A copper pillar multi-sided welding process

Abstract

The present invention belongs to the technical field of welding, and particularly relates to a multi-sided welding process for copper columns, including a welded part. At least two opposite or adjacent soldering surfaces are provided on the welded part, and copper columns are welded on any soldering surface. The specific welding process includes the following steps: S100: Place copper columns on the soldering surfaces to form a weld seam to be welded between the contact surfaces of the copper columns and the soldering surfaces. The purpose is to, by pre-determining the welding sequence among the weld seams to be welded on the welded part, then sort the solder wires in descending order of melting point, then fill the solder wire with the highest melting point into the first weld seam to be welded, and then fill the solder wire with the second highest melting point into the second weld seam, and so on. This can ensure that when the solder wire in the subsequent weld seam to be welded is heated, the solder wire in the previous weld seam to be welded will not melt again. Therefore, by selecting ordered welding and using solder wires with different melting points, the performance of the front and rear welding seams can be effectively controlled, and the welding quality can be improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of welding, and particularly relates to a multi-sided welding process for copper posts. Background Art

[0002] Copper posts play a crucial role in the modern electrical connection field, especially as key components of laminated busbars. There are currently two common ways to connect and fix them to the laminated busbars, namely flaring riveting and welding. Flaring riveting can meet the basic connection requirements in some specific application scenarios. However, compared with flaring riveting, welding achieves higher connection stability and can provide a more reliable and firm bonding force between the copper post and the laminated busbar, thus better ensuring the stable performance of the entire electrical connection system in a complex operating environment.

[0003] In the prior art, the soldering operation of copper posts usually faces the need for double-sided or multi-sided welding. This is because in many actual electrical connection structures, copper posts need to be firmly connected to the laminated busbar or other related components from multiple sides to achieve all-round electrical conduction and mechanical fixation. However, during double-sided or multi-sided soldering, after completing the soldering process on one side, the workpiece needs to be reversed to heat and weld the other side. At this time, the tin in the weld of the previously soldered side often melts. This is because when heating and welding the other side subsequently, the heat will conduct to the previously welded part, causing the temperature of this part to rise, making the tin in the weld reach the melting point and melt again, resulting in a decrease in the connection strength of the weld. The originally firm welded part may become loose, thus affecting the stability and reliability of the entire electrical connection. At the same time, the melted tin liquid will flow downward under the action of gravity, and the flowing downward tin liquid will damage the originally flat and smooth appearance of the weld, making the welded part uneven or even causing void soldering. Summary of the Invention

[0004] In view of this, the present invention provides a multi-sided welding process for copper posts, aiming to use solder wires with different melting points on the same welded part to perform sequential welding on both sides or multiple sides, in order to avoid the melting of the tin in the already welded weld due to repeated heating of the welded part.

[0005] The technical solution adopted by the present invention is as follows:

[0006] A multi-sided welding process for copper posts includes a welded part (1), and at least two opposite or adjacent soldering surfaces are provided on the welded part (1). A copper post (2) is welded on any soldering surface. The specific welding process includes the following steps:

[0007] S100: Place the copper post (2) on the soldering surface so that a weld to be formed is formed between the contact surface of the copper post (2) and the soldering surface;

[0008] S200: Divide all soldering surfaces of the weldment (1) into welding areas, and divide each welding area into N welds to be welded, where N is a positive integer and N≥2;

[0009] S300, obtaining the spacing between the seams to be welded, and determining whether the spacing between adjacent seams to be welded is within the range of influence of the welding temperature;

[0010] If the spacing is within the range affected by the welding temperature, the corresponding seam to be welded is marked as a risk area, and the seam to be welded in the risk area executes S400;

[0011] If the spacing is outside the range affected by the welding temperature, the corresponding seam to be welded is marked as a regular area, and the seam to be welded in the regular area executes S500;

[0012] S400: configuring a number of solder wires with different melting points; determining the number K of seams to be welded in the risk area, matching the K seams to be welded with solder wires; marking the K seams to be welded in order from high to low according to the welding melting points; making the melting point temperature of the Kth solder wire to be welded greater than the melting point temperature of the K-1th solder wire to be welded; completing the welding in the risk area;

[0013] S500: confirm the number M of seams to be welded in the conventional area, configure the same solder wire corresponding to the M seams to be welded (3) for welding, mark the M seams to be welded in sequence according to welding requirements, and complete the welding of the conventional area.

[0014] The specific concept is to predetermine the welding sequence between the various seams to be welded on the welded part, and then sort the solder wires according to the melting point from high to low, and then fill the solder wire with the highest melting point into the first seam to be welded, and then fill the solder wire with the second highest melting point into the second seam to be welded, and so on. In this way, it can be ensured that when the solder wire in the subsequent seam to be welded is heated, the solder wire in the previous seam to be welded will not melt again, so that by selecting orderly welding and using solder wires with different melting points, the performance of the previous and next welding seams can be effectively controlled and the welding quality can be improved.

[0015] Further, in the S500, when the M seams to be welded are marked in sequence according to the welding requirements, the welding sequence of the seams to be welded in the conventional area is determined by the sequence marking;

[0016] The welds to be welded in the conventional area are sorted by area so that the area of ​​the Mth weld is greater than or equal to the area of ​​the M-1th weld.

[0017] As a preferred technical solution, when the areas of the welds to be welded are different, the welds to be welded with smaller areas are arranged in the front welding order, and the welds to be welded with larger areas are arranged in the rear welding order. In this way, the input amount of high-melting-point solder wire can be relatively reduced, the time required to heat the high-melting-point solder wire can be shortened, and the lower the melting point of the solder wire filled in the weld to be welded with a larger area, the shorter the heating time required for subsequent welding of the weld to be welded with a larger area.

[0018] Further, when the areas of the welds to be welded in the conventional area are the same, the same welds to be welded are marked as a competition sequence, and the distance parameter between the welds to be welded marked with the competition sequence and the end of the welded part is obtained; the welds to be welded marked with the competition sequence are sorted in ascending order of the distance parameter.

[0019] As a preferred technical solution, the smaller the distance parameter, the higher the welding priority of the corresponding weld to be welded; conversely, the larger the distance parameter, the lower the welding priority of the corresponding weld to be welded, so that the welding operation can gradually advance from the relatively edge position to the center, reducing the errors and time waste that may be caused by frequent adjustment of the welding position.

[0020] Further, in S500, the material of the solder wire is tin-lead alloy, wherein the proportion of tin is 20%-63%, and the proportion of lead is 37%-80%.

[0021] Further, in step S400, for any two adjacent welds to be welded, the melting point temperature difference between the selected solder wires is greater than 25 degrees Celsius, and the melting point temperature range of all solder wires is between 183 degrees Celsius and 279 degrees Celsius.

[0022] Further, in S100, before placing the copper column, it also includes cleaning the tin soldering surface of the welded part.

[0023] Further, in S400, a laser welding device is used to heat the solder wire, and the laser welding device includes an HLD6772WS-TL type laser solder wire welding machine.

[0024] Further, in S400, an inert gas is required to cover the welding area during welding, and the inert gas includes argon.

[0025] Further, in S400, the time from the start of heating to the complete melting of the solder wire in different welds to be welded is recorded.

[0026] Further, the wire diameter of the solder wire is between 0.3 mm and 0.5 mm.

[0027] In summary, due to the adoption of the above technical solutions, the present invention has at least the following beneficial effects:

[0028] 1. By pre-determining the welding sequence among the welds to be made on the welded parts, it helps to achieve an efficient and orderly welding process. At the same time, solder wires with different melting points can prevent all solder wires from melting simultaneously when heated to a specific temperature. Specifically, when using solder wires with different melting points, first sort the solder wires in descending order of melting point. Then, fill the solder wire with the highest melting point into the first weld to be made, and fill the solder wire with the second highest melting point into the second weld to be made, and so on. This can ensure that when heating the solder wires in the subsequent welds to be made, the solder wires in the previous welds to be made will not melt again. Thus, by choosing an orderly welding sequence and using solder wires with different melting points, the performance of the front and back welded seams can be effectively controlled, and the welding quality can be improved.

[0029] 2. Sort the welding sequence of each weld to be made according to the size of the area, and arrange the welds to be made with smaller areas in the front welding positions to reduce the input amount of high-melting-point solder wires, thereby shortening the time required to heat the high-melting-point solder wires. Moreover, the lower the melting point of the solder wire filled in the weld to be made with a larger area, the shorter the heating time required for subsequent welding of the weld to be made with a larger area. In this way, the welding sequence is further optimized to improve the welding efficiency of the overall product. Brief Description of the Drawings

[0030] The present invention will be described by way of examples with reference to the accompanying drawings, where:

[0031] Figure 1 is a schematic structural diagram of multi-sided welding of copper pillars provided by the present invention.

[0032] Reference numerals in the drawings: welded part - 1; copper pillar - 2; weld to be made - 3. Detailed Embodiment

[0033] Next, in combination with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0034] In the prior art, in the tin soldering operation of copper pillars, double-sided or multi-sided welding is usually involved. Once one side is welded and the welded part needs to be flipped to weld the other side, the tin in the previously welded weld may remelt. Due to the influence of gravity, the liquid tin will flow downward, which will not only reduce the welding quality but may also damage the appearance of the welded part.

[0035] Embodiment

[0036] Therefore, in order to solve the problem of the potential impact of repeated heating on the welded welds during the double-sided or multi-sided welding process, and to achieve the function of ensuring the stability of the weld under continuous heating conditions and avoiding the occurrence of melting phenomena, the present invention discloses a multi-sided welding process for copper columns. Refer to Figure 1 , including a welded part 1, at least two opposite or adjacent soldering surfaces are provided on the welded part 1, and copper columns 2 are welded on any soldering surface. The specific welding process includes the following steps:

[0037] S100: Place the copper column 2 on the soldering surface so that a weld to be formed 3 is formed between the contact surfaces of the copper column 2 and the soldering surface.

[0038] It should be noted that the welded part 1 is preferably a rectangular copper strip, and the diameter of the surface to be welded of the copper column 2 is less than or equal to the width of the soldering surface of the welded part 1 to ensure that the copper column 2 can be stably placed on the soldering surface during welding.

[0039] S200: Divide the welding areas of all the soldering surfaces of the welded part 1, and each welding area is divided into N welds to be formed 3, where N is a positive integer and N≥2.

[0040] S300: Obtain the spacing between the welds to be formed, and determine whether the spacing between adjacent welds to be formed is within the influence range of the welding temperature;

[0041] Among them, if the spacing is within the influence range of the welding temperature, the corresponding weld to be formed is marked as a risk area, and the weld to be formed in the risk area executes S400;

[0042] Among them, if the spacing is outside the influence range of the welding temperature, the corresponding weld to be formed is marked as a normal area, and the weld to be formed in the normal area executes S500.

[0043] S400: Configure several solder wires with different melting points; determine the number K of welds to be formed in the risk area, and match the K welds to be formed with solder wires; mark the K welds to be formed in order from the highest to the lowest welding melting point; make the melting point temperature of the solder wire to be welded for the Kth one greater than the melting point temperature of the solder wire to be welded for the (K - 1)th one; complete the welding of the risk area;

[0044] S500: Confirm the number M of welds to be formed in the normal area, weld the corresponding M welds to be formed with the same solder wire, mark the M welds to be formed in order according to the welding requirements, and complete the welding of the normal area.

[0045] It is worth mentioning that the wire diameter of the solder wire is between 0.3 mm and 0.5 mm to ensure the melting speed of the welding wire and the welding quality during the welding process.

[0046] S400: According to the welding sequence, heat the solder wires in the corresponding welds to be formed 3 in sequence to complete the welding of the copper column 2 and the welded part 1 to obtain the finished product.

[0047] It should be noted that the heating equipment for the solder wire can be cooperated with an electric soldering iron and a laser.

[0048] Combined with the above S100 to S400, by pre-determining the welding sequence among the welds 3 on the welded part 1, it helps to achieve the efficient and orderly progress of the welding process. At the same time, solder wires with different melting points can avoid all solder wires melting simultaneously when heated to a specific temperature. Specifically, when using solder wires with different melting points, first sort the solder wires in descending order of melting point, then fill the solder wire with the highest melting point into the first weld to be made, and then fill the solder wire with the second highest melting point into the second weld to be made, and so on. This can ensure that when heating the solder wire in the subsequent welds 3 to be made, the solder wire in the previous welds 3 to be made will not melt again. Therefore, by selecting orderly welding and using solder wires with different melting points, the performance of the front and back welding seams can be effectively controlled, and the welding quality can be improved.

[0049] In a preferred embodiment, in S500, when the M welds to be made are sequentially marked according to the welding requirements, the welding sequence of the welds to be made in the normal area is determined by the sequential marking. Among them, the welds to be made in the normal area are sorted according to the area for welding, so that the area of the Mth weld to be made is greater than or equal to the area of the (M - 1)th weld to be made. This sorting rule helps to improve the overall welding efficiency of the workpiece.

[0050] The weld to be made 3 is formed by the contact surface between the copper column 2 and the solder surface. Therefore, the area size of the weld to be made 3 is the contact surface size between the copper column 2 and the solder surface. In S500, if the areas of the welds to be made 3 in the safe area are different, the corresponding solder wires are filled into each weld to be made 3 according to the area size. Specifically, the smaller the area of the weld to be made 3, the higher the melting point of the solder wire filled inside it. On the contrary, the larger the area of the weld to be made 3, the lower the melting point of the solder wire filled inside it. Since the welding sequence of the welds to be made 3 with a smaller area precedes that of the welds to be made 3 with a larger area, and the melting point of the solder wire in the welds to be made 3 with a more forward welding sequence is higher, and the higher the melting point of the solder wire, the longer the heating time. If a weld to be made 3 with a larger area is combined with a solder wire with a high melting point, during the welding process, more solder wire needs to be filled and a longer heating time is required to ensure that the solder wire is fully melted and fills the weld, which may lead to a reduction in welding efficiency.

[0051] Therefore, by arranging the weld seams 3 with smaller areas in the front welding order, the input amount of high-melting-point solder wire can be relatively reduced, thereby shortening the time required to heat the high-melting-point solder wire. Moreover, the lower the melting point of the solder wire filled in the weld seam 3 with a larger area, the shorter the required heating time will be when welding the weld seam 3 with a larger area subsequently. Because during the process of the low-melting-point solder wire reaching the melting point for welding and fusing, the state change can be completed more quickly, thus effectively improving the speed of the entire welding process and further enhancing the overall welding efficiency of the workpiece.

[0052] Further, in the step S500, when the areas of the weld seams in the conventional area are the same, the same weld seams are marked as a competition sequence, and the distance parameter between the marked weld seams in the competition sequence and the end of the welded part is obtained; the marked weld seams in the competition sequence are sorted in ascending order of the distance parameter.

[0053] In the specific implementation manner, through this sorting method, the planning of the welding process can be further optimized. When faced with the situation where the areas of multiple weld seams 3 are the same, the weld seams closer to the end of the welded part 1 are preferentially processed, enabling the welding operation to gradually advance from the relatively edge position to the center. In this way, during the actual welding process, the operator can operate more conveniently, reducing the errors and time waste that may be caused by frequently adjusting the welding position.

[0054] In addition, the melting point temperature difference between any two adjacent solder wires in the melting point sorting is greater than 25 degrees Celsius, and the melting point temperature range of all solder wires is between 183 degrees Celsius and 279 degrees Celsius.

[0055] Preferably, in the step S500, the material of the solder wire is a tin-lead alloy, wherein the proportion of tin is 20%-63%, and the proportion of lead is 37%-80%. This ratio of the tin-lead alloy can ensure that the solder has good fluidity and wettability while maintaining sufficient mechanical strength. During the welding process, the tin-lead alloy solder wire can quickly melt and evenly cover the surface of the weld seam, forming a stable and reliable solder joint. In addition, the melting point of this alloy is relatively low, which helps to reduce the thermal impact on the workpiece during welding, thereby protecting sensitive components from damage.

[0056] On the other hand, in the step S400, a laser welding device is used to heat the solder wire. The laser welding device used includes a HLD6772WS-TL type laser solder wire welding machine. Laser welding has the characteristics of high precision and high efficiency. This not only helps to significantly improve the welding speed, but also, due to the focusing characteristics of the laser beam, can carry out fine welding for tiny welds, which is of extremely important significance for improving the welding quality and production efficiency. In addition, the heat generated during laser welding is relatively concentrated, and the corresponding heat-affected zone is smaller. In this way, it helps to reduce the deformation and thermal damage of the welded parts, and thus effectively ensures the structural stability and reliability of the copper column after welding. At the same time, the smoke and spatter generated during laser welding are relatively less, which is conducive to maintaining the cleanliness of the working environment and also reduces the subsequent cleaning work required.

[0057] Further, in the S100, before placing the copper column 2, it also includes cleaning the solder surface of the welded part 1 to remove the oil, oxide layer and impurities on the surface of the solder surface, so as to ensure that the copper column 2 and the solder surface can be in good contact to form the weld to be formed 3.

[0058] In this embodiment, in the S400, an inert gas needs to cover the welding area during welding. The inert gas includes argon to prevent the welding area from reacting with oxygen in the air, thereby avoiding the oxidation phenomenon at the welding part. This inert gas protection measure can significantly improve the quality of the weld, ensuring the stability of the welding process and the strength of the weld after welding.

[0059] Further, in the S400, record the time from the start of heating to the complete melting of the solder wire in different welds to be formed 3, and store the melting time of the solder wire in each weld to be formed 3 separately. When welding multiple products of the same format, if the overall welding time exceeds the predetermined range, by analyzing and comparing these separately stored melting time data, it is possible to quickly locate the product where the weld to be formed with possible problems is located and the specific welding link.

[0060] Exemplarily, assume that the predetermined welding time for a single product is T minutes. When the overall welding time of multiple products in a certain batch exceeds this predetermined range during welding (that is, the completion time is greater than T multiplied by the number of products), first check the melting time records corresponding to each weld to be formed 3 of each product. If it is found that for a certain weld to be formed 3 of a certain product (such as the second weld to be formed of product A), the melting time of its solder wire is significantly longer than the melting time of the welds to be formed at the same position of other normal products, this indicates that there may be an abnormal situation in the welding link of this weld to be formed.

[0061] At the to-be-welded joint 3, if there is a deviation in the laser power setting of the laser welding equipment and insufficient heat is provided to melt the solder wire within the normal time; or if the flow rate of the inert gas is unstable, affecting the protection effect of the welding area and disturbing the melting process of the solder wire; or if there are differences in the quality of the solder wire itself, such as uneven wire diameter, etc., which affect the melting speed. By analyzing these abnormal melting time data, it helps assist the user in finding the root cause of the problem, and then taking targeted measures for adjustment and repair in a timely manner to avoid similar problems in subsequent products, thereby effectively reducing the extra time consumed for troubleshooting and repairing welding faults, and greatly improving the welding efficiency of the overall product.

[0062] Moreover, by statistically analyzing the melting time distribution rules of different batches of products and different to-be-welded joints under various welding conditions, the preset values of the welding process parameters can be further optimized. For example, according to past data, it is found that for a to-be-welded joint with a specific size and layout, under a specific combination of laser power and inert gas flow rate, the melting time of the solder wire is always in a relatively stable and short range. Then in subsequent welding production, this combination of parameters can be used as the standard setting for this type of to-be-welded joint, enabling each to-be-welded joint to be welded under more ideal conditions, further shortening the overall welding time, and improving the welding efficiency of the overall product.

[0063] In addition, the detailed record of the melting time also helps to reasonably arrange the connection of the welding processes during the production process. When knowing the approximate melting time of each to-be-welded joint, the switching time of the welding sequence between different to-be-welded joints within the same product can be more accurately planned, reducing unnecessary waiting time, and enabling the welding equipment and operators to work continuously and efficiently, which also has a significant promoting effect on the welding efficiency of the overall product.

[0064] To sum up, while avoiding the problem of the influence of repeated heating on the already welded joints during double-sided or multi-sided soldering, this multi-sided welding process for copper posts also improves the production efficiency of the welded products.

[0065] Exemplarily, referring to Figure 1 , the welded part 1 is arranged in an "L" - shaped structure with four soldering surfaces. The processing personnel place the four copper posts 2 on the four soldering surfaces respectively, and then sort them according to the area size of the to-be-welded joints 3 formed by the four copper posts 2 and the soldering surfaces to determine the first to-be-welded joint, the second to-be-welded joint, the third to-be-welded joint, and the fourth to-be-welded joint. Then, the solder wire is filled into the first to-be-welded joint, the second to-be-welded joint, the third to-be-welded joint, and the fourth to-be-welded joint in sequence according to the melting point temperature from high to low.

[0066] Among them, the tin - lead ratio of the solder wire filled into the first to-be-welded joint is: tin accounts for 20%, lead accounts for 80%, and the melting point is 279 degrees Celsius.

[0067] The tin-lead ratio of the solder wire filled in the second weld to be is: tin accounts for 35%, lead accounts for 65%, and the melting point is 248 degrees Celsius.

[0068] The tin-lead ratio of the solder wire filled in the third weld to be is: tin accounts for 50%, lead accounts for 50%, and the melting point is 215 degrees Celsius.

[0069] The tin-lead ratio of the solder wire filled in the fourth weld to be is: tin accounts for 63%, lead accounts for 37%, and the melting point is 183 degrees Celsius.

[0070] Finally, heat the solder wires in the first weld to be, the second weld to be, the third weld to be, and the fourth weld to be in sequence to complete the welding.

[0071] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0072] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A copper column multi-sided welding process, characterized in that: The welding part comprises at least two opposite or adjacent soldering surfaces, and a copper column is soldered on any soldering surface. The following steps are involved: S100: placing a copper pillar on the soldering surface to form a weld between the copper pillar and the contact surface of the soldering surface; S200: Divide all soldering surfaces of the weldment into welding areas, and divide each welding area into N welds to be welded, where N is a positive integer and N≥2; S300, obtaining the spacing between the seams to be welded, and determining whether the spacing between adjacent seams to be welded is within the range of influence of the welding temperature; If the spacing is within the range affected by the welding temperature, the corresponding seam to be welded is marked as a risk area, and the seam to be welded in the risk area executes S400; If the spacing is outside the range affected by the welding temperature, the corresponding seam to be welded is marked as a regular area, and the seam to be welded in the regular area executes S500; S400: configuring a number of solder wires with different melting points; determining the number K of seams to be welded in the risk area, matching the K seams to be welded with solder wires; marking the K seams to be welded in order from high to low according to the welding melting points; making the melting point temperature of the Kth solder wire to be welded greater than the melting point temperature of the K-1th solder wire to be welded; completing the welding in the risk area; S500: confirm the number M of seams to be welded in the conventional area, configure the M seams to be welded with the same solder wire for welding, mark the M seams to be welded in sequence according to welding requirements, and complete welding in the conventional area.

2. The copper column multi-surface welding process according to claim 1, characterized in that: In the step S500, when the M seams to be welded are marked in sequence according to the welding requirements, the welding sequence of the seams to be welded in the conventional area is determined by the sequence markings; The welds to be welded in the conventional area are sorted by area so that the area of ​​the Mth weld is greater than or equal to the area of ​​the M-1th weld.

3. The copper column multi-surface welding process according to claim 2, characterized in that: When there are welds with the same area in the conventional area, the same welds are marked as a competition sequence, and the distance parameters between the welds marked in the competition sequence and the ends of the welded parts are obtained; the welds marked in the competition sequence are prioritized from small to large according to the distance parameters.

4. The copper column multi-surface welding process according to claim 1, characterized in that: In the S500, the material of the solder wire is a tin-lead alloy, wherein the proportion of tin is 20%-63% and the proportion of lead is 37%-80%.

5. The copper column multi-surface welding process according to claim 1, characterized in that: In step S400, the melting point temperature difference between the selected solder wires for any two adjacent seams to be welded is greater than 25 degrees Celsius, and the melting point temperature range of all solder wires is between 183 degrees Celsius and 279 degrees Celsius.

6. The copper column multi-surface welding process according to claim 1, characterized in that: In the above S100, before placing the copper pillar, the soldering surface of the soldering part is cleaned.

7. The copper column multi-surface welding process according to claim 1, characterized in that: In S400, a laser welding device is used to heat the solder wire, and the laser welding device includes a HLD6772WS-TL laser solder wire welding machine.

8. The copper column multi-surface welding process according to claim 7, characterized in that: In the above-mentioned S400, the welding area needs to be covered with an inert gas during welding, and the inert gas includes argon.

9. The copper column multi-surface welding process according to claim 7, characterized in that: In the S400, the time from the start of heating to the complete melting of the solder wires in different welds is recorded.

10. The copper column multi-surface welding process according to claim 1, characterized in that: The wire diameter of the solder wire is between 0.3 mm and 0.5 mm.

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