Electrostatic protection structure and electronic device

Abstract

The embodiment of the application provides a kind of electrostatic protection structure and electronic equipment, it is related to terminal technical field, at least one plastic structure piece in electronic equipment has accommodating space, sensitive structure and electrostatic protection structure are all arranged in accommodating space, electrostatic protection structure is connected with sensitive structure and ground terminal respectively;At least one plastic structure piece and sensitive structure have gap, gap is used to make static electricity can enter accommodating space;Electrostatic protection structure at least includes: insulating substrate and conductive layer, insulating substrate is connected with sensitive structure, conductive layer is arranged at the side of insulating substrate away from sensitive structure, and conductive layer is also connected with ground terminal, and conductive layer is used to receive static electricity, and static electricity does not contact with sensitive structure.Electrostatic that enters accommodating space directly contacts with electrostatic protection structure, and does not contact with sensitive structure, can protect sensitive structure from being damaged by static electricity, and the anti-static effect of electronic equipment is better.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of terminals, and in particular to an electrostatic protection structure and an electronic device. BACKGROUND

[0002] Electronic devices such as mobile phones have gradually become an indispensable part of people's work and life. Currently, some structural members in electronic devices are often made of plastic to achieve weight reduction and waterproofing of electronic devices.

[0003] During use of an electronic device, an external charged object or some structures inside the electronic device can generate static electricity. The static electricity hitting some sensitive structures in the electronic device can cause electro-static discharge (ESD), and the sensitive structures are prone to failure due to ESD without proper protection measures. In related technologies, in order to solve this problem, some positions of the electronic device are often provided with back glue or point glue to block static electricity, that is, the back glue or point glue is used to block static electricity from entering a space with sensitive structures, so as to protect the sensitive structures.

[0004] With the development of electronic devices towards thinness and miniaturization, the space inside the electronic device is getting smaller and smaller, and the space left for the back glue or point glue is also very limited. When the size of the back glue or point glue is very small, it is not enough to block static electricity. When the static electricity penetrates the back glue or point glue to enter the space with sensitive structures, and since many structural members in the electronic device are plastic products without static discharge paths, the static electricity directly hits the sensitive structures, causing the sensitive structures to fail, which seriously affects the performance of the electronic device. SUMMARY

[0005] The electrostatic protection structure provided by the embodiments of the present application is directly connected to the sensitive structure, so that the static electricity entering the accommodation space through the gap first contacts the electrostatic protection structure closest to it, and does not hit the sensitive structure. The electrostatic protection structure can protect the sensitive structure from being damaged.

[0006] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, an electrostatic protection structure applied to an electronic device is provided. The electronic device further includes a sensitive structure, a grounding terminal, and at least one plastic structural member having a receiving space. The sensitive structure and the electrostatic protection structure are arranged in the receiving space, and the electrostatic protection structure is connected to the sensitive structure and the grounding terminal, respectively. A gap is formed between the at least one plastic structural member and the sensitive structure. The gap has a width less than or equal to 2 mm and a height of 20 μm to 40 μm. The gap is used to allow static electricity to enter the receiving space. The electrostatic protection structure at least includes an insulating substrate connected to the sensitive structure, and a conductive layer arranged on a side of the insulating substrate away from the sensitive structure. The conductive layer is further connected to the grounding terminal. The conductive layer is used to receive the static electricity entering the receiving space and prevent the static electricity from contacting the sensitive structure.

[0008] The electrostatic protection structure provided by the embodiments of the present application is directly connected to the sensitive structure. When static electricity enters the receiving space, the distance from the static electricity to the electrostatic protection structure is the shortest, which means that the impedance is the smallest. The static electricity directly hits the conductive layer. Since the conductive layer is separated from the sensitive structure by the insulating substrate, the conductive layer is not electrically connected to the sensitive structure and is not conductive. Therefore, the static electricity does not hit the sensitive structure. The electrostatic protection structure increases the static electricity discharge path, that is, the static electricity can directly hit the electrostatic protection structure for discharge. The electrostatic protection structure protects the sensitive structure from being damaged.

[0009] In a possible implementation of the first aspect, the electrostatic protection structure further includes a reinforcing member arranged on a side of the conductive layer away from the insulating substrate. The reinforcing member is connected to the conductive layer. The strength of the reinforcing member is greater than that of the conductive layer.

[0010] In this implementation, the reinforcing member can enhance the strength of the insulating substrate and the conductive layer, thereby ensuring to reduce damage to the insulating substrate and the conductive layer and achieving better connection between the structures.

[0011] In a possible implementation of the first aspect, the reinforcing member is arranged on a part of the surface of the conductive layer away from the insulating substrate. The thickness of the reinforcing member is greater than or equal to 0.15 mm.

[0012] In this implementation, the reinforcing member can enhance the strength of a part of the insulating substrate and the conductive layer, thereby ensuring to reduce damage to the insulating substrate and the conductive layer and achieving better connection between the structures.

[0013] In a possible implementation of the first aspect, the electrostatic protection structure further includes a bonding layer arranged between the electrostatic protection structure and the sensitive structure. The bonding layer is used to bond the electrostatic protection structure and the sensitive structure.

[0014] In the implementation, the bonding layer not only connects the insulating substrate and the sensitive structure, but also makes the conductive layer not electrically connected with the sensitive structure.

[0015] In a possible implementation of the first aspect, the part of the conductive layer penetrating through the insulating substrate is a first conductive layer; and the electrostatic protection structure further includes a protection member, which is arranged between the first conductive layer and the grounding end and connected with the first conductive layer and the grounding end respectively.

[0016] In the implementation, the protection member can protect the conductive layer from corrosion as much as possible, and ensure the impedance continuity after long-term use, so that the position with the protection member can be reliably contacted for a long time.

[0017] In a possible implementation of the first aspect, the electrostatic protection structure further includes an elastic member, which is arranged between the protection member and the grounding end and connected with the protection member and the grounding end respectively.

[0018] In the implementation, since the circuit board or the middle frame cannot be directly connected with the protection member when serving as the grounding end, the elastic member is added to ensure that the protection member is well connected with the grounding end.

[0019] In a possible implementation of the first aspect, the part of the conductive layer penetrating through the insulating substrate is a first conductive layer, and the first conductive layer is connected with the grounding end.

[0020] In the implementation, the conductive layer is grounded by itself, which is simple and easy to implement.

[0021] In a possible implementation of the first aspect, the electrostatic protection structure further includes an elastic member, which is arranged between the first conductive layer and the grounding end and connected with the first conductive layer and the grounding end respectively.

[0022] In the implementation, since the circuit board or the middle frame cannot be directly connected with the protection member when serving as the grounding end, the elastic member is added to ensure that the first conductive layer is well connected with the grounding end.

[0023] In a possible implementation of the first aspect, the electrostatic protection structure further includes an anti-oxidation layer, which is arranged on a side of the conductive layer away from the insulating substrate, and used to protect the conductive layer from being oxidized.

[0024] In the implementation, the anti-oxidation layer can reduce the risk of oxidation of the conductive layer by water and oxygen.

[0025] In a possible implementation of the first aspect, the anti-oxidation layer is used to be broken down by electrostatic of less than 1 kV.

[0026] In the implementation, when static electricity directly hits the anti-oxidation layer, the static electricity can break through the anti-oxidation layer to reach the conductive layer, and since the conductive layer is also grounded, the static electricity directly reaches the ground through the conductive layer, thereby protecting the conductive layer from being corroded by water and oxygen and enabling static electricity to be discharged through the conductive layer.

[0027] In a possible implementation of the first aspect, the sensitive structure is a rear camera assembly; the electronic device further includes a middle frame, a mainboard, a plastic mainboard support, and a plastic decoration piece, the mainboard, the plastic mainboard support, and the plastic decoration piece are arranged on the same side of the middle frame, the plastic mainboard support and the plastic decoration piece enclose a containing space, the rear camera assembly is arranged in the containing space, the middle frame or the mainboard serves as a grounding end, there is a gap between the plastic decoration piece and the rear camera assembly, the electrostatic protection structure is sleeved around the rear camera assembly, the electrostatic protection structure is connected with the mainboard or the middle frame, the electrostatic protection structure is arranged between the rear camera assembly and the mainboard and the plastic mainboard support, and the plastic decoration piece is arranged on a side of the plastic mainboard support away from the middle frame.

[0028] In the implementation, the static electricity enters the containing space and then reaches the electrostatic protection structure, which has the shortest distance and the smallest impedance, the electrostatic protection structure is not conductive with the rear camera assembly, and the electrostatic protection structure is grounded through the elastic member, so that the electrostatic protection structure is the shortest and smallest impedance path for the static electricity to be directly discharged to the mainboard, and thus the static electricity does not hit the rear camera assembly but directly hits the electrostatic protection structure, and the electrostatic protection structure can protect the rear camera assembly from being damaged.

[0029] In a possible implementation of the first aspect, the rear camera assembly includes a rear camera substrate, a rear camera module, a voice coil motor metal shell, and a lens, the rear camera substrate is arranged on one side of the middle frame, the rear camera module and the voice coil motor metal shell are both arranged on the same side of the rear camera substrate away from the middle frame, the rear camera module and the voice coil motor metal shell are respectively connected with the rear camera substrate, the voice coil motor metal shell is sleeved around the rear camera module, the lens is arranged on a side of the rear camera module and the voice coil motor metal shell away from the middle frame, there is a gap between the lens and the plastic decoration piece, the electrostatic protection structure is arranged between the voice coil motor metal shell and the plastic mainboard support and between the mainboard and the plastic mainboard support, and the electrostatic protection structure is respectively connected with the voice coil motor metal shell and the mainboard.

[0030] In the implementation, the electrostatic enters the accommodation space and is closest to the electrostatic protection structure, the impedance is minimum, the electrostatic protection structure is not conductive with the rear camera assembly, and the electrostatic protection structure is grounded through the elastic member. For the electrostatic, the shortest impedance path is to directly discharge to the mainboard through the electrostatic protection structure, so the electrostatic cannot hit the rear camera assembly but directly hits the electrostatic protection structure, and the electrostatic protection structure can protect the rear camera assembly from being damaged.

[0031] In a possible implementation of the first aspect, the electrostatic protection structure includes an insulating substrate, a conductive layer, a reinforcing member, an adhesive layer, a protective member and an elastic member. The insulating substrate and the conductive layer constitute a whole which is divided into a first part, a second part and a third part. The first part, the second part and the third part are sequentially connected. The first part and the third part have the same extension direction, and the second part has an extension direction different from that of the first part and the third part. The insulating substrate in the first part and the second part is connected to the voice coil motor metal shell through the adhesive layer. The conductive layer has a gap with the plastic mainboard support. The third part is arranged between the plastic mainboard support and the mainboard. The reinforcing member is arranged between the conductive layer in the third part and the plastic mainboard support. The protective member is arranged between the conductive layer penetrating the insulating substrate in the third part and the elastic member. The elastic member is arranged between the protective member and the mainboard. The mainboard serves as a grounding end.

[0032] In the implementation, when the electrostatic enters the accommodation space, the electrostatic is closest to the conductive layer and the impedance is minimum. The conductive layer is isolated from the camera module through the insulating substrate and the non-conductive glue, that is, the conductive layer is not conductive with the camera module. The conductive layer is also grounded through the elastic member. For the electrostatic, the shortest impedance path is to directly discharge to the mainboard through the conductive layer. Therefore, the electrostatic cannot hit the camera module but directly hits the conductive layer. The conductive layer can protect the camera module from being damaged. Meanwhile, the electrostatic protection structure is bendable, so that the application range is wider.

[0033] In a possible implementation of the first aspect, the sensitive structure is a receiver assembly.

[0034] The electronic device further includes a plastic shell, a middle frame, a mainboard, a plastic mainboard support and a plastic battery cover. The plastic shell, the plastic mainboard support and the plastic battery cover enclose an accommodation space. The middle frame, the mainboard, the receiver assembly and the electrostatic protection structure are arranged in the accommodation space. The plastic shell has a gap with the plastic battery cover. The middle frame is arranged at one side of the plastic shell. The receiver assembly and the mainboard are arranged at the same side of the middle frame away from the plastic shell. The plastic mainboard support is arranged at one side of the receiver assembly and the mainboard away from the middle frame. The plastic battery cover is arranged at one side of the plastic mainboard support away from the middle frame. The middle frame or the mainboard serves as a grounding end.

[0035] In the implementation, the static electricity enters the accommodation space and then reaches the static electricity protection structure with the shortest distance and the smallest impedance, the static electricity protection structure is not conductive with the earphone assembly, and the static electricity protection structure is grounded through the elastic member. For the static electricity, the shortest impedance path is to directly leak to the ground through the static electricity protection structure, so the static electricity does not hit the earphone assembly but hits the static electricity protection structure, and the static electricity protection structure can protect the earphone from being damaged.

[0036] In a possible implementation of the first aspect, the static electricity protection structure includes an insulating substrate, a conductive layer, an adhesive layer, a protection member, and an elastic member. The insulating substrate and the conductive layer constitute a whole that is divided into a fourth part, a fifth part, and a sixth part. The fourth part, the fifth part, and the sixth part are sequentially connected. The fourth part and the sixth part have the same extension direction, and the fifth part has an extension direction different from the extension directions of the fourth part and the sixth part. The fourth part is arranged between the earphone assembly and the plastic mainboard support. The insulating substrate in the fourth part and the fifth part is adhered to the earphone assembly through the adhesive layer. The conductive layer in the fourth part is adjacent to the plastic mainboard support and has a gap. The conductive layer in the fifth part has a gap with the plastic shell. The sixth part is arranged between the middle frame and the plastic battery cover. The protection member is arranged between the conductive layer penetrating the insulating substrate in the sixth part and the elastic member. The elastic member is arranged between the protection member and the middle frame. The middle frame serves as a grounding end.

[0037] In the implementation, when the static electricity enters the accommodation space, the static electricity reaches the conductive layer with the shortest distance and the smallest impedance. The conductive layer is isolated from the earphone through the insulating substrate and the non-conductive adhesive, that is, the conductive layer is not conductive with the earphone. The conductive layer is also grounded through the elastic member. For the static electricity, the shortest impedance path is to directly leak to the middle frame through the conductive layer. Therefore, the static electricity does not hit the earphone but hits the conductive layer. The conductive layer can protect the earphone from being damaged. Meanwhile, the static electricity protection structure can be bent, so that the static electricity protection structure has a wider application range.

[0038] In the second aspect, an electronic device is provided, which includes the static electricity protection structure in the first aspect or any possible implementation of the first aspect.

[0039] The electronic device provided in the embodiments of the present application effectively improves the electromagnetic compatibility problem of device hard failure or device function soft failure, and greatly improves the performance of the electronic device.

[0040] This application provides an electrostatic discharge (ESD) protection structure and an electronic device. The ESD protection structure is directly connected to the sensitive structure, ensuring that when static electricity enters the containment space, the distance to the ESD protection structure is the shortest, meaning the impedance is minimal. The static electricity will directly strike the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, meaning there is no electrical connection between them, the static electricity will not strike the sensitive structure. Therefore, the ESD protection structure increases the static discharge path, allowing static electricity to directly strike and be discharged. This protects the sensitive structure from damage. When applied to electronic devices, it improves the ESD protection capability of the electronic device, reduces electromagnetic compatibility issues related to structural damage or functional soft failure, and improves the performance of the electronic device. Attached Figure Description

[0041] Figure 1 A schematic diagram of the structure of an electronic device provided for related technologies;

[0042] Figure 2 A schematic diagram of the structure of another electronic device provided for related technologies;

[0043] Figure 3 for Figure 2 A schematic diagram of ESD occurring in the rear-facing camera module;

[0044] Figure 4 This is a front view of the overall structure of an electronic device provided in an embodiment of this application;

[0045] Figure 5 for Figure 1 A schematic diagram of the back of the electronic device shown;

[0046] Figure 6 for Figure 1 A schematic diagram of the disassembled structure of the electronic device shown;

[0047] Figure 7 This is a front view of an electrostatic protection structure provided in an embodiment of this application;

[0048] Figure 8 This is a schematic diagram of the back of an electrostatic protection structure provided in an embodiment of this application;

[0049] Figure 9 This is a front view of another electrostatic protection structure provided in an embodiment of this application;

[0050] Figure 10 A schematic diagram of the back of another electrostatic protection structure provided in this application embodiment;

[0051] Figure 11 for Figure 8 andFigure 10 Another cross-sectional view after cutting along the cutting line T1T2;

[0052] Figure 12 As Figure 8 And Figure 10 Another cross-sectional view after cutting along the cutting line T1T2;

[0053] Figure 13 A structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0054] Figure 14 A structural schematic diagram of another electronic device provided by an embodiment of the present application;

[0055] Figure 15 A structural schematic diagram of still another electronic device provided by an embodiment of the present application;

[0056] Figure 16 A structural schematic diagram of yet another electronic device provided by an embodiment of the present application.

[0057] Reference signs:

[0058] 01-electronic device; 20-first plastic structural member; 21-middle frame; 22-mainboard; 23-sensitive structure; 24-static electricity protection; 3-back camera assembly; 25-static electricity gun; 101-front camera assembly; 102-display screen; 1021-light-transmitting cover plate; 1022-screen; 104-back shell; 1041-back cover; 1042-bezel; 107-mounting port; F-gap; JD-static electricity; 7-plastic mainboard support; 8-plastic battery cover; 9-gelatinizing; 10-plastic decoration; 11-back gelatinizing; 12-LENS; 26-static electricity protection structure; 261-insulating base; 262-conductive layer; 263-reinforcing member; 264-non-conductive glue; 265-protection finger; 266-elastic member; 267-anti-oxidation layer; 1-plastic shell; 100-RCV assembly; 4-connecting assembly; 41-BTB support; 42-BTB; 43-FPC; 31-back camera substrate; 32-back camera module; 33-VCM metal shell; 14-sealing foam. DETAILED DESCRIPTION

[0059] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; the "and / or" in the text only represents a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone.

[0060] Hereinafter, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" are used only for descriptive purposes and should not be construed as implying or suggesting relative importance or an implied direction indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" can explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, the meaning of "a plurality of" is two or more than two. The meaning of "at least one" is one or more than one.

[0061] In addition, in the present application, the orientation terms such as "upper", "lower", "left", "right", "inner", "outer" and the like are defined with respect to the orientation in which the components in each figure are placed, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and they can be changed accordingly according to the change of the orientation in which the components are placed in each figure.

[0062] Firstly, some terms in the embodiments of the present application are explained in detail to facilitate understanding by those skilled in the art.

[0063] ESD refers to the phenomenon of charge transfer when objects with different electrostatic potentials are close to each other or in direct contact.

[0064] Arc refers to the instantaneous spark generated by the current passing through some insulating medium (for example, air), which is a kind of gas discharge phenomenon.

[0065] Instantaneous current refers to the instantaneous high burst of electric energy, which is a kind of instantaneous state and distortion state of current and voltage on an alternating sinusoidal circuit.

[0066] DUMP (Dump) refers to the interface of the memory dump file (DUMP file) generated by the operating system when the program or system crashes. The DUMP file contains the memory state when the program or system crashes, and can be used to record the memory state and system information at the time of crash and facilitate subsequent debugging and analysis.

[0067] EMC (electromagnetic compatibility) refers to the ability of a device or system to meet the requirements in its electromagnetic environment and not to produce intolerable electromagnetic interference to any structure in the environment. Therefore, EMC includes two requirements: on the one hand, the electromagnetic interference generated by the device or system in the normal operation process should not exceed a certain limit value, and on the other hand, any structure should have a certain degree of anti-interference (also called electromagnetic sensitivity) to the electromagnetic interference existing in the environment.

[0068] The back adhesive in the electronic device is usually to coat the adhesive on one side of the film, and then the adhesive is pasted on the structure that needs to be bonded to achieve bonding, wherein the adhesive can use silica gel or glass glue, etc., which has good elasticity, wear resistance, temperature resistance and oxidation resistance, these characteristics make the back adhesive have static voltage resistance characteristics, and the static voltage resistance characteristics of the back adhesive mainly reflect its resistance to static electricity and voltage resistance.

[0069] The dispensing glue in the electronic device is usually to point or smear the glue on the plane, and then place the structure that needs to be bonded to achieve bonding, wherein the glue can use white glue, ultraviolet (UV) glue or red glue, etc., which plays a role in reinforcing and sealing when bonding, preventing the invasion of moisture and humidity, and also has static voltage resistance characteristics, and the static voltage resistance characteristics of the dispensing glue mainly reflect its resistance to static electricity and voltage resistance, in the dispensing process, the shape and size of the dispensing glue can be controlled by different dispensing heads and parameters such as pressure, speed and trajectory of the glue, which is suitable for precise dispensing in a smaller area.

[0070] The board to board (BTB) connector refers to a component used to connect different printed circuit boards (PCBs) in electronic devices, which can provide reliable electrical connection and allow signals, power or data to be transmitted between one circuit board and another.

[0071] The above is a brief introduction to the terms involved in the embodiments of the present application, which will not be repeated below.

[0072] Exemplary, Figure 1 An electronic device 01 to which the embodiments of the present application are applicable is shown.

[0073] As is known, plastic has the advantages of light weight and not easy to corrode after encountering water and oxygen compared with metal, therefore, if the electronic device needs to achieve the requirements of weight reduction and waterproof, some structural parts in the electronic device can be made of plastic to optimize the performance of the electronic device.

[0074] As Figure 1 shown, taking a mobile phone as an example, the mobile phone can include a first plastic structural part 20, a middle frame 21, a mainboard 22 and a sensitive structure 23, the first plastic structural part 20 can itself enclose an accommodation space, and the middle frame 21, the mainboard 22 and the sensitive structure 23 are all arranged in the accommodation space.

[0075] Specifically, in the accommodating space, the middle frame 21 is arranged on the first plastic structural member 20, and all surfaces of the middle frame 21 except one surface are in contact with the first plastic structural member 20. The main board 22 is arranged on the surface of the middle frame 21 which is not in contact with the first plastic structural member 20, and the main board 22 is not in contact with the first plastic structural member 20. The sensitive structure 23 is arranged on the side surface of the main board 22 away from the first plastic structural member 20, and the sensitive structure 23 is not in contact with the first plastic structural member 20. The accommodating space is generally not completely sealed, otherwise it may affect the performance and use of the middle frame 21, the main board 22 and the sensitive structure 23, so that the gap F between the first plastic structural member 20 and the sensitive structure 23 can be used to make the accommodating space not sealed.

[0076] In actual application, the sensitive structure 23 refers to electronic components and wirings which are easy to fail after static contact, such as rear camera assembly, earpiece assembly, microphone, audio assembly and PCB wiring, etc.

[0077] Please refer to Figure 1 The mobile phone can also include an electrostatic protection 24, which is in contact with the first plastic structural member 20, and the electrostatic protection 24 is used to block at least part of the gap F to block static electricity from entering the accommodating space.

[0078] In actual application, the electrostatic protection 24 can be adhesive or dispensing, etc., which needs to block static electricity from entering the accommodating space by using the electrostatic protection 24 such as adhesive or dispensing, etc., while not affecting the performance and use of the middle frame 21, the main board 22 and the sensitive structure 23.

[0079] At present, in order to pursue the extreme appearance of narrow frame and the effects of miniaturization and lightness, etc., various structures need to be designed compactly, and at the same time, the internal space of the mobile phone needs to be small, which leads to the problem of insufficient space in the mobile phone. When applied to Figure 1 , the adhesive or dispensing electrostatic protection 24 generally has a width along the first direction (ox direction) and a width along the second direction (oy direction) in the mobile phone. Figure 1 Figure 1 ​The height of the static protection 24 along the oy direction is set to be small. Based on the electrostatic pressure resistance characteristic of the static protection 24, the product of the size and the pressure resistance characteristic of the static protection 24 is required to meet the electrostatic test level to block the static JD, and if the width of the static protection 24 along the ox direction and the height along the oy direction are small, it is difficult to meet the condition, resulting in that when the static JD enters through the gap F and contacts the static protection 24 (that is, hits the static protection 24), the static JD is easy to penetrate the static protection 24 such as the back glue or the point glue and enter the containing space. At this time, since the first plastic structural member 20 is all around the sensitive structure 23, the first plastic structural member 20 has no static JD discharge function, resulting in that the static JD directly hits the sensitive structure 23, which brings a series of electromagnetic compatibility problems such as hard damage or functional soft failure to the sensitive structure 23, thereby causing poor performance of the mobile phone and poor user experience.

[0080] In applications, the static JD can come from static electricity outside the electronic device 01, for example, static electricity brought by human body contact, static electricity carried by some objects in the living environment, etc., which is not limited here.

[0081] It should be noted that the mobile phone can also not include the static protection 24, at this time, the gap F of the first plastic structural member 20 is not provided with any structure, that is, it is an air gap, which will inevitably make the static JD enter the containing space and directly hit the sensitive structure 23, resulting in the above problems.

[0082] The following gives an example of two different positions of the mobile phone provided in the related art being damaged by static discharge.

[0083] Example one:

[0084] Figure 2 A schematic diagram of the rear camera assembly 3 in the electronic device 01 to which the embodiments of the present application are applicable and some structures related thereto is shown. It should be noted that, Figure 2 The dashed line similar to the triangle is not an actual structure, but only illustrates the angle of the camera.

[0085] As Figure 2 shown, the electronic device 01 can include a middle frame 21, a rear camera assembly 3, a mainboard 22, a plastic mainboard support 7, a plastic battery cover 8, a point glue 9, a plastic decoration (DECO) 10, a back glue 11, a LENS 12, a connecting assembly 4 and a sealing foam 14. It should be noted that the specific positions of these structures are described in the following embodiments, and are not described here.

[0086] In the embodiment of the present application, the rear camera module 32 can refer to the remaining parts of the rear camera assembly 3 except for the lens (LENS) 12, the rear camera substrate 31 and the voice coil motor (VCM) metal shell 33, such as the camera and the photosensitive device, etc. Further, the LENS 12 can be a glass lens, etc.

[0087] In the application, the LENS 12 can be provided on the plastic DECO 10, which can allow light to pass through and enter the light entrance surface of the rear camera assembly 3.

[0088] Figure 3 A rear camera assembly is shown. Figure 2 An electrostatic discharge schematic diagram of the rear camera assembly 3 is shown.

[0089] In the related art, the space left for the LENS by the plastic DECO in the rear camera assembly of some mobile phones is very small. In order to prevent static electricity from directly hitting the rear camera module, a back adhesive 11 is often provided near the LENS 12 as an electrostatic protection device, so as to block the static electricity and protect the rear camera module from being damaged by static electricity. Figure 1

[0090] In combination with the drawings shown in Figure 2 and Figure 3 , the space limitation of the rear camera assembly 3 makes the gap between the plastic DECO 10 and the LENS 12 and the space near the gap very limited. At this time, if the back adhesive 11 is provided in the part of the plastic DECO 10 in the rear camera assembly 3 except for the gap and the space near the gap to block the static electricity entering from the gap, the size of the back adhesive 11 can only be very small, for example, the width of the back adhesive 11 along the ox direction is only about 0.8 mm. The back adhesive 11 with such a small size is difficult to completely block the static electricity. When the ESD test is performed on the rear camera assembly 3 using the static gun 25 in the CAMERA preview mode, it can be observed that the static gun 25 performs 10kV air discharge on the plastic DECO and the position near the plastic DECO. After the back adhesive 11 is broken down by the 10kV air discharge, the electrostatic protection function of the back adhesive 11 is lost. At this time, the static arc can pass through the gap between the plastic DECO 10 and the LENS 12 and hit the rear camera assembly 3, for example, the static electricity directly hits the VCM metal shell 33 of the rear camera assembly 3, which can cause the VCM metal shell 33 to generate a transient large current. The transient large current can damage the rear camera assembly 3, drag the mobile phone system, cause the whole system to abnormally stall and enter the DUMP dead screen interface or the camera function to be abnormal, thereby causing the mobile phone to be abnormal and the user experience to be poor.

[0091] Example II:

[0092] ​The gap between the plastic DECO and the plastic battery cover in the mobile phone and the space near the gap are very limited. At this time, if the dispensing is set to block the static electricity entering from the gap except the gap in the space of the plastic DECO and the plastic battery cover position, the size of the dispensing can only be very small. Such small dispensing is difficult to completely block the static electricity. When the ESD test is performed on the plastic DECO and the plastic battery cover position in the camera preview mode of the mobile phone, 10kV air discharge can be observed at the position. After the dispensing is broken down by the 10kV air discharge, the electrostatic protection function fails. At this time, the electrostatic arc can pass through the gap between the plastic DECO and the plastic battery cover and hit the flash of the mobile phone, which can cause a large instantaneous current to the flash of the mobile phone. The large instantaneous current will damage the flash power supply path of the power management unit (PMU). The flash is always on and cannot be normally turned off, causing the mobile phone to be abnormal and the user experience to be poor.

[0093] Based on the above description, there are many plastic structural members in electronic devices, such as plastic battery covers, plastic DECOs, and plastic mainboard supports. Once the adhesive or dispensing for blocking static electricity fails, static electricity can enter the accommodation space where the sensitive structure is placed through the gap between the plastic structural member and the sensitive structure. Since the plastic structural member around the sensitive structure cannot provide a static electricity discharge path like metal, the static electricity directly hits the sensitive structure, causing a series of electromagnetic compatibility problems, which seriously affects the performance of the electronic device and the user experience.

[0094] Therefore, the present application provides an electrostatic protection structure. The electrostatic protection structure is directly connected to the sensitive structure. When static electricity enters the accommodation space, the distance from the static electricity to the electrostatic protection structure is the shortest, which means the impedance is the smallest. The static electricity directly hits the conductive layer. Since the conductive layer is separated from the sensitive structure by an insulating substrate, the conductive layer and the sensitive structure are not electrically connected and are not conductive. Therefore, the static electricity does not hit the sensitive structure. The electrostatic protection structure increases the static electricity discharge path, i.e., the static electricity can directly hit the electrostatic protection structure for discharge. The electrostatic protection structure can protect the sensitive structure from being damaged. When applied to electronic devices, the electrostatic protection ability of the electronic devices is improved.

[0095] When the electrostatic protection structure of the present application is applied to electronic devices, the electromagnetic compatibility problem of hard damage or soft failure of the device function of the electronic devices is effectively improved, and the performance of the electronic devices is greatly improved.

[0096] The specific type of the electronic device is not limited in the embodiments of the present application. In some embodiments, the electronic device of the present application can include a mobile phone, a wearable device (for example, a smart bracelet, a smart watch, an earphone, etc.), a tablet computer, a laptop, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) \ virtual reality (VR) device, an internet of things (IOT) device, and a vehicle-mounted electronic device.

[0097] Figure 4 A front structure schematic diagram of an electronic device 01 to which the embodiments of the present application are applicable is shown, Figure 5 A back structure schematic diagram of the electronic device 01 is shown, Figure 4 Figure 6 An exploded view of the electronic device 01 is shown, Figure 4 Figure 5 It should be noted that, for the convenience of understanding, the electronic device 01 in the embodiments of the present application is taken as a mobile phone for example, Figure 4 to Figure 6 The electronic device 01 shown in the above figures is taken as a tablet phone for example.

[0098] In other embodiments, the electronic device can also be a foldable mobile phone or other types of mobile phones, which are not specifically limited here.

[0099] The specific structure of the electronic device 01 to which the embodiments of the present application are applicable is further described below.

[0100] As shown in the above figures, Figure 4 to Figure 6 The mobile phone to which the embodiments of the present application are applicable can include a display screen 102, a back shell 104, and a mainboard 22. It can be understood that, Figure 4 to Figure 6 The above figures and the related figures below only schematically show some components in the mobile phone, and the actual shape, size, position, and structure of these components are not limited by Figure 4 to Figure 6 The above figures and the related figures below only schematically show some components in the mobile phone, and the actual shape, size, position, and structure of these components are not limited by

[0101] ​​In practical applications, the display screen 102 can be used to display images and videos, etc. The display screen 102 may include a light-transmitting cover 1021 and a screen 1022, with the light-transmitting cover 1021 and screen 1022 stacked together. The light-transmitting cover 1021 primarily serves to protect and prevent dust from the screen 1022. The screen 1022 can be a flexible display screen or a rigid display screen. For example, the screen 1022 can be any of the following: a liquid crystal display (LCD), an organic light-emitting diode (OLED) screen, a mini light-emitting diode (Mini LED) screen, or a micro light-emitting diode (Micro LED) screen.

[0102] In practical applications, the back cover 104 can be used to protect the electronic components inside the mobile phone. The back cover 104 may include a back cover 1041 and a frame 1042. The back cover 1041 is disposed on the side of the screen 1022 away from the light-transmitting cover 1021 and is stacked on top of the light-transmitting cover 1021 and the screen 1022. The frame 1042 is disposed between the back cover 1041 and the light-transmitting cover 1021 and is fixed to the back cover 1041.

[0103] In practical applications, the motherboard 22 can be a rigid circuit board, such as a PCB; or, the motherboard 22 can be a flexible printed circuit (FPC); or, the motherboard 22 can be a rigid-flex PCB. Furthermore, the motherboard 22 can be a single-sided or double-sided board. A single-sided board refers to a motherboard 22 where electronic components are located on one side. Figure 4 to Figure 6 (Not shown in the image), a double-sided panel refers to a panel with electronic components on both sides of the mainboard 22. Figure 3 to Figure 5 (Not shown in the image). The motherboard 22 can be a radio frequency (RF) board or an application processor (AP) board, etc. The RF board can be used to carry radio frequency integrated circuits (RF ICs) and radio frequency power amplifiers (RF PAs), etc. The application processor board can be used to carry SOCs, DDRs, main power management chips, and auxiliary power management chips, etc.

[0104] exist Figure 4 to Figure 6In the embodiment shown, the shape of the mobile phone to which the present application is applicable can be rectangular and flat, but can also be any other shape, which is not limited herein.

[0105] In addition, as shown in Figure 4 to Figure 6 The mobile phone to which the present application is applicable can also include a camera assembly, which is generally divided into a front camera compact module (CCM) 101 and a rear camera assembly 3.

[0106] As shown in Figure 4 The front camera compact module 101 can be mounted on the upper left of the display screen 102 and used for self-shooting.

[0107] As shown in Figure 5 and Figure 6 The rear camera assembly 3 can be mounted on the upper left of the back cover 104 and used for shooting the scene around the mobile phone.

[0108] It should be understood that Figure 4 to Figure 6 The mounting positions and numbers of the front camera compact module 101 and the rear camera assembly 3 shown are only illustrative, and the actual application is subject to actual application.

[0109] The light entrance surface of the rear camera assembly 3 faces the back cover 1041, and the back cover 1041 is provided with a mounting port 107, which can correspond to the plastic battery cover 8. The plastic DECO 10 is covered and fixed at the mounting port 107, and the plastic DECO 10 is connected with the plastic battery cover 8 through the mounting port 107. The plastic DECO 10 can be used to carry and protect the rear camera assembly 3. In the direction perpendicular to the plastic battery cover 8, the LENS is arranged below the opening of the plastic DECO 10, at this time the plastic DECO 10 is sleeved around the LENS, and the user can directly contact the plastic DECO 10, for example, the user's hand can touch the upper surface and / or side surface of the plastic DECO 10, etc.

[0110] In actual application, the plastic DECO 10 can be a ring structure, for example, a circular ring and a square ring, etc., whereby the ring-shaped part of the plastic DECO 10 can be fixed and supported on one side of the plastic battery cover 8 by means of threaded connection, clamping or welding, etc. For example, the ring-shaped part of the plastic DECO 10 can be fixed to the plastic battery cover 8 by means of screws, so that the plastic DECO 10 can fix the plastic battery cover 8 and make it unable to move.

[0111] In actual application, the rear camera assembly 3 can be a periscopic camera assembly, or a vertical camera assembly, etc., which is not limited herein.

[0112] Here only the content related to the invention point is introduced, and the remaining structure can be obtained by referring to the related technology, which will not be described in detail here.

[0113] Based on the above structure, the electrostatic protection structure provided by the application is applied to an electronic device. The electrostatic protection structure is directly connected to the sensitive structure. When static electricity enters the accommodation space, the static electricity is closest to the electrostatic protection structure, which means that the impedance is the smallest. The static electricity directly hits the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating substrate, that is, the conductive layer and the sensitive structure are not electrically connected and are not conductive, the static electricity will not hit the sensitive structure. The electrostatic protection structure increases the static electricity discharge path, that is, the static electricity can directly hit the electrostatic protection structure for discharge. The electrostatic protection structure can protect the sensitive structure from being damaged. When applied to an electronic device, the electrostatic protection capability of the electronic device is improved, the electromagnetic compatibility problem of hard damage or functional soft failure of the structure in the electronic device is reduced, and the performance of the electronic device is better.

[0114] Please refer to the following Figure 7 to Figure 12 , the electrostatic protection structure 26 suitable for the application will be described in detail. It should be noted that, Figure 11 and Figure 12 are obtained after cutting Figure 8 and Figure 10 along the cutting line T1T2.

[0115] As shown in Figure 7 to Figure 12 , the application provides an electrostatic protection structure 26 applied to an electronic device. The electronic device can also include at least one plastic structural member, a sensitive structure, and a ground terminal. The at least one plastic structural member has an accommodation space. The sensitive structure and the electrostatic protection structure are both arranged in the accommodation space. The electrostatic protection structure is connected to the sensitive structure and the ground terminal, respectively.

[0116] The gap between the at least one plastic structural member and the sensitive structure has a width along a first direction (ox direction in Figure 7 to Figure 12 ) of less than or equal to 2mm, and a height along a second direction (oy direction in Figure 7 to Figure 12 ) of 20μm-40μm. The gap is used to enable static electricity to enter the accommodation space where the sensitive structure is placed.

[0117] The electrostatic protection structure 26 can at least include an insulating substrate 261 and a conductive layer 262. The insulating substrate 261 is in contact with the sensitive structure. The conductive layer 262 is arranged on the side of the insulating substrate 261 away from the sensitive structure. The conductive layer 262 is also connected to the ground terminal. The conductive layer 262 is used to receive static electricity entering the accommodation space and prevent the static electricity from hitting the sensitive structure.

[0118] As an example, the width of the gap along the ox direction can be 0.1 mm, 0.5 mm, 1 mm, 1.5 mm, or 2 mm, etc.; the height of the gap along the oy direction can be 20 mm, 25 mm, 30 mm, 35 mm, or 40 mm, etc.

[0119] In applications, the sensitive structure can or can not be in contact with the at least one plastic structural member, which is not specifically limited here, but the sensitive structure is not in direct contact with the grounding end.

[0120] Similarly, the electrostatic protection structure 26 can or can not be in contact with the at least one plastic structural member, which is not specifically limited here.

[0121] It should be understood that the electronic device including the at least one plastic structural member can mean that the electronic device includes only one plastic structural member, or the electronic device includes a plurality of plastic structural members, which is not specifically limited here. In the case where the electronic device includes one plastic structural member, the plastic structural member itself, and the gap between the plastic structural member and the sensitive structure, the static electricity outside the plastic structural member can enter the accommodation space where the sensitive structure is placed through the gap. In the case where the electronic device includes a plurality of plastic structural members, it can be that one plastic structural member itself has an accommodation space, and the gap between the one plastic structural member itself and the sensitive structure; or it can also be that a plurality of plastic structural members enclose an accommodation space, and the gap between at least two plastic structural members of the plurality of plastic structural members and the gap between the plastic structural members and the sensitive structure, of course, at this time, it can also be that the gap between one plastic structural member itself and the sensitive structure, which can be determined according to actual needs.

[0122] Therefore, the gap between the at least one plastic structural member and the sensitive structure can mean that there is a gap between one plastic structural member and the sensitive structure, or there is a gap between a plurality of plastic structural members and the sensitive structure. Wherein, the number of gaps between each plastic structural member and the sensitive structure can be one or more, which is not specifically limited here. In the case where the number of gaps is multiple, the size and shape of the multiple gaps can be the same or different, which is subject to actual application.

[0123] The above-mentioned grounding end in the electronic device can be a PCB or a middle frame structure, i.e., the PCB and the middle frame structure can be used as the grounding end, so that the electrostatic protection structure 26 flows the received static electricity to the ground.

[0124] The volume and position of the above-mentioned accommodation space can be determined according to the shape and number of the plastic structural members, and the volume and position of the sensitive structure and the electrostatic protection structure 26, etc.

[0125] In applications, the insulating substrate 261 can be a rigid insulating substrate or a flexible insulating substrate. In the case where the insulating substrate 261 is a rigid insulating substrate, the rigid insulating substrate cannot be bent, and in this case, the electrostatic protection structure 26 can be arranged at a position in the electronic device where the electrostatic protection structure 26 does not need to be bent. In the case where the insulating substrate 261 is a flexible insulating substrate, the flexible insulating substrate can be bent, and in this case, the electrostatic protection structure 26 can be arranged at any position in the electronic device, and when the electrostatic protection structure 26 needs to be bent, the electrostatic protection structure 26 is bent, and when the electrostatic protection structure 26 does not need to be bent, the electrostatic protection structure 26 is not bent, so that the insulating substrate 261 can meet the bending performance and can be applied to various application scenarios. The material of the flexible insulating substrate can be polyimide (PI) or polyethylene terephthalate (PET), etc.

[0126] The thickness d1 of the insulating substrate 261 along the oy direction can be greater than or equal to 13 μm, and for example, d1 can be 13 μm, 14 μm, 15 μm, 16 μm, or 17 μm, etc. In this way, the insulating substrate 261 can not only support the conductive layer 262, but also isolate the conductive layer 262 from the sensitive structure, so that the conductive layer 262 does not directly contact the sensitive structure, and thus when static electricity enters the accommodation space, air discharge (rather than contact discharge) can hit the electrostatic protection structure 26 without hitting the sensitive structure, so as to protect the sensitive structure.

[0127] In applications, the conductive layer 262 can be a conductive foil or a conductive wire, etc. In this way, the conductive layer 262 can be bent together with the flexible substrate when the electrostatic protection structure 26 needs to be bent, and the conductive layer 262 does not need to be bent when the electrostatic protection structure 26 does not need to be bent.

[0128] The material of the conductive layer 262 can be metal, for example, copper (Cu), gold (Au), and silver (Ag), etc. In the case where the material of the conductive layer 262 is copper, the material of the conductive layer 262 can be electrolytic copper or rolled copper, etc., which is not limited here.

[0129] The thickness d2 of the conductive layer 262 along the oy direction can be 12 μm-35 μm, and for example, d2 can be 12 μm, 15 μm, 20 μm, 25 μm, 30 μm, or 35 μm, etc. In this way, the thickness of the conductive layer 262 is thin, and the conductive layer 262 has good conductivity and can be well bent, and the electronic device can be miniaturized and lightened.

[0130] The direct current resistance of the conductive layer 262 can be less than or equal to 5 Ω, and for example, the direct current resistance of the conductive layer 262 can be 1 Ω, 2 Ω, 3 Ω, 4 Ω, or 5 Ω, etc. In this way, the conductive layer 262 has good ductility and conductivity.

[0131] It can be understood that the conductive layer 262 can be directly printed on one side of the insulating substrate 261, or the conductive layer 262 can be adhered to one side of the insulating substrate 261 by an adhesive, which is not specifically limited here. In the case of using an adhesive, the adhesive of the embodiments of the present application can be epoxy resin, etc., so that the adhesive has good adhesion and does not affect the performance of the insulating substrate 261 and the conductive layer 262.

[0132] In one or more embodiments, the bending radius of the electrostatic protection structure 26 composed of the insulating substrate 261 and the conductive layer 262 can be greater than or equal to 5h, where h is the thickness of the electrostatic protection structure 26 along the oy direction, that is, the sum of the thickness of the insulating substrate 261 along the oy direction and the thickness of the conductive layer 262 along the oy direction.

[0133] In addition, the electrostatic protection structure 26 composed of the insulating substrate 261 and the conductive layer 262 can be bent as needed, and the number of bends, etc. can be determined according to actual needs, for example, it can be bent once or more.

[0134] It should be understood that the contact of the insulating substrate 261 with the sensitive structure can mean that the insulating substrate 261 is directly connected to the sensitive structure, or the insulating substrate 261 is connected to the sensitive structure through other structures, for example, the insulating substrate 261 can be bonded to the sensitive structure through a bonding layer.

[0135] The bonding layer can be a non-conductive adhesive 264, etc., and the non-conductive adhesive 264 here can be a non-conductive adhesive without metal particles, etc. The insulating resistance of the non-conductive adhesive 264 can be greater than or equal to 10MΩ, for example, the insulating resistance of the non-conductive adhesive 264 can be 10MΩ, 11MΩ, 12MΩ, 13MΩ, 14MΩ or 15MΩ, etc. The thickness d6 of the non-conductive adhesive 264 along the oy direction can be greater than or equal to 30μm, for example, d6 can be 30μm, 35μm, 40μm, 45μm, 50μm or 60μm, etc. Thus, the non-conductive adhesive 264 can connect the insulating substrate 261 and the sensitive structure, and also make the conductive layer 262 not electrically connected to the sensitive structure.

[0136] It should be understood that the electrically conductive layer 262 being connected to the ground terminal can mean that part of the electrically conductive layer 262 penetrates part of the insulating substrate 261 along the oy direction and directly contacts the ground terminal; or part of the electrically conductive layer 262 penetrates part of the insulating substrate 261 along the oy direction and contacts the ground terminal through other protective members, that is, other protective members are arranged between the electrically conductive layer 262 penetrating part of the insulating substrate 261 and the insulating substrate 261, and the other protective members are arranged on the side of the insulating substrate 261 away from the electrically conductive layer 262 and directly contact the insulating substrate 261 and the electrically conductive layer 262; or part of the electrically conductive layer 262 does not penetrate part of the insulating substrate 261 along the oy direction and contacts the ground terminal through other protective members, that is, part of the other protective members are arranged on the side of the insulating substrate 261 away from the electrically conductive layer 262, part of the electrically conductive layer 262 and part of the other protective members are arranged in part of the insulating substrate 261, and the other protective members directly contact the insulating substrate 261 and the electrically conductive layer 262. In these implementation manners, the insulating substrate 261 can have at least one through hole, and part or all of the electrically conductive layer 262 can enter the through hole, and thus the other protective members can partially enter the through hole or not enter the through hole, which is not limited here.

[0137] Of course, the electrically conductive layer 262 being connected to the ground terminal can also mean that the electrically conductive layer 262 does not penetrate the insulating substrate 261 and directly contacts the ground terminal; or the electrically conductive layer 262 does not penetrate the insulating substrate 261 and contacts the ground terminal through other protective members, and the other protective members also do not penetrate the insulating substrate 261 and contact the ground terminal, which is subject to actual application.

[0138] In applications, the protective member can be a protective finger 265 in the electrically conductive layer 262, the protective finger 265 can be plated or coated on the outer surface of the side of the electrically conductive layer 262 penetrating the insulating substrate 261, and the protective finger 265 can be connected to the ground terminal. Figure 11

[0139] The material of the protective finger 265 can be gold, copper or nickel (Ni), etc. In the case that the material of the protective finger 265 is gold and the material of the electrically conductive layer 262 is copper, the copper surface can be plated with gold to form a gold finger, and the gold finger has good ductility and conductivity, so that the copper can be protected from corrosion as much as possible through the gold finger, and the impedance continuity can be ensured after long-term use, so that reliable contact can be achieved at this position for a long time.

[0140] Of course, the protective finger 265 can also be a separate structure, and the protective finger 265 can be combined with the outer surface of the side of the electrically conductive layer 262 penetrating the insulating substrate 261 through an adhesive or the like, which is not limited here.

[0141] For example, the protective finger 265 can be a gold finger, and the material of the electrically conductive layer 262 can be copper. Figure 11 ​As shown, the thickness d4 of the protection finger 265 along the oy direction can be greater than or equal to 5 μm, and specifically, d4 can be 5 μm, 6 μm, 7 μm, 8 μm, or 9 μm, etc. In this way, the protection finger can not only protect the copper from corrosion as much as possible, but also ensure impedance continuity after long-term use, so that the conductive layer can be in long-term reliable contact with the ground terminal or other structures.

[0142] In one or more embodiments, the electrostatic protection structure 26 can further include an elastic member 266, which can be a structure such as a spring, conductive foam, etc. that has elasticity by itself. The spring can be a convex spring or the like.

[0143] As an example, the elastic member 266 is arranged between the protection finger 265 and the ground terminal, and the elastic member 266 is in contact with the protection finger 265 and the ground terminal, respectively. Specifically, the elastic member 266 can be welded or bonded to one side of the protection finger 265, the middle frame 21, or the main board 22.

[0144] Further, the effective contact area of the protection finger 265 and the elastic member 266 can be greater than or equal to 10 mm 2 , and specifically, the effective contact area of the protection finger 265 and the elastic member 266 can be 10 mm 2 , 11 mm 2 , 12 mm 2 , 13 mm 2 , 14 mm 2 , or 15 mm 2 , etc. In this way, long-term effective contact of the protection finger 265 and the elastic member 266 can be ensured.

[0145] It should be noted that the working height of the elastic member 266 can be determined according to the distance between the protection finger 265 and the ground terminal along the oy direction.

[0146] Since the circuit board or the middle frame as the ground terminal cannot be directly connected to the protection finger 265, the elastic member 266 is added to ensure that the protection finger 265 is well connected to the ground terminal through the elastic member 266.

[0147] In one or more embodiments, the entire body of the insulating substrate 261 and the conductive layer 262 is relatively soft, and in the case that the electrostatic protection structure 26 has the elastic member 266, the elastic member 266 is likely to tear the insulating substrate 261 and the conductive layer 262 in some application scenarios, which requires that the part of the electrostatic protection structure 26 that is grounded be harder, i.e., have stronger strength, than other parts to ensure good performance. Therefore, as shown in FIG. 8, the insulating substrate 261 and the conductive layer 262 are arranged on the same side of the protection finger 265, and the protection finger 265 is arranged on the other side of the insulating substrate 261 and the conductive layer 262. Figure 11 and Figure 12As shown, the electrostatic protection structure 26 can further include a reinforcing member 263 arranged on the side of the conductive layer 262 away from the insulating substrate 261. The reinforcing member 263 can be bonded to the conductive layer 262 by an adhesive such as glue, thereby ensuring reduced damage to the insulating substrate 261 and the conductive layer 262 and better connection between the structures.

[0148] As an example, the reinforcing member 263 can be arranged on part of the surface of the side of the conductive layer away from the insulating substrate. In the case where the conductive layer and the insulating substrate need to be bent, the reinforcing member 263 can be arranged on part of the surface of the side of the conductive layer away from the insulating substrate and not needing to be bent.

[0149] In applications, the thickness d3 of the reinforcing member 263 along the oy direction can be greater than or equal to 0.15 mm. Specifically, d3 can be 0.15 mm, 0.18 mm, 0.2 mm, 0.25 mm or 0.3 mm, etc. In this way, the obtained reinforcing member 263 has high strength.

[0150] Further, when the reinforcing member 263 is a steel sheet, the thickness of the steel sheet along the oy direction can be greater than or equal to 0.15 mm. Or, when the reinforcing member 263 is plastic PI, the thickness of the plastic PI along the oy direction can be greater than or equal to 0.25 mm, which is not specifically limited here.

[0151] In one or more embodiments, when the electrostatic protection structure 26 needs to be sleeved around the sensitive structure, whether the electrostatic protection structure 26 is provided with the protective finger 265, the elastic member 266 and the reinforcing member 263 or not, only the first hole in the insulating substrate 261 and the second hole in the conductive layer 262 are needed, the first hole and the second hole at least partially coincide along the oy direction, and then the first hole and the second hole are sleeved on the electrostatic protection structure 26, that is, the electrostatic protection structure 26 is sleeved around the sensitive structure. If the electrostatic protection structure 26 is also provided with the protective finger 265, the elastic member 266 and the reinforcing member 263, these structures can be arranged on part of the insulating substrate 261 other than the first hole and / or part of the conductive layer 262 other than the second hole.

[0152] Significantly, as shown in Figure 9 and Figure 10 The shape and size of the first hole and the second hole are the same. As an example, the shape of the first hole and the second hole can be a cylinder, a cuboid or a square, etc., as long as the insulating substrate 261 and the conductive layer 262 can be sleeved around the sensitive structure.

[0153] In the case where the shape of the first hole and the second hole is a cylinder, significantly, the first hole and the second hole are selected to be completely coincident along the oy direction, that is, the diameter of the first hole and the second hole isFigure 9 and Figure 10 D1 is as small as possible while ensuring that the sensitive structure can work normally. Specifically, D1 needs to be greater than or equal to the maximum length of the part that cannot be covered when the sensitive structure works normally, so that the insulating base 261 and the conductive layer 262 can be set on the sensitive structure and also play a good protection role.

[0154] Further, D1 can be equal to the maximum length of the part that cannot be covered when the sensitive structure works normally, that is, the insulating base 261 and the conductive layer 262 are set on the sensitive structure and contact the sensitive structure around, at which time the electrostatic protection effect of the electrostatic protection structure 26 is very good.

[0155] In one or more embodiments, as shown in Figure 7 and Figure 8 There are no holes in the insulating base 261 and the conductive layer 262 in the electrostatic protection structure 26 at this time, so the electrostatic protection structure 26 cannot be set around the sensitive structure, but can be attached to at least one surface of the sensitive structure, and the electrostatic protection structure 26 can contact at least one surface of the sensitive structure.

[0156] In one or more embodiments, the electrostatic protection structure 26 can further include an oxidation prevention layer 267, which is disposed on the side of the conductive layer 262 away from the insulating base 261.

[0157] In applications, the material of the oxidation prevention layer 267 can be ink without metal particles or gold, etc. Thus, through the protection of the oxidation prevention layer 267, the risk of oxidation of the conductive layer 262 by water and oxygen, etc. can be reduced.

[0158] Further, the oxidation prevention layer is used to be broken down by static electricity with a voltage less than 1kV, at which time the impedance of the oxidation prevention layer is small. For example, in the case where the oxidation prevention layer can be broken down by static electricity with a voltage of 0.5KV, static electricity with a voltage of 0.8KV, 1KV, 1.5KV and 10KV, etc. can break down the oxidation prevention layer, and then the static electricity reaches the conductive layer, which guides it to the ground, thereby achieving protection of the sensitive structure.

[0159] In the case where the material of the oxidation prevention layer 267 is ink without metal particles, at this time the oxidation prevention layer 267 is not conductive, and further needs to satisfy: d7 x static voltage resistance parameter (unit: kV / mm) < 1kV, that is, static electricity less than 1kV can break down the oxidation prevention layer 267.

[0160] When gold is plated on the conductive layer 262 to form the anti-oxidation layer 267, since gold itself is conductive, static electricity can directly pass through the gold to the conductive layer, and then be directly conducted away by the ground of the conductive layer, so at this time the static electricity breakable property of the anti-oxidation layer 267 can not be limited.

[0161] In one or more embodiments, the sensitive device requires a light-transmissive sensitive device or a sound-transmissive sensitive device, etc.

[0162] The electrostatic protection structure provided in the embodiments of the present application is directly connected to the sensitive structure, so that when static electricity enters the accommodation space, the static electricity is closest to the electrostatic protection structure, which means that the impedance is the smallest, and the static electricity directly hits the conductive layer. Since the conductive layer and the sensitive structure are separated by an insulating base, that is, there is no electrical connection between the conductive layer and the sensitive structure, and the conductive layer is not conductive, the static electricity will not hit the sensitive structure. Therefore, the electrostatic protection structure increases the static electricity discharge path, that is, the static electricity can directly hit the electrostatic protection structure for discharge, and the electrostatic protection structure can protect the sensitive structure from being damaged.

[0163] When the electrostatic protection structure of the present application is applied to an electronic device, the electrostatic protection capability of the electronic device is improved, the electromagnetic compatibility problem of hard damage or soft failure of the structure in the electronic device is reduced, and the performance of the electronic device is better.

[0164] The electrostatic protection structure provided in the present application is applied to an electronic device, and an electronic device 01 is obtained. Figure 13 to Figure 16

[0165] Embodiment 1 (sensitive structure is rear camera assembly 3):

[0166] Figure 13 A structure schematic diagram of an electronic device 01 to which the embodiments of the present application are applicable is shown. It should be noted that the electronic device 01 is cut along the T3T4 section line position to obtain the electrostatic protection structure in the electronic device 01, and the dashed line with an arrow in the electronic device 01 is the discharge path during the electrostatic discharge test. Figure 10 Figure 13 Figure 13

[0167] As shown in FIG. 1, the width h1 of the gap along the ox direction is less than or equal to 2 mm; and the height h2 of the gap along the oy direction is 20 μm-40 μm. Figure 13 Please refer to FIG. 1 again, the electronic device 01 includes a middle frame 21, a LENS 12, a rear camera module 32, a rear camera substrate 31, a VCM metal shell 33, a mainboard 22, a plastic mainboard support 7, a plastic battery cover 8, a dispensing 9, a plastic DECO 10, and a back glue 11.

[0168] Figure 13

[0169] ​​​​​​The middle frame 21 is used to support the main board 22, the plastic main board support 7, the plastic battery cover 8, the glue dispensing 9, the plastic DECO 10, the back glue 11, the rear camera module 32, the rear camera substrate 31, the VCM metal shell 33 and the LENS 12. In applications, the middle frame 21 can be a metal middle frame, for example, any one of an aluminum alloy middle frame, a magnesium alloy middle frame or a titanium alloy middle frame.

[0170] The main board 22 is arranged on one side of the middle frame 21, the plastic main board support 7 is arranged on the side of the main board 22 away from the middle frame 21, the plastic battery cover 8 is arranged on the side of the plastic main board support 7 away from the middle frame 21, the plastic DECO 10 is arranged on the side of the plastic battery cover 8 away from the middle frame 21, and the plastic DECO 10 is connected to the plastic battery cover 8 through the glue dispensing 9. The plastic main board support 7, the plastic battery cover 8 and the plastic DECO 10 form a containing space, and the rear camera module 32, the rear camera substrate 31, the VCM metal shell 33 and the LENS 12 are arranged in the containing space.

[0171] The rear camera substrate 31 is arranged on one side of the middle frame 21, the rear camera module 32 is arranged on the side of the rear camera substrate 31 away from the middle frame 21, the rear camera module 32 is connected to the rear camera substrate 31, the VCM metal shell 33 is sleeved around the rear camera module 32, the VCM metal shell 33 is also arranged on the side of the rear camera substrate 31 away from the middle frame 21, the VCM metal shell 33 is also connected to the rear camera substrate 31, the LENS 12 is arranged on the side of the rear camera module 32 and the VCM metal shell 33 away from the middle frame 21, the LENS 12 is not connected to the rear camera module 32 and the VCM metal shell 33 respectively, and the LENS 12 is also connected to the plastic DECO 10 through the back glue 11.

[0172] The electronic device 01 further comprises a BTB support 41, a BTB 42 and an FPC 43, the BTB support 41 is arranged on the side of the main board 22 away from the middle frame 21, the BTB 42 is arranged on the side of the BTB support 41 away from the middle frame 21, the BTB 42 is connected to the BTB support 41, and the BTB 42 is connected to the rear camera substrate 31 through the FPC 43.

[0173] The electronic device 01 further comprises an electrostatic protection structure, the electrostatic protection structure is sleeved outside the VCM metal shell 33, the electrostatic protection structure is connected to the VCM metal shell 33, and the electrostatic protection structure is also located in a partial region between the main board 22, the plastic main board support 7 and the VCM metal shell 33.

[0174] The electrostatic protection structure comprises an insulating substrate 261, a conductive layer 262, a reinforcing member 263, a non-conductive adhesive 264, a protection finger 265 and an elastic member 266. The insulating substrate 261 and the conductive layer 262 constitute a whole which comprises a first part, a second part and a third part. The first part, the second part and the third part are connected in sequence. The first part and the third part extend along the ox direction. The second part extends along the oy direction. The first part and the second part are arranged between the VCM metal shell 33 and the plastic mainboard support 7. Specifically, the insulating substrate 261 in the first part and the second part is connected with the VCM metal shell 33 through the non-conductive adhesive 264. The conductive layer 262 does not contact the plastic mainboard support 7. The third part is arranged between the plastic mainboard support 7 and the mainboard 22. The conductive layer 262 in the third part is further provided with the reinforcing member 263 between the plastic mainboard support 7. The reinforcing member 263 contacts the conductive layer 262, but has a gap between the plastic mainboard support 7. The insulating substrate 261 in the third part is further provided with the protection finger 265 and the elastic member 266 between the mainboard 22. The protection finger 265 is arranged between the insulating substrate 261 and the elastic member 266. The protection finger 265 contacts the conductive layer 262 and the elastic member 266 which penetrate the insulating substrate 261. The elastic member 266 is arranged between the protection finger 265 and the mainboard 22. The elastic member 266 contacts the protection finger 265 and the mainboard 22. The mainboard 22 is used as a grounding terminal.

[0175] Since the electrostatic protection structure is relatively small in size and insufficient in strength relative to the sensitive structure, there may be problems such as warping in the actual assembly of the electronic device. Therefore, from the perspective of improving the assembly difficulty of the electrostatic protection structure, the electrostatic protection structure can be directly attached to the VCM metal shell, and then reliably connected with the grounding terminal. It is only necessary to ensure that the electrostatic protection structure is sleeved around the VCM metal shell. In this way, when static electricity enters the accommodation space from the gap between the plastic DECO and the LENS, it will first hit the electrostatic protection structure, thereby playing a role in protecting the VCM metal shell from static electricity.

[0176] It should be noted that the first part (consisting of the insulating substrate 261, the non-conductive adhesive 264 and the conductive layer 262) can cover the surface of the VCM metal shell 33 along the ox direction, thereby better realizing the electrostatic protection function.

[0177] The electronic device provided by the embodiment of the present application has a containing space for placing a rear camera assembly, so that when static electricity enters the containing space, the distance to the conductive layer is the shortest and the impedance is the smallest, and the conductive layer is isolated from the VCM metal shell through the insulating base and the non-conductive adhesive, that is, the conductive layer is not conductive with the VCM metal shell, and the conductive layer is also grounded through the elastic member. For static electricity, the shortest impedance path is to directly discharge to the mainboard through the conductive layer, so the static electricity will not hit the VCM metal shell but directly hit the conductive layer. The conductive layer can protect the rear camera module from being damaged, and greatly improves the performance of the electronic device.

[0178] Embodiment 2 (sensitive structure is receiver (RCV) assembly 100):

[0179] Figure 14 A structural schematic diagram of an electronic device 01 to which the embodiment of the present application is applicable is shown.

[0180] As shown in Figure 14 , the width h1 of the gap along the ox direction is less than or equal to 2 mm; and the height h2 of the gap along the oy direction is 20 μm-40 μm.

[0181] Please refer to Figure 14 , the electronic device includes a plastic shell 1, a middle frame 21, a mainboard 22, a plastic mainboard support 7, a plastic battery cover 8, a BTB 42, a back adhesive 11, an RCV assembly 100, an insulating base 261, a conductive layer 262, a non-conductive adhesive 264, a finger protection 265 and an elastic member 266. The plastic shell 1, the plastic mainboard support 7 and the plastic battery cover 8 form a containing space, and the middle frame 21, the mainboard 22, the BTB 42, the back adhesive 11, the RCV assembly 100, the insulating base 261, the conductive layer 262, the non-conductive adhesive 264, the finger protection 265 and the elastic member 266 are all arranged in the containing space. There is a gap F between the plastic shell 1 and the plastic battery cover 8, and the back adhesive 11 blocks part of the gap F. The back adhesive 11 is in contact with the plastic shell 1 and the plastic battery cover 8 respectively. The middle frame 21 is arranged on one side of the plastic shell 1, and the surface of the middle frame 21 facing the plastic shell 1 is in contact with the plastic shell 1 respectively. The RCV assembly 100 and the mainboard 22 are both arranged on the side of the middle frame 21 away from the plastic shell 1 along the oy direction. The BTB 42 is arranged between the mainboard 22 and the plastic mainboard support 7 along the oy direction, and the BTB 42 is in contact with the mainboard 22 and the RCV assembly 100 respectively.

[0182] The whole of the insulating substrate 261 and the conductive layer 262 is composed of a fourth part, a fifth part and a sixth part, the fourth part, the fifth part and the sixth part are connected in sequence, the fourth part and the sixth part extend along the ox direction, the fifth part extends along the oy direction, the fourth part is arranged between the RCV assembly 100 and the plastic mainboard support 7 along the oy direction, specifically, the insulating substrate 261 in the fourth part is bonded with the RCV assembly 100 through the non-conductive glue 264, and the conductive layer 262 in the fourth part has a gap with the plastic mainboard support 7. The fifth part is arranged between the plastic shell 1 and the RCV assembly 100 along the ox direction, specifically, the insulating substrate 261 in the fifth part is bonded with the RCV assembly 100 through the non-conductive glue 264, and the conductive layer 262 in the fifth part has a gap with the plastic shell 1. The sixth part is arranged between the middle frame 21 and the plastic battery cover 8 along the oy direction, the insulating substrate 261 in the sixth part is further provided with a protection finger 265 and an elastic piece 266 between the insulating substrate 261 and the middle frame 21, the protection finger 265 is arranged between the insulating substrate 261 and the elastic piece 266, the protection finger 265 is in contact with the conductive layer penetrating the insulating substrate 261 and the elastic piece 266 respectively, the elastic piece 266 is arranged between the protection finger 265 and the middle frame 21, the elastic piece 266 is in contact with the protection finger 265 and the middle frame 21 respectively, the middle frame 21 serves as a grounding end, and the conductive layer 262 in the sixth part has a gap with the plastic battery cover 8.

[0183] The electronic device provided by the embodiment of the present application has a containing space for placing a receiver, so that when static electricity enters the containing space, the distance to the conductive layer is the shortest and the impedance is the smallest, and the conductive layer is isolated from the receiver by the insulating substrate and the non-conductive glue, that is, the conductive layer and the receiver are not conductive, and the conductive layer is also grounded. For static electricity, the shortest impedance path is to directly discharge to the middle frame through the conductive layer, so the static electricity does not hit the receiver, but directly hits the conductive layer, and the conductive layer can protect the receiver from being damaged. The electromagnetic compatibility problem of a series of device hard damage or device function soft failure caused by the electronic device is reduced, and the performance of the electronic device is greatly improved.

[0184] Embodiment 3:

[0185] As shown in Figure 15 , the width h1 of the gap along the ox direction is less than or equal to 2 mm; the height h2 of the gap along the oy direction is 20 μm-40 μm. Figure 16 The gap can be referred to Figure 15 .

[0186] Please refer to Figure 15 and Figure 16The electronic device 01 comprises a first plastic structural member 20, a middle frame 21, a mainboard 22, a sensitive structure 23 and an electrostatic protection structure 26. The first plastic structural member 20 can form a containing space by itself. A gap F is arranged between the first plastic structural member 20 itself and the sensitive structure 23. The middle frame 21 is arranged on the first plastic structural member 20, and all surfaces of the middle frame 21 except one surface are in contact with the first plastic structural member 20. The mainboard 22 is arranged on the surface of the middle frame 21 which is not in contact with the first plastic structural member 20. The mainboard 22 is not in contact with the first plastic structural member 20, and the mainboard 22 is used as a grounding terminal. The sensitive structure 23 is arranged on the side surface of the mainboard 22 which is away from the first plastic structural member 20, and the sensitive structure 23 is not in contact with the first plastic structural member 20.

[0187] Please refer to Figure 15 The electrostatic protection structure 26 is arranged on one side of the sensitive structure 23 along the ox direction, and the electrostatic protection structure 26 is in contact with the sensitive structure 23 and the mainboard 22 respectively.

[0188] Please refer to Figure 16 The electrostatic protection structure 26 covers all surfaces of the sensitive structure 23 and is in contact with the mainboard 22.

[0189] The electronic device provided by the embodiment of the present application has a containing space for placing a sensitive structure. When static electricity enters the containing space, the static electricity is closest to the electrostatic protection structure and has the smallest impedance. The electrostatic protection structure is isolated from the sensitive structure, that is, the electrostatic protection structure and the sensitive structure are not conductive. The electrostatic protection structure is also grounded. For static electricity, the shortest impedance path is to directly leak to the mainboard through the electrostatic protection structure. Therefore, the static electricity does not hit the sensitive structure but directly hits the electrostatic protection structure. The electrostatic protection structure can protect the sensitive structure from being damaged. The electromagnetic compatibility problem of a series of device hard damage or device function soft failure caused by the electronic device is reduced, and the performance of the electronic device is greatly improved.

[0190] Here, only some contents related to the invention points are introduced, and the rest can be obtained by referring to the related art, which will not be described in detail here.

[0191] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, and is not intended to limit the scope of the embodiments of the present application. Those skilled in the art can obviously make various equivalent modifications or changes according to the above examples, for example, some steps in the embodiments of the method can be unnecessary, or some steps can be newly added, etc. The combination of any two / multiple embodiments. The scheme after such modification, change or combination also falls within the scope of the embodiments of the present application.

[0192] It should be understood that the above description of the embodiments of the present application focuses on the differences between the various embodiments, and the same or similar parts not mentioned can be referred to each other, and will not be described here for the sake of brevity.

[0193] It should be understood that the size of the sequence number of the above processes does not mean the order of execution, and the execution order of the processes should be determined according to their functions and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0194] It should also be understood that the division of the modes, cases, categories and embodiments in the embodiments of the present application is only for the convenience of description, and should not constitute a special limitation. The features in various modes, categories, cases and embodiments can be combined without contradiction.

[0195] It should also be understood that in various embodiments of the present application, the terms and / or descriptions of different embodiments are consistent and can be referred to each other if there is no special description and logical conflict. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0196] Finally, it should be pointed out that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: The static electricity protection structure, the sensitive structure, the grounding end and at least one plastic structural member are included, the at least one plastic structural member has a containing space, the sensitive structure and the static electricity protection structure are arranged in the containing space, and the static electricity protection structure is connected with the sensitive structure and the grounding end respectively; a gap is arranged between the at least one plastic structural member and the sensitive structure, the width of the gap is less than or equal to 2 mm, the height of the gap is 20 μm-40 μm, and the gap is used for enabling static electricity to enter the containing space; The static electricity protection structure at least includes an insulating base, a conductive layer, a protection piece, an elastic piece and a reinforcing piece: The insulating base at least partially covers the sensitive structure, and the insulating base is arranged between the conductive layer and the sensitive structure; The conductive layer is arranged on the side of the insulating base away from the sensitive structure, the conductive layer is also electrically connected with the protection piece, the conductive layer is used for receiving static electricity entering the containing space and enabling the static electricity not to contact the sensitive structure, part of the conductive layer penetrates part of the insulating base in a second direction, and the part of the conductive layer penetrating the insulating base is a first conductive layer; The protection piece is arranged between the first conductive layer and the elastic piece, and two ends of the protection piece are respectively abutted with the first conductive layer and the elastic piece; The elastic piece is arranged between the protection piece and the grounding end, and two ends of the elastic piece are respectively abutted with the protection piece and the grounding end; The reinforcing piece is arranged on the surface of the part of the conductive layer away from the insulating base, the reinforcing piece is opposite to the elastic piece in position, and the strength of the reinforcing piece is greater than that of the conductive layer; The conductive layer is conducted through the protection piece, the elastic piece and the grounding end.

2. The electronic device of claim 1, wherein, The thickness of the reinforcing piece is greater than or equal to 0.15 mm.

3. The electronic device of claim 2, wherein, The static electricity protection structure further includes: A bonding layer is arranged between the static electricity protection structure and the sensitive structure, and the bonding layer is used for bonding the static electricity protection structure and the sensitive structure.

4. The electronic device of any of claims 1-3, wherein, The static electricity protection structure further includes: An anti-oxidation layer is arranged on the side of the conductive layer away from the insulating base, and the anti-oxidation layer is used for protecting the conductive layer from being oxidized.

5. The electronic device of claim 4, wherein, The anti-oxidation layer is used for being broken down by static electricity less than 1 kV.

6. The electronic device of any of claims 1-3, wherein, The sensitive structure is a rear camera assembly; The electronic device further comprises a middle frame, a mainboard, a plastic mainboard support and a plastic decoration piece, the mainboard, the plastic mainboard support and the plastic decoration piece are arranged on the same side of the middle frame, the plastic mainboard support and the plastic decoration piece enclose a containing space, the rear camera assembly is arranged in the containing space, the middle frame or the mainboard serves as the grounding end, the plastic decoration piece and the rear camera assembly have the gap, the electrostatic protection structure is sleeved around the rear camera assembly, the electrostatic protection structure is connected with the mainboard or the middle frame, the electrostatic protection structure is arranged between the rear camera assembly and the mainboard and the plastic mainboard support, and the plastic decoration piece is arranged on the side of the plastic mainboard support away from the middle frame.

7. The electronic device of claim 6, wherein, The rear camera assembly comprises a rear camera substrate, a rear camera module, a voice coil motor metal shell and a lens, the rear camera substrate is arranged on one side of the middle frame, the rear camera module and the voice coil motor metal shell are both arranged on the same side of the rear camera substrate away from the middle frame, the rear camera module and the voice coil motor metal shell are connected with the rear camera substrate respectively, the voice coil motor metal shell is sleeved around the rear camera module, the lens is arranged on the side of the rear camera module and the voice coil motor metal shell away from the middle frame, the lens and the plastic decoration piece have the gap, the electrostatic protection structure is arranged between the voice coil motor metal shell and the plastic mainboard support and between the mainboard and the plastic mainboard support, and the electrostatic protection structure is connected with the voice coil motor metal shell and the mainboard respectively.

8. The electronic device of claim 7, wherein, The electrostatic protection structure comprises the insulating base, the conductive layer, a reinforcing piece, a bonding layer, a protection piece and an elastic piece, the whole formed by the insulating base and the conductive layer is divided into a first part, a second part and a third part, the first part, the second part and the third part are connected in sequence, the extension directions of the first part and the third part are the same, and the extension direction of the second part is different from the extension directions of the first part and the third part. The insulating base in the first part and the second part is connected with the voice coil motor metal shell through the bonding layer, the conductive layer has a gap with the plastic mainboard support, the third part is arranged between the plastic mainboard support and the mainboard, the reinforcing piece is arranged between the conductive layer in the third part and the plastic mainboard support, the protection piece is arranged between the conductive layer penetrating the insulating base in the third part and the elastic piece, the elastic piece is arranged between the protection piece and the mainboard, and the mainboard serves as the grounding end.

9. The electronic device of any of claims 1-3, wherein, The sensitive structure is a receiver assembly. The electronic device further comprises a plastic shell, a middle frame, a mainboard, a plastic mainboard support and a plastic battery cover, the plastic shell, the plastic mainboard support and the plastic battery cover form an accommodating space, the middle frame, the mainboard, the earpiece assembly and the electrostatic protection structure are arranged in the accommodating space, the plastic shell and the plastic battery cover have the gap, the middle frame is arranged on one side of the plastic shell, the earpiece assembly and the mainboard are arranged on the same side of the middle frame away from the plastic shell, the plastic mainboard support is arranged on the side of the earpiece assembly and the mainboard away from the middle frame, the plastic battery cover is arranged on the side of the plastic mainboard support away from the middle frame, and the middle frame or the mainboard serves as the grounding end.

10. The electronic device of claim 9, wherein, The electrostatic protection structure comprises the insulating base, the conductive layer, a bonding layer, a protection member and an elastic member, the whole formed by the insulating base and the conductive layer is divided into a fourth part, a fifth part and a sixth part, the fourth part, the fifth part and the sixth part are sequentially connected, the fourth part and the sixth part have the same extension direction, and the extension of the fifth part is different from the extension direction of the fourth part and the sixth part. The fourth part is arranged between the earpiece assembly and the plastic mainboard support, the insulating base in the fourth part and the fifth part are bonded with the earpiece assembly through the bonding layer, the conductive layer in the fourth part is adjacent to the plastic mainboard support and has a gap, the conductive layer in the fifth part has a gap with the plastic shell, the sixth part is arranged between the middle frame and the plastic battery cover, the protection member is arranged between the conductive layer penetrating the insulating base in the sixth part and the elastic member, the elastic member is arranged between the protection member and the middle frame, and the middle frame serves as the grounding end.

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