A selective plating control method and system based on positioning and tracking

Abstract

The present disclosure relates to a selective plating control method and system based on positioning and tracking, and relates to the technical field of electroplating. When a workpiece to be plated is detected, a locator on the workpiece to be plated is scanned to obtain first positioning information characterizing the position of the workpiece to be plated and target information for determining the area to be electroplated. Then, an image of the workpiece to be plated is collected to obtain an image of the workpiece to be plated. Based on the image of the workpiece to be plated and the target information, second positioning information characterizing the position of the target area is determined. Furthermore, based on the first positioning information and the second positioning information, electroplating is performed on the target area to achieve selective electroplating of a specific area. By first positioning the workpiece to be plated and then positioning a specific area of the workpiece to be plated, positioning of the specific area is achieved without manual intervention. Through the image of the workpiece to be plated and the target information, accurate positioning of the specific area can be performed. This technical solution can improve the accuracy and efficiency of selective plating control, and thereby improve the quality of electroplated products.

Description

Technical Field

[0001] The present disclosure relates to the field of electroplating technology, and specifically, to a selective plating control method and system based on positioning and tracking. Background Art

[0002] Electroplating technology uses the electrolysis principle to coat a thin layer of other metals or alloys on the surface of certain metals. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, which can prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhance aesthetics.

[0003] Selective plating technology, which can be called selective electroplating, is a local electroplating technology used to enhance, repair, or refurbish specific local areas of manufactured parts.

[0004] In selective plating technology, it is necessary to perform positioning and tracking on specific local areas to ensure the accuracy of selective plating control and thus ensure the quality of electroplated products. Summary of the Invention

[0005] The object of the present disclosure is to provide a selective plating control method and system based on positioning and tracking, which can improve the accuracy and efficiency of selective plating control and thus improve the quality of electroplated products.

[0006] To achieve the above object, in a first aspect, the present disclosure provides a selective plating control method based on positioning and tracking, including: in response to detecting a workpiece to be plated, scanning a locator on the workpiece to be plated to obtain first positioning information and target information for determining a target area, where the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is the area on the workpiece to be plated that needs to be electroplated; collecting an image of the workpiece to be plated to obtain an image of the workpiece to be plated; determining second positioning information according to the image of the workpiece to be plated and the target information, where the second positioning information is used to characterize the position of the target area; and controlling an electroplating device to electroplate the target area according to the first positioning information and the second positioning information.

[0007] Optionally, the locator is used to emit a positioning signal, and an electronic tag is pasted on the locator. Scanning the locator on the workpiece to be plated to obtain first positioning information and target information for determining a target area includes: scanning the positioning signal emitted by the locator, and determining the first positioning information according to the scanned positioning signal; scanning the electronic tag, and determining the target information for determining the target area according to the scanned electronic tag information.

[0008] Optionally, determining the second positioning information according to the workpiece image to be plated and the target information includes: determining the image feature conditions corresponding to the target area according to the target information; extracting features from the workpiece image to be plated to obtain the image features corresponding to the workpiece image to be plated; determining the position information of the target area in the workpiece image to be plated according to the image feature conditions corresponding to the target area and the image features corresponding to the workpiece image to be plated; and determining the second positioning information according to the position information of the target area in the workpiece image to be plated.

[0009] Optionally, the target information includes workpiece information to be plated. Determining the image feature conditions corresponding to the target area according to the target information includes: obtaining pre-configured plating reference information, where the pre-configured plating reference information includes: multiple preset electroplating workpiece information and the electroplating area information respectively corresponding to the multiple preset electroplating workpiece information; comparing the multiple preset electroplating workpiece information with the workpiece information to be plated to determine the target preset electroplating workpiece information; and determining the image feature conditions corresponding to the target area according to the electroplating area information corresponding to the target preset electroplating workpiece information.

[0010] Optionally, the workpiece to be plated is a circuit board, and the circuit board includes multiple electronic devices. The electroplating area information corresponding to the target electroplating workpiece information includes: electroplating area size, electroplating area material, and electronic device information of the electroplating area. Determining the image feature conditions corresponding to the target area according to the electroplating area information corresponding to the target preset electroplating workpiece information includes: determining the size feature conditions corresponding to the target area according to the electroplating area size; determining the first pixel feature conditions corresponding to the target area according to the electroplating area material; determining the second pixel feature conditions corresponding to the target area according to the electronic device information, where the first pixel feature and the second pixel feature belong to different types of pixel features; and determining the image feature conditions corresponding to the target area according to the size feature conditions, the first pixel feature conditions, and the second pixel feature conditions.

[0011] Optionally, determining the second positioning information according to the image of the workpiece to be plated and the target information includes: determining model reference information according to the target information, where the model reference information is used to assist a pre-trained image processing model in performing image processing, and the training data corresponding to the pre-trained image processing model includes: multiple sample electroplated workpiece images, and areas to be electroplated are marked in each of the multiple sample electroplated workpiece images; performing marking processing on the image of the workpiece to be plated according to the model reference information through the pre-trained image processing model to obtain a processed image of the workpiece to be plated including target area markings; and determining the second positioning information according to the position of the target area markings in the processed workpiece image.

[0012] Optionally, the workpiece to be plated is a circuit board, and the circuit board includes multiple electronic devices. The target information includes: electroplating area size, electroplating area material, and electronic device information of the electroplating area. Determining the model reference information according to the target information includes: determining first model reference information according to the electroplating area size, where the first model reference information is used to represent the proportion of the area to be marked in the image of the workpiece to be plated; determining second model reference information according to the electroplating area material, where the second model reference information is used to represent the proportion of first target pixels in the area to be marked in the image of the workpiece to be plated; determining third model reference information according to the electronic device information, where the third model reference information is used to represent the proportion of second target pixels in the area to be marked in the image of the workpiece to be plated; the second target pixels and the first target pixels belong to different pixel types; and determining the final model reference information according to the first model reference information, the second model reference information, and the third model reference information.

[0013] Optionally, controlling the electroplating device to electroplate the target area according to the first positioning information and the second positioning information includes: controlling the electroplating device to move to an electroplating position matching the position of the workpiece to be plated according to the first positioning information; and controlling the electroplating device to electroplate the target area according to a preset electroplating selection strategy and the second positioning information, where the preset electroplating selection strategy is any one of brush plating, encapsulated flow plating, or drip-free electroplating.

[0014] Optionally, the electroplating selection control method further includes: in response to detecting that the electroplating device has completed electroplating the target area, collecting an image of the electroplated workpiece to obtain an image of the electroplated workpiece; determining electroplating evaluation information for characterizing the positioning accuracy according to the image of the workpiece to be plated and the image of the electroplated workpiece; and optimizing the electroplating accuracy of the electroplating device according to the electroplating evaluation information.

[0015] Second aspect, the present disclosure provides a selective plating control system based on positioning and tracking, including: a scanning device configured to scan a locator on a workpiece to be plated in response to detecting the workpiece to be plated, so as to obtain first positioning information and target information for determining a target area, where the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is the area on the workpiece to be plated that needs to be electroplated; an image acquisition device configured to acquire an image of the workpiece to be plated to obtain an image of the workpiece to be plated; a positioning and tracking device respectively connected to the scanning device and the image acquisition device, configured to determine second positioning information according to the image of the workpiece to be plated and the target information, where the second positioning information is used to characterize the position of the target area; and a control device connected to the positioning and tracking device, configured to control an electroplating device to electroplate the target area according to the first positioning information and the second positioning information.

[0016] Through the above technical solution, when the workpiece to be plated is detected, the locator on the workpiece to be plated is scanned to obtain the first positioning information characterizing the position of the workpiece to be plated and the target information for determining the area to be electroplated. Then, an image of the workpiece to be plated is acquired to obtain an image of the workpiece to be plated. Based on the image of the workpiece to be plated and the target information, the second positioning information characterizing the position of the target area is determined. Furthermore, based on the first positioning information and the second positioning information, electroplating is performed on the target area to achieve selective electroplating of a specific area. By first positioning the workpiece to be plated and then positioning a specific area of the workpiece to be plated, positioning of the specific area is achieved without manual intervention. Also, through the image of the workpiece to be plated and the target information, accurate positioning of the specific area can be performed. Therefore, this technical solution can improve the accuracy and efficiency of selective plating control, and thus improve the quality of electroplated products.

[0017] Other features and advantages of the present disclosure will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification. They are used to explain the present disclosure together with the following specific implementation, but do not constitute a limitation to the present disclosure. In the drawings:

[0019] Figure 1 is a block diagram of a selective plating control system based on positioning and tracking shown according to an exemplary embodiment.

[0020] Figure 2 is a schematic diagram of a selective plating scenario shown according to an exemplary embodiment.

[0021] Figure 3 is a flowchart of a selective plating control method based on positioning and tracking shown according to an exemplary embodiment.

[0022] Figure 4 It is a schematic diagram of a workpiece to be plated shown according to an exemplary embodiment.

[0023] Figure 5 It is a schematic diagram of model application shown according to an exemplary embodiment.

[0024] Figure 6 It is a block diagram of an electronic device shown according to an exemplary embodiment. Detailed implementation manners

[0025] The following will explain in detail the detailed implementation manners of the present disclosure with reference to the accompanying drawings. It should be understood that the detailed implementation manners described herein are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure.

[0026] Electroplating technology uses the electrolysis principle to coat a thin layer of other metals or alloys on the surface of certain metals. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, which can prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhance beauty, etc.

[0027] Selective plating technology, which can be called selective electroplating, is a local electroplating technology used to enhance, repair or refurbish specific local areas of manufactured parts.

[0028] In selective plating technology, it is necessary to perform positioning and tracking on specific local areas to ensure the accuracy of selective plating control, and thus ensure the quality of electroplated products.

[0029] In the related art, positioning technologies such as lidar are used to position the products to be electroplated to control the electroplating device to achieve electroplating. This technical solution can be applied to conventional electroplating scenarios. However, for the electroplating control of specific areas, manual intervention is still required, resulting in low electroplating efficiency.

[0030] Based on this, the embodiments of the present disclosure provide a technical solution that combines image processing technology with positioning technology to achieve accurate positioning and tracking of specific areas of products to be electroplated, without manual intervention. Furthermore, accurate and efficient selective plating control is achieved, thereby improving the quality of electroplated products.

[0031] Figure 1 It is a block diagram of a selective plating control system based on positioning and tracking shown according to an exemplary embodiment, as Figure 1 shown, the system includes: a scanning device, an image acquisition device, a positioning and tracking device, and a control device.

[0032] Among them, the positioning and tracking device is respectively connected to the scanning device and the image acquisition device, and the control device can be integrated on the electroplating device or connected to the electroplating device for sending control instructions to the electroplating device.

[0033] In some embodiments, the scanning device can be a signal transceiver device, which can obtain relevant information by receiving signals or transmitting signals. The scanning device can be integrated on the electroplating device, that is, the position of the scanning device and the electroplating device can be regarded as the same position.

[0034] In some embodiments, the image acquisition device can be an industrial camera, which can be applied to industrial scenarios to acquire industrial-type images.

[0035] In some embodiments, the positioning and tracking device can be a data processing device, which can obtain relevant data from the scanning device and the image acquisition device and process it.

[0036] In some embodiments, the control device can be a host computer, which can obtain the positioning information determined by the positioning and tracking device and control the electroplating device.

[0037] In some embodiments, the control device and the positioning and tracking device can be integrated into the same device, which is not limited herein.

[0038] Figure 2 is a schematic diagram of a selective plating scenario shown according to an exemplary embodiment, as Figure 2 shown, in the selective plating scenario, multiple workpieces to be plated are respectively moved to the lower part of the electroplating device through a conveyor belt. At the position where the electroplating device is located, a scanning device and an image acquisition device are configured. After the current workpiece to be plated moves to the lower part of the electroplating device, the conveyor belt pauses first, the scanning device and the image acquisition device acquire relevant data, and then transmit it to the positioning and tracking device. The positioning and tracking device obtains the positioning information according to the relevant data and then transmits it to the control device. The control device then issues a control instruction to the electroplating device based on the positioning information to enable the electroplating device to electroplate a specific area, realizing selective plating control. After completing the selective plating, the conveyor belt is then controlled to continue moving to perform selective plating control on the next workpiece to be plated.

[0039] Figure 3 is a flowchart of a selective plating control method based on positioning and tracking shown according to an exemplary embodiment, as Figure 3 shown, the selective plating control method includes:

[0040] Step S31: In response to detecting the workpiece to be plated, scan the locator on the workpiece to be plated to obtain first positioning information and target information for determining the target area. The first positioning information is used to characterize the position of the workpiece to be plated, and the target area is the area on the workpiece to be plated that needs to be electroplated.

[0041] Step S32: Collect an image of the workpiece to be plated to obtain an image of the workpiece to be plated.

[0042] Step S33: Determine second positioning information according to the image of the workpiece to be plated and the target information. The second positioning information is used to characterize the position of the target area.

[0043] Step S34: Control the electroplating device to electroplate the target area according to the first positioning information and the second positioning information.

[0044] In some embodiments, step S31 can be implemented by a scanning device, that is, scan the locator on the workpiece to be plated through the scanning device to obtain first positioning information and target information for determining the target area.

[0045] In some embodiments, the locator on the workpiece to be plated can emit a signal. When the signal intensity received by the scanning device is higher than the preset intensity, it is regarded as detecting the workpiece to be plated. The preset signal intensity can be determined according to the distance between the scanning device and the conveyor belt. This preset signal intensity can characterize that the position of the workpiece to be plated (i.e., the electroplating position) is below the scanning device. Therefore, the preset signal intensity can be determined according to the relationship between the scanning device and the electroplating position in different scenarios.

[0046] Figure 4 is a schematic diagram of a workpiece to be plated shown according to an exemplary embodiment. As Figure 4 shown, the workpiece to be plated includes a target area, which is the area that needs to be selectively electroplated. For example, it can be an area that needs to be repaired, an area that needs to be strengthened, etc.

[0047] On the workpiece to be plated, a locator is provided. The locator can emit a positioning signal, and the positioning signal can be: a Bluetooth positioning signal, a radio frequency positioning signal, a laser positioning signal, etc. Specifically, it can refer to the mature positioning methods based on signal transceiver in the art.

[0048] On the locator, an electronic tag is pasted. The electronic tag can be an electronic tag based on radio frequency technology. By scanning the electronic tag, corresponding information can be obtained. Exemplarily, the electronic tag can be a two-dimensional code, a bar code, etc.

[0049] Regarding the position of the locator, it can be a position that does not affect the electroplating of the workpiece to be plated, such as: the edge position, etc.

[0050] Therefore, step S31 may include: scanning the positioning signal emitted by the locator, and determining the first positioning information according to the scanned positioning signal; scanning the electronic tag, and determining the target information used to determine the target area according to the scanned electronic tag information.

[0051] In this embodiment, the position information of the workpiece to be plated can be obtained by scanning the positioning signal emitted by the positioning device, and the target information for determining the target area can be obtained by scanning the electronic tag.

[0052] It can be understood that the first positioning information is only used to characterize the position of the workpiece to be plated, which is equivalent to rough positioning information. If the target area needs to be electroplated, the positioning information of the corresponding target area also needs to be obtained.

[0053] Therefore, target information that can be used to determine the target area can be preconfigured to achieve positioning tracking based on the target area.

[0054] There may be a variety of different implementations of target information, which will be described in detail in the subsequent embodiments.

[0055] In some embodiments, step S32 may be performed by an image acquisition device.

[0056] In some embodiments, the scanning device may send information to the image acquisition device to inform the image acquisition device that it can perform image acquisition. Alternatively, the image acquisition device may continue to acquire images, and when positioning and tracking are performed subsequently, positioning and tracking may be performed based on the images acquired by the image acquisition device at the time when the target information is obtained.

[0057] In some embodiments, the image of the workpiece to be plated needs to include the entire workpiece to be plated in order to achieve accurate positioning of the target area.

[0058] Furthermore, in step S33, the positioning tracking device may determine the second positioning information according to the image of the workpiece to be plated and the target information.

[0059] As an optional implementation, step S33 includes: determining image feature conditions corresponding to the target area based on the target information; performing feature extraction on the image of the workpiece to be plated to obtain image features corresponding to the image of the workpiece to be plated; determining position information of the target area in the image of the workpiece to be plated based on the image feature conditions corresponding to the target area and the image features corresponding to the image of the workpiece to be plated; determining second positioning information based on the position information of the target area in the image of the workpiece to be plated.

[0060] In this embodiment, since the image of the workpiece to be plated also includes the target area, based on the target information, the image feature conditions that the target area needs to meet can be determined. Using these image feature conditions, the position information of the target area in the image of the workpiece to be plated can be determined. Furthermore, this position information is converted into the position information in the real scenario, that is, the second positioning information.

[0061] In some embodiments, the conversion relationship between the coordinates of the image of the workpiece to be plated and the real coordinates can be pre-configured. Based on this conversion relationship, the image coordinates can be directly converted into real coordinates. Specifically, the mature coordinate conversion technology in this field can be referred to and will not be introduced in detail here.

[0062] In some embodiments, the target information includes: the information of the workpiece to be plated. Regarding the information of the workpiece to be plated, it can be used to uniquely identify the workpiece to be plated and reflect the characteristics of the workpiece to be plated.

[0063] Exemplarily, the information of the workpiece to be plated can include relatively simple information such as the identifier of the workpiece to be plated and the type of the workpiece to be plated. Regarding the identifier of the workpiece to be plated, it can be understood that each product to be electroplated has a corresponding product identifier, such as a serial number. Regarding the type of the workpiece to be plated, it can describe that the workpiece to be plated belongs to various workpieces, and its form can also be a type identifier.

[0064] Furthermore, based on the target information, the image feature conditions corresponding to the target area are determined, including: obtaining the pre-configured plating selection reference information. The pre-configured plating selection reference information includes: multiple preset electroplated workpiece information and the electroplating area information respectively corresponding to the multiple preset electroplated workpiece information; comparing the multiple preset electroplated workpiece information with the information of the workpiece to be plated to determine the target preset electroplated workpiece information; and determining the image feature conditions corresponding to the target area according to the electroplating area information corresponding to the target preset electroplated workpiece information.

[0065] In this embodiment, the plating selection reference information is pre-configured. In the plating selection reference information, it includes multiple preset electroplated workpiece information and the electroplating area information respectively corresponding to the multiple preset electroplated workpiece information.

[0066] It can be understood that this plating selection reference information is usually configured before product electroplating, so it can be directly obtained.

[0067] In some embodiments, multiple pieces of preset electroplating workpiece information are compared with the workpiece information to be electroplated to determine the target preset electroplating workpiece information. For example, assuming that both the preset electroplating workpiece information and the workpiece information to be electroplated include a product identifier and a type identifier, first, the product identifiers are compared. If the same product identifier is found, the same preset electroplating workpiece information is determined as the target preset electroplating workpiece information. If the same product identifier is not found, the type identifiers are compared, and the preset electroplating workpiece information with the same type identifier is determined as the target preset electroplating workpiece information.

[0068] Furthermore, based on the electroplating area information corresponding to the target preset electroplating workpiece information, the image feature conditions corresponding to the target area can be determined.

[0069] In some embodiments, the workpiece to be electroplated can be a circuit board, and there are multiple electronic devices on the circuit board. Then, the electroplating area information can include: the electroplating area size, the electroplating area material, and the electronic device information of the electroplating area. Correspondingly, the electroplating area information corresponding to the target electroplating workpiece information can also include: the electroplating area size, the electroplating area material, and the electronic device information of the electroplating area.

[0070] In some embodiments, the electronic device information can include: the number of electronic devices, the number of types of electronic devices, and the distribution density of electronic devices, etc.

[0071] Thus, determining the image feature conditions corresponding to the target area according to the electroplating area information corresponding to the target preset electroplating workpiece information can include: determining the size feature conditions corresponding to the target area according to the electroplating area size; determining the first pixel feature conditions corresponding to the target area according to the electroplating area material; determining the second pixel feature conditions corresponding to the target area according to the electronic device information, where the first pixel feature and the second pixel feature belong to different types of pixel features; and determining the image feature conditions corresponding to the target area according to the size feature conditions, the first pixel feature conditions, and the second pixel feature conditions.

[0072] In some embodiments, the electroplating area size can be converted into the size of the target area in the image. For example, assuming that the size ratio relationship between the image of the workpiece to be electroplated and the actual workpiece to be electroplated is 1:10, then, if the size of the electroplating area is 10, the size of the target area in the image can be around 1. Therefore, the size feature conditions can be within the range of 0.9 to 1.1.

[0073] Through the size feature conditions, it is convenient to determine the position of the target area in the image of the workpiece to be electroplated.

[0074] It can be understood that for different electroplating area materials, the corresponding average pixel grayscale values are different. Therefore, the first pixel feature can be the average pixel grayscale value. Thus, based on the electroplating area materials, the average pixel grayscale value condition can be determined. Regarding the average pixel grayscale value, it can be the average among the pixel grayscale values within the area.

[0075] Exemplarily, the average pixel grayscale value corresponding to the copper material is higher than that corresponding to the iron material.

[0076] It can be understood that for different electronic device information, the corresponding pixel grayscale similarities are different. Therefore, the second pixel feature can be the pixel grayscale similarity. Regarding the pixel grayscale similarity, it can be characterized by the difference between pixel grayscale values. The larger the difference, the lower the similarity.

[0077] Exemplarily, the more the number of electronic devices, the more the number of types of electronic devices, and the higher the distribution density of electronic devices, the higher the pixel grayscale similarity, indicating that the pixel distribution is relatively dense.

[0078] Therefore, according to the electronic device information, reasonable second pixel feature conditions can be configured.

[0079] In some embodiments, size feature conditions corresponding to different electroplating area sizes, first pixel feature conditions corresponding to different electroplating area materials, and second pixel feature conditions corresponding to different electronic device information can be pre-configured. Furthermore, according to the current relevant information and the pre-configured conditional relationships, the corresponding conditions matching the current relevant information can be determined.

[0080] Furthermore, in the image feature conditions corresponding to the target area, it includes: size feature conditions, first pixel feature conditions, and second pixel feature conditions.

[0081] In some embodiments, when performing feature extraction on the image of the workpiece to be plated to obtain the image features corresponding to the workpiece to be plated, it can include: dividing the image of the workpiece to be plated into multiple sub-regions according to the image size corresponding to the target area, and then extracting the first pixel feature and the second pixel feature for each sub-region.

[0082] In some embodiments, the image feature extraction can be implemented by mature feature extraction techniques in the art and will not be specifically introduced here.

[0083] Furthermore, comparing the image feature conditions corresponding to the target area with the actually extracted first pixel feature and second pixel feature, the sub-regions that can meet the image feature conditions are determined as the target area.

[0084] Furthermore, according to the position information of the target area in the image of the workpiece to be plated and converting it into real coordinates, the second positioning information can be obtained.

[0085] In some embodiments, when performing sub-region division, multiple different sub-region division methods can be adopted to perform image feature condition matching respectively to ensure that the target region in the image of the workpiece to be plated can be located.

[0086] As an alternative implementation, step S33 includes: determining model reference information according to the target information, where the model reference information is used to assist the pre-trained image processing model in performing image processing. The training data corresponding to the pre-trained image processing model includes: multiple sample electroplated workpiece images, and the areas that need to be electroplated are marked in each of the multiple sample electroplated workpiece images; through the pre-trained image processing model, performing marking processing on the image of the workpiece to be plated according to the model reference information to obtain the processed image of the workpiece to be plated including the target region marking; determining the second positioning information according to the position of the target region marking in the processed workpiece image.

[0087] In this implementation, the annotation of the target region is achieved through the model. Therefore, for the pre-trained image processing model, its training data can include: multiple sample electroplated workpiece images, and the areas that need to be electroplated are marked in the multiple sample electroplated workpiece images.

[0088] In some embodiments, the multiple sample electroplated workpiece images can cover the products that need to be selectively electroplated in the electroplating scenario, and they are all images collected from real electroplated products.

[0089] In some embodiments, the pre-trained image processing model can be a large model. For a large model, after training is completed, it has preliminary prediction ability. However, if the model reference information can be increased, the prediction accuracy of the model can be improved.

[0090] Therefore, in the embodiments of the present disclosure, the model reference information is determined according to the target information to assist the pre-trained image processing model in better completing the annotation of the target region.

[0091] In some embodiments, the model reference information and the image of the workpiece to be plated are output together into the pre-trained large image processing model to obtain the processed image of the workpiece to be plated including the target region marking.

[0092] In some embodiments, in an implementation where the target information includes the electroplating area size, the electroplating area material, and the electronic device information of the electroplating area, determining the model reference information according to the target information may include: determining the first model reference information according to the electroplating area size, where the first model reference information is used to characterize the proportion of the area to be marked in the image of the workpiece to be electroplated; determining the second model reference information according to the electroplating area material, where the second model reference information is used to characterize the proportion of the first target pixels in the area to be marked in the image of the workpiece to be electroplated; determining the third model reference information according to the electronic device information, where the third model reference information is used to characterize the proportion of the second target pixels in the area to be marked in the image of the workpiece to be electroplated; the second target pixels and the first target pixels belong to different pixel types; determining the final model reference information according to the first model reference information, the second model reference information, and the third model reference information.

[0093] In this implementation, the proportion of the target area in the workpiece to be electroplated can be determined according to the electroplating area size, and this proportion is also the proportion of the area to be marked in the image of the workpiece to be electroplated.

[0094] In some embodiments, the first target pixels can be pixels whose pixel grayscale satisfies a preset pixel grayscale mean condition, and the preset pixel grayscale mean condition can be related to the electroplating area material, and specifically can refer to the implementation of the first pixel feature condition described above. Correspondingly, according to the electroplating area material and the materials of other areas in the workpiece to be electroplated, the proportion of the electroplating area material in all materials is determined. Furthermore, this proportion can characterize the proportion of the first target pixels in the image of the workpiece to be electroplated.

[0095] In some embodiments, the second target pixels can be the proportion of the second pixel feature whose pixel grayscale satisfies a preset pixel grayscale similarity condition. The preset pixel grayscale similarity condition can be related to the electronic device information, and specifically can refer to the implementation of the second pixel feature condition described above. Correspondingly, according to the electronic device information and the electronic device information of other areas in the workpiece to be electroplated, the proportion of the electronic device information in all electronic device information is determined, which is the proportion of the second target pixels in the area to be marked in the image of the workpiece to be electroplated.

[0096] Furthermore, the first model reference information, the second model reference information, and the third model reference information can be integrated into the final model reference information.

[0097] Figure 5 is a schematic diagram of model application shown according to an exemplary embodiment, as Figure 5As shown, based on the image of the workpiece to be plated, target information is determined; based on the target information and the relevant information of the workpiece to be plated, three types of model reference information can be determined. Then, these three types of model reference information and the image of the workpiece to be plated without the target area marked are input into the image processing model. The image processing model, based on the model reference information, marks the part corresponding to the target area in the workpiece to be plated and outputs an image including the target area mark.

[0098] Furthermore, based on the position of the target area mark in the image, it can be converted into the second positioning information.

[0099] In some other embodiments, the model reference information can also be the reference information affecting the model accuracy, such as: external bias constants, etc. Specifically, it can be configured according to different scenarios and will not be limited here.

[0100] Exemplarily, according to the target information, the marking difficulty of the target area can be determined, and a reasonable external bias constant can be configured according to this marking difficulty. For example, the smaller the size of the electroplating area, the more common the material of the electroplating area, and the less the electronic device information in the electroplating area, the higher the marking difficulty.

[0101] Further, in step S34, based on the first positioning information and the second positioning information, the electroplating device can be controlled to electroplate the target area.

[0102] As an optional implementation manner, this step includes: controlling the electroplating device to move to the electroplating position matching the position of the workpiece to be plated according to the first positioning information; controlling the electroplating device to electroplate the target area according to the preset plating selection strategy and the second positioning information, and the preset plating selection strategy is any one of brush plating, encapsulated flow plating, or drip-free electroplating.

[0103] In this implementation manner, one of the plating selection methods of brush plating, encapsulated flow plating, or drip-free electroplating can be adopted.

[0104] In some embodiments, the electroplating device can first control the electroplating device to move to the electroplating position matching the position of the workpiece to be plated according to the first positioning information, and then further move to the electroplating position matching the position of the target area according to the second positioning information and perform electroplating according to the plating selection strategy.

[0105] In some embodiments, the control instruction of the electroplating device can be generated according to the first positioning information, the second positioning information, and the plating selection strategy. Regarding the generation method of the control instruction, the mature implementation methods in the art can be referred to and will not be introduced in detail here. That is, in the embodiments of the present disclosure, the key is how to determine the positioning information, and for the specific control method after positioning, the mature technologies in the art can be adopted.

[0106] In some embodiments, after electroplating is completed, the electroplating effect can also be evaluated.

[0107] As an alternative implementation, the selective plating control method further includes: in response to detecting that the electroplating device has completed electroplating of the target area, performing image acquisition on the electroplated workpiece to obtain an electroplated workpiece image; determining electroplating evaluation information for characterizing the positioning accuracy according to the workpiece image to be electroplated and the electroplated workpiece image; and optimizing the electroplating accuracy of the electroplating device according to the electroplating evaluation information.

[0108] In this implementation, after the electroplating device completes electroplating according to the control instruction, electroplating will be temporarily stopped. Therefore, after detecting that the electroplating device has temporarily stopped electroplating, it is regarded as completing electroplating of the target area.

[0109] At this time, the electroplated workpiece can be imaged by an image acquisition device to obtain an electroplated workpiece image.

[0110] Next, the electroplating evaluation information for characterizing the positioning accuracy can be determined by combining the workpiece image to be electroplated and the electroplated workpiece image.

[0111] In some embodiments, since the part corresponding to the target area in the electroplated workpiece image will change. Therefore, the similarity between the workpiece image to be electroplated and the electroplated workpiece image can be determined. If the similarity matches the image difference that the target area may bring, it means that the positioning accuracy is high.

[0112] In some embodiments, the image difference that the target area may bring can be determined according to the size, electronic device information, material, etc. of the target area. The higher the image difference, the lower the similarity between the workpiece image to be electroplated and the electroplated workpiece image.

[0113] Alternatively, other implementations can also be used to determine the positioning accuracy, which is not limited here.

[0114] Furthermore, if the positioning accuracy is low, the electroplating accuracy of the electroplating device can be optimized first to compensate for the influence of the positioning accuracy on the electroplating effect. For example, reducing the electroplating speed of the electroplating device, increasing the intermediate stop points of the electroplating device, etc.

[0115] Meanwhile, it can also feedback to relevant maintenance personnel that the current positioning accuracy is low, so that the relevant maintenance personnel can optimize the positioning strategy. For example, increasing the accuracy of the target information carried by the electronic tag for determining the target area to facilitate more accurate positioning of the target area. Or replacing the image acquisition device to improve the image acquisition accuracy, etc.

[0116] In an embodiment of the present disclosure, when a workpiece to be plated is detected, a locator on the workpiece to be plated is scanned to obtain first positioning information characterizing the position of the workpiece to be plated and target information for determining an area to be electroplated. Then, an image of the workpiece to be plated is acquired to obtain an image of the workpiece to be plated. Based on the image of the workpiece to be plated and the target information, second positioning information characterizing the position of the target area is determined. Further, based on the first positioning information and the second positioning information, electroplating is performed on the target area to achieve selective electroplating of a specific area. By first positioning the workpiece to be plated and then positioning a specific area of the workpiece to be plated, positioning of the specific area can be achieved without manual intervention. Moreover, through the image of the workpiece to be plated and the target information, precise positioning of the specific area can be performed. Therefore, this technical solution can improve the accuracy and efficiency of selective plating control, and thus improve the quality of electroplated products.

[0117] Figure 6 is a block diagram of an electronic device 600 shown according to an exemplary embodiment. As Figure 6 shown, the electronic device 600 may include: a processor 601, a memory 602. The electronic device 600 may further include one or more of a multimedia component 603, an input / output (I / O) interface 604, and a communication component 605.

[0118] Among them, the processor 601 is used to control the overall operation of the electronic device 600 to complete all or part of the steps in the above-mentioned selective plating control method based on positioning and tracking. The memory 602 is used to store various types of data to support the operation of the electronic device 600. These data may include, for example, instructions for any application program or method operating on the electronic device 600, as well as application-related data, such as contact data, sent and received messages, pictures, audio, video, and so on. The memory 602 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM for short), electrically erasable programmable read-only memory (EEPROM for short), erasable programmable read-only memory (EPROM for short), programmable read-only memory (PROM for short), read-only memory (ROM for short), magnetic memory, flash memory, magnetic disk or optical disk. The multimedia component 603 may include a screen and an audio component. Among them, the screen may be a touch screen, and the audio component is used to output and / or input audio signals. For example, the audio component may include a microphone, and the microphone is used to receive external audio signals. The received audio signals may be further stored in the memory 602 or sent through the communication component 605. The audio component further includes at least one speaker for outputting audio signals. The I / O interface 604 provides an interface between the processor 601 and other interface modules, and the above-mentioned other interface modules may be a keyboard, a mouse, buttons, etc. These buttons may be virtual buttons or physical buttons. The communication component 605 is used for wired or wireless communication between the electronic device 600 and other devices. Wireless communication, such as Wi-Fi, Bluetooth, near field communication (NFC for short), 2G, 3G or 4G, or a combination of one or more of them. Therefore, the corresponding communication component 605 may include: a Wi-Fi module, a Bluetooth module, an NFC module.

[0119] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for performing the above-mentioned XXXX method.

[0120] In another exemplary embodiment, there is also provided a computer-readable storage medium including program instructions, which implement the steps of the above-mentioned plating selection control method based on positioning and tracking when being executed by a processor. For example, the computer-readable storage medium may be the above-mentioned memory 602 including program instructions, and the above program instructions may be executed by the processor 601 of the electronic device 600 to complete the above-mentioned plating selection control method based on positioning and tracking.

[0121] In another exemplary embodiment, there is also provided a computer program product, which includes a computer program capable of being executed by a processor, and the computer program implements the steps of the above-mentioned plating selection control method based on positioning and tracking when being executed by the processor.

[0122] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0123] In addition, it should be noted that, in the case of no contradiction, the various specific technical features described in the above specific embodiments can be combined in any suitable way. To avoid unnecessary repetition, the present disclosure does not separately describe various possible combination methods.

[0124] Furthermore, any combination can be made between various different embodiments of the present disclosure, as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.

Claims

1. A selective plating control method based on positioning and tracking, characterized in that Including: In response to detecting a workpiece to be plated, scanning a locator on the workpiece to be plated to obtain first positioning information and target information for determining a target area, where the first positioning information is used to characterize the position of the workpiece to be plated, and the target area is the area on the workpiece to be plated that needs electroplating; Performing image acquisition on the workpiece to be plated to obtain an image of the workpiece to be plated; Determining second positioning information according to the image of the workpiece to be plated and the target information, where the second positioning information is used to characterize the position of the target area; Controlling an electroplating device to electroplate the target area according to the first positioning information and the second positioning information; The determining the second positioning information according to the image of the workpiece to be plated and the target information includes: Determining an image feature condition corresponding to the target area according to the target information; Performing feature extraction on the image of the workpiece to be plated to obtain an image feature corresponding to the image of the workpiece to be plated; Determining position information of the target area in the image of the workpiece to be plated according to the image feature condition corresponding to the target area and the image feature corresponding to the image of the workpiece to be plated; Determining the second positioning information according to the position information of the target area in the image of the workpiece to be plated; The target information includes workpiece to be plated information. The determining the image feature condition corresponding to the target area according to the target information includes: Obtaining pre-configured selective plating reference information, where the pre-configured selective plating reference information includes: multiple preset electroplating workpiece information and electroplating area information respectively corresponding to the multiple preset electroplating workpiece information; Comparing the multiple preset electroplating workpiece information with the workpiece to be plated information to determine target preset electroplating workpiece information; Determining the image feature condition corresponding to the target area according to the electroplating area information corresponding to the target preset electroplating workpiece information; The workpiece to be plated is a circuit board, and the circuit board includes multiple electronic devices. The electroplating area information corresponding to the target preset electroplating workpiece information includes: electroplating area size, electroplating area material, and electronic device information of the electroplating area. The determining the image feature condition corresponding to the target area according to the electroplating area information corresponding to the target preset electroplating workpiece information includes: Determining a size feature condition corresponding to the target area according to the electroplating area size; Determining a first pixel feature condition corresponding to the target area according to the electroplating area material; Determining a second pixel feature condition corresponding to the target area according to the electronic device information, where the first pixel feature and the second pixel feature belong to different types of pixel features; Determining the image feature condition corresponding to the target area according to the size feature condition, the first pixel feature condition, and the second pixel feature condition; where the first pixel feature is the average pixel gray value; the second pixel feature is the pixel gray similarity.

2. The selective plating control method according to claim 1, wherein, The locator is used to emit a positioning signal, and an electronic tag is pasted on the locator. The scanning the locator on the workpiece to be plated to obtain first positioning information and target information for determining a target area includes: Scan the positioning signal emitted by the locator, and determine the first positioning information according to the scanned positioning signal; Scan the electronic tag, and determine the target information for determining the target area according to the scanned electronic tag information.

3. The selective plating control method according to claim 1, wherein The determining the second positioning information according to the workpiece image to be plated and the target information includes: Determine model reference information according to the target information, where the model reference information is used to assist the pre-trained image processing model in performing image processing. The training data corresponding to the pre-trained image processing model includes: multiple sample electroplated workpiece images, and areas to be electroplated are marked in the multiple sample electroplated workpiece images respectively; Through the pre-trained image processing model, perform marking processing on the workpiece image to be plated according to the model reference information, and obtain a processed workpiece image to be plated including target area markings; Determine the second positioning information according to the position of the target area marking in the processed workpiece image.

4. The selective plating control method according to claim 3, characterized in that, The workpiece to be plated is a circuit board, and the circuit board includes multiple electronic devices. The target information includes: electroplating area size, electroplating area material, and electronic device information of the electroplating area. The determining the model reference information according to the target information includes: Determine first model reference information according to the electroplating area size, where the first model reference information is used to characterize the proportion of the area to be marked in the workpiece image to be plated; Determine second model reference information according to the electroplating area material, where the second model reference information is used to characterize the proportion of the first target pixels in the area to be marked in the workpiece image to be plated; Determine third model reference information according to the electronic device information, where the third model reference information is used to characterize the proportion of the second target pixels in the area to be marked in the workpiece image to be plated; the second target pixels and the first target pixels belong to different pixel types; Determine the final model reference information according to the first model reference information, the second model reference information, and the third model reference information.

5. The selective plating control method according to claim 1, wherein The controlling the electroplating device to electroplate the target area according to the first positioning information and the second positioning information includes: According to the first positioning information, control the electroplating device to move to an electroplating position matching the position of the workpiece to be plated; According to the preset selective electroplating strategy and the second positioning information, control the electroplating device to electroplate the target area, and the preset selective electroplating strategy is any one of brush plating, encapsulated flow plating, or drip-free electroplating.

6. The selective plating control method according to claim 1, wherein The selective electroplating control method further includes: In response to detecting that the electroplating device has completed electroplating the target area, collect an image of the electroplated workpiece to obtain an electroplated workpiece image; Determine electroplating evaluation information for characterizing the positioning accuracy according to the workpiece image to be plated and the electroplated workpiece image; Optimize the electroplating accuracy of the electroplating device according to the electroplating evaluation information.

7. A selective plating control system based on positioning and tracking, characterized in that, Including: A scanning device, configured to scan a locator on a workpiece to be plated in response to detecting the workpiece to be plated, obtain first positioning information for characterizing the position of the workpiece to be plated and target information for determining a target area, where the target area is the area on the workpiece to be plated that needs to be electroplated; An image acquisition device, configured to acquire an image of the workpiece to be plated to obtain an image of the workpiece to be plated; A positioning and tracking device, respectively connected to the scanning device and the image acquisition device, configured to determine second positioning information according to the image of the workpiece to be plated and the target information, where the second positioning information is used to characterize the position of the target area; A control device, connected to the positioning and tracking device, configured to control an electroplating device to electroplate the target area according to the first positioning information and the second positioning information; The positioning and tracking device is further configured to: Extract features from the image of the workpiece to be plated to obtain image features corresponding to the image of the workpiece to be plated; Determine position information of the target area in the image of the workpiece to be plated according to the image feature conditions corresponding to the target area and the image features corresponding to the image of the workpiece to be plated; Determine the second positioning information according to the position information of the target area in the image of the workpiece to be plated; The target information includes: workpiece information to be plated, and the positioning and tracking device is further configured to: Obtain pre-configured plating selection reference information, where the pre-configured plating selection reference information includes: multiple preset electroplated workpiece information and electroplating area information respectively corresponding to the multiple preset electroplated workpiece information; Compare the multiple preset electroplated workpiece information with the workpiece information to be plated to determine target preset electroplated workpiece information; Determine the image feature conditions corresponding to the target area according to the electroplating area information corresponding to the target preset electroplated workpiece information; The workpiece to be plated is a circuit board, and the circuit board includes multiple electronic devices. The electroplating area information corresponding to the target preset electroplated workpiece information includes: electroplating area size, electroplating area material, and electronic device information of the electroplating area. The positioning and tracking device is further configured to: Determine the size feature conditions corresponding to the target area according to the electroplating area size; Determine the first pixel feature conditions corresponding to the target area according to the electroplating area material; Determine the second pixel feature conditions corresponding to the target area according to the electronic device information, where the first pixel feature and the second pixel feature belong to different types of pixel features; Determine the image feature conditions corresponding to the target area according to the size feature conditions, the first pixel feature conditions, and the second pixel feature conditions; where the first pixel feature is the average pixel gray value; the second pixel feature is the pixel gray similarity.

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