide coil by the chemical vapor deposition device of this embodiment.

[0036] In this embodiment, the control of the vacuum pumping device 2, the coating device 3, the coating gas supply device 4, the unwinding motor and the winding motor, etc. can be either manual or automatic. However, in order to improve the intelligence and automation level of the chemical vapor deposition device, the control of the vacuum pumping device 2, the coating device 3, the coating gas supply device 4, the unwinding motor and the winding motor, etc. is preferably automatic control; of course, it is not limited to the vacuum pumping device 2, the coating device 3, the coating gas supply device 4, the unwinding motor and the winding motor. For other devices described below (such as the cleaning device 8, the cleaning gas supply device 9, etc.), the control of these devices is also preferably automatic control. Specifically, when the vacuum device 2, the coating device 3, the coating gas supply device 4, the unwinding motor, the winding motor, the cleaning device 8 and the cleaning gas supply device 9 are controlled automatically, the chemical vapor deposition device includes, in addition to the structure given above, a central controller that is communicatively connected to the vacuum device 2, the coating device 3, the coating gas supply device 4, the unwinding motor, the winding motor, the cleaning device 8 and the cleaning gas supply device 9, respectively, and is used to control the vacuum device 2, the coating device 3, the coating gas supply device 4, the unwinding motor, the winding motor, the cleaning device 8 and the cleaning gas supply device 9. Exemplarily, the central controller can be any device commonly used in the art with control and data processing and analysis functions, such as a micro-controller such as a small computer, a single-chip microcomputer, an industrial control computer (IPC), a programmable logic controller (PLC), a distributed control system (DCS), etc., which can be selected according to actual needs, and this embodiment does not make a sole limitation on this.

[0037] As can be seen from the above, the present embodiment can form a first electric field and a first magnetic field in the coating area 3111. Under the action of the first electric field, the coating gas will be ionized into first charged particles and first active particles, and the first charged particles will produce spiral motion under the dual action of the first electric field and the first magnetic field, which increases the energy of the first charged particles and prolongs their motion path, greatly increasing the chance of collision between the first charged particles and the coating gas molecules, so that the first charged particles can effectively transfer energy to the coating gas molecules and cause the chemical bonds of the coating gas molecules to break, so that more first charged particles and first active particles can be generated. When the number of first active particles increases, the rate at which the first active particles undergo chemical reactions on the substrate surface is also accelerated accordingly, that is, more first active particles can form a film layer on the substrate surface faster, ultimately significantly improving the coating efficiency of the substrate. At the same time, the existence of the first magnetic field can also make the distribution of the first active particles on the substrate surface more uniform, thereby improving the uniformity and quality of the film layer. In addition, compared with the limited contact area between the substrate and the electrode roller in the traditional solution, the present embodiment designs the coating area 3111 between two parallel first electrode plates 311 and allows the substrate to pass through the coating area 3111, which is equivalent to increasing the contact area between the substrate and the electrode roller in the traditional solution, which can not only further improve the coating efficiency of the substrate, but also further improve the uniformity and quality of the film layer.

[0038] In some embodiments, see Figures 1 to 4 , the coating device 3 may include one first electromagnetic component 31, or may include multiple first electromagnetic components 31. When multiple first electromagnetic components 31 are included, these first electromagnetic components 31 are arranged at intervals along the height direction of the vacuum chamber 1 (i.e., the coating chamber 12), and a coating area 3111 is formed between the two first electrode plates 311 in each first electromagnetic component 31. Then, after one end of the substrate wound on the unwinding roller 5 enters the coating chamber 12 from the unwinding chamber 11, it will sequentially pass through the multiple coating areas 3111 and enter the winding chamber 13, and finally be set on the winding roller 6. Preferably, the coating device 3 includes multiple first electromagnetic components 31, and the first electromagnet 312 is shared between the adjacent two first electrode plates 311 in any two adjacent first electromagnetic components 31; combined Figure 1 , assuming that the four first electrode plates 311 in two adjacent first electromagnetic assemblies 31 are a, b, c, and d from top to bottom, then the first electromagnet 312 is shared by b and c; it can be understood that if the first electromagnet 312 is not shared by b and c, then it is necessary to set a group of first electromagnets 312 on b and another group of first electromagnets 312 on c, and if the first electromagnet 312 is shared by b and c, then only one group of first electromagnets 312 is required, and this group of first electromagnets 312 belongs to both b and c, thereby reducing the number of first electromagnets 312 used and reducing the production cost of the chemical vapor deposition device.

[0039] Based on this, the multiple guide rollers 7 can be divided into multiple large-size guide rollers 72 and multiple small-size guide rollers 71. One end of each first electromagnetic assembly 31 (i.e., the coating area 3111) is provided with a large-size guide roller 72, and the other end is provided with two small-size guide rollers 71; Figure 1 From the perspective of a single coating area 3111, the end of the coating area 3111 provided with a small-sized guide roller 71 is defined as the first end, and the end of the coating area 3111 provided with a large-sized guide roller 72 is defined as the second end. Then, under the sequential guidance of the small-sized guide roller 71 located above, the large-sized guide roller 72, and the small-sized guide roller 71 located below, the substrate will first pass from the first end of the coating area 3111 to the second end, and then pass back from the second end of the coating area 3111 to the first end, and finally pass out from the first end of the coating area 3111 and enter the coating area 3111 in the next first electromagnetic component 31, and so on, until it passes through all the coating areas 3111 and then enters the winding chamber 13. It can be understood that when the coating device 3 includes multiple first electromagnetic components 31, this movement path of the substrate in the coating chamber 12 can make the first active particles fully diffuse on the two opposite sides of the substrate, and the first active particles are more evenly distributed on the surface of the substrate, thereby improving the uniformity and quality of the film layer.

[0040] In some embodiments, see Figures 1 to 4 , the first electromagnet driver includes a first DC power supply (not shown) and a first current regulator (not shown), the first DC power supply is electrically connected to the first current regulator, the first current regulator is electrically connected to each first electromagnet 312 in each first electromagnet assembly 31, and the first current regulator is communicatively connected to the central controller. Specifically, the first current regulator is used to distribute the DC power provided by the first DC power supply to each first electromagnet 312 in each first electromagnet assembly 31, so as to generate a first magnetic field in each coating area 3111; the central controller is used to control the first current regulator to adjust the DC current delivered by the first DC power supply to each first electromagnet 312 in each first electromagnet assembly 31, so as to adjust the intensity and / or direction of the first magnetic field in each coating area 3111. That is to say, in the actual coating process of the substrate, the DC current delivered by the first DC power supply to each first electromagnet 312 in each first electromagnet assembly 31 can be adjusted by the first current regulator, thereby adjusting the intensity and / or direction of the first magnetic field in each coating area 3111. It can be seen that compared with the traditional solution in which the permanent magnet inside the electrode roller has fewer adjustable process parameters, the coating device 3 of the present application has higher process parameter adjustability, can adapt to different coating requirements, and has a wider range of applications.

[0041] In some embodiments, see Figures 1 to 4, the first electrode plate driver includes a first RF power supply (not shown), a first RF matcher (not shown) and two conductive plates (not shown), and each first electrode plate 311 with the same polarity in the plurality of first electromagnetic components 31 is electrically connected to the same conductive plate, and the two conductive plates are electrically connected to the two poles of the first RF power supply through the first RF matcher. Specifically, the first RF matcher is used to couple the RF power provided by the first RF power supply to the two first electrode plates 311 in each first electromagnetic component 31, so as to generate a first electric field in each coating area 3111. It can be understood that since the energy received by the two first electrode plates 311 in the first electromagnetic component 31 is the RF power from the first RF power supply, the first electric field generated in the coating area 3111 is actually a RF electric field, which is a kind of high-frequency electric field.

[0042] In some embodiments, see Figures 1 to 4 In addition to the unwinding chamber 11, the coating chamber 12 and the winding chamber 13, the multiple functional chambers in the vacuum chamber 1 also include a cleaning chamber 14, which is connected between the unwinding chamber 11 and the coating chamber 12; based on this, the chemical vapor deposition device, in addition to the structure given above, also includes a cleaning device 8 and a clean gas supply device 9, the cleaning device 8 is arranged in the clean chamber 14, and the clean gas supply device 9 is connected to the clean chamber 14.

[0043] Specifically, the cleaning device 8 includes a second electromagnetic component 81, a second electromagnet driver (not shown in the figure) and a second electrode plate driver (not shown in the figure). The second electromagnetic component 81 includes two second electrode plates 811 with opposite polarities and parallel to each other. Each second electrode plate 811 is electrically connected to the second electrode plate driver. A plurality of second electromagnets 812 are provided on a surface of each second electrode plate 811 away from the other second electrode plate 811. Each second electromagnet 812 is electrically connected to the second electromagnet driver. The two second electrode plates 811 are separated to form a cleaning area 8111 in the middle. In this case, one end of the substrate wound on the unwinding roller 5 enters the cleaning chamber 14 from the unwinding chamber 11 under the guidance of multiple guide rollers 7. The substrate entering the cleaning chamber 14 enters the coating chamber 12 after passing through the cleaning area 8111. The substrate entering the coating chamber 12 enters the winding chamber 13 and is arranged on the winding roller 6 after passing through multiple coating areas 3111 in sequence; that is, the winding path of the substrate is unwinding chamber 11→cleaning chamber 14 (i.e., cleaning area 8111)→coating chamber 12 (i.e., coating area 3111)→winding chamber 13. It should be noted that the cleaning device 8 may include one second electromagnetic component 81, or may include multiple second electromagnetic components 81, which can be selected according to actual needs, and this application does not make a sole limitation on this. Preferably, the cleaning device 8 includes one second electromagnetic component 81.

[0044] Further, the cleaning gas supply device 9 is used to provide cleaning gas into the cleaning chamber 14; the second electrode plate driver is used to drive the two second electrode plates 811 in the second electromagnetic assembly 81 so as to generate a second electric field in the cleaning area 8111; the second electromagnet driver is used to drive each second electromagnet 812 in the second electromagnetic assembly 81 so as to generate a second magnetic field in the cleaning area 8111; the cleaning gas is used to be ionized in the second electric field and generate a corresponding second plasma (including second charged particles and second active particles); the second charged particles in the second plasma are used to generate spiral motion in the second electric field and the second magnetic field to stimulate the cleaning gas to be ionized; the second active particles in the second plasma are used to diffuse to the opposite sides of the substrate and react chemically to clean the opposite sides of the substrate. In addition, it should be noted that the cleaning gas provided by the cleaning gas supply device 9 is such as argon, oxygen, hydrogen, nitrogen and carbon tetrafluoride, etc., which can be selected according to actual needs, and this application does not make a sole limitation on this.

[0045] That is to say, in the actual coating process of the substrate, after the vacuum chamber 1 is evacuated by the vacuum pumping device 2 and the vacuum degree in the vacuum chamber 1 meets the coating requirement, not only the coating gas supply device 4 and the coating device 3 are started, but also the cleaning gas supply device 9 and the cleaning device 8 are started, and then the unwinding motor and the winding motor are used to drive the unwinding roller 5 and the winding roller 6 to rotate respectively, so as to wind the substrate from the unwinding roller 5 to the winding roller 6; when the substrate moves at a uniform speed along the winding path, the cleaning gas supply device 9 will provide cleaning gas to the cleaning chamber 14, the second electrode plate driver will drive the two second electrode plates 811 in the second electromagnetic assembly 81 to generate a second electric field in the cleaning area 8111, and the second electromagnet driver will drive Each second electromagnet 812 in the second electromagnetic assembly 81 generates a second magnetic field in the cleaning area 8111. The cleaning gas entering the cleaning area 8111 will be ionized in the second electric field and generate a corresponding second plasma. The second charged particles in the second plasma will generate a spiral motion under the dual action of the second electric field and the second magnetic field to stimulate the cleaning gas to be ionized, and the second active particles in the second plasma will diffuse to the opposite sides of the substrate and undergo a chemical reaction. In this way, the pollutants (such as oil stains, etc.) on the surface of the substrate can be decomposed into small molecular gaseous substances and discharged with the exhaust gas, thereby finally achieving the cleaning of the substrate surface; thereafter, the substrate will enter the coating chamber 12 from the cleaning chamber 14 for subsequent coating. In addition, it should be noted that the cleaning of the substrate in the cleaning chamber 14 not only depends on the chemical reaction of the second active particles on the surface of the substrate, but also depends on the physical bombardment of the second charged particles on the surface of the substrate. The second charged particles have higher kinetic energy. When they hit the surface of the substrate, they can peel off the pollutants on the surface of the substrate. This physical bombardment is very effective in removing dust, granular pollutants and some weakly attached organic matter on the surface of the substrate.

[0046] It can be understood that a second electric field and a second magnetic field are formed in the cleaning area 8111. Under the action of the second electric field, the cleaning gas will be ionized into second charged particles and second active particles, and the second charged particles will produce spiral motion under the dual action of the second electric field and the second magnetic field, which increases the energy of the second charged particles and prolongs their movement path, greatly increasing the chance of collision between the second charged particles and the cleaning gas molecules, so that the second charged particles can effectively transfer energy to the cleaning gas molecules and cause the chemical bonds of the cleaning gas molecules to break, thereby generating more second charged particles and second active particles. When the number of second active particles increases, the chemical reaction intensity of the second active particles on the substrate surface increases accordingly, and the physical bombardment intensity of the second charged particles on the substrate surface also increases accordingly, which ultimately significantly enhances the cleaning effect of the substrate surface. In addition, the second active particles can not only remove pollutants on the surface of the substrate, but also realize activation treatment of the surface of the substrate. Under the action of the second active particles, the molecular bonds on the surface of the substrate are broken, thereby forming some active sites, which increases the roughness and specific surface area of ​​the substrate surface, thereby improving the wettability, adhesion and other properties of the substrate surface, which is beneficial to subsequent processing (such as subsequent coating in the coating chamber 12).

[0047] As one or more embodiments thereof, the second electromagnet driver includes a second DC power supply (not shown) and a second current regulator (not shown), the second DC power supply is electrically connected to the second current regulator, the second current regulator is electrically connected to each second electromagnet 812 in the second electromagnetic assembly 81, and the second current regulator is communicatively connected to the central controller. Specifically, the second current regulator is used to distribute the DC power provided by the second DC power supply to each second electromagnet 812 in the second electromagnetic assembly 81, so as to generate a second magnetic field in the cleaning area 8111; the central controller is used to control the second current regulator to adjust the DC current delivered by the second DC power supply to each second electromagnet 812 in the second electromagnetic assembly 81, so as to adjust the strength and / or direction of the second magnetic field in the cleaning area 8111. That is to say, in the actual coating process of the substrate, the DC current delivered by the second DC power supply to each second electromagnet 812 in the second electromagnetic assembly 81 can be adjusted by the second current regulator, thereby adjusting the strength and / or direction of the second magnetic field in the cleaning area 8111. It can be seen that compared with the traditional solution in which the permanent magnet inside the electrode roller has fewer adjustable process parameters, the cleaning device 8 of the present application has higher process parameter adjustability, can adapt to different cleaning needs, and has a wider range of applications.

[0048] As one or more embodiments thereof, the second electrode plate driver includes a second RF power supply (not shown in the figure) and a second RF matcher (not shown in the figure), and the two second electrode plates 811 in the second electromagnetic assembly 81 are electrically connected to the two poles of the second RF power supply through the second RF matcher. Specifically, the second RF matcher is used to couple the RF power provided by the second RF power supply to the two second electrode plates 811 in the second electromagnetic assembly 81, so as to generate a second electric field in the clean area 8111. It can be understood that since the energy received by the two second electrode plates 811 in the second electromagnetic assembly 81 is the RF power from the second RF power supply, the second electric field generated in the clean area 8111 is actually a RF electric field, which is a type of high-frequency electric field.

[0049] As one or more embodiments, for the adjacent second electromagnetic assembly 81 and the first electromagnetic assembly 31, the adjacent second electrode plate 811 and the first electrode plate 311 share the electromagnet; Figure 1 , the adjacent second electromagnetic component 81 and the first electromagnetic component 31 are actually the second electromagnetic component 81 located at the bottom in the cleaning chamber 14 and the first electromagnetic component 31 located at the top in the coating chamber 12. Assuming that the two second electrode plates 811 in the second electromagnetic component 81 located at the bottom in the cleaning chamber 14 are e and f from top to bottom, and the two first electrode plates 311 in the first electromagnetic component 31 located at the top in the coating chamber 12 are g and h from top to bottom, then the electromagnet will be shared between f and g; it can be understood that if the electromagnet is not shared between f and g, then it is necessary to set a group of second electromagnets 812 on f and a group of first electromagnets 312 on g, and if the electromagnet is shared between f and g, then only a group of electromagnets (a group of first electromagnets 312 or second electromagnets 812) is required between f and g, and this group of electromagnets belongs to both f and g, thereby reducing the number of electromagnets used and reducing the production cost of the chemical vapor deposition device.

[0050] In some embodiments, see Figures 1 to 4In order to ensure the independence of the multiple functional chambers in the vacuum chamber 1 and avoid interference between different functional chambers, the chemical vapor deposition device includes, in addition to the structure given above, a plurality of baffles 105 arranged in the vacuum chamber 1, each of which is provided with a passage for the substrate to pass through, and the plurality of baffles 105 are used to separate the interior of the vacuum chamber 1 into a sequentially connected unwinding chamber 11, a cleaning chamber 14, a coating chamber 12 and a winding chamber 13. It can be understood that the vacuum chamber 1 is divided into a plurality of sequentially connected functional chambers by a plurality of baffles 105, and each baffle 105 is provided with a passage for the substrate to pass through, so that the winding requirements of the substrate can be met, and any two connected functional chambers can be guaranteed to be non-interfering to the greatest extent, so that the effect of the function realized in each functional chamber (such as the cleaning effect in the cleaning chamber 14, the coating effect in the coating chamber 12, etc.) can be optimized, thereby ensuring the overall chemical vapor deposition effect. In addition, it should be noted that the distribution of functional chambers such as the unwinding chamber 11, the cleaning chamber 14, the coating chamber 12 and the winding chamber 13 in the vacuum chamber 1 can be set according to actual needs, and the present application does not make a sole limitation on this; illustratively, the cleaning chamber 14 and the coating chamber 12 are both located on one side of the vacuum chamber 1 (such as the left side), the unwinding chamber 11 and the winding chamber 13 are both located on the other side opposite to the vacuum chamber 1 (such as the right side), the cleaning chamber 14 and the unwinding chamber 11 are both located above the vacuum chamber 1, and the coating chamber 12 and the winding chamber 13 are both located below the vacuum chamber 1.

[0051] In some embodiments, see Figures 1 to 4In addition to the structure given above, the chemical vapor deposition device also includes a first measuring roller 101 and a second measuring roller 102, which are respectively connected to the central controller for communication, and are respectively arranged in the unwinding chamber 11 and the winding chamber 13; in this case, one end of the substrate wound on the unwinding roller 5 enters the cleaning chamber 14 under the guidance of the first measuring roller 101, that is, the substrate needs to bypass the first measuring roller 101 at a certain wrap angle before entering the cleaning chamber 14 from the unwinding chamber 11, and the substrate entering the winding chamber 13 from the coating chamber 12 is arranged on the winding roller 6 under the guidance of the second measuring roller 102, that is, after the substrate enters the winding chamber 13 from the coating chamber 12, it needs to bypass the second measuring roller 102 at a certain wrap angle, and then be arranged on the winding roller 6. Specifically, the first measuring roller 101 is used to measure the first pressure data of the substrate on itself in real time during the process of the substrate being wound from the unwinding roller 5 to the winding roller 6. The second measuring roller 102 is used to measure the second pressure data of the substrate on itself in real time during the process of the substrate being wound from the unwinding roller 5 to the winding roller 6. The central controller is used to: calculate the first tension data of the substrate according to the first pressure data; calculate the second tension data of the substrate according to the second pressure data; determine whether the first tension data is within the preset tension range, and determine whether the second tension data is within the preset tension range; if the first tension data is not within the preset tension range, then adjust the speed of the unwinding motor so that the first tension data is within the preset tension range; if the second tension data is not within the preset tension range, then adjust the speed of the winding motor so that the second tension data is within the preset tension range.

[0052] That is to say, in the actual coating process of the substrate, when the substrate moves along the winding path, the substrate applies pressure to the first measuring roller 101 and the second measuring roller 102, and the first measuring roller 101 can sense the first pressure data of the substrate on itself in real time and transmit it to the central controller, and the second measuring roller 102 can also sense the second pressure data of the substrate on itself in real time and transmit it to the central controller, and the central controller can calculate the corresponding first tension data in combination with the first pressure data and some pre-stored parameters (such as the inherent parameters of the first measuring roller 101, the inherent parameters of the substrate, etc.), and calculate the corresponding second tension data in combination with the second pressure data and some pre-stored parameters (such as the inherent parameters of the second measuring roller 102, the inherent parameters of the substrate, etc.), and then the central controller can judge respectively Whether the first tension data and the second tension data are within the preset tension range, when the central controller determines that the first tension data is not within the preset tension range, the central controller will control the unwinding motor to adjust its own speed (i.e., adjust the speed of the unwinding roller 5), thereby adjusting the tension of the substrate in the unwinding chamber 11, and finally making the first tension data within the preset tension range, thereby ensuring that the substrate can move at a uniform speed along the winding path; similarly, when the central controller determines that the second tension data is not within the preset tension range, the central controller will control the winding motor to adjust its own speed (i.e., adjust the speed of the winding roller 6), thereby adjusting the tension of the substrate in the winding chamber 13, and finally making the second tension data within the preset tension range, thereby ensuring that the substrate can move at a uniform speed along the winding path. In addition, it should be noted that the inherent parameters of the first measuring roller 101 and the second measuring roller 102 may include but are not limited to radius, diameter, circumference, friction coefficient and wrap angle with the substrate, and the inherent parameters of the substrate may include but are not limited to initial length, width, thickness, cross-sectional area and elastic modulus.

[0053] As one or more embodiments thereof, the first measuring roller 101 includes a first roller body (not shown), a first pressure sensing component (not shown) is provided on the first roller body, the first pressure sensing component is communicatively connected to the central controller, and the first pressure sensing component is used to measure the first pressure data of the substrate on the first roller body in real time during the process of the substrate being wound from the unwinding roller 5 to the winding roller 6; correspondingly, the second measuring roller 102 includes a second roller body (not shown), a second pressure sensing component (not shown) is provided on the second roller body, the second pressure sensing component is communicatively connected to the central controller, and the second pressure sensing component is used to measure the second pressure data of the substrate on the second roller body in real time during the process of the substrate being wound from the unwinding roller 5 to the winding roller 6. In addition, it should be noted that whether it is the first measuring roller 101 or the second measuring roller 102, it can include one pressure sensor or multiple pressure sensors, which can be selected according to actual needs, and this application does not make a sole limitation on this.

[0054] In some embodiments, see Figures 1 to 4In addition to the structure given above, the chemical vapor deposition device also includes a first monitoring roller 103 and a second monitoring roller 104 which are communicatively connected to the central controller, and the first monitoring roller 103 and the second monitoring roller 104 are respectively arranged inside the unwinding chamber 11 and the winding chamber 13; in this case, one end of the substrate wound on the unwinding roller 5 will enter the cleaning chamber 14 under the guidance of the first measuring roller 101 and the first monitoring roller 103 in turn, that is, before the substrate enters the cleaning chamber 14 from the unwinding chamber 11, it is necessary to first bypass the first measuring roller 101 at a certain wrap angle, and then bypass the first monitoring roller 103 at a certain wrap angle, and the substrate entering the winding chamber 13 from the coating chamber 12 will be successively arranged on the winding roller 6 under the guidance of the second monitoring roller 104 and the second measuring roller 102, that is, after the substrate enters the winding chamber 13 from the coating chamber 12, it is necessary to first bypass the second monitoring roller 104 at a certain wrap angle, and then bypass the second measuring roller 102 at a certain wrap angle, and finally be arranged on the winding roller 6.

[0055] Specifically, the first monitoring roller 103 is used to measure the first number of revolutions of the substrate in real time during the process of the substrate being wound from the unwinding roller 5 to the winding roller 6; the second monitoring roller 104 is used to measure the second number of revolutions of the substrate in real time during the process of the substrate being wound from the unwinding roller 5 to the winding roller 6; the central controller is also used to calculate the first length traveled by the substrate based on the first number of revolutions, and to calculate the second length traveled by the substrate based on the second number of revolutions. That is to say, in the actual coating process of the substrate, when the substrate moves at a constant speed along the winding path, the first monitoring roller 103 and the second monitoring roller 104 will both rotate, and the first monitoring roller 103 can measure the first number of rotations of itself in real time and transmit it to the central controller, and the second monitoring roller 104 can measure the second number of rotations of itself in real time and transmit it to the central controller, and the central controller can calculate the first length traveled by the substrate in combination with the first number of rotations and some pre-stored parameters (such as the inherent parameters of the first monitoring roller 103, the inherent parameters of the substrate, etc.), and calculate the second length traveled by the substrate in combination with the second number of rotations and some pre-stored parameters (such as the inherent parameters of the second monitoring roller 104, the inherent parameters of the substrate, etc.). Subsequently, the central controller can position the substrate according to the first length and the second length, and can also judge the stretching condition of the substrate, for example: when the first length is equal to the second length, it means that the substrate has not been stretched; when the first length is different from the second length, it means that the substrate has been stretched, and the greater the difference between the first length and the second length, the more severe the stretching of the substrate. In addition, it should be noted that the inherent parameters of the first monitoring roller 103 and the second monitoring roller 104 may include but are not limited to radius, diameter, circumference, friction coefficient and wrap angle with the substrate.

[0056] In fact, the central controller can directly calculate the stretched length of the substrate. For example, taking the calculation of the stretched length of the substrate in the unwinding chamber 11 as an example, the specific calculation process can be divided into three steps: the first step is to record the inherent parameters of the substrate, such as the initial length L 0 , cross-sectional area A and elastic modulus E, etc., are pre-stored in the central controller; the second step is to monitor the tension change of the substrate in the unwinding chamber 11 in real time. When the substrate moves along the winding path, the first tension T of the substrate is monitored in real time by the first measuring roller 101. The change of the first tension T will reflect the stretching / contraction of the substrate; the third step is to calculate the stretching length of the substrate in the unwinding chamber 11. According to Hooke's law, the strain ε of the substrate material is related to the change of the stretching length of the substrate, and the strain ε is proportional to the stress σ, that is, σ=E×ε, where the stress σ can be calculated from the first tension T and the cross-sectional area A, that is, σ=T / A, then assuming that the stretching length of the substrate in the unwinding chamber 11 is ΔL, the strain ε can be expressed as ε=ΔL / L 0 , set σ = T / A and ε = ΔL / L 0 Substituting σ = E × ε, we can get T / A = E × (ΔL / L 0 ), from which it can be deduced that the stretched length of the substrate in the unwinding chamber 11 is ΔL=(T×L 0 ) / (E×A).

[0057] As one or more embodiments thereof, the first monitoring roller 103 includes a first roller body 1031 and a first encoder (not shown) having a first gear 1032, the first gear 1032 being disposed on one end of the first roller body 1031 to rotate synchronously with the first roller body 1031, and the first encoder being used to record the number of revolutions made by the first gear 1032 to obtain a first number of revolutions; the second monitoring roller 104 includes a second roller body 1041 and a second encoder (not shown) having a second gear 1042, the second gear 1042 being disposed on one end of the second roller body 1041 to rotate synchronously with the second roller body 1041, and the second encoder being used to record the number of revolutions made by the second gear 1042 to obtain a second number of revolutions. It can be understood that since the first gear 1032 rotates synchronously with the first roller body 1031, the first encoder only needs to record the number of rotations of the first gear 1032 to obtain the first number of rotations of the first roller body 1031; similarly, since the second gear 1042 rotates synchronously with the second roller body 1041, the second encoder only needs to record the number of rotations of the second gear 1042 to obtain the second number of rotations of the second roller body 1041.

[0058] Exemplarily, taking the calculation of the first length traveled by the substrate as an example, the specific calculation process can be divided into three steps: the first step is to determine the circumference C of the first monitoring roller 103, which is a fixed value that can be obtained by measuring or obtaining the specification parameters of the chemical vapor deposition device and is pre-stored in the central controller; the second step is to calculate the relationship between the number of pulses of the first encoder and the first number of turns of the first roller body 1031. The first encoder will send a certain number of pulse signals every time the first gear 1032 rotates one circle or every time it passes a certain angle. Suppose the number of pulses sent by the first encoder every time the first gear 1032 rotates one circle is N, then when the number of pulses sent by the first encoder is P, the number of turns n of the first gear 1032 can be calculated by the formula n=P / N; the third step is to calculate the first length traveled by the substrate. Since the first roller body 1031 rotates synchronously with the first gear 1032, the number of turns n of the first gear 1032 is the first number of turns of the first roller body 1031, so the first length traveled by the substrate is C×n=C×(P / N).

[0059] In some embodiments, see Figures 1 to 4 The vacuum pumping device 2 includes a first vacuum pumping component 21, a second vacuum pumping component 22, a third vacuum pumping component 23 and a fourth vacuum pumping component 24. The first vacuum pumping component 21, the second vacuum pumping component 22, the third vacuum pumping component 23 and the fourth vacuum pumping component 24 are all arranged on the outer wall of the vacuum chamber 1. The first vacuum pumping component 21 is connected to the unwinding chamber 11, the second vacuum pumping component 22 is connected to the winding chamber 13, the third vacuum pumping component 23 is connected to the cleaning chamber 14, and the fourth vacuum pumping component 24 is connected to the coating chamber 12. Specifically, the first vacuum pumping component 21 is used to vacuum the unwinding chamber 11; the second vacuum pumping component 22 is used to vacuum the winding chamber 13; the third vacuum pumping component 23 is used to vacuum the cleaning chamber 14; and the fourth vacuum pumping component 24 is used to vacuum the coating chamber 12. It can be seen that the present application configures a vacuum pumping component for each functional chamber in the vacuum chamber 1, so that the independence between multiple functional chambers in the vacuum chamber 1 can be better guaranteed.

[0060] As one or more embodiments thereof, the first vacuum pumping component 21 includes a first screw pump 211 and a first vacuum valve 212 which are communicatively connected to the central controller, the first vacuum valve 212 is arranged on the outer wall of the vacuum chamber 1, and the first screw pump 211 is connected to the unwinding chamber 11 through the first vacuum valve 212; the second vacuum pumping component 22 includes a second screw pump 221 and a second vacuum valve 222 which are communicatively connected to the central controller, the second vacuum valve 222 is arranged on the outer wall of the vacuum chamber 1, and the second screw pump 221 is connected to the winding chamber 13 through the second vacuum valve 222; the third vacuum pumping component 23 includes a third screw pump 231 which is communicatively connected to the central controller and a plurality of third vacuum valves 232, and the plurality of third vacuum valves 232 are all arranged in the vacuum chamber. 1, one end of the plurality of third vacuum valves 232 is respectively connected to the cleaning chamber 14, and the other end of the plurality of third vacuum valves 232 is respectively connected to the third screw pump 231; the fourth vacuum pumping assembly 24 includes a plurality of vacuum pumping units 241 which are communicatively connected to the central controller, and the plurality of vacuum pumping units 241 are spaced apart along the height direction of the vacuum chamber 1 (i.e., the coating chamber 12), and each vacuum pumping unit 241 includes a fourth screw pump 2411 which is communicatively connected to the central controller and a plurality of fourth vacuum valves 2412, and the plurality of fourth vacuum valves 2412 are all arranged on the outer wall of the vacuum chamber 1, one end of the plurality of fourth vacuum valves 2412 is respectively connected to the coating chamber 12, and the other end of the plurality of fourth vacuum valves 2412 is respectively connected to the fourth screw pump 2411. It can be understood that each vacuum pumping assembly in the present application includes at least one screw pump and at least one vacuum valve, and the central controller can control the switch of each vacuum valve, and can also control the start and stop of each screw pump, thereby realizing the vacuum pumping of each functional chamber. In addition, it should be noted that Figures 1 to 4 As an example only, the number of screw pumps and vacuum valves in each vacuum assembly can be selected according to actual needs, and this application does not make a sole limitation on this.

[0061] In some embodiments, see Figures 1 to 4 In addition to the structure given above, the chemical vapor deposition device also includes a plurality of observation windows 106, and the plurality of observation windows 106 are all arranged on the outer wall of the vacuum chamber 1, and the plurality of observation windows 106 correspond to the plurality of functional cavities in the vacuum chamber 1. In other words, the staff can observe each functional cavity in the vacuum chamber 1 through these observation windows 106, so as to understand the condition of the substrate in each functional cavity in real time; wherein, for a single functional cavity in the vacuum chamber 1, one observation window 106 can be configured for it, or two or more observation windows 106 can be configured for it, and the specific selection can be based on actual needs, and this application does not make a sole limitation on this. In addition, a plurality of flange interfaces 108 are reserved on the outer wall of the vacuum chamber 1 to facilitate the subsequent functional expansion of the chemical vapor deposition device.

[0062] In some embodiments, see Figures 1 to 4 In addition to the structure given above, the chemical vapor deposition device also includes a cooling water pipe 107 for conveying cooling water, and the cooling water pipe 107 is coiled on the outer wall of the vacuum chamber 1. It can be understood that whether it is the cleaning of the substrate surface in the cleaning chamber 14 or the coating of the substrate surface in the coating chamber 12, there is a chemical reaction of active particles on the substrate surface, and the chemical reaction is usually accompanied by the release of heat, which leads to the temperature rise in the vacuum chamber 1 (especially the cleaning chamber 14 and the coating chamber 12). Excessive temperature is bound to affect the chemical vapor deposition of the substrate. Therefore, the present application is equipped with a cooling water circulation system for the chemical vapor deposition device, and the cooling water pipe 107 of the cooling water circulation system is coiled on the outer wall of the vacuum chamber 1, so that the vacuum chamber 1 (especially the cleaning chamber 14 and the coating chamber 12) can be cooled down, avoiding the excessive temperature affecting the chemical vapor deposition of the substrate. In addition, since the technology of the cooling water circulation system in this field is very mature, the present application does not elaborate on the structure and working principle of the cooling water circulation system.

[0063] See also Figure 5 , Figure 5 It is a flow chart of a chemical vapor deposition method. The present embodiment provides a plasma enhanced chemical vapor deposition method, which is applied to the plasma enhanced chemical vapor deposition device described above, that is, the chemical vapor deposition method is implemented based on the chemical vapor deposition device described above. Specifically, the chemical vapor deposition method includes the following steps 501 to 507 (abbreviated as S501 to S507), namely: S501, winding the substrate to be coated on an unwinding roller; S502, using a plurality of guide rollers to guide one end of the substrate from the unwinding chamber into the coating chamber, and allowing the substrate entering the coating chamber to enter the winding chamber after passing through the coating area to be arranged on the winding roller; S503, using a vacuum pumping device to evacuate the vacuum chamber; S504, using a coating gas supply device to provide coating gas into the coating chamber; S505, using a coating device to generate a first electric field and a first electric field in the coating area. A magnetic field is used to ionize the coating gas entering the coating area in the first electric field and generate a first plasma, wherein the first plasma includes first charged particles and first active particles, and the first charged particles generate a spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized; S506, the unwinding motor and the winding motor are used to drive the unwinding roller and the winding roller to rotate respectively, so as to wind the substrate from the unwinding roller to the winding roller; S507, in the process of winding the substrate from the unwinding roller to the winding roller, the first active particles diffuse to the opposite sides of the substrate and react chemically to form a corresponding film layer. In addition, it should be noted that for any incomplete description of the plasma enhanced chemical vapor deposition method, please refer to the relevant description of the plasma enhanced chemical vapor deposition device in the previous text, and this embodiment will not be elaborated here.

[0064] The above embodiments are only preferred implementations of the present application, and they are not the only limitations on the plasma enhanced chemical vapor deposition device and related methods; in this regard, those skilled in the art can flexibly set them according to the actual application scenarios based on the above embodiments. It can be understood that through the implementation of the above embodiments of the present application, a plasma enhanced chemical vapor deposition device is formed by using a vacuum chamber 1, a vacuum pumping device 2, a coating device 3, a coating gas supply device 4, an unwinding motor, a winding motor, an unwinding roller 5, a winding roller 6 and a plurality of guide rollers 7. The vacuum pumping device 2 is connected to the vacuum chamber 1, and the vacuum chamber 1 is divided into a plurality of functional chambers (i.e., an unwinding chamber 11, a coating chamber 12 and a winding chamber 13 connected in sequence). The unwinding motor is driven and connected to the unwinding roller 5 and both are arranged in the unwinding chamber 11. The winding motor is driven and connected to the winding roller 6 and both are arranged in the winding chamber 13. The coating device 3 is arranged in the coating chamber 12. The coating air supply device 4 is connected to the coating chamber 12, and multiple guide rollers 7 are distributed in multiple functional chambers; wherein, the coating device 3 is composed of a first electromagnetic component 31, a first electromagnet driver and a first electrode plate driver, the first electromagnetic component 31 includes two first electrode plates 311 with opposite polarities and parallel to each other, each first electrode plate 311 is electrically connected to the first electrode plate driver, and each first electrode plate 311 is provided with multiple first electromagnets 312 on one side away from the other first electrode plate 311, each first electromagnet 312 is electrically connected to the first electromagnet driver, and the two first electrode plates 311 are separated to form a coating area 3111 in the middle. In practical applications, the substrate to be coated can be wound on the unwinding roller 5, and then a plurality of guide rollers 7 are used to guide one end of the substrate from the unwinding chamber 11 into the coating chamber 12, and the substrate entering the coating chamber 12 enters the winding chamber 13 after passing through the coating area 3111, so that one end of the substrate is set on the winding roller 6, and then the vacuum chamber 1 can be evacuated by the vacuum pumping device 2. After the vacuum pumping is completed, the coating air supply device 4 and the coating device 3 are started, and the unwinding motor and the winding motor are used to drive the unwinding roller 5 and the winding roller 6 to rotate respectively, so as to remove the substrate from the unwinding roller 5. Winding onto the winding roller 6, during this process, the coating gas supply device 4 will provide coating gas into the coating chamber 12, and the coating device 3 will generate a first electric field and a first magnetic field in the coating area 3111, so that the coating gas entering the coating area 3111 is ionized in the first electric field and generates a corresponding first plasma (including first charged particles and first active particles), and the first charged particles will generate a spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized, and the first active particles will diffuse to the opposite sides of the substrate and undergo a chemical reaction to form a corresponding film layer.It can be seen that the present application can form a first electric field and a first magnetic field in the coating area 3111. Under the action of the first electric field, the coating gas will be ionized into first charged particles and first active particles, and the first charged particles will produce spiral motion under the dual action of the first electric field and the first magnetic field, which increases the energy of the first charged particles and prolongs their motion path, greatly increasing the chance of collision between the first charged particles and the coating gas molecules, so that the first charged particles can effectively transfer energy to the coating gas molecules and cause the chemical bonds of the coating gas molecules to break, thereby generating more first charged particles and first active particles. When the number of first active particles increases, the first active particles on the surface of the substrate are The rate of chemical reaction is also accelerated accordingly, that is, more first active particles can form a film layer on the surface of the substrate faster, ultimately significantly improving the coating efficiency of the substrate. At the same time, the existence of the first magnetic field can make the first active particles more evenly distributed on the surface of the substrate, thereby improving the uniformity and quality of the film layer. In addition, compared with the limited contact area between the substrate and the electrode roller in the traditional scheme, the present application designs the coating area 3111 between two parallel first electrode plates 311 and allows the substrate to pass through the coating area 3111, which is equivalent to increasing the contact area between the substrate and the electrode roller in the traditional scheme, which can not only further improve the coating efficiency of the substrate, but also further improve the uniformity and quality of the film layer.

[0065] It should be noted that the several embodiments shown in the present application above are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can refer to each other. It should also be noted that in the text description of the present application, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is such an actual relationship or order between these entities or operations. Further, the terms "include", "comprise" or any other corresponding variants are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only these elements, but also other elements that are not explicitly listed, or may also include elements inherent to such a process, method, article or device; and, in the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0066] In addition, by implementing the several embodiments shown above in the present application, professionals and technicians in this field can implement or use the present application. For the several embodiments shown above in the present application, various modifications will be obvious to professionals and technicians in this field, and the general principles defined in the present application can be implemented in other embodiments not shown without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the several embodiments shown above, but will conform to the widest range consistent with the principles and novel features disclosed in the present application.

Claims

1. A plasma enhanced chemical vapor deposition device, characterized in that: It comprises a vacuum chamber, a vacuum pumping device, a coating device, a coating air supply device, an unwinding motor, a winding motor, an unwinding roller, a winding roller and a plurality of guide rollers, wherein the vacuum pumping device is connected to the vacuum chamber, and the vacuum chamber is divided into a plurality of functional chambers, wherein the plurality of functional chambers comprise an unwinding chamber, a coating chamber and a winding chamber connected in sequence, wherein the unwinding motor and the unwinding roller are both arranged in the unwinding chamber, wherein the unwinding roller is arranged on the output shaft of the unwinding motor, wherein the winding motor and the winding roller are both arranged in the winding chamber, wherein the winding roller is arranged on the output shaft of the winding motor, wherein the coating device is arranged in the coating chamber, wherein the coating air supply device is connected to the coating chamber, and wherein the plurality of guide rollers are distributed in the plurality of functional chambers; The coating device includes a first electromagnetic component, a first electromagnet driver and a first electrode plate driver, the first electromagnetic component includes two first electrode plates with opposite polarities and parallel to each other, each of the first electrode plates is electrically connected to the first electrode plate driver, a plurality of first electromagnets are arranged on a surface of each first electrode plate away from another first electrode plate, each of the first electromagnets is electrically connected to the first electromagnet driver, two first electrode plates are spaced apart to form a coating area in the middle, a substrate to be coated is wound on the unwinding roller, one end of the substrate enters the coating chamber from the unwinding chamber under the guidance of the plurality of guide rollers, the substrate entering the coating chamber enters the winding chamber after passing through the coating area and is arranged on the winding roller; The vacuum pumping device is used to vacuum the vacuum chamber; The unwinding motor and the winding motor are used to drive the unwinding roller and the winding roller to rotate respectively, so as to wind the substrate from the unwinding roller to the winding roller; the coating gas supply device is used to provide coating gas into the coating chamber; The first electrode plate driver is used to drive the two first electrode plates to generate a first electric field in the coating area; The first electromagnet driver is used to drive each of the first electromagnets to generate a first magnetic field in the coating area; the coating gas is used to be ionized in the first electric field and generate a corresponding first plasma, and the first plasma includes first charged particles and first active particles; the first charged particles are used to generate spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized; the first active particles are used to diffuse to the opposite sides of the substrate and undergo chemical reactions to form corresponding film layers.

2. The chemical vapor deposition device according to claim 1, characterized in that: The coating device includes a plurality of the first electromagnetic components, which are arranged at intervals along the height direction of the vacuum chamber. The coating area is formed between the two first electrode plates in each of the first electromagnetic components. The substrate entering the coating cavity from the unwinding cavity enters the winding cavity and is arranged on the winding roller after passing through the plurality of the coating areas in sequence.

3. The chemical vapor deposition device according to claim 2, characterized in that: The first electromagnet is shared between two adjacent first electrode plates in any two adjacent first electromagnetic assemblies.

4. The chemical vapor deposition device according to claim 2, characterized in that: The first electromagnet driver includes a first DC power supply and a first current regulator, the first DC power supply is electrically connected to the first current regulator, and the first current regulator is electrically connected to each of the first electromagnets in each of the first electromagnetic components; wherein, The first current regulator is used to: distribute the DC power provided by the first DC power supply to each of the first electromagnets in each of the first electromagnetic components; and adjust the DC current delivered by the first DC power supply to each of the first electromagnets in each of the first electromagnetic components to adjust the intensity and / or direction of the first magnetic field in each of the coating areas.

5. The chemical vapor deposition device according to claim 2, characterized in that: The first electrode plate driver includes a first RF power supply, a first RF matcher and two conductive plates. The first electrode plates of the same polarity in the plurality of first electromagnetic components are electrically connected to the same conductive plate. The two conductive plates are electrically connected to the two poles of the first RF power supply through the first RF matcher, respectively. The first RF matcher is used to couple the RF power provided by the first RF power supply to the two first electrode plates in each of the first electromagnetic components.

6. The chemical vapor deposition device according to claim 2, characterized in that: The plurality of functional chambers further include a cleaning chamber, wherein the cleaning chamber is connected between the unwinding chamber and the coating chamber; The chemical vapor deposition device further comprises a cleaning device and a cleaning gas supply device, wherein the cleaning device is arranged in the cleaning chamber, and the cleaning gas supply device is connected to the cleaning chamber; The cleaning device comprises a second electromagnetic component, a second electromagnet driver and a second electrode plate driver, the second electromagnetic component comprises two second electrode plates with opposite polarities and in parallel, each of the second electrode plates is electrically connected to the second electrode plate driver, a plurality of second electromagnets are arranged on a surface of each second electrode plate away from the other second electrode plate, each of the second electromagnets is electrically connected to the second electromagnet driver, two second electrode plates are spaced apart to form a cleaning area in the middle, one end of the substrate wound on the unwinding roller enters the cleaning chamber from the unwinding chamber under the guidance of the plurality of guide rollers, the substrate entering the cleaning chamber enters the coating chamber after passing through the cleaning area, the substrate entering the coating chamber enters the winding chamber after passing through the plurality of coating areas in sequence and is arranged on the winding roller; The cleaning gas supply device is used to provide cleaning gas into the cleaning chamber; the second electrode plate driver is used to drive the two second electrode plates to generate a second electric field in the cleaning area; The second electromagnet driver is used to drive each of the second electromagnets to generate a second magnetic field in the cleaning area; the cleaning gas is used to be ionized in the second electric field and generate a corresponding second plasma, wherein the second plasma includes second charged particles and second active particles; The second charged particles are used to generate spiral motion in the second electric field and the second magnetic field to stimulate the cleaning gas to be ionized; the second active particles are used to diffuse to the two opposite sides of the substrate and undergo chemical reactions to clean the two opposite sides of the substrate.

7. The chemical vapor deposition device according to claim 6, characterized in that: The second electromagnet driver includes a second DC power supply and a second current regulator electrically connected, and the second current regulator is electrically connected to each of the second electromagnets; wherein, The second current regulator is used to: distribute the DC power provided by the second DC power supply to each of the second electromagnets; and adjust the DC current delivered by the second DC power supply to each of the second electromagnets to adjust the intensity and / or direction of the second magnetic field.

8. The chemical vapor deposition device according to claim 6, characterized in that: The second electrode plate driver includes a second RF power supply and a second RF matcher, and the two second electrode plates are electrically connected to the two poles of the second RF power supply through the second RF matcher, and the second RF matcher is used to couple the RF power provided by the second RF power supply to the two second electrode plates.

9. The chemical vapor deposition device according to claim 6, characterized in that: It also includes a plurality of baffles, each of which is disposed in the vacuum chamber, each of which is provided with a passage for the substrate to pass through, and the plurality of baffles are used to separate the vacuum chamber into the unwinding chamber, the cleaning chamber, the coating chamber and the winding chamber which are connected in sequence; The cleaning chamber and the coating chamber are both located on one side of the vacuum chamber, the unwinding chamber and the winding chamber are both located on the other side opposite to the vacuum chamber, the cleaning chamber and the unwinding chamber are both located above the vacuum chamber, and the coating chamber and the winding chamber are both located below the vacuum chamber.

10. The chemical vapor deposition device according to claim 9, characterized in that: In the adjacent second electromagnetic assembly and the first electromagnetic assembly, the adjacent second electrode plates and the first electrode plates share the electromagnet.

11. The chemical vapor deposition device according to claim 6, characterized in that: It also includes a central controller which is communicatively connected to the vacuum pumping device, the coating device, the coating air supply device, the unwinding motor, the winding motor, the cleaning device and the cleaning air supply device, and the central controller is used to control the operation of the vacuum pumping device, the coating device, the coating air supply device, the unwinding motor, the winding motor, the cleaning device and the cleaning air supply device.

12. The chemical vapor deposition device according to claim 11, characterized in that: It also includes a first measuring roller and a second measuring roller, the first measuring roller and the second measuring roller are respectively connected to the central controller in communication, the first measuring roller and the second measuring roller are respectively arranged in the unwinding chamber and the winding chamber, one end of the substrate wound on the unwinding roller enters the cleaning chamber under the guidance of the first measuring roller, and the substrate entering the winding chamber from the coating chamber is arranged on the winding roller under the guidance of the second measuring roller; wherein, The first measuring roller is used to measure first pressure data of the substrate on itself in real time during the process of the substrate being wound from the unwinding roller to the winding roller; The second measuring roller is used to measure the second pressure data of the substrate on itself in real time during the process of the substrate being wound from the unwinding roller to the winding roller; The central controller is used to: calculate the first tension data of the substrate according to the first pressure data; calculate the second tension data of the substrate according to the second pressure data; determine whether the first tension data is within a preset tension range, and determine whether the second tension data is within the preset tension range; when the first tension data is not within the preset tension range, adjust the speed of the unwinding motor so that the first tension data is within the preset tension range; when the second tension data is not within the preset tension range, adjust the speed of the winding motor so that the second tension data is within the preset tension range.

13. The chemical vapor deposition device according to claim 12, characterized in that: The first measuring roller comprises a first roller body, on which is disposed a first pressure sensing assembly communicatively connected to the central controller, for measuring in real time the first pressure data of the substrate on the first roller body during the process in which the substrate is wound from the unwinding roller to the winding roller; The second measuring roller includes a second roller body, on which is provided a second pressure sensing component communicatively connected to the central controller, for measuring the second pressure data of the substrate on the second roller body in real time during the process in which the substrate is wound from the unwinding roller to the winding roller.

14. The chemical vapor deposition device according to claim 12, characterized in that: It also includes a first monitoring roller and a second monitoring roller which are communicatively connected to the central controller, the first monitoring roller and the second monitoring roller are respectively arranged in the unwinding chamber and the winding chamber, one end of the substrate wound on the unwinding roller enters the cleaning chamber under the guidance of the first measuring roller and the first monitoring roller, and the substrate entering the winding chamber from the coating chamber is arranged on the winding roller under the guidance of the second monitoring roller and the second measuring roller; wherein, The first monitoring roller is used to measure in real time the first number of revolutions of the first monitoring roller during the process of the substrate being wound from the unwinding roller to the winding roller; The second monitoring roller is used to measure the second number of rotations of the second monitoring roller in real time during the process of the substrate being wound from the unwinding roller to the winding roller; The central controller is further used to calculate a first length traveled by the substrate according to the first number of turns, and to calculate a second length traveled by the substrate according to the second number of turns.

15. The chemical vapor deposition device according to claim 14, characterized in that: The first monitoring roller comprises a first roller body and a first encoder having a first gear, wherein the first gear is disposed on one end of the first roller body to rotate synchronously with the first roller body, and the first encoder is used to record the number of revolutions of the first gear to obtain the first number of revolutions; The second monitoring roller includes a second roller body and a second encoder having a second gear, the second gear is arranged on one end of the second roller body to rotate synchronously with the second roller body, and the second encoder is used to record the number of revolutions of the second gear to obtain the second number of revolutions.

16. The chemical vapor deposition apparatus according to claim 6, characterized in that: The vacuum pumping device comprises a first vacuum pumping assembly, a second vacuum pumping assembly, a third vacuum pumping assembly and a fourth vacuum pumping assembly respectively arranged on the outer wall of the vacuum chamber, wherein the first vacuum pumping assembly is connected to the unwinding chamber, the second vacuum pumping assembly is connected to the winding chamber, the third vacuum pumping assembly is connected to the cleaning chamber, and the fourth vacuum pumping assembly is connected to the coating chamber; wherein, The first vacuuming component is used to vacuum the unwinding chamber; The second vacuuming component is used to vacuum the winding chamber; The third vacuuming component is used to vacuum the cleaning chamber; The fourth vacuum pumping component is used to vacuum the coating chamber.

17. The chemical vapor deposition device according to claim 16, characterized in that: The first vacuum pumping assembly includes a first screw pump and a first vacuum valve, and the first screw pump is connected to the unwinding chamber through the first vacuum valve; the second vacuum pumping assembly includes a second screw pump and a second vacuum valve, and the second screw pump is connected to the winding chamber through the second vacuum valve; the third vacuum pumping assembly includes a third screw pump and a plurality of third vacuum valves, and one end of the plurality of third vacuum valves is respectively connected to the cleaning chamber, and the other end is respectively connected to the third screw pump; The fourth vacuum pumping assembly includes a plurality of vacuum pumping units, and the plurality of vacuum pumping units are spaced apart along the height direction of the vacuum chamber. Each of the vacuum pumping units includes a fourth screw pump and a plurality of fourth vacuum valves, and one end of the plurality of fourth vacuum valves is respectively connected to the coating chamber, and the other end is respectively connected to the fourth screw pump.

18. The chemical vapor deposition apparatus according to claim 6, characterized in that: A plurality of observation windows are arranged on the outer wall of the vacuum chamber, and the plurality of observation windows correspond to the plurality of functional cavities.

19. The chemical vapor deposition apparatus according to claim 6, characterized in that: The invention also comprises a cooling water pipe for conveying cooling water, wherein the cooling water pipe is coiled on the outer wall of the vacuum chamber.

20. A plasma enhanced chemical vapor deposition method, characterized in that: The chemical vapor deposition device according to any one of claims 1 to 19, comprising: Winding the substrate to be coated onto a take-up roll; Using a plurality of guide rollers to guide one end of the substrate from the unwinding chamber into the coating chamber, and allowing the substrate entering the coating chamber to enter the winding chamber after passing through the coating area to be arranged on the winding roller; Using a vacuum pump to evacuate the vacuum chamber; Providing coating gas into the coating chamber by using a coating gas supply device; Using a coating device to generate a first electric field and a first magnetic field in the coating area, so that the coating gas entering the coating area is ionized in the first electric field and generates a first plasma; wherein the first plasma includes first charged particles and first active particles, and the first charged particles generate a spiral motion in the first electric field and the first magnetic field to stimulate the coating gas to be ionized; Using an unwinding motor and a winding motor to drive the unwinding roller and the winding roller to rotate respectively, so as to wind the substrate from the unwinding roller to the winding roller; In the process of winding the substrate from the unwinding roll to the winding roll, the first active particles diffuse onto two opposite sides of the substrate and undergo chemical reactions to form corresponding film layers.

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