Semiconductor part processing clamp, clamping method and processing method

Abstract

The invention belongs to the technical field of semiconductor part processing, and discloses a semiconductor part processing clamp, a clamping method and a processing method.The semiconductor part processing clamp comprises a supporting piece and a plurality of fixing pieces; the supporting piece is provided with a step part, the step part is used for bearing a semiconductor part, the supporting piece is provided with a first positioning assembly, and the first positioning assembly is used for positioning and installing the supporting piece; and the plurality of fixing pieces are detachably arranged on the supporting piece at intervals, and the fixing pieces are used for limiting and fixing the semiconductor parts. According to the semiconductor part processing clamp, the clamping difficulty of the semiconductor part is reduced, the processing efficiency is improved, the clamping frequency is reduced, and the precision error of a product caused by multiple times of clamping is effectively avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component processing, and in particular to a semiconductor component processing fixture, a clamping method and a processing method. Background Art

[0002] In the process of parts processing, especially for semiconductor parts processing, since some semiconductor parts do not have clamping positions, all positions need to be processed, so that the positions of the semiconductor parts need to be constantly adjusted during the processing, and multiple clamping of the semiconductor parts is required at various positions; and since there is no clamping position, the clamping of the semiconductor parts is unstable, and the semiconductor parts may also be damaged, which will lead to cumbersome processing of the semiconductor parts, low processing efficiency, large processing errors of the products, and low yield rate.

[0003] Therefore, there is an urgent need for a semiconductor component processing fixture, a clamping method and a processing method to solve the above-mentioned technical problems. Summary of the invention

[0004] One object of the present invention is to provide a semiconductor component processing fixture, which reduces the difficulty of clamping semiconductor components, improves processing efficiency, reduces the number of clamping times, and effectively avoids the problem of large product precision errors caused by multiple clamping.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] Semiconductor parts processing fixtures include:

[0007] A support member, wherein the support member is provided with a step portion, and the step portion is used to receive the semiconductor component. The support member is provided with a first positioning assembly, and the first positioning assembly is used for positioning and installing the support member;

[0008] A plurality of fixing members are arranged on the supporting member at intervals and in a detachable manner, and the fixing members are used to positionally fix the semiconductor components.

[0009] Optionally, the first positioning assembly includes a plurality of straightening grooves, and the plurality of straightening grooves are provided on the support member for positioning and straightening the support member.

[0010] Optionally, the first positioning assembly further comprises a plurality of mounting holes, and the mounting holes are used for fixed connection with the tooling.

[0011] Optionally, the fixing member is provided with a limiting groove, the limiting groove comprises a first limiting surface and a second limiting surface which are perpendicularly arranged to each other, the first limiting surface abuts against the top of the semiconductor component, and the second limiting surface abuts against the periphery of the semiconductor component.

[0012] Optionally, along the radial direction of the support member, the fixing member is adjustably arranged on the support member.

[0013] Optionally, the support member is also provided with a plurality of tool withdrawal grooves for feeding and withdrawing the machining tool.

[0014] Optionally, a lifting seat is further included, and the lifting seat is arranged at the bottom of the supporting member to lift the supporting member.

[0015] Optionally, the lifting seat includes a base and a plurality of heightening columns, one end of the heightening column is fixedly connected to the base, and the other end is fixedly connected to the bottom of the support member.

[0016] Another object of the present invention is to provide a semiconductor component clamping method, which reduces the difficulty of clamping semiconductor components, improves processing efficiency, reduces the number of clamping times, and effectively avoids product precision errors caused by multiple clamping.

[0017] To achieve this object, the present invention adopts the following technical solutions:

[0018] A semiconductor component clamping method, using the semiconductor component processing fixture described in any of the above schemes, the semiconductor component clamping method comprises the following steps:

[0019] S1. placing the semiconductor component on the step portion of the support member, and adjusting the installation position of the semiconductor component to a preset installation position by straightening the hole;

[0020] S2. Clamp the limiting grooves of the plurality of fixing members onto the semiconductor component at intervals along the circumferential direction of the supporting member, and fix the fixing members onto the supporting member so that the groove walls of the limiting grooves are pressed tightly against the semiconductor component.

[0021] Another object of the present invention is to provide a semiconductor component processing method, which reduces the difficulty of clamping semiconductor components, improves processing efficiency, reduces the number of clamping times, and effectively avoids product precision errors caused by multiple clamping.

[0022] To achieve this object, the present invention adopts the following technical solutions:

[0023] A semiconductor component processing method, using the semiconductor component processing fixture described in any of the above schemes to clamp the semiconductor component, the semiconductor component processing method comprising the following steps:

[0024] S10, adjusting the position of the support member by the first positioning assembly, and installing the support member on the tooling of the processing equipment; adjusting the position of the semiconductor component by the second positioning assembly, installing the semiconductor component on the step portion, and installing a plurality of fixing members to fix the semiconductor component;

[0025] S20, processing the upper surface of the semiconductor component along a first preset processing path;

[0026] S30, turning over the semiconductor component and installing it on the step portion, and processing the lower surface of the semiconductor component along a second preset processing path;

[0027] S40, installing the lifting seat at the bottom of the above-mentioned support member, and leveling and installing the above-mentioned support member; processing the circumferential side wall of the above-mentioned semiconductor component along the third preset processing path to complete the processing of the above-mentioned semiconductor component.

[0028] Beneficial effects of the present invention:

[0029] The present invention provides a semiconductor component processing fixture, a clamping method and a processing method. By arranging a step portion on a support member, a first protrusion and a second protrusion of the semiconductor component in the present invention can be matched to achieve the placement of the front and back sides of the semiconductor component; then, a first positioning component is used to adjust the position of the mounting support member when it is installed on the tooling to ensure the installation position of the semiconductor component on the support member, thereby allowing the processing equipment to have higher processing accuracy for the semiconductor component; finally, the semiconductor component can be fully limited by a fixing member to achieve processing of semiconductor components without a clamping position; and there is no need to change the installation position multiple times, which simplifies the processing steps and effectively avoids the problem of large precision errors of products caused by multiple clamping; and improves processing efficiency, processing accuracy and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is an axonometric view of a semiconductor component processing fixture provided by a specific embodiment of the present invention;

[0031] Figure 2 is a top view of a semiconductor component processing fixture provided by a specific embodiment of the present invention;

[0032] Figure 3 is a side view of a fixing member provided in a specific embodiment of the present invention;

[0033] Figure 4 is an isometric view of a semiconductor component after installation provided by a specific embodiment of the present invention;

[0034] Figure 5is an axonometric diagram of a semiconductor component after being processed along a first preset path provided by a specific embodiment of the present invention;

[0035] Figure 6 is an axonometric diagram of a semiconductor component after being processed along a second preset path provided by a specific embodiment of the present invention;

[0036] Figure 7 is an axonometric diagram of a semiconductor component after being processed along a third preset path provided by a specific embodiment of the present invention;

[0037] Figure 8 It is a side view of a semiconductor component provided by a specific embodiment of the present invention after being processed along a third preset path.

[0038] In the figure:

[0039] 10. Support member; 101. Positioning hole; 11. Step portion; 111. First step portion; 112. Second step portion; 12. Backing groove;

[0040] 20. fixing member; 21. limiting groove; 211. first limiting surface; 212. second limiting surface;

[0041] 30. first positioning assembly; 31. straightening groove; 32. mounting hole;

[0042] 40. Elevated seat; 41. Base; 42. Heightening column;

[0043] 200, semiconductor component; 210, first protrusion; 220, second protrusion; 230, straightening hole;

[0044] 300. Work clothes. DETAILED DESCRIPTION

[0045] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0046] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0049] Refer to the following Figures 1 to 8 The semiconductor component processing fixture, clamping method and processing method of the present invention are described.

[0050] Please refer to Figures 4 to 6 The semiconductor component processing fixture in this embodiment is used to process a semiconductor component 200. In this embodiment, the semiconductor component 200 is an annular structure, which includes a body, a first protrusion 210 and a second protrusion 220. The first protrusion 210 and the second protrusion 220 are respectively arranged on both sides of the body along its own axial direction. The first protrusion 210, the second protrusion 220 and the body are concentrically arranged to form an annular structure.

[0051] Optionally, the semiconductor component 200 further includes a plurality of straightening holes 230 , so that the semiconductor component 200 can be straightened and positioned before being processed to ensure the accuracy of the processing position.

[0052] Specifically, two straightening holes 230 are provided, and the two straightening holes 230 are arranged oppositely on the upper surface of the first protrusion 210 to adjust the installation position of the semiconductor component 200 .

[0053] Please refer to Figure 1 and Figure 2In order to ensure the processing of the semiconductor component 200, this embodiment provides a semiconductor component processing fixture. Specifically, the semiconductor component 200 processing fixture includes a support member 10 and a plurality of fixing members 20; the support member 10 is provided with a step portion 11, the step portion 11 is used to receive the semiconductor component 200, the support member 10 is provided with a first positioning component 30, the first positioning component 30 is used for positioning and installing the support member 10; a plurality of fixing members 20 are detachably arranged on the support member 10 at intervals, and the fixing members 20 are used to limit and fix the semiconductor component 200.

[0054] The semiconductor component processing fixture in this embodiment can match the first protrusion 210 and the second protrusion 220 of the semiconductor component 200 in this embodiment by setting a step portion 11 on the support member 10, so as to realize the placement of the front and back sides of the semiconductor component 200; then, the first positioning component 30 is used to adjust the position of the mounting support member 10 when it is installed on the tooling 300, so as to ensure the installation position of the semiconductor component 200 on the support member 10, thereby making the processing accuracy of the semiconductor component 200 of the processing equipment higher; finally, the semiconductor component 200 can be limited in all directions by the fixing member 20, so as to realize the processing of the semiconductor component 200 without a clamping position; and there is no need to change the installation position multiple times, which simplifies the processing steps and effectively avoids the problem of large precision error of the product caused by multiple clamping; thus, the processing efficiency, processing accuracy and yield rate are improved.

[0055] Please continue to refer to Figure 1 and Figure 2 In the present embodiment, the step portion 11 includes a first step portion 111 and a second step portion 112, and the first step portion 111 and the second step portion 112 are connected to support the first protrusion 210, the main body or the second protrusion 220 of the step portion 11, so as to facilitate the installation of the front and back sides of the semiconductor component 200, thereby realizing the processing of various positions of the semiconductor component 200 by using one semiconductor component processing fixture.

[0056] Specifically, the opening of the first step portion 111 and the second step portion 112 also enables the semiconductor component processing fixture to form a step groove, and the step groove is used to accommodate the first protrusion 210 or the second protrusion 220 to achieve the placement of the semiconductor component 200.

[0057] In some embodiments, a plurality of positioning holes 101 are provided on the step portion 11, and the positioning holes 101 are used to position the hole positions of the semiconductor component 200, that is, the positioning holes 101 are provided according to the positioning holes 101 and the fixing holes of the processed semiconductor component 200, so that during the processing, whether the hole positions of the semiconductor component 200 are correct, and when the semiconductor component 200 is flipped over and reinstalled or in other installation situations, the positioning holes 101 can be used to limit and fix the semiconductor component 200, so as to better realize the positioning and installation of the semiconductor component 200.

[0058] In some embodiments, the support member 10 is also provided with a plurality of tool-retracting grooves 12 for feeding and withdrawing the machining tool. Since the circumferential wall surface of the semiconductor component 200 also needs to be processed, and its height is not high, if the machining tool is directly processed, it may collide with the support member 10 or the tooling 300, causing damage to the machining tool or the machining fixture. The provision of the tool-retracting grooves 12 reserves a processing position for the machining tool, so as to facilitate the feeding and withdrawing of the machining tool, and facilitate the machining of the semiconductor component 200.

[0059] In this embodiment, the first positioning component 30 includes a plurality of straightening grooves 31, and the plurality of straightening grooves 31 are opened on the support member 10 for positioning and straightening the support member 10, so that when the support member 10 is installed, its position can be adjusted and straightened through the straightening grooves 31 to ensure that its installation position is correct, thereby making the installation position of the semiconductor component 200 on the support member 10 accurate.

[0060] In some embodiments, the first positioning assembly 30 also includes a plurality of mounting holes 32, which are used to be fixedly connected to the tooling 300. After the support member 10 is straightened by the straightening groove 31, the support member 10 is fixed to the tooling 300 of the processing equipment through the mounting holes 32 to ensure the stability of the installation of the support member 10 and the semiconductor component 200, thereby preventing the semiconductor component 200 from moving around during the processing and causing processing errors, thereby improving its processing accuracy.

[0061] In this embodiment, a plurality of fixing members 20 are provided, and the plurality of fixing members 20 are arranged at intervals along the circumference of the support member 10 to limit and fix the semiconductor component 200 at various positions in the circumferential direction.

[0062] Please refer to Figure 3Specifically, the fixing member 20 is provided with a limiting groove 21, and the limiting groove 21 includes a first limiting surface 211 and a second limiting surface 212 which are arranged perpendicular to each other. The first limiting surface 211 abuts against the top of the semiconductor component 200, and the second limiting surface 212 abuts against the outer periphery of the semiconductor component 200. The above-mentioned arrangement cooperates with the step portion 11, which not only limits the two sides of the axial direction of the semiconductor component 200, but also limits the radial direction of the semiconductor component 200, thereby realizing the limiting and fixing of the semiconductor component 200 in all directions, thereby improving the stability of the semiconductor component processing fixture in fixing the semiconductor component 200.

[0063] Optionally, the fixing member 20 is adjustably arranged on the supporting member 10 along the radial direction of the supporting member 10, so that the fixing member 20 can be installed in a limited position for semiconductor components 200 of different sizes to improve the compatibility and adaptability of the semiconductor component processing fixture.

[0064] Specifically, along the radial direction of the support member 10 , the fixing member 20 is provided with an oblong hole, and the installation position of the fixing member 20 can be adjusted through the oblong hole.

[0065] Optionally, the top surface of the support member 10 is provided with a plurality of threaded holes along its circumference, and the support member 10 and the fixing member 20 can be fixed by bolts passing through the oblong holes and being threadedly connected with the threaded holes.

[0066] Please refer to Figure 7 and Figure 8 In this embodiment, the semiconductor component processing fixture also includes a lifting seat 40, which is arranged at the bottom of the support member 10 to lift the support member 10, so as to provide a processing space for the processing tool when processing the circumferential wall surface of the semiconductor component 200.

[0067] Specifically, the lifting seat 40 includes a base 41 and a plurality of heightening columns 42 . One end of the heightening column 42 is fixedly connected to the base 41 , and the other end is fixedly connected to the bottom of the support member 10 , so that the lifting seat 40 can lift the support member 10 .

[0068] Optionally, the heightening column 42 and the supporting member 10 , as well as the heightening column 42 and the base 41 are connected via threads.

[0069] The present embodiment also provides a semiconductor component clamping method, which adopts the semiconductor component processing fixture described in any of the above schemes, and the semiconductor component clamping method includes the following steps: S1, placing the semiconductor component 200 on the step portion 11 of the support member 10, and adjusting the installation position of the semiconductor component 200 to a preset installation position by straightening the hole 230; S2, clamping the limiting grooves 21 of multiple fixing members 20 on the semiconductor component 200 along the circumferential intervals of the support member 10, and fixing the fixing members 20 on the support member 10 so that the groove walls of the limiting grooves 21 are tightly pressed against the semiconductor component 200.

[0070] Through the above-mentioned semiconductor component clamping method, the installation and clamping of the semiconductor component 200 without a clamping position can be realized, which reduces the clamping difficulty of the semiconductor component 200, improves the processing efficiency, reduces the number of clamping times, and effectively avoids the precision error of the product caused by multiple clamping.

[0071] This embodiment further provides a semiconductor component processing method, which uses the semiconductor component processing fixture described in any of the above schemes to clamp the semiconductor component 200. It has all the technical effects of the semiconductor component processing fixture described in any of the above schemes, which will not be repeated here.

[0072] The semiconductor component processing method comprises the following steps:

[0073] Please refer to Figure 4 Step S10, adjust the position of the support member 10 through the first positioning component 30, and install the support member 10 on the tooling 300 of the processing equipment; adjust the position of the semiconductor component 200 through the second positioning component, install the semiconductor component 200 on the step portion 11, and install a plurality of fixing members 20 to fix the semiconductor component 200.

[0074] Specifically, in step S10 , the support member 10 is firstly leveled through the straightening groove 31 , and then installed on the tooling 300 through the mounting hole 32 ; and then the semiconductor component 200 is leveled and installed on the support member 10 through the straightening hole 230 .

[0075] It should be noted that in step S10 , when the semiconductor component 200 is installed, the first protrusion 210 is arranged upward.

[0076] Please refer to Figure 5 After step S10, step S20 is included, processing the upper surface of the semiconductor component 200 along the first preset processing path. That is, the first protrusion 210 and the body are processed to obtain the positioning hole 101, the fixing hole and other apertures and surface processing.

[0077] It should be noted that the first preset processing path is set according to the actual processing requirements of the semiconductor component 200, which will not be elaborated here.

[0078] Please refer to Figure 6 , after step S20, the method includes step S30, flipping the semiconductor component 200 and installing it on the step portion 11, and processing the lower surface of the semiconductor component 200 along a second preset processing path; that is, installing the second protrusion 220 of the semiconductor component 200 on the step portion 11 facing upward, and then further processing the second protrusion 220.

[0079] It should be noted that the second preset processing path is set according to the actual processing requirements of the semiconductor component 200, which will not be repeated here.

[0080] Please refer to Figure 7 After step S30, the method includes step S40, installing the lifting seat 40 at the bottom of the support member 10, and leveling and installing the support member 10; processing the circumferential side wall of the semiconductor component 200 along the third preset processing path to complete the processing of the semiconductor component 200. That is, the semiconductor component 200 is lifted as a whole, and then the circumferential side wall of the second protrusion 220 is further processed to complete the processing of the semiconductor component 200.

[0081] It should be noted that the third preset processing path is set according to the actual processing requirements of the semiconductor component 200, which will not be repeated here.

[0082] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A semiconductor component processing fixture, characterized in that: include: A support member (10), the support member (10) being provided with a step portion (11), the step portion (11) being used to receive a semiconductor component (200), the support member (10) being provided with a first positioning assembly (30), the first positioning assembly (30) being used for positioning and installing the support member (10); A plurality of fixing members (20), wherein the plurality of fixing members (20) are arranged on the support member (10) at intervals and in a detachable manner, and the fixing members (20) are used to positionally fix the semiconductor component (200).

2. The semiconductor component processing fixture according to claim 1, characterized in that: The first positioning component (30) comprises a plurality of straightening grooves (31), and the plurality of straightening grooves (31) are arranged on the support member (10) to be used for positioning and straightening the support member (10).

3. The semiconductor component processing fixture according to claim 2, characterized in that: The first positioning assembly (30) further comprises a plurality of mounting holes (32), wherein the mounting holes (32) are used for fixed connection with the tooling (300).

4. The semiconductor component processing fixture according to claim 1, characterized in that: The fixing member (20) is provided with a limiting groove (21), and the limiting groove (21) comprises a first limiting surface (211) and a second limiting surface (212) which are arranged perpendicular to each other, the first limiting surface (211) abuts against the top of the semiconductor component (200), and the second limiting surface (212) abuts against the periphery of the semiconductor component (200).

5. The semiconductor component processing fixture according to claim 1, characterized in that: Along the radial direction of the support member (10), the fixing member (20) is arranged on the support member (10) in an adjustable manner.

6. The semiconductor component processing fixture according to claim 1, characterized in that: The support member (10) is also provided with a plurality of tool withdrawal grooves (12) for feeding and withdrawing the machining tool.

7. The semiconductor component processing fixture according to any one of claims 1 to 6, characterized in that: It also includes a lifting seat (40), which is arranged at the bottom of the support member (10) to lift the support member (10).

8. The semiconductor component processing fixture according to claim 7, characterized in that: The lifting seat (40) comprises a base (41) and a plurality of heightening columns (42), one end of the heightening column (42) is fixedly connected to the base (41), and the other end is fixedly connected to the bottom of the support member (10).

9. A semiconductor component clamping method, characterized in that: Using the semiconductor component processing fixture as described in claims 1-8, the semiconductor component clamping method comprises the following steps: S1, placing the semiconductor component (200) on the step portion (11) of the support member (10), and adjusting the installation position of the semiconductor component (200) to a preset installation position by straightening the hole (230); S2. The limiting grooves (21) of the plurality of fixing members (20) are clamped onto the semiconductor component (200) along the circumferential intervals of the support member (10), and the fixing member (20) is fixed onto the support member (10) so that the groove walls of the limiting grooves (21) are pressed tightly against the semiconductor component (200).

10. A semiconductor component processing method, characterized in that: A semiconductor component (200) is clamped by using a semiconductor component processing fixture as described in claims 1 to 8, and the semiconductor component processing method comprises the following steps: S10, adjusting the position of the support member (10) by means of the first positioning assembly (30), and installing the support member (10) on a tooling (300) of a processing device; adjusting the position of the semiconductor component (200) by means of the second positioning assembly, installing the semiconductor component (200) on the step portion (11), and installing a plurality of fixing members (20) to fix the semiconductor component (200); S20, processing the upper surface of the semiconductor component (200) along a first preset processing path; S30, turning over the semiconductor component (200) and installing it on the step portion (11), and processing the lower surface of the semiconductor component (200) along a second preset processing path; S40, installing the lifting seat (40) at the bottom of the support member (10), and leveling and installing the support member (10); processing the circumferential side wall of the semiconductor component (200) along a third preset processing path, and completing the processing of the semiconductor component (200).

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