Cathode contact plating tank structure applied to horizontal electroplating

Abstract

The invention provides a cathode contact plating bath structure applied to horizontal electroplating, and relates to the technical field of traction brackets, the cathode contact plating bath structure comprises an electroplating frame, a driving frame and a mounting mechanism, the driving frame is mounted on the side wall of the electroplating frame, a fur rolling brush, a vacuum liquid suction device and a liquid blocking roller are sequentially mounted on the inner wall of the driving frame, and a backflow device is mounted at the bottom end of the inner wall of the electroplating frame; a plating solution box is mounted on the surface of the upper end of the electroplating frame, the mounting mechanism is arranged at the position where the driving frame and the solution blocking roller are close to each other and comprises a fixing column, one end of the fixing column is fixedly connected with the output end of the driving frame, connecting grooves are formed in the two sides of the arc surface of the fixing column, and positioning rods are fixedly connected to the surfaces of the inner walls of the connecting grooves. According to the device, the problems that the surface of a plated part is cleaned in an auxiliary manner by means of a soft hair rolling brush, a vacuum liquid suction device and a liquid blocking roller, the liquid blocking roller is inconvenient to replace, mount and limit after long-time operation and use, and the plated part is further processed are solved.

Description

Technical Field

[0001] The invention relates to the technical field of traction supports, and in particular to a cathode contact plating tank structure used for horizontal electroplating. Background Art

[0002] Horizontal electroplating is a common electroplating technology used in the manufacturing process of printed circuit boards. Its purpose is to deposit a uniform metal layer on the surface and hole walls of the circuit board to improve the conductivity and corrosion resistance of the circuit board. The cathode contact plating tank structure is a key component in the horizontal electroplating system, which directly affects the quality and efficiency of electroplating. In order to obtain copper electrodes with excellent performance in all aspects on the surface of the battery cell, more complete electroplating equipment is required. The cathode contact structure used in the existing horizontal electroplating equipment is prone to surface liquid, causing the cathode contact structure to self-plating, poor contact with the battery cell surface, and splashing of plating liquid, which is more common in daily life.

[0003] Prior art includes an invention with publication number CN113943967B, which discloses a horizontal electroplating device for solar photovoltaic products and a jig thereof. The patent includes a jig body, on which a plurality of through grooves are evenly arranged, and both sides of the upper openings of the plurality of through grooves are provided with supporting mechanisms for supporting solar photovoltaic products, wherein the outer sides of the jig body and the supporting mechanism are wrapped with an insulating layer, and a cathode contact point is provided on the jig body, and the cathode contact point is exposed on the outer side of the insulating layer, and the supporting end of the supporting mechanism is exposed on the outer side of the insulating layer; in addition, the present invention also discloses a horizontal electroplating device for solar photovoltaic products. The advantages of the present invention are that the structure is simple, the enterprise cost is effectively reduced, and the electroplating effect is improved.

[0004] It is found in daily life that when the workpiece to be plated is transported to the electroplating frame, the use of a horizontal electroplating cathode contact structure can effectively improve the situation where the cathode contact part is liquid-carrying during the electroplating process, thereby avoiding the self-plating phenomenon of the cathode contact structure due to contamination with the plating liquid during mass production. In this process, a soft-bristled roller brush, a vacuum suction device and a liquid-blocking roller will be used to assist in cleaning the surface of the plated workpiece. If used for a long time, it will be inconvenient to replace and install the liquid-blocking roller to limit it, and further process the plated workpiece. Summary of the invention

[0005] The purpose of the present invention is to solve the problem in the prior art that when the workpiece to be plated is transported to the electroplating frame, the horizontal electroplating cathode contact structure can be used to effectively improve the situation that the cathode contact part is liquid-carrying during the electroplating process, thereby avoiding the self-plating phenomenon of the cathode contact structure due to contact with the plating liquid during mass production. In this process, a soft-bristled roller brush, a vacuum liquid aspirator and a liquid-blocking roller are used to assist in cleaning the surface of the plated workpiece. If used for a long time, it will be inconvenient to replace and install the liquid-blocking roller to limit it, and further process the plated workpiece.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a cathode contact plating tank structure applied to horizontal electroplating, comprising an electroplating frame, a driving frame and a mounting mechanism, wherein the driving frame is mounted on the side wall of the electroplating frame, and the inner wall of the driving frame is sequentially mounted with a soft-bristled roller brush, a vacuum liquid absorber and a liquid-blocking roller, a reflux device is mounted on the bottom end of the inner wall of the electroplating frame, and a plating liquid box is mounted on the upper end surface of the electroplating frame, and the mounting mechanism is arranged at a position where the driving frame and the liquid-blocking roller are close to each other, and the mounting mechanism comprises a fixed column, one end of which is fixedly connected to the output end of the driving frame, and connecting grooves are provided on both sides of the circular arc surface of the fixed column, and the inner wall surface of the connecting groove is fixedly connected with a fixed The positioning rod has an arc surface which is slidably connected to a positioning plate, the cross-section of the positioning plate is in an "L" shape, the arc surface of the positioning rod is sleeved with a spring, the two ends of the spring are respectively fixedly connected to the bottom end of the inner wall of the connecting groove and the positioning plate, a docking column is slidably penetrated at a position close to the fixed column at one end of the arc surface of the liquid-blocking roller, positioning holes are provided on both sides of the arc surface of the docking column, the inner wall of the positioning hole is plugged into the short arm end of the positioning plate, a connecting pipe is fixedly connected to one end of the docking column away from the fixed column, a connecting hole is provided at a position of the arc surface of the liquid-blocking roller corresponding to the connecting pipe, a connecting rod is threadedly connected to the inner wall of the connecting hole, and the arc surface of the connecting rod slides through the surface of the connecting pipe.

[0007] The effect achieved by the above components is: during the electroplating operation of the workpiece to be plated, the soft-bristled roller brush, vacuum absorber and liquid-blocking roller in the driving frame on the surface of the electroplating frame will be used in turn for auxiliary protection to remove excess impurities. After long-term use, the liquid-blocking roller can be replaced and installed with the help of the installation mechanism, which helps to quickly replace and use it.

[0008] Preferably, the arc surface of the liquid-blocking roller is threadedly connected with a rotating ring, and one end of the rotating ring close to the connecting pipe is rotatably connected with a protective ring, and the cross-sectional size of the protective ring is matched with the cross-sectional size of the connecting pipe.

[0009] The effect achieved by the above components is: when the connecting rod is connected to the connecting pipe and the connecting hole, the protective ring can be used for protection and limiting, and the position of the protective ring can be squeezed by the rotating ring to prevent the protective ring from sliding and falling off.

[0010] Preferably, the positioning plate is a hard alloy plate, and the cross-sectional dimension of the short arm end of the positioning plate is matched with the cross-sectional dimension of the positioning hole.

[0011] The effect achieved by the above components is that the positioning plate made of cemented carbide can be used for a long time, and deformation of the positioning plate during operation and clamping can be avoided.

[0012] Preferably, the arc surface of the fixing column is threadedly connected with a fixing ring, one side of the fixing ring is plugged into the arc surface of the docking column, and the surface of the fixing ring is fixedly connected with a rotating sleeve, which is a rubber sleeve.

[0013] The effect achieved by the above components is that when the fixed column and the docking column are better limited, the fixed ring and the rotating sleeve can be used for auxiliary matching operations to facilitate better docking protection operations.

[0014] Preferably, a guide mechanism is installed on the side wall of one end of the electroplating frame, and the guide mechanism includes a guide frame, one end of the guide frame is fixedly connected to the side wall surface of the electroplating frame, the inner wall of the guide frame is rotatably connected to a plurality of rotating shafts, connecting plates are fixedly connected on both sides of the guide frame, the cross-section of the connecting plate is circular, the surface of the connecting plate is rotatably connected to the guide plate, the cross-section of the guide plate is "L"-shaped, a sliding rod is fixedly connected to the lower surface of the guide plate, an auxiliary hole is opened on the surface of the connecting plate, the inner wall of the auxiliary hole is slidably connected to the circular arc surface of the sliding rod, the circular arc surface of the sliding rod is sleeved with a gasket, the circular arc surface of the sliding rod is threadedly connected to an extrusion shaft, and the upper surface of the extrusion shaft abuts against the lower surface of the gasket.

[0015] The effect achieved by the above components is: in the process of conveying the workpiece to be plated to the electroplating frame, the guide mechanism installed at one end of the electroplating frame can be used to guide the position of the workpiece to be plated, thereby avoiding position displacement of the workpiece to be plated during the conveying process, and can conveniently and effectively provide guiding assistance, allowing workpieces to be plated of different sizes to be conveyed.

[0016] Preferably, a friction sleeve is fixedly connected to the arc surface of the rotating shaft, and the friction sleeve is a silicone sleeve.

[0017] The effect achieved by the above components is that when the rotating shaft is guided for rotation, it can be protected by means of a friction sleeve made of silicone material, thereby avoiding the use of effective protective support and guiding operations on the workpiece to be plated.

[0018] Preferably, a pull rod is fixedly connected to the upper end surface of the guide plate, an inlay groove is provided on the short arm end surface of the guide plate, and a plurality of rollers are rotatably connected to the inner wall of the inlay groove.

[0019] The above components have the following effects: the guide plate can be assisted in rotation by means of a pull rod fixed on the upper end of the guide plate, and the roller in the inlay groove on the surface of the guide plate can be used to effectively guide the slide of the plated part.

[0020] Preferably, a bearing mechanism is provided on one end surface of the electroplating frame away from the guiding mechanism, and the bearing mechanism includes a bearing frame, and the bearing frame is located on one side of the electroplating frame, and both side surfaces of the bearing frame are fixedly connected with auxiliary plates, and the cross-section of the auxiliary plate is "L"-shaped, and the side wall surface of the electroplating frame is fixedly connected with an insertion plate, and the surface of the insertion plate is plugged into the surface of the auxiliary plate, and a moving rod is slidably penetrated through the surface of the insertion plate, and the bottom end surface of the bearing frame is rotatably connected with a plurality of pulleys, and the plurality of pulleys are evenly distributed on the lower surface of the bearing frame, and the inner wall of the bearing frame is fixedly connected with a plurality of card frames, and the cross-section of the card frames is "U"-shaped.

[0021] The effect achieved by the above components is: after the electroplating operation is carried out on the workpiece to be plated, the electroplated workpiece can be carried and collected with the help of a carrying mechanism, and the auxiliary plates fixed on both sides of the carrying frame are plugged into the plug plates fixed on the side walls of the electroplating frame, and at the same time, they are plugged in with the help of moving rods, so as to facilitate and effectively carry, collect and limit the electroplated workpieces after the electroplating is completed.

[0022] Preferably, both side surfaces of the supporting frame are fixedly connected with a connecting frame, the inner wall of the connecting frame is rotatably connected with a connecting rod, the cross-section of the connecting rod is "U"-shaped, and both ends of the inner wall of the connecting frame are sleeved with coil springs, and the two ends of the coil spring are respectively fixedly connected to the connecting frame and the connecting rod.

[0023] The effect achieved by the above components is: after placing a large number of electroplated parts in the supporting frame, they can be pulled assisted by the connecting rods in the connecting frames on both sides of the supporting frame, and the connecting rods can be squeezed and limited by the torsional force generated by the coil spring.

[0024] Preferably, a mosaic frame is clamped on the arc surface of the upper end of the connecting rod, one side of the mosaic frame is fixedly connected to the side wall of the supporting frame, the inner wall of the mosaic frame is "U"-shaped, and the mosaic frame is an elastic frame.

[0025] The effect achieved by the above components is that when limiting the position of the connecting rod, the elastically operated inlay frame can be used for auxiliary clamping and fixing the limit.

[0026] Compared with the prior art, the advantages and positive effects of the present invention are:

[0027] 1. In the present invention, by setting up an installation mechanism, the liquid-blocking roller that has been used for a long time can be replaced and limited effectively and conveniently. The sliding docking posts at both ends of the liquid-blocking roller and the fixed posts fixed at the output end of the driving frame are used for docking and installation, which can effectively and conveniently perform docking and fixing. At the same time, the positioning plates on both sides of the arc surface of the fixed post are used to clamp and fix with the positioning holes on both sides of the docking post, which facilitates the replacement, maintenance, installation and use of the entire liquid-blocking roller.

[0028] 2. In the present invention, by setting a guiding mechanism, the position of the guide plates on both sides of the guide frame can be effectively and conveniently deflected, so that the sliding rod on the lower surface of the guide plate can slide along the auxiliary hole, and the extrusion shaft can be used to extrude and fix the limit, so as to facilitate the fixing of the deflection angle of the guide plate, so that different sizes of electroplated materials can be better guided and conveyed.

[0029] 3. In the present invention, by setting up a bearing mechanism, the bearing frame can be effectively and conveniently plugged and limited with the help of the auxiliary frames on both sides and the plug-in plates fixed on the side walls of the electroplating frame, so that the electroplated parts can be quickly placed in the bearing frame, and the card frame is used to block and limit the electroplated parts. Then, the rotating connecting rods in the connecting frames on both sides of the bearing frame are used to perform stretching operations, which facilitates the transportation and movement of the entire bearing frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of a three-dimensional structure of a cathode contact plating tank structure applied to horizontal electroplating is provided for the present invention;

[0031] Figure 2 A partial schematic diagram of a three-dimensional structure of a cathode contact plating tank structure applied to horizontal electroplating is provided in the present invention;

[0032] Figure 3 The present invention provides a schematic structural diagram of a mounting mechanism for a cathode contact plating tank structure applied to horizontal electroplating;

[0033] Figure 4 A schematic diagram of the split structure of a mounting mechanism of a cathode contact plating tank structure applied to horizontal electroplating is provided in the present invention;

[0034] Figure 5 A partial structural schematic diagram of a mounting mechanism of a cathode contact plating tank structure applied to horizontal electroplating proposed by the present invention;

[0035] Figure 6 The present invention provides a schematic structural diagram of a guide mechanism for a cathode contact plating tank structure applied to horizontal electroplating;

[0036] Figure 7 A schematic diagram of the split structure of a guide mechanism of a cathode contact plating tank structure applied to horizontal electroplating is provided in the present invention;

[0037] Figure 8 The present invention provides a structural schematic diagram of a supporting mechanism of a cathode contact plating tank structure applied to horizontal electroplating;

[0038] Fig. 9 The present invention proposes a cathode contact plating tank structure for horizontal electroplating Figure 8 A schematic diagram of the enlarged structure at point A;

[0039] Fig.10 The present invention proposes a cathode contact plating tank structure for horizontal electroplating Figure 8 Schematic diagram of the enlarged structure at B.

[0040] Legend: 1. Electroplating frame; 2. Driving frame; 3. Soft brush; 4. Vacuum suction device; 5. Liquid-blocking roller; 6. Mounting mechanism; 601. Docking column; 602. Fixed column; 603. Connecting pipe; 604. Connecting rod; 605. Rotating ring; 606. Protective ring; 607. Positioning hole; 608. Connecting hole; 609. Fixed ring; 610. Rotating sleeve; 611. Positioning plate; 612. Connecting groove; 613. Positioning rod; 614. Spring; 7. Guide mechanism; 701. Guide frame; 702. Rotating shaft; 703, friction sleeve; 704, connecting plate; 705, auxiliary hole; 706, sliding rod; 707, gasket; 708, extrusion shaft; 709, guide plate; 710, inlay groove; 711, roller; 712, pull rod; 8, bearing mechanism; 801, bearing frame; 802, pulley; 803, card frame; 804, connecting frame; 805, connecting rod; 806, inlay frame; 807, coil spring; 808, plug plate; 809, auxiliary plate; 810, moving rod; 9, plating liquid box; 10, reflux device. DETAILED DESCRIPTION

[0041] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0042] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0043] Embodiment 1, as Figure 1-10As shown, the present invention provides a cathode contact plating tank structure for horizontal electroplating, comprising an electroplating frame 1, a driving frame 2 and a mounting mechanism 6, wherein the driving frame 2 is mounted on the side wall of the electroplating frame 1, and the inner wall of the driving frame 2 is sequentially mounted with a soft-bristle roller brush 3, a vacuum liquid aspirator 4 and a liquid-blocking roller 5, wherein the soft-bristle roller brush 3 mainly functions to contact the cathode surface for conduction, and the soft-bristle roller brush 3 can be distributed as a whole or locally distributed according to the grid line arrangement direction, and the vacuum liquid aspirator 4 functions to absorb part of the liquid and tiny impurities remaining on the surface, and the liquid-blocking roller 5 has both a transmission function and a liquid-blocking liquid aspiration tool to prevent the residual liquid on the surface from affecting the electroplating quality, a reflux device 10 is mounted on the bottom end of the inner wall of the electroplating frame 1, a plating liquid box 9 is mounted on the upper end surface of the electroplating frame 1, and the mounting mechanism 6 is arranged at a position where the driving frame 2 and the liquid-blocking roller 5 are close to each other, a guide mechanism 7 is mounted on one end side wall of the electroplating frame 1, and a bearing mechanism 8 is mounted on the end surface of the electroplating frame 1 away from the guide mechanism 7.

[0044] The specific arrangement and functions of the installation mechanism 6, the guiding mechanism 7 and the supporting mechanism 8 will be described in detail below.

[0045] like Figure 3 , Figure 4 and Figure 5 As shown, the mounting mechanism 6 includes a fixed column 602, one end of which is fixedly connected to the output end of the driving frame 2, connecting grooves 612 are provided on both sides of the circular arc surface of the fixed column 602, and a positioning rod 613 is fixedly connected to the inner wall surface of the connecting groove 612, and the circular arc surface of the positioning rod 613 is slidably connected to a positioning plate 611, and the cross-section of the positioning plate 611 is "L"-shaped, and the circular arc surface of the positioning rod 613 is sleeved with a spring 614, and the two ends of the spring 614 are respectively fixedly connected to the bottom end of the inner wall of the connecting groove 612 and the positioning plate 611, and the circular arc surface of the liquid-blocking roller 5 is close to the fixed column 602. The position of the position slidingly penetrates the docking column 601, and the circular arc surface of the docking column 601 is provided with a positioning hole 607 on both sides, and the inner wall of the positioning hole 607 is plugged into the short arm end of the positioning plate 611, and the end of the docking column 601 away from the fixed column 602 is fixedly connected to the connecting rod 613. Tube 603, a connecting hole 608 is provided at a position corresponding to the connecting tube 603 on the arc surface of the liquid-blocking roller 5, a connecting rod 604 is threadedly connected to the inner wall of the connecting hole 608, the arc surface of the connecting rod 604 slides through the surface of the connecting tube 603, a rotating ring 605 is threadedly connected to the arc surface of the liquid-blocking roller 5, and a protective ring 606 is rotatably connected to one end of the rotating ring 605 close to the connecting tube 603, and the cross-sectional size of the protective ring 606 is adapted to the cross-sectional size of the connecting tube 603, the positioning plate 611 is a hard alloy plate, and the cross-sectional size of the short arm end of the positioning plate 611 is adapted to the cross-sectional size of the positioning hole 607, a fixing ring 609 is threadedly connected to the arc surface of the fixing column 602, one side of the fixing ring 609 is plugged into the arc surface of the docking column 601, and a rotating sleeve 610 is fixedly connected to the surface of the fixing ring 609, and the rotating sleeve 610 is a rubber sleeve.

[0046] like Figure 6 and Figure 7 As shown, the guide mechanism 7 includes a guide frame 701, one end of which is fixedly connected to the side wall surface of the electroplating frame 1, and the inner wall of the guide frame 701 is rotatably connected to a plurality of rotating shafts 702, and both sides of the guide frame 701 are fixedly connected to connecting plates 704, the cross section of the connecting plate 704 is circular, and the surface of the connecting plate 704 is rotatably connected to a guide plate 709, the cross section of the guide plate 709 is "L" shaped, and the lower surface of the guide plate 709 is fixedly connected to a sliding rod 706, and the surface of the connecting plate 704 is provided with auxiliary holes 705, and the auxiliary holes 706 are fixedly connected to the guide plate 709. The inner wall of the guide plate 709 is slidably connected with the arc surface of the slide bar 706, the arc surface of the slide bar 706 is sleeved with a gasket 707, the arc surface of the slide bar 706 is threadedly connected with an extrusion shaft 708, the upper surface of the extrusion shaft 708 abuts against the lower surface of the gasket 707, the arc surface of the rotating shaft 702 is fixedly connected with a friction sleeve 703, the friction sleeve 703 is a silicone sleeve, the upper end surface of the guide plate 709 is fixedly connected with a pull rod 712, the short arm end surface of the guide plate 709 is provided with an inlay groove 710, and the inner wall of the inlay groove 710 is rotatably connected with a plurality of rollers 711.

[0047] like Figure 8 , Fig. 9 and Fig.10 As shown, the bearing mechanism 8 includes a bearing frame 801, the bearing frame 801 is located on one side of the electroplating frame 1, and the two side surfaces of the bearing frame 801 are fixedly connected with auxiliary plates 809, and the cross section of the auxiliary plate 809 is "L"-shaped. The side wall surface of the electroplating frame 1 is fixedly connected with an insert plate 808, and the surface of the insert plate 808 is plugged into the surface of the auxiliary plate 809. The surface of the insert plate 808 is slidably penetrated by a moving rod 810, and the bottom end surface of the bearing frame 801 is rotatably connected with a plurality of pulleys 802, and the plurality of pulleys 802 are evenly distributed on the lower surface of the bearing frame 801, and the inner wall of the bearing frame 801 is fixedly connected with a plurality of The card frame 803 has a "U"-shaped cross section, and the two side surfaces of the supporting frame 801 are fixedly connected with connecting frames 804, and the inner wall of the connecting frame 804 is rotatably connected with a connecting rod 805, and the cross section of the connecting rod 805 is "U"-shaped. Both ends of the inner wall of the connecting frame 804 are sleeved with coil springs 807, and the two ends of the coil spring 807 are respectively fixedly connected to the connecting frame 804 and the connecting rod 805, and the upper arc surface of the connecting rod 805 is clamped with an inlay frame 806, and one side of the inlay frame 806 is fixedly connected to the side wall of the supporting frame 801, the inner wall of the inlay frame 806 is "U"-shaped, and the inlay frame 806 is an elastic frame.

[0048] The overall working principle is as follows: during the electroplating operation of the workpiece, the soft-bristled roller brush 3, the vacuum liquid absorber 4 and the liquid-blocking roller 5 in the driving frame 2 on the surface of the electroplating frame 1 will be used in turn for auxiliary protection to remove excess impurities. After long-term use, the liquid-blocking roller 5 can be replaced and installed with the help of the installation mechanism 6. At this time, the entire liquid-blocking roller 5 is first placed on the position of the driving frame 2, and then the connecting tubes 603 sliding at both ends of the liquid-blocking roller 5 are pulled to allow the connecting tube 603 to drive the docking column 601 to be plugged toward the fixed column 602 at one end of the driving frame 2, so that the positioning holes 607 opened on the surfaces of both sides of the docking column 601 are plugged and limited with the positioning plates 611 in the connecting grooves 612 on both sides of the fixed column 602, and the positioning plates 611 are moved along the positioning rods 613. The connecting rod 604 is inserted into the connecting tube 603 to fix the connecting rod 604 and the connecting hole 608 by threaded connection. Then, the rotating ring 605 is rotated to drive the protective ring 606 to protect and close the position of the connecting rod 604. At the same time, the fixing ring 609 on the arc surface of the fixing column 602 is rotated to protect the interface between the fixing column 602 and the docking column 601 by the fixing ring 609. At the same time, the rotating sleeve 610 on the surface of the fixing ring 609 is used for auxiliary operation. At this time, the entire liquid-blocking roller 5 and the driving frame 2 can be conveniently installed, replaced and limited.

[0049] In the process of conveying the workpiece to be plated into the electroplating frame 1, the guide mechanism 7 can be used for auxiliary operation. First, the workpiece to be plated is supported along the guide frame 701 fixed on one side of the electroplating frame 1, and at the same time, the rotating shaft 702 rotating on the inner wall of the guide frame 701 is used to slide. Then, when conveying the workpieces to be plated of different sizes, the guide plates 709 on both sides of the guide frame 701 can be pulled to deflect the position of the guide plates 709 along the connecting plate 704, and the sliding rod 706 fixed on the lower surface of the guide plate 709 can be moved along the connecting plate 704. The auxiliary hole 705 opened on the surface of 704 slides, and after reaching the specified position, the extrusion shaft 708 on the surface of the rotating slide bar 706 is used to squeeze and fix the extrusion shaft 708 and the connecting plate 704, and at the same time, the position of the entire guide plate 709 is limited. At this time, the entire workpiece to be plated can be guided and transported with the help of the guide plate 709, and at the same time, the roller 711 rotating on the surface of the short arm end of the guide plate 709 is used for sliding guidance to reduce friction. At this time, the entire workpiece to be plated can be effectively and conveniently transported.

[0050] When the electroplated parts are transported and collected after the electroplating is completed, the supporting mechanism 8 set on one side of the electroplating frame 1 can be used for assistance. First, the supporting frame 801 is plugged into the plug plate 808 fixed on the side wall of the electroplating frame 1 with the help of the auxiliary plates 809 fixed on both sides, and the moving rod 810 on the surface of the plug plate 808 is pulled to facilitate the blocking and limiting of the position of the auxiliary plate 809. After the electroplated parts are placed in the supporting frame 801, the card frame 803 can be used for limiting protection. At the same time, the connecting rods 805 on both sides of the supporting frame 801 can be pulled to move and adjust the position of the supporting frame 801. The inlaid frame 806 made of elastic material fixed on the side wall surface of the supporting frame 801 can be clamped and limited to fix the position of the connecting rod 805, so as to facilitate better operation and use of the supporting frame 801.

[0051] The upper and lower surfaces of the workpiece to be plated are in contact with the cathode contact structure, which are an upper cathode contact structure and a lower cathode contact structure respectively. The gap between the two is for the workpiece to be plated to pass through and the roller can drive it to move. Each cathode contact structure unit is equipped with an anode area, so the anode area is also divided into upper and lower anode areas. The upper anode area and the lower anode area are arranged above the gap of the upper cathode contact unit and below the gap of the lower cathode contact unit. The height and width of the anode area shall not exceed the cathode contact unit to prevent the non-electroplating area from being wetted by the plating solution. The plating solution anode area includes an upper plating solution box electroplating frame 9 electroplating frame and a lower plating solution box electroplating frame 9 electroplating frame. A liquid inlet is arranged above the upper plating solution box electroplating frame 9 electroplating frame. The plating solution enters the upper plating solution box electroplating frame 9 electroplating frame through the liquid inlet and then is sprinkled downward through the plating solution controller. The lower plating solution is to ensure that the plating solution flows evenly through the porous anode plate and the anode mesh and then contacts the upper surface of the workpiece to be plated evenly and continuously. All lower cathode contact structures are above the electroplating frame 1 and slightly higher than the electroplating frame 1 to ensure that the workpiece to be plated can be driven to move normally. A liquid inlet is arranged at the bottom of the horizontal electroplating equipment, and a reflux plate is arranged. The reflux plate is located lower than the electroplating frame 1. The electroplating frame 1 contains plating solution. The lower plating solution box electroplating frame 9 obtains the plating solution from the electrolytic cell through the liquid inlet below it and then sprays the plating solution through the plating solution controller, so that the plating solution flows evenly and continuously through the porous anode plate and the anode mesh and then contacts the lower surface of the workpiece to be plated evenly. Finally, the plating solution is refluxed through the reflux device electroplating frame 10 and the vacuum aspirator electroplating frame 4 to realize the circulation of the plating solution.

[0052] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A cathode contact plating tank structure for horizontal electroplating, comprising an electroplating frame (1), a drive frame (2) and a mounting mechanism (6), characterized in that: The driving frame (2) is mounted on the side wall of the electroplating frame (1); the inner wall of the driving frame (2) is sequentially mounted with a soft-bristled roller brush (3), a vacuum liquid absorber (4) and a liquid blocking roller (5); the bottom end of the inner wall of the electroplating frame (1) is mounted with a reflux device (10); the upper surface of the electroplating frame (1) is mounted with a plating liquid box (9); the mounting mechanism (6) is arranged at a position where the driving frame (2) and the liquid blocking roller (5) are close to each other; the mounting mechanism (6) comprises a fixed column (602); one end of the fixed column (602) is fixedly connected to the output end of the driving frame (2); connecting grooves (612) are provided on both sides of the circular arc surface of the fixed column (602); a positioning rod (613) is fixedly connected to the inner wall surface of the connecting groove (612); the circular arc surface of the positioning rod (613) is slidably connected with a positioning plate (611); the cross section of the positioning plate (611) is in an "L" shape; The arc surface of the positioning rod (613) is sleeved with a spring (614), and the two ends of the spring (614) are respectively fixedly connected to the bottom end of the inner wall of the connecting groove (612) and the positioning plate (611); a docking column (601) is slidably penetrated at a position of one end of the arc surface of the liquid-blocking roller (5) close to the fixed column (602); positioning holes (607) are provided on both sides of the arc surface of the docking column (601); the inner wall of the positioning hole (607) is plugged into the short arm end of the positioning plate (611); a connecting pipe (603) is fixedly connected to one end of the docking column (601) away from the fixed column (602); a connecting hole (608) is provided on the arc surface of the liquid-blocking roller (5) at a position corresponding to the connecting pipe (603); a connecting rod (604) is threadedly connected to the inner wall of the connecting hole (608); and the arc surface of the connecting rod (604) slides through the surface of the connecting pipe (603).

2. The cathode contact plating tank structure for horizontal electroplating according to claim 1, characterized in that: The circular arc surface of the liquid-blocking roller (5) is threadedly connected to a rotating ring (605), and one end of the rotating ring (605) close to the connecting pipe (603) is rotatably connected to a protective ring (606), and the cross-sectional size of the protective ring (606) is adapted to the cross-sectional size of the connecting pipe (603).

3. The cathode contact plating tank structure for horizontal electroplating according to claim 1, characterized in that: The positioning plate (611) is a hard alloy plate, and the cross-sectional dimensions of the short arm end of the positioning plate (611) are adapted to the cross-sectional dimensions of the positioning hole (607).

4. The cathode contact plating tank structure for horizontal electroplating according to claim 1, characterized in that: The arc surface of the fixing column (602) is threadedly connected to a fixing ring (609), one side of the fixing ring (609) is plugged into the arc surface of the docking column (601), and the surface of the fixing ring (609) is fixedly connected to a rotating sleeve (610), and the rotating sleeve (610) is a rubber sleeve.

5. The cathode contact plating tank structure for horizontal electroplating according to claim 1, characterized in that: A guide mechanism (7) is installed on the side wall of one end of the electroplating frame (1), and the guide mechanism (7) comprises a guide frame (701), one end of the guide frame (701) is fixedly connected to the side wall surface of the electroplating frame (1), the inner wall of the guide frame (701) is rotatably connected to a plurality of rotating shafts (702), both sides of the guide frame (701) are fixedly connected to connecting plates (704), the cross section of the connecting plate (704) is circular, and the surface of the connecting plate (704) is rotatably connected to a guide plate (709), The cross section of the guide plate (709) is "L"-shaped, and a sliding rod (706) is fixedly connected to the lower surface of the guide plate (709). An auxiliary hole (705) is opened on the surface of the connecting plate (704). The inner wall of the auxiliary hole (705) is slidably connected to the arc surface of the sliding rod (706). The arc surface of the sliding rod (706) is sleeved with a gasket (707). The arc surface of the sliding rod (706) is threadedly connected to an extrusion shaft (708), and the upper surface of the extrusion shaft (708) is in contact with the lower surface of the gasket (707).

6. The cathode contact plating tank structure for horizontal electroplating according to claim 5, characterized in that: The arc surface of the rotating shaft (702) is fixedly connected with a friction sleeve (703), and the friction sleeve (703) is a silicone sleeve.

7. The cathode contact plating tank structure for horizontal electroplating according to claim 5, characterized in that: The upper end surface of the guide plate (709) is fixedly connected with a pull rod (712), the short arm end surface of the guide plate (709) is provided with an inlay groove (710), and the inner wall of the inlay groove (710) is rotatably connected with a plurality of rollers (711).

8. The cathode contact plating tank structure for horizontal electroplating according to claim 1, characterized in that: A bearing mechanism (8) is provided on one end surface of the electroplating frame (1) away from the guiding mechanism (7), and the bearing mechanism (8) comprises a bearing frame (801), and the bearing frame (801) is located on one side of the electroplating frame (1). Auxiliary plates (809) are fixedly connected to both side surfaces of the bearing frame (801), and the cross section of the auxiliary plates (809) is in an "L" shape. An inserting plate (808) is fixedly connected to the side wall surface of the electroplating frame (1), and the inserting plate (808) is fixedly connected to the side wall surface of the electroplating frame (1). 08) is plugged into the surface of the auxiliary plate (809), a moving rod (810) is slidably penetrated through the surface of the plug plate (808), a bottom surface of the carrying frame (801) is rotatably connected to a plurality of pulleys (802), a plurality of pulleys (802) are evenly distributed on the lower surface of the carrying frame (801), an inner wall of the carrying frame (801) is fixedly connected to a plurality of card frames (803), and a cross-section of the card frame (803) is "U"-shaped.

9. The cathode contact plating tank structure for horizontal electroplating according to claim 8, characterized in that: The two side surfaces of the supporting frame (801) are fixedly connected to a connecting frame (804), the inner wall of the connecting frame (804) is rotatably connected to a connecting rod (805), the cross section of the connecting rod (805) is "U" shaped, and both ends of the inner wall of the connecting frame (804) are sleeved with a coil spring (807), and the two ends of the coil spring (807) are respectively fixedly connected to the connecting frame (804) and the connecting rod (805).

10. The cathode contact plating tank structure for horizontal electroplating according to claim 8, characterized in that: The arc surface at the upper end of the connecting rod (805) is clamped with a mosaic frame (806), one side of the mosaic frame (806) is fixedly connected to the side wall of the supporting frame (801), the inner wall of the mosaic frame (806) is "U"-shaped, and the mosaic frame (806) is an elastic frame.

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