Light-emitting assembly and display substrate

Abstract

The invention discloses a light-emitting assembly and a display substrate, and relates to the technical field of display. The light-emitting assembly comprises a substrate and a first light-emitting unit, a second light-emitting unit and a third light-emitting unit which are located on one side of the substrate. The first light-emitting functional layer of the first light-emitting unit, the second light-emitting functional layer of the second light-emitting unit and the third light-emitting functional layer of the third light-emitting unit are sequentially sleeved. Therefore, the optical environments of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are close, and the light-emitting effect of the light-emitting assembly can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting component and a display substrate. Background Art

[0002] The display substrate includes a driving backplane and a plurality of light-emitting components connected to the driving backplane, wherein the driving backplane can provide driving signals for the light-emitting components to make the light-emitting components emit light, thereby realizing display.

[0003] In the related art, the light emitting assembly includes a substrate and light emitting units located on the substrate. Usually, due to the different distances between each light emitting unit and the two sides of the substrate, the optical environments of different light emitting units are quite different, which leads to poor light emitting effect of the light emitting assembly. Summary of the invention

[0004] The present application provides a light-emitting component and a display substrate, which can solve the problem of poor light-emitting effect of the light-emitting component. The technical solution is as follows:

[0005] In one aspect, a light emitting component is provided, the light emitting component comprising:

[0006] substrate;

[0007] A first light emitting unit, a second light emitting unit and a third light emitting unit located on one side of the substrate;

[0008] The first light-emitting unit includes a first light-emitting functional layer, the outer side of which is annular; the second light-emitting unit includes a second light-emitting functional layer, the second light-emitting functional layer is annular, and the second light-emitting functional layer is sleeved on the outside of the first light-emitting functional layer; the third light-emitting unit includes a third light-emitting functional layer, the third light-emitting functional layer is annular, and the third light-emitting functional layer is sleeved on the outside of the second light-emitting functional layer.

[0009] Optionally, the first light-emitting functional layer has a hollow region, and the ring shape of the outer side surface of the first light-emitting functional layer and the hollow region of the first light-emitting functional layer make the first light-emitting functional layer a ring-shaped structure.

[0010] Optionally, the first light-emitting unit, the second light-emitting unit and the third light-emitting unit further include: a common semiconductor layer located on a side of the first light-emitting functional layer, the second light-emitting functional layer and the third light-emitting functional layer close to the substrate;

[0011] The common semiconductor layer comprises: a first connection part, a second connection part and a third connection part which are arranged at intervals, wherein the first connection part is annular on one side close to the second connection part, the second connection part and the third connection part are both annular structures, the second connection part is sleeved outside the first connection part, and the third connection part is sleeved outside the second connection part;

[0012] The first light-emitting functional layer includes a first light-emitting layer and a first semiconductor layer stacked in a direction away from the common semiconductor layer; the second light-emitting functional layer includes a second light-emitting layer and a second semiconductor layer stacked in a direction away from the common semiconductor layer; the third light-emitting functional layer includes a third light-emitting layer and a third semiconductor layer stacked in a direction away from the common semiconductor layer;

[0013] The first light-emitting layer is connected to the first connecting portion, the second light-emitting layer is connected to the second connecting portion, and the third light-emitting layer is connected to the third connecting portion.

[0014] Optionally, the first light-emitting unit further includes a first light-emitting electrode, the first light-emitting electrode is located on a side of the first light-emitting functional layer away from the substrate, and the first light-emitting electrode is connected to the first semiconductor layer; the first light-emitting electrode is a ring structure, and the orthographic projection of the first light-emitting electrode on the substrate is located within the orthographic projection of the first light-emitting functional layer on the substrate;

[0015] The second light-emitting unit further includes a second light-emitting electrode, which is located on a side of the second light-emitting functional layer away from the substrate, and the second light-emitting electrode is connected to the second semiconductor layer; the second light-emitting electrode is a ring structure, and the orthographic projection of the second light-emitting electrode on the substrate is located within the orthographic projection of the second light-emitting functional layer on the substrate;

[0016] The third light-emitting unit also includes a third light-emitting electrode, which is located on a side of the third light-emitting functional layer away from the substrate, and the third light-emitting electrode is connected to the third semiconductor layer; the third light-emitting electrode is a ring structure, and the orthographic projection of the third light-emitting electrode on the substrate is located within the orthographic projection of the third light-emitting functional layer on the substrate.

[0017] Optionally, the common semiconductor layer further includes: a common connection portion, wherein the common connection portion and the first connection portion, the second connection portion and the third connection portion are arranged at intervals;

[0018] The first light emitting unit, the second light emitting unit and the third light emitting unit further include: a common light emitting electrode located at a side of the common semiconductor layer away from the substrate, and the common light emitting electrode is connected to the common connecting portion.

[0019] Optionally, the light emitting component further includes:

[0020] an insulating protective layer, the insulating protective layer being located on a side of the first light-emitting electrode, the second light-emitting electrode, the third light-emitting electrode and the common light-emitting electrode away from the substrate, the insulating protective layer comprising a first via hole, a second via hole, a third via hole and a common via hole; the first via hole exposes at least a portion of the first light-emitting electrode, the second via hole exposes at least a portion of the second light-emitting electrode, the third via hole exposes at least a portion of the third light-emitting electrode, and the common via hole exposes at least a portion of the common light-emitting electrode;

[0021] A first connecting electrode, a second connecting electrode, a third connecting electrode and a common connecting electrode are located on a side of the insulating protective layer away from the substrate, the first connecting electrode is connected to the first light-emitting electrode through the first via hole, the second connecting electrode is connected to the second light-emitting electrode through the second via hole, the third connecting electrode is connected to the third light-emitting electrode through the third via hole, and the common connecting electrode is connected to the common light-emitting electrode through the common via hole.

[0022] Optionally, the substrate has a first side surface and a second side surface that are oppositely arranged, and a third side surface and a fourth side surface that are oppositely arranged, the first end of the third side surface is connected to the first end of the first side surface, the second end of the third side surface is connected to the first end of the second side surface, the first end of the fourth side surface is connected to the second end of the first side surface, and the second end of the fourth side surface is connected to the second end of the second side surface; the first side surface, the second side surface, the third side surface and the fourth side surface are connected to form four corners;

[0023] The first connecting electrode includes a first connecting wire and a first connecting pad, at least a portion of the first connecting wire is located in the first via hole and is connected to the first light-emitting electrode exposed by the first via hole;

[0024] The second connecting electrode includes a second connecting wire and a second connecting pad, at least a portion of the second connecting wire is located in the second via hole and is connected to the second light-emitting electrode exposed by the second via hole;

[0025] The third connection electrode includes a third connection wire and a third connection pad, at least a portion of the third connection wire is located in the third via hole and is connected to the third light-emitting electrode exposed by the third via hole;

[0026] The common connection electrode includes a common connection wire and a common connection pad, at least a portion of the common connection wire is located in the fourth via hole and is connected to the common light-emitting electrode exposed by the common via hole;

[0027] Wherein, the first connection pad, the second connection pad, the third connection pad and the common connection pad are respectively located at the four corners.

[0028] Optionally, the light emitting color of the first light emitting unit is blue, the light emitting color of the second light emitting unit is red, and the light emitting color of the third light emitting unit is green.

[0029] Optionally, the substrate includes a first side surface and a second side surface that are arranged opposite to each other;

[0030] The distance between the first light-emitting functional layer and the first side is equal to the distance between the first light-emitting functional layer and the second side; the distance between the second light-emitting functional layer and the first side is equal to the distance between the second light-emitting functional layer and the second side; the distance between the third light-emitting functional layer and the first side is equal to the distance between the third light-emitting functional layer and the second side.

[0031] Optionally, the light-emitting component further includes: a color conversion unit located on a side of the first light-emitting unit close to the substrate; the color conversion unit includes:

[0032] A first light shielding layer located on a side of the substrate close to the light-emitting unit, wherein the first light shielding layer has a light-through hole;

[0033] a limiting dam layer located at a side of the first light shielding layer away from the substrate, the limiting dam layer having an opening area corresponding to the light through hole, and an orthographic projection of the opening area on the substrate overlaps with an orthographic projection of the corresponding light through hole on the substrate;

[0034] An optical functional layer located in the opening area, at least a portion of the optical functional layer is used to convert the color of light entering the optical functional layer;

[0035] and, a filter layer located between the substrate and the optical functional layer; the filter layer comprises a filter unit corresponding to the light through hole, and the orthographic projection of the filter unit on the substrate overlaps with the orthographic projection of the corresponding light through hole on the substrate;

[0036] Wherein, the first light-emitting functional layer of the first light-emitting unit, the opening area and the light-through hole are arranged correspondingly.

[0037] On the other hand, a display substrate is provided, the display substrate comprising: a driving backplane, and a plurality of light-emitting components as described in the above aspects located on one side of the driving backplane;

[0038] The driving backplane is used to provide a driving signal for the light-emitting component to drive the light-emitting component to emit light.

[0039] Optionally, the display substrate further includes: a second light shielding layer;

[0040] The second light shielding layer is at least located between adjacent light emitting components among the plurality of light emitting components, and the second light shielding layer is disposed in contact with the side surface of the substrate in the light emitting components.

[0041] Optionally, the second light shielding layer includes a first portion located between adjacent light emitting components, and a second portion located on a side of the light emitting component away from the driving backplane;

[0042] The first part and the second part are distributed continuously.

[0043] The beneficial effects of the technical solution provided by this application include at least:

[0044] The present application provides a light-emitting component and a display substrate, wherein the light-emitting component includes a substrate and a first light-emitting unit, a second light-emitting unit and a third light-emitting unit located on one side of the substrate. Since the first light-emitting functional layer of the first light-emitting unit, the second light-emitting functional layer of the second light-emitting unit and the third light-emitting functional layer of the third light-emitting unit are sequentially connected, the optical environments of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit can be ensured to be close, thereby improving the light-emitting effect of the light-emitting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1 is a top view of a light-emitting component provided in an embodiment of the present application;

[0047] Figure 2 is a cross-sectional schematic diagram of a light-emitting component provided in an embodiment of the present application;

[0048] Figure 3 is a top view of another light-emitting component provided in an embodiment of the present application;

[0049] Figure 4is a cross-sectional schematic diagram of another light-emitting component provided in an embodiment of the present application;

[0050] Figure 5 is a top view of a common semiconductor layer provided by an embodiment of the present application;

[0051] Figure 6 is a top view of another light-emitting component provided in an embodiment of the present application;

[0052] Figure 7 is a cross-sectional schematic diagram of another light-emitting component provided in an embodiment of the present application;

[0053] Figure 8 is a top view of another light-emitting component provided in an embodiment of the present application;

[0054] Fig. 9 yes Figure 8 The schematic cross-sectional view of the light emitting assembly shown is along the AA' direction;

[0055] Fig.10 yes Figure 8 The schematic cross-sectional view of the light emitting assembly shown along the BB' direction;

[0056] Fig.11 is a top view of another light-emitting component provided in an embodiment of the present application;

[0057] Fig.12 yes Fig.11 A schematic cross-sectional view of the light emitting assembly along the CC' direction is shown;

[0058] Fig.13 yes Fig.11 The schematic cross-sectional view of the light emitting assembly shown along the DD' direction;

[0059] Fig.14 is a top view of another light-emitting component provided in an embodiment of the present application;

[0060] Fig.15 is a top view of a dam layer defined in an embodiment of the present application;

[0061] Fig.16 is a top view of a light shielding layer provided in an embodiment of the present application;

[0062] Fig.17 is a flow chart of a method for preparing a light-emitting component provided in an embodiment of the present application;

[0063] Fig.18 It is a schematic diagram of sequentially forming a first semiconductor film, a light-emitting film and a second semiconductor film on one side of a first temporary substrate provided by an embodiment of the present application;

[0064] Fig.19It is a schematic diagram of forming a common semiconductor layer, a first light-emitting layer and a first semiconductor layer of a first light-emitting functional layer, a second light-emitting layer and a second semiconductor layer of a second light-emitting functional layer, and a third light-emitting layer and a third semiconductor layer of a third light-emitting functional layer provided by an embodiment of the present application;

[0065] Fig. 20 It is a schematic diagram of forming a first light-emitting electrode, a second light-emitting electrode, a third light-emitting electrode and a common light-emitting electrode provided in an embodiment of the present application;

[0066] Fig.21 is a top view of forming an insulating protective layer provided by an embodiment of the present application;

[0067] Fig. 22 yes Fig.21 Cross-sectional view along EE' direction;

[0068] Fig.23 yes Fig.21 Cross-sectional view along FF' direction;

[0069] Fig.24 is a top view of forming a first connecting line, a second connecting line, a third connecting line and a common connecting line provided by an embodiment of the present application;

[0070] Fig.25 yes Fig.24 Cross-sectional view along the GG' direction;

[0071] Fig.26 yes Fig.24 Cross-sectional view along the HH' direction;

[0072] Fig. 27 is a cross-sectional view of forming a circuit protection layer provided by an embodiment of the present application;

[0073] Fig.28 is another cross-sectional view of forming a circuit protection layer provided by an embodiment of the present application;

[0074] Fig.29 is a cross-sectional view of forming a first connection pad and a third connection pad provided by an embodiment of the present application;

[0075] Fig.30 is a cross-sectional view of forming a second connection pad and a common connection pad provided by an embodiment of the present application;

[0076] Fig.31 is a cross-sectional view after being transferred to a second temporary substrate provided by an embodiment of the present application;

[0077] Fig.32 is another cross-sectional view after being transferred to a second temporary substrate provided by an embodiment of the present application;

[0078] Fig.33 is a cross-sectional view of a para-bonding provided in an embodiment of the present application;

[0079] Fig.34 is a cross-sectional view of another alignment bonding provided in an embodiment of the present application;

[0080] Fig.35 It is a cross-sectional view of a display substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0081] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0082] Figure 1 It is a top view of a light-emitting component provided in an embodiment of the present application. Figure 2 is a cross-sectional schematic diagram of a light emitting component provided in an embodiment of the present application. Figure 1 and Figure 2 The light emitting component 100 includes: a substrate 101 , and a first light emitting unit 102 , a second light emitting unit 103 and a third light emitting unit 104 located on one side of the substrate 101 .

[0083] refer to Figure 1 , the first light-emitting unit 102 includes a first light-emitting functional layer 102a. The outer side 102b of the first light-emitting functional layer 102a is annular. The second light-emitting unit 103 includes a second light-emitting functional layer 103a, the second light-emitting functional layer 103a is annular, and the second light-emitting functional layer 103a is sleeved on the outside of the first light-emitting functional layer 102a. The third light-emitting unit 104 includes a third light-emitting functional layer 104a, the third light-emitting functional layer 104a is annular, and the third light-emitting functional layer 104a is sleeved on the outside of the second light-emitting functional layer 103a. That is, the first light-emitting functional layer 102a, the second light-emitting functional layer 103a and the third light-emitting functional layer 104a are sequentially sleeved from the inside to the outside.

[0084] Thus, the optical environments of the first light-emitting unit 102a, the second light-emitting unit 103a and the third light-emitting unit 104a can be close to each other, which can be beneficial to improving the light-emitting effect of the light-emitting component 100.

[0085] In summary, the embodiment of the present application provides a light-emitting component, which includes a substrate and a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit located on one side of the substrate. Since the first light-emitting functional layer of the first light-emitting unit, the second light-emitting functional layer of the second light-emitting unit, and the third light-emitting functional layer of the third light-emitting unit are sequentially connected, the optical environments of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be ensured to be close, thereby improving the light-emitting effect of the light-emitting component.

[0086] Optionally, the substrate 101 may include a first side surface 101a and a second side surface 101b that are arranged opposite to each other, and a substrate center 101c located between the first side surface 101a and the second side surface 101b. The first side surface 101a and the second side surface 101b are located on both sides of the substrate center 101c, respectively. The outer side surface of the first light-emitting functional layer 102a may refer to the side surface of the first light-emitting functional layer 102a that is away from the substrate center 101c.

[0087] The first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103, and the third light-emitting functional layer 104a of the third light-emitting unit 104 are regarded as a functional layer as a whole. The light-emitting functional layers of the three light-emitting units 102 in the portion of the functional layer as a whole close to the first side surface 101a are close to the optical environment of the first side surface 101a, and the light-emitting functional layers of the three light-emitting units 102 in the portion of the functional layer as a whole close to the second side surface 101b are close to the optical environment of the second side surface 101b, which can be beneficial to the improvement of the display effect.

[0088] refer to Figure 3 and Figure 4 The first light-emitting functional layer 102a may have a hollow region L, and the hollow region L may be located in the middle of the first light-emitting functional layer 102a. The ring shape of the outer side surface 102b of the first light-emitting functional layer 102a and the hollow region L of the first light-emitting functional layer 102a may make the first light-emitting functional layer 102a a ring-shaped structure.

[0089] By setting a hollow region L in the first light-emitting functional layer 102a, the ejector pins during subsequent die bonding of the light-emitting component 100 can be placed in the hollow region L, thereby preventing the die bonding pins from affecting the performance of the first light-emitting functional layer 102a.

[0090] Optionally, the first light-emitting functional layer 102a may be a circular ring structure. This allows the shape of the light-emitting functional layer of the first light-emitting unit 102 to be more symmetrical, and further, by making the center of the circular ring structure overlap with the substrate center 101c of the substrate 101, the symmetry of the first light-emitting unit 102 relative to the substrate 101 is ensured, thereby improving the light-emitting effect of the light-emitting component 100. That is, the first light-emitting functional layer 102a in the light-emitting component provided in the embodiment of the present application is a circular ring structure, which can solve the problem of large viewing angle deviation while preventing the top needle from damaging the first light-emitting functional layer 102a.

[0091] At present, the diameter of the ejector needle of the die-bonding equipment with an ejector pin ranges from 15 μm to 20 μm. Therefore, setting the diameter of the hollow area L of the first light-emitting functional layer 102a to be greater than or equal to 20 μm can avoid the ejector pin from acting on the first light-emitting functional layer 102a and avoid the ejector pin from affecting the first light-emitting functional layer 102a. Of course, the diameter of the hollow area L cannot be set too large, because setting it too large will result in a low utilization rate of the epitaxial film layer forming the light-emitting functional layer in the light-emitting component. For example, the diameter of the hollow area L can be less than or equal to 30 μm.

[0092] It should be noted that the minimum value of the diameter of the hollow region L of the first light-emitting functional layer 102a is determined according to the diameter of the ejector needle. Therefore, when the diameter of the ejector needle of the die-bonding device changes (for example, less than 15 μm or greater than 20 μm), the minimum value of the diameter of the hollow region L of the first light-emitting functional layer 102a can be appropriately adjusted, as long as the ejector needle is prevented from acting on the first light-emitting functional layer 102a.

[0093] In the embodiment of the present application, in order to further improve the symmetry of the light pattern of each light-emitting unit, the first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103, and the third light-emitting functional layer 104a of the third light-emitting unit 104 can all be annular structures. In this way, the shape symmetry of the light-emitting functional layer of each light-emitting unit can be better, and then the center of the annular structure can be overlapped with the substrate center 101c of the substrate 101, so as to ensure the symmetry of each light-emitting unit relative to the substrate 101 and improve the light-emitting effect of the light-emitting component 100.

[0094] Optionally, the light-emitting component 100 may include a fourth light-emitting unit, a fifth light-emitting unit, ..., an nth light-emitting unit, etc. in addition to the first light-emitting unit 102, the second light-emitting unit 103 and the third light-emitting unit 104. Each light-emitting unit includes a light-emitting functional layer, and the light-emitting functional layer included in each light-emitting unit is a ring structure, and the light-emitting functional layers of each ring structure are sequentially connected. Optionally, the light-emitting unit included in the light-emitting component 100 may be a micro light-emitting micro diode (Micro Light Emitting Diode, Micro LED). Accordingly, the light-emitting component 100 may be a MIP (MicroLED in package) chip.

[0095] Optionally, among the multiple light-emitting units included in the light-emitting component 100, the distance h7 between the light-emitting functional layers of adjacent light-emitting units is greater than or equal to 20μm (micrometers). This facilitates the first light-shielding layer 1111 (or black barrier wall or black bank) and the limiting dam layer 1112 in the color conversion unit 111 to be arranged in the area between adjacent light-emitting units, thereby avoiding crosstalk between the light of adjacent light-emitting units. For example, the distance between the first light-emitting functional layer 102a of the first light-emitting unit 102 and the second light-emitting functional layer 103a of the second light-emitting unit 103, and the distance between the second light-emitting functional layer 103a of the second light-emitting unit 103 and the third light-emitting functional layer 104a of the third light-emitting unit 104 are both greater than or equal to 20μm.

[0096] Optionally, the distances between adjacent light-emitting functional layers may be the same or different, which is not limited in the present embodiment.

[0097] Optionally, when the light-emitting functional layer of the plurality of light-emitting units included in the light-emitting component is a circular ring structure, the circular ring width h8 of the light-emitting functional layer of each light-emitting unit may be greater than or equal to 15 μm. This allows the width of the light-emitting functional layer to be wider, thereby improving the shear strength of the light-emitting functional layer, reducing the impact of subsequent processes on the light-emitting functional layer, and thus avoiding the breakage of the light-emitting functional layer. In addition, since the width of the light-emitting functional layer is wider, it is convenient for subsequent light-emitting electrodes (the first light-emitting electrode 1023, the second light-emitting electrode 1033, and the third light-emitting electrode 1043 described later) to be formed on the light-emitting functional layer.

[0098] refer to Figure 3 and Figure 4 The first light-emitting unit 102 , the second light-emitting unit 103 and the second light-emitting unit 103 also include: a common semiconductor layer C located on the side of the first light-emitting functional layer 102 a , the second light-emitting functional layer 103 a and the third light-emitting functional layer 104 a close to the substrate 101 .

[0099] refer to Figure 5 , the common semiconductor layer C includes: a first connection part C1, a second connection part C2 and a third connection part C3 arranged at intervals. The side of the first connection part C1 close to the second connection part C2 is annular, for example, the first connection part C1 can be an annular structure. The second connection part C2 and the third connection part C3 can also be annular structures. Among them, the second connection part C2 is sleeved outside the first connection part C1, and the third connection part C3 is sleeved outside the second connection part C2.

[0100] The first light-emitting functional layer 102a includes a first light-emitting layer 1021 and a first semiconductor layer 1022 stacked in a direction away from the common semiconductor layer C. The second light-emitting functional layer 103a includes a second light-emitting layer 1031 and a second semiconductor layer 1032 stacked in a direction away from the common semiconductor layer C. The third light-emitting functional layer 104a includes a third light-emitting layer 1041 and a third semiconductor layer 1042 stacked in a direction away from the common semiconductor layer C.

[0101] The first light-emitting layer 1021 is connected to the first connection portion C1, the second light-emitting layer 1031 is connected to the second connection portion C2, and the third light-emitting layer 1041 is connected to the third connection portion C3.

[0102] Optionally, the outer boundary of the orthographic projection of the first connection portion C1 on the substrate 101 may completely coincide with the outer boundary of the orthographic projection of the first light-emitting functional layer 102a on the substrate 101. The outer boundary of the orthographic projection of the second connection portion C2 on the substrate 101 completely coincides with the outer boundary of the orthographic projection of the second light-emitting functional layer 103a on the substrate 101. The outer boundary of the orthographic projection of the third connection portion C3 on the substrate 101 completely coincides with the outer boundary of the orthographic projection of the third light-emitting functional layer 104a on the substrate 101.

[0103] Optionally, the first light-emitting layer 1021, the second light-emitting layer 1031 and the third light-emitting layer 1041 may be located in the same layer. For example, the first light-emitting layer 1021, the second light-emitting layer 1031 and the third light-emitting layer 1041 may be made of the same material and prepared based on a single process.

[0104] Optionally, the first semiconductor layer 1022, the second semiconductor layer 1032 and the third semiconductor layer 1042 may be located in the same layer. For example, the first semiconductor layer 1022, the second semiconductor layer 1032 and the third semiconductor layer 1042 may be made of the same material and prepared based on a single process.

[0105] refer to Figure 6 and Figure 7 It can be seen that the first light-emitting unit 102 may further include: a first light-emitting electrode 1023. The first light-emitting electrode 1023 is located on the side of the first light-emitting functional layer 102a away from the substrate 101, and the first light-emitting electrode 1023 is connected to the first semiconductor layer 1022. The first light-emitting electrode 1023 is a ring structure, and the orthographic projection of the first light-emitting electrode 1023 on the substrate 101 is located within the orthographic projection of the first light-emitting functional layer 102a on the substrate 101.

[0106] The second light-emitting unit 103 may further include: a second light-emitting electrode 1033. The second light-emitting electrode 1033 is located on a side of the second light-emitting functional layer 103a away from the substrate 101, and the second light-emitting electrode 1033 is connected to the second semiconductor layer 1032. The second light-emitting electrode 1033 is a ring structure, and the orthographic projection of the second light-emitting electrode 1033 on the substrate 101 is located within the orthographic projection of the second light-emitting functional layer 103a on the substrate 101.

[0107] The third light-emitting unit 104 may further include: a third light-emitting electrode 1043. The third light-emitting electrode 1043 is located on a side of the third light-emitting functional layer 104a away from the substrate 101, and the third light-emitting electrode 1043 is connected to the third semiconductor layer 1042. The third light-emitting electrode 1043 is a ring structure, and the orthographic projection of the third light-emitting electrode 1043 on the substrate 101 is located within the orthographic projection of the third light-emitting functional layer 104a on the substrate 101.

[0108] Optionally, the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043 may be located in the same layer. For example, the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043 may be made of the same material and prepared by a single process. Here, the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043 may all serve as current spreading layers of the corresponding light-emitting functional layer. Optionally, the material of the current spreading layer is ITO (indium tin oxide) or metal.

[0109] Since the first light-emitting functional layer 102a, the second light-emitting functional layer 103a and the third light-emitting functional layer 104a are all ring structures, it is more difficult for holes to migrate compared to the design of conventional light-emitting functional layers. Therefore, by setting a current expansion layer in the light-emitting functional layer, it can be beneficial to the transmission of holes and improve the electrical performance of the light-emitting component.

[0110] Optionally, in order to improve the effect of the current spreading layer in reducing the heat generated by current accumulation, the width of the current spreading layer can be greater than or equal to 10 μm. That is, the widths of the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043 can be greater than 10 μm. In addition, in order to avoid short circuits between different light-emitting electrodes, the width of the first light-emitting electrode 1023 can be smaller than the width of the first semiconductor layer 1022, the width of the second light-emitting electrode 1033 can be smaller than the width of the second semiconductor layer 1032, and the width of the third light-emitting electrode 1043 can be smaller than the width of the third semiconductor layer 1042.

[0111] refer to Figure 5 It can be seen that the common semiconductor layer C further includes: a common connection portion C4. The common connection portion C4 and the first connection portion C1, the second connection portion C2 and the third connection portion C3 are all arranged at intervals.

[0112] Optionally, the first connection portion C1, the second connection portion C2, the third connection portion C3 and the common connection portion C4 in the common semiconductor layer C are an integrated structure. In addition, the first connection portion C1, the second connection portion C2, the third connection portion C3 and the common connection portion C4 in the common semiconductor layer C are made of the same material. It can be understood that the first connection portion C1, the second connection portion C2, the third connection portion C3 and the common connection portion C4 in the common semiconductor layer C are arranged in the direction of the extension surface of the substrate 101, and the common semiconductor layer C is a planar structure arranged in an entire layer. Any part of the common semiconductor layer C except the first connection portion C1, the second connection portion C2 and the third connection portion C3 can be used as the common connection portion C4.

[0113] refer to Figure 6 and Figure 7 The first light emitting unit 102, the second light emitting unit 103 and the third light emitting unit 104 further include: a common light emitting electrode C5 located on a side of the common semiconductor layer C away from the substrate 101. The common light emitting electrode C5 may be connected to the common connection portion C4.

[0114] In order to avoid the problem of short circuit between the common light-emitting electrode C5 and the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043, the distance h9 between the orthographic projection of the common light-emitting electrode C5 on the substrate 101 and the orthographic projection of the light-emitting functional layer under any light-emitting electrode on the substrate 101 can be made greater than or equal to 10μm.

[0115] Optionally, the shape of the orthographic projection of the common light-emitting electrode C5 on the substrate 101 may be a circle, an ellipse, a rectangle, or other polygons. The embodiment of the present application does not limit the shape of the orthographic projection of the common light-emitting electrode C5 on the substrate 101. For example, if the shape of the orthographic projection of the common light-emitting electrode C5 on the substrate 101 is a circle, the diameter of the circle may be greater than or equal to 10 μm to ensure the reliability of the subsequent connection between the common connection electrode 109 and the common light-emitting electrode C5.

[0116] Optionally, the first light-emitting layer 1021, the second light-emitting layer 1031 and the third light-emitting layer 1041 may be multi-quantum well layers, and the materials of the multi-quantum well layers include indium gallium nitride (InGaN) and gallium nitride (GaN). The materials of the first semiconductor layer 1022, the second semiconductor layer 1032 and the third semiconductor layer 1042 may include: P-doped gallium nitride (P-GaN). Figure 7As shown, the common semiconductor layer C may include: a first sublayer C-1 and a second sublayer C-2 stacked in a direction perpendicular to and away from the substrate 101. That is, the second sublayer C-2 is farther away from the substrate 101 than the first sublayer C-1. It can be understood that the common semiconductor layer C can be divided into: a first connection portion C1, a second connection portion C2, a third connection portion C3 and a common connection portion C4 in a direction parallel to the extension surface of the substrate 101, and the common semiconductor layer C can be divided into: a first sublayer C-1 and a second sublayer C-2 in a direction perpendicular to the extension surface of the substrate 101.

[0117] The second sublayer C-2 in the common semiconductor layer C may be located between the first sublayer C-1 and the light-emitting layer in each light-emitting functional layer. That is, the second sublayer C-2 is closer to the light-emitting layer in each light-emitting functional layer than the first sublayer C-1. Here, the material of the first sublayer C-1 in the common semiconductor layer C may be a gallium nitride buffer layer, and the second sublayer C-2 in the common semiconductor layer C may be N-type doped gallium nitride (N-GaN).

[0118] In this case, the common light-emitting electrode C5 can be called an N electrode, and the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043 can be called a P electrode. In the light-emitting unit, after the common light-emitting electrode C5 is loaded with a cathode signal, if the light-emitting electrode in the light-emitting functional layer of a certain light-emitting unit is loaded with an anode signal, the light-emitting layer in the light-emitting functional layer can emit the first light.

[0119] In the examples of this application, refer to Figures 8 to 10 The light emitting component 100 further includes an insulating protective layer 105. The insulating protective layer 105 is located on a side of the first light emitting electrode 1023, the second light emitting electrode 1033, the third light emitting electrode 1043 and the common light emitting electrode C5 away from the substrate 101. The insulating protective layer 105 can completely cover the first light emitting electrode 1023, the second light emitting electrode 1033, the third light emitting electrode 1043 and the common light emitting electrode C5, and can also be located in the interval between different light emitting functional layers.

[0120] The insulating protection layer 105 includes a first via hole G1, a second via hole G2, a third via hole G3 and a common via hole G4. The first via hole G1 exposes at least a portion of the first light-emitting electrode 1023, the second via hole G2 exposes at least a portion of the second light-emitting electrode 1033, the third via hole G3 exposes at least a portion of the third light-emitting electrode 1043, and the common via hole G4 exposes at least a portion of the common light-emitting electrode C5.

[0121] Optionally, the first via hole G1 may be located directly above the first light-emitting electrode 1023, the second via hole G2 may be located directly above the second light-emitting electrode 1033, and the third via hole G3 may be located directly above the third light-emitting electrode 1043. The common via hole G4 may be located directly above the common light-emitting electrode C5. The via hole being located directly above the electrode may mean that the substrate center 101c of the orthographic projection of the via hole on the substrate 101 may overlap with the substrate center 101c of the orthographic projection of the electrode on the substrate 101.

[0122] Optionally, the diameters of the first via hole G1, the second via hole G2, and the third via hole G3 may be greater than or equal to 10 μm. In order to avoid short circuits of light-emitting functional layers of different light-emitting units, the diameters of the first via hole G1, the second via hole G2, and the third via hole G3 may be less than (circular ring width + interval width) / 2. The circular ring width may refer to the width of the light-emitting functional layer, and the interval width may refer to the width of the interval between adjacent light-emitting functional layers.

[0123] In addition, the diameter of the common via G4 may also be greater than or equal to 10 μm. In order to avoid short circuit between the common light-emitting electrode C5 and other light-emitting electrodes, the radius of the common via G4 may be smaller than the distance between the orthographic projection of the center of the common via G4 on the substrate 101 and the orthographic projection of the light-emitting functional layer closest to the common via G4 on the substrate 101.

[0124] In the embodiment of the present application, the material of the insulating protective layer 105 may be an inorganic material. For example, the material of the insulating protective layer 105 may be SiOx (silicon oxide). Alternatively, the material of the insulating protective layer 105 may be other silicon-based insulating materials. For example, the material of the insulating protective layer 105 may include one or more inorganic oxides of SiNx (silicon nitride), SiOx (silicon oxide) and SiOxNy (silicon oxynitride).

[0125] Optionally, the insulating protective layer 105 may also be a reflector (DBR), the main function of which is to reflect light to improve the light collection efficiency and ensure the luminous efficiency of the light-emitting component. The reflector may be a multi-layer structure of SiOx (silicon oxide) and SiN (silicon nitride), or a multi-layer structure of SiOx (silicon oxide) and TiO2 (titanium oxide).

[0126] refer to Figures 11 to 13, the light emitting component 100 further includes a first connection electrode 106, a second connection electrode 107, a third connection electrode 108 and a common connection electrode 109. The first connection electrode 106 includes a first connection trace 1061 and a first connection pad 1062. At least a portion of the first connection trace 1061 is located in the first via hole G1, and the portion of the first connection trace 1061 located in the first via hole G1 can be connected to the first light emitting electrode 1023 exposed by the first via hole G1. Another portion of the first connection trace 1061 is located on a side of the insulating protection layer 105 away from the substrate 101, and the first connection pad 1062 can be connected to a portion of the first connection trace 1061 located on a side of the insulating protection layer 105 away from the substrate 101.

[0127] The second connection electrode 107 includes a connected second connection wire 1071 and a second connection pad 1072. At least a portion of the second connection wire 1071 is located in the second via hole G2, and the portion of the second connection wire 1071 located in the second via hole G2 can be connected to the second light-emitting electrode 1033 exposed by the second via hole G2. Another portion of the second connection wire 1071 is located on a side of the insulating protection layer 105 away from the substrate 101, and the second connection pad 1072 can be connected to a portion of the second connection wire 1071 located on a side of the insulating protection layer 105 away from the substrate 101.

[0128] The third connection electrode 108 includes a connected third connection wire 1081 and a third connection pad 1082. At least a portion of the third connection wire 1081 is located in the third via hole G3, and the portion of the third connection wire 1081 located in the third via hole G3 can be connected to the third light-emitting electrode 1043 exposed by the third via hole G3. Another portion of the third connection wire 1081 is located on a side of the insulating protection layer 105 away from the substrate 101, and the third connection pad 1082 can be connected to a portion of the third connection wire 1081 located on a side of the insulating protection layer 105 away from the substrate 101.

[0129] The common connection electrode 109 includes a common connection wire 1091 and a common connection pad 1092. At least a portion of the common connection wire 1091 is located in the common via G4, and the portion of the common connection wire 1091 located in the common via G4 can be connected to the common light-emitting electrode C5 exposed by the common via G4. Another portion of the common connection wire 1091 is located on a side of the insulating protection layer 105 away from the substrate 101, and the common connection pad 1092 can be connected to a portion of the common connection wire 1091 located on a side of the insulating protection layer 105 away from the substrate 101.

[0130] refer to Fig.11The substrate 101 also has a third side surface 101d and a fourth side surface 101e that are arranged opposite to each other. The first end of the third side surface 101d is connected to the first end of the first side surface 101a, and the second end of the third side surface 101d is connected to the first end of the second side surface 101b. The first end of the fourth side surface 101e is connected to the second end of the first side surface 101a, and the second end of the fourth side surface 101e is connected to the second end of the second side surface 101b. The first side surface 101a, the second side surface 101b, the third side surface 101d and the fourth side surface 101e are connected to form four corners.

[0131] For example, the shape of the substrate 101 may be a rectangle, and the four corners of the rectangle may be the four corners of the substrate 101 .

[0132] refer to Fig.11 , the first connection pad 1062, the second connection pad 1072, the third connection pad 1082 and the common connection pad 1092 are respectively located at the four corners. Of course, the first connection pad 1062, the second connection pad 1072, the third connection pad 1082 and the common connection pad 1092 can also be arranged in other ways. For example, the first connection pad 1062, the second connection pad 1072, the third connection pad 1082 and the common connection pad 1092 can be arranged in an array in 2 rows and 2 columns.

[0133] Optional, reference Fig.11 , the first connection pad 1062, the second connection pad 1072, the third connection pad 1082 and the common connection pad 1092 can be roughly triangular. Of course, the first connection pad 1062, the second connection pad 1072, the third connection pad 1082 and the common connection pad 1092 can also be other shapes, which is not limited in the embodiment of the present application.

[0134] In the examples of this application, refer to Fig.12 and Fig.13 The light emitting component 100 may further include: a circuit protection layer 110 located on a side of the first connection wiring 1061, the second connection wiring 1071, the third connection wiring 1081 and the common connection wiring 1091 away from the substrate 101. The main function of the circuit protection layer 110 is to prevent the first connection wiring 1061, the second connection wiring 1071, the third connection wiring 1081 and the common connection wiring 1091 from being exposed to the outside and damaged.

[0135] Optionally, the circuit protection layer 110 may include a first connection hole K1, a second connection hole K2, a third connection hole K3 and a common connection hole K4. The first connection hole K1 may expose at least a portion of the first connection trace 1061, and the first connection pad 1062 may be connected to the first connection trace 1061 through the first connection hole K1. The second connection hole K2 may expose at least a portion of the second connection trace 1071, and the second connection pad 1072 may be connected to the second connection trace 1071 through the second connection hole K2. The third connection hole K3 may expose at least a portion of the third connection trace 1081, and the third connection pad 1082 may be connected to the third connection trace 1081 through the third connection hole K3. The common connection hole K4 may expose at least a portion of the common connection trace 1091, and the common connection pad 1092 may be connected to the common connection trace 1091 through the common connection hole K4.

[0136] Optionally, the material of the circuit protection layer 110 may be an inorganic material. For example, the material of the circuit protection layer 110 may be made of one or more inorganic oxides selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride).

[0137] In the embodiment of the present application, Figure 3 , Figure 6 , Figure 8 as well as Fig.11 It can be seen that the size of the light-emitting functional layer of the light-emitting unit closer to the substrate center 101c of the substrate 101 is smaller, and the size of the light-emitting functional layer of the light-emitting unit farther from the substrate center 101c of the substrate 101 is larger. Fig.10 In the embodiment, the area of ​​the orthographic projection of the first light-emitting functional layer 102a of the first light-emitting unit 102 on the substrate 101 is smaller than the area of ​​the orthographic projection of the second light-emitting functional layer 103a of the second light-emitting unit 103 on the substrate 101; the area of ​​the orthographic projection of the second light-emitting functional layer 103a of the second light-emitting unit 103 on the substrate 101 is smaller than the area of ​​the orthographic projection of the third light-emitting functional layer 104a of the third light-emitting unit 104 on the substrate 101.

[0138] Since the human eye is most sensitive to green light, in order to ensure the luminous effect of the light-emitting component, while taking into account the ratio of the luminous intensity of the red light-emitting pixel, the green light-emitting pixel and the blue light-emitting pixel (usually red: green: blue = 3:6:1), the area of ​​the luminous area of ​​the blue light-emitting pixel, the area of ​​the luminous area of ​​the red light-emitting pixel, and the area of ​​the luminous area of ​​the green light-emitting pixel can be reduced in turn.

[0139] In the embodiment of the present application, the light-emitting unit may be a part of the light-emitting pixel, and the area of ​​the light-emitting region of the light-emitting pixel is positively correlated with the area of ​​the orthographic projection of the light-emitting functional layer of the light-emitting unit on the substrate 101. That is, the larger the area of ​​the orthographic projection of the light-emitting functional layer of the light-emitting unit on the substrate 101, the larger the area of ​​the light-emitting region of the light-emitting pixel; the smaller the area of ​​the orthographic projection of the light-emitting functional layer of the light-emitting unit on the substrate 101, the smaller the area of ​​the light-emitting region of the light-emitting pixel.

[0140] Thus, in order to reduce the area of ​​the light-emitting region of the blue light-emitting pixel, the area of ​​the light-emitting region of the red light-emitting pixel, and the area of ​​the light-emitting region of the green light-emitting pixel in sequence, the area of ​​the orthographic projection of the light-emitting functional layer of the light-emitting unit included in the blue light-emitting pixel on the substrate 101, the area of ​​the orthographic projection of the light-emitting functional layer of the light-emitting unit included in the red light-emitting pixel on the substrate 101, and the area of ​​the orthographic projection of the light-emitting functional layer of the light-emitting unit included in the green light-emitting pixel on the substrate 101 can be reduced in sequence. Furthermore, the light-emitting unit included in the blue light-emitting pixel can be the first light-emitting unit 102; the light-emitting unit included in the red light-emitting pixel can be the second light-emitting unit 103; and the light-emitting unit included in the green light-emitting pixel can be the third light-emitting unit 104.

[0141] In the case where the light-emitting component includes a blue light-emitting pixel (blue, B), a red light-emitting pixel (red, R), and a green light-emitting pixel (green, G), the light-emitting component may be a RGB three-in-one light-emitting chip. In the embodiment of the present application, the light-emitting color of the light-emitting unit may refer to the light-emitting color of the light-emitting pixel to which the light-emitting unit belongs. For example, the light-emitting pixel to which the first light-emitting unit 102 belongs may be a blue light-emitting pixel, and the light-emitting color of the blue light-emitting pixel is blue, then the light-emitting color of the first light-emitting unit 102 may be considered to be blue. The light-emitting pixel to which the second light-emitting unit 103 belongs may be a red light-emitting pixel, and the light-emitting color of the red light-emitting pixel is red, then the light-emitting color of the second light-emitting unit 103 may be considered to be red. The light-emitting pixel to which the third light-emitting unit 104 belongs may be a green light-emitting pixel, and the light-emitting color of the green light-emitting pixel is green, then the light-emitting color of the third light-emitting unit 104 may be considered to be green.

[0142] In the examples of this application, refer to Fig.14, the light emitting component 100 further includes: a color conversion unit 111 located on a side of the first light emitting unit 102 close to the substrate 101. In the case where the light emitting component 100 further includes a second light emitting unit 103 and a third light emitting unit 104, the color conversion unit 111 is also located on a side of the second light emitting unit 103 and the third light emitting unit 104 close to the substrate 101. That is, the first light emitting unit 102, the second light emitting unit 103 and the third light emitting unit 104 can all be located on a side of the color conversion unit 111 away from the substrate 101. In this case, the light emitted by the first light emitting unit 102, the second light emitting unit 103 and the third light emitting unit 104 can all be emitted toward the color conversion unit 111, and then emitted after passing through the color conversion unit 111.

[0143] For example, the light-emitting functional layer of each light-emitting unit is used to emit a first light, and the first light includes at least one of blue light and ultraviolet light. Under the action of the color conversion unit 111, the light-emitting component can emit at least one of red light, green light and blue light.

[0144] refer to Fig.14 The color conversion unit 111 includes: a first light shielding layer 1111 , a defining dam layer 1112 , an optical function layer 1113 and a filter layer 1114 .

[0145] The first light shielding layer 1111 in the color conversion unit 111 may be located on one side of the substrate 101. The first light shielding layer 1111 may have a light through hole. In the case where the light emitting component 100 includes a plurality of light emitting units, the first light shielding layer 1111 may have a plurality of light through holes corresponding to the plurality of light emitting units. The orthographic projection of each light through hole on the substrate 101 may overlap with the orthographic projection of the light emitting functional layer of the corresponding light emitting unit on the substrate 101. For example, the orthographic projection of the light emitting functional layer in the light emitting unit on the substrate 101 may be located within the orthographic projection of the corresponding light through hole on the substrate 101.

[0146] The defining dam layer 1112 in the color conversion unit 111 may be located on the side of the first light shielding layer 1111 away from the substrate 101. The defining dam layer 1112 has an opening area corresponding to the light through hole, and the orthographic projection of the opening area on the substrate 101 overlaps with the orthographic projection of the corresponding light through hole on the substrate 101. In the case where the light-emitting component 100 includes a plurality of light-emitting units, the defining dam layer 1112 may have a plurality of opening areas corresponding to the plurality of light through holes one by one, and these opening areas may also correspond to the plurality of light-emitting functional layers of the plurality of light-emitting units one by one. Here, the orthographic projection of each opening area in the defining dam layer 1112 on the substrate 101 may overlap with the orthographic projection of the corresponding light through hole on the substrate 101, and may overlap with the orthographic projection of the light-emitting functional layer of the corresponding light-emitting unit on the substrate 101. For example, the light-emitting sides of the light-emitting functional layers in the light-emitting units may all face the corresponding opening areas, and the orthographic projection of the light-emitting functional layer of the light-emitting unit on the substrate 101 may be located within the orthographic projection of the corresponding opening area on the substrate 101. It is defined that the orthographic projection of each opening area in the dam layer 1112 on the substrate 101 may be located within the orthographic projection of the corresponding light-through hole on the substrate 101 .

[0147] When the light-emitting component 100 includes a first light-emitting unit 102, a second light-emitting unit 103 and a third light-emitting unit 104, the first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103 and the third light-emitting functional layer 104a of the third light-emitting unit 104 are all used to emit a first light in a working state.

[0148] Accordingly, reference Fig.14 , the plurality of opening regions defined in the dam layer 1112 may include: a first opening region Q1, a second opening region Q2, and a third opening region Q3. The first opening region Q1 may be disposed opposite to the first light-emitting functional layer 102a, the second opening region Q2 may be disposed opposite to the second light-emitting functional layer 103a, and the third opening region Q3 may be disposed opposite to the third light-emitting functional layer 104a.

[0149] Among them, reference Fig.15 , the first opening area Q1, the second opening area Q2 and the third opening area Q3 can all be annular structures. Moreover, the second opening area Q2 can be sleeved outside the first opening area Q1, and the third opening area Q3 can be sleeved outside the second opening area Q2. Accordingly, the dam layer 1112 can be located in the annular interval between the first opening area Q1 and the second opening area Q2, and can be located in the annular interval between the second opening area Q2 and the third opening area Q3. Further, the dam layer 1112 can also be located inside the annular area of ​​the first opening area Q1, and outside the annular area of ​​the third opening area Q3.

[0150] refer to Fig.14The plurality of light-through holes in the first light-shielding layer 1111 may include: a first light-through hole T1, a second light-through hole T2, and a third light-through hole T3. The first light-through hole T1 may be disposed opposite to the first light-emitting functional layer 102a, the second light-through hole T2 may be disposed opposite to the second light-emitting functional layer 103a, and the third light-through hole T3 may be disposed opposite to the third light-emitting functional layer 104a.

[0151] Among them, reference Fig.16 , the first light hole T1, the second light hole T2 and the third light hole T3 can all be annular structures. Moreover, the second light hole T2 can be sleeved outside the first light hole T1, and the third light hole T3 can be sleeved outside the second light hole T2. Accordingly, the first light shielding layer 1111 can be located in the annular interval between the first light hole T1 and the second light hole T2, and can be located in the annular interval between the second light hole T2 and the third light hole T3. Furthermore, the first light shielding layer 1111 can also be located inside the annular ring of the first light hole T1, and outside the annular ring of the third light hole T3.

[0152] The optical function layer 1113 in the color conversion unit 111 may be located inside the opening area defining the dam layer 1112, and at least part of the optical function layer 1113 is used to convert the color of the light entering the optical function layer 1113. Here, the light emitted by the light emitting unit may be directed toward the optical function layer 1113, and then the optical function layer 1113 converts the color of the light, and then the light is emitted after passing through the through hole of the first light shielding layer 1111.

[0153] Optionally, the optical functional layer 1113 in the color conversion unit 111 may include: a first color conversion portion 1113a, a second color conversion portion 1113b, and a third color conversion portion 1113c. The first color conversion portion 1113a may be located in the first opening area Q1, the second color conversion portion 1113b may be located in the second opening area Q2, and the third color conversion portion 1113c may be located in the third opening area Q3. For example, the first color conversion portion 1113a, the second color conversion portion 1113b, and the third color conversion portion 1113c may also be annular structures.

[0154] In this case, the first light emitted by the first light-emitting functional layer 102a of the first light-emitting unit 102 can be directed toward the first color conversion portion 1113a, and the first light can be transmitted through the first color conversion portion 1113a or can be converted by the first color conversion portion 1113a. The first light emitted by the second light-emitting functional layer 103a of the second light-emitting unit 103 can be directed toward the second color conversion portion 1113b, and the second color conversion portion 1113b converts the first light emitted by the second sub-light-emitting functional layer into light of another color. The first light emitted by the third light-emitting functional layer 104a of the third light-emitting unit 104 can be directed toward the third color conversion portion 1113c, and the third color conversion portion 1113c converts the first light emitted by the third light-emitting functional layer 104a into light of another color.

[0155] The first color conversion part 1113a is used to convert the first light into blue light or maintain the blue light emission. For example, when the first light contains only blue light, the first color conversion part 1113a can be a transparent part or the first color conversion part 1113a can include blue quantum dots (QD). Among them, the transparent part is used for direct transmission of the first light, and the blue quantum dots can be used to convert the first light into blue light with a wavelength different from that of the first light. Preferably, the first color conversion part 1113a also includes scattering particles for scattering the light. Here, after the first light emitted by the first light-emitting functional layer 102a is emitted to the first color conversion part 1113a distributed in the first opening area Q1, the first light can be scattered by the scattering particles to ensure that the blue light has a larger emission angle, thereby ensuring that the display substrate integrated with the light-emitting component has a larger viewing angle. For another example, when the first light includes ultraviolet light, the first color conversion unit 1113a includes blue quantum dots that convert the first light into blue light, or the first color conversion unit 1113a includes scattering particles for scattering light and blue quantum dots for converting ultraviolet light into blue light. Here, after the first light emitted by the first light-emitting functional layer 102a is emitted to the first color conversion unit 1113a distributed in the first opening area Q1, the ultraviolet light in the first light can be converted into blue light by the blue quantum dots, and the first light and blue light can be scattered by the scattering particles to ensure that more ultraviolet light is converted into blue light by the blue quantum dots, and the emission angle of the converted blue light can be larger, so as to ensure that the display substrate integrated with the light-emitting component 100 has a larger viewing angle. To this end, the blue light-emitting pixel B in the light-emitting component 100 can include: a first light-emitting unit 102 and a first color conversion unit 1113a.

[0156] The second color conversion unit 1113b is used to convert the first light into red light. For example, the second color conversion unit 1113b includes red quantum dots that convert the first light into red light; preferably, the second color conversion unit 1113b also includes scattering particles for scattering the light. After the first light emitted by the second light-emitting functional layer 103a is emitted to the second color conversion unit 1113b distributed in the second opening area Q2, the first light can be converted into red light by the red quantum dots, and the first light and red light can be scattered by the scattering particles to ensure that more of the first light can be converted into red light by the red quantum dots, and the emission angle of the converted red light can be larger, so as to ensure that the display substrate integrated with the light-emitting component 100 has a larger viewing angle. To this end, the red sub-pixel R in the light-emitting component can include: a second light-emitting unit 103 and a second color conversion unit 1113b.

[0157] The third color conversion unit 1113c is used to convert the first light into green light. For example, the third color conversion unit 1113c includes green quantum dots that convert the first light into green light; preferably, the third color conversion unit 1113c also includes scattering particles for scattering the light. Here, after the first light emitted by the third light-emitting functional layer 104a is emitted to the third color conversion unit 1113c distributed in the second opening area Q2, the first light can be converted into green light by the green quantum dots, and the first light and green light can be scattered by the scattering particles to ensure that more of the first light can be converted into green light by the green quantum dots, and the emission angle of the converted green light can be larger, so as to ensure that the display substrate integrated with the light-emitting component 100 has a larger viewing angle. To this end, the green sub-pixel G in the light-emitting component 100 can include: a third light-emitting unit 104 and a third color conversion unit 1113c.

[0158] Optionally, the material defining the dam layer 1112 in the color conversion unit 111 may include: an organic material with light absorption or an organic material with light reflection. Here, the color of the organic material with light absorption is usually black, which can absorb the light emitted from the side of the optical functional layer 1113; the organic material with light reflection is usually gray, which can reflect the light emitted from the side of the optical functional layer 1113.

[0159] To this end, when the material of the defined dam layer 1112 includes an organic material with reflective properties, the light emitted from the side of the optical functional layer 1113 can be reflected back to the optical functional layer 1113 by the defined dam layer 1112, so that the quantum dots in the optical functional layer 1113 can convert the blue light or ultraviolet light in the reflected light into light of corresponding colors, thus further improving the excitation efficiency of the quantum dots. In addition, the light reflected back by the defined dam layer 1112 can be emitted from the side of the optical functional layer 1113 toward the substrate 101, so that the light can be emitted after passing through the corresponding light holes, thus effectively improving the light extraction efficiency of the light emitting component.

[0160] The filter layer 1114 may be located between the substrate 101 and the optical function layer 1113. The filter layer 1114 includes filter units corresponding to the light through holes. The orthographic projection of the filter unit on the substrate 101 overlaps with the orthographic projection of the corresponding light through hole on the substrate 101. Optionally, the filter layer 1114 may include: a plurality of filter units corresponding to the plurality of light through holes one by one, and the orthographic projection of each filter unit on the substrate 101 may overlap with the orthographic projection of the corresponding light through hole on the substrate 101.

[0161] For example, the plurality of filter units in the filter layer 1114 may include: a first filter unit 1114a, a second filter unit 1114b and a third filter unit 1114c. Here, the first filter unit 1114a may be arranged corresponding to the first color conversion unit 1113a, the second filter unit 1114b may be arranged corresponding to the second color conversion unit 1113b, and the third filter unit 1114c may be arranged corresponding to the third color conversion unit 1113c. To this end, the blue sub-pixel B in the light-emitting component 100 may also include: a first filter unit 1114a; the red sub-pixel R in the light-emitting component 100 may also include: a second filter unit 1114b; and the green sub-pixel G in the light-emitting component 100 may also include: a third filter unit 1114c.

[0162] For example, the first light emitted by the first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103, and the third light-emitting functional layer 104a of the third light-emitting unit 104 are all blue light, and the first filter unit 1114a can be a blue color block, which can transmit blue light and absorb light of other colors. In this way, the light emitted from the first color conversion unit 1113a can be emitted after passing through the first filter unit 1114a, and the first filter unit 1114a can filter out light of other colors except blue light, so as to ensure that the blue sub-pixel B in the light-emitting component can emit relatively pure blue light.

[0163] For example, the first light emitted by the first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103 and the third light-emitting functional layer 104a of the third light-emitting unit 104 are all blue light, and the first filter unit 1114a can be a transparent block that can transmit blue light.

[0164] For example, the first light emitted by the first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103, and the third light-emitting functional layer 104a of the third light-emitting unit 104 are all blue light, and the second filter unit 1114b may be a red color block, which can transmit red light and absorb light of other colors. In this way, the light emitted from the second color conversion unit 1113b can be emitted after passing through the second filter unit 1114b, and the second filter unit 1114b can filter out light of other colors except red light, so as to ensure that the red sub-pixel R in the light-emitting component can filter out the blue light component. It should be noted that, in other possible implementations, the second filter unit 1114b may also be: a film layer for transmitting red light and reflecting blue light. In this way, after the light emitted from the second color conversion portion 1113b is emitted to the second filter unit 1114b, the red light in these light rays can pass through the second filter unit 1114b before being emitted, and the blue light in these light rays can be reflected back to the second color conversion portion 1113b by the second filter unit 1114b, so that the red quantum dots in the second color conversion portion 1113b can excite the blue light into red light. In this way, the excitation efficiency of the red quantum dots can be further improved.

[0165] For example, the first light emitted by the first light-emitting functional layer 102a of the first light-emitting unit 102, the second light-emitting functional layer 103a of the second light-emitting unit 103, and the third light-emitting functional layer 104a of the third light-emitting unit 104 are all blue light, and the third filter unit 1114c can be a green color block, which can transmit green light and absorb light of other colors. In this way, the light emitted from the third color conversion unit 1113c can be emitted after passing through the third filter unit 1114c, and the third filter unit 1114c can filter out light of other colors except green light, so as to ensure that the green sub-pixel G in the light-emitting component can filter out the blue light component. It should be noted that, in other possible implementations, the third filter unit 1114c may also be: a film layer for transmitting green light and reflecting blue light. In this way, after the light emitted from the third color conversion portion 1113c is emitted to the third filter unit 1114c, the green light in these light rays can pass through the third filter unit 1114c before being emitted, and the blue light in these light rays can be reflected by the third filter unit 1114c back to the third color conversion portion 1113c, so that the green quantum dots in the third color conversion portion 1113c can excite the blue light into green light. In this way, the excitation efficiency of the green quantum dots can be further improved.

[0166] It should be noted that the film structures of the second filter unit 1114b and the third filter unit 1114c can be the same and can be prepared by the same process; for example, the second filter unit 1114b and the third filter unit 1114c are both films that transmit red light and green light and reflect blue light.

[0167] It should be noted that, since the orthographic projection of each filter unit in the filter layer 1114 on the substrate 101 overlaps with the orthographic projection of the corresponding light hole in the first light shielding layer 1111 on the substrate 101, a portion of the first light shielding layer 1111 is distributed between two adjacent filter units in the filter layer 1114 in the direction parallel to the extension surface of the substrate 101. In this way, the light emitted from the side of a filter unit in the filter layer 1114 can be absorbed by the first light shielding layer 1111, so as to ensure that the light intensity emitted by each sub-pixel to the adjacent sub-pixel is low, which can effectively reduce the probability of color crosstalk in the light-emitting component.

[0168] For further reference, Fig.14The color conversion unit 111 includes a first encapsulation layer 1115, and the first encapsulation layer 11151045 can be located on the side of the definition dam layer 1112 away from the substrate 101. The definition dam layer 1112, the optical function layer 1113 and the filter layer 1114 can be encapsulated by the first encapsulation layer 1115 to prevent water and oxygen in the external environment from penetrating the definition dam layer 1112 and corroding the optical function layer 1113 or the filter layer 1114, thereby ensuring that the optical function layer 1113 can stably convert the color of light, so that the reliability of the optical function layer 1113 is high.

[0169] refer to Fig.14 , the color conversion unit 111 may further include: a second encapsulation layer 1116 located between the first light shielding layer 1111 and the defining dam layer 1112. The optical functional layer 1113 and the defining dam layer 1112 in the color conversion unit 111 may be located on the side of the second encapsulation layer 1116 away from the substrate 101, and the second encapsulation layer 1116 needs to at least cover the outer side of the first light shielding layer 1111 and the side of the first light shielding layer 1111 away from the substrate 101. In this case, the first light shielding layer 1111 may be encapsulated by the second encapsulation layer 1116, so that water and oxygen in the external environment will not corrode the optical functional layer 1113 through the first light shielding layer 1111 and the defining dam layer 1112.

[0170] The first encapsulation layer 1115 may be a film layer structure that is continuously distributed at all positions, and of course, the second encapsulation layer 1116 may also be a film layer structure that is continuously distributed at all positions. In addition, the orthographic projections of the dam layer 1112 and the optical functional layer 1113 on the substrate 101 are both located within the orthographic projection of the first encapsulation layer 1115 on the substrate 101, and are also located within the orthographic projection of the second encapsulation layer 1116 on the substrate 101. At the same time, the second encapsulation layer 1116 is arranged in contact with the first encapsulation layer 1115, so that the dam layer 1112 and the optical functional layer 1113 can be completely wrapped by the cooperation of the first encapsulation layer 1115 and the first encapsulation layer 1115. Here, the area where the second encapsulation layer 1116 contacts the first encapsulation layer 1115 is distributed around the dam layer 1112, so that the packaging effect of the optical functional layer 1113 can be ensured to be better through the cooperation of the first encapsulation layer 1115 and the second encapsulation layer 1116, and the reliability of the optical functional layer 1113 is further improved.

[0171] In the embodiment of the present application, each light-emitting unit in the light-emitting component 100 can be bonded to the color conversion unit 111 through a connection layer 112. That is, a connection layer 112 for bonding the two together is distributed between each light-emitting unit and the color conversion unit 111.

[0172] In summary, the embodiment of the present application provides a light-emitting component, which includes a substrate and a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit located on one side of the substrate. Since the first light-emitting functional layer of the first light-emitting unit, the second light-emitting functional layer of the second light-emitting unit, and the third light-emitting functional layer of the third light-emitting unit are sequentially connected, the optical environments of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be ensured to be close, thereby improving the light-emitting effect of the light-emitting component.

[0173] Fig.17 1 is a flow chart of a method for preparing a light-emitting component provided in an embodiment of the present application. Fig.17 , the method comprising:

[0174] Step S101, obtaining a first temporary substrate.

[0175] The first temporary electrode plate may be a glass substrate 101 .

[0176] Step S102: forming a first semiconductor thin film, a light-emitting thin film and a second semiconductor thin film in sequence on one side of the first temporary substrate.

[0177] refer to Fig.18 The first semiconductor film, the light-emitting film and the second semiconductor film may be epitaxial films formed on the first temporary substrate. The material of the first semiconductor film may include N-type doped gallium nitride (N-GaN), the light-emitting film may be a multi-quantum well film, and the second semiconductor film may include P-type doped gallium nitride (P-GaN).

[0178] Step S103, using an etching process to etch the first semiconductor film, the light-emitting film and the second semiconductor film to obtain a common semiconductor layer, a first light-emitting layer and a first semiconductor layer of the first light-emitting functional layer, a second light-emitting layer and a second semiconductor layer of the second light-emitting functional layer, and a third light-emitting layer and a third semiconductor layer of the third light-emitting functional layer.

[0179] refer to Fig.19 After etching by the etching process, it is necessary to ensure that the light-emitting film and the second semiconductor film are etched cleanly in the depth direction to obtain the first light-emitting layer 1021 and the first semiconductor layer 1022 of the first light-emitting functional layer 102a, the second light-emitting layer 1031 and the second semiconductor layer 1032 of the second light-emitting functional layer 103a, and the third light-emitting layer 1041 and the third semiconductor layer 1042 of the third light-emitting functional layer 104a. In addition, a portion of the first semiconductor film may be etched (not completely etched in the depth direction) during the etching process to form a common semiconductor layer.

[0180] In the embodiment of the present application, the first light-emitting layer 1021 and the first semiconductor layer 1022 of the first light-emitting functional layer 102a, the second light-emitting layer 1031 and the second semiconductor layer 1032 of the second light-emitting functional layer 103a, and the third light-emitting layer 1041 and the third semiconductor layer 1042 of the third light-emitting functional layer 104a may be formed by the same etching process. For ease of distinction, subsequent drawings use different filling patterns to represent the first light-emitting layer 1021 and the first semiconductor layer 1022 of the first light-emitting functional layer 102a, the second light-emitting layer 1031 and the second semiconductor layer 1032 of the second light-emitting functional layer 103a, and the third light-emitting layer 1041 and the third semiconductor layer 1042 of the third light-emitting functional layer 104a.

[0181] Step S104, forming a common light-emitting electrode on the side of the common semiconductor layer away from the first temporary substrate, forming a first light-emitting electrode on the side of the first semiconductor layer away from the first temporary substrate, forming a second light-emitting electrode on the side of the second semiconductor layer away from the first temporary substrate, and forming a third light-emitting electrode on the side of the third semiconductor layer away from the first temporary substrate.

[0182] refer to Fig. 20 , a first light-emitting electrode 1023, a second light-emitting electrode 1033, a third light-emitting electrode 1043 and a common light-emitting electrode C5 are formed by a one-time process. Here, the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043 can all be used as current spreading layers of the corresponding light-emitting functional layer. Optionally, the material of the current spreading layer is ITO (indium tin oxide) or metal.

[0183] Since the first light-emitting functional layer 102a, the second light-emitting functional layer 103a and the third light-emitting functional layer 104a are all ring structures, it is more difficult for holes to migrate compared to the design of conventional light-emitting functional layers. Therefore, by setting a current expansion layer in the light-emitting functional layer, it can be beneficial to the transmission of holes and improve the electrical performance of the light-emitting component.

[0184] Step S105 , forming an insulating protective layer on a side of the common light-emitting electrode, the first light-emitting electrode, the second light-emitting electrode and the third light-emitting electrode away from the first temporary substrate.

[0185] refer to Figure 21 to Figure 23 The insulating protection layer 105 includes a first via hole G1, a second via hole G2, a third via hole G3 and a common via hole G4. The first via hole G1 exposes at least a portion of the first light emitting electrode 1023, the second via hole G2 exposes at least a portion of the second light emitting electrode 1033, the third via hole G3 exposes at least a portion of the third light emitting electrode 1043, and the common via hole G4 exposes at least a portion of the common light emitting electrode C5.

[0186] Step S106 , forming a first connection wire of the first connection electrode, a second connection wire of the second connection electrode, a third connection wire of the third connection electrode, and a common connection wire of the common connection electrode.

[0187] refer to Figure 24 to Figure 26 , metal can be deposited in the first via hole G1, the second via hole G2, the third via hole G3 and the common via hole G4 to lead out the signals of the P electrode (the first light-emitting electrode 1023, the second light-emitting electrode 1033 and the third light-emitting electrode 1043) and the N electrode (the common light-emitting electrode C5). The first connecting wire 1061, the second connecting wire 1071, the third connecting wire 1081 and the common connecting wire 1091 formed on one side of the insulating protection layer 105 can be led to the four corners to facilitate the subsequent secondary evaporation to form the connecting pad.

[0188] Step S107 , forming a first connection pad of the first connection electrode, a second connection pad of the second connection electrode, a third connection pad of the third connection electrode, and a common connection pad of the common connection electrode.

[0189] refer to Fig. 27 and Fig.28 Before forming each connection pad, a circuit protection layer 110 may be formed first. The circuit protection layer 110 may include a first connection hole K1, a second connection hole K2, a third connection hole K3 and a common connection hole K4. The first connection hole K1 may expose at least a portion of the first connection trace 1061. The second connection hole K2 may expose at least a portion of the second connection trace 1071. The third connection hole K3 may expose at least a portion of the third connection trace 1081. The common connection hole K4 may expose at least a portion of the common connection trace 1091.

[0190] Afterwards, refer to Fig.29 and Fig.30 , and then form a first connection pad 1062, a second connection pad 1072, a third connection pad 1082 and a common connection pad 1092. Among them, the first connection pad 1062 is connected to the first connection line 1061 through the first connection hole K1. The second connection pad 1072 can be connected to the second connection line 1071 through the second connection hole K2. The third connection pad 1082 can be connected to the third connection line 1081 through the third connection hole K3. The common connection pad 1092 can be connected to the common connection line 1091 through the common connection hole K4.

[0191] Step S108 , transferring the devices on the first temporary substrate to the second temporary substrate, and removing the first temporary substrate.

[0192] refer to Fig.31 and Fig.32After the device is transferred to the second temporary substrate, the first connection pad 1062, the second connection pad 1072, the third connection pad 1082 and the common connection pad 1092 may contact the second temporary substrate. In addition, the common semiconductor layer is the layer farthest from the second temporary substrate.

[0193] Step S109: obtaining an initial substrate and a color conversion unit located on one side of the substrate.

[0194] Step S110, align and bond the structure obtained in step S108 and the structure obtained in step S109 to obtain a light-emitting component.

[0195] refer to Fig.33 and Fig.34 After the alignment bonding is completed, the second temporary substrate can be removed to obtain the light emitting component 100. The initial substrate on one side of the color conversion unit 111 can also be thinned to achieve a thin and light light emitting component 100. Fig.33 and Fig.34 The structure of the color conversion unit 111 in FIG. Fig.14 Indicated in Fig.33 and Fig.34 The color conversion unit 111 is shown in a simplified manner.

[0196] Optionally, when preparing the light-emitting components, a first temporary substrate, a second temporary substrate and an initial substrate of a larger size (such as 4 inches) can be used for preparation to obtain multiple light-emitting components. Moreover, after step S110, supervised cutting can be performed to obtain multiple independent light-emitting components. Among them, each light-emitting component can be an independent light-emitting chip, for example, each light-emitting component can be an RGB three-in-one light-emitting chip. Since the light-emitting areas of each light-emitting pixel of this light-emitting chip are symmetrical, the light type symmetry of the light-emitting brightness is better, and the light-emitting effect of the light-emitting component is better.

[0197] In summary, the embodiment of the present application provides a method for preparing a light-emitting component, wherein the light-emitting component includes a substrate and a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit located on one side of the substrate. Since the first light-emitting functional layer of the first light-emitting unit, the second light-emitting functional layer of the second light-emitting unit, and the third light-emitting functional layer of the third light-emitting unit are sequentially connected, the optical environments of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be ensured to be close, thereby improving the light-emitting effect of the light-emitting component.

[0198] The embodiments of the present application also provide a display substrate, and a plurality of light-emitting components as provided in the above embodiments.

[0199] Optionally, a plurality of light emitting components 100 are located in the display area of ​​the display substrate, and the plurality of light emitting components are arranged in an array. The driving backplane 200 is used to provide driving signals to the light emitting components so that the light emitting components emit light.

[0200] Optional, reference Fig.35 The display substrate further includes a second light shielding layer 300 . The second light shielding layer 300 is at least located between adjacent light emitting components in the plurality of light emitting components 100 , and the second light shielding layer 300 is disposed in contact with the side surface of the substrate 101 in the light emitting component 100 . Fig.35 The light emitting components shown in FIG. Fig.33 Take the light-emitting component as an example.

[0201] For example, the second light shielding layer 300 is located between any two adjacent light emitting components 100 in the display substrate. The second light shielding layer 300 is used to prevent the light of the adjacent light emitting components 100 from crosstalking.

[0202] Optionally, the second light shielding layer 300 may also be located on the side of the light emitting component 100 away from the driving backplane 200. The portion of the second light shielding layer 300 located on the side of the light emitting component 100 away from the driving backplane 200 is at least transparent, or the portion of the second light shielding layer 300 located on the side of the light emitting component 100 away from the driving backplane 200 has a certain transmittance. In this way, the light emitting effect of the light emitting component 100 may be prevented from being affected by the setting of the second light shielding layer 300.

[0203] Optionally, the second light shielding layer 300 may also be called black glue or black film.

[0204] refer to Fig.35 The second light shielding layer 300 includes a first portion 301 located between adjacent light emitting components 100, and a second portion 302 located on a side of the light emitting component 100 away from the driving backplane 200. The first portion 301 and the second portion 302 are continuously distributed. Thus, the side surface of the light emitting component and the surface away from the driving backplane both have the second light shielding layer 300, so that the ink color of the light emitting component can be ensured to be consistent.

[0205] In the embodiment of the present application, since the second light shielding layer 300 is located between adjacent light emitting components 100 , the light with a large viewing angle (such as light emitted from the side) emitted by the light emitting component 100 may be absorbed by the second light shielding layer 300 .

[0206] In the solution of the embodiment of the present application, since the first light-emitting functional layer 102a, the second light-emitting functional layer 103a and the third light-emitting functional layer 104a of the light-emitting component 100 are sequentially nested from the inside to the outside, the optical environments of the first light-emitting unit 102a, the second light-emitting unit 103a and the third light-emitting unit 104a can be close. Therefore, when the first light-emitting functional layer 102a, the second light-emitting functional layer 103a and the third light-emitting functional layer 104a are regarded as a functional layer as a whole, even if the distance between the functional layer as a whole and the first side 101a is not equal to the distance between the functional layer as a whole and the second side 101b, the color deviation problem can be reduced or avoided.

[0207] Since the distance between the entire functional layer and the first side 101a is not equal to the distance between the entire functional layer and the second side 101b, the luminous brightness of the portion of the entire functional layer close to the first side 101a and the luminous brightness of the portion of the functional layer close to the second side 101b will be different. The luminous brightness of the entire functional layer close to the side with a larger distance is smaller, and the luminous brightness of the portion close to the side with a smaller distance is larger.

[0208] Optionally, the distance between the entire functional layer and the first side 101a and the distance between the entire functional layer and the second side 101b can be made equal, thereby ensuring consistent luminous brightness on both sides while avoiding color cast problems and ensuring the luminous effect of the light-emitting component.

[0209] For example, the distance h1 between the first light-emitting functional layer 102a and the first side 101a of the first light-emitting unit 102 is equal to the distance h2 between the first light-emitting functional layer 102a and the second side 101b of the first light-emitting unit 102. The distance h3 between the second light-emitting functional layer 103a and the first side 101a of the second light-emitting unit 103 is equal to the distance h4 between the second light-emitting functional layer 103a and the second side 101b of the second light-emitting unit 103. The distance h5 between the third light-emitting functional layer 104a of the third light-emitting unit 104 and the first side 101a is equal to the distance h6 between the third light-emitting functional layer 104a and the second side 101b of the third light-emitting unit 104.

[0210] Thus, the light emitted by the first light-emitting functional layer 102a in the direction close to the first side surface 101a and the light emitted in the direction close to the second side surface 101b can be roughly the same. Thus, the light type symmetry of the luminous brightness of the first light-emitting functional layer 102a can be ensured, and then the light type symmetry of the luminous brightness of the first light-emitting unit 102 can be ensured. In addition, the light emitted by the second light-emitting functional layer 103a in the direction close to the first side surface 101a and the light emitted in the direction close to the second side surface 101b can be roughly the same. Thus, the light type symmetry of the luminous brightness of the second light-emitting functional layer 103a can be ensured, and then the light type symmetry of the luminous brightness of the second light-emitting unit 103 can be ensured. At the same time, the light emitted by the third light-emitting functional layer 104a in the direction close to the first side surface 101a and the light emitted in the direction close to the second side surface 101b can be roughly the same. Thus, the light type symmetry of the luminous brightness of the third light-emitting functional layer 104a can be ensured, and then the light type symmetry of the luminous brightness of the third light-emitting unit 104 can be ensured.

[0211] Optionally, the luminous color of the first light-emitting unit 102, the luminous color of the second light-emitting unit 103, and the luminous color of the third light-emitting unit 104 are different. Since the light patterns of the first light-emitting unit 102, the second light-emitting unit 103, and the third light-emitting unit 104 are all well symmetric, when at least two of the first light-emitting unit 102, the second light-emitting unit 103, and the third light-emitting unit 104 are luminous, the mixing effect of the mixed light emitted by the at least two luminous light-emitting units is also good, which can ensure the mixing uniformity of the mixed light in different directions and improve the luminous effect of the light-emitting component 100.

[0212] Since the display substrate can have substantially the same technical effects as the light-emitting components described in the previous embodiments, the technical effects of the display substrate will not be repeatedly described herein for the purpose of brevity.

[0213] The terms used in the embodiments of this application are only used to explain the embodiments of this application, and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should be the common meanings understood by people with general skills in the field to which this application belongs.

[0214] The terms used in the implementation mode of the present application are only used to explain the embodiments of the present application, and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the implementation mode of the present application should be the common meanings understood by people with ordinary skills in the field to which the present application belongs. The words "first", "second", "third" and similar words used in the patent application specification and claims of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limit, but indicate that there is at least one. Words such as "include" or "include" and similar words mean that the elements or objects appearing in front of "include" or "include" include the elements or objects listed after "include" or "include" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0215] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A light emitting component, characterized in that: The light emitting component comprises: substrate; A first light emitting unit, a second light emitting unit and a third light emitting unit located on one side of the substrate; The first light-emitting unit includes a first light-emitting functional layer, the outer side of which is annular; the second light-emitting unit includes a second light-emitting functional layer, the second light-emitting functional layer is annular, and the second light-emitting functional layer is sleeved on the outside of the first light-emitting functional layer; the third light-emitting unit includes a third light-emitting functional layer, the third light-emitting functional layer is annular, and the third light-emitting functional layer is sleeved on the outside of the second light-emitting functional layer.

2. The light emitting assembly according to claim 1, characterized in that: The first light-emitting functional layer has a hollow region, and the ring shape of the outer side surface of the first light-emitting functional layer and the hollow region of the first light-emitting functional layer make the first light-emitting functional layer a ring-shaped structure.

3. The light emitting assembly according to claim 1 or 2, characterized in that: The first light-emitting unit, the second light-emitting unit and the third light-emitting unit further include: a common semiconductor layer located on a side of the first light-emitting functional layer, the second light-emitting functional layer and the third light-emitting functional layer close to the substrate; The common semiconductor layer comprises: a first connection part, a second connection part and a third connection part which are arranged at intervals, wherein the first connection part is annular on one side close to the second connection part, the second connection part and the third connection part are both annular structures, the second connection part is sleeved outside the first connection part, and the third connection part is sleeved outside the second connection part; The first light-emitting functional layer includes a first light-emitting layer and a first semiconductor layer stacked in a direction away from the common semiconductor layer; the second light-emitting functional layer includes a second light-emitting layer and a second semiconductor layer stacked in a direction away from the common semiconductor layer; the third light-emitting functional layer includes a third light-emitting layer and a third semiconductor layer stacked in a direction away from the common semiconductor layer; The first light-emitting layer is connected to the first connecting portion, the second light-emitting layer is connected to the second connecting portion, and the third light-emitting layer is connected to the third connecting portion.

4. The light emitting assembly according to claim 3, characterized in that: The first light-emitting unit further includes a first light-emitting electrode, which is located on a side of the first light-emitting functional layer away from the substrate, and is connected to the first semiconductor layer; the first light-emitting electrode is a ring-shaped structure, and an orthographic projection of the first light-emitting electrode on the substrate is located within an orthographic projection of the first light-emitting functional layer on the substrate; The second light-emitting unit further includes a second light-emitting electrode, which is located on a side of the second light-emitting functional layer away from the substrate, and the second light-emitting electrode is connected to the second semiconductor layer; the second light-emitting electrode is a ring structure, and the orthographic projection of the second light-emitting electrode on the substrate is located within the orthographic projection of the second light-emitting functional layer on the substrate; The third light-emitting unit also includes a third light-emitting electrode, which is located on a side of the third light-emitting functional layer away from the substrate, and the third light-emitting electrode is connected to the third semiconductor layer; the third light-emitting electrode is a ring structure, and the orthographic projection of the third light-emitting electrode on the substrate is located within the orthographic projection of the third light-emitting functional layer on the substrate.

5. The light emitting assembly according to claim 4, characterized in that: The common semiconductor layer further comprises: a common connection portion, wherein the common connection portion and the first connection portion, the second connection portion and the third connection portion are all arranged at intervals; The first light emitting unit, the second light emitting unit and the third light emitting unit further include: a common light emitting electrode located at a side of the common semiconductor layer away from the substrate, and the common light emitting electrode is connected to the common connecting portion.

6. The light emitting assembly according to claim 5, characterized in that: The light emitting component further comprises: an insulating protective layer, the insulating protective layer being located on a side of the first light-emitting electrode, the second light-emitting electrode, the third light-emitting electrode and the common light-emitting electrode away from the substrate, the insulating protective layer comprising a first via hole, a second via hole, a third via hole and a common via hole; the first via hole exposes at least a portion of the first light-emitting electrode, the second via hole exposes at least a portion of the second light-emitting electrode, the third via hole exposes at least a portion of the third light-emitting electrode, and the common via hole exposes at least a portion of the common light-emitting electrode; A first connecting electrode, a second connecting electrode, a third connecting electrode and a common connecting electrode are located on a side of the insulating protective layer away from the substrate, the first connecting electrode is connected to the first light-emitting electrode through the first via hole, the second connecting electrode is connected to the second light-emitting electrode through the second via hole, the third connecting electrode is connected to the third light-emitting electrode through the third via hole, and the common connecting electrode is connected to the common light-emitting electrode through the common via hole.

7. The light emitting assembly according to claim 6, characterized in that: The substrate comprises a first side surface and a second side surface which are arranged opposite to each other, and a third side surface and a fourth side surface which are arranged opposite to each other, wherein a first end of the third side surface is connected to a first end of the first side surface, a second end of the third side surface is connected to a first end of the second side surface, a first end of the fourth side surface is connected to a second end of the first side surface, and a second end of the fourth side surface is connected to a second end of the second side surface; the first side surface, the second side surface, the third side surface and the fourth side surface are connected to form four corners; The first connecting electrode includes a first connecting wire and a first connecting pad, at least a portion of the first connecting wire is located in the first via hole and is connected to the first light-emitting electrode exposed by the first via hole; The second connecting electrode includes a second connecting wire and a second connecting pad, at least a portion of the second connecting wire is located in the second via hole and is connected to the second light-emitting electrode exposed by the second via hole; The third connection electrode includes a third connection wire and a third connection pad, at least a portion of the third connection wire is located in the third via hole and is connected to the third light-emitting electrode exposed by the third via hole; The common connection electrode includes a common connection wire and a common connection pad, at least a portion of the common connection wire is located in the fourth via hole and is connected to the common light-emitting electrode exposed by the common via hole; Wherein, the first connection pad, the second connection pad, the third connection pad and the common connection pad are respectively located at the four corners.

8. The light emitting assembly according to any one of claims 1 to 2, and 4 to 7, characterized in that: The light emitting color of the first light emitting unit is blue, the light emitting color of the second light emitting unit is red, and the light emitting color of the third light emitting unit is green.

9. The light emitting assembly according to any one of claims 1 to 2, and 4 to 7, characterized in that: The substrate comprises a first side surface and a second side surface which are arranged opposite to each other; The distance between the first light-emitting functional layer and the first side is equal to the distance between the first light-emitting functional layer and the second side; the distance between the second light-emitting functional layer and the first side is equal to the distance between the second light-emitting functional layer and the second side; the distance between the third light-emitting functional layer and the first side is equal to the distance between the third light-emitting functional layer and the second side.

10. The light emitting assembly according to any one of claims 1 to 2, and 4 to 7, characterized in that: The light-emitting component further includes: a color conversion unit located on a side of the first light-emitting unit close to the substrate; the color conversion unit includes: A first light shielding layer located on a side of the substrate close to the light-emitting unit, wherein the first light shielding layer has a light-through hole; a limiting dam layer located at a side of the first light shielding layer away from the substrate, the limiting dam layer having an opening area corresponding to the light through hole, and an orthographic projection of the opening area on the substrate overlaps with an orthographic projection of the corresponding light through hole on the substrate; An optical functional layer located in the opening area, at least a portion of the optical functional layer is used to convert the color of light entering the optical functional layer; and, a filter layer located between the substrate and the optical functional layer; the filter layer comprises a filter unit corresponding to the light through hole, and the orthographic projection of the filter unit on the substrate overlaps with the orthographic projection of the corresponding light through hole on the substrate; Wherein, the first light-emitting functional layer of the first light-emitting unit, the opening area and the light-through hole are arranged correspondingly.

11. A display substrate, characterized in that: The display substrate comprises: a driving backplane, and a plurality of light-emitting components according to any one of claims 1 to 10 located on one side of the driving backplane; The driving backplane is used to provide a driving signal for the light-emitting component to drive the light-emitting component to emit light.

12. The display substrate according to claim 11, characterized in that: The display substrate further includes: a second light shielding layer; The second light shielding layer is at least located between adjacent light emitting components among the plurality of light emitting components, and the second light shielding layer is disposed in contact with the side surface of the substrate in the light emitting components.

13. The display substrate according to claim 12, characterized in that: The second light shielding layer includes a first portion located between adjacent light emitting components, and a second portion located on a side of the light emitting component away from the driving backplane; The first part and the second part are distributed continuously.

Images