Wafer disc film expansion device

Abstract

The present invention provides a wafer disc film expansion device, which relates to the technical field of semiconductor equipment, and comprises: a base; a fixing component, wherein the fixing component is placed on one side of the top of the base, and the fixing component comprises a pressure plate arranged on one side of the top of the base. In the present invention, firstly, the wafer disc is placed on the bottom of the pressure plate, and is firmly fixed on the fixing plate by fixing bolts and a support plate, and then, the first transmission motor and the second transmission motor in the rotating component are started, and the first transmission motor drives the movable rod to rotate through the first rotating rod, the second rotating rod and the movable ball and other components, so as to adjust the position of the wafer disc, and at the same time, the second transmission motor drives the bevel gear to rotate, and further drives the first rotating block to rotate in the fixed shell, so as to realize the rotational film expansion of the wafer disc, and in the whole process, the various components work together to realize the horizontal offset shaking of the wafer disc before film expansion, so that the liquid film can be evenly spread on the wafer surface.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a wafer disk film expansion device. Background Art

[0002] The wafer expansion device is mainly used in the semiconductor manufacturing process. By expanding the film layer on the surface of the wafer, its surface quality and film uniformity are improved. This technology plays an important role in improving the performance and yield of integrated circuits. Traditional film expansion technology often faces problems such as uneven film layer and low efficiency. Therefore, more efficient and precise equipment is needed to meet the growing process requirements.

[0003] However, in actual use, there are still the following deficiencies, such as: the existing wafer disc film expansion device cannot perform horizontal offset shaking on the wafer disc before film expansion to evenly spread the liquid film on the wafer surface. If the wafer disc cannot be horizontally offset and shaken before film expansion, the liquid film may not be evenly distributed on the wafer surface. This will lead to uneven film thickness, thus affecting the accuracy of subsequent processes and the quality of chips. Due to the uneven distribution of the film, additional steps may be required to correct or re-coat, which will increase production time and cost. Manually adjusting the angle and position of the wafer disc to achieve uniform distribution of the film requires high skills of the operator and is prone to errors.

[0004] Therefore, the present invention proposes a wafer disk film expansion device to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to provide a wafer disc film expansion device.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a wafer disc film expansion device, comprising:

[0007] Base;

[0008] A fixing assembly is placed on one side of the top of the base, and the fixing assembly includes a pressing plate arranged on one side of the top of the base, a wafer disc is arranged at the bottom of the pressing plate, a top ring is arranged inside the wafer disc, a supporting plate is arranged at the bottom of the top ring, a fixing bolt is threadedly connected to the bottom of the supporting plate, and a fixing plate is fixedly connected to one side of the bottom of the supporting plate;

[0009] A rotating assembly is placed on the side of the base close to the bottom of the fixed plate. The rotating assembly includes a fixed shell fixedly connected to the side of the base close to the bottom of the fixed plate. A first transmission motor is installed on one side of the fixed shell. The output end of the first transmission motor is fixedly connected to a first rotating rod. The other end of the first rotating rod is rotatably connected to a second rotating rod. A first movable ball groove is provided on the second rotating rod. A first movable ball is movably connected in the first movable ball groove. The top of the first movable ball is fixedly connected to a movable rod. The end of the movable rod away from the first movable ball is fixedly connected to a second movable ball. A second transmission motor is installed on one side of the fixed shell, and a bevel gear is fixedly connected to the output end of the second transmission motor. A first rotating block is rotatably connected in the fixed shell, a tooth groove is provided at the bottom of the first rotating block, a connecting plate is provided on the top of the fixed shell, a first limiting plate is provided at the bottom of the connecting plate, a second limiting groove is provided on the first limiting plate, a first limiting rod is fixedly connected to the side of the bottom of the connecting plate close to the second limiting groove, a second rotating block is rotatably connected on the first limiting plate, a second movable ball groove is provided on the connecting plate, and the second movable ball is movably connected in the second movable ball groove.

[0010] As a preferred implementation, a fixing block is fixedly connected to the fixing plate, and a first limiting groove is formed on the fixing plate.

[0011] The beneficial effect of adopting the above further scheme is: since the fixed plate is fixedly connected to the fixed block, the fixed plate can support and fix the fixed block, and the lifting assembly can lift or lower the fixed assembly and the wafer disk fixed on the fixed assembly through the set fixed block. Since the fixed plate is provided with a first limit groove, the second limit rod can be inserted into the first limit groove, so that the fixed assembly can be fixed on the rotating assembly through the limit assembly.

[0012] As a preferred implementation, the bevel gear is meshed with the tooth groove, the first limiting rod is slidably connected in the second limiting groove, and the other end of the second rotating block is rotatably connected to the first rotating block.

[0013] The beneficial effect of adopting the above further scheme is: since the bevel gear is meshed with the tooth groove, when the bevel gear rotates, the bevel gear can drive the first rotating block to rotate; since the first limit rod is slidably connected in the second limit groove, the first limit rod can limit the movement of the first limit plate; since the other end of the second rotating block is rotatably connected to the first rotating block, the connecting plate can limit it when it rotates.

[0014] As a preferred embodiment, a limiting assembly is provided on the connecting plate, and the limiting assembly includes a second limiting rod, the second limiting rod is fixedly connected to the connecting plate, the second limiting rod is slidably connected to the first sliding block, the second limiting rod is provided with a telescopic spring, and the top of the second limiting rod is rotatably connected to the first limiting block.

[0015] The beneficial effect of adopting the above further scheme is: the second limit rod is inserted into the first limit groove on the fixed component, and then the first limit block is rotated so that the fixed component can be fixed on the rotating component. When the connecting plate moves, the telescopic spring on the second limit rod is compressed or stretched.

[0016] As a preferred implementation, one end of the telescopic spring is fixedly connected to the connecting plate, the other end of the telescopic spring is fixedly connected to the first sliding block, and the second limiting rod is arranged in the first limiting groove.

[0017] The beneficial effect of adopting the above further scheme is: as the connecting plate continues to move, the first slider slides on the second limit rod and maintains an unchanged relative position with the connecting plate through the force of the telescopic spring. When the first slider reaches the position of the first limit groove, due to the force of the telescopic spring, the first slider is stuck in the first limit groove, and then the operator rotates the first limit block so that the fixed component is fixedly connected to the rotating component, thereby achieving buffering and limiting of the wafer disk.

[0018] As a preferred embodiment, a lifting assembly is provided on one side of the base close to the rotating assembly, and the lifting assembly includes a supporting seat, the supporting seat is fixedly connected to the base, and a telescopic rod is fixedly connected to the supporting seat.

[0019] The beneficial effect of adopting the above further solution is: when the height of the wafer disc needs to be adjusted or the wafer disc needs to be expanded, the electric push rod is started, and the output end of the electric push rod pushes the second slider to slide on the second limit block.

[0020] As a preferred embodiment, the other end of the telescopic rod is fixedly connected to a second limiting plate, a third limiting groove is formed on the second limiting plate, and the top of the support seat is fixedly connected to a second limiting block.

[0021] The beneficial effect of adopting the above further solution is: the third limiting rod is driven to move up and down in the third limiting groove, and because the third limiting rod is fixedly connected to the second slider, the second limiting plate will rise and fall with the movement of the third limiting rod.

[0022] As a preferred implementation, an electric push rod is mounted on the second limit block, an output end of the electric push rod is fixedly connected to a second slider, and the second slider is slidably connected to the second limit block.

[0023] The beneficial effect of adopting the above further solution is that at the same time, the support arm will also rise or fall accordingly to adapt to wafer plates of different heights.

[0024] As a preferred implementation, a third limiting rod is fixedly connected to the second sliding block, the third limiting rod is slidably connected in the third limiting groove, and a support arm is fixedly connected to the second limiting plate.

[0025] The beneficial effect of adopting the above further solution is that the height of the wafer disc can be accurately controlled, so that the wafer disc can be adjusted to a suitable height before the film expansion process to facilitate operation.

[0026] Compared with the prior art, the advantages and positive effects of the present invention are:

[0027] 1. In the present invention, first, the wafer disc is placed at the bottom of the pressure plate and firmly fixed on the fixed plate by fixing bolts and a support plate. Next, the first transmission motor and the second transmission motor in the rotating assembly are started. Through the cooperation of two groups of first transmission motors, a first rotating rod, a second rotating rod and movable balls and other components, the output end of the first transmission motor will drive the first rotating rod and the second rotating rod to rotate, so that the two groups of second rotating rods can rotate the movable rods, thereby adjusting the position of the wafer disc. At the same time, the second transmission motor drives the bevel gear to rotate, and further drives the first rotating block to rotate in the fixed shell to realize the rotational film expansion of the wafer disc. During the whole process, the various components work together to realize the horizontal offset shaking of the wafer disc before film expansion, so that the liquid film can be evenly spread on the wafer surface.

[0028] 2. In the present invention, the second limit rod is inserted into the first limit groove on the fixed component, and then the first limit block is rotated so that the fixed component can be fixed on the rotating component. When the connecting plate moves, the telescopic spring on the second limit rod is compressed or stretched. As the connecting plate continues to move, the first slider slides on the second limit rod and maintains its relative position with the connecting plate unchanged by the force of the telescopic spring. When the first slider reaches the position of the first limit groove, due to the force of the telescopic spring, the first slider is stuck in the first limit groove. Then the operator rotates the first limit block so that the fixed component is fixedly connected to the rotating component, thereby achieving buffering and limiting of the wafer.

[0029] 3. In the present invention, when the height of the wafer disc needs to be adjusted or the wafer disc needs to be expanded, the electric push rod is started, and the output end of the electric push rod pushes the second slider to slide on the second limit block, thereby driving the third limit rod to move up and down in the third limit groove. Since the third limit rod is fixedly connected to the second slider, the second limit plate will rise and fall with the movement of the third limit rod. At the same time, the support arm will also rise or fall accordingly to adapt to wafer discs of different heights. The height of the wafer disc can be accurately controlled, so that the wafer disc can be adjusted to a suitable height before the film expansion process for easy operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of a wafer disc film expansion device of the present invention;

[0031] Figure 2 It is a schematic diagram of the working state structure of a wafer disc film expansion device of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of a fixing component of a wafer disc film expansion device of the present invention;

[0033] Figure 4 This is a schematic diagram of the disassembly of the fixed component structure of a wafer disc film expansion device of the present invention;

[0034] Figure 5 This is a schematic diagram of the structure of a rotating assembly of a wafer disc film expansion device of the present invention;

[0035] Figure 6 This is a cross-sectional view of the structure of a rotating assembly of a wafer disc film expansion device of the present invention;

[0036] Figure 7 It is a schematic diagram of the operating structure of a rotating assembly of a wafer disc film expansion device of the present invention;

[0037] Figure 8 This is a schematic diagram of the structure of a limit plate of a wafer disc film expansion device of the present invention;

[0038] Fig. 9 This is a schematic diagram of the structure of a limiting component of a wafer disc film expansion device of the present invention;

[0039] Fig.10 The present invention is a schematic diagram of the structure of a lifting component of a wafer disc film expansion device.

[0040] Reference numerals:

[0041] 1. Base;

[0042] 2. Fixing assembly; 21. Pressing plate; 22. Wafer plate; 23. Top ring; 24. Support plate; 25. Fixing bolt; 26. Fixing plate; 27. Fixing block; 28. First limiting groove;

[0043] 3. Rotating assembly; 31. Fixed shell; 32. First transmission motor; 33. First rotating rod; 34. Second rotating rod; 35. First movable ball groove; 36. First movable ball; 37. Movable rod; 38. Second movable ball; 39. Second transmission motor; 310. Bevel gear; 311. First rotating block; 312. Tooth groove; 313. Connecting plate; 314. First limiting plate; 315. Second limiting groove; 316. First limiting rod; 317. Second rotating block; 318. Second movable ball groove;

[0044] 4. Limiting assembly; 41. Second limiting rod; 42. First sliding block; 43. Telescopic spring; 44. First limiting block;

[0045] 5. Lifting assembly; 51. Support seat; 52. Telescopic rod; 53. Second limiting plate; 54. Third limiting groove; 55. Second sliding block; 56. Third limiting rod; 57. Second limiting block; 58. Electric push rod; 59. Support arm. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] like Figure 1-Figure 8 As shown, this embodiment provides a technical solution: a wafer disc film expansion device, comprising:

[0048] Base 1;

[0049] A fixing assembly 2 is placed on one side of the top of the base 1. The fixing assembly 2 includes a pressing plate 21 arranged on one side of the top of the base 1. A wafer disc 22 is arranged at the bottom of the pressing plate 21. A top ring 23 is arranged inside the wafer disc 22. A support plate 24 is arranged at the bottom of the top ring 23. A fixing bolt 25 is threadedly connected to the bottom of the support plate 24. A fixing plate 26 is fixedly connected to one side of the bottom of the support plate 24.

[0050] The rotating assembly 3 is placed on one side of the base 1 close to the bottom of the fixed plate 26. The rotating assembly 3 includes a fixed shell 31 fixedly connected to the base 1 close to the bottom of the fixed plate 26. A first transmission motor 32 is installed on one side of the fixed shell 31. The output end of the first transmission motor 32 is fixedly connected to a first rotating rod 33. The other end of the first rotating rod 33 is rotatably connected to a second rotating rod 34. A first movable ball groove 35 is provided on the second rotating rod 34. A first movable ball 36 is movably connected in the first movable ball groove 35. A movable rod 37 is fixedly connected to the top of the first movable ball 36. A second movable ball 38 is fixedly connected to the end of the movable rod 37 away from the first movable ball 36. A second transmission motor 39 is installed on one side of the fixed shell 31. The output end of the motor 39 is fixedly connected with a bevel gear 310, and a first rotating block 311 is rotatably connected in the fixed shell 31, and a tooth groove 312 is provided at the bottom of the first rotating block 311, and a connecting plate 313 is provided on the top of the fixed shell 31, and a first limiting plate 314 is provided at the bottom of the connecting plate 313, and a second limiting groove 315 is provided on the first limiting plate 314, and a first limiting rod 316 is fixedly connected to the side of the bottom of the connecting plate 313 close to the second limiting groove 315, and a second rotating block 317 is rotatably connected to the first limiting plate 314, and a second movable ball groove 318 is provided on the connecting plate 313, and the second movable ball 38 is movably connected in the second movable ball groove 318. First, place the wafer disc 22 on the bottom of the pressing plate 21, and fix it with a bolt 2 5 and the support plate 24 are firmly fixed on the fixed plate 26, then, the first transmission motor 32 and the second transmission motor 39 in the rotating assembly 3 are started, and through the cooperation of the two sets of first transmission motors 32, the first rotating rod 33, the second rotating rod 34 and the movable ball and other components, the output end of the first transmission motor 32 will drive the first rotating rod 33 and the second rotating rod 34 to rotate, so that the two sets of second rotating rods 34 can drive the movable rod 37 to rotate, and through the rotation of the movable rod 37, the movable rod 37 will drive the connecting plate 313 to rotate. Since the first limiting plate 314 is provided with a second limiting groove 315, and the first limiting rod 316 is fixed to the side of the bottom of the connecting plate 313 close to the second limiting groove 315, when the first limiting plate 314 is provided with a second limiting groove 315, the first limiting rod 316 is fixed to the side of the bottom of the connecting plate 313 close to the second limiting groove 315. When the plate 314 rotates with the first rotating block 311, it moves along the second limiting groove 315, ensuring that the relative position relationship between the first limiting plate 314 and the connecting plate 313 remains stable. In addition, the second rotating block 317 is connected to the second movable ball 38 on the movable rod 37 through the movable ball groove, so that the second rotating block 317 can rotate freely on the movable rod 37, and the connecting plate 313 is provided with a second movable ball groove 318, and the second movable ball 38 can move freely in the groove, which plays a role in limiting its movement, thereby adjusting the position of the wafer disk 22. At the same time, the second transmission motor 39 drives the bevel gear 310 to rotate, further driving the first rotating block 311 to rotate in the fixed shell 31, so as to realize the rotation expansion of the wafer disk 22.During the whole process, all components work together to achieve horizontal offset shaking of the wafer plate 22 before film expansion, so that the liquid film can be evenly spread on the wafer surface.

[0051] The above solution still has the problem that the height of the wafer plate 22 cannot be adjusted when the wafer plate 22 is operated. Figure 1-Figure 4 As shown: a fixing block 27 is fixedly connected to the fixing plate 26, and a first limiting groove 28 is provided on the fixing plate 26. Since the fixing block 27 is fixedly connected to the fixing plate 26, the fixing plate 26 can support and fix the fixing block 27. The lifting assembly 5 is provided with the fixing block 27, so that the lifting assembly 5 can lift or lower the fixing assembly 2 and the wafer disk 22 fixed on the fixing assembly 2. Since the first limiting groove 28 is provided on the fixing plate 26, the second limiting rod 41 can be inserted into the first limiting groove 28, so that the fixing assembly 2 can be fixed on the rotating assembly 3 through the limiting assembly 4;

[0052] like Figure 1 as well as Figure 5-Figure 8 As shown, the bevel gear 310 is meshed with the tooth groove 312, the first limiting rod 316 is slidably connected in the second limiting groove 315, and the other end of the second rotating block 317 is rotatably connected to the first rotating block 311. Since the bevel gear 310 is meshed with the tooth groove 312, when the bevel gear 310 rotates, the bevel gear 310 can drive the first rotating block 311 to rotate. Since the first limiting rod 316 is slidably connected in the second limiting groove 315, the first limiting rod 316 can limit the movement of the first limiting plate 314. Since the other end of the second rotating block 317 is rotatably connected to the first rotating block 311, when the connecting plate 313 rotates, it can limit it.

[0053] like Figure 5-Figure 6 as well as Fig. 9As shown, a limiting assembly 4 is provided on the connecting plate 313, and the limiting assembly 4 includes a second limiting rod 41, the second limiting rod 41 is fixedly connected to the connecting plate 313, a first slider 42 is slidably connected to the second limiting rod 41, a telescopic spring 43 is provided on the second limiting rod 41, and a first limiting block 44 is rotatably connected to the top of the second limiting rod 41, the second limiting rod 41 is inserted into the first limiting groove 28 on the fixing assembly 2, and then the first limiting block 44 is rotated so that the fixing assembly 2 can be fixed on the rotating assembly 3, when the connecting plate 313 moves, the telescopic spring 43 on the second limiting rod 41 is compressed or stretched, and one end of the telescopic spring 43 is fixed The first slider 42 is connected to the connecting plate 313, and the other end of the telescopic spring 43 is fixedly connected to the first slider 42. The second limiting rod 41 is arranged in the first limiting groove 28. As the connecting plate 313 continues to move, the first slider 42 slides on the second limiting rod 41, and the relative position with the connecting plate 313 is kept unchanged by the force of the telescopic spring 43. When the first slider 42 reaches the position of the first limiting groove 28, the first slider 42 is stuck in the first limiting groove 28 due to the force of the telescopic spring 43. Then the operator rotates the first limiting block 44, so that the fixed component 2 is fixedly connected to the rotating component 3, thereby realizing buffering and limiting the wafer 22.

[0054] like Figure 1-Figure 2 as well as Fig.10 As shown, a lifting assembly 5 is provided on one side of the base 1 close to the rotating assembly 3, and the lifting assembly 5 includes a supporting seat 51, and the supporting seat 51 is fixedly connected to the base 1, and a telescopic rod 52 is fixedly connected to the supporting seat 51. When it is necessary to adjust the height of the wafer disk 22 or expand the wafer disk 22, the electric push rod 58 is started, and the output end of the electric push rod 58 pushes the second slider 55 to slide on the second limit block 57, and the other end of the telescopic rod 52 is fixedly connected to the second limit plate 53, and the second limit plate 53 is provided with a third limit groove 54, and the top of the supporting seat 51 is fixedly connected to the second limit block 57, thereby driving the third limit rod 56 to move up and down in the third limit groove 54. It is fixedly connected to the second slider 55, so the second limit plate 53 will rise and fall with the movement of the third limit rod 56. An electric push rod 58 is installed on the second limit block 57. The output end of the electric push rod 58 is fixedly connected to the second slider 55. The second slider 55 is slidably connected to the second limit block 57. At the same time, the support arm 59 will also rise or fall accordingly to adapt to wafer discs 22 of different heights. The second slider 55 is fixedly connected to the third limit rod 56, and the third limit rod 56 is slidably connected in the third limit groove 54. The second limit plate 53 is fixedly connected to the support arm 59, which can accurately control the height of the wafer disc 22, so that the wafer disc 22 can be adjusted to a suitable height before the film expansion process for easy operation.

[0055] Working principle:

[0056] like Figure 1-Figure 10 As shown, first, the wafer disc 22 is placed at the bottom of the pressure plate 21 and firmly fixed on the fixing plate 26 by the fixing bolts 25 and the support plate 24. Then, the first transmission motor 32 and the second transmission motor 39 in the rotating assembly 3 are started. Through the cooperation of the two sets of first transmission motors 32, the first rotating rod 33, the second rotating rod 34 and the movable ball and other components, the output end of the first transmission motor 32 will drive the first rotating rod 33 and the second rotating rod 34 to rotate, so that the two sets of second rotating rods 34 can rotate the movable rod 37, thereby adjusting the position of the wafer disc 22. At the same time, the second transmission motor 39 drives the bevel gear 310 to rotate, further driving the first rotating block 311 to rotate in the fixed shell 31, so as to realize the rotation expansion of the wafer disk 22. During the whole process, various components work together to realize the horizontal offset shaking of the wafer disk 22 before the film expansion, so that the liquid film can be evenly spread on the wafer surface, and the second limiting rod 41 is inserted into the first limiting groove 28 on the fixed component 2, and then the first limiting block 44 is rotated so that the fixed component 2 can be fixed on the rotating component 3. When the connecting plate 313 moves, the telescopic spring on the second limiting rod 41 The spring 43 is compressed or stretched. As the connecting plate 313 continues to move, the first slider 42 slides on the second limiting rod 41 and maintains a relative position with the connecting plate 313 unchanged by the force of the telescopic spring 43. When the first slider 42 reaches the position of the first limiting groove 28, the first slider 42 is stuck in the first limiting groove 28 due to the force of the telescopic spring 43. Then the operator rotates the first limiting block 44 so that the fixing component 2 is fixedly connected to the rotating component 3, thereby achieving buffering and limiting of the wafer disc 22. When the height of the wafer disc 22 needs to be adjusted or the wafer needs to be moved When the disk 22 is expanding the film, the electric push rod 58 is started, and the output end of the electric push rod 58 pushes the second slider 55 to slide on the second limit block 57, thereby driving the third limit rod 56 to move up and down in the third limit groove 54. Since the third limit rod 56 is fixedly connected to the second slider 55, the second limit plate 53 will rise and fall with the movement of the third limit rod 56. At the same time, the support arm 59 will also rise or fall accordingly to adapt to wafer disks 22 of different heights. The height of the wafer disk 22 can be accurately controlled, so that the wafer disk 22 can be adjusted to a suitable height before the film expansion process for easy operation.

[0057] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A wafer disc film expansion device, characterized in that: include: Base (1); A fixing component (2), the fixing component (2) being disposed on one side of the top of the base (1), the fixing component (2) comprising a pressing plate (21) disposed on one side of the top of the base (1), a wafer disc (22) being disposed at the bottom of the pressing plate (21), a top ring (23) being disposed inside the wafer disc (22), a supporting plate (24) being disposed at the bottom of the top ring (23), a fixing bolt (25) being threadedly connected to the bottom of the supporting plate (24), and a fixing plate (26) being fixedly connected to one side of the bottom of the supporting plate (24); A rotating assembly (3), the rotating assembly (3) being placed on one side of the base (1) close to the bottom of the fixed plate (26), the rotating assembly (3) comprising a fixed shell (31) fixedly connected to one side of the base (1) close to the bottom of the fixed plate (26), a first transmission motor (32) being mounted on one side of the fixed shell (31), a first rotating rod (33) being fixedly connected to the output end of the first transmission motor (32), a second rotating rod (34) being rotatably connected to the other end of the first rotating rod (33), a first movable ball groove (35) being provided on the second rotating rod (34), a first movable ball (36) being movably connected to the first movable ball groove (35), a movable rod (37) being fixedly connected to the top of the first movable ball (36), a second movable ball (38) being fixedly connected to the end of the movable rod (37) away from the first movable ball (36), and a first movable ball (38) being mounted on one side of the fixed shell (31). A second transmission motor (39) is installed, the output end of the second transmission motor (39) is fixedly connected to a bevel gear (310), a first rotating block (311) is rotatably connected in the fixed shell (31), a tooth groove (312) is provided at the bottom of the first rotating block (311), a connecting plate (313) is provided at the top of the fixed shell (31), a first limiting plate (314) is provided at the bottom of the connecting plate (313), a second limiting groove (315) is provided on the first limiting plate (314), a first limiting rod (316) is fixedly connected to the side of the bottom of the connecting plate (313) close to the second limiting groove (315), a second rotating block (317) is rotatably connected to the first limiting plate (314), a second movable ball groove (318) is provided on the connecting plate (313), and the second movable ball (38) is movably connected in the second movable ball groove (318).

2. The wafer expansion device according to claim 1, characterized in that: A fixing block (27) is fixedly connected to the fixing plate (26), and a first limiting groove (28) is provided on the fixing plate (26).

3. The wafer expansion device according to claim 1, characterized in that: The bevel gear (310) is meshed with the tooth groove (312); the first limiting rod (316) is slidably connected in the second limiting groove (315); and the other end of the second rotating block (317) is rotatably connected to the first rotating block (311).

4. The wafer expansion device according to claim 1, characterized in that: A limit assembly (4) is provided on the connecting plate (313), and the limit assembly (4) comprises a second limit rod (41), the second limit rod (41) is fixedly connected to the connecting plate (313), a first slider (42) is slidably connected to the second limit rod (41), a telescopic spring (43) is provided on the second limit rod (41), and the top of the second limit rod (41) is rotatably connected to the first limit block (44).

5. The wafer expansion device according to claim 4, characterized in that: One end of the telescopic spring (43) is fixedly connected to the connecting plate (313), the other end of the telescopic spring (43) is fixedly connected to the first sliding block (42), and the second limiting rod (41) is arranged in the first limiting groove (28).

6. The wafer expansion device according to claim 1, characterized in that: A lifting assembly (5) is provided on one side of the base (1) close to the rotating assembly (3), and the lifting assembly (5) comprises a support seat (51), the support seat (51) is fixedly connected to the base (1), and a telescopic rod (52) is fixedly connected to the support seat (51).

7. The wafer expansion device according to claim 6, characterized in that: The other end of the telescopic rod (52) is fixedly connected to a second limiting plate (53), a third limiting groove (54) is provided on the second limiting plate (53), and the top of the support seat (51) is fixedly connected to a second limiting block (57).

8. The wafer expansion device according to claim 7, characterized in that: An electric push rod (58) is mounted on the second limit block (57); an output end of the electric push rod (58) is fixedly connected to a second slider (55); and the second slider (55) is slidably connected to the second limit block (57).

9. The wafer expansion device according to claim 8, characterized in that: A third limiting rod (56) is fixedly connected to the second sliding block (55), and the third limiting rod (56) is slidably connected in the third limiting groove (54). A supporting arm (59) is fixedly connected to the second limiting plate (53).

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