Intravascular stent of passive brain-computer interface system

Through the vascular stent of the passive brain-computer interface system, wireless charging and communication technology is used to realize the power supply and data transmission of intracranial microelectrodes, solving the risks brought about by craniotomy in the existing technology, and providing a low-risk brain-computer interface implantation solution.

CN119564214APending Publication Date: 2025-03-07NATIONAL UNIVERSITY OF SINGAPORE +2
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Patent Information

Application Number
CN202311150552.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-07
Publication Date
2025-03-07

AI Technical Summary

Technical Problem

The existing invasive intracranial electrode technology requires craniotomy surgery, which poses multiple risks such as intracranial hemorrhage and brain tissue damage, which limits the application of brain-computer interfaces.

Method used

It provides a vascular stent of a passive brain-computer interface system, including a stent net, intracranial microelectrode, wireless charging and communication coil, intracranial sensor unit and stent circuit. Through wireless charging and communication, power supply and data transmission of intracranial microelectrodes are realized, avoiding craniotomy surgery.

Benefits of technology

Low-risk intracranial EEG signal acquisition is achieved, reducing trauma and risk during implantation, and providing a minimally invasive brain-computer interface implantation solution.

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Abstract

The invention discloses an intravascular stent of a passive brain-computer interface system. The intravascular stent comprises a stent net, an intracranial microelectrode, a wireless charging and communication coil, an intracranial sensor unit and a stent circuit, the bracket net is an expandable support frame; the intracranial microelectrode and the intracranial sensor unit are arranged on the stent net, and the intracranial microelectrode and the intracranial sensor unit are in contact with a blood vessel wall under the condition that the stent net is unfolded and is in contact with the blood vessel wall; the wireless charging and communication coil is an expandable coil attached to the stent net and is used for receiving an electromagnetic signal sent by external equipment in a state of being expanded along with the stent net and generating a working electric signal of the stent circuit according to the electromagnetic signal; the support circuit is electrically connected with the intracranial microelectrode and the intracranial sensor unit and used for generating electroencephalogram signals used for analyzing the brain state according to brain physiological signals obtained by the intracranial microelectrode and the intracranial sensor unit. According to the embodiment of the invention, an intracranial electroencephalogram signal can be collected in a low-risk manner.
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Description

Technical Field

[0001] The present application belongs to the field of medical technology, and more specifically, to a vascular stent for a passive brain-computer interface system. Background Art

[0002] In recent years, EEG signal recording based on invasive intracranial electrodes has attracted much attention in the development of brain-computer interface technology. By recording EEG signals through intracranial electrodes, EEG signals with a wider frequency range and stronger signal strength can be obtained. At the same time, through the design of the electrodes, local field potential signals of multi-neuron discharges can be collected, and the electrical activity of single neuron cells can also be collected, laying an important data foundation for brain-computer interface related applications. However, current rod-shaped electrodes (such as sEEG (stereoElectro EncephaloGraphy) electrodes, DBS (Deep Brain Stimulation) electrodes), cortical electrodes (ECoG, Electrocorticography), Utah electrodes and other intracranial electrodes all require craniotomy, which is a complicated surgical procedure and may cause multiple risks such as intracranial hemorrhage and brain tissue damage, limiting the application of invasive brain-computer interfaces.

[0003] Therefore, how to implement intracranial electrode technology using a less risky solution is a problem that needs to be solved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a vascular stent for a passive brain-computer interface system, which helps to collect intracranial electroencephalogram signals in a low-risk manner.

[0005] Based on the above purpose, the embodiment of the present application provides a vascular stent of a passive brain-computer interface system, including: a stent mesh, an intracranial microelectrode, a wireless charging and communication coil, an intracranial sensor unit, and a stent circuit;

[0006] The support net is an expandable support frame;

[0007] The intracranial microelectrode and the intracranial sensor unit are arranged on the support net, and when the support net is unfolded and contacts the blood vessel wall, the intracranial microelectrode and the intracranial sensor unit contact the blood vessel wall;

[0008] The wireless charging and communication coil is an expandable coil attached to the stent net, which is used to receive electromagnetic signals sent by the external device when the stent net is expanded, and generate working electrical signals of the stent circuit according to the electromagnetic signals;

[0009] The bracket circuit is electrically connected to the intracranial microelectrode and the intracranial sensor unit, and is used to generate an electroencephalogram signal for analyzing the brain state according to the brain physiological signals obtained by the intracranial microelectrode and the intracranial sensor unit.

[0010] The vascular stent of the passive brain-computer interface system provided in the embodiment of the present application integrates the circuit system with the stent electrode, and realizes wireless power supply and wireless data transmission through the proposed wireless link, allowing truly minimally invasive implantation. It is a key device used to solve the problem of minimally invasive implantation of invasive brain-computer interfaces. It can further reduce trauma and further reduce risks by wirelessly charging and communicating coils for wireless power supply, wireless communication scheme, and intracranial physiological signal sensing functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0012] Figure 1 A schematic diagram of a vascular stent structure of a passive brain-computer interface system provided in an embodiment of the present application and its connection with an external device;

[0013] Figure 2 A schematic diagram of the winding direction of the wireless charging and communication coil in the vascular stent of the passive brain-computer interface system provided in an embodiment of the present application;

[0014] Figure 3 A schematic diagram of a wireless charging and communication coil winding method provided in an embodiment of the present application;

[0015] Figure 4A and Figure 4B A schematic diagram of a unit line segment in a serpentine routing method in an embodiment of the present application;

[0016] Figure 5 This is a schematic diagram of an axial perspective of a support network and a circuit network according to an embodiment of the present application;

[0017] Figure 6 This is a schematic diagram of a stent mesh implanted into a brain blood vessel according to an embodiment of the present application;

[0018] Figure 7 A schematic diagram of the grid connection between the intracranial microelectrode and the support mesh in the embodiment of the present application;

[0019] Figure 8 A schematic diagram of the wiring arrangement of the circuit layer of an embodiment of the present application;

[0020] Fig. 9 The figure shows a structural framework diagram of a bracket circuit composition of an example of the present application;

[0021] Fig.10 This is a circuit connection diagram of an impedance calculation processor and an impedance measurement unit according to an example of the present application;

[0022] Fig.11 This is a schematic diagram of a connection between a tuning unit and a wireless transceiver circuit according to an example of the present application;

[0023] Fig.12 This is a schematic diagram of an exemplary adjustable impedance matching network of the present application.

[0024] The reference numerals in the above drawings are as follows:

[0025] 11. Support mesh; 12. Intracranial microelectrode; 13. Wireless charging and communication coil; 14. Intracranial sensor unit; 15. Support circuit; 21. Winding direction; 22. Pipeline axial direction; 31. Outer circle; 32. Inner circle; 33. Coil cross section; 34. Single-turn wire; 41. First line segment; 42. Second line segment; 43. Third line segment; 51. Support mesh; 52. Circuit layer; 61. Brain blood vessels; 62. Support mesh; 71. Intracranial microelectrode; 72. Support mesh; 73. Ceramic ring; 121. First MOS switch; 122. Second MOS switch; 123. MOS switch subunit. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] The embodiment of the present application provides a vascular stent of a passive brain-computer interface system, the structure of which is as follows Figure 1 As shown, it includes: a support network 11, an intracranial microelectrode 12, a wireless charging and communication coil 13, an intracranial sensor unit 14, and a support circuit 15;

[0028] The support net 11 is a deployable support frame;

[0029] The intracranial microelectrode 12 and the intracranial sensor unit 14 are arranged on the support net 11, and when the support net 11 is unfolded and contacts the blood vessel wall, the intracranial microelectrode 12 and the intracranial sensor unit 14 contact the blood vessel wall;

[0030] The wireless charging and communication coil 13 is an expandable coil attached to the support net 11, and is used to receive electromagnetic signals sent by an external device when the support net 11 is expanded, and generate working electrical signals of the support circuit 15 according to the electromagnetic signals;

[0031] The support circuit 15 is electrically connected to the intracranial microelectrode 12 and the intracranial sensor unit 14 , and is used to generate electroencephalogram signals for analyzing brain states based on brain physiological signals obtained by the intracranial microelectrode 12 and the intracranial sensor unit 14 .

[0032] In the embodiment of the present application, the stent mesh 11 is a mesh pipe structure and is also an expandable support structure. The material used to make the stent mesh 11 is generally made of metal tantalum, medical stainless steel, nickel-titanium alloy, etc. Balloon dilatation can be used to expand the stent mesh 11 to a certain diameter value in the blood vessel and attach it to the blood vessel. A self-expanding structure stent mesh can also be used to expand itself in the blood vessel. The surgery and implantation process of the vascular stent of the passive brain-computer interface system provided in the embodiment of the present application can be completely consistent with the vascular stent implantation method, without the need for craniotomy, etc. The stent mesh 11 is used to fix the intracranial microelectrode 12, the wireless charging and communication coil 13, the intracranial sensor unit 14 and the stent circuit 15, and is the main structure of the vascular stent of the passive brain-computer interface system.

[0033] The intracranial microelectrode 12 is an intracranial electrode, which is a multi-contact electrode made of special material. It can directly record the electrical activity of the cerebral cortex, collect electrophysiological signals or perform electrical stimulation. It can be fixed in the support net 11 by embedding, and electrically connected to other parts of the circuit system on the support net 11 through wires. The intracranial electrodes of the embodiments of the present application can generally be divided into deep electrodes, subdural strip electrodes and grid-shaped cortical electrodes. The cortical electroencephalogram or deep electroencephalogram recorded by intracranial electrodes can maximize the elimination of the influence of structures such as the scalp, skull, and dura mater on the recording of brain electrical activity; as well as the influence of the conduction and spread of brain electrical activity to the surrounding or distant areas on the judgment of the origin of the disease attack.

[0034] Recording EEG signals through intracranial electrodes avoids the low-pass filtering effect of human tissue structures such as the skull and scalp, and can obtain EEG signals with a wider frequency range and stronger signal strength. At the same time, the design of the electrodes can collect local field potential signals of multi-neuron discharges, and can also collect the electrical activity of single neuron cells.

[0035] The wireless charging and communication coil 13 may include a wireless communication coil and a wireless charging coil, which are used to realize the functions of wireless communication and wireless charging respectively. The wireless communication coil may be used to receive the EEG signals collected by the intracranial microelectrode 12, and send the EEG signals to an external device, so that the external device can analyze the physical condition of the implanted person based on the EEG signals. The wireless charging coil may be used to receive electromagnetic signals sent by an external device, and generate power based on the received electromagnetic signals, i.e., the working electrical signals used by the vascular stent of the passive brain-computer interface system.

[0036] In another embodiment, the wireless charging and communication coil 13 can also be a partially deployable coil that integrates wireless communication and wireless charging functions, and is deployed as the bracket network is deployed. After the bracket is deployed, the wireless charging and communication coil 13 can receive electromagnetic energy sent by the external device, provide working power for the circuit system, and can also be used as a communication element to exchange data with the external device.

[0037] The wireless charging and communication coil 13 may be internally mounted with an intracranial sensor unit 14 and a support circuit 15. The intracranial sensor unit 14 may include one or more sensors having functions such as measuring pressure, monitoring blood pressure, detecting intracranial pressure, and measuring oxygen partial pressure of arterial blood oxygen partial pressure.

[0038] In a specific implementation, both the intracranial microelectrode and the intracranial sensor unit can be connected to the support circuit via an insulated wire.

[0039] When the vascular stent of the passive brain-computer interface system is implanted in the blood vessel and unfolded, the wireless charging and wireless communication coils can establish an electromagnetic link with the coils in the external device aligned with them, realizing wireless power supply and wireless data transmission. Under the energy supply of the external device, the stent circuit can be configured or use intracranial microelectrodes to collect EEG signals, and realize the transmission of EEG signals from the body to the outside through electromagnetic links. After the external device receives the EEG signal, it can complete the analysis of the EEG in the external circuit system, or send the collected EEG signal to other terminals or the cloud through wireless communication for storage and analysis of the EEG signal, thereby realizing the interpretation of brain commands. After completing the interpretation of the brain command, the interpretation result can be used to control the movement of the robotic arm, keyboard typing and other brain-control-related brain-computer interface applications to complete the corresponding operations. In addition, under the energy supply of the external device, the stent circuit can be configured or use intracranial microelectrodes to implement electrical stimulation to achieve the treatment of neurological diseases, etc. Similarly, under the energy supply of the external device, the stent circuit can drive the intracranial sensor unit to work, which is used to monitor other physiological indicators in the skull.

[0040] The human brain has multiple functional areas, each with different functions, responsible for the normal operation of the human body. When a single functional area has symptoms, it may affect the overall health and normal life of the human body, but it is difficult to accurately determine the specific locations of the functional areas of the human brain in non-invasive or minimally invasive situations. The vascular stent of the passive brain-computer interface system provided in the embodiment of the present application can be combined with intracranial microelectrodes on the basis of the vascular stent, so that the intracranial microelectrodes can be implanted into the patient's body by means of the vascular stent, which helps to locate each functional area more accurately with the help of brain blood vessels. At the same time, the human brain is an uneven curved surface, so that the fit between the intracranial electrode and the brain is usually lower than that of the extracranial electrode. The embodiment of the present application can improve the fit between the intracranial electrode and the part of the human body where the signal is collected by fixing the intracranial microelectrode in the stent net of the vascular stent of the passive brain-computer interface system, and at the same time help to reduce the difficulty of implanting the intracranial microelectrode into the skull.

[0041] At the same time, the vascular stent of the passive brain-computer interface system of the embodiment of the present application has a wireless charging and communication unit, which is fixed on the stent net and is retractable, so that the stent does not need to be configured with a power supply after being implanted in the brain blood vessels, thereby improving ease and safety of use.

[0042] If wireless charging and communication unit is not used, Figure 6 As shown, a stent mesh 62 fixed with intracranial microelectrodes, intracranial sensor units and stent circuits can be implanted into a brain blood vessel 61 through a vascular puncture operation, thereby avoiding a craniotomy. After implantation, the microelectrode contacts on the stent can be connected to an active implantable device implanted in the human chest through an extension wire, so that the active implantable device implanted in the human chest can realize the functions of charging and communication, and provide electrical energy for the intracranial microelectrodes to perform EEG collection, electrical stimulation, etc. This can also avoid craniotomy, but it is necessary to connect to the active implantable device in the chest through an extension wire, which may pose a risk of extension wire breakage, leading to other adverse events. In addition, an incision needs to be made in the human chest to place an active implantable device, so the system is not completely low-risk and minimally invasive.

[0043] The present invention Figure 1 The vascular stent of the passive brain-computer interface system of the embodiment shown, the circuit system and the stent electrode are integrated, and wireless power supply and wireless data transmission are realized through the proposed wireless link, allowing truly minimally invasive implantation. It is a key device used to solve the problem of minimally invasive implantation of invasive brain-computer interfaces. Through wireless charging and communication coils for wireless power supply, wireless communication scheme, intracranial physiological signal sensing function and other functions, it can further reduce trauma and further reduce risks.

[0044] In one embodiment, the support mesh is in the shape of a pipe; the intracranial microelectrodes, intracranial sensor units, wireless charging and communication coils and support circuits are arranged on the outside of the support mesh.

[0045] In one embodiment, the wireless charging and communication coil is attached and fixed to the side of the support network, the cross section of the coil is substantially parallel to the pipeline axis of the support network, and the cross section of the coil is a curved surface and its shape is adapted to the side of the pipeline of the support network.

[0046] In another embodiment, the winding direction of the wireless charging and communication coil is along the circumferential direction of the pipe of the support network, such as Figure 2 The winding direction 21 may be perpendicular to the axial direction 22 of the pipe of the support network, or may be at a certain angle to the axial direction 22 of the pipe of the support network.

[0047] In one embodiment, the normal direction of the wireless charging and communication coil is perpendicular to the axial direction of the support network; a plurality of intracranial microelectrodes are provided, which are located on the outside of the cross-section formed by the wireless charging and communication coil; the support circuit is an integrated circuit, which is provided on the inside of the cross-section formed by the wireless charging and communication coil; and the intracranial sensor unit is provided on the inside of the cross-section formed by the wireless charging and communication coil.

[0048] Since the normal direction of the wireless charging and communication coil is perpendicular to the axial direction of the support network, the coil cross-section is perpendicular to the pipe cross-section of the support network, and the side area of ​​the pipe of the support network is larger than the area of ​​the pipe cross-section of the support network, the arrangement of the wireless charging and communication coils adopted in this embodiment can maximize the area of ​​the coil cross-section formed by the coil, thereby having a higher magnetic flux and charging efficiency during charging.

[0049] In one embodiment, the wireless charging and communication coil includes a plurality of closed-loop single-turn coils; the single-turn coils are arranged to be arranged in a serpentine pattern.

[0050] In this embodiment, the single-turn coil of the wireless charging and communication coil is a circular or elliptical closed loop wound by a wire. When each closed loop is enlarged, the area covered by the wire is annular, including an outer circle and an inner circle. Figure 3 As shown, the single-loop wire 34 provided in this embodiment is arranged in a serpentine manner between the outer loop 31 and the inner loop 32, spreading along the annular area between the outer loop 31 and the inner loop 32, and the first part is closed. Thus, in the case of shrinking, the coil cross section 33 of the wireless charging and communication coil is elliptical or rectangular.

[0051] In one implementation, the serpentine routing of a single-turn coil can be implemented using Figure 4A , Figure 4B The method shown.

[0052] Reference Figure 4AAs shown, the serpentine routing of the single-turn coil may include a plurality of regular routing units, the routing paths of each routing unit are consistent, and the single-turn coils do not cross each other. The routing path of each routing unit includes a first line segment 41 extending from the inner circle to the outer circle, a second line segment 42 extending from the outer circle to the inner circle, and a third line segment 43 connecting the first line segment 41 and the second line segment 42. The first line segment 41, the second line segment 42, and the third line segment 43 can also form a "Z" shape or a "W" shape.

[0053] Reference Figure 4B The serpentine routing of a single-turn coil may include a plurality of irregular routing units, and the routing paths of each routing unit may be consistent or inconsistent. The routing path of each routing unit is an irregular, non-intersecting turning path from the outer circle to the inner circle.

[0054] For wireless charging and wireless communication coils, the larger the wireless charging coil is, the greater the magnetic flux passing through it is, which is more conducive to improving the wireless charging energy. Figure 3 , Figure 4A , Figure 4B and other similar bayfront structures, can be fully deployed.

[0055] In one embodiment of the present application, the vascular stent of the passive brain-computer interface system further includes:

[0056] The circuit layer includes insulated wires; the circuit layer electrically connects the intracranial microelectrode with the bracket circuit, and also electrically connects the intracranial sensor unit with the bracket circuit.

[0057] Reference Figure 5 As shown, in the axial perspective of the stent mesh, a circuit layer 52 is arranged on the outer ring of the stent mesh 51, and the circuit layer 52 is used to realize the necessary electrical connection between all components of the vascular stent of the passive brain-computer interface system. In this embodiment, the insulated wire is a wire wrapped with an insulating layer.

[0058] In one embodiment, the insulated conductive wire is arranged to run in a serpentine shape.

[0059] In this embodiment, the insulated wires of the circuit layer are wired on the outside of the stent net in a serpentine routing manner, which can improve the stability of the connection between the intracranial microelectrodes, the intracranial sensor units, the stent circuit and the stent net.

[0060] like Figure 8The figure shows the wiring method of the circuit layer. The serpentine wiring method used is similar to the wiring method of the coil. When the circuit layer is unfolded, the wire is pulled up and extended along the x and y directions of the plane coordinate system. When the stent mesh is contracted, the bay line is contracted together to facilitate minimally invasive implantation through blood vessel puncture. When in the blood vessel, the stent is in the open state, and the circuit layer can be fully extended due to the bay line design.

[0061] In one embodiment, the intracranial microelectrode comprises: a microelectrode and an insulating ring; the microelectrode is embedded in the insulating ring; and the intracranial microelectrode is fixed at a grid intersection or a grid edge of the support mesh.

[0062] Figure 7 The figure shows the schematic diagram of the grid connection between the intracranial microelectrode and the support mesh. Figure 7 As shown, the intracranial microelectrode 71 is embedded in the support net 72, and can be at the intersection of the grid of the support net 72, or at the edge of the grid of the support net. The insulating ring is a ceramic ring 73, which blocks the current propagation between the intracranial microelectrode and the support net. The intracranial microelectrode 71 is embedded in the ceramic ring 73 and connected to the circuit through a wire.

[0063] During the opening process of the stent mesh, the edges of the mesh will deform and move as the stent mesh opens, but the deformation is minimal at the mesh intersection or single edge. Therefore, setting the intracranial microelectrode at the mesh intersection or edge can avoid the intracranial microelectrode from hindering the opening process of the stent mesh.

[0064] During the manufacturing process, the intracranial sensor unit, wireless charging and wireless communication coil, and stent circuit can realize circuit design on the same layer of flexible and expandable base material, and the circuit layer can be prepared at the same time. The flexible and expandable base material is wrapped in the outer layer of the stent net. Since the circuit layer and wireless charging coil and other components are on the outer layer of the stent net, the stent net plays a supporting role in the assembled state, and the circuit and wire parts of the vascular stent of the passive brain-computer interface system will not be blocked inside the blood vessel.

[0065] In one embodiment, the support circuit comprises:

[0066] Tuning unit, wireless transceiver, control unit, intracranial electrode subcircuit, microelectrode selection switch, wireless charging unit, sensor unit interface;

[0067] The tuning unit is configured to transmit radio frequency information to and from the wireless charging and wireless communication coils, and the wireless transceiver, respectively;

[0068] The wireless charging unit is configured to transmit radio frequency information to and from the tuning unit;

[0069] The intracranial electrode subcircuit and the intracranial microelectrode are electrically connected to the microelectrode selection switch respectively;

[0070] The sensor unit interface is electrically connected to the intracranial sensor unit;

[0071] The tuning unit, the wireless transceiver, and the sensor unit interface are respectively configured to receive control instructions sent by the control unit and send feedback information for the control instructions to the control unit;

[0072] The intracranial electrode sub-circuit and the wireless charging unit are respectively configured to receive control instructions sent by the control unit.

[0073] In one embodiment, the intracranial electrode subcircuit includes: an EEG acquisition function subcircuit;

[0074] The EEG acquisition function subcircuit is connected to the microelectrode selection switch, and is used to obtain brain electrophysiological signals when the microelectrode selection switch selects the EEG acquisition function subcircuit. It is configured to receive control instructions sent by the control unit and send feedback information for the control instructions to the control unit.

[0075] In one embodiment, the intracranial electrode subcircuit includes: a neural electrical stimulation functional subcircuit;

[0076] The neural electrical stimulation functional subcircuit is connected to the microelectrode selection switch, and is used to provide constant current electrical pulse stimulation when the microelectrode selection switch selects the neural electrical stimulation functional subcircuit, and is configured to receive control instructions sent by the control unit.

[0077] In one implementation, the wireless transceiver includes: a radio frequency source and a power amplifier (PA); the tuning unit includes: an impedance measurement unit, an adjustable impedance matching network and an impedance calculation processor.

[0078] Fig.11 This is a schematic diagram of a connection structure of a tuning unit and a wireless transceiver circuit according to an embodiment of the present application. Fig.11 As shown, RF signals are sent to each other between the RF source and the power amplifier, between the power amplifier and the impedance measurement unit, between the impedance measurement unit and the adjustable impedance matching network, between the adjustable impedance matching network and the wireless charging and communication coil, and between the impedance measurement unit and the impedance calculation processor; the impedance calculation processor is configured to send instructions to the adjustable impedance matching network.

[0079] In one embodiment of the present application, the impedance calculation processor includes an analog-to-digital converter and a digital signal processor; the impedance measurement unit includes: a detection capacitor, an attenuator and a down-conversion module;

[0080] The detection capacitor is configured to transmit a radio frequency signal to and from the power amplifier;

[0081] The attenuator is configured to transmit radio frequency signals to and from the two ends of the detection capacitor and the two ends of the down-conversion module respectively;

[0082] The down-conversion module is configured with two ends respectively transmitting intermediate frequency signals to and from the analog-to-digital converter.

[0083] An example of a connection between the impedance calculation processor and the impedance measurement unit is as follows: Fig.10 As shown, the impedance measurement unit can be a detection capacitor. After the vector signals V1 and V2 at both ends of the detection capacitor pass through the attenuator and the down-conversion module, they are sampled by the impedance calculation processor to calculate the wireless charging and wireless charging coil impedances.

[0084] Fig. 9 The figure shows a structural framework diagram of a stent circuit composition of an example of the present application. In order to achieve full miniaturization, the stent circuit adopts an integrated circuit SoC (System on Chip), and the integrated units include: microelectrode selection switch, EEG acquisition functional subcircuit, neural electrical stimulation functional subcircuit, control unit, wireless transceiver, wireless charging unit, tuning unit and sensor unit interface.

[0085] Microelectrode selection switch: used to determine the circuit access status of the intracranial microelectrode in the support network. When connected to the EEG acquisition function subcircuit, it is configured as the acquisition electrode function; when connected to the neural electrical stimulation function subcircuit, it is configured as the stimulation electrode function.

[0086] EEG acquisition functional subcircuit: realizes electrical signal amplification, analog-to-digital conversion (ADC), caching and other functions. The electrical signals that can be collected include EEG, ECG, EMG and other physiological, physical and biological indicators that can be converted into voltage signals. In addition, this subcircuit also includes impedance test circuit.

[0087] Nerve electrical stimulation functional subcircuit: realizes constant current electrical pulse stimulation function.

[0088] Control unit: used to realize the logic control and scheduling of each functional circuit.

[0089] Wireless transceiver: used to realize modulation and demodulation of radio frequency signals and wireless communication with external devices.

[0090] Wireless charging unit / power management: receives radio frequency energy, completes rectification and voltage regulation output, and provides energy for all units included in the bracket circuit.

[0091] Tuning unit: capable of measuring the impedance of wireless charging and wireless communication coils to achieve automatic impedance matching function.

[0092] Sensor unit interface: used to connect other intracranial sensor units and provide power and data interfaces.

[0093] In one embodiment of the present application, the adjustable impedance matching network includes i first network units, i second network units, a first inductor, and a second inductor, where i is a positive integer;

[0094] Each first network unit includes a first adjustable capacitor, a second adjustable capacitor, and a MOS switch subunit, and the first adjustable capacitor, the MOS switch subunit, and the second adjustable capacitor are connected in sequence;

[0095] Each second network unit includes a third adjustable capacitor, a fourth adjustable capacitor, and a MOS switch subunit, and the third adjustable capacitor, the MOS switch subunit, and the fourth adjustable capacitor are connected in sequence;

[0096] The parallel sub-circuits of i first network units, the first inductor, the parallel sub-circuits of i second network units, the second inductor, and the parallel sub-circuits of i first network units are connected in sequence to form a closed loop circuit;

[0097] Two ends of the parallel sub-circuit of the i first network units constitute a radio frequency signal transceiver;

[0098] The parallel sub-circuits of the i second network units constitute a radio frequency signal transceiver.

[0099] In one embodiment of the present application, the MOS switch subunit includes: a first MOS switch, a second MOS switch;

[0100] The control ends of the first MOS switch and the second MOS switch are connected to form a common control end, and are closed or opened at the same time.

[0101] like Fig.12 The figure shows an example of an adjustable impedance matching network. The adjustable impedance matching network can adjust the parameters of the T-type matching network by controlling the access of the adjustable capacitor to achieve antenna impedance matching. This structure can be implemented in the chip. Fig.12, the adjustable impedance matching network includes i first network units and i second network units, i is a positive integer. The nth first network unit includes adjustable capacitors Cn1 and Cn2. Cn1, MOS switch subunits 123, and Cn2 are connected in sequence. The nth second network unit includes adjustable capacitors Cn1' and Cn2'. Cn1', MOS switch subunits 123, and Cn2' are connected in sequence. The MOS switch subunit includes: a first MOS switch 121, a second MOS switch 122, and the control ends of the first MOS switch 121 and the second MOS switch 122 are connected to form a common control end SWn or SWn', which are closed and opened at the same time. The parallel subcircuits of the i first network units, the first inductor L1, the parallel subcircuits of the i second network units, the second inductor L2, and the parallel subcircuits of the i first network units are connected in sequence to form a closed-loop circuit. The two ends of the parallel subcircuit of i first network units constitute a radio frequency signal transceiver; the parallel subcircuit of i second network units constitutes a radio frequency signal transceiver; n is a positive integer greater than 0 and less than i.

[0102] The above-mentioned embodiments of the present application are combinations of elements and features of the present application. Unless otherwise mentioned, the elements or features may be considered as optional. Each element or feature may be put into practice without being combined with other elements or features. In addition, the embodiments of the present application may be constructed by combining some elements and / or features. The order of operations described in the embodiments of the present application may be rearranged. Some constructions of any one embodiment may be included in another embodiment, and may be replaced by the corresponding construction of another embodiment. It is obvious to those skilled in the art that claims that do not have a clear reference relationship to each other in the attached claims may be combined with the embodiments of this application, or may be included as new claims in the amendment after submitting this application.

[0103] In a firmware or software configuration, the embodiments of the present application may be implemented in the form of modules, processes, functions, etc. The software code may be stored in a memory unit and executed by a processor. The memory unit is located inside or outside the processor and may send data to and receive data from the processor via various known means.

[0104] Various aspects of the system described herein may be implemented as functions programmed into any of a variety of circuits, including programmable logic devices (PLDs), such as field programmable gate arrays (FPGAs), programmable array logic (PAL) devices, electronic programmable logic and storage devices, standard cell-based devices, and application-specific integrated circuits (ASICs). Some other possibilities for implementing these aspects of the system include: microcontrollers with memory, such as electronically erasable programmable read-only memory (EEPROM), embedded microprocessors, firmware, software, etc. In addition, these aspects of the system may be embodied in microprocessors with software-based circuit simulation, discrete logic (sequential and combinational), custom devices, fuzzy (neural) logic, quantum devices, and combinations of any of the above various device types. Of course, the underlying device technology may be provided in a variety of component types, such as metal oxide semiconductor field effect transistor (MOSFET) technology such as complementary metal oxide semiconductor (CMOS), bipolar technology such as emitter coupled logic (ECL), polymer technology (e.g., silicon conjugated polymer and metal conjugated polymer metal structure), hybrid analog and digital, etc.

[0105] The various functions or processes disclosed herein may be described as data and / or instructions embodied in various computer-readable media in terms of their behavior, register transfers, logic components, transistors, geometric layouts, and / or other characteristics. Computer-readable media that may contain such formatted data and / or instructions include, but are not limited to, various forms of non-volatile storage media (e.g., optical, magnetic, or semiconductor storage media) and carrier waves, which may be used to transmit such formatted data and / or instructions via wireless, optical, or wired signal media, or any combination thereof. When received in any of a variety of circuits (e.g., computers), such data and / or instructions may be processed by a processing entity (e.g., one or more processors).

[0106] The above description of the illustrated embodiments of the systems and methods is not intended to be exhaustive or to limit the systems and methods to the precise forms disclosed. Although specific embodiments and examples of the system components and methods are described herein for illustrative purposes, it will be appreciated by those skilled in the art that various equivalent modifications may be made within the scope of the systems, components, and methods. The teachings of the systems and methods provided herein may be applied to other processing systems and methods, not just to the above-described systems and methods.

[0107] Those skilled in the art will appreciate that, without departing from the spirit or scope of the broad description of the present application, various changes and / or modifications may be made to the present application shown in the specific embodiments. Therefore, the present embodiment will be considered in all respects to be illustrative and not restrictive. In addition, the present application includes any combination of features described for different embodiments (including features in the abstract section), even if the feature or combination of features is not clearly defined in the claims or the detailed description of the present embodiment.

[0108] Generally, in the following claims, the terms used should not be construed to limit the systems and methods to the specific embodiments disclosed in the specification and the claims, but should be construed to include all processing systems that operate under the claims. Therefore, the systems and methods are not limited by the present disclosure, but rather the scope of the systems and methods is determined entirely by the claims.

[0109] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include", "including", "comprising", etc. should be interpreted in an inclusive sense and not in an exclusive or exhaustive sense; that is, in the sense of "including but not limited to". Words using the singular or plural number also include the singular or plural number, respectively. In addition, "herein", "herein below", "above", "hereafter" and words of similar meaning refer to this application as a whole and not to any particular part of this application. When the word "or" is used in a list involving two or more items, the word "or" includes all of the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list.

[0110] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0111] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A vascular stent for a passive brain-computer interface system, comprising: Stent mesh, intracranial microelectrodes, wireless charging and communication coils, intracranial sensor units, stent circuits; The support net is a deployable support frame; The intracranial microelectrode and the intracranial sensor unit are arranged on the support net, and when the support net is unfolded and contacts the blood vessel wall, the intracranial microelectrode and the intracranial sensor unit contact the blood vessel wall; The wireless charging and communication coil is an expandable coil attached to the stent net, and is used to receive electromagnetic signals sent by an external device when the stent net is expanded, and generate working electrical signals of the stent circuit according to the electromagnetic signals; The support circuit is electrically connected to the intracranial microelectrode and the intracranial sensor unit, and is used to generate an electroencephalogram signal for analyzing the brain state according to the brain physiological signals obtained by the intracranial microelectrode and the intracranial sensor unit.

2. The vascular stent of the passive brain-computer interface system according to claim 1, wherein: The support net is in the shape of a pipe on the net surface; the intracranial microelectrodes, intracranial sensor units, wireless charging and communication coils and the support circuit are arranged on the outside of the support net.

3. The vascular stent of the passive brain-computer interface system according to claim 1 or 2, wherein: The normal direction of the wireless charging and communication coil is perpendicular to the axial direction of the support network; there are multiple intracranial microelectrodes, which are located on the outside of the cross-section formed by the wireless charging and communication coil; the support circuit is an integrated circuit, which is arranged on the inside of the cross-section formed by the wireless charging and communication coil; the intracranial sensor unit is arranged on the inside of the cross-section formed by the wireless charging and communication coil.

4. The vascular stent of the passive brain-computer interface system according to claim 3, wherein: The wireless charging and communication coil includes a plurality of closed-loop single-loop coils; the single-loop coils are arranged to be arranged in a serpentine pattern.

5. The vascular stent of the passive brain-computer interface system according to claim 1, further comprising: The circuit layer includes an insulated wire; the circuit layer electrically connects the intracranial microelectrode with the support circuit, and electrically connects the intracranial sensor unit with the support circuit.

6. The vascular stent of the passive brain-computer interface system according to claim 5, wherein: The insulated wire is arranged to be arranged in a serpentine shape.

7. The vascular stent of the passive brain-computer interface system according to claim 1, wherein: The intracranial microelectrode comprises: a microelectrode and an insulating ring; the microelectrode is embedded in the insulating ring; and the intracranial microelectrode is fixed at the grid intersection or grid edge of the support mesh.

8. The vascular stent of the passive brain-computer interface system according to claim 1, wherein: The support circuit comprises: Tuning unit, wireless transceiver, control unit, intracranial electrode subcircuit, microelectrode selection switch, wireless charging unit, sensor unit interface; The tuning unit is configured to transmit radio frequency information to and from the wireless charging and wireless communication coil and the wireless transceiver respectively; The wireless charging unit is configured to transmit radio frequency information to and from the tuning unit; The intracranial electrode subcircuit and the intracranial microelectrode are electrically connected to the microelectrode selection switch respectively; The sensor unit interface is electrically connected to the intracranial sensor unit; The tuning unit, the wireless transceiver, and the sensor unit interface are respectively configured to receive a control instruction sent by the control unit and send feedback information for the control instruction to the control unit; The intracranial electrode sub-circuit and the wireless charging unit are respectively configured to receive control instructions sent by the control unit.

9. The vascular stent of the passive brain-computer interface system according to claim 8, wherein: The intracranial electrode subcircuit comprises: an EEG acquisition function subcircuit; The EEG acquisition function subcircuit is connected to the microelectrode selection switch, and is used to obtain brain electrophysiological signals when the microelectrode selection switch selects the EEG acquisition function subcircuit. It is configured to receive control instructions sent by the control unit and send feedback information regarding the control instructions to the control unit.

10. The vascular stent of the passive brain-computer interface system according to claim 8 or 9, wherein: The intracranial electrode subcircuit comprises: a neural electrical stimulation functional subcircuit; The neural electrical stimulation functional subcircuit is connected to the microelectrode selection switch, and is used to provide constant current electrical pulse stimulation when the microelectrode selection switch selects the neural electrical stimulation functional subcircuit, and is configured to receive control instructions sent by the control unit.

11. The vascular stent of the passive brain-computer interface system according to claim 8, wherein: The wireless transceiver includes: a radio frequency source and a power amplifier; the tuning unit includes: an impedance measurement unit, an adjustable impedance matching network and an impedance calculation processor; Radio frequency signals are transmitted mutually between the radio frequency source and the power amplifier, between the power amplifier and the impedance measurement unit, between the impedance measurement unit and the adjustable impedance matching network, between the adjustable impedance matching network and the wireless charging and communication coil, and between the impedance measurement unit and the impedance calculation processor; The impedance calculation processor is configured to send instructions to the adjustable impedance matching network.

12. The vascular stent of the passive brain-computer interface system according to claim 11, wherein: The impedance calculation processor includes an analog-to-digital converter and a digital signal processor; the impedance measurement unit includes: a detection capacitor, an attenuator and a down-conversion module; the detection capacitor is configured to send a radio frequency signal to the power amplifier; The attenuator is configured to transmit radio frequency signals to and from two ends of the detection capacitor and two ends of the down-conversion module respectively; The down-conversion module is configured with two ends thereof respectively transmitting intermediate frequency signals to and from the analog-to-digital converter.

13. The vascular stent of the passive brain-computer interface system according to claim 11, wherein: The adjustable impedance matching network includes i first network units, i second network units, a first inductor, and a second inductor, where i is a positive integer; Each first network unit includes a first adjustable capacitor, a second adjustable capacitor, and a MOS switch subunit, and the first adjustable capacitor, the MOS switch subunit, and the second adjustable capacitor are connected in sequence; Each second network unit includes a third adjustable capacitor, a fourth adjustable capacitor, and a MOS switch subunit, and the third adjustable capacitor, the MOS switch subunit, and the fourth adjustable capacitor are connected in sequence; The parallel sub-circuits of i first network units, the first inductor, the parallel sub-circuits of i second network units, the second inductor, and the parallel sub-circuits of i first network units are connected in sequence to form a closed loop circuit; The two ends of the parallel sub-circuit of the i first network units constitute a radio frequency signal transceiver; The parallel sub-circuits of the i second network units constitute a radio frequency signal transceiver.

14. The vascular stent of the passive brain-computer interface system according to claim 13, wherein: The MOS switch subunit includes: a first MOS switch and a second MOS switch; The control ends of the first MOS switch and the second MOS switch are connected to form a common control end, and are closed or opened at the same time.