Diamond laser cutting device and cutting method

Abstract

The invention discloses a diamond laser cutting device which comprises a laser emitting assembly capable of emitting laser beams, and the laser emitting assembly comprises an output end close to one side of a product. A shielding unit is arranged on the side, close to the output end, of the product, and a light passing area is arranged on the shielding unit. The laser beam comprises a machining beam and an edge beam, and only the machining beam can penetrate through the light passing area. The shielding unit is arranged on the product, the light passing area is arranged on the shielding unit, the processing light beam at the output end can penetrate through the light passing area, the edge light beam is shielded, and therefore ablation of the edge light beam to the product (diamond) is reduced, cutting channel widening is avoided, and material loss is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of diamond processing, and in particular to a diamond laser cutting device and a cutting method. Background Art

[0002] Diamond possesses unique material properties, such as an ultra-wide bandgap, high breakdown field strength, and high carrier saturation drift velocity. Diamond holds broad application prospects in high-power electronics, 5G / 6G communications, microwave / millimeter-wave integrated circuits, and detection and sensing. Furthermore, diamond's high hardness makes it suitable for manufacturing precision cutting tools, while its high thermal conductivity makes it an excellent thermal management material. While significant progress has been made in the preparation of diamond single crystals both domestically and internationally in recent years, the efficiency and quality of diamond processing remain to be improved.

[0003] For example, publication number "CN117943706A" discloses "a processing technology for high-strength CVD diamond using laser", and the laser cutting machine includes a workbench, a drive assembly is fixedly installed on the left side of the workbench, the output end of the drive assembly is fixedly sleeved with a connecting ring, a laser emitter is fixedly installed in the middle of the connecting ring, and an annular tube is fixedly installed at the bottom end of the laser emitter. Diamond has the highest Mohs hardness and extremely high thermal conductivity, making it more difficult to achieve laser processing than other materials. However, when the laser contacts the diamond and its temperature reaches about 700°C, the diamond begins to convert into graphite, making this part of the material particularly easy to be removed by the laser. Therefore, when laser processing is actually carried out, the edge of the laser beam will form a continuous process of converting the surface diamond into graphite-ablating-converting into graphite and then ablating, resulting in an abnormally wide surface cutting path and a high material loss. Summary of the Invention

[0004] In response to the problems of large cutting path width and large material loss in the existing technology mentioned in the background technology, the present invention provides a diamond laser cutting device, which filters out part of the edge light beam through a shielding unit to prevent weak light from ablating the surface diamond, thereby significantly reducing the cutting path width and reducing material loss.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions.

[0006] A diamond laser cutting device includes a laser emitting component capable of emitting a laser beam, wherein the laser emitting component includes an output end close to a side of a product; A shielding unit is provided on one side of the product close to the output end, and a light-transmitting area is provided on the shielding unit; The laser beam includes a processing beam and an edge beam, and the light-passing area is only for the processing beam to pass through.

[0007] In the existing technology, diamond processing and manufacturing are mainly carried out through diamond wire saws and laser processing. The processing efficiency of diamond wire saws is extremely low, and debris and cracks are easily generated during the processing. Laser processing is a non-contact processing technology with the advantages of high efficiency, high precision and low loss. However, there is a certain degree of loss when using laser processing. For example, after cutting a diamond with a cutting section of 20mm×20mm, the cutting path width can reach 0.5mm wide, causing great loss. On the one hand, this is because the laser beam has a Gaussian distribution. As the cutting deepens, the focus moves downward, and the divergent beam at the upper end will continue to ablate the cutting path wall, so the diamond cutting path will eventually present a conical morphology. On the other hand, although according to the definition of the spot diameter, the light intensity drops to the peak value 1 / e 2 The circular diameter formed at the spot is the diameter of the light spot, which is also the main part of the laser ablation effect. However, in practice, each laser beam includes a weak light area and a central beam. If only one laser beam is used for processing, the weak light area of ​​the light spot may cause the upper surface diamond to be converted into graphite, ablated, converted into graphite, and then ablated continuously, resulting in an abnormally wide surface cutting path. If multiple laser beams are used for processing simultaneously, some weak light areas of the edge laser beams within this laser beam group will cause the surface diamond to be converted into graphite, ablated, converted into graphite, and then ablated continuously. Polishing and grinding are usually required later to form parallel diamond slices on the upper and lower surfaces. Therefore, the width of the upper cutting path results in more material that needs to be polished and removed, resulting in high material loss.

[0008] In the present application, a shielding unit is provided on the product, and a light-through area is provided on the shielding unit, wherein the light-through area can allow the processing light beam at the output end to pass through, while shielding the edge light beam, thereby reducing the ablation of the product (diamond) by the edge light beam, avoiding the widening of the cutting path, and reducing material loss. The laser beam is the laser used to process diamonds, which can be only one laser ray or a combination of multiple laser rays; the edge light beam is the part of the laser beam edge that will cause additional ablation; if the laser beam only includes one laser ray, the edge light beam is the weak light area of ​​the laser ray; if the laser beam includes several laser rays, the edge light beam is the outermost part of the weak light area of ​​the laser beam, that is, the weak light area of ​​the laser ray at the edge of the laser beam away from the processing center, that is, the weak light area of ​​the laser beam will cause additional ablation on the cutting path; the processing beam is the part of the laser beam excluding the edge light beam; if the laser beam is only one laser ray, the processing beam is the part of the laser beam that does not include the weak light area; If the laser beam includes several laser rays, the processing beam is the rest of the part except the weak light area at the outermost edge of the laser beam, including the central beam and weak light area of ​​all laser rays at non-edge positions and the central beam of laser rays at edge positions and the weak light area close to the processing center; the length of the shielding unit and the light-through area needs to be set according to whether there is relative displacement with the product; if the shielding unit is fixedly connected to the diamond product, the length of the shielding unit and the light-through area needs to be set to be greater than or equal to the length of the diamond product; if the shielding unit is displaced with the diamond product during the cutting process, the length of the shielding unit and the light-through area can also be set to be less than the length of the diamond product.

[0009] Preferably, the shielding unit includes a shielding plate, on which a light-through area is provided. The edge light beam is shielded by the shielding plate provided with the light-through area, wherein the shape of the light-through area on the shielding plate varies according to the processing requirements, and mainly includes a strip through-slot structure and a circular through-hole structure, which respectively adapt to the working conditions requiring cutting and the working conditions requiring drilling. In the processing process using the strip through-slot, since the strip through-slot can only block the edge light beams on both sides, but cannot block the ablation of the product by the edge light beam in the cutting direction, the product in the forward direction will be ablated by the edge light beam first, and then the ablation by the processing light beam will be performed, thereby improving the processing efficiency and making full use of the auxiliary processing of the edge light beam.

[0010] The light-through area on the shielding plate is a through groove or through hole structure. The shape of the light-through area on the shielding plate can be changed as needed, mainly including through groove and through hole shapes. The through groove-shaped light-through area is suitable for working conditions where a laser beam is required for cutting. During use, since the through groove only blocks the edge beams on both sides of the laser beam, while the edge beams along the direction of travel of the laser beam are not blocked, the edge beams along the direction of travel continue to process the product, thereby improving cutting efficiency, making full use of the energy of the edge beams, and controlling the groove width at the same time; further, the through groove shape can be formed by placing two shielding plates on the product, leaving a gap between the two shielding plates to form a through groove, or by processing a through groove on one shielding plate; the through groove processing on the shielding plate can be directly processed by the laser beam, thereby making it more suitable for blocking the edge beams of the laser beam. The light-transmitting area in the shape of a through hole is suitable for products that require drilling processing. During use, the through hole blocks all edge light beams, allowing only the processing light beam to pass through, thereby avoiding the widening of the channel during the drilling process and comprehensively limiting the interference of the edge light beam. The structural formation of the through hole is similar to that of the through slot, and can be obtained by splicing or direct processing.

[0011] The shielding unit is attached to the product. By attaching the shielding unit to the product, a stable shielding effect can be achieved, thereby avoiding a large gap between the shielding unit and the product, which causes light to enter the gap and continuously ablate the cutting edge of the product, causing the cutting edge to widen.

[0012] Preferably, the shielding unit includes staggered rotating assemblies disposed on either side, each comprising a rotating mask and a blank area. The rotating mask can block the edge beam, while the edge beam can pass through the blank area. When the rotating mask is rotated to the minimum distance between the edges of the rotating mask, a light-transmitting area is formed between the edges of the rotating mask. Since the laser beam passes between the two staggered rotating assemblies, the edge beam is blocked for a period of time during the rotation of the rotating mask. However, since the blank area is a slot structure, it does not block the processing beam or the edge beam in the laser beam. When the rotating mask corresponds to the laser beam, the processing beam is also not blocked, thereby ensuring that the processing beam continuously processes the product, while the edge beam only processes the product when the laser beam corresponds to the blank area. Therefore, the processing beam received by the product is continuous, while the edge beam is received intermittently. During the processing, the edge beam can heat the product, thereby improving the processing efficiency. Since the edge beam processes the product intermittently, the edge beam can never reach the ablation standard and always cycles between the heating-heating state, thereby ensuring the heating effect of the edge beam on the product while avoiding ablation, maximizing the heating effect of the edge beam, and avoiding affecting the cutting path width of the laser processing.

[0013] Preferably, a plurality of shielding units are provided along the direction of laser beam emission, and the staggered rotating components on each shielding unit are staggered. By providing a plurality of shielding units and staggering the staggered rotating components in the shielding units along the radiation direction of the laser beam, the staggered rotating components in different shielding units can shield edge beams in different directions of the laser beam, thereby achieving a comprehensive shielding effect on the edge beams, thereby reducing the ablation of the edge beams in various directions during the drilling process, avoiding widening of the cutting path, and at the same time, because the rotating shielding pieces and the empty areas alternately correspond to the laser beam, the heating effect of the edge beams on the product can be ensured, thereby ensuring processing efficiency.

[0014] Preferably, the rotating mask is a fan-shaped structure, so that during the rotation process, the relative gap between the edges of the rotating mask on both sides can be stabilized at a required size of the light-transmitting area.

[0015] Preferably, the shielding unit includes a planetary drive gear set, the planetary drive gear set including planetary gears, the planetary gears being connected to a rotating mask, the planetary drive gear set having a perforation at its center, and the rotating mask synchronously rotating around the planetary gear and revolving around the perforation. By providing the planetary gear set, the rotating mask can simultaneously rotate and revolve around the perforation. Driven by the revolution, the edge of the rotating mask can form a circular shielding area. Furthermore, because the revolution continuously drives the rotating mask to different positions of the laser beam, it can achieve a shielding effect at different positions of the laser beam, eliminating blind spots and continuous shielding, thereby preventing edge beam ablation of the product. At the same time, since the rotating mask also rotates synchronously, there will be a period of time when the empty area corresponds to the laser beam during the rotation and revolution cycle. Therefore, even if it revolves, there will be no obstruction when it corresponds to the empty area. At this time, the edge beams in all directions can heat the product, thereby ensuring the uniformity of heating, improving the heating efficiency of the product, and improving the processing efficiency.

[0016] Preferably, the rotating mask is provided with a notch, and during the revolution, when the notch faces the perforation, the notch is located on the side of the perforation along the cutting direction. The notch is provided on the rotating mask, and by controlling the gear meshing relationship, the rotation rate, the notch opening position, etc., it is ensured that during the rotation, when the notch faces the perforation, the notch is also located on the side of the perforation facing the cutting direction. Therefore, during the entire rotation and revolution process, the edge beam is not blocked only at the position on the side of the perforation facing the cutting direction, thereby improving cutting efficiency under the cutting process. At the same time, it can ensure that the remaining parts are blocked without blind spots and intermittent blocking, ensuring that the edge beam only generates heating without ablation effects in the remaining parts.

[0017] Preferably, the planetary drive gear set includes a central gear, the perforations being provided on the central gear, the central gear being connected to drive teeth, the drive teeth being offset from the planetary gears along the axis, and the drive teeth being connected to a drive unit. The central gear transmits the output force of the drive unit, typically a motor, via the drive teeth, wherein the drive teeth are offset from the planetary gears along the axis, thereby preventing the meshing position of the drive teeth from interfering with the orbital motion of the planetary gears, thereby ensuring the stability of the device.

[0018] The present invention also provides a cutting method, comprising the following steps: S1. Set the shielding unit on the side of the product close to the output end and adjust the size of the light-passing area; S2. Set the parameters of the laser emission component. The laser emission component emits a laser beam. The processing beam passes through the light-passing area, and the edge beam is blocked by the blocking unit. S3. The product and the laser beam move relative to each other to form a laser cutting track.

[0019] In step S1, after the shielding unit is placed on the product, a laser beam is used to cut the shielding unit to form a light-transmitting area. The shielding unit can only be cut by the processing beam, and the light-transmitting area can only allow the processing beam to pass through. The shielding unit is made of an opaque material, such as ceramic, opaque quartz, opaque crystal material (such as garnet, barite, etc.), metal, or alloy material. The shielding unit is directly placed on the product and processed and cut by laser. The material of the shielding unit is selected to be able to be cut by the processing beam but not by the edge beam, so that the light-transmitting area opened on the shielding unit can accurately adapt to the size of the processing beam in the laser beam, and the edge beam in the laser beam cannot penetrate and cut the shielding unit, thereby ensuring the accuracy of the light-transmitting area and better adaptability to the laser beam.

[0020] Preferably, in step S2, the staggered rotating assembly drives the rotating mask and the blank area; When the rotating masks on both sides approach each other, a light-transmitting area is formed and the edge light beams are blocked; When the empty areas on either side approach each other, the light-passing area disappears, and the edge beam passes through the shielding unit to process the product. By rotating the mask and the empty area to alternately correspond to the laser beam, the edge beam on the laser beam can alternately act on the product. When the empty area corresponds to the laser beam, the edge beam can heat the product. However, when the rotating mask corresponds to the laser beam, the edge beam does not heat the product. The parts of the product previously heated by the edge beam are now dissipated and are waiting to be reheated when the empty area corresponds to the laser beam next time, thus ensuring that the edge beam can continuously heat the auxiliary processing beam.

[0021] Preferably, the staggered rotating assembly is connected to a planetary drive gear set, and the staggered rotating assembly simultaneously rotates and orbits, intermittently blocking the edge beams of the laser beam. The synchronized orbital and rotational processes allow the shielding area to maintain a full circle, eliminating blind spots. The orbital rotation allows for real-time changes in the shielding position, preventing the edge beams from continuously heating a specific area. Meanwhile, the rotational process ensures that edge beams in all directions can simultaneously heat the product over a period of time, ensuring uniform heating.

[0022] The beneficial effects of the present invention are as follows: (1) By filtering out part of the edge beam domain through the shielding unit, the weak light is prevented from ablating the surface diamond, thereby significantly reducing the cutting path width and reducing material loss; (2) It can utilize the ablation effect of the edge beam on the product to improve the processing efficiency under the working conditions where cutting is required; (3) The edge beam can be intermittently blocked so that the edge beam can act on the product intermittently, thereby ensuring that the edge beam heats the product and at the same time controlling the ablation in non-essential areas, thereby ensuring the processing effect and processing quality; (4) It can rely on the synchronous rotation and revolution to ensure all-round shielding of the edge beam without blind spots, and at the same time ensure intermittent heating of the edge beam and overall uniform heating, further improving the control of processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention.

[0024] Figure 2 This is a first structural diagram of Example 1.

[0025] Figure 3 This is a second structural diagram of Example 1.

[0026] Figure 4 It is a structural diagram of Example 3.

[0027] Figure 5 It is a structural diagram of Example 4.

[0028] Figure 6 It is a structural diagram of Example 5.

[0029] Figure 7 It is a structural diagram of Example 6.

[0030] Figure 8 This is a comparison diagram of the processing of diamond products in the present invention.

[0031] Figure 9 This is a schematic diagram of the first state of the laser beam processed product in the present invention.

[0032] Figure 10 It is a schematic diagram of the second state of the laser beam processed product in the present invention.

[0033] In the picture: 1 laser emission component, 11 output end; 2 blocking units, 21 light-passing areas; 3 shielding plates, 4 staggered rotating components, 41 rotating mask, 42 ​​empty area, 43 notch; 5 planetary drive gear set, 51 planetary gear, 52 perforated gear, 53 sun gear; 6 translation units; 7. Product clamping and moving components; 8 laser beam, 81 processing beam, 82 edge beam. DETAILED DESCRIPTION

[0034] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0035] Example 1: like Figure 1 As shown, a diamond laser cutting device includes a laser emitting component 1 capable of emitting a laser beam, and the laser emitting component 1 includes an output end 11 close to a side of a product; A shielding unit 2 is provided on the side of the product close to the output end 11, and a light-transmitting area 21 is provided on the shielding unit 2; The laser beam 8 includes a processing beam 81 and an edge beam 82 , and the light-passing area 21 is only for the processing beam to pass through.

[0036] In this embodiment, a shielding unit 2 is provided on the product, and a light-transmitting area 21 is provided on the shielding unit 2, wherein the light-transmitting area 21 can allow the processing light beam to pass through while shielding the edge light beam, thereby reducing the ablation of the product (diamond) by the edge light beam, avoiding the widening of the cutting path, and reducing material loss.

[0037] like Figure 2 、 3 As shown, the shielding unit 2 includes a shielding plate 3, which is provided with a light-transmitting area 21, which is a through-slot structure. In this embodiment, the shielding plate is attached to the product, specifically by bonding. This achieves a stable shielding effect, avoiding the formation of a large gap between the shielding plate and the product, which would cause light to enter the gap and cause continuous ablation at the cutting edge of the product, resulting in widening of the cutting edge.

[0038] like Figure 9 、 10 As shown, the laser beam 8 is a laser for processing diamonds, which can be just one laser ray or a combination of multiple laser rays; the edge beam 82 is the portion of the edge of the laser beam 8 where additional ablation will occur; if the laser beam 8 only includes one laser ray, the edge beam 82 is the weak light area of ​​the laser ray; if the laser beam 8 includes several laser rays, the edge beam 82 is the outermost weak light area of ​​the laser beam 8, that is, the weak light area of ​​the laser ray at the edge of the laser beam 8 away from the processing center, that is, the weak light area of ​​the laser ray at the edge of the laser beam 8 will cause additional ablation on the cutting path; the processing beam 81 is the portion of the laser beam 8 excluding the edge beam 82; if the laser beam 8 is just one laser ray, the processing beam 81 is the portion of the laser beam 8 excluding the weak light area; if the laser beam 8 includes several laser rays, the processing beam 81 is the rest of the portion except the weak light area at the outermost edge of the laser beam 8, including the central beam and weak light area of ​​all laser rays at non-edge positions and the central beam and weak light area of ​​the laser rays at the edge position close to the processing center.

[0039] This embodiment discloses a diamond laser cutting device, wherein the shielding unit 2 provided on the laser emitting assembly 1 in this embodiment is mainly a shielding plate 3, and a light-passing area 21 is provided on the shielding plate 3. In this embodiment, the light-passing area 21 is a through-slot structure, wherein the extending direction of the through-slot is the same as the cutting direction, and the light-passing area 21 is aligned with the center position of the laser beam. The laser beam includes a processing beam and an edge beam, wherein the processing beam plays the main processing role. Under normal processing conditions, the light spot generated by the processing beam usually includes a light intensity drop to a peak value of 1 / e 2However, the edge beam may also cause the upper surface diamond to form a continuous process of conversion to graphite-ablation-conversion to graphite and then ablation, resulting in an abnormally wide surface cutting path. In this embodiment, due to the provision of a shielding plate 3, the size of the light-through area 21 provided on the shielding plate 3 corresponds to the size of the processing beam. Therefore, after the laser beam passes through the light-through area 21, the edge beam is blocked by the shielding plate 3 and cannot pass through the light-through area 21. Therefore, only the processing beam processes the product, thereby avoiding the edge beam from burning the product, thereby reducing the widening of the cutting path during the processing. The through-slot structure in this embodiment can be achieved by Figure 2 、 3 As shown, it is formed by the gap between two shielding plates, or by a shielding plate with a through groove processed in the middle; the through groove structure in this embodiment can be cut into a through groove shape by pre-machining, or the shielding plate can be placed on the product and directly cut by a laser beam. It is necessary to ensure that the material of the shielding plate can be cut by the processing beam but not by the edge beam, so as to ensure that the processed through groove can only pass through the processing beam in the laser beam.

[0040] In the actual processing process, the through-groove-shaped light-transmitting area 21 in this embodiment is suitable for working conditions that require the use of a laser beam for cutting. During use, since the through-groove only blocks the edge beams on both sides of the laser beam, and the edge beams along the direction of travel of the laser beam are not blocked, the edge beams along the direction of travel continue to process the product, thereby improving the cutting efficiency, making full use of the energy of the edge beam, and controlling the groove width at the same time.

[0041] like Figure 8 As shown, Figure 8 The left side is a cross-sectional view of the diamond product cutting path produced by the present invention. Figure 8 The right side is a cross-sectional effect diagram of the cutting path in the prior art, where it can be clearly seen that Figure 8 The top of the right cutting lane has a widened portion ablated by the edge beam, while the top of the left cutting lane does not have this widened portion. Therefore, in this embodiment, the laser beam uses a shielding unit to shield the edge beam, which can prevent the edge beam from ablating the diamond product.

[0042] In this embodiment, an implementation group and a control group are provided, wherein the control group is not provided with a shielding unit; the implementation group adopts the shielding unit of this embodiment, and the following comparison data are obtained. Example 2: like Figure 1 As shown, a diamond laser cutting device includes a laser emitting component 1 capable of emitting a laser beam, and the laser emitting component 1 includes an output end 11 close to a side of a product; A shielding unit 2 is provided on the side of the product close to the output end 11, and a light-transmitting area 21 is provided on the shielding unit 2; The laser beam 8 includes a processing beam 81 and an edge beam 82 , and the light-passing area 21 is only for the processing beam to pass through.

[0043] The shielding unit 2 includes a shielding plate 3, which is provided with a light-transmitting area 21, which is a through-hole structure. In this embodiment, the shielding plate is attached to the product, specifically by bonding. This achieves a stable shielding effect, avoiding the formation of a large gap between the shielding plate and the product, which would cause light to enter the gap and cause continuous ablation at the cutting edge of the product, resulting in widening of the cutting edge.

[0044] This embodiment discloses a diamond laser cutting device, wherein the shielding unit 2 provided on the product of the laser emission component 1 in this embodiment is mainly a shielding plate 3, and a light-passing area 21 is provided on the shielding plate 3. In this embodiment, the light-passing area 21 is a through-hole structure, and the light-passing area 21 is aligned with the center position of the laser beam. During use, the light-passing area 21 of the through-hole structure can fully block the edge beams in all directions around the laser beam. The laser beam includes a processing beam and an edge beam, wherein the processing beam plays the main processing role. Under normal processing conditions, the light spot generated by the processing beam usually includes a light intensity drop to a peak value of 1 / e 2 The circular area formed at the edge of the laser beam may also cause ablation of the portion of the upper surface diamond converted to graphite. However, the edge of the laser beam may also cause a continuous process of conversion of the upper surface diamond to graphite, ablation, conversion to graphite, and then ablation, resulting in an abnormally wide surface cutting path. In this embodiment, due to the provision of a shielding plate 3, the size of the light-through area 21 set on the shielding plate 3 corresponds to the size of the processing beam. Therefore, after the laser beam passes through the light-through area 21, the edge of the laser beam is blocked by the shielding plate 3 and cannot pass through the light-through area 21. Therefore, only the processing beam processes the product, thereby preventing the edge of the laser beam from burning the product and reducing the widening of the cutting path during the processing.

[0045] In the actual processing process, the through-hole-shaped light-transmitting area 21 in this embodiment is suitable for products that require drilling processing. During use, the through-hole blocks all edge light beams so that only the processing light beam passes through, thereby avoiding the widening of the channel during the drilling process and comprehensively limiting the interference of edge light beams.

[0046] Example 3: like Figure 4As shown, unlike Example 1, this embodiment includes a shielding unit 2, each of which includes two staggered rotating assemblies 4, each of which includes a rotating mask 41 and a blank area 42. The rotating mask 41 can block the edge beam, while the edge beam can pass through the blank area 42. When the edge spacing of the rotating masks 41 is minimized, a light-transmitting area 21 is formed between the edges of the rotating masks 41. As the laser beam passes between the two staggered rotating assemblies 4, the edge beam is blocked for a period of time during the rotation of the rotating masks 41. However, since the blank area 42 is a hollow slot structure, it does not block the processing beam or the edge beam in the laser beam. When the rotating mask 41 corresponds to the laser beam, the processing beam is also unblocked. This ensures that the processing beam continuously processes the product, while the edge beam only processes the product when the laser beam corresponds to the blank area 42. Therefore, the processing beam received by the product is continuous, while the edge beam is received intermittently. During the processing, the edge beam can heat the product, thereby improving the processing efficiency. Since the processing of the product by the edge beam is intermittent, the edge beam can never reach the ablation standard and always cycles between the heating-heat dissipation state, thereby ensuring the heating effect of the edge beam on the product, while avoiding ablation to maximize the use of the heating effect of the edge beam, while avoiding affecting the cutting path width of the laser processing; wherein the shielding unit 2 in this embodiment remains in contact with the diamond product to ensure a stable and effective shielding effect, and a micron-level gap can also be left between the shielding unit 2 and the diamond product to avoid friction during rotation.

[0047] like Figure 4 As shown, the rotating mask 41 is a fan-shaped structure. The rotating mask 41 is arranged in a fan-shaped structure so that during the rotation process, the relative gap between the edges of the rotating mask 41 on both sides can be stabilized at the required size of the light-transmitting area 21.

[0048] This embodiment discloses a diamond laser cutting device. In this embodiment, two interleaved rotating assemblies 4 are provided, one on each side. The interleaved rotating assemblies 4 can be rotated by a drive element, which includes, but is not limited to, direct motor drive, gear drive, pulley drive, etc., which are not described in detail in this embodiment. The interleaved rotating assemblies 4 are provided with a rotating mask 41 and a blank area 42. The edge of the rotating mask 41 is fan-shaped, and the rotating profile of the rotating mask 41 is a perfect circular profile. Since two interleaved rotating assemblies 4 are provided in this embodiment, the gap between the rotating profiles of the rotating masks 41 on the two interleaved rotating assemblies 4 is adjusted to a size that is only large enough to allow the processing beam to pass. At the same time, since the staggered rotating assembly 4 in this embodiment is provided with the rotating masks 41 and the empty area 42, when the rotating masks 41 on both sides are close to each other and in relative positions, a light-transmitting area 21 is formed at the minimum gap between the edge contours of the two rotating masks 41. However, if the rotating masks 41 on both sides move away from each other, the edge contours of the rotating masks 41 on both sides cannot reach the minimum gap, and the light-transmitting area 21 cannot be formed, thereby allowing both the processing light beam and the edge light beam to act on the product.

[0049] Therefore, in this embodiment, the laser beam processes the product continuously. Since the laser beam passes between the two staggered rotating components 4, the edge beam in the laser beam will be blocked when the two rotating masks 41 approach each other. Since the rotating masks 41 are fan-shaped structures, the edge beam will be blocked for a period of time during the rotation of the rotating masks 41. When the rotating masks 41 on both sides are away from each other, that is, after the rotating masks 41 are separated from the laser beam, they are transformed into empty areas 42 corresponding to the laser beam. Since the empty areas 42 are empty groove structures, they will not cause any blocking of the processing beam and the edge beam in the laser beam. When the rotating masks 41 correspond to the laser beam, the processing beam is not blocked, thereby ensuring that the processing beam always processes the product continuously, and the edge beam only processes the product when the laser beam corresponds to the empty areas 42. The received processing beam is continuous, while the received edge beam is intermittent. During the processing, although the energy of the edge beam is lower than that of the processing beam, it can also heat the product, thereby improving the processing efficiency. If the product is heated for a long time, ablation will occur. In this embodiment, since the processing of the product by the edge beam is intermittent, the edge beam can never reach the ablation standard and always cycles between the heating-heat dissipation state, thereby ensuring the heating effect of the edge beam on the product while avoiding ablation. By controlling the rotation frequency of the staggered rotating component 4, as well as the size and distribution of the rotating mask 41 and the empty area 42, the processing effect of the edge beam on the product is always below the critical value of ablation, thereby maximizing the heating effect of the edge beam while avoiding affecting the cutting path width of the laser processing.

[0050] Furthermore, in this embodiment, a translation unit 6 is mounted on the interleaved rotating assembly 4. This translation unit 6 is a slide mechanism that can drive the interleaved rotating assembly 4 to translate, thereby changing the gap between the interleaved rotating assemblies 4 on either side, and thus affecting the size of the light-transmitting area 21. In actual operation, the spot diameter of fundamental mode Gaussian light exhibits a hyperbolic distribution, meaning the laser beam is similar to a cone. When the focus moves downward, the spot diameter at the light shield increases, partially blocking the processing beam and reducing processing efficiency. Therefore, in this embodiment, the translation unit 6 drives the interleaved rotating assembly 4 to ensure that the edge beams are blocked while the processing beam is not blocked.

[0051] In this embodiment, since the staggered rotating components 4 are respectively arranged on both sides, the vertical direction of the line connecting the center points of the two staggered rotating components 4 is the cutting direction of the laser beam in this embodiment. Therefore, during the cutting process, the staggered rotating components 4 only block the edge light beams on both sides of the cutting direction. The blocking of the edge light beams on both sides can ensure heating and improve the processing efficiency of the processing light beam; but the edge light beams in the cutting direction are not blocked. The continuous heating of the edge light beams in the direction of travel can produce ablation. Before the processing beam is processed, the surface of the product is ablated first to remove part of the material, thereby reducing the processing burden of the processing beam and ensuring the processing efficiency.

[0052] Example 4: like Figure 5 As shown, unlike Example 1, in this embodiment, a plurality of shielding units 2 are provided along the direction of laser beam emission, and the staggered rotating components 4 on each shielding unit 2 are staggered. By providing a plurality of shielding units 2 and staggering the staggered rotating components 4 in the shielding units 2 along the radiation direction of the laser beam, the staggered rotating components 4 in different shielding units 2 can shield the edge beams in different directions of the laser beam, thereby achieving a comprehensive shielding effect on the edge beams. This reduces the ablation of the edge beams in various directions during the drilling process, avoiding widening of the cutting path. At the same time, because the rotating shielding pieces 41 and the empty areas 42 alternately correspond to the laser beam, the heating effect of the edge beams on the product can be ensured, thereby ensuring processing efficiency.

[0053] This embodiment discloses a laser cutting device for diamonds. In this embodiment, unlike the working condition of cutting that needs to be carried out in embodiment 3, the working condition mainly addressed in this embodiment is the scenario where drilling is required, such as the scenario where a diamond needs to be drilled individually, or the pre-drilling operation that needs to cut diamonds. In this working condition, it is necessary to block the all-around edge beam of the laser beam, while avoiding the method of continuous blocking in embodiment 2 that affects the processing efficiency. In this embodiment, an intermittent all-around blocking processing method is adopted. The blocking unit 2 in this embodiment maintains contact with the diamond product to ensure a stable and effective blocking effect. A micron-level gap can also be left between the blocking unit 2 and the diamond product to avoid friction during rotation.

[0054] In this embodiment, two groups of shielding units 2 are arranged along the axial direction, and each group of shielding units 2 is internally provided with two staggered rotating assemblies 4. Assuming that the emission direction of the laser beam processed product in this embodiment is from top to bottom, that is, in this embodiment, two groups of shielding units 2 are stacked in the vertical direction, each group of shielding units 2 is provided with a rotating shielding plate 41 and a blank area 42. Therefore, both the upper and lower groups of shielding units 2 can block the edge beam. However, in this embodiment, it is necessary to control the staggered arrangement of the staggered rotating assemblies 4 within the upper and lower shielding units 2. In this embodiment, the two upper staggered rotating assemblies 4 are arranged along the left and right sides, while the two lower staggered rotating assemblies 4 are arranged along the upper and lower sides. This allows the upper and lower groups of shielding units 2 to block the edge beams in different directions, achieving all-round shielding and ensuring the quality of laser beam drilling. The size of the light-transmitting area 21 in this embodiment is adjusted in the same manner as in Example 3, and is achieved via the translation unit 6.

[0055] Example 5: like Figure 6As shown, unlike Example 1, the shielding unit 2 in this embodiment includes a planetary drive gear set 5, which includes planetary gears 51. The planetary gears 51 are connected to a rotating shielding plate 41. A through-hole 52 is provided at the center of the planetary drive gear set 5. The rotating shielding plate 41 rotates around the planetary gears 51 and revolves around the through-hole 52 simultaneously. By providing the planetary gear set 51, the rotating shielding plate 41 can simultaneously rotate and revolve around the through-hole 52. Driven by the revolution, the edge of the rotating shielding plate 41 can form a circular shielding area. At the same time, because the revolution continuously drives the rotating shielding plate 41 to move to different directions of the laser beam, it can achieve a shielding effect at different directions of the laser beam, eliminating blind spots and continuous shielding, thereby preventing edge beam ablation of the product. At the same time, because the rotating shielding plate 41 also rotates synchronously, there will be a period of time during the rotation and revolution cycle when the empty area 42 corresponds to the laser beam. Therefore, even if it revolves, there will be no obstruction when the empty area 42 corresponds to the laser beam. At this time, the edge beams in all directions can heat the product, thereby ensuring uniform heating, improving the heating efficiency of the product, and improving processing efficiency. In this embodiment, the shielding unit 2 maintains contact with the diamond product to ensure a stable and effective shielding effect. A micron-level gap can also be left between the shielding unit 2 and the diamond product to avoid friction during rotation.

[0056] like Figure 6 As shown, the planetary drive gear set 5 includes a central gear 53 with a through-hole 52 provided therein. Drive teeth are connected to the central gear 53, and the drive teeth are offset along the axis from the planetary gears 51. The drive teeth are connected to a drive unit. Central gear 53 transmits the output force of the drive unit, typically a motor, through the drive teeth. The drive teeth are offset along the axis from the planetary gears 51 to prevent the meshing position of the drive teeth from interfering with the orbital motion of the planetary gears 51, thus ensuring the stability of the device.

[0057] This embodiment discloses a laser cutting device for diamonds. In this embodiment, unlike the cutting working condition required in Example 3, this embodiment mainly deals with the working condition that requires drilling, such as the scene where a diamond needs to be drilled individually, or the pre-drilling operation that requires cutting diamonds. Under such working conditions, it is necessary to block the all-round edge beam of the laser beam, while avoiding the method of continuous blocking in Example 2 that affects the processing efficiency. This embodiment adopts an intermittent all-round blocking processing method. This embodiment uses the cutting direction of the up and down direction as an example for explanation.

[0058] The present embodiment is different from the arrangement of two groups of shielding units 2 in the fourth embodiment in that only one group of shielding units 2 is provided in the present embodiment, wherein the arrangement of the shielding units 2 is more flexible and varied. Only one group of staggered rotating components 4 can be provided; two groups of staggered rotating components 4 can be provided; rotating shielding pieces 41 can be provided without providing an empty area 42; rotating shielding pieces 41 and an empty area 42 can be provided. The specific arrangement and working method are as follows: In this embodiment, compared with Example 3, a planetary drive gear set 5 is added, and the planetary gears 51 in the planetary drive gear set 5 drive the rotating cover 41 to rotate and revolve. In this embodiment, two planetary gears 51, two staggered rotating components 4, and rotating covers 41 and empty areas 42 on the rotating components are set as an example for explanation.

[0059] In this embodiment, the planetary drive gear set 5 includes a central gear 53 arranged at a central position, and planetary gears 51 are connected to the left and right sides of the central gear 53 respectively. The planetary gears 51 on both sides are connected to the staggered rotating components 4, and the staggered rotating components 4 are provided with rotating masks 41 and empty areas 42 arranged at intervals. During operation, when the central gear 53 moves, it will drive the planetary gears 51 to revolve and rotate synchronously. Therefore, the rotating masks 41 and the empty areas 42 will rotate and revolve around the center point synchronously. The edge of the rotating mask 41 is controlled to be at the boundary line between the processing beam and the edge beam, that is, there is a gap between the edge of the rotating mask 41 and the center point, and the gap is half of the diameter of the processing beam spot. Due to the revolution, the trajectory formed by the edge of the rotating mask 41 will form a circular structure at the center. This revolution enables the rotating mask 41 to achieve a full-scale shielding effect. Due to the revolution, the rotating mask 41 cannot remain in a certain area for a long time, nor will the edge beam pass through a certain area for a long time, thereby achieving circumferential blocking of the edge beam. During this process, the rotating mask 41 and the empty area 42 will rotate. When the empty area 42 is toward the center point, it will pass through all the edge beams, thereby ensuring uniform heating. Therefore, this embodiment uses fewer rotating masks 41 and shielding units 2, achieving a full-scale edge beam shielding effect. At the same time, it can prevent the shielded area from having blind spots. The revolution can form a circular shielding area, ensuring processing accuracy.

[0060] During the cutting process, as the depth of the cutting path increases, the focus needs to be moved downward. In this embodiment, due to the use of a planetary drive gear set 5, the size of the light-transmitting area 21 is not easy to change. Unlike Example 3, this embodiment adopts the method of moving the product to change the position of the focus on the product. The product is driven by the product clamping moving component 7 to adapt to the position of the focus, that is, the absolute position of the focus remains unchanged, and the product moves upward, so that the laser beam and the light-transmitting area 21 in this embodiment do not need to be adjusted again after the initial adjustment.

[0061] Example 6: like Figure 7 As shown, unlike Example 1, this embodiment includes a notch 43 on the rotating shield 41. During the revolution, when the notch 43 faces the perforation 52, the notch 43 is located on the side of the perforation 52 in the cutting direction. The notch 43 is provided on the rotating shield 41. By controlling the gear meshing relationship, rotation rate, and the position of the notch 43, the notch 43 is positioned on the side of the perforation 52 facing the cutting direction during rotation. Consequently, during the entire rotation and revolution process, the edge beam is only unobstructed at the location facing the perforation 52 in the cutting direction, thereby improving cutting efficiency during the cutting process. Furthermore, the remaining portions of the shield are shielded without blind spots and provide intermittent shielding, ensuring that the edge beam only generates heating rather than ablation in the remaining portions. The shielding unit 2 in this embodiment maintains contact with the diamond product to ensure stable and effective shielding. Alternatively, a micron-level gap may be left between the shielding unit 2 and the diamond product to prevent friction during rotation.

[0062] like Figure 7 As shown, the planetary drive gear set 5 includes a central gear 53 with a through-hole 52 provided therein. Drive teeth are connected to the central gear 53, and the drive teeth are offset along the axis from the planetary gears 51. The drive teeth are connected to a drive unit. Central gear 53 transmits the output force of the drive unit, typically a motor, through the drive teeth. The drive teeth are offset along the axis from the planetary gears 51 to prevent the meshing position of the drive teeth from interfering with the orbital motion of the planetary gears 51, thus ensuring the stability of the device.

[0063] This embodiment discloses a diamond laser cutting device. In this embodiment, the working condition requiring cutting is the same as that in Example 3. This embodiment mainly copes with the scene requiring cutting and moving. Under this working condition, it is necessary to block the edge beam of the laser beam except for the side of the forward direction, while avoiding continuous blocking in Example 2, and avoiding blocking the edge beam on the side of the forward direction. This embodiment adopts a targeted revolution blocking processing method, which can form a circular blocking area with a gap 43, and block the edge beam on the side except for the side of the forward direction in all directions. Since this embodiment adopts revolution, there is no blocking dead angle in the blocking area, and the revolution enables the part of the perforation 52 that can pass through the edge beam to cycle through the blocking-non-blocking state, and perform alternating heat and heat dissipation.

[0064] Specifically, in this embodiment, only one central gear 53 and one planetary gear 51 are provided, wherein a rotating shielding plate 41 is provided on the planetary gear 51, wherein the rotating shielding plate 41 is a whole circular plate structure, but there is a notch 43, and the angle of the notch 43 is not large. During the rotation process, when the notch 43 gradually approaches the center point of the through hole 52 along the cutting direction, the opening direction of the notch 43 gradually faces the center point of the through hole 52, so that more edge beam irradiation can be obtained in front of the center point, while the rest of the parts continuously perform edge beam blocking-non-blocking alternation; in this embodiment, the same fixed focus position and moving product position adjustment method as in Example 5 is adopted to avoid re-adjusting the size of the light-transmitting area 21 during the processing process.

[0065] Therefore, the device in this embodiment can achieve the following beneficial effects: alternation of blocking and non-blocking is performed through revolution; more edge beam irradiation of the product part in the cutting direction is achieved through the gap 43, thereby improving processing efficiency; reducing the number of components used and reducing costs; and forming a circular blocking area through revolution to reduce blocking blind spots.

Claims

1. A diamond laser cutting device, characterized in that: It comprises a laser emitting assembly (1) capable of emitting a laser beam, wherein the laser emitting assembly (1) comprises an output end (11) close to one side of a product; A shielding unit (2) is provided on one side of the product close to the output end (11), and a light-through area (21) is provided on the shielding unit (2); the laser beam comprises a processing beam and an edge beam, and the light-through area (21) can only allow the processing beam to pass through.

2. A diamond laser cutting device according to claim 1, characterized in that: The shielding unit (2) comprises a shielding plate (3), and a light-transmitting area (21) is provided on the shielding plate (3).

3. A diamond laser cutting device according to claim 2, characterized in that: The light-transmitting area (21) on the shielding plate (3) is a through groove or through hole structure.

4. A diamond laser cutting device according to claim 1, characterized in that: The shielding unit (2) is attached to the product.

5. A diamond laser cutting device according to claim 1, characterized in that: The shielding unit (2) comprises staggered rotating components (4) respectively arranged on two sides, and the staggered rotating components (4) comprise rotating shielding plates (41) and empty areas (42); The rotating mask (41) can block the edge light beam, and the edge light beam can pass through the empty area (42); When the rotation is performed until the distance between the edges of the rotating shielding plates (41) on both sides is the smallest, a light-transmitting area (21) is formed between the edges of the rotating shielding plates (41) on both sides.

6. A diamond laser cutting device according to any one of claims 1 to 5, characterized in that: The shielding unit (2) comprises a planetary drive gear set (5), the planetary drive gear set (5) comprises a planetary gear (51), the planetary gear (51) is connected to a rotating shielding plate (41), a through hole (52) is provided at the center of the planetary drive gear set (5), and the rotating shielding plate (41) rotates synchronously around the planetary gear (51) and revolves around the through hole (52).

7. A diamond laser cutting device according to claim 6, characterized in that: The rotating shielding sheet (41) is provided with a notch (43). During the revolution, when the notch (43) faces the through hole (52), the notch (43) is located on one side of the through hole (52) along the cutting direction.

8. A cutting method using a diamond laser cutting device according to any one of claims 1 to 7, characterized in that: The following steps are included: S1, setting the shielding unit (2) on the side of the product close to the output end (11), and adjusting the size of the light-transmitting area (21); S2, setting parameters of the laser emitting component (1), the laser emitting component (1) emits a laser beam, the processing beam passes through the light-passing area (21), and the edge beam is blocked by the shielding unit (2); S3. The product and the laser beam move relative to each other to form a laser cutting track.

9. A cutting method according to claim 8, characterized in that: In step S1, after the shielding unit (2) is placed on the product, a laser beam is used to cut the shielding unit (2) to form a light-transmitting area (21). The shielding unit (2) can only be cut by a processing light beam, and the light-transmitting area (21) can only allow the processing light beam to pass through.

10. A cutting method according to claim 8, characterized in that: In step S2, the staggered rotating assembly (4) drives the rotating mask (41) and the empty area (42); When the rotating shielding plates (41) on both sides are close to each other, a light-transmitting area (21) is formed and the edge light beams are shielded; When the empty areas (42) on both sides approach each other, the light-transmitting area (21) disappears, and the edge light beam passes through the shielding unit (2) and processes the product.

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