Optical module

Abstract

The embodiment of the invention provides an optical module, comprising a circuit board, the surface of which is provided with a gap, and the side wall of the gap is provided with a first connecting part; the circuit board is provided with a signal pin area; the light emitting component is located at the notch, the light emitting component comprises an electric connector, the electric connector is provided with a bonding pad area, and the bonding pad area is connected with the signal pin area; wherein a second connecting part is formed on the end face, facing the circuit board, of the electric connector, and the second connecting part is connected with the first connecting part in an embedded mode, so that relative fixed connection between the electric connector and the circuit board is achieved; the carrying part is connected with the light emitting part or the circuit board, and the carrying part is configured to adjust the position of the light emitting part at the notch so as to enable the signal pin area to be flush with the bonding pad area; and the protection component is arranged on the circuit board, and the protection component is configured to protect the connection between the lead mark pin area and the bonding pad area.

Description

optical modules

[0001] This application claims the priority of application number 202321706782.1 filed with the China Patent Office on June 30, 2023; the priority of application number 202311402916.5 filed with the China Patent Office on October 26, 2023; the priority of application number 202321845090.5 filed with the China Patent Office on July 13, 2023; and the priority of application number 202310863127.5 filed with the China Patent Office on July 13, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising:

[0006] A circuit board is formed with a notch on its surface, and a first connecting portion is formed on a sidewall of the notch; the circuit board is provided with a signal pin area;

[0007] a light emitting component, located at the notch, the light emitting component including an electrical connector, the electrical connector having a pad area, the pad area being connected to the signal pin area;

[0008] A second connecting portion is formed on the end surface of the electrical connector facing the circuit board, and the second connecting portion is embedded and connected with the first connecting portion to achieve a relatively fixed connection between the electrical connector and the circuit board;

[0009] a mounting component connected to the light emitting component or the circuit board, wherein the mounting component is configured to adjust the position of the light emitting component at the notch so that the signal pin area is flush with the pad area;

[0010] A protection component is provided on the circuit board, and is configured to protect the connection between the quote pin area and the pad area. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0013] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0014] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0015] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0016] FIG5 is a first structural diagram of an internal structure of an optical module provided according to some embodiments of the present disclosure;

[0017] FIG6 is a second structural diagram of the interior of an optical module provided according to some embodiments of the present disclosure;

[0018] FIG7 is a first assembly diagram of a light receiving component and a circuit board according to some embodiments of the present disclosure;

[0019] FIG8 is a structural diagram 1 of a light receiving component according to some embodiments of the present disclosure;

[0020] FIG9 is a second assembly diagram of a light receiving component and a circuit board according to some embodiments of the present disclosure;

[0021] FIG10 is a second structural diagram of a light receiving component according to some embodiments of the present disclosure;

[0022] FIG11 is a schematic diagram of an optical path of a light receiving component according to some embodiments of the present disclosure;

[0023] FIG12 is a schematic diagram showing the optical path principle of a converging reflective component according to some embodiments of the present disclosure;

[0024] FIG13 is a structural diagram of a support frame provided according to some embodiments of the present disclosure;

[0025] FIG14 is a structural diagram of a converging reflective component provided according to some embodiments of the present disclosure;

[0026] FIG15 is an exploded schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0027] FIG16 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0028] FIG17 is a structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0029] FIG18 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0030] FIG19 is a schematic diagram of an assembly of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0031] FIG20 is a schematic structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0032] FIG21 is a partial cross-sectional diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0033] FIG22 is a structural diagram 1 of an electrical connector provided according to some embodiments of the present disclosure;

[0034] FIG23 is a second structural diagram of an electrical connector provided according to some embodiments of the present disclosure;

[0035] FIG24 is a schematic cross-sectional view of a circuit board according to some embodiments of the present disclosure;

[0036] FIG25 is a cross-sectional view of an assembly of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0037] FIG26 is a schematic diagram of bonding an electrical connector to a circuit board according to some embodiments of the present disclosure;

[0038] FIG27 is a schematic structural diagram of another adapter block provided according to some embodiments of the present disclosure;

[0039] FIG28 is a schematic structural diagram of another adapter block provided according to some embodiments of the present disclosure;

[0040] FIG29 is an exploded schematic diagram of another adapter block according to some embodiments of the present disclosure;

[0041] FIG30 is a second exploded schematic diagram of another adapter block provided according to some embodiments of the present disclosure;

[0042] FIG31 is an exploded schematic diagram of another optical emitting component, optical receiving component, and circuit board according to some embodiments of the present disclosure;

[0043] FIG32 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0044] FIG33 is a schematic structural diagram of a launch housing according to some embodiments of the present disclosure;

[0045] FIG34 is a schematic structural diagram of an electrical connector according to some embodiments of the present disclosure;

[0046] FIG35 is a schematic structural diagram of a pad provided according to some embodiments of the present disclosure;

[0047] FIG36 is a partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0048] FIG37 is a second partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0049] FIG38 is an exploded schematic diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0050] FIG39 is a schematic structural diagram of another launch shell provided according to some embodiments of the present disclosure;

[0051] FIG40 is a third partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0052] FIG41 is a fourth partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0053] FIG42 is an assembly diagram of a first protective cover and a second protective cover according to some embodiments of the present disclosure;

[0054] FIG43 is a cross-sectional view of a first protective cover and a second protective cover according to some embodiments of the present disclosure;

[0055] FIG44 is an exploded view of a first protective cover and a second protective cover according to some embodiments of the present disclosure;

[0056] FIG45 is a schematic diagram of a structure in which a protective cover and a circuit board are disassembled according to some embodiments of the present disclosure;

[0057] FIG46 is a first structural diagram of an upper protective cover and a lower protective cover according to some embodiments of the present disclosure;

[0058] FIG47 is a second structural diagram of an upper protective cover and a lower protective cover according to some embodiments of the present disclosure;

[0059] Figure 48 is a schematic cross-sectional view of a portion of an optical module provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0060] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0061] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0062] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0063] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0064] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0065] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0066] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0067] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0068] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0069] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0070] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0071] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0072] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0073] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0074] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0075] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0076] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0077] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0078] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0079] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0080] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0081] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0082] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located on the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100. The opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the light emitting component 400 and the light receiving component 500 in the optical module 200.

[0083] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0084] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0085] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0086] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0087] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0088] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0089] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0090] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0091] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0092] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0093] Figure 5 illustrates the first internal structure of an optical module according to some embodiments of the present disclosure. As shown in Figure 5 , in some embodiments, a light emitting component 400 and a light receiving component 500 are located on either side of a circuit board 300. The light emitting component 400 includes a cover 401 and a housing 402. The light emitting component 400 includes a first fiber optic adapter, which connects to an optical fiber. The optical transmission signal generated by the light emitting component 400 is transmitted through the first fiber optic adapter.

[0094] In some embodiments of the present disclosure, optical receiving component 500 includes a second optical fiber adapter 503, which is also connected to an optical fiber to receive optical signals transmitted from an external source. Optical receiving component 500 includes an optical demultiplexing assembly 504, a converging lens array 505, a reflector 506, and an optical receiving chip array 507. Optical demultiplexing assembly 504 decomposes the optical signal output from second optical fiber adapter 503 into multiple optical signals. Converging lens array 505 includes multiple converging lenses, one for each optical signal, and converges the optical signals. The photosensitive surface of the optical receiving chip array 507 is parallel to the circuit board 300, that is, the transmission direction of the optical signal received by the optical receiving chip array 507 is perpendicular to the circuit board 300, while the transmission direction of the optical signal output by the converging lens is parallel to the circuit board 300. Therefore, a reflector 506 is provided above the optical receiving chip array 507 in the light emitting direction of the converging lens array 505. The reflector 506 is used to reflect the optical signal output by the converging lens array 505 toward the optical receiving chip array 507, thereby adjusting the transmission direction of the optical signal from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, thereby transmitting the optical signal to the optical receiving chip array 507 to realize the reception of the optical signal.

[0095] In some embodiments, since the reflector 506 needs to be arranged above the light receiving chip array 507, and the light receiving chip array 507 is located on the surface of the circuit board 300, a substrate 502 is also provided on the surface of the circuit board 300, and the optical demultiplexing component 504, the converging lens array 505, and the reflector 506 are arranged on the surface of the substrate 502, so that the light incident surfaces of the optical demultiplexing component 504, the converging lens array 505 and the reflector 506 are located on the same horizontal plane, and it can be ensured that the reflector 506 has a certain distance from the light receiving chip array 507 located below it.

[0096] In some embodiments, the optical receiving component 500 further includes a cover 501 , which covers the surfaces of the optical demultiplexing assembly 504 , the converging lens array 505 , the reflector 506 , and the optical receiving chip array 507 , thereby protecting these optical devices.

[0097] FIG6 is a second structural diagram of an optical module according to some embodiments of the present disclosure. As shown in FIG6 , in some embodiments, a side of the cover 501 close to the second optical fiber adapter 503 is formed with an avoidance groove 5011 to avoid the second optical fiber adapter 503.

[0098] Figure 7 is an assembly diagram of an optical receiving component and a circuit board according to some embodiments of the present disclosure; Figure 8 is a structural diagram of an optical receiving component according to some embodiments of the present disclosure; Figure 9 is an assembly diagram of an optical receiving component and a circuit board according to some embodiments of the present disclosure; and Figure 10 is a structural diagram of an optical receiving component according to some embodiments of the present disclosure. As shown in Figures 7-10, in some other embodiments of the present disclosure, the optical receiving component 500 includes an optical fiber array 511, a support frame 513, a converging reflective component array 512, and an optical receiving chip array 514.

[0099] In some embodiments, the optical fiber array 511 includes several receiving optical fibers to receive multiple optical signals. For example, when the optical module is a 400G optical module, the optical fiber array 511 includes four receiving optical fibers; when the optical module is an 800G optical module, the optical fiber array 511 includes eight receiving optical fibers.

[0100] In some embodiments, a support frame 513 is provided on one side of the optical fiber array 511, and the support frame 513 is used to support the convergent reflective component array 512. The support frame 513 includes an inclined surface 5131, and the convergent reflective component array 512 is provided on the surface of the inclined surface 5131. The inclined surface 5131 is inclined relative to the light emitting direction of the optical fiber array 511. There is a certain distance between the inclined surface 5131 and the surface of the circuit board 300. Exemplarily, the height of the inclined surface 5131 is higher than the height of the surface of the circuit board 300. The inclined surface 5131 has a preset inclination direction, and the height of one end of the inclined surface 5131 close to the optical fiber array 511 is higher than the other end (the end facing away from the optical fiber array 511). Exemplarily, the convergent reflective component array 512 is located on the surface of the inclined surface 5131 facing the light emitting end face of the optical fiber array 511.

[0101] In some embodiments, the converging reflective component array 512 is provided on the surface of the inclined surface 5131. The converging reflective component array 512 includes a plurality of converging reflective components 512a, and one converging reflective component 512a corresponds to one receiving optical fiber. The optical signal transmitted from the receiving optical fiber is incident on the surface of the converging reflective component, and the converging reflective component 512a reflects and converges the optical signal. A curved surface is formed on the surface of the converging reflective component 512a facing the optical fiber array 511, and the curved surface is a functional surface, which has both reflection and convergence functions. The surface of the converging reflective component 512a is formed with a curved surface. Since the converging reflective component 512a is provided on the inclined surface, the curved surface is inclined. As an inclined surface, it can reflect the optical signal output by the optical fiber array; at the same time, the curved surface is recessed relative to the light-emitting end face of the optical fiber array, so that the curved surface can converge the reflected optical signal, and thus the curved surface of the converging reflective component has both reflection and convergence functions. Since the curved surface has both reflection and convergence functions, the optical signal received by the optical fiber array 511 can be reflected toward the optical receiving chip through the curved surface of the converging reflection component 512a, and the optical signal can be converged during the reflection process so that the optical signal is focused on the photosensitive surface of the optical receiving chip.

[0102] In some embodiments, the optical receiving chip array 514 includes a plurality of optical receiving chips, each of which is disposed below the inclined surface 5131. One optical receiving chip corresponds to one converging reflective component 512a to receive the optical signal output by the converging reflective component 512a. Since the converging reflective component 512a is disposed on the inclined surface, the curved surface of the converging reflective component 512a is tilted and faces the optical fiber array 511. The curved surface reflects the optical signal output by the optical fiber array 511 toward each photosensitive surface of the optical receiving chip array 514, thereby achieving reception of the optical signal. In some embodiments, the optical receiving chip array 514 can also be the same optical receiving chip having multiple photosensitive surfaces, which can also achieve reception of multiple optical signals.

[0103] In some embodiments, the support frame 513 is used to support the converging reflective component array 512. The converging reflective component array 512 should be located above the light receiving chip array 514. Therefore, the inclined surface 5131 of the support frame 513 is at a certain height from the surface of the circuit board 300. To ensure that the optical path of the optical fiber array 511 and the optical path of the converging reflective component array 512 are on the same plane, a spacer 516 is provided below the optical fiber array 511 to elevate the optical path of the optical fiber array 511 and ensure that it is on the same plane as the optical path of the converging reflective component array 512.

[0104] In some embodiments, a transimpedance amplifier 515 is provided on one side of the optical receiving chip array 514 . The optical receiving chip is used to convert the optical signal into an electrical signal, and then convert the electrical signal into a voltage signal through the transimpedance amplifier 515 and amplify it.

[0105] In some embodiments, to reduce the overall height of the optical module, a groove 311 is formed on the surface of the circuit board 300, and the spacer 516, the optical receiver chip array 514, and the transimpedance amplifier 515 are all disposed on the surface of the groove 311. When the optical receiver chip array 514 and the transimpedance amplifier 515 are disposed on the surface of the groove 311, their surfaces can be flush with the surface of the circuit board 300, thereby shortening the bonding length between them and the circuit board 300 and improving high-frequency signal transmission performance.

[0106] Figure 11 is a schematic diagram of the optical path of a light receiving component according to some embodiments of the present disclosure. As shown in Figure 11, the four optical signals output by the optical fiber array 511 are transmitted to the surfaces of four converging and reflecting components. The converging and reflecting components reflect the optical signals toward the corresponding photosensitive surfaces of the light receiving chip array 514, thereby achieving optical signal reception.

[0107] The converging and reflecting component 512a deflects the optical path, thereby changing the optical transmission direction from parallel to the surface of the circuit board 300 to perpendicular to the surface. Furthermore, because the optical signal output by the optical fiber array 511 is divergent light, the converging and reflecting component 512a not only reflects the optical signal but also converges it, focusing the optical signal spot on the photosensitive surface. In the present disclosure, both reflection and convergence occur on the surface of the converging and reflecting component 512a, thereby simplifying the optical path structure.

[0108] In the present disclosure, the converging reflective component 512a has both the reflective function and the converging energy, that is, it integrates the reflector and the converging lens into one, and there is no need to set an additional reflector between the optical fiber array 511 and the converging lens, thereby shortening the lateral distance between the optical fiber array 511 and the converging reflective component 512a, making the optical device more compact.

[0109] FIG12 is a schematic diagram of the optical path principle of a converging and reflecting component provided according to some embodiments of the present disclosure. As shown in FIG12 , a curved surface is formed on the surface of the converging and reflecting component 512a. Since the converging and reflecting component 512a is arranged on the inclined surface 5131, the curved surface can reflect the optical signal output by the optical fiber array 511. At the same time, the curved surface is recessed relative to the light-emitting end face of the optical fiber array 511, so the curved surface can converge the reflected optical signal. In the present disclosure, since the curved surface has both a reflective function and a convergent function, the optical signal received by the optical fiber array 511 can be reflected toward the optical receiving chip through the curved surface of the converging and reflecting component 512a, and the optical signal is converged during the reflection process, so that the optical signal is focused on the photosensitive surface of the optical receiving chip. In the present disclosure, the curved surface of the converging and reflecting component 512a has both a reflective function and a convergent function, so there is no need to set an additional reflector on the light-emitting optical path of the optical fiber array, which simplifies the optical path structure and makes the structure more compact.

[0110] FIG13 is a structural diagram of a support frame provided according to some embodiments of the present disclosure. As shown in FIG13 , in some embodiments, the support frame 513 includes a first side panel 5132, a second side panel 5133, and an inclined surface 5131. The first side panel 5132 and the second side panel 5133 are located on two side surfaces, and the inclined surface 5131 is located at the top. The inclined surface 5131 is located between the first side panel 5132 and the second side panel 5133. The first side panel 5132 and the second side panel 5133 are used to support the inclined surface 5131. The first side panel 5132 and the second side panel 5133 have a certain height to lift the inclined surface 5131 to a certain height, so that the converging reflective component 512a provided on the inclined surface 5131 is at a certain distance from the optical receiving chip, so that the converging reflective component 512a can realize the function of converging the optical signal during the reflection process. The inclined surface 5131 faces the optical fiber array 511, and the inclined surface 5131 can provide a certain inclination angle for the converging and reflecting component 512a arranged thereon, while ensuring that the converging and reflecting component 512a can receive the optical signal output by the optical fiber array 511, and also provide a guarantee for the converging and reflecting component 512a to reflect the optical signal.

[0111] It should be noted that an inclined plate is arranged between the first side panel 5132 and the second side panel 5133. The large surface of the inclined plate facing the optical fiber array 511 is the inclined surface 5131. In order to facilitate the adjustment of the inclination degree of the inclined surface 5131, the inclined plate can be rotated and set between the first side panel 5132 and the second side panel 5133. The specific rotation connection method can be riveting, etc., which is not limited here.

[0112] FIG14 is a structural diagram of a converging reflective component provided according to some embodiments of the present disclosure. As shown in FIG14 , in some embodiments, the converging reflective component array 512 includes a converging reflective component 512a, and the converging reflective component 512a includes a curved surface 5121a and a connecting surface 5122a arranged opposite to each other. The curved surface 5121a has both a reflective function and a converging function. The optical signal received by the optical fiber array 511 can be reflected toward the optical receiving chip through the curved surface 5121a, and the optical signal is converged during the reflection process, so that the optical signal is focused on the photosensitive surface of the optical receiving chip. The connecting surface 5122a is fixedly connected to the inclined surface 5131, thereby fixing the converging reflective component 512a to the surface of the inclined surface 5131. The fixed connection method of the connecting surface 5122a and the inclined surface 5131 can be gluing, snapping, threading, etc., which is not specifically limited here.

[0113] In some embodiments, the converging reflective component 512a should have a certain magnification to focus the light spot formed by the light signal on the photosensitive surface of the light receiving chip. Because there is a certain relationship between the magnification of the converging reflective component 512a and the effective focal length of the curved surface 5121a, the curved surface 5121a has a preset effective focal length, thereby satisfying the magnification of the converging reflective component 512a and ultimately focusing the light spot on the photosensitive surface of the light receiving chip.

[0114] In some embodiments, there is a first preset distance between the center of the curved surface 5121a and the light-emitting end face of the optical fiber array 511; there is a second preset distance between the center of the curved surface 5121a and the photosensitive surface of the light receiving chip, and the second preset distance is in a preset multiple relationship with the first preset distance to meet the magnification of the converging reflective component 512a, so that the focusing position of the light spot formed by the light signal received by the light receiving component 500 falls on the photosensitive surface of the light receiving chip.

[0115] In some embodiments, the converging reflective component 512a is configured as a free-form surface reflector, and the curved surface 5121a is a free-form surface. A free-form surface generally refers to an optical functional surface that cannot be expressed using spherical or aspheric coefficients, or cannot be expressed using an exact expression. These surfaces primarily refer to non-rotationally symmetric functional surfaces or functional surfaces that can only be expressed using parameter vectors. Free-form surfaces have greater degrees of freedom than aspheric surfaces, enabling the control of the angle and direction of each light ray according to human needs.

[0116] Exemplarily, the curved surface 5121a is a Zernike standard sag surface.

[0117] The surface sag of the curved surface 5121a is:

[0118] Among them, c is the radius of curvature of the reference point, r is the radial coordinate of the light, k is the coefficient of the quadratic surface, a i are high-order coefficients, is the Zernike polynomial, N is the total number of Zernike polynomials, A i is the coefficient of the i-th Zernike polynomial, ρ is the normalized radius coordinate, is the normalized angular coordinate.

[0119] For example, when a i is 0, then the surface sag of the surface 5121a is:

[0120] The surface 5121a is optimized by using equation (2). For example, the reference point curvature radius of the surface 5121a is -1.83 mm, and the quadratic surface coefficient is 0.861. For example, the "reference point" in the reference point curvature radius refers to the point where the surface 5121a is most concave relative to the light-emitting end face of the optical fiber array 511.

[0121] It is understandable that when the light receiving component 500 including the converging reflective component and the light emitting component 400 are arranged inside the same optical module, the transmitting optical fiber of the light emitting component 400 adopts a transmitting optical fiber array similar to the optical fiber array 511.

[0122] In some embodiments, a notch is formed on the surface of the circuit board, and a first connecting portion is formed on the sidewall of the notch; the circuit board is provided with a signal pin area; a light emitting component is located in the notch, and the light emitting component includes an electrical connector (also known as an adapter block), and the electrical connector is provided with a pad area, and the pad area is connected to the signal pin area; wherein a second connecting portion is formed on the end surface of the electrical connector facing the circuit board, and the second connecting portion is embedded and connected with the first connecting portion to achieve a relatively fixed connection between the electrical connector and the circuit board. A mounting component is connected to the light emitting component or the circuit board, and the mounting component is configured to adjust the position of the light emitting component in the notch so that the signal pin area is flush with the pad area; a protective component is provided on the circuit board, and the protective component is configured to protect the connection between the pin area and the pad area.

[0123] In one example, the pad area of ​​the electrical connector may include a first metal area and a second metal area. The first metal area needs to be flush with the upper surface of the circuit board, and the second metal area needs to be flush with the lower surface of the circuit board to facilitate wire connection between the two.

[0124] In one example, the pad area includes a first high-frequency metal layer and a second high-frequency metal layer. The first high-frequency metal layer is located inside the tube shell and connected to the optical transmission component; the second high-frequency metal layer is located outside the tube shell and connected to the circuit board by wire bonding.

[0125] In one example, the protective component can be a first protective cover and a second protective cover with simple structures. The first protective cover protects the bonding wires between the first metal area and the upper surface of the circuit board, and the second protective cover protects the bonding wires between the second metal area and the lower surface of the circuit board.

[0126] Of course, the protective component can also be an upper protective cover and a lower protective cover, and the upper and lower protective covers are provided with avoidance grooves, so that the wiring connection part of the electrical connector and the circuit board is conveniently located in the avoidance grooves.

[0127] It should be understood that the mounting component is mainly used to support the light emitting component. The mounting component can be set on the light emitting component, or on the circuit board, or on both the light emitting component and the circuit board. It is mainly used to adjust the position of the electrical connector on the light emitting component relative to the surface of the circuit board, thereby facilitating wiring connection between the two.

[0128] In one example, the mounting component can be a first overlapping portion and a second overlapping portion protruding from the sidewall of the tube housing; specifically, a first ridge and a second ridge provided on the sidewall of the tube housing. Alternatively, the mounting component can be a plurality of supporting portions connected to a circuit board, capable of supporting the light emitting component, thereby facilitating bonding of the electrical connector to the circuit board surface.

[0129] The specific connection between the first connecting portion and the second connecting portion, the wire bonding connection between the signal pin area and the pad area, the structure and setting of the mounting component, and the structure and setting of the protection component can be understood through the following examples.

[0130] Figure 15 is a schematic diagram of an optical emission component and a circuit board according to some embodiments of the present disclosure. Figure 16 is a schematic diagram of an optical emission component according to some embodiments of the present disclosure; Figure 17 is a structural diagram of an optical emission component according to some embodiments of the present disclosure; and Figure 18 is a schematic diagram of an optical emission component according to some embodiments of the present disclosure. As shown in Figures 15 to 18, in some embodiments, the optical emission component 400 includes a cover 401 and a tube shell 402. A first optical fiber adapter 403 is provided at one end of the tube shell 402, and the first optical fiber adapter 403 is used to transmit the optical signal generated by the optical emission component 400. A laser chip array, a lens 408, and an optical multiplexing component 405 are respectively provided inside the tube shell 402. The laser chip array includes a plurality of laser chips 407.

[0131] Laser chip 407 emits a diverging optical signal, which is then converged into a convergent optical beam by lens 408. The laser chip array emits multiple optical signals, which are then incident on optical multiplexing assembly 405. Multiplexing assembly 405 combines the multiple optical signals into a single optical signal, which is then output through first fiber optic adapter 403.

[0132] In some embodiments, a support block 404 is provided between the cover plate 401 and the optical multiplexing assembly 405. One surface of the support block 404 is connected to the cover plate 401, and the other surface is connected to the optical multiplexing assembly 405, thereby connecting the optical multiplexing assembly 405 to the cover plate 401. This position of the optical multiplexing assembly 405 closer to the upper housing 201 facilitates heat dissipation from the optical multiplexing assembly 405. Furthermore, in some embodiments, the rigidity of the cover plate 401 is greater than that of the tube housing 402. Connecting the optical multiplexing assembly 405 to the cover plate 401 further enhances the stability of the optical path.

[0133] In some embodiments, the light emitting component 400 further includes a semiconductor cooler (TEC) 406. One surface of the TEC 406 is connected to the cover plate 401, and the other surface is used to support the laser chip array and lens 408. Similarly, in this case, the laser chip array and lens 408 are closer to the upper housing 201, which is more conducive to heat dissipation of the laser chip array and lens 408. At the same time, in some embodiments, the rigidity of the cover plate 401 is greater than the rigidity of the tube shell 402. In this way, connecting the laser chip array and lens 408 to the cover plate 401 can also help increase the stability of the optical path.

[0134] In some embodiments, the light emitting component 400 further includes an electrical connector 409 . The electrical connector 409 is disposed at an end of the tube shell 402 . The electrical connector 409 is used to electrically connect the laser chip array and the circuit board 300 .

[0135] As shown in FIG. 15 and FIG. 16 , in some examples, the circuit board 300 is provided with a notch 302 , which may also be referred to as a first avoidance hole, and the light emitting component is located in the first avoidance hole.

[0136] In some embodiments, the optical fiber adapter 403 has a second high-frequency signal line (located in the solder pad area) on the upper surface of the electrical connector, and a second low-frequency signal line (located in the solder pad area) on the lower surface of the electrical connector. One end of the electrical connector is located inside the housing 402, and the other end is located outside the housing 402. The electrical connector 409 is connected to the circuit board 300 via a metal wire.

[0137] Typically, the metal wires connecting an electrical connector to a circuit board protrude from the circuit board's surface, making them susceptible to contact and pressure from external objects, leading to poor connection. To protect these wires, a protective cover is installed on the circuit board. This cover sits above the wires to prevent external objects from coming into contact with them, preventing them from breaking under stress or causing external conductive material to fall between the wires and cause a short circuit.

[0138] For the convenience of description, in the embodiment of the present application, the length direction of the circuit board is referred to as the X direction, the width direction of the circuit board is referred to as the Y direction, and the direction perpendicular to the circuit board is referred to as the Z direction.

[0139] Figure 19 is a schematic diagram illustrating the assembly of a light emitting component and a circuit board, according to some embodiments of the present disclosure. As shown in Figure 19, in some embodiments, the sidewalls of the tube housing 402 are formed with a first overlapping portion 4021 and a second overlapping portion 4022. The first overlapping portion 4021 and the second overlapping portion 4022 are respectively overlapped with the surface of the circuit board 300, thereby connecting the light emitting component 400 to the circuit board 300.

[0140] FIG20 is a schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure. As shown in FIG20 , in some embodiments, a notch 302 is formed through the surface of the circuit board 300, and the first overlapping portion 4021 and the second overlapping portion 4022 of the tube shell 402 are respectively overlapped on the surface of the notch 302. The notch 302 includes a first notch portion 3021 and a second notch portion 3022. The first notch portion 3021 is used to avoid the first optical fiber adapter 403, and the second notch portion 3022 is used to avoid the tube shell 402. The first overlapping portion 4021 and the second overlapping portion 4022 are respectively overlapped on the surface of the second notch portion 3022 to place the light emitting component 400 in the notch of the circuit board, thereby realizing the connection between the light emitting component 400 and the circuit board 300.

[0141] In some embodiments, the intermediate structure of the housing 402 is embedded in the notch 302, and the upper surface of the housing 402 protrudes relative to the upper surface of the circuit board 300, that is, the upper surface of the housing 402 is exposed relative to the upper surface of the circuit board 300. Similarly, the lower surface of the housing 402 protrudes relative to the lower surface of the circuit board 300, that is, the lower surface of the housing 402 is exposed relative to the lower surface of the circuit board 300. The first overlapping portion 4021 and the second overlapping portion 4022 of the housing 402 then overlap the surfaces of the notch 302, thereby achieving a connection between the housing 402 and the circuit board 300.

[0142] It should be noted that in order to facilitate the embedding of the tube shell 402 in the notch 302 of the circuit board 300 through the first overlapping portion 4021 and the second overlapping portion 4022, a limiting groove can be constructed at a position close to the notch 302 on the circuit board 300. The shape of the limiting groove can be adapted to the first overlapping portion 4021 and / or the second overlapping portion 4022. This setting can also prevent the tube shell 402 from moving relative to the circuit board 300, thereby facilitating the subsequent wiring connection between the optical emitting component and the circuit board 300.

[0143] Figure 21 is a partial cross-sectional diagram of an optical transmission component and a circuit board according to some embodiments of the present disclosure. As shown in Figures 16 and 21, a fixing surface 4101 is provided on the top of the housing 402, and the cover 401 is fixedly connected to the fixing surface 4101. A first through hole 4103 is provided in the housing 402, which communicates with the inner cavity of the housing 402 and is connected to the optical fiber adapter 403.

[0144] In some embodiments, the optical transmission assembly includes a first isolator. Exemplarily, the first isolator is disposed in the first through hole 4103 , and the first isolator seals the first through hole 4103 , thereby preventing external optical signals from entering the tube housing 402 .

[0145] In some embodiments, an electrical connector 409 is provided at the opposite end of the first through hole 4103 of the tube shell 402, with one side of the electrical connector 409 inserted into the tube shell 402 and the other side exposed outside the tube shell 402, so that the tube shell 402, the cover plate 401 and the electrical connector are assembled to form a second cavity.

[0146] The outer wall of the tube shell 402 is provided with a ridge that protrudes from the outer wall of the launch shell. The lower surface of the ridge is connected to the upper surface of the circuit board to limit the launch shell on the circuit board. In some embodiments, the tube shell 402 has a first ridge 4111 and a second ridge 4112, wherein the first ridge 4111 and the second ridge 4112 are symmetrically arranged on the outer wall of the tube shell 402. The first ridge 4111 is located on the first side wall 4413 of the tube shell 402, and the first side wall 4113 is adjacent to the side wall where the first through hole 4103 is located. The second ridge 4112 is located on the second side wall 4114 of the launch shell, and the second side wall 4114 is located on the opposite side of the first side wall 4113. For example, the ridge is integrally formed with the launch shell.

[0147] A laser chip 407 and a lens 408 are disposed within the tube shell 402. In this example, the laser chip 407 is hoisted on the bottom of the cover plate 401 for heat dissipation.

[0148] One end of the electrical connector 409 located inside the transmitting shell is connected to each laser of the laser chip 407 through a gold wire, and the other end of the electrical connector 409 located outside the transmitting shell is connected to the circuit board through a gold wire, transferring the electrical signals, working signals, etc. generated by the circuit board 300 to each laser to drive each laser to emit laser beams of different wavelengths.

[0149] In order to achieve electrical connection between the inside and outside of the shell through the electrical connector 409, a metal layer is plated on the electrical connector 409. Signal pads and ground pads are provided on the metal layer of the electrical connector 409 located on the inner side of the shell. Signal pads and ground pads are also provided on the metal layer of the electrical connector 409 located on the outer side of the shell. The signal pads inside and outside the electrical connector 409 are connected to achieve electrical connection between the inside and outside of the electrical connector 409, thereby realizing the transfer of electrical signals, working signals, etc. through the electrical connector 409.

[0150] Figure 22 is a first structural diagram of an electrical connector according to some embodiments of the present disclosure; Figure 23 is a second structural diagram of an electrical connector according to some embodiments of the present disclosure. As shown in Figures 22 and 23, in some embodiments, one end of the electrical connector 409 extends into the interior of the tube housing 402, and the other end has a boss 4095a, which is located outside the tube housing 402.

[0151] A third metal region 4092 and a fourth metal region 4093 are formed on the surface of the electrical connector 409 that extends into the interior of the tube housing 402. One end of each of the third and fourth metal regions 4092 and 4093 is electrically connected to the laser chip. For example, the third and fourth metal regions 4092 and 4093 are arranged in a stepped pattern. The third metal region 4092 is used to transmit high-frequency signals, while the fourth metal region 4093 is used to transmit low-frequency signals.

[0152] The upper and lower surfaces of boss 4095a are respectively formed with a first metal region 4095 and a second metal region 4096. First metal region 4095 is electrically connected to the other end of third metal region 4092 for transmitting high-frequency signals, while second metal region 4096 is electrically connected to the other end of fourth metal region 4093 for transmitting low-frequency signals.

[0153] The first metal region 4095 is flush with the upper surface of the circuit board 300, and the second metal region 4096 is flush with the lower surface of the circuit board 300. The first metal region 4095 is wire-bonded to the upper surface of the circuit board 300, and the second metal region 4096 is wire-bonded to the lower surface of the circuit board 300.

[0154] In some embodiments, when inserting or removing an optical module, the circuit board deforms due to force, causing relative displacement between the electrical connector 409 and the circuit board 300 due to disconnection. This exerts a certain pulling force on the gold wire, causing it to break, etc. To enhance the stability of the connection between the electrical connector 409 and the circuit board 300, a second connecting portion is formed on the end of the boss 4095a facing the circuit board 300. This second connecting portion engages with the first connecting portion described below, securing the electrical connector 409 on the circuit board 300, thereby enhancing the stability of the connection between the electrical connector 409 and the circuit board 300.

[0155] FIG24 is a schematic diagram of the cross-sectional structure of a circuit board provided according to some embodiments of the present disclosure; FIG25 is a cross-sectional diagram of the assembly of an optical emitting component and a circuit board provided according to some embodiments of the present disclosure. As shown in FIG24 and FIG25, in some embodiments, the circuit board 300 includes a notch 302, and the side wall of the notch 302 is formed with a first connecting portion, and the first connecting portion is embedded and connected with the second connecting portion to achieve a relatively fixed connection between the electrical connector and the circuit board, thereby reducing the relative displacement between the electrical connector and the circuit board when plugging and unplugging the optical module, thereby reducing the pulling on the gold wire, avoiding the breakage of the gold wire, and ensuring the quality of high-frequency signal transmission. At the same time, through the fixed connection between the first connecting portion and the second connecting portion, it can be ensured that the wire bonding end face of the electrical connector is flush with the wire bonding end face of the circuit board, so as to avoid the wire bonding end face being misaligned due to other external forces, providing a relatively stable platform for wire bonding, thereby ensuring the quality of high-frequency signal transmission.

[0156] In some embodiments, the bonding end face of the electrical connector 409 and the bonding end face of the circuit board 300 may shift or pry due to machining tolerances, other external forces, etc., thereby making the bonding platform unstable. When the end face of the electrical connector 409 is formed with a second connection portion and the end face of the circuit board 300 is formed with a first connection portion, the relative fixed connection between the first connection portion and the second connection portion can ensure that the bonding end face of the electrical connector is flush with the bonding end face of the circuit board, thereby preventing the bonding end face from shifting due to other external forces, providing a relatively stable platform for bonding, and thus ensuring the quality of high-frequency signal transmission.

[0157] In some embodiments of the present disclosure, the connection between the first and second connecting portions may be a recessed connection, although other connection methods are also possible. When the first and second connecting portions are recessed, in some embodiments, the first connecting portion may be a protruding portion, while the second connecting portion may be a recessed portion; in some embodiments, the first connecting portion may be a recessed portion, while the second connecting portion may be a protruding portion.

[0158] In some embodiments, because the material of circuit board 300 is relatively soft, if the first connection portion formed by the sidewall of notch 302 is a protrusion, the protrusion's soft material results in insufficient support force to support the end face of electrical connector 409, thereby reducing the stability of the connection between circuit board 300 and electrical connector 409. In some embodiments, to ensure the support force of the protrusion formed on the sidewall of notch 302, the thickness of circuit board 300 and the protrusion should be sufficiently large to ensure sufficient support force. At the same time, the hollowing size of the recessed portion on the end face of electrical connector 409 will be relatively large, increasing the difficulty of manufacturing circuit board 300 and electrical connector 409. Based on the above considerations, the first connection portion formed by the sidewall of notch 302 is configured as recessed portion 303, and the second connection portion formed by the end face of electrical connector 409 is configured as protrusion 4091. Recessed portion 303 and protrusion 4091 form a mortise and tenon fit, achieving a relatively fixed connection between circuit board 300 and electrical connector 409. For example, a recessed portion 303 is formed on the side of the notch 302 close to the gold finger 301. In other words, a recessed portion 303 is formed at the notch 302 where the electrical connector 409 is connected to the circuit board 300. By providing a protrusion on the electrical connector 409 and plugging it into the recessed portion, it can be further ensured that the bonding end face of the electrical connector is flush with the bonding end face of the circuit board, thereby avoiding misalignment of the bonding end face due to other external forces.

[0159] In some embodiments, the protrusion 4091 is embedded in the recess 303 to achieve a relatively fixed connection between the electrical connector 409 and the circuit board 300. This reduces relative movement between the electrical connector 409 and the circuit board 300 when inserting and removing the optical module, thereby reducing the pull on the gold wire, preventing the gold wire from breaking, and ensuring the quality of high-frequency signal transmission. At the same time, the fixed connection between the recess 303 and the protrusion 4091 can ensure that the bonding end face of the electrical connector 409 is flush with the bonding end face of the circuit board 300, preventing the bonding end face from being misaligned due to other external forces, providing a relatively stable platform for bonding, and thus ensuring the quality of high-frequency signal transmission.

[0160] In some embodiments, the protrusion 4091 is configured as a flange and the recess 303 is configured as a groove, and the two are matched in a concave-convex manner. The shapes of the protrusion 4091 and the recess 303 match each other. For example, the shapes of the protrusion 4091 and the recess 303 are both trapezoidal, but other shapes are also possible.

[0161] In some examples, the second connection portion formed on the end surface of the electrical connector 409 can be a U-shaped claw structure, and the second connection portion formed at the notch of the circuit board 300 can be a positioning groove that communicates with the notch. More specifically, the positioning groove is formed on the upper and lower surfaces of the circuit board 300. Then, the two claw arms of the claw structure are arranged one above the other, and the claw structure can extend into the positioning groove, thereby fixing the electrical connector 409 relative to the circuit board 300. This can ensure that the wiring end surface of the electrical connector 409 is flush with the wiring end surface of the circuit board 300, thereby preventing the wiring end surfaces from being misaligned due to other external forces.

[0162] In addition, in order to prevent the claw structure from affecting the wiring connection between the electrical connector 409 and the circuit board 300, the claw structure can be set at the edge of the boss of the electrical connector 409. In order to further ensure the relative stability of the electrical connector 409 and the circuit board 300, a U-shaped claw structure can be set on each side edge of the boss. The positioning groove formed at the notch can be set according to the number and position of the claw structure, which will not be repeated here.

[0163] Figure 26 is a schematic diagram illustrating bonding an electrical connector to a circuit board according to some embodiments of the present disclosure. As shown in Figure 26 , first metal region 4095 is flush with the top surface of circuit board 300, and second metal region 4096 is flush with the bottom surface of circuit board 300. First metal region 4095 is bonded to the top surface of circuit board 300, while second metal region 4096 is bonded to the bottom surface of circuit board 300.

[0164] Figure 27 is a schematic diagram of the structure of another electrical connector provided according to some embodiments of the present disclosure. Figure 28 is a schematic diagram of the structure of another electrical connector provided according to some embodiments of the present disclosure. Figures 27 and 28 illustrate the electrical connector from different angles. Figure 29 is a first exploded schematic diagram of another electrical connector provided according to some embodiments of the present disclosure. Figure 30 is a second exploded schematic diagram of another electrical connector provided according to some embodiments of the present disclosure. As shown in Figures 27, 28, 29, and 30, electrical connector 409 includes a first adapter board 4131, a second adapter board 4132, and a third adapter board 4133. A first high-frequency metal layer 41311 is provided on the lower surface of the first adapter board 4131. This first high-frequency metal layer 41311 is electrically connected to the laser assembly, transmitting high-speed signals from the circuit board to the laser assembly. In this example, the first high-frequency metal layer 41311 of the first adapter board 4131 is located inside the transmitting housing.

[0165] The second adapter plate 4132 is located below the first adapter plate 4131, forming a stepped surface with the first adapter plate 4131. The second adapter plate 4132 does not cover the first high-frequency metal layer 41311, leaving it exposed inside the launch housing and facilitating electrical connection between the first high-frequency metal layer 41311 and the laser assembly. A first low-frequency metal layer 41324 is provided on the lower surface of the second adapter plate 4132. This layer is electrically connected to the laser assembly, transmitting low-speed signals from the circuit board to the laser assembly.

[0166] The lower surface of the first adapter plate 4131 is flush with the lower surface of the laser assembly, reducing the length of the connecting line between the first high-frequency metal layer 41311 and the signal line of the laser assembly, thereby reducing signal loss. A positioning portion 41312 is provided on the lower surface of the first adapter plate 4131. The second adapter plate 4132 is fixedly connected to the positioning portion 41312, facilitating the installation of the first adapter plate 4131 and the second adapter plate 4132.

[0167] For example, positioning portion 41312 includes a first positioning post 41313 and a second positioning post 41314. The first positioning post protrudes from the bottom surface of first adapter plate 4131 and is not located at the edge of first adapter plate 4131. In other words, a certain gap exists between first positioning post 41313 and the edge of first adapter plate 4131, facilitating the positioning and installation of second adapter plate 4132. The second positioning post protrudes from the bottom surface of first adapter plate 4131, and second positioning post 41314 is not located at the edge of first adapter plate 4131.

[0168] In some embodiments, the lower surface of the first adapter plate 4131 is a surface facing the lower housing.

[0169] The second adapter plate 4132 has a first stopper 41321 and a second stopper 41322 extending into the interior of the tube housing 402. The second adapter plate 4132 has a third stopper 41323 that protrudes from the bottom surface of the second adapter plate 4132. The bottom surface of the third stopper 41323 is flush with the bottom surfaces of the first positioning post 41313 and the second positioning post 41314.

[0170] The inner wall of the first limiting portion 41321 contacts and connects with the first positioning post 41313, which defines the position of the first limiting portion 41321 relative to the first adapter plate 4131. The inner wall of the second limiting portion 41322 contacts and connects with the second positioning post 41314, which defines the position of the second limiting portion 41322 relative to the first adapter plate 4131. The first limiting portion 41321 and the second limiting portion 41322 define the front-to-back positioning of the first adapter plate 4131 and the second adapter plate 4132. The front-to-back direction is the Y direction in the figure.

[0171] The sidewall at one end of the third position-limiting portion 41323 contacts and connects with the first positioning post 41313, which defines the X-direction position of the second adapter plate 4132. The sidewall at the other end of the third position-limiting portion 41323 contacts and connects with the second positioning post 41314, which defines the X-direction position of the second adapter plate 4132.

[0172] The lower surface of the second adapter plate 4132 has a second low-frequency metal layer 41325, with the third stopper located between the first and second low-frequency metal layers 41325. The upper surface of the second adapter plate 4132 has a second high-frequency metal layer 41326. The first and second low-frequency metal layers are electrically connected, while the first and second high-frequency metal layers 41311 and 41326 are electrically connected. The second low-frequency metal layer 41325 and the second high-frequency metal layer 41326 are located outside the launch shell.

[0173] The upper surface of the circuit board has high-speed pins, which are connected to the second high-frequency metal layer 41326 by wire bonding to provide high-speed signals for the optical transmission component; the lower surface of the circuit board has low-speed pins 306, which are connected to the second low-frequency metal layer 41325 by wire bonding to provide low-speed signals for the optical transmission component.

[0174] In some embodiments, the thickness of the circuit board is the same as or similar to the thickness of the second adapter plate 4132 , so that the metal wire between the circuit board and the second adapter plate 4132 can be shortened as much as possible to reduce loss.

[0175] The thickness of the circuit board is the same as or similar to that of the second adapter plate 4132 , and the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 can be greater than or equal to 0.95, and the ratio of the thickness of the circuit board to the thickness of the second adapter plate 4132 can be less than or equal to 1.2.

[0176] The third adapter plate 4133 surrounds the first low-frequency metal layer 41324 and is connected to the third adapter plate 4133. For example, the third adapter plate 4133 includes a limiting body 41331 and a first limiting plate 41332 and a second limiting plate 41333 extending into the interior of the launch shell. The two limiting plates are located on either side of the limiting body. The first limiting plate 41332 is in contact with a first positioning post, which defines the X-direction position of the second adapter plate 4132. The second limiting plate 41333 is in contact with a second positioning post, which defines the X-direction position of the second adapter plate 4132.

[0177] The third transfer plate 4133 defines a relief opening 41334 , and the third limiting portion 41323 abuts against a sidewall of the relief opening 41334 .

[0178] Figure 31 is an exploded schematic diagram of another optical transmitter, optical receiver, and circuit board according to some embodiments of the present disclosure. As shown in Figure 31 , circuit board 300 has a notch 302, within which the optical transmitter is positioned. Both the optical transmitter and the optical receiver are located on the top surface of the circuit board. The optical module also has a backing plate 420, upon which the optical transmitter is positioned, with a portion of the backing plate 420 positioned below the circuit board corresponding to the optical receiver.

[0179] In some embodiments, the notch 302 is located on one side of the circuit board, with its opening communicating with the outside. A signal pin area is provided on the circuit board, and the light emitting component is wiredly connected to the signal pin area. A narrow plate area 330 is located on one side of the notch 302, juxtaposed with the notch 302 in the width direction of the circuit board. The light receiving component 500 is located in the narrow plate area 330.

[0180] The width of the narrow board area 330 is less than or equal to 1 / 3 of the width of other areas of the circuit board 300 .

[0181] Figure 32 is an exploded schematic diagram of an optical transmitter component according to some embodiments of the present disclosure; Figure 33 is a schematic diagram of the structure of a transmitter housing according to some embodiments of the present disclosure. As shown in Figures 32 and 33, the optical transmitter component includes a housing 402 and an electrical connector 409. A first through-hole 4103 is provided on one sidewall of the housing 402, and electrical connector 409 is provided on the sidewall opposite the first through-hole 4103. Housing 402 houses the optical transmitter assembly.

[0182] By way of example, housing 402 is a transmitting housing, housing an optical transmission assembly including a laser array 407, a lens 408, and an optical multiplexing assembly 405. Laser array 407 emits light of varying wavelengths, each of which is sequentially processed by a converging lens in lens 408, transitioning from a divergent state to a convergent state. Multiplexing assembly 405 then combines the light of varying wavelengths into a single beam. This light is then collimated by a collimating lens in optical fiber adapter 403, converted into parallel light, and emitted from housing 402 as parallel light.

[0183] As shown in FIG. 33 , a first through hole 4103 is provided on the tube shell 402 . The first through hole 4103 communicates with the inner cavity of the tube shell 402 , and the first through hole 4103 is connected to the optical fiber adapter 403 .

[0184] The tube shell 402 is provided with a first opening 4101 , and the first through hole 4103 and the first opening 4101 are respectively located on opposite sides of the transmitting shell.

[0185] In some embodiments, electrical connector 409 is located at first opening 4101. One side of electrical connector 409 is inserted into tube housing 402, while the other side is exposed outside tube housing 402, so that tube housing 402 and electrical connector are assembled to form a light emitting cavity. One end of electrical connector 409 located inside the emitting housing is connected to laser array 407 via gold wire, while the other end of electrical connector 409 located outside the emitting housing is connected to the circuit board via gold wire. This transfers electrical signals and operating signals generated by circuit board 300 to laser array 407, thereby driving each laser to emit laser beams of different wavelengths.

[0186] In some embodiments, the housing bottom 4102 of the tube housing 402 is connected to the electrical connector 409 to support the electrical connector 409. The lower surface of the electrical connector 409 is higher than the housing bottom 4102.

[0187] Figure 34 is a schematic diagram of the structure of an electrical connector provided according to some embodiments of the present disclosure. As shown in Figure 34, the surface of the electrical connector 409 located inside the housing 402 is formed with a first pad area 431, and the surface of the electrical connector 409 located outside the housing 402 is formed with a second pad area 432. The first pad area 431 and the second pad area 432 are electrically connected, thereby enabling signal transmission within and outside the housing 402, including the transmission of low-frequency and high-frequency signals. The second pad area 432 includes low-frequency signal lines and high-frequency signal lines. The low-frequency signal lines are used to transmit low-frequency signals, while the high-frequency signal lines are used to transmit high-frequency signals.

[0188] The circuit board 300 has a signal pin area on its surface. This area includes pads for transmitting both low-frequency and high-frequency signals. Bonding is performed between the signal pin area and the second pad area 432, thereby enabling transmission of both low-frequency and high-frequency signals between the circuit board and the electrical connector 409. When the signal pin area and the second pad area 432 are flush, bonding time is shortened, resulting in improved high-frequency signal transmission quality.

[0189] In order to provide a certain support force for the metal bond between the tube shell 402 and the electrical connector 409, the pad 420 has a first support portion 421, a second support portion 422 and a third support portion 423. For example, the first support portion 421, the second support portion 422 and the third support portion 423 are an integrated structure.

[0190] The thickness of the electrical connector 409 is greater than that of the circuit board 300. To shorten the length of the metal wires between the electrical connector 409 and the signal pin area, a second support portion 422 is provided between the signal pin area and the lower housing. The second support portion 422 elevates the signal pin area so that the upper surface of the electrical connector 409 is flush with the upper surface of the signal pin area.

[0191] In some embodiments, the upper surface of the electrical connector 409 being flush with the upper surface of the signal pin area means that the height difference between the upper surface of the electrical connector 409 and the upper surface of the signal pin area is less than 0.2 mm.

[0192] Figure 35 is a schematic diagram of the structure of a backing plate provided according to some embodiments of the present disclosure. As shown in Figure 35 , the upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board to support the circuit board. The upper surface of the second support portion 422 protrudes from the upper surface of the first support portion 421 and is located below the signal pin area. The second support portion 422 supports the circuit board so that the signal pin area and the second pad area 432 are coplanar.

[0193] The second support portion 422 is located on one side of the first support portion 421, and the third support portion 423 is located on a side adjacent to the second support portion 422. The light receiving component 500 is located within the projection range of the third support portion 423. The width of the circuit board 300 at the position where the notch 302 is provided is narrow, which causes the circuit board to be easily deformed under force. The third support portion 423 is located on one side of the notch 302, and the third support portion 423 reinforces the narrow plate area 330 of the circuit board. At the same time, the light receiving component is connected to the circuit board, the upper surface of the third support portion 423 is connected to the circuit board, and the lower surface of the pad 420 is connected to the lower shell, which increases the heat dissipation effect of the light receiving component and the light receiving component.

[0194] For example, the third supporting portion 423 has an escape groove 4231 , and the escape groove 4231 accommodates the electrical components on the circuit board.

[0195] In some embodiments, the second support portion 422 is located below the signal pin area. The hardness of the second support portion 422 is greater than the hardness of the circuit board, providing rigid support for the metal of the signal pin area and the second pad area 432 .

[0196] Figure 36 is a partial cross-sectional schematic diagram (I) of an optical emitting component and a circuit board according to some embodiments of the present disclosure. Figure 37 is a partial cross-sectional schematic diagram (II) of an optical emitting component and a circuit board according to some embodiments of the present disclosure. As shown from different angles in Figures 36 and 37, the upper surface of the second solder pad area 432 of the electrical connector 409 is higher than the upper surface of the second support portion 422, so that the signal pin area and the second solder pad area 432 are located in the same plane. The signal pin area and the second solder pad area 432 are connected via wire bonding, which helps reduce impedance.

[0197] In some embodiments, the second support portion, the third support portion and the circuit board are glued and fixed, and the first support portion and the shell bottom 4102 can be glued or welded.

[0198] In some embodiments, to reduce the length of the gold wire between the electrical connector 409 and the circuit board 300, the sidewalls of the electrical connector 409 abut against the sidewalls of the second support portion 422. The lower surface of the electrical connector 409 is higher than the shell base 4102, and the second solder pad area 432 of the electrical connector 409 is located outside the launch shell. A first gap 424 is formed between the shell base 4102 and the second support portion 422. The first gap 424 receives excess solder or glue during soldering between the launch shell and the first support portion 421, preventing the launch shell from tilting due to excessive solder or glue, thereby improving coupling efficiency. The second solder pad area 432 is located above the first gap 424, and the sidewalls of the electrical connector 409 abut against the sidewalls of the second support portion 422. The sidewalls of the tube shell 402 are connected to the third support portion 423.

[0199] The third support portion 423 is connected to the lower surface of the circuit board, providing support for the circuit board 300. The light receiving component is also connected to the circuit board, and the upper surface of the third support portion 423 is also connected to the circuit board. The lower surface of the backing plate 420 is connected to the lower housing, and the backing plate 420 is thermally connected to the light emitting component, increasing the heat dissipation area and improving the heat dissipation effect of the light receiving and light emitting components.

[0200] In the present disclosure, the circuit board 300 is provided with a notch 302, and the light emitting component is located within the notch. The light emitting component and the light receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, on which the light emitting component is located, and a portion of the pad 420 is located below the circuit board corresponding to the light receiving component. An electrical connector is provided at one end of the light emitting component, and a second solder pad area 432 of the electrical connector protrudes from the outside of the transmitting shell. The second solder pad area 432 is wired to the signal pin area of ​​the circuit board to reduce impedance and improve signal transmission quality. The pad includes a first support portion, a second support portion, and a third support portion. The bottom of the transmitting shell is welded to the first support portion, the second support portion is located below the signal pin area, and the third support portion is located below the circuit board below the light receiving component. The upper surfaces of the second and third support portions are higher than the upper surface of the first support portion. The bottom of the transmitting shell is located between the pad and the electrical connector, and the electrical connector is in contact with one side of the second support portion.

[0201] There is a first gap 424 between the shell bottom and the second support portion to absorb the overflow welding between the launch shell and the first support portion 421. There is a second gap 425 between the shell bottom and the third support portion 423 to absorb the overflow welding between the launch shell and the first support portion 421.

[0202] Figure 38 is an exploded schematic diagram of another optical transmitter according to some embodiments of the present disclosure. As shown in Figure 38, the optical transmitter comprises a housing 402 and an electrical connector 409. A first through-hole 4103 is defined on one side of the housing 402, and electrical connector 409 is located on the side opposite the first through-hole 4103. The optical transmitter assembly is housed within the transmitter housing 410b.

[0203] By way of example, housing 402 is a transmitting housing, housing an optical transmission assembly including a laser array 407, a lens 408, and an optical multiplexing assembly 405. Laser array 407 emits light of varying wavelengths, each of which is sequentially processed by a converging lens in lens 408, transitioning from a divergent state to a convergent state. Multiplexing assembly 405 then combines the light of varying wavelengths into a single beam. This light is then collimated by a collimating lens in optical fiber adapter 403, converted into parallel light, and emitted from housing 402 as parallel light.

[0204] In order to provide a certain support force for bonding between the tube shell 402 and the electrical connector 409, the pad 420 has a first support portion 421, a second support portion 422 and a third support portion 423. For example, the first support portion 421, the second support portion 422 and the third support portion 423 are an integrated structure.

[0205] The upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board and are used to support the circuit board. The upper surface of the second support portion 422 protrudes from the upper surface of the first support portion 421 and is located below the signal pin area. The second support portion 422 supports the circuit board so that the signal pin area and the second pad area 432 are located in the same plane.

[0206] The second support portion 422 is located on one side of the first support portion 421, and the third support portion 423 is located on a side adjacent to the second support portion 422. The light receiving component 500 is located within the projection range of the third support portion 423. The width of the circuit board 300 at the position where the notch 302 is provided is narrow, which causes the circuit board to be easily deformed under force. The third support portion 423 is located on one side of the notch 302, and the third support portion 423 reinforces the narrow plate area 330 of the circuit board. At the same time, the light receiving component is connected to the circuit board, the upper surface of the third support portion 423 is connected to the circuit board, and the lower surface of the gasket 420 is connected to the lower shell, which increases the heat dissipation effect of the light receiving component and the light emitting component.

[0207] For example, the pad 420 is provided with a groove 4221, which is located at the connection between the second support portion and the third support portion. The groove 4221 can be used for installation and positioning, or the groove 4221 can be used to support overflow glue or overflow solder.

[0208] For example, the groove 4221 is arc-shaped, and the groove 4221 is recessed toward the second support portion and the third support portion. The groove 4221 can also be other shapes. The groove 4221 is a chamfered structure at the connection between the second support portion and the third support portion, which is convenient for preparation and molding.

[0209] FIG39 is a schematic diagram of another transmitting housing according to some embodiments of the present disclosure. As shown in FIG39 , a first through hole 4103 is provided on the housing 402 , communicating with the inner cavity of the housing 402 and connected to the optical fiber adapter 403 .

[0210] The tube shell 402 is provided with a first opening, and the first through hole 4103 and the first opening are respectively located on opposite sides of the transmitting shell.

[0211] In some embodiments, the bottom of the tube housing 402 is an opening, which is referred to as the bottom opening 4104 for convenience, and the pad 420 is located below the tube housing 402. The bottom opening 4104 is connected to the first opening.

[0212] The tube shell 402 includes a first side wall 4107 and a second side wall 4105 and a third side wall 4106 located on both sides of the first side wall. The first through hole 4103 is located on the first side wall 4107, and the first opening is located on the opposite side of the first side wall 4107.

[0213] In some embodiments, an electrical connector 409 is located at the first opening. One side of the electrical connector 409 is inserted into the housing 402, while the other side is exposed outside the housing 402. This allows the housing 402 and the electrical connector to be assembled to form a light-emitting cavity. The end of the electrical connector 409 located inside the housing 402 is connected to the laser array 407 via a gold wire, while the end of the electrical connector 409 located outside the housing is also connected to the circuit board via a gold wire. This relays the electrical signals and operating signals generated by the circuit board 300 to the laser array 407, thereby driving each laser to emit laser beams of different wavelengths.

[0214] After the backing plate 420 is connected to the housing 402, the first support portion 421 blocks the bottom opening 4104. The electrical connector 409 is located at the first opening 4101. The sidewalls of the electrical connector 409 are respectively connected to the second sidewall 4105 and the third sidewall 4106 of the housing 402, and the bottom of the electrical connector 409 is connected to the first support portion 421.

[0215] Figure 40 is a third schematic partial cross-sectional view of an optical emitting component and a circuit board according to some embodiments of the present disclosure. Figure 41 is a fourth schematic partial cross-sectional view of an optical emitting component and a circuit board according to some embodiments of the present disclosure. As shown from different angles in Figures 40 and 41, the upper surface of the second solder pad area 432 of the electrical connector 409 is higher than the upper surface of the second support portion 422, so that the signal pin area and the second solder pad area 432 are located in the same plane. The signal pin area and the second solder pad area 432 are connected via wire bonding, which helps reduce impedance.

[0216] In some embodiments, to reduce the length of the gold wire between the electrical connector 409 and the circuit board 300, the sidewalls of the electrical connector 409 are positioned close to the sidewalls of the second support portion 422. However, to prevent excess glue or solder from flowing out when the electrical connector is connected to the pad 420 and to prevent the excess glue or solder from affecting the optical module, a third gap is provided between the sidewalls of the electrical connector 409 and the sidewalls of the second support portion 422. The third gap receives excess solder when the electrical connector is soldered to the first support portion 421, preventing the emitter housing from tilting due to excessive solder, thereby improving coupling efficiency.

[0217] A second gap 425 exists between the third sidewall 4106 and the third support portion 423. This gap absorbs any excess solder or glue during soldering between the emitter housing and the first support portion 421, preventing the emitter housing from tilting due to excessive solder. This gap also provides a platform for the optoelectronic components of the light emitting assembly, helping to improve coupling efficiency. The circuit board 300 rests against the sidewall 4106 of the tube housing 402, securing the tube housing 402 in place.

[0218] The third support portion 423 is connected to the lower surface of the circuit board, providing support for the circuit board 300. The light receiving component is also connected to the circuit board, and the upper surface of the third support portion 423 is also connected to the circuit board. The lower surface of the backing plate 420 is connected to the lower housing, and the backing plate 420 is thermally connected to the light emitting component, increasing the heat dissipation area and improving the heat dissipation effect of the light receiving and light emitting components.

[0219] In the present disclosure, the circuit board 300 is provided with a notch 302, and the light emitting component is located in the notch. The light emitting component and the light receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, on which the light emitting component is located, and a portion of the pad 420 is located below the circuit board corresponding to the light receiving component. An electrical connector is provided at one end of the light emitting component, and the second solder pad area 432 of the electrical connector protrudes from the outside of the transmitting shell. The second solder pad area 432 is wired to the signal pin area of ​​the circuit board to reduce impedance and improve signal transmission quality. The pad includes a first support portion, a second support portion, and a third support portion. The bottom of the transmitting shell is welded to the first support portion, the second support portion is located below the signal pin area, and the third support portion is located below the circuit board below the light receiving component. The upper surfaces of the second support portion and the third support portion are higher than the upper surface of the first support portion. A pad is provided at the bottom opening of the transmitting shell, and a third gap is provided on one side of the electrical connector and the second support portion. A second gap 425 exists between the side wall of the launch shell and the third support portion, and the second gap 425 absorbs the overflow weld when the launch shell is welded to the first support portion 421. A second gap 425 exists between the shell bottom and the third support portion 423, and the second gap 425 absorbs the overflow weld when the launch shell is welded to the first support portion 421.

[0220] Figure 42 is an assembly diagram of a first protective cover and a second protective cover provided according to some embodiments of the present disclosure; Figure 43 is a cross-sectional view of a first protective cover and a second protective cover provided according to some embodiments of the present disclosure; and Figure 44 is an exploded view of a first protective cover and a second protective cover provided according to some embodiments of the present disclosure. As shown in Figures 42-44, the bonding wires between the first metal region 4095 and the upper surface of the circuit board 300 are covered by the first protective cover 910, thereby protecting the bonding wires between the first metal region 4095 and the upper surface of the circuit board 300 and providing dustproof and protective effects. The bonding wires between the second metal region 4096 and the lower surface of the circuit board 300 are covered by the second protective cover 920, thereby protecting the bonding wires between the second metal region 4096 and the lower surface of the circuit board 300 and providing dustproof and protective effects.

[0221] In some embodiments, a through hole is formed on the surface of the circuit board 300 to connect the first protective cover 910 and the second protective cover 920. Exemplarily, the first protective cover 910 is connected to the second protective cover 920 through the through hole.

[0222] It can be understood that when the above-mentioned light receiving component 500 including the converging and reflecting component and the light emitting component 400 with the above-mentioned electrical connector and the circuit board connected in a mortise and tenon manner are arranged inside the same optical module, the transmitting optical fiber of the light emitting component 400 adopts a transmitting optical fiber array similar to the optical fiber array 511.

[0223] In the optical module provided by the present disclosure, a first connecting portion is formed on the sidewall of the notch, and a second connecting portion is formed on the end surface of the boss facing the circuit board. The first connecting portion and the second connecting portion are embedded and connected to achieve a relatively fixed connection between the electrical connector and the circuit board, thereby reducing relative movement between the electrical connector and the circuit board when plugging and unplugging the optical module, thereby reducing the pulling on the gold wire, preventing the gold wire from breaking, and ensuring the quality of high-frequency signal transmission. At the same time, the fixed connection between the first connecting portion and the second connecting portion can ensure that the wire bonding end surface of the electrical connector is flush with the wire bonding end surface of the circuit board, preventing the wire bonding end surface from being misaligned due to other external forces, providing a relatively stable platform for wire bonding, and thus ensuring the quality of high-frequency signal transmission.

[0224] FIG45 is a schematic diagram of another structure of a protective cover and a circuit board according to some embodiments of the present disclosure. As shown in FIG15 and FIG45 , the protective cover includes: an upper protective cover 810 and a lower protective cover 820. The upper protective cover 810 is located above the circuit board, and is provided above the second high-frequency metal layer 41326 and the high-speed pin 305 to protect the metal wire between the second high-frequency metal layer 41326 and the high-speed pin 305. The lower protective cover is located below the circuit board, and is provided above the second low-frequency metal layer 41325 and the low-speed pin 306 to protect the metal wire between the second high-frequency metal layer 41326 and the high-speed pin 305. For example, the metal wire is a gold wire.

[0225] A clamping portion 815 is provided on the upper surface of the upper protective cover 810 . The width of the clamping portion 815 is smaller than the width of the upper protective cover 810 body, which facilitates installation and clamping.

[0226] The upper protective cover 810 is detachably connected to the lower protective cover 820. For example, the circuit board is provided with a second through-hole 303 and a third through-hole 304, and the lower surface of the upper protective cover 810 is provided with a third positioning post 811 and a fourth positioning post 812. The lower protective cover 820 is provided with a fourth through-hole 821 and a fifth through-hole 822. The third positioning post 811 passes through the second through-hole 303 and the fourth through-hole 821, and the fourth positioning post 812 passes through the third through-hole 304 and the fifth through-hole 822. The third positioning post 811 and the fourth positioning post are threaded, and nuts are used to detachably connect the upper protective cover 810 to the lower protective cover 820.

[0227] The clamping portion 813 protrudes from the upper surface of the upper protective cover 810. The thickness of the clamping portion is smaller than that of the upper protective cover 810. During the installation process, a clamping device is used to clamp both sides of the clamping portion to prevent the upper protective cover 810 from slipping out of the clamping device.

[0228] Figure 46 is a structural schematic diagram of the upper protective cover and the lower protective cover provided according to some embodiments of the present disclosure. Figure 47 is a structural schematic diagram of the upper protective cover and the lower protective cover provided according to some embodiments of the present disclosure. Figure 48 is a partial cross-sectional schematic diagram of the optical module provided according to some embodiments of the present disclosure. Figures 46 and 47 are structural schematic diagrams at different angles. As shown in Figures 46, 47 and 48, the lower surface of the upper protective cover 810 is provided with a third positioning column 811 and a fourth positioning column 812, and the lower surface of the upper protective cover 810 is recessed and provided with a first avoidance groove 814. The first avoidance groove 814 is provided above the second high-frequency metal layer 41326 and the high-speed pin 305 to protect the metal wire between the second high-frequency metal layer 41326 and the high-speed pin 305.

[0229] The first avoidance groove 814 does not penetrate the width direction of the upper protective cover 810, thereby improving the pressure resistance of the upper protective cover and preventing the upper protective cover from being deformed due to external force during installation, thereby affecting product performance.

[0230] The upper surface of the lower protective cover 820 is recessed to form a second avoidance groove 823 . The second avoidance groove 823 is provided above the second low-frequency metal layer and the low-speed pins to protect the metal wires between the second low-frequency metal layer and the low-speed pins.

[0231] To facilitate installation, the third positioning post 811 includes a first mounting portion 8111 and a second mounting portion 8112. One end of the first mounting portion 8111 is connected to the lower surface of the upper protective cover 810, and the other end is connected to the second mounting portion 8112. The cross-sectional area of ​​the first mounting portion 8111 is larger than that of the second mounting portion 8112. During installation, the first mounting portion 8111 is inserted into the second through-hole 303, and the lower surface of the upper protective cover 810 rests against the circuit board. The second mounting portion 8112 is inserted into the fourth through-hole 821.

[0232] The fourth positioning post 812 includes a third mounting portion 8121 and a fourth mounting portion 8122. One end of the third mounting portion 8121 is connected to the lower surface of the upper protective cover 810, and the other end is connected to the fourth mounting portion 8122. The cross-sectional area of ​​the third mounting portion 8121 is larger than that of the fourth mounting portion 8122. Therefore, a mounting step surface is provided between the third mounting portion 8121 and the fourth mounting portion 8122, against which the upper surface of the lower protective cover 820 abuts. During installation, the third mounting portion 8121 is embedded in the third through-hole, and the lower surface of the upper protective cover 810 abuts the circuit board. The fourth mounting portion 8122 is embedded in the fifth through-hole.

[0233] For example, the second through hole 303, the third through hole 304, the fourth through hole 821, and the fifth through hole 822 may be square; the second through hole 303, the third through hole 304, the fourth through hole 821, and the fifth through hole 822 may be circular. The area of ​​the second through hole 303 is larger than the cross-sectional area of ​​the first mounting portion 8111, and the area of ​​the fourth through hole 821 is larger than the cross-sectional area of ​​the second mounting portion 8112. The area of ​​the third through hole is larger than the cross-sectional area of ​​the third mounting portion 8121, and the area of ​​the fifth through hole 822 is larger than the cross-sectional area of ​​the fourth mounting portion 8122.

[0234] An embodiment of the present application provides an optical module comprising an optical transmitter component and a circuit board. The optical transmitter component comprises a transmitter housing formed by a transmitter housing and a transmitter cover, and an optical transmitter assembly located within the transmitter housing. The transmitter housing is provided with a first through-hole for connecting to a fiber optic adapter. An electrical connector is provided opposite the first through-hole for connecting the circuit board to the optical transmitter assembly. A second high-frequency metal layer is provided on one exterior side of the electrical connector for bonding to high-frequency pins on the circuit board. A second low-frequency metal layer is provided on the other exterior side of the electrical connector for bonding to low-frequency pins on the circuit board. The circuit board is also provided with an upper protective cover and a lower protective cover, located on either side of the circuit board and detachably connected. The upper protective cover is provided with a first relief groove, within which the second high-frequency metal layer and high-frequency pins are located. The first relief groove protects the metal wires between the second high-frequency metal layer and the high-frequency pins. A ridge is provided on the exterior side of the transmitter housing, the lower surface of which is fixedly connected to the upper surface of the circuit board to ensure secure mounting of the transmitter housing and the circuit board. Gold wire is used to connect the second high-frequency metal layer and the high-frequency pins to reduce the impedance between the circuit board and the optical transmission component and improve the communication rate.

[0235] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the disclosure of this application. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered merely as exemplary, and the true scope and spirit of the present application are indicated by the claims.

[0236] The above-described embodiments of the present application do not constitute a limitation on the scope of protection of the present application.

Claims

1. An optical module, comprising: A circuit board, a surface of which is formed with a notch, a side wall of which is formed with a first connecting portion; the circuit board is provided with a signal pin area; A light emitting component is located at the notch, the light emitting component includes an electrical connector, the electrical connector is provided with a pad area, and the pad area is connected to the signal pin area; Wherein, a second connecting portion is formed on the end surface of the electrical connector facing the circuit board, and the second connecting portion is embedded and connected with the first connecting portion to achieve a relatively fixed connection between the electrical connector and the circuit board; A mounting component connected to the light emitting component or the circuit board, wherein the mounting component is configured to adjust the position of the light emitting component at the notch so that the signal pin area is flush with the pad area; A protection component is disposed on the circuit board, and the protection component is configured to protect the connection between the quote pin area and the pad area.

2. The optical module according to claim 1, wherein: The light emitting component further comprises a tube shell having an opening on one side, and the electrical connector is located at the opening.

3. The optical module according to claim 2, wherein: The tube shell is overlapped on the surface of the notch; The pad region includes a first metal region and a second metal region; The electrical connector is arranged at the end of the tube shell, one end of the electrical connector extends into the interior of the tube shell, and the other end has a boss, and the boss is located outside the tube shell; the first metal area and the second metal area are respectively formed on the upper and lower surfaces of the boss, and the first metal area is flush with the upper surface of the circuit board; the first metal area is connected to the upper surface of the circuit board by wire bonding, and the second metal area is connected to the lower surface of the circuit board by wire bonding; the second connecting portion is formed on the end surface of the boss facing the circuit board.

4. The optical module according to claim 3, wherein: The protection component includes a first protection cover and a second protection cover; The upper surface of the circuit board is provided with the first protective cover to protect the bonding wire between the first metal area and the upper surface of the circuit board; The lower surface of the circuit board is provided with the second protective cover to protect the bonding wire between the second metal area and the lower surface of the circuit board; The first protective cover passes through the surface of the circuit board to be fixedly connected with the second protective cover.

5. The optical module according to claim 3, wherein: The mounting component includes a first overlapping portion and a second overlapping portion; The first overlapping portion and the second overlapping portion are respectively protruded from the side walls of the tube shell, and the first overlapping portion and the second overlapping portion are respectively overlapped on the surface of the notch to achieve the connection between the tube shell and the circuit board.

6. The optical module according to claim 5, wherein: The upper surface of the tube shell protrudes relative to the upper surface of the circuit board; the lower surface of the tube shell protrudes relative to the lower surface of the circuit board.

7. The optical module according to claim 2, wherein: The light emitting component also includes: A light emitting component is located inside the tube shell; The electrical connector is located at the opening; the pad area includes a first high-frequency metal layer, the first high-frequency metal layer is located inside the tube shell, and the first high-frequency metal layer is electrically connected to the optical emitting component; The pad area includes a second high-frequency metal layer, which is located outside the tube shell, and the second high-frequency metal layer is connected to the signal pin area by wire bonding; The second high-frequency metal layer is electrically connected to the first high-frequency metal layer.

8. The optical module according to claim 7, wherein: The signal pin area includes high-frequency pins; The protective component includes an upper protective cover and a lower protective cover; The upper protective cover is located at one side of the circuit board, the lower surface of the upper protective cover is recessed to form a first avoidance groove, and the second high-frequency metal layer and the high-frequency pin are located in the first avoidance groove; The lower protective cover is located at the opposite side of the upper protective cover, and the upper protective cover is detachably connected to the lower protective cover.

9. The optical module according to claim 8, wherein: The signal pin area further includes a low-frequency pin, and the low-frequency pin is located at the opposite side of the high-frequency pin; The pad area includes a second low-frequency metal layer, and the second low-frequency metal layer is wire-bonded to the low-frequency pin; The upper surface of the lower protective cover is recessed to form a second avoidance groove, and the second low-frequency metal layer and the low-frequency pin are located in the second avoidance groove.

10. The optical module according to claim 8, wherein: The lower surface of the upper protective cover is provided with a third positioning column and a fourth positioning column; The lower protective cover is provided with a fourth through hole and a fifth through hole; The circuit board is provided with a second through hole and a third through hole; The third positioning post is embedded in the second through hole and the fourth through hole; the fourth positioning post is embedded in the third through hole and the fifth through hole.

11. The optical module according to claim 10, wherein: The third positioning column includes: a first mounting portion and a second mounting portion; The first mounting portion is located between the lower surface of the upper protective cover and the second mounting portion, and the cross-sectional area of ​​the first mounting portion is greater than the cross-sectional area of ​​the second mounting portion; The first mounting portion is embedded in the second through hole, and the second mounting portion is embedded in the fourth through hole.

12. The optical module according to any one of claims 8 to 11, wherein: The upper protective cover is provided with a clamping portion, and the clamping portion protrudes from the upper surface of the upper protective cover.

13. The optical module according to claim 7 or 8, wherein: The electrical connector comprises: a first adapter board, a second adapter board and a third adapter board; Wherein, the second adapter plate is located between the first adapter plate and the third adapter plate; The lower surface of the first adapter plate is provided with a first high-frequency metal layer; the second adapter plate does not cover the first high-frequency metal layer; A second high-frequency metal layer is disposed on the upper surface of the second adapter plate, and a second low-frequency metal layer is disposed on the lower surface of the second adapter plate.

14. The optical module according to claim 13, wherein: The lower surface of the first adapter plate is provided with a first positioning column and a second positioning column; The second adapter plate has a first limiting portion, a second limiting portion and a third limiting portion, the first limiting portion and the second limiting portion extend toward the inside of the tube shell, and the third limiting portion protrudes from the lower surface of the second adapter plate; The lower surface of the second adapter plate is provided with a first low-frequency metal layer and a second low-frequency metal layer, and the upper surface of the second adapter plate is provided with the second high-frequency metal layer; The inner wall of the first limiting portion is in contact with and connected to the first positioning column; The inner wall of the second limiting portion is in contact with and connected to the second positioning column; The side wall at one end of the third limiting portion is in contact with and connected to the first positioning column; the side wall at the other end of the third limiting portion is in contact with and connected to the second positioning column.

15. The optical module according to claim 14, wherein: The third adapter plate is provided with an avoidance opening, and the third limiting portion abuts against a side wall of the avoidance opening; The third adapter plate is located between the first low-frequency metal layer and the second low-frequency metal layer.

16. The optical module according to claim 7, wherein: The mounting component is a convex strip, the convex strip is arranged on the outer wall of the launching shell, and the lower surface of the convex strip is connected to the upper surface of the circuit board.

17. The optical module according to claim 16, wherein: The convex strips include a first convex strip and a second convex strip; The first convex strip and the second convex strip are symmetrically arranged on two sides of the tube shell.

18. The optical module according to claim 7, wherein: The light emitting component also includes: A cover plate, connected to the tube shell; The light emitting assembly is suspended on the inner wall of the cover plate.

19. The optical module according to claim 18, wherein: The light emitting assembly comprises: A first optical fiber adapter connected to one end of the tube shell; A laser chip array, comprising a laser chip, wherein the laser chip array is configured to emit a plurality of light signals; A lens array, comprising lenses, the lenses corresponding to the laser chips, the lenses configured to converge the optical signals; An optical multiplexing component is optically connected to the first optical fiber adapter, and the optical multiplexing component is configured to combine multiple optical signals into one optical signal and transmit the combined optical signal to the first optical fiber adapter.

20. The optical module according to claim 19, wherein: The notch includes a first notch portion and a second notch portion. The first notch portion is configured to avoid the first optical fiber adapter, and the second notch portion is configured to avoid the tube shell.

21. The optical module according to claim 19, wherein: The light emitting component also includes: A support block, one surface of which is connected to the cover plate, and the other surface of which is connected to the optical multiplexing component, wherein the support block is configured to connect the cover plate and the optical multiplexing component; The TEC has one surface connected to the cover plate and another surface configured to support the laser chip array and the lens array respectively.

22. The optical module according to claim 1, wherein: The optical module further includes: A light receiving component is disposed on the surface of the circuit board, and the light receiving component includes: An optical fiber array, comprising a plurality of receiving optical fibers, wherein the optical fiber array is configured to receive a plurality of optical signals; A support frame, arranged at one side of the optical fiber array, the support frame having an inclined surface, and the inclined surface is arranged obliquely relative to the light emitting direction of the optical fiber array; A converging and reflecting component array is arranged on the surface of the inclined surface, the converging and reflecting component array includes a plurality of converging and reflecting components, one of the converging and reflecting components corresponds to one of the receiving optical fibers; a curved surface is formed on the surface of the converging and reflecting component, the curved surface is concave relative to the light output end surface of the optical fiber array; the curved surface is configured to reflect the optical signal output by the optical fiber array and converge the reflected optical signal; The light receiving chip array includes a plurality of light receiving chips, which are arranged below the inclined surface; one light receiving chip corresponds to one converging and reflecting component to receive the optical signal output by the converging and reflecting component.

23. The optical module according to claim 22, wherein: The support frame further includes a first side plate connected to one end of the inclined surface and a second side plate connected to the other end of the inclined surface; The first side plate and the second side plate are located on the surface of the circuit board; The converging and reflecting component array is located on a surface of the inclined surface facing the light emitting end surface of the optical fiber array.

24. The optical module according to claim 23, wherein: There is a first preset distance between the center of the curved surface and the light-emitting end face of the optical fiber array; there is a second preset distance between the center of the curved surface and the photosensitive surface of the light receiving chip, and the second preset distance is a preset multiple of the first preset distance.

25. The optical module according to claim 2, wherein: The pad area includes a second pad area; the second pad area is connected to the signal pin area via a metal bond; The mounting component includes: a first supporting portion and a second supporting portion, wherein the upper surface of the second supporting portion is higher than the upper surface of the first supporting portion; The light emitting component is located above the first supporting portion; and the second supporting portion supports the signal pin region so that the signal pin region is flush with the second pad region.

26. The optical module according to claim 25, wherein: The circuit board has a narrow board area, and the narrow board area and the notch are located in parallel in the width direction of the circuit board; the narrow board area is used to place the light receiving component; The second pad area is located outside the light emitting component; The mounting component further includes a third supporting portion, wherein the upper surfaces of the second supporting portion and the third supporting portion are higher than the upper surface of the first supporting portion; The tube shell has a bottom opening, and the first supporting portion blocks the bottom opening; the second supporting portion supports the signal pin area so that the signal pin area is flush with the second pad area; and the third supporting portion is located below the narrow plate area.

27. The optical module according to claim 26, wherein: The tube shell has a first through hole, the first through hole is located at the opposite side of the electrical connector, and the optical fiber adapter is located in the first through hole.

28. The optical module according to claim 26 or 27, wherein: The side wall of the electrical connector abuts against the side wall of the second supporting portion; the lower surface of the light emitting component is lower than the lower surface of the electrical connector, and a first gap is provided between the second pad area, the shell bottom and the second supporting portion; The light emitting component abuts against a side wall of the third supporting portion.

29. The optical module according to claim 25 or 27, wherein: The lower surface of the electrical connector is connected to the first supporting portion, and a third gap is defined between the second pad region and the second supporting portion; the signal pin region covers the third gap to connect the signal pin region to the second pad region.

30. The optical module according to claim 26, wherein: A second gap is provided between the tube shell and the side wall of the third supporting portion.

31. The optical module according to claim 26, wherein: The mounting component is a pad, and the pad is provided with: a laser array, a lens array and an optical multiplexing component; The lens array is located between the laser array and the optical multiplexing assembly; The laser array is electrically connected to the electrical connector.

32. The optical module according to claim 31, wherein: The pad area includes a first pad area, which is electrically connected to the laser array; the second pad area includes a low-frequency signal line and a high-frequency signal line, the low-frequency signal line is configured to transmit a low-frequency signal, and the high-frequency signal line is configured to transmit a high-frequency signal.

33. The optical module according to claim 26, wherein: The tube shell is welded to the first supporting portion.

34. The optical module according to claim 31, wherein: The pad is provided with a groove, and the groove is located at the connection between the second supporting part and the third supporting part.

35. The optical module according to claim 26, wherein: The optical module further includes: Upper shell; Lower housing; The circuit board is located between the upper housing and the lower housing; The light receiving component is located between the narrow plate area and the upper shell; the upper surface of the third supporting portion is connected to the narrow plate area, and the lower surface of the mounting component is thermally connected to the lower shell.

36. The optical module according to claim 26, wherein: The width of the narrow board area is less than or equal to 1 / 3 of the width of the circuit board.

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