Electronic package and heat dissipation structure thereof

Abstract

The invention relates to an electronic packaging piece and a heat dissipation structure thereof. A supporting piece of the heat dissipation structure is arranged on the periphery of a central area in a surrounding mode and provided with a groove in a corner area. Therefore, the groove can prevent stress from being concentrated in the corner area, and the rest part of the supporting piece can be well connected and fixed with the heat dissipation structure and the bearing structure, so that the warping of the whole electronic packaging piece is inhibited, and the delamination is avoided.

Description

Technical Field

[0001] The present invention relates to a packaging structure, and more particularly to an electronic packaging component and a heat dissipation structure thereof with improved reliability. Background Art

[0002] A flip-chip ball grid array (FCBGA) semiconductor package electrically connects the active surface of at least one chip to one surface of a substrate via a plurality of solder bumps. A plurality of solder balls, serving as input / output (I / O) terminals, are implanted on the other surface of the substrate. This package structure significantly reduces size while eliminating existing wire bonds, thereby lowering impedance and improving electrical performance to prevent signal degradation during transmission. Consequently, it has become the mainstream packaging technology for next-generation chips.

[0003] Due to its superior properties, flip-chip ball grid array (FBA) packages are often used in high-integration multi-chip packages to meet the demands of miniaturization and high-speed computing. However, due to its high-frequency computing characteristics, this type of package generates more heat during operation than conventional packages. Therefore, the effectiveness of its heat dissipation becomes a key factor affecting the quality and yield of this type of package.

[0004] like Figure 1 As shown, the conventional method for manufacturing a heat-dissipating semiconductor package 1 is to first place a semiconductor chip 11 on a package substrate 10 using a flip-chip bonding method (i.e., via conductive bumps 110 and underfill 111) with its active surface 11a. A gold layer (not shown) is then formed on the inactive surface 11b of the semiconductor chip 11. A heat sink 13 is then reflow-bonded to the gold layer with its top sheet 130 via a TIM (Thermal Interface Material) layer 12 (which includes a solder layer and flux). The support legs 131 of the heat sink 13 are then mounted on the package substrate 10 via an adhesive layer 14. Next, a package molding operation is performed to allow an encapsulant (not shown) to encapsulate the semiconductor chip 11 and heat sink 13, leaving the top sheet 130 of the heat sink 13 exposed to the encapsulant and in direct contact with the atmosphere. In addition, a plurality of conductive elements 15 may be disposed on the package substrate 10 , and an electronic device such as a circuit board (not shown) may be subsequently connected via the conductive elements 15 .

[0005] During operation, since the heat sink 13 is directly adhered to the inactive surface 11 b of the semiconductor chip 11, the heat energy generated by the semiconductor chip 11 does not need to be transferred through the packaging resin with poor thermal conductivity. Instead, a direct heat dissipation path can be formed from the inactive surface 11 b of the semiconductor chip 11 through the TIM layer 12 and the heat sink 13 to the outside world, achieving better heat dissipation performance than other packages.

[0006] However, in the existing semiconductor package 1, when the heat sink 13 is placed on the package substrate 10, it is adhered to the package substrate 10 through the support legs 131 arranged around the top sheet 130, and the top sheet 130 and the support legs 131 are made of an integrally formed material. Therefore, when the semiconductor package 1 undergoes a subsequent high-temperature process, the thermal deformation of the top sheet 130 of the heat sink 13 will be slightly greater than that of the semiconductor chip 11 due to the large difference in the coefficient of thermal expansion (CTE) between the heat sink 13 and the semiconductor chip 11. At the same time, the stress on the semiconductor package 1 is concentrated at the corners. At this time, since the top sheet 130 is constrained by the support legs 131 all around, it will be difficult to release its thermal strain, resulting in the following problems: Figure 1 The deformation shown in FIG. 1 may cause delamination between the top sheet 130 and the semiconductor chip 11 or the TIM layer 12, thereby reducing the heat dissipation performance; it may even cause delamination between the support legs 131 of the heat sink 13 and the package substrate 10, causing the heat sink 13 to fall off when subjected to shock.

[0007] Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the Invention

[0008] In view of the various deficiencies of the above-mentioned prior art, the present invention provides a heat dissipation structure, comprising: a heat dissipation element, which is defined by a central area, multiple edge areas located on the sides of the outer periphery of the central area, and multiple corner areas located at the corners of the outer periphery of the central area; and a support element, which is arranged on the edge area and the corner area of ​​the heat dissipation element, and the support element has at least one groove in the corner area.

[0009] The present invention also provides an electronic package, comprising: a supporting structure; an electronic component, which is arranged on the supporting structure; and a heat dissipation structure, which is arranged on the supporting structure to cover the electronic component, and the heat dissipation structure includes: a heat dissipation member, which defines a central area, multiple edge areas located on the sides of the outer periphery of the central area, and multiple corner areas located at the corners of the outer periphery of the central area, wherein the electronic component is located in the area corresponding to the central area; and a support member, which is arranged on the edge area and the corner area of ​​the heat dissipation member, and the support member has at least one groove in the corner area.

[0010] In the aforementioned electronic package and heat dissipation structure thereof, the groove extends from one end of the support member connected to the heat dissipation member to the other end.

[0011] In the aforementioned electronic package and heat dissipation structure thereof, the groove is located on the inner side of the support member.

[0012] In the aforementioned electronic package and heat dissipation structure, the groove opens inward and communicates with the space in the central area.

[0013] In the aforementioned electronic package and heat dissipation structure thereof, the support member is continuously connected to the outer periphery of the edge area and the corner area without being interrupted by the groove.

[0014] In the aforementioned electronic package and heat dissipation structure thereof, the support member is distributed in each of the edge areas and the corner areas, and each of the corner areas has the groove.

[0015] In the aforementioned electronic package and heat dissipation structure thereof, the support member and the heat dissipation member are integrally formed or non-integrally formed.

[0016] As can be seen from the above, in the electronic package and its heat dissipation structure of the present invention, the heat dissipation structure's support members are primarily arranged around the periphery of the central region, with grooves formed in the corners of the support members. These grooves effectively dissipate stress on the support members in the corners, preventing stress concentration there. Furthermore, the remaining portion of the support members is securely connected and fixed between the heat dissipation structure and the supporting structure, thereby suppressing warping and preventing delamination of the entire electronic package. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The figure is a cross-sectional view of a conventional heat dissipation type semiconductor package.

[0018] Figures 2A to 2F It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0019] Figure 3A FIG. 1 is a perspective schematic diagram of a heat dissipation structure according to an embodiment of the present invention.

[0020] Figure 3B FIG. 1 is a schematic plan view of a heat dissipation structure according to an embodiment of the present invention.

[0021] Main component symbols

[0022] 1 Semiconductor Package

[0023] 10 Package substrate

[0024] 11. Semiconductor Chips

[0025] 11a Active surface

[0026] 11b Non-active surface

[0027] 110 conductive bumps

[0028] 111 Primer

[0029] 12 TIM layer

[0030] 13 heat sink

[0031] 130 top sheet

[0032] 131 Support Legs

[0033] 14 Adhesive layer

[0034] 15 Conductive elements

[0035] 2 Electronic packaging

[0036] 20 load-bearing structure

[0037] 20a First side

[0038] 20b Second side

[0039] 21 Electronic components

[0040] 21a Active surface

[0041] 21b Non-active surface

[0042] 210 conductive bumps

[0043] 211 Primer

[0044] 22 thermal conductive layer

[0045] 23 Heat dissipation structure

[0046] 230 heat sink

[0047] 231 Support

[0048] 232 grooves

[0049] 24 Adhesive layer

[0050] 25 conductive elements

[0051] 26 Passive Components

[0052] A Central Area

[0053] B marginal zone

[0054] C Corner area. DETAILED DESCRIPTION

[0055] The following describes the embodiments of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0056] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, terms such as "upper", "lower", "one", "first", and "second" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0057] Figures 2A to 2F It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0058] like Figure 2A As shown, a supporting structure 20 is provided, which has a first side 20 a and a second side 20 b opposite to each other, and at least one electronic component 21 is disposed on the first side 20 a of the supporting structure 20 .

[0059] The supporting structure 20 may be a package substrate having a core layer and a circuit portion, or a coreless circuit structure.

[0060] In this embodiment, the carrier structure 20 includes at least one dielectric layer and a redistribution layer (RDL) formed by a circuit layer bonded to the dielectric layer. For example, the first side 20a of the carrier structure 20 serves as a die placement side for supporting the electronic component 21, and the second side 20b of the carrier structure 20 serves as a ball implantation side.

[0061] It should be understood that the supporting structure 20 may also be other supporting units for supporting chips, such as a leadframe, a silicon interposer, or other boards with metal routing, and is not limited to the above.

[0062] The electronic component 21 is an active component, a passive component or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0063] In this embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b relative to each other, and the active surface 21a has a plurality of electrode pads (not shown) so that these electrode pads are flip-chip bonded and electrically connected to the circuit layer of the supporting structure 20 through a plurality of conductive bumps 210 such as solder materials.

[0064] In other embodiments, the electronic component 21 may also be electrically connected to the circuit layer of the supporting structure 20 through a plurality of bonding wires in a wire bonding manner; or, the electronic component 21 may directly contact the circuit layer of the supporting structure 20 .

[0065] It should be understood that there are many ways to electrically connect the electronic components 21 to the supporting structure 20 , and any desired type and number of electronic components 21 can be placed on the supporting structure 20 , which is not limited to the above.

[0066] like Figure 2B As shown, a coating layer such as a primer 211 is filled and formed between the first side 20 a of the supporting structure 20 and the active surface 21 a of the electronic component 21 to cover the conductive bumps 210 .

[0067] like Figure 2C As shown, at least one passive component 26 is disposed on the supporting structure 20 and electrically connected to the circuit layer of the supporting structure 20 .

[0068] like Figure 2D As shown, a heat conducting layer 22 is formed on the inactive surface 21 b of the electronic component 21 .

[0069] In this embodiment, the thermal conductive layer 22 serves as a thermal interface material (TIM). For example, the thermal conductive layer 22 may be made of solder material, which has a high thermal conductivity.

[0070] like Figure 2E As shown, a heat dissipation structure 23 is disposed on the first side 20a of the supporting structure 20 and the thermally conductive layer 22 to cover the electronic component 21. The heat dissipation structure 23 includes a heat dissipation member 230 that contacts and engages the thermally conductive layer 22, and a plurality of support members 231 that extend downward from the heat dissipation member 230 to engage the supporting structure 20. For example, the heat dissipation member 230 is in the form of a sheet that can be pressed against the thermally conductive layer 22 so that the thermally conductive layer 22 is located between the heat dissipation member 230 and the electronic component 21.

[0071] Furthermore, the support member 231 is coupled to the supporting structure 20 via an adhesive layer 24. For example, the adhesive layer 24 is first formed on the first side 20a of the supporting structure 20 by dispensing glue so that the adhesive layer 24 is located around the passive component 26. The support member 231 is then bonded to the adhesive layer 24 to secure the heat dissipation structure 23 to the supporting structure 20.

[0072] Afterwards, if Figure 2F As shown, a packaging colloid (not shown) covering the electronic component 21 can also be formed on the first side 20a of the supporting structure 20, and a plurality of conductive elements 25 such as metal pillars such as copper pillars, metal bumps covered with insulating blocks, solder balls, solder balls with core copper balls (Cu core balls) or other conductive structures can be provided on the second side 20b of the supporting structure 20 to obtain the electronic package 2 of the present invention. Subsequently, an electronic device such as a circuit board can be connected through these conductive elements 25 (not shown).

[0073] When the electronic package 2 is in operation, heat generated by the electronic component 21 is conducted to the heat dissipation structure 23 via the inactive surface 21 b and the heat conductive layer 22 , and is dissipated to the outside of the electronic package 2 .

[0074] Hereinafter, the heat dissipation structure 23 of the aforementioned electronic package 2 of the present invention will be described in more detail.

[0075] Figure 3A and Figure 3B The heat dissipation structure 23 according to an embodiment of the present invention is shown. Figure 3B As shown, the heat dissipation element 230 of the heat dissipation structure 23 is defined by a central region A, a plurality of edge regions B located on the sides of the central region A, and a plurality of corner regions C located at the corners of the central region A. For example, in this embodiment, the heat dissipation element 230 is rectangular and defines a central region A, four edge regions B, and four corner regions C.

[0076] In this embodiment, the central area A corresponds to the area where the electronic component 21 and the passive component 26 are disposed (eg Figure 2E and Figure 2F Furthermore, Figure 3A and Figure 3B As shown, the support member 231 is disposed around the edge region B and the corner region C outside the central region A, and the support member 231 has a groove 232 in the corner region C. In other words, the support member 231 is grooved in the corner region C to hollow out a portion of the support member 231 to form the groove 232. The heat dissipation structure 23 is fixed to the supporting structure 20 through the unhollowed portions of the support member 231 distributed in the edge region B and the corner region C.

[0077] Thus, the stress of the heat dissipation structure 23 can be dissipated by the groove 232, rather than being concentrated in the corner area C, thereby preventing the entire structure from warping and delamination. Furthermore, the support members 231 arranged around the outer periphery of the central area A can effectively connect and secure the heat dissipation element 230 and the supporting structure 20. Therefore, the stability of the entire structure is further improved, preventing bending and deformation.

[0078] The support member 231 can be made of the same material as the heat sink 230, such as a heat sink wall or heat sink column made of a hard material (metal). This can enhance the heat dissipation efficiency of the entire heat sink structure 23. When the support member 231 is made of the same material as the heat sink 230, the heat sink 230 and the support member 231 can be integrally formed, but can also be non-integrally formed. Furthermore, it should be understood that the support member 231 can also be other components capable of supporting the heat sink 230, and is not limited to the above.

[0079] In this embodiment, the groove 232 extends from one end of the support member 231 connected to the heat sink 230 to the other end of the support member 231 connected to the supporting structure 20 , so that the height of the groove 232 is the same as that of the support member 231 .

[0080] Furthermore, the groove 232 is located inside the heat dissipation structure 23 and opens inward, thereby communicating with the space in the central area A. At this point, the wall surfaces of the support member 231 located in two adjacent edge areas B are separated on the inside by the groove 232. Thus, the groove 232 of the support member 231 effectively prevents stress concentration in the corner area C.

[0081] Furthermore, the groove 232 is located on the inner side of the support member 231 and does not extend laterally to the outer side of the support member 231, thereby allowing the support member 231 to continuously extend around the outer periphery of the central region A without being interrupted by the groove 232. Thus, while the groove 232 of the support member 231 effectively prevents stress concentration in the corner region C, the remaining portion of the support member 231 can also be well connected and fixed between the heat sink 230 and the supporting structure 20, further enhancing the stability of the entire structure. In this embodiment, the wall surface of the portion of the support member 231 in the corner region C hollowed out by the groove 232 is, for example, formed into an L-shape. The L-shaped wall surface of the support member 231 in the corner region C is located outside the groove 232 and has a uniform thickness. Furthermore, the L-shaped wall surface of the support member 231 in the corner region C can connect the wall surfaces distributed in two adjacent edge regions B, but the present invention is not limited to the above.

[0082] In addition, in this embodiment, the support members 231 are distributed in each of the edge regions B and the corner regions C. However, it should be understood that the support members 231 only need to be sufficient to connect and fix the heat sink 230 and the supporting structure 20, and the support members 231 may not be provided in each of the edge regions B and the corner regions C.

[0083] Furthermore, in this embodiment, the groove 232 is provided in each corner region C. However, it should be understood that, as long as the stress is sufficiently prevented from being excessively concentrated in the corner region C, the groove 232 may not be provided in every corner region C. In other embodiments, the groove 232 may be provided only in two diagonally opposing corner regions C, or different grooves 232 may be provided depending on the conditions of each corner region C. Furthermore, the sizes of the grooves 232 may be the same or different.

[0084] Furthermore, in other embodiments, the support member 231 may also be grooved in the edge region B to further interrupt the stress in the edge region B.

[0085] In summary, the electronic package and heat dissipation structure of the present invention primarily utilizes a heat dissipation support member disposed around the periphery of the heat dissipation element's central region, with grooves formed in the corners. These grooves effectively disrupt stress in the corners, preventing stress concentration there. Furthermore, the remaining portion of the support member effectively connects and secures the heat dissipation structure to the supporting structure, thereby preventing warping and delamination of the entire electronic package.

[0086] Furthermore, the groove of the present application is located on the inner side and opens inwards, and is connected to the space in the central area. Therefore, the groove of the support member can effectively avoid stress concentration in the corner area.

[0087] Furthermore, the grooves of the present application are located on the inner side of the support member and do not extend to the outer side of the support member, allowing the support member to continuously extend around the outer periphery of the edge region B and the corner region C without being interrupted by the grooves. Therefore, the support member can effectively connect and secure the heat sink and the supporting structure while avoiding stress concentration in the corner regions, further enhancing the stability of the entire structure.

[0088] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Any skilled artisan may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the appended claims.

Claims

1. A heat dissipation structure, comprising: A heat sink, which is defined by a central region, a plurality of edge regions located at sides of an outer periphery of the central region, and a plurality of corner regions located at corners of an outer periphery of the central region; as well as The support member is arranged on the edge area and the corner area of ​​the heat dissipation member, and the support member has at least one groove in the corner area.

2. The heat dissipation structure according to claim 1, wherein: The groove extends from one end of the support member connected to the heat sink to the other end.

3. The heat dissipation structure according to claim 1, wherein: The groove is located on the inner side of the support member.

4. The heat dissipation structure according to claim 1, wherein: The groove opens inwardly and communicates with the space in the central area.

5. The heat dissipation structure according to claim 1, wherein: The support member is continuously connected to the outer periphery of the edge area and the corner area without being interrupted by the groove.

6. The heat dissipation structure according to claim 1, wherein: The support member is distributed in each of the edge areas and the corner areas, and has the groove in each of the corner areas.

7. The heat dissipation structure according to claim 1, wherein: The support member and the heat sink are integrally formed or non-integrally formed.

8. An electronic package, comprising: load-bearing structure; an electronic component disposed on the supporting structure; as well as A heat dissipation structure is disposed on the supporting structure to cover the electronic component, and the heat dissipation structure includes: a heat sink defining a central region, a plurality of edge regions located at sides of an outer periphery of the central region, and a plurality of corner regions located at corners of an outer periphery of the central region, wherein the electronic component is located in a region corresponding to the central region; and The support member is arranged on the edge area and the corner area of ​​the heat dissipation member, and the support member has at least one groove in the corner area.

9. The electronic package of claim 8, wherein: The groove extends from one end of the support member connected to the heat sink to the other end.

10. The electronic package of claim 8, wherein: The groove is located on the inner side of the support member.

11. The electronic package of claim 8, wherein: The groove opens inwardly and communicates with the space in the central area.

12. The electronic package of claim 8, wherein: The support member is continuously connected to the outer periphery of the edge area and the corner area without being interrupted by the groove.

13. The electronic package of claim 8, wherein: The support member is distributed in each of the edge areas and the corner areas, and has the groove in each of the corner areas.

14. The electronic package of claim 8, wherein: The support member and the heat sink are integrally formed or non-integrally formed.

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