Elastic nozzle assembly, eutectic device and eutectic method

Abstract

The present invention relates to the technical field of eutectic equipment, and in particular to an elastic suction nozzle assembly, eutectic equipment and a eutectic method; wherein the elastic suction nozzle assembly includes a base, at least two suction nozzles arranged on the base and an elastic assembly arranged corresponding to each suction nozzle; the suction nozzle includes a connected connection section and a working section, and the two ends of the elastic assembly are connected to the base and the corresponding connection section of the suction nozzle; a through avoidance channel is provided on the base, the working section can be movably located in the avoidance channel, and the working section passes through the avoidance channel on one side of the base and is exposed to the other side of the base; a vacuum air path and a perspective window arranged corresponding to the vacuum air path are provided on the working section; external light can pass through the perspective window and the vacuum air path in turn and then pass out from the suction port of the suction nozzle. This solution can simultaneously mount and elastically support multiple chips, allowing the orientation of the chip to be obtained during the mounting process so as to adjust the chip instantly, realizing the efficient mounting and instant calibration capabilities of multiple chips.

Description

Technical Field

[0001] The present invention relates to the technical field of eutectic equipment, and in particular to an elastic suction nozzle assembly, a eutectic equipment and a eutectic method. Background Art

[0002] In the field of semiconductor manufacturing and electronic packaging, eutectic welding is a widely used chip attach technology that achieves electrical and mechanical connection by heating two metals to form an alloy layer.

[0003] However, traditional eutectic equipment and its nozzle components face multiple challenges in practical applications, limiting their performance and efficiency; existing nozzle structures are usually relatively rigid and cannot adapt to substrate surfaces of different heights or uneven surfaces. This may cause position deviation when placing the chip, or even damage sensitive components due to hard contact. In the process of moving the chip to the target position, the existing nozzle design often creates certain obstacles to the monitoring of the visual system, such as blocking the line of sight or reflecting light to interfere with the visual device from capturing a clear image, resulting in reduced positioning accuracy. Summary of the invention

[0004] In order to solve the problem that the existing nozzle structure is relatively rigid and easily obstructs the visual system, the present invention provides an elastic nozzle assembly, a eutectic device and a eutectic method.

[0005] In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions: an elastic suction nozzle assembly, applied to eutectic equipment, the elastic suction nozzle assembly comprises a base, at least two suction nozzles arranged on the base and an elastic component arranged corresponding to each of the suction nozzles; the suction nozzle comprises a connected connecting section and a working section, and the two ends of the elastic component are connected to the base and the corresponding connecting section of the suction nozzle; a through avoidance channel is provided on the base, the working section can be movably located in the avoidance channel, and the working section passes through the avoidance channel on one side of the base and is exposed on the other side of the base; a vacuum air path and a perspective window arranged corresponding to the vacuum air path are provided on the working section; external light can pass through the perspective window and the vacuum air path in sequence and then pass out from the suction port of the suction nozzle.

[0006] Preferably, the vacuum air path comprises an input section, a turning section and an output section which are connected in sequence and arranged at an angle, and the perspective window is coaxial with the output section.

[0007] Preferably, the perspective window comprises a connecting hole provided on the suction nozzle and a transparent sheet closing the connecting hole, the connecting hole is connected to the output section and the connecting hole is coaxial with the output section.

[0008] Preferably, the elastic member assembly includes a first fixing portion, a spring sheet and a second fixing portion which are connected in sequence; the first fixing portion is fixed to the base, the second fixing portion is fixed to the nozzle, and the second fixing portion is arranged away from the perspective window.

[0009] Preferably, at least two elastic sheets are stacked between the first fixing portion and the second fixing portion, a first gap is provided between adjacent elastic sheets, and a second gap is provided between the elastic sheet and the base.

[0010] Preferably, a stopper is provided on the base, the first fixing portion is fixed to the connecting section of the suction nozzle, and the stopper is located on a side of the connecting section away from the second fixing portion.

[0011] Preferably, it also includes a sensing component arranged corresponding to each of the elastic components, for sensing the deformation degree of the corresponding elastic component.

[0012] Preferably, the suction nozzle is flat, and adjacent surfaces of adjacent suction nozzles are planes; and the cross-sectional area of ​​the working section gradually increases from an end close to the suction port to an end far from the suction port.

[0013] In order to solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a eutectic device, comprising a main body and an elastic suction nozzle assembly as described above which is movably arranged on the main body; a eutectic table is also provided on the main body, a eutectic region is provided on the eutectic table, and the maximum inner diameter of the eutectic region is greater than the sum of the total arrangement lengths of all suction nozzles in the elastic suction nozzle assembly along their arrangement direction.

[0014] In order to solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a eutectic method, using the elastic suction nozzle assembly as described above to mount the eutectic, comprising the following steps: using the elastic suction nozzle assembly to suck up the chip and move it to the substrate; in the process of moving and placing the chip, obtaining the orientation of the chip through the avoidance channel by a visual device, and calibrating the orientation of the chip by adjusting the orientation of the elastic suction nozzle assembly; in the process of heating the eutectic, the chip is pressed against the substrate by the suction nozzle, and the position of the suction nozzle is adaptively adjusted by the elastic assembly.

[0015] Compared with the prior art, the elastic nozzle assembly, eutectic device and eutectic method provided by the present invention have the following beneficial effects:

[0016] 1. An elastic suction nozzle assembly provided by an embodiment of the present invention can simultaneously mount and elastically support and fix multiple chips, and allows the orientation of the chip to be obtained during the mounting process so as to adjust the orientation of the chip in real time. The overall solution realizes the efficient mounting and real-time calibration capabilities of multiple chips by introducing elastic components, vacuum air paths and corresponding perspective windows. Specifically, the base serves as a basic platform, carrying multiple suction nozzles and corresponding elastic components. The arrangement of multiple suction nozzles enables the elastic suction nozzle assembly to simultaneously absorb and transfer multiple chips. The base and the suction nozzle are connected at both ends of the elastic component, so that the suction nozzle has a certain range of movement relative to the base, reducing the risk of chip damage caused by hard contact, and allowing the elastic component and the suction nozzle to move relative to the base. The nozzles are arranged one-to-one, so that each nozzle can move relatively independently and realize independent downward pressure feedback; the avoidance channel provides the necessary movement space for the nozzle and allows it to extend out of the base for operation, so that the nozzle can move freely without interfering with other components, thereby enhancing flexibility; the vacuum air path consists of an input section, a turning section and an output section; the perspective window is arranged at the output section, so that light can enter through the perspective window and reach the suction port along the vacuum air path, which facilitates the external visual device to capture the posture information of the chip and improves the positioning accuracy; at the same time, the vacuum air path and the elastic component are respectively arranged corresponding to the working section and the connecting section of the nozzle, which can avoid the elastic component interfering with the visual device in capturing the posture information of the chip.

[0017] 2. In the embodiment of the present invention, the vacuum air path design cleverly solves the potential conflict problem between the vacuum equipment and the visual device; specifically, the presence of the turning section enables the input section and the output section of the vacuum air path to be staggered. This is to ensure that there is no physical interference between the vacuum equipment (usually used to generate the negative pressure required to absorb the chip) and the visual device (such as a camera or other optical sensor, used to monitor and calibrate the position of the chip). In this way, it can be ensured that the two key systems work independently and do not interfere with each other; the coaxial design of the output section and the perspective window ensures that the light can pass through the vacuum air path in a straight line from the perspective window to the adsorption port, which not only simplifies the optical path, but also improves the transmittance, thereby ensuring that the visual device captures clear and accurate image information, which helps to achieve high-precision chip positioning and calibration.

[0018] 3. In the embodiment of the present invention, by designing the connection hole and the output section to be coaxial, it is ensured that the light entering from the perspective window can pass through the vacuum air path along a straight path and directly reach the adsorption port. This straight light path design simplifies the optical system, reduces the loss and distortion of light during transmission, and thus improves the quality and accuracy of the image acquired by the visual device; using a transparent sheet to seal the connection hole can effectively prevent external impurities from entering the interior of the suction nozzle while maintaining good light transmittance, which helps to maintain the cleanliness of the perspective window, thereby ensuring that the captured chip image is always clear and visible, which is conducive to subsequent analysis and processing, while providing the necessary sealing performance to prevent vacuum leakage.

[0019] 4. In the embodiment of the present invention, the design of the elastic component assembly not only provides the necessary elastic support for the suction nozzle, ensuring its stability and safety during operation, but also further improves the overall performance and user experience of the system by cleverly avoiding details such as the perspective window; specifically, the spring sheet, as the core part of the elastic component, can provide the necessary elastic support for the suction nozzle. When the suction nozzle contacts the substrate or chip, the spring sheet can absorb the impact and give appropriate restoring force to avoid damage caused by hard contact. This feature is crucial for protecting sensitive components (such as chips); the first fixed part is connected to the base, and the second fixed part is connected to the suction nozzle. Such a structure allows each suction nozzle to have independent micro-movement capabilities in the vertical direction; this helps the suction nozzle to adapt to different substrate height changes to ensure that each placement can reach the optimal position; the design of the second fixed part avoiding the perspective window ensures that the transparent sheet area is not affected by any mechanical structure, which not only maintains the integrity of the perspective window, but also avoids the problem that the visual device cannot accurately capture chip information due to the obstruction of the fixed component.

[0020] 5. In the embodiment of the present invention, the avoidance function is achieved by cleverly utilizing the gap, which effectively avoids mutual interference between the springs, and at the same time provides multi-level elastic buffering and the ability to support complex motion patterns. Specifically, by adjusting the number and material of the springs, the stiffness of the entire elastic component can be adjusted within a large range. This is critical for meeting the force requirements in different application scenarios. For example, when handling chips of different sizes or weights, the downward pressure of the nozzle can be flexibly adjusted; the first gap and the second gap play a role in avoiding position, ensuring that the layers of springs will not interfere with each other or get stuck during the compression process. This not only improves the reliability and stability of the system, but also reduces energy loss and wear problems caused by friction.

[0021] 6. In the embodiment of the present invention, the presence of the stopper directly limits the maximum distance that the nozzle can move downward, preventing the nozzle from over-extending or applying excessive pressure to the chip; at the same time, a clear stopping point is provided for the nozzle, ensuring that the nozzle can contact the substrate in a consistent manner during each placement process. This consistency helps to achieve more precise positioning and placement, which is crucial for protecting sensitive components from damage, especially when handling tiny or fragile electronic components.

[0022] 7. In the embodiment of the present invention, the sensing component can monitor the deformation degree of each elastic component in real time, thereby indirectly obtaining the actual pressure applied by the nozzle to the chip. This high-precision force feedback mechanism ensures that the force control during the mounting process is more accurate, which helps to improve the mounting quality.

[0023] 8. In the embodiment of the present invention, the flat design of the nozzle and the feature that the adjacent surfaces are flat enable multiple nozzles to be arranged more closely together. This not only improves the space utilization, but also supports the simultaneous eutectic mounting of multiple chips with small pitches, meeting the requirements of high-density packaging.

[0024] 9. The eutectic device provided in the embodiment of the present invention includes the above-mentioned elastic suction nozzle assembly, and therefore also has the same beneficial effects as the above-mentioned elastic suction nozzle assembly, which will not be elaborated here.

[0025] 10. The eutectic method provided in the embodiment of the present invention adopts the above-mentioned elastic suction nozzle assembly to mount the eutectic, and therefore also has the same beneficial effects as the above-mentioned elastic suction nozzle assembly, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural diagram of an elastic suction nozzle assembly provided in the first embodiment of the present invention.

[0027] Figure 2 FIG. 1 is a top view of an elastic nozzle assembly provided in the first embodiment of the present invention.

[0028] Figure 3 is along Figure 2 Sectional view along AA.

[0029] Figure 4 yes Figure 3 Enlarged view of B.

[0030] Figure 5 It is a block diagram of a eutectic device provided in the first embodiment of the present invention.

[0031] Description of the accompanying drawings:

[0032] 100. eutectic device; 10. elastic nozzle assembly; 20. body;

[0033] 1. Base; 11. Avoidance channel; 12. Block; 2. Suction nozzle; 21. Connecting section; 22. Working section; 221. Vacuum air path; 2211. Input section; 2212. Turning section; 2213. Output section; 222. Perspective window; 2221. Connecting hole; 2222. Transparent sheet; 3. Elastic component; 31. First fixing part; 32. Spring sheet; 33. Second fixing part; 34. First gap; 35. Second gap; 4. Induction component. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0035] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0036] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0037] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the above-mentioned processes does not mean the necessary order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0038] The flow chart and block diagram in the accompanying drawings of the present invention illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be particularly noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs a specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0039] In eutectic equipment, the main function of the nozzle is to pick up the chip from the source position by vacuum adsorption and place it precisely to the target position. This operation requires the nozzle to have high precision and stability to ensure that the chip will not be damaged or shifted during the transfer process; in order to safely and reliably carry the chip, the nozzle needs to generate enough negative pressure to adsorb chips of different sizes, shapes and weights. At the same time, when placing the chip, the nozzle should be able to release the chip quickly to ensure the smooth progress of the mounting process. During the eutectic welding process, the chip needs to form a good physical contact with the substrate. By applying appropriate pressure, the nozzle can make the interface between the chip and the substrate fit more closely and reduce the presence of air or other impurities, which is necessary for the formation of a uniform and reliable intermetallic compound layer.

[0040] Please combine Figure 1 and Figure 2 The first embodiment of the present invention provides an elastic suction nozzle assembly 10, which is applied to eutectic equipment. The elastic suction nozzle assembly 10 includes a base 1, at least two suction nozzles 2 arranged on the base 1, and an elastic component 3 arranged corresponding to each suction nozzle 2; the suction nozzle 2 includes a connected connecting section 21 and a working section 22, and the two ends of the elastic component 3 are connected to the base 1 and the corresponding connecting section 21 of the suction nozzle 2; a through avoidance channel 11 is provided on the base 1, and the working section 22 can be movably located in the avoidance channel 11, and the working section 22 passes through the avoidance channel 11 on one side of the base 1 and is exposed on the other side of the base 1; a vacuum air path 221 and a perspective window 222 arranged corresponding to the vacuum air path 221 are provided on the working section 22; external light can pass through the perspective window 222 and the vacuum air path 221 in sequence and then pass out from the suction port of the suction nozzle 2.

[0041] It can be understood that the elastic suction nozzle assembly 10 provided in the embodiment of the present invention can simultaneously mount and elastically support and fix multiple chips, and allows the orientation of the chip to be obtained during the mounting process so as to adjust the orientation of the chip in real time. The overall solution realizes the efficient mounting and real-time calibration capabilities of multiple chips by introducing the elastic component 3, the vacuum air path 221 and the corresponding perspective window 222; specifically, the base 1 serves as a basic platform, carrying multiple suction nozzles 2 and corresponding elastic components 3; the arrangement of multiple suction nozzles 2 enables the elastic suction nozzle assembly 10 to simultaneously absorb and transfer multiple chips; the two ends of the elastic component 3 are connected to the base 1 and the suction nozzle 2, so that the suction nozzle 2 has a certain range of movement relative to the base 1, reducing the risk of chip damage caused by hard contact, and the elastic component 3 and the suction nozzle 2 are arranged one-to-one, so that Each suction nozzle 2 can move relatively independently and realize independent downward pressure feedback; the avoidance channel 11 provides the suction nozzle 2 with necessary movement space and allows it to extend out of the base 1 for operation, so that the suction nozzle 2 can move freely without interfering with other components, thereby enhancing flexibility; the vacuum air path 221 is composed of an input section 2211, a turning section 2212 and an output section 2213; the perspective window 222 is arranged at the output section 2213, so that light can enter through the perspective window 222 and reach the suction port along the vacuum air path 221, which facilitates the external visual device to capture the posture information of the chip and improves the positioning accuracy; at the same time, the vacuum air path 221 and the elastic component 3 are respectively arranged corresponding to the working section 22 and the connecting section 21 of the suction nozzle 2, which can prevent the elastic component 3 from interfering with the visual device in capturing the posture information of the chip.

[0042] As an implementation method, the base 1 is placed horizontally, the elastic component 3 is arranged parallel to the top surface of the base 1, and the avoidance channel 11 runs through the base 1 longitudinally. The horizontal placement of the base 1 provides a stable reference surface for the entire device. The parallel arrangement of the elastic components 3 can ensure that each elastic component 3 works at the same height, thereby providing uniform pressure distribution in the entire mounting area, avoiding problems caused by uneven local pressure, and the longitudinal avoidance channel 11 provides a longitudinal movement adjustment space for the suction nozzle 2; when the suction nozzle 2 is against the chip during the eutectic process, the reaction force will cause the suction nozzle 2 to move up along the avoidance channel 11 and drive the elastic component 3 to deform until a balanced state is reached; due to the presence of the elastic component 3, the suction nozzle 2 can automatically adjust the applied pressure according to chips of different thicknesses, ensuring that each chip can be subjected to appropriate pressure, and realizing high-precision pressure application. This is not only suitable for chips of standard thickness, but also can handle chips of different thicknesses caused by manufacturing tolerances or design requirements. When chips of different specifications need to be processed, the elastic component 3 can respond quickly and adjust to a suitable working state, without the need to frequently replace hardware or perform complex recalibration, thereby improving operating efficiency.

[0043] Please combine Figure 3and Figure 4 As an implementation manner, the vacuum air path 221 includes an input section 2211 , a turning section 2212 , and an output section 2213 which are connected in sequence and arranged at an angle, and the perspective window 222 is coaxial with the output section 2213 .

[0044] It can be understood that in the embodiment of the present invention, the design of the vacuum air path 221 cleverly solves the potential conflict problem between the vacuum equipment and the visual device; specifically, the presence of the turning section 2212 enables the input section 2211 and the output section 2213 of the vacuum air path 221 to be staggered. This is to ensure that there is no physical interference between the vacuum equipment (usually used to generate the negative pressure required to absorb the chip) and the visual device (such as a camera or other optical sensor, used to monitor and calibrate the position of the chip). In this way, it can be ensured that the two key systems work independently and do not interfere with each other; the coaxial design of the output section 2213 and the perspective window 222 ensures that light can pass through the vacuum air path 221 from the perspective window 222 in a straight line to the adsorption port, which not only simplifies the optical path, but also improves the transmittance, thereby ensuring that the visual device captures clear and accurate image information, which helps to achieve high-precision chip positioning and calibration.

[0045] As an implementation method, the input section 2211 may be detachably connected to the turning section 2212. The detachable connection enables the input section 2211 and the turning section 2212 to be independently detached and assembled, and also facilitates the access of external vacuum equipment.

[0046] As an implementation manner, the perspective window 222 includes a connecting hole 2221 provided on the suction nozzle 2 and a transparent sheet 2222 closing the connecting hole 2221 , and the connecting hole 2221 is connected to the output section 2213 and the connecting hole 2221 is coaxial with the output section 2213 .

[0047] It can be understood that in the embodiment of the present invention, by designing the connection hole 2221 and the output section 2213 to be coaxial, it is ensured that the light entering from the perspective window 222 can pass through the vacuum air path 221 along a straight path and directly reach the suction port. This straight light path design simplifies the optical system, reduces the loss and distortion of light during transmission, and thus improves the quality and accuracy of the image acquired by the visual device; using a transparent sheet 2222 to seal the connection hole 2221 can effectively prevent external impurities from entering the interior of the suction nozzle 2 while maintaining good light transmittance, which helps to maintain the cleanliness of the perspective window 222, thereby ensuring that the captured chip image is always clearly visible, which is conducive to subsequent analysis and processing, while providing the necessary sealing performance to prevent vacuum leakage.

[0048] As an implementation manner, the transparent sheet 2222 is high-transmittance glass.

[0049] High-transmittance glass has extremely high light transmittance, which can minimize the loss and distortion of light when it passes through. This ensures that the image obtained by the visual device is clear and accurate, which helps to achieve high-precision chip positioning and posture calibration.

[0050] Please combine Figure 1 and Figure 2 As an embodiment, the elastic member assembly includes a first fixing portion 31, a spring piece 32 and a second fixing portion 33 connected in sequence; the first fixing portion 31 is fixed on the base 1, the second fixing portion 33 is fixed on the suction nozzle 2, and the second fixing portion 33 is arranged to avoid the perspective window 222.

[0051] It can be understood that in the embodiment of the present invention, the design of the elastic component assembly not only provides the necessary elastic support for the suction nozzle 2, ensuring its stability and safety during operation, but also further improves the overall performance and user experience of the system by cleverly avoiding the perspective window 222 and other details; Specifically, the spring 32, as the core part of the elastic component, can provide the necessary elastic support for the suction nozzle 2. When the suction nozzle 2 contacts the substrate or chip, the spring 32 can absorb the impact and give appropriate restoring force to avoid damage caused by hard contact. This feature is crucial for protecting sensitive components (such as chips); the first fixed part 31 is connected to the base 1, and the second fixed part 33 is connected to the suction nozzle 2. Such a structure allows each suction nozzle 2 to have independent micro-movement ability in the vertical direction; this helps the suction nozzle 2 to adapt to different substrate height changes and ensure that each placement can reach the best position; the second fixed part 33 avoids the design of the perspective window 222, ensuring that the transparent sheet 2222 area is not affected by any mechanical structure, which not only maintains the integrity of the perspective window 222, but also avoids the problem that the visual device cannot accurately capture chip information due to the blocking of the fixed component.

[0052] Specifically, when the suction nozzle 2 moves longitudinally, the second fixing portion 33 is simultaneously driven to move, and the elastic sheet 32 ​​is driven to bend and deform through the second fixing portion 33 .

[0053] Please combine Figure 1 and Figure 3 As an implementation mode, at least two spring sheets 32 are stacked between the first fixing portion 31 and the second fixing portion 33 , a first gap 34 is provided between adjacent spring sheets 32 , and a second gap 35 is provided between the spring sheet 32 ​​and the base 1 .

[0054] It can be understood that in the embodiment of the present invention, the avoidance function is achieved by cleverly utilizing the gap, which effectively avoids mutual interference between the springs 32, and at the same time provides multi-level elastic buffering and the ability to support complex motion patterns. Specifically, by adjusting the number and material of the springs 32, the stiffness of the entire elastic component 3 can be adjusted within a large range. This is critical to meeting the force requirements in different application scenarios. For example, when handling chips of different sizes or weights, the downward pressure of the nozzle 2 can be flexibly adjusted; the first gap 34 and the second gap 35 play a role in avoiding position, ensuring that the layers of springs 32 will not interfere with each other or get stuck during the compression process. This not only improves the reliability and stability of the system, but also reduces energy loss and wear problems caused by friction.

[0055] As an embodiment, the distances between the first gap 34 and the second gap 35 are equal. It is understandable that when all gap distances are equal, the spring piece 32 will not produce additional friction or jamming during movement due to a certain layer of gap being too small. The uniform gap design allows the spring piece 32 to maintain a consistent movement path during deformation, reducing the nonlinear deformation caused by mutual interference between spring pieces 32 at different levels. This can more accurately predict and control the response behavior of the spring piece 32, improving the predictability and reliability of the system. The use of equal gaps in the design simplifies the production and assembly process. Manufacturers only need to set a standard gap value for mass production, without having to adjust the gap size for different positions, reducing manufacturing difficulty and cost.

[0056] As an implementation manner, a stopper 12 is provided on the base 1 , the first fixing portion 31 is fixed to the connecting section 21 of the suction nozzle 2 , and the stopper 12 is located on a side of the connecting section 21 away from the second fixing portion 33 .

[0057] It can be understood that in the embodiment of the present invention, the presence of the stopper 12 directly limits the maximum distance that the nozzle 2 can move downward, preventing the nozzle 2 from over-extending or applying excessive pressure to the chip; at the same time, a clear stopping point is provided for the nozzle 2 to ensure that the nozzle 2 can contact the substrate in a consistent manner during each mounting process. This consistency helps to achieve more precise positioning and mounting, which is crucial for protecting sensitive components from damage, especially when handling tiny or fragile electronic components.

[0058] Specifically, the stopper 12 is fixedly arranged on a side of the base 1 facing away from the elastic component 3 , the stopper 12 blocks the position of the avoidance channel 11 , and is arranged corresponding to the connecting section 21 , and the connecting section 21 is adapted to the adjacent surface of the stopper 12 .

[0059] As an implementation manner, it further includes a sensing component 4 provided corresponding to each elastic component 3 for sensing the deformation degree of the corresponding elastic component 3 .

[0060] It can be understood that in the embodiment of the present invention, the sensing component 4 can monitor the deformation degree of each elastic component 3 in real time, thereby indirectly obtaining the actual pressure applied by the suction nozzle 2 to the chip. This high-precision force feedback mechanism ensures that the force control during the mounting process is more accurate, which helps to improve the mounting quality.

[0061] As an implementation method, the sensing component 4 is arranged corresponding to the spring 32 in the elastic component 3. It can be understood that the sensing component 4 directly monitors the deformation degree of the spring 32 and can provide real-time, high-precision force feedback. This allows the control system to accurately understand the actual pressure applied by each nozzle 2 to the chip, thereby achieving more precise force control.

[0062] Through the data provided by the sensing component 4, a closed-loop control system can be constructed, so that the device can automatically adjust the position or downward pressure of the nozzle 2 according to the actual deformation. This feedback mechanism significantly improves the automation level of the system and its adaptability to complex operating environments. When the sensing component 4 detects that the deformation of the spring 32 exceeds the preset threshold, the system can immediately take measures (such as stopping the descent or reducing the pressure) to prevent damage to the chip or other sensitive components due to excessive pressure. This provides additional protection for the safe operation of the equipment.

[0063] As an implementation method, a sensing component 4 is provided for each spring piece 32. It can be understood that each spring piece 32 has a corresponding sensing component 4, which means that the downward pressure of each nozzle 2 can be independently monitored and accurately controlled. This is especially important for processing multi-chip eutectic mounting, ensuring that each chip can obtain the appropriate mounting force, improving the consistency and reliability of the overall process.

[0064] As an implementation manner, the sensing component 4 includes a distance sensing device and / or a force sensing device.

[0065] It can be understood that the distance sensing device can monitor the relative distance between the suction nozzle 2 and the substrate in real time, ensuring that the suction nozzle 2 can contact the chip at a consistent distance each time it is mounted. This helps to improve the mounting accuracy and avoid chip damage or poor welding caused by distance deviation. The force sensing device can directly measure the actual pressure applied by the suction nozzle 2 to the chip and provide high-precision force feedback. This allows the control system to accurately adjust the downward pressure as needed to ensure that each placement achieves the best effect.

[0066] It should be noted that, when the sensing component 4 includes a distance sensing device, a third gap is provided between the sensing component 4 and the spring 32 ; when the nozzle 2 moves in the avoidance channel 11 , the spring 32 approaches or moves away from the distance sensing device.

[0067] When the sensing component 4 includes a force sensing device, the force sensing device abuts against the elastic sheet 32 ​​.

[0068] As an implementation mode, the suction nozzle 2 is flat, and the adjacent surfaces of adjacent suction nozzles 2 are planes; the cross-sectional area of ​​the working section 22 gradually increases from the end close to the suction port to the end far from the suction port.

[0069] It can be understood that in the embodiment of the present invention, the flat design of the suction nozzle 2 and the feature that the adjacent surfaces are flat allow multiple suction nozzles 2 to be arranged more closely together. This not only improves the space utilization, but also supports the simultaneous eutectic mounting of multiple chips with small pitches, meeting the requirements of high-density packaging. In order to solve the above technical problems, the present invention provides another technical solution as follows: A eutectic device, comprising a body and an elastic suction nozzle assembly as above that is movably arranged on the body.

[0070] It can be understood that the eutectic device provided in the embodiment of the present invention includes the above-mentioned elastic suction nozzle assembly, and therefore also has the same beneficial effects as the above-mentioned elastic suction nozzle assembly, which will not be elaborated here.

[0071] See also Figure 5 A second embodiment of the present invention provides a eutectic device 100, comprising a body 20 and the elastic nozzle assembly 10 as described above which is movably disposed on the body.

[0072] It can be understood that the eutectic device 100 provided in the embodiment of the present invention includes the elastic nozzle assembly 10 described above, and therefore also has the same beneficial effects as the elastic nozzle assembly 10 described above, which will not be elaborated herein.

[0073] As an embodiment, a eutectic table is also provided on the main body 20, and a eutectic area is provided on the eutectic table, and the maximum inner diameter of the eutectic area is greater than the sum of the total arrangement lengths of all the nozzles in the elastic nozzle assembly along their arrangement direction. It can be understood that this ensures that the eutectic table can fully accommodate the corresponding substrate. This ensures that when multiple chips are mounted, the substrate will not be partially suspended or exceed the range of the eutectic table due to size limitations, thereby ensuring the stability and safety of the mounting process; since the elastic nozzle assembly 10 can operate multiple nozzles at the same time for multi-chip mounting, the design of the eutectic table fully considers this. The larger eutectic area allows the substrate to have enough space to place multiple chips, and each chip can be properly supported, avoiding mounting problems caused by insufficient space.

[0074] Please combine Figures 1 to 5The working process / principle of the eutectic device 100 provided in this embodiment is briefly described as follows: Through the vacuum air path 221, the suction nozzle 2 generates sufficient negative pressure to absorb the chip. At this time, the connection section 21 of the suction nozzle 2 is stationary relative to the base 1, and the working section 22 is exposed through the avoidance channel 11 to ensure that it can move freely and contact the chip. Since each suction nozzle 2 is equipped with an independent elastic component 3 (including a spring 32 and a sensing component 4), the position of the suction nozzle 2 can be fine-tuned according to actual needs to ensure that each suction nozzle 2 can accurately align with the corresponding chip. In the process of moving the chip from the source position to the target position, the external visual device monitors the attitude information of the chip in real time through the avoidance channel 11, and adjusts the direction and angle of the suction nozzle 2 according to the feedback to ensure that the chip is placed correctly. When the suction nozzle 2 reaches the target position, the elastic suction nozzle 2 component is moved down and the chip is gently but firmly pressed on the substrate through the action of the elastic component 3 to ensure that the two are in close contact. This step is crucial to forming a uniform and reliable intermetallic compound layer. Start the heating program so that the interface between the chip and the substrate reaches the eutectic transformation temperature and completes the welding process. During this period, the elastic component 3 adaptively adjusts the position of the suction nozzle 2 to ensure good contact quality even on surfaces that are not completely flat.

[0075] A third embodiment of the present invention provides a eutectic method, which uses the elastic nozzle assembly as described above to mount the eutectic, and includes the following steps:

[0076] S1: Use an elastic suction nozzle assembly to pick up the chip and move it to the substrate; in the process of moving and placing the chip, the position of the chip is obtained through the avoidance channel by a visual device, and the position of the chip is calibrated by adjusting the position of the elastic suction nozzle assembly;

[0077] S3: During the process of heating the eutectic, the chip is pressed against the substrate by a suction nozzle, and the position of the suction nozzle is adaptively adjusted by an elastic component.

[0078] It can be understood that the eutectic method provided in the embodiment of the present invention adopts the above-mentioned elastic suction nozzle assembly to mount the eutectic, and therefore also has the same beneficial effects as the above-mentioned elastic suction nozzle assembly, which will not be elaborated here.

[0079] The above is a detailed introduction to an elastic nozzle assembly, eutectic equipment and eutectic method disclosed in the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention, and any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An elastic nozzle assembly, applied to eutectic equipment, characterized by: The elastic suction nozzle assembly comprises a base, at least two suction nozzles arranged on the base, and an elastic assembly arranged corresponding to each of the suction nozzles; The nozzle comprises a connecting section and a working section connected to each other, and two ends of the elastic component are connected to the base and the corresponding connecting section of the nozzle; The base is provided with a through avoidance channel, the working section is movably located in the avoidance channel, and the working section passes through the avoidance channel on one side of the base and is exposed on the other side of the base; the base is placed horizontally, the elastic component is arranged parallel to the top surface of the base, and the avoidance channel vertically penetrates the base; The working section is provided with a vacuum air path and a perspective window corresponding to the vacuum air path; external light can pass through the perspective window and the vacuum air path in sequence and then pass out from the suction port of the suction nozzle; the elastic component includes a first fixing part, a spring sheet and a second fixing part which are connected in sequence; the first fixing part is fixed to the base, the second fixing part is fixed to the suction nozzle, and the second fixing part is arranged to avoid the perspective window; at least two spring sheets are stacked between the first fixing part and the second fixing part, a first gap is provided between adjacent spring sheets, and a second gap is provided between the spring sheet and the base.

2. The elastic nozzle assembly according to claim 1, characterized in that: The vacuum air path comprises an input section, a turning section and an output section which are connected in sequence and arranged at an angle, and the perspective window is coaxial with the output section.

3. The elastic nozzle assembly according to claim 2, characterized in that: The perspective window includes a connecting hole provided on the suction nozzle and a transparent sheet closing the connecting hole, wherein the connecting hole is connected to the output section and the connecting hole is coaxial with the output section.

4. The elastic nozzle assembly according to claim 1, characterized in that: A stopper is provided on the base, the first fixing portion is fixed on the connecting section of the suction nozzle, and the stopper is located on a side of the connecting section away from the second fixing portion.

5. The elastic nozzle assembly according to claim 1, characterized in that: It also includes a sensing component arranged corresponding to each of the elastic components, for sensing the deformation degree of the corresponding elastic component.

6. The elastic nozzle assembly according to claim 1, characterized in that: The suction nozzle is flat, and adjacent surfaces of adjacent suction nozzles are planes; the cross-sectional area of ​​the working section gradually increases from an end close to the suction port to an end far from the suction port.

7. A eutectic device, characterized in that: It comprises a main body and an elastic suction nozzle assembly as claimed in any one of claims 1 to 6 which is movably arranged on the main body; the main body is also provided with a eutectic table, the eutectic table is provided with a eutectic region, the maximum inner diameter of the eutectic region is greater than the sum of the total arrangement lengths of all suction nozzles in the elastic suction nozzle assembly along their arrangement direction.

8. A eutectic method, characterized in that: Using the elastic nozzle assembly as described in any one of claims 1 to 6 to mount a eutectic comprises the following steps: Use the elastic nozzle assembly to pick up the chip and move it to the substrate; In the process of moving and placing the chip, the orientation of the chip is obtained through the avoidance channel by the visual device, and the orientation of the chip is calibrated by adjusting the orientation of the elastic nozzle assembly; During the process of heating the eutectic, the chip is pressed against the substrate by a suction nozzle, and the position of the suction nozzle is adaptively adjusted by an elastic component.

Images